Line laser structure and preparation method thereof

Abstract

The invention discloses a line laser structure and a preparation method thereof. The line laser structure comprises a first lens assembly, a second lens assembly and a plane carrier plate, a laser chip is attached to the side, close to the second lens assembly, of the plane carrier plate. A platform glue area is arranged between the second lens assembly and the plane carrier plate. The setting reference of the second lens assembly coincides with the positioning reference of the laser chip, and the platform glue area, the second lens assembly and the plane carrier plate are integrally formed in a plastic packaging mode. Laser light emitted by the light emitting surface of the laser chip enters the second lens assembly after passing through the platform glue area to increase a transmission path, and the second lens assembly collimates the laser light and then enters the first lens assembly; the laser light is emitted by the first lens assembly to form a linear light spot. According to the line laser structure provided by the invention, a better collimation effect can be realized through the arrangement of the platform glue area, the bonding force between the platform glue area and the second lens assembly is greatly improved through a plastic packaging mode, and the manufacturing cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of laser technology, and in particular to a line laser structure and its fabrication method. Background Technology

[0002] Current line laser projectors based on Vertical Cavity Surface Emitting Laser (VCSEL) applications typically include optical collimating and stretching lens assemblies for beam shaping, and a chip carrier for mounting the chip. The conventional bonding and assembly process between the lens assembly and the chip carrier uses active coupling. However, active coupling results in low production efficiency and high cost, hindering large-scale mass production. Furthermore, the use of adhesive to bond the lens assembly to the chip carrier increases the risk of lens detachment and failure, impacting the structural reliability of the line laser module and limiting its widespread application. Summary of the Invention

[0003] This invention provides a line laser structure and its fabrication method, comprising: a first lens assembly, a second lens assembly, and a planar carrier plate. The second lens assembly and the planar carrier plate further include a platform adhesive region. The platform adhesive region and the second lens assembly and the planar carrier plate are integrally formed by molding. The platform adhesive region can greatly improve the collimation effect of the laser beam. The molding method fixes the platform adhesive region and the second lens assembly to the planar carrier plate, which is suitable for low-cost mass production and greatly improves the structural reliability of the second lens assembly and the planar carrier plate.

[0004] According to a first aspect of the present invention, a line laser structure is provided, comprising: a first lens assembly, a second lens assembly, and a planar carrier plate;

[0005] The second lens assembly is located on one side of the planar carrier plate, and the first lens assembly is located on the side of the second lens assembly facing away from the planar carrier plate; a laser chip is attached to the side of the planar carrier plate closest to the second lens assembly.

[0006] The first lens assembly and the second lens assembly are fixedly connected by adhesive; the second lens assembly also includes a platform adhesive area between itself and the planar carrier plate;

[0007] The setting reference of the second lens assembly coincides with the positioning reference of the laser chip, and the platform adhesive area and the second lens assembly are integrally formed with the planar carrier plate by plastic encapsulation.

[0008] The laser beam emitted from the light-emitting surface of the laser chip passes through the platform adhesive area to increase the transmission path before entering the second lens assembly. The second lens assembly collimates the laser beam before it enters the first lens assembly. The laser beam is then emitted from the first lens assembly to form a line spot.

[0009] Optionally, along a direction perpendicular to the planar carrier plate, the thickness of the platform adhesive area is 55%-60% of the sum of the thickness of the platform adhesive area and the thickness of the second lens assembly.

[0010] Optionally, the planar carrier board further includes electrical wiring and silver paste;

[0011] The silver paste is applied to the side of the planar carrier plate near the second lens assembly, and the silver paste adheres and fixes the negative electrode of the laser chip to the planar carrier plate; the positive electrode of the laser chip is connected to the positive electrode surface of the planar carrier plate through the electrical connection.

[0012] Optionally, along the direction perpendicular to the planar carrier plate, the sum of the thicknesses of the second lens assembly and the platform adhesive area is 7mm-10mm.

[0013] Optionally, the material of the second lens assembly is silicone or epoxy resin.

[0014] Optionally, the material of the planar carrier plate includes epoxy fiberglass cloth laminate, bismaleimide-triazine resin plate or ceramic planar carrier plate; the material of the electrical interconnects includes gold, aluminum or copper.

[0015] Optionally, the first lens assembly includes a wave lens, and the second lens assembly includes a collimating lens.

[0016] According to a second aspect of the present invention, a method for fabricating a line laser structure is provided, for fabricating any of the line lasers described in the first aspect of the present invention, the method comprising:

[0017] Multiple sets of silver paste, laser chips, and electrical interconnects are sequentially arranged on a planar substrate.

[0018] The positioning reference of the laser chip is aligned with the mold setting reference of the second lens assembly;

[0019] The planar carrier plate is placed inside the mold of the second lens assembly;

[0020] A line laser with a whole-plate array structure is formed by attaching the first lens assembly to the side of the second lens assembly facing away from the planar carrier plate with adhesive.

[0021] The line laser in the whole-plate array structure is cut to form multiple independent line lasers.

[0022] Optionally, after placing the planar carrier plate into the mold of the second lens assembly, the following steps are included:

[0023] Optical adhesive is injected into the mold of the second lens assembly to form a platform adhesive area, wherein the platform adhesive area, the planar carrier plate, and the second lens assembly are integrally formed; wherein the molding temperature is 80℃-200℃, the molding pressure is 20MPa-500MPa, and the molding time is 10s-60s.

[0024] Optionally, the step of cutting the line laser in the whole-plate array structure to form multiple independent line lasers includes:

[0025] Multiple crisscrossing cutting path marking lines are provided on the side of the planar carrier plate opposite to the second lens assembly;

[0026] The cutting path markings are used to cut the surface of the planar carrier plate on the side opposite to the second lens assembly using a water jet.

[0027] This invention discloses a line laser structure and its fabrication method, comprising: a first lens assembly, a second lens assembly, and a planar carrier plate; the second lens assembly is located on one side of the planar carrier plate, and the first lens assembly is located on the side of the second lens assembly facing away from the planar carrier plate; a laser chip is attached to the side of the planar carrier plate closest to the second lens assembly; the first lens assembly and the second lens assembly are fixedly connected by adhesive; a platform adhesive area is also included between the second lens assembly and the planar carrier plate; the setting reference of the second lens assembly coincides with the positioning reference of the laser chip; the platform adhesive area and the second lens assembly are integrally formed with the planar carrier plate by molding; the laser beam emitted from the light-emitting surface of the laser chip passes through the platform adhesive area to increase the transmission path before entering the second lens assembly; the second lens assembly collimates the laser beam before entering the first lens assembly; the laser beam is emitted from the first lens assembly to form a line spot. The line laser structure and its fabrication method provided by this invention can greatly improve the collimation effect of the laser beam by setting the platform adhesive area, and the platform adhesive area and the second lens assembly are fixed with the planar carrier plate by molding, which is suitable for low-cost mass production and greatly improves the structural reliability of the second lens assembly and the planar carrier plate.

[0028] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the structure of a line laser in the prior art;

[0031] Figure 2 This is a schematic diagram of the structure of a line laser provided in an embodiment of the present invention;

[0032] Figure 3 This is a side view of a one-piece molded structure for a line laser provided in an embodiment of the present invention;

[0033] Figure 4 This is a partial structural schematic diagram of a planar carrier plate in a line laser provided by an embodiment of the present invention;

[0034] Figure 5 This is a flowchart illustrating a method for fabricating a line laser structure according to an embodiment of the present invention;

[0035] Figure 6 This is a top view of a planar carrier plate in a line laser structure provided by an embodiment of the present invention;

[0036] Figure 7 This is a schematic diagram of a mold for the second lens assembly in a line laser structure provided in an embodiment of the present invention;

[0037] Figure 8 This is a mold side view of the second lens assembly in a line laser structure provided in an embodiment of the present invention;

[0038] Figure 9 This is a schematic diagram of another line laser provided in an embodiment of the present invention;

[0039] Figure 10 This is a flowchart of another method for fabricating a line laser structure provided in an embodiment of the present invention;

[0040] Figure 11 This is a schematic diagram of the planar carrier plate in another line laser provided by an embodiment of the present invention. Detailed Implementation

[0041] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0042] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0043] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0044] Figure 1 This is a schematic diagram of a line laser in the prior art, for reference. Figure 1 A line laser is a type of laser that uses special optical elements (such as cylindrical lenses or diffractive optical elements, DOE) to convert a laser beam into a line-shaped spot. Figure 1 As shown, the line laser includes a wavy lens A, a collimating lens C, and a substrate D. In the prior art, the method for fabricating a line laser involves bonding the wavy lens A and the collimating lens C together with adhesive. To obtain a good line spot effect, it is necessary to actively couple the collimating lens C to the substrate D and also fix them together with adhesive, i.e., to fabricate a... Figure 1 The line laser shown requires two bonding processes using adhesive, which is not conducive to mass production and is costly. In addition, the adhesive bonding between the collimating lens C and the substrate D is easily affected by the heating during the subsequent tinning and electrical connection assembly of the line laser. The adhesive strength weakens after the adhesive is heated, which can easily cause the collimating lens C to fall off, resulting in poor reliability of the laser structure.

[0045] Therefore, in order to solve the above-mentioned technical problems, embodiments of the present invention provide a line laser. Figure 2 This is a schematic diagram of the structure of a line laser provided in an embodiment of the present invention; Figure 3 This is a side view of a one-piece molded structure for a line laser provided in an embodiment of the present invention, with reference to... Figure 2 and Figure 3 The line laser includes: a first lens assembly 1, a second lens assembly 2, and a planar carrier plate 3; the second lens assembly 2 is located on one side of the planar carrier plate 3, and the first lens assembly 1 is located on the side of the second lens assembly 2 away from the planar carrier plate 3; a laser chip 31 is attached to the side of the planar carrier plate 3 closest to the second lens assembly 2; the first lens assembly 1 and the second lens assembly 2 are fixedly connected by adhesive; a platform adhesive area 4 is also included between the second lens assembly 2 and the planar carrier plate 3; the setting reference of the second lens assembly 2 coincides with the positioning reference of the laser chip 31, and the platform adhesive area 4 and the second lens assembly 2 are integrally formed with the planar carrier plate 3 by molding; the laser beam S emitted from the light-emitting surface of the laser chip 31 passes through the platform adhesive area 4 to increase the transmission path and then enters the second lens assembly 2; the second lens assembly 2 collimates the laser beam S and then enters the first lens assembly 1; the laser beam S is emitted from the first lens assembly 1 to form a line spot.

[0046] For details, please refer to Figure 2 and Figure 3 As shown, the line laser provided in this embodiment of the invention includes: a first lens assembly 1, a second lens assembly 2 located on one side of the planar carrier plate 3 (i.e., on the upper side of the planar carrier plate 3), the first lens assembly 1 located on the side of the second lens assembly 2 away from the planar carrier plate 3 (i.e., on the upper side of the second lens assembly 2), a laser chip 31 attached to the side of the planar carrier plate 3 near the second lens assembly 2 (i.e., on the upper surface of the planar carrier plate 3), and the first lens assembly 1 and the second lens assembly 2 bonded together with adhesive to achieve a tight connection between the first lens assembly 1 and the second lens assembly 2;

[0047] A platform adhesive area 4 is also included between the second lens assembly 2 and the planar carrier plate 3. The setting reference of the second lens assembly 2 coincides with the positioning reference of the laser chip 31 to ensure high alignment accuracy between the second lens assembly 2 and the laser chip 31, which can be controlled within 25μm. Correspondingly, it can be controlled within the offset tolerance of the lens design, thereby improving the spot performance of the line laser. The platform adhesive area 4 and the second lens assembly 2 are integrally formed with the planar carrier plate 3 through a molding process (where molding is a semiconductor packaging process in which the laser chip 31 is placed on the planar carrier plate 3, high-temperature molten epoxy resin is injected, and after pressing and curing, a protective shell is formed, which is described in detail below and will not be repeated here). Figure 3The laser beam S emitted from the light-emitting surface of the laser chip 31 passes through the platform adhesive area 4 to increase the transmission path and then enters the second lens assembly 2. The second lens assembly 2 collimates the laser beam S and then enters the first lens assembly 1. The laser beam S is emitted from the first lens assembly 1 and forms a line spot.

[0048] The line laser structure provided in this embodiment of the invention can greatly improve the collimation effect of the laser beam by setting a platform adhesive area. The platform adhesive area and the second lens assembly are fixed to the planar carrier plate by plastic encapsulation, which is suitable for low-cost mass production and greatly improves the structural reliability of the second lens assembly and the planar carrier plate.

[0049] Optionally, along the direction X perpendicular to the planar carrier plate 3, the thickness of the platform adhesive area 4 is 55%-60% of the sum of the thickness of the platform adhesive area 4 and the thickness of the second lens assembly 2.

[0050] For details, please refer to [link / reference]. Figure 2 or Figure 3 Along the direction perpendicular to the plane plate 3 (i.e. Figure 3 In the X direction), the thickness of the platform adhesive area 4 is 55%-60% of the sum of the thicknesses of the platform adhesive area 4 and the second lens assembly 2. Setting the thickness of the platform adhesive area 4 to be slightly larger than the thickness of the second lens assembly 2 can, on the one hand, increase the transmission path of the laser beam S, significantly improve the collimation effect of the laser beam S, and ensure that the divergence angle of the collimated laser beam S reaches 0.1°-0.3°; on the other hand, it can improve the molding effect under a large aspect ratio, with the surface shape error of the second lens assembly being less than 3µm and the surface roughness controlled to less than 10nm, which can be controlled within the shape tolerance of the lens design.

[0051] Figure 4 This is a partial structural schematic diagram of a planar carrier plate in a line laser provided by an embodiment of the present invention. (Refer to...) Figure 4 Optionally, the planar carrier 3 also includes electrical wiring 32 and silver paste 33;

[0052] Silver paste 33 is applied to the side of the planar carrier plate 3 near the second lens assembly 2. The silver paste 33 adheres and fixes the negative electrode of the laser chip 31 to the planar carrier plate 3. The positive electrode of the laser chip 31 is connected to the positive electrode surface of the planar carrier plate 3 through an electrical connection 32.

[0053] Specifically, such as Figure 4 As shown, the planar carrier plate 3 also includes electrical connection wires 32 and silver paste 33. Silver paste 33 is provided on the side of the planar carrier plate 3 near the second lens assembly 2 (that is, silver paste 33 is provided on the upper surface of the planar carrier plate 3). Silver paste 33 is applied to the planar carrier plate 3, and the negative electrode of the laser chip 31 is bonded and fixed to the planar carrier plate 3 by the silver paste 33. The positive electrode of the laser chip 31 is connected to the positive electrode surface of the planar carrier plate 3 by electrical connection wires 32.

[0054] Optionally, the laser chip 31 can be a single-point laser chip or a multi-point laser chip.

[0055] Optional, continue to refer to Figure 3 Along the direction X perpendicular to the plane carrier plate 3, the sum of the thicknesses of the second lens assembly 2 and the platform adhesive area 4 is 7mm-10mm.

[0056] Specifically, by setting a second lens assembly 2 and a platform adhesive area 4 with sufficient thickness to increase the transmission path of the laser beam S, the collimation effect of the laser beam S is improved.

[0057] Optionally, the material of the second lens assembly 2 is silicone or epoxy resin.

[0058] Specifically, the material of the second lens assembly 2 is silicone or epoxy resin to achieve a better molding effect, and also to ensure the structural reliability and stability of the line laser, making it less prone to falling off.

[0059] Optionally, the material of the flat substrate 3 includes an epoxy fiberglass cloth laminate, a bismaleimide-triazine resin board, or a ceramic flat substrate; the material of the electrical wiring 32 includes gold, aluminum, or copper.

[0060] Specifically, the material of the planar carrier plate 3 has the characteristics of low cost, high temperature resistance and strong conductivity to achieve stable and efficient emission of laser beam S, and the material of the electrical connection 32 includes gold, aluminum or copper to achieve stable electrical signal transmission.

[0061] Optionally, the first lens assembly 1 includes a wave lens, and the second lens assembly 2 includes a collimating lens.

[0062] Specifically, the laser beam S is collimated by the second lens assembly 2 and forms the final line spot by the first lens assembly 1. For example, the second lens assembly 2 can also be a beam expander, etc., and the embodiments of the present invention do not limit this.

[0063] Based on the same inventive concept, embodiments of the present invention provide a method for fabricating a line laser structure, used to fabricate the line laser in any of the above-described embodiments. Figure 5 This is a flowchart illustrating a method for fabricating a line laser structure according to an embodiment of the present invention. The fabrication method includes:

[0064] S101. Multiple sets of silver paste, laser chips and electrical wires are sequentially arranged on a flat substrate.

[0065] Specifically, Figure 6 This is a top view of a planar carrier plate in a line laser structure provided by an embodiment of the present invention, with reference to... Figure 6 Select a sufficiently large flat substrate 3, and sequentially apply multiple sets of silver paste on the flat substrate 3. Figure 6 (Not shown in the image), laser chip 31, and electrical connection 32, the specific method is as follows: silver paste is applied to the surface of the planar substrate, the negative electrode of the laser chip is attached to the silver paste to make the chip adhere to the planar substrate, and then the positive electrode of the laser chip is connected to the positive electrode surface of the planar substrate through electrical connection, so that an array (e.g., ...) is formed on the planar substrate 3. Figure 6 (a 10×10 array).

[0066] Optionally, before sequentially mounting multiple sets of silver paste, laser chips, and electrical interconnects on the planar substrate, the following steps are also included:

[0067] The surface of the flat substrate is cleaned using organic and plasma methods to keep it clean and tidy.

[0068] S102. Align the positioning reference of the laser chip with the mold setting reference of the second lens assembly.

[0069] Specifically, Figure 7 This is a schematic diagram of a mold for the second lens assembly in a line laser structure provided by an embodiment of the present invention. Figure 8 This is a mold side view of the second lens assembly in a line laser structure provided by an embodiment of the present invention, as shown in the figure. Figure 7-8 As shown, a mold for the second lens assembly is selected. This mold has individual surface-shaped cavities Q (i.e., the release adhesive area of ​​the second lens assembly). The positioning reference of the laser chip (i.e., the center point of the laser chip) is aligned with the positioning reference of the mold for the second lens assembly (e.g., the center point of the laser chip). Figure 7 The center point Z of each second lens assembly is aligned to ensure that the second lens assembly and the laser chip have higher alignment accuracy, which can be controlled within 25μm, thereby improving the spot performance of the line laser.

[0070] S103. Place the planar carrier plate into the mold of the second lens assembly.

[0071] Specifically, following the principle of step S102 above, the positioning reference of the laser chip is aligned and coincident with the positioning reference of the mold of the second lens assembly 2, and the planar carrier plate is placed inside the mold of the second lens assembly.

[0072] S104. The first lens assembly is attached to the side of the second lens assembly facing away from the planar carrier plate with adhesive to form a line laser with a whole-plate array structure.

[0073] Specifically, Figure 9 This is a schematic diagram of another line laser provided in an embodiment of the present invention, for reference. Figure 9 Following step S103 above, after placing the planar carrier plate into the mold of the second lens assembly, it becomes as follows: Figure 9As shown, the first lens assembly 1 is mounted on the side of the second lens assembly 2 / Q facing away from the planar carrier plate 3 to form a line laser with a whole-plate array structure (such as...). Figure 9 The line laser with a 10×10 array structure shown is specifically implemented by applying glue to the surface of the second lens assembly 2 and then attaching the first lens assembly 1 piece by piece to the surface of the second lens assembly 2 using a pick-and-place machine.

[0074] S105. Cut the line laser in the whole plate array structure to form multiple independent line lasers.

[0075] Specifically, after step S104 above, laser tinning is performed on the positive and negative metal surfaces on the back of the planar substrate for electrical connection with external components.

[0076] On the back side, the line lasers of the whole plate array structure are cut to form multiple independent line lasers. In this embodiment of the invention, 10×10, or 100 independent line lasers, are formed. It can be understood that as long as the planar carrier plate is large enough, more line lasers can be formed at once. This embodiment of the invention does not limit the size of the planar carrier plate.

[0077] Optionally, after placing the planar carrier plate into the mold of the second lens assembly, the process includes:

[0078] Optical adhesive is injected into the mold of the second lens assembly to form a platform adhesive area. The platform adhesive area, the planar carrier plate, and the second lens assembly are integrally formed. The molding temperature is 80℃-200℃, the molding pressure is 20MPa-500MPa, and the molding time is 10s-60s.

[0079] Specifically, in step S103 above, after placing the planar carrier plate into the mold of the second lens assembly, the following steps are included:

[0080] Inject optical adhesive (i.e., such as...) into the mold of the second lens assembly. Figure 7 Next to the cavity acupoint Q shown, the optical adhesive is fully filled into the cavity acupoint Q to form a platform adhesive area. The platform adhesive area, the planar carrier plate, and the second lens assembly are integrally molded. The molding conditions are as follows:

[0081] The sealing temperature is 80℃-200℃, the sealing pressure is 20MPa-500MPa, and the sealing time is 10s-60s to achieve a better sealing effect.

[0082] Based on the above embodiments, this invention further refines the line laser structure by cutting the entire array structure into multiple independent line lasers. Figure 10 This is a flowchart illustrating another method for fabricating a line laser structure provided in this embodiment of the invention. (Refer to...) Figure 10The method for fabricating a line laser provided in this embodiment of the invention includes:

[0083] S201. Multiple sets of silver paste, laser chips and electrical wires are sequentially arranged on a planar carrier.

[0084] S202. Align the positioning reference of the laser chip with the mold setting reference of the second lens assembly.

[0085] S203. Place the planar carrier plate into the mold of the second lens assembly.

[0086] S204. A line laser with a whole-plate array structure is formed by attaching the first lens assembly to the side of the second lens assembly facing away from the planar carrier plate with adhesive.

[0087] S205. Cut the line laser in the whole plate array structure to form multiple independent line lasers.

[0088] S206. Multiple crisscrossing cutting path marking lines are provided on the side of the planar carrier plate away from the second lens assembly.

[0089] Specifically, Figure 11 This is a schematic diagram of the planar carrier plate in another line laser provided by an embodiment of the present invention, for reference. Figure 11 Multiple crisscrossing cutting path marking lines L are set on the side of the planar carrier plate away from the second lens assembly (i.e., the back of the planar carrier plate). By setting multiple cutting path marking lines L, precise cutting of the laser can be achieved.

[0090] S207. Cut the surface of the flat plate away from the second lens assembly using a water jet according to the cutting path marking line.

[0091] Specifically, the cutting path marking line L set on the back of the planar carrier plate in step S206 above is used for cutting, and the planar carrier plate is cut by water jet to complete the fabrication of the line laser.

[0092] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A line laser structure, characterized in that, include: First lens assembly, second lens assembly, and planar carrier plate; The second lens assembly is located on one side of the planar carrier plate, and the first lens assembly is located on the side of the second lens assembly facing away from the planar carrier plate; a laser chip is attached to the side of the planar carrier plate closest to the second lens assembly. The first lens assembly and the second lens assembly are fixedly connected by adhesive; the second lens assembly also includes a platform adhesive area between itself and the planar carrier plate; The setting reference of the second lens assembly coincides with the positioning reference of the laser chip, and the platform adhesive area and the second lens assembly are integrally formed with the planar carrier plate by plastic encapsulation. The laser beam emitted from the light-emitting surface of the laser chip passes through the platform adhesive area to increase the transmission path before entering the second lens assembly. The second lens assembly collimates the laser beam before it enters the first lens assembly. The laser beam is then emitted from the first lens assembly to form a line spot.

2. The line laser structure according to claim 1, characterized in that, Along the direction perpendicular to the planar carrier plate, the thickness of the platform adhesive area is 55%-60% of the sum of the thickness of the platform adhesive area and the thickness of the second lens assembly.

3. The line laser structure according to claim 1, characterized in that, The planar carrier plate also includes electrical wiring and silver paste; The silver paste is applied to the side of the planar carrier plate near the second lens assembly, and the silver paste adheres and fixes the negative electrode of the laser chip to the planar carrier plate; the positive electrode of the laser chip is connected to the positive electrode surface of the planar carrier plate through the electrical connection.

4. The line laser structure according to claim 1, characterized in that, Along the direction perpendicular to the planar carrier plate, the sum of the thicknesses of the second lens assembly and the platform adhesive area is 7mm-10mm.

5. The line laser structure according to claim 1, characterized in that, The material of the second lens assembly is silicone or epoxy resin.

6. The line laser structure according to claim 3, characterized in that, The material of the planar carrier includes epoxy fiberglass cloth laminate, bismaleimide-triazine resin board, or ceramic planar carrier; the material of the electrical interconnects includes gold, aluminum, or copper.

7. The line laser structure according to claim 1, characterized in that, The first lens assembly includes a wave lens, and the second lens assembly includes a collimating lens.

8. A method for fabricating a line laser structure, characterized in that, The method for preparing the line laser according to any one of claims 1-7 comprises: Multiple sets of silver paste, laser chips, and electrical interconnects are sequentially arranged on a planar substrate. The positioning reference of the laser chip is aligned with the mold setting reference of the second lens assembly; The planar carrier plate is placed inside the mold of the second lens assembly; A line laser with a whole-plate array structure is formed by attaching the first lens assembly to the side of the second lens assembly facing away from the planar carrier plate with adhesive. The line laser in the whole-plate array structure is cut to form multiple independent line lasers.

9. The method for fabricating a line laser structure according to claim 8, characterized in that, After placing the planar carrier plate into the mold of the second lens assembly, the process includes: Optical adhesive is injected into the mold of the second lens assembly to form a platform adhesive area, wherein the platform adhesive area, the planar carrier plate, and the second lens assembly are integrally formed; wherein the molding temperature is 80℃-200℃, the molding pressure is 20MPa-500MPa, and the molding time is 10s-60s.

10. The method for fabricating a line laser structure according to claim 8, characterized in that, The step of cutting the line laser in the whole-plate array structure to form multiple independent line lasers includes: Multiple crisscrossing cutting path marking lines are provided on the side of the planar carrier plate opposite to the second lens assembly; The cutting path markings are used to cut the surface of the planar carrier plate on the side opposite to the second lens assembly using a water jet.

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