Mask, bearing device and laser lift-off method

Abstract

The invention relates to the technical field of laser lift-off, in particular to a mask, a bearing device and a laser lift-off method.The mask comprises a light-transmitting area and a light-shielding area, the light-transmitting area is used for laser transmission, the light-shielding area is used for shielding laser, and the bearing device comprises the mask, a bearing plate body and a placement area formed in the bearing plate body; during laser lift-off, the display screen is placed in the placing area, the mask is placed in a light path between laser and the display screen, a transparent substrate in the display screen is divided into a connecting area and a lift-off area, the light-transmitting area corresponds to the lift-off area, the shading area covers the area outside the lift-off area, and the area outside the lift-off area comprises the connecting area. The laser can only be irradiated to the stripping area through the light-transmitting area, the connecting area is located in the area between the stripping area and the routing area, the connecting area and the adjacent routing area are shielded by the shielding area, and the laser cannot pass through, so that the problem that the laser is irradiated to the routing area to cause damage to the routing area is avoided.

Description

Technical Field

[0001] This invention relates to the field of laser ablation technology, and more particularly to a laser ablation method. Background Technology

[0002] Laser Lift-Off (LLO) is a technology that uses laser energy to separate material interfaces and is widely used in semiconductor, optoelectronic and flexible device manufacturing.

[0003] For example, in the semiconductor field, laser lift-off is often used in display manufacturing to peel a transparent substrate from a gallium nitride (GaN) epitaxial layer in order to improve the heat dissipation and luminous efficiency of the light emitter. In this laser lift-off process, a laser of a specific wavelength (such as an ultraviolet laser) is selected to penetrate the transparent substrate (such as sapphire) and focus on the functional layer at the interface: the gallium nitride layer. After absorbing the laser energy, the functional layer undergoes instantaneous thermal decomposition or vaporization, thereby destroying the interfacial bonding force.

[0004] However, during laser irradiation, laser spot or light beam can easily burn the wire bonding area of ​​the display screen due to laser irradiation errors or placement errors by operators, thus affecting chip performance. Summary of the Invention

[0005] In view of the above-mentioned deficiencies in the prior art, one of the technical problems to be solved by this application is: how to prevent the laser spot / ray from burning the wire bonding area in the display screen and affecting its electrical performance.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows: A photomask is used in the manufacturing process of a display screen, the display screen comprising: a light-emitting chip and a driving board, the driving board including a mounting area and a wire bonding area located on at least one side of the mounting area, the wire bonding area being used for electrically connecting external signals, the light-emitting chip being mounted in the mounting area and electrically connected to the driving board, the light-emitting chip including a plurality of light emitters and a transparent substrate covering the light-emitting surface of the light emitters, characterized in that the transparent substrate comprises: The connection area refers to the region in the transparent substrate that is close to the wire bonding area; The stripping region refers to the area outside the bonding region in the transparent substrate; The photomask includes: The light-transmitting area is used for laser transmission; The light-shielding area is used to block the laser. During laser stripping, the mask is located in the optical path between the laser and the transparent substrate, and the mask and the transparent substrate are offset: the light-transmitting area corresponds to the stripping area, the light-shielding area covers the area outside the stripping area, and the area outside the stripping area includes the connecting area.

[0007] Its further feature is that, The driver board is provided with a first pad and a second pad. The first pad is located in the mounting area, and the second pad is located in the wire bonding area. The electrode of the light-emitting element is electrically connected to the first pad, and external signals are electrically connected to the light-emitting element through the second pad and the first pad.

[0008] Furthermore, the light-emitting chip is an integrated LED chip.

[0009] Furthermore, the width of the connection area is 3μm to 20μm.

[0010] Furthermore, the bonding area includes a first bonding area and / or a second bonding area and / or a third bonding area, wherein the first bonding area is located on the left or right side of the light-emitting chip, the second bonding area is located on the upper or lower side of the light-emitting chip, and the third bonding area is located on the lower or upper side of the light-emitting chip.

[0011] Furthermore, the connection area includes a first connection area and / or a second connection area and / or a third connection area, wherein the first connection area is adjacent to the first bonding area, the second connection area is adjacent to the second bonding area, and the third connection area is adjacent to the third bonding area.

[0012] Furthermore, the material of the transparent substrate includes, but is not limited to, sapphire.

[0013] A support device, characterized in that it comprises: A carrier board includes a carrier board body and a placement area formed in the carrier board body. The placement area is used to place a display screen. The display screen includes: a light-emitting chip and a driver board. The driver board includes a mounting area and a wire bonding area located on at least one side of the mounting area. The wire bonding area is used to electrically connect to external signals. The light-emitting chip is mounted in the mounting area and electrically connected to the driver board. The light-emitting chip includes a plurality of light emitters and a transparent substrate covering the light-emitting surface of the light emitters. The transparent substrate includes: a connection area and a stripping area. The connection area refers to the area of ​​the transparent substrate near the wire bonding area, and the stripping area refers to the area of ​​the transparent substrate other than the connection area. A photomask, comprising: a light-transmitting area and a light-blocking area, wherein the light-transmitting area is used for laser transmission and the light-blocking area is used for blocking laser; During laser stripping, the mask is located in the optical path between the laser and the transparent substrate. The light-transmitting area corresponds to the stripping area, and the light-shielding area corresponds to the area outside the stripping area. The area outside the stripping area includes the connecting area.

[0014] Its further feature is that, The mask has a first bolt hole on its edge, and the support plate has a second bolt hole on its edge. The first bolt hole corresponds to the second bolt hole, and the bolt passes through the first bolt hole and the second bolt hole in sequence to fix the mask to the support plate.

[0015] Furthermore, the carrier plate body is provided with a plurality of arrayed placement areas, and the mask is provided with a plurality of arrayed light-transmitting areas, the light-transmitting areas corresponding one-to-one with the placement areas.

[0016] A laser ablation method, which utilizes the aforementioned mask and carrier device, includes: A display screen is provided, the display screen including: a light-emitting chip and a driving board, the driving board including a mounting area and a wire bonding area located on at least one side of the mounting area, the wire bonding area being used for electrically connecting external signals, the light-emitting chip being mounted in the mounting area and electrically connected to the driving board, the light-emitting chip including a plurality of light emitters and a transparent substrate covering the light-emitting surface of the light emitters; The transparent substrate is divided into a connection area and a release area. The connection area refers to the region of the transparent substrate near the wire bonding area, and the release area refers to the region of the transparent substrate outside the connection area. A photomask is provided, the photomask including a light-transmitting area and a light-blocking area, the light-transmitting area being used for laser transmission and the light-blocking area being used for blocking laser; The photomask is placed in the optical path between the laser and the transparent substrate; The laser passes through the light-transmitting area and irradiates the stripping area. The light-shielding area blocks the area outside the stripping area, and the area outside the stripping area includes the connecting area. Peel off the transparent substrate.

[0017] A further feature is that, The transparent substrate is peeled off using a mechanical peeling method.

[0018] The above-mentioned solution of the present invention can achieve the following beneficial effects: This application provides a photomask that is applied to the laser lift-off process in the manufacturing process of a display screen to lift off the transparent substrate in the display screen. The photomask includes a light-transmitting area and a light-shielding area. The light-transmitting area corresponds to the lift-off area in the transparent substrate, and the light-shielding area blocks the area outside the lift-off area in the transparent substrate. The area outside the lift-off area includes a connecting area. When the laser is irradiated, it can only irradiate the lift-off area through the light-transmitting area. The connecting area is located between the lift-off area and the wire bonding area. The connecting area and the adjacent wire bonding area are blocked by the light-shielding area, and the laser cannot pass through. This effectively avoids the problem of the laser spot / light beam irradiating the wire bonding area and causing the wire bonding area to be burned and damaged, thereby avoiding the impact on the electrical performance of the display screen and ensuring the yield of laser lift-off. Attached Figure Description

[0019] Figure 1 This is a top view of the supporting device according to Embodiment 1 of this application; Figure 2 This is a top view of a partial area of ​​the support device in Embodiment 1 of this application; Figure 3 This is a top view of the supporting device according to Embodiment 2 of this application; Figure 4 This is a top view schematic diagram of a partial area of ​​the support device in Embodiment 2 of this application; Figure 5 This is a top view of the load-bearing device according to Embodiment 3 of this application; Figure 6 This is a top view of a partial area of ​​the bearing device in Embodiment 3 of this application; Figure 7 This is a top view of the load-bearing device in Embodiment 4 of this application; Figure 8 This is a top view schematic diagram of a partial area of ​​the bearing device in Embodiment 4 of this application; Figure 9 This is a top view of the load-bearing device according to Embodiment 5 of this application; Figure 10 This is a top view of a partial area of ​​the support device in Embodiment 5 of this application; Figure 11 This is a top view of the supporting device in Embodiment Six of this application; Figure 12 This is a top view of a partial area of ​​the bearing device in Embodiment Six of this application; Figure 13 This is a top view of the supporting device in Embodiment 7 of this application; Figure 14 This is a top view schematic diagram of a partial area of ​​the support device in Embodiment 7 of this application; Figure 15 This is a top view of the bearing device in Embodiment 8 of this application; Figure 16 This is a top view of a partial area of ​​the bearing device in Embodiment 8 of this application; Figure 17 This is a schematic diagram of the main structure of the support device in Embodiment 4 of this application; Figure 18 This is a schematic diagram of the main structure of the support device in Embodiment 5 of this application; Figure 19 This is a top view of the structure of the support device of this application, which includes the mechanical peeling component of Embodiment 1. Figure 20This is a front view schematic diagram of the bearing device of this application, which includes the mechanical peeling component of Embodiment 1. Figure 21 This is a top view of the structure of the support device of this application, which includes the mechanical peeling component of Embodiment 2. Figure 22 This is a front view schematic diagram of the mechanical peeling component of Embodiment 2 provided in the carrier device of this application.

[0020] Reference numerals: 1. Light emitter; 2. Driver plate; 3. Transparent substrate; 4. Mask; 5. Support plate; 6. Push rod; 7. Through slot; 8. Base. Hitting the line area 203; Connection area 301, stripping area 302; Light-transmitting area 401, light-blocking area 402, first bolt hole 403; First connection area 3011, second connection area 3012, third connection area 3013; First protrusion 3001, first upper protrusion 3002, first lower protrusion 3003; Second protrusion 4001, second upper protrusion 4002, second lower protrusion 4003; First hitting zone 2031, second hitting zone 2032, third hitting zone 2033; Carrier plate body 501, placement area 502, vacuum adsorption hole 503, second bolt hole 504; The third protrusion 601. Detailed Implementation

[0021] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0022] It should be noted that the terms "comprising" and "having" and any variations thereof in the specification, claims and accompanying drawings of this invention are intended to cover non-exclusive inclusion. For example, a process, method, apparatus, product or device that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such process, method, product or device.

[0023] The display screen is mainly composed of light-emitting chips and a driver board 2. The driver board 2 includes a substrate, a mounting area distributed on the substrate, and a wire bonding area 203 adjacent to the mounting area. The mounting area is used to mount the light-emitting chips, and the wire bonding area 203 is used to electrically connect external signals.

[0024] To facilitate the installation of the light-emitting chip, a first pad is provided in the mounting area 202 of the driver board 2. The first pad is flip-chip bonded to the electrode of the light-emitting element in the light-emitting element 1. To facilitate the electrical connection between the driver board 2 and external signals, a second pad is provided in the wire bonding area 203. The second pad can be electrically connected to external signals via FPC connection wires.

[0025] When the light-emitting chip is working, external signals are transmitted to the light-emitting body 1 through the second pad, the circuit in the substrate, the first pad, and the electrode. That is, the driving board 2 controls the working state of the light-emitting body, such as turning it on or off.

[0026] In this application, the display screen is an LED micro-display screen, and the size of its driving board ranges from (10mm to 20mm) * (5mm to 10mm). In this embodiment, the size of the driving board is preferably 15mm * 7mm. The light-emitting chip is an LED integrated chip. In this LED integrated chip, the light-emitting element 1 is arrayed in the transparent substrate 3. The light-emitting element is mainly composed of an N-type GaN layer, a light-emitting layer, and a P-type GaN layer, and its size is usually below 50μm. In the process of preparing the above-mentioned LED micro-display screen, the light-emitting element electrode is first aligned and bonded to the driving board 2. After bonding, the transparent substrate 3 covers the light-emitting element, while the wire bonding area 203 is exposed. In the prior art, when the transparent substrate 3 is subsequently removed by laser lift-off process, it is very easy for laser irradiation to occur on the wire bonding area 203 adjacent to the transparent substrate due to laser irradiation error, operation error, cutting error, etc., thus affecting its electrical performance.

[0027] To address the aforementioned shortcomings in the existing technology, the following provides several specific embodiments of photomasks. These embodiments detail the photomask structure and its specific application in the laser lift-off process, aiming to solve the technical problem of low laser lift-off yield caused by the laser spot / ray easily ablating the wire bonding area adjacent to the transparent substrate due to laser irradiation errors, operation errors, cutting errors, etc. Example 1

[0028] A photomask is used in a laser lift-off process to peel off the transparent substrate 3 in a display screen, which is the aforementioned LED micro-display screen. In this embodiment, a first bonding area 2031 is provided on one side of the light-emitting chip in the LED micro-display screen. During laser lift-off, the laser spot / light should be prevented from irradiating the first bonding area 2031.

[0029] First, the transparent substrate 3 is divided into a connection area 301 and a stripping area 302. The connection area 301 includes a first connection area 3011, which refers to the area in the transparent substrate near the first wire bonding area 2031. The stripping area 302 refers to the area in the transparent substrate outside the first connection area. The transparent substrate 3 is horizontally striped and preferably made of sapphire. The first connection area 3011 is vertically striped and located at the left edge of the transparent substrate, to the left of the stripping area 302, that is, between the left side of the first wire bonding area 2031 and the left side of the stripping area 302. To reduce the influence of overall error, the width of the first connection area is greater than the overall error. The overall error includes laser irradiation error, operation error, cutting error, etc. In this embodiment, the overall error range is 1μm~10μm, and the width of the first connection area ranges from 3μm~20μm, preferably 15μm. The width of the first connection area is the vertical distance from the left edge of the transparent substrate to the left edge of the light-transmitting area in the photomask, denoted by "c1". In addition, in this first embodiment, the vertical distance from the left edge of the transparent substrate to the light emitter is a1, the vertical distance from the right edge of the transparent substrate to the light emitter is a2, the vertical distance from the top edge of the transparent substrate to the light emitter is a3, and the vertical distance from the bottom edge of the transparent substrate to the light emitter is a4. (Refer to...) Figure 1 , Figure 2 .

[0030] The mask is designed based on the position and structure of the first bonding area 2031 and the transparent substrate 3. In this embodiment, the mask is designed with the following structure: The mask 4 includes a light-transmitting area 401 and a light-shielding area 402. The light-transmitting area 401 is structurally matched with the stripping area 302 for laser transmission. The light-shielding area 402 is structurally matched with the area outside the stripping area for blocking the laser. During laser stripping, the mask 4 is placed in the optical path between the laser and the transparent substrate 3. The mask 4 and the transparent substrate 3 are misaligned: the light-transmitting area 401 corresponds to the stripping area 302, and the light-shielding area 402 covers the area outside the stripping area. The area outside the stripping area includes the first connection area 3011. The first connecting area 3011 has a certain width. When the laser is irradiated, it can only irradiate the stripping area 302 through the light-transmitting area 401. The first connecting area 3011 is located in the area between the stripping area 302 and the first bonding area 2031. The first connecting area 2031 and the adjacent first bonding area 2031 are blocked by the light-shielding area 402, so the laser cannot pass through. Even if there is a certain error, it will not burn the adjacent first bonding area 2031. This effectively avoids the problem of the first bonding area being burned and damaged due to the laser spot / light irradiating the first bonding area 2031, thereby avoiding the impact on the electrical performance of the display screen and improving the laser stripping yield. Example 2

[0031] A photomask is used in a laser lift-off process to peel off a transparent substrate from a display screen, which is the aforementioned LED micro-display screen. In this embodiment, the LED micro-display screen has bonding areas 203 on both sides of the light-emitting chip, namely: a first bonding area 2031 located on the left side of the light-emitting chip and a second bonding area 2032 located on the upper side of the light-emitting chip. During laser lift-off, the laser spot / light should be prevented from irradiating the first bonding area 2031 and the second bonding area 2032.

[0032] First, the transparent substrate 3 is divided into a connection area 301 and a stripping area 302. The connection area 301 refers to the region of the transparent substrate 3 near the wire bonding area 203, and the stripping area 302 refers to the region of the transparent substrate 3 outside the connection area. The transparent substrate 3 is horizontally striped, and the preferred material is sapphire. In this embodiment, the connection area 301 includes a vertically striped first connection area 3011 and a horizontally striped second connection area 3012. The first connection area 3011 is located at the left edge of the transparent substrate, to the left of the stripping area 302, that is, between the first wire bonding area 2031 and the left side of the stripping area, and is adjacent to the first wire bonding area 2031. The second connection area 3012 is located at the upper edge of the transparent substrate, above the stripping area 302, that is, between the second wire bonding area 2032 and the upper side of the stripping area, and is adjacent to the second wire bonding area 2032. To reduce the impact of laser irradiation errors and operational errors, the widths of both the first and second connection areas are greater than the overall error, which includes laser irradiation errors, operational errors, and cutting errors. In this second embodiment, the overall error range is 1μm to 10μm, so the widths of the first and second connection areas are 3μm to 20μm, preferably 15μm. The width of the first connection area is the vertical distance from the left edge of the transparent substrate to the left edge of the light-transmitting area in the mask, denoted by "c1". The width of the second connection area is the vertical distance from the top edge of the transparent substrate to the top edge of the light-transmitting area in the mask, denoted by "c2". Additionally, in this second embodiment, the vertical distance from the left edge of the transparent substrate to the light emitter is a1, the vertical distance from the right edge of the transparent substrate to the light emitter is a2, the vertical distance from the top edge of the transparent substrate to the light emitter is a3, and the vertical distance from the bottom edge of the transparent substrate to the light emitter is a4. (Refer to...) Figure 3 , Figure 4 .

[0033] The mask 4 is designed based on the position and structure of the first bonding area 2031, the second bonding area 2032, and the transparent substrate 3. In this embodiment, the mask is designed with the following structure: The mask includes a light-transmitting area 401 and a light-shielding area 402. The light-transmitting area is structurally matched with the stripping area for laser transmission, and the light-shielding area 402 is structurally matched with the area outside the stripping area 302 for blocking the laser. During laser stripping, the mask 4 is placed in the optical path between the laser and the transparent substrate 3. The mask 4 and the transparent substrate 3 are staggered: the light-transmitting area 401 corresponds to the stripping area 302, and the light-shielding area 402 covers the area outside the stripping area 302. The area outside the stripping area includes the first connecting area 3011 and the second connecting area 3012. Both the first connection area 3011 and the second connection area 3012 have a certain width. When the laser is irradiated, it can only irradiate the stripping area 302 through the light-transmitting area 401. The first connection area 3011 and the adjacent first bonding area 2031, the second connection area 3012 and the adjacent second bonding area 2032 are blocked by the light-shielding area 402, and the laser cannot pass through. Even if there is a certain error, it will not burn the adjacent first bonding area 2031 and second bonding area 2032. This effectively avoids the problem of the first bonding area and the second bonding area being burned and damaged due to the laser spot / light irradiating the first bonding area and the second bonding area, thereby avoiding the impact on the electrical performance of the display screen and ensuring the laser stripping yield. Example 3

[0034] A photomask is used in a laser lift-off process to peel off a transparent substrate from a display screen, which is the aforementioned LED micro-display screen. In this embodiment, the LED micro-display screen has bonding areas 203 on three sides of the light-emitting chip, namely: a first bonding area 2031 on the left side of the light-emitting chip, a second bonding area 2032 on the upper side of the light-emitting chip, and a third bonding area 2033 on the lower side of the light-emitting chip. During laser lift-off, the laser spot / light should be prevented from irradiating the first bonding area 2031, the second bonding area 2032, and the third bonding area 2033.

[0035] First, the transparent substrate 3 is divided into a connection area 301 and a stripping area 302. The connection area 301 refers to the area of ​​the transparent substrate 3 near the wire bonding area 203, and the stripping area 302 refers to the area of ​​the transparent substrate 3 outside the connection area. The transparent substrate 3 is horizontal strip-shaped and the preferred material is sapphire. In this third embodiment, the connection area 301 includes a vertical strip-shaped first connection area 3011, a horizontal strip-shaped second connection area 3012, and a horizontal strip-shaped third connection area 3013. The first connection area 3011 is located at the left edge of the transparent substrate and to the left of the release area 302, that is, between the first wire bonding area 2031 and the left side of the release area, and is adjacent to the first wire bonding area 2031. The second connection area 3012 is located at the upper edge of the transparent substrate and above the release area 302, that is, between the second wire bonding area 2032 and the upper side of the release area, and is adjacent to the second wire bonding area 2032. The third connection area 3013 is located at the lower edge of the transparent substrate and below the release area 302, that is, between the third wire bonding area 2033 and the lower side of the release area, and is adjacent to the third wire bonding area 2033. To reduce the impact of laser irradiation errors, operational errors, etc., the widths of the first, second, and third connection areas are all greater than the comprehensive error, which includes laser irradiation errors, operational errors, cutting errors, etc. In this third embodiment, the comprehensive error range is 1μm~10μm, so the widths of the first, second, and third connection areas range from 3μm to 20μm, preferably 15μm. The width of the first connection area is the vertical distance from the left edge of the transparent substrate to the left edge of the light-transmitting area in the mask, denoted by "c1". The width of the second connection area is the vertical distance from the top edge of the transparent substrate to the top edge of the light-transmitting area in the mask, denoted by "c2". The width of the third connection area is the vertical distance from the bottom edge of the transparent substrate to the bottom edge of the light-transmitting area in the mask, denoted by "c3". In addition, in this third embodiment, the vertical distance from the left edge of the transparent substrate to the light emitter is a1, the vertical distance from the right edge of the transparent substrate to the light emitter is a2, the vertical distance from the top edge of the transparent substrate to the light emitter is a3, and the vertical distance from the bottom edge of the transparent substrate to the light emitter is a4. (Refer to...) Figure 5 , Figure 6 .

[0036] The mask 4 is designed based on the position and structure of the first bonding area 2031, the second bonding area 2032, the third bonding area 2033, and the transparent substrate 3. In this embodiment, the mask is designed with the following structure: The mask includes a light-transmitting area 401 and a light-shielding area 402. The light-transmitting area 401 is structurally matched with the stripping area and is used for laser transmission. The light-shielding area 402 is structurally matched with the area outside the stripping area 302 and is used to block the laser. During laser stripping, the mask 4 is placed in the optical path between the laser and the transparent substrate 3. The mask 4 and the transparent substrate 3 are staggered: the light-transmitting area 401 corresponds to the stripping area 302, and the light-shielding area 402 covers the area outside the stripping area 302. The area outside the stripping area includes the first connecting area 3011, the second connecting area 3012, and the third connecting area 3013. The first connecting area 3011, the second connecting area 3012, and the third connecting area 3013 all have a certain width. When the laser is irradiated, it can only irradiate the stripping area 302 through the light-transmitting area 401. The first connecting area 3011 and the adjacent first bonding area 2031, the second connecting area 3012 and the adjacent second bonding area 2032, and the third connecting area 3013 and the adjacent third bonding area 2033 are blocked by the light-shielding area 402, and the laser cannot pass through. Even if there is a certain error in the laser irradiation range, it will not burn the adjacent first bonding area 2031, second bonding area 2032, and third bonding area 2033. This effectively avoids the problem of the laser spot / ray irradiating the first bonding area 2031, second bonding area 2032, and third bonding area 2033 and causing them to be burned and damaged. This also avoids affecting the electrical performance of the display screen and ensures the laser stripping yield. Example 4

[0037] A photomask is used in a laser lift-off process to peel off the transparent substrate 3 in a display screen, which is the aforementioned LED micro-display screen. In this embodiment, a first bonding area 203 is provided on one side of the light-emitting chip in the LED micro-display screen. During laser lift-off, the laser spot / light should be prevented from irradiating the first bonding area 2031.

[0038] First, the transparent substrate 3 is divided into a connection area 301 and a stripping area 302. The connection area includes a first connection area 3011, which refers to the region of the transparent substrate near the first wire bonding area 2031. The stripping area 302 refers to the region of the transparent substrate outside the first connection area. The transparent substrate 3 is horizontally striped and preferably made of sapphire. The first connection area 301 is vertically striped and located at the left edge of the transparent substrate, to the left of the stripping area 302, that is, between the first wire bonding area 2031 and the stripping area 302. To reduce the influence of overall error, the width of the first connection area is greater than the overall error. The overall error includes laser irradiation error, operation error, cutting error, etc. In this embodiment, the overall error range is 1μm~10μm, and the width of the first connection area ranges from 3μm~20μm, preferably 15μm. The width of the first connection area is the vertical distance from the left edge of the transparent substrate to the left edge of the light-transmitting area in the photomask, denoted by "c1". In addition, in this first embodiment, the vertical distance from the left edge of the transparent substrate to the light emitter is a1, the vertical distance from the upper edge of the transparent substrate to the light emitter is a3, and the vertical distance from the lower edge of the transparent substrate to the light emitter is a4.

[0039] The mask is designed based on the position and structure of the first bonding area 2031 and the transparent substrate 3. In this embodiment, the mask is designed with the following structure: The mask 4 includes a light-transmitting area 401 and a light-shielding area 402. The light-transmitting area 401 is structurally matched with the stripping area 302 for laser transmission, and the light-shielding area 402 is structurally matched with the area outside the stripping area for blocking the laser. During laser stripping, the mask 4 is placed in the optical path between the laser and the transparent substrate 3, and the mask 4 and the transparent substrate 3 are staggered: the light-transmitting area 401 corresponds to the stripping area 302, and the light-shielding area 402 covers the area outside the stripping area, which includes the first connecting area 301. The width of the first connecting area is greater than the comprehensive error range, so that even if there is a certain error during laser stripping, the adjacent first bonding area 2031 will not be burned.

[0040] The difference between Embodiment 4 and Embodiment 1 is that the transparent substrate 3 in Embodiment 4 has a first protrusion 3001, and the right end of the peeling area 302 extends outward, that is, the right end of the peeling area 302 extends away from the first connecting area 3011 to form the first protrusion 3001. The width of the first protrusion is the vertical distance from the right edge of the transparent substrate to the adjacent light emitter, denoted by "t1". t1 is greater than a2. (Refer to...) Figure 7 , Figure 8 .

[0041] To ensure that the light-transmitting area 401 completely covers the stripping area 302, the right end of the light-transmitting area 401 protrudes from the edge of the first protrusion of the stripping area 302 to form a second protrusion 4001.

[0042] It should be noted that in another embodiment (Embodiment 5), the left end of the stripping area 302 is the first connecting area 3011, the right end is the first protrusion 3001, the upper end and the lower end protrude from the upper edge and the lower edge of the lower driving plate, respectively, forming the first upper protrusion 3002 and the first lower protrusion 3003. The width of the first upper protrusion is the vertical distance from the upper edge of the transparent substrate to the adjacent light-emitting body, denoted by "t2", and the width of the first lower protrusion is the vertical distance from the lower edge of the transparent substrate to the adjacent light-emitting body, denoted by "t3", where t2 > a3 and t3 > a4.

[0043] In this fifth embodiment, to ensure that the light-transmitting area 401 completely covers the peeling area 302, the right end of the light-transmitting area 401 protrudes beyond the edge of the first protrusion of the peeling area 302 to form a second protrusion 4001. The upper and lower ends of the light-transmitting area 401 protrude beyond the edges of the first upper protrusion and the first lower protrusion of the peeling area 302, respectively, to form a second upper protrusion 4002 and a second lower protrusion 4003. (Refer to...) Figure 9 , Figure 10 . Example 6

[0044] A photomask is used in a laser lift-off process to peel off a transparent substrate from a display screen, which is the aforementioned LED micro-display screen. In this embodiment, the LED micro-display screen has bonding areas 203 on both sides of the light-emitting chip, namely: a first bonding area 2031 located on the left side of the light-emitting chip and a second bonding area 2032 located on the upper side of the light-emitting chip. During laser lift-off, the laser spot / light should be prevented from irradiating the first bonding area 2031 and the second bonding area 2032.

[0045] First, the transparent substrate 3 is divided into a connection area 301 and a stripping area 302. The connection area 301 refers to the region of the transparent substrate 3 near the wire bonding area 203, and the stripping area 302 refers to the region of the transparent substrate 3 outside the connection area. The transparent substrate 3 is horizontally striped, and the preferred material is sapphire. In this embodiment, the connection area 301 includes a vertically striped first connection area 3011 and a horizontally striped second connection area 3012. The first connection area 3011 is located at the left edge of the transparent substrate, to the left of the stripping area 302, that is, between the first wire bonding area 2031 and the left side of the stripping area, and is adjacent to the first wire bonding area 2031. The second connection area 3012 is located at the upper edge of the transparent substrate, above the stripping area 302, that is, between the second wire bonding area 2032 and the upper side of the stripping area, and is adjacent to the second wire bonding area 2032. To reduce the impact of laser irradiation errors and operational errors, the widths of both the first and second connection areas are greater than the overall error, which includes laser irradiation errors, operational errors, and cutting errors. In this sixth embodiment, the overall error range is 1μm to 10μm, so the widths of the first and second connection areas are 3μm to 20μm, preferably 15μm. The width of the first connection area is the vertical distance from the left edge of the transparent substrate to the left edge of the light-transmitting area in the photomask, denoted by "c1". The width of the second connection area is the vertical distance from the top edge of the transparent substrate to the top edge of the light-transmitting area in the photomask, denoted by "c2". Additionally, in this sixth embodiment, the vertical distance from the left edge of the transparent substrate to the light emitter is a1, and the vertical distance from the right edge of the transparent substrate to the light emitter is a2.

[0046] The mask 4 is designed based on the position and structure of the first bonding area 2031, the second bonding area 2032, and the transparent substrate 3. In this embodiment, the mask is designed with the following structure: The mask includes a light-transmitting area 401 and a light-shielding area 402. The light-transmitting area 401 matches the structure of the stripping area and is used for laser transmission. The light-shielding area 402 matches the structure of the area outside the stripping area 302 and is used to block the laser. During laser stripping, the mask 4 is placed in the optical path between the laser and the transparent substrate 3. The mask 4 and the transparent substrate 3 are staggered: the light-transmitting area 401 corresponds to the stripping area 302, and the light-shielding area 402 covers the area outside the stripping area 302. The area outside the stripping area includes the first connecting area 3011 and the second connecting area 3012. The widths of the first connecting area and the second connecting area are both greater than the overall error. During laser stripping, even if there is a certain error, the adjacent first bonding area 2031 and second bonding area 2032 will not be burned.

[0047] The difference between Embodiment Six and Embodiment Two is that the transparent substrate 3 in Embodiment Six has a first protrusion 3001, and the right end of the peeling area 302 extends outward, that is, the right end of the peeling area 302 extends away from the first connecting area 3011 to form the first protrusion 3001. The first protrusion 3001 is the vertical distance from the right edge of the transparent substrate to the adjacent light emitter, which is denoted by "t1", and t1 is greater than a2.

[0048] To ensure that the light-transmitting area 401 completely covers the stripping area 302, the right end of the light-transmitting area 401 protrudes beyond the edge of the first protrusion of the stripping area 302 to form a second protrusion 4001, as shown in the reference. Figure 11 , Figure 12 .

[0049] It should be noted that in another embodiment (i.e., embodiment seven), the left end of the stripping region 302 is the first connecting region 3011, and the right end is the first protrusion 3001. The first protrusion 3001 is the vertical distance from the right edge of the transparent substrate to the adjacent light emitter, denoted by "t1", where t1 is greater than a2. The lower end of the stripping region 302 protrudes to form a first lower protrusion 3003. The width of the first lower protrusion is the vertical distance from the lower edge of the transparent substrate to the adjacent light emitter, denoted by "t3", where t3 is greater than a4.

[0050] In this seventh embodiment, to ensure that the light-transmitting area 401 completely covers the peeling area 302, the right end of the light-transmitting area 401 protrudes beyond the edge of the first protrusion of the peeling area 302 to form a second protrusion 4001, and the lower end of the light-transmitting area 401 protrudes beyond the edge of the first lower protrusion of the peeling area 302 to form a second lower protrusion 4003. (Refer to...) Figure 13 , Figure 14 . Example 8

[0051] A photomask is used in a laser lift-off process to peel off a transparent substrate from a display screen, which is the aforementioned LED micro-display screen. In this embodiment, the LED micro-display screen has bonding areas 203 on three sides of the light-emitting chip, namely: a first bonding area 2031 on the left side of the light-emitting chip, a second bonding area 2032 on the upper side of the light-emitting chip, and a third bonding area 2033 on the lower side of the light-emitting chip. During laser lift-off, the laser spot / light should be prevented from irradiating the first bonding area 2031, the second bonding area 2032, and the third bonding area 2033.

[0052] First, the transparent substrate 3 is divided into a connection area 301 and a stripping area 302. The connection area 301 refers to the area of ​​the transparent substrate 3 near the wire bonding area 203, and the stripping area 302 refers to the area of ​​the transparent substrate 3 outside the connection area. The transparent substrate 3 is horizontal strip-shaped and the preferred material is sapphire. In this embodiment, the connection area 301 includes a vertical strip-shaped first connection area 3011, a horizontal strip-shaped second connection area 3012, and a horizontal strip-shaped third connection area 3013. The first connection area 3011 is located at the left edge of the transparent substrate and to the left of the release area 302, that is, between the first wire bonding area 2031 and the left side of the release area, and is adjacent to the first wire bonding area 2031. The second connection area 3012 is located at the upper edge of the transparent substrate and above the release area 302, that is, between the second wire bonding area 2032 and the upper side of the release area, and is adjacent to the second wire bonding area 2032. The third connection area 3013 is located at the lower edge of the transparent substrate and below the release area 302, that is, between the third wire bonding area 2033 and the lower side of the release area, and is adjacent to the third wire bonding area 2033. To reduce the impact of overall error, the widths of the first, second, and third connection areas are all greater than the overall error, which includes laser irradiation error, operational error, and cutting error. In this embodiment, the overall error ranges from 1μm to 10μm, and the widths of the first, second, and third connection areas range from 3μm to 20μm, preferably 15μm. The width of the first connection area is the vertical distance from the left edge of the transparent substrate to the left edge of the light-transmitting area in the mask, denoted by "c1". The width of the second connection area is the vertical distance from the top edge of the transparent substrate to the top edge of the light-transmitting area in the mask, denoted by "c2". The width of the third connection area is the vertical distance from the bottom edge of the transparent substrate to the bottom edge of the light-transmitting area in the mask, denoted by "c3". Furthermore, in this embodiment eight, the vertical distance from the left edge of the transparent substrate to the light emitter is a1, the vertical distance from the top edge of the transparent substrate to the light emitter is a3, and the vertical distance from the bottom edge of the transparent substrate to the light emitter is a4.

[0053] The mask 4 is designed based on the position and structure of the first bonding area 2031, the second bonding area 2032, the third bonding area 2033, and the transparent substrate 3. In this embodiment, the mask is designed with the following structure: The mask includes a light-transmitting area 401 and a light-shielding area 402. The light-transmitting area 401 is structurally matched with the stripping area and is used for laser transmission. The light-shielding area 402 is structurally matched with the area outside the stripping area 302 and is used to block the laser. During laser stripping, the mask 4 is placed in the optical path between the laser and the transparent substrate 3. The mask 4 and the transparent substrate 3 are staggered: the light-transmitting area 401 corresponds to the stripping area 302, and the light-shielding area 402 covers the area outside the stripping area 302. The area outside the stripping area includes the first connecting area 3011, the second connecting area 3012, and the third connecting area 3013. The widths of the first connection area, the second connection area, and the third connection area are all greater than the overall error. During laser stripping, even if there is a certain error, the adjacent first wire bonding area 2031, the second wire bonding area 2032, and the third wire bonding area 2033 will not be burned.

[0054] In this embodiment, a first protrusion 3001 is provided in the transparent substrate 3. The right end of the peeling area 302 extends outward, that is, the right end of the peeling area 302 extends away from the first connecting area 3011 to form the first protrusion 3001. The first protrusion 3001 is the vertical distance from the right edge of the transparent substrate to the adjacent light emitter, denoted by "t1". t1 is greater than a2. (Refer to...) Figure 15 , Figure 16 .

[0055] To ensure that the light-transmitting area 401 completely covers the stripping area 302, the right end of the light-transmitting area 401 protrudes from the edge of the first protrusion of the stripping area 302 to form a second protrusion 4001.

[0056] In embodiments four to eight above, the provision of the first protrusion 4001 and / or the first upper protrusion and / or the first lower protrusion facilitates mechanical peeling. In the laser peeling process, after the laser irradiates the peeling area, reducing the adhesion between the peeling area 302 and the light-emitting body 1, mechanical peeling is required to separate the transparent substrate 3 from the light-emitting body 1. Traditional mechanical peeling involves pressing one side of the transparent substrate 3 and pushing or pulling the other side of the transparent substrate 3. If the edge of the transparent substrate is close to the adjacent light-emitting body, it is not easy to push or pull. In embodiments four to eight of this application, a first protrusion and / or the first upper protrusion and / or the first lower protrusion are provided on the other side of the transparent substrate. The widths of the first protrusion t1, the first upper protrusion t2, and the first lower protrusion t3 are all greater than or equal to 0.5 mm. During mechanical peeling, the first protrusion or the first upper protrusion or the first lower protrusion is used as the force-bearing area, thereby facilitating the implementation of the pushing or pulling operation and improving peeling efficiency.

[0057] In addition, this application also provides a carrier device, in which the mask 4 from Embodiments 1 to 8 is applied, forming the carrier device of Embodiment 1, the carrier device of Embodiments 2 to 8, respectively. (Refer to...) Figures 1-18 .

[0058] The specific structure of the carrier device in Embodiment 1 includes: a carrier plate 5 and a mask plate from Embodiment 1. The specific structure of the carrier device in Embodiment 2 includes: a carrier plate 5 and a mask plate from Embodiment 2 to Embodiment 8. The carrier plate structures of the carrier devices in Embodiments 1, 2, 3, and 8 are the same, all including a carrier plate body 501 and a placement area 502 formed on the carrier plate body 501. The placement area 502 matches the shape of the display screen and is used to place the display screen, which is an LED micro display screen. The specific structure of the mask plate 4 is as described in Embodiments 1 to 8 above, and will not be repeated here.

[0059] In the carrier devices of Embodiments 1 to 8, to facilitate the corresponding installation of the mask of Embodiment 1 or the mask of Embodiments 2 to 8 with the carrier plate, a first bolt hole 403 is opened on the edge of the mask of Embodiment 1 or the mask of Embodiments 2 to 8, and a second bolt hole 504 is opened on the edge of the carrier plate body 501. The first bolt hole 403 and the second bolt hole 504 correspond to each other, and the bolts pass through the first bolt hole 403 and the second bolt hole 504 in sequence to fix the mask of Embodiment 1 or the mask of Embodiments 2 to 8 to the carrier plate 5.

[0060] After the mask in Embodiment 1 or Embodiments 2 to 8 is installed in accordance with the carrier plate 5, the alignment of the light-transmitting area and the stripping area is achieved. The alignment operation is simple and quick. In addition, the mask and the transparent substrate are misaligned in this application, which reduces the impact of the laser on the adjacent wire bonding area and helps to further improve the stripping efficiency and yield.

[0061] In addition, during mechanical peeling, the LED micro-display screen needs to be fixed to facilitate the smooth peeling of the transparent substrate 3. This application incorporates a vacuum adsorption assembly in the support devices of Embodiments 1, 2, to 8. The vacuum adsorption assembly includes a vacuum adsorption hole 503, located below the placement area 502 in the support plate body. One end of the vacuum adsorption hole 503 penetrates through the support plate body 501 and corresponds to the bottom end of the display screen; the other end is connected to a vacuum generator. After laser irradiation, during mechanical peeling, the display screen is first adsorbed and fixed through the vacuum adsorption hole 503 to prevent displacement or damage during peeling, thus facilitating the smooth peeling of the transparent substrate 3.

[0062] To improve laser stripping efficiency, several placement areas are provided in the carrier device of Embodiment 1, Embodiment 2 to Embodiment 8. The placement areas are grooves, and the shape of the grooves matches the shape of the drive board. The placement areas are arrayed in the carrier board body. At the same time, several arrayed light-transmitting areas 401 are provided in the corresponding photomask of Embodiment 1, Embodiment 2 to Embodiment 8. The light-transmitting areas 401 are set one-to-one with the placement areas 502. With this structure, laser stripping processing of multiple displays can be achieved at one time, which greatly improves the processing efficiency.

[0063] The above-described carrier device of Embodiment 1 or Embodiments 2 to 8 is applied to the laser ablation process. The laser irradiation area is controlled by the carrier device of Embodiment 1 or Embodiments 2 to 8. This application uses the carrier device of Embodiment 1 as an example to illustrate its working principle. The specific steps for laser ablation using the carrier device of Embodiment 1 include: S1. Provide a display screen, which is an LED micro display screen. Place the LED micro display screen in the placement area 502.

[0064] S2. Divide the transparent substrate 3 into a connection region 301 and a stripping region 302. The connection region 301 refers to the area of ​​the transparent substrate 3 near the wire bonding area, and the stripping region 302 refers to the area of ​​the transparent substrate 3 outside the connection region.

[0065] S3. Provide a mask template for Example 1.

[0066] It should be further explained that a suitable mask is selected according to the position and structure of the wire bonding area and the transparent substrate. For example, when the wire bonding area is located on the left side of the transparent substrate, the mask of Embodiment 1 or the mask of Embodiments 4 and 5 is selected. When the wire bonding area is located on the left or upper side of the transparent substrate, the mask of Embodiment 2 or the mask of Embodiments 6 and 7 is selected. When the wire bonding area is located on the left, upper or lower side of the transparent substrate, the mask of Embodiment 3 or Embodiment 8 is selected.

[0067] S4. Place the mask from Example 1 in the optical path between the laser and the transparent substrate, and connect the mask to the carrier plate 5.

[0068] S5. The laser passes through the light-transmitting area 401 and irradiates the stripping area 302, reducing the adhesion between the transparent substrate 3 and the light-emitting body. S6. The transparent substrate 3 is peeled off by mechanical peeling, for example by adsorbing and fixing the display screen through the vacuum adsorption hole 503, and then pushing or pulling the first protrusion 3001 to separate the transparent substrate 3 from the light emitter.

[0069] The removal of the transparent substrate 3 helps to reduce light crosstalk, improve the light extraction efficiency and display brightness of the display screen. In addition, in some embodiments, removing the transparent substrate facilitates the subsequent application of color film to meet the color display requirements of the display screen.

[0070] To facilitate mechanical peeling by pushing or pulling the transparent substrate 3, specific embodiments of two mechanical peeling components are provided below. Example 1: Mechanical Peeling Component The mechanical peeling assembly includes a push rod 6, one end of which corresponds to the bottom end of one of the protrusions. This application takes the case where the push rod 6 corresponds to the bottom end of the first protrusion 3001 as an example.

[0071] refer to Figure 19 , Figure 20 The mechanical peeling assembly is installed in the support device. A through groove 7 is formed on one side of the placement area 502 in the support plate body, below the first protrusion 3001. The shape of the through groove 7 matches the shape of the push rod 6 and is used to place the push rod 6. In this embodiment, the through groove 7 is distributed along the Y direction of the support plate body 501, and its two ends pass through the upper edge and lower edge of the support plate body 501, respectively. The push rod 6 is distributed along the Y direction of the support plate body 501, slidably installed in the through groove 7, and its two ends extend outward, protruding from the support plate body 501 to form a third protrusion 601. The third protrusion 601 is used to apply pushing or pulling force. For example, when manually applying external force, the third protrusion 601 facilitates the operator to manually push or pull the push rod 6.

[0072] In this embodiment, the push rod 6 is arranged side by side with the placement area 502 in the same column. When the push rod 6 is raised, it can simultaneously push multiple transparent substrates 3 in the same column of placement area 502, so that the transparent substrates 3 placed in the same column can be peeled off at the same time, thereby meeting the batch processing requirements and improving the peeling efficiency.

[0073] Example 2 Mechanical peeling assembly The mechanical peeling assembly includes a push rod 6, one end of which corresponds to the bottom end of one of the protrusions. This application takes the case where the push rod 6 corresponds to the bottom end of the first protrusion 3001 as an example.

[0074] refer to Figure 21 , Figure 22The mechanical peeling assembly is installed in the carrier device. In this embodiment, a through groove 7 is opened in the Z direction of the carrier plate body 501, and push rods 6 are distributed along the Z direction and slidably installed in the corresponding through grooves 7. The two ends of the push rods 6 pass through the top and bottom ends of the carrier plate body 501, with one end corresponding to the bottom end of the first protrusion 3001 and the other end connected to the drive mechanism. The drive structure includes a base 8, and the other end of the push rod 6 is vertically fixed to the top end of the base 8. During mechanical peeling, the base 8 drives the push rod 6 to rise and fall under the action of external force. When the push rod 6 rises, it pushes the first protrusion 3001, that is, pushes one side of the transparent substrate 3, thereby separating the transparent substrate 3 from the light emitter 1 and realizing peeling.

[0075] Placement areas 502 are arrayed within the carrier plate body 501. Each placement area 502 has a push rod 6 on one side, and the push rods 6 are distributed in an array within the carrier plate body 501. When peeling off the transparent substrate 3, a laser scans the light-transmitting area 401 in each transparent substrate, reducing the adhesion between each transparent substrate 401 and the light-emitting element 1, followed by mechanical peeling. During this process, each push rod 6 is lifted under the action of the driving mechanism. The push rod 6 is a spring rod, ensuring that the first protrusion of each transparent substrate can be subjected to force, thereby ensuring effective separation of each transparent substrate from the light-emitting chip.

[0076] Applying the mechanical peeling device of Embodiment 1 or Embodiment 2 to the laser peeling process to peel off the transparent substrate in the display screen, the specific steps include: S1. Provide a mask as described in Example 4.

[0077] S2. A laser peeling process is used to reduce the adhesion between the transparent substrate and the light emitter in the display screen. Specifically, S21. A display screen is provided in which the right end of the transparent substrate protrudes outward to form a first protrusion.

[0078] S22. Divide the transparent substrate into a connection area and a stripping area. The connection area refers to the region of the transparent substrate near the wire bonding area, and the stripping area refers to the region of the transparent substrate outside the connection area. S23. The mask of embodiment four is placed in the optical path between the laser and the mechanical stripping device. The light-transmitting area in the mask corresponds to the stripping area in the transparent substrate. The light-shielding area blocks the area outside the stripping area. The area outside the stripping area includes the first connection area.

[0079] S24. The laser passes through the light-transmitting area and irradiates the stripping area, reducing the adhesion between the transparent substrate 3 and the light-emitting body. The laser can only irradiate the stripping area through the light-transmitting area. The first connecting area 3011 is located in the area between the stripping area and the first wire bonding area 2031. The first connecting area 3011 and the adjacent first wire bonding area 2031 are blocked by the shielding area, preventing the laser from passing through. This effectively avoids the problem of the laser spot / ray irradiating the wire bonding area and causing burn damage to the wire bonding area, thereby avoiding the impact on the electrical performance of the display screen and ensuring the laser stripping yield.

[0080] S3. The transparent substrate 3 is peeled off by mechanical peeling. Specifically, S31. The display screen is fixed by adsorption through vacuum adsorption holes. S32. Push or pull the first protrusion 3001 to separate the transparent substrate 3 from the light emitter 1. When using the mechanical peeling device in Embodiment 2, the base of the drive mechanism is raised and lowered, and the base drives the push rod 6 to rise and fall. When the push rod 6 rises, it pushes the first protrusion 3001, that is, pushes one side of the transparent substrate, thereby separating the transparent substrate 3 from the light emitter 1 and achieving peeling.

[0081] It should be noted that, in another embodiment, when using the mechanical peeling device in Embodiment 1, the push rod 6 can be manually pulled to raise and lower the push rod 6. When the push rod 6 rises, it pushes the first protrusion 3001, that is, pushes one side of the transparent substrate, thereby separating the transparent substrate 3 from the light-emitting body 1 and achieving peeling.

[0082] The combination of the push rod and any protrusion, such as the combination of the push rod and the first protrusion, improves the convenience of pulling or pushing operations and further reduces the difficulty of peeling off the transparent substrate. In addition, the vacuum adsorption component facilitates the fixing of the display screen and avoids problems such as breakage caused by manual pressing of the display screen. The combination of the push rod, protrusion and vacuum adsorption component further reduces the difficulty of peeling off the transparent substrate and facilitates the rapid peeling off of the transparent substrate.

[0083] It is understood that the above detailed description of the present invention is for illustrative purposes only and is not intended to limit the technical solutions described in the embodiments of the present invention. Those skilled in the art should understand that modifications or equivalent substitutions can still be made to the present invention to achieve the same technical effects; as long as the usage requirements are met, they are all within the protection scope of the present invention.

Claims

1. A photomask for use in the fabrication process of a display screen, the display screen comprising: The light-emitting chip and the driving board (2) include a mounting area and a wire bonding area (203) located on at least one side of the mounting area. The wire bonding area (203) is used for electrical connection to external signals. The light-emitting chip is mounted in the mounting area and electrically connected to the driving board (2). The light-emitting chip includes a plurality of light emitters (1) and a transparent substrate (3) covering the light-emitting surface of the light emitters. The transparent substrate (3) comprises: The connection area (301) refers to the region in the transparent substrate (3) that is close to the wire bonding area (203); The stripping region (302) refers to the area outside the connection region in the transparent substrate (3); The photomask includes: The light-transmitting area (401) is used for laser transmission; The light-shielding area (402) is used to block the laser; During laser stripping, the mask is located in the optical path between the laser and the transparent substrate (3). The mask and the transparent substrate (3) are misaligned: the light-transmitting area (401) corresponds to the stripping area (302), the light-shielding area (402) covers the area outside the stripping area (302), and the area outside the stripping area includes the connecting area (301).

2. The photomask according to claim 1, characterized in that, The driver board (2) is provided with a first pad and a second pad. The first pad is located in the mounting area and the second pad is located in the wire bonding area (203). The electrode of the light-emitting body is electrically connected to the first pad, and external signals are electrically connected to the light-emitting body through the second pad and the first pad.

3. The photomask according to claim 1 or 2, characterized in that, The light-emitting chip is an integrated LED chip.

4. The photomask according to claim 3, characterized in that, The width of the connection area (301) is 3μm~20μm.

5. The photomask according to claim 1, characterized in that, The bonding area (203) includes a first bonding area (2031) and / or a second bonding area (2032) and / or a third bonding area (2033). The first bonding area (2031) is located on the left or right side of the light-emitting chip, the second bonding area (2032) is located on the upper or lower side of the light-emitting chip, and the third bonding area (2033) is located on the lower or upper side of the light-emitting chip. The connection area (301) includes a first connection area (3011) and / or a second connection area (3012) and / or a third connection area (3013). The first connection area (3011) is adjacent to the first bonding area (2031), the second connection area (3012) is adjacent to the second bonding area (2032), and the third connection area (3013) is adjacent to the third bonding area (2033).

6. A supporting device, characterized in that, It includes: The carrier plate (5) includes a carrier plate body (501) and a placement area (502) formed on the carrier plate body (501). The placement area (502) is used to place the display screen. The display screen includes: a light-emitting chip and a driving board (2). The driving board (2) includes an installation area and a wire bonding area (203) located on at least one side of the installation area. The wire bonding area (203) is used to electrically connect external signals. The light-emitting chip is installed in the installation area and electrically connected to the driving board (2). The light-emitting chip includes a plurality of light-emitting elements (1) and a transparent substrate (3) covering the light-emitting surface of the light-emitting elements. The transparent substrate (3) includes: a connection area (301) and a stripping area (302). The connection area (301) refers to the area in the transparent substrate (3) close to the wire bonding area (203). The stripping area (302) refers to the area in the transparent substrate (3) other than the connection area. A photomask, wherein the photomask is the photomask as described in claim 1; During laser stripping, the mask is located in the optical path between the laser and the transparent substrate (3). The light-transmitting area (401) corresponds to the stripping area (302), and the light-shielding area (402) corresponds to the area outside the stripping area. The area outside the stripping area includes the connecting area (301).

7. The bearing device according to claim 6, characterized in that, The mask plate has a first bolt hole on its edge, and the support plate body (501) has a second bolt hole on its edge. The first bolt hole corresponds to the second bolt hole, and the bolt passes through the first bolt hole and the second bolt hole in sequence to fix the mask plate and the support plate (5) together.

8. The bearing device according to claim 7, characterized in that, The carrier plate body (501) is provided with a plurality of arrayed placement areas (502), and the mask is provided with a plurality of arrayed light-transmitting areas (401), and the light-transmitting areas (401) correspond one-to-one with the placement areas (502).

9. A laser ablation method, characterized in that, The method includes: A display screen is provided, the display screen includes: a light-emitting chip and a driving board (2), the driving board (2) includes a mounting area and a wire bonding area (203) located on at least one side of the mounting area, the wire bonding area (203) is used for electrical connection to external signals, the light-emitting chip is mounted in the mounting area and electrically connected to the driving board (2), the light-emitting chip includes a plurality of light emitters and a transparent substrate (3) covering the light-emitting surface of the light emitters. The transparent substrate (3) is divided into a connection area (301) and a stripping area (302). The connection area (301) refers to the area of ​​the transparent substrate (3) near the wire bonding area (203), and the stripping area (302) refers to the area of ​​the transparent substrate (3) outside the connection area. A photomask is provided, the photomask being the photomask of claim 1, the photomask including a light-transmitting area (401) and a light-blocking area (402), the light-transmitting area (401) being used for laser transmission, and the light-blocking area (402) being used for blocking laser. The photomask is placed in the optical path between the laser and the transparent substrate (3); The laser passes through the light-transmitting area (401) and irradiates the stripping area (302). The light-shielding area (402) blocks the area outside the stripping area, and the area outside the stripping area includes the connecting area (301). Peel off the transparent substrate (3).

10. The laser ablation method according to claim 9, characterized in that, The transparent substrate (3) was peeled off by mechanical peeling.

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