A method for producing copper foil for IC packaging

Abstract

This invention relates to the field of electronic packaging materials technology, specifically a method for producing copper foil for IC packaging. The invention first performs surface treatment on electrolytic copper foil to introduce oxygen-containing functional groups, thereby activating the surface of the electrolytic copper foil and significantly enhancing its adhesion to the subsequent polydopamine-polypyrrole composite graft layer. Then, a polypyrrole conductive layer, a polydopamine-polypyrrole composite graft layer, and a nickel transition layer are sequentially prepared on the surface of the electrolytic copper foil. Finally, the secondary modified electrolytic copper foil undergoes electrodeposition and passivation treatment, thereby forming an organic-inorganic hybrid film on the copper layer surface. Through the above process, the produced IC packaging copper foil not only possesses advantages such as high adhesion, low roughness, and high conductivity, but also excellent corrosion resistance, wear resistance, and oxidation resistance, effectively ensuring its quality while extending its service life to a certain extent.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic packaging materials, in particular to a production method of copper foil for IC packaging. BACKGROUND

[0002] IC packaging is a key link in integrated circuit manufacturing, which protects the chip from the external environment, and realizes the electrical connection and mechanical support between the chip and the external circuit. Copper foil, as a commonly used conductive material in IC packaging, its performance directly affects the quality and reliability of IC packaging.

[0003] With the continuous development of IC technology, the performance requirements of copper foil are also getting higher and higher. On the one hand, copper foil needs to have high conductivity to reduce resistance loss in signal transmission process and improve signal transmission speed and efficiency. On the other hand, in order to ensure that copper foil and packaging material can form a good combination and ensure the stability of the packaging structure, copper foil needs to have high bonding force. In addition, in the use process of IC, copper foil may be affected by various environmental factors such as humidity, chemical corrosion, etc., so copper foil also needs to have excellent corrosion resistance, wear resistance and oxidation resistance to prolong the service life of IC.

[0004] However, the copper foil prepared by the traditional copper foil production method often cannot meet the strict requirements of IC packaging in terms of comprehensive performance. For example, the surface activity of ordinary electrolytic copper foil is low, and the bonding force with the packaging material is insufficient; in terms of electrical conductivity, although copper itself has good electrical conductivity, the electrical conductivity of copper foil after conventional treatment still needs to be further improved; and when facing complex use environment, the corrosion resistance, wear resistance and oxidation resistance of traditional copper foil are limited, and corrosion, wear and oxidation phenomena are easy to occur, thereby affecting the performance and reliability of IC packaging.

[0005] Based on this, the present application provides a production method of copper foil for IC packaging, aiming at solving the above-mentioned technical problems. SUMMARY

[0006] The copper foil for IC packaging produced by the present application not only has the advantages of high bonding force, low roughness and high electrical conductivity, but also has excellent corrosion resistance, wear resistance and oxidation resistance, effectively ensuring its quality and prolonging its service life to a certain extent.

[0007] To achieve the above-mentioned purpose, the present application provides the following technical scheme:

[0008] A production method of copper foil for IC packaging, comprising the following steps:

[0009] Step one, clean the electrolytic copper foil with purity of 99.95%, then use plasma to treat the surface of the cleaned electrolytic copper foil; after the treatment, use nitrogen to blow the surface of the electrolytic copper foil, and obtain the activated electrolytic copper foil;

[0010] Step two, immerse the activated electrolytic copper foil into the treatment solution at 20-30℃ under the protection of nitrogen, and stir at the speed of 100-300r / min for 15-30min; after the reaction, use the ethanol aqueous solution with volume concentration of 20-30% to perform four-stage countercurrent rinsing on the electrolytic copper foil, and then perform vacuum drying.

[0011] Step three, immerse the electrolytic copper foil treated in step two into the modified solution at 20-30℃, and oscillate at the speed of 50-100r / min for 3-6h in the normal temperature and light-proof environment; after the reaction, take out the electrolytic copper foil and sequentially perform deionized water rinsing and room temperature air drying, and obtain the primary modified electrolytic copper foil.

[0012] Step four, immerse the primary modified electrolytic copper foil into the nickel sulfate aqueous solution with concentration of 0.1-0.2mol / L and pH value of 4.5-5.5, and add EDTA with molar amount of 0.1-0.2 times of the nickel sulfate; stir at the speed of 100-200r / min for 10-15min in the constant temperature water bath at 25-35℃; after the reaction, take out the electrolytic copper foil and sequentially perform deionized water rinsing, ethanol dehydration and vacuum drying, and obtain the secondary modified electrolytic copper foil.

[0013] Step five, place the secondary modified electrolytic copper foil into the electroplating solution, and deposit a copper layer with thickness of 3-8μm in the constant temperature water bath at 25-30℃; then immerse the electrolytic copper foil with the deposited copper layer into the passivation solution, and perform passivation at the temperature of 35-45℃ for 60-90s; finally, perform gradient heat treatment under the protection of nitrogen.

[0014] Further, the cleaning method of the electrolytic copper foil is as follows: immerse the electrolytic copper foil into acetone, perform ultrasonic cleaning at the frequency of 40-50kHz for 10-15min, and then perform drying.

[0015] Further, the plasma is oxygen plasma, and the power during the surface treatment is 200-500W, and the treatment time is 3-10min.

[0016] Further, the preparation method of the treatment solution is as follows: add ammonium persulfate with molar amount of 1.2-1.5 times of the pyrrole monomer and sodium dodecyl benzene sulfonate with molar amount of 0.05-0.08 times of the pyrrole monomer into the pyrrole monomer aqueous solution with concentration of 0.2-0.4mol / L, and mix and stir uniformly.

[0017] Further, the preparation method of the modification liquid is as follows: dopamine is added into Tris buffer solution with pH value of 8.5-9 at a dosage of 1-3 g / L, and the mixture is stirred uniformly to obtain the modification liquid.

[0018] Further, the specific composition of the electroplating liquid is as follows: 80-120 g / L of copper sulfate, 120-160 g / L of sulfuric acid, 60-90 g / L of polyethyleneimine, 40-60 g / L of thiourea, 30-50 g / L of polyethylene glycol and 30-80 ppm of chloride ion.

[0019] Further, the forward pulse current density is 3-6 A / dm 2 , the duty cycle is 30-50%, the frequency is 200-400 Hz, the reverse pulse current density is 1-3 A / dm 2 , and the duty cycle is 10-20%.

[0020] Further, the preparation method of the passivation liquid is as follows: nano-titanium dioxide, silane coupling agent and sodium phytate are put into deionized water at dosages of 3-5 g / L, 4-6 g / L and 1-3 g / L respectively, the mixture is stirred uniformly, and then the pH value is adjusted to 4.5-5.5 by using citric acid.

[0021] Further, the silane coupling agent is any one of 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane and N-aminoethyl-γ-aminopropyltriethoxysilane.

[0022] Further, the specific process of the gradient heat treatment is as follows: first, heat preservation treatment is carried out at a temperature of 80-100 ℃ for 10-20 min, then heat preservation treatment is carried out at a temperature of 120-150 ℃ for 5-10 min, and finally heat preservation treatment is carried out at a temperature of 180-200 ℃ for 2-5 min.

[0023] Compared with the prior art, the present application has the following beneficial effects:

[0024] The present application adopts oxygen plasma to treat the cleaned electrolytic copper foil to introduce oxygen-containing functional groups, thereby completing the activation of the surface of the electrolytic copper foil and significantly enhancing the adhesion of the subsequent polydopamine-poly pyrrole composite grafting layer. The activated electrolytic copper foil is immersed in a treatment solution, and under the action of ammonium persulfate, pyrrole monomers are polymerized to deposit a layer of poly pyrrole conductive layer on the surface of the electrolytic copper foil, and sodium dodecyl benzene sulfonate can be embedded in the molecular chain of poly pyrrole, thereby further improving the conductivity of poly pyrrole. Then, the treated electrolytic copper foil is put into a modification solution, and dopamine molecules are self-oxidized and polymerized to form a polydopamine-poly pyrrole composite grafting layer under alkaline conditions. The ortho-phenol groups in the polydopamine can chemically react with the active groups on the surface of the electrolytic copper foil, and the amino groups provide abundant active sites, thereby endowing the composite grafting layer with extremely strong adhesion.

[0025] The primary modified electrolytic copper foil is immersed in a nickel sulfate aqueous solution and EDTA is added, wherein the EDTA can form a stable complex with nickel ions to control the release rate of the nickel ions, thereby realizing the uniform deposition of the nickel ions on the surface of the composite grafting layer. The amino groups in the polydopamine undergo chelation reaction with the nickel ions to deposit and form a dense nickel transition layer on the surface of the composite grafting layer.

[0026] The obtained secondary modified electrolytic copper foil is placed in an electroplating solution for electrodeposition. During the positive pulse, copper ions are reduced and deposited on the surface of the nickel transition layer. During the reverse pulse, part of the rough or irregular copper deposition layer is dissolved, thereby realizing the grain refinement and surface flattening of the copper layer. After the electrodeposition is completed, the electrolytic copper foil with the deposited copper layer is subjected to passivation treatment by using a chromium-free passivation solution, wherein the silane coupling agent can form an organic-inorganic hybrid film on the surface of the copper layer, and the nano titanium dioxide can enhance the corrosion resistance and wear resistance of the passivation film, thereby effectively preventing the oxidation of the copper layer.

[0027] In summary, the copper foil for IC packaging produced by the present application not only has the advantages of high adhesion, low roughness and high conductivity, but also has excellent corrosion resistance, wear resistance and oxidation resistance, thereby effectively ensuring the quality and prolonging the service life to a certain extent. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0029] Embodiment 1

[0030] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0031] A production method of copper foil for IC packaging, comprising the following steps:

[0032] Step one, clean the electrolytic copper foil with purity of 99.95%, and then use plasma to treat the surface of the cleaned electrolytic copper foil; after the treatment, blow the surface of the electrolytic copper foil with nitrogen to obtain the activated electrolytic copper foil;

[0033] The cleaning method of the electrolytic copper foil is: soak the electrolytic copper foil in acetone, ultrasonic cleaning for 15 min at a frequency of 40 kHz, and then dry;

[0034] The plasma is oxygen plasma, and the power during the surface treatment is 200 W, and the treatment time is 10 min;

[0035] Step two, immerse the activated electrolytic copper foil in a treatment solution at 20℃ under nitrogen protection, and stir at a speed of 100 r / min for 30 min; after the reaction is completed, rinse the electrolytic copper foil with a four-stage countercurrent ethanol aqueous solution with a volume concentration of 20%, and then vacuum dry; the preparation method of the treatment solution is: add ammonium persulfate with a molar amount of 1.2 times that of the pyrrole monomer and sodium dodecylbenzenesulfonate with a molar amount of 0.05 times that of the pyrrole monomer to a 0.2 mol / L pyrrole monomer aqueous solution, and mix and stir uniformly;

[0036] Step three, immerse the electrolytic copper foil treated in step two in a modified solution at 20℃ in a constant temperature water bath at room temperature and in the dark, and oscillate at a speed of 50 r / min for 6 h; after the reaction is completed, take out the electrolytic copper foil and sequentially wash with deionized water and air dry at room temperature to obtain the primary modified electrolytic copper foil; the preparation method of the modified solution is: add dopamine to a Tris buffer solution with a pH value of 8.5 at a dosage of 1 g / L, and mix and stir uniformly to obtain the modified solution;

[0037] Step four, immerse the primary modified electrolytic copper foil in a 0.1 mol / L nickel sulfate aqueous solution with a pH value of 4.5 and add EDTA with a molar amount of 0.1 times that of the nickel sulfate; stir at a speed of 100 r / min in a constant temperature water bath at 25℃ for 15 min; after the reaction is completed, take out the electrolytic copper foil and sequentially wash with deionized water, dehydrate with ethanol, and vacuum dry to obtain the secondary modified electrolytic copper foil;

[0038] Step five, place the secondary modified electrolytic copper foil in an electroplating solution, and electrodeposited a copper layer with a thickness of 3 μm in a constant temperature water bath at 25℃; then immerse the electrolytic copper foil with the deposited copper layer in a passivation solution, and passivate at a temperature of 35℃ for 60-90 s; finally, perform gradient heat treatment under the protection of nitrogen;

[0039] The specific composition of the electroplating solution is: 80 g / L of copper sulfate, 120 g / L of sulfuric acid, 60 g / L of polyethylene imine, 40 g / L of thiourea, 30 g / L of polyethylene glycol, and 30 ppm of chloride ions;

[0040] The forward pulse current density during electrodeposition is 3 A / dm 2 , the duty cycle is 30%, the frequency is 200 Hz, and the reverse pulse current density is 1 A / dm 2 , the duty cycle is 10%;

[0041] The preparation method of the passivation solution is: nano-titanium dioxide, 3-aminopropyltrimethoxysilane, and sodium phytate are put into deionized water in a dosage ratio of 3 g / L, 4 g / L, and 1 g / L, and then mixed and stirred uniformly, and then the pH is adjusted to 4.5 with citric acid;

[0042] The specific process of gradient heat treatment is: first, heat treatment at 80℃ for 20min, then heat treatment at 120℃ for 10min, and finally heat treatment at 180℃ for 5min.

[0043] Example 2

[0044] A production method of a copper foil for IC packaging comprises the following steps:

[0045] Step one, clean the electrolytic copper foil with a purity of 99.95%, and then use plasma to treat the surface of the cleaned electrolytic copper foil; after the treatment, blow the surface of the electrolytic copper foil with nitrogen to obtain an activated electrolytic copper foil;

[0046] The cleaning method of the electrolytic copper foil is: soak the electrolytic copper foil in acetone, ultrasonic clean for 15min at a frequency of 45kHz, and then dry;

[0047] The plasma is oxygen plasma, and the power during surface treatment is 400W, and the treatment time is 6min;

[0048] Step two, immerse the activated electrolytic copper foil in a treatment solution at 25℃ under nitrogen protection, and stir at a speed of 200r / min for 20min; after the reaction is completed, perform four-stage counter-current rinsing of the electrolytic copper foil with a 25% ethanol aqueous solution, and then perform vacuum drying; the preparation method of the treatment solution is: add ammonium persulfate with a molar amount of 1.4 times that of the pyrrole monomer, and 0.06 times that of sodium dodecylbenzenesulfonate, to a 0.3mol / L pyrrole monomer aqueous solution, and mix and stir uniformly;

[0049] Step 3: Immerse the electrolytic copper foil treated in Step 2 into the modification solution at 25°C, and react with shaking at a rate of 80 r / min for 5 hours under normal temperature and light-proof environment. After the reaction is completed, remove the electrolytic copper foil and rinse it with deionized water and air dry it at room temperature to obtain the first modified electrolytic copper foil. The modification solution is prepared by adding dopamine to a Tris buffer solution with a pH of 8.8 at a dosage ratio of 2 g / L, and mixing and stirring evenly to obtain the modification solution.

[0050] Step 4: Immerse the first modified electrolytic copper foil in a 0.2 mol / L nickel sulfate aqueous solution with a pH of 5 and add EDTA with a molar amount of 0.2 times that of nickel sulfate; stir the reaction at a rate of 150 r / min in a constant temperature water bath at 30℃ for 15 min; after the reaction is complete, remove the electrolytic copper foil and rinse it with deionized water, dehydrate it with ethanol and vacuum dry it in sequence to obtain the second modified electrolytic copper foil;

[0051] Step 5: Place the modified electrolytic copper foil in the electroplating solution and electrodeposit a 5μm thick copper layer in a constant temperature water bath at 30℃; then immerse the electrolytic copper foil with the deposited copper layer in the passivation solution and passivate it at 40℃ for 70s; finally, perform gradient heat treatment under nitrogen protection.

[0052] The specific composition of the electroplating solution is: 100g / L copper sulfate, 150g / L sulfuric acid, 80g / L polyethyleneimine, 50g / L thiourea, 40g / L polyethylene glycol and 50ppm chloride ions;

[0053] The forward pulse current density during electrodeposition is 4 A / dm. 2 The duty cycle is 40%, the frequency is 300Hz, and the reverse pulse current density is 2A / dm². 2 Duty cycle 15%;

[0054] The passivation solution is prepared by adding nano-titanium dioxide, 3-aminopropyltriethoxysilane and sodium phytate into deionized water at dosage ratios of 4 g / L, 5 g / L and 2 g / L, mixing and stirring evenly, and then adjusting the pH to 5 with citric acid.

[0055] The specific steps of gradient heat treatment are as follows: first, hold at 90℃ for 15 minutes, then hold at 140℃ for 8 minutes, and finally hold at 200℃ for 5 minutes.

[0056] Example 3

[0057] A method for producing copper foil for IC packaging includes the following steps:

[0058] Step 1: Clean the electrolytic copper foil with a purity of 99.95%, and then use plasma to perform surface treatment on the cleaned electrolytic copper foil; after the treatment is completed, purge the surface of the electrolytic copper foil with nitrogen gas to obtain activated electrolytic copper foil.

[0059] The cleaning method for electrolytic copper foil is as follows: immerse the electrolytic copper foil in acetone, ultrasonically clean it at a frequency of 50kHz for 10 minutes, and then dry it.

[0060] The plasma used is oxygen plasma, and the power during surface treatment is 500W, with a treatment time of 3 minutes.

[0061] Step 2: Under nitrogen protection, immerse the activated electrolytic copper foil in a treatment solution at 30°C and stir at a rate of 100-300 r / min for 30 min. After the reaction is complete, rinse the electrolytic copper foil with a 30% (v / v) ethanol aqueous solution using a four-stage countercurrent rinsing process, and then vacuum dry it. The treatment solution is prepared by adding ammonium persulfate (1.5 times the molar amount of pyrrole monomer) and sodium dodecylbenzenesulfonate (0.08 times the molar amount of sodium dodecylbenzenesulfonate) to a 0.4 mol / L pyrrole monomer aqueous solution, and mixing thoroughly.

[0062] Step 3: Immerse the electrolytic copper foil treated in Step 2 into a modification solution at 30°C, and react with shaking at a rate of 100 r / min for 6 hours under normal temperature and light-proof conditions. After the reaction is complete, remove the electrolytic copper foil and rinse it with deionized water and air dry it at room temperature to obtain the first modified electrolytic copper foil. The modification solution is prepared by adding dopamine to a Tris buffer solution with a pH of 9 at a dosage ratio of 3 g / L, and mixing and stirring evenly to obtain the modification solution.

[0063] Step 4: Immerse the first-modified electrolytic copper foil in a 0.2 mol / L nickel sulfate aqueous solution with a pH of 5.5 and add EDTA with a molar amount of 0.2 times that of nickel sulfate; stir the reaction in a constant temperature water bath at 35°C at a rate of 200 r / min for 10 min; after the reaction is complete, remove the electrolytic copper foil and rinse it with deionized water, dehydrate it with ethanol and vacuum dry it in sequence to obtain the second-modified electrolytic copper foil;

[0064] Step 5: Place the modified electrolytic copper foil in the electroplating solution and electrodeposit an 8μm thick copper layer in a constant temperature water bath at 30℃; then immerse the electrolytic copper foil with the deposited copper layer in the passivation solution and passivate it at 45℃ for 60s; finally, perform gradient heat treatment under nitrogen protection.

[0065] The specific composition of the electroplating solution is: 120 g / L copper sulfate, 160 g / L sulfuric acid, 90 g / L polyethyleneimine, 60 g / L thiourea, 50 g / L polyethylene glycol and 80 ppm chloride ions.

[0066] The forward pulse current density during electrodeposition is 6 A / dm. 2 The duty cycle is 50%, the frequency is 400Hz, and the reverse pulse current density is 3A / dm³. 2 Duty cycle 20%;

[0067] The passivation solution is prepared by adding nano-titanium dioxide, N-aminoethyl-γ-aminopropyltriethoxysilane and sodium phytate into deionized water at dosage ratios of 5 g / L, 6 g / L and 3 g / L, mixing and stirring evenly, and then adjusting the pH to 5.5 with citric acid.

[0068] The specific steps of gradient heat treatment are as follows: first, hold at 100℃ for 10 minutes, then hold at 150℃ for 5 minutes, and finally hold at 200℃ for 2 minutes.

[0069] Performance testing:

[0070] The relevant performance of the IC packaging copper foil samples produced in Examples 1-3 were tested as follows:

[0071] 1. Bonding strength test: The test was conducted using the ASTM D3359 (cross-cut test) standard.

[0072] 2. Surface roughness (Ra): Tested according to ISO 4287 (stylus profilometer) standard.

[0073] 3. Conductivity: Tested using the four-probe method.

[0074] 4. Corrosion resistance: Tested according to the neutral salt spray test (GB / T 10125-2012) standard.

[0075] 5. Wear resistance: Tested using the Taber wear test (CS-10 wheel, 1kg load) standard.

[0076] 6. Antioxidant performance: The sample to be tested was accelerated to oxidation in an oven at 150℃ for 2 hours and then weighed, and the oxidation weight gain rate was calculated; where, oxidation weight gain rate = (mass of copper foil after oxidation - mass of copper foil before oxidation) / mass of copper foil before oxidation × 100%.

[0077] The test results obtained above are recorded in the table below:

[0078]

[0079]

[0080] By comparing and analyzing the relevant data in the table, it can be seen that the copper foil for IC packaging produced by this invention not only has the advantages of high bonding strength, low roughness, and high conductivity, but also excellent corrosion resistance, wear resistance, and oxidation resistance, effectively ensuring its quality while extending its service life to a certain extent. This indicates that the flexible cable sheath material and its preparation method provided by this invention have a broader market prospect and are more suitable for widespread application.

[0081] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0082] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A method for producing a copper foil for IC packaging, characterized by, It comprises the following steps: Step one, clean the electrolytic copper foil with purity of 99.95%, then use plasma to treat the surface of the cleaned electrolytic copper foil; After the treatment, use nitrogen to blow the surface of the electrolytic copper foil to obtain the activated electrolytic copper foil; Step two, immerse the activated electrolytic copper foil in a treatment solution at 20-30℃ under nitrogen protection, and stir at a speed of 100-300 r / min for 15-30 min; after the reaction, rinse the electrolytic copper foil with four-stage countercurrent ethanol solution with a volume concentration of 20-30%, and then vacuum dry; Step three, immerse the electrolytic copper foil treated in step two in a modification solution at 20-30℃, and oscillate at a speed of 50-100 r / min for 3-6 h in a normal temperature and light-proof environment; after the reaction, take out the electrolytic copper foil and sequentially wash with deionized water and air dry at room temperature to obtain the primary modified electrolytic copper foil; Step four, immerse the primary modified electrolytic copper foil in a nickel sulfate aqueous solution with a concentration of 0.1-0.2 mol / L and a pH value of 4.5-5.5, and add EDTA with a molar amount of 0.1-0.2 times of the nickel sulfate; stir at a speed of 100-200 r / min for 10-15 min in a constant temperature water bath at 25-35℃; after the reaction, take out the electrolytic copper foil and sequentially wash with deionized water, dehydrate with ethanol and vacuum dry to obtain the secondary modified electrolytic copper foil; Step five, place the secondary modified electrolytic copper foil in an electroplating solution, and deposit a copper layer with a thickness of 3-8 μm in a constant temperature water bath at 25-30℃; then immerse the electrolytic copper foil with the deposited copper layer in a passivation solution, and passivate at a temperature of 35-45℃ for 60-90 s; finally, perform gradient heat treatment under the protection of nitrogen; The plasma is oxygen plasma, and the power during the surface treatment is 200-500 W, and the treatment time is 3-10 min; The preparation method of the treatment solution is as follows: add ammonium persulfate with a molar amount of 1.2-1.5 times of the pyrrole monomer and sodium dodecyl benzene sulfonate with a molar amount of 0.05-0.08 times of the pyrrole monomer into a pyrrole monomer aqueous solution with a concentration of 0.2-0.4 mol / L, and mix and stir uniformly; The preparation method of the modification solution is as follows: add dopamine into a Tris buffer solution with a pH value of 8.5-9 at a dosage of 1-3 g / L, and mix and stir uniformly to obtain the modification solution; The specific composition of the electroplating solution is as follows: 80-120 g / L of copper sulfate, 120-160 g / L of sulfuric acid, 60-90 g / L of polyethylene imine, 40-60 g / L of thiourea, 30-50 g / L of polyethylene glycol, and 30-80 ppm of chloride ion; The preparation method of the passivation solution is as follows: add nano titanium dioxide, silane coupling agent and sodium phytate into deionized water at a dosage ratio of 3-5 g / L, 4-6 g / L and 1-3 g / L, mix and stir uniformly, and then adjust the pH value to 4.5-5.5 with citric acid.

2. The method of producing a copper foil for IC packaging according to claim 1, wherein The cleaning method of the electrolytic copper foil is as follows: immerse the electrolytic copper foil in acetone, ultrasonically clean at a frequency of 40-50 kHz for 10-15 min, and then dry.

3. The method of producing a copper foil for IC packaging according to claim 1, wherein: The forward pulse current density is 3-6 A / dm2, the duty cycle is 30-50%, the frequency is 200-400 Hz, the reverse pulse current density is 1-3 A / dm2, and the duty cycle is 10-20%.

4. The method of producing a copper foil for IC packaging according to claim 1, wherein The silane coupling agent is selected from any one of 3-aminopropyl trimethoxysilane, 3-aminopropyl triethoxysilane and N-aminoethyl-gamma-aminopropyl triethoxysilane.

5. The method of producing a copper foil for IC packaging according to claim 1, wherein The specific process of the gradient heat treatment is: first, heat preservation treatment at 80-100 DEG C for 10-20 min, then heat preservation treatment at 120-150 DEG C for 5-10 min, and finally heat preservation treatment at 180-200 DEG C for 2-5 min.

Images