Light processing device

Abstract

Provided is an optical processing device with improved processing efficiency. The light processing apparatus includes: an ultraviolet light source that irradiates ultraviolet light to a surface of an object to be processed that is conveyed along a conveyance path; an optical processing chamber capable of forming an inert gas atmosphere in a space in which the ultraviolet light is irradiated to the object to be processed; a purge chamber capable of being formed as an inert gas atmosphere upstream of the optical processing chamber in the transport path; and at least one purge gas nozzle that is disposed in the purge chamber and that injects an inert gas onto the object to be processed.

Description

TECHNICAL FIELD

[0001] The present application relates to a light processing apparatus. BACKGROUND

[0002] In order to protect articles such as interior materials (walls, ceilings, and floors, etc.), residential equipment and furniture, and interior and exterior materials for vehicles, a protective material called a decorative material and a decorative sheet has been used since the past. For the decorative material and the decorative sheet, in addition to surface properties such as scratch resistance, stain resistance, and weather resistance, processing properties, and the like as physical and mechanical properties of the protective material, design properties are also required.

[0003] In order to improve the design properties of the decorative material and the decorative sheet, a method of imparting a matting effect to the surface of the decorative material and the decorative sheet is known. If the matting effect is imparted to the surface of the decorative material and the decorative sheet, the texture of the decorative material and the decorative sheet can be improved. As the method of imparting the matting effect, a method of forming a coating film by applying an acrylic photocurable resin or a thermosetting resin to the surface of the decorative material and the decorative sheet, performing a process of forming fine irregularities on the surface of the coating film by irradiating ultraviolet light, and then photocuring or thermally curing the entire coating film is known.

[0004] As the light irradiation apparatus that performs the process of forming fine irregularities on the surface of the coating film by irradiating ultraviolet light, a light processing apparatus for manufacturing a semiconductor, a liquid crystal element is known, for example. The light processing apparatus disclosed in Patent Literature 1 is provided with an ultraviolet light source that irradiates ultraviolet light to the surface of a processed body that is transported along a transport path, and a light processing chamber that can form a space in which the ultraviolet light is irradiated to the processed body into an inert gas atmosphere.

[0005] PRIOR ART DOCUMENTS PATENT LITERATURE Patent Literature 1: Japanese Patent Application Laid-Open No. 2019-018164 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION In a case where light is irradiated to a processed body such as a decorative material and a decorative sheet having a large area, it becomes important to improve the processing efficiency and improve the productivity compared to the light processing apparatus for manufacturing a semiconductor, a liquid crystal. It is an object of the present application to provide a light processing apparatus in which the processing efficiency is improved.

[0007] MEANS FOR SOLVING THE PROBLEMS In order to improve the processing efficiency of the light processing apparatus, it is necessary to increase the transport speed of the processed body. However, if the transport speed of the processed body is increased, it is difficult to perform the light processing. The present inventors have conducted intensive studies and as a result, have found one of the reasons why it is difficult to perform the light processing.

[0008] Reference Figure 8 The reason for this will be explained. Figure 8 is an enlarged view schematically showing the side on which the object 4 is transported. The object 4 is transported at high speed in an atmospheric air atmosphere along the direction of Al (-Y direction) in the figure together with the belt 1 on which the object 4 is placed. The gas 9 (the portion shown by hatching with oblique lines) that is adjacent to the surface of the object 4 is transported in a state of being adhered to the surface of the object 4 together with the object 4 at the time of high-speed transportation of the object 4. In the present specification, the gas 9 adhered to the surface of the object 4 is referred to as a boundary layer 9. The object 4 is transported at high speed in an atmospheric air atmosphere, and therefore the gas constituting the boundary layer 9 is air.

[0009] The inside of the photo-processing chamber in which the object 4 is irradiated with ultraviolet light is provided with an inert gas atmosphere.

[0010] Although the details will be described later, this is to prevent the ultraviolet light from being absorbed by oxygen in the air and thus not being able to sufficiently irradiate the surface of the object with the ultraviolet light. However, the boundary layer 9 constituted by air comes into contact with the object 4 that is carried into the photo-processing chamber in the inert gas atmosphere. That is, even if the inside of the photo-processing chamber is provided with an inert gas atmosphere, the ultraviolet light is absorbed due to the boundary layer 9 that comes into contact with the object 4.

[0011] Therefore, the present inventors have created the following photo-processing apparatus. The photo-processing apparatus has: an ultraviolet light source that irradiates the surface of an object being transported along a transportation path with ultraviolet light; a photo-processing chamber that can form a space for irradiation of the ultraviolet light with an inert gas atmosphere; a purge chamber that is located upstream of the photo-processing chamber in the transportation path and that can form the inside thereof with an inert gas atmosphere; and at least one purge gas nozzle that is disposed in the purge chamber and that sprays an inert gas toward the object.

[0012] In the purge chamber disposed upstream of the photo-processing chamber, an inert gas is sprayed toward the object. Thereby, the boundary layer constituted by air on the object being transported at high speed can be removed, or the thickness of the boundary layer can be thinned. Therefore, the absorption of the ultraviolet light due to the boundary layer can be suppressed. As a result, the photo-processing is easily performed. In particular, the ultraviolet light of 205 nm or less, which is called vacuum ultraviolet light, is greatly absorbed by oxygen. In the case where the surface of the object is irradiated with vacuum ultraviolet light, in particular, if the boundary layer is removed by spraying a purge gas toward the object, the photo-processing is favorably performed.

[0013] It can also be that the angle θ1 between the gas injection direction and the direction toward the upstream of the transport path (+Y direction) of at least one of the purge gas nozzles is 45 degrees or more and 90 degrees or less. When the angle θ1 is the above angle, the effect of destroying the boundary layer is large.

[0014] When the pressure in the light treatment chamber is set to P1 and the pressure in the purge chamber is set to P2, it can also be set to P1 > P2. Thereby, gas does not flow from the purge chamber into the light treatment chamber, and the turbulence of the gas in the light treatment chamber can be prevented.

[0015] A gas recovery chamber that recovers the inert gas can also be provided upstream of the purge chamber in the transport path. The gas recovery chamber has a recovery nozzle for the inert gas. Thereby, the leakage of the inert gas is suppressed, and the people around the light treatment device are protected from oxygen deficiency. The gas recovery chamber can have only a recovery port for the inert gas, and for example, can not have a hollow for recovering the inert gas.

[0016] The gas recovery chamber can have a gas recovery nozzle that is disposed in the gas recovery chamber so as to be biased toward the downstream side of the transport path and is disposed so as to be close to the object to be treated.

[0017] A gas recovery chamber that recovers the inert gas can also be provided downstream of the light treatment chamber in the transport path. In the case where the gas recovery chambers are provided upstream and downstream of the two chambers (light treatment chamber and purge chamber) that eject the inert gas, the leakage of the inert gas can be further suppressed. In addition, by providing the gas recovery chambers upstream and downstream of the light treatment chamber, the flow of the gas in the light treatment chamber is easily maintained as laminar flow, and the turbulence can be suppressed.

[0018] When the pressure in the light treatment chamber is set to P1, the pressure in the purge chamber is set to P2, and the pressure in the gas recovery chamber is set to P3, P1 > P2 > P3.

[0019] At least one second purge gas nozzle that ejects gas toward the object to be treated can also be provided upstream of the purge chamber in the transport path. The gas ejected from the second purge gas nozzle can be air or an inert gas. The second purge gas nozzle also has the effect of destroying the boundary layer adhering to the surface of the object to be treated that is being transported.

[0020] It can also be that the angle θ1 between the gas injection direction and the direction toward the upstream of the transport path (+Y direction) of at least one of the second purge gas nozzles is 45 degrees or more and 90 degrees or less. When the angle θ1 is the above angle, the effect of destroying the boundary layer is large.

[0021] It can also be that the at least one purge gas nozzle is disposed in the purge chamber so as to be biased toward the downstream side of the transport path.

[0022] Inventive Effects A light processing apparatus that improves processing efficiency can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 FIG. 1 is a view that shows a first embodiment of a light processing apparatus.

[0024] Figure 2 FIG. 2 is a view that shows a case where purge gas is injected toward a processed object.

[0025] Figure 3 FIG. 3 is a view that shows the disposition of purge gas nozzles of a purge chamber.

[0026] Figure 4 FIG. 4 is a view that shows a gas recovery port of a gas recovery chamber.

[0027] Figure 5 FIG. 5 is a view that shows a second embodiment of a light processing apparatus.

[0028] Figure 6 FIG. 6 is a view that shows a third embodiment of a light processing apparatus.

[0029] Figure 7 FIG. 7 is a view that shows a fourth embodiment of a light processing apparatus.

[0030] Figure 8 FIG. 8 is a view that shows a boundary layer. DETAILED DESCRIPTION

[0031] Embodiments of the present application are described with reference to the accompanying drawings. Each of the drawings disclosed herein is for the purpose of explaining particular embodiments and does not limit the present application, for the drawings can represent design choices made by a designer and are not necessarily a representation of the actual size or shape of the structures they depict. It is not always to scale, to number of elements, to geometric proportions, or to relative positions of parts. Some elements in the drawings can not appear to scale or in proper proportions. The emphasis is on functions and concepts.

[0032] Hereinafter, the drawings will be described with reference to the XYZ coordinate system. In the present specification, when a direction is expressed, in the case of distinguishing the positive and negative directions, the signs of the positive and negative are indicated as, for example, "+X direction" and "-X direction" and are described. In the case of expressing a direction without distinguishing the positive and negative directions, only "X direction" is described. That is, in the present specification, in the case of only "X direction" being described, both the "+X direction" and the "-X direction" are included. The same applies to the Y direction and the Z direction. In the embodiment described below, the direction of gravity is the -Z direction, the conveying direction in which the object to be processed is conveyed is the -Y direction, and the width direction of the object to be processed is the X direction.

[0033] <First Embodiment> [Outline of Light Processing Apparatus] Figure 1 is a view that shows a first embodiment of a light processing apparatus. The light processing apparatus 100 is provided with three light sources 3, a light processing chamber 2 that is arranged so as to cover the three light sources 3, and a purge chamber 10 that can form an inert gas atmosphere upstream of the light processing chamber 2. The light processing apparatus 100 is arranged so as to face a conveying body that conveys an object to be processed 4. The conveying body conveys the object to be processed 4 along a conveying path.

[0034] In the present embodiment, a conveyor belt 1 (hereinafter, sometimes simply referred to as "belt 1") is used as the conveying body. The object to be processed 4 is placed on the belt 1 and is conveyed in the -Y direction together with the belt 1. The light processing chamber 2 and the purge chamber 10 are each a box that has an opening in the direction (-Z direction) facing the belt 1. The belt 1 conveys the object to be processed 4 so as to pass through the vicinity of the opening of the purge chamber 10 and the vicinity of the opening of the light processing chamber 2 in this order.

[0035] A plate 5 is provided on the lower side (-Z side) of the belt 1. The plate 5 is arranged so as to cover the opening of the light processing chamber 2 and the opening of the purge chamber 10. A gap through which the belt 1 and the object to be processed 4 pass is present between the light processing chamber 2 and the plate 5 and between the purge chamber 10 and the plate 5. Other than the gap, the light processing chamber 2 and the purge chamber 10 form a space that is closed from the surroundings together with the plate 5.

[0036] [Light Source] The light source 3 is described. The light source 3 irradiates the surface of the transported processed object 4 with ultraviolet light Ll. The ultraviolet light Ll emitted from the light source 3 is vacuum ultraviolet light, that is, ultraviolet light having at least light belonging to a wavelength band of 205 nm or less. The "light belonging to a wavelength band of 205 nm or less" used in this specification means light showing an emission intensity of 205 nm or less in the emission spectrum of the light source 3. As the light, there can be exemplified: (1) light showing an emission spectrum in which an intensity is shown in a wide wavelength band and a peak emission wavelength showing a maximum intensity is 205 nm or less; (2) light showing an emission spectrum in which a plurality of maximum intensities (a plurality of peaks) are shown and any one of the plurality of peaks is included in a wavelength range of 205 nm or less; and (3) light showing an integral intensity of 30% or more with respect to the total integral intensity within the emission spectrum.

[0037] The processed object 4 processed by the light processing apparatus 100 is a decorative material. A coated film of a curable resin (for example, a photocurable resin or a thermocurable resin) is formed on the surface of the processed object 4. The processed object 4 on which the coated film is formed is transported to the light processing apparatus 100, and a process of imparting a mat effect is performed in the light processing apparatus 100. After the process in the light processing apparatus 100 is completed, a device different from the light processing apparatus 100 is used to impart light or heat to the coated film to cure it. In addition, the light processing apparatus 100 can have a mechanism for curing the entire coated film (for example, a light source for photocuring the coated film or a heater for thermocuring the coated film).

[0038] The process of imparting a mat effect is described. The ultraviolet light irradiated in the light processing apparatus 100 onto the processed object 4 causes the resin in a liquid state coated on the surface of the processed object 4 to shrink. If the resin shrinks, a fine unevenness that scatters visible light is formed on the surface of the resin. Thus, the surface of the resin coated film is imparted with a mat effect.

[0039] The shrinkage of the resin is described. In this embodiment, the processed object 4 has a coated film of an acrylic photocurable resin on the surface. In this embodiment, the light source 3 is a xenon excimer lamp that emits light showing a peak emission wavelength of 172 nm at a maximum intensity. The light having a wavelength around 172 nm emitted from the xenon excimer lamp causes the double bonds of the molecules of the photocurable resin constituting the coated film to cleave and bond with other molecules, whereby the volume of the resin decreases and the resin shrinks.

[0040] The light source 3 can also be a discharge lamp in which a gas other than xenon is enclosed. In this case, the light source 3 can emit light having a wavelength of 172 nm or less. Figure 1In the present embodiment, three light sources 3 are arranged in the conveying direction (Y direction) of the processed body 4. However, one light source 3 is sufficient. In the case where a plurality of light sources 3 are present, the plurality of light sources 3 can be arranged in the X direction, or the light sources 3 can be arranged in the X direction and the Y direction, respectively. The light sources 3 can be solid light sources such as LEDs. Each light source 3 can be composed of one or a plurality of small light sources. The illuminance to the processed body 4 can be changed by bringing the light sources 3 closer to or farther from the belt 1. Alternatively, the illuminance can be changed by arranging a desired light-reducing filter in the light sources 3. The width of the light sources 3 in the X direction can be larger than the width of the processed body 4 in the X direction. The width of the light sources 3 in the X direction can be 20 mm or more, more preferably 40 mm or more, and 60 mm or less, than the width of the irradiated body in the X direction. For example, in the case where the width of the irradiated body in the X direction is 500 mm, the width of the light sources 3 in the X direction can be 520 mm or more, more preferably 540 mm or more, and 580 mm or less. For example, in the case where the width of the irradiated body in the X direction is 300 mm, the width of the light sources 3 in the X direction can be 320 mm or more, more preferably 340 mm or more, and 380 mm or less.

[0041] [Light processing chamber] The light processing chamber 2 is described. The light processing chamber 2 is arranged so as to cover the light sources 3. In order to make it easy for the ultraviolet light to reach the surface of the processed body 4, the oxygen concentration of the space in the light processing chamber 2, which is the irradiation space containing ultraviolet light, is reduced. Therefore, the light processing chamber 2 is formed as an inert gas atmosphere.

[0042] In the present specification, "inert gas atmosphere" means, unless otherwise specified, a mixed gas in which the inert gas G1 accounts for 90 vol% or more of the whole in the light processing chamber 2. At this time, the oxygen concentration in the light processing chamber 2 is reliably less than 10 vol%. For example, if the ultraviolet light of 172 nm travels 4 mm in a space having an oxygen concentration of less than 10%, it is possible to ensure an intensity of 50% or more. In the light processing chamber 2, the inert gas G1 preferably accounts for 95 vol% or more. At this time, the oxygen concentration in the light processing chamber 2 is reliably less than 5%. For example, if the ultraviolet light of 172 nm travels 4 mm in a space having an oxygen concentration of 5% or less, it is possible to ensure an intensity of 70% or more. It is further preferable that the inert gas concentration in the light processing chamber 2 account for 98 vol% or more.

[0043] The inner wall of the light processing chamber 2 in the present embodiment has a plurality of gas supply ports 8 for supplying the inert gas G1. The plurality of gas supply ports 8 are connected to a gas supply source 12 via a gas pipe 6. The gas pipe 6 is branched as necessary. There is a flow control valve 7 in the middle of the gas pipe 6. The inert gas G1 is supplied from the gas supply source 12 to the gas supply ports 8. The inert gas G1 is supplied from the gas supply ports 8 into the light processing chamber 2. Thus, even if the outside of the light processing chamber 2 is an atmospheric environment, the inside of the light processing chamber 2 can be formed into an inert gas atmosphere. In the present embodiment, as the inert gas G1, nitrogen is used.

[0044] In the present embodiment, the inert gas G1 is supplied from the gas supply ports 8 along a plane (XY plane) containing the conveyance direction of the belt 1. That is, the inert gas G1 is not jetted toward the processed object 4 or the belt 1. This is because, if the inert gas G1 is jetted toward the processed object 4 or the belt 1, the jetted inert gas G1 collides with the processed object 4 or the belt 1, and the gas easily becomes turbulent in the light processing chamber 2. If the gas becomes turbulent in the light processing chamber 2, air easily enters from the outside of the light processing chamber 2 through the gap between the light processing chamber 2 and the plate 5, and it is difficult to maintain the inside of the light processing chamber 2 at a low oxygen concentration. In addition, the supply direction of the inert gas G1 can be inclined from the XY plane to the extent that it is not jetted toward the processed object 4 or the belt 1.

[0045] In addition, the gas supply ports 8 for supplying the inert gas G1 in the light processing chamber 2 are not essential to the present application. In a case where the inside of the light processing chamber 2 is formed and maintained into an inert gas atmosphere by the jetting of a purge gas (inert gas) G2 from a purge gas nozzle in a purge chamber 10 to be described later, or the like, the gas supply ports 8 for supplying the inert gas G1 can not be present in the light processing chamber 2.

[0046] A reflector or a reflective layer that reflects ultraviolet light can also be formed in the inner wall of the light processing chamber 2. By the reflector or the reflective layer, the outgoing light from the light source 3 is directed to advance in the -Z direction. The Y direction length of the light processing chamber 2 can be, for example, 400 mm to 500 mm.

[0047] [Purge Chamber] The purge chamber 10 will be described. In the light processing apparatus 100, the purge chamber 10 is located upstream of the transport path of the light processing chamber 2 (in this embodiment, in the +Y direction of the light processing chamber 2). Three purge gas nozzles 11 for injecting inert gas are installed on the inner wall of the purge chamber 10. The purge gas G2 injected from each purge gas nozzle 11 is an inert gas. The purge gas G2 can be the same type of gas as the inert gas G1 supplied to the light processing chamber 2, or it can be a different type of gas. In this embodiment, nitrogen is used as the purge gas G2. Each purge gas nozzle 11 is connected to the gas supply source 12 via a gas pipe 6. The gas pipe 6 branches as needed. A flow control valve 7 is provided midway through the gas pipe 6.

[0048] Figure 2 This diagram illustrates the situation where purge gas G2 is injected from the purge gas nozzle 11 toward the workpiece 4 being transported at high speed. The workpiece 4, placed on the belt 1, is being... Figure 2 High-speed transport in the A1 direction (-Y direction). With the air-based boundary layer 9 adhering to the workpiece 4, the workpiece 4 is transported into the purge chamber 10. Purge gas G2 is injected from the purge gas nozzle 11 towards the workpiece 4 passing near the purge chamber 10. As a result, the boundary layer 9 is disrupted by the injected purge gas G2, and is either removed from the workpiece 4 or its thickness is reduced. The workpiece 4 is then transported into the light processing chamber 2 with the boundary layer 9 removed (or its thickness reduced). Consequently, in the light processing chamber 2, the amount of ultraviolet light absorbed by the boundary layer 9 is reduced, and more ultraviolet light reaches the workpiece 4. Furthermore, after the purge gas G2 is injected, the workpiece 4 moves at high speed in an inert gas atmosphere, so even if a new boundary layer forms, it is also composed of inert gas, and therefore ultraviolet light is not absorbed by this boundary layer.

[0049] In order to break down and remove the boundary layer 9 or to thin its thickness, the angle θ1 between the injection direction of the purge gas G2 and the upstream direction (+Y direction) is preferably 45 degrees or more and 90 degrees or less, more preferably 60 degrees or more and less than 85 degrees. Unlike the gas supply port 8 in the light processing chamber 2, the purge gas nozzle 11 injects the purge gas G2 toward the belt 1 or the workpiece 4. Therefore, the gas in the purge chamber 10 is prone to turbulence. However, since no light processing is performed in the purge chamber 10, even if the gas is turbulent in the purge chamber 10, it is unlikely to adversely affect the light processing in the light processing chamber 2. The ability to inject inert gas toward the workpiece 4 is significant because the purge chamber 10 is provided separately from the light processing chamber 2.

[0050] Reference Figure 3The configuration of the three purge gas nozzles 11 in the purge chamber 10 will be described. From the upstream of the transport path, they are referred to as purge gas nozzle 11a, purge gas nozzle 11b, and purge gas nozzle 11c. Figure 3 is a view of the bottom surface (the surface facing the object 4) of the purge gas nozzles (11a, 11b, 11c) arranged in the purge chamber 10, as viewed from the object 4 side. The three purge gas nozzles (11a, 11b, 11c) are each a rod-shaped nozzle extending in the X direction. The purge gas nozzles (11a, 11b, 11c) are arranged in the transport direction of the object 4.

[0051] The bottom surface of each rod-shaped nozzle has a plurality of gas ejection ports (19a, 19b, 19c). In the present embodiment, the plurality of gas ejection ports (19a, 19b, 19c) in each purge gas nozzle (11a, 11b, 11c) are arranged at equal intervals (have a certain arrangement pitch). However, the plurality of gas ejection ports 19a, 19b, 19c can also be arranged at unequal intervals. In addition, the arrangement pitch can be the same between the purge gas nozzles (11a, 11b, 11c) or can be different.

[0052] The shape of each of the gas ejection ports 19a, 19b, 19c is circular, and the diameters of the gas ejection ports 19a, 19b, 19c are all the same. However, the shape or diameter of each gas ejection port (19a, 19b, 19c) can be made different by the purge gas nozzles (11a, 11b, 11c), or the shape or diameter of the gas ejection ports arranged in the X direction can be made different in the same purge gas nozzle (11a, 11b, 11c). The interval from the gas ejection ports (19a, 19b, 19c) to the surface of the object 4 can be 5 mm or more, more preferably 8 mm or more, and can be 25 mm or less, more preferably 20 mm or less.

[0053] The gas ejection ports of the purge gas nozzles (11a, 11b, 11c) can also be slits extending in the X direction. In the case where the gas ejection ports are slits, it is easier to eject more gas than in the case where a plurality of gas ejection ports are arranged in one direction. Conversely, it is easier to maintain the pressure of the gas ejected from each gas ejection port or the amount of gas ejected at a constant level in the case where a plurality of gas ejection ports are arranged in one direction.

[0054] Three purge gas nozzles are arranged in the purge chamber 10 so as to be biased toward the downstream side of the conveyance path (the -Y side in this embodiment). That is, the purge gas nozzles are arranged near the light processing chamber 2. Thereby, the possibility of air entering the light processing chamber 2 is further reduced. The purge gas nozzles (11a, 11b, 11c) are arranged in a staggered arrangement in which the respective gas injection ports (19a, 19b, 19c) are staggered in the X direction. The gas injection port 19a provided in the purge gas nozzle 11a does not overlap the gas injection ports (19b, 19c) provided in the purge gas nozzles (11b, 11c) in the X direction, and thus the interval of the gas injection ports (19a, 19b, 19c) in the X direction is reduced as a whole in the three purge gas nozzles (11a, 11b, 11c). Thereby, the purge gas G2 can be injected more uniformly to the object 4. In this embodiment, as shown in FIG. 10, a step in the Z direction is generated in the purge chamber 10 depending on the presence or absence of the purge gas nozzles. Such a step in the Z direction can cause turbulence in the purge chamber 10 and can be a cause of introducing air outside the chamber. Therefore, by arranging a space limiting material or the like in the region where the purge gas nozzles are not present, the step in the Z direction due to the presence or absence of the purge gas nozzles can be reduced in the purge chamber 10, and turbulence in the purge chamber 10 can be reduced. Figure 1

[0055] In this embodiment, three purge gas nozzles (11a, 11b, 11c) are arranged at different positions in the Y direction, but four or more purge gas nozzles can be arranged, or two or fewer purge gas nozzles can be arranged. The number of purge gas nozzles can be determined based on the conveyance speed of the object, the oxygen concentration in the light processing chamber 2 or the purge chamber 10.

[0056] [Gas recovery chamber] The light processing apparatus 100 has a gas recovery chamber 20 for recovering gas upstream of the purge chamber 10 in the conveyance path. The gas recovery chamber 20 is a tank having an opening in the direction opposite to the belt 1 (-Z direction). The gas recovery chamber 20 has a plurality of gas recovery ports 21 arranged in the tank and a gas recovery nozzle 22 arranged so as to approach the object 4 on the downstream side (-Y direction side) of the tank. The plurality of gas recovery ports 21 are formed by arranging a plurality of porous plates 21p in the gas recovery chamber 20. The plurality of gas recovery ports 21 are connected to a common exhaust port 23. The gas recovery nozzle 22 and the exhaust port 23 are each connected to an exhaust source not shown.

[0057] Figure 4 ​is a view of the plurality of gas recovery ports 21 and the gas recovery nozzle 22 provided in the gas recovery chamber 20 as viewed from the side of the object 4 to be processed. In order to more reliably recover the gas, the plurality of gas recovery nozzles 22 are in the shape of a slit that is long in the X direction. In the present embodiment, the plurality of gas recovery ports 21 are arranged at equal intervals.

[0058] Returning to Figure 1 The light processing device 100 has a gas recovery chamber 30 that recovers gas downstream of the light processing chamber 2 in the conveyance path. The gas recovery chamber 30 has a plurality of gas recovery ports 31 and a gas recovery nozzle 32 that is disposed close to the object 4 on the upstream side (+Y direction side) in the gas recovery chamber 30. The plurality of gas recovery ports 31 are connected to a common exhaust port 34. The gas recovery nozzle 32 and the exhaust port 34 are each connected to an exhaust source not shown. The gas recovery nozzle 32 is likewise in the shape of a slit that is long in the X direction. Furthermore, in the light processing device 100, the gas recovery nozzle 32 is not an essential component.

[0059] The gas recovery chambers (20, 30) recover gas that leaks from the purge chamber 10 or the light processing chamber 2. Most of the leaked gas is the inert gas G1 supplied to the light processing chamber 2 and the purge gas G2 (inert gas) ejected from the purge chamber 10.

[0060] By recovering the inert gas G1 and the purge gas G2 in the gas recovery chambers (20, 30), the inert gas G1 and the purge gas G2 do not leak to the surroundings of the light processing device 100. Thereby, a person located near the light processing device 100 is protected from oxygen deficiency.

[0061] The light processing device can also have only either of the gas recovery chamber 20 upstream of the purge chamber 10 and the gas recovery chamber 30 downstream of the light processing chamber 2. The amount of leaked gas is greater downstream of the conveyance path than upstream, so the gas recovery chamber 30 is more important than the gas recovery chamber 20. In the case of having both the gas recovery chamber 20 upstream of the purge chamber 10 and the gas recovery chamber 30 downstream of the light processing chamber 2 as in the light processing device 100, it is easy to maintain the flow of gas in the light processing chamber 2 as laminar flow, which is more preferable.

[0062] When the pressure in the light treatment chamber 2 is set to Pl and the pressure in the purge chamber 10 is set to P2, Pl can be set to be greater than P2. Thereby, the amount of gas flowing from the purge chamber 10 into the light treatment chamber 2 can be reduced. Further, when the pressure in the gas recovery chamber (20, 30) is set to P3, Pl can be set to be greater than P2, which is greater than P3. It can be considered that the gas recovery chamber (20, 30) has a shape in which the front end of the gas recovery port (21, 31) is enlarged so as to easily recover gas. In addition, the front end of the gas recovery port 21, 31 can also have a shape in which it is not enlarged. That is, a configuration in which there is no gas recovery chamber and only a gas recovery port can also be used.

[0063] For the light treatment device 100, it is not necessary to recover the inert gas. In a case where there is no person around the light treatment device 100, or in a case where there is an exhaust device that does not belong to the light treatment device 100, the light treatment device 100 can also not have the gas recovery chamber (20, 30) and the gas recovery port (21, 22, 31, 32).

[0064] [Transport body] A detailed description will be given of the conveyer belt 1 used as the transport body. The belt 1 is wound around a first pulley 38 and a second pulley 37. The first pulley 38 and the second pulley 37 are rotary bodies having shafts extending in the X direction as centers. In the present embodiment, the first pulley 38 is a drive pulley for driving the belt 1. The second pulley 37 is a driven pulley that moves by friction with the driven belt 1. The first pulley 38 and the second pulley 37 can also have a cylindrical shape in which the diameter is constant in the X direction. The length of the first pulley 38 and the second pulley 37 in the X direction can be greater than the width of the belt 1 in the X direction.

[0065] The belt 1 is in a sheet shape. The belt 1 does not contact the plate 5. The belt 1 does not contact the light treatment chamber 2 or the purge chamber 10. The width of the belt 1 in the X direction is greater than the width of the object to be treated 4 in the X direction. The width of the belt 1 in the X direction can be 500 mm or more and can be 560 mm or less. In addition, the thickness of the belt 1 in the Z direction can be 0.1 mm or more and can be 2.0 mm or less. If the belt 1 is thick, the belt 1 is less likely to flex. On the other hand, if the belt 1 is thin, the belt 1 is more likely to move smoothly. In the present embodiment, it is desirable to transport the object to be treated 4 at high speed. The moving speed of the belt 1 can be, for example, 70 m / minute, and more preferably 100 m / minute or more. Even if the moving speed of the belt 1 is set to be fast, the belt 1 can move smoothly.

[0066] The belt 1 can be made of, for example, resin. Polyurethane can be used in the belt 1. When vacuum ultraviolet light is absorbed by air containing oxygen or water, it is feared that oxygen radicals (O ( 1D), ozone (O3), or hydroxyl radicals (·OH) and other reactive substances. If belt 1 deteriorates or deteriorates due to these reactive substances, belt 1 can be replaced periodically. Alternatively, belt 1 can be made of materials that are less susceptible to chemical degradation by these reactive substances, such as fluoropolymer resins. PTFE is an example of a fluoropolymer resin material.

[0067] The belt 1 has a guide roller 13 supporting it between the first pulley 38 and the second pulley 37. The guide roller 13 can be made of metal or resin. The guide roller 13 can also be composed of a plurality of small rollers arranged in the X direction. When using resin for the guide roller 13, a resin that is not easily degraded by ultraviolet light (e.g., polyimide resin, epoxy resin, or PTFE resin) can be used. It is preferable to arrange the guide roller 13 in such a way that the workpiece 4 is supported by the guide roller 13 in the area where ultraviolet light L1 can be irradiated, which makes it easier to maintain the distance between the workpiece 4 and the light source 3.

[0068] <Second Implementation Method> Reference Figure 5 A second embodiment of the light processing apparatus will be described. Hereinafter, the description will focus on features that differ from the first embodiment. Points not described in the second embodiment can be implemented in the same manner as in the first embodiment. The same applies to the third embodiment described later.

[0069] The light processing device 200 is located upstream of the transport path of the gas recovery chamber 20 (in Figure 5 The second purge chamber 40 (located on the +Y side) has a box-shaped structure. A second purge gas nozzle 41 is disposed on the inner wall of the second purge chamber 40. A second purge gas G3 is injected from the second purge gas nozzle 41 toward the workpiece 4 passing through the second purge chamber 40. The purpose of the second purge gas G3 is the same as that of the purge gas G2: to reduce the thickness of the boundary layer 9 on the workpiece 4 being transported at high speed. However, since the boundary layer 9 can be removed within the purge chamber 10, the second purge chamber 40 serves as an auxiliary function to the purge chamber 10.

[0070] The second purge gas nozzle 41 is connected to a second gas supply source 49. The second gas supply source 49 can also be a supply source of air. That is, as the second purge gas G3, air can also be used. Even if air is ejected toward the object to be treated 4, the boundary layer 9 composed of air can be broken. Due to the ejected air, a new boundary layer 9 is feared to be formed, but by the ejection of air, at least the thickness of the boundary layer 9 can be reduced. The remaining boundary layer 9 is removed in the purge chamber 10. Of course, an inert gas can also be used in the second purge gas G3. In the case where the second purge gas G3 uses an inert gas, a gas recovery chamber 20 can be arranged upstream of the second purge gas nozzle 41. The second purge chamber 40 can be contiguous with the gas recovery chamber 20.

[0071] <Third Embodiment> Reference Figure 6 A third embodiment of the light treatment device will be described. The object to be treated 4 is a decorative sheet. In the case where the object to be treated 4 is a sheet-like decorative sheet, an object to be treated winding device (not shown) that winds the sheet-like object to be treated 4 is a conveyance body. The sheet-like object to be treated 4 is conveyed in the -Y direction while the winding device and the guide roller 33 are rotated.

[0072] The light treatment device 300 has a space 50 at a position opposite to the purge chamber 10 with respect to the object to be treated 4. An inert gas G1 is also supplied to the space 50. Thereby, both the front surface and the back surface of the object to be treated 4 are surrounded by the inert gas. The light treatment device 300 also has a space 60 at a position opposite to the light treatment chamber 2 with respect to the object to be treated 4. Three purge gas nozzles 1111 that eject the purge gas G2 (inert gas) are installed in the space 60.

[0073] The light treatment device 300 has box-shaped gas recovery chambers (25, 35) at positions opposite to the gas recovery chambers (20, 30) with respect to the object to be treated 4, respectively. The gas recovery chambers (25, 35) each have a gas recovery port (26, 36) formed in the bottom of the box. The gas recovery ports 26, 36 are each connected to an exhaust source not shown. The gas recovery ports 26, 36 are similarly slit-shaped in the X direction.

[0074] <Fourth Embodiment> Reference Figure 7 A fourth embodiment of the light treatment device will be described. The light treatment device 400 has a single space 70 at a position opposite to the light treatment chamber 2 and the purge chamber 10 with respect to the object to be treated 4. An inert gas G1 is supplied to the space 70. Since the single space 70 is formed, a space opposite to the purge chamber 10 with respect to the object to be treated 4 is ensured to be large.

[0075] The gas recovery chambers (20, 30) of the light treatment apparatus 400 do not have gas recovery nozzles arranged in close proximity, but are simply gas recovery ports (21, 31). Thus, it is not necessary to provide a gas recovery nozzle arranged in close proximity to the object 4.

[0076] The above describes several embodiments of the light treatment apparatus, but the present application is not limited to the above-described embodiments, and various modifications or improvements can be made to the above-described embodiments, or the embodiments can be combined, without departing from the spirit of the present application.

[0077] The above-described light treatment apparatuses (100, 200, 300) have a single light treatment chamber 2, but a plurality of light treatment chambers 2 can be arranged in the conveyance direction (Y direction).

[0078] The above-described light treatment apparatuses (100, 200, 300) are shown with the direction of irradiation of the ultraviolet light Ll being the same as the direction of gravity (-Z direction), but the direction of irradiation of the ultraviolet light Ll can be different from the direction of gravity. For example, the ultraviolet light can be irradiated in the horizontal direction to a conveyance object conveyed in the direction of gravity.

[0079] The object 4 treated by the light treatment apparatus of the present embodiment can also be a material other than a decorative material or a decorative sheet. Ultraviolet light of various wavelengths is irradiated to an object composed of a plurality of materials for various purposes. The light treatment apparatus of the present embodiment can also be used for purposes other than imparting an extinction effect.

[0080] Explanation of Reference Numerals 1: Conveyance object (conveyance belt) 2: Light treatment chamber 3: Light source 4: Object 5: Plate 6: Gas pipe 7: Flow control valve 8: Gas supply port 9: Boundary layer 10: Purge chamber 11, 11a, 11b, 11c: Purge gas nozzle 12: Gas supply source 13, 33: Guide roller 19a, 19b: Gas discharge port 20, 25, 30, 35: Gas recovery chamber 21, 26, 31, 36: Gas recovery port 22, 32: Gas recovery nozzle 34: Exhaust port 37: Second pulley 38: first pulley 40: second purge chamber 41: second purge gas nozzle 49: second gas supply source 50, 60: space 70: space 100, 200, 300, 400: light processing device G1: inert gas G2: purge gas G3: second purge gas

Claims

1. A light processing device, characterized in that, have: An ultraviolet light source irradiates the surface of the object being processed along the transport path with ultraviolet light; The light processing chamber is capable of forming an inert gas atmosphere in the space irradiated by the ultraviolet light; The purge chamber, located upstream of the optical processing chamber in the transport path, is capable of forming an inert gas atmosphere inside. as well as At least one purge gas nozzle is disposed in the purge chamber to spray inert gas toward the object being treated.

2. The light processing apparatus according to claim 1, characterized in that, At least one of the purge gas nozzles has an angle θ1 between 45 degrees and 90 degrees between the gas injection direction and the direction upstream of the delivery path (+Y direction).

3. The light processing apparatus according to claim 1, characterized in that, When the pressure in the light processing chamber is set to P1 and the pressure in the purge chamber is set to P2, P1 > P2.

4. The light processing apparatus according to claim 1, characterized in that, It has a gas recovery chamber located upstream of the purge chamber in the transport path to recover the inert gas.

5. The light processing apparatus according to claim 4, characterized in that, The gas recovery chamber is equipped with a gas recovery nozzle, which is disposed in the gas recovery chamber on the downstream side of the conveying path and close to the object being processed.

6. The light processing apparatus according to claim 4, characterized in that, It includes a gas recovery chamber located downstream of the light processing chamber in the transport path, for recovering the inert gas.

7. The light processing apparatus according to claim 4, characterized in that, When the pressure in the light processing chamber is set to P1, the pressure in the purge chamber is set to P2, and the pressure in the gas recovery chamber is set to P3, P1>P2>P3.

8. The light processing apparatus according to any one of claims 1-7, characterized in that, It has at least one second purge gas nozzle, which is located upstream of the purge chamber in the transport path and sprays gas toward the object being processed.

9. The light processing apparatus according to claim 8, characterized in that, The gas ejected by the second purge gas nozzle is air.

10. The light processing apparatus according to claim 8, characterized in that, At least one of the second purge gas nozzles has an angle θ1 between 45 degrees and 90 degrees between the gas injection direction and the direction upstream of the delivery path (+Y direction).

11. The light processing apparatus according to any one of claims 1-7, characterized in that, The at least one purge gas nozzle is configured in the purge chamber to be biased towards the downstream side of the delivery path.

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