Chip test data tracing method and system

By calculating the chip processing position sequence to generate RFID data and combining it with video and machine monitoring data, the problem of not being able to accurately locate individual chip test records in existing technologies has been solved. This enables precise location and traceability of chip test data, improving the accuracy and efficiency of chip quality management.

CN120892265APending Publication Date: 2025-11-04SHENZHEN PAISIDI POWER SEMICON CO LTD
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Patent Information

Application Number
CN202510891524.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-30
Publication Date
2025-11-04

AI Technical Summary

Technical Problem

Existing chip testing methods cannot accurately locate the test records of individual chips; they can only determine that there are errors in a certain batch of chips, and cannot trace the source sequentially for batches with low fluctuation values.

Method used

By calculating the processing position sequence of the chip, RFID data is generated. Combined with video and machine monitoring data, the processing path is dynamically adjusted. Multi-source data is integrated for analysis to accurately locate the processing sequence of defective products.

Benefits of technology

It enables precise location of test records for individual chips, traces chip test data, and improves the accuracy and efficiency of chip quality management.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a chip test data traceability method and system, which are applied to the technical field of chip testing, and the method comprises the steps: calculating the subsequent step sequence processing position of a chip according to the step sequence of the processing position of a first batch of chips; after calculation data is obtained, corresponding RFID data are input into corresponding chips of the first batch; obtaining a final chip test result, and positioning a corresponding processing step sequence for the RFID data of the defective product; monitoring data such as corresponding videos and camera positions are called for calculation and analysis; the problems that at present, test data can only be indexed according to thousands to hundreds of thousands of chips in production batches, the test record of a single chip cannot be accurately positioned, and errors of the chips in a certain batch can only be determined, for example, in ten thousands of times of detection, a certain threshold value is always in a fluctuation state, and the test efficiency is low are solved. And the technical problem that the test data of the chips cannot be sequentially traced for batches with low fluctuation valley values is solved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip testing, in particular to a chip testing data tracing method and system. BACKGROUND

[0002] Chip testing usually tracks and records the testing data of each chip through technical means in the production line to ensure that these data can accurately correspond to specific chip individuals, thereby realizing quality tracking and management of the whole life cycle of the chip.

[0003] However, the current chip testing method can only index the testing data of ten to one hundred thousand chips according to the production batch, cannot accurately locate the testing record of a single chip, and can only determine that the chip in a certain batch has errors, for example, in ten thousand detections, it is always in a fluctuating state in terms of a certain threshold, and it is impossible to sequentially trace the testing data of the chip for the batch with low fluctuation valley value. SUMMARY

[0004] The present application aims to solve the technical problem that the testing data of a chip can only be indexed according to ten to one hundred thousand chips according to the production batch, the testing record of a single chip cannot be accurately located, and it can only be determined that the chip in a certain batch has errors, for example, in ten thousand detections, it is always in a fluctuating state in terms of a certain threshold, and it is impossible to sequentially trace the testing data of the chip for the batch with low fluctuation valley value, and provides a chip testing data tracing method and system.

[0005] To solve the technical problem, the present application adopts the following technical means:

[0006] A chip testing data tracing method and system, the method comprising:

[0007] According to the processing position step sequence of the first batch of chips, the processing position of the subsequent step sequence of the chips is calculated;

[0008] After obtaining the calculation data, the corresponding RFID data of the corresponding chips of the first batch is punched in;

[0009] The RFID data of the defective products are positioned according to the final chip testing results;

[0010] And mobilize the monitoring data such as video and camera position to calculate and analyze.

[0011] Further, in the step of calculating the processing position of the subsequent step sequence of the chips according to the processing position step sequence of the first batch of chips,

[0012] The subsequent processing points are dynamically calculated by using the positioning algorithm and the equipment displacement parameters, and the position processing information of the different chips in the first batch is respectively output according to the obtained subsequent processing points.

[0013] Further, in the step of generating the corresponding RFID data into the corresponding chip after obtaining the calculation data of the first batch of chips,

[0014] By obtaining the different step sequence processing positions of each chip in the first batch of chips, the corresponding RFID data is generated and punched into the corresponding chip.

[0015] Further, in the step of generating the corresponding RFID data into the corresponding chip,

[0016] The RFID data includes but is not limited to processing point sequence, processing time, and process completion status.

[0017] Further, in the step of obtaining the final chip test result and positioning the RFID data of the defective product to the corresponding processing step sequence,

[0018] The historical test data of the RFID data of the defective product is called, and according to the data on the RFID data, it is traced back to which step of the production line and the equipment at the corresponding production station fails.

[0019] Further, in the step of calculating and analyzing the corresponding video, camera, and other monitoring data,

[0020] Integrate the video data of the corresponding RFID data station and the monitoring data of the corresponding station equipment to provide more edge data to determine whether the equipment itself or other supporting equipment appears defective.

[0021] A chip test data tracing method and system, the system comprises:

[0022] The processing calculation module calculates the subsequent step sequence processing position of the chip according to the first batch of chip processing position step sequences;

[0023] The label pairing module punches the corresponding RFID data into the corresponding chip according to the first batch of chips corresponding to the calculation data;

[0024] The label information module obtains the final chip test result and positions the RFID data of the defective product to the corresponding processing step sequence;

[0025] The label tracing module calculates and analyzes the corresponding video, camera, and other monitoring data.

[0026] The chip test data tracing method and system provided by the application has the following beneficial effects: the processing position step sequence of the chips in the first batch is calculated, the corresponding RFID data of the chips in the first batch is obtained after the calculation data is obtained, the RFID data of the defective products is positioned according to the processing step sequence of the final chip test results, and the corresponding video, camera position and other monitoring data are calculated and analyzed, so that the technical problem that only the production batch number can be used to index the test data of ten thousand to one hundred thousand chips, the test record of a single chip cannot be accurately positioned, and it is only determined that there is an error in the chips in a certain batch, for example, in ten thousand detections, the chips are in a fluctuating state in a certain threshold, and the test data of the chips cannot be traced in sequence according to the batch with a low fluctuation valley. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 The flowchart of an embodiment of the chip test data tracing method and system of the application.

[0028] The purpose, functional features and advantages of the application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0029] It should be understood that the specific embodiments described herein are merely intended to explain the application and are not intended to limit the application.

[0030] The technical solutions in the embodiments of the application will be described clearly and completely in the embodiments of the application with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the application, but not all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the application.

[0031] It should be noted that the terms "include", "contain" and "have" in the specification and claims of the application and the above-mentioned drawings are intended to cover the non-exclusive inclusion. For example, the process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but optionally includes the steps or units not listed, or optionally includes other steps or units inherent to the process, method, product or device. The terms such as "first" and "second" and the like in the claims, specification and drawings of the application are only used to distinguish one entity / operation / object from another entity / operation / object, and do not necessarily require or imply any actual relationship or sequence between the entities / operations / objects.

[0032] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive of one another. As will be apparent to those of ordinary skill in the art, embodiments described herein can be combinable with other embodiments.

[0033] Reference is made to the accompanying drawings that form a part of this Figure 1 A flow chart of a chip test data traceability method and system in an embodiment of the application;

[0034] Embodiment one

[0035] A chip test data traceability method and system, the method comprising:

[0036] calculating the processing position of the subsequent step of the chip according to the processing position of the first batch of chips;

[0037] After obtaining the calculation data, the corresponding chip of the first batch is punched into the corresponding RFID data;

[0038] Obtaining the final chip test result, positioning the RFID data of the defective product to the corresponding processing step;

[0039] And mobilize the corresponding video, camera, etc. Monitoring data for calculation and analysis.

[0040] In the step of calculating the processing position of the subsequent step of the chip according to the processing position of the first batch of chips in the embodiment,

[0041] The subsequent processing point is dynamically calculated by using the positioning algorithm and the equipment displacement parameter, and the position processing information is output according to the obtained subsequent processing point and for different chips in the first batch.

[0042] Specifically,

[0043] In the process of chip processing, during multi-batch and high-precision packaging, the dynamic matching of the initial processing position and the subsequent process is the key to ensure the yield. The traditional method relies on fixed step or manual setting, which is difficult to adapt to the micro deformation of different chips and the displacement error of equipment;

[0044] To solve the above problems, the initial processing position coordinates are obtained based on a high-resolution vision system, the mapping relationship between the chip individual and the processing step is established, the initial positioning point image is grayed, the binarization value is determined through histogram analysis, then the largest area of the connected domain is extracted as the reference chip, the center coordinates are calculated, and the displacement noise caused by camera vibration is compensated by introducing a gyroscope sensor, so as to ensure the accuracy of the initial coordinates.

[0045] Wherein, combined with the mechanical parameters of the device and real-time feedback, the pitch value is dynamically adjusted to avoid cumulative error.

[0046] Pitch calculation: according to the accuracy of the device stepping motor and the wafer processing direction, the following is the definition of the pitch formula N1=\frac{\text{target position X}-\text{initial position X}}{\text{single step displacement of stepping motor}}+\Delta_{\text{compensation}}};

[0047] Wherein, delta compensation is obtained by historical processing error data regression;

[0048] If the chip in the camera field of view is not complete, trigger the pitch self-adaptive adjustment module, and correct the displacement amount in real time through the PID algorithm.

[0049] In addition,

[0050] Subsequent processing point generation and chip individual mapping are realized through coordinate exchange and data binding.

[0051] 1. Convert the initial positioning point coordinates (X0, Y0) to the origin of the global coordinate system.

[0052] 2. Based on the device displacement parameters, the processing position of the i-th chip is calculated according to the following matrix:

[0053]

[0054] Wherein, N k , M k is the dynamically adjusted pitch parameter;

[0055] In this way, the change of the processing path can be dynamically calculated and optimized in real time.

[0056] In the embodiment, after the calculation data is obtained, the corresponding chips in the first batch are punched into the corresponding RFID data in the step of

[0057] After obtaining the different step sequence processing positions of each chip in the first batch of chips, the corresponding RFID data is punched into the corresponding chips.

[0058] In the step of generating corresponding RFID data and punching into the corresponding chip,

[0059] The RFID data includes but is not limited to processing point order, processing time, and process completion status.

[0060] Specifically,

[0061] Construct a structured data packet, including the following fields:

[0062]

[0063] Chunk processing: split the data packet by 16 bytes, and use batch writing mechanism for the excess part, write 1-2 sectors per batch;

[0064] AES-128 encryption: encrypt each data block, and the key is dynamically generated through the device unique identifier;

[0065] Redundant design:

[0066] Key data is stored repeatedly in multiple sectors to prevent single-point data damage;

[0067] Additional CRC16 check code, verify data integrity before writing;

[0068] So as to write the corresponding processing point order, processing time, and process completion state into the corresponding RFID, so as to trace back and find the data.

[0069] In the embodiment, in the step of positioning the corresponding processing step sequence of the RFID data of the defective product according to the final chip test result,

[0070] The historical test data of the RFID data of the defective product is called, and it is traced back to which step of the production line and the corresponding production position of the equipment that fails according to the data on the RFID data.

[0071] In the step of calculating and analyzing the corresponding video and camera monitoring data,

[0072] Integrate the video data of the corresponding RFID data of the station and the monitoring data of the corresponding station equipment to provide more edge data to determine whether the equipment itself or other supporting equipment is abnormal.

[0073] Specifically,

[0074] In the semiconductor manufacturing scene, the station equipment failure may be caused by the device itself or the coordinated abnormality of the supporting equipment. The traditional method relies on a single data source, and it is difficult to accurately locate the problem source;

[0075] In order to solve the above problems,

[0076] Hardware deployment

[0077] RFID reader / writer: deployed at the entrance of the station, reads the RFID tag of the chip carrier, and generates a station activation signal with a timestamp when an event is triggered;

[0078] Industrial camera: use a global shutter camera with a frame rate of 60fps, covering the station operation area;

[0079] Device sensor: Collect vibration, temperature, current, etc. Parameters, upload to edge gateway through Modbus protocol;

[0080] Time synchronization

[0081] Synchronize RFID reader, camera, sensor clock based on NTP protocol, error ≤10ms;

[0082] When RFID event is triggered, record the trigger time T0, and intercept the video stream and device data in the [T0-28, T0+58] time window.

[0083] Extract key features through edge computing to reduce cloud load;

[0084] Video data analysis:

[0085] Operation compliance detection: Use YOLOv5s model to detect real-time mechanical arm grabbing angle, chip placement position deviation, output abnormal frame number and deviation value;

[0086] Action timing analysis: Calculate the mechanical arm motion trajectory by optical flow method, compare with the standard action template, and generate the trajectory similarity index;

[0087] Device data modeling:

[0088] SPC control chart: Wavelet transform is used to extract frequency energy of vibration signal. If the energy of a certain frequency band exceeds 3σ control limit, it is determined that the device is abnormal;

[0089] Linkage device influence analysis: Calculate the beat synchronization rate of the current station and the upstream station, formula:

[0090] Synchronization rate = 1- standard beat time | current station arrival time- upstream station completion time |

[0091] Trigger alarm when synchronization rate <0.9;

[0092] In the logic of bad root cause determination,

[0093] Based on evidence theory, fuse multi-source data and quantify the influence weight of the device itself and the matching device;

[0094] Evidence generation:

[0095] Device self-fault evidence E1: SPC control chart abnormal (weight 0.4) + current fluctuation overrun (weight 0.3)

[0096] Matching device linkage evidence: Mechanical arm trajectory similarity <0.8 (weight 0.5) + beat synchronization rate <0.9 (weight 0.4);

[0097] Fusion rule:

[0098]

[0099] The conflict factor is determined by the time overlap of the video and sensor data;

[0100] The determination output is:

[0101] If the E1 confidence is greater than 0.7: the positioning is the device main shaft bearing wear or power module failure;

[0102] If the E2 confidence is greater than 0.6: the mechanical arm and the conveyor belt are determined to be misaligned in cooperation, and the PLC timing parameters need to be adjusted;

[0103] In summary, through the high-precision camera and the compensation algorithm, the position error of each chip in the processing is minimized, and the gyroscope is used to real-time dithering. The RFID data, the processing path, the timestamp, and the device state are all encrypted and protected, and the data will not be lost due to the workshop or strong electromagnetic interference. If there is a defective product, the historical trajectory can be retrieved through the RFID data on the chip, the video playback can capture abnormal actions, and the device sensor can compare parameters. Three-way evidence cross-validation is used to obtain the cause of the defective product.

[0104] A chip test data tracing method and system, the system comprises:

[0105] A processing calculation module calculates the subsequent step processing position of the chips in the first batch according to the first batch chip processing position step sequence.

[0106] A label pairing module obtains the corresponding RFID data of the corresponding chips in the first batch after calculating the data.

[0107] A label information module obtains the RFID data positioning corresponding processing step sequence of the defective product according to the final chip test result.

[0108] A label tracing module is used to mobilize the corresponding video, camera, and other monitoring data for calculation and analysis.

[0109] Those skilled in the art should understand that the embodiments of the present application can be provided as a method, a system, or a computer program product. Therefore, the present application can be in the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present application can be in the form of a computer program product implemented on one or more computer usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer usable program code.

[0110] The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart Figure 1 one or more functions specified in the flowchart or multiple flows and / or block Figure 1 one or more functions specified in the flowchart or multiple flows and / or block

[0111] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instructions which implement the function specified in the flowchart Figure 1 one or more functions specified in the flowchart or multiple flows and / or block Figure 1 one or more functions specified in the flowchart or multiple flows and / or block

[0112] These computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart Figure 1 one or more functions specified in the flowchart or multiple flows and / or block Figure 1 one or more functions specified in the flowchart or multiple flows and / or block

[0113] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary of the principles and application of the present application. Numerous modifications and adaptions can be made by those skilled in the art without departing from the scope of the present application.

Claims

1. A method and system for tracing chip test data, characterized in that, The method includes: Calculate the processing positions of subsequent chip steps based on the processing position sequence of the first batch of chips; After obtaining the calculation data, the corresponding RFID data is entered into the corresponding chip of the first batch; Obtain the final chip test results to locate the corresponding processing steps using RFID data of defective products; It also mobilizes corresponding video, camera position and other monitoring data for calculation and analysis.

2. The chip test data traceability method and system according to claim 1, characterized in that, In the step of calculating the processing positions of subsequent chip steps based on the processing position sequence of the first batch of chips... The subsequent processing points are dynamically calculated using positioning algorithms and equipment displacement parameters. Based on the obtained subsequent processing points, position processing information is output for different chips in the first batch.

3. The chip test data traceability method and system according to claim 1, characterized in that, In the step of acquiring the calculated data and then inserting the corresponding RFID data into the corresponding chip of the first batch, After obtaining the different processing positions of each chip in the first batch of chips, the corresponding RFID data is generated and injected into the corresponding chip.

4. The chip test data traceability method and system according to claim 3, characterized in that, In the step of generating the corresponding RFID data and inserting it into the corresponding chip... The RFID data includes, but is not limited to, processing point sequence, processing time, and process completion status.

5. The chip test data traceability method and system according to claim 1, characterized in that, In the step of obtaining the final chip test results and locating the corresponding processing steps based on the RFID data of defective products, For defective products, retrieve historical test data from the RFID data, and trace back to which step of the production line and the corresponding equipment at the production station malfunctioned.

6. The chip test data traceability method and system according to claim 1, characterized in that, In the step of calculating and analyzing the corresponding video, camera position, and other monitoring data... By integrating video data from the corresponding RFID data workstations and monitoring data from the corresponding workstation equipment, more edge data can be provided to determine whether the malfunction is caused by the equipment itself or by its interaction with other supporting equipment.

7. A method and system for tracing chip test data, characterized in that, The system includes: The processing calculation module calculates the processing positions of subsequent chip steps based on the processing position sequence of the first batch of chips. The tag pairing module acquires the calculated data and then inserts the corresponding RFID data into the corresponding chip in the first batch. The tag information module obtains the final chip test results and locates the corresponding processing steps based on the RFID data of defective products; The tag-based traceability module utilizes corresponding video and camera location monitoring data for calculation and analysis.