Deviation correction system and method and thin film deposition equipment

Abstract

The invention provides a deviation correction system, a deviation correction method, thin film deposition equipment and a computer readable storage medium. A deviation correction system comprises a learning tool, an automatic wafer calibration device, an image sensor and a controller. The learning tool is provided with a plurality of calibration points. And the image sensor is arranged above the learning tool and is used for acquiring coordinates of the calibration points on the learning tool. The controller is configured to transmit a learning tool into the automatic wafer calibration device for primary compensation of position offset, acquire coordinates of the calibration points of the learning tool through the image sensor, calculate a secondary compensation value of the automatic wafer calibration device according to the coordinates of the calibration points, and calculate the secondary compensation value of the automatic wafer calibration device according to the secondary compensation value of the automatic wafer calibration device. And adjusting the zero point of the automatic wafer calibration device to a standard zero point position.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a bias correction system, a bias correction method, a thin film deposition apparatus, and a computer-readable storage medium. Background Technology

[0002] In precision manufacturing fields such as semiconductor manufacturing, Automated Wafer Centering (AWC) is a crucial step in ensuring process accuracy. Its operation typically involves: a transport mechanism picking up a wafer from a wafer storage device or preceding workstation and transferring it to the AWC inspection area; AWC sensors using optical or mechanical methods to detect parameters such as the wafer's edge position and center offset, feeding back the detected positional deviation data relative to a preset standard value to the control system; the control system sending adjustment commands to the transport mechanism based on this deviation data; and the transport mechanism completing precise wafer centering through rotation and fine-tuning, followed by transferring the centered wafer to the target workstation. In this process, the transport mechanism handles the physical handling and coarse positioning of the wafer, while AWC provides high-precision position detection and correction benchmarks. Together, they ensure that the wafer's transfer accuracy between processes meets process requirements.

[0003] However, during long-term operation, the conveyor mechanism inevitably experiences mechanical wear due to the repeated execution of multi-degree-of-freedom movements such as rotation, lifting, extension, and retraction. As wear accumulates, the actual motion trajectory of the conveyor mechanism deviates from the theoretical trajectory, resulting in mechanical errors. These errors directly lead to a decrease in the positioning accuracy of the conveyor mechanism when transporting wafers. Even if the AWC sensor can detect and report the wafer position deviation in real time, the mechanical error of the conveyor mechanism itself may exceed the single correction range of the AWC, or result in residual deviations after correction, ultimately affecting the wafer transfer accuracy and adversely impacting the stability and consistency of the process.

[0004] In order to overcome the above-mentioned defects in the existing technology, there is an urgent need in the field for a correction technology to correct the systematic deviation caused by mechanical wear, thereby improving the wafer transfer accuracy of the thin film deposition process and improving the stability and consistency of the process. Summary of the Invention

[0005] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0006] To overcome the aforementioned deficiencies in the prior art, the present invention provides a bias correction system, a bias correction method, a thin film deposition apparatus, and a computer-readable storage medium for correcting systematic deviations caused by mechanical wear, thereby improving the wafer transfer accuracy of the thin film deposition process and enhancing the stability and consistency of the process.

[0007] Specifically, according to a first aspect of the present invention, a correction system includes: a learning fixture having a plurality of calibration points thereon; an automatic wafer calibration device; an image sensor disposed above the learning fixture for acquiring the coordinates of each of the calibration points on the learning fixture; and a controller configured to: transmit the learning fixture to the automatic wafer calibration device for initial compensation of positional offset, acquire the coordinates of each of the calibration points on the learning fixture via the image sensor, and calculate a secondary compensation value of the automatic wafer calibration device based on the coordinates of each of the calibration points, so as to adjust the zero point of the automatic wafer calibration device to a standard zero point position.

[0008] Furthermore, in some embodiments of the present invention, the step of transmitting the learning fixture to the automatic wafer calibration device for initial position offset compensation includes: obtaining, via the automatic wafer calibration device, the coordinates of the first transfer position where the learning fixture is located and the coordinates of a preset standard transfer position; determining the initial compensation value for automatic wafer calibration based on the coordinates of the first transfer position and the coordinates of the standard transfer position; and the automatic wafer calibration device moving the learning fixture to a second transfer position based on the initial compensation value.

[0009] Furthermore, in some embodiments of the present invention, the step of calculating the secondary compensation value of the automatic wafer calibration device based on the coordinates of each of the calibration points includes: obtaining the first calibration coordinates of the plurality of calibration points on the learning fixture located at the second wafer transfer position via the image sensor; and calculating the difference between the first calibration coordinates and the standard calibration coordinates based on the preset standard calibration coordinates of the plurality of calibration points to obtain the secondary compensation value.

[0010] Furthermore, in some embodiments of the present invention, after calculating the difference between the first calibration coordinate and the standard calibration coordinate to obtain the secondary compensation value, the controller further includes the following steps: adding the secondary compensation value to the initial compensation value to obtain the correction value of the automatic wafer calibration device; and adjusting the zero point of the automatic wafer calibration device to the standard zero point position according to the correction value.

[0011] Furthermore, in some embodiments of the present invention, the step of obtaining the preset standard calibration coordinates of the plurality of calibration points includes: pre-placing the learning fixture in the standard transfer position; and obtaining the coordinates of the plurality of calibration points on the learning fixture via the image sensor to obtain the preset standard calibration coordinates of the plurality of calibration points.

[0012] Furthermore, in some embodiments of the present invention, before the learning fixture is introduced into the automatic wafer calibration device for initial compensation of position offset, the controller further includes: acquiring the calibration count of the automatic wafer calibration device; introducing the wafer to be processed into the first transfer position in response to the calibration count being less than a preset count threshold; and introducing the learning fixture into the first transfer position in response to the calibration count being greater than the preset count threshold.

[0013] Furthermore, in some embodiments of the present invention, the correction system further includes: a transport teaching fixture, which is detachably connected to the learning fixture and used for transporting the learning fixture.

[0014] Furthermore, in some embodiments of the present invention, the central region of the learning tool has a plurality of first pin holes arranged in a ring, and the transport teaching tool and the learning tool are positioned by at least two first pins, wherein the at least two first pins are symmetrical with respect to the center of the learning tool.

[0015] Furthermore, the thin film deposition apparatus provided according to a second aspect of the present invention includes: a transfer base plate having a first end connected to a transfer mechanism and a second end fixedly connected to a learning fixture via a second pin for transferring the learning fixture; and a correction system as described in any one of the first aspects of the present invention.

[0016] Furthermore, the correction method provided by the third aspect of the present invention includes the following steps: transmitting the learning fixture in the correction system as described in any one of the first aspects of the present invention into the automatic wafer calibration device for initial compensation of position offset; and obtaining the coordinates of each of the calibration points of the learning fixture via the image sensor, and calculating the secondary compensation value of the automatic wafer calibration device based on the coordinates of each of the calibration points, so as to adjust the zero point of the automatic wafer calibration device to the standard zero point position.

[0017] Furthermore, according to the fourth aspect of the present invention, a computer-readable storage medium has computer instructions stored thereon. When the computer instructions are executed by a processor, the correction method as described in the third aspect of the present invention is implemented. Attached Figure Description

[0018] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0019] Figure 1 A schematic diagram of a thin film deposition apparatus provided according to some embodiments of the present invention is shown.

[0020] Figure 2 A schematic diagram of the structure of a learning tooling provided according to some embodiments of the present invention is shown.

[0021] Figure 3 A schematic diagram of the structure of a transport teaching fixture provided according to some embodiments of the present invention is shown.

[0022] Figure 4 A schematic diagram of the structure of a first pin provided according to some embodiments of the present invention is shown.

[0023] Figure 5 A flowchart illustrating a correction method provided according to some embodiments of the present invention is shown.

[0024] Figure 6 A schematic diagram of the initial compensation process provided according to some embodiments of the present invention is shown.

[0025] Figure 7 A schematic diagram of a secondary compensation process provided according to some embodiments of the present invention is shown.

[0026] Figure label:

[0027] 10. Learning work clothes

[0028] 11 First pin hole

[0029] 12 Calibration Points

[0030] 20 Image Sensors

[0031] 30 Handling and Demonstration Equipment

[0032] 31 First Pin

[0033] 40 Conveyor base plate

[0034] 41 Second Pin Detailed Implementation

[0035] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0036] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0037] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0038] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0039] As mentioned above, during long-term operation, the conveyor mechanism inevitably experiences mechanical wear due to the repeated execution of multi-degree-of-freedom movements such as rotation, lifting, extension, and retraction. With accumulated wear, the actual motion trajectory of the conveyor mechanism deviates from its theoretical trajectory, resulting in mechanical errors. These errors directly lead to a decrease in the positioning accuracy of the conveyor mechanism when transporting wafers. Even if the Auto Wafer Centering (AWC) sensor can detect and report the wafer's positional deviation in real time, the mechanical error of the conveyor mechanism itself may exceed the single-correction range of the AWC, or result in residual deviations after correction, ultimately affecting the wafer transfer accuracy and consequently adversely impacting the stability and consistency of the process.

[0040] To overcome the aforementioned deficiencies in the prior art, the present invention provides a bias correction system, a bias correction method, a thin film deposition apparatus, and a computer-readable storage medium for correcting systematic deviations caused by mechanical wear, thereby improving the wafer transfer accuracy of the thin film deposition process and enhancing the stability and consistency of the process.

[0041] In some non-limiting embodiments, the polarization correction system provided in the first aspect of the present invention can be configured within the thin film deposition apparatus provided in this aspect. The polarization correction method provided in the third aspect of the present invention can be implemented based on the polarization correction system provided in the first aspect of the present invention. Specifically, the polarization correction system is configured with a memory and a controller. The memory includes, but is not limited to, the computer-readable storage medium provided in the fourth aspect of the present invention, on which computer instructions are stored. The controller is connected to the memory and configured to execute the computer instructions stored in the memory to implement the polarization correction method provided in the third aspect of the present invention.

[0042] Please refer to the details. Figure 1 , Figure 1 A schematic diagram of a thin film deposition apparatus provided according to some embodiments of the present invention is shown.

[0043] like Figure 1 As shown, the thin film deposition equipment includes a transfer base plate 40 and a web guiding system. Specifically, the first end of the transfer base plate 40 is connected to a transfer mechanism, and its second end is fixedly connected to a learning fixture 10 via a second pin 41. During the web guiding operation, the learning fixture 10 is transferred via the transfer mechanism. Correspondingly, during the thin film deposition process in this equipment, the transfer mechanism can also be used to transfer wafers to the working position of the thin film deposition process. Here, the transfer mechanism can be a vacuum robot.

[0044] Please refer to Figures 2-4 , Figure 2 A schematic diagram of the structure of a learning tooling provided according to some embodiments of the present invention is shown. Figure 3 A schematic diagram of the structure of a transport teaching fixture provided according to some embodiments of the present invention is shown. Figure 4 A schematic diagram of the structure of a first pin provided according to some embodiments of the present invention is shown.

[0045] like Figures 2-4 As shown, the correction system includes a learning fixture 10, an automatic wafer calibration device, an image sensor 20, a handling teaching fixture 30, and a controller.

[0046] The learning fixture 10 is provided with multiple calibration points 12. The transport teaching fixture 30 is detachably connected to the learning fixture 10 and is used to transport the learning fixture 10. Here, the learning fixture 10 can be set to be close to the weight of the actual wafer, so as to make the suspension angle consistent during transport by the transfer mechanism, which is beneficial for correction.

[0047] Furthermore, the central area of ​​the learning fixture 10 can adopt a hollow structure to reduce its weight. The central area of ​​the learning fixture 10 has multiple annularly arranged first pin holes 31. The teaching fixture 30 and the learning fixture 10 are positioned via at least two first pins 31, wherein at least two first pins 31 are symmetrical with respect to the center of the learning fixture 10. Thus, the relative angle between the learning fixture 10 and the teaching fixture 30 remains constant, thereby enabling precise transport of the learning fixture 10 and avoiding false AWC alarms caused by the weight reduction area.

[0048] The image sensor 20 is positioned above the learning fixture 10 and is used to acquire the coordinates of each calibration point 12 on the learning fixture 10. Preferably, the image sensor 20 is a charge-coupled device (CCD) camera.

[0049] The controller is configured to: transmit the learning fixture 10 to the automatic wafer calibration device for initial compensation of positional offset; acquire the coordinates of each calibration point 12 of the learning fixture 10 via the image sensor 20; and calculate the secondary compensation value of the automatic wafer calibration device based on the coordinates of each calibration point 12, so as to adjust the zero point of the automatic wafer calibration device to the standard zero point position. Here, the zero point is the system's preset reference origin. The system determines whether the wafer is accurately placed by comparing the deviation between the actual position of the wafer and the zero point.

[0050] In some embodiments, the correction system configures a learning fixture 10 and an image sensor 20 for the automatic wafer calibration device. The image sensor 20 acquires the coordinates of each calibration point 12 on the learning fixture 10, and establishes a data closed loop with the initial correction value of the AWC device, thereby performing secondary compensation on the initial correction value of the automatic wafer calibration device. Thus, the correction system can correct systematic deviations caused by mechanical wear, thereby improving the wafer transfer accuracy of the thin film deposition process, and further enhancing the stability and consistency of the process.

[0051] The working principle of the above-mentioned correction system and thin film deposition equipment will be described below with reference to some embodiments of correction methods. Those skilled in the art will understand that these embodiments of correction methods are merely non-limiting implementation methods provided by the present invention, intended to clearly demonstrate the main concepts of the invention and provide specific solutions convenient for public implementation, rather than limiting all functions or operating modes of the correction system and thin film deposition equipment. Similarly, the correction system and thin film deposition equipment are also merely non-limiting implementation methods provided by the present invention, and do not constitute a limitation on the implementing entity or execution order of the steps in the correction method.

[0052] Please refer to Figures 5-7 , Figure 5 A flowchart illustrating a correction method provided according to some embodiments of the present invention is shown. Figure 6 A schematic diagram of the initial compensation process provided according to some embodiments of the present invention is shown. Figure 7 A schematic diagram of a secondary compensation process provided according to some embodiments of the present invention is shown.

[0053] like Figure 5 As shown, the correction system can first perform step S1: input the learning fixture 10 into the automatic wafer calibration device for initial compensation of position offset.

[0054] like Figure 6 As shown, the controller of the wafer correction system can execute step S11: via the automatic wafer calibration device, obtain the coordinates of the first transfer position where the learning fixture 10 is located and the coordinates of the preset standard transfer position. Then, the controller of the wafer correction system can execute step S12: based on the coordinates of the first transfer position and the coordinates of the standard transfer position, determine the initial compensation value for automatic wafer calibration. Next, the controller of the wafer correction system can execute step S13: the automatic wafer calibration device moves the learning fixture 10 to the second transfer position according to the initial compensation value.

[0055] Here, the learning fixture 10 is transferred to the first wafer transfer position, awaiting routine initial compensation by the automated wafer calibration device. After compensation via AWC, the learning fixture 10 is transferred to the second wafer transfer position, which has undergone AWC compensation. However, due to mechanical errors in the transfer mechanism during long-term operation, this second wafer transfer position is not the same as the standard wafer transfer position and requires secondary compensation to correct systematic deviations caused by mechanical wear. This improves the wafer transfer accuracy of the thin film deposition process, thereby enhancing process stability and consistency.

[0056] Please continue to refer to this. Figure 5 After the learning fixture 10 is fed into the automatic wafer calibration device for initial position offset compensation, the correction system can continue to execute step S2: obtain the coordinates of each calibration point 12 of the learning fixture 10 via the image sensor 20, and calculate the secondary compensation value of the automatic wafer calibration device based on the coordinates of each calibration point 12, so as to adjust the zero point of the automatic wafer calibration device to the standard zero point position.

[0057] like Figure 7 As shown, the controller of the correction system can first execute S21: via the image sensor 20, acquire the first calibration coordinates of multiple calibration points 12 on the learning fixture 10 at the second transfer position.

[0058] Then, the controller of the correction system can execute S22: calculate the difference between the first calibration coordinate and the standard calibration coordinate based on the preset standard calibration coordinates of multiple calibration points 12, so as to obtain the secondary compensation value.

[0059] Here, the step of obtaining the preset standard calibration coordinates of the multiple calibration points 12 may include: placing the learning fixture 10 in the standard transfer position beforehand. Then, the coordinates of the multiple calibration points 12 on the learning fixture 10 are obtained via the image sensor 20 to obtain the preset standard calibration coordinates of the multiple calibration points 12.

[0060] Then, the controller of the correction system can also execute step S23: add the secondary compensation value to the primary compensation value to obtain the correction value of the automatic wafer calibration device.

[0061] Then, the controller of the correction system can also perform step S24: adjust the zero point of the automatic wafer calibration device to the standard zero point position according to the correction value.

[0062] Furthermore, before the learning fixture 10 is transferred to the automatic wafer calibration device for initial compensation of positional offset, the controller of the correction system can also perform the following steps: acquiring the calibration count of the automatic wafer calibration device; in response to the calibration count being less than a preset threshold, transferring the wafer to be processed to the first transfer position; correspondingly, in response to the calibration count being greater than the preset threshold, transferring the learning fixture 10 to the first transfer position. Thus, the correction device can perform correction after the conveyor mechanism has operated for a certain period and the mechanical error has accumulated to a quantifiable level, promptly correcting systematic deviations caused by mechanical wear, thereby improving the wafer transfer accuracy of the thin film deposition process and enhancing the stability and consistency of the process.

[0063] In summary, the web correction system, web correction method, thin film deposition equipment, and computer-readable storage medium provided by this invention can be used to correct systematic deviations caused by mechanical wear, thereby improving the wafer transfer accuracy of the thin film deposition process and enhancing the stability and consistency of the process.

[0064] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0065] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A deviation correction system, characterized in that, include: The training equipment has multiple calibration points on it; Automatic wafer calibration device; An image sensor is disposed above the learning fixture and is used to acquire the coordinates of each calibration point on the learning fixture; as well as The controller is configured to: transmit the learning fixture to the automatic wafer calibration device for initial compensation of position offset; and acquire the coordinates of each of the calibration points of the learning fixture via the image sensor, and calculate the secondary compensation value of the automatic wafer calibration device based on the coordinates of each of the calibration points, so as to adjust the zero point of the automatic wafer calibration device to the standard zero point position.

2. The correction system as described in claim 1, characterized in that, The step of transmitting the learning fixture to the automatic wafer calibration device for initial position offset compensation includes: The coordinates of the first transfer position where the learning tooling is located and the coordinates of the preset standard transfer position are obtained through the automatic wafer calibration device. Based on the coordinates of the first wafer transfer position and the coordinates of the standard wafer transfer position, determine the initial compensation value for automatic wafer calibration; and The automatic wafer calibration device moves the learning fixture to the second wafer transfer position according to the initial compensation value.

3. The correction system as described in claim 2, characterized in that, The step of calculating the secondary compensation value of the automatic wafer calibration device based on the coordinates of each calibration point includes: The first calibration coordinates of the plurality of calibration points on the learning fixture located at the second transfer position are obtained via the image sensor; and Based on the preset standard calibration coordinates of the plurality of calibration points, the difference between the first calibration coordinate and the standard calibration coordinate is calculated to obtain the secondary compensation value.

4. The correction system as described in claim 3, characterized in that, After calculating the difference between the first calibration coordinate and the standard calibration coordinate to obtain the secondary compensation value, the controller further includes the following steps: The secondary compensation value is added to the primary compensation value to obtain the correction value of the automatic wafer calibration device; and Based on the correction value, the zero point of the automatic wafer calibration device is adjusted to the standard zero point position.

5. The correction system as described in claim 3, characterized in that, The steps for obtaining the preset standard calibration coordinates of the plurality of calibration points include: The learning fixture is pre-placed at the standard transfer position; and The coordinates of multiple calibration points on the learning fixture are obtained via the image sensor to obtain the preset standard calibration coordinates of the multiple calibration points.

6. The correction system as described in claim 2, characterized in that, Before the learning fixture is fed into the automatic wafer calibration device for initial position offset compensation, the controller further includes: The calibration count of the automatic wafer calibration device is obtained; In response to the calibration count being less than a preset threshold, the wafer to be processed is transferred to the first wafer transfer position; and In response to the calibration count exceeding a preset threshold, the learning tool is transmitted to the first transfer position.

7. The correction system as described in claim 1, characterized in that, Also includes: A transport demonstration fixture, which is detachably connected to the learning fixture, is used to transport the learning fixture.

8. The correction system as described in claim 7, characterized in that, The central area of ​​the learning tool has a plurality of first pin holes arranged in a ring. The transport teaching tool and the learning tool are positioned by at least two first pins, wherein the at least two first pins are symmetrical with respect to the center of the learning tool.

9. A thin film deposition apparatus, characterized in that, include: A conveying base plate has a first end connected to a conveying mechanism and a second end fixedly connected to a learning fixture via a second pin, for conveying the learning fixture. as well as The correction system as described in any one of claims 1 to 8.

10. A method for correcting deviations, characterized in that, Includes the following steps: The learning fixture in the correction system as described in any one of claims 1 to 8 is fed into the automatic wafer calibration device for initial compensation of positional offset; and The coordinates of each calibration point of the learning fixture are obtained via the image sensor, and the secondary compensation value of the automatic wafer calibration device is calculated based on the coordinates of each calibration point, so as to adjust the zero point of the automatic wafer calibration device to the standard zero point position.

11. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the processor, the correction method as described in claim 10 is implemented.

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