Liquid crystal module dismounting processing device and dismounting processing method

Abstract

The invention relates to the technical field of circuit board disassembly and assembly, and provides a liquid crystal module disassembly processing device and method. The liquid crystal module dismounting processing device is used for dismounting a liquid crystal module from a PCB, the liquid crystal module dismounting processing device comprises a heating platform provided with a heating groove and a limiting mechanism, the heating groove is arranged to contain heat conduction liquid, the upper end face of the heating groove is higher than the upper surface of the heating platform, and the limiting mechanism is arranged on the heating platform; the shape of the heating groove is matched with the arrangement shape of welding spots of the PCB; the limiting mechanism is used for limiting the distance between the PCB and the heating platform, so that a welding spot of the PCB is in contact with the heat conduction liquid in the heating groove, and an electronic device on the PCB is limited to be in contact with the upper surface of the heating platform; and the heat source is used for increasing the temperature of the heat conduction liquid in the heating tank to a preset value. According to the liquid crystal module dismounting processing device, the dismounting efficiency of the liquid crystal module can be effectively improved, and the PCB is protected.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board disassembly, and in particular to a liquid crystal module disassembly processing device and a disassembly processing method. BACKGROUND

[0002] The liquid crystal module is a high-precision display unit integrated by components such as a liquid crystal display (LCD), a driving circuit, a backlight source, and a connecting piece, and is widely used in electronic devices such as industrial monitoring, human-computer interaction, and medical instruments. The liquid crystal module is mainly connected to a PCB board through a metal pin connection mode. In the metal pin connection mode, one end of the metal pin is fixed on an external lead of the liquid crystal display, and the other end of the metal pin is welded in a welding hole (or a socket) of the PCB board, thereby realizing the effect of welding and fixing the liquid crystal display on the PCB board. This connection mode has the characteristics of high reliability and good anti-vibration performance, and is suitable for devices that need stable connection, such as audio products and electric energy meters. However, during the production process of these devices, the liquid crystal module may not work normally after the PCB board is completed due to various reasons (such as the existence of defective materials in the liquid crystal module, and the damage of the liquid crystal module caused by the misoperation of employees). At this time, if the whole assembly formed by the PCB board and the liquid crystal module is directly scrapped, it will cause great loss and waste of resources.

[0003] A conventional liquid crystal module has about 40 metal pins, and these metal pins are arranged closely with each other. If an electric soldering iron is used for disassembly, due to the limitation of the heating head of the electric soldering iron, all the welding points cannot be heated simultaneously and uniformly. If the welding points are pulled out without sufficient heating, the PCB board will be easily damaged, causing permanent damage to the PCB board. In addition, since devices are often distributed on the back of the liquid crystal module, the PCB board on the back of the liquid crystal module is easily touched by mistake when the soldering iron is used for disassembly, which will also damage other devices on the PCB board. The above aspects result in difficult disassembly and low disassembly efficiency of the liquid crystal module. SUMMARY

[0004] The present application provides a liquid crystal module disassembly processing device to solve the problems of difficult disassembly of the liquid crystal module and the PCB board in the prior art, difficult recycling of the PCB board, improve the disassembly efficiency of the liquid crystal module, and effectively protect the PCB board.

[0005] The present application also provides a liquid crystal module disassembly processing method.

[0006] According to the liquid crystal module disassembly processing device of the first aspect of the present application, the liquid crystal module is disassembled from the PCB board. The liquid crystal module disassembly processing device comprises: The heating platform is provided with a heating groove and a limiting mechanism. The heating groove is arranged to contain heat-conducting liquid, and the upper end surface of the heating groove is higher than the upper surface of the heating platform. The shape of the heating groove matches the arrangement shape of the solder joints of the PCB. The limiting mechanism is used to limit the distance between the PCB and the heating platform, so that the solder joints of the PCB are in contact with the heat-conducting liquid in the heating groove, and the electronic devices on the PCB are prevented from contacting the upper surface of the heating platform. A heat source is used to increase the temperature of the heat-conducting liquid in the heating groove to a preset value.

[0007] According to one embodiment of the present application, the limiting mechanism includes a limiting column fixed on the upper surface of the heating platform. The free end of the limiting column is used to abut against the PCB to prevent the electronic devices on the PCB from contacting the upper surface of the heating platform. In addition, the groove wall of the heating groove forms the limiting mechanism.

[0008] According to one embodiment of the present application, based on the limiting mechanism including a limiting column fixed on the upper surface of the heating platform: The free end of the limiting column is provided with a heat insulation member, and / or the free end of the limiting column is provided with a heat insulation coating.

[0009] According to one embodiment of the present application, the liquid crystal module disassembly and processing device further includes a solder hole cleaning mechanism. The solder hole cleaning mechanism includes an air outlet pipe. The air inlet end of the air outlet pipe is used to communicate with an air source. The air outlet end of the air outlet pipe is used to output compressed gas to the solder holes on the PCB. The solder hole cleaning mechanism is connected with the heating platform, or the solder hole cleaning mechanism is provided in a split type with the heating platform.

[0010] According to one embodiment of the present application, the solder hole cleaning mechanism includes: A handle; An air path plate is detachably connected with the handle. The air path plate is internally provided with a cavity. The cavity communicates with the air source through a pipeline. The air path plate is provided with a plurality of air outlets communicating with the cavity. The air outlet is provided with the air outlet pipe. A plurality of air outlet pipes are correspondingly arranged with a plurality of solder joints of the PCB.

[0011] According to one embodiment of the present application, the heating platform is locally upwardly protruding, and the upper surface of the protrusion is concave to form the heating groove. Alternatively, the upper surface of the heating platform is fixed with a baffle. The baffle is connected head to tail to form the heating groove.

[0012] According to one embodiment of the present application, the heating platform is arranged above the heat source and in contact with the heat source. Alternatively, the heating platform is internally provided with the heat source.

[0013] According to one embodiment of the present application, the heat-conducting liquid is tin paste, silicone oil, heat-conducting oil or fluorinated liquid; and / or, the heating platform is a component made of stainless steel, copper, copper alloy or aluminum alloy.

[0014] According to the liquid crystal module dismounting and processing method of the second aspect of the present application, the liquid crystal module dismounting and processing device is used, which comprises: Turning on the heat source to heat the heat-conducting liquid in the heating groove to a preset value; Placing the PCB board with the liquid crystal module on the heating platform so that the solder joints of the PCB board are immersed in the heat-conducting liquid; After the solder joints of the PCB board are melted, the liquid crystal module is dismounted from the PCB board in the vertical direction.

[0015] According to one embodiment of the present application, after the liquid crystal module is dismounted from the PCB board in the vertical direction, the method further comprises: Using the solder hole cleaning mechanism to blow the solder holes on the PCB board.

[0016] The one or more technical solutions in the embodiments of the present application have at least one of the following technical effects: The liquid crystal module dismounting and processing device in the present application is provided with a heating groove on the heating platform, the solder joints on the PCB board can be placed in the heating groove, the solder joints on the PCB board are melted by the heat-conducting liquid in the heating groove reaching a preset temperature, and then the metal pins of the liquid crystal module are separated from the PCB board. The heating groove can accommodate all the metal pins of the liquid crystal module at the same time, without heating and melting the solder joints one by one by the heating head as in the prior art, so that all the metal pins of the liquid crystal module can be kept in a molten state at the same time, the liquid crystal module can be smoothly dismounted from the PCB board, the damage to the PCB board caused by insufficient heating and melting of the solder joints and then pulling out is avoided, the PCB board is effectively protected, and the dismounting efficiency of the liquid crystal module from the PCB board is improved.

[0017] Additional aspects and advantages of the present application will be made apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technical solutions, the drawings needed to be used in the embodiments or related technical solution descriptions will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0019] Figure 1is a structural schematic diagram of a liquid crystal module dismounting treatment device provided by the present application.

[0020] Figure 2 is a structural schematic diagram of a heating platform and a heat source provided by the present application.

[0021] Figure 3 is a structural schematic diagram of a welding hole cleaning mechanism provided by the present application.

[0022] Figure 4 is a structural schematic diagram of a PCB and a liquid crystal module provided by the present application.

[0023] Figure 5 is a flow schematic diagram of a liquid crystal module dismounting treatment method provided by the present application.

[0024] Reference signs: 1, heating platform; 11, heating groove; 111, redundantly arranged heating groove; 12, limiting mechanism; 121, limiting column; 2, heat source; 3, welding hole cleaning mechanism; 31, air outlet pipe; 32, handle; 33, air path plate; 34, stop valve; 35, speed regulating check valve; 41, liquid crystal module; 42, PCB; 43, metal pin; 44, welding point. DETAILED DESCRIPTION

[0025] The embodiments of the present application will be further described in detail below with reference to the drawings and examples. The following examples are used to illustrate the present application, but cannot be used to limit the scope of the present application.

[0026] In the description of the embodiments of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0027] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0028] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0029] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0030] Existing methods for disassembling LCD modules suffer from problems such as easy damage to the PCB board, difficulty in disassembly, and low disassembly efficiency. Furthermore, after disassembling the LCD module, it is necessary to clean the solder holes (the solder holes exposed after removing the metal pins at the solder joints). Current technology typically involves heating each solder hole with a soldering iron tip and then cleaning them one by one with a desoldering pump. The large number of solder holes makes the cleaning work extremely tedious.

[0031] According to an embodiment of the first aspect of this application, a liquid crystal module disassembly processing apparatus is provided for removing a liquid crystal module 41 from a PCB board 42, such as... Figure 1 and Figure 2 As shown, the liquid crystal module disassembly processing device includes: a heating platform 1, which is provided with a heating tank 11 and a limiting mechanism 12. The heating tank 11 is configured to contain heat-conducting liquid, and the upper end surface of the heating tank 11 is higher than the upper surface of the heating platform 1. The shape of the heating tank 11 matches the arrangement shape of the solder joints 44 of the PCB board 42. The limiting mechanism 12 is used to limit the distance between the PCB board 42 and the heating platform 1, so that the solder joints 44 of the PCB board 42 are in contact with the heat-conducting liquid in the heating tank 11, and to limit the contact between the electronic components on the PCB board 42 (electronic components on the back of the PCB board 42) and the upper surface of the heating platform 1. A heat source 2 is used to increase the temperature of the heat-conducting liquid in the heating tank 11 to a preset value.

[0032] The metal pins 43 on the liquid crystal module 41 are inserted into the solder holes of the PCB 42 and fixed by soldering to form integral solder points 44 on the upper and lower surfaces of the PCB 42. The metal pins 43 will penetrate the PCB 42 and form raised solder points 44 on the back surface of the PCB 42. In the embodiment of the present application, the solder points 44 on the back surface of the PCB 42 (i.e., the surface of the PCB 42 facing away from the liquid crystal module 41) are placed in the heating groove 11 to avoid interference with the melting of the solder points 44 by the liquid crystal module 41.

[0033] The liquid crystal module dismounting device of the embodiment of the present application can simply, quickly and efficiently dismount the damaged liquid crystal module 41 from the PCB 42, so that the PCB 42 can be reinstalled with a new liquid crystal module, avoiding waste of the PCB 42. The form of the heating groove 11 can correspond to only the solder points 44 on the PCB 42, or additional redundant heating grooves 111 can be provided to adapt to PCBs of other specifications, i.e., not only the heating groove 11 can cover the solder points on a regular PCB, but also the redundant heating grooves 111 can cope with PCBs of different specifications (i.e., PCBs with different solder point positions), improving the application range of the heating platform 1. Of course, the heating platform 1 can also be replaced according to PCBs of different specifications to realize that the liquid crystal module dismounting device can be compatible with metal pin type liquid crystal modules of various pin specifications.

[0034] The liquid crystal module dismounting device in the present application can contain heat-conducting liquid in the heating groove 11 on the heating platform 1, heat the heat-conducting liquid to a preset temperature with the heat source 2, and provide a stable heat source for the melting of the solder points 44 on the PCB 42. The provision of the limiting mechanism 12 can effectively limit the distance between the PCB 42 and the heating platform 1, so that the solder points 44 on the PCB 42 can accurately contact the heat-conducting liquid in the heating groove 11, while avoiding contact between the electronic devices on the back surface of the PCB 42 and the upper surface of the heating platform 1, thereby preventing the electronic devices from being affected by high temperature or mechanically damaged due to contact with the heating platform 1, and protecting the electronic devices on the PCB 42 from damage. The upper end surface of the heating groove 11 is higher than the upper surface of the heating platform 1, which can ensure that the heating groove 11 has sufficient capacity for heat-conducting liquid, and ensure that the solder points 44 on the PCB 42 can be fully immersed in the heat-conducting liquid, so that the solder points 44 can uniformly absorb heat and be fully heated and melted.

[0035] Compared with the way of heating each welding point by the heating head in the prior art, the heating groove 11 can simultaneously accommodate all the metal pins 43 of the liquid crystal module 41, so that all the welding points 44 corresponding to the metal pins 43 can be simultaneously in a heated state, and then all the welding points 44 are simultaneously in a molten state. This simultaneous heating manner can avoid damage to the PCB 42 caused by insufficient heating and melting of part of the welding points 44 when the liquid crystal module 41 is pulled out, and effectively protects the structural integrity of the PCB 42. At the same time, there is no need to heat the welding points 44 one by one, which reduces the operation steps, significantly improves the dismounting efficiency of the liquid crystal module 41 from the PCB 42, and makes the dismounting process more convenient and stable.

[0036] In some cases, a temperature monitoring assembly can be additionally arranged on the heating platform 1. The temperature monitoring assembly can detect the temperature of the heat-conducting liquid in the heating groove 11 in real time, and transmit the temperature information to the control unit. The control unit automatically adjusts the output power of the heat source 2 according to the difference between the preset temperature and the actual temperature, so that the temperature of the heat-conducting liquid is always stabilized within the preset range, and the stability and consistency of the melting of the welding points 44 are further improved. In addition, a positioning assembly can be arranged on one side of the heating platform 1. The positioning assembly can accurately position the PCBs of different sizes, so that the welding points of the PCBs of different specifications can accurately contact the heat-conducting liquid in the heating groove 11 when the PCBs are placed, and the adaptability of the device to PCBs of different models is improved.

[0037] According to one embodiment of the present application, as shown in Figure 2 The limiting mechanism 12 includes a limiting column 121 fixed on the upper surface of the heating platform 1, and the free end of the limiting column 121 is used to abut against the PCB 42 to limit the electronic devices on the PCB 42 from contacting the upper surface of the heating platform 1; and / or the groove wall of the heating groove 11 forms the limiting mechanism 12.

[0038] The limiting mechanism 12 in the embodiment of the present application can effectively realize stable positioning of the PCB 42, and guarantee the safety and reliability of the dismounting process.

[0039] When the limiting mechanism 12 is the limiting column 121 fixed on the upper surface of the heating platform 1, the free end of the limiting column 121 directly abuts against the PCB 42, and the distance between the PCB 42 and the heating platform 1 is clearly limited by mechanical support, so that the electronic devices on the back of the PCB 42 cannot contact the upper surface of the heating platform 1, thereby avoiding thermal damage of the electronic devices caused by contacting the high-temperature heating platform 1, and preventing physical damage of the electronic devices caused by mechanical collision with the platform surface. This structure is simple in form and low in processing difficulty, can adapt to PCBs of different thicknesses by adjusting the height of the limiting column 121, and enhances the universality of the device.

[0040] If the groove wall of the heating groove 11 forms the limiting mechanism 12, the top edge of the groove wall can be in direct contact with the PCB board 42 and form support while containing the heat-conducting liquid, so that the limiting function is integrated with the structure of the heating groove 11. This design reduces the setting of independent limiting components, simplifies the overall structure of the heating platform 1, and reduces the assembly complexity.

[0041] The limiting mechanism 12 adopts the form of a limiting column 121 or the groove wall of the heating groove 11, both of which can control the position of the PCB board 42 through explicit support, ensuring that the solder joints 44 fully contact the heat-conducting liquid to achieve uniform heating, and avoiding damage to electronic devices due to contact with the heating platform 1. It achieves the core function while taking into account the structural simplicity and operational reliability.

[0042] According to one embodiment of the present application, based on the limiting mechanism 12 including a limiting column 121 fixed on the upper surface of the heating platform 1: the free end of the limiting column 121 is provided with a heat insulation piece (not shown in the figure), and / or the free end of the limiting column 121 is provided with a heat insulation coating.

[0043] The heat insulation piece or heat insulation coating at the free end of the limiting column 121 can further optimize the protection performance of the limiting mechanism 12, effectively blocking the heat transfer path from the heating platform 1 to the PCB board 42. The heating platform 1 will maintain a high temperature during operation due to the action of the heat source 2, and the limiting column 121 is directly fixed on the upper surface of the heating platform 1, which is easy to transfer heat to the free end through heat conduction. If the free end is in direct contact with the PCB board 42, heat may be conducted to the electronic devices on the PCB board 42 through the contact part, causing the electronic devices to be damaged due to high temperature. The heat insulation piece is made of high-temperature resistant insulation material, which has extremely low thermal conductivity and can significantly reduce the heat transfer from the free end of the limiting column 121 to the PCB board 42. The heat insulation coating forms a heat insulation film on the surface of the free end of the limiting column 121, which also reduces the heat conduction efficiency.

[0044] The two ways of heat insulation piece and heat insulation coating can be used alone or in combination to ensure the support function of the limiting column 121 while avoiding the impact of heat on the electronic devices on the PCB board 42 through mechanical contact.

[0045] The heat insulation piece and the heat insulation coating not only retain the stable support and distance control of the limiting column 121 on the PCB board 42, ensuring effective contact of the solder joints 44 with the heat-conducting liquid, but also enhance the protection of electronic devices through heat insulation treatment, especially suitable for scenarios where there are heat-sensitive electronic components on the PCB board 42, improving the safety and reliability of the device in high-temperature working environment, while not affecting the structural strength and service life of the limiting column 121, making the function of the limiting mechanism 12 more perfect.

[0046] In some cases, the heat insulating member can be designed as a detachable structure, connected with the free end of the limiting column 121 through buckles or threads, so as to replace the heat insulating member with different materials according to different working temperature scenes, for example, using a ceramic-based heat insulating member in a higher temperature environment and using a silica gel-based heat insulating member in a low temperature environment; meanwhile, a wear-resistant layer is additionally arranged on the surface of the heat insulating coating to reduce the abrasion of the heat insulating coating when the PCB board 42 is placed and taken, thereby prolonging the effective service life of the coating.

[0047] Of course, the limiting column 121 can also be made of a composite material with a low thermal conductivity, such as glass fiber reinforced plastic, which has good heat insulation performance and meets the support strength requirement, thereby simplifying the structure design and realizing the heat insulation function.

[0048] According to one embodiment of the present application, as shown in Figure 1 and Figure 3 , the liquid crystal module dismounting and processing device further comprises a solder hole cleaning mechanism 3, which comprises an air outlet pipe 31, the air inlet end of the air outlet pipe 31 being used to communicate with a gas source, and the air outlet end of the air outlet pipe 31 being used to output compressed gas to the solder hole on the PCB board 42; the solder hole cleaning mechanism 3 is connected with the heating platform 1, or the solder hole cleaning mechanism 3 is separately arranged from the heating platform 1.

[0049] The solder hole cleaning mechanism 3 is arranged in the liquid crystal module dismounting and processing device, and the compressed gas is delivered to the solder hole of the PCB board 42 through the air outlet pipe 31, so that the residual solder scraps or flux residues in the solder hole can be timely removed after the liquid crystal module 41 is dismounted, thereby avoiding that the residual substances block the solder hole and affect the quality of subsequent re-soldering. The air outlet end of the air outlet pipe 31 directly aims at the solder hole to output the compressed gas, and this cleaning mode realizes cleaning by means of the impact force of the gas, so that mechanical contact with the solder hole is avoided, thereby preventing scratches or deformation of the inner wall of the solder hole, protecting the structural integrity of the solder hole and ensuring that the solder hole can normally accommodate new pins and form reliable soldering in subsequent use.

[0050] In actual application, a collection box can be arranged below the PCB board 42 to collect the residues in the solder hole of the PCB board 42 when the solder hole cleaning mechanism 3 performs blowing and cleaning.

[0051] The arrangement mode that the solder hole cleaning mechanism 3 is connected with the heating platform 1 can make the cleaning operation and the dismounting and soldering operation form an integrated process, thereby facilitating the improvement of the automation degree of the entire cleaning process, for example, moving the PCB board 42 to a cleaning station after the heating and dismounting and soldering are completed, and the solder hole cleaning mechanism 3 automatically performs blowing and cleaning after detecting the PCB board 42, thereby further improving the dismounting and cleaning efficiency of the liquid crystal module.

[0052] The split setting allows flexible adjustment of the position of the solder hole cleaning mechanism 3 according to the actual operation demand, adapts to different sizes or shapes of PCB cleaning scenes, enhances the use flexibility of the device, and is also convenient for the operator to directly hold and operate.

[0053] In some cases, a replaceable nozzle can be added to the gas outlet end of the gas outlet pipe 31. Different sizes of nozzles can adapt to different aperture solder holes, so that the compressed gas can act more accurately on the inside of the solder hole, improving the cleaning specificity.

[0054] Of course, in actual application, the solder hole cleaning mechanism 3 can also be a negative pressure suction device. The residue in the solder hole is adsorbed by the suction pipe, which is suitable for scenes where the residual solder debris is large or sticky, so as to avoid the debris being blown to other areas of the PCB 42.

[0055] According to one embodiment of the present application, as shown in Figure 3 The handle 32 and the gas path plate 33 are detachably connected.

[0056] The handle 32 and the gas path plate 33 can be made of heat insulation materials.

[0057] The handle 32 provided in the solder hole cleaning mechanism 3 can provide a stable gripping position for the operator, facilitating flexible adjustment of the position and angle of the gas path plate 33 during cleaning, so that the gas outlet end of the gas outlet pipe 31 can accurately aim at the solder hole on the PCB 42, improving the convenience of operation. The gas path plate 33 and the handle 32 are detachably connected, so that the gas path plate 33 can be replaced according to the distribution specifications of the solder holes on the PCB 42. When facing different numbers or arrangement modes of solder holes, only the corresponding layout of the gas path plate 33 needs to be replaced to realize accurate cleaning, enhancing the adaptability of the device to different models of PCBs, without the need to replace the entire cleaning device, reducing the use cost.

[0058] The cavity inside the gas path plate 33 is connected with the gas source through the pipeline, which can temporarily store and buffer the compressed gas delivered by the gas source, so that the gas pressure remains stable in the cavity. Then the compressed gas is evenly distributed to each gas outlet pipe 31 through multiple gas outlets, ensuring that the compressed gas output by each gas outlet pipe 31 has consistent pressure, avoiding incomplete cleaning of some solder holes or damage to the solder holes due to excessive pressure. The multiple gas outlet pipes 31 are correspondingly arranged with the multiple solder points 44 on the PCB 42, which can clean multiple solder holes at a time, greatly shortening the cleaning time compared with the cleaning mode one by one, improving the overall processing efficiency, while ensuring that the cleaning effect of each solder hole is consistent, avoiding the cleaning difference caused by different operation sequences.

[0059] By integrating the functions of gas distribution, holding operation, and adapter replacement into one, the reliability of compressed gas cleaning of the welding hole is ensured, the flexibility and efficiency of the device are improved through the detachable design and multi-outlet layout, the welding hole cleaning process is more efficient and stable, there is no mechanical damage to the welding hole, and the reuse quality of the PCB board 42 is further ensured.

[0060] The gas path plate 33 can also be connected to a stop valve 34, which can be manual, and the stop valve 34 is fixed on the handle 32; the handle 32 is fixed on the gas path plate 33 using a countersunk screw. The gas outlet pipe 31 can be a micro gas pipe made of high-temperature resistant metal material. The gas outlet pipe 31 is tightly fitted between the gas outlet. The spacing, size, and number of the gas outlets on the gas path plate 33, as well as the length of the gas outlet pipe 31, are determined according to the number, spacing, and length of the pins of the liquid crystal module 41 to be disassembled, as well as the devices distributed near the liquid crystal module 41. Different specifications of the gas path plate 33 can be used for different liquid crystal modules. The side of the gas path plate 33 is provided with a through hole, which connects the micro gas holes on one side to the through hole on the same side. The gas path plate 33 required for the disassembly of a commonly used liquid crystal module has two-way through holes. One end of the through hole is sealed with a detachable plug for easy cleaning of the inside. The other end is threaded at the opening, and a speed control check valve 35 is installed at the opening. A high-temperature resistant air pipe is used to connect the gas inlets of all the speed control check valves 35 to the gas outlets of the stop valve 34. The gas inlet of the stop valve 34 is connected to a special gas source device that can output high-temperature dry air.

[0061] In some cases, a gas blowing time control module can also be integrated on the welding hole cleaning mechanism 3 to preset the blowing time according to the welding hole specification, realize automatic cleaning, and reduce human operation differences.

[0062] In some cases, a gas pressure monitoring table can also be provided inside the handle 32 to display the gas pressure input into the cavity in real time, so that the operator can adjust the gas output pressure as needed to ensure cleaning effect while preventing excessive pressure.

[0063] According to one embodiment of the present application, the heating platform 1 is locally raised upward, and the upper surface of the raised part is concave downward to form a heating groove 11 (not shown in the figure); or a baffle is fixed on the upper surface of the heating platform 1, and the baffles are connected end to end to form the heating groove 11, as shown in Figure 2 .

[0064] The heating platform 1 is locally raised upward and the upper surface of the raised part is concave downward to form a heating groove 11, or a baffle is fixed on the upper surface of the heating platform 1 and the baffles are connected end to end to form the heating groove 11, which can effectively realize the accommodation and positioning of the heat-conducting liquid and provide a stable working area for the heating and melting of the welding points 44 on the PCB board 42.

[0065] For the structure of the local protrusion and the concave forming the heating groove 11, the protrusion part can relatively raise the position of the heating groove 11, so that the upper end surface of the heating groove 11 is higher than the upper surface of the heating platform 1. This design not only ensures that the heating groove 11 has sufficient depth to accommodate the heat-conducting liquid, but also enables the solder joints 44 on the PCB board 42 to be fully immersed in the heat-conducting liquid. At the same time, the concave formed groove structure can naturally constrain the heat-conducting liquid, preventing it from overflowing during the heating process and ensuring that the heat-conducting liquid is concentrated around the solder joints 44, thereby improving the accuracy of the heating effect.

[0066] The way of using the baffle to form the heating groove 11 is relatively flexible, and different shapes or heights of baffles can be selected and combined according to the size and solder joint distribution of different PCB boards to form a heating groove 11 that meets specific needs, thereby enhancing the versatility and customizability of the device. The fixed connection of the baffle and the heating platform 1 can form a stable blocking structure to effectively block the outflow of the heat-conducting liquid. In addition, the material of the baffle can be selected to have good heat insulation performance, further reducing heat loss and improving heating efficiency. The baffle and the heating platform 1 can be fixed by welding.

[0067] Both of the above two structures can restrict the heat-conducting liquid in a specific area by physical blocking, so that the heat-conducting liquid can concentrate on the solder joints 44 of the PCB board 42 after absorbing the heat transferred by the heat source 2, ensuring that the solder joints 44 are heated to a molten state and preventing the heat-conducting liquid from leaking and affecting other parts of the heating platform 1, thereby ensuring the safe and stable operation of the device.

[0068] Taking the baffle to form the heating groove 11 as an example, a surrounding plate can be arranged around the heating groove 11 to form an annular overflow groove. The overflow groove is in communication with the heating groove 11 through a plurality of evenly distributed flow guide holes, and the height of the flow guide hole is flush with the normal liquid level of the heating groove 11. When the solder joints 44 enter the heating groove 11 filled with heat-conducting liquid, the displaced heat-conducting liquid will flow into the overflow groove through the flow guide holes due to the rising liquid level. The volume of the overflow groove is designed to accommodate the maximum liquid volume displaced by the solder joints 44, ensuring that the excess liquid is completely collected without overflowing. The design of the above-mentioned overflow groove can reduce the capacity accuracy requirement of the heat-conducting liquid in the heating groove 11. When adding heat-conducting liquid to the heating groove 11, there is no need to consider whether the heat-conducting liquid is too little to contact the solder joints 44 or too much to easily overflow. The operator can directly set the heat-conducting liquid to be relatively more, and the heat-conducting liquid will flow into the overflow groove after overflowing, without affecting subsequent operations.

[0069] According to an embodiment of the present application, the heating platform 1 is arranged above the heat source 2 and in contact with the heat source 2, as shown in Figure 1 and Figure 2Or, a heat source 2 (not shown in the figure) is arranged in the heating platform 1.

[0070] The heating platform 1 is arranged above and in contact with the heat source 2, and the heat generated by the heat source 2 can be transmitted to the heating platform 1 through direct contact, so that the heating platform 1 is uniformly heated as a whole, and then the heat is transmitted to the heat-conducting liquid in the heating groove 11. The contact area of the heat source 2 and the heating platform 1 can be flexibly designed according to the heating requirement, the thermal resistance is reduced by increasing the contact area, the heat transfer efficiency is improved, and the heat-conducting liquid can quickly reach the preset temperature. At the same time, the split arrangement of the heat source 2 and the heating platform 1 facilitates the separate maintenance and replacement of the heat source 2 or the heating platform 1, reduces the difficulty of later maintenance, and the installation position of the heat source 2 can be adjusted according to the space layout to adapt to different overall structural designs of the equipment.

[0071] The heat source 2 is arranged in the heating platform 1, and the heat source 2 directly generates heat inside the heating platform 1, the heat transfer path is shorter, the loss of heat in the transmission process is reduced, the heat-conducting liquid in the heating groove 11 can be heated to the target temperature in a shorter time, and the heating efficiency is improved. The built-in structure can make the temperature distribution of the heating platform 1 more uniform, avoid excessive local temperature difference of the heat-conducting liquid caused by uneven heat transfer, and ensure that the solder joints 44 on the PCB board 42 can be uniformly heated. At the same time, the built-in design of the heat source 2 makes the overall device structure more compact, saves installation space, and meets the design requirements of small-sized equipment.

[0072] According to one embodiment of the present application, the heat-conducting liquid is tin paste, silicon oil, heat-conducting oil or fluorinated liquid; and / or the heating platform 1 is a component made of stainless steel, copper, copper alloy or aluminum alloy. The heating platform 1 can also use other metals with good heat conductivity according to actual needs. When using silicon oil, heat-conducting oil or fluorinated liquid as the heat-conducting liquid, a "impurity removal" step can be added in the subsequent PCB board recycling process according to actual conditions, so as to avoid the influence of residual silicon oil, heat-conducting oil or fluorinated liquid on the subsequent re-soldering operation.

[0073] The heating platform 1 can adopt the form of a micro-tin furnace heating disc, and the thickness of the heating disc can be 5-10 mm. The upper and lower surfaces of the heating disc can be polished and ground to reduce the surface roughness, and the micro-tin furnace heating disc and the heat exchanger of the controllable heat source 2 are locked by using a countersunk screw, so that the two are in close contact and the heat loss rate is reduced. The heat source of the heating platform 1 can also adopt the form of a copper wire heating coil.

[0074] The liquid crystal module disassembly and processing device provided by the embodiment of the present application is simple and convenient to operate, has low operation threshold, does not limit the soldering level of the operator, and can be completed by simple training of the operator without soldering experience. After disassembly, the PCB board 42 can be directly assembled with a new liquid crystal module, which greatly improves the production efficiency, ensures the continuity of production and maintenance, and eliminates the process bottleneck.

[0075] According to the liquid crystal module dismounting and processing method of the second aspect of the present application, the aforementioned liquid crystal module dismounting and processing device is used, as shown in the figure, including: turning on the heat source 2, heating the heat-conducting liquid in the heating groove 11 to a preset value; placing the PCB board 42 with the liquid crystal module 41 on the heating platform 1, so that the solder joints 44 of the PCB board 42 are immersed in the heat-conducting liquid; after the solder joints 44 of the PCB board 42 are melted, the liquid crystal module 41 is vertically dismounted from the PCB board 42. Figure 5

[0076] The liquid crystal module dismounting and processing method implemented by the aforementioned device can heat the heat-conducting liquid to a preset temperature by the heat source 2, so that the solder joints 44 of the PCB board 42 are uniformly heated by being immersed in the heat-conducting liquid, and the efficient and safe dismounting of the liquid crystal module 41 can be realized. After the heat source 2 is turned on, the heat-conducting liquid forms a stable high-temperature environment in the heating groove 11, and when the solder joints 44 of the PCB board 42 are immersed in the heat-conducting liquid, the heat is quickly transferred to the solder joints 44 through the heat-conducting liquid, so that the solder joints 44 are uniformly melted, and the damage to the PCB board 42 caused by local overheating is avoided. The liquid crystal module 41 is vertically dismounted, and the characteristic that the solder joints 44 are simultaneously in a molten state can be used to reduce the pulling force on the PCB board pads and the metal pins 43 of the liquid crystal module during the dismounting process, thereby reducing the risk of pad falling off or pin deformation and protecting the structural integrity of the two.

[0077] Compared with the traditional point-by-point heating dismounting method, this method synchronously melts all the solder joints 44 through the overall heating of the heat-conducting liquid, thereby omitting the step of heating one by one, shortening the operation time, and avoiding the damage to the PCB board 42 caused by forcibly dismounting due to insufficient melting of part of the solder joints 44, which not only improves the dismounting efficiency, but also enhances the safety and reliability of the operation, and is suitable for various PCB board dismounting scenarios of liquid crystal modules with metal pins.

[0078] In some cases, after the PCB board 42 is placed on the heating platform 1, a heat preservation and standing step can be added, that is, the temperature of the heat-conducting liquid is maintained at the preset value for a period of time, so that the solder joints 44 are sufficiently softened at a stable temperature, and the uneven melting caused by temperature fluctuations is reduced; when the liquid crystal module 41 is dismounted, a slight rotating action (the rotating angle is controlled within 10 degrees) can be used to separate the liquid crystal module 41 from the PCB board 42, so that the shear force generated by the rotation can assist in separation, the pulling force in the vertical direction is reduced, and the pads are further protected.

[0079] According to an embodiment of the present application, after the liquid crystal module 41 is vertically dismounted from the PCB board 42, a solder hole cleaning mechanism 3 is used to clean the solder holes on the PCB board 42.

[0080] ​After the LCD module 41 is vertically removed from the PCB board 42, the solder holes on the PCB board 42 are cleaned using the solder hole cleaning mechanism 3. This effectively removes residual solder debris, flux residue, or heat transfer fluid traces from the solder holes, preventing these residues from solidifying or accumulating and ensuring the solder holes remain unobstructed. The cleaning process utilizes the impact force of high-temperature, dry compressed gas to clean the inside of the solder holes without mechanical contact with the inner wall, preventing scratches or deformation and protecting the structural integrity of the solder holes. This provides a clean connection base for subsequent resoldering of the LCD module or other components.

[0081] The addition of the purging and cleaning step creates a complete closed-loop process for disassembly, from heating and melting the solder joint 44 and disassembling the LCD module to cleaning the solder holes. This reduces the risk of contamination in intermediate steps. At the same time, the compressed gas purging method is easy to operate and can be matched with the overall rhythm of the disassembly and processing device without significantly increasing the operation time. It maintains high processing efficiency while ensuring the cleaning effect, further improving the reusability of the PCB board 42 and the reliability of subsequent soldering.

[0082] During the purging process, the gas injection angle can be adjusted to purge the weld hole multiple times from different directions, ensuring that all residues in the corners of the hole are removed. It is especially suitable for cleaning deep holes or irregularly shaped weld holes.

[0083] For example, when disassembling and cleaning the LCD module 41, the operator can specifically operate in the following manner: Place the LCD module disassembly and processing device on a horizontal platform, connect the controllable heat source 2 to the power supply, and preheat it to 280-290 degrees Celsius for 10 minutes. After the solder paste in the heating tank 11 melts (using solder paste as a heat transfer fluid), take the PCB board 42 to be disassembled, align the PCB board 42 with the heating tank 11, and place it horizontally on the heating platform 1 so that the solder joints 44 are completely immersed in the solder paste in the heating tank 11. After the solder on the pins (i.e., metal pins 43) of the LCD module 41 melts, the operator, wearing thermal protective gear, removes the LCD module 41 from the PCB board 42 in a vertical direction. Align the metal micro air tube (i.e., air outlet 31) of the solder hole cleaning mechanism 3 with the solder holes on the PCB board 42 one by one, quickly remove the PCB board 42 and the solder hole cleaning mechanism 3 from the heating platform 1, and quickly press the shut-off valve 34 on the solder hole cleaning mechanism 3 to complete the cleaning of the solder holes on the PCB board 42.

[0084] Finally, it should be noted that the above embodiments are only used to illustrate the present application, and are not intended to limit the present application. Although the present application is described in detail with reference to the embodiments, those skilled in the art should understand that various combinations, modifications or equivalent replacements of the technical solutions of the present application do not deviate from the spirit and scope of the present application, and should be covered in the scope of claims of the present application.

Claims

1. A liquid crystal module disassembly processing device for removing a liquid crystal module (41) from a PCB board (42), characterized in that, include: The heating platform (1) is provided with a heating tank (11) and a limiting mechanism (12). The heating tank (11) is configured to contain heat-conducting liquid, and the upper end surface of the heating tank (11) is higher than the upper surface of the heating platform (1). The shape of the heating tank (11) matches the arrangement shape of the solder joints (44) of the PCB board (42). The limiting mechanism (12) is used to limit the distance between the PCB board (42) and the heating platform (1), so that the solder joints (44) of the PCB board (42) are in contact with the heat-conducting liquid in the heating tank (11), and to limit the contact between the electronic devices on the PCB board (42) and the upper surface of the heating platform (1). Heat source (2) is used to increase the temperature of the heat-conducting liquid in the heating tank (11) to a preset value.

2. The liquid crystal module disassembly processing device according to claim 1, characterized in that, The limiting mechanism (12) includes a limiting post (121) fixed to the upper surface of the heating platform (1), the free end of the limiting post (121) being used to abut against the PCB board (42) to limit the contact between the electronic devices on the PCB board (42) and the upper surface of the heating platform (1); and / or The wall of the heating tank (11) forms the limiting mechanism (12).

3. The liquid crystal module disassembly processing device according to claim 2, characterized in that, The limiting mechanism (12) includes a limiting post (121) fixed to the upper surface of the heating platform (1): The free end of the limiting post (121) is provided with a heat insulation element, and / or the free end of the limiting post (121) is provided with a heat insulation coating.

4. The liquid crystal module disassembly processing device according to claim 1, characterized in that, It also includes a weld hole cleaning mechanism (3), which includes an air outlet pipe (31). The air inlet of the air outlet pipe (31) is used to connect with an air source, and the air outlet of the air outlet pipe (31) is used to output compressed gas to the weld holes on the PCB board (42). The weld hole cleaning mechanism (3) is connected to the heating platform (1), or the weld hole cleaning mechanism (3) and the heating platform (1) are separately configured.

5. The liquid crystal module disassembly processing device according to claim 4, characterized in that, The weld hole cleaning mechanism (3) includes: Handle (32); The air circuit board (33) is detachably connected to the handle (32); the air circuit board (33) has a cavity inside, and the cavity is connected to the air source through a pipeline; the air circuit board (33) is provided with multiple air outlets connected to the cavity, and the air outlets are equipped with air outlet pipes (31), and the multiple air outlet pipes (31) are correspondingly set with multiple solder points (44) of the PCB board (42).

6. The liquid crystal module disassembly processing apparatus according to any one of claims 1 to 5, characterized in that, The heating platform (1) is partially convex upwards, and the upper surface of the convexity is partially concave to form the heating groove (11); or The upper surface of the heating platform (1) is fixed with a baffle, which is connected end to end to form the heating groove (11).

7. The liquid crystal module disassembly processing apparatus according to any one of claims 1 to 5, characterized in that, The heating platform (1) is positioned above the heat source (2) and in contact with the heat source (2); or The heating platform (1) is equipped with the heat source (2).

8. The liquid crystal module disassembly processing apparatus according to any one of claims 1 to 5, characterized in that, The heat-conducting fluid is solder paste, silicone oil, heat-conducting oil, or fluorinated fluid; and / or The heating platform (1) is a component made of stainless steel, copper, copper alloy or aluminum alloy.

9. A method for disassembling a liquid crystal module, characterized in that, The liquid crystal module disassembly processing apparatus as described in any one of claims 1 to 8 includes: Turn on the heat source (2) to heat the heat transfer fluid in the heating tank (11) to the preset value; The PCB board (42) with the liquid crystal module (41) is placed on the heating platform (1) and the solder joints (44) of the PCB board (42) are immersed in the heat-conducting liquid. After the solder joints (44) on the PCB board (42) are melted, the LCD module (41) is removed from the PCB board (42) in a vertical direction.

10. The liquid crystal module disassembly method according to claim 9, characterized in that, After the liquid crystal module (41) is removed vertically from the PCB board (42), the following steps are also included: The solder holes on the PCB board (42) are cleaned using a solder hole cleaning device (3).

Images