Circuit board, light-emitting device and manufacturing method of light-emitting device

Abstract

The invention discloses a circuit board, a light-emitting device and a manufacturing method of the light-emitting device, the circuit board is provided with a driving IC chip die bonding area, the driving IC chip die bonding area is internally provided with a plurality of driving IC chip pin bonding pads, any driving IC chip pin bonding pad is provided with a plurality of grooves, the plurality of grooves form a plurality of groove units, and the plurality of groove units are arranged in the driving IC chip die bonding area. The plurality of groove units are arranged in an array; and any one of the driving IC chip pin bonding pads is covered with a first solder. The light-emitting device comprises the circuit board, a driving IC chip and a light-emitting chip, the pins of the driving IC chip are correspondingly welded in the pin bonding pads of the driving IC chip, and second solder is arranged on the pins of the driving IC chip. According to the circuit board provided by the invention, the groove design is adopted on the driving IC chip bonding pad, and the first solder is covered on the driving IC chip bonding pad, so that the tin connection rate and the pseudo soldering rate during welding and die bonding are reduced, the die bonding process is effectively optimized, and the yield and the reliability of a light-emitting device are improved.

Description

Technical Field

[0001] This invention relates to the field of light-emitting device technology, and in particular to a circuit board, a light-emitting device, and a method for manufacturing the light-emitting device. Background Technology

[0002] In recent years, integrated lamp-driver devices have become increasingly popular in the LED direct-view display market due to their advantages such as low power consumption, thinner cabinets for backend applications, and simple wiring. Furthermore, compared to traditional wire-bonded integrated lamp-driver devices, the latest devices utilize a fully flip-chip packaging process, offering a wider viewing angle, higher brightness, and better heat dissipation. This has made them a highly sought-after product for end-users. However, their development is still hampered by high technical difficulty and low yield rates. This is because traditional LED flip-chip packaging processes often result in solder bridging and cold solder joints. This is because the driver IC chip has many pins with small spacing, leading to similarly small spacing between the pads on the circuit board. When soldering the driver IC chip and circuit board using solder paste, the high fluidity of the solder paste causes it to spread rapidly between adjacent pins or pads due to surface tension, overflowing and connecting, leading to short circuits and cold solder joints. This negatively impacts device yield and severely restricts the yield of fully flip-chip integrated driver IC processes. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art. This invention provides a circuit board, a light-emitting device, and a method for manufacturing the light-emitting device. The driver IC chip pads on the circuit board are designed with grooves and covered with low-temperature solder paste to reduce the solder bridging rate and cold solder joint rate during die bonding, effectively optimize the die bonding process, and improve the yield and reliability of the light-emitting device.

[0004] This invention provides a circuit board, wherein a die-bonding area for a driver IC chip is provided on the circuit board, and a plurality of driver IC chip pin pads are provided in the die-bonding area for the driver IC chip. A plurality of grooves are formed on any one of the driver IC chip pin pads, and the plurality of grooves form a plurality of groove units, which are arranged in an array. The first solder is applied to the pads of any one of the driver IC chip pins.

[0005] Furthermore, the depth of the groove is 2um-5um.

[0006] Furthermore, the opening width of the groove is 2um-5um.

[0007] Furthermore, the plurality of groove units are arranged in a honeycomb array.

[0008] Furthermore, the first solder is a low-temperature solder paste.

[0009] Furthermore, the low-temperature solder paste is Sn-Bi low-temperature solder paste or Sn-Bi-Ag low-temperature solder paste.

[0010] Furthermore, the melting point of the low-temperature solder paste is 125℃-180℃.

[0011] Furthermore, the circuit board is also provided with a die-bonding area for light-emitting chips, and the die-bonding area for light-emitting chips is provided with a plurality of die-bonding pads for light-emitting chips.

[0012] The present invention provides a light-emitting device, which includes the circuit board, the driver IC chip and the light-emitting chip described above. The driver IC chip is die-bonded in the driver IC chip die-bonding area of ​​the circuit board, and the light-emitting chip is die-bonded in the light-emitting chip die-bonding area of ​​the circuit board. The pins of the driver IC chip are soldered onto the pin pads of the driver IC chip, and a second solder is provided on the pins of the driver IC chip.

[0013] Furthermore, the second solder is a high-temperature solder ball.

[0014] Furthermore, the high-temperature solder ball is a SAC305 high-temperature solder ball, a SAC307 high-temperature solder ball, or a Sn5Pb95 high-temperature solder ball.

[0015] Furthermore, the melting point of the high-temperature solder ball is 200℃-310℃.

[0016] Furthermore, the driver IC chip includes several sets of light-emitting chip control pins, power supply pins, ground pins, data input pins, and data output pins, which are correspondingly soldered onto the pin pads of the driver IC chip.

[0017] Furthermore, any set of light-emitting chip control pins includes a red light chip control pin, a green light chip control pin, and a blue light chip control pin.

[0018] Furthermore, the back of the circuit board is provided with power pads, ground pads, data input pads, and data output pads.

[0019] Furthermore, the plurality of groups of light-emitting chip control pins are connected to the corresponding pins of the light-emitting chip; The power pin is connected to the power pad; The grounding pin is connected to the grounding pad; The data input pin is connected to the data input pad; The data output pin is connected to the data output pad.

[0020] The present invention also provides a method for manufacturing a light-emitting device, the method being used to manufacture the aforementioned light-emitting device, the method comprising: The circuit board is preheated to a first heating temperature, causing the first solder covering the pin pads of the driver IC chip to melt. Place the pins of the driver IC chip in the pin pads of the driver IC chip; The circuit board and driver IC chip are heated to a second heating temperature, causing the second solder on the pins of the driver IC chip to melt. The circuit board and driver IC chip are cooled to produce a light-emitting device.

[0021] This invention provides a circuit board, a light-emitting device, and a method for manufacturing the light-emitting device. A groove design is adopted on the pads of the driver IC chip on the circuit board to form an array of groove units, increasing the contact area for molten solder spreading and significantly reducing the risk of molten solder overflow and extension, thus reducing the solder bridging rate and cold solder joint rate during die bonding. Low-temperature solder paste is covered on the pads of the driver IC chip on the circuit board, while high-temperature solder balls are placed on the pins of the driver IC chip. Based on the solder paste with different melting points, different heating temperatures are used to ensure sequential melting, achieving "first-melt-drives-later-melt," effectively optimizing the die bonding process and improving the yield and reliability of the light-emitting device. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the circuit board structure in Embodiment 1 of the present invention; Figure 2 This is in Embodiment 1 of the present invention Figure 1 Enlarged schematic diagram of the structure at point a; Figure 3 This is a side view of the circuit board structure in Embodiment 1 of the present invention; Figure 4 This is in Embodiment 1 of the present invention Figure 2 Enlarged schematic diagram of the structure at point b; Figure 5 This is in Embodiment 1 of the present invention Figure 3 Enlarged schematic diagram of the structure at point c; Figure 6 This is a schematic diagram of the light-emitting device structure in Embodiment 2 of the present invention; Figure 7 This is a schematic diagram of the pin structure of the driver IC chip in Embodiment 2 of the present invention; Figure 8 This is a schematic diagram of the back structure of the circuit board in Embodiment 2 of the present invention; Figure 9 This is a schematic diagram of the connection structure between the driver IC chip and the light-emitting chip in Embodiment 2 of the present invention; Figure 10 This is a flowchart of the fabrication method of the light-emitting device in Embodiment 3 of the present invention. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] In this invention, it should be understood that terms such as “comprising” or “having” are intended to indicate the presence of features, figures, steps, behaviors, components, portions or combinations thereof disclosed in this specification, and are not intended to exclude the possibility that one or more other features, figures, steps, behaviors, components, portions or combinations thereof are present or added.

[0026] It should also be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0027] Example 1 Embodiment 1 of the present invention provides a circuit board, wherein a die-bonding area for a driver IC chip is provided on the circuit board, and a plurality of driver IC chip pin pads are provided in the die-bonding area for the driver IC chip. A plurality of grooves are formed on any one of the driver IC chip pin pads, and the plurality of grooves form a plurality of groove units, which are arranged in an array; a first solder is covered on any one of the driver IC chip pin pads.

[0028] In one optional implementation of this embodiment, such as Figure 1 As shown, Figure 1 The diagram shows a circuit board structure according to Embodiment 1 of the present invention. The circuit board 1 is provided with a die bonding area 2 for a driver IC chip, and a plurality of driver IC chip pin pads 3 are provided in the die bonding area 2 for the driver IC chip.

[0029] Specifically, the die-bonding region 2 of the driver IC chip is used for die-bonding the driver IC chip.

[0030] Furthermore, such as Figure 2 As shown, Figure 2 The first embodiment of the present invention is shown. Figure 1 Enlarged schematic diagram of the structure at point a. Figure 3 A side view of the circuit board structure in Embodiment 1 of the present invention is shown. Figure 2 The image shows a magnified view of the structure of a single driver IC chip pin pad 3. Figure 2 As can be seen, a number of grooves 41 are formed on the pin pads 3 of the driver IC chip, and the number of grooves 41 form a number of groove units 42, which are arranged in an array.

[0031] Specifically, a plurality of grooves 41 are formed on the pin pads 3 of the driver IC chip, wherein six grooves 41 form a plurality of hexagonal groove units 42 as edges, and the plurality of hexagonal groove units 42 are arranged in an array.

[0032] In an optional implementation of this embodiment, the plurality of groove units 42 are arranged in a honeycomb array.

[0033] Specifically, in this embodiment, the plurality of hexagonal groove units 42 are arranged in an array to form a honeycomb array groove. In practical applications, the shape of the groove units 42 and the way they are arranged in an array can be set according to actual design requirements.

[0034] In one optional implementation of this embodiment, such as Figure 4 As shown, Figure 4 The first embodiment of the present invention is shown. Figure 2 Enlarged schematic diagram of the structure at point b. Figure 4 The structure of the groove 41 can be seen more clearly in the image, such as... Figure 4 As shown, the opening width w of the groove 41 is 2um-5um. Here, one or more values ​​of 2um, 3um, 4um, and 5um can be selected, and the value is set according to the actual design requirements. When it is determined that a larger pad space is needed, the opening width is set to be larger, and when it is determined that a larger pad space is not needed, the opening width is set to be smaller.

[0035] In one optional implementation of this embodiment, such as Figure 5 As shown, Figure 5 The first embodiment of the present invention is shown. Figure 3 A magnified schematic diagram of the structure at point c. Figure 5The side view of the groove 41 can be seen more clearly. The depth d of the groove 41 is 2um-5um, and one or more values ​​of 2um, 3um, 4um and 5um can be selected. It is set according to the actual design requirements. When it is determined that a larger pad space is needed, the depth is set to be larger, and when it is determined that a larger pad space is not needed, the depth is set to be smaller.

[0036] Furthermore, from Figure 1 As can be seen, the spacing between several adjacent driver IC chip pin pads 3 in the die bonding region 2 of the driver IC chip is small. During the solder paste melting process, molten solder is prone to overflowing from the pads and extending. Therefore, this array of grooves is set on the driver IC chip pin pads 3. During solder melting, the diffusion of molten solder is limited by the capillary effect, providing a path and space for the flow of molten solder and alleviating the overflow phenomenon.

[0037] In an optional implementation of this embodiment, the pin pads 3 of the driver IC chip are covered with a first solder, which is a low-temperature solder paste.

[0038] Specifically, the low-temperature solder paste can be Sn-Bi low-temperature solder paste or Sn-Bi-Ag low-temperature solder paste; The low-temperature solder paste covering the pin pads 3 of the driver IC chip has a melting point of 125℃-180℃.

[0039] Specifically, the Sn-Bi low-temperature solder paste is a solder paste with tin and bismuth as the main alloying components, and the alloy composition is: Sn 42wt%, Bi 58wt%; The Sn-Bi-Ag low-temperature solder paste is a solder paste with tin, bismuth and silver as the main alloy components. The alloy composition is: Sn 64wt%, Bi 35wt%, Ag 1wt%. Both types of solder paste share the characteristic of being low-temperature solder pastes with melting points below 200℃. Specifically, the Sn-Bi low-temperature solder paste has a melting point of 125℃-140℃, while the Sn-Bi-Ag low-temperature solder paste has a melting point of 160℃-180℃.

[0040] Furthermore, the melting point of the low-temperature solder paste covering the pin pads 3 of the driver IC chip can be one of 125°C, 140°C, 160°C, or 180°C, which can be set according to actual design requirements.

[0041] Here, we consider covering the pads of the driver IC chip pins on the circuit board with low-temperature solder paste. When the pins of the driver IC chip are subsequently die-bonded to the pads, the low-temperature solder paste on the pads melts first to form a liquid surface, and then melts the high-temperature solder balls on the pins of the driver IC chip. The solder paste process is smoother and effectively improves the soldering strength and yield.

[0042] In one optional implementation of this embodiment, such as Figure 1 As shown, the circuit board 1 is also provided with a light-emitting chip die-bonding area 5, which is used for bonding the light-emitting chip.

[0043] Specifically, the die bonding region 5 of the light-emitting chip is provided with a plurality of die bonding pads 51 for the light-emitting chip.

[0044] In summary, Embodiment 1 of the present invention provides a circuit board in which the pads of the driver IC chip on the circuit board are designed with grooves to form an array of groove units, which increases the contact area of ​​molten solder spreading, significantly reduces the risk of molten solder overflow and extension, reduces the solder bridging rate and cold solder joint rate during soldering and die bonding, and improves the yield and reliability of light-emitting devices.

[0045] Example 2 Embodiment 2 of the present invention provides a light-emitting device, which includes the circuit board, driver IC chip and light-emitting chip as in Embodiment 1. The driver IC chip is die-bonded in the driver IC chip die-bonding area of ​​the circuit board, and the light-emitting chip is die-bonded in the light-emitting chip die-bonding area of ​​the circuit board. The pins of the driver IC chip are soldered to the pin pads of the driver IC chip, and a second solder is provided on the pins of the driver IC chip.

[0046] In one optional implementation of this embodiment, such as Figure 6 As shown, Figure 6 A schematic diagram of the light-emitting device structure in Embodiment 2 of the present invention is shown. The light-emitting device includes a circuit board 1, a driver IC chip 6, and a light-emitting chip 7. The driver IC chip 6 and the light-emitting chip 7 are die-bonded on the circuit board 1.

[0047] In an optional implementation of this embodiment, the driver IC chip 6 is die-bonded in the driver IC chip die-bonding area of ​​the circuit board 1, and the pins of the driver IC chip 6 are respectively soldered onto the pin pads of the driver IC chip.

[0048] In an optional implementation of this embodiment, when the driver IC chip 6 is not soldered to the circuit board 1, a second solder is provided on the pins of the driver IC chip 6.

[0049] Specifically, the second solder is a high-temperature solder ball.

[0050] Furthermore, the high-temperature solder balls disposed on the pins of the driver IC chip 6 can be SAC305 high-temperature solder balls, SAC307 high-temperature solder balls, or Sn5Pb95 high-temperature solder balls. The high-temperature solder balls on the pins of the driver IC chip 6 have a melting point of 200℃-310℃.

[0051] Specifically, the SAC305 and SAC307 high-temperature solder balls are solder balls with tin, silver, and copper as the main alloy components. The alloy composition of the SAC305 high-temperature solder ball is: Sn 96.5wt%, Ag 3.0wt%, Cu 0.5wt%, and the alloy composition of the SAC307 high-temperature solder ball is: Sn 99wt%, Ag 0.3wt%, Cu 0.7wt%. The Sn5Pb95 high-temperature solder ball is a solder ball with tin and lead as the main alloy components, and the alloy composition is: Sn 5wt%, Pb 95wt%; These three types of solder balls share the common characteristic of being high-temperature solder pastes with melting points above 200℃. Specifically, the SAC305 high-temperature solder ball has a melting point of 200℃-220℃, the SAC307 high-temperature solder ball has a melting point of 227℃, and the Sn5Pb95 high-temperature solder ball has a melting point of 310℃.

[0052] Furthermore, the melting point of the high-temperature solder balls set on the pins of the driver IC chip can be one of 200℃, 220℃, 227℃, 260℃, or 310℃, depending on the actual design requirements.

[0053] This approach considers using low-temperature solder paste on the pads of the driver IC chip pins and high-temperature solder balls on the pins of the driver IC chip. By using different solder paste materials, different melting temperatures are created, achieving "melting first to drive melting later" during soldering. This ensures that the solder paste does not spread out and reduces the risk of short circuits.

[0054] In an optional implementation of this embodiment, the driver IC chip 6 includes several sets of light-emitting chip control pins, power supply pins, ground pins, data input pins, and data output pins, which are correspondingly soldered onto the pin pads 61 of the driver IC chip.

[0055] Specifically, such as Figure 7 As shown, Figure 7This diagram illustrates the pin structure of the driver IC chip in Embodiment 2 of the present invention. The driver IC chip 6 includes eighteen pins, including four groups of light-emitting chip control pins (the first group R...). <0> G <0> B <0> Group 2 R <1> G <1> B <1> Group 3 R <2> G <2> B <2> Group 4 R <3> G <3> B <3> The four sets of LED control pins, two power supply pins (VDDR, VDDEF), ground pin GND, two data input pins (SDI0, SDI1), and data output pin SDO are soldered onto the driver IC chip pin pads 61.

[0056] Furthermore, any set of light-emitting chip control pins includes a red light chip control pin, a green light chip control pin, and a blue light chip control pin.

[0057] In one optional implementation of this embodiment, such as Figure 8 As shown, Figure 8 A schematic diagram of the back structure of a circuit board in Embodiment 2 of the present invention is shown. The back of the circuit board 1 is provided with power pads, ground pads, data input pads, and data output pads.

[0058] Specifically, it includes two power pads (VDDR, VDDGB), a ground pad (GND), two data input pads (SDI0, SDI1), and a data output pad (SDO).

[0059] In an optional implementation of this embodiment, the light-emitting chip 7 is die-bonded in the light-emitting chip die-bonding area of ​​the circuit board 1, and the pins of the light-emitting chip 7 are correspondingly soldered onto the light-emitting chip die-bonding pads.

[0060] Furthermore, in this embodiment, a total of four groups of light-emitting chips 7 are provided, which are respectively located at the four corners of the circuit board 1. The number of light-emitting chips 7 can be set according to actual design requirements.

[0061] In an optional implementation of this embodiment, the plurality of groups of light-emitting chip control pins are connected to the pins of the light-emitting chip respectively.

[0062] Specifically, such as Figure 9 As shown, Figure 9This diagram illustrates the connection structure between the driver IC chip and the light-emitting chip in Embodiment 2 of the present invention. The control pins of the light-emitting chip are connected to the pins of the light-emitting chip. In the first group of light-emitting chip control pins, R... <0> Connect the anode of the light-emitting chip R1, G <0> Connect the anode of the light-emitting chip G1, B <0> Connect the anode of the light-emitting chip B1, and the connection relationships of the remaining groups are similar. The cathodes of all light-emitting chips are grounded to GND.

[0063] In an optional implementation of this embodiment, the power supply pin is connected to the power supply pad; the ground pin is connected to the ground pad; the data input pin is connected to the data input pad; and the data output pin is connected to the data output pad.

[0064] Specifically, the power supply pin VDDR is connected to the power supply pad VDDR, the power supply pin VDDGB is connected to the power supply pad VDDGB, the ground pin GND is connected to the ground pad GND, the data input pin SDI0 is connected to the data input pad SDI0, the data input pin SDI1 is connected to the data input pad SDI1, and the data output pin SDO0 is connected to the data output pad SDO0.

[0065] In summary, Embodiment 2 of the present invention provides a light-emitting device, including the circuit board of Embodiment 1. A groove design is adopted on the pads of the driver IC chip on the circuit board to form an array of groove units, increasing the contact area for molten solder spreading, significantly reducing the risk of molten solder overflow and extension, and reducing the solder bridging rate and cold solder joint rate during die bonding. Low-temperature solder paste is covered on the pads of the driver IC chip on the circuit board, while high-temperature solder balls are placed on the pins of the driver IC chip. Based on the solder paste with different melting points, different heating temperatures are used to ensure sequential melting separation, achieving "first-melt-drives-later-melt," effectively optimizing the die bonding process and improving the yield and reliability of the light-emitting device.

[0066] Example 3 Embodiment 3 of the present invention provides a method for manufacturing a light-emitting device. The method is used to manufacture the light-emitting device in Embodiment 2. The method includes: preheating the circuit board to a first heating temperature to melt the low-temperature solder paste covering the pin pads of the driver IC chip; placing the pins of the driver IC chip in the pin pads of the driver IC chip; heating the circuit board and the driver IC chip to a second heating temperature to melt the high-temperature solder balls disposed on the pins of the driver IC chip; and cooling the circuit board and the driver IC chip to manufacture the light-emitting device.

[0067] In one optional implementation of this embodiment, such as Figure 10 As shown, Figure 10A flowchart illustrating the fabrication method of the light-emitting device according to Embodiment 3 of the present invention is shown, including the following steps: S101. Preheat the circuit board to a first heating temperature to melt the first solder covering the pin pads of the driver IC chip. In an optional implementation of this embodiment, the first solder is low-temperature solder paste. Since the melting point of the low-temperature solder paste covering the pin pads of the driver IC chip is 125℃-180℃, the first heating temperature needs to be set to be greater than 180℃. Since the melting point of the high-temperature solder balls on the pins of the driver IC chip is 200℃-310℃, the first heating temperature needs to be set to be less than 200℃. Therefore, the value range of the first heating temperature is 180℃-200℃. For example, the first heating temperature can be one of 180℃, 185℃, 190℃, 195℃, and 200℃, determined according to the actual design requirements.

[0068] Furthermore, heating is stopped after the low-temperature solder paste covering the pin pads of the driver IC chip has completely melted.

[0069] S102. Place the pins of the driver IC chip in the pin pads of the driver IC chip; In an optional implementation of this embodiment, the pins of the driver IC chip are placed in the corresponding driver IC chip pin pads.

[0070] It should be noted that at this time, the solder paste in the pads of the driver IC chip pins has melted into molten solder and filled the array grooves.

[0071] S103. The circuit board and driver IC chip are heated to a second heating temperature, so that the second solder on the pins of the driver IC chip melts. In an optional implementation of this embodiment, the second solder is a high-temperature solder ball, and the second heating temperature needs to be set to be greater than the melting point of the high-temperature solder ball set on the pin of the driver IC chip. Therefore, the value range of the second heating temperature is greater than 310°C, and can be 310°C, 330°C, 350°C, 400°C, etc., determined according to actual design requirements.

[0072] Furthermore, heating is stopped after the high-temperature solder balls placed on the pins of the driver IC chip have completely melted.

[0073] S104. Cool the circuit board and driver IC chip to produce a light-emitting device.

[0074] In one optional implementation of this embodiment, the circuit board and driver IC chip are subjected to slow cooling to solidify the molten solder, forming a die bond structure and manufacturing a light-emitting device.

[0075] In summary, Embodiment 3 of the present invention provides a method for fabricating a light-emitting device, used to fabricate the light-emitting device in Embodiment 2, including the circuit board in Embodiment 1. A groove design is adopted on the pads of the driver IC chip on the circuit board to form an array of groove units, increasing the contact area for molten solder spreading, significantly reducing the risk of molten solder overflow and extension, and reducing the solder bridging rate and cold solder joint rate during die bonding. Low-temperature solder paste is covered on the pads of the driver IC chip on the circuit board, while high-temperature solder balls are placed on the pins of the driver IC chip. Based on the solder paste with different melting points, different heating temperatures are used to ensure separation of melting sequence, achieving "first-melt-drives-later-melt," effectively optimizing the die bonding process and improving the yield and reliability of the light-emitting device.

[0076] The circuit board, light-emitting device, and method for manufacturing the light-emitting device provided by the present invention have been described in detail above. Those skilled in the art will understand that all or part of the steps in the various methods of the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, which may include: read-only memory (ROM), random access memory (RAM), disk or optical disk, etc.

[0077] Furthermore, the embodiments of the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A circuit board, characterized in that, The circuit board is provided with a die-bonding area for a driver IC chip. The die-bonding area for the driver IC chip is provided with a plurality of driver IC chip pin pads. A plurality of grooves are formed on any one of the driver IC chip pin pads. The plurality of grooves form a plurality of groove units, and the plurality of groove units are arranged in an array. The first solder is applied to the pads of any one of the driver IC chip pins.

2. The circuit board as described in claim 1, characterized in that, The depth of the groove is 2um-5um.

3. The circuit board as described in claim 1, characterized in that, The opening width of the groove is 2um-5um.

4. The circuit board as described in claim 1, characterized in that, The plurality of groove units are arranged in a honeycomb array.

5. The circuit board as described in claim 1, characterized in that, The first solder is low-temperature solder paste.

6. The circuit board as described in claim 5, characterized in that, The low-temperature solder paste is Sn-Bi low-temperature solder paste or Sn-Bi-Ag low-temperature solder paste.

7. The circuit board as described in claim 5, characterized in that, The melting point of the low-temperature solder paste is 125℃-180℃.

8. The circuit board as described in claim 1, characterized in that, The circuit board is also provided with a die-bonding area for light-emitting chips, and a number of die-bonding pads for light-emitting chips are provided in the die-bonding area for light-emitting chips.

9. A light-emitting device, characterized in that, The light-emitting device includes a circuit board, a driver IC chip, and a light-emitting chip as described in any one of claims 1-8, wherein the driver IC chip is die-bonded in the driver IC chip die-bonding area of ​​the circuit board, and the light-emitting chip is die-bonded in the light-emitting chip die-bonding area of ​​the circuit board. The pins of the driver IC chip are soldered onto the pin pads of the driver IC chip, and a second solder is provided on the pins of the driver IC chip.

10. The light-emitting device as described in claim 9, characterized in that, The second solder is a high-temperature solder ball.

11. The light-emitting device as claimed in claim 10, characterized in that, The high-temperature solder ball is a SAC305 high-temperature solder ball, a SAC307 high-temperature solder ball, or a Sn5Pb95 high-temperature solder ball.

12. The light-emitting device as described in claim 10, characterized in that, The melting point of the high-temperature solder ball is 200℃-310℃.

13. The light-emitting device as described in claim 10, characterized in that, The driver IC chip includes several sets of light-emitting chip control pins, power supply pins, ground pins, data input pins, and data output pins, which are soldered onto the pin pads of the driver IC chip.

14. The light-emitting device as described in claim 13, characterized in that, Any set of LED control pins includes one red LED control pin, one green LED control pin, and one blue LED control pin.

15. The light-emitting device as described in claim 13, characterized in that, The back of the circuit board is provided with power pads, ground pads, data input pads, and data output pads.

16. The light-emitting device as described in claim 15, characterized in that, The control pins of the several groups of light-emitting chips are connected to the pins of the light-emitting chips respectively; The power pin is connected to the power pad; The grounding pin is connected to the grounding pad; The data input pin is connected to the data input pad; The data output pin is connected to the data output pad.

17. A method for manufacturing a light-emitting device, characterized in that, The manufacturing method is used to manufacture the light-emitting device according to any one of claims 9-16, and the manufacturing method includes: The circuit board is preheated to a first heating temperature, causing the first solder covering the pin pads of the driver IC chip to melt. Place the pins of the driver IC chip in the pin pads of the driver IC chip; The circuit board and driver IC chip are heated to a second heating temperature, causing the second solder on the pins of the driver IC chip to melt. The circuit board and driver IC chip are cooled to produce a light-emitting device.

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