Perovskite solar module for spacecraft and preparation method thereof
By using laser scribing technology to delineate the bottom and top electrode channels in perovskite solar modules for spacecraft and setting electrode solder joint areas with different spacing, problems such as low polarity identification accuracy and large edge loss are solved, achieving efficient and reliable photoelectric conversion and module series connection, adapting to the harsh environment of spacecraft.
Patent Information
- Application Number
- CN202510829967.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-20
- Publication Date
- 2025-10-31
AI Technical Summary
Existing perovskite solar modules for spacecraft suffer from problems such as low polarity recognition accuracy, high edge loss, high packaging complexity, and high reliability risks in small-size applications, making it difficult to meet the stringent requirements of the aerospace environment.
Laser scribing technology is used to delineate bottom electrode separation channels and active layer patterned channels on the transparent bottom electrode layer, and top electrode isolation channels are delineated on the metal top electrode layer. Electrode solder joint areas with different spacings are set, and polarity is identified by recognizing the solder joint spacing, thereby reducing edge loss and improving the polarity recognition accuracy and photoelectric conversion efficiency of the component.
It improves the polarity identification accuracy of perovskite solar modules, reduces the risk of power supply failure, enhances photoelectric conversion efficiency and module safety redundancy, adapts to the harsh conditions of aerospace environments, simplifies the packaging process, and reduces production costs.
Smart Images
Figure CN120882273A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of solar energy manufacturing for spacecraft, and particularly to a perovskite solar energy module for spacecraft and its preparation method. Background Technology
[0002] Perovskite solar cells are widely regarded as a strong contender for next-generation high-performance photovoltaic technology due to their advantages such as high photoelectric conversion efficiency, low-temperature process compatibility, and lightweight flexibility. They are particularly suitable for applications with extremely high requirements for power-to-mass ratio and system integration, such as spacecraft, satellites, and high-altitude platforms.
[0003] In practical applications, to achieve multi-unit series connection and modular output, perovskite solar modules typically employ laser scribing technology, including P1 (bottom electrode separation), P2 (active layer patterning), and P3 (top electrode separation) steps. Traditional lead-in methods, to connect the device to external circuits, usually reserve an edge area of approximately 0.5–1 cm on both sides of the module's positive and negative electrodes. This requires additional processes to remove the functional layer before depositing a metal top electrode layer and attaching busbars for current extraction and performance testing.
[0004] This approach is adaptable to large-area ground-based modules because the edge area is relatively small, and area loss is controllable. However, in scenarios such as spacecraft that require small-sized (e.g., 5cm×5cm) modules, the edge loss caused by this structure is significant. For example, with a 5mm edge clearing on each side, the module area utilization rate will drop to approximately 64%, severely impacting the power generation capacity per unit area and the system power density. Furthermore, this structure relies on bonded busbars, which not only increases encapsulation complexity but also poses potential reliability risks such as thermal expansion mismatch and uneven contact, making it difficult to adapt to the thermal cycling, mechanical vibration, and vacuum conditions of aerospace environments. Additionally, existing methods for identifying the positive and negative polarities of solar cells used in spacecraft—using different colors and markings like "+" for positive and "-" for negative—are distorted in vacuum and high-radiation environments, making identification difficult and reducing polarity accuracy. Incorrect polarity identification can cause power supply malfunctions in spacecraft, preventing them from functioning properly. Summary of the Invention
[0005] The purpose of this invention is to overcome the shortcomings of low polarity recognition accuracy in the prior art and to provide a perovskite solar cell module for spacecraft and its preparation method.
[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solution:
[0007] A method for fabricating a perovskite solar panel for spacecraft includes the following steps:
[0008] A transparent bottom electrode layer is deposited on a substrate, and a first laser is used to delineate bottom electrode dividing channels on the transparent bottom electrode layer to divide the transparent bottom electrode layer into at least two sub-transparent bottom electrodes and delineate at least two first electrode solder joints to close protective channels.
[0009] A first carrier transport layer, a perovskite light-absorbing layer, and a second carrier transport layer are sequentially deposited on the transparent bottom electrode layer, with the first carrier transport layer and the second carrier transport layer having opposite polarities.
[0010] A second laser is used to delineate vertically projected patterned channels on the first carrier transport layer, the perovskite light-absorbing layer, and the second carrier transport layer. The vertical projection of the active layer patterned channels on the transparent bottom electrode layer is located on one side of the bottom electrode separating channel.
[0011] A first electrode solder joint region is set in the region where the closed protective channel of the first electrode solder joint is vertically projected onto the second charge carrier transport layer. At least two second electrode solder joint regions are set on the second charge carrier transport layer. A third laser is used to remove the transparent bottom electrode layer, the first charge carrier transport layer, the perovskite light-absorbing layer, and the second charge carrier transport layer in the vertical direction within the first electrode solder joint region and the second electrode solder joint region.
[0012] The spacing between the first electrode solder joint areas is equal, the spacing between the second electrode solder joint areas is equal but different from the spacing between the first electrode solder joint areas, and the polarity of the second electrode solder joint areas is opposite to that of the first electrode solder joint areas;
[0013] A metal top electrode layer is deposited on the second carrier transport layer, and a fourth laser is used to delineate a top electrode isolation channel and a second electrode solder joint closure protection channel on the metal top electrode layer to surround the area of the second electrode solder joint region vertically projected onto the metal top electrode layer. The vertical projection of the top electrode isolation channel on the second carrier transport layer is located on the side of the active layer patterned channel away from the bottom electrode isolation channel.
[0014] Metal leads are welded in the areas where the first electrode solder joint region is vertically projected onto the transparent bottom electrode and the areas where the second electrode solder joint region is vertically projected onto the metal top electrode layer.
[0015] Preferably, the first carrier transport layer is a hole transport layer or an electron transport layer. When it is the hole transport layer, the second carrier is the electron transport layer; when it is the electron transport layer, the second carrier is the hole transport layer.
[0016] Preferably, when the first carrier transport layer is a hole transport layer, the polarity of the first electrode solder joint region is negative, the polarity of the second electrode solder joint region is positive, the active layer patterned channel is located to the right of the bottom electrode separating channel projected vertically onto the hole transport layer and the perovskite light-absorbing layer, and the top electrode blocking channel is located to the right of the active layer patterned channel projected vertically onto the metal top electrode layer; when the first carrier transport layer is an electron transport layer, the polarity of the first electrode solder joint region is positive, the polarity of the second electrode solder joint region is negative, the active layer patterned channel is located to the left of the bottom electrode separating channel projected vertically onto the hole transport layer and the perovskite light-absorbing layer, and the top electrode blocking channel is located to the left of the active layer patterned channel projected vertically onto the metal top electrode layer.
[0017] Preferably, when the transparent bottom electrode is made of indium tin oxide, the hole transport layer is made of nickel oxide, the perovskite light-absorbing layer is made of formamidinium-cesium-lead iodide perovskite, and the electron transport layer is made of fullerene, tin oxide, or titanium oxide, the first and fourth lasers are infrared lasers, and the second and third lasers are green lasers.
[0018] Preferably, the transparent bottom electrode layer, the hole transport layer, and the metal top electrode layer are deposited by physical vapor deposition, the perovskite light-absorbing layer is deposited by spin coating and slot coating, and the electron transport layer is deposited by evaporation.
[0019] Preferably, when the electron transport layer is made of fullerene, an electron transport enhancement layer of tin oxide is deposited between the electron transport layer and the metal top electrode layer, or an electron transport enhancement layer of tin oxide is deposited between the electron transport layer and the transparent bottom electrode, by atomic layer deposition.
[0020] Preferably, the sum of the areas of all the first electrode solder joint areas and the second electrode solder joint areas is less than 5% of the area of the substrate.
[0021] Preferably, the process further includes, after defining the patterned channels of the active layer, dividing the perovskite solar module, defining the divided perovskite module as a sub-perovskite solar module, determining the first electrode solder joint closed protection channel, the first electric solder joint region, and the second electrode solder joint region, or determining the first electrode solder joint closed protection channel and the first electric solder joint region, or determining the second electrode solder joint region, removing the transparent bottom electrode layer, the first carrier transport layer, the perovskite light-absorbing layer, and the second carrier transport layer in the vertical direction within the first electrode solder joint region and the second electrode solder joint region, depositing the metal top electrode layer on the second carrier transport layer, defining the top electrode isolation channel and defining the second electrode solder joint closed protection channel on the metal top electrode layer to surround the region where the second electrode solder joint region is vertically projected onto the metal top electrode layer.
[0022] A perovskite solar panel for spacecraft, fabricated using the aforementioned method for preparing a perovskite solar panel for spacecraft, comprises a substrate and a transparent bottom electrode layer, a first carrier transport layer, a perovskite light-absorbing layer, a second carrier transport layer, and a metal top electrode layer sequentially deposited on the substrate.
[0023] Preferably, when the first carrier transport layer is a hole transport layer and the second carrier transport layer is an electron transport layer, an electron transport enhancement layer is deposited between the electron transport layer and the metal top electrode layer; when the first carrier transport layer is the electron transport layer and the second carrier transport layer is the hole transport layer, the electron transport enhancement layer is deposited between the electron transport layer and the transparent bottom electrode layer.
[0024] Preferably, the substrate is a rigid substrate or a flexible substrate.
[0025] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0026] This invention divides the transparent bottom electrode into at least two sub-transparent bottom electrodes by marking bottom electrode dividing channels on the transparent bottom electrode. Vertically projected and aligned active layer patterned channels are marked on the first carrier transport layer, the perovskite light-absorbing layer, and the second carrier transport layer. A top electrode isolation channel is marked on the metal top electrode layer. This allows a perovskite solar module formed by sequentially depositing a transparent bottom electrode layer, a first carrier transport layer, a perovskite light-absorbing layer, a second carrier transport layer, and a top metal top electrode layer on a substrate. The module consists of at least two sub-perovskite solar cells connected in series. At least two first electrode solder joints are marked on the transparent bottom electrode layer to close and protect the module. First electrode solder joint regions are defined in the area where the first electrode solder joints are vertically projected onto the second carrier transport layer. At least two second electrode solder joint regions are also defined on the second carrier transport layer. Second electrode solder joints are marked on the metal top electrode to close and protect the second electrode solder joint regions. The spacing between the first and second electrode solder joint regions is different. This allows for the identification of the first electrode solder joints. The spacing between the first and second electrode solder joints can identify different polarities. Since the spacing between the electrode solder joints is a physical structural characteristic, it will not change due to vacuum or high-radiation environments, thus improving the polarity identification accuracy of the perovskite solar module. This reduces the risk of power supply failure in the perovskite solar module. Furthermore, defining closed protection channels for the first and second electrode solder joints to surround the first and second electrode solder joint areas reduces leakage current between the first carrier transport layer, the perovskite light-absorbing layer, the second carrier transport layer, and the first and second electrode solder joint areas, thereby improving the photoelectric conversion efficiency of the perovskite solar cell and maximizing the power supply to the spacecraft. In addition, there are at least two first and second electrode solder joint areas, adding safety redundancy to the perovskite solar module. Even if some electrode solder joints fail, the other normal electrode solder joints can continue to provide some power output, ensuring a continuous power supply to the spacecraft. Attached Figure Description
[0027] Figure 1 This is a flowchart illustrating the steps of a method for fabricating a perovskite solar panel for spacecraft, as disclosed in one embodiment.
[0028] Figure 2 This is a schematic diagram of a pin-shaped structure of a perovskite solar panel for spacecraft, as disclosed in one embodiment.
[0029] Figure 3 This is a schematic diagram of a nip structure for a perovskite solar panel used in spacecraft, as disclosed in one embodiment.
[0030] Figure 4This is a schematic diagram showing the location of the bottom electrode isolation channel and the negative electrode solder joint closure protection channel in a perovskite solar module for spacecraft, as disclosed in one embodiment.
[0031] Figure 5 This is a schematic diagram showing the location of the patterned channels in the active layer of a perovskite solar panel for spacecraft, as disclosed in one embodiment.
[0032] Figure 6 This is a schematic diagram showing the location of the positive and negative electrode solder joint areas in a perovskite solar panel for spacecraft, as disclosed in one embodiment.
[0033] Figure 7 This is a schematic diagram showing the location of the top electrode isolation channel and the positive electrode solder joint closure protection channel in a perovskite solar panel for spacecraft, as disclosed in one embodiment.
[0034] Figure 8 This is a schematic diagram showing the positions of the bottom electrode separating channel, the active layer patterned channel, and the top electrode separating channel in a perovskite solar panel for spacecraft, as disclosed in one embodiment.
[0035] Marking Explanation: 10-Substrate; 20-Transparent bottom electrode layer; 21-First negative electrode solder joint closed protection channel; 22-Second negative electrode solder joint closed protection channel; 30-Hole transport layer; 40-Perovskite light-absorbing layer; 50-Electron transport layer; 51-First negative electrode solder joint region; 52-Second negative electrode solder joint region; 53-First positive electrode solder joint region; 54-Second positive electrode solder joint region; 60-Metallic top electrode layer; 61-First positive electrode solder joint closed protection channel; 62-Second positive electrode solder joint closed protection channel; 70-Bottom electrode separation channel; 80-Active layer patterned channel; 90-Top electrode isolation channel. Detailed Implementation
[0036] The present invention will be further described in detail below with reference to experimental examples and specific embodiments. However, this should not be construed as limiting the scope of the above-mentioned subject matter of the present invention to the following embodiments; all technologies implemented based on the content of the present invention fall within the scope of the present invention.
[0037] like Figure 1As shown, a disclosed embodiment reveals a method for fabricating a perovskite solar panel for spacecraft, comprising the following steps: depositing a transparent bottom electrode layer on a substrate, and using a first laser to delineate bottom electrode partition channels on the transparent bottom electrode layer to divide the transparent bottom electrode layer into at least two sub-transparent bottom electrodes and delineate at least two first electrode solder joint closure protection channels; sequentially depositing a first carrier transport layer, a perovskite light-absorbing layer, and a second carrier transport layer on the transparent bottom electrode layer, wherein the polarities of the first carrier transport layer and the second carrier transport layer are opposite; using a second laser to delineate vertically projected patterned active layer channels on the first carrier transport layer, the perovskite light-absorbing layer, and the second carrier transport layer, wherein the vertical projection of the active layer patterned channels on the transparent bottom electrode layer is located on one side of the bottom electrode partition channels; setting a first electrode solder joint region in the region where the first electrode solder joint closure protection channel is vertically projected onto the second carrier transport layer, setting at least two second electrode solder joint regions on the second carrier transport layer, and using a third laser to delineate the first electrode solder joint region and the... The transparent bottom electrode layer, the first carrier transport layer, the perovskite light-absorbing layer, and the second carrier transport layer are removed vertically within the second electrode solder joint area. The spacing between the first and second electrode solder joint areas is equal. This description applies when the number of first and second electrode solder joint areas is greater than 2. The spacing between the second electrode solder joint areas is different from that between the first electrode solder joint areas, and the polarities of the second electrode solder joint areas are opposite to those of the first electrode solder joint areas. A metal top electrode layer is deposited on the second carrier transport layer, and a fourth laser is used to delineate a top electrode isolation channel and a second electrode solder joint closure protection channel on the metal top electrode layer to surround the area where the second electrode solder joint area is vertically projected onto the metal top electrode layer. The vertical projection of the top electrode isolation channel onto the second carrier transport layer is located on the side of the active layer patterned channel away from the bottom electrode isolation channel. Metal leads are welded in the areas where the first electrode solder joint area is vertically projected onto the transparent bottom electrode and the areas where the second electrode solder joint area is vertically projected onto the metal top electrode layer. The active layer refers to the first carrier transport layer, the perovskite light-absorbing layer, and the second carrier transport layer.
[0038] In some embodiments, the first carrier transport layer is a hole transport layer or an electron transport layer. When it is the hole transport layer, the second carrier is the electron transport layer, and the perovskite solar cell has a pin structure. When it is the electron transport layer, the second carrier is the hole transport layer, and the perovskite solar cell has a nip structure.
[0039] In some embodiments, when the first carrier transport layer is a hole transport layer, the polarity of the first electrode solder joint region is negative, the polarity of the second electrode solder joint region is positive, the active layer patterned channel is located to the right of the bottom electrode separating channel projected vertically onto the hole transport layer and the perovskite light-absorbing layer, and the top electrode blocking channel is located to the right of the active layer patterned channel projected vertically onto the metal top electrode layer; when the first carrier transport layer is an electron transport layer, the polarity of the first electrode solder joint region is positive, the polarity of the second electrode solder joint region is negative, the active layer patterned channel is located to the left of the bottom electrode separating channel projected vertically onto the hole transport layer and the perovskite light-absorbing layer, and the top electrode blocking channel is located to the left of the active layer patterned channel projected vertically onto the metal top electrode layer.
[0040] In some embodiments, when the transparent bottom electrode is made of indium tin oxide, the hole transport layer is made of nickel oxide, the perovskite light-absorbing layer is made of formamidinium-cesium-lead iodide perovskite, and the electron transport layer is made of fullerene, tin oxide, or titanium oxide, the first and fourth lasers are infrared lasers, and the second and third lasers are green lasers.
[0041] In some embodiments, the transparent bottom electrode layer, the hole transport layer, and the metal top electrode layer are deposited by physical vapor deposition, the perovskite light-absorbing layer is deposited by spin coating and slot coating, and the electron transport layer is deposited by evaporation.
[0042] In some embodiments, when the electron transport layer is made of fullerene, an electron transport enhancement layer of tin oxide is deposited between the electron transport layer and the metal top electrode layer, or an electron transport enhancement layer of tin oxide is deposited between the electron transport layer and the transparent bottom electrode, by atomic layer deposition.
[0043] In some embodiments, the sum of the areas of all the first electrode solder joint regions and the second electrode solder joint regions is less than 5% of the area of the substrate. The effective area of perovskite solar cells used in spacecraft is generally 90% to meet the requirements. Therefore, limiting the sum of the areas of the first electrode solder joint regions and the second electrode solder joint regions to within 5% of the area of the substrate is fully achievable, and the technical solution according to this embodiment is fully feasible.
[0044] In some embodiments, the method for fabricating a spacecraft perovskite solar module further includes, after defining the patterned channels of the active layer, dividing the fabricated perovskite solar module into sub-perovskite solar modules, defining the sub-perovskite solar modules as sub-perovskite solar modules, determining the first electrode solder joint closure protection channel, the first electric solder joint region, and the second electrode solder joint region, or determining the first electrode solder joint closure protection channel and the first electric solder joint region, or determining the second electrode solder joint region, removing the transparent bottom electrode layer, the first carrier transport layer, the perovskite light-absorbing layer, and the second carrier transport layer vertically within the first electrode solder joint region and the second electrode solder joint region, depositing the metal top electrode layer on the second carrier transport layer, and defining the top electrode isolation channel and the second electrode solder joint closure protection channel on the metal top electrode layer to surround the region where the second electrode solder joint region is vertically projected onto the metal top electrode layer. This allows for the rapid fabrication of more perovskite solar modules, which can have the same or different specifications, depending on the requirements.
[0045] Another embodiment discloses a perovskite solar panel for spacecraft, fabricated using the aforementioned method for preparing a perovskite solar panel for spacecraft. The panel includes a substrate and, sequentially deposited on the substrate, a transparent bottom electrode layer, a first carrier transport layer, a perovskite light-absorbing layer, a second carrier transport layer, and a metal top electrode layer. Specifically, as shown... Figure 2 As shown, when the first carrier transport layer is a hole transport layer 30 and the second carrier transport layer is an electron transport layer 50, the perovskite solar module has a pin junction structure; as Figure 3 As shown, when the first carrier transport layer is an electron transport layer 50 and the second carrier transport layer is a hole transport layer 30, the perovskite solar module has a nip structure.
[0046] In some embodiments, when the first carrier transport layer is a hole transport layer and the second carrier transport layer is an electron transport layer, an electron transport enhancement layer is deposited between the electron transport layer and the metal top electrode layer; when the first carrier transport layer is the electron transport layer and the second carrier transport layer is the hole transport layer, the electron transport enhancement layer is deposited between the electron transport layer and the transparent bottom electrode layer.
[0047] In some embodiments, the substrate is a rigid substrate or a flexible substrate.
[0048] Application Example 1
[0049] This embodiment fabricates a perovskite solar module on a 50mm×50mm×0.1mm polyimide (PI) film, and the perovskite solar module has a pin structure. The fabrication process is as follows:
[0050] Transparent bottom electrode layer 20 made of indium tin oxide (ITO): The transparent bottom electrode layer 20 made of ITO is deposited on the surface of a clean PI film using a physical vapor deposition (PVD) process. The thickness of the transparent bottom electrode layer 20 is 100-150 nm, and the PI film serves as the substrate 10.
[0051] Define the bottom electrode separator (P1) channel and the negative electrode solder joint closure protection channel: such as Figure 4 As shown, after the transparent bottom electrode layer 20 is deposited, an infrared laser is used to draw a P1 channel with a width of approximately 30 μm on the transparent electrode to divide the transparent bottom electrode layer 20 into 5 sub-transparent bottom electrode layers 20. Two negative electrode (-) solder joint closed protection channels are also drawn. The length of the negative electrode solder joint closed protection channel is 6 mm and the width is 2 mm. The spacing between the bottom electrode separating channels 70 is 0.52 cm, and the spacing between the two negative electrode solder joint closed protection channels is 12 mm. That is, the spacing between the first negative electrode solder joint closed protection channel 21 and the second negative electrode solder joint closed protection channel 22 is 12 mm. Furthermore, the distance from the upper edge of the first negative electrode solder joint closed protection channel 21 to the upper edge of the substrate 10 and the distance from the lower edge of the second negative electrode solder joint closed protection channel 22 to the lower edge of the substrate 10 are both 13 mm. The bottom electrode separating channels 70... The transparent bottom electrode layer 20 needs to be pierced, meaning the depth of the bottom electrode separating channel 70 needs to be no less than the thickness of the transparent bottom electrode. The purpose is to divide the transparent bottom electrode layer 20 into independent units, laying the foundation for the subsequent formation of perovskite solar modules. Since the voltage output of a single perovskite solar cell is generally between 0.8V and 1.2V, which does not meet the voltage requirements of spacecraft, multiple perovskite solar cells need to be connected in series to form a perovskite solar cell module, thereby increasing the voltage output to the spacecraft. The first and second negative electrode solder joints close the protective channel to form a closed insulating channel, blocking the leakage current path between the hole transport layer 30, the perovskite light-absorbing layer 40, the electron transport layer 50, and the electron transport enhancement layer and the solder joints, ensuring that the current can only be discharged through the designed solder joint channel.
[0052] Sputtering nickel oxide (NiOx) nanoparticles, that is, depositing hole transport layer 30: The substrate 10 with the bottom electrode separation channel 70 marked is placed in the carrier disk, which is used to support and fix the substrate 10. Using physical vapor deposition (PVD) process, a 18nm NiOx thin film is deposited on the transparent bottom electrode layer 20 as hole transport layer 30.
[0053] The perovskite thin film was prepared by slit coating, which is the preparation of the perovskite light-absorbing layer 40: The formamidine-cesium-lead iodide (FA-Cs-PbI3) multi-cation perovskite solution was prepared and filtered in advance. The solution was then coated on the surface of the NiOx layer, which is the hole transport layer 30, using the slit coating method. The coating speed was set to 15 mm / s and the spin coating time was 45 seconds. After coating, the film was transferred to a vacuum crystallization drying equipment (VCD) for vacuuming for 30 seconds and holding the pressure for 40-60 seconds to help the perovskite thin film crystallize.
[0054] Vacuum deposition of electron transport layer 50: On the perovskite light-absorbing layer 40, a 30 nm fullerene (C60) is deposited as electron transport layer 50 by evaporation.
[0055] Atomic layer deposition (ALD) tin oxide (SnOx), also known as electron transport enhancement layer: Depositing 20nm tin oxide after the C60 film can reduce nonradiative recombination caused by carrier diffusion, promote electron transport to the metal top electrode layer 60, and prevent hole backflow.
[0056] Define the active layer patterning (P2) channels: such as Figure 5 As shown, a green laser is used to etch an 80 μm wide active layer patterned channel 80 on the hole transport layer 30, the perovskite light-absorbing layer 40, and the electron transport layer 50. The active layer patterned channel 80 is located 30 μm to the right of the bottom electrode isolation channel. Figure 5 The active layer patterned channel 80 is not marked on the transparent bottom electrode. Instead, it is projected vertically onto the transparent bottom electrode to more clearly show the spatial relationship between the bottom electrode separating channel 70 and the active layer patterned channel 80. The active layer patterned channel 80 needs to penetrate the hole transport layer 30, the perovskite light-absorbing layer 40, the electron transport layer 50, and the electron transport enhancement layer. In other words, the depth of the active layer patterned channel 80 is not less than the sum of the thicknesses of the hole transport layer 30, the perovskite light-absorbing layer 40, the electron transport layer 50, and the electron transport enhancement layer. The purpose is to open up the charge transport channel between adjacent sub-cells and realize the series path of the metal top electrode layer 60 of the front sub-cell perovskite solar cell to the transparent bottom electrode layer 20 of the rear sub-cell perovskite solar cell.
[0057] Define the positive (+) solder joint area and the negative solder joint area: e.g. Figure 6 As shown, positive and negative electrode solder joint regions are defined on the electron transport layer 50. The negative electrode solder joint regions are projected vertically into the electron transport layer 50 from the closed protective channel of the negative electrode solder joint. The number of positive electrode solder joint regions is the same as the number of negative electrode solder joint regions, namely, a first positive electrode solder joint region 53, a second positive electrode solder joint region 54, a first negative electrode solder joint region 51, and a second negative electrode solder joint region 52. Figure 6The first positive electrode solder joint region 53, the second positive electrode solder joint region 54, the first negative electrode solder joint region 51, and the second negative electrode solder joint region 52 are not located on the transparent bottom electrode layer 20, but are located on the electron transport layer 50. The positions of the positive electrode solder joint regions are shown in the diagram, which is a vertical projection of the positive electrode solder joint regions onto the transparent bottom electrode layer 20. The positive and negative electrode solder joint regions have the same dimensions, with a length of 3mm to 4mm and a width of 0.5mm to 1mm. An infrared laser is used to project the positive and negative electrode solder joint regions vertically. The transparent bottom electrode layer 20, hole transport layer 30, perovskite light-absorbing layer 40, electron transport layer 50, and electron transport enhancement layer are removed, that is, four hollow cubes with a length of 6 mm, a width of 2 mm, and a height equal to the sum of the thicknesses of the transparent bottom electrode layer 20, hole transport layer 30, perovskite light-absorbing layer 40, electron transport layer 50, and electron transport enhancement layer are formed on the transparent bottom electrode layer 20, hole transport layer 30, perovskite light-absorbing layer 40, electron transport layer 50, and electron transport enhancement layer;
[0058] Vacuum-deposited metal top electrode layer 60: A 100nm thick copper electrode is sputtered using physical vapor deposition (PVD) to ensure good conductivity and cell stability. The deposited copper is also deposited in a hollow cube, thereby enabling the metal top electrode layer 90 (Cu) of the fore-seed perovskite solar cell to contact the transparent bottom electrode layer 20 of the post-seed perovskite solar cell through the cubic space, forming a series path. The thickness of the copper electrode can be in the range of 80 to 200nm.
[0059] Define the top electrode isolation (P3) channel and the positive electrode solder joint closure protection channel: such as Figure 7 As shown, a 50μm wide top electrode isolation channel 90 is etched on the top metal top electrode layer 60 using a green laser. The top electrode isolation channel 90 is located 30μm to the right of the P2 channel, and a positive electrode solder joint closure protection channel is also etched. The distance between the two positive electrode solder joint closure protection channels is 18mm, that is, the distance between the first positive electrode solder joint closure protection channel 61 and the second positive electrode solder joint closure protection channel 62 is 18mm. The length of the first positive electrode solder joint closure protection channel 61 and the width of the second positive electrode solder joint closure protection channel 62 are 6mm and 2mm respectively. The distance from the top edge of the first positive electrode solder joint closure protection channel 61 to the top edge of the metal top electrode layer 60 is 10mm, and the distance from the bottom edge of the second positive electrode solder joint closure protection channel 62 to the bottom edge of the metal top electrode layer 60 is 10mm. Figure 7 The protective channel for the first and second positive electrode solder joints is not located on the transparent bottom electrode layer 20, but rather on the metal top electrode layer 60. Figure 7The first and second positive electrode solder joint closed protection channels are simply projected vertically onto the transparent bottom electrode layer 20 to briefly illustrate the positional relationship. The top electrode isolation channel 90 and the first and second positive electrode solder joint closed protection channels need to penetrate the metal top electrode layer 60. That is, the depth of the top electrode isolation channel 90 and the positive electrode solder joint closed protection channel is not less than the thickness of the metal top electrode layer 60, which is not less than the thickness of the copper electrode. The purpose of penetrating the metal top electrode layer 60 is to make the metal top electrode layer 60 an independent metal top electrode unit so as to realize the series connection of the sub-perovskite solar cells. The positive electrode solder joint closed protection channel is to form a closed insulating channel to block the leakage current path between the hole transport layer 30, the perovskite light-absorbing layer 40, the electron transport layer 50 and the electron transport enhancement layer and the solder joint, ensuring that the current can only be discharged through the designed solder joint channel.
[0060] Soldering metal leads: Metal leads are used as electrode leads, and metal leads are soldered in both the positive and negative electrode solder joint areas.
[0061] The positional relationship between the bottom electrode separating channel 70, the active layer patterned channel 80, and the top electrode separating channel 90 is as follows: Figure 8 As shown, from Figure 8 It can be clearly seen that the bottom electrode separating channel 70 is filled with the deposited hole transport layer 30. However, since the materials that can serve as the hole transport layer 30 all have high resistivity, the independent units of the separated transparent bottom electrode layer 20 still do not establish an electrical connection. The active layer patterned channel 80 is filled with the deposited metal top electrode layer 60. Thus, the metal top electrode layer 60 is electrically connected to the transparent bottom electrode layer 20 of the subsequent perovskite solar module through the active layer patterned channel 80 filled with the metal top electrode, realizing a series path from the metal top electrode layer 60 of the previous perovskite solar module to the transparent bottom electrode layer 20 of the subsequent perovskite solar module. After the perovskite solar module is fabricated, a 50×50mm... 2 The flexible module has a photoelectric conversion efficiency of 18%. Each sub-perovskite solar cell has an area of 4.905 cm². 2 Therefore, the effective area of the component is 24.525 cm². 2 The corresponding area utilization rate can reach 98.08%, which far exceeds the area utilization rate (64%) obtained by the traditional marking process.
[0062] Application Example 2
[0063] In this embodiment, a perovskite solar module is prepared on a 50mm×50mm×0.15mm ordinary ultra-white glass cover. The specific steps are basically the same as those in Application Example 1. The difference is that before depositing the transparent bottom electrode layer 20 on the ultra-white glass, the ultra-white glass needs to be cleaned three times in an ultrasonic cleaner for 30 minutes each time. After cleaning, it is placed in an oven to dry. The relevant data results are the same as those in Application Example 1, and will not be described again here.
[0064] Application Implementation 3
[0065] This embodiment fabricates a perovskite solar module on a 300mm×300mm×0.1mm polyimide (PI) film. To obtain a smaller perovskite solar module based on the 300mm×300mm×0.1mm polyimide (PI) film, the steps of Application Example 1 are followed. However, after defining the active layer patterned channel 80, the perovskite solar module needs to be divided into smaller perovskite solar modules, for example, perovskite solar modules with a length and width of 50mm. Subsequently, the steps of Application Example 1 are implemented on each divided perovskite solar module, which will not be repeated here. It is important to emphasize that each divided perovskite solar module will have a positive electrode solder joint closed protection channel and a defined positive electrode solder joint protection area. Therefore, it is not necessary to repeat the definition or setting of the positive electrode solder joint closed protection channel and the positive electrode solder joint area. Similarly, it will also have a negative electrode solder joint area, thus eliminating the need to repeat the setting of the negative electrode solder joint area.
[0066] Application Example 4
[0067] When the structure of the perovskite solar module in Application Example 1 is changed to a NIP structure, the corresponding steps are the same. The difference is that the top electrode isolation channel 90 is located to the left of the active layer patterned channel 80, the active layer patterned channel 80 is located to the left of the bottom electrode isolation channel 70, and the positive electrode solder joint is first defined to close the protective channel, and then the negative electrode solder joint is defined to close the protective channel. The rest are adjusted accordingly, and will not be described again here.
[0068] The above embodiments can significantly improve area utilization. Specifically, by designing small solder joint areas on both sides of the positive and negative electrodes of the perovskite solar module for external leads, the need for traditional large-area edge clearing areas is reduced, allowing more module surface to participate in photoelectric conversion and significantly increasing the effective power generation area. It can also improve the power density per unit area; specifically, by effectively utilizing more area of the perovskite solar module for power generation, it increases the output power per unit area, meeting the stringent requirements of spacecraft for high specific power and high energy density. Furthermore, it can simplify the packaging structure and process flow; specifically, it avoids the large-area edge clearing and busbar pasting processes, reducing process steps and material usage, lowering production costs and manufacturing complexity. Finally, it can enhance the perovskite... The reliability and environmental adaptability of perovskite solar modules are enhanced. Specifically, laser scribing precisely controls the solder joint positions, reducing thermal expansion mismatch and poor electrical contact, thus improving the stability and durability of perovskite solar modules in complex aerospace environments (such as alternating high and low temperatures, vibration, and vacuum). It can adapt to the design requirements of small-sized modules, especially suitable for small-sized perovskite solar modules (such as 50mm×50mm), effectively overcoming the area loss problem caused by traditional lead wire methods and improving the overall system integration efficiency. It promotes the lightweighting and efficiency of spacecraft energy systems, improves the power output and area utilization efficiency of solar modules, helps reduce the weight and volume of spacecraft energy systems, and enhances payload capacity and mission execution capabilities.
[0069] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A method for fabricating a perovskite solar panel for spacecraft, characterized in that, Includes the following steps: A transparent bottom electrode layer is deposited on a substrate, and a first laser is used to delineate bottom electrode dividing channels on the transparent bottom electrode layer to divide the transparent bottom electrode layer into at least two sub-transparent bottom electrodes and delineate at least two first electrode solder joints to close protective channels. A first carrier transport layer, a perovskite light-absorbing layer, and a second carrier transport layer are sequentially deposited on the transparent bottom electrode layer, with the first carrier transport layer and the second carrier transport layer having opposite polarities. A second laser is used to delineate vertically projected patterned channels on the first carrier transport layer, the perovskite light-absorbing layer, and the second carrier transport layer. The vertical projection of the active layer patterned channels on the transparent bottom electrode layer is located on one side of the bottom electrode separating channel. A first electrode solder joint region is defined in the area where the closed protective channel of the first electrode solder joint is vertically projected onto the second charge carrier transport layer. At least two second electrode solder joint regions are defined on the second charge carrier transport layer. A third laser is used to remove the transparent bottom electrode layer, the first charge carrier transport layer, the perovskite light-absorbing layer, and the second charge carrier transport layer in the vertical direction within both the first and second electrode solder joint regions. The spacing between the first electrode solder joint regions is equal, and the spacing between the second electrode solder joint regions is equal but different from the spacing between the first electrode solder joint regions. The polarity of the second electrode solder joint regions is opposite to that of the first electrode solder joint regions. A metal top electrode layer is deposited on the second carrier transport layer, and a fourth laser is used to delineate a top electrode isolation channel and a second electrode solder joint closure protection channel on the metal top electrode layer to surround the area of the second electrode solder joint region vertically projected onto the metal top electrode layer. The vertical projection of the top electrode isolation channel on the second carrier transport layer is located on the side of the active layer patterned channel away from the bottom electrode isolation channel. Metal leads are welded in the areas where the first electrode solder joint region is vertically projected onto the transparent bottom electrode and the areas where the second electrode solder joint region is vertically projected onto the metal top electrode layer.
2. The method for preparing a perovskite solar panel for spacecraft according to claim 1, characterized in that, The first carrier transport layer is either a hole transport layer or an electron transport layer. When it is the hole transport layer, the second carrier is the electron transport layer; when it is the electron transport layer, the second carrier is the hole transport layer.
3. The method for preparing a perovskite solar panel for spacecraft according to claim 2, characterized in that, When the first carrier transport layer is a hole transport layer, the polarity of the first electrode solder joint region is negative, the polarity of the second electrode solder joint region is positive, and the active layer patterned channel is located to the right of the bottom electrode separating channel projected vertically onto the hole transport layer and the perovskite light-absorbing layer. The top electrode blocking channel is located to the right of the active layer patterned channel projected vertically onto the metal top electrode layer. When the first carrier transport layer is an electron transport layer, the polarity of the first electrode solder joint region is positive, the polarity of the second electrode solder joint region is negative, and the active layer patterned channel is located to the left of the bottom electrode separating channel projected vertically onto the hole transport layer and the perovskite light-absorbing layer. The top electrode blocking channel is located to the left of the active layer patterned channel projected vertically onto the metal top electrode layer.
4. The method for preparing a perovskite solar panel for spacecraft according to claim 2, characterized in that, When the transparent bottom electrode is made of indium tin oxide, the hole transport layer is made of nickel oxide, the perovskite light-absorbing layer is made of formamidinium-cesium-lead iodide perovskite, and the electron transport layer is made of fullerene, tin oxide, or titanium oxide, the first and fourth lasers are infrared lasers, and the second and third lasers are green lasers.
5. The method for preparing a perovskite solar panel for spacecraft according to claim 2, characterized in that, The transparent bottom electrode layer, the hole transport layer, and the metal top electrode layer are deposited by physical vapor deposition; the perovskite light-absorbing layer is deposited by spin coating and slot coating; and the electron transport layer is deposited by evaporation.
6. The method for preparing a perovskite solar panel for spacecraft according to claim 4, characterized in that, When the electron transport layer is made of fullerene, an electron transport enhancement layer of tin oxide is deposited between the electron transport layer and the metal top electrode layer, or an electron transport enhancement layer of tin oxide is deposited between the electron transport layer and the transparent bottom electrode, by atomic layer deposition.
7. The method for preparing a perovskite solar panel for spacecraft according to claim 1, characterized in that, The sum of the areas of all the first electrode solder joint areas and the second electrode solder joint areas is less than 5% of the area of the substrate.
8. The method for preparing a perovskite solar panel for spacecraft according to claim 1, characterized in that, The method also includes dividing the perovskite solar module after defining the patterned channel of the active layer, defining the divided perovskite module as a sub-perovskite solar module, determining the first electrode solder joint closed protection channel, the first electric solder joint area and the second electrode solder joint area, or determining the first electrode solder joint closed protection channel and the first electric solder joint area, or determining the second electrode solder joint area, removing the transparent bottom electrode layer, the first carrier transport layer, the perovskite light-absorbing layer and the second carrier transport layer in the vertical direction within the first electrode solder joint area and the second electrode solder joint area, depositing the metal top electrode layer on the second carrier transport layer, defining the top electrode isolation channel and defining the second electrode solder joint closed protection channel on the metal top electrode layer to surround the area where the second electrode solder joint area is vertically projected onto the metal top electrode layer.
9. A perovskite solar panel for spacecraft, manufactured using the method for preparing a perovskite solar panel for spacecraft according to any one of claims 1 to 8, characterized in that, It includes a substrate and a transparent bottom electrode layer, a first carrier transport layer, a perovskite light-absorbing layer, a second carrier transport layer, and a metal top electrode layer sequentially deposited on the substrate.
10. The perovskite solar panel for spacecraft according to claim 9, characterized in that, When the first carrier transport layer is a hole transport layer and the second carrier transport layer is an electron transport layer, an electron transport enhancement layer is deposited between the electron transport layer and the metal top electrode layer; when the first carrier transport layer is the electron transport layer and the second carrier transport layer is the hole transport layer, the electron transport enhancement layer is deposited between the electron transport layer and the transparent bottom electrode layer.
11. The perovskite solar module for spacecraft according to claim 10, characterized in that, The substrate can be a rigid substrate or a flexible substrate.