Processing system

Abstract

The treatment system comprises an atmosphere conveying module, a conveying device and a cleaning device. The atmosphere conveying module can convey the substrate under the atmosphere. The transport device has an end effector including at least one support member on which a substrate can be placed. The conveying device is arranged in the atmosphere conveying module and can convey the substrate. The cleaning device is capable of cleaning the at least one support member.

Description

TECHNICAL FIELD

[0001] An exemplary embodiment of the present application relates to a processing system. BACKGROUND

[0002] In processing of placing a substrate on a substrate placing portion, a substrate conveying device is used. The substrate conveying device disclosed in the following Patent Literature 1 has a hand portion, a substrate detector, and a control device. The hand portion is capable of placing a substrate thereon. The substrate detector is provided to the hand portion and is capable of projecting light to the substrate. The control device is capable of judging whether or not a positional shift of the substrate has occurred, depending on whether or not the substrate detector receives reflected light from a main surface of the substrate.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Laid-Open No. 2022-091855 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] The present application provides a technology of cleaning a support member that supports a substrate in a conveying device.

[0008] MEANS FOR SOLVING THE PROBLEMS

[0009] In one exemplary embodiment, a processing system is provided. The processing system includes an atmospheric conveying module, a conveying device, and a cleaning device. The atmospheric conveying module is capable of conveying a substrate under an atmosphere. The conveying device has an end effector that includes at least one support member capable of placing a substrate thereon. The conveying device is disposed in the atmospheric conveying module and is capable of conveying the substrate. The cleaning device is capable of cleaning the at least one support member.

[0010] EFFECTS OF THE INVENTION

[0011] With one exemplary embodiment of the present application, a support member that supports a substrate in a conveying device can be cleaned. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is a side view of a processing system that represents one exemplary embodiment.

[0013] Figure 2 is a view of a processing system that represents one exemplary embodiment.

[0014] Figure 3 is a top view of a conveying robot of a processing system that represents one exemplary embodiment.

[0015] Figure 4 is a cross-sectional view of a transport robot and a substrate along an IV-IV line of Figure 3

[0016] Figure 5 is a flowchart of a cleaning method of a processing system of one illustrative embodiment.

[0017] Figure 6 is a flowchart of an adsorption force abnormality detection method of a processing system of one illustrative embodiment.

[0018] Figure 7 is a flowchart of a position adjustment method of a processing system of one illustrative embodiment.

[0019] Figure 8 is a flowchart of a foreign matter removal method of a processing system of one illustrative embodiment.

[0020] Figure 9 is a flowchart of an image acquisition method of a processing system of one illustrative embodiment.

[0021] Figure 10 is a flowchart of a polishing method of a support member of a processing system of one illustrative embodiment.

[0022] Figure 11 is a flowchart of an abnormality detection method of a processing system of one illustrative embodiment. DETAILED DESCRIPTION

[0023] Hereinafter, various illustrative embodiments will be explained in detail with reference to the accompanying drawings. In each of the drawings, the same or corresponding portions are designated by the same reference numerals.

[0024] [PROCESSING SYSTEM]

[0025] Referring to Figure 1 and Figure 2 , one example of a processing system of one illustrative embodiment will be explained. Figure 1 is a side view showing a part of a processing system of one illustrative embodiment. Figure 2 is a view showing a processing system of one illustrative embodiment. The processing system PS is a system capable of processing a substrate W by transporting the substrate W with a transport robot TR3. The transport robot TR3 is one example of a transport device. The processing system PS is capable of cleaning at least one support member P supporting the substrate W in the transport robot TR3. The processing system PS is a system capable of cleaning at least one support member P supporting the substrate W in the transport robot TR3.

[0026] As Figure 1 and Figure 2 ​As shown, the processing system PS includes a loading module LM, a conveying robot TR3, and a grinding device 40. The loading module LM is an example of an atmospheric conveying module. The grinding device 40 is an example of a cleaning device. The processing system PS may also include a capturing device 50 and a control device CU. The processing system PS may also include at least one adsorption sensor V5, at least one position measuring device 20, and a foreign matter removal device 30. The adsorption sensor V5 is an example of a pressure measuring device.

[0027] like Figure 2 As shown, the processing system PS may also include a cleaning station CL. Figure 1 The position measuring device 20, foreign object removal device 30, grinding device 40 and imaging device 50 shown are installed in the cleaning station CL.

[0028] like Figure 2 As shown, the processing system PS may also include loading ports LP1-LP4, an aligner AN, load locking modules LL1 and LL2, and a storage device SR. The processing system PS may also include transport modules TM1 and TM2, and processing modules PM1-PM12, etc.

[0029] In the processing system PS, the loading module LM is a structure capable of transporting substrates W under atmospheric pressure. The loading module LM can transport substrates W taken from any of the loading ports LP1-LP4 under atmospheric pressure. The loading module LM includes a chamber. The pressure within the chamber of the loading module LM is set to atmospheric pressure. The loading module LM may have an FFU (Fan Filter Unit). For example, the loading module LM is an EFEM (Equipment Front End Module). The loading module LM is configured between each loading port LP1-LP4 and each load locking module LL1, LL2. The loading ports LP1-LP4 are arranged along one of a pair of edges along the long side of the loading module LM. Each loading port LP1-LP4 can support a cassette CST placed thereon. The cassette CST is a container capable of holding multiple substrates W. For example, the cassette CST is a FOUP (Front-Opening Unified Pod).

[0030] The load module LM further includes a transport robot TR3. The transport robot TR3 is provided within the load module LM. For example, the transport robot TR3 is provided in a chamber of the load module LM. The transport robot TR3 has, for example, an end effector EE31. The transport robot TR3 can have a multi-joint arm AR31. The transport robot TR3 is capable of moving the end effector EE31 based on a movement instruction output by the control device CU described later, and transporting the substrate W. The transport robot TR3 is capable of transporting the substrate W between any two of the load ports LP1 to LP4, the load lock modules LL1, LL2, the aligner AN, the storage device SR, and the cleaning station CL.

[0031] The aligner AN is connected to the load module LM, and is capable of adjusting the position of the substrate W. In the example shown in FIG. 1, the aligner AN is disposed along one of a pair of edge portions of the load module LM in the short direction. Figure 2

[0032] The storage device SR is connected to the load module LM, and is capable of storing the substrate W therein. In the example shown in FIG. 1, the storage device SR is disposed along an edge portion of the load module LM in the long direction. Figure 2

[0033] The cleaning station CL is capable of cleaning at least one support member of the transport robot TR3 described later. In the example shown in FIG. 1, the cleaning station CL is disposed along the other of the pair of edge portions of the load module LM in the short direction, on which the aligner AN is not disposed. The cleaning station CL is connected to the chamber of the load module LM. Further, the cleaning station CL can also be disposed along the other of the pair of edge portions of the load module LM in the short direction. The other of the edge portions of the load module LM is not provided with the aligner AN. The cleaning station CL can also be disposed along the edge portion of the load module LM in the long direction. The cleaning station CL can be arranged in series with the storage device SR. The cleaning station CL is in communication with the load module LM, without a partition being provided between the cleaning station CL and the load module LM. The transport robot TR3 is capable of positioning the end effector EE31 within the cleaning station CL in a state in which a part of the multi-joint arm AR31 is positioned within the load module LM. Details of the cleaning station CL will be described later. Figure 2

[0034] The load lock modules LL1, LL2 are each connected to the load module LM, and provide a preliminary pressure reduction chamber. The load lock modules LL1, LL2 are each disposed between the transport module TM1 and the load module LM. The load lock modules LL1, LL2 are each connected to the load module LM via a gate valve G3. The load lock modules LL1, LL2 are each connected to the transport module TM1 via a gate valve G2.

[0035] ​​​Each of the load lock modules LL1, LL2 has a stage arranged in an inner space thereof. The inner space is depressurizable. When the substrate W is transported between the inner space and the load module LM, the pressure of the inner space is set to be atmospheric pressure. When the substrate W is transported between the inner space and the transport module TM1, the pressure of the inner space is depressurized, for example, to a vacuum state.

[0036] Each of the transport modules TM1, TM2 includes a chamber. Each of the transport modules TM1, TM2 is capable of transporting the substrate W via a depressurized space within the chamber thereof. The chamber of the transport module TM1 is connected to each of the load lock modules LL1, LL2 via a gate valve G2. The processing modules PM1 to PM6 are connected to the chamber of the transport module TM1 via a gate valve Gl. The chamber of the transport module TM1 is connected to the chamber of the transport module TM2. The processing modules PM7 to PM12 are connected to the chamber of the transport module TM2 via a gate valve Gl.

[0037] The transport module TM1 includes a transport robot TR1 disposed within the chamber thereof. The transport robot TR1 has, for example, end effectors EE11, EE12 and multi-joint arms AR11, AR12. The end effector EE11 has a fork FK11. The end effector EE12 has a fork FK12. The fork FK11 is mounted at a front end of the multi-joint arm AR11 and is capable of supporting the substrate W placed thereon. The fork FK12 is mounted at a front end of the multi-joint arm AR12 and is capable of supporting the substrate W placed thereon. The transport robot TR1 is capable of transporting the substrate W based on an action instruction output from a control device CU described later. The transport robot TR1 is capable of holding the substrate W with the forks FK11, FK12. The transport robot TR1 is capable of transporting the substrate W between any two of the load lock modules LL1, LL2, the processing modules PM1 to PM6, the chamber of the transport module TM1 and a path between the chamber of the transport module TM1 and the chamber of the transport module TM2.

[0038] The transport module TM2 includes a transport robot TR2 disposed within the chamber thereof. The transport robot TR2 has, for example, end effectors EE21, EE22 and multi-joint arms AR21, AR22. The end effector EE21 has a fork FK21. The end effector EE22 has a fork FK22. The fork FK21 is mounted at a front end of the multi-joint arm AR21 and is capable of supporting the substrate W placed thereon. The fork FK22 is mounted at a front end of the multi-joint arm AR22 and is capable of supporting the substrate W placed thereon. The transport robot TR2 is capable of transporting the substrate W based on an action instruction output from a control device CU described later. The transport robot TR2 is capable of holding the substrate W with the forks FK21, FK22. The transport robot TR2 is capable of transporting the substrate W between any two of the processing modules PM7 to PM12 and the above-described path.

[0039] The processing modules PM1 to PM12 are each a substrate processing apparatus capable of performing a dedicated process on the substrate W. At least one of the processing modules PM1 to PM12 can be a plasma processing apparatus. The transport modules TM1, TM2 and the processing modules PM1 to PM12 are separated by a gate valve G1 which is openable and closable.

[0040] The control device CU is, for example, a computer. The control device CU includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), an auxiliary storage device, and the like. The CPU is capable of acting based on a program saved in the ROM or the auxiliary storage device, and controlling each part of the processing system PS. For example, the control device CU outputs an action instruction to the transport robots TR1, TR2, TR3, and the like. The action instruction includes an instruction to move the end effectors EE11, EE12, EE21, EE22, EE31 which transport the substrate W to a transport site of the substrate W. The action instruction includes an instruction to move the end effector EE31 to each component part within the cleaning station CL.

[0041] Further, the processing system PS is not necessarily limited to Figure 2 the structure shown in the drawing. For example, the number of processing modules and / or the number of forks in the processing system can be different from Figure 2 the number shown in the drawing. In addition, the processing system can also be a system obtained by connecting a plurality of module groups each including a processing module and a load lock module to a load module (so-called load type system). In addition, the processing system can also be a system obtained by arranging two or more processing modules around a transport module in a manner of surrounding the transport module and connecting them (so-called cluster type system).

[0042] Next, detailed description will be given of each component part of the processing system of one example embodiment. First, detailed description will be given of each component part of the transport robot TR3 with reference to Figure 3 and Figure 4 Figure 3 is a plan view of the transport robot of the processing system of one example embodiment. Figure 4 is a cross-sectional view of the transport robot and the substrate along the IV-IV line of Figure 3

[0043] ​​The end effector EE31 of the transport robot TR3 includes the fork FK31 and at least one support member P. The fork FK31 has a root end portion 311 and a pair of arm portions 312, 312. The pair of arm portions 312, 312 are spaced apart from each other, extending from the root end portion 311 to their front ends. That is, the fork FK31 has a substantially U-shaped or horseshoe-shaped form. The width of the gap between the arm portion 312 and the arm portion 312 is greater than the width of the substrate placement portion 10 described later, so that the pair of arm portions 312, 312 do not come into contact with the substrate placement portion 10 when the end effector EE31 moves up and down. The end effector EE31 further includes a camera CM. The camera CM is capable of taking an image of at least one support member P of the end effector EE31 and the substrate W on at least one support member P. The camera CM notifies the image taken to the judging portion 93 of the control device CU.

[0044] At least one support member P is capable of placing the substrate W thereon. The material of at least one support member P can be an engineering plastic, and particularly, can be polyimide. As the polyimide, Vespel (registered trademark) can be used as the material of at least one support member P. The material of at least one support member P is not limited to polyimide, as long as it is a material having prescribed corrosion resistance, heat resistance, and strength. The end effector EE31 can include three support members P as at least one support member P. The three support members P are provided on the fork FK31. Three marks M can be provided on the face of the fork FK31 opposite to the face on which the three support members P are provided. The marks M are targets when the position of the end effector EE31 is made to coincide with the foreign matter removing device 30, the polishing device 40, and the imaging device 50 by at least one position measuring device 20.

[0045] The three support members P are, for example, adsorption pads. The three support members P each include a suction hole V1. Each suction hole V1 penetrates each support member P in the up-and-down direction. The three support members P are capable of adsorbing the substrate W by suction from the respective suction holes V1. The respective suction holes V1 of the three support members P extend into the fork FK31. The fork FK31 includes a suction passage V2 formed in the inside thereof. The respective suction holes V1 of the three support members P are connected to the suction passage V2.

[0046] The processing system PS can further include an exhaust pipe V3, an exhaust device V4, and at least one adsorption sensor V5. The processing system PS includes one adsorption sensor V5 as the at least one adsorption sensor V5. The plurality of suction holes V1 are connected to the exhaust device V4 via the suction path V2 and the exhaust pipe V3. The exhaust device V4 includes a valve, a regulator, a vacuum pump, or the like. The exhaust device V4 is capable of regulating the pressure of each of the suction holes V1, the suction path V2, and the exhaust pipe V3 while sucking the inside of the suction holes V1, the suction path V2, and the exhaust pipe V3. The suction holes V1 are also connected to the adsorption sensor V5 via the suction path V2 and the exhaust pipe V3. The adsorption sensor V5 is capable of measuring the pressure reflecting the adsorption force of the transport robot TR3. The adsorption sensor V5 is capable of measuring the pressure reflecting the adsorption force of the transport robot TR3 to the wafer W in a state where the wafer W is placed on the three support members P. The adsorption sensor V5 is capable of measuring the pressure (hereinafter also referred to as "adsorption force") in the exhaust pipe V3 and notifying the measured pressure to the judging section 93 of the control device CU.

[0047] Next, the details of each component of the processing system of one exemplary embodiment will be described. First, the details of each component of the processing system will be described again with reference to Figure 1 The details of each component in the cleaning station CL will be described. The wafer placing section 10, the at least one position measurer 20, the foreign matter removing device 30, the polishing device 40, and the imaging device 50 are provided in the cleaning station CL. In the cleaning station CL, the at least one position measurer 20, the foreign matter removing device 30, the polishing device 40, the imaging device 50, and the wafer placing section 10 are arranged in this order upward. In the case where the cleaning of the three support members P is performed, first, the transport robot TR3 hands over the wafer W from the end effector EE31 to the wafer placing section 10. After that, the transport robot TR3 moves the end effector EE31 to the object regions 20a, 30a, 41a, 46a, 50a where each function of the position measurer 20, the foreign matter removing device 30, the polishing device 40, and the imaging device 50 can be exerted, respectively.

[0048] The wafer placing section 10 has a placing surface 11. The wafer placing section 10 is capable of supporting the wafer W placed on the placing surface 11. Further, the placing surface 11 can be constituted by several pads.

[0049] The processing system PS includes three position measurers 20 as the at least one position measurer 20. The three position measurers 20 are capable of measuring the position and inclination of the three support members P with respect to at least one of the foreign matter removing device 30, the polishing device 40, and the imaging device 50. In the case where the cleaning of the three support members P is performed, the three position measurers 20 are capable of measuring the position and inclination of the three support members P with respect to the foreign matter removing device 30, the polishing device 40, and the imaging device 50. Figure 1In the illustrated example, the three position measurers 20 can not be disposed in a straight line with respect to each other. The three position measurers 20 can be disposed in the same plane along a horizontal direction. The three position measurers 20 each include a laser displacement meter.

[0050] The three position measurers 20 are capable of irradiating laser light toward a stage 32 of the foreign matter removing device 30, which will be described later. The laser light is irradiated in a manner going upward. The three position measurers 20 are capable of measuring distances from the three position measurers 20 respectively to the stage 32 of the foreign matter removing device 30 by irradiation of the laser light. The three position measurers 20 notify the judged portion 93 of the control device CU of the measured distances respectively. Here, for example, in a case where the three distances are different from each other, it is indicated that the stage 32 is tilted. As described above, the measured distances respectively become indexes indicating the degree of tilt of the stage 32.

[0051] In addition, the three position measurers 20 are capable of irradiating laser light toward the end effector EE31 of the transport robot TR3 moved to the object region 20a of the position measurer 20. The object region 20a of each position measurer 20 refers to a region capable of functioning to measure the positions of the three support members P by each position measurer 20. The object region 20a is, for example, a region capable of irradiating the laser light from the three position measurers 20. The object region 20a is, for example, a space above the three position measurers 20. The object region 20a includes at least the stage 32 of the foreign matter removing device 30 within the region thereof.

[0052] The three position measurers 20 are capable of measuring the degree of tilt of the three support members P with respect to the foreign matter removing device 30. In Figure 1 In the illustrated example, the degree of tilt of the three support members P provided on the end effector EE31 is measured by measuring the degree of tilt of the end effector EE31. The three support members P are provided on the fork FK31 of the end effector EE31, and thus the degree of tilt of the three support members P is the same as the degree of tilt of the end effector EE31. The three position measurers 20 measure distances from the three position measurers 20 respectively to the end effector EE31 by irradiation of the laser light. The three position measurers 20 notify the judged portion 93 of the control device CU of the measured distances respectively. The measured distances respectively become indexes indicating the degree of tilt of the three support members P.

[0053] Further, the three position measurers 20 are capable of measuring the positions of the three support members P. As one example of measuring the positions of the three support members P, the three position measurers 20 measure the positions of the three markers M provided to the end effector EE31. That is, by measuring the positions of the three markers M, the positions of the three support members P are measured. The three position measurers 20 each are capable of irradiating a laser light to a corresponding respective marker M, and receiving reflected light from the respective marker M. The intensity of the reflected light from the respective marker M irradiated with the laser light, for example, is greater than the intensity of the reflected light from a region other than the respective marker M of the end effector EE31 irradiated with the laser light. The intensity of the reflected light from the respective marker M is stored in advance. The three position measurers 20 are capable of detecting a positional shift in the horizontal direction based on the intensity of the received reflected light. The laser light is irradiated, for example, from the three position measurers 20 upward. In a case where the intensity of the reflected light of the laser light is not equivalent to the intensity of the reflected light from the respective marker M, the positions of the three position measurers 20 and the three markers M are shifted in the horizontal direction. In a case where the intensity of the reflected light of the laser light is equivalent to the intensity of the reflected light from the respective marker M, the positions of the three position measurers 20 and the three markers M coincide in the horizontal direction.

[0054] The foreign matter removing device 30 is capable of removing foreign matter attached to at least one support member P. The foreign matter removing device 30 is capable of removing foreign matter attached to at least one support member P of the end effector EE31 moved to the object region 30a of the foreign matter removing device 30 by the transport robot TR3. The object region 30a of the foreign matter removing device 30 refers to a region capable of functioning to remove foreign matter by the foreign matter removing device 30. The foreign matter removing device 30 has a blow device 31 and at least one dust collecting device 36. The blow device 31 is capable of removing foreign matter attached to at least one support member P by blowing.

[0055] The blow device 31 has a placement table 32, a blow pipe 33, and at least one blow nozzle 34. The placement table 32 is a plate-like member extending in the horizontal direction. The placement table 32 is disposed, for example, at a position higher than the three position measurers 20 and the object region 30a. The placement table 32 is disposed at a position opposite to the three position measurers 20. The placement table 32 includes a portion of the blow pipe 33 formed in the inside thereof. One end of the blow pipe 33 is connected to a blower 35, for example. The other end of the blow pipe 33 is connected to at least one blow nozzle 34.

[0056] The air supply device 31 has three blow-off nozzles 34 as the at least one blow-off nozzle 34, corresponding to the three support members P, respectively. One end of each blow-off nozzle 34 protrudes downward from the lower surface of the placement table 32 and toward the dust collecting device 36a described later. The air supply device 31 can cause air to be blown out from each blow-off nozzle 34 by activating the air blower 35 to supply air to the air supply pipe 33, and supply air to the target area 30a. For example, each blow-off nozzle 34 protrudes in a direction from the root end portion 311 of the end effector EE31 to the pair of arm portions 312, 312, toward each support member P at a target position within the target area 30a, so that air can be supplied to each support member P in that direction. By moving the three support members P to the target position in the target area 30a by the transport robot TR3, foreign matter adhering to the three support members P can be blown away by the air supply.

[0057] Figure 1 The processing system PS illustrated has three dust collecting devices 36a, 36b, 36c as the at least one dust collecting device 36. The dust collecting devices 36a, 36b, 36c are provided corresponding to the foreign matter removing device 30, the first polishing portion 41 of the polishing device 40 described later, and the second polishing portion 46 of the polishing device 40 described later, respectively. The dust collecting devices 36a, 36b, 36c are arranged in order upward. The dust collecting devices 36a, 36b, 36c include respective suction ports 37 and dust collecting pipes 38. The dust collecting devices 36a, 36b, 36c can suck dust within the target areas 30a, 41a, 46a by suction from the respective suction ports 37. A part of the dust collecting pipes 38 of the dust collecting devices 36a, 36b, 36c is formed by the same piping, respectively. Each suction port 37 is connected to an exhaust device 39 via each dust collecting pipe 38. The exhaust device 39 includes, for example, a valve, a regulator, a vacuum pump, and the like. The exhaust device 39 can suck dust from the suction port 37 while adjusting the pressure of each of the suction port 37 and the dust collecting pipe 38.

[0058] The dust collecting device 36a can collect foreign matter removed by the air supply device 31. The suction port 37 of the dust collecting device 36a is disposed in the direction of air supply from each blow-off nozzle 34 with respect to each blow-off nozzle 34. The dust collecting device 36b can collect fine powder and abrasive grains generated by the first polishing portion 41 of the polishing device 40 described later. The dust collecting device 36c can collect fine powder and abrasive grains generated by polishing by the second polishing portion 46 of the polishing device 40 described later. Each suction port 37 of the dust collecting devices 36b, 36c is disposed, for example, at the same position as the suction port 37 of the dust collecting device 36a in the horizontal direction.

[0059] The polishing device 40 is capable of cleaning the three support members P. As an example of cleaning, the polishing device 40 polishes the three support members P. The polishing device 40 has a first polishing portion 41 and a second polishing portion 46. The first polishing portion 41 is disposed below the second polishing portion 46. The first polishing portion 41 is capable of polishing the three support members P of the end effector EE31 moved to an object region 41a of the first polishing portion 41 by the transport robot TR3. The object region 41a of the first polishing portion 41 is a region capable of functioning as polishing of the support members P by the first polishing portion 41. The first polishing portion 41 includes a placement table 42 and at least one polishing member 43. The placement table 42 is a plate-like member extending in the horizontal direction. The placement table 42 is disposed, for example, at a position higher than the object region 41a. The placement table 42 of the first polishing portion 41 is disposed directly above the placement table 32 of the foreign matter removing device 30 and is disposed in parallel with the placement table 32. The first polishing portion 41 has three polishing members 43 corresponding to the three support members P, respectively, as the at least one polishing member 43. The three support members P can be physically polished by the three polishing members 43, respectively. The three polishing members 43 are disposed on the lower surface of the placement table 42. In the horizontal direction, the three polishing members 43 are located directly above the three support members P when the three support members P are moved to the target position by the transport robot TR3. By relatively sliding the end effector EE31 with respect to the three polishing members 43 in the horizontal direction by the transport robot TR3, the three polishing members 43 can each polish the corresponding support member P.

[0060] The second polishing section 46 is capable of polishing the three support members P of the end effector EE31 moved to the object region 46a of the second polishing section 46 by the conveyance robot TR3. The object region 46a of the second polishing section 46 is a region capable of functioning as polishing of the support members P by the second polishing section 46. The second polishing section 46 includes a table 47 and at least one polishing member 48. The table 47 is a plate-like member extending in the horizontal direction. The table 47 is disposed, for example, at a position higher than the object region 46a. The table 47 of the second polishing section 46 is disposed directly above the table 42 of the first polishing section 41 and is disposed in parallel with the table 32 of the foreign matter removing device 30. The second polishing section 46 has three polishing members 48 corresponding to the three support members P, respectively, as the at least one polishing member 48. The three support members P can be physically polished by the three polishing members 48, respectively. The three polishing members 48 are disposed on the lower surface of the table 47. In the horizontal direction, the three polishing members 48 are located directly above the three support members P when the three support members P are moved to the target position by the conveyance robot TR3. By relatively sliding the end effector EE31 with respect to the three polishing members 48 in the horizontal direction by the conveyance robot TR3, the three polishing members 48 can each polish the corresponding support member P.

[0061] The abrasive grains of the three polishing members 48 in the second polishing section 46 are finer than the abrasive grains of the three polishing members 43 in the first polishing section 41, respectively. The polishing by only the first polishing section 41, the polishing by only the second polishing section 46, and the polishing by the first polishing section 41 and the second polishing section 46 can be selected in accordance with the size of the damaged region of each support member P generated due to damage or wear of each support member P. The damaged region refers to a region including damage. The damage in the damaged region includes a dent or a burr. For example, the selection of the polishing sections described above can be made with reference to the support member P having the largest damaged region among the three support members P.

[0062] For example, in a case where the size of the damaged region is large, the polishing by the first polishing section 41 is selected. In a case where the three support members P are polished by the first polishing section 41, the end effector EE31 is moved to the object region 41a of the first polishing section 41 by the conveyance robot TR3, and the three support members P are slid with respect to the three polishing members 43, thereby polishing the three support members P. Thereby, the height difference between the damaged region of the support member P generated due to damage or wear of the support member P and the region other than the damaged region of the support member P becomes small.

[0063] For example, in a case where the size of the damaged region is relatively small, or in a case where finishing is performed after the polishing by the first polishing section 41, polishing by the second polishing section 46 is selected. In a case where the three support members P are polished by the second polishing section 46, the end effector EE31 is moved to the target region 46a of the second polishing section 46 by the conveyance robot TR3, and the three support members P are caused to slide with respect to the three polishing members 48, thereby polishing the three support members P. Thereby, the difference in the height direction between the damaged region and the other regions can be made smaller, and the support members P as a whole can be finished smoothly.

[0064] The imaging device 50 can acquire an image of at least one support member P before and after cleaning by the polishing device 40 as a pre-cleaning image and a post-cleaning image of the three support members P. Specifically, the imaging device 50 can acquire an image of at least one support member P before and after polishing by the polishing device 40 as a pre-polishing image and a post-polishing image of the three support members P. The pre-polishing image is an example of the pre-cleaning image. The imaging device 50 can acquire an image containing the three support members P as the pre-polishing image before polishing the three support members P by at least one of the first polishing section 41 and the second polishing section 46 of the polishing device 40. The post-polishing image is an example of the post-cleaning image. The imaging device 50 can acquire an image containing the three support members P as the post-polishing image after polishing the three support members P by at least one of the first polishing section 41 and the second polishing section 46 of the polishing device 40.

[0065] The imaging device 50 includes a camera 51 and a stage 52. The camera 51 can acquire an image of the three support members P of the end effector EE31 moved to a target region 50a of the imaging device 50 by the conveyance robot TR3. The target region 50a of the imaging device 50 refers to a region capable of functioning to acquire an image of the support members P by the imaging device 50. The target region 50a is, for example, a region in which the camera 51 of the imaging device 50 can image a subject. The camera 51 can image the three support members P after focusing on each support member P. The camera 51 includes, for example, a CCD sensor. The stage 52 is a plate-like member extending in the horizontal direction. The stage 52 is disposed, for example, at a position higher than the target region 50a. The stage 52 of the imaging device 50 is disposed directly above the stage 47 of the second polishing section 46, and is disposed in parallel with the stage 32 of the foreign matter removing device 30. The camera 51 is disposed on the lower surface of the stage 52.

[0066] Next, the structure of the control device CU and the processing in the control device CU will be described. The control device CU can include a judging section 93. The control device CU can include a control section 92. First, the control section 92 controls the transport robot TR3. The flow of the steps of the handover of the wafer W from the end effector EE31 to the wafer placing section 10 will be described. The control section 92 controls the transport robot TR3 in a state where the wafer W is placed on the three support members P of the end effector EE31 so that the wafer W is transported to a region above the wafer placing section 10 of the aligner AN. Next, the control section 92 controls the exhaust device V4 so that the suction of the wafer W by the end effector EE31 is stopped. Next, the control section 92 controls the transport robot TR3 so that the end effector EE31 is lowered with respect to the placing surface 11 of the wafer placing section 10 to a region below. By lowering the end effector EE31, as shown in FIG. 8, the wafer W is placed on the placing surface 11 and the end effector EE31 is separated downward from the wafer W. Thus, the wafer W is handed over from the end effector EE31 to the wafer placing section 10. Figure 1

[0067] Further, in the case of handing over the wafer W from the wafer placing section 10 to the end effector EE31, the control section 92 controls the transport robot TR3 so that the end effector EE31 is raised from a region below with respect to the placing surface 11 of the wafer placing section 10 to a region above. Thus, the end effector EE31 supports the wafer W on the three support members P, thereby lifting the wafer W from the placing surface 11 of the wafer placing section 10. The control section 92 controls the transport robot TR3 so that the wafer W is sucked and transported after the wafer W is lifted from the placing surface 11 of the wafer placing section 10.

[0068] Next, the flow of the processing by the control device CU until the three support members P are cleaned will be described. First, the judging section 93 judges whether the state of at least one of the support members P is good in order to judge whether the three support members P need to be cleaned. As one example of judging whether the state of at least one of the support members P is good, the judging section 93 detects an abnormality in the suction force of the transport robot TR3 with respect to the wafer W. In order to detect an abnormality in the suction force of the transport robot TR3, suction is started from a state where the suction of the exhaust device V4 is stopped in a state where the wafer W is placed on the three support members P. The three support members P suck the wafer W by suction from the respective suction holes V1. The suction sensor V5 measures the pressure in the exhaust pipe V3 communicating with the suction hole V1 as the suction force. The suction sensor V5 notifies the judging section 93 of the control device CU of the measured value of the measured pressure.

[0069] ​The determination section 93 determines whether the suction force of the transport robot TR3 to the substrate W is abnormal based on the measured value of the pressure notified from the suction sensor V5. First, the determination section 93 detects abnormality of the suction force of the transport robot TR3 by comparing the notified measured value of the pressure with a threshold value. The threshold value is set in advance. The determination section 93 determines that the suction force of the transport robot TR3 is abnormal in a case where the measured value of the pressure is less than the threshold value. That is, the determination section 93 determines that the state of at least one of the support members P is not good in a case where the measured value of the pressure is less than the threshold value. In addition, the determination section 93 detects abnormality of the suction force of the transport robot TR3 by comparing the time from when the measured value of the pressure is measured until the measured value of the pressure reaches the threshold value with a set time. The set time is set in advance. The determination section 93 determines that the suction force of the transport robot TR3 is abnormal in a case where the time from when the measured value of the pressure is measured until the measured value of the pressure reaches the threshold value is longer than the set time. That is, the determination section 93 determines that the state of at least one of the support members P is not good in a case where the time from when the measured value of the pressure is measured until the measured value of the pressure reaches the threshold value is longer than the set time. Here, in a case where the states of the three support members P supporting the substrate W are good and the suction force is normal, the measured value of the pressure is equal to or greater than the threshold value, and the time from when the measured value of the pressure is measured until the measured value of the pressure reaches the threshold value is shorter than the set time.

[0070] However, in a case where the end effector EE31 including at least one of the support members P supporting the substrate W is contaminated for some reason, the substrate W can not be sufficiently suctioned to at least one of the support members P. In particular, at least one of the support members P is exposed on the surface on the end effector EE31, and thus, the possibility of contamination is high compared to the suction path V2 and the exhaust pipe V3. In this case, the substrate W easily separates from at least one of the support members P due to a low suction force. Or, it takes a long time until the substrate W is properly suctioned to at least one of the support members P. Thus, in either case where the measured value of the pressure is less than the threshold value and the time from when the measured value of the pressure is measured until the measured value of the pressure reaches the threshold value is longer than the set time, it is determined that the suction force of the transport robot TR3 to the substrate W is abnormal.

[0071] In one embodiment, in a case where it is determined by the determination section 93 that the suction force of the transport robot TR3 to the substrate W is abnormal, the control section 92 controls the transport robot TR3 so that the end effector EE31 moves to the cleaning station CL. The control section 92 controls the cleaning station CL so that the three support members P on the end effector EE31 are cleaned. The cleaning station CL, for example, blows air to at least one of the support members P, grinds, or both blows air and grinds.

[0072] In one embodiment, the control section 92 controls the transport robot TR3 and the position measurers 20 so that the positions and inclinations of the three support members P with respect to the foreign matter removing device 30 are adjusted. The control section 92 controls the transport robot TR3 so that the end effector EE31 is moved to the object region 20a corresponding to the position measurers 20. The control section 92 causes the three position measurers 20 to measure distances to the stage 32 of the foreign matter removing device 30 and distances to the three support members P of the end effector EE31. The control section 92 acquires inclinations of the stage 32 of the foreign matter removing device 30 and inclinations of the three support members P of the end effector EE31 measured by the three position measurers 20. The control section 92 controls the transport robot TR3 so that the inclinations of the three support members P of the end effector EE31 coincide with the inclinations of the stage 32 of the foreign matter removing device 30.

[0073] Specifically, the control section 92 acquires distances from the three position measurers 20 to the stage 32 of the foreign matter removing device 30, respectively. The control section 92 acquires distances from the three position measurers 20 to the end effector EE31, respectively. The control section 92 controls the movement of the transport robot TR3 so that the ratio of the three distances from the three position measurers 20 to the end effector EE31 coincides with the ratio of the three distances from the three position measurers 20 to the stage 32 of the foreign matter removing device 30. Thereby, the inclination of the end effector EE31 can be adjusted, and the inclinations of the three support members P provided on the end effector EE31 can be adjusted.

[0074] The control section 92 causes the three position measurers 20 to measure the positions of the three support members P of the end effector EE31. As one example of measuring the positions of the three support members P, the control section 92 controls the three position measurers 20 so that the positions of the three markers M provided on the end effector EE31 are measured. As described above, the control section 92 can control the transport robot TR3 based on the intensity of the reflected light from the markers M so that the positions of the three markers M of the end effector EE31 are moved to directly above the three position measurers 20. Thereby, the control section 92 can control the transport robot TR3 so that the three support members P are moved to the target positions.

[0075] Here, the stage 42 of the first polishing section 41, the stage 47 of the second polishing section 46, and the stage 52 of the imaging device 50 are respectively provided directly above the stage 32 of the foreign matter removing device 30 and are provided in parallel with the stage 32. Therefore, the control section 92 can control the inclinations of the three support members P with respect to the stage 42 of the first polishing section 41, the stage 47 of the second polishing section 46, and the stage 52 of the imaging device 50 by controlling the inclinations of the three support members P as described above.

[0076] The control section 92 stores the amount of movement of the end effector EE31 in the horizontal direction when the three position measuring devices 20 are aligned with the positions of the three markers M within the object region 20a by moving the end effector EE31 with the transport robot TR3. The control section 92 moves the end effector EE31 by the amount of movement with respect to the object region 30a of the foreign matter removal device 30, for example, by the transport robot TR3. Thus, the transport robot TR3 can move the three support members P of the end effector EE31 to a position at which the foreign matter removal device 30 can perform removal of foreign matter. In addition, the control section 92 moves the end effector EE31 by the amount of movement with respect to the object region 41a and the object region 46a of the polishing device 40, for example, by the transport robot TR3. Thus, the transport robot TR3 can move the three support members P of the end effector EE31 to a position at which the polishing device 40 can perform polishing. Furthermore, the control section 92 moves the end effector EE31 by the amount of movement with respect to the object region 50a of the photographing device 50, for example, by the transport robot TR3. Thus, the transport robot TR3 can move the three support members P of the end effector EE31 to a position at which the photographing device 50 can perform photographing. This position of the three support members P in the horizontal direction is recorded as a target position. The control section 92 can move the end effector EE31 in the horizontal direction with respect to the foreign matter removal device 30, the polishing device 40, and the photographing device 50 to the target position by the transport robot TR3.

[0077] In one embodiment, the control device CU can control the transport robot TR3 and the foreign matter removal device 30 so that foreign matter attached to the three support members P is removed. The control section 92 can control the transport robot TR3 so that the end effector EE31 is moved to the object region 30a corresponding to the foreign matter removal device 30. The control section 92 can perform air supply to the three support members P by the air supply device 31 after the dust collection device 36a is activated.

[0078] In one embodiment, the control section 92 can control the transport robot TR3 and the dust collection device 36b, 36c so that the three support members P are polished. The control section 92 can control the transport robot TR3 in accordance with a polishing condition as a condition when the three support members P are polished by the polishing device 40. The polishing condition is set by the determination section 93. The control section 92 can control the transport robot TR3 so that the end effector EE31 moves to the target region 41a corresponding to the first polishing section 41 of the polishing device 40. The control section 92 can control the transport robot TR3 so that the three support members P are slid with respect to the three polishing members 43 so that the three polishing members 43 each polish the three support members P each within the target region 41a. The control section 92 can control the transport robot TR3 so that at least a part of each of the three support members P contacts each of the three polishing members 43 in the up-down direction. The control section 92 can control the transport robot TR3 so that the end effector EE31 moves in the horizontal direction while at least a part of each of the three support members P contacts each of the three polishing members 43. At this time, the control section 92 can control the dust collection device 36b so that the fine powder and the abrasive grains generated by polishing are collected.

[0079] In one embodiment, for example, the control section 92 can control the transport robot TR3 so that the end effector EE31 moves to the target region 46a corresponding to the second polishing section 46 of the polishing device 40. The control section 92 can control the transport robot TR3 so that the three support members P are slid with respect to the three polishing members 48 so that the three polishing members 48 each polish the three support members P each within the target region 46a. The control section 92 can control the transport robot TR3 so that at least a part of each of the three support members P contacts each of the three polishing members 48 in the up-down direction. The control section 92 can control the transport robot TR3 so that the end effector EE31 moves in the horizontal direction while at least a part of each of the three support members P contacts each of the three polishing members 48. At this time, the control section 92 can control the dust collection device 36c so that the fine powder and the abrasive grains generated by polishing are collected.

[0080] In one embodiment, the control section 92 can control the transport robot TR3 and the imaging device 50 so that images of the three support members P before and after polishing are acquired as the pre-polishing images and the post-polishing images of the three support members P. The control section 92 can control the transport robot TR3 so that the end effector EE31 moves to the subject region 50a corresponding to the imaging device 50. The control section 92 can control the transport robot TR3 so that each of the support members P is positioned directly below the camera 51. The control section 92 can control the imaging device 50 so that each of the three support members P before polishing by the polishing device 40 is imaged. The control section 92 can control the imaging device 50 so that each of the three support members P after polishing by the polishing device 40 is imaged.

[0081] In one embodiment, the judging section 93 can detect at least one damage region of the three support members P in the pre-polishing images, among the three support members P in which the abnormality of the adhesion force of the transport robot TR3 to the substrate W is detected. The judging section 93 can judge whether at least one damage region exists in at least one subject region in the post-polishing images at the same position as the at least one damage region in the pre-polishing images. The case where at least one damage region is detected by the judging section 93 in at least one subject region in the post-polishing images will be described below. The judging section 93 can calculate the difference between the size of the at least one damage region in the pre-polishing images and the size of the damage region in at least one subject region in the post-polishing images. The size of the damage region can be the area of the damage region, or the length in the depth direction of the damage region, or the width of the damage region. The size of the damage region can be the area of the damage region per unit area, or the length in the depth direction of the damage region per unit length, or the width of the damage region per unit length.

[0082] When a plurality of damage regions are detected in at least one subject region in the post-polishing images, the sum of the sizes of the plurality of damage regions is calculated as the size of the damage region in at least one subject region in the post-polishing images. In the case where the state where the damage region before polishing is not detected after polishing due to polishing by the polishing device 40, the size of the damage region in the post-polishing images is set to zero. The judging section 93 can detect the abnormality of the state of the support member P in which the damage region is detected before polishing by comparing the difference between the size of the at least one damage region in the pre-polishing images and the size of the damage region in at least one subject region in the post-polishing images with a set difference value. The judging section 93 can judge whether the state of the support member P in which the damage region is detected before polishing is abnormal after polishing by comparing the difference with the set difference value. The set difference value is set in advance. The judging section 93 judges that the state of the support member P is not good in the case where the abnormality of the state of at least one support member P among the three support members P is detected.

[0083] 〔cleaning method〕

[0084] Next, a cleaning method performed by the processing system of one exemplary embodiment will be described with reference to Figure 5 A cleaning method performed in a processing system of one exemplary embodiment will be described. Figure 5 is a flowchart of a cleaning method performed by the processing system of one exemplary embodiment. Hereinafter, the cleaning method MT (hereinafter, referred to as "method MT") shown in FIG. 10 will be described with an example of a case where the processing system PS is used. Note that the control of the structures and the parts of the processing system PS by the control device CU in the method MT will be described. Further, the method MT can be performed using a processing system other than the processing system PS. Figure 5 In the method MT, it is determined whether the suction force of the transport robot TR3 to the substrate W is abnormal, and in the case where the suction force is abnormal, removal of foreign matter is performed by the foreign matter removal device 30 and polishing is performed by the polishing device 40. It is determined whether the support member P is abnormal based on a pre-polishing image and a post-polishing image acquired by the imaging device 50 before and after polishing performed by the polishing device 40.

[0085] The method MT includes a step STa. In the step STa, a pressure reflecting the suction force of the transport robot TR3 to the substrate W is measured by the suction sensor V5, and it is detected whether the suction force is abnormal based on the measured pressure.

[0086] In the method MT, next, a step STb is performed. In the step STb, it is determined by the determination section 93 whether the suction force of the transport robot TR3 is abnormal. When the suction force of the transport robot TR3 is not detected to be abnormal in the step STa, it is determined that the suction force of the transport robot TR3 is not abnormal, and the method MT ends. On the other hand, when the suction force of the transport robot TR3 is detected to be abnormal in the step STa, it is determined that the suction force of the transport robot TR3 is abnormal, and the processing proceeds to a step STc.

[0087] In the step STc, the position and the inclination of the end effector EE31 with respect to the foreign matter removal device 30, the polishing device 40, and the imaging device 50 of the cleaning station CL are adjusted by the three position gauges 20 and the transport robot TR3.

[0088] In the method MT, next, a step STd is performed. In the step STd, foreign matter attached to the three support members P is removed by the foreign matter removal device 30 and the transport robot TR3. The foreign matter here includes the attached matter attached to the three support members P before polishing in the polishing device 40.

[0089] In the method MT, next, a step STd is performed. In the step STd, foreign matter attached to the three support members P is removed by the foreign matter removal device 30 and the transport robot TR3. The foreign matter here includes the attached matter attached to the three support members P before polishing in the polishing device 40.

[0090] In the method MT, then, step STe is performed. In step STe, an image of the three support members P before polishing by the polishing device 40 is acquired using the imaging device 50 and the transport robot TR3.

[0091] In the method MT, then, step STf is performed. In step STf, the three support members P are polished using the polishing device 40 and the transport robot TR3. In step STf, the judging section 93 sets a polishing condition for polishing the three support members P in the polishing device 40, and the control section 92 controls the transport robot TR3 in accordance with the polishing condition.

[0092] In the method MT, then, step STg is performed. In step STg, foreign matter adhering to the three support members P is removed using the foreign matter removing device 30 and the transport robot TR3. The foreign matter here is adhering matter adhering to the three support members P after polishing in the polishing device 40, and includes fine powder and abrasive grains.

[0093] In the method MT, then, step STh is performed. In step STh, an image of the three support members P after polishing by the polishing device 40 is acquired using the imaging device 50 and the transport robot TR3.

[0094] In the method MT, then, step STi is performed. In step STi, an abnormality in the state of the three support members P is detected on the basis of the image before polishing acquired in step STe and the image after polishing acquired in step STh.

[0095] In the method MT, then, step STj is performed. In step STj, it is judged by the judging section 93 whether or not the state of the three support members P is abnormal. When no abnormality in the state of the three support members P is detected in step STi, it is judged that the state of the three support members P is not abnormal, and the processing is transferred to step STk. On the other hand, when an abnormality in the state of the three support members P is detected in step STi, it is judged that the state of the three support members P is abnormal, and the processing is returned to step STf, and the processing after step STf is performed again.

[0096] In step STk, the pressure reflecting the suction force of the transport robot TR3 to the substrate W is measured using the suction sensor V5, and it is detected on the basis of the measured pressure whether or not the suction force is abnormal.

[0097] In the method MT, next, step STm is performed. In step STm, it is judged by the judging section 93 whether the suction force of the transport robot TR3 is abnormal. When it is not detected in step STk that the suction force of the transport robot TR3 is abnormal, it is judged that the suction force of the transport robot TR3 is not abnormal, and the method MT is ended. On the other hand, when it is detected in step STk that the suction force of the transport robot TR3 is abnormal, it is judged that the suction force of the transport robot TR3 is abnormal, and the processing is transferred to step STn.

[0098] In step STn, it is judged by the judging section 93 whether the removal of foreign matter is further performed by the foreign matter removal device 30 and the transport robot TR3 after step STm. When it is judged that the removal of foreign matter is not further performed by the foreign matter removal device 30 and the transport robot TR3 after step STm, the processing is transferred to step STp. On the other hand, when it is judged that the removal of foreign matter is performed after step STm, the processing is transferred to step STq.

[0099] In step STp, the foreign matter attached to the three support members P is removed by the foreign matter removal device 30 and the transport robot TR3. The foreign matter here is the attached matter to the three support members P after the polishing in the polishing device 40, and is the attached matter after step STg. The processing returns to step STk, and the processing after step STk is performed again.

[0100] In step STq, a warning is issued for the suction force of the transport robot TR3. The warning includes the notification of the abnormality of the suction force of the transport robot TR3. The control section 92 issues the warning by the sound notification of a buzzer not shown, the display of a screen in the display section, and the like. When it is judged in step STb and step STm that the suction force is not abnormal, or when the warning is issued in step STq, the method MT is ended.

[0101] Next, details of the cleaning method performed in the processing system of one illustrative embodiment will be described with reference to Figure 6 Figure 6 is a flowchart of a suction force abnormality detection method performed by the processing system of one illustrative embodiment. Hereinafter, the details of steps STa and STk in the method MT will be described with reference to Figure 6

[0102] ​​The step STa and the step STk include the step S10. In the step S10, the judgment section 93 judges whether or not the substrate W is placed on the end effector EE31. In the step S10, for example, the control section 92 controls the camera CM provided to the end effector EE31 so that the three support members P on the end effector EE31 are imaged. The camera CM notifies the judgment section 93 of the imaged image. The judgment section 93 judges whether or not the substrate W is placed on the three support members P in the notified image. In a case where the substrate W is not included in the image, it is judged that the substrate W is not placed on the end effector EE31, and the process shifts to the step SIl. On the other hand, in a case where the substrate W is included in the image, it is judged that the substrate W is placed on the end effector EE31, and the process shifts to the step S12.

[0103] In the step SIl, the substrate W is handed over to the end effector EE31 by the transport robot TR3. The transport robot TR3 raises the end effector EE31 from the lower area to the upper area with respect to the placement surface 11 of the substrate placement section 10. Thereby, the end effector EE31 supports the substrate W on the three support members P, and lifts the wafer W from the placement surface 11 of the substrate placement section 10, thereby handing over the substrate W from the substrate placement section 10 to the end effector EE31. The process after the step SIl shifts to the step S12.

[0104] In the step S12, the substrate W is sucked. The exhaust device V4 performs suction in each suction hole Vl, each suction path V2, and the exhaust pipe V3. The substrate W is sucked to the three support members P by the suction from each suction hole Vl provided to the three support members P.

[0105] In the step STa and the step STk, then, the step S13 is performed. In the step S13, the pressure reflecting the suction force of the transport robot TR3 is measured by the suction sensor V5. The suction sensor V5 measures the pressure in the exhaust pipe V3 during a set time from the start of the suction in each suction hole Vl, each suction path V2, and the exhaust pipe V3 by the exhaust device V4. The suction sensor V5 notifies the judgment section 93 of the measured pressure.

[0106] In steps STa and STk, then, step S14 is performed. In step S14, it is determined whether or not the suction force of the transport robot TR3 is abnormal. In step S14, first, the determination section 93 detects abnormality of the suction force of the transport robot TR3 by comparing the measured value of the pressure notified in step S13 with a threshold value. The determination section 93 determines that the suction force of the transport robot TR3 is abnormal in a case where the measured value of the pressure is less than the threshold value. In addition, the determination section 93 detects abnormality of the suction force of the transport robot TR3 by comparing the time from when the measured value of the pressure is measured until the measured value of the pressure reaches the threshold value with a set time. The determination section 93 determines that the suction force of the transport robot TR3 is abnormal in a case where the time from when the measured value of the pressure is measured until the measured value of the pressure reaches the threshold value is longer than the set time. When it is determined that the suction force of the transport robot TR3 is abnormal in either of the above two determinations, the processing proceeds to step S15. On the other hand, when it is not determined that the suction force of the transport robot TR3 is abnormal in either of the above two determinations, steps STa and STk end.

[0107] In a case where it is determined that the suction force of the transport robot TR3 is abnormal, in steps STa and STk, then, step S15 is performed. In step S15, the suction of the end effector EE31 to the substrate W is stopped. For example, in a case where the end effector EE31 is not positioned in the region above the substrate placement section 10, the transport robot TR3 transports the substrate W to the region above the substrate placement section 10 in a state where the substrate W is placed on the three support members P. In a case where the end effector EE31 that placed the substrate W is positioned above the substrate placement section 10, the suction of the exhaust device V4 to the suction hole V1, the suction path V2, and the exhaust pipe V3 is stopped. Thus, the suction of the substrate W to the three support members P is stopped.

[0108] In steps STa and STk, then, step S16 is performed. In step S16, the substrate W is handed over from the end effector EE31 to the substrate placement section 10 by the transport robot TR3. The transport robot TR3 that reached the region above the substrate placement section 10 lowers the end effector EE31 downward with respect to the placement surface 11 of the substrate placement section 10. By lowering the end effector EE31, the substrate W is placed on the placement surface 11, and the end effector EE31 is moved downward from the substrate W. Thus, the substrate W is handed over from the end effector EE31 to the substrate placement section 10. When the substrate W is handed over from the end effector EE31 to the substrate placement section 10 in step S16, Figure 6 The steps STa and STk shown as the suction force abnormality detection method end.

[0109] Next, with reference toFigure 7 The details of the cleaning method performed in the processing system of one illustrative embodiment will be described. Figure 7 FIG. 7 is a flowchart of a position adjustment method of an end effector performed by the processing system of one illustrative embodiment. Hereinafter, with reference to FIG. 7, the position adjustment method of the end effector performed by the processing system PS will be described using the case where the processing system PS is used. Figure 7 The details of the step STc in the method MT will be described. In the step STc, the position and the inclination of the end effector EE31 with respect to the foreign matter removing device 30, the polishing device 40, and the imaging device 50 are adjusted.

[0110] The step STc includes a step S20. In the step S20, the three position measurers 20 irradiate the laser light to the placement table 32 of the foreign matter removing device 30. The three position measurers 20 can measure the respective distances from the three position measurers 20 to the placement table 32 of the foreign matter removing device 30 by the irradiation of the laser light. The three position measurers 20 notify the respective distances measured to the judging section 93. The judging section 93 regards the respective distances from the three position measurers 20 to the placement table 32 of the foreign matter removing device 30 as the indexes indicating the inclination of the placement table 32.

[0111] In the step STc, next, a step S21 is performed. In the step S21, the end effector EE31 is moved to the object region 20a of the three position measurers 20 by the transport robot TR3. The transport robot TR3 moves the end effector EE31 to the space above the position measurers 20 so that the three support members P of the end effector EE31 are positioned within the object region 20a.

[0112] In the step STc, next, a step S22 is performed. In the step S22, the three position measurers 20 irradiate the laser light to the end effector EE31. The three position measurers 20 can measure the respective distances from the three position measurers 20 to the end effector EE31 by the irradiation of the laser light. The three position measurers 20 notify the respective distances measured to the judging section 93. The judging section 93 regards the respective distances from the three position measurers 20 to the end effector EE31 as the indexes indicating the inclination of the three support members P.

[0113] In step STc, then, step S23 is performed. In step S23, the inclination of the end effector EE31 is adjusted by the transport robot TR3 so as to coincide with the inclination of the placement table 32 of the foreign matter removing device 30. The placement tables 42 and 47 of the polishing device 40 and the placement table 52 of the photographing device 50 are parallel to the placement table 32 of the foreign matter removing device 30. Therefore, the inclination of the end effector EE31 adjusted to coincide with the inclination of the placement table 32 of the foreign matter removing device 30 in step S23 coincides with the inclination of the placement table 42 of the polishing device 40, the inclination of the placement table 47, and the inclination of the placement table 52 of the photographing device 50. That is, it is possible to move the end effector EE31 to the target position in the same manner as in the case of the foreign matter removing device 30. Figure 5 The step STc is not performed before the steps STe, STf, STg, STh, and STp shown in FIG. 7.

[0114] In step STc, then, step S24 is performed. In step S24, the positions of the three support members P are measured by the three position measuring devices 20. As one example of the position measurement of the three support members P, the three position measuring devices 20 measure the positions of the three marks M. The three position measuring devices 20 each irradiate a laser light ray toward the corresponding respective mark M and receive reflected light. The three position measuring devices 20 each can measure the positional deviation of the respective position measuring device 20 from the respective mark M based on the intensity of the reflected light.

[0115] In step STc, then, step S25 is performed. In step S25, the positions of the three support members P are adjusted by the transport robot TR3. The transport robot TR3 moves the end effector EE31 so that the laser light rays irradiated upward from the three position measuring devices 20 are irradiated to the three marks M of the end effector EE31. That is, the control section 92 moves the end effector EE31 by the transport robot TR3 so that the intensity of the reflected light from the end effector EE31 receiving the light coincides with the intensity of the reflected light from the mark M. Thereby, the three position measuring devices 20 coincide with the positions of the three marks M, and the three support members P are positioned at the target positions.

[0116] In step STc, then, step S26 is performed. In step S26, the end effector EE31 is moved from the object region 20a of the three position measuring devices 20 to another region by the transport robot TR3. For example, the transport robot TR3 moves the end effector EE31 upward so that the transfer to the next step STd is enabled. When the end effector EE31 is moved from the position measured by the three position measuring devices 20 in step S26, Figure 7 The step STc as the position adjustment method shown in FIG. 7 ends.

[0117] Next, the steps STe, STf, STg, STh, and STp shown in FIG. 7 will be described. Figure 8The details of the cleaning method performed in the processing system of one exemplary embodiment will be described. Figure 8 FIG. 8 is a flowchart of a foreign matter removal method performed by the processing system of one exemplary embodiment. Next, with reference to FIG. 8, the details of the cleaning method performed in the processing system PS will be described, using the case of using the processing system PS as an example. Figure 8 The details of the steps STd, STg, STp in the method MT will be described. In the steps STd, STg, STp, the foreign matter adhering to the three support members P is removed.

[0118] The steps STd, STg, STp include a step S30. In the step S30, the end effector EE31 is moved to the target area 30a of the foreign matter removal device 30 by the transport robot TR3. The transport robot TR3 moves the end effector EE31 to a space below the air blowing device 31 of the foreign matter removal device 30 so that the three support members P of the end effector EE31 are located within the target area 30a. The transport robot TR3 moves the end effector EE31 so that the three support members P are located between the blow-off nozzle 34 of the air blowing device 31 and the suction port 37 of the dust collecting device 36a. Further, when the end effector EE31 is moved to a region in which the target area 20a and the target area 30a overlap in the step STc, the step S30 can not be performed in the step STd. In this case, the step S26 can not be performed in the step STc, and the step STc as the position adjustment method can end in the step S25.

[0119] In the steps STd, STg, STp, next, a step S31 is performed. In the step S31, the dust within the target area 30a is sucked by the dust collecting device 36a. The control device CU activates the exhaust device 39 of the dust collecting device 36a to suck the dust within the target area 30a in advance before the step S22. The exhaust device 39 sucks the dust from the suction port 37 while performing suction within the dust collecting pipe 38.

[0120] In the steps STd, STg, STp, next, a step S32 is performed. In the step S32, the foreign matter adhering to the three support members P is removed by the foreign matter removal device 30. The control section 92 controls the foreign matter removal device 30 to activate the air blower 35 of the air blowing device 31, and supply air to the blow-off nozzle 34 via the air blowing pipe 33, so that the three support members P are air blown.

[0121] In steps STd, STg, STp, next, step S33 is performed. In step S33, the end effector EE31 is moved within the object region 30a of the foreign matter removing device 30 by the transport robot TR3. The control section 92 causes the foreign matter to be easily removed from the three support members P by blowing air from various positions. The control section 92 can control the transport robot TR3 so that the end effector EE31 is moved forward, backward, upward, downward, leftward, and rightward with respect to the blow nozzles 34. The control section 92 continues to blow air to the three support members P during and after the movement.

[0122] In steps STd, STg, STp, next, step S34 is performed. In step S34, the removal of the foreign matter adhering to the three support members P by the foreign matter removing device 30 is ended. The control section 92 controls the foreign matter removing device 30 so that the blower 35 of the blow device 31 is stopped from supplying air to the blow nozzles 34 via the blow pipe 33, thereby ending the blowing of air to the three support members P.

[0123] In steps STd, STg, STp, next, step S35 is performed. In step S35, the dust collection within the object region 30a by the dust collecting device 36a is stopped. The control section 92 stops the suction by the exhaust device 39 of the dust collecting device 36a, and stops the suction within the dust collecting pipe 38, thereby ending the process of sucking in dust from the suction port 37.

[0124] In steps STd, STg, STp, next, step S36 is performed. In step S36, the end effector EE31 is moved from the object region 30a of the foreign matter removing device 30 to another region by the transport robot TR3. For example, the transport robot TR3 causes the end effector EE31 to retreat so that it can be transferred to the next step. When the end effector EE31 is moved from the object region 30a in step S36, Figure 8 The steps STd, STg, STp shown as the foreign matter removing method are ended.

[0125] Next, the details of the cleaning method performed in the processing system of one illustrative embodiment will be described with reference to Figure 9 Figure 9 is a flowchart of an image acquisition method performed by the processing system of one illustrative embodiment. Below, the case where the processing system PS is used will be described with reference to Figure 9 The details of step STe in the method MT will be described. In step STe, the pre-polish image of each of the three support members P is acquired before polishing is performed by the polishing device 40.

[0126] ​The step STe includes the step S40. In the step S40, the end effector EE31 is moved to the object region 50a of the photographing device 50 by the transport robot TR3. The transport robot TR3 moves the end effector EE31 to a space below the photographing device 50 so that one of the three support members P of the end effector EE31 is positioned within the object region 50a.

[0127] In the step STe, next, the step S41 is performed. In the step S41, the pre-polishing images of the three support members P are acquired by the photographing device 50. The control section 92 can control the photographing device 50 so that the camera 51 focuses on each of the support members P to take an image of each of the support members P. Thus, the photographing device 50 can acquire the pre-polishing images including the three support members P.

[0128] In the step STe, next, the step S42 is performed. In the step S42, the pre-polishing images acquired by the control section 92 are stored. The control device CU stores the date and time at which the pre-polishing images are acquired together with the pre-polishing images.

[0129] In the step STe, next, the step S43 is performed. In the step S43, the end effector EE31 is moved from the object region 50a of the photographing device 50 to another region by the transport robot TR3. For example, the transport robot TR3 moves the end effector EE31 backward so that the process can be shifted to the next step STf. When the end effector EE31 is moved from the object region 50a of the photographing device 50 in the step S43, Figure 9 The step STe shown as the image acquisition method is ended.

[0130] Further, the details of the step STh in the method MT are also similarly performed. In the step STh, the post-polishing images of the three support members P are acquired after the polishing is performed by the polishing device 40. The step STe and the pre-polishing images are replaced by the step STh and the post-polishing images, respectively, to perform the step STh. In the step S43, for example, the transport robot TR3 moves the end effector EE31 backward so that the process can be shifted to the next step STf or the step STk.

[0131] Next, the details of the cleaning method performed in the processing system of one example embodiment will be described with reference to Figure 10 Figure 10 is a flowchart of a polishing method of a support member performed by the processing system of one example embodiment. Hereinafter, the case where the processing system PS is used will be described with reference to Figure 10 ​Details of the step STf in the method MT are described. In the step STf, the polishing conditions of the polishing device 40 are set in which the three support members P are each polished. The polishing method of the support members P has, for example, a setting step of the polishing conditions including steps S50 to S55, and a polishing step including steps S60 to S64.

[0132] The step STf includes the step S50. In the step S50, the judgment section 93 judges whether the polishing performed in the following step STf is the first polishing for the three support members P. The judgment section 93 judges whether the polishing is performed based on whether the pre-polishing image is acquired in the step STe, for example. When the pre-polishing image is not acquired in the step STe, it is judged that the polishing performed in the following step STf is the first polishing for the three support members P, and the processing is shifted to the step S51. When the pre-polishing image is acquired in the step STe, it is judged that the polishing performed in the following step STf is not the first polishing for the three support members P, and the processing is shifted to the step S52.

[0133] In the step S51, the judgment section 93 sets the polishing conditions to initial conditions. The initial conditions are set in advance. The judgment section 93 sets the selection conditions of the polishing sections, the polishing time conditions, the polishing movement conditions, and the like included in the polishing conditions to the initial conditions. The selection conditions of the polishing sections refer to conditions regarding the polishing of the three support members P in the first polishing section 41, the second polishing section 46, or both the first polishing section 41 and the second polishing section 46. For example, in the initial conditions, it is set that the polishing of the three support members P is performed only in the first polishing section 41. Further, for example, in a case where fine polishing is required, it is possible to set the polishing in the second polishing section 46 as the initial conditions. For example, in a case where the polishing after the first polishing section 41 is required, and then the fine polishing is performed, it is possible to set the polishing in both the first polishing section 41 and the second polishing section 46 as the initial conditions. In addition, the polishing time conditions refer to the time in which the three support members P are positioned in the target region 40a of the polishing device 40. The polishing movement conditions refer to conditions regarding the movement range of the three support members P with respect to the polishing members 43 and 48 of the polishing device 40. The polishing movement conditions include conditions regarding the number of times in which the three support members P are slid in the horizontal direction with respect to the polishing members 43 and 48 of the polishing device 40, and the distance in which the three support members P are brought close to the polishing members 43 and 48 of the polishing device 40.

[0134] In step S52, the polishing interval from the time when the three support members P were last polished to the time when step S52 is performed is calculated by the judging section 93. The judging section 93, for example, acquires the date and time stored in step S42 in step STn together with the post-polishing image, as the time when the three support members P were last polished. The judging section 93, for example, acquires the date and time at which the stored date and time was acquired. The judging section 93 calculates the polishing interval based on the stored date and time and the acquired date and time.

[0135] In step STf, then, step S53 is performed. In step S53, the judging section 93 judges whether or not the calculated polishing interval is the set period or more. The set period is set in advance. In the case where it is judged that the polishing interval is the set period or more, the processing is transferred to step S54. In the case where it is judged that the polishing interval is not the set period or more, the processing is transferred to step S55.

[0136] In the case where it is judged in step S53 that the polishing interval is the set period or more, in step STf, then, step S54 is performed. In step S54, the polishing conditions are set to be the same as the last polishing conditions. By making the polishing conditions the same as the last polishing conditions, the judging section 93 is able to adopt conditions in which the three support members P can be effectively polished, such as the polishing interval being the set period or more.

[0137] In the case where it is judged in step S53 that the polishing interval is not the set period or more, in step STf, then, step S55 is performed. In step S55, the polishing conditions are changed from the last polishing conditions. The judging section 93, for example, in the case where the polishing interval is less than the set period, judges that effective polishing was not performed in the last polishing, and sets the polishing conditions more strongly so that the three support members P can be further polished. By the polishing conditions being set more strongly, for example, it is possible to include the polishing time being set longer as the polishing time condition. By the polishing conditions being set more strongly, for example, it is possible to include the number of times of horizontal direction sliding per unit time of the polishing members 43 and 48 of the polishing device 40 being increased as the polishing movement condition. By the polishing conditions being set more strongly, for example, it is possible to include the distance at which the three support members P are brought close to the polishing members 43 and 48 of the polishing device 40 being shortened as the polishing movement condition. By the polishing conditions being changed from the last polishing conditions to be more strong, the judging section 93 is able to suppress the result from being the same as the last polishing conditions, such as the polishing interval being less than the set period.

[0138] In step STf, after the polishing conditions are set in any one of steps S51, S54, and S55, a polishing step including steps S60 to S64 is performed. In step STf, then, step S60 is performed. In step S60, the transport robot TR3 moves the end effector EE31 to the target region 41a of the first polishing section 41 of the polishing device 40. The transport robot TR3 moves the end effector EE31 to a space below the placement table 42 of the first polishing section 41 so that the three support members P of the end effector EE31 are positioned within the target region 41a. The transport robot TR3 moves the end effector EE31 so that the three support members P are in contact with the lower surfaces of the three polishing members 43 based on the polishing movement conditions of the polishing conditions.

[0139] In step STf, then, step S61 is performed. In step S61, the dust collector 36b sucks in the dust within the target region 41a. The control section 92 activates the exhaust device 39 of the dust collector 36b before step S62 so as to preliminarily suck in the dust within the target region 41a. The exhaust device 39 sucks in the dust from the suction port 37 to the dust collection pipe 38.

[0140] In step STf, then, step S62 is performed. In step S62, the transport robot TR3 slides the three support members P on the end effector EE31 relative to the three polishing members 43. The control section 92 controls the transport robot TR3 so that the three support members P are slid relative to the three polishing members 43 based on the polishing conditions.

[0141] In step STf, then, step S63 is performed. In step S63, the dust collection within the target region 41a by the dust collector 36b is stopped. The control section 92 stops the suction by the exhaust device 39 of the dust collector 36b, and stops the suction within the dust collection pipe 38 so as to end the process of sucking in the dust from the suction port 37.

[0142] In step STf, then, step S64 is performed. In step S64, the transport robot TR3 moves the end effector EE31 from the target region 41a of the first polishing section 41 of the polishing device 40 to another region. For example, the transport robot TR3 moves the end effector EE31 backward so as to enable the transfer to the next step. When the end effector EE31 is moved from the target region 41a in step S64, Figure 10 The step STf of the polishing method as the support member P ends.

[0143] Further, when only the second polishing section 46 is selected in the selection condition of the polishing section of the polishing condition, the description about the first polishing section 41 can be replaced with the description about the second polishing section 46 in the polishing step including steps S60 to S64 described above. When both the first polishing section 41 and the second polishing section 46 are selected in the selection condition of the polishing section of the polishing condition, the description about the first polishing section 41 can be replaced with the description about the second polishing section 46 in the polishing step including steps S60 to S64 described above after step S64 ends.

[0144] Next, details of a cleaning method performed in the processing system of one illustrative embodiment will be described with reference to Figure 11 Figure 11 is a flowchart of an abnormality detection method performed by the processing system of one illustrative embodiment. Next, with reference to Figure 11 Details of the step STi in the method MT will be described. In the step STi, based on the pre-polishing image and the post-polishing image, an abnormality of the state of the three support members P or the like is detected.

[0145] The step STi includes a step S70. In the step S70, at least one damage region of the three support members P in the pre-polishing image is detected by the judging section 93. In the step S70, the judging section 93 detects the damage region of the three support members P in the pre-polishing image. Figure 11 In the step S70, an example in which one damage region is detected in one support member P will be described.

[0146] In the step STi, next, the step S71 is performed. In the step S71, the judging section 93 detects a damage region in an object region in the post-polishing image at the same position as the damage region of the pre-polishing image. The judging section 93 detects the object region in the post-polishing image at the same position as the damage region of the pre-polishing image. The judging section 93 detects a damage region in the object region. The judging section 93 detects a size of the damage region. When no damage region is detected in the object region in the post-polishing image at the same position as the damage region of the pre-polishing image by the judging section 93, the judging section 93 sets the size of the damage region in the object region to 0.

[0147] In the step STi, next, the step S72 is performed. In the step S72, the judging section 93 judges whether or not a difference between the size of the damage region of the pre-polishing image and the size of the damage region in the object region of the post-polishing image is equal to or smaller than a first set difference. The first set difference is set in advance. When the difference is judged to be equal to or smaller than the first set difference, it is judged that no abnormality of the state of the three support members P is detected, Figure 11 The step STi as the abnormality detection method shown in FIG. 8 ends. When the difference is judged not to be equal to or smaller than the first set difference, the processing shifts to the step S73.​

[0148] In step S73, the judging section 93 judges whether or not the difference between the size of the damage area of the pre-polishing image and the size of the damage area within the target area of the post-polishing image is equal to or less than a second set difference. The second set difference is set in advance. In the case where it is judged that the difference is greater than the first set difference and equal to or less than the second set difference, it is indicated that the effect of polishing is exhibited, but it is not enough to eliminate the abnormal state of the three support members P. In the case where it is judged that the difference is equal to or less than the second set difference, the processing is shifted to step S74. In the case where it is judged that the difference is greater than the first set difference and greater than the second set difference, it is indicated that the effect of polishing is not exhibited, and it is likely that an abnormal state occurs in the cleaning station CL or the like. In the case where it is judged that the difference is not equal to or less than the second set difference, the processing is shifted to step S77.

[0149] In step S74, the judging section 93 judges whether or not the number of times of polishing since the method MT is executed is less than a set number. The set number is set in advance. The number of times of polishing since the method MT is executed is, for example, the same as the number of post-polishing images after the date and time at which the most recent pre-polishing image is acquired. Therefore, the judging section 93 acquires the number of post-polishing images as the number of times of polishing. In the case where it is judged that the number of times of polishing is less than the set number, the processing is shifted to step S75. In the case where it is judged that the number of times of polishing is not less than the set number, the processing is shifted to step S77.

[0150] In step S75, it is judged by the judging section 93 that the abnormality of the state of the three support members P is detected. In the case where the abnormality of the state of at least one of the three support members P is detected, the judging section 93 judges that the state of the support member P is not good.

[0151] In step STi, then, step S76 is performed. In step S76, a warning of the meaning that the state of the three support members P is not good is issued by the control section 92. The warning of the meaning that the state of the three support members P is not good is issued by a sound notification of a buzzer which is not shown, and a picture display in the display section, or the like.

[0152] In step S77, the determination unit 93 determines whether the abnormality determination in the method MT is abnormal. The abnormality of the abnormality determination means that the state of the three support members P is determined to be an abnormal state of a prescribed number of times or more due to a setting error of each threshold value of the first set difference, the second set difference, the set number, or the like. In a case where it is determined that the abnormality determination in the method MT is abnormal, the processing proceeds to step S78. There is a case where the state of the three support members P is an abnormal state of a prescribed number of times or more although the abnormality determination is not abnormal. In this case, it can be a state where the transport robot TR3 has become abnormal, such as a case where the transport robot TR3 has not moved the end effector EE31 to the object region set for each component of the cleaning station CL. In a case where it is determined that the abnormality determination in the method MT is not abnormal, the processing proceeds to step S79.

[0153] In step S78, the control unit 92 notifies of the abnormality of the abnormality determination. A warning is given by a sound notification of a buzzer not shown, a screen display in the display unit, or the like. In addition, the warning is given in a different manner from a warning of a meaning that the state of the three support members P is not good. After the warning is given, Figure 11 The step STi as the abnormality detection method shown ends.

[0154] In step S79, the control unit 92 notifies of the abnormality of the transport robot TR3. A warning is given by a sound notification of a buzzer not shown, a screen display in the display unit, or the like. In addition, the warning is given in a different manner from a warning of a meaning that the state of the three support members P is not good and the above-described warning of the abnormality determination. After the warning is given, Figure 11 The step STi as the abnormality detection method shown ends.

[0155] [Summary of Embodiments]

[0156] According to the processing system PS of the embodiment, the at least one support member P on which the substrate W can be placed can be polished by the polishing device 40. Therefore, according to the processing system PS, the support member P that supports the substrate W in the transport robot TR3 can be appropriately cleaned. In addition, the polishing device 40 has a plurality of polishing members 43, 48 corresponding to the plurality of support members P, respectively, and can physically polish the plurality of support members P by the plurality of polishing members 43, 48, respectively. Thus, the polishing device 40 can more effectively polish the plurality of support members P.

[0157] Further, the transport robot TR3 is capable of moving the end effector EE31 to the polishing device 40. The end effector EE31 includes at least one support member P. Therefore, it is possible to move the at least one support member P to the polishing device 40 by the transport robot TR3. According to the processing system PS, it is possible to easily clean the support member P supporting the wafer W in the transport robot TR3.

[0158] Further, in the step STe and the step STh, the imaging device 50 acquires images of the at least one support member P before and after polishing by the polishing device 40 as a pre-polishing image and a post-polishing image of the at least one support member P. In the step STi, the judging section 93 judges whether or not the state of the at least one support member P is good based on the pre-polishing image and the post-polishing image acquired by the imaging device 50. According to the processing system PS, it is possible to appropriately detect a change in the state of the at least one support member P caused by polishing compared to a case where an operator or the like confirms the state of the at least one support member P by visual observation.

[0159] Further, the processing system PS further includes the foreign matter removing device 30 capable of removing foreign matter attached to the at least one support member P. In the step STd, the foreign matter removing device 30 removes foreign matter of the at least one support member P before polishing by the polishing device 40. Therefore, in the step STe, it is possible to suppress the foreign matter from being reflected in the pre-polishing image when the pre-polishing image is acquired. Also, in the step STf, it is possible to suppress the foreign matter from hindering polishing and improve an effect caused by polishing by the polishing device 40. Further, in the step STg, the foreign matter removing device 30 removes foreign matter such as fine powder and abrasive grains from the at least one support member P after polishing by the polishing device 40. Therefore, in the step STh, it is possible to suppress the foreign matter from being reflected in the post-polishing image when the post-polishing image is acquired. In the step STi, it is possible to appropriately detect a damaged area of the at least one support member P and appropriately detect an abnormality in the state of the at least one support member P. Further, in a case where it is judged that the adsorption force is abnormal, in the step STp, the foreign matter removing device 30 removes foreign matter from the at least one support member P. Thereby, it is possible to suppress the adsorption force from being judged to be abnormal due to foreign matter that can be removed by the foreign matter removing device 30.

[0160] The foreign matter removing device 30 has the air supply device 31 and the dust collecting device 36. The foreign matter removing device 30 is capable of removing foreign matter without directly contacting the at least one support member P in the steps STd, STg, and STp.

[0161] Further, in steps S20, S24 of step STc, the at least one position measurer 20 can measure the position and inclination of the at least one support member P with respect to the foreign matter removing device 30, the polishing device 40, and the imaging device 50. In steps S23, S25 of step STc, the transport robot TR3 can adjust the position and inclination of the at least one support member P with respect to the foreign matter removing device 30, the polishing device 40, and the imaging device 50, based on the measured position and inclination of the at least one support member P. In this case, the effects of the removal of foreign matter by the foreign matter removing device 30 in steps STd, STg, STp, and the polishing in step STf can be more appropriately obtained. Further, by adjusting the position and inclination of the at least one support member P with respect to the imaging device 50, the pre-polishing image and the post-polishing image obtained by the imaging device 50 in steps STe and STh can be acquired with stable quality. In this case, for example, the position and inclination of the at least one support member P in the pre-polishing image and the post-polishing image are constant. Therefore, the man-hours required for the position alignment and correction of the at least one support member P in the pre-polishing image and the post-polishing image in step STi can be reduced, the at least one support member P can be easily compared, and the detection of the damage area becomes easy.

[0162] Further, the transport robot TR3 can adsorb the wafer W to the at least one support member P by suction from the suction hole V1 provided in the at least one support member P. The processing system PS includes at least one adsorption sensor V5. In steps STa and STk, the judging section 93 can compare the measured value of the pressure measured by the at least one adsorption sensor V5 with a threshold value, and detect an abnormality in the state of the at least one support member P. When the transport robot TR3 transports the wafer W, the wafer W is adsorbed to the at least one support member P by suction from the suction hole V1, whereby the wafer W can be inhibited from being detached from the end effector EE31. In the case where the measured value of the measured pressure is less than the threshold value, it is likely that the wafer W is not properly adsorbed to the at least one support member P. Therefore, by detecting an abnormality in the state of the at least one support member P based on the measured value of the pressure and the threshold value in steps STa and STk, it is possible to detect early the possibility that the wafer W is not properly adsorbed to the at least one support member P.

[0163] In steps STa and STk, the judging section 93 can detect an abnormality in the state of the at least one support member P by comparing the time from when the pressure measurement value measured by the at least one adsorption sensor V5 is measured until the pressure measurement value reaches the threshold value with the set time. In a case where the time from when the pressure measurement value is measured until the pressure measurement value reaches the threshold value is longer than the set time, it is likely that the substrate W is not adsorbed on the at least one support member P smoothly, and the substrate W cannot be transported smoothly by the transport robot TR3. Therefore, by detecting an abnormality in the state of the at least one support member P based on the time and the set time in steps STa and STk, it is possible to detect early the possibility that the substrate W is not adsorbed on the at least one support member P smoothly.

[0164] In step S76 within step STi, the control section 92 issues a warning in a case where it is judged by the judging section 93 that the state of the at least one support member is not good. Thereby, the processing system PS can cause an operator or the like to recognize an abnormality in the at least one support member P appropriately.

[0165] In addition, in step STf, the control section 92 polishes the at least one support member P in a case where it is judged by the judging section 93 that the state of the at least one support member is not good. An abnormality in the adsorption force of the at least one support member P to the substrate W is detected in step STa, and an abnormality in the at least one support member P is detected in step STi. Step STf is executed after steps STa and STi, and therefore, the at least one support member P in which an abnormality is detected can be polished appropriately.

[0166] In addition, in step STi, the judging section 93 detects an abnormality in the state of the at least one support member P by comparing the difference between the size of the damage region of the pre-polishing image and the size of the damage region within the target region of the post-polishing image with the set difference. Thereby, the judging section 93 can judge whether the state of the at least one support member P is good or not. In this case, as for the damage region in the pre-polishing image, it is possible to evaluate how much the damage region is reduced in the post-polishing image by the removal of foreign matter by the foreign matter removal device 30 in steps STd and STg, and the polishing by the polishing device 40 in step STf. In a case where the damage region is not reduced by a size corresponding to the set difference, the state of the at least one support member P is detected as abnormal, and therefore, it is possible to reduce the damage region of the at least one support member P appropriately.

[0167] Further, the number of the support members P in the transport robot TR3 of the processing system PS is not limited to three. The transport robot TR3 can include one support member P, or two or more support members P. In step STc, the control section 92 can not control the transport robot TR3 so that the end effector EE31 moves to the target position. In this case, the imaging device 50 can image one support member P with the camera 51 in a manner that one image is acquired for one support member P. After imaging the image of one support member P, the control section 92 can move the end effector EE31 with the transport robot TR3 so that the other support member P that is not imaged is positioned directly below the camera 51. The number of the cameras 51 in the imaging device 50 is not limited to one, and three cameras 51 can be included. The imaging device 50 can include two or more cameras 51.

[0168] The number of the blow nozzles 34 in the foreign matter removing device 30 and the number of the polishing members 43, 48 in the polishing device 40 can be set in correspondence with the number of the support members P. In step STf, the transport robot TR3 is shown to slide the three support members P with respect to the polishing members 43, but the polishing device 40 can be controlled to slide with respect to the three support members P.

[0169] The number of the position measurers 20 in the processing system PS is not limited to three. The processing system PS can include one position measurer 20, or two or more position measurers 20. The position and inclination of at least one support member with respect to at least one of the foreign matter removing device 30, the polishing device 40, and the imaging device 50 can be measured with only the position measurer 20. The position and inclination of at least one support member with respect to at least one of the foreign matter removing device 30, the polishing device 40, and the imaging device 50 can be calculated with the control section 92.

[0170] The cleaning device in the processing system PS is not limited to the polishing device 40. The cleaning device can be a device that has a function of cleaning at least one support member P. The processing system PS can include at least one of a polishing device, a plasma irradiation device, a sandblasting device, and a blowing device as the cleaning device. The cleaning device can be the same device as the foreign matter removing device 30.

[0171] The above describes various exemplary embodiments, but is not limited to the above-described exemplary embodiments, and various additions, omissions, substitutions, and changes can be made. Further, elements in different embodiments can be combined to form other embodiments.

[0172] Here, various exemplary embodiments included in the present application are described in the following [E1] to [E16].

[0173] [E1]

[0174] A processing system characterized by comprising:

[0175] An atmospheric transport module capable of transporting a substrate in the atmosphere;

[0176] A transport device provided in the atmospheric transport module and capable of transporting the substrate, having an end effector including at least one support member capable of placing the substrate thereon; and

[0177] A cleaning device capable of cleaning the at least one support member.

[0178] [E2]

[0179] The processing system according to [E1], characterized in that:

[0180] The cleaning device is provided in the atmospheric transport module or connected to the atmospheric transport module,

[0181] The transport device is capable of moving the end effector to the cleaning device.

[0182] [E3]

[0183] The processing system according to [E1] or [E2], characterized by further comprising:

[0184] An imaging device capable of acquiring images of the at least one support member before and after cleaning by the cleaning device as pre-cleaning images and post-cleaning images of the at least one support member; and

[0185] A determination section capable of determining whether the state of the at least one support member is good or not based on the pre-cleaning images and the post-cleaning images acquired by the imaging device.

[0186] [E4]

[0187] The processing system according to any one of [E1] to [E3], characterized by further comprising a foreign matter removing device capable of removing foreign matter attached to the at least one support member.

[0188] [E5]

[0189] The processing system according to [E4], characterized in that:

[0190] The foreign matter removing device has:

[0191] a blowing device capable of removing foreign matter adhering to the at least one support member by blowing,

[0192] a dust collecting device capable of collecting the foreign matter removed by the blowing device.

[0193] [E6]

[0194] The processing system according to any one of [E1] to [E5], wherein:

[0195] further comprising at least one position measurer capable of measuring a position and an inclination of the at least one support member with respect to the cleaning device,

[0196] the conveying device is capable of adjusting at least one of the position and the inclination of the at least one support member with respect to the grinding device, based on the position and the inclination of the at least one support member measured by the at least one position measurer.

[0197] [E7]

[0198] The processing system according to [E3], wherein:

[0199] further comprising at least one position measurer capable of measuring a position and an inclination of the at least one support member with respect to the imaging device,

[0200] the conveying device is capable of adjusting at least one of the position and the inclination of the at least one support member with respect to the imaging device, based on the position and the inclination of the at least one support member measured by the at least one position measurer.

[0201] [E8]

[0202] The processing system according to [E4] or [E5], wherein:

[0203] further comprising at least one position measurer capable of measuring a position and an inclination of the at least one support member with respect to the foreign matter removing device,

[0204] the conveying device is capable of adjusting at least one of the position and the inclination of the at least one support member with respect to the foreign matter removing device, based on the position and the inclination of the at least one support member measured by the at least one position measurer.

[0205] [E9]

[0206] The processing system according to any one of [E1] to [E8], wherein:

[0207] the conveying device is capable of adsorbing the substrate to the at least one support member by suction from a suction hole provided in the at least one support member,

[0208] the processing system further includes:

[0209] at least one pressure measurer capable of measuring a pressure reflecting an adsorbing force of the conveying device; and

[0210] a judging section capable of judging whether or not the state of the at least one support member is good by comparing a measured value of the pressure measured by the at least one pressure measurer with a threshold value.

[0211] [E10]

[0212] The processing system according to any one of [E1] to [E9], wherein:

[0213] the conveying device is capable of adsorbing the substrate to the at least one support member by suction from a hole provided in the at least one support member,

[0214] the processing system further includes:

[0215] at least one pressure measurer capable of measuring a pressure reflecting an adsorbing force of the conveying device; and

[0216] a judging section capable of judging whether or not the state of the at least one support member is good by comparing a time from when the measured value of the pressure is measured until the measured value of the pressure reaches a threshold value with a set time.

[0217] [E11]

[0218] The processing system according to [E9] or [E10], further including a control section capable of issuing a warning in a case where the state of the at least one support member is judged to be not good by the judging section.

[0219] [E12]

[0220] The processing system according to any one of [E9] to [E11], wherein the cleaning device is capable of cleaning the at least one support member in a case where the state of the at least one support member is judged to be not good by the judging section.

[0221] [E13]

[0222] The processing system according to any one of [E9] to [E12], wherein:

[0223] a foreign matter removing device capable of removing foreign matter adhering to the at least one support member,

[0224] The foreign matter removing device is capable of removing foreign matter adhering to the at least one support member in a case where the at least one support member is judged by the judging section to be in a poor state after being cleaned by the cleaning device.

[0225] [E14]

[0226] The processing system according to [E3], wherein the judging section is capable of detecting at least one damaged area of the at least one support member in the pre-cleaning image, and in a case where at least one damaged area is detected in at least one target area in the post-cleaning image at the same position as the at least one damaged area in the pre-cleaning image, the judging section judges whether the at least one support member is in a good state by comparing a difference between a size of the at least one damaged area in the pre-cleaning image and a size of at least one damaged area in the at least one target area in the post-cleaning image with a set difference value.

[0227] [E15]

[0228] The processing system according to [E14], further comprising a control section capable of issuing a warning in a case where the judging section judges that the difference between the size of the at least one damaged area in each of the pre-cleaning image and the post-cleaning image is larger than the set difference value.

[0229] [E16]

[0230] The processing system according to any one of [E1] to [E15], wherein:

[0231] The end effector includes a plurality of support members as the at least one support member,

[0232] The cleaning device has a plurality of polishing members corresponding to the plurality of support members respectively, and is capable of physically polishing the plurality of support members respectively using the plurality of polishing members.

[0233] It should be understood from the above description that various embodiments of the present application are described in the present specification for the purpose of illustration, and various changes can be made without departing from the scope and spirit of the present application. Therefore, the various embodiments disclosed in the present specification are not intended to limit the present application, and the true scope and spirit are represented by the appended claims.

[0234] Explanation of Reference Signs

[0235] 10…substrate placement portion, 20…position measurer, 30…foreign matter removing device, 31…air supply device, 36, 36a, 36b, 36c…dust collecting device, 40…polishing device, 43, 48…polishing member, 50…imaging device, 92…control portion, 93…determination portion, AN…aligner, CL…cleaning station, CU…control device, EE11, EE12, EE21, EE22, EE31…end effector, FK11, FK12, FK21, FK22, FK31…fork, LL1, LL2…load lock module, LM…load module, LP1 to LP4…load port, MT…cleaning method, P…support member, PS…processing system, SR…storage device, TR1, TR2, TR3…transport robot, V1…suction hole, V2…suction path, V3…exhaust pipe, V4…exhaust device, V5…adsorption sensor, W…substrate.

Claims

1. A processing system, characterized in that, include: An atmospheric transport module capable of transporting substrates in the atmosphere; A conveying device, disposed within the atmospheric conveying module, capable of conveying the substrate, has an end effector including at least one support member capable of placing the substrate thereon. and A cleaning device capable of cleaning the at least one support component.

2. The processing system according to claim 1, characterized in that: The cleaning device is installed inside or connected to the air delivery module. The conveying device enables the end effector to be moved to the cleaning device.

3. The processing system according to claim 1 or 2, characterized in that, Also includes: The imaging device is capable of acquiring images of the at least one support component before and after cleaning by the cleaning device, as images of the at least one support component before and after cleaning; and The judgment unit is capable of determining whether the condition of the at least one support component is good based on the pre-cleaning image and the post-cleaning image acquired by the imaging device.

4. The processing system according to claim 1 or 2, characterized in that: It also includes a foreign matter removal device capable of removing foreign matter attached to the at least one support member.

5. The processing system according to claim 4, characterized in that: The foreign matter removal device has: An air supply device capable of removing foreign matter adhering to the at least one support member by supplying air; and A dust collection device that can collect the foreign matter removed by the air supply device.

6. The processing system according to claim 1 or 2, characterized in that: It also includes at least one position measuring device capable of measuring the position and tilt of the at least one support component relative to the cleaning device. The conveying device can adjust the position and tilt of the at least one support member relative to the cleaning device based on the position and tilt of the at least one support member measured by the at least one position measuring device.

7. The processing system according to claim 3, characterized in that: It also includes at least one position measuring device capable of measuring the position and tilt of the at least one support member relative to the imaging device. The conveying device is capable of adjusting at least one of the position and tilt of the at least one support member relative to the shooting device based on the position and tilt of the at least one support member measured by the at least one position measuring device.

8. The processing system according to claim 4, characterized in that: It also includes at least one position measuring device capable of measuring the position and tilt of the at least one support member relative to the foreign object removal device. The conveying device can adjust the position and tilt of the at least one support member relative to the foreign object removal device based on the position and tilt of the at least one support member measured by the at least one position measuring device.

9. The processing system according to claim 1, characterized in that: The conveying device is capable of adsorbing the substrate onto the at least one support member by suction from the suction hole provided on the at least one support member. The processing system also includes: At least one pressure measuring device capable of measuring the pressure reflecting the suction force of the conveying device; and The judgment unit is capable of determining whether the condition of the at least one support component is good by comparing the measured value of the pressure obtained by the at least one pressure measuring device with a threshold.

10. The processing system according to claim 1, characterized in that: The conveying device is capable of adsorbing the substrate onto the at least one support member by suction through a hole provided in the at least one support member. The processing system also includes: At least one pressure measuring device capable of measuring the pressure reflecting the suction force of the conveying device; and The judgment unit is capable of determining whether the condition of the at least one support component is good by comparing the time from when the pressure measured by the at least one pressure measuring instrument to when the pressure reaches a threshold with a set time.

11. The processing system according to claim 9 or 10, characterized in that: It also includes a control unit that can issue a warning if the determination unit determines that the condition of the at least one support component is not good.

12. The processing system according to claim 9 or 10, characterized in that: The cleaning device is capable of cleaning the at least one support member when the determination unit determines that the at least one support member is in poor condition.

13. The processing system according to claim 9 or 10, characterized in that: It also includes a foreign matter removal device capable of removing foreign matter adhering to the at least one support member. The foreign matter removal device can remove foreign matter attached to the at least one support component when the determination unit determines that the at least one support component is in poor condition after the at least one support component has been cleaned by the cleaning device.

14. The processing system according to claim 3, characterized in that: The determination unit can detect at least one damaged area of ​​the at least one support component in the pre-cleaning image. When at least one damaged area is detected in the post-cleaning image in at least one object area at the same position as the at least one damaged area in the pre-cleaning image, the difference between the size of the at least one damaged area in the pre-cleaning image and the size of the at least one damaged area in the at least one object area in the post-cleaning image is compared with a set difference value to determine whether the condition of the at least one support component is good.

15. The processing system according to claim 14, characterized in that: It also includes a control unit that can issue a warning if the determination unit determines that the difference in size between at least one damaged area in each of the pre-cleaning image and the post-cleaning image is greater than a set difference value.

16. The processing system according to claim 1 or 2, characterized in that: The end effector includes multiple support components as the at least one support component. The cleaning device has multiple grinding components corresponding to the multiple support components, and can use the multiple grinding components to physically grind the multiple support components respectively.

Images