An intelligent adaptive SOP packaging system

Abstract

This invention discloses an intelligent adaptive SOP packaging system, relating to the field of semiconductor packaging technology. The system includes an environmental sensing module, an intelligent decision-making module, a dynamic execution module, a closed-loop control module, and auxiliary function modules. By setting up an environmental sensing module, it captures changes in temperature, humidity, and air pressure within the packaging cavity in real time, enabling timely identification of local high-temperature condensation risks and abnormal air pressure fluctuations. This solves the problem of chip performance degradation caused by sudden environmental changes in traditional packaging, avoids blind spots in single-parameter monitoring, and improves the reliability of the packaging process. By setting up a closed-loop control module, it establishes a linkage response mechanism for multi-dimensional environmental variables, simultaneously activating cooling, ventilation, and pressure regulation functions, solving the problem of single-actuator control failure in traditional technologies. Through intelligent algorithms, it dynamically matches the action combinations of the actuators, ensuring rapid stabilization of packaging parameters under different environmental change scenarios and eliminating the risk of material deformation caused by environmental mismatch.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to an intelligent adaptive SOP packaging system. Background Technology

[0002] SOP (Surface Mount Package) is a common surface mount packaging form, mainly used for packaging integrated circuits. The characteristic of SOP packaging is that the leads extend from both sides of the package, forming gull-wing leads. SOP packaging is widely used in various integrated circuits. Common packaging materials include plastics, ceramics, glass, and metals, with plastics being the most commonly used material.

[0003] Currently, due to the complex and variable environmental conditions faced by semiconductor packaged devices in actual operation, traditional SOP packaging systems use fixed process parameters for packaging operations, which cannot sense and respond to dynamic environmental changes within the packaging cavity in real time. This leads to localized high temperatures and condensation within the cavity, causing chip performance degradation or even permanent damage. Furthermore, when controlling multiple environmental variables, existing technologies lack a coordinated control mechanism for temperature, humidity, and air pressure. When encountering high-temperature and high-humidity coupled scenarios, a single actuator cannot effectively stabilize the internal environment, resulting in decreased packaging reliability. In addition, packaging parameter adjustments rely on manual experience intervention, which cannot quickly trigger adaptive adjustments in the event of sudden environmental anomalies, causing thermal stress deformation of the packaging material. Especially for miniaturized SOP packaging, its internal environmental sensitivity is increased; mismatch between static parameter settings and dynamic environment directly leads to increased product defect rates, and fault repair requires production line interruption, reducing packaging efficiency.

[0004] Therefore, an intelligent adaptive SOP packaging system is proposed to solve the above problems. Summary of the Invention

[0005] The main objective of this invention is to provide an intelligent adaptive SOP packaging system to solve the problems mentioned in the background above.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: an intelligent adaptive SOP packaging system, comprising: an environmental sensing module: a multi-sensor array, including temperature sensors distributed at the four corners of the packaging shell, a humidity sensor integrated in the top cover, and a substrate air pressure sensor, and a signal conditioning circuit for filtering and amplifying the raw sensor data;

[0007] Intelligent decision-making module: microprocessor unit, using ARM Cortex-M4 architecture chip, with built-in environmental threshold database and deviation analysis algorithm, instruction generation unit, outputs drive signals based on deviation analysis results, signal types include PWM wave and digital switch quantity;

[0008] Dynamic execution module: Temperature execution component, including semiconductor cooling chip and PTC heating chip, mounted on the side wall of the housing; Vent valve assembly, a 304 stainless steel ball valve driven by a stepper motor, installed in the vent hole of the housing top cover; Pressure balance valve, a diaphragm valve whose opening degree is adjusted by a linear motor.

[0009] Closed-loop control module: Data feedback unit, which collects environmental parameters after execution in real time and sends them back to the microprocessor; Adaptive calibration unit, which optimizes the threshold range and response speed based on historical adjustment records.

[0010] Auxiliary function module: Wireless communication unit, supporting Bluetooth 5.0 transmission of environmental data to the monitoring terminal.

[0011] The safety protection unit forces a switch to a preset safety mode when a sensor malfunctions.

[0012] Preferably, the environment sensing module includes:

[0013] The multi-sensor array consists of temperature sensors distributed at the four corners of the package, a humidity sensor integrated in the top cover, and a pressure sensor on the substrate, forming a spatially distributed monitoring network.

[0014] The signal conditioning circuit is connected to a multi-sensor array to perform dynamic compression and noise suppression on the raw data.

[0015] The environmental coupling analysis unit calculates the environmental synergy index δ based on multi-sensor data.

[0016]

[0017] Where ΔT is the real-time temperature fluctuation value, T max -T min The preset temperature upper and lower limits are given, and ΔH represents the real-time humidity fluctuation value. max The preset humidity upper limit is defined by α, which is the weighting coefficient for the influence of temperature, and β is the weighting coefficient for the influence of humidity.

[0018] Preferably, the multi-sensor array includes four sets of temperature sensors, and the mounting positions satisfy the spatial thermal field coverage equation:

[0019]

[0020] Where L and W are the length and width of the packaging shell, and θ n Install the phase angle for the sensor.

[0021] Preferably, the signal conditioning circuit implements a third-order Butterworth low-pass filter with a cutoff frequency of 10Hz, a programmable gain amplifier with a gain range of up to 1000 times adaptive adjustment, and a 24-bit high-precision ADC conversion with a sampling rate of 1kHz.

[0022] Preferably, the intelligent decision-making module includes:

[0023] The microprocessor unit uses an ARM Cortex-M4 architecture chip;

[0024] The instruction generation unit outputs a PWM wave with an adjustable frequency of 10kHz.

[0025] Preferably, the microprocessor unit integrates an environmental threshold database, a dynamic deviation analysis algorithm, and an adaptive learning engine.

[0026] Preferably, the cooling power calculation formula for the temperature actuator is:

[0027] W cold =2.8×|ΔT| 1.2

[0028] Where ΔT is the absolute value of the temperature deviation.

[0029] Preferably, the closed-loop control module includes a data feedback unit and an adaptive calibration unit, with a response period of 500ms.

[0030] Preferably, the safety protection unit implements a three-level fault response mechanism.

[0031] Preferred options also include:

[0032] The packaging process self-diagnostic unit is configured to perform real-time diagnostics at critical process nodes, including:

[0033] When wafer mounting is complete: Scan the temperature sensor readings at the four corners to ensure consistency. When the maximum temperature difference is greater than 0.5℃, trigger local compensation heating and generate a temperature distribution thermal map report.

[0034] During gold wire bonding: real-time monitoring of humidity fluctuation gradient; when the fluctuation rate is greater than 5% / min, dry air injection is initiated, and the humidity change curve of the bonding point is recorded.

[0035] The sealing cover closing critical point is used to verify the response time of the air pressure balance valve. If the valve fails to respond within the time limit, the backup valve is switched on, and the microprocessor redundancy verification mode is activated simultaneously.

[0036] Final stage of curing: Compare the similarity between the actual process curve and the baseline curve. When the similarity is less than 90%, mark the batch with abnormal process and automatically generate an NG report and push it to the monitoring terminal.

[0037] The present invention has the following beneficial effects:

[0038] 1. In this invention, by setting up an environmental sensing module, a real-time dynamic monitoring system is constructed during the semiconductor packaging process. This system captures changes in temperature, humidity, and air pressure within the packaging cavity in real time, enabling timely identification of local high-temperature condensation risks and abnormal air pressure fluctuations. This solves the problem of chip performance degradation caused by sudden environmental changes in traditional packaging. Based on a multi-sensor collaborative sensing mechanism, comprehensive monitoring of packaging environmental parameters is ensured, avoiding blind spots in single-parameter monitoring and improving the reliability of the packaging process.

[0039] 2. In this invention, a closed-loop control module is set up to establish a linkage response mechanism for multi-dimensional environmental variables such as temperature, humidity and air pressure. When a high temperature and high humidity coupled scenario is detected, the cooling, ventilation and pressure regulation functions are activated simultaneously to solve the problem of single actuator control failure in traditional technology. Through intelligent algorithm, the combination of actuator actions is dynamically matched to ensure the rapid stabilization of encapsulation parameters under different environmental change scenarios and eliminate the risk of material deformation caused by environmental mismatch.

[0040] 3. In this invention, by setting up an intelligent decision-making module, a dynamic decision-making model is constructed based on real-time environmental data, which automatically generates the optimal adjustment command and drives the actuator to respond accurately, replacing the manual experience intervention mode; through a closed-loop control mechanism, the adjustment strategy is continuously optimized to solve the problem of lag in traditional packaging response, and to achieve millisecond-level autonomous response in the event of sudden environmental anomalies, thereby reducing the frequency of production line downtime and maintenance, and improving packaging efficiency and product consistency. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of an intelligent adaptive SOP packaging system according to the present invention. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] Please see Figure 1 This intelligent adaptive SOP packaging system includes:

[0044] Environmental perception module:

[0045] A multi-sensor array, including temperature sensors distributed at the four corners of the package housing, a humidity sensor integrated in the top cover, and a substrate pressure sensor;

[0046] The conditioning circuit filters and amplifies the raw sensor data;

[0047] Intelligent decision-making module:

[0048] The microprocessor unit uses an ARM Cortex-M4 architecture chip and has a built-in environmental threshold database and deviation analysis algorithm; the instruction generation unit outputs drive signals based on the deviation analysis results, and the signal types include PWM waves and digital switching signals; the dynamic execution module:

[0049] The temperature actuator, comprising a semiconductor cooling chip and a PTC heating chip, is mounted on the side wall of the housing;

[0050] The vent valve assembly, consisting of a 304 stainless steel ball valve driven by a stepper motor, is installed in the vent hole of the housing top cover.

[0051] A pneumatic pressure balancing valve, a diaphragm valve whose opening degree is adjusted by a linear motor;

[0052] Closed-loop control module:

[0053] The data feedback unit collects environmental parameters after execution in real time and sends them back to the microprocessor;

[0054] The adaptive calibration unit optimizes the threshold range and response speed based on historical adjustment records.

[0055] Auxiliary function modules:

[0056] The wireless communication unit supports Bluetooth 5.0 for transmitting environmental data to the monitoring terminal.

[0057] The safety protection unit forces a switch to a preset safety mode when a sensor malfunctions.

[0058] Includes the following steps:

[0059] S1. Real-time acquisition of environmental parameters inside the packaging shell through multiple types of sensors, including temperature, humidity and air pressure;

[0060] S2. Transmit environmental parameters to the microprocessor, perform parameter deviation analysis based on the preset environmental threshold range, and generate environmental adjustment instructions.

[0061] S3. Drive the corresponding actuator according to the type of environmental adjustment command:

[0062] If the temperature exceeds the threshold range, the temperature regulation component is activated to perform cooling and heating operations;

[0063] If the humidity exceeds the upper limit of the threshold, the ventilation valve will be opened to reduce the internal humidity;

[0064] If the air pressure is abnormal, adjust the opening degree of the air pressure balancing valve to stabilize the internal pressure of the housing;

[0065] S4. After the actuator completes its action, environmental parameters are collected again and fed back to the microprocessor to form closed-loop control.

[0066] S5. When environmental parameters remain within the threshold range, maintain the current actuator state until the next environmental fluctuation triggers adjustment.

[0067] The multiple types of sensors in step S1 include:

[0068] Distributed temperature sensors are mounted inside the four corners of the housing, with a measurement accuracy of 0.5℃.

[0069] A humidity sensor is integrated inside the top cover of the housing, with a measurement range covering up to 90% RH;

[0070] The barometric pressure sensor is fixed at the center of the housing base plate and has a detection range up to 110 kPa.

[0071] The parameter deviation analysis in step S2 includes:

[0072] Establish a three-dimensional environmental model with temperature T, humidity H, and air pressure P as coordinate axes;

[0073] Calculate the current parameter point (T) c H c ,P c ) and preset threshold point (T) s H s ,P s The Euclidean distance D:

[0074]

[0075] Where T c H represents the current temperature value. c P represents the current humidity value. c T represents the current air pressure value. s H s P s Preset temperature, humidity, and air pressure thresholds;

[0076] When D is greater than D max When a preset tolerance threshold is set, an environmental control command containing the deviation type and adjustment amount is generated.

[0077] Perform sensor calibration before sealing the enclosure:

[0078] The temperature sensor was calibrated for zero-point drift by placing it in a constant temperature environment of 25°C.

[0079] Reset the barometer reference value at standard atmospheric pressure;

[0080] The accuracy curve of the humidity sensor was calibrated using a saturated salt solution.

[0081] The temperature control components include:

[0082] A semiconductor refrigeration element activates the Peltier effect to lower the temperature when it responds to a cooling command.

[0083] PTC heating elements raise the temperature by resistive heating when responding to a heating command.

[0084] The power output of the temperature regulation component is proportional to the temperature deviation.

[0085] The linkage logic of the actuator in step S3 is as follows:

[0086] When both ΔT and ΔH are simultaneously satisfied:

[0087] ΔT=T c -T s

[0088] ΔH=H c -H s

[0089] Calculate the high temperature and high humidity coupling coefficient K:

[0090]

[0091] Where ΔT is the absolute value of the temperature deviation and ΔH is the absolute value of the humidity deviation;

[0092] When K is greater than 0.8, the vent valve and the thermoelectric cooler will work together simultaneously.

[0093] It also includes exception handling steps:

[0094] When sensor data is continuously abnormal for more than a set time, a fault alarm is triggered and the system switches to the preset safety parameter mode.

[0095] In safety parameter mode, the actuators start and stop cyclically at fixed intervals to maintain the stability of the basic environment.

[0096] Connect to an external monitoring platform via a wireless communication module:

[0097] Real-time uploading of environmental parameters and actuator status data;

[0098] Receive remotely issued threshold range modification instructions and forced control commands.

[0099] Integrating adaptive control into chip packaging processes:

[0100] After the gold wire bonding process is completed, the environmental parameter acquisition function is activated immediately.

[0101] The closed-loop control program of the microprocessor is started synchronously when the package cover is closed.

[0102] Example 1:

[0103] System composition structure:

[0104] 1. Environmental perception module

[0105] Multi-sensor array deployment:

[0106] The temperature sensors are mounted at the four corners of the enclosure, and their positions satisfy the spatial thermal field coverage equation:

[0107]

[0108] Where L = 120mm and W = 80mm are the shell dimensions, and θn is taken as the phase angle [0°, 90°, 180°, 270°].

[0109] The humidity sensor is integrated in the center of the top cover, with a range of 0-100%RH; the barometric pressure sensor is embedded in the substrate, with a range of 50-110kPa.

[0110] Signal conditioning circuit:

[0111] It employs a third-order Butterworth low-pass filter, a programmable gain amplifier, and a 24-bit ADC to convert the raw data at a 1kHz sampling rate.

[0112] Environmental Coupling Analysis Unit:

[0113] Real-time computing environment synergy index δ:

[0114]

[0115] Where ΔT is the real-time temperature fluctuation value, T max T min The preset temperature upper and lower limits are given, and ΔH represents the real-time humidity fluctuation value. max The preset humidity upper limit is defined by α, where α is the temperature weighting coefficient and β is the humidity weighting coefficient.

[0116] Preset T max =85℃,T min = -40℃, H max =90%RH, α=0.7, β=0.3 weighting coefficients.

[0117] 2. Intelligent Decision-Making Module

[0118] Microprocessor unit:

[0119] Threshold database and dynamic deviation analysis algorithm for the operating environment of ARM Cortex-M4 chip.

[0120] An integrated adaptive learning engine optimizes threshold range and response speed based on historical adjustment records.

[0121] Instruction generation unit:

[0122] Output a 10kHz adjustable PWM wave and digital switching signal to the execution module.

[0123] 3. Dynamic Execution Module

[0124] Temperature actuator:

[0125] The semiconductor cooling chip and PTC heating element are mounted on the side wall of the housing, and the cooling power is dynamically adjusted according to a formula:

[0126] W cold =2.8×|ΔT| 1.2

[0127] Cooling is started when ΔT = 10℃, where ΔT is the absolute value of the temperature deviation.

[0128] Vent valve assembly:

[0129] A stepper motor drives a 304 stainless steel ball valve, which is installed in the vent hole of the top cover.

[0130] Air pressure balancing valve:

[0131] Linear motor controls the opening and closing degree of diaphragm valve.

[0132] 4. Closed-loop control module

[0133] Data feedback unit:

[0134] After real-time collection and execution, environmental parameters are transmitted back to the microprocessor.

[0135] Adaptive calibration unit:

[0136] Based on the adjustment records of the past 24 hours, the compression temperature threshold is 3°C, and the humidity response speed is improved.

[0137] 5. Auxiliary function module

[0138] Wireless communication unit:

[0139] Bluetooth 5.0 transmits environmental data to the monitoring terminal.

[0140] Safety protection unit:

[0141] Three-level fault response mechanism:

[0142] Level 1: Enable redundant data estimation when a single sensor fails;

[0143] Level 2: Switches to preset safety mode when multiple sensors fail;

[0144] Level 3: The valve closes and an alarm sounds when the actuator malfunctions.

[0145] Packaging process self-diagnostic unit:

[0146] During the wafer mounting stage: the temperature sensors at the four corners are scanned, and local compensation heating is triggered when the maximum temperature difference is >0.5℃, generating a thermal map report of the temperature distribution.

[0147] Gold wire bonding stage: When the humidity fluctuation gradient is >5% / min, dry air injection is started and the humidity change curve of the bonding point is recorded; Encapsulation cover closing stage: The response time of the air pressure balance valve is checked. If there is no response after 300ms, the backup valve is switched and the microprocessor redundancy check is activated.

[0148] Final stage of curing: Compare the actual process curve with the baseline curve. If the similarity is <90%, mark the abnormal batch and generate an NG report to push to the terminal.

[0149] Example 2:

[0150] 1. Environmental perception module

[0151] Temperature sensors are distributed at the four corners of the housing with phase angles of 0 degrees, 90 degrees, 180 degrees, and 270 degrees;

[0152] Calculation of the Environmental Synergy Index:

[0153] The temperature fluctuation difference is divided by the 125-degree Celsius range and then multiplied by a coefficient of 0.7.

[0154] The humidity fluctuation value is divided by the 90% relative humidity threshold and then multiplied by a coefficient of 0.3.

[0155] The two are added together to obtain the environmental synergy index;

[0156] 2. Intelligent Decision-Making Module

[0157] The ARM Cortex-M4 chip completes dynamic deviation analysis within 10 milliseconds;

[0158] The adaptive learning engine compresses the temperature threshold by 3 degrees Celsius based on historical data;

[0159] 3. Dynamic Execution Module

[0160] The cooling capacity is adjusted according to the 1.2 power of the absolute value of the temperature deviation;

[0161] The opening degree of the pneumatic valve is linearly proportional to the temperature deviation;

[0162] 4. Closed-loop control module

[0163] Feedback data is collected at 500-millisecond intervals;

[0164] Humidity response speed improved by 20%;

[0165] Auxiliary function module

[0166] Gold wire bonding stage: Humidity fluctuations exceeding 5% per minute trigger drying;

[0167] Final stage of curing: If the process curve similarity is less than 90%, an anomaly is marked.

[0168] Example 3:

[0169] On the packaging production line for the 800V high-voltage electric drive system power module, the four-corner distributed temperature sensor network of the environmental sensing module detected a sudden heat buildup in the IGBT area, with the local temperature rapidly rising to a high-risk state of 128 degrees Celsius. Simultaneously, the humidity sensor integrated in the top cover detected an abnormal fluctuation in relative humidity, caused by a minor coolant leak, which sharply increased from the baseline value of 45% to 82%. Based on the real-time data stream, the microprocessor unit of the intelligent decision-making module quickly performed a dynamic calculation of the environmental coupling index, arriving at a comprehensive risk value of δ = 0.93, exceeding the preset safety threshold of 0.8, thus identifying it as a high-temperature and high-humidity coupled fault risk.

[0170] The system immediately triggers a three-level linkage control protocol: the temperature actuator precisely outputs the required 112 watts of cooling power based on the cooling power calculation formula, driving the high-power semiconductor cooling chip to operate at full load; the vent valve assembly adjusts the opening angle of the stainless steel ball valve to 70 degrees via a high-precision stepper motor, forming a directional dehumidification channel; the pressure balancing valve simultaneously switches to a 95 kPa negative pressure operating mode to suppress the vapor diffusion effect. The data feedback unit of the closed-loop control module continuously collects changes in environmental parameters at a period of 200 milliseconds, and the adaptive calibration unit dynamically optimizes the temperature weighting coefficient to 0.78 based on historical data.

[0171] When the current monitoring system of the safety protection unit detects abnormal fluctuations in the operating current of the cooling chip, the system automatically switches to the backup cooling channel within 5 milliseconds and sends an early warning code to the central control system of the production line via the industrial bus. After 12.3 seconds of high-precision closed-loop control, the environment of the packaging cavity is stabilized in the safe range of 92 degrees Celsius / 58% relative humidity, successfully avoiding the damage accident of the automotive-grade silicon carbide power module worth 180,000 yuan, and permanently improving the cooling power benchmark value of more than 3,000 products in this batch.

[0172] Example 4:

[0173] In the lifelong reliable hermetically sealed packaging process of the core control module of the implantable cardiac pacemaker, the high-precision sensor array of the environmental sensing module detected an abnormal fluctuation of 0.9% relative humidity in the argon-protected environment. This value exceeds the tolerance range of the ISO 13485 standard for the medical device industry. The signal conditioning circuit performs three-stage Butterworth low-pass filtering on the raw acquired signal, effectively filtering out high-frequency noise interference above 10 Hz.

[0174] The intelligent decision-making module initiates mathematical modeling and analysis of the spatial thermal field distribution, identifying a 0.4-degree monitoring blind zone at the coordinate position of phase angle θ3 = 225 degrees. The system immediately issues control commands: the temperature execution component applies 9.2 watts of directional compensation heating to the target position in the blind zone; and simultaneously controls the pressure balance valve to precisely inject 0.4 ml of dry nitrogen into the cavity.

[0175] The closed-loop control module improves humidity regulation response speed by 30 percentage points through advanced algorithms. The wireless communication unit uses Bluetooth 5.0 low-power protocol to transmit packaging parameters to the central monitoring terminal in a Class 10,000 clean environment in real time. During the critical gold wire bonding process, the packaging process self-diagnosis unit detected a humidity fluctuation rate of up to 6.8% / minute in the local area of ​​the bonding point. The system initiates the dry air injection program within 0.5 seconds after the detection result exceeds the 5% safety threshold and automatically generates a humidity change curve analysis report for the bonding point. More notably, at the critical moment of the packaging cap closing operation, the response delay of the air pressure balance valve reaches 320 milliseconds. The system automatically switches to the backup valve device according to preset rules and simultaneously activates the microprocessor's triple redundancy verification mechanism.

[0176] After undergoing two thousand hours of accelerated aging verification testing, the sealing leakage rate of this batch of medical devices remained stable at an excellent level, fully meeting the stringent requirements for lifetime reliability of implantable devices.

[0177] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An intelligent adaptive SOP packaging system, characterized in that: include: Environmental sensing module: a multi-sensor array, including temperature sensors distributed at the four corners of the package, a humidity sensor integrated in the top cover, and a pressure sensor on the substrate, and a signal conditioning circuit to filter and amplify the raw sensor data; Intelligent decision-making module: microprocessor unit, using ARM Cortex-M4 architecture chip, with built-in environmental threshold database and deviation analysis algorithm, instruction generation unit, outputs drive signals based on deviation analysis results, signal types include PWM wave and digital switch quantity; Dynamic execution module: Temperature execution component, including semiconductor cooling chip and PTC heating chip, mounted on the side wall of the housing; Vent valve assembly, a 304 stainless steel ball valve driven by a stepper motor, installed in the vent hole of the housing top cover; Pressure balance valve, a diaphragm valve whose opening degree is adjusted by a linear motor. Closed-loop control module: Data feedback unit, which collects environmental parameters after execution in real time and sends them back to the microprocessor; Adaptive calibration unit, which optimizes the threshold range and response speed based on historical adjustment records. Auxiliary function module: Wireless communication unit, supporting Bluetooth 5.0 transmission of environmental data to the monitoring terminal. The safety protection unit forces a switch to a preset safety mode in the event of a sensor malfunction. The environment sensing module includes: The multi-sensor array consists of temperature sensors distributed at the four corners of the package, a humidity sensor integrated in the top cover, and a pressure sensor on the substrate, forming a spatially distributed monitoring network. The signal conditioning circuit is connected to a multi-sensor array to perform dynamic compression and noise suppression on the raw data. The environmental coupling analysis unit calculates the environmental synergy index δ based on multi-sensor data. ； in This represents the real-time temperature fluctuation value. Preset upper and lower temperature limits, This represents the real-time humidity fluctuation value. To preset the upper limit of humidity, The weighting factor for the effect of temperature. The weighting factor for the effect of humidity; The multi-sensor array contains four sets of temperature sensors, and their mounting positions satisfy the spatial thermal field coverage equation: ； in , For the length and width of the package housing, Install the phase angle for the sensor.

2. The intelligent adaptive SOP packaging system according to claim 1, characterized in that: The signal conditioning circuit implements a third-order Butterworth low-pass filter with a cutoff frequency of 10Hz, a programmable gain amplifier with a gain range of up to 1000 times adaptive adjustment, and a 24-bit high-precision ADC conversion with a sampling rate of 1kHz.

3. The intelligent adaptive SOP packaging system according to claim 1, characterized in that: The intelligent decision-making module includes: The microprocessor unit uses an ARM Cortex-M4 architecture chip; The instruction generation unit outputs a PWM wave with an adjustable frequency of 10kHz.

4. The intelligent adaptive SOP packaging system according to claim 3, characterized in that: The microprocessor unit integrates an environmental threshold database, a dynamic deviation analysis algorithm, and an adaptive learning engine.

5. The intelligent adaptive SOP packaging system according to claim 1, characterized in that: The formula for calculating the cooling power of the temperature actuator is as follows: ； in This represents the absolute value of the temperature deviation.

6. The intelligent adaptive SOP packaging system according to claim 1, characterized in that: The closed-loop control module includes a data feedback unit and an adaptive calibration unit, with a response period of 500ms.

7. The intelligent adaptive SOP packaging system according to claim 1, characterized in that: The safety protection unit implements a three-level fault response mechanism.

8. The intelligent adaptive SOP packaging system according to claim 1, characterized in that: Also includes: The packaging process self-diagnostic unit is configured to perform real-time diagnostics at critical process nodes, including: When wafer mounting is complete: Scan the temperature sensor readings at the four corners to ensure consistency. When the maximum temperature difference is greater than 0.5℃, trigger local compensation heating and generate a temperature distribution thermal map report. During gold wire bonding: real-time monitoring of humidity fluctuation gradient; when the fluctuation rate is greater than 5% / min, dry air injection is initiated, and the humidity change curve of the bonding point is recorded. The sealing cover closing critical point is used to verify the response time of the air pressure balance valve. If the valve fails to respond within the time limit, the backup valve is switched on, and the microprocessor redundancy verification mode is activated simultaneously. Final stage of curing: Compare the similarity between the actual process curve and the baseline curve. When the similarity is less than 90%, mark the batch with abnormal process and automatically generate an NG report and push it to the monitoring terminal.

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