Multi-band adaptive control system for radio frequency front-end module

Abstract

The invention relates to the technical field of radio frequency front-end modules, in particular to a multi-band adaptive control system for a radio frequency front-end module, and the system comprises a substrate which is integrated with a low-noise amplifier and a power amplifier; the sensing unit is used for collecting real-time operation data of the power amplifier, and the real-time operation data at least comprise temperature data and output power data; the inter-stage matching network is connected between the low-noise amplifier and the power amplifier; the output matching network is connected with the output end of the power amplifier; and the main control unit is respectively connected with the sensing unit, the inter-stage matching network and the output matching network, and the main control unit is used for coordinating task scheduling and control signal issuing of each unit. The radio frequency front-end module has the effect of reducing the size of the radio frequency front-end module while realizing unified coordination and adjustment of control.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of radio frequency front-end modules, in particular to a multi-band adaptive control system for a radio frequency front-end module. BACKGROUND

[0002] At present, with the rapid development of modern wireless communication technologies such as 5G, the performance of the radio frequency front-end system, as a core component of wireless communication equipment, directly determines the communication quality and reliability of the entire system. The radio frequency front-end system usually integrates key devices such as power amplifiers (PAs) and low noise amplifiers (LNAs), which are responsible for signal transmission amplification and reception amplification, respectively.

[0003] In traditional radio frequency front-end module design, low noise amplifiers and power amplifiers are usually designed independently using separate chips or modules, and then connected through PCB traces. In order to achieve inter-stage matching, external inter-stage matching networks such as LC circuits are often needed. At the same time, the output network of the power amplifier is usually optimized for a single frequency band, making it difficult to dynamically adapt to multi-band requirements. In terms of heat dissipation, a row of metal heat sinks or conductive thermal silicon is usually used for heat conduction, and no active measures are taken to isolate the thermal coupling between the low noise amplifier and the power amplifier. Moreover, when the low noise amplifier and the power amplifier are designed independently, the inter-stage impedance matching network will introduce a certain insertion loss, which will worsen the noise figure of the system. Furthermore, the fixed matching network used in traditional power amplifiers will greatly reduce the efficiency when switching across frequency bands. In addition, the heat generated by the power amplifier during high-power output will cause the transistors of the adjacent low noise amplifier to drift, thereby degrading the noise figure. At the same time, the external heat dissipation device will occupy a large area of the PCB, hindering the miniaturization design of the module, and thus there is room for improvement. SUMMARY

[0004] The present application provides a multi-band adaptive control system for a radio frequency front-end module, which can realize unified coordination and adjustment of control while reducing the volume of the radio frequency front-end module.

[0005] The above-mentioned application purpose of the present application is achieved by the following technical solution:

[0006] A multi-band adaptive control system for a radio frequency front-end module, comprising:

[0007] a substrate, the substrate having a low noise amplifier and a power amplifier integrated thereon;

[0008] a sensing unit for collecting real-time operating data of the power amplifier, the real-time operating data including at least temperature data and output power data;

[0009] an inter-stage matching network connected between the low-noise amplifier and the power amplifier;

[0010] an output matching network connected to an output end of the power amplifier;

[0011] a master control unit connected to the sensing unit, the inter-stage matching network and the output matching network respectively, and configured to coordinate task scheduling and control signal issuing of each unit.

[0012] By integrating the low-noise amplifier and the power amplifier on the same substrate, the module size can be significantly reduced, the radio frequency signal transmission path can be shortened, the inter-stage insertion loss can be reduced, and the system noise figure can be improved.

[0013] In a preferred example, the application can be further configured to have a MEMS bypass switch integrated on the substrate, the MEMS bypass switch being connected in parallel with the power amplifier and controlled by the master control unit, and used to selectively bypass the power amplifier in different working modes.

[0014] By adding the MEMS bypass switch, the power amplifier can be completely bypassed in the receiving mode without high power amplification, the power consumption of the system in the standby or receiving state can be significantly reduced, the endurance time of the mobile terminal can be prolonged, and the flexibility of the system working mode is improved.

[0015] In a preferred example, the application can be further configured to have an isolation wall arranged between the low-noise amplifier and the power amplifier, wherein the surface of the low-noise amplifier is covered with an aerogel thermal insulation layer.

[0016] By arranging the physical isolation wall and covering the aerogel thermal insulation layer, the heat generated by the power amplifier during operation can be effectively blocked from spreading to the low-noise amplifier area from the two paths of heat conduction and heat radiation, the thermal crosstalk effect is greatly inhibited, the stability of the low-noise amplifier performance is ensured, the noise figure degradation caused by temperature drift is avoided, and the high sensitivity of the receiving link is ensured.

[0017] In a preferred example, the application can be further configured to have the inter-stage matching network and the output matching network each comprising an array of adjustable capacitors and adjustable inductors.

[0018] By adopting the above technical scheme, the impedance matching can be dynamically adjusted by adopting the matching network composed of the adjustable capacitor and the adjustable inductor, so that the matching tuning can be performed for different working frequency bands, thereby overcoming the defect that the traditional fixed matching network is only optimal at a single frequency point, and ensuring that the radio frequency front-end module can maintain high efficiency and high linearity within the entire working bandwidth.

[0019] In a preferred example, the multi-band adaptive control system further comprises a micro-channel heat dissipation structure, which is arranged on the back surface of the substrate region corresponding to the power amplifier.

[0020] By adopting the above technical scheme, the micro-channel heat dissipation structure is integrated on the back surface of the heat source region of the power amplifier, so that the fluid can be used for efficient active heat dissipation, the temperature rise of the power amplifier can be effectively controlled, stable output under high power can be ensured, and the structure is compact, which greatly promotes the miniaturization and integration of the entire radio frequency front-end module.

[0021] In a preferred example, the master control unit is configured to,

[0022] acquire real-time running data and current working frequency band data of the power amplifier, the real-time running data at least including the temperature data and the output power data;

[0023] determine target control parameters according to the real-time running data and the current working frequency band data, the target control parameters including target matching parameters and a target bias voltage;

[0024] adjust and control the inter-stage matching network and the output matching network according to the target control parameters.

[0025] By adopting the above technical scheme, the master control unit can analyze the real-time data, adjust and control the inter-stage matching network and the output matching network, so as to respond to the external working condition changes such as frequency switching and temperature change in real time, automatically optimize the matching network and the bias state, so as to always maintain the system at the optimal working point, and improve the comprehensive performance of the system.

[0026] In a preferred example, the determination of the target control parameters according to the real-time running data specifically includes:

[0027] determining the target matching parameters of the inter-stage matching network and the output matching network by using a preset matching parameter fitting function according to the frequency data in the real-time running data;

[0028] According to the temperature data, temperature change rate data is calculated, and based on the temperature data and the temperature change rate data, a preset thermal crosstalk feature lookup table is used to obtain a predicted temperature drift amount of the low noise amplifier;

[0029] Based on the predicted temperature drift amount, a target bias voltage of the low noise amplifier is determined.

[0030] By using the above technical solution, the optimal matching parameter at any frequency point can be quickly calculated by using the matching parameter fitting function, efficient broadband matching is realized, and further, the influence of thermal crosstalk on the low noise amplifier can be eliminated in advance by predicting the temperature drift amount based on the temperature and the temperature change rate and compensating the bias voltage. Compared with the lagging temperature compensation, this predictive compensation mechanism responds more quickly and controls more accurately, thereby further ensuring the ultimate stability of the reception performance.

[0031] In a preferred example, the application can be further configured such that the master control unit is further configured to determine a current working mode according to output power data, and determine closing and opening of the MEMS bypass switch according to a type of the current working mode.

[0032] By using the above technical solution, by associating the output power with the working mode, it can be autonomously determined when to enter the high-power transmission state and when to switch to the low-power consumption reception state, thereby optimizing the overall energy efficiency management and improving the user experience.

[0033] In a preferred example, the application can be further configured such that the determination of the current working mode according to the output power data and the determination of the closing and opening of the MEMS bypass switch according to the type of the current working mode specifically include:

[0034] When the output power data is lower than a preset low-power consumption threshold, the current working mode is determined to be a pure LNA reception mode, and the MEMS bypass switch is controlled to be closed.

[0035] When the output power data is higher than the low-power consumption threshold, the current working mode is determined to be an LNA-PA cascade amplification mode, and the MEMS bypass switch is controlled to be opened.

[0036] By using the above technical solution, by using the threshold-based judgment mechanism, mode misjudgment can be maximally avoided under the premise of ensuring normal switching of functions, thereby ensuring the stability of system operation.

[0037] The application can be further configured in a preferred example that the multi-band adaptive control system further comprises a low-temperature co-fired ceramic strip line connecting the low-noise amplifier and the power amplifier, and a PIN diode attenuator is integrated on the path of the low-temperature co-fired ceramic strip line, used for sending a feedback signal to the low-noise amplifier in the calibration mode.

[0038] By adopting the above technical solution, the device aging, performance drift and other problems can be compensated and corrected after production or long-term use by integrating the low-temperature co-fired ceramic strip line path with the PIN diode attenuator, thereby improving the production yield and long-term working reliability of the module and reducing the maintenance cost.

[0039] In summary, the application has at least one of the following beneficial technical effects:

[0040] 1. By integrating the low-noise amplifier and the power amplifier on the same substrate, the module size can be significantly reduced, the radio frequency signal transmission path can be shortened, the inter-stage insertion loss can be reduced, and the system noise coefficient can be improved. At the same time, by setting the sensing unit and the main control unit, a hardware foundation is provided for realizing adaptive control, which can dynamically adjust according to the actual working conditions, and improve the intelligent level and environmental adaptability of the radio frequency front-end system.

[0041] 2. By analyzing the real-time data by the main control unit, the inter-stage matching network and the output matching network are adjusted and controlled, which can respond to the changes of external working conditions such as frequency switching and temperature change in real time, automatically optimize the matching network and the bias state, so as to always maintain the system at the optimal working point, and improve the comprehensive performance of the system. BRIEF DESCRIPTION OF DRAWINGS

[0042] Figure 1 is a structure schematic diagram of a multi-band adaptive control system for a radio frequency front-end module in an embodiment of the application;

[0043] Figure 2 is a step implementation flowchart of a multi-band adaptive control system for a radio frequency front-end module in an embodiment of the application. DETAILED DESCRIPTION

[0044] The following embodiments will help those skilled in the art to further understand the application, but do not limit the application in any form. It should be pointed out that, for those skilled in the art, without departing from the concept of the application, a number of modifications and improvements can be made. These all belong to the protection scope of the application.

[0045] In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular architectures, technologies, techniques, etc. in order to provide a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application can be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.

[0046] It should be understood that the term "comprising" when used in this specification and the appended claims, specifies the presence of stated features, integers, steps, operations, elements, and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0047] A multi-band adaptive control system for a radio frequency front-end module, comprising:

[0048] a substrate, on which a low noise amplifier and a power amplifier are integrated;

[0049] a sensing unit, configured to collect real-time operation data of the power amplifier, the real-time operation data comprising at least temperature data and output power data;

[0050] an inter-stage matching network, connected between the low noise amplifier and the power amplifier;

[0051] an output matching network, connected to an output terminal of the power amplifier;

[0052] a master control unit, connected to the sensing unit, the inter-stage matching network, and the output matching network respectively, and configured to coordinate task scheduling and control signal issuing of the units.

[0053] Specifically, the substrate is preferably a semiconductor material with good high-frequency characteristics, such as gallium arsenide (GaAs) or gallium nitride (GaN), on which the low noise amplifier and the power amplifier are monolithically integrated, greatly shortening the physical distance between the two and thus significantly reducing the parasitic inductance and capacitance effects introduced by long wiring during signal transmission. The sensing unit can be a temperature sensor integrated in the vicinity of the power amplifier and a power detector that acquires power information through a coupling line, and the analog data collected by the sensing unit are sent to the master control unit after analog-to-digital conversion. The master control unit, as the control core of the system, internally runs a pre-set control algorithm and can generate accurate digital or analog control signals based on the received sensing data and external instructions, and issue the control signals to the inter-stage matching network and the output matching network respectively, to realize dynamic and closed-loop regulation and control of the entire radio frequency link.

[0054] In some embodiments, a MEMS bypass switch is also integrated on the substrate, which is connected in parallel with the power amplifier and controlled by the master control unit to selectively bypass the power amplifier in different operation modes.

[0055] Specifically, when the system is working in the receiving mode, the radio frequency signal only needs to pass through the low noise amplifier for amplification, at this time the power amplifier is in a non-working state, in order to avoid unnecessary insertion loss caused by the signal passing through the non-working power amplifier, the master control unit sends a control signal to close the MEMS bypass switch, and the closed MEMS switch forms a low-impedance signal path to guide the signal from the low noise amplifier to bypass directly to the output matching network or subsequent circuit, thereby ensuring the signal-to-noise ratio of the receiving link. Conversely, when the system switches to the transmitting mode, the master control unit controls the MEMS bypass switch to open, ensuring that the signal must flow through the power amplifier to obtain sufficient transmission power.

[0056] In some embodiments, an isolation wall is arranged between the low noise amplifier and the power amplifier, wherein the surface of the low noise amplifier is covered with an aerogel thermal insulation layer.

[0057] Specifically, the isolation wall can be formed by semiconductor processes such as deep etching or metal filling on the substrate, which physically blocks the heat conduction from the power amplifier area to the low noise amplifier area through the substrate material. The aerogel thermal insulation layer covering the surface of the low noise amplifier chip can effectively block the heat generated by the power amplifier from being transmitted to the low noise amplifier through thermal radiation and air convection, as a kind of nano-porous material with extremely low thermal conductivity. This double thermal insulation design of conduction isolation and radiation / convection isolation maximally suppresses the thermal crosstalk, ensures the stable temperature of the working environment of the low noise amplifier, and prevents the degradation of key performance parameters such as noise figure and gain due to temperature drift.

[0058] In some embodiments, the inter-stage matching network and the output matching network each include an array of adjustable capacitors and adjustable inductors.

[0059] Specifically, the adjustable capacitors can be an array of varactor diodes whose capacitance values are adjusted by changing the DC bias voltage, and the adjustable inductors can be variable inductors based on MEMS technology or composed of a switched inductor network. The master control unit outputs different DC voltages to the control terminals of these adjustable components through a digital-to-analog converter (DAC) according to the current operating frequency, thereby accurately changing the capacitance or inductance of each component. By coordinated control of multiple components in the array, the impedance characteristics of the matching network as a whole can be reconfigured to achieve nearly ideal 50-ohm impedance matching at different target frequencies such as switching from 2.4 GHz to 5.8 GHz, thereby ensuring efficient power transmission.

[0060] In some embodiments, the multi-band adaptive control system further comprises a micro-channel heat dissipation structure arranged on the back surface of the substrate region corresponding to the power amplifier.

[0061] Specifically, the micro-channel heat dissipation structure can form a complex micro-channel network on the back surface of the substrate by micro-machining technology and sealing packaging. The cooling liquid such as deionized water or special electronic cooling liquid circulating inside can efficiently absorb the large amount of Joule heat generated by the power amplifier during operation. The heat is quickly conducted to the cooling liquid through an extremely thin substrate and is taken away to an external heat sink for heat exchange. The heat exchange efficiency of this active liquid cooling heat dissipation mode is much higher than that of the traditional passive metal heat dissipation fin, which can strictly control the junction temperature of the power amplifier within a safe range, thereby supporting the stable operation of the power amplifier at a higher output power. At the same time, due to its compact structure, it is also beneficial to the miniaturization of the entire radio frequency front-end module.

[0062] In some embodiments, the master control unit is configured to,

[0063] obtain real-time operation data and current operating frequency band data of the power amplifier, the real-time operation data at least including temperature data and output power data;

[0064] determine target control parameters according to the real-time operation data and the current operating frequency band data, the target control parameters including target matching parameters and target bias voltage;

[0065] adjust the inter-stage matching network and the output matching network according to the target control parameters.

[0066] Specifically, the master control unit periodically reads the latest temperature and power values from the sensing unit and receives the current communication frequency band instruction from the system baseband or the upper controller. It substitutes these real-time changing input data into the internal fixed algorithm model for calculation to obtain a set of control parameters that can optimize the system performance under the current working condition. For example, when the working frequency changes are detected, the new matching network tuning voltage is calculated. When the temperature rises, the bias voltage adjustment amount for compensating the temperature drift is calculated. Then, these newly calculated target control parameters are updated to the corresponding execution unit, so that the system can adapt to the external changes in real time and automatically.

[0067] In some embodiments, the target control parameters are determined according to the real-time operation data, specifically including:

[0068] determining the target matching parameters of the inter-stage matching network and the output matching network according to the frequency data in the real-time operation data by using a preset matching parameter fitting function;

[0069] According to the temperature data, temperature change rate data is calculated, based on the temperature data and the temperature change rate data, a preset thermal crosstalk characteristic lookup table is used to obtain a predicted temperature drift amount of the low noise amplifier;

[0070] Based on the predicted temperature drift amount, a target bias voltage of the low noise amplifier is determined.

[0071] Specifically, the process of determining the target control parameter can be divided into two parallel sub-tasks, one responsible for frequency adaptive matching, and the other responsible for forward-looking thermal management. In the frequency adaptive matching task, the matching parameter fitting function is a mathematical expression or high-dimensional polynomial established by a large number of electromagnetic simulations and network analyzer scan tests on the circuit in the chip design and verification stage, which describes the accurate control voltage value required for each adjustable capacitor and adjustable inductor in the inter-stage matching network and the output matching network in order to achieve the best parameters such as minimum reflection loss and maximum gain at different operating frequencies. This function is written in the memory of the main control unit. When the main control unit receives new operating frequency band data such as switching from Band 1 of 4G to n78 frequency band of 5G, it will immediately substitute the center frequency value into the function for calculation, thereby solving a complete set of optimal control voltage combinations, and applying these voltages to the tuning elements of the matching network through digital-to-analog converters, completing the rapid frequency reconstruction. At the same time, in the thermal management task, the algorithm in the main control unit continuously performs time series analysis on the received temperature data, calculates the difference between the current temperature value and the temperature value of the last sampling period and then divides by the sampling time interval to obtain real-time temperature change rate data. This change rate data reflects the intensity and trend of heat generation of the power amplifier. Subsequently, the main control unit takes the current absolute temperature value and the temperature change rate data as two indexes to query the thermal crosstalk characteristic lookup table stored in the non-volatile memory. This table is obtained based on accurate simulation of the chip thermal model or by calibrating the actual chip with a thermal imager, and it records the drift amount of performance parameters such as gain and noise figure of the low noise amplifier caused by heat crosstalk from the power amplifier under different base temperatures and different heating rates. Through table lookup, the main control unit can obtain a predicted temperature drift amount. This predicted value not only considers the current thermal state, but more importantly, it predicts the future thermal trend. Based on this forward-looking predicted temperature drift amount, the main control unit calculates a compensatory bias voltage adjustment value. For example, if it is predicted that the gain will decrease by 0.5 dB, the gate bias voltage of the low noise amplifier will be adjusted accordingly to increase the gain by about 0.5 dB in advance, thereby actively and dynamically offsetting the negative effects of thermal crosstalk and maintaining the high stability of the receive link performance.

[0072] In some embodiments, the master control unit is further configured to determine a current operation mode according to the output power data, and determine the closing and opening of the MEMS bypass switch according to a type of the current operation mode.

[0073] Specifically, the master control unit determines the current operation mode of the system according to the real-time output power data obtained from the sensing unit. For example, when the mobile terminal is in standby or receiving data, the radio frequency front end does not need to transmit high-power signals, and the detected output power is very low. The master control unit determines that the system is in a receiving mode. When the user initiates a call or uploads data, the baseband chip drives the radio frequency link to transmit signals, and the output power rapidly increases. The master control unit detects this change and determines that the system switches to a transmitting mode. This automatic mode recognition based on actual power output enables the master control unit to intelligently manage the configuration of the radio frequency link without relying on frequent instructions from the upper software, thereby improving the autonomy of the system.

[0074] In some embodiments, the determination of the current operation mode according to the output power data, and the determination of the closing and opening of the MEMS bypass switch according to a type of the current operation mode specifically include:

[0075] When the output power data is lower than a preset low-power threshold, the current operation mode is determined to be a pure LNA receiving mode, and the MEMS bypass switch is controlled to be closed.

[0076] When the output power data is higher than the low-power threshold, the current operation mode is determined to be an LNA-PA cascade amplification mode, and the MEMS bypass switch is controlled to be opened.

[0077] Specifically, the low-power threshold is a power value that is pre-calibrated and set, for example, -10 dBm, which serves as a clear boundary between the receiving state and the transmitting state. A comparator in the master control unit continuously compares the real-time collected output power value with the threshold. When the power value is lower than the threshold for a long time, it indicates that the system is in a pure signal receiving or standby state. At this time, the pure LNA receiving mode strategy is executed, that is, the MEMS switch is closed to bypass the power amplifier, thereby saving power consumption and optimizing the performance of the receiving link. Once it is detected that the output power value exceeds the threshold, it is immediately determined that the system has entered a transmitting state that requires power amplification. At this time, the LNA-PA cascade amplification mode strategy is executed, that is, the MEMS bypass switch is opened, and the power amplifier is connected in series in the signal link to provide the necessary transmitting gain.

[0078] In some embodiments, the multi-band adaptive control system further includes a low-temperature co-fired ceramic strip line connected between the low-noise amplifier and the power amplifier, and a PIN diode attenuator integrated on the low-temperature co-fired ceramic strip line path, for sending a feedback signal to the low-noise amplifier in the calibration mode.

[0079] Specifically, in a particular calibration mode, such as at device startup or idle, the host unit can control the power amplifier to generate a low-power known test signal that is fed back through the stripline path, through a PIN diode attenuator controlled by the host unit, to the input of the low noise amplifier. The host unit then compares the actual output of the low noise amplifier to the theoretically expected output, and by analyzing the difference between the two, can accurately assess whether the gain, linearity, and other performance metrics of the current link are deviating. If deviations are detected, the host unit can automatically adjust its internal control algorithm parameters or bias voltages to compensate for performance drifts due to device aging or environmental changes, thus enabling online automatic calibration of the system.

[0080] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the above-mentioned division of each functional unit and module is exemplified, and in actual application, the above-mentioned functions can be completed by different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above.

[0081] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A multi-band adaptive control system for radio frequency front-end modules, characterized in that, include: A substrate on which a low-noise amplifier and a power amplifier are integrated; A sensing unit is used to collect real-time operating data of the power amplifier, wherein the real-time operating data includes at least temperature data and output power data; An interstage matching network is connected between the low-noise amplifier and the power amplifier; An output matching network is connected to the output terminal of the power amplifier; The main control unit is connected to the sensing unit, the inter-level matching network, and the output matching network, respectively. The main control unit is used to coordinate the task scheduling and control signal distribution of each unit.

2. The multi-band adaptive control system according to claim 1, characterized in that, A MEMS bypass switch is also integrated on the substrate. The MEMS bypass switch is connected in parallel with the power amplifier and is controlled by the main control unit to selectively allow the radio frequency signal to bypass the power amplifier in different operating modes.

3. The multi-band adaptive control system according to claim 1, characterized in that, An isolation wall is provided between the low-noise amplifier and the power amplifier, wherein the surface of the low-noise amplifier is covered with an aerogel heat insulation layer.

4. The multi-band adaptive control system according to claim 1, characterized in that, Both the inter-stage matching network and the output matching network comprise an array of adjustable capacitors and adjustable inductors.

5. The multi-band adaptive control system according to claim 1, characterized in that, The multi-band adaptive control system also includes a microchannel heat dissipation structure, which is disposed on the back side of the substrate region corresponding to the power amplifier.

6. The multi-band adaptive control system according to claim 2, characterized in that, The main control unit is used for, Acquire the real-time operating data and current operating frequency band data of the power amplifier, wherein the real-time operating data includes at least the temperature data and the output power data; Based on the real-time operating data and the current operating frequency band data, the target control parameters are determined, including the target matching parameters and the target bias voltage; The inter-level matching network and the output matching network are adjusted according to the target control parameters.

7. The multi-band adaptive control system according to claim 4, characterized in that, The step of determining the target control parameters based on the real-time operating data specifically includes: Based on the frequency data in the real-time running data, the target matching parameters of the inter-level matching network and the output matching network are determined using a preset matching parameter fitting function. Based on the temperature data, the temperature change rate data is calculated. Based on the temperature data and the temperature change rate data, the predicted temperature drift of the low-noise amplifier is obtained using a preset thermal crosstalk feature lookup table. Based on the predicted temperature drift, the target bias voltage of the low-noise amplifier is determined.

8. The multi-band adaptive control system according to claim 2, characterized in that, The main control unit is also used to determine the current operating mode based on the output power data, and to determine the closing and opening of the MEMS bypass switch based on the type of the current operating mode.

9. The multi-band adaptive control system according to claim 6, characterized in that, The process of determining the current operating mode based on output power data, and determining the closing and opening of the MEMS bypass switch based on the type of the current operating mode, specifically includes: When the output power data is lower than the preset low power threshold, the current working mode is determined to be pure LNA receiving mode, and the MEMS bypass switch is controlled to close. When the output power data is higher than the low power consumption threshold, the current operating mode is determined to be LNA-PA cascade amplification mode, and the MEMS bypass switch is controlled to open.

10. The multi-band adaptive control system according to claim 1, characterized in that, The multi-band adaptive control system also includes a cryogenic co-fired ceramic stripline connecting the low-noise amplifier and the power amplifier. A PIN diode attenuator is also integrated on the path of the cryogenic co-fired ceramic stripline for sending a feedback signal to the low-noise amplifier in calibration mode.

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