Manufacturing method of glass substrate

Abstract

The invention discloses a manufacturing method of a glass substrate suitable for the display industry and the semiconductor field. The manufacturing method comprises the following steps: S1, forming an electrode circuit of a pure copper plate allowing current to flow through an electrode material through precision machining and photoetching; s2, melting the glass into semi-liquid glass under high-temperature and vacuum conditions, and combining the cylindrical surface of the pure copper plate with the semi-liquid glass to form a glass-pure copper plate (electrode) joint; s3, after cooling and molding, polishing the surface of a conjugate according to application, and manufacturing a glass substrate; and through vacuum high-temperature melting combination and a polishing process, micron-level surface flatness is realized, and strict requirements of high-end display panels and advanced semiconductor packaging are met.

Description

Technical Field

[0001] This invention relates to a glass substrate, and more particularly to a method for manufacturing a glass substrate suitable for the display industry and the semiconductor field. Background Technology

[0002] Glass substrates are a core material in the flat panel display industry and semiconductor packaging. They are thin sheets of glass made primarily from raw materials such as quartz sand (glass), and their surface flatness must reach the micrometer level, while their coefficient of thermal expansion must be similar to that of silicone. This material is widely used in display technology and semiconductor manufacturing, providing a pixel-by-pixel mounting platform for displays or semiconductor components.

[0003] Traditionally, glass substrates are mainly manufactured using the through-glass via (TGV) method. However, this method has several problems in the production process: first, laser and etching processes can easily cause microcracks or internal stress in the glass substrate, which can lead to breakage of the glass substrate in subsequent processes; second, the manufacturing process is complex and time-consuming, resulting in increased production costs.

[0004] Therefore, there is an urgent need for a new method for manufacturing glass substrates to solve the above-mentioned technical problems. Summary of the Invention

[0005] This invention overcomes the shortcomings of the prior art and provides a method for manufacturing a glass substrate.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a method for manufacturing a glass substrate, comprising the following steps:

[0007] S1. An electrode circuit is formed on a pure copper plate that allows current to flow through the electrode material through etching, polishing and photolithography.

[0008] S2. After melting the glass into a semi-liquid glass under vacuum and high temperature conditions, the cylindrical surface of the pure copper plate with printed circuits is bonded to the semi-liquid glass by pressure, so that a circuit combination is formed in the glass.

[0009] S3. After cooling and molding, the surface of the assembly is polished according to the intended use to manufacture a glass substrate.

[0010] In a preferred embodiment of the present invention, in step S1, the required electrode circuit is constructed by processing and photolithography techniques.

[0011] In a preferred embodiment of the present invention, the linewidth and height of the electrode circuit are designed to be on the order of tens to hundreds of micrometers, and can be customized according to customer needs; in the manufacturing of the glass substrate, the processing environment temperature needs to be controlled below 1000°C, and the temperature parameters are adjusted to adapt to the thermal properties of different glass materials; the manufacturing process needs to be completed in a vacuum chamber, and the glass substrate and electrode circuit are tightly bonded by applying controllable pressure.

[0012] In a preferred embodiment of the present invention, the cooling forming process is carried out in a vacuum chamber using an additional cooling line to achieve cooling through staged temperature control without causing adverse effects.

[0013] In a preferred embodiment of the present invention, the polishing process employs chemical etching and mechanical CMP methods depending on the application of the glass substrate. The polishing method selected according to the application of the glass substrate includes polishing only one side of the glass or polishing both the glass and the copper plate simultaneously to manufacture the glass substrate.

[0014] Specifically, only one side of the glass layer is polished to expose the top of the column on the surface of the pure copper plate;

[0015] Only one side of the pure copper plate layer is polished, and the surface oxide layer is removed by chemical mechanical polishing process, while preserving the structural integrity of the column.

[0016] The glass layer and the pure copper plate layer are polished simultaneously on both sides. The amount of polishing on both sides is controlled by a laser positioning system, so that conductive contacts are formed on both sides of the glass substrate.

[0017] In a preferred embodiment of the present invention, the cylindrical surface includes at least one of the following shapes: a polygonal prism structure, a circular or elliptical cylindrical structure, or an irregular cross-section cylindrical structure.

[0018] Specifically, a polygonal prism structure has a cross-section that is any regular polygon among triangles, quadrilaterals, or hexagons; a circular or elliptical prism structure has a cross-section that is circular or elliptical; and an irregular cross-section prism structure has a cross-section that is wavy, serrated, or gradually changing asymmetrical geometric shape.

[0019] This invention addresses the shortcomings of the prior art and has the following beneficial effects:

[0020] (1) Through vacuum high-temperature melting bonding + polishing process, micron-level surface flatness is achieved to meet the stringent requirements of high-end display panels and advanced semiconductor packaging.

[0021] (2) By using a glass material with a thermal expansion coefficient that is highly matched to that of the silicon substrate and combining it with a pure copper electrode layer, the interface peeling problem caused by CTE mismatch in traditional methods is effectively solved, and the reliability of the device is improved.

[0022] (3) The pure copper electrode posts form an atomic-level interface with the glass substrate, which reduces the contact resistance and reduces the signal transmission loss compared with the traditional electroplating process. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a three-dimensional composition diagram of a preferred embodiment of the present invention;

[0025] Figure 2 This is a structural diagram of the preferred embodiment of the present invention, showing the electrode being bonded to the glass;

[0026] Figure 3 This is a structural diagram of a glass substrate after polishing only one layer of glass according to a preferred embodiment of the present invention;

[0027] Figure 4 This is a structural diagram of the glass substrate after polishing only the pure copper sheet, according to a preferred embodiment of the present invention.

[0028] Figure 5 This is a structural diagram of a glass substrate after simultaneous double-sided grinding according to a preferred embodiment of the present invention;

[0029] In the diagram: 1. Glass layer; 2. Pure copper plate; 2.1. Vertical column. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein. Therefore, the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0032] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0033] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] like Figure 1 and Figure 2 As shown, the glass substrate consists of a glass layer 1 and a pure copper plate 2, with several rows of vertical columns 2.1 arranged at equal intervals on one side of the pure copper plate 2.

[0035] In advanced display or semiconductor applications, such as Figure 3 As shown, the glass substrate prepared by polishing only the glass layer is suitable for interlayer materials. By controlling the polishing depth of the glass layer, the mechanical support properties of the glass substrate can be preserved, while the tops of the pure copper plate pillars can be exposed to form electrical connection points. This structure is particularly suitable for 2.5D / 3D packaging technology because the high flatness of the glass substrate ensures precise alignment between the chip and the substrate, while the exposed copper pillars provide low-impedance interconnect channels to meet the requirements of high-frequency signal transmission.

[0036] like Figure 4 As shown, for wearable devices or flexible display applications, a process solution that only polishes the pure copper plate layer is selected. After removing the oxide layer on the surface of the pure copper plate through chemical mechanical polishing (CMP), the remaining column structure acts as a stress buffer when the flexible substrate is bent.

[0037] like Figure 5As shown, the synchronous double-sided polishing process is suitable for 3D packaging scenarios requiring double-sided electrical connections. By controlling the polishing amount on both sides through a laser positioning system, a symmetrical array of copper pillar contacts can be formed on both sides of the glass substrate. This structure is particularly suitable for the vertical interconnection requirements of through-silicon via (TSV) technology, and the measured signal transmission delay between the double-sided contacts is shown.

[0038] Depending on the customer's needs and applications, the thickness (tens of μm to hundreds of μm) and flatness (several μm) can be adjusted as needed. Similarly, the column shape can be any shape, such as cylindrical, rhomboid, or quadrilateral, depending on requirements.

[0039] Example 1

[0040] The manufacturing method of the glass substrate, using glass and pure copper plate as materials, is as follows:

[0041] S1. Electrode circuit pillars required by the customer are formed on a pure copper plate by photolithography and etching.

[0042] S2, in a vacuum environment, the temperature of the glass is appropriately raised (below 1000°C) within a vacuum chamber using a heater for an appropriate time. The glass is made into a semi-liquid state, and then pressure is applied to the electrode made in S1 to bond the glass and the electrode.

[0043] S3. Cooling after bonding: The temperature of the bonded glass substrate is cooled to room temperature (20~25°C) according to a set time by water circulation in the cooling circuit inside the vacuum chamber.

[0044] Based on the preferred embodiments of the present invention described above, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A method for manufacturing a glass substrate, characterized in that, Includes the following steps: S1. An electrode circuit is formed by processing and photolithography on a pure copper plate that allows current to flow through the electrode material; S2. After melting the glass into a semi-liquid glass under vacuum and high temperature conditions, the cylindrical surface of the pure copper plate with printed circuits is bonded to the semi-liquid glass by pressure, so that a circuit combination is formed in the glass. S3. After cooling and forming, the surface of the assembly is etched and polished according to the intended use to manufacture a glass substrate.

2. The method for manufacturing a glass substrate according to claim 1, characterized in that: In step S1, the required electrode circuit is constructed using processing and photolithography techniques.

3. The method for manufacturing a glass substrate according to claim 1, characterized in that: The linewidth and height of the electrode circuit are designed to be on the order of tens to hundreds of micrometers, and can be customized according to customer needs. In the manufacturing of the glass substrate, the processing environment temperature must be controlled below 1000℃, and the temperature parameters are adjusted to adapt to the thermal properties of different glass materials. The manufacturing process must be completed in a vacuum chamber, and the glass substrate and electrode circuit are tightly bonded by applying controllable pressure.

4. A method for manufacturing a glass substrate according to claim 1 or 3, characterized in that: The cooling forming process is carried out in a vacuum chamber using an additional cooling line to achieve cooling through staged temperature control without causing adverse effects.

5. The method for manufacturing a glass substrate according to claim 1, characterized in that: The polishing process employs chemical etching and mechanical CMP methods depending on the application of the glass substrate. The polishing method selected based on the application of the glass substrate includes polishing only one side of the glass, polishing both the glass and the copper plate simultaneously, or polishing only the copper plate to produce the glass substrate.

6. The method for manufacturing a glass substrate according to claim 1, characterized in that: The cylindrical surface includes at least one of the following shapes: polygonal prism structure, circular or elliptical cylindrical structure, and irregular cross-section cylindrical structure.

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