A PCB board soldering tray adjustment device

By designing a PCB board soldering tray adjustment device, and utilizing components such as sliding grooves, sliding plates, and magnetic clamps, the precise movement and pressure adjustment of the soldering gun are achieved, solving the problem of poor soldering displacement and pressure control, and improving soldering quality and circuit reliability.

CN120897364BActive Publication Date: 2026-04-03PI SEMICON (NANTONG) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-10-30
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

Existing PCB board soldering equipment suffers from poor control of soldering displacement during the soldering process, leading to cold solder joints and short circuits, which affect the quality of solder joint connections and circuit reliability. Furthermore, uneven soldering pressure results in uneven solder joint distribution, reducing the reliability of solder joint connections.

Method used

A PCB board soldering tray adjustment device was designed, comprising a device housing, a connecting beam, a clamping and positioning mechanism, a horizontal and vertical adjustment mechanism, and a pressure adjustment mechanism. Through the combination of sliding grooves, sliding plates, magnetic clamps, and locking blocks, the welding gun can be moved precisely and the pressure adjusted to ensure welding quality.

Benefits of technology

It achieves precise movement and pressure control of the welding gun, ensuring the accuracy of welding displacement and the uniformity of welding pressure during the welding process, thereby improving the reliability of weld joint connections and the stability of circuits.

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Abstract

This invention provides a PCB board soldering pad adjustment device, including a device housing and a connecting beam. The connecting beam is fixedly connected to the inner surface of the device housing, and a device base is fixedly connected to the bottom surface of the device housing. A soldering gun is mounted on the inner surface of the connecting beam. A clamping and positioning mechanism is provided on the bottom surface of the device housing. A lateral adjustment mechanism is provided on the inner surface of the connecting beam. A longitudinal adjustment mechanism is provided on the outer surface of the soldering gun. A pressure adjustment mechanism is provided on the inner surface of the connecting beam. The lateral adjustment mechanism can move laterally and restrict lateral movement to achieve longitudinal control. The longitudinal adjustment mechanism can move longitudinally and restrict longitudinal movement to achieve lateral control. The pressure adjustment mechanism can adjust the soldering pressure of the soldering gun. Appropriate pressure application can ensure soldering quality and ensure that the soldering pad applies uniform pressure to the soldering area to ensure a good solder joint.
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Description

[0001] This application is a divisional application of application filed on October 30, 2023, with application number 202311420844.7 and invention title "A Precision Adjustment Device for PCB Board Welding Pads". Technical Field

[0002] This invention relates to the field of embossing circuit technology, and in particular to a PCB board soldering pad adjustment device. Background Technology

[0003] Printed circuit boards (PCBs) are crucial electronic components widely used in various electronic devices. They are flat boards that support and connect electronic components, containing conductive paths, connection points, and solder joints for transmitting electronic signals and power. The main function of a PCB is to provide mechanical support and electrical connections for electronic components. It is typically made of insulating materials, such as glass fiber reinforced epoxy resin (FR-4), and coated with conductive copper layers that form the circuitry. PCBs are manufactured through printing, etching, and other processing techniques. The advantages of PCBs lie in their highly reliable circuit connections, compact design, ease of manufacturing and assembly, and support for the miniaturization and automated production of electronic devices. They are suitable for various applications, including consumer electronics, communication equipment, medical instruments, industrial control, and aerospace. During use, PCBs typically contain small components and solder pads that require high-precision soldering. Poor control of soldering displacement can lead to cold solder joints and short circuits, potentially causing circuit failures. Appropriate soldering pressure ensures uniform contact between the solder joints and the pads and components, providing a good solder joint connection. This is crucial for ensuring circuit reliability and stability. Poor soldering pressure control, such as excessively high or low soldering pressure, can lead to incomplete solder joints and short circuits, thus affecting the quality of solder joint connections. Furthermore, incorrect soldering pressure can result in uneven solder joint distribution, with some joints having excessive or insufficient solder, which may reduce the reliability of the solder joint connections.

[0004] However, most existing PCB board soldering pad equipment, when used in practice, suffers from problems. A search of patent number CN201810608161.7, concerning a BGA pad soldering machine and method, reveals that "a drive device is used to move the electrical discharge welding head closer to the mounting position, where the BGA pad can be soldered to the solder material. Finally, the drive device moves the electrical discharge welding head away from the mounting position." While the welding head can move, pressure control is poor. Appropriate welding pressure ensures the appropriate amount of solder is used, avoiding excessive waste and saving costs. High welding pressure can damage components, especially surface mount components. Poor displacement control can lead to decreased solder joint quality, resulting in uneven solder joints or cold solder joints, which may reduce solder joint reliability. Summary of the Invention

[0005] The purpose of this invention is to provide a PCB board solder pad adjustment device to address the problems of existing PCB board solder pad devices mentioned in the background art. During use, PCB boards typically have small components and solder pads that require high-precision soldering. Poor control of soldering displacement can lead to cold solder joints and short circuits, potentially causing circuit failures. Appropriate soldering pressure ensures uniform contact between the solder joints and the pads and components, providing a good solder joint connection. This is crucial for ensuring circuit reliability and stability. Poorly controlled soldering pressure (too high or too low) can cause cold solder joints and short circuits, affecting the solder joint connection quality. Incorrect soldering pressure can also lead to uneven solder joint distribution, with some solder joints being over- or under-plated, potentially reducing the reliability of the solder joint connection.

[0006] To achieve the above objectives, the present invention provides a PCB board soldering tray adjustment device, including a device housing and a connecting beam. The connecting beam is fixedly connected to the inner surface of the device housing, and a device base is fixedly connected to the bottom surface of the device housing. A soldering gun is mounted on the inner surface of the connecting beam. A clamping and positioning mechanism is provided on the bottom surface of the device housing. A lateral adjustment mechanism is provided on the inner surface of the connecting beam. A longitudinal adjustment mechanism is provided on the outer surface of the soldering gun. A pressure adjustment mechanism is provided on the inner surface of the connecting beam.

[0007] Preferably, the number of the equipment housings is two and they are symmetrically distributed. Both ends of the connecting beam are fixedly connected to the equipment housings. The connecting beams are made of stainless steel.

[0008] Preferably, the clamping and positioning mechanism includes a fixing block, a mounting rod, a tension spring, a clamping plate, and a placement base. The fixing block is fixedly connected to the bottom surface of the equipment housing, the mounting rod is fixedly connected to the inner surface of the fixing block, the tension spring is sleeved on the outer surface of the mounting rod, the clamping plate is slidably connected to the outer surface of the mounting rod, and the placement base is slidably connected to the inner surface of the clamping plate.

[0009] Preferably, a fixing block is fixedly connected to the bottom surface of the connecting beam, the mounting rod passes through the fixing block and is fixedly connected to the fixing block, one end of the tension spring is fixedly connected to the fixing block, and the other end of the tension spring is fixedly connected to the clamping plate. The number of clamping plates is two and they are symmetrically distributed.

[0010] Preferably, the lateral adjustment mechanism includes a sliding groove, a sliding plate, a magnetic clamp, a mounting shaft, and a locking block. The inner surface of the connecting beam has a sliding groove, the inner surface of the sliding groove is slidably connected to the sliding plate, the outer surface of the connecting beam is slidably connected to the magnetic clamp, the top surface of the magnetic clamp is fixedly connected to the mounting shaft, and the outer surface of the mounting shaft is rotatably connected to the locking block.

[0011] Preferably, the number of sliding plates is two and they are symmetrically distributed, and the locking block is slidably connected to the sliding plates.

[0012] Preferably, the longitudinal adjustment mechanism includes an installation cylinder, a sliding cylinder, a connecting block, a threaded post, a clamping plate, and a clamping knob. The installation cylinder is engaged with the outer surface of the welding gun. The sliding cylinder is fixedly connected to the bottom surface of the installation cylinder. The connecting block is fixedly connected to the outer surface of the sliding cylinder. The threaded post is threadedly connected to the inner surface of the connecting block. One end of the threaded post is fixedly connected to the clamping plate, and the other end of the threaded post is fixedly connected to the clamping knob.

[0013] Preferably, there are two connecting blocks symmetrically distributed on the outer surface of the sliding cylinder, the sliding plate passes through the connecting blocks and is slidably connected to the connecting blocks, and the clamping disc is slidably connected to the sliding plate.

[0014] Preferably, the pressure regulating mechanism includes a mounting block, a rotating column, a sliding groove, a threaded rod, a compression spring, and a lifting base. The mounting block is slidably connected to the inner surface of the connecting beam, the rotating column is rotatably connected to the top of the mounting block, the sliding groove is formed on the top surface of the connecting beam, the threaded rod is threadedly connected to the inner surface of the rotating column, the compression spring is sleeved on the outer surface of the threaded rod, and the lifting base is fixedly connected to the bottom of the threaded rod.

[0015] Preferably, the mounting block is slidably connected to the sliding groove, and both ends of the mounting block are fixedly connected to the sliding plate.

[0016] Preferably, the rotating column is slidably connected to the sliding groove, the threaded rod passes through the mounting block, and the lifting base is slidably connected to the sliding groove.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: The PCB board soldering pad adjustment device has the following effects:

[0018] 1. Through the setting of sliding groove, sliding plate, magnetic clamp, mounting shaft and locking block, during use, the sliding plate is slidably connected in the sliding groove opened on the connecting crossbeam to limit the sliding range of the sliding plate. The longitudinal adjustment mechanism and welding gun are installed on the sliding plate to realize the lateral movement of the welding gun. The magnetic clamp is magnetically attracted to the connecting crossbeam and can be freely adjusted in position. When aligned with the sliding plate, the locking block can be put down. The locking block rotates around the mounting shaft and locks on the sliding plate to limit the lateral movement of the sliding plate. At this time, the longitudinal adjustment mechanism can be used to make the welding gun move only longitudinally, realizing precise control of the longitudinal movement of the welding gun.

[0019] 2. Through the configuration of the mounting cylinder, sliding cylinder, connecting block, threaded column, clamping plate, and clamping knob, the connecting block is slidably connected to the sliding plate during use, allowing it to slide on the sliding plate. The mounting cylinder and sliding cylinder drive the welding gun to move longitudinally. The welding gun is clamped and installed inside the mounting cylinder and sliding cylinder, ensuring it remains perpendicular to the bottom base and the PCB board. The threaded column on the connecting block moves by rotating the clamping knob, moving the threaded column and driving the clamping plate. When the clamping plate approaches the sliding plate inside the connecting block, the clamping plates on both sides clamp it, restricting the longitudinal movement of the welding gun. At this time, the welding gun can be adjusted laterally by the lateral adjustment mechanism, achieving precise control of the welding gun's lateral movement.

[0020] 3. Through the design of the mounting block, rotating column, sliding groove, threaded rod, compression spring, and lifting base, the mounting block can slide on the threaded rod and lifting base during use. When the welding gun is pressed for welding, it will drive the sliding plate down together, and the sliding plate will move the mounting block down until it contacts the lifting base. When the welding gun is not pressed, the mounting block will be lifted and reset by the compression spring on the lifting base. The threaded rod is connected to the lifting base. By rotating the rotating column, the threaded rod can be moved and the position of the lifting base can be changed. This changes the downward movement range of the mounting block, thereby adjusting the welding pressure of the welding gun. Appropriate pressure application can ensure welding quality and ensure that the welding plate applies uniform pressure to the welding area to ensure a good weld connection. Attached Figure Description

[0021] Figure 1 This is a side view of the overall structure of the present invention;

[0022] Figure 2 This is a side view of the overall structure of the present invention;

[0023] Figure 3 This is a schematic diagram of the interaction between the outer shell and the fixing block of the device of the present invention;

[0024] Figure 4This is a schematic diagram of the structure in which the clamping plate and the placement base of the present invention cooperate with each other;

[0025] Figure 5 This is a schematic diagram of the interlocking structure of the connecting beam and the sliding plate of the present invention;

[0026] Figure 6 This is a schematic diagram of the cooperative structure of the sliding plate and the locking block of the present invention;

[0027] Figure 7 This is a schematic diagram of the interlocking structure of the locking block and the connecting block of the present invention;

[0028] Figure 8 This is a cross-sectional schematic diagram of the interlocking structure of the connecting block and the clamping plate of the present invention;

[0029] Figure 9 This is a schematic diagram of the interaction between the sliding plate and the mounting block of the present invention;

[0030] Figure 10 This is a cross-sectional schematic diagram of the structure in which the mounting block and the lifting base of the present invention cooperate.

[0031] In the diagram: 1. Equipment casing; 2. Connecting beam; 3. Equipment base; 4. Welding gun; 5. Clamping and positioning mechanism; 501. Fixing block; 502. Mounting rod; 503. Tension spring; 504. Clamping plate; 505. Placement base; 6. Lateral adjustment mechanism; 601. Sliding groove; 602. Sliding plate; 603. Magnetic clamping plate; 604. Mounting shaft; 605. Locking block; 7. Longitudinal adjustment mechanism; 701. Mounting cylinder; 702. Sliding cylinder; 703. Connecting block; 704. Threaded column; 705. Clamping plate; 706. Clamping knob; 8. Pressure adjustment mechanism; 801. Mounting block; 802. Rotating column; 803. Sliding groove; 804. Threaded rod; 805. Compression spring; 806. Lifting base. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Please see Figure 1-10This invention provides a PCB board soldering tray adjustment device, comprising a device housing 1 and a connecting beam 2. The connecting beam 2 is fixedly connected to the inner surface of the device housing 1, and a device base 3 is fixedly connected to the bottom surface of the device housing 1. A soldering gun 4 is mounted on the inner surface of the connecting beam 2. A clamping and positioning mechanism 5 is provided on the bottom surface of the device housing 1. A lateral adjustment mechanism 6 is provided on the inner surface of the connecting beam 2. A longitudinal adjustment mechanism 7 is provided on the outer surface of the soldering gun 4. A pressure adjustment mechanism 8 is provided on the inner surface of the connecting beam 2. During use, the device housing 1 and the device base 3 provide external protection and install the internal connecting beam 2. The connecting beam 2 is used to install most of the components. After the clamping and positioning mechanism 5 clamps the PCB board to be soldered, the position of the soldering gun 4 is adjusted by the lateral adjustment mechanism 6 and the longitudinal adjustment mechanism 7, and the pressure during soldering is adjusted by the pressure adjustment mechanism 8.

[0034] Furthermore, there are two housings 1, which are symmetrically distributed. Both ends of the connecting beam 2 are fixedly connected to the housing 1. The connecting beam 2 is made of stainless steel. The symmetrically arranged housings 1 simultaneously clamp and protect both sides of the connecting beam 2. The stainless steel can be used in conjunction with magnetic components.

[0035] Furthermore, the clamping and positioning mechanism 5 includes a fixing block 501, a mounting rod 502, a tension spring 503, a clamping plate 504, and a placement base 505. The fixing block 501 is fixedly connected to the bottom surface of the equipment housing 1. The mounting rod 502 is fixedly connected to the inner surface of the fixing block 501. The tension spring 503 is sleeved on the outer surface of the mounting rod 502. The clamping plate 504 is slidably connected to the outer surface of the mounting rod 502. The placement base 505 is slidably connected to the inner surface of the clamping plate 504. The clamping and positioning mechanism 5, through the fixing block 501, mounting rod 502, tension spring 503, clamping plate 504, and placement base 505, achieves its positioning function. In the use of the base 505, the fixing block 501 is used to support and install the mounting rod 502. The fixing block 501 is located at the center of the equipment housing 1 and the connecting beam 2 respectively. The mounting rod 502 is fitted with a tension spring 503 and is slidably connected to a clamping plate 504. The tension spring 503 is fixedly connected to the clamping plate 504 and the fixing block 501 in the center. When the clamping plate 504 is pulled closer to the fixing block 501, the clamping plates 504 on both sides move closer to the center to clamp the PCB board placed on the base 505 for fixation. This is suitable for PCB boards of different sizes.

[0036] Furthermore, a fixing block 501 is fixedly connected to the bottom surface of the connecting beam 2. The mounting rod 502 passes through the fixing block 501 and is fixedly connected to the fixing block 501. One end of the tension spring 503 is fixedly connected to the fixing block 501, and the other end of the tension spring 503 is fixedly connected to the clamping plate 504. There are two clamping plates 504, which are symmetrically distributed. The fixing blocks 501 are located at the center of the equipment housing 1 and the connecting beam 2, respectively, to support and install the mounting rod 502. The tension spring 503 pulls the clamping plates 504 on both sides closer to the fixing block 501 for clamping.

[0037] Furthermore, the lateral adjustment mechanism 6 includes a sliding groove 601, a sliding plate 602, a magnetic clamping plate 603, a mounting shaft 604, and a locking block 605. The inner surface of the connecting beam 2 has a sliding groove 601, the sliding plate 602 is slidably connected to the inner surface of the sliding groove 601, the magnetic clamping plate 603 is slidably connected to the outer surface of the connecting beam 2, the mounting shaft 604 is fixedly connected to the top surface of the magnetic clamping plate 603, and the locking block 605 is rotatably connected to the outer surface of the mounting shaft 604. Through the arrangement of the sliding groove 601, sliding plate 602, magnetic clamping plate 603, mounting shaft 604, and locking block 605, during use, the connecting beam 2... A sliding plate 602 is slidably connected within a sliding groove 601 on the connecting beam 2 to limit the sliding range of the sliding plate 602. A longitudinal adjustment mechanism 7 and a welding gun 4 are installed on the sliding plate 602 to enable the lateral movement of the welding gun 4. A magnetic clamp 603 is magnetically attached to the connecting beam 2 and can be freely adjusted in position. When aligned with the sliding plate 602, a locking block 605 can be lowered. The locking block 605 rotates around the mounting shaft 604 and locks onto the sliding plate 602, restricting the lateral movement of the sliding plate 602. At this time, the longitudinal adjustment mechanism 7 can be used to make the welding gun 4 move only longitudinally, thus achieving precise control over the longitudinal movement of the welding gun 4.

[0038] Furthermore, there are two sliding plates 602, which are symmetrically distributed. The locking block 605 is slidably connected to the sliding plate 602. The symmetrically arranged sliding plates 602 are used to install the longitudinal adjustment mechanism 7. The locking block 605 can be locked on the sliding plate 602 to restrict the lateral movement of the sliding plate 602.

[0039] Furthermore, the longitudinal adjustment mechanism 7 includes a mounting cylinder 701, a sliding cylinder 702, a connecting block 703, a threaded post 704, a clamping plate 705, and a clamping knob 706. The mounting cylinder 701 is engaged with the outer surface of the welding gun 4. The sliding cylinder 702 is fixedly connected to the bottom surface of the mounting cylinder 701. The connecting block 703 is fixedly connected to the outer surface of the sliding cylinder 702. The threaded post 704 is threadedly connected to the inner surface of the connecting block 703. One end of the threaded post 704 is fixedly connected to the clamping plate 705, and the other end of the threaded post 704 is fixedly connected to the clamping knob 706. Through the arrangement of the mounting cylinder 701, the sliding cylinder 702, the connecting block 703, the threaded post 704, the clamping plate 705, and the clamping knob 706, during use, the connecting block 703 is controlled by the sliding plate 602. The connecting block 703 is slidably connected, allowing it to slide on the sliding plate 602. The welding gun 4 moves longitudinally via the mounting cylinder 701 and the sliding cylinder 702. The welding gun 4 is clamped and installed inside the mounting cylinder 701 and the sliding cylinder 702, ensuring it remains perpendicular to the bottom placement base 505 and the PCB board. The threaded column 704 on the connecting block 703 is rotated by the clamping knob 706. The threaded column 704 moves on the connecting block 703 and drives the clamping plate 705 to move. When the clamping plate 705 approaches the sliding plate 602 inside the connecting block 703, the clamping plates 705 on both sides clamp it, restricting the longitudinal movement of the welding gun 4. At this time, the welding gun 4 can only move laterally via the lateral adjustment mechanism 6, achieving precise control of the lateral movement of the welding gun 4.

[0040] Furthermore, there are two connecting blocks 703, which are symmetrically distributed on the outer surface of the sliding cylinder 702. The sliding plate 602 passes through the connecting blocks 703 and is slidably connected to the connecting blocks 703. The clamping plate 705 is slidably connected to the sliding plate 602. The symmetrical arrangement of the connecting blocks 703 disperses the force and balances the weight when moving through the sliding plate 602. The connecting blocks 703 are penetrated by the sliding plate 602 and are slidably connected so that the connecting blocks 703 can slide on the sliding plate 602. When the clamping plate 705 approaches the sliding plate 602 inside the connecting blocks 703, the clamping plates 705 on both sides clamp it, restricting the longitudinal movement of the welding gun 4.

[0041] Furthermore, the pressure regulating mechanism 8 includes a mounting block 801, a rotating column 802, a sliding groove 803, a threaded rod 804, a compression spring 805, and a lifting base 806. The mounting block 801 is slidably connected to the inner surface of the connecting beam 2. The rotating column 802 is rotatably connected to the top of the mounting block 801. The top surface of the connecting beam 2 has a sliding groove 803. The inner surface of the rotating column 802 is threadedly connected to the threaded rod 804. The outer surface of the threaded rod 804 is fitted with a compression spring 805. The bottom of the threaded rod 804 is fixedly connected to the lifting base 806. The mechanism utilizes the mounting block 801, rotating column 802, sliding groove 803, threaded rod 804, compression spring 805, and lifting base 806 to achieve the desired effect. The lifting base 806 is designed so that, during use, the mounting block 801 can slide on the threaded rod 804 and the lifting base 806. When the welding gun 4 is pressed for welding, it will cause the sliding plate 602 to be pressed down together, and the sliding plate 602 will move the mounting block 801 down until it contacts the lifting base 806. When the welding gun 4 is not pressed, the mounting block 801 will be lifted and reset by the compression spring 805 on the lifting base 806. The threaded rod 804 is connected to the lifting base 806. By rotating the rotating column 802, the threaded rod 804 is moved and the position of the lifting base 806 is changed. This changes the downward movement range of the mounting block 801, thereby adjusting the welding pressure of the welding gun 4.

[0042] Furthermore, the mounting block 801 is slidably connected to the sliding groove 601, and both ends of the mounting block 801 are fixedly connected to the sliding plate 602. The mounting block 801 moves within the connecting beam 2 along with the transverse adjustment mechanism 6.

[0043] Furthermore, the rotating column 802 is slidably connected to the sliding groove 803, the threaded rod 804 passes through the mounting block 801, the lifting base 806 is slidably connected to the sliding groove 601, the rotating column 802 moves on the connecting beam 2 through the sliding groove 803, and the threaded rod 804 is controlled in position within the mounting block 801 by the rotating column 802, without affecting the movement of the mounting block 801.

[0044] Working Principle: A PCB board soldering tray adjustment device. During use, the outer shell 1 and the base 3 provide external protection. The connecting beam 2 is used to install components, and the clamping and positioning mechanism 5 clamps the components. The position of the soldering gun 4 is adjusted by the horizontal adjustment mechanism 6 and the vertical adjustment mechanism 7. The pressure during soldering is adjusted by the pressure adjustment mechanism 8. The clamping and positioning mechanism 5 has a fixing block 501 that mounts the mounting rod 502. The tension spring 503 pulls the clamping plate 504 closer to the fixing block 501. The sliding plate 602 of the horizontal adjustment mechanism 6 moves the soldering gun 4. The magnetic clamping plate 603 controls the locking. The position of block 605 is locked, and the displacement of the horizontal adjustment mechanism 6 is locked. The vertical adjustment mechanism 7 can slide on the sliding plate 602 to drive the welding gun 4 to move. The threaded column 704 on the connecting block 703 is rotated by the clamping knob 706. When the clamping plate 705 approaches the sliding plate 602 in the connecting block 703, it clamps it and locks the displacement of the vertical adjustment mechanism 7. The pressure adjustment mechanism 8 drives the threaded rod 804 to move by rotating the rotating column 802 and changes the position of the lifting base 806, thereby changing the downward movement range of the mounting block 801 and adjusting the welding pressure of the welding gun 4.

[0045] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A PCB board soldering tray adjustment device, comprising a device housing (1) and a connecting beam (2), characterized in that: A connecting beam (2) is fixedly connected to the inner surface of the equipment housing (1), and an equipment base (3) is fixedly connected to the bottom surface of the equipment housing (1). A welding gun (4) is installed on the inner surface of the connecting beam (2). A clamping and positioning mechanism (5) is provided on the bottom surface of the equipment housing (1). The clamping and positioning mechanism (5) includes a fixing block (501), a mounting rod (502), a tension spring (503), a clamping plate (504), and a placement base (505). A lateral adjustment mechanism (6) is provided on the inner surface of the connecting beam (2). The lateral adjustment mechanism (6) includes a sliding groove (601), a sliding plate (602), a magnetic clamp (603), a mounting shaft (604), and a locking block (605). The inner surface of the connecting beam (2) is provided with a sliding groove (601). The inner surface of the sliding groove (601) is slidably connected to the sliding plate (602). The outer surface of the connecting beam (2) is slidably connected to the magnetic clamp (603). The top surface of the magnetic clamp (603) is fixedly connected to the mounting shaft (604). The outer surface of the mounting shaft (604) is rotatably connected to the locking block (605). The welding gun (4) is provided with a longitudinal adjustment mechanism (7) on its outer surface. The longitudinal adjustment mechanism (7) includes an installation cylinder (701), a sliding cylinder (702), a connecting block (703), a threaded column (704), a clamping plate (705), and a clamping knob (706). The inner surface of the connecting beam (2) is provided with a pressure adjustment mechanism (8). The pressure regulating mechanism (8) includes a mounting block (801), a rotating column (802), a sliding groove (803), a threaded rod (804), a compression spring (805), and a lifting base (806). The mounting block (801) is slidably connected to the inner surface of the connecting beam (2). The rotating column (802) is rotatably connected to the top of the mounting block (801). The sliding groove (803) is opened on the top surface of the connecting beam (2). The threaded rod (804) is threadedly connected to the inner surface of the rotating column (802). The compression spring (805) is sleeved on the outer surface of the threaded rod (804). The lifting base (806) is fixedly connected to the bottom of the threaded rod (804).

2. The PCB board soldering tray adjustment device according to claim 1, characterized in that: The number of the equipment housing (1) is two and they are symmetrically distributed. Both ends of the connecting beam (2) are fixedly connected to the equipment housing (1). The connecting beam (2) is made of stainless steel.

3. The PCB board soldering tray adjustment device according to claim 1, characterized in that: A fixing block (501) is fixedly connected to the bottom surface of the device housing (1). An installation rod (502) is fixedly connected to the inner surface of the fixing block (501). A tension spring (503) is sleeved on the outer surface of the installation rod (502). A clamping plate (504) is slidably connected to the outer surface of the installation rod (502). A placement base (505) is slidably connected to the inner surface of the clamping plate (504).

4. The PCB board soldering tray adjustment device according to claim 3, characterized in that: A fixing block (501) is fixedly connected to the bottom surface of the connecting beam (2). The mounting rod (502) passes through the fixing block (501) and is fixedly connected to the fixing block (501). One end of the tension spring (503) is fixedly connected to the fixing block (501), and the other end of the tension spring (503) is fixedly connected to the clamping plate (504). There are two clamping plates (504) and they are symmetrically distributed.

5. The PCB board soldering tray adjustment device according to claim 1, characterized in that: The number of sliding plates (602) is two and they are symmetrically distributed. The locking block (605) is slidably connected to the sliding plate (602).

6. The PCB board soldering tray adjustment device according to claim 1, characterized in that: The outer surface of the welding gun (4) is engaged with a mounting cylinder (701), the bottom surface of the mounting cylinder (701) is fixedly connected with a sliding cylinder (702), the outer surface of the sliding cylinder (702) is fixedly connected with a connecting block (703), the inner surface of the connecting block (703) is threaded with a threaded post (704), one end of the threaded post (704) is fixedly connected with a clamping disc (705), and the other end of the threaded post (704) is fixedly connected with a clamping knob (706).

7. The PCB board soldering tray adjustment device according to claim 6, characterized in that: The number of connecting blocks (703) is two and they are symmetrically distributed on the outer surface of the sliding cylinder (702). The sliding plate (602) passes through the connecting block (703) and is slidably connected to the connecting block (703). The clamping plate (705) is slidably connected to the sliding plate (602).

8. The PCB board soldering tray adjustment device according to claim 1, characterized in that: The mounting block (801) is slidably connected to the sliding groove (601), and both ends of the mounting block (801) are fixedly connected to the sliding plate (602).

9. The PCB board soldering tray adjustment device according to claim 1, characterized in that: The rotating column (802) is slidably connected to the sliding groove (803), the threaded rod (804) passes through the mounting block (801), and the lifting base (806) is slidably connected to the sliding groove (601).

Citation Information

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