Processing method for improving processing efficiency of groove of printed circuit board

Abstract

The invention relates to the technical field of circuit boards, in particular to a processing method for improving the processing efficiency of a groove of a printed circuit board. Intelligent matching of the machining modes is achieved through a machining mode sorting mechanism, the comprehensive influence coefficient is obtained on the basis of the design parameters of the groove to be machined and combined with the machining influence coefficient, then the comprehensive influence coefficient is compared with the dynamically-adjusted comprehensive division threshold value, and it is accurately judged that laser finish machining or mechanical-laser combined machining is adopted; the problems that time is prolonged and energy consumption is increased sharply due to the fact that scanning is needed for multiple times in the deep groove machining process through single laser machining are solved, the defect that precision of single machining is insufficient is overcome, grooves of different depths and materials can be matched with the optimal machining path, and the overall machining efficiency is greatly improved. And through combined machining regional treatment, machining monitoring and quality evaluation early warning are matched, machining abnormities are reduced, process problems are found in time, the defective product rate is reduced, and meanwhile the machining quality stability is guaranteed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board, in particular to a processing method for improving the processing efficiency of a printed circuit board cavity. BACKGROUND

[0002] Today, with the continuous miniaturization of electronic products, the space on the circuit board becomes more and more valuable; the appearance of the printed circuit board cavity (Cavity) can effectively reduce the assembly height for large components, thereby optimizing the space utilization of the circuit board and making the entire product more compact; Cavity design can effectively reduce electromagnetic interference; some high-frequency or high-power components may generate strong electromagnetic fields when working, which may cause electromagnetic interference to the surrounding circuits; placing these components in the Cavity and taking appropriate shielding measures can effectively reduce electromagnetic interference and increase signal transmission distance and improve signal transmission speed.

[0003] In traditional printed circuit board cavity processing, laser processing has obvious limitations: as the processing depth increases, multiple repeated scanning is required, resulting in prolonged processing time, low efficiency, and significantly increased energy consumption; increasing laser energy to speed up can easily cause copper breakdown at the bottom of the hole, uneven bottom plane, and carbonization of the sidewall, among other problems; in addition, a single processing method cannot adapt to the processing needs of cavities of different depths and materials, and cannot balance efficiency and quality. SUMMARY

[0004] The present application provides a processing method for improving the processing efficiency of a printed circuit board cavity to solve the above technical problems.

[0005] The present application provides a processing method for improving the processing efficiency of a printed circuit board cavity, comprising the following steps: Step 1: Collecting the design parameters of the cavity to be processed by data acquisition technology; the design parameters include the target depth of the cavity, the opening size of the cavity, and the material parameters of the board; the material parameters of the board include the material types corresponding to the dielectric layer and the conductive layer, respectively.

[0006] Step 2: Obtaining the design parameters of the current cavity to be processed and inputting the design parameters into a preset processing mode sorting mechanism; the processing mode sorting mechanism outputs an initial processing mode signal based on the design parameters, the initial processing mode signal includes a laser finishing signal and a mechanical and laser composite processing signal; and the initial processing mode signal is identified by a signal recognition unit; when the initial processing mode signal corresponds to the mechanical and laser composite processing signal, step 3 is performed on the cavity to be processed; when the initial processing mode signal corresponds to the laser finishing signal, step 4 is performed on the cavity to be processed.

[0007] As a further improvement of the present application, the processing mode sorting mechanism outputs an initial processing mode signal based on the design parameters, which is specifically: The processing mode sorting mechanism comprises a processing mode threshold setting unit and a processing mode matching unit, and the design parameters of each groove to be processed are identified to obtain a groove target depth and a plate material parameter; The processing influence analysis unit specifically analyzes the processing influence coefficient of the plate material parameter of each groove to be processed to obtain the corresponding processing influence coefficient; The processing mode matching unit specifically matches and analyzes the groove target depth of the groove to be processed with the processing influence coefficient to obtain the corresponding initial processing mode signal.

[0008] Further, the processing influence coefficient of the plate material parameter of each groove to be processed is analyzed to obtain the corresponding processing influence coefficient, which is specifically: According to the plate material parameter, the medium layer parameter and the conductive layer parameter corresponding to the to-be-processed area corresponding to the to-be-processed groove are obtained; according to the medium layer parameter, the material hardness and the medium heat resistance corresponding to the medium layer are obtained, the material hardness is the material hardness value obtained by converting the material hardness of the medium layer through the Shore hardness conversion method; the material hardness values corresponding to the commonly used media of the PCB plate in the database are obtained, the material hardness values corresponding to each commonly used medium are collected to obtain a medium hardness span interval, and the numerical value of the lowest medium hardness corresponding to the medium hardness span interval is marked as a hardness reference point; the hardness reference point and the material hardness value corresponding to each to-be-processed groove are substituted into a preset arctangent function to calculate the material hardness factor to obtain the medium hardness coefficient, that is, through the formula the hardness influence coefficient is calculated ; wherein YD corresponds to the material hardness value corresponding to the medium layer parameter; YD jz represents the hardness reference point, YD mg represents a preset hardness interval compression constant, which is 20.

[0009] The medium heat resistance is identified to obtain the glass transition temperature interval of each type of material, the glass transition temperature interval of each type of material is collected to obtain the medium layer glass transition temperature interval, and the middle value of the medium layer glass transition temperature interval is marked as a heat resistance reference point; the glass transition temperature value of the medium layer corresponding to the to-be-processed groove and the heat resistance reference point are input into a preset heat resistance influence index decay function model to calculate the heat resistance influence coefficient ; wherein respectively represent the heat resistance reference point and the glass transition temperature value; 0.01 is a preset heat resistance sensitivity constant.

[0010] obtain the thickness of the conductive layer and the surface state of the conductive layer based on the conductive layer parameters; obtain a thickness standard maximum value of the conductive layer copper foil in the PCB industry based on a database, and perform summation calculation on the thickness standard maximum value and a preset upper limit constant, and mark the obtained value as a conductive layer thickness upper limit extreme value; input the value of the conductive layer thickness of the current groove to be processed and the conductive layer thickness upper limit extreme value into a preset thickness influence logarithmic function calculation model obtain the thickness influence coefficient by calculation ; wherein HD represents the conductive layer thickness, represents the conductive thickness upper limit extreme value. represents a preset thickness weight coefficient, and the value is 0.2.

[0011] obtain the laser reflectivity of the surface of the conductive layer according to the surface state of the conductive layer, obtain a corresponding preset light reflection threshold based on a laser in the laser processing database, obtain a low light reflection area and a high light reflection area according to the light reflection threshold, and mark them as [0, F th ] and (F th , 1] respectively; obtain the reflection influence coefficient by calculation based on a preset power law function and a hyperbolic tangent function coupling model ; wherein F BM represents the laser reflectivity. respectively represent a preset maximum laser gain coefficient and a maximum laser inhibition coefficient. represents a preset power index, and the value is a constant greater than zero; represents a preset reflection sensitivity factor, and the value is 10.

[0012] The hardness influence coefficient, the heat resistance influence coefficient, the thickness influence coefficient and the reflection influence coefficient are collected to obtain the processing influence coefficient corresponding to each groove to be processed.

[0013] Further, the groove target depth of the groove to be processed is matched and analyzed with the processing influence coefficient to obtain the corresponding initial processing mode signal, which is specifically: obtain the hardness influence coefficient, the heat resistance influence coefficient, the thickness influence coefficient and the reflection influence coefficient by identifying the processing influence coefficient, normalize each processing influence coefficient and take its value, and input the normalized processing influence coefficient into a preset processing coefficient coupling formula obtain the comprehensive influence coefficient by calculation ; wherein represents the weight coefficient corresponding to each processing influence coefficient, and the value is 0.33, 0.17, 0.34 and 0.16.

[0014] obtain a preset initial processing division threshold for the groove to be processed, and input the comprehensive influence coefficient and the initial processing division threshold into a preset hyperbolic tangent comprehensive model​ computing an output comprehensive division threshold value ; wherein, respectively represent an initial machining division threshold value and a preset maximum threshold value adjustment range; obtain the target design parameter corresponding to the groove target depth of the current groove to be machined, obtain the comprehensive division threshold value of the target design parameter based on the hyperbolic tangent comprehensive model, and mark it as the target division threshold value, compare the groove target depth with the target division threshold value, when the groove target depth is less than or equal to the target division threshold value, generate the initial machining mode signal as the laser finishing signal; when the groove target depth exceeds the target division threshold value, generate the initial machining mode signal as the mechanical and laser composite machining signal.

[0015] Step 3: When receiving the mechanical and laser composite machining signal, composite machining processing is performed on the groove to be machined; As a further improvement of the present application, the groove to be machined is subjected to composite machining processing, and the specific processing steps are: Step 3.1: Based on the target division threshold value of the groove to be machined, the machining area is divided to obtain the mechanical machining depth and the laser machining depth, which is specifically: obtaining the target division threshold value of the groove to be machined corresponding to the mechanical and laser composite machining signal, based on the target division threshold value, the groove target depth is divided into two working target depths, the working target depth close to the cutting surface of the groove to be machined is marked as the mechanical machining depth, and vice versa, the other working target depth is marked as the laser machining depth.

[0016] Step 3.2: Obtain the mechanical machining depth and the laser machining depth of the groove to be machined; and obtain the groove opening size corresponding to the mechanical machining depth, set the mechanical machining target area based on the mechanical machining depth and the groove opening size; similarly, obtain the laser machining target area corresponding to the laser machining depth, and generate a laser reprocessing signal, execute step 4 on the laser machining target area.

[0017] Step 3.3: Machining the mechanical machining target area; Step 3.4, mechanical machining monitoring: obtain the mechanical machining parameter of the mechanical machining, and perform machining monitoring analysis on the mechanical machining parameter to obtain the mechanical machining state information, when the mechanical machining state information corresponds to the mechanical machining abnormality, the corresponding groove to be machined is marked as the mechanical abnormal groove, the mechanical abnormal groove is executed step 3.1, and the number of mechanical machining of the mechanical abnormal groove is counted, when the number of mechanical machining exceeds the preset machining number threshold value, generate the mechanical machining process abnormality warning.

[0018] Further, the machining monitoring analysis is performed on the machining parameter to obtain the machining state information, which is specifically: According to the machining parameters, cutting data and tool wear parameters are obtained; according to the cutting data, cutting force and cutting vibration parameters are obtained, the cutting force is differentially calculated with the preset cutting standard force, and a cutting force difference is obtained; when the cutting force difference exceeds the preset force difference threshold, a force difference abnormal signal is generated; based on the cutting vibration parameters, vibration acceleration peak value and vibration frequency are obtained; when the vibration acceleration peak value exceeds the preset upper limit of the acceleration peak value, a peak value abnormal information is generated; similarly, when the vibration frequency exceeds the preset vibration frequency interval, a frequency abnormal information is generated; when any one of the peak value abnormal information and the frequency abnormal information is detected, a vibration abnormal signal is generated; According to the tool wear parameters, tool wear and tool use time are obtained; based on the database, the tool wear and tool use time correspondingly obtain the tool wear allowance and the longest service life; the tool wear, the tool use time, the tool wear allowance and the longest service life are all normalized and substituted into the preset nonlinear coupling formula The tool wear comprehensive value ms is calculated; wherein, respectively represent the tool wear and the tool wear allowance; respectively represent the tool use time and the longest service life; when the tool wear comprehensive value exceeds the preset wear comprehensive threshold, a wear abnormal signal is generated; The signal monitoring unit is used for identifying the force difference abnormal signal, the vibration abnormal signal and the wear abnormal signal; when no signal or any one of the force difference abnormal signal and the vibration abnormal signal is monitored, no machining state information is generated; when the force difference abnormal signal and the vibration abnormal signal are simultaneously monitored, it is recorded as signal state one; when the wear abnormal signal is monitored, it is recorded as signal state two; when the signal state one and the signal state two are simultaneously monitored, it is recorded as signal state three; when the signal monitoring unit monitors any one of the signal state one, the signal state two and the signal state three, the machining state information is generated as machining abnormality.

[0019] Step 4: when the laser finishing signal and the laser reprocessing signal are received, laser finishing is performed on the corresponding to-be-processed groove and the laser processing target area, and the corresponding groove is marked as a processed groove; Step 5: the image monitoring comparison technology is used for quality evaluation of the processed groove to obtain the processing quality state and the process warning, which specifically comprises: the image monitoring comparison technology is used for quality evaluation of the processed groove and the preset design parameters to obtain the processing quality state, and the number of processed grooves corresponding to quality abnormality is obtained in a preset unit monitoring state; when the number of processed grooves exceeds the preset processed abnormal threshold, a process warning is generated.

[0020] Compared with the prior art, the technical scheme provided by the application has the beneficial effects that: 1、The application realizes intelligent adaptation of processing mode through processing mode sorting mechanism, which significantly improves processing efficiency. Based on the design parameters of the to-be-processed groove, the application performs comprehensive analysis in combination with processing influence coefficients, obtains a comprehensive influence coefficient through normalization processing and coupling calculation, and compares the comprehensive influence coefficient with a dynamically adjusted comprehensive division threshold value to accurately determine whether to use laser finishing or mechanical-laser composite processing. This avoids the problems of time extension and energy consumption surge caused by multiple scanning of single laser processing in deep groove processing, solves the defects of insufficient precision of single mechanical processing, enables grooves of different depths and materials to match the optimal processing path, and greatly improves overall processing efficiency.

[0021] 2、The application processes grooves in different regions through composite processing. In composite processing, the groove depth is divided into mechanical processing and laser processing regions according to the target division threshold value. The surface is efficiently processed by a machine, and the deep layer is precisely processed by a laser. The efficiency and precision are taken into account. The mechanical processing monitoring and quality evaluation early warning are matched to reduce processing abnormalities, discover process problems in a timely manner, reduce the defective product rate, and ensure the stability of the processing quality. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. The following drawings are not deliberately scaled according to the actual size, and the focus is on showing the main idea of the present application.

[0023] Figure 1 The method flowchart of the present application. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0025] For the convenience of understanding, the specific process of the embodiments of the present application will be described below. Please refer to Figure 1 In an embodiment of the processing method for improving the processing efficiency of grooves of printed circuit boards in the embodiments of the present application, the embodiment includes the following steps. Step 1, processing requirement identification and parameter acquisition: the design parameters of the to-be-processed groove are acquired through data acquisition technology. The design parameters include groove target depth, groove opening size, and board material parameters. The board material parameters include the material types corresponding to the dielectric layer and the conductive layer respectively.

[0026] Step 2, processing mode selection analysis: obtain the design parameters of the current to-be-processed groove and input the design parameters into a preset processing mode sorting mechanism, the processing mode sorting mechanism outputs an initial processing mode signal based on the design parameters, the initial processing mode signal includes a laser finishing signal and a mechanical and laser composite processing signal; and the initial processing mode signal is identified by a signal recognition unit, when the initial processing mode signal corresponds to the mechanical and laser composite processing signal, step 3 is executed on the to-be-processed groove; when the initial processing mode signal corresponds to the laser finishing signal, step 4 is executed on the to-be-processed groove.

[0027] The processing mode sorting mechanism has the following specific analysis content: The processing mode sorting mechanism includes a processing mode threshold setting unit and a processing mode matching unit, and the design parameters of each to-be-processed groove are identified to obtain a groove target depth and a plate material parameter; The processing influence analysis unit is used to analyze the processing influence coefficient of the plate material parameter of each to-be-processed groove to obtain the corresponding processing influence coefficient; The processing mode matching unit matches and analyzes the groove target depth of the to-be-processed groove with the processing influence coefficient to obtain the corresponding initial processing mode signal.

[0028] The processing influence coefficient of the plate material parameter of each to-be-processed groove is analyzed, and the specific analysis content is as follows: According to the plate material parameter, the medium layer parameter and the conductive layer parameter corresponding to the to-be-processed area of the to-be-processed groove are obtained; according to the medium layer parameter, the material hardness and the medium heat resistance corresponding to the medium layer are obtained, the material hardness is the material hardness value obtained by converting the material hardness of the medium layer through the Shore hardness conversion method; the material hardness values corresponding to the commonly used media of the PCB plate material in the database are obtained, and the material hardness values corresponding to the commonly used media are collected to obtain a medium hardness span interval, and the numerical value of the lowest medium hardness corresponding to the medium hardness span interval is marked as a hardness reference point; for example, in the commonly used medium layer of the PCB, the PP glue is the softest medium, and the lower limit of the Shore hardness is 60D, that is, the hardness reference point is 60, and the corresponding medium hardness span interval is 60D-100D; the hardness reference point and the material hardness value corresponding to each to-be-processed groove are substituted into a preset arctangent function to calculate the material hardness factor to obtain the medium hardness coefficient, that is, through the formula the hardness influence coefficient is calculated ; wherein YD corresponds to the material hardness value corresponding to the medium layer parameter; YD jz represents the hardness reference point, YD mg represents a preset hardness interval compression constant, which is 20, used to compress the input value to the interval [0, 2] to match the nonlinear sensitive area of the arctan function.

[0029] The glass transition temperature ranges of various materials are identified by assessing the heat resistance of the medium. These ranges are then aggregated to obtain the glass transition temperature range of the medium layer. The median value of this range is marked as the heat resistance benchmark point. The glass transition temperature value of the medium layer corresponding to the groove to be processed and the heat resistance benchmark point are input into a preset heat resistance influence index decay function model. The heat resistance influence coefficient was calculated. ;in, These represent the heat resistance reference point and glass transition temperature value, respectively; 0.01 is the preset heat resistance sensitivity constant, set based on the temperature range of the glass transition temperature interval of the dielectric layer, used to ensure... The value range is (-0.7, 0.1), ensuring ∈[0.5, 1].

[0030] The conductive layer thickness and surface condition are obtained based on the conductive layer parameters. The maximum standard thickness of the conductive layer copper foil in the PCB industry is used as the basis for calculation. This maximum standard thickness is summed with a preset upper limit constant, and the resulting value is marked as the upper limit extreme value of the conductive layer thickness. For example, if the industry standard maximum thickness is 70 μm and the upper limit constant is 10 μm, the corresponding upper limit extreme value of the conductive layer thickness is 80 μm. The conductive layer thickness value of the current groove to be processed and the upper limit extreme value of the conductive layer thickness are both input into a preset thickness influence logarithmic function calculation model. The thickness influence coefficient was calculated. Where HD represents the thickness of the conductive layer, Represented as the upper limit of the conductive thickness, it is used to make To avoid the logarithmic function taking a negative value; This represents the preset thickness weighting coefficient, with a value of 0.2.

[0031] The laser reflectivity of the conductive layer surface is obtained based on the surface state of the conductive layer. A preset reflection threshold is obtained from the lasers used in laser processing based on the database. Low-reflectivity and high-reflectivity regions are then identified based on the reflection threshold and denoted as [0, F]. th ]、(F th [1]; Based on the pre-defined power law function and hyperbolic tangent function coupling model The reflection influence coefficient was calculated. Among them, F BM Expressed as laser reflectivity; These represent the preset maximum laser gain coefficient and the maximum laser suppression coefficient, respectively. The maximum laser gain coefficient represents the maximum laser gain coefficient under ideal low reflectivity conditions (i.e., F). BM =0), the maximum threshold improvement brought about by the efficiency advantage of laser processing is 0.15; conversely, the maximum laser suppression coefficient represents the maximum threshold improvement under extremely high reflectivity (i.e., F = 0). BM=1), the threshold value reduction maximum value caused by the laser being unable to process; is a preset power index, a constant greater than zero, used to control the shape of the function curve, when , the function is a convex curve; when , the function is a concave curve, indicating the relationship between laser energy absorption and processing efficiency; is a preset reflection sensitivity factor, taking a value of 10, used to control the rate of change of the hyperbolic tangent function in the high reflection area.

[0032] The hardness influence coefficient, heat resistance influence coefficient, thickness influence coefficient, and reflection influence coefficient are combined to obtain the processing influence coefficient corresponding to each to-be-processed groove.

[0033] The groove target depth of the to-be-processed groove is matched and analyzed with the processing influence coefficient, and the specific analysis content is as follows: The hardness influence coefficient, heat resistance influence coefficient, thickness influence coefficient, and reflection influence coefficient are identified from the processing influence coefficient, and the values of each processing influence coefficient are normalized and taken, and the normalized processing influence coefficient is substituted into the preset processing coefficient coupling formula to obtain the comprehensive influence coefficient ; wherein, is a weight coefficient corresponding to each processing influence coefficient, n=1, 2, 3, 4. , , , The values of 0.33, 0.17, 0.34, and 0.16, respectively.

[0034] The initial processing division threshold value preset for the to-be-processed groove is obtained, and the comprehensive influence coefficient and the initial processing division threshold value are substituted into the preset hyperbolic tangent comprehensive model to calculate the output comprehensive division threshold value ; wherein, respectively represent the initial processing division threshold value and the preset maximum threshold value adjustment amplitude, which is used to limit the value of the comprehensive division threshold value, i.e., the maximum absolute value that the threshold value can change based on all influence coefficients; The groove target depth corresponding to the target design parameter of the current to-be-processed groove is obtained, and the comprehensive division threshold value of the target design parameter is obtained based on the hyperbolic tangent comprehensive model, and is recorded as the target division threshold value. The groove target depth is compared with the target division threshold value, when the groove target depth is less than or equal to the target division threshold value, the initial processing mode signal is generated as a laser fine processing signal; when the groove target depth exceeds the target division threshold value, the initial processing mode signal is generated as a mechanical and laser composite processing signal.

[0035] Step 3, composite processing: when receiving the mechanical and laser composite machining signal, the composite machining processing is performed on the to-be-machined groove, which is specifically: Step 3.1, processing area division: obtaining the target division threshold of the to-be-machined groove corresponding to the mechanical and laser composite machining signal, dividing the groove target depth into two working target depths based on the target division threshold, marking the working target depth close to the cutting surface of the to-be-machined groove as the mechanical machining depth, and vice versa, marking the other working target depth as the laser machining depth; Step 3.2, processing parameter setting: obtaining the mechanical machining depth and laser machining depth of the to-be-machined groove; and obtaining the groove opening size corresponding to the mechanical machining depth, setting the mechanical machining target area based on the mechanical machining depth and the groove opening size; similarly, obtaining the laser machining target area corresponding to the laser machining depth, and generating a laser reprocessing signal, executing step 4 on the laser machining target area; Step 3.3, mechanical machining execution: mechanical machining is performed on the mechanical machining target area; Step 3.4, mechanical machining monitoring: obtaining the mechanical machining parameters of the mechanical machining, and performing machining monitoring analysis on the mechanical machining parameters to obtain the mechanical machining state information, when the mechanical machining state information corresponds to mechanical machining abnormality, the corresponding to-be-machined groove is marked as a mechanical abnormal groove, step 3.1 is executed on the mechanical abnormal groove, and the number of mechanical machining of the mechanical abnormal groove is counted, when the number of mechanical machining exceeds the preset machining number threshold, a mechanical machining process abnormality warning is generated.

[0036] The machining monitoring analysis is performed on the mechanical machining parameters, and the specific analysis content is as follows: According to the mechanical machining parameters, cutting data and tool wear parameters are obtained; according to the cutting data, cutting force and cutting vibration parameters are obtained, the cutting force is calculated by difference with the preset cutting standard force, and the cutting force difference is obtained, when the cutting force difference exceeds the preset force difference threshold, a force abnormality signal is generated; based on the cutting vibration parameters, the vibration acceleration peak value and the vibration frequency are obtained, when the vibration acceleration peak value exceeds the preset upper limit of the acceleration peak value, a peak value abnormality information is generated, similarly, when the vibration frequency exceeds the preset vibration frequency interval, a frequency abnormality information is generated, when any one of the peak value abnormality information and the frequency abnormality information is detected, a vibration abnormality signal is generated; According to the tool wear parameters, tool wear and tool use time are obtained; based on the database, the tool wear allowance and the longest service life corresponding to the tool wear and the tool use time are obtained respectively; the tool wear, the tool use time, the tool wear allowance and the longest service life are all normalized and substituted into the preset nonlinear coupling formula The tool wear comprehensive value ms is calculated; wherein, respectively represent the tool wear amount and the tool wear allowance; respectively represent the tool use time and the longest service life; when the tool wear comprehensive value exceeds the preset wear comprehensive threshold value, a wear abnormal signal is generated; The force abnormal signal, the vibration abnormal signal and the wear abnormal signal are identified by the preset signal monitoring unit; when no signal or any one of the force abnormal signal and the vibration abnormal signal is monitored, no machining state information is generated; when the force abnormal signal and the vibration abnormal signal are simultaneously monitored, it is recorded as signal state one; when the wear abnormal signal is monitored, it is recorded as signal state two; when the signal state one and the signal state two are simultaneously monitored, it is recorded as signal state three; when the signal monitoring unit monitors any one of the signal state one, the signal state two and the signal state three, the machining state information is generated as machining abnormality.

[0037] Step 4, laser finishing processing: when the laser finishing signal and the laser reprocessing signal are received, the to-be-processed groove corresponding to the laser finishing signal is obtained, and the laser processing target area corresponding to the laser reprocessing signal is obtained; laser finishing is performed on the corresponding to-be-processed groove and laser processing target area, and the corresponding groove is marked as a processed groove.

[0038] Step 5, processing quality feedback: the processed groove and the preset design parameter are compared by the pre-deployed image monitoring technology to obtain the processing quality state, and the number of processed grooves corresponding to quality abnormality is obtained in the preset unit monitoring; when the number of processed grooves exceeds the preset processed abnormal threshold value, a process warning is generated.

[0039] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A processing method for improving the processing efficiency of a printed circuit board groove, characterized in that, The method comprises the following steps: Step 1: Collecting the design parameters of the to-be-processed groove through a data acquisition technology; Step 2: Obtaining the design parameters of the to-be-processed groove and inputting the design parameters into a preset processing mode sorting mechanism, the processing mode sorting mechanism outputs an initial processing mode signal based on the design parameters, the initial processing mode signal comprises a laser finishing signal and a mechanical and laser combined processing signal; and the initial processing mode signal is identified by a signal identification unit, when the initial processing mode signal corresponds to the mechanical and laser combined processing signal, step 3 is performed on the to-be-processed groove; when the initial processing mode signal corresponds to the laser finishing signal, step 4 is performed on the to-be-processed groove; Step 3: When the mechanical and laser combined processing signal is received, the to-be-processed groove is subjected to combined processing; Step 4: When the laser finishing signal and the laser reprocessing signal are received, laser finishing is performed on the corresponding to-be-processed groove and laser processing target area, and the corresponding groove is marked as a processed groove; Step 5: The quality of the processed groove is evaluated by a pre-deployed image monitoring comparison technology to obtain a processing quality state and a process early warning.

2. The method of claim 1, wherein, The processing mode sorting mechanism outputs an initial processing mode signal based on the design parameters, and specifically: The processing mode sorting mechanism comprises a processing mode threshold setting unit and a processing mode matching unit, and the design parameters of each to-be-processed groove are identified to obtain a groove target depth and a plate material parameter; The processing influence analysis unit specifically analyzes the processing influence coefficient of the plate material parameter of each to-be-processed groove to obtain the corresponding processing influence coefficient; The processing mode matching unit specifically matches and analyzes the groove target depth of the to-be-processed groove with the processing influence coefficient to obtain the corresponding initial processing mode signal.

3. The method of claim 2, wherein, The processing influence coefficient of the plate material parameter of each to-be-processed groove is obtained by analyzing the processing influence coefficient of the plate material parameter, and specifically: According to the plate material parameter, the medium layer parameter and the conductive layer parameter corresponding to the to-be-processed area of the to-be-processed groove are obtained; according to the medium layer parameter, the material hardness and the medium heat resistance of the medium layer are obtained, the material hardness is a material hardness value obtained by converting the material of the medium layer into hardness through a Shore hardness conversion method; the material hardness values corresponding to the commonly used media of the PCB plate in the database are obtained, and the material hardness values corresponding to the commonly used media are collected to obtain a medium hardness span interval, and the value of the lowest medium hardness corresponding to the medium hardness span interval is marked as a hardness reference point; The hardness reference point and the material hardness value corresponding to each to-be-processed groove are substituted into a preset arctangent function to calculate a medium hardness coefficient; The glass transition temperature interval of each type of material is obtained by identifying the medium heat resistance, and the glass transition temperature interval of each type of material is collected to obtain a medium layer glass transition temperature interval, and the middle value of the medium layer glass transition temperature interval is marked as a heat resistance reference point; the glass transition temperature value of the medium layer corresponding to the to-be-processed groove and the heat resistance reference point are input into a preset heat resistance influence index decay function model to calculate a heat resistance influence coefficient; Based on the conductive layer parameter, the thickness and the surface state of the conductive layer are obtained; Based on the maximum standard thickness of the conductive layer copper foil in the PCB industry database, the maximum standard thickness is summed with a preset upper limit constant, and the resulting value is marked as the upper limit extreme value of the conductive layer thickness. The value of the conductive layer thickness of the current groove to be processed and the upper limit extreme value of the conductive layer thickness are both input into the preset thickness influence logarithmic function calculation model to calculate the thickness influence coefficient. The laser reflectivity of the conductive layer surface is obtained based on the surface state of the conductive layer. The corresponding preset reflection threshold is obtained based on the laser processed by the laser in the database. The low reflection area and high reflection area are obtained based on the reflection threshold. The reflection influence coefficient is calculated based on the preset power law function and hyperbolic tangent function coupling model. The processing influence coefficients for each groove to be processed are obtained by combining the hardness influence coefficient, heat resistance influence coefficient, thickness influence coefficient, and reflection influence coefficient.

4. The method of claim 3, wherein the method further comprises: The initial processing method signal is obtained by matching and analyzing the target depth of the groove to be processed with the processing influence coefficient. Specifically: The processing influence coefficients are identified to obtain the hardness influence coefficient, heat resistance influence coefficient, thickness influence coefficient, and reflection influence coefficient. Each processing influence coefficient is normalized and its value is taken. The normalized processing influence coefficients are then substituted into a preset processing coefficient coupling formula to calculate the comprehensive influence coefficient. An initial processing division threshold is obtained for the groove to be processed. Both the comprehensive influence coefficient and the initial processing division threshold are substituted into a preset hyperbolic tangent comprehensive model to calculate and output the comprehensive division threshold. The target design parameters corresponding to the current groove target depth are obtained. Based on the hyperbolic tangent comprehensive model, the comprehensive division threshold of the target design parameters is obtained and recorded as the target division threshold. The groove target depth is compared with the target division threshold. When the groove target depth is less than or equal to the target division threshold, an initial processing mode signal of laser finishing is generated; when the groove target depth exceeds the target division threshold, an initial processing mode signal of mechanical and laser composite processing is generated.

5. The method of claim 1, wherein, The groove to be processed undergoes a composite processing treatment, the specific processing steps of which are as follows: Step 3.1: Divide the processing area based on the target segmentation threshold of the groove to be processed to obtain the mechanical processing depth and the laser processing depth; Step 3.2: Based on the machining depth and laser machining depth, obtain the machining target area and the laser machining target area respectively. Perform step 3.3 on the machining target area and step 4 on the laser machining target area. Step 3.3: Perform machining on the target area; Step 3.4, Machining Monitoring: Obtain the machining parameters and perform machining monitoring and analysis on the machining parameters to obtain machining status information. When the machining status information corresponds to a machining abnormality, mark the corresponding groove to be processed as a machining abnormal groove, execute step 3.1 on the machining abnormal groove, and count the number of machining operations for the machining abnormal groove. When the number of machining operations exceeds the preset machining operation threshold, generate a machining process abnormality warning.

6. The method of claim 5, wherein, The step 3.1 is specifically: obtaining a target division threshold corresponding to the mechanical and laser combined machining signal of the to-be-machined groove, and dividing the groove target depth into two working target depths based on the target division threshold; the working target depth close to the cutting surface of the to-be-machined groove is marked as the mechanical machining depth, and otherwise, the other working target depth is marked as the laser machining depth.

7. The method of claim 6, wherein the method further comprises: The step 3.2 is specifically: obtaining the mechanical machining depth and the laser machining depth of the to-be-machined groove; and obtaining the groove opening size corresponding to the mechanical machining depth, and setting the mechanical machining target area based on the mechanical machining depth and the groove opening size; similarly, the laser machining target area corresponding to the laser machining depth is obtained, and a laser reprocessing signal is generated, and the step 4 is performed on the laser machining target area.

8. The method of claim 7, wherein the method further comprises: The machining state information is obtained by machining monitoring analysis of the mechanical machining parameters, which is specifically: The cutting data and tool wear parameters are obtained according to the mechanical machining parameters; the cutting force and cutting vibration parameters are obtained according to the cutting data, the cutting force difference is obtained by difference calculation between the cutting force and the preset cutting standard force, the force abnormal signal is generated when the cutting force difference exceeds the preset force difference threshold; the vibration acceleration peak value and the vibration frequency are obtained based on the cutting vibration parameters, the peak value abnormal information is generated when the vibration acceleration peak value exceeds the preset upper limit of the acceleration peak value, and the frequency abnormal information is generated when the vibration frequency exceeds the preset vibration frequency interval, the vibration abnormal signal is generated when any one of the peak value abnormal information and the frequency abnormal information is detected; The tool wear amount and tool use time are obtained according to the tool wear parameters; the tool wear allowance and the longest service life corresponding to the tool wear amount and the tool use time are obtained based on the database; the tool wear amount, the tool use time, the tool wear allowance and the longest service life are all normalized and substituted into the preset nonlinear coupling formula to calculate the tool wear comprehensive value; The wear abnormal signal is generated when the tool wear comprehensive value exceeds the preset wear comprehensive threshold; The signal monitoring unit is used to identify the force abnormal signal, the vibration abnormal signal and the wear abnormal signal, no machining state information is generated when no signal or any one of the force abnormal signal and the vibration abnormal signal is monitored, the signal state one is recorded when the force abnormal signal and the vibration abnormal signal are simultaneously monitored, the signal state two is recorded when the wear abnormal signal is monitored, and the signal state three is recorded when the signal state one and the signal state two are simultaneously monitored; the machining state information is generated as machining abnormality when the signal monitoring unit monitors any one of the signal state one, the signal state two and the signal state three.

9. The method of claim 1, wherein, The machining quality state and the process warning are obtained by quality evaluation of the machined groove through the pre-deployed image monitoring comparison technology, which is specifically: the machining quality state is obtained by quality evaluation of the machined groove and the preset design parameters through the pre-deployed image monitoring comparison technology, and the number of machined grooves corresponding to the quality abnormality is obtained in the preset unit monitoring state; the process warning is generated when the number of machined grooves exceeds the preset machined abnormal threshold.

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