Modularized high-protection fusion intelligent ring main unit
By using a fully enclosed automatic opening and closing structure and a finned assembly linkage design, combined with a semiconductor heat dissipation structure, the automation level, heat dissipation adaptability, and dust prevention issues of the intelligent ring network box in outdoor environments are solved, achieving high protection and efficient heat dissipation, and improving the stability and lifespan of the equipment.
Patent Information
- Application Number
- CN202511135145.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-14
- Publication Date
- 2025-11-04
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Existing intelligent ring network boxes lack sufficient automation in harsh outdoor environments, have limited and poorly adaptable heat dissipation methods, and are weak in dust protection, which affects equipment stability and lifespan.
It adopts a fully enclosed automatic opening and closing structure and a fin assembly linkage design, combined with a semiconductor heat dissipation structure to achieve IP-level dust and water resistance. The opening angle of the sealed top cover and the deployment of the fins are precisely controlled by a motor drive. With selectable liquid cooling or non-liquid cooling modes, it achieves high protection and efficient heat dissipation.
It improves operational safety and response speed, extends maintenance cycles, reduces the risk of dust blockage, adapts to complex environments, and enhances equipment stability and lifespan.
Smart Images

Figure CN120896025A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of intelligent ring network boxes, in particular to a modular high-protection fusion intelligent ring network box. BACKGROUND
[0002] As a key equipment in the power distribution system, the intelligent ring network box is widely used in urban power distribution network, industrial park and remote area power distribution and control, and its stable operation directly relates to the reliability of power supply. Due to the complex working environment, it often faces problems such as high temperature, dust accumulation and moisture invasion, which puts forward strict requirements on the heat dissipation performance, protection ability and automation level of the equipment.
[0003] In the prior art, some ring network boxes are equipped with basic protection structures (such as the secondary fusion ring network box external protection structure with application number 202022619347.8), which offset the external impact force through mechanical mechanisms, but there are still significant limitations in core performance: (1) The degree of automation is insufficient, and the operation and maintenance are inconvenient; The opening and closing of the traditional ring network box depends on manual operation. In outdoor harsh environment (such as heavy rain, high temperature and high altitude area) or remote area, manual intervention not only has high cost and slow response, but also has safety hazards. Especially in the event of a fault, it is impossible to realize rapid automatic opening and closing to cooperate with maintenance or emergency treatment, which seriously affects the power supply recovery efficiency.
[0004] (2) The heat dissipation mode is single, and the adaptability is poor; The heat dissipation of the existing equipment is mostly single air cooling or natural heat dissipation, which is difficult to meet the needs of ring network boxes with different sealing degrees. For example, the heat in the sealed ring network box is easy to accumulate, and the single air cooling efficiency is low, which may cause the equipment to trip due to overheating; while the openwork ring network box has good heat dissipation conditions, but the traditional heat dissipation structure lacks targeted design, and the heat export efficiency is insufficient, which may cause the components to age quickly due to high temperature in long-term operation.
[0005] (3) The dustproof ability is weak, which affects the service life of the equipment; In outdoor environment, dust, sand and other impurities are easy to enter the equipment through the heat dissipation gap. The heat dissipation structure of the traditional ring network box (such as fixed fan and exposed fin) lacks effective dustproof design, and dust accumulation may block the heat dissipation channel, causing air flow to be blocked and heat dissipation efficiency to be greatly reduced. Further, high temperature may force CPU, relay and other core components to run at a lower frequency, causing unstable operation of the equipment, misoperation and other problems; more seriously, the conductive substances in the dust may cause short circuit of the circuit, causing damage to the mainboard, mutual inductor and other key components, significantly shortening the service life of the equipment and increasing the operation and maintenance cost. SUMMARY
[0006] The application aims to provide a modular high-protection fusion intelligent ring network box to solve the problems in the background art.
[0007] The technical scheme of the application is: a modular high-protection fusion intelligent ring network box, comprising a radiator shell, a sealing top cover and an intelligent ring network box structure, a fully-enclosed automatic opening and closing structure is installed inside the radiator shell, the fully-enclosed automatic opening and closing structure automatically opens and closes the sealing top cover, a semiconductor heat dissipation structure is arranged at the bottom end of the radiator shell, and a fan structure is installed at the bottom end of the semiconductor heat dissipation structure, a fin assembly is installed at the bottom end of the fan structure, The fully-enclosed automatic opening and closing structure comprises a first motor and a support, and the first motor is provided with two groups of support installed on the two sides inside the radiator shell, the output end of the first motor is connected with the support, and the top end of the support is installed with the sealing top cover, The fin assembly comprises an external shell, the external shell is installed at the bottom end of the radiator shell, one side of the external shell is installed with a second transmission gear, one side of the second transmission gear is installed with a first transmission gear, and one end of the first transmission gear is installed with a double-head articulated piece.
[0008] Further, the inside of the radiator shell is provided with the intelligent ring network box structure, both sides of the radiator shell are provided with a preset hole, and a rubber sealing plug is installed inside the preset hole, The intelligent ring network box structure comprises an intelligent ring network box host, power supply wires are installed on both sides of the intelligent ring network box host, the power supply wires pass through the preset hole, and the rubber sealing plug is installed at the connection between the preset hole and the power supply wires, The power supply wires are provided with two groups, one end of the first group of power supply wires away from the intelligent ring network box host is installed with a power supply outlet end, and one end of the second group of power supply wires away from the intelligent ring network box host is installed with a power supply interface end.
[0009] Further, independent sealing pieces are installed on both sides of the inside of the radiator shell, one side inside the independent sealing piece is installed with a first motor, The output end of the first motor is installed with a second articulated piece, one side of the second articulated piece is articulated with a first articulated piece, one end of the first articulated piece away from the second articulated piece is articulated with a support, and the top end of the support is connected with the sealing top cover, One side inside the independent sealing piece away from the first motor is installed with a Y-shaped groove limiting plate, a first sliding rod is installed at the middle of the side of the support close to the Y-shaped groove limiting plate, and a second sliding rod is installed at the bottom end of the side of the support close to the Y-shaped groove limiting plate.
[0010] Further, the first motor is provided with two groups, the output end of one of the groups of first motors is connected with a sixth transmission gear, The bottom end of the sixth transmission gear is provided with a fifth transmission gear, and the fifth transmission gear and one end of the sixth transmission gear are sleeved with a transmission gear chain, and the fifth transmission gear, the transmission gear chain and the sixth transmission gear are driven by meshing teeth.
[0011] Further, one end of the external shell is embedded with a limiting sliding groove, and the inside of the limiting sliding groove is provided with a limiting sliding block, The fifth transmission gear is installed at one end of the external shell, one end of the fifth transmission gear is installed with a second transmission gear, one side of the second transmission gear is provided with a first transmission gear, and the first transmission gear and the second transmission gear are driven by meshing teeth, The first transmission gear is installed with a double-head articulated piece on one side, the second transmission gear is installed with a support angle piece at the bottom end, and the bottom end of the support angle piece is installed with a heat dissipation fin.
[0012] Further, one end of the double-head articulated piece away from the first transmission gear is connected with a third transmission gear, one side of the third transmission gear is installed with a fourth transmission gear, and one end of the double-head articulated piece away from the third transmission gear is installed with a connecting page piece, The limiting sliding block, the double-head articulated piece, the support angle piece, the third transmission gear and the fourth transmission gear are all provided with multiple groups, The double-head articulated piece is internally provided with two groups of double-head articulated rods, the two groups of double-head articulated rods are connected by articulation points, and one end of the two groups of double-head articulated rods away from the articulation points is respectively connected with the third transmission gear and the fourth transmission gear on both sides, The external shell is installed with a support base at the four peripheral edges away from the bottom end of the radiator shell.
[0013] Further, the fan structure includes a second articulation seat, and one side of the second articulation seat is connected with the radiator shell, One side of the second articulation seat away from the radiator shell is provided with a first articulation seat, and one side of the first articulation seat away from the second articulation seat is connected with a connecting side plate, The connecting part of the second articulation seat and the first articulation seat penetrates a connecting plug, and the top end of the connecting plug is installed with a reinforcing knob, One side of the connecting side plate close to the radiator shell is installed with a support frame, and the top end of the support frame is installed with a heat dissipation fan, and the bottom end of the support frame is installed with a moving pulley.
[0014] Further, the connecting side plate is installed with an anti-falling connecting piece away from the radiator shell, and the inside of the anti-falling connecting piece is installed with a locking piece, and one side of the locking piece close to the radiator shell is connected with an embedded groove, The outer casing is embedded with an inner embedded groove at one end close to the embedded groove.
[0015] Further, the semiconductor heat dissipation structure comprises a ceramic heat-conducting substrate, and a refrigeration end is installed at one end of the ceramic heat-conducting substrate close to the intelligent ring network box structure, and a heat release end is installed at one end of the ceramic heat-conducting substrate close to the fan structure. The side of the connection between the refrigeration end and the heat release end is installed with a P-type semiconductor, and the other side of the connection between the refrigeration end and the heat release end is installed with an N-type semiconductor.
[0016] The present application improves a modular high-protection fusion intelligent ring network box, which has the following improvements and advantages compared with the prior art. The traditional ring network box often faces the dilemma of "sealing and insufficient heat dissipation, heat dissipation and degradation of protection". The present application realizes IP-level dustproof and waterproof through the linkage design of the fully-closed automatic opening and closing structure and the fin assembly in the non-heat dissipation state, and forms a fully-closed space through the sealing top cover and the closed fins, realizes the IP-level dustproof and waterproof; and when the heat dissipation demand occurs, the opening angle of the sealing top cover is accurately controlled through the motor drive, and the fin assembly is linked to expand the heat dissipation fins to form a directional air flow channel. Combined with the solid-state refrigeration characteristics of the semiconductor heat dissipation structure, the liquid cooling and non-liquid cooling modes can be selected to realize the cooperation of "high protection" and "high efficiency heat dissipation", and solve the technical problem that the traditional equipment cannot be considered.
[0017] The fully-closed automatic opening and closing structure of the present application realizes the automatic turning opening and closing of the sealing top cover through the sliding cooperation of the motor-driven support and the Y-shaped groove limiting plate, replaces the traditional manual operation, greatly improves the operation safety and response speed in harsh environments. At the same time, the fin assembly is linked through the gear transmission and the double-head hinge piece, so that the heat dissipation fins can automatically adjust the angle according to the heat dissipation demand, and are completely closed in the non-working state to avoid the problem of dust accumulation caused by long-term exposure of the traditional heat dissipation fins. This "dynamic dustproof" design reduces the risk of dust blocking the heat dissipation channel from the source, reduces the hardware failure (such as short circuit and performance attenuation) caused by overheating, and prolongs the maintenance period by more than 30% compared with the traditional equipment.
[0018] The present application adopts modular design, realizes rapid assembly and sealing through rubber sealing inserts, independent sealing pieces and the like. Among them, the pullable design (realized through the hinge seat and the locking piece) of the fan structure is convenient for individual maintenance; the ceramic heat-conducting substrate of the semiconductor heat dissipation structure has insulation and heat conduction performance, and is suitable for ring network box hosts of different voltage grades. This modular characteristic makes the equipment flexible to adapt to outdoor, industrial park, high altitude and other scenes, solves the limitation that the traditional ring network box is difficult to adapt to complex environments due to fixed structure. BRIEF DESCRIPTION OF DRAWINGS
[0019] The application will be further explained in connection with the accompanying drawings and examples: Figure 1 is a schematic view of the three-dimensional appearance structure of the application; Figure 2 is a first schematic view of the three-dimensional explosion of the application; Figure 3 is a first schematic view of the internal explosion of the radiator shell of the application; Figure 4 is a second schematic view of the three-dimensional explosion of the application; Figure 5 is a schematic view of the three-dimensional explosion of the fan structure of the application; Figure 6 is a schematic view of the three-dimensional appearance structure of the application; Figure 5 is a schematic view of the enlarged structure at A of the application; Figure 7 is a schematic view of the three-dimensional appearance structure of the application; Figure 5 is a schematic view of the enlarged structure at B of the application; Figure 8 is a third schematic view of the three-dimensional explosion of the application; Figure 9 is a second schematic view of the internal explosion of the radiator shell of the application; Figure 10 is a third schematic view of the internal explosion of the radiator shell of the application; Figure 11 is a first schematic view of the partial three-dimensional appearance of the fully-closed automatic opening and closing structure of the application; Figure 12 is a second schematic view of the partial three-dimensional appearance of the fully-closed automatic opening and closing structure of the application; Figure 13 is a first schematic view of the three-dimensional explosion of the fin assembly of the application; Figure 14 is a second schematic view of the three-dimensional explosion of the fin assembly of the application; Figure 15 is a schematic view of the three-dimensional appearance structure of the application; Figure 14 is a schematic view of the enlarged structure at C of the application; Figure 16 is a third schematic view of the three-dimensional explosion of the fin assembly of the application; Figure 17 is a schematic view of the three-dimensional appearance structure of the application; Figure 16 is a schematic view of the enlarged structure at D of the application; Figure 18 is a fourth schematic view of the three-dimensional explosion of the application; Figure 19 is a schematic view of the three-dimensional appearance structure of the application; Figure 18 is a schematic view of the enlarged structure at E of the application; Figure 20 is a schematic view of the internal electrical structure of the semiconductor heat dissipation structure of the application.
[0020] Explanation of reference signs: 1, radiator shell; 2, sealing top cover; 3, intelligent ring network box structure; 301, intelligent ring network box host; 302, power supply wire; 303, power supply outlet end; 304, power supply interface end; 4, rubber sealing plug-in; 5, preset hole; 6, fin assembly; 601, external shell; 602, heat dissipation fin; 603, limiting sliding groove; 604, limiting sliding block; 605, support corner piece; 606, double-end articulated piece; 607, first transmission gear; 608, second transmission gear; 609, connecting page piece; 610, third transmission gear; 611, fourth transmission gear; 7, fan structure; 701, connecting side plate; 702, anti-falling connecting piece; 703, locking piece; 704, support frame; 705, heat dissipation fan; 706, moving pulley; 707, first articulated seat; 708, second articulated seat; 709, connecting plug-in; 710, reinforcing knob; 711, embedded groove; 712, embedded recess; 8, support base; 9, fully-enclosed automatic opening and closing structure; 901, independent sealing piece; 902, fifth transmission gear; 903, transmission toothed chain; 904, sixth transmission gear; 905, first motor; 906, Y-shaped groove limiting plate; 907, support piece; 908, first sliding rod; 909, second sliding rod; 910, first articulated piece; 911, second articulated piece; 10, semiconductor heat dissipation structure; 1001, ceramic heat-conducting base plate; 1002, refrigeration end; 1003, heat release end; 1004, P-type semiconductor; 1005, N-type semiconductor. DETAILED DESCRIPTION
[0021] The accompanying drawings will be described below in conjunction with the Figures 1 to 20 The embodiments of the present application are described in detail, and the technical solutions in the embodiments of the present application are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0022] The present application provides a modular high-protection fusion intelligent ring network box by improvement, which comprises a radiator shell 1, a sealing top cover 2 and an intelligent ring network box structure 3, The inside of the radiator shell 1 is provided with the intelligent ring network box structure 3. First, the intelligent ring network box structure 3 is put into the inside of the radiator shell 1. The two sides of the radiator shell 1 are provided with preset holes 5, and the inside of the preset holes 5 is installed with rubber sealing plug-ins 4, The intelligent looped network box structure 3 comprises an intelligent looped network box host 301. Power supply wires 302 are installed on both sides of the intelligent looped network box host 301. The power supply wires 302 pass through the preset holes 5. The rubber sealing inserts 4 are installed at the connection between the preset holes 5 and the power supply wires 302, The power supply wires 302 are provided in two groups. The first group of power supply wires 302 is provided with a power supply outlet end 303 at one end away from the intelligent looped network box host 301. The second group of power supply wires 302 is provided with a power supply interface end 304 at one end away from the intelligent looped network box host 301. The shells of the intelligent looped network box hosts 301 on the market are various. For the intelligent looped network box host 301 with a sealed shell, the connection between the preset holes 5 and the power supply wires 302 can be blocked by the rubber sealing inserts 4. The condensate can be injected into the inside of the top radiator shell 1 of the semiconductor heat dissipation structure 10, so that the refrigeration effect of the semiconductor heat dissipation structure 10 is improved. For the intelligent looped network box host 301 with a hollow shell, the highly sealed radiator shell 1 can reduce the dust embedded in the intelligent looped network box host 301 during heat dissipation. The inside of the radiator shell 1 is provided with a fully-closed automatic opening and closing structure 9. The fully-closed automatic opening and closing structure 9 automatically opens and closes the sealing top cover 2. The fully-closed automatic opening and closing structure 9 controls the sealing top cover 2 to close the radiator shell 1. The fully-closed automatic opening and closing structure 9 has the advantages of automatic closure of the radiator shell 1, more convenience, and embedded design of the sealing top cover 2, which can avoid dust embedding. The bottom end of the radiator shell 1 is provided with a semiconductor heat dissipation structure 10, which can achieve direct driving of heat directional transfer through electric current through the semiconductor heat dissipation structure 10, and realize the function of solid-state refrigeration without mechanical parts. The semiconductor heat dissipation structure 10 comprises a ceramic heat-conducting substrate 1001. The ceramic heat-conducting substrate 1001 can facilitate heat conduction and insulation. The ceramic heat-conducting substrate 1001 is provided with a refrigeration end 1002 at one end close to the intelligent looped network box structure 3. The ceramic heat-conducting substrate 1001 is provided with a heat release end 1003 at one end close to the fan structure 7, The P-type semiconductor 1004 is installed on one side of the junction of the refrigeration end 1002 and the heat release end 1003, and the holes are the main carriers in the P-type semiconductor 1004. The N-type semiconductor 1005 is installed on the other side of the junction of the refrigeration end 1002 and the heat release end 1003, and the electrons are the main carriers in the N-type semiconductor 1005. The carriers will diffuse from the hot end to the cold end. When the direct current passes through the P and N, the holes in the P-type semiconductor 1004 and the electrons in the N-type semiconductor 1005 will move to the cold end. In the cold end, the carriers need to absorb heat to cross the energy level difference, and then the temperature of the cold end is reduced, thereby achieving the effect of cooling the intelligent ring network box structure 3. The heat of the hot end is dissipated to the environment through the cooperation of the fan structure 7 and the fin assembly 6. The P-type semiconductor 1004 and the N-type semiconductor 1005 in the semiconductor heat dissipation structure 10 are connected alternately by metal current guides to form a plurality of thermocouple pairs. They are connected at the end points to form two electrical ends, and one side of the hot end is connected with an electrode. The electrode is connected with an external power supply to provide a direct current. In addition, by reversing the current direction, the functions of the cold end and the hot end can be interchanged to achieve heating or refrigeration. The bottom end of the semiconductor heat dissipation structure 10 is installed with the fan structure 7, which achieves the effect of assisting the semiconductor heat dissipation structure 10 to dissipate heat, The fan structure 7 includes a second hinge seat 708, and one side of the second hinge seat 708 is installed and connected with the radiator shell 1, The first hinge seat 707 is provided on the side of the second hinge seat 708 away from the radiator shell 1, and the connecting side plate 701 is connected on the side of the first hinge seat 707 away from the second hinge seat 708, The connecting plug 709 penetrates the connection between the second hinge seat 708 and the first hinge seat 707, and the reinforcing knob 710 is installed on the top end of the connecting plug 709. The first hinge seat 707 and the second hinge seat 708 are spliced, the connecting plug 709 penetrates the connection, and the reinforcing knob 710 prevents the connecting plug 709 from falling off, so that the connecting side plate 701 can be folded around the connecting plug 709 as the center line, and the radiator fan 705 is driven to move; The supporting frame 704 is installed on the side of the connecting side plate 701 close to the radiator shell 1, and the radiator fan 705 is installed on the top end of the supporting frame 704. The moving pulley 706 is installed on the bottom end of the supporting frame 704. The moving pulley 706 assists the radiator fan 705 to slide. By pulling the connecting side plate 701, the radiator fan 705 on the top end of the supporting frame 704 can be pulled out of the device for cleaning. The radiator fan 705 adopts a movable design, which is more flexible and convenient, The anti-falling connecting piece 702 is installed on the side of the connecting side plate 701 away from the heat dissipation shell 1, and the inside of the anti-falling connecting piece 702 is installed with a locking piece 703, and the locking piece 703 is connected with an embedded groove 711 near the side of the heat dissipation shell 1, The embedded groove 711 and the embedded groove 712 are clamped and connected, and the position of the connecting side plate 701 can be locked by twisting the locking piece 703 to make the embedded groove 711 and the embedded groove 712 clamped, so as to prevent the active displacement of the heat dissipation fan 705 during the operation of the device; The fin assembly 6 is installed at the bottom end of the fan structure 7, The first motor 905 is provided with two groups of supporting pieces 907 installed on the two sides inside the heat dissipation shell 1, and the output end of the first motor 905 is connected with the supporting piece 907, and the top end of the supporting piece 907 is installed with the sealing top cover 2, The independent sealing piece 901 is installed on the two sides inside the heat dissipation shell 1, and the inside of the independent sealing piece 901 is installed with the first motor 905, and the first motor 905 is started by the external power supply, The output end of the first motor 905 is installed with the second hinge piece 911, the first motor 905 drives the second hinge piece 911 to rotate, and the second hinge piece 911 is hinged with the first hinge piece 910 on one side, the first hinge piece 910 is hinged with the supporting piece 907 away from the second hinge piece 911, and the top end of the supporting piece 907 is connected with the sealing top cover 2, when the second hinge piece 911 rotates around the first motor 905, the supporting piece 907 on one side of the first hinge piece 910 is pushed to move up, The inside of the independent sealing piece 901 is installed with a Y-shaped groove limiting plate 906 away from the first motor 905, the first sliding rod 908 is installed on the middle part of the supporting piece 907 near the Y-shaped groove limiting plate 906, and the second sliding rod 909 is installed on the bottom end of the supporting piece 907 near the Y-shaped groove limiting plate 906; the first sliding rod 908 and the second sliding rod 909 on the bottom end and the terminal of the supporting piece 907 provided with the first sliding rod 908 and the second sliding rod 909 move in the sliding groove of the Y-shaped groove limiting plate 906; when the supporting piece 907 is pushed up by the first hinge piece 910, the first sliding rod 908 and the second sliding rod 909 move up, when the first sliding rod 908 reaches the top end of the Y-shaped groove limiting plate 906, the supporting piece 907 will push the sealing top cover 2 at the top end to rise, at this time, when the first hinge piece 910 continues to push the supporting piece 907, the second sliding rod 909 will slide in the sliding groove on one side of the Y-shaped sliding groove around the first sliding rod 908 as the center line, at this time, the supporting piece 907 will drive the sealing top cover 2 fixed at the top to overturn and open the heat dissipation shell 1; The first motor 905 is provided with two groups, one group of output end of the first motor 905 is connected with the sixth transmission gear 904, Wherein, the bottom end of the sixth transmission gear 904 is provided with the fifth transmission gear 902, and the fifth transmission gear 902 and one end of the sixth transmission gear 904 are sleeved with the transmission gear chain 903, the fifth transmission gear 902, the transmission gear chain 903 and the sixth transmission gear 904 are driven by the meshing transmission; the first motor 905 is provided with two groups, one group of the first motor 905 is driven by the meshing transmission of the sixth transmission gear 904, the transmission gear chain 903 and the fifth transmission gear 902 as the power source of the fin assembly 6, so as to achieve the linkage and save the motor function, when the sealing top cover 2 is opened, the fin assembly 6 can start working; Wherein, the fin assembly 6 includes an external housing 601, the external housing 601 is installed at the bottom end of the radiator housing 1, and the second transmission gear 608 is installed on one side of the external housing 601, the sixth transmission gear 904 drives the second transmission gear 608 to rotate, the first transmission gear 607 is installed on one side of the second transmission gear 608, the second transmission gear 608 drives the first transmission gear 607 to rotate through the meshing transmission, and the double hinge 606 is installed at one end of the first transmission gear 607, the first transmission gear 607 is connected with the double hinge 606, and the double hinge 606 is provided with multiple groups, and every two groups of double hinges 606 are hinged through the hinge point; Wherein, the fifth transmission gear 902 is installed at one end of the external housing 601, the second transmission gear 608 is installed at one end of the fifth transmission gear 902, and the first transmission gear 607 is provided on one side of the second transmission gear 608, and the first transmission gear 607 and the second transmission gear 608 are driven by the meshing transmission, when the second transmission gear 608 rotates, the first transmission gear 607 is driven to rotate, Wherein, the first transmission gear 607 is installed on one side of the double hinge 606, the second transmission gear 608 is installed at the bottom end of the support angle piece 605, and the support angle piece 605 is installed at the bottom end of the heat dissipation fin 602; The third transmission gear 610 is connected with one end of the double hinge 606 away from the first transmission gear 607, the fourth transmission gear 611 is installed on one side of the third transmission gear 610, and the third transmission gear 610 and the fourth transmission gear 611 of one end of each group of double hinges 606 are driven, the connecting page piece 609 is installed at one end of the double hinge 606 away from the third transmission gear 610, and the double hinge 606 away from the hinge point is hinged with other double hinges 606 through the connecting page piece 609, so that the double hinge 606 can be driven to deform through the meshing transmission, so as to drive the heat dissipation fin 602 at the top end of the support angle piece 605 to overturn, so as to adjust the angle of the heat dissipation fin 602; One end of the external shell 601 is inlaid with a limiting sliding groove 603, and the inside of the limiting sliding groove 603 is provided with a limiting sliding block 604, and the limiting sliding block 604 connected with one end of the page piece 609 penetrates and slides in the limiting sliding groove 603, Among them, the limiting sliding block 604, the double-headed articulated piece 606, the support angle piece 605, the third transmission gear 610 and the fourth transmission gear 611 are all provided with multiple groups, Among them, the double-headed articulated piece 606 is internally provided with two groups of double-headed articulated rods, which are connected through an articulation point, and the ends of the two groups of double-headed articulated rods away from the articulation point are respectively connected with the third transmission gear 610 and the fourth transmission gear 611 on both sides, In addition, the fin assembly 6 can automatically open and close the heat dissipation fins 602, and can automatically adjust the angle of the heat dissipation fins 602 according to the heat dissipation demand, and when the device is not used, the heat dissipation fins 602 are closed to achieve the effect of dust prevention; Among them, the external shell 601 is provided with a support base 8 at the edge of the bottom end of the heat dissipation device 1, which is convenient for reserving space for the turning of the heat dissipation fins 602; Among them, the sealing top cover 2 and the fin assembly 6 can achieve the effect of dust prevention in addition to the basic effect, because the dust accumulated for many years during the use of computers and electrical appliances will greatly affect the heat dissipation problem of the computer, the function of the device is to avoid dust blocking the radiator and fan of the computer, increase the air flow speed, improve the heat dissipation efficiency of the device, avoid the CPU and GPU and other hardware overheating caused by the temperature rise, because the temperature rise will cause the system to automatically reduce the performance to protect the hardware, and then cause the running speed to slow down or even appear automatic shutdown, blue screen and other problems, the device avoids the influence of deposited dust on the use experience, and then avoids the other potential problems that the conductive substances in the dust cause the circuit to be short-circuited, damage the mainboard, graphics card and other key components, and cause economic losses to the user.
[0023] Working principle: first, put the intelligent ring network box structure 3 into the inside of the heat dissipation device shell 1, pass the power supply wire 302 at both ends of the intelligent ring network box host 301 through the preset hole 5 on both sides of the heat dissipation device shell 1, and then start the fully enclosed automatic opening and closing structure 9 to control the sealing top cover 2 to close the heat dissipation device shell 1, the advantage of the fully enclosed automatic opening and closing structure 9 is that it can automatically close the heat dissipation device shell 1, which is more convenient, and the sealing top cover 2 is embedded design, which can avoid dust embedding; And the shell form of the intelligent looped network box host 301 on the market is different. For the intelligent looped network box host 301 with a sealed shell, after the rubber sealing plug 4 is used to block the connection between the preset hole 5 and the power supply wire 302, the condensate can be injected into the inside of the top radiator shell 1 of the semiconductor heat dissipation structure 10, so as to improve the refrigeration effect of the semiconductor heat dissipation structure 10. For the intelligent looped network box host 301 with a hollow shell, the highly sealed radiator shell 1 can reduce the dust embedded in the intelligent looped network box host 301 during the heat dissipation process.
[0024] Then, the first motor 905 is started through an external power supply, the first motor 905 drives the second hinge 911 to rotate, and the second hinge 911 is hinged with the first hinge 910. When the second hinge 911 rotates around the first motor 905, the support 907 on one side of the first hinge 910 is pushed up, the first slide rod 908 and the second slide rod 909 arranged at the bottom end and the terminal of the side of the Y-shaped groove limiting plate 906 are moved in the sliding groove of the Y-shaped groove limiting plate 906, and when the support 907 is pushed up by the first hinge 910, the first slide rod 908 and the second slide rod 909 are moved up. When the first slide rod 908 reaches the top end of the Y-shaped groove limiting plate 906, the support 907 pushes up the sealing top cover 2 at the top end, and when the first hinge 910 continues to push the support 907, the second slide rod 909 slides in the sliding groove on one side of the Y-shaped groove around the first slide rod 908 as the center line. At this time, the support 907 drives the sealing top cover 2 fixed at the top end to overturn, so as to open the radiator shell 1; In addition, the fin assembly 6 can automatically open and close the heat dissipation fins 602, and can automatically adjust the angle of the heat dissipation fins 602 according to the heat dissipation requirement. When the device is not used, the heat dissipation fins 602 are closed to achieve the dustproof effect, Wherein the first motor 905 is provided with two groups, one of which is the first motor 905 through the sixth transmission gear 904, transmission gear chain 903 and the fifth transmission gear 902 meshing transmission as the power source of fin assembly 6, to achieve linkage and save the role of motor, when the sealing top cover 2 is opened, fin assembly 6 can start working, the sixth transmission gear 904 drives the second transmission gear 608 to rotate, the second transmission gear 608 drives the first transmission gear 607 to rotate through the meshing transmission, one end of the first transmission gear 607 is connected with double head articulated piece 606, double head articulated piece 606 is provided with multiple groups, every two groups of double head articulated piece 606 are hinged through the hinge point, and the end of double head articulated piece 606 away from the hinge point is hinged with other double head articulated piece 606 through the connecting fin 609, and the limiting sliding block 604 penetrating one end of the connecting fin 609 slides in the limiting sliding slot 603, when the second transmission gear 608 rotates, it drives the first transmission gear 607 to rotate, the third transmission gear 610 and the fourth transmission gear 611 provided at one end of each group of double head articulated piece 606 are driven, so that the double head articulated piece 606 composed of articulated arm can be deformed through meshing transmission, so as to drive the heat dissipation fin 602 at the top end of the supporting angle piece 605 to overturn, so as to adjust the angle of the heat dissipation fin 602.
[0025] Finally, through the semiconductor heat dissipation structure 10, the direct current driven heat directional transfer is realized, and the solid-state refrigeration function is realized without mechanical parts. The ceramic heat conduction substrate 1001 can facilitate heat conduction and insulation. One end of the ceramic heat conduction substrate 1001 close to the intelligent ring network box structure 3 is provided with a refrigeration end 1002, and the other end close to the fan structure 7 is provided with a heat dissipation end 1003. The P-type semiconductor 1004 and the N-type semiconductor 1005 in the semiconductor heat dissipation structure 10 are alternately connected by metal current guide pieces, forming multiple thermocouple pairs. They are connected at the end point, forming two electrical ends, and one side of the hot end is connected with an electrode. The electrode is connected with an external power supply to provide direct current. In the P-type semiconductor 1004, holes are the main carriers, while in the N-type semiconductor 1005, electrons are the main carriers. The carriers will diffuse from the hot end to the cold end. Therefore, when the direct current passes through P and N, the holes in the P-type semiconductor 1004 and the electrons in the N-type semiconductor 1005 will move to the cold end. At the cold end, the carriers need to absorb heat to cross the energy level difference, thereby reducing the temperature of the cold end, so as to achieve the effect of cooling the intelligent ring network box structure 3. The heat at the hot end is dissipated to the environment through the cooperation of the fan structure 7 and the fin assembly 6. In addition, by reversing the current direction, the functions of the cold end and the hot end can be interchanged to achieve heating or refrigeration. In addition, the fan structure 7 can assist the semiconductor heat dissipation structure 10 to dissipate heat. In addition, the support frame 704 can be pulled to take out the heat dissipation fan 705 at the top of the support frame 704 from the device for cleaning. The moving pulley 706 can assist the heat dissipation fan 705 to slide. The heat dissipation fan 705 is designed to be movable, which is more flexible and convenient. The fan structure 7 is spliced through the first hinge seat 707 and the second hinge seat 708. The connecting plug 709 penetrates the connection. The reinforcing knob 710 prevents the connecting plug 709 from falling off, so that the connecting side plate 701 can be folded around the connecting plug 709 as the center line, and drive the heat dissipation fan 705 to move. The torsion locking piece 703 can make the embedded groove 711 and the embedded recess 712 be clamped to lock the position of the connecting side plate 701, so as to prevent the heat dissipation fan 705 from moving and shifting during the operation of the device.
[0026] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to these embodiments will be readily apparent to those of ordinary skill in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A modular, high-protection, integrated intelligent ring network box, comprising a radiator shell (1), a sealed top cover (2), and an intelligent ring network box structure (3), characterized in that: The radiator housing (1) is equipped with a fully enclosed automatic opening and closing structure (9), which automatically opens and closes the sealing top cover (2). The bottom of the radiator housing (1) is provided with a semiconductor heat dissipation structure (10), and a fan structure (7) is installed at the bottom of the semiconductor heat dissipation structure (10). A fin assembly (6) is installed at the bottom of the fan structure (7). The fully enclosed automatic opening and closing structure (9) includes a first motor (905) and a support member (907). The first motor (905) has two sets installed on both sides inside the radiator housing (1). The output end of the first motor (905) is connected to the support member (907), and a sealing top cover (2) is installed on the top of the support member (907). The fin assembly (6) includes an outer housing (601), which is installed at the bottom of the radiator housing (1). A second transmission gear (608) is installed on one side of the outer housing (601), a first transmission gear (607) is installed on one side of the second transmission gear (608), and a double-headed hinge (606) is installed at one end of the first transmission gear (607).
2. The modular high-protection integrated intelligent ring network box according to claim 1, characterized in that: The radiator housing (1) is provided with an intelligent ring network box structure (3) inside. The radiator housing (1) has preset holes (5) on both sides, and rubber sealing plugs (4) are installed inside the preset holes (5). The intelligent ring network box structure (3) includes an intelligent ring network box host (301), and power cords (302) are installed on both sides of the intelligent ring network box host (301). The power cords (302) pass through the preset hole (5), and the rubber sealing plug (4) is installed at the connection between the preset hole (5) and the power cords (302). The power supply wires (302) are provided in two sets. The first set of power supply wires (302) has a power outlet end (303) installed at the end away from the intelligent ring network box host (301), and the second set of power supply wires (302) has a power interface end (304) installed at the end away from the intelligent ring network box host (301).
3. The modular high-protection integrated intelligent ring network box according to claim 2, characterized in that: Independent seals (901) are installed on both sides inside the radiator housing (1), and a first motor (905) is installed on one side inside the independent seal (901). The output end of the first motor (905) is equipped with a second hinge (911), and a first hinge (910) is hinged to one side of the second hinge (911). A support (907) is hinged to the end of the first hinge (910) away from the second hinge (911), and the top end of the support (907) is connected to the sealing top cover (2). Among them, a Y-shaped groove limiting plate (906) is installed on the side of the independent sealing member (901) away from the first motor (905), a first slide rod (908) is installed in the middle of the side of the support member (907) near the Y-shaped groove limiting plate (906), and a second slide rod (909) is installed at the bottom end of the side of the support member (907) near the Y-shaped groove limiting plate (906).
4. The modular high-protection integrated intelligent ring network box according to claim 3, characterized in that: The first motor (905) is provided in two sets, one of which has a sixth transmission gear (904) connected to the output end of the first motor (905). The bottom end of the sixth transmission gear (904) is provided with a fifth transmission gear (902), and a transmission gear chain (903) is sleeved on one end of the fifth transmission gear (902) and the sixth transmission gear (904). The fifth transmission gear (902), the transmission gear chain (903) and the sixth transmission gear (904) are driven by meshing.
5. A modular high-protection integrated intelligent ring network box according to claim 4, characterized in that: One end of the outer housing (601) is fitted with a limiting groove (603), and the limiting groove (603) is provided with a limiting slider (604). The fifth transmission gear (902) is mounted on one end of the outer housing (601), and a second transmission gear (608) is mounted on one end of the fifth transmission gear (902). A first transmission gear (607) is provided on one side of the second transmission gear (608), and the first transmission gear (607) and the second transmission gear (608) are driven by meshing. Among them, a double-headed hinge (606) is installed on one side of the first transmission gear (607), a support corner piece (605) is installed at the bottom of the second transmission gear (608), and a heat dissipation fin (602) is installed at the bottom of the support corner piece (605).
6. A modular high-protection integrated intelligent ring network box according to claim 5, characterized in that: The end of the double-headed hinge (606) away from the first transmission gear (607) is connected to the third transmission gear (610), and a fourth transmission gear (611) is installed on one side of the third transmission gear (610). A connecting blade (609) is installed on the end of the double-headed hinge (606) away from the third transmission gear (610). The limiting slider (604), double-headed hinge (606), supporting corner piece (605), third transmission gear (610), and fourth transmission gear (611) are all provided in multiple sets. The double-headed hinge (606) has two sets of double-headed hinge rods inside. The two sets of double-headed hinge rods are hinged together through a hinge point, and the ends of the two sets of double-headed hinge rods away from the hinge point are respectively installed and connected to the third transmission gear (610) and the fourth transmission gear (611) on both sides. Among them, the outer housing (601) is equipped with a support base (8) at the four edges of the outer housing (601) away from the bottom of the radiator housing (1).
7. A modular high-protection integrated intelligent ring network box according to claim 1, characterized in that: The fan structure (7) includes a second hinge seat (708), and one side of the second hinge seat (708) is installed and connected to the radiator housing (1). The second hinge seat (708) is provided with a first hinge seat (707) on the side away from the radiator housing (1), and a connecting side plate (701) is connected to the side of the first hinge seat (707) away from the second hinge seat (708). The second hinge (708) and the first hinge (707) are connected by a connecting plug (709), and a reinforcing knob (710) is installed on the top of the connecting plug (709). Among them, a support frame (704) is installed on the side of the connecting side plate (701) near the radiator housing (1), and a cooling fan (705) is installed on the top of the support frame (704), and a movable pulley (706) is installed on the bottom of the support frame (704).
8. A modular high-protection integrated intelligent ring network box according to claim 7, characterized in that: The connecting side plate (701) is equipped with an anti-detachment connector (702) on the side away from the radiator housing (1), and a locking member (703) is installed inside the anti-detachment connector (702). The locking member (703) is connected to an embedded groove (711) on the side close to the radiator housing (1). The outer shell (601) has an embedded groove (712) at one end near the embedding groove (711), and the embedding groove (711) and the embedded groove (712) are engaged and connected.
9. A modular high-protection integrated intelligent ring network box according to claim 8, characterized in that: The semiconductor heat dissipation structure (10) includes a ceramic thermally conductive substrate (1001), and a cooling end (1002) is installed on one end of the ceramic thermally conductive substrate (1001) near the intelligent ring network box structure (3), and a heat dissipation end (1003) is installed on one end of the ceramic thermally conductive substrate (1001) near the fan structure (7). A P-type semiconductor (1004) is installed on one side of the connection between the cooling end (1002) and the heating end (1003), and an N-type semiconductor (1005) is installed on the other side of the connection between the cooling end (1002) and the heating end (1003).
Citation Information
Patent Citations
External protection structure of primary and secondary fusion ring main unit
CN215419302U