Lift pin actuator, actuator device, semiconductor processing system and manufacturing method

Abstract

A lift pin actuator includes an actuator body having a hub portion, first and second arm portions, and a pad portion. The actuator body is arranged along an axis of rotation, the hub portion extends around the axis of rotation, and the arm portions extend outwardly from the hub portion in a direction opposite the axis of rotation and parallel to each other. A pad portion is radially separated from the hub portion by the arm portions, the pad portion coupling the first arm portion to the second arm portion, and the pad portion having an engagement surface orthogonal to the rotational axis and coplanar with the arm portions to drive the lift pin over the engagement surface along the rotational axis. Chamber devices and semiconductor processing systems having lift pin actuators are also described, as are related methods of manufacturing lift pin actuators and actuator devices.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to U.S. Provisional Patent Application Serial No. 63 / 641,312, filed May 1, 2024, entitled LIFT PIN ACTUATORS, ACTUATOR ARRANGEMENTS AND SEMICONDUCTOR PROCESSING SYSTEMS HAVING LIFT PIN ACTUATORS, AND METHDOS OF MAKING LIFT PIN ACTUATORS AND ACTUATOR ARRANGEMENTS, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] This disclosure relates generally to material processing, and more specifically to substrate processing, such as semiconductor processing systems for depositing material layers onto and / or removing material from a substrate. Background Technology

[0004] Mechanical systems typically employ actuators, such as mechanical actuators, to displace and / or move actuated components. Mechanical actuators generally perform movement by converting one type of motion (e.g., rotational motion) into another (e.g., linear motion). The operation of such mechanical actuators is usually based on the characteristics of the components incorporated into the mechanical system to achieve actuation. The characteristics of the components included in the mechanical system can be selected based on various requirements of the actuated components, such as the materials of the various components forming the mechanical system and the mechanical tolerances and tolerance superpositions of the components within the mechanical system. In some mechanical systems, mechanical tolerances and / or tolerance superpositions may require the actuator components within the actuator assembly to be larger than desired.

[0005] Such systems and methods are generally acceptable for their intended purpose. However, there is still a need for improved lifting pin actuators, actuator devices including lifting pin actuators, semiconductor processing systems, and methods for manufacturing lifting pin actuators and actuator devices. This disclosure provides a solution to this need. Summary of the Invention

[0006] A lifting pin actuator is provided. The lifting pin actuator includes an actuator body arranged along a rotation axis, having: a hub portion extending about the rotation axis; a first arm portion and a second arm portion extending outward from the hub portion and in a direction opposite to the rotation axis, the second arm portion being parallel to the first arm portion; a pad portion radially separated from the hub portion by the first arm portion and the second arm portion, the pad portion connecting the first arm portion to the second arm portion; wherein the pad portion has a mating surface orthogonal to the rotation axis and coplanar with the first arm portion and the second arm portion of the actuator body, for driving a lifting pin above the mating surface of the pad portion of the actuator body along the rotation axis.

[0007] In addition to one or more of the features described above, or as an alternative, another example of a lifting pin actuator may include: a pad portion being one of three (3) pad portions circumferentially distributed around the hub portion of the actuator body.

[0008] In addition to one or more of the features described above, or as an alternative, another example of a lifting pin actuator may include: a first arm portion and a second arm portion forming a first arm pair of actuator bodies, wherein the actuator body has three (3) arm pairs circumferentially distributed around a hub portion of the actuator body.

[0009] In addition to one or more of the features described above, or as an alternative, other examples of lifting pin actuators may include: the actuator body is formed of a ceramic material, and wherein the actuator body is integrally formed from a single ceramic workpiece using a subtractive manufacturing technique.

[0010] In addition to one or more of the features described above, or as an alternative, another example of a lifting pin actuator may include: a hub portion of the actuator having an upper surface that defines an upper surface bore therein, a lower surface that defines a mounting bore therein, and an inner surface that connects the upper surface bore to the mounting bore.

[0011] In addition to one or more of the features described above, or as an alternative, other examples of a lifting pin actuator may include: the inner surface of the hub portion defining a plurality of flat surfaces circumferentially distributed around the axis of rotation.

[0012] In addition to one or more of the features described above, or as an alternative, other examples of a lifting pin actuator may include: a plurality of flat surfaces at an angle relative to at least one of the upper and lower surfaces, between about 5 degrees and about 45 degrees, or between about 5 degrees and about 30 degrees, or between about 5 degrees and about 15 degrees, or even between about 5 degrees and about 10 degrees.

[0013] In addition to one or more of the features described above, or as an alternative, another example of a lifting pin actuator may include: the inner surface of the hub portion defining a plurality of arcuate surfaces circumferentially distributed around the axis of rotation. The plurality of arcuate surfaces are substantially parallel to the axis of rotation.

[0014] In addition to one or more of the features described above, or alternatively, another example of a lifting pin actuator may include: one or more of a plurality of flat surfaces defined by an arcuate periphery having a base near a lower surface of the hub portion and an open end near an upper bore of the hub portion. One or more of the plurality of flat surfaces define a release channel therein extending from the open end to a position midway between the open end and the base of the arcuate periphery.

[0015] In addition to one or more of the features described above, or as an alternative, another example of a lifting pin actuator may include: a hub portion of the actuator body having an annular segment and a plurality of toothed segments. The plurality of toothed segments may extend axially from the annular segment of the actuator body. The plurality of toothed segments may axially separate the first arm portion and the second arm portion from the annular segment of the hub portion of the actuator body.

[0016] In addition to one or more of the features described above, or as an alternative, the actuator body may be formed of a ceramic material (e.g., composed of or substantially composed of it). The ceramic material may be fused silica, quartz, or sapphire.

[0017] An actuator device is provided. The actuator device includes an actuator tube member arranged along a rotation axis and a lifting pin actuator as described above disposed on the actuator tube member. The actuator tube member has an outer surface that defines a plurality of flat facets distributed circumferentially around the rotation axis. The lifting pin actuator has an inner surface that has a plurality of flat facets distributed circumferentially around the rotation axis. Each of the plurality of flat facets defined by the inner surface of the actuator member abuts a corresponding one of the plurality of flat facets defined by the outer surface of the actuator tube member, such that the pin actuator is constrained to the actuator tube member.

[0018] In addition to one or more of the features described above, or as an alternative, other examples of actuator devices may include: the outer surface of the actuator tube member defining three (3) flat facets. The inner surface of the lifting pin actuator may define three (3) flat facets. Each of the flat facets defined by the inner surface of the hub portion of the actuator body may radially overlap with a corresponding one of the plurality of flat facets defined by the outer surface of the actuator tube member.

[0019] In addition to one or more of the features described above, or as an alternative, other examples of actuator devices may include: a plurality of flat facets angled relative to the axis of rotation at a facet angle. The facet angle may be between about 5 degrees and about 45 degrees, or between about 5 degrees and about 30 degrees, or between about 5 degrees and about 15 degrees, or even between about 5 degrees and about 10 degrees. The multiple flat facets may be angled relative to the axis of rotation at a facet angle substantially equal to the facet angle.

[0020] In addition to one or more of the features described above, or as an alternative, other examples of actuator devices may include: an outer surface of the actuator tube member defining a plurality of arcuate facets, an inner surface of the lifting pin actuator defining a plurality of arcuate faces, and each of the plurality of arcuate faces radially overlapping a corresponding one of the plurality of arcuate facets.

[0021] In addition to one or more of the features described above, or as an alternative, another example of an actuator device may include: a plurality of arcuate surfaces defined by the inner surface of the lifting pin actuator being radially offset from a corresponding one of a plurality of arcuate facets defined by the outer surface of the actuator tube member.

[0022] In addition to one or more of the features described above, or as an alternative, other examples of actuator devices may include: the outer surface of the actuator tube member defining three (3) arcuate facets circumferentially distributed around the axis of rotation, and the inner surface of the lifting pin actuator defining three (3) arcuate facets circumferentially distributed around the axis of rotation.

[0023] In addition to one or more of the features described above, or as an alternative, other examples of actuator devices may include: a shaft member disposed within the actuator tube member and supported for rotation about a rotation axis. Multiple flat facets and multiple flat surfaces may radially overlap with the shaft member.

[0024] In addition to one or more of the features described above, or as an alternative, the actuator tube component may be formed of a ceramic material (e.g., composed of or substantially composed of it). The ceramic material may be fused silica, quartz, or sapphire.

[0025] In addition to one or more of the features mentioned above, or as an alternative, the lifting pin actuator may be positioned on the actuator tube member according to the 3-2-1 positioning method and clamped onto the actuator tube member by gravity.

[0026] A semiconductor processing system is provided. The semiconductor processing system includes a chamber body and a lift-pin actuator as described above, disposed within the chamber body. An actuator tube member extends through a lower wall of the chamber body, the lift-pin actuator is mounted on the actuator tube member, and a shaft member is disposed within the actuator tube member and supported for rotation about a rotation axis. A substrate support is mounted on the shaft member, and a plurality of lift pins are slidably received within the substrate support. The lift-pin actuator is axially arranged between the lower wall of the chamber body and the plurality of lift pins to place a substrate on and remove it from the substrate support by translating the lift-pin actuator along the rotation axis.

[0027] A method for manufacturing a lifting pin actuator is provided. The method includes: forming a lifting pin actuator body from a single workpiece body made of ceramic material using boring or drilling operations and milling operations by: defining a hub portion extending about a rotation axis; defining a first arm portion and a second arm portion extending outward from the hub portion and in a direction opposite to the rotation axis, the second arm portion being parallel to the first arm portion; defining a pad portion radially separated from the hub portion by the first arm portion and the second arm portion, which connects the first arm portion to the second arm portion; and defining a mating surface of the pad portion, which is orthogonal to the rotation axis and coplanar with the first arm portion and the second arm portion of the actuator body, whereby the mating surface is configured to drive a lifting pin above the mating surface of the pad portion of the actuator body along the rotation axis.

[0028] A method for manufacturing an actuator device is provided. The method includes: positioning an actuator body relative to an actuator tube member at three contact points, the three contact points being located on the actuator tube member and in a first plane orthogonal to a rotation axis, the three contact points being distributed around the rotation axis; positioning the actuator body relative to the actuator tube member at fourth and fifth contact points, the fourth and fifth contact points being located on the actuator tube member and in a second plane parallel to the rotation axis and orthogonal to the first plane; positioning the actuator body relative to the actuator tube member at a sixth contact point, the sixth contact point being located on the actuator tube member and in a third plane parallel to the rotation axis and orthogonal to both the first and second planes; and clamping the actuator body to the actuator tube member using gravity, thereby constraining the translation and rotation of the lifting pin actuator relative to the actuator tube member within the first, second, and third planes.

[0029] This summary is provided to present the chosen concepts in a simplified form. These concepts are further described in detail in the following exemplary embodiments of this disclosure. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter. Attached Figure Description

[0030] These and other features, aspects, and advantages of the invention disclosed herein are described below with reference to the accompanying drawings of certain embodiments, which are intended to illustrate rather than limit the invention.

[0031] Figure 1 The schematic diagram of the lifting pin actuator according to the present disclosure shows a lifting pin actuator and actuator tube component arranged in a chamber device of a semiconductor processing system.

[0032] Figure 2 It is based on the example of this disclosure. Figure 1 A schematic diagram of a portion of a semiconductor processing system shows a processing fluid source connected to a chamber device to provide processing fluid to the chamber device;

[0033] Figure 3 It is based on the example of this disclosure. Figure 1 A schematic diagram of a portion of a semiconductor processing system shows a chamber assembly including a lifting pin actuator and an actuator tube assembly on which the lifting pin actuator is mounted.

[0034] Figures 4 to 7 It is based on the example of this disclosure. Figure 1 A schematic side view of the chamber device shows, in sequence, the lifting pin actuator placing the substrate in the chamber device, processing the substrate, and removing the substrate after processing.

[0035] Figure 8 According to this disclosure, it includes a lifting pin actuator. Figure 1 A side view of a portion of the chamber assembly shows a lifting pin actuator mounted on an actuator tube member, and a shaft member mounting a support member extending through the lifting pin actuator and the actuator tube member.

[0036] Figure 9 According to this disclosure, it includes a lifting pin actuator. Figure 1 An exploded view of a portion of the chamber assembly shows the lifting pin actuator and shaft assembly, as well as the support assembly disassembled away from the actuator tube assembly;

[0037] Figures 10 to 12 It is based on the example of this disclosure. Figure 1 A view of the lifting pin actuator, showing the pad portion connected to the hub portion via the first arm portion and the second arm portion of the lifting pin actuator;

[0038] Figure 13 and Figure 14 It is based on the example of this disclosure. Figure 1 The transverse and longitudinal cross-sectional views of the lifting pin actuator show the flat surface with the release channel and the arcuate periphery of the flat surface, respectively.

[0039] Figure 15 and Figure 16 It is based on the example of this disclosure. Figure 1 The side view and top plan view of the actuator tube assembly show the seat end of the actuator assembly with flat facets to mount the lifting pin actuator thereon.

[0040] Figure 17 and Figure 18 It is based on the example of this disclosure. Figure 1 The side view and top view of the seat end of the actuator tube component show the release channel and the flat surface of the flat facet adjacent to the actuator tube component, respectively.

[0041] Figure 19 This is a block diagram of a method for manufacturing a lifting pin actuator device according to the present disclosure, illustrating the operation of the method according to illustrative and non-limiting examples; and

[0042] Figure 20 This is a block diagram of a method for manufacturing an actuator device according to the present disclosure, illustrating the operation of the method according to illustrative and non-limiting examples.

[0043] It should be understood that the elements in the accompanying drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the relative dimensions of some elements in the drawings may be exaggerated relative to other elements to help improve the understanding of the embodiments illustrated in this disclosure. Detailed Implementation

[0044] Reference will now be made to the accompanying drawings, wherein like reference numerals identify similar structural features or aspects of the subject matter disclosed herein. For purposes of explanation and illustration, and not limitation, a partial view of an example of a lifting pin actuator according to this disclosure is shown in... Figure 1 As shown in the figure, and generally indicated by reference numeral 100. Figures 2 to 20 Other examples of lift pin actuators, actuator devices, and semiconductor processing systems including lift pin actuators, as well as methods of manufacturing lift pin actuators and actuator devices, are provided in accordance with this disclosure or its aspects, as will be described. The systems and methods of this disclosure can be used to actuate lift pins in semiconductor processing systems, such as in a single-wafer cold-wall chamber device having a crossflow architecture for depositing silicon-containing material layers onto a substrate, but this disclosure is not limited to any particular chamber device or semiconductor processing system generally used for depositing material layers onto a substrate.

[0045] refer to Figure 1The image illustrates a semiconductor processing system 100. The semiconductor processing system 100 typically includes a processing fluid source 102, a chamber device 104, an exhaust source 106, and a controller 108. The processing fluid source 102 is configured to deliver processing fluid 10 to the chamber device 104. The chamber device 104, which in turn connects the processing fluid source 102 to the exhaust source 106, includes a lift pin actuator 200 and an actuator tube member 300, and can be configured to use the lift pin actuator 200 to deliver the processing fluid 10 to a substrate located within the chamber device 104, such as substrate 2. Figure 3 (As shown). The exhaust source 106 connects the chamber assembly 104 to an external environment 12 outside the semiconductor processing system 100, for example via a vacuum pump and / or a purification device such as a scrubber, and is configured to deliver residual processing fluids and / or reaction product streams to the outside. It is conceivable that the controller 108 is operatively coupled to one or more of the processing fluid source 102, the chamber assembly 104, and the exhaust source 106 via a wired or wireless link 112, for example to operate the lift pin actuator 200 and / or control substrate processing within the chamber assembly 104.

[0046] As used herein, the term "substrate" can refer to any one or more underlying materials, including any one or more underlying materials that can be modified or on which devices, circuits, or films can be formed. Substrates can be continuous or discontinuous; rigid or flexible; solid or porous; and combinations thereof. Substrates can be in any form, such as (but not limited to) powder, plate, or workpiece. Plate-type substrates can include wafers of various shapes and sizes, for example, including 300 mm wafers. Substrates can be formed from semiconductor materials, including, for example, silicon (Si), silicon-germanium (SiGe), silicon oxide (SiO2), gallium arsenide (GaAs), gallium nitride (GaN), and silicon carbide (SiC). Substrates can include patterned substrates or can be unpatterned, such as so-called blanket substrates. As an example, substrates in powder form can have applications for pharmaceutical manufacturing.

[0047] The porous substrate may comprise one or more polymers. Examples of workpieces may include medical devices (e.g., stents and syringes), jewelry, tooling devices, components for battery manufacturing (e.g., anodes, cathodes, or separators), or components for photovoltaic cells. The continuous substrate may extend beyond the boundaries of the processing chamber where the deposition process takes place. In some processes, the continuous substrate may move through the processing chamber, allowing the process to continue until the end of the substrate is reached. The continuous substrate may be supplied from a continuous substrate feed system to allow the continuous substrate to be manufactured and output in any suitable form. Non-limiting examples of continuous substrates may include sheets, nonwoven films, rolls, foils, meshes, flexible materials, bundles of continuous filaments, or fibers (e.g., ceramic fibers or polymer fibers). The continuous substrate may also include a carrier or sheet on which one or more discontinuous substrates are mounted.

[0048] refer to Figure 2 This illustration shows a semiconductor processing system 100 according to an example of the present disclosure. In the illustrated example, the semiconductor processing system 100 is configured to deposit a silicon-containing material layer 4 onto a substrate 2 using an epitaxial technique with a processing fluid source 102, and includes a silicon-containing material layer precursor source 114, a doped material layer precursor source 116, an etchant source 118, and a carrier / diluent fluid source 120. The silicon-containing material layer precursor source 114 includes a silicon-containing material layer precursor 16 and is coupled to a chamber device 104 via a processing fluid supply conduit 122. The silicon-containing material layer precursor source 114 is further configured to flow the silicon-containing material layer precursor 16 into the chamber device 104, and in this respect can be coupled to the chamber device 104 via one or more mass flow control devices (e.g., mass flow controller (MFC) devices) operatively associated with a controller 108.

[0049] In some embodiments, the silicon-containing material layer precursor 16 may include a non-halogenated silicon-containing material layer precursor. Non-limiting examples of suitable non-halogenated silicon-containing material layer precursors include silane (SiH4), silane (Si2H6), propane (H8Si3), and tetrasilane (Si4H). 10 According to some examples, the silicon-containing material layer precursor 16 may include a halogenated silicon-containing material layer precursor. Non-limiting examples of suitable halogenated silicon-containing material layer precursors include chlorosilanes (SiH3Cl), dichlorosilanes (H2SiCl2), and trichlorosilanes (HCl3Si). It is contemplated that the silicon-containing material layer precursor source 114 may include two or more of the aforementioned silicon-containing material layer precursors and be configured to deliver two or more silicon-containing material layer precursors to the chamber device 104. It is also contemplated that the silicon-containing material layer precursor source 114 may cooperate with a metal-containing material layer precursor source 124, which includes a metal-containing material layer precursor 18 and is configured to provide a flow of the metal-containing material layer precursor 18 to the chamber device 104. Examples of suitable metal-containing material layer precursors include germanium (Ge) and gallium (Ga), for example, supplied to chamber device 104 via germanane (GeH4) and / or gallium trichloride (GaCl3) from metal-containing material layer precursor source 124.

[0050] The doped material layer precursor source 116 is similar to the silicon-containing material layer precursor source 114, and additionally includes a doped material layer precursor 20, and is configured to flow the doped material layer precursor 20 into the chamber device 104. In some examples, the doped material layer precursor 20 may include a p-type dopant. Examples of suitable p-type dopant include boron (B) and indium (In). According to some examples, the doped material layer precursor 20 may include an n-type dopant. Examples of suitable n-type dopant include phosphorus (P) and arsenic (As). It is also contemplated that the doped material layer precursor source may include carbon (C) and is still within the scope of this disclosure. As those skilled in the art will understand in light of this disclosure, other dopant may be employed and are still within the scope of this disclosure.

[0051] Etching source 118 is similar to silicon-containing material layer precursor source 114, additionally including etchant 22, and further configured to deliver etchant 22 to chamber configuration 104. In some examples, etchant 22 may include a chlorine-containing etchant. For example, etchant 22 may include hydrochloric acid (HCl) and / or chlorine gas (Cl2). According to some examples, etchant 22 may include a fluorine-containing etchant. Examples of suitable fluorine-containing etchants include hydrofluoric acid (HF) and fluorine gas (F2). It is contemplated that etchant source 118 may be configured to provide etchant 22 to chamber device 104 mixed with and / or independent of silicon-containing material layer precursor 16, for example as a cleaning or purging fluid. As those skilled in the art will understand in light of this disclosure, other etchants may be included in etchant source 118 and are still within the scope of this disclosure.

[0052] The carrier / diluent fluid source 120 is similar to the silicon-containing material layer precursor source 114, additionally including a carrier / diluent fluid 24, and further configured to provide a flow of the carrier / diluent fluid 24 to the chamber device 104. In some examples, the carrier / diluent fluid source 120 may be configured to provide the chamber device 104 with a carrier / diluent fluid 24 mixed with one or more of the silicon-containing material layer precursor 16, the metal-containing material layer precursor 18, the dopant-containing material layer precursor 20, and the etchant 22. According to some examples, the carrier / diluent fluid source 120 may be configured to provide the carrier / diluent fluid 24 to the chamber device 104 independently of one or more of the aforementioned fluids. Examples of suitable carrier / diluent fluids include hydrogen (H2) and inert gases such as nitrogen (N2), argon (Ar), and mixtures comprising one or more of the above fluids.

[0053] The discharge source 106 is connected to the chamber device 104 via a process fluid discharge conduit 126 and is configured to maintain a predetermined pressure within the chamber device 104. In some examples, the discharge source 106 may be configured to maintain the pressure within the chamber device 104 within a pressure range suitable for atmospheric pressure processing, for example, between about 760 Torr and about 710 Torr. According to some examples, the discharge source 106 may be configured to maintain the pressure within the chamber device 104 within a pressure range suitable for depressurization processing, for example, between about 710 Torr and about 0.1 Torr. As used herein, the term "processing" can refer to a processing operation of depositing a material layer onto a substrate, a processing operation of removing material from a substrate, and a processing operation of depositing a material layer and removing material from a substrate disposed within the chamber device 104.

[0054] refer to Figure 3 This illustration shows an example chamber device 104 according to the present disclosure. In the example shown, chamber device 104 has a single-wafer crossflow architecture 128 and includes a chamber body 130, an injection flange 132, and an exhaust flange 134. Chamber device 104 also includes an upper heater element array 136, a lower heater element array 138, and a separator 140. As shown and described herein, chamber device 104 also includes a substrate support 142, a support member 146, a shaft member 148, and a lifting and rotating module 150, the substrate support 142 having a plurality of lifting pins 144 slidably received therein. Although shown and described herein with a particular arrangement and including certain elements, it should be understood and recognized that chamber device 104 may have different arrangements, and may include or exclude elements shown and described herein, and remain within the scope of this disclosure.

[0055] The chamber body 130 is formed of a ceramic material 152 (e.g., a ceramic material transparent to electromagnetic radiation in the infrared band) and has an injection end 154 and a longitudinally opposed discharge end 156. Examples of suitable ceramic materials include quartz, fused silica, and sapphire. In some examples, the chamber body 130 may have a substantially flat upper wall and / or a substantially flat lower wall. In such examples, the chamber body 130 may further have a plurality of external ribs 158 extending laterally around the exterior of the chamber body 130 and longitudinally spaced from each other between the injection end 154 and the discharge end 156 of the chamber body 130. According to some examples, either (or both) of the upper and lower walls of the chamber body 130 may be arched or dome-shaped in form, and are still within the scope of this disclosure.

[0056] The injection flange 132 is adjacent to the injection end 154 of the chamber body 130, and the processing fluid source 102 ( Figure 1(As shown) fluid connection to the interior 160 of the chamber body 130. In this respect, the process fluid supply conduit 122 can connect the process fluid source 102 to the injection flange 132 to deliver the process fluid 10 into the interior 160 of the chamber body 130. The discharge flange 134 abuts the discharge end 156 of the chamber body 130 and fluidly connects the interior 160 of the chamber body 130 to the discharge source 106. Figure 1 (As shown). In this respect, the process fluid discharge conduit 126 may connect the discharge flange 134 to the discharge source 106 to deliver residual process fluid and / or reaction products to the discharge source 106. In some examples, the injection flange 132 may be shown and described as in U.S. Patent No. 11,053,591 to Ma et al., published July 6, 2021, the contents of which are incorporated herein by reference in their entirety. According to some examples, the discharge flange 134 may be shown and described as in U.S. Patent No. 10,612,136 to Sreeram et al., published April 7, 2020, the contents of which are incorporated herein by reference in their entirety.

[0057] An array 136 of upper heater elements is supported above the chamber body 130 and includes a plurality of upper heater elements 162. It is conceivable that the upper heater elements 162 are operatively connected to a controller 108. Figure 1 (As shown) and configured to transfer heat H into the interior 160 of the chamber body 130. In some examples, a plurality of upper heater elements 162 may each include a linear filament extending laterally through the upper wall of the chamber body 130 and longitudinally spaced apart from each other between the injection end 154 and the discharge end 156 of the chamber body 130. According to some examples, the plurality of upper heater elements 162 may extend longitudinally between the injection end 154 and the discharge end 156 of the chamber body 130, and the plurality of upper heater elements 162 may be laterally spaced apart from each other between the laterally opposite sidewalls of the chamber body 130. The lower heater element array 138 may be similar to the upper heater element array 136 and additionally includes a plurality of lower heater elements 164, each lower heater element 164 supported below the lower wall of the chamber body 130. In some examples, the plurality of lower heater elements may be substantially orthogonal to the plurality of upper heater elements 162. Although shown and described herein as including linear filament type heater elements, it should be understood and recognized that either (or both) of the upper heater element array 136 and the lower heater element array 138 may include bulb type heater elements and remain within the scope of this disclosure.

[0058] The partition 140 is formed of an opaque material 166 (e.g., a material opaque to electromagnetic radiation in the infrared band) and is supported within the interior 160 of the chamber body 130. It is contemplated that the partition 140 divides the interior 160 of the chamber body 130 into an upper chamber 168 and a lower chamber 170. It is also contemplated that the partition 140 defines a partition aperture 172 through which the upper chamber 168 is fluidly connected to the lower chamber 170. It is also contemplated that a substrate support 142 is disposed within the interior 160 of the chamber body 130, at least partially within the partition aperture 172, and supported therein for rotation about a rotation axis 174. In some examples, the opaque material 166 may comprise a bulk carbonaceous material, such as pyrolytic carbon or graphite with a ceramic coating. According to some examples, the opaque material 166 may comprise a bulk ceramic material, such as silicon carbide, as an example and not a limitation. It is contemplated that the substrate support 142 may also be formed (at least partially) of the opaque material 166.

[0059] Support member 146 is arranged along rotation axis 174 and within lower chamber 170 of chamber body 130, and is fixed relative to substrate support 142. It is conceivable that support member 146 is formed of a material transparent to electromagnetic radiation in the infrared band (e.g., ceramic material 152). Shaft member 148 is also arranged along rotation axis 174 and is additionally fixed relative to support member 146 when rotating about rotation axis 174. Shaft member 148 further extends through channel 176 defined within lower wall of chamber body 130 and into the external environment outside chamber body 130, and operably connects lifting and rotation module 150 to substrate support 142 to rotate substrate support 142 about rotation axis 174 via shaft member 148 and support member 146. In some examples, shaft member 148 may be formed of a material transparent to electromagnetic radiation in the infrared band (e.g., ceramic material 152).

[0060] A plurality of lifting pins 144 are slidably received within corresponding lifting pin holes 178 defined within the substrate support 142. It is conceivable that the plurality of lifting pins 144 are configured to place and remove a substrate (e.g., substrate 2) onto the substrate support 142, and in this respect supported relative to gravity within the interior 160 of the chamber body 130 at a position above the lifting pin actuator 200 and actuator tube member 300. The lifting pin actuator 200 is arranged (at least partially) along the axis of rotation 174 within the lower chamber 170 of the chamber body 130, mounted on the actuator tube member 300, and is translatable along the axis of rotation 174 between a retracted position 180 and an extended position 182. The actuator tube member 300 houses the lifting pin actuator 200 thereon and extends through a channel 176 into the external environment outside the chamber body 130.

[0061] It is conceivable that the actuator tube member 300 is supported to translate relative to the shaft member 148 along the axis of rotation 174 to drive the lifting pin actuator 200 between a retracted position 180 and an extended position 182. In the retracted position 180, the lifting pin actuator 200 is close to the lower wall of the chamber body 130, such that the lifting pins are overhanging below the substrate support 142 within the lower chamber 170 of the chamber body 130. In the extended position 182, the lifting pin actuator 200 is close to the substrate support 142 and abuts against a plurality of lifting pins 144, such that each of the plurality of lifting pins 144 protrudes above the substrate support 142 and into the upper chamber 168 of the chamber body 130. The translation of the actuator tube member 300, and thus the translation via the lifting pin actuator 200, can be achieved through the operable association of the lifting and rotation module 150. In some examples, either or both of the lifting pin actuator 200 and actuator tube member 300 may be formed of a ceramic material (e.g., composed of or substantially composed of ceramic material 152). According to some examples, the outer surface of the shaft member 148 and the inner surface of the actuator tube member 300 may be radially spaced apart to define an annular flow region therebetween. It is also conceivable that the tubular member 184 may be fixed to the lower wall of the chamber body 130 and surround the passage 176, with the actuator tube member 300 and shaft member 148 at least partially arranged within the tubular member 184.

[0062] refer to Figure 4-8 The diagram sequentially illustrates loading and placing the substrate 2 within the chamber device 104 before processing the substrate 2, processing the substrate 2 (e.g., depositing material layer 4), and removing and unloading the substrate 2 from the chamber device 104 after processing. Figure 4 As shown, the substrate 2 is loaded into the chamber assembly 104 by opening the gate valve 186 connected to the injection flange 132 of the chamber assembly 104 and using a substrate transfer robot 188 connected to the chamber body 130 to advance the end effector 190 carrying the substrate 2 into the upper chamber 168 of the chamber body 130. It is conceivable that the substrate transfer robot 188 longitudinally advances the end effector 190 A into the upper chamber 168 towards the discharge end 156 of the chamber body 130 until the substrate 2 is positioned above the substrate support 142 and the plurality of lifting pins 144, centered on the axis of rotation 174. In this positioning, the substrate can be placed on the substrate support 142.

[0063] like Figure 5As shown, the substrate 2 is positioned on the substrate support 142 by driving the lifting pin actuator 200 from the retracted position 180 to the extended position 182. In this regard, it is conceivable that the lifting and rotating module 150 axially drives the actuator tube member 300 (and thereby drives the lifting pin actuator 200 mounted thereon) upward along the rotation axis 174 toward the substrate support 142 within the lower chamber 170 of the chamber body 130. As the lifting pin actuator 200 translates upward within the lower chamber 170, it contacts the ends of a plurality of lifting pins 144 extending from the substrate support 142 into the lower chamber 170. Thereafter, further translation drives the plurality of lifting pins 144 through the substrate support 142, such that the plurality of lifting pins 144 protrude above the substrate support 142 and contact the underside of the substrate 2. When the multiple lifting pins 144 contact the lower side 6 of the substrate 2, further translation of the lifting pin actuator 200 causes the substrate 2 to transfer from the end effector 190 to the multiple lifting pins 144 as the multiple lifting pins 144 approach the extended position 182. Thereafter, the substrate transfer robot 188 can retract the end effector 190 from the upper chamber 168 of the chamber body 130, close the gate valve 186, and the lifting pin actuator 200 translates downwards in the lower chamber 170 toward the retracted position 180 in a direction axially opposite to the substrate support 142. Figure 6 (As shown). When the lifting pin actuator 200 moves downward, the plurality of lifting pins 144 move downward through the substrate support 142 by gravity, thereby transferring the substrate 2 to the substrate support 142 when the plurality of lifting pins 144 approach the retracted position 180. The substrate 2 can be processed within the chamber device 104 (e.g., within the chamber body 130) to deposit the material layer 4 onto the substrate 2.

[0064] like Figure 6 As shown, the processing of substrate 2 can be achieved by heating substrate 2 to a predetermined material layer deposition temperature using either (or both) the upper heater element array 136 and the lower heater element array 138, for example, to a temperature between about 200 degrees Celsius and about 1200 degrees Celsius. The processing of substrate 2 can be further achieved by establishing (and then maintaining) a predetermined material layer deposition pressure within the interior 160 of the chamber body 130, for example using a vacuum pump included in the exhaust source 106. Figure 1(As shown). In this regard, it is conceivable that the pressure within the interior 160 of chamber 130 is maintained in the range of approximately 0.1 Torr and 760 Torr, for example, between approximately 760 Torr and approximately 720 Torr (for deposition of material layer 4 using atmospheric techniques) or between approximately 720 Torr and approximately 0.1 Torr (for deposition of material layer 4 using depressurization techniques). The substrate support 142 on which the substrate 2 is disposed can be further rotated about the rotation axis 174 by the lifting and rotating module 150 using a rotation R transmitted to the substrate support 142 via the shaft member 148 and the support member 146, for example, at a predetermined material layer deposition rotation speed.

[0065] It is conceivable that the upper surface 8 of the substrate 2 is exposed to the processing fluid 10, while the substrate is maintained at a predetermined deposition temperature and the interior 160 of the chamber body 130 is maintained at a predetermined deposition pressure. It is also conceivable that the processing fluid 10 further includes a silicon-containing material layer precursor 16 (…). Figure 2 (as shown) and precursor 18 containing a metal material layer ( Figure 2 As shown), doped material layer precursor 20 ( Figure 2 As shown), etchant 22 ( Figure 2 (as shown) and carrier / diluent fluid 24 ( Figure 2 One or more of the following (shown), the material layer 4 is thus a silicon-containing material layer, and in some examples of this disclosure, the material layer 4 is further epitaxial with the substrate 2. It is also conceivable that once the material layer 4 produces one or more predetermined properties (e.g., thickness and / or resistivity), the flow of the processing fluid 10 stops, the rotation of the substrate support 142 about the rotation axis 174 stops, and the heating of the substrate and the pressure within the interior 160 of the chamber body 130 are adjusted such that the substrate 2 on which the material layer 4 is deposited can be removed from the substrate support 142 and unloaded from the chamber body 130.

[0066] like Figure 7As shown, the substrate 2 can be removed from the substrate support 142 by translating the lift pin actuator 200 again from the retracted position 180 to the extended position 182. In this regard, it is conceivable that the lifting and rotating module 150 again drives the E-actuator tube member 300 (and thereby drives the lift pin actuator 200 mounted thereon) axially toward the substrate support 142 within the lower chamber 170 along the rotation axis 174. As the lift pin actuator 200 translates upward within the lower chamber 170, the lift pin actuator 200 contacts the ends of a plurality of lift pins 144 extending from the substrate support 142 into the lower chamber 170. Further translation of the lift pin actuator 200 then drives the plurality of lift pins 144 through the substrate support 142, such that the plurality of lift pins 144 contact the underside 6 of the substrate 2. The continued translation of the lifting pin actuator 200 along the rotation axis 174 causes multiple lifting pins 144 to protrude from the substrate support 142 into the upper chamber 168 of the chamber body 130, thereby removing the substrate 2 from the substrate support 142. The substrate 2 is then supported above the substrate support 142 at a position where, once the lifting pin actuator 200 reaches the extended position 182, the end effector 190 can be pushed back into the upper chamber 168 to a position axially positioned between the substrate 2 and the substrate support 142. With this positioning, the substrate can be unloaded from the chamber assembly 104.

[0067] The substrate 2, on which the material layer 4 is deposited, can be unloaded by reopening the gate valve 186. Once the gate valve 186 is open, the substrate transfer robot 188 can again longitudinally advance the end effector 190 toward the discharge flange 134 into the chamber body 130. In this regard, it is conceivable that the end effector 190 is positioned such that it is below the substrate 2, axially spaced from both the underside 6 of the substrate 2 and the substrate support 142, and registered to the substrate 2 such that the movement of the lifting pin actuator from the extended position 182 toward the retracted position 180 transfers the substrate 2 to the end effector 190. Once the end effector 190 is positioned, the lifting mechanism in the rotary module 150 can translate the actuator tube member 300 (and the lifting pin actuator 200 mounted thereon) downward along the rotation axis 174. The downward translation of the actuator tube component 300 causes the lifting pin actuator 200 to translate from the extended position 182. Multiple lifting pins 144 slide downwards through the substrate support 142 under gravity. As the multiple lifting pins 144 are positioned in the substrate support 142 and extend from the substrate support 142 into the lower chamber 170 of the chamber body 130, the substrate 2 is transferred from the multiple lifting pins 144 to the end effector 190. Then, the substrate transfer robot 188 can withdraw the end effector 190 carrying the substrate 2 on which the material layer 4 is deposited from the upper chamber 168, the gate valve 186 closes, and the chamber assembly 104 is ready to process subsequent substrates.

[0068] One challenge in operating a chamber apparatus with lift pin actuators is that, because the lift pin actuators tend to shield the underside of the substrate support, they may need to be excessively large relative to their originally preferred dimensions. For example, the lift pin actuator may have a larger circumferential range than originally desired due to registration errors of the lift pin relative to the lift pin actuator at the end of deposition. The lift pin actuator may further have a larger radial range than originally desired because it tends to pitch and / or roll around the end of the actuator tube member when the lift pin engages. This pitching and / or rolling tendency of the lift pin actuator can be exacerbated during deposition, where the substrate support is pre-coated, as the lift pin itself is prone to accumulating during deposition. This pre-coating and accumulating increases the force required to asymmetrically drive the lift pin during movement. To limit the shielding of the underside of the substrate support 142 and / or limit the displacement of the lifting pin actuator during the pre-coating process and / or the displacement of the lifting pin actuator that may be subjected to the accumulation formation on the component (such as multiple lifting pins 144) within the chamber body 130, a lifting pin actuator 200 and an actuator tube member 300 are provided.

[0069] refer to Figure 8 and Figure 9 This illustrates a portion of the chamber assembly 104, including a lifting pin actuator 200 and an actuator tube assembly 300. (See image below.) Figure 9 As shown, the lifting pin actuator 200 is arranged along the rotation axis 174, extends about the rotation axis 174, and is axially offset from the support member 146 along the rotation axis 174. The actuator tube member 300 is also arranged along the rotation axis 174, extends about the shaft member 148, and mounts the lifting pin actuator 200 thereon. The shaft member 148 projects axially from the lifting pin actuator 200 in a direction opposite to the axial direction of the actuator tube member 300, mounts the support member 146 thereon, and is radially spaced from the inner surface 202 of the actuator tube member 300, such that the outer surface 192 and the inner surface 202 of the actuator tube member 300 define a radial gap 194 therebetween. It is conceivable that a fluid source (e.g., a carrier / diluent fluid source 120) Figure 2 (As shown) can be connected to actuator tube assembly 300, such that actuator tube assembly 300 fluidly connects the fluid source to chamber body 130. Figure 3 The lower chamber 170 (as shown) Figure 3 (As shown).

[0070] refer to Figures 10 to 14 The image shows an example of a lifting pin actuator 200 according to this disclosure. Figure 10 As shown, the lifting pin actuator 200 typically includes an actuator body 204. The actuator body 204 is configured for use along the rotation axis 174 in the chamber body 130 ( Figure 3 The lower chamber 78 (as shown) Figure 3 (As shown) translation within. The actuator body 204 is further composed of ceramic material 206 ( Figure 3 (as shown) is formed, for example, of a ceramic material transparent to electromagnetic radiation in the infrared band, and may consist of or substantially consist of ceramic material 206. As those skilled in the art will understand from this disclosure, forming the actuator body 204 from a ceramic material can limit deposition onto the substrate 2 (shown). Figure 3 Material layer 4 (as shown) Figure 3 Variations within (as shown) are, for example, limited during the deposition of material layer 4 onto substrate 2 due to substrate support 142 (as shown). Figure 3 The non-uniform temperature across the substrate caused by the shielding of electromagnetic radiation on the lower side of the substrate (as shown) is transmitted by the lower heater element array 138 via the lifting pin actuator 200. Figure 3 (As shown) transmitted to the main body of the room 130 ( Figure 3 The interior of the 160 (shown) Figure 3 (as shown). In some examples of this disclosure, the ceramic material 206 may be quartz. It is also conceivable that the ceramic material 206 may be fused silica or sapphire, and still within the scope of this disclosure. According to some examples, the lifting pin actuator 200 may be manufactured using subtractive manufacturing techniques from a single workpiece 26 ( Figure 12 (As shown) (e.g., a single ceramic workpiece body) is formed. For example, as a non-limiting example, the lifting pin actuator 200 can be formed using two or more of cutting or sawing operations 28, boring or drilling operations 30, and milling operations 32. As those skilled in the art will understand in light of this disclosure, using two or more subtractive manufacturing techniques can reduce the time required to manufacture the lifting pin actuator 200, for example, due to the relatively high material removal rates of cutting or sawing and boring or drilling relative to milling, thereby limiting the semiconductor processing system 100 including the lifting pin actuator 200 ( Figure 1 The cost (as shown).

[0071] It can be envisioned that the lifting pin actuator 200 is configured to drive multiple lifting pins 144. Figure 3 As shown), and in this respect, the actuator body 204 has a hub portion 208, a first arm portion 210, a second arm portion 212, and a pad portion 214. The hub portion 208 extends about the rotation axis 174 and has an upper surface 216 (as shown). Figure 11 As shown), radial outer surface 218 and lower surface 220 ( Figure 11(As shown). It is conceivable that the upper surface 216 is angled relative to the axis of rotation 174, and in this respect, the upper surface 216 may be orthogonal relative to the axis of rotation 174. The radially outer surface 218 extends from the upper surface 216 along the axis of rotation 174 toward the lower surface 220 and axially about the axis of rotation 174, and axially separates the lower surface 220 from the upper surface 216 of the hub portion 208 of the actuator body 204. The lower surface 220 is angled relative to the axis of rotation 174 and may be substantially orthogonal relative to the axis of rotation 174. In some examples, the lower surface 220 may be wider than the upper surface 216, and the hub portion 208 in such examples has a generally truncated conical shape. It is also conceivable that the hub portion 208 may be cylindrical in shape, and is still within the scope of this disclosure.

[0072] like Figure 11 As shown, it is conceivable that the hub portion 208 of the actuator body 204 can be castle-shaped. In this respect, the hub portion 208 has an annular segment 222 and a plurality of toothed segments 224. The annular segment 222 extends axially along and around the rotation axis 174. The annular segment 222 further extends axially between the lower surface 220 and the upper surface 216 of the hub portion 208 of the actuator body 204. The plurality of toothed segments 224 extend axially from the annular segment 222 of the hub portion 208 of the actuator body 204, are distributed around the rotation axis 174, and connect the first arm portion 210 ( Figure 10 (as shown) and the second arm part 212 ( Figure 10 (As shown) The annular segment 222 is connected to the hub portion 208 of the actuator body 204. It is also conceivable that a plurality of toothed segments 224 axially separate the first arm portion 210 and the second arm portion 212 from the annular segment 222 of the hub portion 208 of the actuator body 204, defining a plurality of notches 226 between each other. The plurality of notches 226 extend axially between the annular segment 222 and the arm portions (e.g., the first arm portion 210 and the second arm portion 212) of the hub portion 208, and each notch separates circumferentially adjacent toothed segments 224 from each other. In the example shown, the hub portion 208 has three (3) toothed segments 224 circumferentially separated by three (3) notches 226. As those skilled in the art will understand in view of this disclosure, in other examples, the hub portion 208 may have fewer or more toothed segments and notches, and still within the scope of this disclosure.

[0073] like Figure 12As shown, the first arm portion 210 and the second arm portion 212 extend outward (e.g., chordally) from the hub portion 208 and in a direction opposite to the axis of rotation 174. The second arm portion 212 may further be substantially parallel to the first arm portion 210 and may be orthogonal to the axis of rotation 174. In some examples, the first arm portion 210 and the second arm portion 212 may be substantially orthogonal to the radial outer surface 218 of the hub portion 208 of the actuator body 204. According to some examples, the first arm portion 210 may axially overlap with a first tooth segment of a plurality of tooth segments 224. Figure 11 As shown), and the second arm portion 212 can axially overlap with the second tooth segment in the plurality of tooth segments 224, and a single tooth in the plurality of tooth segments 226 (as shown). Figure 11 (As shown) the second arm portion 212 is then circumferentially separated from the first arm portion 210 of the actuator body 204.

[0074] It is conceivable that the first arm portion 210 and the second arm portion 212 form a first arm pair 228. The first arm pair 228 may be one of a plurality of arm pairs extending outward from the hub portion and circumferentially distributed around the rotation axis 174. The plurality of arm pairs may in turn be circumferentially distributed around the rotation axis 174, for example symmetrically, such that each arm pair is offset from its adjacent arm pair by a common angle around the rotation axis 174. In the example shown, the first arm pair 228 is one of three (3) arm pairs circumferentially distributed around the rotation axis 174 and the hub portion 208 of the actuator body 204. As those skilled in the art will understand in view of this disclosure, the actuator body 204 may have fewer or more arm pairs than shown and described herein, and still remain within the scope of this disclosure.

[0075] The pad portion 214 of the actuator body 204 is radially separated from the hub portion 208 of the actuator body 204. The pad portion 214 further connects the second arm portion 212 to the first arm portion 210 of the actuator body 204 and has a mating surface 230. The mating surface 230 is configured to engage a plurality of lifting pins 144. Figure 3 The bottom end of the joint surface 230 (as shown) can be substantially planar in this respect. In another aspect, it is conceivable that the joint surface 230 is substantially orthogonal to the axis of rotation 174. In some examples, the joint surface 230 can be aligned with the upper surface 232 of the first arm portion (as shown). Figure 11 As shown) and the upper surface 234 of the second arm portion Figure 11(As shown) are coplanar. According to some examples, pad portion 214 may define (e.g., delineate) an arcuate segment 236 extending circumferentially around axis of rotation 174. It is contemplated that pad portion 214 may be defined by a radially inner pad surface 238 extending between first arm portion 210 and second arm portion 212, and a radially outer pad surface 240 extending parallel to the radially inner pad surface 238 and circumferentially spanning both first arm portion 210 and second arm portion 212 of actuator body 204. In the example shown, pad portion 214 is one of three (3) pad portions circumferentially distributed around axis of rotation 174. As those skilled in the art will understand in light of this disclosure, actuator body 204 may include fewer or more pad portions than those shown and described herein, and still remain within the scope of this disclosure.

[0076] like Figure 13 As shown, it can be envisioned that the hub portion 208 of the actuator body 204 is configured for mounting to the actuator tube member 300. Figure 3 As shown. In this respect, the hub portion 208 defines a recess 242 within the interior of the hub portion 208 of the actuator body 204. The recess 242 is defined by the inner surface 244 of the hub portion 208 and geometrically corresponds to the seat end 304 of the actuator tube member 300. Figure 9 As shown), and by defining the lower surface 220 of the hub portion 208 ( Figure 11 The seat hole 246 (shown) Figure 11 (as shown) and the upper surface 216 of the hub portion 208 defined in the actuator body 204. Figure 11 The upper surface hole 248 (as shown) Figure 11 (As shown) the external environment connected to the outside of the hub portion 208. It is conceivable that the inner surface 244 of the defining recess 242 of the hub portion 208 defines a plurality of flat surfaces 250. It is also conceivable that the inner surface 244 of the hub portion 208 of the actuator body 204 may define a plurality of arcuate surfaces 252 within the recess 242, and the inner surface 244 connects the upper surface hole 248 defined in the upper surface 216 to the seat hole 246 defined in the lower surface 220.

[0077] Multiple flat surfaces 250 are circumferentially distributed around the axis of rotation 174. The multiple flat surfaces 250 are further angled relative to the axis of rotation 174, and each of the multiple flat surfaces 250 is separated from the axis of rotation 174 by a greater distance near the lower surface 220 of the hub portion 208 than near the upper surface 216 of the hub portion 208 of the actuator body 204. In this respect, it is conceivable that each of the multiple flat surfaces 250 is relative to the axis of rotation 174 (and / or relative to the upper surface 216 of the hub portion 208). Figure 11 (as shown) and lower surface 220 ( Figure 11At least one of the components shown is angled at a common flat plane angle 254. The common flat plane angle 254 can be an inclination angle. In some examples, the common flat plane angle 254 may be between about 5 degrees and 45 degrees, or between about 5 degrees and about 30 degrees, or between about 5 degrees and about 15 degrees, or even between about 5 degrees and about 10 degrees. Advantageously, the common flat plane angle within these angular ranges can limit (or completely prevent) the lifting pin actuator 200 from fusion with the actuator tube component 300. Figure 1 The trend shown is, for example, due to the sequential processing of the substrate within the semiconductor processing system 100, causing the actuator device 110 (as shown) to... Figure 3 The cyclic heating and cooling (shown) simplifies maintenance of the semiconductor processing system 100 in an example where the lifting pin actuator 200 may need to be periodically removed from the actuator tube assembly 300 during maintenance events. In the illustrated example, the inner surface 244 of the hub portion 208 has three (3) flat surfaces. As those skilled in the art will understand from the present invention, the lifting pin actuator 200 may have fewer or more flat surfaces in other examples, and still remain within the scope of the invention.

[0078] In some examples, one or more of the plurality of flat surfaces 250 may be defined by an arcuate periphery 256. The arcuate periphery 256 may have a base 258 adjacent to the lower surface 220 of the hub portion 208 of the actuator body 204, and an upper surface hole 248 adjacent to the upper surface 216 defined within the hub portion 208 of the actuator body 204. Figure 11 The open end 260 (shown). According to some examples, one or more of the plurality of flat surfaces 250 may have a release channel 262 defined within the respective flat surface 250. The release channel 262 may extend from the open end 260 of the arcuate periphery 256 toward a position between the open end 260 of the arcuate periphery 256 and the base 258. Advantageously, the definition of the release channel 262 within one or more of the plurality of flat surfaces 250 can facilitate the actuator tube member 300 ( Figure 3 The stability of the lifting pin actuator 200 (as shown) is achieved, for example, through the plane 250 having the release channel 262 and the seat end 304 defined in the actuator tube member 300. Figure 9 Multiple flat facets 336 (as shown) on Figure 16 Contact points are spread between adjacent flat facets (shown herein). As shown and described herein, each of the plurality of flat facets 250 defines a single release channel 262 therein. As those skilled in the art will understand in light of this disclosure, the plurality of flat facets 250 may have fewer or more release channels defined therein than those shown and described herein, and are still within the scope of this disclosure.

[0079] Continue to refer to Figure 13A plurality of arcuate surfaces 252, defined by the inner surface 244 of the hub portion 208, are circumferentially distributed around the axis of rotation 174. It is conceivable that each of the arcuate surfaces 252 separates circumferentially adjacent flat surfaces among a plurality of flat surfaces 250, and that the circumferentially adjacent flat surfaces among the plurality of arcuate surfaces 252 are separated by intermediate flat surfaces among the plurality of flat surfaces 250. In some examples, the plurality of arcuate surfaces 252 may be substantially parallel to the axis of rotation 174. According to some examples, each of the plurality of arcuate surfaces 252 may be relative to the actuator tube member 300 (…). Figure 3 The seat end 304 (as shown) Figure 9 The corresponding arcuate facet 306 on the (shown) is overcut, and the corresponding arcuate facet 252 and arcuate facet 306 define a radial gap therebetween. Advantageously, overcutting multiple arcuate faces 252 relative to multiple arcuate facets 306 ensures that multiple flat surfaces 250 position the lifting pin actuator 200 on the seat end 304 of the actuator tube member 300, thereby promoting the stability of the lifting pin actuator 200 on the actuator tube member 300. As shown and described herein, the inner surface 244 of the hub portion 208 has three (3) arcuate faces. As those skilled in the art will understand from this disclosure, the lifting pin actuator 200 ( Figure 3 (As shown) In other examples, there may be fewer or more arched surfaces, and they are still within the scope of this disclosure.

[0080] refer to Figure 15-18 The image shows an actuator tube component 300 according to an example of this disclosure. Reference Figure 15 The actuator tube component 300 is configured and adapted to hold the lifting pin actuator 200 ( Figure 1 (As shown) is placed thereon and includes, in this respect, a tube body 308. It is conceivable that the tube body 308 is arranged along and extends about the axis of rotation 174. It is also conceivable that the tube body 308 has an actuating end 310 connected to the seat end 304 via an intermediate section 312, and that the tube body 308 is formed of a ceramic material 314. Figure 18 (As shown). In some examples, the ceramic material 314 may be transparent to electromagnetic radiation in the infrared band. Examples of suitable ceramic materials include fused silica, quartz, and sapphire. According to some examples, the ceramic material 314 may be composed of or substantially composed of ceramic material 314.

[0081] The actuating end 310 of the tube component body 308 is configured for engagement with an actuating device, such as the lifting and rotating module 150. Figure 3(as shown), and in this respect, a through hole or longitudinal slot 316 may be defined therein. The intermediate section 312 of the pipe member body 308 extends axially from the actuating end 310 of the pipe member body 308 and connects the seat end 304 of the pipe member body 308 to the actuating end 310 of the pipe member body 308. It is conceivable that the seat end 304 of the pipe member body 308 extends from the intermediate section 312 to the end face 318, separated from the actuating end 310 of the pipe member body 308 by the intermediate section 312 of the pipe member body 308, and is configured to house the lifting pin actuator 200 (…). Figure 1 (As shown).

[0082] It can be envisioned that the main body of the pipe component 308 defines a through hole 320 passing through it. Figure 18 (As shown). The through hole 320 connects the actuation end hole 324 defined in the actuation end face 322 on the actuation end 310 to the end hole 326 defined in the end face 318 on the seat end 304 of the tube member body 308. Figure 18 (As shown). The through hole 320 extends continuously and uninterruptedly through the tube member body 308 along the axis of rotation 174, and the size and dimensions of the through hole 320 are designed to accommodate the shaft member 148 passing through it. Figure 3 (As shown). In this respect, it is conceivable that the shaft member 148, when received within the through-hole 320, is separated from the inner surface 302 of the tube member body 308 by a radial clearance 328. The radial clearance 328 extends circumferentially around the shaft member 148 and axially between the actuation end hole 324 and the end hole 326. As those skilled in the art will understand from this disclosure, the shaft member 148 thereby rotates freely relative to the actuator tube member 300 and the chamber body 130 about the axis of rotation 174 to allow for [further action] on the substrate 2 ( Figure 3 During the processing shown, the substrate support 142 is rotated. Figure 3 (As shown). In view of this disclosure, as those skilled in the art will also understand, the actuator tube member 300 thereby also translates freely axially relative to the shaft member 148 and the chamber body 130 along the axis of rotation 174, in the retracted position 180 ( Figure 5 (as shown) and extension position 182 ( Figure 5 The lifting pin actuator 200 is driven between (as shown) to place the substrate 2 on and remove it from the substrate support 142 before and after processing, respectively.

[0083] The intermediate segment 312 of the tube body 308 extends between the actuating end 310 and the seat end 304 of the tube body 308. In some embodiments of this disclosure, the intermediate segment 312 may define an intermediate portion diameter 330. The intermediate portion diameter 330 may extend continuously and uninterruptedly across the intermediate segment 312 of the tube body 308. It is contemplated that the actuating end 310 of the tube body 308 may have an actuator end diameter 332. The actuator end diameter 332 may be larger than the intermediate portion diameter 330. It is also contemplated that the seat end 304 of the tube body 308 may define a seat end diameter 334 larger than the intermediate portion diameter 330. Advantageously, thickening either (or both) the seat end 304 and the actuating end 310 can strengthen the actuator tube member 300, thereby facilitating the mounting of the actuator tube member 300 to the semiconductor processing system 100. Figure 1 (as shown) and remove from it.

[0084] refer to Figure 16 The seat end 304 of the tube member body 308 is configured to house the lifting pin actuator 200 thereon, and in this respect has a plurality of flat facets 336 defined on the outer surface 338 of the tube member body 308. It is conceivable that the plurality of flat facets 336 correspond to those of the lifting pin actuator 200 (…). Figure 1 The hub portion 208 (as shown) Figure 13 The inner surface 244 (as shown) Figure 13 Multiple flat surfaces 250 (as shown) are defined Figure 13 (As shown). In this respect, a plurality of flat facets 336 are circumferentially distributed around the axis of rotation 174, equal in number to the plurality of flat surfaces 250, and spaced circumferentially around the axis of rotation 174 at an angular spacing matching that of the plurality of flat surfaces 250. In another respect, the plurality of flat facets 336 are further angled relative to the axis of rotation 174, and each of the plurality of flat facets 336 is separated by a greater distance from the axis of rotation 174 at the end near the middle section 312 of the tube member body 308 than at the end near the actuation end face 322.

[0085] It is conceivable that the plurality of flat facets 336 each have a common flat facet angle 340 relative to the axis of rotation 174 (and / or relative to at least one of the actuating end 310 and the outer surface 338 of the tube member body 308). Figure 9 (As shown) at an angle. In some examples, the common flat facet angle 340 can be a tilt angle. According to some examples, the common flat facet angle 340 can be between about 5 degrees and 45 degrees, or between about 5 degrees and about 30 degrees, or between about 5 degrees and about 15 degrees, or even between about 5 degrees and about 10 degrees. It is conceivable that the common flat facet angle 340 matches (e.g., is substantially equal to) the common flat facet angle 254 (as shown). Figure 9(As shown). Advantageously, matching the common flat surface angle 340 with the common flat surface angle 254 allows the lifting pin actuator 200 to be positioned using the 3-2-1 positioning method. Figure 1 The lifting pin actuator 200 is positioned on the actuator tube member 300 (as shown). Positioning the lifting pin actuator 200 on the actuator tube member 300 allows gravity to be used as a clamping force to constrain the lifting pin actuator 200 with six degrees of freedom relative to the actuator tube member 300. In this respect, it is conceivable that the lifting pin actuator 200 is positioned relative to the actuator tube member 300 on the first plane 342 (…). Figure 16 As shown), the second plane 344 ( Figure 17 (as shown) and the third plane 346 ( Figure 18 Translation and rotation within (as shown) are constrained, thereby limiting (or eliminating) the lifting pin actuator 200 due to its position from retracted 180 (as shown). Figure 5 (As shown) Move to the extended position 182 ( Figure 5 (As shown) During this period, multiple lifting pins 144 ( Figure 3 The tendency to pitch or roll due to unequal loads applied (as shown).

[0086] refer to Figure 17 It is conceivable that one or more of the plurality of flat facets 336 may be defined by an arcuate edge 348. The arcuate edge 348 may extend from the base 350 near the intermediate section 312 of the tube member body 308 and the open end 352 near the end face 318. In some examples, the arcuate edge 348 of one or more of the plurality of flat facets 33 may correspond to (e.g., match) the lifting pin actuator 200. Figure 1 The arc-shaped periphery 256 (as shown) Figure 14 (As shown). According to some examples, the plurality of flat facets 336 may each have a larger size than the hub portion 208 of the lifting pin actuator 200 (as shown). Figure 10 The inner surface 244 (as shown) Figure 13 The planar area of ​​each of the plurality of flat surfaces 250 defined (as shown). Advantageously, this makes it possible to position the lifting pin actuator 200 at circumferentially spaced contact points on the actuator tube member 300 about the axis of rotation 174 using a 3-2-1 positioning method, for example at the release channel 262 ( Figure 14 (As shown) at contact points that are circumferentially separated from each other. As those skilled in the art will understand in light of this disclosure, although shown and described herein as being defined on a flat surface 250 ( Figure 14 (as shown), but it should be understood and recognized that the release channel may alternatively (or additionally) be defined within one or more of the plurality of flat facets 336, and is still within the scope of this disclosure.

[0087] Continue to refer to Figure 13 and Figure 16 and reference Figure 18 It is conceivable that the outer surface 338 of the tube body 308 defines a plurality of arcuate facets 306. The plurality of arcuate facets 306 are circumferentially distributed around the axis of rotation 174, separating circumferentially adjacent flat facets 336, and circumferentially separated from each other by a single one of the plurality of flat facets 336. It is conceivable that the plurality of arcuate facets 306 are substantially parallel to the axis of rotation 174, and relative to the hub portion 208 of the actuator body 204 (…). Figure 10 The inner surface 244 (as shown) Figure 14 The corresponding and radially overlapping arcuate surfaces among the multiple arcuate surfaces 252 defined (as shown) are overcut. Figure 13 As shown, it is also conceivable that (a) each flat surface 250 within the lift pin actuator 200 radially overlaps with a corresponding one of the plurality of flat facets defined by the seat end 304 of the actuator tube member 300, (b) each of the plurality of arcuate surfaces 252 defined within the lift pin actuator 200 radially overlaps with a corresponding one of the plurality of arcuate facets 354 defined by the seat end 304 of the actuator tube member 300, and (c) each of the plurality of flat surfaces 250 defined within the lift pin actuator 200 abuts a corresponding one of the plurality of flat facets 336 defined by the seat end 304 of the actuator tube member 300. It is noteworthy that a gap 356 is provided between the radially overlapping arcuate surfaces of the plurality of arcuate surfaces 252 defined by the hub portion 208 and the arcuate facets of the plurality of arcuate facets 306 defined by the actuator tube member 300. The gap 356 causes the lifting pin actuator 200 to be positioned on a plurality of flat facets 336 at a plurality of flat surfaces 250, thereby promoting the stability of the lifting pin actuator 200 on the actuator tube member 300 (e.g., resisting pitch and roll).

[0088] refer to Figure 19 The diagram illustrates the manufacture of a lifting pin actuator (e.g., lifting pin actuator 200). Figure 1 Method 400 (as shown). Method 400 includes a single workpiece body (e.g., a single workpiece 26). Figure 12 As shown)) forms the lifting pin actuator body (e.g., actuator body 204) Figure 10 As shown), the individual workpiece body is formed of ceramic material (e.g., ceramic material 206). Figure 5 As shown in bracket 402, the lifting pin actuator body is formed by a hub portion defined by a single workpiece, such as hub portion 208. Figure 10 As shown in box 404. The lifting pin actuator body forming 402 also includes a first arm portion and a second arm portion defined by a single workpiece, such as the first arm portion 210 (…). Figure 10 (as shown) and the second arm part 212 ( Figure 10As shown in box 406. The lifting pin actuator body forming 402 further includes a pad portion defining the lifting pin actuator body from a single workpiece, such as pad portion 214. Figure 10 As shown in box 408. It is conceivable that the lifting pin actuator body forming 402 further includes a mating surface defined by a single workpiece on the pad portion of the lifting pin actuator body, such as mating surface 230. Figure 12 As shown in box 410.

[0089] It is conceivable that one or more of operations 504-410 include forming a portion of the lift pin actuator body and / or mating surfaces using two or more subtractive manufacturing techniques. In this regard, the hub portion can be formed using boring or drilling operations and milling operations, as shown in boxes 412 and 414. In another aspect, the first arm portion and the second arm portion of the actuator body can be formed using boring or drilling operations and milling operations, as shown in boxes 416 and 418. It is also conceivable that the pad portion of the actuator body can be formed using drilling or boring and milling operations, as shown in boxes 420 and 422, and the mating surfaces can additionally be formed on the pad portion using boring or drilling operations and milling operations, as shown in boxes 424 and 426. As those skilled in the art will understand from this disclosure, using subtractive manufacturing techniques to form the actuator body can limit (or completely eliminate) the need for welding the actuator body, thereby limiting associated deformation and increasing the throughput of the process used to manufacture the lift pin actuator. As will be understood by those skilled in the art in light of this disclosure, the use of boring or drilling operations and milling operations to form the actuator body can reduce the time required to manufacture the actuator body, because of the relatively high material removal rate associated with boring or drilling related to milling ceramic materials, thereby limiting the cost of the lifting pin actuator.

[0090] refer to Figure 20 The manufacture of an actuator device (e.g., actuator device 110) is shown. Figure 3 Method 500 (shown) includes positioning a lifting pin actuator on an actuator tube member according to the 3-2-1 positioning method, for example, positioning the lifting pin actuator 200 (shown) on the actuator tube member. Figure 1 As shown) positioned in actuator tube component 300 ( Figure 1 As shown in bracket 502. In this respect, it is conceivable that positioning 502 of the lifting pin actuator includes positioning the lifting pin actuator relative to the actuator tube member at three (3) contact points on the actuator tube member in a first plane orthogonal to the axis of rotation 174, for example, in the first plane 342 (shown). Figure 16 The 3-2-1 positioning method is used in the diagram. Figure 16The three (3) contact points identified are shown in boxes 504 and 512. In another aspect, it is also conceivable that the lifting pin actuator relative to the actuator tube member positioning 502 includes positioning the lifting pin actuator relative to the tube member body at a fourth and fifth contact point located in a second plane parallel to the axis of rotation and orthogonal to the first plane, for example, the second plane 344 (…). Figure 17 Position 3-2-1 (as shown) Figure 16 Two of the six contact points (as shown in the diagram) are shown in box 506.

[0091] It is also conceivable that the lifting pin actuator, relative to the actuator tube component positioning 502, includes positioning the lifting pin actuator at six contact points in a third plane located parallel to the axis of rotation and orthogonal to the first and second planes, for example, at the third plane 346. Figure 18 The 3-2-1 positioning method (as shown) is used in the following example. Figure 16 The sixth of the six contact points identified (as shown in box 508). Positioned according to the 3-2-1 positioning method, the lift pin actuator is clamped to the actuator tube member by gravity, such that the translation and rotation of the lift pin actuator relative to the actuator tube member in the first, second, and third planes are constrained, as shown in box 510. Advantageously, the constrained movement (e.g., rolling and pitching) of the lift pin actuator relative to the actuator tube member during operation is limited (or completely absent), allowing the pad portion of the lift pin actuator to be relatively small. The small pad portion, in turn, limits the shielding of the lift pin actuator on the substrate support, thereby improving the temperature control of the substrate mounted on the substrate support and limiting trans-substrate variations in the material layers deposited on the substrate due to trans-substrate temperature changes.

[0092] Although this disclosure has been provided in the context of certain embodiments and examples, those skilled in the art will understand that this disclosure extends beyond the specifically described embodiments to other alternative embodiments and / or uses of embodiments, as well as their obvious modifications and equivalents. Furthermore, while several variations of embodiments of this disclosure have been shown and described in detail, other modifications based on this disclosure will be apparent to those skilled in the art. It is also contemplated that various combinations or sub-combinations of specific features and aspects of the embodiments may be made and still fall within the scope of this disclosure. It should be understood that various features and aspects of the disclosed embodiments may be combined or substituted with each other to form variations of embodiments of this disclosure. Therefore, it is intended that the scope of this disclosure should not be limited to the specific embodiments described above.

[0093] The headings provided herein (if any) are for convenience only and do not necessarily affect the scope or meaning of the apparatus and methods disclosed herein.

Claims

1. A lifting pin actuator, comprising: The actuator body, arranged along the axis of rotation, has: The hub portion extending around the axis of rotation; A first arm portion and a second arm portion extend outward from the hub portion and in a direction opposite to the axis of rotation, with the second arm portion parallel to the first arm portion; The pad portion is radially separated from the hub portion via a first arm portion and a second arm portion, and the pad portion connects the first arm portion to the second arm portion; The pad portion has a mating surface that is orthogonal to the axis of rotation and coplanar with the first arm portion and the second arm portion of the actuator body, and is configured to drive the lifting pin above the mating surface of the pad portion of the actuator body along the axis of rotation.

2. The lifting pin actuator according to claim 1, wherein, The pad portion is one of three (3) pad portions circumferentially distributed around the hub portion of the actuator body.

3. The lifting pin actuator according to claim 1, wherein, The first arm portion and the second arm portion form the first arm pair of the actuator body, and wherein the actuator body has three (3) arm pairs circumferentially distributed around the hub portion of the actuator body.

4. The lifting pin actuator according to claim 1, wherein, The actuator body is formed of ceramic material, and the actuator body is integrally formed from a single ceramic workpiece using subtractive manufacturing technology.

5. The lifting pin actuator according to claim 1, wherein, The hub portion has an upper surface that defines an upper surface hole therein, a lower surface that defines a mounting hole therein, and an inner surface that connects the upper surface hole to the mounting hole.

6. The lifting pin actuator according to claim 5, wherein, The inner surface of the hub portion defines a plurality of flat surfaces circumferentially distributed around the axis of rotation.

7. The lifting pin actuator according to claim 6, wherein, The plurality of flat surfaces are angled relative to at least one of the upper and lower surfaces at a flat surface angle between about 5 degrees and about 45 degrees.

8. The lifting pin actuator according to claim 6, wherein, The inner surface of the hub portion defines a plurality of arcuate surfaces circumferentially distributed around the axis of rotation, wherein the plurality of arcuate surfaces are substantially parallel to the axis of rotation.

9. The lifting pin actuator according to claim 6, wherein, One or more of the plurality of flat surfaces are defined by an arcuate periphery having a base near the lower surface of the hub portion and an open end near the upper hole of the hub portion, and wherein one or more of the plurality of flat surfaces define a release channel therein extending from the open end to a position between the open end and the base of the arcuate periphery.

10. The lifting pin actuator according to claim 1, wherein, The hub portion of the actuator body has an annular segment and a plurality of toothed segments, wherein the plurality of toothed segments extend axially from the annular segment and wherein the plurality of toothed segments axially separate the first arm portion and the second arm portion from the annular segment of the hub portion.

11. An actuator device, comprising: The lifting pin actuator as described in claim 1; An actuator tube assembly arranged along the axis of rotation, wherein a lifting pin actuator is mounted on the actuator tube assembly; The actuator tube component has an outer surface that defines a plurality of flat facets distributed circumferentially around the axis of rotation; The lifting pin actuator has an inner surface with multiple flat surfaces circumferentially distributed around the rotation axis; and Each of the plurality of flat surfaces defined by the inner surface of the actuator member is adjacent to a corresponding one of the plurality of flat facets defined by the outer surface of the actuator tube member, so as to position the lifting pin actuator on the actuator tube member.

12. The actuator device according to claim 11, wherein, The outer surface of the actuator tube member defines three (3) flat facets, wherein the inner surface of the lifting pin actuator defines three (3) flat facets, and wherein each flat facet radially overlaps with a corresponding one of the plurality of flat facets.

13. The actuator device according to claim 11, wherein, The plurality of flat facets are angled relative to the axis of rotation at a flat facet angle between approximately 5 degrees and approximately 45 degrees, and wherein the plurality of flat facets are angled relative to the axis of rotation at a flat facet angle substantially equal to the flat facet angle.

14. The actuator device according to claim 11, wherein, The outer surface of the actuator tube member defines a plurality of arcuate facets, wherein the inner surface of the lifting pin actuator defines a plurality of arcuate facets, and wherein each of the plurality of arcuate facets radially overlaps with a corresponding one of the plurality of arcuate facets.

15. The actuator device according to claim 14, wherein, Each of the plurality of arcuate surfaces defined by the inner surface of the lifting pin actuator is radially offset from a corresponding one of the plurality of arcuate facets defined by the outer surface of the actuator tube member.

16. The actuator device according to claim 14, wherein, The outer surface of the actuator tube member defines three (3) arcuate facets circumferentially distributed around the axis of rotation, and wherein the inner surface of the lifting pin actuator defines three (3) arcuate facets circumferentially distributed around the axis of rotation.

17. The actuator device of claim 11, further comprising a shaft member disposed within the actuator tube member and supported for rotation about the axis of rotation, wherein, The plurality of flat facets and the plurality of flat surfaces radially overlap with the shaft member.

18. A semiconductor processing system, comprising: Main body of the room; The lifting pin actuator as described in claim 1, arranged within the main body of the room; Actuator tube assembly extending through the lower wall of the chamber body, with a lifting pin actuator mounted on the actuator tube assembly; A shaft member, which is arranged within the actuator tube member and supported to rotate about the axis of rotation; as well as A substrate support, mounted on a shaft member, has multiple lifting pins slidably accommodated therein. The lifting pin actuator is axially arranged between the lower wall of the chamber body and a plurality of lifting pins, and is configured to place the substrate on and remove it from the substrate support.

19. A method for manufacturing a lifting pin actuator, comprising: The lifting pin actuator body is formed from a single workpiece body made of ceramic material using boring or drilling operations and milling operations as follows: Defines the hub portion extending around the axis of rotation; Define a first arm portion and a second arm portion that extend outward from the hub portion and in a direction opposite to the axis of rotation, with the second arm portion being parallel to the first arm portion; A pad portion is defined that is radially separated from the hub portion by the first arm portion and the second arm portion, which connects the first arm portion to the second arm portion; as well as The mating surface of the defining pad portion is orthogonal to the axis of rotation and coplanar with the first and second arm portions of the actuator body. Thus, the mating surface of the pad portion of the actuator body is configured to drive the lifting pin above the mating surface of the pad portion along the axis of rotation.

20. A method of manufacturing an actuator device, comprising: At the lifting pin actuator, the lifting pin actuator includes an actuator body arranged along the rotation axis and has: a hub portion extending around the rotation axis; A first arm portion and a second arm portion extend outward from the hub portion and in a direction opposite to the axis of rotation, with the second arm portion parallel to the first arm portion; The pad portion, which is radially separated from the hub portion by a first arm portion and a second arm portion, connects the first arm portion to the second arm portion. The pad portion has a mating surface that is orthogonal to the axis of rotation and coplanar with the first arm portion and the second arm portion of the actuator body, and is configured to drive the lifting pin above the mating surface of the pad portion of the actuator body along the axis of rotation. The actuator body is positioned relative to the actuator tube component at three contact points. The three contact points are located on the actuator tube component and in a first plane orthogonal to the axis of rotation. The three contact points are distributed around the axis of rotation. The actuator body is positioned relative to the actuator tube member at the fourth and fifth contact points, which are located on the actuator tube member and in a second plane that is parallel to the axis of rotation and orthogonal to the first plane. The actuator body is positioned relative to the actuator tube component at the sixth contact point, which is located on the actuator tube component and in a third plane that is parallel to the axis of rotation and orthogonal to both the first and second planes. as well as Gravity is used to clamp the actuator body to the actuator tube component, thereby constraining the translation and rotation of the lifting pin actuator relative to the actuator tube component in the first, second, and third planes.

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