Conductive backboard manufacturing method, conductive backboard and photovoltaic module

Abstract

The invention provides a conductive backboard manufacturing method, which is used for manufacturing a conductive backboard, the conductive backboard comprises glass, a glue film, a metal foil and an insulating layer, and the manufacturing method comprises the following steps: laminating the glass and the glue film; covering the metal foil subjected to pattern hollowing on the adhesive film; and covering the insulating layer on the metal foil. The conductive backboard can be prevented from permeating water vapor, and the reliability of the conductive backboard is improved. The invention also provides a conductive back plate and a photovoltaic module comprising the conductive back plate.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic cell technology, and in particular to a method for manufacturing a conductive backsheet, a conductive backsheet, and a photovoltaic module. Background Technology

[0002] IBC (Interdigitated Back Contact) batteries are a type of back-contact battery where the positive and negative metal electrodes are arranged in an interdigitated pattern on the back of the battery. The front of the battery is unobstructed by grid lines, effectively reducing optical loss and achieving higher power generation efficiency. The back of the IBC battery features MBB (Multi-Busbar) cells. The beginning, end, and middle of the MBB cells are connected to the main grids via pads, and the fine grid lines of the positive and negative electrodes of the MBB cells are arranged alternately.

[0003] In existing technologies, IBC (Integrated Circuit Board) battery modules are manufactured using integrated conductive backsheet technology. The integrated backsheet is composed of a substrate, encapsulant film, metal foil, and insulating material, and these modules are all single-glass modules. Due to the problem of moisture permeation in the substrate material, the module may experience issues such as encapsulant film hydrolysis, metal component corrosion, and PID (performance degradation) phenomena, which have a certain impact on the reliability of the module. Summary of the Invention

[0004] The purpose of this invention is to solve the technical problems of easy water vapor penetration and poor reliability of conductive backsheets in single-glass modules. This invention provides a method for manufacturing a conductive backsheet, a conductive backsheet, and a photovoltaic module, which can prevent water vapor penetration into the conductive backsheet and improve its reliability.

[0005] To address the aforementioned technical problems, embodiments of the present invention provide a method for manufacturing a conductive backplane. The conductive backplane comprises glass, an adhesive film, a metal foil, and an insulating layer. The manufacturing method includes:

[0006] The glass is laminated with the adhesive film;

[0007] Metal foil with a perforated pattern is laminated onto an adhesive film;

[0008] An insulating layer is laminated onto a metal foil.

[0009] In an optional embodiment of this application, laminating glass with an adhesive film includes:

[0010] The adhesive film is cut to fit the shape of the glass;

[0011] Lay the adhesive film onto the glass;

[0012] A release material is laid on the surface of the adhesive film away from the glass;

[0013] The adhesive film is heated through the insulating material, causing it to bond with the glass.

[0014] In an optional embodiment of this application, laminating the glass with the encapsulant film further includes:

[0015] Before heating the adhesive film, place the glass, adhesive film, and insulating material in a negative pressure environment;

[0016] When heating the adhesive film, apply pressure toward the glass to the insulating material and continue for a preset time;

[0017] Cooling of glass, film and insulating materials.

[0018] In an optional embodiment of this application, the size of the insulating material is 3-5 mm larger than the size of the glass along the width direction; and / or the size of the insulating material is 30-50 mm larger than the size of the glass along the length direction.

[0019] In an optional embodiment of this application, the temperature of the heating insulation material is 160±10℃; and / or the vacuum degree of the negative pressure environment is greater than or equal to 90%; and / or the pressure applied to the insulation material is 5 to 10 MPa, and the preset time is 20±5 s.

[0020] In an optional embodiment of this application, after cooling the glass, the adhesive film, and the insulating material, the adhesive peel force between the adhesive film and the glass is 50-80 N / cm, and / or the adhesive peel force between the adhesive film and the insulating material is less than or equal to 20 N / cm.

[0021] In an optional embodiment of this application, the surface of the glass facing the film is a frosted glass surface or has a roughness Ra of 1 to 5 μm.

[0022] In an optional embodiment of this application, laminating the metal foil onto the adhesive film includes:

[0023] Remove the release material from the adhesive film;

[0024] The metal foil is cut to fit the shape of the glass and then adsorbed onto the base plate.

[0025] The surface of the glass facing away from the glass, which has an adhesive film, is attached to a metal foil.

[0026] Heating the metal foil and / or glass, and applying pressure to the metal foil and / or glass to bring them closer together;

[0027] Cooling of metal foil, adhesive film and glass.

[0028] In an optional embodiment of this application, the temperature of the heated metal foil and / or glass is 80-160°C, and / or the pressure applied to the metal foil and / or glass is 0.1-0.8 MPa.

[0029] In an optional embodiment of this application, after cooling the metal foil, adhesive film, and glass, the adhesive peel force between the metal foil and the adhesive film is 2-15 N / cm.

[0030] In an optional embodiment of this application, laminating the insulating layer onto the metal foil includes:

[0031] The insulating layer is cut to fit the shape of the glass;

[0032] The insulating layer is attached to the surface of the metal foil that is away from the glass.

[0033] The insulation layer and / or glass are heated, and pressure is applied to the insulation layer and / or glass to bring them closer together.

[0034] In an optional embodiment of this application, the temperature of the heating insulation layer and / or glass is 150±50℃, the heating time is 15±10s; and / or the pressure applied to the insulation layer and / or glass is 0.1-1MPa.

[0035] In an optional embodiment of this application, the adhesive peel force between the insulating layer and the adhesive film at the perforated pattern of the metal foil is 1-15 N / cm.

[0036] According to another aspect of this application, embodiments of the present invention also provide a conductive backsheet, comprising glass, an adhesive film, a metal foil with a perforated pattern, and an insulating layer stacked sequentially; wherein the surface of the glass facing the adhesive film is a frosted glass surface or has a roughness Ra of 1 to 5 μm.

[0037] In an optional embodiment of this application, the surface of the film facing away from the glass is provided with a rough band region and a normal region. The rough band region is located near at least one edge of the film, and the roughness Ra of the rough band region is 2-2.5 times that of the roughness Ra of the normal region.

[0038] In the optional scheme of this application, the roughness Ra of the conventional area is 2-3.5 μm.

[0039] In an optional embodiment of this application, the minimum distance between the roughened area and the edge of the adhesive film is 3-5 mm, and the width of the roughened area is 15-20 mm.

[0040] In an optional embodiment of this application, there is a height difference between the rough area and the regular area along a direction perpendicular to the surface of the adhesive film.

[0041] According to another aspect of this application, embodiments of the present invention also provide a photovoltaic module, the photovoltaic module including any of the aforementioned conductive backsheets.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] In this invention, a metal foil and glass phase are laminated together using an adhesive film, and an insulating film is laminated onto the other surface of the metal foil to form an integrated conductive backplane. Compared to existing technologies where the substrate material suffers from moisture permeation, potentially leading to adhesive film hydrolysis, metal component corrosion, and performance degradation (PID) in the components, this application uses glass as the substrate material. This prevents moisture permeation, thus avoiding moisture hydrolysis of the adhesive film and corrosion of metal components, thereby improving the reliability of the conductive backplane. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application; those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0045] Figure 1 An exploded view of the conductive backplane provided in the embodiments of this application;

[0046] Figure 2 A structural view showing the stacking position of the insulating material, adhesive film, and glass provided in an embodiment of this application;

[0047] Figure 3 A cross-sectional view of the insulating material, adhesive film, and glass phase composite provided in an embodiment of this application;

[0048] Figure 4 This is a structural view showing the stacked positions of the metal foil, adhesive film, and glass provided in an embodiment of this application.

[0049] Figure label:

[0050] 1. Glass, 2. Adhesive film, 3. Metal foil, 4. Insulating layer, 5. Insulating material, 6. Hollowed-out pattern, 7. Flanged edge. Detailed Implementation

[0051] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a deep understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of the present invention can be combined with each other.

[0052] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0053] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of the invention is usually placed in during use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0054] The terms “first”, “second”, etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0055] In the description of this embodiment, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.

[0056] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. Figure 1 An exploded view of the conductive backplane provided in the embodiments of this application is provided to show the positional relationship of the glass, adhesive film, metal foil and insulating layer in the conductive backplane. Figure 2 A structural view showing the stacking position of the insulating material, adhesive film, and glass provided in an embodiment of this application; Figure 3 A cross-sectional view of the insulating material, adhesive film, and glass phase composite provided in an embodiment of this application; Figure 4 This is a structural view showing the stacked positions of the metal foil, adhesive film, and glass provided in an embodiment of this application.

[0057] To address the aforementioned technical problems, embodiments of the present invention provide a method for manufacturing a conductive backplane, such as... Figure 1 As shown, the conductive backsheet includes glass 1, adhesive film 2, metal foil 3, and insulating layer 4. The manufacturing method includes:

[0058] S1 laminates glass 1 with adhesive film 2;

[0059] S2. The metal foil 3 with the hollowed-out pattern 6 is laminated onto the adhesive film 2;

[0060] S3 laminates the insulating layer 4 onto the metal foil 3.

[0061] Using the above technical solution, a metal foil 3 and glass 1 are laminated together using an adhesive film 2, and an insulating film is laminated on the other surface of the metal foil 3 to form an integrated conductive backplane. Compared with the prior art, where the substrate material has the problem of moisture permeation, which may cause hydrolysis of the adhesive film 2, corrosion of metal components, and PID (performance degradation) phenomena in the component, this application uses glass 1 as the substrate material, which can prevent moisture permeation of the substrate material, thereby avoiding moisture hydrolysis of the adhesive film 2 and corrosion of metal components, and improving the reliability of the conductive backplane.

[0062] In addition, by constructing a hollow pattern 6 on the metal foil 3, the softened adhesive film 2 can be bonded to the insulating layer 4 through the hollow pattern 6. This ensures the conductivity of the metal foil 3 and avoids the increase in the thickness and material of the conductive backplate caused by constructing another layer of adhesive film 2 between the metal foil 3 and the insulating layer 4. This enables the conductive backplate to be reduced in weight and thickness and production costs to be reduced.

[0063] It is worth mentioning that the above manufacturing methods S1 to S3 do not limit the order of the steps. Any integrated conductor backplate with glass 1 and its manufacturing method that sequentially laminates glass 1, adhesive film 2, metal foil 3, and insulating layer 4 in the order of "glass 1-adhesive film 2-metal foil 3-insulating layer 4" is within the scope of protection of this application. For example, the step order of the above manufacturing method can be S3-S2-S1, that is, first laminating the insulating layer 4 with the metal foil 3, then laminating the metal foil 3 with the adhesive film 2, and finally laminating glass 1 on the other side of the adhesive film 2. The step order of the above manufacturing method can be S2-S1-S3, that is, first laminating the metal foil 3 with the adhesive film 2, then laminating the other side of the adhesive film 2 with glass 1, and finally laminating the insulating layer 4 on the other side of the metal foil 3. Similarly, the glass 1, adhesive film 2, metal foil 3 and insulating layer 4 can be laminated in the order of steps S3-S1-S2, S1-S3-S2 or S2-S3-S1.

[0064] As a further preferred embodiment, based on the above-mentioned solution, the specific embodiments of this application may also include one or more of the following additions or combinations.

[0065] Furthermore, laminating the glass 1 with the adhesive film 2 includes:

[0066] S11 cuts the adhesive film 2 to fit the shape of the glass 1. The length and width of the cut adhesive film 2 are equal to the length and width of the glass 1. In some embodiments, through holes are formed in the glass 1, and through holes are also formed at corresponding positions when cutting the adhesive film 2. Furthermore, the processing error between the cutting dimensions and the punching dimensions of the adhesive film 2 should be less than or equal to 1 mm.

[0067] S12. The adhesive film 2 is laid on the glass 1. The long side of the adhesive film 2 is aligned with the long side of the glass 1, the short side of the adhesive film 2 is aligned with the short side of the glass 1, the through holes on the adhesive film 2 are connected to the through holes on the glass 1, and the projection of the adhesive film 2 and the glass 1 coincides in the vertical direction, with an overlap error of less than or equal to 1 mm.

[0068] S13 applies a separating material 5 to the surface of the adhesive film 2 away from the glass 1. For example... Figure 2 and Figure 3 As shown, the insulating material 5 is located on the side of the adhesive film 2 facing away from the glass 1. The insulating material 5 should be a heat-resistant material that is resistant to high temperatures and has low adhesion to the adhesive film 2, and can be PTFE cloth or release film.

[0069] S14 heats the adhesive film 2 through the insulating material 5, causing the adhesive film 2 to bond with the glass 1. Heating the adhesive film 2 through the insulating material 5 prevents the adhesive film 2 from sticking to the heating plate. On the one hand, it maintains the integrity and flatness of the adhesive film 2, and on the other hand, it prevents the adhesive film 2 from sticking to the heating equipment, which facilitates the maintenance of the heating equipment and the output of the glass 1 after the adhesive film 2 is applied.

[0070] Furthermore, laminating glass 1 with adhesive film 2 also includes:

[0071] Before heating the adhesive film 2, S141 places the glass 1, adhesive film 2 and insulating material 5 in a negative pressure environment; heating the adhesive film 2 in a negative pressure environment helps to reduce the temperature requirements for softening and melting of the adhesive film 2, reduce the heating power, and at the same time increase the bonding speed between the adhesive film 2 and the glass 1.

[0072] S142 applies pressure towards the glass 1 to the insulating material 5 while heating the adhesive film 2, and maintains this pressure for a preset time. Applying pressure to the insulating material 5 can improve the adhesion between the adhesive film 2 and the glass 1. Specifically, the surface of the heating plate is flat, and applying pressure to the insulating material 5 by the heating plate can ensure that the force is evenly distributed throughout the adhesive film 2 and the glass 1, making the surface of the adhesive film 2 flat and ensuring that the adhesion between the adhesive film 2 and the glass 1 is the same throughout.

[0073] S143 cools the glass 1, the adhesive film 2, and the insulating material 5. Specifically, the cooling time is 30±5s, and the cooling method is air cooling to reduce the temperature of the adhesive film 2 and the insulating material 5 to below 80°C. Cooling allows the adhesive film 2 to solidify, which facilitates reducing the adhesion between the adhesive film 2 and the insulating material 5, and makes it easier to remove the insulating material 5 from the adhesive film 2 for the next step of laminating the adhesive film 2 with the metal foil 3.

[0074] Furthermore, the length and / or width of the insulating material 5 is greater than the length and / or width of the glass 1, that is, the insulating material 5 includes a burr 7 located outside the surface of the glass 1 (such as...). Figure 3 (As shown). Specifically, along the width direction of glass 1, the size of the insulating material 5 is 3-5 mm larger than the size of glass 1; and / or along the length direction of glass 1, the size of the insulating material 5 is 30-50 mm larger than the size of glass 1. When removing the insulating material 5 from the adhesive film 2, the insulating material 5 can be separated from the adhesive film 2 by manually or automatically / semi-automatically holding the burr 7 of the insulating material 5 and tearing it away from the glass.

[0075] Furthermore, the temperature of the heating isolation material 5 is 160±10℃; and / or the vacuum degree of the negative pressure environment is greater than or equal to 90%; and / or the pressure applied to the isolation material 5 is 5-10MPa, and the preset time is 20±5s. Specifically, the process of laminating the adhesive film 2 and the glass 1 is carried out by a laminator: first, the adhesive film 2-glass 1 covered with the isolation material 5 is placed in the laminator, the temperature of the heating plate of the laminator is set to 160±10℃, and a vacuuming process is carried out for 40±5s so that the vacuum degree in the laminator should reach more than 90%.

[0076] Furthermore, after cooling the glass 1, adhesive film 2, and release material 5, the adhesive peel force between the adhesive film 2 and the glass 1 is greater than that between the adhesive film 2 and the release material 5, preventing the adhesive film 2 from being torn off the glass 1 when removing the release material 5. Specifically, the adhesive peel force between the adhesive film 2 and the glass 1 is 50-80 N / cm, and / or the adhesive peel force between the adhesive film 2 and the release material 5 is less than or equal to 20 N / cm. It is worth mentioning that the test conditions for all adhesive peel forces involved in this application are set as follows: peel angle 90°, glass 1 speed 150 mm / min (ASTM D903), sample width 25 mm, test temperature 23±2℃, and humidity control 50±5%RH.

[0077] Furthermore, the surface of glass 1 facing the adhesive film 2 is frosted glass 1 or has a roughness Ra of 1 to 5 μm. By constructing the surface of glass 1 facing the adhesive film 2 as a rough surface, the adhesive peel force between glass 1 and adhesive film 2 can be improved, preventing the adhesive film 2 from separating from glass 1.

[0078] Further, laminating the metal foil 3 onto the adhesive film 2 includes:

[0079] S21 Remove the insulating material 5 from the adhesive film 2. Specifically, the insulating material 5 and the adhesive film 2 can be cooled to below 80°C, preferably at room temperature, and the insulating material 5 can be separated from the adhesive film 2 by manually or automatically / semi-automatically holding the burr 7 of the insulating material 5 and tearing it downwards.

[0080] S22 cuts the metal foil 3 to fit the shape of the glass 1 and then attaches the metal foil 3 to the base plate. Specifically, both the cut metal foil 3 and the glass 1 are rectangular, with the long side of the metal foil 3 equal to the long side of the glass 1, and the short side of the metal foil 3 equal to the short side of the glass 1. The surface of the base plate is flat, and the metal foil 3 can be attached to the base plate by electrostatic adsorption, magnetic attraction, or negative pressure adsorption, etc.

[0081] S23 attaches the surface of the glass 1 facing away from the glass 1 with the adhesive film 2 to the metal foil 3. Since the metal foil 3 is lightweight and not easy to move, and is prone to breakage and wrinkling during movement, fixing the position of the metal foil 3 and then moving the glass 1 above the metal foil 3 and attaching it to the metal foil 3 can effectively protect the metal foil 3.

[0082] S24 heats the metal foil 3 and / or glass 1, and applies pressure to the metal foil 3 and / or glass 1 to bring them closer together; the base plate supports the metal foil 3, preventing the glass 1 from wrinkling or breaking it. Specifically, the temperature of the heated metal foil 3 and / or glass 1 is 80-160°C, and / or the pressure applied to the metal foil 3 and / or glass 1 is 0.1-0.8 MPa.

[0083] S25 cools the metal foil 3, the adhesive film 2, and the glass 1.

[0084] Furthermore, after cooling the metal foil 3, adhesive film 2, and glass 1, the adhesive peel force between the metal foil 3 and the adhesive film 2 is 2-15 N / cm.

[0085] Furthermore, laminating the insulating layer 4 onto the metal foil 3 includes:

[0086] S31 cuts the insulating layer 4 to fit the shape of the glass 1. Specifically, the cut insulating layer 4 is rectangular, with the long side of the insulating layer 4 being equal to the long side of the glass 1, and the short side of the insulating layer 4 being equal to the short side of the glass 1. In the vertical direction, the projection of the insulating layer 4 coincides with the projection of the glass 1, and the overlap error between the insulating layer 4 and the glass 1 is ±1mm.

[0087] S32 attaches the insulating layer 4 to the surface of the metal foil 3 facing away from the glass 1;

[0088] S33 heats the insulating layer 4 and / or the glass 1 and applies pressure to the insulating layer 4 and / or the glass 1 to bring them closer together. Specifically, the temperature of the insulating layer 4 and / or the glass 1 is 150±50℃, the heating time is 15±10s; and / or the pressure applied to the insulating layer 4 and / or the glass 1 is 0.1-1MPa.

[0089] Furthermore, the adhesive peel force between the insulating layer 4 and the adhesive film 2 at the hollowed-out pattern 6 of the metal foil 3 is 1-15 N / cm.

[0090] According to another aspect of this application, an embodiment of the present invention also provides a conductive backsheet, comprising a glass 1, an adhesive film 2, a metal foil 3 having a perforated pattern 6, and an insulating layer 4 stacked sequentially; wherein the surface of the glass 1 facing the adhesive film 2 is a frosted glass 1 surface or has a roughness Ra of 1-5 μm.

[0091] Furthermore, the surface of the adhesive film 2 facing away from the glass 1 is provided with a roughened region and a regular region. The roughened region is located near at least one edge of the adhesive film 2, and the roughness Ra of the roughened region is 2-2.5 times that of the regular region. By providing the roughened region, the tolerance of the conductive backsheet edge to moisture can be improved, preventing moisture from eroding the conductive backsheet and reducing edge cell failure caused by moisture erosion. The method for constructing the roughened region is not limited here; any method capable of generating a roughened edge is within the scope of protection of this application. For example, the method for generating the roughened region includes applying pressure to the heat insulation material using a soft silicone pad in step S142 above, thereby reducing the force and adhesion of the roughened region, and causing the separated material 5 to adhere outwards to form a rough surface when the separating material 5 is removed. Alternatively, in step S142 above, a pressure plate with a roughened surface can be used to apply pressure to the position corresponding to the roughened region on the separating material 5, thereby forming a rough surface on the surface of the adhesive film 2. Alternatively, after removing the separating material 5, the surface of the adhesive film 2 can be polished to obtain the roughened region.

[0092] Furthermore, the roughness Ra of the conventional region is 2-3.5 μm.

[0093] Furthermore, the minimum distance between the rough area and the edge of the adhesive film 2 is 3-5 mm, and the width of the rough area is 15-20 mm.

[0094] Furthermore, along a direction perpendicular to the surface of the adhesive film 2, there is a height difference between the rough area and the regular area.

[0095] According to another aspect of this application, embodiments of the present invention also provide a photovoltaic module, the photovoltaic module including any of the aforementioned conductive backsheets.

[0096] While the present invention has been illustrated and described with reference to certain preferred embodiments, those skilled in the art should understand that the above description is a further detailed explanation of the invention in conjunction with specific embodiments, and should not be construed as limiting the specific implementation of the invention to these descriptions. Various changes in form and detail can be made by those skilled in the art, including several simple deductions or substitutions, without departing from the spirit and scope of the invention.

Claims

1. A method for manufacturing a conductive backsheet, wherein the conductive backsheet comprises glass, an adhesive film, a metal foil, and an insulating layer, characterized in that, The manufacturing method includes: The glass is laminated with the adhesive film; The metal foil with the hollowed-out pattern is laminated onto the adhesive film; The insulating layer is laminated onto the metal foil.

2. The method for manufacturing a conductive backplane as described in claim 1, characterized in that, The step of laminating the glass with the adhesive film includes: The adhesive film is cut to fit the shape of the glass; The adhesive film is laid on the glass; A separating material is laid on the surface of the adhesive film away from the glass; The adhesive film is heated through the insulating material to bond it to the glass.

3. The method for manufacturing a conductive backplane as described in claim 2, characterized in that, The process of bonding the glass to the adhesive film further includes: Before heating the adhesive film, the glass, the adhesive film, and the insulating material are placed in a negative pressure environment; When the adhesive film is heated, pressure is applied to the insulating material toward the glass for a preset time; The glass, the adhesive film, and the insulating material are cooled.

4. The method for manufacturing a conductive backplane as described in claim 3, characterized in that, Along the width direction of the glass, the size of the insulating material is 3-5 mm larger than the size of the glass; and / or along the length direction of the glass, the size of the insulating material is 30-50 mm larger than the size of the glass.

5. The method for manufacturing a conductive backplane as described in claim 4, characterized in that, The temperature of the insulating material is 160±10℃; and / or the vacuum degree of the negative pressure environment is greater than or equal to 90%; and / or the pressure applied to the insulating material is 5 to 10 MPa, and the preset time is 20±5 s.

6. The method for manufacturing a conductive backplane as described in claim 4, characterized in that, After the glass, the adhesive film, and the insulating material are cooled, the adhesive peel force between the adhesive film and the glass is 50-80 N / cm, and / or the adhesive peel force between the adhesive film and the insulating material is less than or equal to 20 N / cm.

7. The method for manufacturing a conductive backplane as described in any one of claims 1 to 6, characterized in that, The surface of the glass facing the adhesive film is frosted glass or has a roughness Ra of 1–5 μm.

8. The method for manufacturing a conductive backplane as described in any one of claims 2 to 6, characterized in that, The step of laminating the metal foil onto the adhesive film includes: Remove the insulating material from the adhesive film; The metal foil is cut to fit the shape of the glass and then adsorbed onto the base plate. The surface of the glass facing away from the glass, which has the adhesive film attached, is adhered to the metal foil; Heating the metal foil and / or the glass, and applying pressure to the metal foil and / or the glass to bring the metal foil and the glass closer together; The metal foil, the adhesive film, and the glass are cooled.

9. The method for manufacturing a conductive backplane as described in claim 8, characterized in that, The temperature of the heated metal foil and / or the glass is 80-160°C, and / or the pressure applied to the metal foil and / or the glass is 0.1-0.8 MPa.

10. The method for manufacturing a conductive backplane as described in claim 8, characterized in that, After the metal foil, the adhesive film, and the glass are cooled, the adhesive peel force between the metal foil and the adhesive film is 2-15 N / cm.

11. The method for manufacturing a conductive backplane as described in any one of claims 1 to 6, characterized in that, The step of laminating the insulating layer onto the metal foil includes: The insulating layer is cut to fit the shape of the glass; The insulating layer is attached to the surface of the metal foil that is away from the glass. The insulating layer and / or the glass are heated, and pressure is applied to the insulating layer and / or the glass to bring them closer together.

12. The method for manufacturing a conductive backplane as described in claim 11, characterized in that, The temperature of the insulating layer and / or the glass is 150±50℃, and the heating time is 15±10s; and / or the pressure applied to the insulating layer and / or the glass is 0.1-1MPa.

13. The method for manufacturing a conductive backplane as described in claim 11, characterized in that, The adhesive peel force between the insulating layer and the adhesive film at the hollowed-out pattern of the metal foil is 1-15 N / cm.

14. A conductive backplate, characterized in that, It includes glass, an adhesive film, a metal foil with a perforated pattern, and an insulating layer stacked in sequence; wherein the surface of the glass facing the adhesive film is a frosted glass surface or has a roughness Ra of 1 to 5 μm.

15. The conductive backplate as described in claim 14, characterized in that, The adhesive film has a rough band region and a normal region on its surface away from the glass. The rough band region is located near at least one edge of the adhesive film, and the roughness Ra of the rough band region is 2-2.5 times that of the normal region.

16. The conductive backplate as described in claim 15, characterized in that, The roughness Ra of the conventional region is 2-3.5 μm.

17. The conductive backplate as described in claim 15, characterized in that, The minimum distance between the rough band region and the edge of the adhesive film is 3-5 mm, and the width of the rough band region is 15-20 mm.

18. The conductive backplate as described in claim 15, characterized in that, Along a direction perpendicular to the surface of the adhesive film, there is a height difference between the rough area and the regular area.

19. A photovoltaic module, characterized in that, The photovoltaic module includes a conductive backsheet as described in any one of claims 14 to 18.

Images