Method and system for applying fluid discharged from slit die to one or more advancing substrates

Abstract

A method and system for applying fluid exiting from a slit die (100) onto a front surface of one or more advancing substrates (202) is provided. The slit die (100) includes a discharge slit and a meniscus guide (102). An adhesive substrate carrier tape (204) having an adhesive front surface holds one or more substrates (202) on its front surface. A carrier tape (204) holding one or more substrates (202) is advanced in a machine direction through a discharge slit of a slit die (100) while discharging fluid from the discharge slit as a wet film layer on a front surface of the one or more substrates (202). The system includes an alignment support (2099) for supporting the back surface of the carrier tape to maintain a predetermined distance between the front surface of the carrier tape and the bottom edge of the meniscus guide (102).

Description

Technical Field

[0001] This disclosure relates to a method and system for discharging fluid from a slit die onto the front surface of one or more advancing substrates. As the substrates advance past the slit die, they can be temporarily sealed to a carrier tape or foil. The substrates may be wafers, such as silicon wafers used in photovoltaic cells. Background Technology

[0002] The fundamental building block of the semiconductor industry is the silicon wafer. A silicon wafer is a thin sheet cut from purified molten silicon single crystals or silicon ingots. Depending on the application, its thickness, size, and shape vary within a limited range according to current industry standards. In the photovoltaic (PV) field, solar modules typically consist of many silicon wafers with electrical connections placed side by side. The manufacturing facilities for wafers, cells, and modules are compatible with specific geometries. Therefore, any changes to these facilities beyond their expected energy payback period represent additional capital expenditures. Typical sizes for PV manufacturing are M6 or 166 mm half-square. However, the industry trend is likely to be M12 (210 mm square) gradually replacing M6. Several intermediate formats play an important role in achieving this transition, some differing by only a few millimeters. Unlike the PV field, in the fields of LEDs, microchips, and other microstructure or nanostructure semiconductor devices, the number of devices per wafer has reached its maximum. Therefore, wafers do not need to be reshaped but retain their original circular shape and are additionally planarized according to their crystal faces. The different sizes will be named according to their diameter (in inches), such as 6 inches, 8 inches and 12 inches.

[0003] Typical semiconductor manufacturing processes involve coating functional layers, in the form of a liquid solution, onto an entire area of ​​a wafer. For example, the multiple photolithography steps required to manufacture microchips rely on the application of photoresist. The thickness of the photoresist film ranges from 1 micrometer to several hundred micrometers, and the primary deposition technique used is spin coating. Spin coating is a deposition technique in which a relatively large amount of solution is distributed onto a rotating wafer. The wafer's rotation speed determines the final wet film thickness for a given solution, with the lower limit depending on rheological properties. After a certain amount of solution is distributed once the wafer begins to move or during wafer movement, centrifugal force generated at thousands of revolutions per minute creates the necessary liquid-gas interface to achieve the final thickness. Since centrifugal force is proportional to the distance from the origin, spin coating is inherently limited by substrate size and the range of operating thicknesses. At the end of spin coating, it is conservatively estimated that about 2% of the solution remains in the film. The remainder is recycled or discarded. Considering that some more complex microchip designs require approximately 20 or 50 photolithography steps, current coating schemes may be considered somewhat wasteful. Especially as the industry is expected to focus on reducing resource scarcity, waste, and pollution.

[0004] Another example of solution-coated layers on top of wafers is silicon-based photovoltaic technology. An internationally recognized roadmap statement recently acknowledged that the use of next-generation materials is a necessary development to drive this field. These so-called next-generation materials include thin-film sequences added to silicon solar cells as a second complementary solar cell, forming a tandem structure. This thin-film-based top cell absorbs complementary portions of the solar spectrum, thereby improving overall solar-to-electrical conversion efficiency. Perovskite is one of the more successful next-generation solar cell materials. One of the properties of perovskites is that they can be dissolved and coated. However, given state-of-the-art deposition methods and mainstream manufacturing protocols, several challenges have arisen, making spin-coating an unlikely option.

[0005] One technique for creating a uniform wet film coating using dissolved materials is "slot die coating." This technique involves a pumping element driving a solution into a slot die assembly. The solution is uniformly distributed within the slot die assembly and enters an internal solution reservoir or manifold. The manifold is connected to a narrow cavity via a meniscus guide and a gasket element, thereby guiding the solution downwards into the target substrate. The continuous downward flow creates a volume accumulation at the bottom end of the slot die assembly, where gravity exceeds the intermolecular forces holding the solution together. The collapse of the volume overflow brings the bottom surface of the meniscus guide into contact with the surface of the target substrate. Once a solution bridge or meniscus is formed, the excess volume is distributed across the extension of the meniscus guide and the substrate. The combination of the continuously supplied fluid volume to the meniscus and the moving substrate forms a wet film with a width equal to the gasket width. The wet film thickness is proportional to the pumping rate and inversely proportional to the speed of meniscus extension and substrate movement. The direct correlation between coating parameters and final film formation makes slot die coating a pre-metering technique. Unlike spin coating, in slot die coating, all the solution leaving the slot die eventually enters the wet film.

[0006] The diversity of wafer sizes and formats presents challenges to adopting slot die coating as a mainstream high-throughput industry solution, leading to numerous issues. The primary approach to slot die coating involves an intermittent process using a high-precision robotic system to load and unload each wafer into a slot die tool. In this example, the flow distribution on the slot die element is interrupted between samples. A wafer carrier moves back and forth beneath the slot die while holding the wafer stationary. In this way, a rectangular coating area is formed with its boundaries perpendicular to the coating direction with each iteration. However, this assumes the target wafer size is smaller than a rectangular coating. In this case, problems arise as the solution diffuses below, leading to cross-contamination, unnecessary chemical reactions, or additional cleaning steps. A route that cleans the coating area holding the wafer between samples can prevent further contamination. Adjusting the coating area to fit the wafer area is also complex and only applicable to square substrates. In both examples above, the need for intermittent switching of the solution supply and the loading and unloading of the vertically retrieving slit die head can lead to unwanted uniformity problems, such as so-called tailing and leading effects at the beginning and end of each intermittent coating. Inconsistencies in the amount of ink accumulated within the slit die cavity or in the formed meniscus can cause these defects and other deviations from the intended metering process quality.

[0007] Various strategies for avoiding inhomogeneities before and after the slit die have been described. For example, US5536313 and US7041336 propose complex designs for meniscus guide cavities to better control the flow rate of the slit die. US 6475282 proposes a method for high-resolution control of the solution flow rate entering the slit die system. Unfortunately, regardless of the sophisticated nozzle architecture or high hydraulic control, residual volumes caused by capillary action or surface effects persist. Alternatively, as described in US6436472, a slit die spin coating mixing mechanism is employed, in which the solution is first distributed using a slit die coating head before spin coating. While this method introduces an innovative approach to better distribute the solution onto the substrate, the process retains all the limitations of slit die coating in terms of materials, waste, thickness, and scalability. In the current context, it is necessary to consider extending this to production lines capable of producing coatings on thousands of wafers per hour with minimal operating and capital costs.

[0008] TW202015818A discloses a slit-die coating system for applying fluid discharged from a slit-die onto one or more substrates. The system includes a slit-die with a discharge slit or slot and a conveyor belt or carrier, on which one or more substrates are arranged and pass directly below the discharge slit of the slit-die during coating with the fluid discharged from the slit-die. The slit-die has two fixed side bars and two movable side bars. The fixed side bars are located on either side of the discharge slit, with the distance between the two fixed side bars equal to the width of the discharge slit. The movable side bars are adjacent to the discharge slit and movable along the width direction of the discharge slit. Therefore, the width of the discharge slit can be adjusted and changed at any time; specifically, the slit-die is divided into a central portion and two side portions by the movable side bars, wherein the width of the central portion can vary according to the shape of the substrate being coated, and this width corresponds to the spacing of the movable side bars. However, the disclosed slit-type die head lacks a meniscus guide, and the conveyor belt carrying the substrate lacks an adhesive front surface for providing a substantially sealed connection between the back surface of the substrate and the front surface of the conveyor belt.

[0009] Therefore, there is a need for an improved slit-die coating method and system that can coat substrates or wafers of different sizes without contaminating the back surface of the substrates or wafers. Furthermore, there is a need for a slit-die coating process and system capable of continuously processing substrates or wafers. Summary of the Invention

[0010] The purpose of this disclosure is to provide an improved method for slit-die coating of one or more substrates without contaminating the back surface of the substrates.

[0011] Another objective of this disclosure is to provide an improved method for slot die coating of multiple substrates, which allows for continuous substrate production.

[0012] According to a first aspect, the object is achieved by providing a method for applying fluid discharged from a slit-type die to one or more substrates, the slit-type die including a discharge slit and a meniscus guide, the bottom of the meniscus guide extending below the discharge slit, and the substrates having a front surface, a back surface, an edge surface between the front and back surfaces, a maximum width, a maximum length, and a thickness; wherein the method includes:

[0013] a) Provide an adhesive carrier tape having an adhesive front surface and a non-adhesive back surface;

[0014] b) Position one or more substrates on the front surface of the carrier tape;

[0015] c) Provide a substantially sealed connection between the back surface of one or more substrates and the front surface of the carrier tape;

[0016] c) Positioning the carrier tape holding one or more substrates adjacent to the slit die to define a predetermined distance between the front surface of the carrier tape and the bottom edge of the bottom of the meniscus guide; and

[0017] d) The carrier tape, together with one or more substrates, is advanced along the machine direction through the discharge slit of the slit-type die head, while fluid is discharged from the discharge slit as a wet film layer on the front surface of one or more of the substrates.

[0018] In a possible implementation of the first aspect, the distance between the front surface of the carrier tape and the bottom edge of the meniscus guide is greater than the thickness of one or more of the substrates.

[0019] In a possible implementation of the first aspect, the distance between the front surface of the carrier tape and the bottom edge of the meniscus guide is determined according to the thickness of the substrate.

[0020] In a possible implementation of the first aspect, the slit mold head includes a slit mold back plate, a slit mold front plate, a gasket, and a meniscus guide, wherein the gasket and the meniscus guide are sandwiched between the slit mold front plate and the slit mold back plate.

[0021] In a possible implementation of the first aspect, the length of the discharge slit is defined by the length of the opening on the gasket, and the width of the discharge slit is defined by the thickness of the gasket.

[0022] In a possible implementation of the first aspect, one or more of the substrates are one or more wafers.

[0023] In a possible implementation of the first aspect, one or more substrates are located on a carrier tape to advance through an exhaust slit along the length of the substrates, the exhaust slit extending along the width of one or more of the substrates, and the extension of the exhaust slit is greater than the maximum width of one or more of the substrates.

[0024] In a possible implementation of the first aspect, step d) involves discharging the fluid from the discharge slit to one or more of the substrates to cover the entire front surface of the substrate and the edge surface of the substrate.

[0025] Therefore, the entire front surface of the substrate is covered by a wet film layer, which also covers the edges of the substrate. By establishing a sealed connection between the back surface of the substrate and the carrier tape, the back surface of the substrate is protected from the fluid that forms the wet film layer, thereby preventing potential chemical reactions between any functional layers on the back surface of the substrate and the fluid components that form the wet film layer.

[0026] In a possible implementation of the first aspect, multiple individual substrates are continuously positioned on the front surface of the adhesive carrier tape, wherein each substrate is spaced apart.

[0027] In a possible implementation of the first aspect, the carrier belt, together with the substrate, continues to advance in the machine direction for a period of time to allow fluid to be discharged from the discharge slits onto the wet film layer on the front surface of a plurality of consecutively positioned substrates.

[0028] In a possible implementation of the first aspect, during the time period, the fluid is continuously discharged from the discharge slit, thereby forming a wet film layer on both the front surface of the substrate and a portion of the carrier tape that separates the substrates from each other.

[0029] In a possible implementation of the first aspect, one or more substrates are positioned substantially horizontally on the front surface of the carrier tape, and the carrier tape is advanced substantially horizontally through the discharge slit.

[0030] In a possible implementation of the first aspect, an alignment support is provided to support the back surface of the carrier tape during at least a portion of step d) to maintain a predetermined distance between the front surface of the carrier tape and the bottom edge of the meniscus guide as fluid is discharged from the discharge slit onto the substrate.

[0031] In a possible implementation of the first aspect, the alignment support is a vacuum chuck that provides negative pressure between the vacuum chuck and the carrier tape to planarize one or more substrates sealed to the carrier tape during the discharge of fluid from the discharge slit onto one or more substrates.

[0032] In a possible implementation of the first aspect, the magnitude of the negative pressure is selected such that the carrier belt is allowed to advance along the machine direction on top of the vacuum chuck.

[0033] In a possible implementation of the first aspect, the method further includes the step of eliminating the sealing connection between one or more of the substrates and the adhesive carrier tape.

[0034] In a possible implementation of the first aspect, the adhesive carrier tape is a photocurable tape, and after one or more of the substrates have completely passed through the discharge slit, light from a light radiation source illuminates the back surface of the carrier tape located below one or more of the substrates on the front surface of the carrier tape, thereby inhibiting or eliminating the connection between one or more of the substrates and the adhesive carrier tape.

[0035] Photopolymerization uses light (such as ultraviolet light) to eliminate the adhesive strength of the carrier tape and promote the separation of the substrate from the carrier tape.

[0036] In a possible implementation of the first aspect, the light source is arranged below the carrier tape, and the light trap structure is arranged above the light source to keep the carrier tape of one or more of the substrates passing between the light source and the light trap structure in the machine direction.

[0037] In a possible implementation of the first aspect, the light radiation source is arranged downstream of the slit-type mold head and the alignment support relative to the machine direction.

[0038] In a possible implementation of the first aspect, the adhesive carrier tape is a thermally sensitive tape, and step c) of providing a sealing connection between the back surface of one or more of the substrates and the front surface of the carrier tape includes a heating process using a first heat source, in which heat is supplied to the back surface of the carrier tape located below one or more of the substrates on the front surface of the carrier tape.

[0039] In a possible implementation of the first aspect, the first heat source is arranged relative to the machine direction upstream of the slit-type mold head and the alignment support.

[0040] In a possible implementation of the first aspect, after one or more of the substrates have completely passed through the discharge slit, heat is supplied from a second heat source to the back surface of the carrier tape located below one or more of the substrates on the front surface of the carrier tape, thereby eliminating the sealing connection between one or more of the substrates and the adhesive carrier tape.

[0041] The heat supplied by the second heat source can eliminate the adhesive strength of the carrier tape and promote the separation of the substrate from the carrier tape.

[0042] In a possible implementation of the first aspect, the second heat source is arranged downstream of the slit-type die and the alignment support relative to the machine direction.

[0043] In a possible implementation of the first aspect, a first transport conveyor belt is provided for supplying a plurality of individual substrates to a carrier belt, and a first backing roller is provided for holding the carrier belt in place as it moves in the machine direction to receive individual substrates from the conveyor belt.

[0044] In a possible implementation of the first aspect, the first backing roller is arranged upstream of the slit die and the alignment support relative to the machine direction.

[0045] In a possible implementation of the first aspect, when a first heat source is provided, the first backing roller is arranged upstream of the first heat source relative to the machine direction.

[0046] In a possible implementation of the first aspect, the method further includes the step of separating one or more substrates from the adhesive carrier tape.

[0047] In a possible implementation of the first aspect, after the step of eliminating the sealing connection between one or more substrates and the adhesive carrier tape, the next step is to separate one or more said substrates from the adhesive carrier tape.

[0048] In a possible implementation of the first aspect, a substrate-tape separation platform and a second backing roller are provided and arranged for separating one or more said substrates from the adhesive carrier tape.

[0049] In a possible implementation of the first aspect, a second transport conveyor belt is provided for receiving one or more of the substrates separated from the adhesive carrier belt, and a substrate-belt separation platform is positioned for supplying one or more separated substrates to the second transport conveyor belt.

[0050] In a possible implementation of the first aspect, the second transport conveyor belt is arranged downstream of the substrate-belt separation platform along the machine direction.

[0051] In a possible implementation of the first aspect, the substrate-tape separation platform has a circular substrate release edge, and a second backing roller is positioned to ensure that, as the carrier tape advances, the carrier tape holding one or more of the substrates is pulled around the substrate release edge.

[0052] In a possible implementation of the first aspect, the substrate-belt separation platform and the second backing roller are arranged downstream of the light radiation source or downstream of the second heat source relative to the machine direction.

[0053] In a possible implementation of the first aspect, the substrate-tape separation platform and the second backing roller are arranged to change the orientation of the adhesive carrier tape by a peel angle, said peel angle being at least 90 degrees relative to the machine direction.

[0054] Another object of this disclosure is to provide an improved system for slit-die coating of one or more substrates without contaminating the back surface of the substrates.

[0055] Another object of this disclosure is to provide an improved system for slot die coating of multiple substrates, which allows for continuous processing of substrates.

[0056] According to the second aspect, this objective is achieved by providing a system for applying fluid to one or more movable substrates, the substrates having a front surface, a back surface, an edge surface between the front and back surfaces, a maximum width, a maximum length, and a thickness; wherein the system includes:

[0057] A slit-type die head, the slit-type die head including an exhaust slit and a meniscus guide, the bottom of the meniscus guide extending below the exhaust slit;

[0058] An adhesive substrate carrier tape having an adhesive front surface and a non-adhesive back surface, the carrier tape holding one or more substrates on the front surface of the carrier tape, and the carrier tape being configured to provide a substantially sealed connection between the back surfaces of one or more of the substrates and the front surface of the carrier tape.

[0059] A roller system for advancing the carrier belt, holding one or more of the substrates, in the machine direction through an exit slit of a slit-type die head; and

[0060] An alignment support is provided to support the back surface of the carrier belt to maintain a predetermined distance between the front surface of the carrier belt and the bottom edge of the meniscus guide, thereby maintaining the distance between the front surface of one or more substrates and the bottom edge of the meniscus guide as the carrier belt carrying one or more substrates is advanced in the machine direction through the discharge slit of the slit die.

[0061] In a possible implementation of the second aspect, the distance between the front surface of the carrier tape and the bottom edge of the meniscus guide is greater than the thickness of one or more of the substrates.

[0062] In a possible implementation of the second aspect, the distance between the front surface of the carrier tape and the bottom edge of the meniscus guide is determined according to the thickness of one or more of the substrates.

[0063] In a possible implementation of the second aspect, the slit mold head includes a slit mold back plate, a slit mold front plate, a gasket, and a meniscus guide, wherein the gasket and the meniscus guide are sandwiched between the slit mold front plate and the slit mold back plate.

[0064] In a possible implementation of the second aspect, the length of the discharge slit is defined by the length of the opening on the gasket, and the width of the discharge slit is defined by the thickness of the gasket.

[0065] In a possible implementation of the second aspect, one or more of the substrates are one or more wafers.

[0066] In a possible implementation of the second aspect, one or more substrates are positioned on a carrier tape to advance through an exhaust slit along the length of the substrate.

[0067] In a possible implementation of the second aspect, the discharge slit extends along the width direction of one or more of the substrates, and the extension range of the discharge slit is greater than the maximum width of one or more of the substrates.

[0068] In a possible implementation of the second aspect, the slit die is configured to discharge fluid from the discharge slit as a wet film layer on the front surface of one or more substrates as the carrier belt carrying one or more substrates advances along the machine direction through the discharge slit of the slit die.

[0069] In a possible implementation of the second aspect, the slit-type die is configured to discharge fluid from the discharge slit onto one or more substrates to cover the entire front surface of the substrates and the edge surfaces of the substrates.

[0070] Therefore, the entire front surface of the substrate can be covered by a wet film layer, which also covers the edges of the substrate. By establishing a sealed connection between the back surface of the substrate and the carrier tape, the back surface of the substrate is protected from the fluid that forms the wet film layer, thereby preventing potential chemical reactions between any functional layers on the back surface of the substrate and the fluid components that form the wet film layer.

[0071] In a possible implementation of the second aspect, multiple individual substrates are continuously positioned on the front surface of the adhesive carrier tape, wherein each substrate is spaced apart.

[0072] In a possible implementation of the second aspect, the roller system is configured to allow the carrier belt, together with the substrate, to advance continuously in the machine direction for a period of time, so as to allow fluid to be discharged from the discharge slits onto the wet film layer on the front surface of a plurality of consecutively positioned substrates.

[0073] In a possible implementation of the second aspect, one or more substrates are positioned in a substantially horizontal position on the front surface of the carrier tape, and the roller system is configured to advance the carrier tape through the discharge slit in a substantially horizontal direction.

[0074] In a possible implementation of the second aspect, the alignment support is a vacuum chuck, wherein the vacuum chuck is configured to provide negative pressure between the vacuum chuck and the carrier tape to flatten the substrate sealed on the carrier tape as it passes through the discharge slit.

[0075] In a possible implementation of the second aspect, the magnitude of the negative pressure is selected such that the carrier belt is allowed to advance along the machine direction on top of the vacuum chuck.

[0076] In a possible implementation of the second aspect, the system also includes an elimination system for eliminating the sealing connection between one or more substrates and the adhesive carrier tape.

[0077] In a possible implementation of the second aspect, the adhesive carrier tape is a photocurable tape, and the elimination system includes a light radiation source arranged to supply light to the back surface of the carrier tape located below a substrate on the front surface of the carrier tape.

[0078] The supply of light will eliminate the adhesive strength of the photocurable carrier tape and promote the separation of the substrate from the carrier tape.

[0079] In a possible implementation of the second aspect, the light radiation source is arranged downstream of the slit-type mold head and the alignment support relative to the machine direction.

[0080] In a possible implementation of the second aspect, the light source is arranged below the carrier tape, and a light trap structure is provided above the light source, so that the carrier tape of one or more of the substrates passes between the light source and the light trap structure in the machine direction.

[0081] In a possible implementation of the second aspect, the adhesive carrier tape is a thermally sensitive tape, and the system further includes a first heat source for supplying heat to the back surface of the carrier tape located below the substrate on the front surface of the carrier tape.

[0082] In a possible implementation of the second aspect, the first heat source is arranged relative to the machine direction upstream of the slit-type die head and the alignment support.

[0083] In a possible implementation of the second aspect, the elimination system includes a second heat source arranged to supply heat to the back surface of the carrier tape located below a substrate on the front surface of the carrier tape.

[0084] The heat supplied by the second heat source can eliminate the adhesive strength of the thermal carrier tape and promote the separation of the substrate from the carrier tape.

[0085] In a possible implementation of the second aspect, the second heat source is arranged downstream of the slit-type die head and the alignment support relative to the machine direction.

[0086] In a possible implementation of the second aspect, the system further includes:

[0087] A first transport conveyor belt is used to supply multiple individual substrates to a carrier belt, and

[0088] A first backing roller is used to hold the carrier belt in place so as to receive individual substrates from the conveyor belt as the carrier belt moves in the machine direction.

[0089] In a possible implementation of the second aspect, the first backing roller is arranged upstream of the slit die and the alignment support, and if there is a first heat source, it is also arranged upstream of the first heat source relative to the machine direction.

[0090] In a possible implementation of the second aspect, the first conveyor belt is located upstream of the first backing roller relative to the machine direction.

[0091] In a possible implementation of the second aspect, the system also includes a separation system for separating one or more substrates from the adhesive carrier tape.

[0092] In a possible implementation of the second aspect, the separation system includes a substrate-belt separation platform and a second backing roller.

[0093] In a possible implementation of the second aspect, the system further includes a second transport conveyor for receiving substrates separated from the adhesive carrier tape, and a substrate-tape separation platform is positioned to supply one or more separated substrates to the second transport conveyor.

[0094] In a possible implementation of the second aspect, the second transport conveyor belt is arranged downstream of the substrate-belt separation platform relative to the machine direction.

[0095] In a possible implementation of the second aspect, the substrate-tape separation platform has a circular substrate release edge, and a second backing roller is positioned to ensure that the carrier tape holding one or more of the substrates is pulled around the substrate release edge as the carrier tape advances.

[0096] In a possible implementation of the second aspect, the substrate-belt separation platform and the second backing roller are arranged downstream of the light radiation source or the second heat source relative to the machine direction.

[0097] In a possible implementation of the second aspect, the substrate-belt separation platform and the second backing roller are arranged to change the orientation of the adhesive carrier belt by a peel angle, said peel angle being at least 90 degrees relative to the machine direction.

[0098] The above and other objectives are achieved by the features of the independent claims. Further embodiments will be apparent from the dependent claims, the description, and the drawings. These and other aspects of the invention will be apparent from the following embodiments. Attached Figure Description

[0099] In the following detailed sections of this disclosure, the invention will be explained in more detail with reference to exemplary embodiments shown in the accompanying drawings, wherein:

[0100] Figure 1a An isometric view of an assembled slit mold head according to an exemplary embodiment;

[0101] Figure 1b According to an exemplary implementation Figure 1a An exploded view of the slit-type die head;

[0102] Figure 1c According to an exemplary implementation Figure 1a Left side view of the assembled slit mold head;

[0103] Figure 1d According to an exemplary implementation Figure 1a A front view of the assembled slit mold head;

[0104] Figure 1e According to an exemplary implementation Figure 1d A close-up view of a portion of the bottom of a slit-type die head;

[0105] Figure 2a A roller-to-substrate slot die coating system using a photocurable adhesive carrier tape is shown according to an exemplary embodiment;

[0106] Figure 2b A roller-to-substrate slot die coating system using a thermally sensitive adhesive carrier tape is shown according to an exemplary embodiment;

[0107] Figure 3a A schematic top view of a substrate slit-die coating system using a carrier tape and a roller for coating one substrate at a time, according to an exemplary embodiment.

[0108] Figure 3b A schematic top view of a roller-to-substrate slot die coating system according to an exemplary embodiment, using a carrier tape and a slot die coating width for simultaneously coating two substrates.

[0109] Figure 4a This is a close-up view of a textured substrate being transferred from a supply conveyor belt to an adhesive carrier belt according to an exemplary embodiment.

[0110] Figure 4b This is a close-up view of a flat substrate being transferred from a supply transport conveyor belt to an adhesive carrier belt according to another exemplary embodiment.

[0111] Figure 5a and Figure 5b A schematic side view illustrating a coating process of a substrate moving relative to a coating slit die according to an exemplary embodiment.

[0112] Figure 5c A cross-sectional view illustrating the coating on a substrate having a textured bottom surface according to an exemplary embodiment;

[0113] Figure 5d A cross-sectional view illustrating the coating on a substrate having a flat bottom surface according to an exemplary embodiment;

[0114] Figure 6a and Figure 6b A schematic close-up side view and a top view illustrating the arrangement of the slit die and vacuum chuck within a roller-to-substrate slit die coating system according to an exemplary embodiment.

[0115] Figure 7 A flowchart illustrating the steps of a roller-to-substrate slot die coating process using a photocurable adhesive carrier tape according to an exemplary embodiment; and

[0116] Figure 8 This is a flowchart illustrating the steps of a roller-to-substrate slot die coating process using a thermally sensitive adhesive carrier belt according to an exemplary embodiment.

[0117] List of reference numerals

[0118] 100 Slit-type die head.

[0119] 101 Slit mold plate.

[0120] 102. Meniscus guide component.

[0121] 103 Gasket.

[0122] 104 Slit-type mold front plate.

[0123] 105 Front panel fasteners.

[0124] 106 Backplate fasteners.

[0125] 107 The surface of the substrate to be coated.

[0126] 108. Width of the bottom of the meniscus guide component.

[0127] 109 Distance between the meniscus guide and the substrate to be coated.

[0128] 110 Length of the gasket and meniscus guide.

[0129] 111a Slit-type manifold ink reservoir and ink inlet.

[0130] 111b Exhaust slit.

[0131] 200a Roller-to-substrate slot die coating system using photocurable adhesive carrier tape.

[0132] 200b is a roller-to-substrate slit-die coating system using a heat-sensitive adhesive carrier tape.

[0133] 201 First transport conveyor belt.

[0134] 202 substrate.

[0135] 202a A substrate with a textured bottom surface.

[0136] 202b A substrate with a flat bottom surface.

[0137] 203 First backing roller.

[0138] 204 Adhesive Carrier Tape.

[0139] 205 The direction in which the first backing roller pulls the carrier belt forward.

[0140] 206 The point where the carrier tape and the substrate merge.

[0141] 207a The upstream meniscus formed between the meniscus guide and the substrate.

[0142] 207b The upstream meniscus formed between the meniscus guide and the carrier belt.

[0143] 208. Coated wet film layer.

[0144] 208a A wet film layer coated on the front surface of a substrate.

[0145] 208b A wet film layer coated on the front surface of an adhesive carrier tape.

[0146] 208ca is a wet film layer coated at the edge between the substrate with a textured underlayer and the carrier tape.

[0147] 208cb is a wet film layer coated at the edge between a substrate with a flat underlayer and a carrier tape.

[0148] 209 Vacuum suction cup.

[0149] 209a Vacuum suction cup metal solid frame component.

[0150] 209b Vacuum suction cup with porous metal material.

[0151] 210 A light radiation source for curing carrier tape.

[0152] The 211 optical trap structure prevents the coated wet film from being exposed to stray light from the light source 210.

[0153] 212 The machine direction in which the carrier belt advances through the coating slit die.

[0154] 213 The remaining coating layer on the carrier tape.

[0155] 214 Peeling Angle

[0156] 215 Substrate strip separation platform.

[0157] 216 Second backing roller.

[0158] 217 The direction in which the second backing roller pulls the carrier belt forward.

[0159] 218 Separation point between carrier tape and substrate.

[0160] 219 Second conveyor belt.

[0161] 220 Coated and separated substrate.

[0162] 221 A first heat source used to activate the adhesive strength of the thermal carrier tape.

[0163] 222 is a second heat source used to deactivate the adhesive strength of the thermal carrier tape.

[0164] 223. The adhesive layer of the carrier tape. Its thickness is greater than the roughness of the bottom surface of the textured substrate.

[0165] 224 Adhesive carrier tape base film.

[0166] 225 Distance between the meniscus guide and the top surface of the adhesive carrier tape.

[0167] 226 Cross-sectional view of the wet film layer between the substrate edge and the carrier tape.

[0168] 226a Cross-sectional view of the wet film layer at the edge between the substrate with a textured underlayer and the carrier tape.

[0169] 226b Cross-sectional view of the wet film layer at the edge between the substrate with a flat underlayer and the carrier tape. Detailed Implementation

[0170] For slit-die coating, a slit-die coating system should be provided, which includes a slit-die head 100, such as... Figure 1a , Figure 1b , Figure 1c and Figure 1d As shown. Among them, Figure 1a This is an isometric view of the fully assembled slit-type mold head 100 according to the embodiment. Figure 1b An exploded view of the slit-type die head 100. Figure 1c The left-side view, and Figure 1d A front view of the assembled slit mold head 100.

[0171] The slot-die head 100 includes a slot-die backplate 101, a meniscus guide 102, a gasket 103, and a slot-die front plate 104. The meniscus guide 102 and the gasket 103 are sandwiched between the backplate 101 and the front plate 104, and are provided with a front plate fastener 105 and a backplate fastener 106 for assembling the backplate 101, the meniscus guide 102, the gasket 103, and the front plate 104.

[0172] An ink inlet 111a is formed in the front plate 104 (see...) Figure 2a , Figure 2b , Figure 5a, Figure 5b and Figure 6a The ink reservoir of the slit-type die head, which is connected to the discharge slit 111b formed in the front plate 104 and located at the bottom of the slit-type die head 100 (see...). Figure 2a , Figure 2b , Figure 5a , Figure 5b and Figure 6a The connection is fluid. The length of the discharge slit 111b is defined by the length of the opening in the gasket 103, and the width of the discharge slit 111b is defined by the thickness of the gasket 103.

[0173] The bottom portion of the meniscus guide 102 extends below the discharge slit 111b, as... Figure 1e As shown, Figure 1e yes Figure 1d A close-up view of the bottom portion of the slit-type die 100 shown (as indicated by arrow A). Figure 1e In the diagram, 108 represents the width of the bottom portion of the meniscus guide 102 extending below the front plate 104 of the discharge slit 111b and the slit die head 100; 107 represents the surface of the substrate to be coated; 109 represents the distance between the bottom edge of the meniscus guide 102 and the surface 107 of the substrate to be coated; and 110 represents the length of the spacer 103 and the length of the meniscus guide 102.

[0174] To apply a wet film layer on a substrate using a slit die 100, the slit die coating system may include a pumping element that drives a fluid solution into a slit die ink reservoir 111a, and then guides the solution from the slit die ink reservoir 111a through an outlet slit to the target substrate 107 by a meniscus guide 102. A continuous flow of the ink to the slit die ink reservoir 111a and the moving substrate is combined to form a wet film with a width equal to the length 110 of the meniscus guide 102. The wet film thickness is proportional to the pumping rate and inversely proportional to the extension of the meniscus guide 102 and the speed of substrate movement.

[0175] Figure 2a A so-called "roll-to-substrate" slot die coating system 200a is shown, which uses a photocurable adhesive carrier tape to carry a substrate 202 to be coated; while Figure 2b A so-called "roll-to-substrate" slot die coating system 200b using a heat-sensitive adhesive carrier tape is shown. Figure 2a and Figure 2b The system includes many of the same components and is therefore referred to by the same reference numerals.

[0176] Figure 2a Both systems 200a and 200b in Figure 2 include, for example: Figures 1a to 1eThe slit-type die head 100 shown includes a slit-type die back plate 101, a meniscus guide 102, a gasket 103, and a slit-type die front plate 104. An ink reservoir with an ink inlet 111a is formed in the front plate 104, fluidly connected to a discharge slit 111b formed in the front plate 104 and located at the bottom of the slit-type die head 100. The length of the discharge slit 111b is defined by the length of the opening in the gasket 103, and the width of the discharge slit 111b is defined by the thickness of the gasket 103. The bottom portion of the meniscus guide 102 extends below the discharge slit 111b.

[0177] For both systems 200a and 200b, a roller system is provided, comprising a first backing roller 203 and a second backing roller 216. The first backing roller 203 and the second backing roller 216 are used to advance an adhesive carrier belt 204 holding one or more substrates 202 along the machine direction 212 through an exhaust slit 111b and the bottom portion of a meniscus guide 102 extending below the exhaust slit 102 of the slit-type die head 100. The adhesive substrate carrier belt 204 has an adhesive front surface and a non-adhesive back surface. The carrier belt 204 holds the substrates on its front surface, and due to the adhesive front surface of the carrier belt 204, a substantially sealed connection can be provided between the back surface of the substrate 202 and the front surface of the carrier belt 204.

[0178] A first conveyor belt 201 is arranged to feed a substrate 202 onto an adhesive carrier belt, and a second conveyor belt 219 is arranged to receive the substrate 202 after a wet film layer 208 has been applied to the substrate 202 as it passes through the discharge slit 111b of the slit die 100 and after the substrate has separated from the carrier belt 204. As the carrier belt 204 and the substrate 202 advance along the machine direction 212 through the discharge slit 111b of the slit die 100, fluid is simultaneously discharged from the discharge slit 111b as a wet film layer 208 on the front surface of the substrate 202, forming an upstream meniscus 207 between the meniscus guide 102 and the substrate 202. Figure 2a and Figure 2b In the figure, reference numeral 220 refers to the coated and separated substrate received by the second transport conveyor belt 219.

[0179] An alignment support 209 is arranged below the slit-type die 100. This support supports the back surface of the carrier tape 204 and maintains a predetermined distance between the front surface of the carrier tape 204 and the bottom edge of the meniscus guide 102. This ensures that the predetermined distance is maintained between the front surface of the substrate 202 and the bottom edge of the meniscus guide 102 as the carrier tape 204, carrying one or more substrates, advances along the machine direction through the discharge slit of the slit-type die. It should be understood that the distance between the front surface of the carrier tape 204 and the bottom edge of the meniscus guide 102 is greater than the thickness of the substrate 202. Preferably, the substrate 202 is a wafer, such as a silicon wafer.

[0180] The substrate 202 can be positioned on the carrier tape 204 so that the carrier tape 204 moves along the length of the substrate 202 through the discharge slit.

[0181] The discharge slit 111b and meniscus guide 102 of the slit-type mold head 100 can be configured to discharge fluid from the discharge slit 111b to the substrate 202, covering the entire front surface of the substrate 202 and the edge surface of the substrate 202. Therefore, the discharge slit 111b extends along the width of the substrate 202, and its extension should be greater than the maximum width of the substrate 202.

[0182] The substrate 202 is positioned substantially horizontally on the front surface of the carrier tape 204, and the roller system is configured to advance the carrier tape in a substantially horizontal direction through the discharge slit 111b. Preferably, a plurality of individual substrates 202 are continuously placed on the front surface of the adhesive carrier tape 204, wherein there is a distance between each substrate 202. The roller system may be configured to continuously advance the carrier tape 204 together with the substrates 202 in the machine direction 212 for a period of time to allow fluid to be discharged from the discharge slit 111b as a wet film layer on the front surface of the plurality of consecutively placed substrates 202.

[0183] Preferably, the alignment support 209 is a vacuum chuck configured to provide negative pressure between the vacuum chuck and the carrier tape 204, so that the substrate 202 sealed on the carrier tape is planarized as it passes through the discharge slit 111b. The magnitude of the negative pressure can be selected to allow the carrier tape 204 to advance in the machine direction 212 above the top of the alignment support 209. Here, the negative pressure can be in the range of 2 bar to 6 bar, for example, in the range of 3 bar to 4 bar.

[0184] To separate the coated substrate 202 from the carrier tape 204, a substrate tape separation platform 215 is provided. This platform 215 is located above the second backing roller 216 and is used to change the orientation of the carrier tape by a peel angle 214 of at least 90 degrees, thereby separating the substrate 202 from the carrier tape 204. After the substrate 202 is separated from the carrier tape 204, some of the coated film layer remains on the carrier tape 204, as shown by reference numeral 213.

[0185] exist Figure 2a and Figure 2b In the attached figures, reference numeral 205 indicates the forward direction of the carrier belt 204 as it enters the first backing roller 203; reference numeral 206 indicates the point where the carrier belt 204 and the substrate 202 merge when the substrate 202 is received from the first transport conveyor belt 201; reference numeral 217 indicates the forward direction of the carrier belt 204 as it leaves the second backing roller 216; and reference numeral 218 indicates the point where the carrier belt 204 separates from the substrate 202.

[0186] Figure 2a System 200a is designed for use with a photocurable adhesive carrier tape 204, such as an ultraviolet (UV) photocurable adhesive carrier tape, wherein the adhesive strength between the carrier tape 204 and the substrate 202 can be deactivated by exposing the carrier tape to light (e.g., ultraviolet light). Therefore, system 200a includes a deactivation system in the form of a light source 210 arranged to supply light to the back surface of the carrier tape 204, located below the substrate 202 on the front surface of the carrier tape 204. The light source 210 is arranged downstream of the slit-type die head 100 and the alignment support 209 relative to the machine direction 212. A light trap structure 211 may be provided above the light source 210, wherein the carrier tape 204 is held between the light source 210 and the light trap structure 211 as it passes over the substrate 202 along the machine direction 212. The light trap structure 211 can prevent scattered light from the light radiation source 201 from shining on the wet film layer 208 coated on the top of the substrate 202.

[0187] for Figure 2a In system 200a, substrate-belt separation platform 215 and second backing roller 216 are arranged downstream of light radiation source 210 relative to machine direction 212, and second transport conveyor belt 219 is arranged downstream of substrate-belt separation platform 215 relative to machine direction.

[0188] Figure 2b System 200b is designed for use with thermally sensitive adhesive carrier tape 204. Therefore, Figure 2bSystem 200b includes a first heat source 221 for activating the adhesive strength of the thermal carrier tape 204. The first heat source 221 is positioned to supply heat to the back surface of the carrier tape 204, located below the substrate 202 on the front surface of the carrier tape 204. The first heat source 2021 is arranged upstream of the slit die 100 and the alignment support 209 relative to the machine direction 212. The thermal adhesive carrier tape 204 may have an adhesive top layer that is softened by the heat treatment provided by the first heat source 221, subsequently re-cured, and holds the substrate 202 in a secure position. To separate the coated substrate 202 from the thermal carrier tape 204, a second heat treatment may be required to soften the cured top layer adhesive. Therefore, an elimination system in the form of a second heat source 222 is arranged for supplying heat to the back surface of the thermal carrier tape 204, located below the substrate 202 on the front surface of the carrier tape. The second heat source 222 is arranged along the machine direction 212 downstream of the slit mold head 100 and the alignment support 209.

[0189] for Figure 2b In system 200b, substrate-belt separation platform 215 and second backing roller 216 are arranged downstream of second heat source 222 relative to machine direction 212, and second conveyor belt 219 is arranged downstream of substrate-belt separation platform 215 relative to machine direction.

[0190] In embodiments of this disclosure, the carrier tape 204 can carry a single row of substrates 202, but in embodiments of this disclosure, the carrier tape 204 can also carry two or more rows of substrates 202. This is in Figure 3a and Figure 3b The explanation is provided in the text, in which Figure 3a This is a schematic top view of a "roller-to-substrate" slit-die coating system 200a or 200b that uses a carrier tape 204 and a slit-die coating width for coating one substrate 202 at a time. It can be seen that... Figure 3a The extension range of the discharge slit 111b is greater than the maximum width of a single substrate 202. Figure 3a In the case of system 200a, there is no first heat source 211 and a second heat source 220, but system 200a has a light radiation source 210 and a light trap structure 211. Figure 3a In the case of system 200b, there is a first heat source 211 and a second heat source 220, while system 200b does not have a light radiation source 210 or a light trap structure 211.

[0191] Figure 3b This is a schematic top view of a "roller-to-substrate" slit-die coating system using a carrier tape 204 and a slit-die coating width for simultaneously coating two substrates 202. It can be seen that... Figure 3bThe extension range of the discharge slit 111b is greater than the maximum width of the two parallel-arranged substrates 202. Figure 3b In the case of system 200a, there is no first heat source 211 and a second heat source 220, but system 200a has a light radiation source 210 and a light trap structure 211. Figure 3b In the case of system 200b, there is a first heat source 211 and a second heat source 220, while system 200b does not have a light radiation source 210 or a light trap structure 211.

[0192] The surface shape of the bottom of the substrate or wafer 202 processed by system 200a or 200b may differ. This is in Figure 4a and Figure 4b The explanation is provided in the text, in which, Figure 4a This is a close-up view of the textured substrate 202a being transferred from the supply conveyor belt 201 onto the adhesive carrier belt 204. Figure 4b This is a close-up view of the planar substrate 202b being transferred from the supply conveyor belt 201 onto the adhesive carrier belt 204. Figure 4a and Figure 4b In the image, carrier tape 204 is shown as a double-layer carrier tape, having an adhesive top layer 223 on top of the carrier tape base film 224. The thickness of the adhesive top layer 223 should be greater than the roughness of the textured substrate bottom surface of the substrate 202a.

[0193] The substrate or wafer 202 processed by system 200a or 200b moves forward along machine direction 212, passes through the discharge slit 111b of slit-type die head 100, and at the same time the fluid is discharged as a wet film layer 208a on the front surface of the substrate or wafer 202. Figure 5a and Figure 5b This is explained by schematic side views showing the coating process as the substrate 202 moves relative to the coating discharge slit 111b of the slit die 100.

[0194] The slit-type die head 100 has a slit-type die back plate 101, a meniscus guide 102, a gasket 103, and a slit-type die front plate 104. A slit-type die ink reservoir with an ink inlet 111a is formed in the front plate 104, which is fluidly connected to a discharge slit 111b located on the front plate 104 and at the bottom of the slit-type die head 100. A substrate 202 is sealed on a double-layer carrier belt having an adhesive top layer 223 above a carrier belt base film 224 and moves along the machine direction 212 by the advance of the carrier belt, passing through the discharge slit 111b. The carrier belt, together with the substrate 202, can move at a constant speed while the slit-type die head 100 remains in a fixed position.

[0195] Figure 5aThe first part of the coating process is shown, in which a wet film layer 208a has been coated on a portion of the front surface of the substrate 202. To obtain a wet film layer 208a of the desired thickness, the slit die 100 is positioned such that a predetermined distance 225 is defined between the bottom edge of the meniscus guide 102 and the top surface 223 of the adhesive carrier tape. To guide fluid discharged onto the substrate 202, such as… Figure 5a As shown, the bottom of the meniscus guide 102, with a width of 108, extends below the discharge slit 111b. Figure 5a In the figure, reference numeral 109 indicates the distance between the bottom edge of the meniscus guide 102 and the coated substrate 202. During fluid discharge onto the substrate 202, an upstream meniscus 207a is formed between the bottom edge of the meniscus guide 102 and the substrate 202.

[0196] Figure 5b The second part of the coating process is shown, in which the substrate 202 has passed through the discharge slit 111b, at which point the fluid is discharged directly onto the top layer 223 of the carrier tape, and a layer coated with a wet film 208b is formed on the top layer 223 of the carrier tape. During the discharge of fluid onto the top layer 223 of the carrier tape, an upstream meniscus 207b is formed between the bottom edge of the meniscus guide 102 and the top layer 223 of the carrier tape.

[0197] exist Figure 5a In the figure, reference numeral 226 indicates a sealing cut between the top surface 223 of the carrier tape and the edge of the coated substrate 202. Figure 5c and Figure 5d This was further explained, among which, Figure 5c Figure 226a shows the coating of substrate 202a, which has a textured bottom surface of an adhesive top layer 223 sealed on top of carrier base film 224, and a coated wet film layer 208ca formed at the edge of substrate 202. Figure 5d The cut view 226b shows the coating of substrate 202b, which has a flat bottom surface of an adhesive top layer 223 sealed on top of carrier base film 224, and a coated wet film layer 208cb formed at the edge of substrate 202.

[0198] Such as combination Figure 2a and Figure 2b Both systems 200a and 200b discussed include an alignment support 209 disposed below the slit-type die 100 to support the back surface of the carrier tape 204 and maintain a predetermined distance between the front surface of the carrier tape 204 and the bottom edge of the meniscus guide 102. Preferably, the alignment support 209 is a vacuum suction cup type support, such as... Figure 6a and Figure 6b As further shown. Figure 6a and Figure 6b A schematic close-up side view and a top view are provided to illustrate the arrangement of the roller-to-substrate slit die head 100 and the vacuum chuck 209 in the roller-to-substrate slit die coating systems 200a and 200b.

[0199] exist Figure 6a and Figure 6b In this design, the slit die 100 includes a slit die back plate 101, a meniscus guide 102, a gasket 103, and a slit die front plate 104. A slit die ink reservoir with an ink inlet 111a is formed in the front plate 104, which is fluidly connected to a discharge slit 111b located on the front plate 104 and at the bottom of the slit die 100. A substrate 202 is sealed to an adhesive carrier tape 204 and moves in the machine direction 212, passing over the discharge slit 111b on top of a vacuum chuck 209. The vacuum chuck 209 has a vacuum chuck metal solid frame component 209a that forms a frame around a vacuum chuck metal porous material 209b. The vacuum chuck metal porous material 209b allows for laminar flow, thereby achieving maximum flatness of the carrier tape 204 and the substrate 202 during the coating process. Figure 6b The system shown uses a carrier tape 204 and a slit-type die for simultaneously coating two substrates 202. It can be seen that the extension of the discharge slit 111b is greater than the maximum width of the two parallel substrates 202. The extension of the discharge slit 111b is defined by the length 110 of the spacer 103 and the meniscus guide 102. Figure 6b It is also shown that the width of the vacuum suction cup porous metal material 209b is substantially equal to the width of the carrier tape 204.

[0200] Figure 7 It shows the use Figure 2a The flowchart describes the steps of a roll-to-substrate slot die coating process using a system 200a and a substrate in the form of a photocurable adhesive carrier tape 204 and a silicon wafer 202.

[0201] Figure 7 The coating process begins in step 301. The wafer 202 is continuously guided through the first dual-belt conveyor system 201 into the first backing roller 203 carrying the adhesive carrier tape 204, step 302. The first backing roller 203 and the second backing roller 216 drive the carrier tape 204 from the unwinding machine (…). Figure 2a(Not shown) moves toward the slit die 100, step 303. Upon contact with the carrier tape 204, each wafer 202 is sealed onto the adhesive carrier tape 204, step 304. The sealed wafer 202 is now driven to the slit die 100 by the advancing carrier tape 204, step 305. As the wafer 202 passes through the exit slit 111b of the slit die 100, the alignment support 209 in the form of a vacuum chuck ensures maximum flatness or alignment through negative pressure laminar flow, while a wet film layer 208 is coated on the wafer 202, step 306. After passing through the exit slit 111b, the wafer 202, now coated with the film layer 208, reaches the light source 210, where the adhesive carrier tape 204, along with the wafer 202, is exposed to light, thereby releasing the wafer 202 from the carrier tape 204, step 307. Subsequently, the coated wafers 202 and 208 reach the peeling platform 215 with a peeling angle 214 greater than 90 degrees. Here, the movement direction of the carrier tape 204 is changed to separate the wafer 202 from the carrier tape 204, step 308. The separated wafer 202, together with the coated film layer 208, is received by the second transport conveyor belt or the exit conveyor belt 219 to remove the coated wafer 202, step 309. The method ends, step 310.

[0202] Figure 8 It shows the use Figure 2b The flowchart shows the steps of a roll-to-substrate slot die coating process using a system 200b and a substrate in the form of a thermally sensitive adhesive carrier tape 204 and a silicon wafer 202.

[0203] Figure 8 The coating process begins at step 401. The wafer 202 is continuously guided through the first dual-belt conveyor system 201 into the first backing roller 203 carrying the adhesive carrier tape 204, step 402. The first backing roller 203 and the second backing roller 216 drive the carrier tape 204 from the unwinding machine (…). Figure 2a(Not shown) moves toward the slit die 100, step 403. Upon contact with the carrier tape 204 and while the carrier tape 204 is exposed to the heat of the first heat source 221, each wafer 202 is sealed onto the carrier tape 204, step 404. The sealed wafers 202 are now driven toward the slit die 100 by the advancing carrier tape 204, step 405. As the wafers 202 pass through the discharge slit 111b of the slit die 100, the alignment support 209 in the form of a vacuum chuck ensures maximum flatness or alignment through negative pressure laminar flow, while a wet film layer 208 is coated onto the wafers 202, step 406. After passing through the discharge slit 111b, the wafer 202 now coated with the film layer 208 reaches the second heat source 222, where the carrier tape 204 is heated to soften the adhesive layer of the carrier tape 204 and release the wafer 202 from the carrier tape 204, step 407. The coated wafers 202 and 208 then reach the separation platform 215 with a peel angle 214 greater than 90 degrees, where the movement direction of the carrier tape 204 is changed to separate the wafer 202 from the carrier tape 204, step 408. At this time, the separated wafer 202, together with the coated film layer 208, is received by the second transport conveyor belt or the exit conveyor belt 219 to remove the coated wafer 202, step 409. The method ends, step 410.

[0204] according to Figure 7 The steps involve using a photocurable adhesive carrier tape 204 and... Figure 2a System 200a, or in accordance with Figure 8 The steps involve using thermal adhesive carrier tape 204 and... Figure 2b Details of an exemplary implementation of the slot die coating process in System 200b:

[0205] Substrate: Substrate 202 is an M6 silicon wafer (approximately 166 square millimeters) with a thickness of 180 micrometers. Individual wafers are aligned on carrier tape 204 with a distance of approximately 10 mm between them.

[0206] Carrier roller-to-roller system: Figure 2a and Figure 2b The first backing roller 203 and the second backing roller 216 shown are part of a carrier roller-to-roll system for driving the carrier belt 204 through the slot die coating machine 100. The remaining components of the carrier roller-to-roll system are not shown in the diagram. Figure 2a or Figure 2b As shown, these are typical components of a roll-to-roll coating machine system and may include idler rollers, antistatic units, tension systems, mesh guides, height-adjustable roller units, and pressure zone circuit breakers.

[0207] Carrier tape used when using photocurable adhesive carrier tape. Figure 7The carrier tape 204 has a polyolefin-based web layer 224 and a photosensitive or UV-sensitive acrylic adhesive top layer 223 with a thickness ranging from 10 to 20 micrometers. The width of the carrier tape 204 is approximately 200 millimeters. The carrier tape 204 advances along the machine direction 212 at a web speed of 20 cm / min.

[0208] Carrier tape when using heat-sensitive adhesive carrier tape Figure 8 The carrier tape 204 has a polyolefin-based web layer 224 and a heat-sensitive acrylic-based adhesive top layer 223 with a thickness ranging from 10 micrometers to 20 micrometers. The width of the carrier tape 204 is approximately 200 millimeters. The carrier tape 204 advances along the machine direction 212 at a web speed of 20 cm / min.

[0209] The fluid used for coating: The fluid supplied to the slit-type die manifold ink reservoir 111a for discharge or coating on the top of the wafer is a perovskite solution.

[0210] Perovskite solution (1 mL) for slot die coating: Add 1 mmol formamidine iodide (FAI) (171.97 mg), 1 mmol lead iodide (PbI2) (461.01 mg), and 0.1 mmol methylammonium chloride (MACl) (6.75 mg) powder to a vial, and mix with 0.46 mL acetonitrile (ACN), 0.46 mL 2-mercaptoethanol (2-ME), and 0.08 mL N-methyl-2-pyrrolidone (NMP). Stir the solution at room temperature.

[0211] Slot-die coating of the perovskite layer: The perovskite solution or ink is supplied to a large reservoir connected to a continuous flow peristaltic pump or diaphragm pump system (not shown). This pump system allows continuous or intermittent flow into the slot-die 100. The coating speed is 20 cm / min, the pumping rate is 100 μL / min, and the distance 109 between the bottom side of the meniscus guide 102 and the front surface of the wafer 202 is 200 μm. The distance 225 between the bottom side of the meniscus guide and the top side of the carrier tape is 380 μm. The exhaust slot extends 18 cm and is centered relative to the carrier tape 204 and the sealing wafer 202.

[0212] Slit-die coating system: The slit-die coating system includes: a) an alignment support 209 in the form of a platform vacuum chuck, the alignment support 209 having a flat metal micro-hole insertion portion 209b for allowing the transfer of negative pressure laminar flow; b) an electrically driven high-precision gantry motion system (not shown) driven by an AC or DC servo motor (not shown), the servo motor being capable of achieving a step resolution of 1 micrometer. The motion system maintains a platform (not shown) on which the slit die head 100 is fixed and can be driven up and down on the platform until the desired distance is reached between it and the substrate or wafer 202 or carrier tape 204.

[0213] The alignment support 209, which is in the form of a platform vacuum chuck with a micro-hole insertion portion 209b, can achieve a laminar flow distribution with a variable negative pressure (between 2 bar and 6 bar), thereby ensuring maximum flatness of the carrier tape 204 and the substrate 202 during coating.

[0214] Photocuring using photocurable adhesive carrier tape Figure 7 After coating, the wafer 202, sealed on the top adhesive surface 223 of the carrier tape 204, advances towards the photocuring source 210. The irradiation area laterally covers the width of the carrier tape 204, and the irradiation intensity is at 100 mW / cm² in an equal-energy manner. 2 Up to 400mW / cm 2 The delivery rate between the two is irradiated onto the bottom side of the carrier tape 204. The spectral range of the light source 210 can be between 390 nm and 400 nm.

[0215] A protective light trap structure 211 on top of the light radiation source 210 when using a photocurable adhesive carrier tape. Figure 7 The high-absorption textured structure 211 can cover the exposure area from the top of the moving wafer 202 to prevent stray light radiation from damaging the wet film 208 or any functional layer of the wafer 202.

[0216] Heat sources 221 and 222 used for wafer-to-tape bonding and wafer-to-tape separation when using thermally sensitive adhesive carrier tape. Figure 8 The first heat source 221 and the second heat source 222 include platforms with variable temperature controls to ensure that the adhesive material is heated to 40 to 50 degrees Celsius. As the carrier tape 204 passes through the first and second heat sources, the bottom of the carrier tape can directly contact the heat sources 221 and 222 to achieve effective heat transfer.

[0217] Separation platform 215 and peeling angle 214: Figure 7 Irradiation or exposure Figure 8 The adhesive reduction factor after heat exposure is proportional to the contact angle or peel angle 214 at which the carrier tape 204 is pulled away from the planar wafer 202. The separation platform 215 can provide a variable peel angle 214 to ensure separation of the wafer from the tape at a specific carrier tape or mesh speed.

[0218] The hardware required to achieve sufficient motion resolution for the slit die 100 to reach the distance 225 between the carrier tape 204 and the bottom side of the meniscus guide 102 can be obtained using the AlphaSC system provided by FOM Technologies A / S. This slit die coating system includes a platform chuck 209 with a flat metal micro-orifice insertion portion 209b, enabling the transfer of laminar negative pressure; and an electrically driven high-precision gantry motion system powered by an AC or DC servo motor capable of 1-micron step resolution. The slit die coating system supports a platform on which the slit die 100 can be driven up and down until the desired distance is reached between it and the substrate or wafer 202 or carrier tape 204. Depending on the number of wafers 202 being coated simultaneously, the size of the slit die 100 can be the same as that of the FOM low-viscosity XL slit die, which allows for coating widths up to 20 cm. The FOM XL slit die can be delivered by FOM Technologies A / S.

[0219] For the light source 210 used to eliminate adhesion strength on the carrier tape 204 and promote wafer-to-tape separation, its light intensity should be sufficiently strong to achieve the light radiation dose and intensity required during carrier tape travel. For example, for applications requiring 200 mJ / cm²... 2 Only carrier tape 204, which can achieve adhesives with reduced bond strength and a coating speed of 15 mm / sec, can be used with a spectral range between 390 nm and 400 nm and provides 200 mW / cm². 2 The irradiation source should be at least 15 mm long and its width should be equal to or slightly larger than the width of the carrier tape 204 to effectively separate the wafer from the tape. For different types of wafers with different dimensions, bottom morphology, and chemical compositions, the architecture and composition of the adhesive tape may need to be customized. Therefore, different irradiation conditions may be required. The same applies when changing the coating speed. A series of 2 to 4 irradiation sources with adjustable intensity should provide sufficient functionality for various processing scenarios.

[0220] This invention has been described in conjunction with various embodiments. However, those skilled in the art, through studying the accompanying drawings, disclosure, and appended claims, can understand and implement other variations of the disclosed embodiments. In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite articles "a" or "an" do not exclude a plurality.

Claims

1. A method for applying fluid discharged from a slit-type die (100) to one or more substrates (202), the slit-type die (100) comprising a discharge slit (111b) and a meniscus guide (102) having a bottom extending below the discharge slit (111b), and the substrates (202) having a front surface, a back surface, an edge surface between the front surface and the back surface, a maximum width, a maximum length, and a thickness; wherein, The method includes: a) Provide an adhesive carrier tape (204) having an adhesive front surface and a non-adhesive back surface; b) Positioning one or more of the substrates (202) on the front surface of the carrier tape (204); c) Provide a substantially sealed connection between the back surface of one or more of the substrates (202) and the front surface of the carrier tape (204); d) Positioning a carrier tape (204) holding one or more of the substrates (202) adjacent to the slit die (100) to define a predetermined distance between the front surface of the carrier tape and the bottom edge of the bottom of the meniscus guide (102); and e) The carrier tape (204) together with one or more of the substrates (202) is advanced along the machine direction (212) through the discharge slit (111b) of the slit die (100) while the fluid is discharged from the discharge slit (111b) as a wet film layer (208a) on the front surface of one or more of the substrates (202).

2. The method according to claim 1, wherein, The distance between the front surface of the carrier tape and the bottom edge of the meniscus guide is greater than the thickness of one or more of the substrates (202).

3. The method according to claim 1 or 2, wherein, In step e), the fluid is discharged from the discharge slit (111b) to one or more of the substrates (202) to cover the entire front surface of one or more of the substrates and to cover the edge surface of one or more of the substrates.

4. The method according to any one of claims 1 to 3, wherein, Multiple individual substrates (202) are continuously positioned on the front surface of the adhesive carrier tape (204), wherein each substrate is spaced apart. The carrier tape (204), together with the substrate (202), advances continuously in the machine direction (212) for a period of time to allow the fluid to be discharged from the discharge slit (111b) as a wet film layer (208a) on the front surface of a plurality of consecutively positioned substrates (202).

5. The method according to any one of claims 1 to 4, wherein, An alignment support is provided to support the back surface of the carrier tape (204) during at least a portion of step e) to maintain a predetermined distance between the front surface of the carrier tape (204) and the bottom edge of the meniscus guide (102) as the fluid is discharged from the discharge slit (111b) onto one or more of the substrates (202).

6. The method according to claim 5, wherein, The alignment support is a vacuum chuck (209) that provides negative pressure between the vacuum chuck (209) and the carrier tape (204) to planarize one or more of the substrates (202) sealed to the carrier tape during the discharge of the fluid from the discharge slit (111b) onto one or more of the substrates (202).

7. The method according to any one of claims 1 to 6, wherein, The method further includes the step of eliminating the sealing connection between one or more of the substrates (202) and the adhesive carrier tape (204).

8. The method according to any one of claims 1 to 7, wherein, The adhesive carrier tape (204) is a photocurable tape, and wherein, after one or more of the substrates (202) have completely passed through the discharge slit (111b), light from the light radiation source (210) irradiates the back surface of the carrier tape (204) located below one or more of the substrates (202) on the front surface of the carrier tape (204), thereby inhibiting or eliminating the connection between one or more of the substrates (202) and the adhesive carrier tape (204).

9. The method according to any one of claims 1 to 7, wherein, The adhesive carrier tape (204) is a thermally sensitive tape, and step c) of providing a sealing connection between the back surface of one or more of the substrates (202) and the front surface of the carrier tape (204) includes a heating process utilizing a first heat source (221), in which heat is supplied to the back surface of the carrier tape (204) located below one or more of the substrates (202) on the front surface of the carrier tape (204), and Wherein, after one or more of the substrates (202) have completely passed through the discharge slit (111b), heat is supplied by a second heat source (222) to the back surface of the carrier tape (204) located below one or more of the substrates (202) on the front surface of the carrier tape (204), thereby eliminating the sealing connection between one or more of the substrates (202) and the adhesive carrier tape (204).

10. The method according to any one of claims 7 to 9, wherein, The method further includes the step of separating one or more of the substrates (202) from the adhesive carrier tape (204), and wherein after the step of eliminating the sealing connection between one or more of the substrates (202) and the adhesive carrier tape (204), the next step is to separate one or more of the substrates (202) from the adhesive carrier tape (204).

11. The method according to claim 10, wherein, A substrate-to-tape separation platform (215) and a second backing roller (216) are provided and arranged for separating one or more of the substrates (202) from the adhesive carrier tape (204), wherein the substrate-to-tape separation platform (215) and the second backing roller (216) are arranged to change the orientation of the adhesive carrier tape (204) by a peel angle (214) which is at least 90 degrees relative to the machine direction (212).

12. A system (200a, 200b) for applying fluid to one or more movable substrates (202), one or more said substrates having a front surface, a back surface, an edge surface between said front surface and said back surface, a maximum width, a maximum length, and a thickness; wherein, The system includes: A slit-type die head (100) includes an exhaust slit (111b) and a meniscus guide (102), the bottom of which extends below the exhaust slit (111b). An adhesive substrate carrier tape (204) having an adhesive front surface and a non-adhesive back surface, the carrier tape (204) holding one or more substrates (202) on the front surface of the carrier tape (204), and the carrier tape (204) being configured to provide a substantially sealed connection between the back surface of one or more of the substrates (202) and the front surface of the carrier tape (204); A roller system for advancing the carrier belt (204) holding one or more of the substrates (202) in the machine direction (212) through the discharge slit (111b) of the slit die head (100); and Alignment support for supporting the back surface of the carrier tape (204) to maintain a predetermined distance between the front surface of the carrier tape and the bottom edge of the meniscus guide (102), thereby maintaining a distance (109) between the front surface of one or more substrates (202) and the bottom edge of the meniscus guide (102) as the carrier tape (204) holding one or more substrates (202) is advanced in the machine direction (212) through the discharge slit (111b) of the slit die head (100).

13. The system (200a, 200b) according to claim 12, wherein, The distance between the front surface of the carrier tape and the bottom edge of the meniscus guide is greater than the thickness of one or more of the substrates.

14. The system (200a, 200b) according to claim 12 or 13, wherein, The discharge slit (111b) extends along the width of one or more of the substrates (202), and the extension range of the discharge slit (111b) is greater than the maximum width of one or more of the substrates, wherein the slit-type die (100) is configured to discharge the fluid from the discharge slit (111b) as a wet film layer (208a) on the front surface of one or more of the substrates (202) as the carrier belt (204) holding one or more of the substrates (202) advances along the machine direction (212) through the discharge slit (111b) of the slit-type die (100). The slit-type mold head (100) is configured to discharge the fluid from the discharge slit to one or more of the substrates (202) to cover the entire front surface of one or more of the substrates and to cover the edge surface of one or more of the substrates.

15. The system (200a, 200b) according to any one of claims 12 to 14, wherein, Multiple individual substrates (202) are continuously positioned on the front surface of the adhesive carrier tape (204), wherein each substrate is spaced apart, and The roller system is configured to allow the carrier belt (204) together with the substrate (202) to advance continuously along the machine direction (212) for a period of time, so as to allow the fluid to be discharged from the discharge slit (111b) as a wet film layer (208a) on the front surface of a plurality of sequentially positioned substrates (202).

16. The system (200a, 200b) according to any one of claims 12 to 15, wherein, The alignment support is a vacuum chuck (209) configured to provide negative pressure between the vacuum chuck (209) and the carrier tape (204) to flatten one or more of the substrates (202) sealed to the carrier tape (204) as they pass through the discharge slit (111b).

17. The system (200a, 200b) according to any one of claims 12 to 16, wherein, The system further includes an elimination system for eliminating the sealing connection between one or more of the substrates (202) and the adhesive carrier tape (204).

18. The system (200a, 200b) according to any one of claims 12 to 17, wherein, The adhesive carrier tape (204) is a photocurable tape, and wherein the elimination system includes a light source (210) arranged to supply light to the back surface of the carrier tape (204) located below one or more substrates (202) on the front surface of the carrier tape (204), and The light radiation source (210) is arranged downstream of the slit-type mold (100) and the alignment support relative to the machine direction (212).

19. The system (200a, 200b) according to any one of claims 12 to 17, wherein, The adhesive carrier tape (204) is a thermally sensitive tape, and the system further includes a first heat source (221) for supplying heat to the back surface of the carrier tape (204) located below one or more substrates (202) on the front surface of the carrier tape (204), and The first heat source (221) is arranged upstream of the slit-type mold head (100) and the alignment support relative to the machine direction (212).

20. The system (200a, 200b) according to claims 17 and 19, wherein, The elimination system includes a second heat source (222) arranged to supply heat to the back surface of the carrier tape (204) located below one or more substrates (202) on the front surface of the carrier tape (204), and The second heat source (222) is arranged downstream of the slit-type die head (100) and the alignment support relative to the machine direction (212).

21. The system (200a, 200b) according to any one of claims 12 to 20, wherein, The system further includes a separation system for separating one or more of the substrates (202) from the adhesive carrier tape (204). The separation system includes a substrate-belt separation platform (215) and a second backing roller (216), and The substrate-tape separation platform (215) and the second backing roller (216) are arranged to change the orientation of the adhesive carrier tape (204) by a peel angle (214), the peel angle (214) being at least 90 degrees relative to the machine direction (212).

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