Semiconductor cleaning device and method

Abstract

The invention provides a semiconductor cleaning device and method, and the device comprises a conveying belt which is used for conveying a semiconductor workpiece and is arranged on a conveying frame; the flushing mechanism outputs cleaning liquid, is used for flushing the semiconductor workpieces on the conveying belt and is arranged on the conveying frame, and the output end of the flushing mechanism is located above the conveying belt in the Z direction; and the cleaning mechanism is used for cleaning dust and impurities remaining on the conveying belt after the washing procedure, the cleaning mechanism is in sliding connection with the conveying frame and can ascend and descend in the Z direction, and the cleaning mechanism is located below the conveying belt in the Z direction. According to the invention, the semiconductor workpieces can be cleaned in batches, and the subsequent semiconductor workpieces are prevented from being polluted, so that the cleaning quality and efficiency are improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor, and particularly relates to a semiconductor cleaning device and method. BACKGROUND

[0002] In the semiconductor manufacturing process, cleaning is a crucial link. As the size of semiconductor devices becomes smaller and smaller, the requirements for the production environment become more and more stringent. Any tiny dust or chemical residue can cause the performance of the chip to decline or even fail. Therefore, the cleaning process not only needs to completely remove the pollutants generated during the processing, but also needs to ensure that no new impurities are introduced to avoid secondary pollution. Although flexible, it is low in efficiency, high in cost, and greatly affected by the skills of the operators, making it difficult to ensure consistency. Although it has been partially automated, it still has deficiencies in processing speed, cleaning effect and the ability to adapt to various workpiece types. For example, some devices may not be able to process multiple workpieces at the same time, or fail to effectively clean the conveyor belt after cleaning, resulting in subsequent workpieces being contaminated, so it is necessary to propose a solution to this technical problem. SUMMARY

[0003] The purpose of the present application is to provide a semiconductor cleaning device and method, which can realize batch cleaning of semiconductor workpieces and ensure that subsequent semiconductor workpieces are not contaminated, thereby improving the cleaning quality and efficiency. The technical scheme adopted is as follows: A semiconductor cleaning device, comprising: a conveyor belt 2 for conveying semiconductor workpieces, which is arranged on a conveying frame 1; a flushing mechanism for outputting cleaning liquid to perform a flushing process on the semiconductor workpieces on the conveyor belt 2, which is arranged on the conveying frame 1 and has its output end located above the conveyor belt 2 in the Z direction; and a cleaning mechanism for cleaning dust and impurities remaining on the conveyor belt 2 after the flushing process, which is slidably connected to the conveying frame 1 and can be lifted in the Z direction, and the cleaning mechanism is located below the conveyor belt 2 in the Z direction.

[0004] Preferably, the cleaning mechanism comprises: a cleaning brush 11 connected to the output end of a drive motor 10, the drive motor 10 being arranged in a cleaning box 9, and the output end of the drive motor 10 extending upward out of the cleaning box 9 in the Z direction; the cleaning box 9 being arranged on a cleaning plate 3; the cleaning plate 3 being slidably connected to the conveying frame 1 through a lifting column 4; the lifting column 4 being fixedly connected to the cleaning plate 3; and an extension mechanism 5 for driving the cleaning plate 3 to lift in the Z direction, which is arranged in the cleaning plate 3, and its output end successively passes through the lifting column 4, the lifting hole arranged on the conveying frame 1, and is fixed to the inner wall of the lifting groove arranged on the conveying frame 1 in the Z direction; The lifting hole is arranged on the lower end surface of the lifting groove along the Z direction. The lifting column 4 is movable in the lifting hole and the lifting groove.

[0005] Preferably, the upper end surface of the lifting column 4 along the X direction is a first limiting plate 18. The first limiting plate 18 is located in the lifting groove and is attached to the inner wall of the lifting groove along the X direction, which is used to prevent the lifting column 4 from escaping from the lifting hole. The first limiting plate 18 is provided with a mounting hole through which the output end of the telescopic mechanism 5 passes.

[0006] Preferably, the cleaning mechanism further comprises: A guide column 6 is arranged opposite to the lifting column 4 along the X direction, the lower end of which is fixedly connected to the cleaning plate 3 along the Z direction, and the upper end of which is adapted to the guide hole of the conveying frame 1 along the Z direction, and is movable in the guide hole and the guide groove; the guide groove is formed in the conveying frame 1; and the guide hole is arranged on the lower end surface of the guide groove along the Z direction.

[0007] Preferably, the cleaning mechanism further comprises: An iron plate 8 is used for adsorption by the electromagnet 7 after being powered on, and is fixed to the inner wall of the guide groove extending along the Y direction. The electromagnet 7 is fixed to the guide column 6 and is attached to the iron plate 8.

[0008] Preferably, the guide column 6 is provided with a second limiting plate along the Z direction, one end of which is attached to the guide groove and the other end of which is attached to the iron plate 8.

[0009] Preferably, the flushing mechanism comprises: A spray head 15 is used for outputting cleaning liquid and is arranged on the flushing plate 14, and the flushing plate 14 is arranged on the conveying frame 1 through the mounting column. A hose 16 is arranged corresponding to the spray head 15, one end of which is connected to the spray head and the other end of which is connected to the pipeline of the cleaning liquid device.

[0010] Preferably, the conveying belt 2 is provided with an empty groove for the outflow of cleaning liquid, and the empty groove is a through groove along the Z direction.

[0011] Preferably, further comprising a recycling mechanism located below the cleaning mechanism along the Z direction, which is fixed to the stand column of the conveying frame 1, and comprising a recycling plate 12. The upper end surface of the recycling plate 12 along the Z direction is provided with a collection groove penetrating through the recycling plate 12, and the lower part of the recycling plate 12 is provided with a recycling pipe 13, and the recycling pipe 13 is connected to the collection groove.

[0012] A semiconductor cleaning method based on the semiconductor cleaning device, comprising the following steps: Step 1, the rinsing mechanism rinses the semiconductor workpiece on the conveying belt 2; Step 2, the cleaning mechanism rises to contact the conveying belt 2; Step 3, the cleaning mechanism cleans the conveying belt 2.

[0013] Compared with the prior art, the advantages of the present application are: 1. The continuous transmission of semiconductor workpieces is realized by the conveying belt, the empty slot design on the conveying belt allows multiple workpieces to be placed at the same time, and the efficient discharge of cleaning liquid is facilitated, each workpiece can receive cleaning treatment at the same time, and the cleaning quantity per unit time is greatly improved, 2. The conveying belt is kept clean after each cleaning operation by the cleaning plate, drive motor and cleaning brush, etc., to avoid contamination of subsequent workpieces.

[0014] 3. The iron plate of the guide groove is attracted by the electromagnetic lock to ensure the fixing reliability of the cleaning plate during the cleaning work of the cleaning mechanism, which ensures the cleaning effect and prolongs the service life of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a structural schematic view of a semiconductor cleaning device; Figure 2 is another structural schematic view of a semiconductor cleaning device; Figure 3 is a front view and a half sectional view; Figure 4 is a left view and a half sectional view.

[0016] Among them, 1, conveying frame; 2, conveying belt; 3, cleaning plate; 4, lifting column; 5, telescopic mechanism; 6, guide column; 7, electromagnetic lock; 8, iron plate; 9, cleaning box; 10, drive motor; 11, cleaning brush; 12, recovery plate; 13, recovery pipe; 14, rinsing plate; 15, spray head; 16, hose; 17, sealing bearing; 18, first limiting plate, 19- second limiting plate. DETAILED DESCRIPTION

[0017] The semiconductor cleaning device and method of the present application will be described in more detail below in conjunction with the schematic view, which shows the preferred embodiment of the present application, it should be understood that those skilled in the art can modify the present application described herein while still achieving the advantageous effects of the present application. Therefore, the following description should be understood as extensive knowledge for those skilled in the art, and not as a limitation on the present application.

[0018] As Figures 1-4 A semiconductor cleaning device, comprising: a conveying belt 2, a rinsing mechanism, a cleaning mechanism and a recovery mechanism.

[0019] The transmission belt 2 is used for transmitting semiconductor workpieces and is arranged on the transmission frame 1; the transmission belt 2 is provided with air slots for flowing out cleaning liquid, and the air slots penetrate the transmission belt 2 along the Z direction. The air slots are two and symmetrically arranged.

[0020] The flushing mechanism is arranged on the transmission frame 1 and outputs cleaning liquid to perform a flushing process on the semiconductor workpieces on the transmission belt 2, and the output end of the flushing mechanism is located above the transmission belt 2 along the Z direction; The cleaning mechanism is used for cleaning dust and impurities remaining on the transmission belt 2 after the flushing process, is slidably connected with the transmission frame 1 and can be lifted along the Z direction, and the cleaning mechanism is located below the transmission belt 2 along the Z direction.

[0021] Specifically, the cleaning mechanism comprises: The cleaning brush 11 is connected with the output end of the driving motor 10, the driving motor 10 is arranged in the cleaning box 9, and the output end of the driving motor 10 extends out of the cleaning box 9 along the Z direction upward; and the cleaning box 9 is arranged on the cleaning plate 3. The cleaning box 9 is provided with a plurality of.

[0022] Further, the output shaft of the driving motor 10 is sleeved with a sealing bearing 17, and the sealing bearing 17 is clamped in the space surrounded by the cleaning box 9 and the telescopic mechanism 5. The sealing bearing 17 can improve the sealing performance between the cleaning box 9 and the output end of the driving motor 10.

[0023] In the embodiment, the mounting mode of the driving motor 10 and the cleaning box 9 is as follows: The first mounting slot and the second mounting slot are arranged on the cleaning plate 3. The first mounting slot is used for mounting the cleaning box 9, and the second mounting slot is used for mounting the telescopic mechanism 5.

[0024] The housing of the driving motor 10 is fixed or embedded in the cleaning box 9; The cleaning box 9 is fixed in the first mounting slot arranged on the cleaning plate 3 and extends out of the cleaning plate 3 along the Z direction upward.

[0025] The upper end surface of the first mounting slot along the Z direction is open to allow the cleaning box 9 to pass through.

[0026] The cleaning box 9 is provided with a wire hole for allowing the electric wire between the driving motor 10 and the control unit to pass through.

[0027] The cleaning plate 3 is slidably connected with the transmission frame 1 through the lifting column 4; the lifting column 4 is fixedly connected with the cleaning plate 3; The telescopic mechanism 5 is used for driving the cleaning plate 3 to lift along the Z direction, is arranged in the cleaning plate 3, and the output end of the telescopic mechanism 5 sequentially passes through the lifting hole arranged on the transmission frame 1 and the lifting groove arranged on the transmission frame 1 along the Z direction upward and is fixed to the inner wall of the lifting groove arranged on the transmission frame 1; The lifting hole is arranged on the lower end surface of the lifting groove along the Z direction; The lifting column 4 can move in the lifting hole and the lifting groove.

[0028] In the embodiment, the driving motor 10 is a servo motor, and the telescopic mechanism 5 is an electric telescopic rod.

[0029] The electric telescopic rod has the characteristic of high moving precision, thereby improving the lifting precision of the cleaning cloth. The servo motor has the characteristic of high rotating precision, thereby improving the rotating precision of the cleaning brush 11 and the cleaning effect on the conveying belt 2.

[0030] In the embodiment, the mounting mode of the telescopic mechanism 5 is as follows: The lifting column 4 has a hollow structure; A wire hole is formed on the lifting column 4 or the cleaning plate 3, and the wire hole is used for the electric wire between the telescopic mechanism 5 and the control unit.

[0031] The shell of the telescopic mechanism 5 is fixed or clamped in the second mounting groove formed on the cleaning plate 3 and extends into the lifting column 4. The second mounting groove is communicated with the lifting column 4.

[0032] The telescopic mechanism 5 is mounted into the second mounting groove along the Y direction through the transition groove on one side of the cleaning plate 3. Along the Y direction, the transition groove is communicated with the second mounting groove.

[0033] The telescopic mechanism 5 sequentially passes through the lifting hole formed on the conveying frame 1 and the lifting groove, and is fixed to the upper end surface of the lifting groove.

[0034] The upper end surface of the lifting column 4 along the X direction is a first limiting plate 18. The conveying frame 1 is formed by splicing or welding to form the lifting groove and the guide groove, so as to facilitate the installation of the first limiting plate 18, the second limiting plate 19 and the electromagnetic lock 7.

[0035] The first limiting plate 18 is located in the lifting groove and is attached to the inner wall of the lifting groove along the X direction, which is used to prevent the lifting column 4 from separating from the lifting hole. An installation hole is formed on the first limiting plate 18 for the output end of the telescopic mechanism 5 to pass through.

[0036] The guide column 6 is arranged opposite to the lifting column 4 along the X direction, and is fixedly connected to the cleaning plate 3 along the Z direction. The upper end along the Z direction is matched with the guide hole formed on the conveying frame 1, and can move in the guide hole and the guide groove. The guide groove is formed on the conveying frame 1, and the guide hole is formed on the lower end surface along the Z direction of the guide groove. The iron plate 8 is used for adsorption of the electromagnet 7 after being powered on, and is fixed to the inner wall of the guide groove along the Y direction. The electromagnetic lock 7 is fixed to the second limiting plate 19 of the guide column 6 and is attached to the iron plate 8. When the electromagnetic lock 7 is opened, the electromagnetic lock 7 is powered, and the electromagnetic lock 7 adsorbs the iron plate 8 of the guide groove, so that the cleaning plate 3 is firmly fixed in position.

[0037] The electromagnetic lock 7 is an electromagnet.

[0038] When the on-off switch is closed, the electromagnetic lock 7 is powered.

[0039] The second limiting plate 19 is fixed on the guide column 6, and one end of the second limiting plate 19 is attached to the guide groove along the X direction, and the other end is attached to the iron plate 8. Thus, the second limiting plate is used to assist in supporting the cleaning plate 3.

[0040] As shown in the drawings, the guide column 6 includes an inner and outer structure, and the guide column 6 as a whole can pass through the guide hole. Figure 4

[0041] In this embodiment, the conveying frame 1 includes: The first combined frame extends along the Y direction, and surrounds the lifting groove extending along the Y direction; The second combined frame extends along the Y direction, and surrounds the guide groove extending along the Y direction; and the wire hole is provided on the second combined frame for the wire between the electromagnetic lock 7 and the control unit to pass through.

[0042] During the operation of the telescopic mechanism 5, the electromagnetic lock 7 is powered off. When the telescopic mechanism 5 stops operating, the electromagnetic lock 7 is powered on to attract the iron plate 8.

[0043] The driving shaft is rotatably arranged between the first combined frame and the second combined frame, and one end of the driving shaft extends out of the first combined frame and is connected with the output end of the driving unit. The driving unit is fixed to the first combined frame and is connected with the control unit.

[0044] The driven shaft is rotatably arranged between the first combined frame and the second combined frame.

[0045] The driving shaft and the driven shaft are connected through the conveying belt 2.

[0046] The column unit is used to support the first combined frame and the second combined frame, and includes a plurality of columns.

[0047] The "rotatable connection" means that the shaft is clearance-fitted with the combined frame, or a bearing is arranged between the shaft and the combined frame.

[0048] The flushing mechanism includes: The spray head 15 is used to output the cleaning liquid, and is arranged on the flushing plate 14. The flushing plate 14 is arranged on the conveying frame 1 through the mounting column. The spray head 15 is provided with a plurality of spray heads.

[0049] The hose 16 is arranged corresponding to the spray head 15, one end of the hose 16 is connected with the spray head, and the other end of the hose 16 is connected with the pipeline of the cleaning liquid device.

[0050] In this embodiment, one end of the spray head 15 is fixed to the lower end surface of the flushing plate 14 and communicates with the hose 16, and the hose 16 passes through the flushing plate 14. ​

[0051] The cleaning liquid enters the spray head 15 through the hose 16, and then the spray head 15 sprays the cleaning liquid on the semiconductor workpiece on the conveying belt 2, so that the automatic rinsing of the semiconductor workpiece can be realized.

[0052] The recovery mechanism is located below the cleaning mechanism in the Z direction, and is fixed to the column of the conveying frame 1, and includes a recovery plate 12. The recovery plate 12 is provided with a collection groove penetrating the recovery plate 12 at the upper end surface in the Z direction, and the lower side of the recovery plate 12 is provided with a recovery pipe 13 communicating with the collection groove. The collection groove is a tapered groove.

[0053] The cleaning liquid falling on the conveying belt 2 and the cleaning plate 3 is collected through the collection groove of the recovery plate 12, and then recovered through the recovery pipe 13.

[0054] The working principle of the semiconductor cleaning device is as follows: 1. The rinsing mechanism rinses the semiconductor workpiece on the conveying belt 2.

[0055] The conveying belt 2 transports the semiconductor workpiece, and then connects the pipe of the cleaning liquid supply device through the use of the rinsing mechanism, and rinses the semiconductor workpiece on the conveying belt 2 through the rinsing mechanism.

[0056] The conveying belt 2 can be separated by the empty slot on the conveying belt 2, so that the cleaning liquid can flow out through the empty slot, and the conveying belt 2 separated by the empty slot can store multiple semiconductor workpieces and perform rinsing operation at the same time, so that the automatic self-cleaning operation of the semiconductor workpiece can be realized, and the dust and impurities on the semiconductor workpiece can be effectively removed.

[0057] When the semiconductor workpiece is transported to the output end of the conveying belt 2, it is manually taken off.

[0058] 2. The cleaning mechanism rises to contact the conveying belt 2.

[0059] By controlling the contraction of the output end of the telescopic mechanism 5 in the lifting column 4, the upper end of the lifting groove connected to the output end of the telescopic mechanism 5, the telescopic mechanism 5 can drive the lifting column 4 to move upward, and the lifting column 4 drives the cleaning plate 3 to move upward, so that the cleaning brush 11 on the output end of the driving motor 10 on the cleaning box 9 approaches and contacts the bottom end of the conveying belt 2; The cleaning plate 3 drives the guide column 6 to move upward, and the guide column 6 drives the electromagnetic lock 7 to move upward. By opening the electromagnetic lock 7, the electromagnetic lock 7 adsorbs the iron plate 8 of the guide groove, so that the cleaning plate 3 is firmly fixed in position.

[0060] 3. The cleaning mechanism cleans the conveying belt 2.

[0061] The driving motor 10 in the cleaning box 9 drives the cleaning brush 11 to rotate, which can clean the dust and impurities left on the conveying belt 2 after the semiconductor workpiece is taken off, ensure the cleanliness of the conveying belt 2, and prevent the secondary pollution of the semiconductor workpiece.

[0062] The iron plate 8 is adsorbed by the electromagnetic lock 7, which can ensure the fixing reliability of the cleaning plate 3 during the cleaning of the conveying belt 2 by the cleaning brush 11, and stably and reliably clean the conveying belt 2.

[0063] The above is only the preferred embodiment of the present application, and does not limit the present application in any way. Any person skilled in the art can make any equivalent replacement, modification or change of the technical solutions and technical contents disclosed in the present application without departing from the scope of the technical solutions of the present application, which still belongs to the protection scope of the present application.

Claims

1. A semiconductor cleaning device, characterized in that, include: Conveyor belt (2) is used to transport semiconductor workpieces and is set on conveyor frame (1). A rinsing mechanism that outputs cleaning liquid for rinsing semiconductor workpieces on conveyor belt (2) is located on conveyor frame (1) with its output end above conveyor belt (2) along the Z direction. A cleaning mechanism is provided for cleaning dust and impurities remaining on the conveyor belt (2) after the rinsing process. It is slidably connected to the conveyor frame (1) and can be raised and lowered along the Z direction. The cleaning mechanism is located below the conveyor belt (2) along the Z direction.

2. The semiconductor cleaning apparatus according to claim 1, characterized in that, The cleaning facility includes: A cleaning brush (11) is connected to the output end of a drive motor (10), which is located in a cleaning box (9) and its output end extends upward along the Z direction out of the cleaning box (9); the cleaning box (9) is located on a cleaning plate (3). The cleaning plate (3) is slidably connected to the conveyor frame (1) via the lifting column (4); the lifting column (4) is fixedly connected to the cleaning plate (3); And telescopic mechanism (5), used to drive the cleaning plate (3) to rise and fall along the Z direction. It is set inside the cleaning plate (3), and its output end passes through the lifting column (4) and the lifting hole opened on the conveyor frame (1) in sequence along the Z direction, and is fixed to the inner wall of the lifting groove on the conveyor frame (1). The lifting hole is located on the lower end face of the lifting groove along the Z direction; The lifting column (4) can move within the lifting hole and the lifting groove.

3. The semiconductor cleaning apparatus according to claim 2, characterized in that, The upper end face of the lifting column (4) along the X direction is the first limiting plate (18). The first limiting plate (18) is located in the lifting groove and is attached to the inner wall of the lifting groove along the X direction. It is used to prevent the lifting column (4) from disengaging from the lifting hole. The first limiting plate (18) has a mounting hole through which the output end of the telescopic mechanism (5) passes.

4. The semiconductor cleaning apparatus according to claim 2, characterized in that, The cleaning facility also includes: The guide column (6) is arranged opposite to the lifting column (4) along the X direction. Its lower end along the Z direction is fixedly connected to the cleaning plate (3). Its upper end along the Z direction is adapted to the guide hole opened on the conveyor frame (1). It can move in the guide hole and the guide groove. The guide groove is formed on the conveyor frame (1). The guide hole is opened on the lower end face of the guide groove along the Z direction.

5. The semiconductor cleaning apparatus according to claim 4, characterized in that, The cleaning facility also includes: Iron plate (8) is used for the electromagnet (7) after it is energized to attract the magnet. It is fixed to the inner wall of the guide groove that extends along the Y direction. The electromagnetic lock (7) is fixed to the guide post (6) and attached to the iron plate (8).

6. The semiconductor cleaning apparatus according to claim 5, characterized in that, The guide post (6) is provided with a second limiting plate (19) along the Z direction. One end of the second limiting plate is attached to the guide groove, and the other end is attached to the iron plate (8).

7. The semiconductor cleaning apparatus according to claim 1, characterized in that, The rinsing mechanism includes: A nozzle (15) for dispensing cleaning liquid is disposed on a rinsing plate (14), which is mounted on a conveyor frame (1) via a mounting column. A hose (16) is provided corresponding to the nozzle (15), with one end connected to the nozzle and the other end connected to the pipe of the cleaning liquid equipment.

8. The semiconductor cleaning apparatus according to claim 1, characterized in that, The conveyor belt (2) has an empty trough for the cleaning liquid to flow out, and the empty trough is a through trough along the Z direction.

9. The semiconductor cleaning apparatus according to claim 1, characterized in that, It further includes a recycling mechanism located below the cleaning mechanism along the Z direction, which is fixed to the column of the conveyor (1) and includes a recycling plate (12). The recycling plate (12) has a collection groove that runs through the upper surface along the Z direction, and a recycling pipe (13) is provided below the recycling plate (12), which is connected to the collection groove.

10. A semiconductor cleaning method, based on the semiconductor cleaning apparatus according to any one of claims 1 to 9, characterized in that, Includes the following steps: Step 1: The rinsing mechanism performs a rinsing process on the semiconductor workpieces on the conveyor belt (2); Step 2: The cleaning mechanism rises until it contacts the conveyor belt (2); Step 3: The cleaning unit cleans the conveyor belt (2).

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