Integrated bidirectional four-quadrant switch with driver and input / output circuit

Abstract

The invention discloses an electronic system. The electronic system includes: an electronic package having a base with a plurality of external terminals, and further having an electrically insulating material at least partially encapsulating the base; a controller circuit disposed within the electronic package and referenced to a first ground; a first driver circuit and a second driver circuit disposed within the electronic package and referenced to a second ground, and arranged to receive an isolated control signal from the controller circuit; and a bidirectional switch disposed within the electronic package and referenced to the second ground, and arranged to receive drive signals from the first driver circuit and the second driver circuit. In one aspect, the first driver circuit and the second driver circuit are isolated from the controller circuit via a capacitor, or a magnetic element, or an optical coupler, or a magnetically controlled resistor.

Description

Cross Reference to Related Applications

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 496,915, filed April 18, 2023, entitled “Integrated bidirectional four quadrant switches having drivers and input / output circuits,” which is hereby incorporated by reference in its entirety for all purposes. TECHNICAL FIELD

[0002] The described embodiments relate generally to power converters, and more specifically, the present embodiments relate to integrated bidirectional four quadrant switches having drivers and input / output circuits for use in power converter circuits. BACKGROUND

[0003] Electronic devices such as computers, servers, and televisions employ one or more electrical power conversion circuits to convert one form of electrical energy to another form of electrical energy. Some electrical power conversion circuits use a circuit topology known as a DC-DC converter to convert a high (or low) DC voltage to a lower (or higher) DC voltage. As many electronic devices are sensitive to the size and efficiency of power conversion circuits, new types of power converters can provide relatively higher efficiency and smaller size for new types of electronic devices. SUMMARY

[0004] In some embodiments, an electronic system is disclosed. The electronic system includes an electronic package including a base having a plurality of external terminals, and further including an electrically insulating material at least partially encapsulating the base; a controller circuit disposed within the electronic package and referenced to a first ground; first and second driver circuits disposed within the electronic package and referenced to a second ground, and arranged to receive isolated control signals from the controller circuit; and a bidirectional switch disposed within the electronic package and referenced to the second ground, and arranged to receive drive signals from the first and second driver circuits.

[0005] In some embodiments, the first and second driver circuits are isolated from the controller circuit via a capacitor, a magnetic element, an optocoupler, or a magnetoresistor.

[0006] In some embodiments, the bidirectional switch is a first bidirectional switch, and the first bidirectional switch includes a first gate terminal, a second gate terminal, a first source terminal, and a second source terminal.

[0007] In some embodiments, the first source terminal is coupled to a first external terminal of the plurality of external terminals, and the second source terminal is coupled to a second external terminal of the plurality of external terminals.

[0008] In some embodiments, the bidirectional switch is gallium nitride (GaN) based.

[0009] In some embodiments, the first driver circuit is coupled to the first gate terminal, and the second driver circuit is coupled to the second gate terminal.

[0010] In some embodiments, the first driver circuit is disposed on a first die, the second driver circuit is disposed on a second die, the controller circuit is disposed on a third die, and the bidirectional switch is disposed on a fourth die.

[0011] In some embodiments, the fourth die further includes a sensing device arranged to send a signal to the controller circuit, the signal including at least one of a magnitude and a polarity of a current through the bidirectional switch.

[0012] In some embodiments, the first driver circuit is arranged to send a first drive signal to the first gate terminal in response to receiving a first control signal from the control circuit, and the second driver circuit is arranged to send a second drive signal to the second gate terminal in response to receiving a second control signal from the control circuit.

[0013] In some embodiments, the system further includes a second bidirectional switch and a third bidirectional switch coupled in parallel to the first bidirectional switch.

[0014] In some embodiments, an AC power source referenced to the second ground is coupled between the first source terminal and the second source terminal, and the second bidirectional switch and the third bidirectional switch are arranged to harvest energy from the AC power source for operating the first driver circuit and the second driver circuit.

[0015] In some embodiments, the second bidirectional switch includes a depletion mode (D-mode) section and an enhancement mode (E-mode) section.

[0016] In some embodiments, the second bidirectional switch is coupled in series with an energy harvesting capacitor.

[0017] In some embodiments, the bidirectional switch is arranged to store energy collected from the primary input and use the collected energy to provide power to the first driver circuit and the second driver circuit.

[0018] In some embodiments, the second bidirectional GaN switch is coupled in series with a first energy harvesting capacitor and the third bidirectional GaN switch is coupled in series with a second energy harvesting capacitor.

[0019] In some embodiments, the input / output circuit is electrically isolated from the first driver circuit and the second driver circuit via one or more isolation capacitors.

[0020] In some embodiments, the first driver circuit is disposed on a first die, the second driver circuit is disposed on a second die, the input / output circuit is disposed on a third die, and the first bidirectional GaN switch is disposed on a fourth die.

[0021] In some embodiments, the fourth die further includes a sensing device arranged to send a signal to the input / output circuit, the signal including at least one of a magnitude and a polarity of a current through the first bidirectional GaN switch.

[0022] In some embodiments, the first driver circuit is arranged to send a first drive signal to the first gate terminal in response to receiving a first control signal from the input / output circuit, and the second driver circuit is arranged to send a second drive signal to the second gate terminal in response to receiving a second control signal from the input / output circuit.

[0023] In some embodiments, the second bidirectional GaN switch and the third bidirectional GaN switch are coupled in parallel to the first bidirectional GaN switch.

[0024] In some embodiments, a method of forming an electronic assembly is disclosed. The method includes providing an electronic package including a base having a plurality of external terminals; forming an electrically insulating material at least partially encapsulating the base; disposing a controller circuit within the electronic package, the controller circuit referenced to a first ground; disposing a first driver circuit and a second driver circuit within the electronic package, the first driver circuit and the second driver circuit referenced to a second ground and arranged to receive isolated control signals from the controller circuit; and disposing a bidirectional switch within the electronic package, the bidirectional switch referenced to the second ground and arranged to receive drive signals from the first driver circuit and the second driver circuit.

[0025] In some embodiments, a method of operating a circuit is disclosed. The method includes providing an electronic package including a base having a plurality of external terminals, and further including an electrically insulating material at least partially encapsulating the base; providing an input / output circuit disposed within the electronic package and referenced to a first ground; providing a first driver circuit and a second driver circuit disposed within the electronic package and referenced to a second ground, and arranged to receive isolated control signals from the input / output circuit; providing a bidirectional switch disposed within the electronic package and referenced to the second ground, and arranged to receive drive signals from the first driver circuit and the second driver circuit; receiving input data by the input / output circuit; sending intermediate data corresponding to the input data by the input / output circuit; receiving the intermediate data by the first driver circuit and the second driver circuit; generating output data corresponding to the input data by the first driver circuit and the second driver circuit; and driving the bidirectional switch by the first driver circuit and the second driver circuit with the output data. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1A An integrated bidirectional four quadrant switch with drivers and input / output circuits is shown in accordance with certain embodiments; Figure 1B An integrated bidirectional four quadrant switch with drivers and input / output circuits is shown in accordance with some embodiments, where the drivers have additional connections to the substrate of the bidirectional switch; Figure 2 An integrated half bridge circuit with two bidirectional four quadrant switches with drivers and input / output circuits is shown in accordance with certain embodiments; Figure 3 An integrated bidirectional four quadrant switch with drivers, input / output circuits, and current and voltage sensors is shown in accordance with certain embodiments; Figure 4 An integrated bidirectional four quadrant switch with drivers, current and voltage sensors, and multiple input / output circuits disposed on separate dies is shown in accordance with certain embodiments; Figure 5 An integrated half bridge circuit with two bidirectional four quadrant switches with drivers, current and voltage sensors, and multiple input / output circuits disposed on separate dies is shown in accordance with certain embodiments; Figure 6A1 An integrated bidirectional four quadrant switch with self-powered drivers is shown in accordance with certain embodiments. Figure 6A2An integrated bidirectional four-quadrant switch with a self-powered driver is shown in accordance with some embodiments. Figure 6B Voltage across the bidirectional switch of FIG. 6A is shown as a function of time. Figure 6C Current through the bidirectional switch of FIG. 6A is shown as a function of time. Figure 6D Voltage at certain nodes of the bidirectional switch of FIG. 6A is shown as a function of time; Figure 7 An integrated bidirectional four-quadrant switch is shown in accordance with certain embodiments, similar to Figure 3 the integrated bidirectional switch of FIG. 6A.

[0027] Figures 8A to 8D Input signals and current waveforms for the integrated bidirectional four-quadrant switch of FIG. 6A are shown in accordance with certain embodiments; Figure 7 Figure 9A A simplified partial plan view of an electronic package including a bidirectional switch, first and second driver circuits, and input / output circuits is shown in accordance with embodiments of the present disclosure. Figure 9B A simplified partial plan view of an electronic package including a bidirectional switch, first and second driver circuits, and input / output circuits is shown in accordance with some embodiments of the present disclosure; Figure 10 A simplified partial plan view of an electronic package 1000 including a bidirectional switch, first and second driver circuits, and input / output circuits is shown in accordance with embodiments of the present disclosure. Figure 11A A simplified partial plan view of an electronic package 1100 including a bidirectional switch, first and second driver circuits, and input / output circuits is shown in accordance with embodiments of the present disclosure. Figure 11B A simplified partial cross-sectional view of the electronic package 1100 is shown. Figure 12 A simplified partial plan view of an electronic package 1200 including a bidirectional switch, first and second driver circuits, and input / output circuits is shown in accordance with embodiments of the present disclosure. Figure 13 A simplified partially transparent plan view of an electronic package 1300 in accordance with disclosed embodiments is shown. Figure 14 A simplified cross-section of the electronic package 1300 shown is shown. Figure 13 Figure 15 Steps associated with a method of forming an electronic package in accordance with embodiments of the present disclosure are shown; and Figure 16 ​​A method of forming an electronic package is shown in accordance with embodiments of the present disclosure. DETAILED DESCRIPTION

[0028] The circuits, devices, and related technology disclosed herein generally relate to power converters. More specifically, the circuits, devices, and related technology disclosed herein relate to integrated bidirectional four-quadrant switches with drivers and input / output circuits used in power converter circuits. In some embodiments, a bidirectional switch capable of operating in four operating quadrants can be integrated with a driver and input / output circuit within one semiconductor package. In various embodiments, the bidirectional switch can be a gallium nitride (GaN)-based switch having two gate terminals and two source terminals. In some embodiments, the source terminals can float during operation and the gate terminals can float during operation, thus the driver circuit can be arranged to operate with respect to the floating nodes. In various embodiments, the electronic package can include a base with a plurality of external terminals, and further include an electrically insulating material at least partially encapsulating the base. The electronic package can further include a controller circuit disposed within the electronic package and referenced to a first ground, and first and second driver circuits disposed within the electronic package and referenced to a second ground and a third ground, and arranged to receive isolated control signals from the controller. The electronic package can further include a bidirectional switch disposed within the electronic package and referenced to the second ground and the third ground, and arranged to receive drive signals from the first and second driver circuits. In some elements, the controller circuit can include an input / output circuit.

[0029] In various embodiments, the driver circuits can be coupled to the gate terminals of the bidirectional switch, where the driver circuits are galvanically isolated from the input / output circuit. In this manner, the integrated bidirectional switch can enable the use of input digital signals referenced to a ground that provide control signals to the integrated bidirectional switch. Further, the integrated bidirectional switch can be used for various applications, such as but not limited to power conversion circuits of relatively high power. In some embodiments, the semiconductor package for the integrated bidirectional switch can include the bidirectional switch disposed on a first die, the first driver circuit disposed on a second die, the second driver circuit disposed on a third die, and the input / output circuit disposed on a fourth die. In various embodiments, the first die can be GaN-based, and the second, third, and fourth dies can be silicon (Si)-based. In some embodiments, the first, second, third, and fourth dies can be GaN-based.

[0030] In some embodiments, the gate terminals of the bidirectional switches can be independently driven, such that an independent drive scheme can be used to drive each gate terminal with its corresponding source terminal as a reference, where each of the source terminals can be at a highly different voltage potential. The bidirectional switches and the driver circuit for each gate terminal can be isolated from each other and from the input / output circuit. In various embodiments, the isolation can be implemented by capacitors, magnetic elements, optocouplers, or magnetoresistors. In some embodiments, an isolation capacitor can be used to provide isolation between the controller and the driver / bidirectional switches. In various embodiments, the capacitor can be a high voltage capacitor. In some embodiments, the isolation capacitor can include two series connected capacitors, where one capacitor can be disposed on a die including the input / output (control) circuit and the other capacitor can be disposed on a die including the driver circuit. In various embodiments, the isolation capacitor can be entirely disposed on a die including the driver circuit. In some embodiments, the isolation capacitor can include multiple cross-coupled capacitors. In various embodiments, the multiple cross-coupled capacitors can include high voltage common centroid layout capacitors. In some embodiments, the multiple capacitors can be arranged in a non-cross-coupled configuration. In various embodiments, the electronic package can include one or more mismatch compensation capacitors. In some embodiments, the multiple cross-coupled capacitors can be formed from a conductive semiconductor layer.

[0031] In some embodiments, an integrated half-bridge circuit can include two bidirectional switches coupled in series to form a half-bridge circuit with drivers and input / output circuits integrated within a single semiconductor package. In various embodiments, a voltage sensing circuit can be included in the integrated bidirectional switches such that the voltage potential between the high-side driver and the low-side driver can be detected and fed back to the common packaged drivers, input / output circuits, and controller. The detected voltage potential can then be used to control the conduction state of the bidirectional switches and / or sent to the microcontroller.

[0032] In various embodiments, the input / output circuit can be split into two circuits disposed on two independent dies within the integrated bidirectional switch package. This can be done in some applications, such as industrial applications, where the integrated bidirectional switch complies with functional safety regulations. These applications can have a relatively high safety level, so redundancy can be used for these safety critical functions, particularly for shutting down devices to protect them. Thus, two input / output circuits on two independent dies can be used in order to provide backup and reliability.

[0033] In some embodiments, an integrated bidirectional switch can include multiple parallel connected bidirectional switches arranged to self-power a high-side driver. Current methods of providing power to an isolated high-side driver can be cumbersome as schemes such as bootstrap can not work due to the use of isolation. Embodiments disclosed by the present disclosure enable the use of self-powering of an isolated high-side driver, thereby reducing system complexity and saving system cost. In various embodiments, the disclosed self-powering techniques can be used to provide power to a low-side driver and / or an input / output circuit.

[0034] In various embodiments, current flowing in a bidirectional switch can be sensed and this information can be used to autonomously drive the gate terminal of the bidirectional switch. In some embodiments, information from the sensed current can be used to improve the turn-off behavior of the switch, improve the soft turn-off of the switch, and improve the soft turn-on of the switch, and cause the bidirectional switch to perform functions that can have otherwise been performed in a microcontroller. Various inventive embodiments are described herein, including methods, processes, systems, apparatuses, and the like.

[0035] Several illustrative embodiments will now be described, by way of example, with reference to the accompanying drawings, which are formed a part of this specification. The ensuing description provides exemplary embodiments only, and is not intended to limit the scope, applicability or configuration of the disclosure. Rather, the ensuing description of the exemplary embodiments will provide those skilled in the art with an enabling description that can be employed in conjunction with the appended claims. It will be appreciated that various modifications can be made to the embodiments described herein without departing from the spirit and scope of the disclosure. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of certain inventive embodiments. It will be apparent, however, that various embodiments can be practiced without these specific details. In other instances, well-known structures and functions have not been described in detail in order to avoid obscuring the understanding of this description. The drawings and description are not intended to be limiting. The word “example” or “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any embodiment or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments or designs.

[0036] Integrated bidirectional switch Figure 1A An integrated bidirectional four-quadrant switch with driver and input / output circuit is shown in accordance with certain embodiments. The integrated bidirectional four-quadrant switch with driver and input / output circuit can also be referred to as an integrated bidirectional switch. In some embodiments, the input / output circuit can include a controller circuit. Figure 1AAn integrated bidirectional four-quadrant switch 100 with drivers and input / output circuitry is shown, which can include a bidirectional switch 102. The bidirectional switch 102 can include a first source terminal 104, a first gate terminal 106, a drain terminal 108, a second source terminal 110, a second gate terminal 112, and a connection to a substrate 114. The bidirectional switch 102 can be disposed on a first die 116. In some embodiments, the first die can be GaN-based.

[0037] A bidirectional switch can have the advantage of being able to operate in four quadrants of operation of a transistor, i.e., it can block voltage in two directions and current can flow in both directions in the switch. This can be useful in power converter applications where current can flow in either direction, e.g., when a freewheeling condition occurs in a power converter, a bidirectional switch can allow freewheeling current to flow from its source terminal to its drain terminal with a relatively small voltage drop across its source to drain terminals. The characteristics of a bidirectional switch can be particularly useful in GaN-based switches, which can not include a freewheeling diode, or which can have a relatively large voltage drop when freewheeling current flows through the freewheeling diode. Using a bidirectional switch that is capable of four-quadrant operation can improve the power efficiency of a power converter. In addition, a bidirectional switch can have blocking properties in both directions.

[0038] Current methods of forming a bidirectional switch by coupling two devices back-to-back in series can use a relatively large die area and have a relatively high series resistance, as the total resistance can be twice the resistance of each back-to-back device in series. And since there are two switches, the die area consumed can be twice that of a single switch. Therefore, the specific on-resistance (RSP) can be increased by a factor of four compared to a unidirectional switch. Using a GaN-based lateral bidirectional switch can reduce the RSP of a power switch, e.g., the RSP of a GaN-based directional switch can be 1.2 times that of a unidirectional switch. This is almost a four-fold improvement compared to back-to-back devices. Therefore, the area efficiency of a GaN-based lateral bidirectional switch can be almost as good as a unidirectional switch. A GaN-based lateral bidirectional switch can include two source terminals, two gate terminals, and a common drain.

[0039] The bidirectional switch can have its gate voltage precisely controlled for efficient operation. In addition, the voltage at the terminals of the bidirectional switch can be monitored for reliable operation of the bidirectional switch. Embodiments of the present disclosure enable integration of the bidirectional switch with associated drivers and input / output circuitry in a single semiconductor package for providing precise control of the bidirectional switch and reliable operation of the bidirectional switch. In addition, embodiments of the present disclosure enable precise control of the voltage levels at the terminals of the bidirectional switch, where the bidirectional switch operates in an isolated high-side configuration. Thus, the integrated bidirectional switch can operate reliably and efficiently, thereby saving system cost. Current approaches can use a relatively large number of external components, which can result in relatively high system cost and reduced reliability.

[0040] The integrated bidirectional switch 100 can also include a second die 120 having a first driver 124 and a third die 122 having a second driver 126. The first driver 124 can be coupled to the first gate terminal 106, and the second driver 126 can be coupled to the second gate terminal 112. The first source terminal 104 can be connected to a pin source high (SH), and the second source terminal 110 can be connected to a pin source low (SL). The integrated bidirectional switch 100 can also include a fourth die 118 having input / output circuitry 128. The input / output circuitry 128 can be coupled to the first driver 124 and the second driver 126 via differential isolation capacitors 130 and 132, respectively. In some embodiments, the differential isolation capacitor 130 can be formed from series connected capacitors, where one capacitor can be disposed on the second die 120 and the other capacitor can be disposed on the fourth die 118. In various embodiments, the differential isolation capacitor 132 can be formed from series connected capacitors, where one capacitor can be disposed on the third die 122 and the other capacitor can be disposed on the fourth die 118.

[0041] The integrated bidirectional switch 100 can be formed in a single semiconductor package including the first, second, third, and fourth dies. The dies can be electrically isolated from one another, thereby allowing control of the conduction state of the bidirectional switch with input signals referenced to independent ground levels. The single semiconductor package can be a quad flat no-lead (QFN), small outline integrated circuit package (SOIC), dual in-line package (DIP), or any other suitable semiconductor package.

[0042] The input / output circuit 128 can include I / O pins (pins D1 / D2 / SGND) for driver circuitry to isolate the power supply, pins (pins VDD, INH, INL, SGND) for signal input and control logic, and pins (pin TEMP) for temperature sensor and signal output. Temperature can be sensed and the sensed information can be provided to external circuitry. The input / output circuit 128 can also include transmitter circuitry for transmitting drive signals across the isolation capacitors 130 and 132 to the first and second drivers, respectively. The first and second drivers 124 and 126 can include receiver circuitry for receiving drive signals from the input / output circuit 128, respectively. The first and second drivers 124 and 126 can also include voltage regulators and driver circuitry (pins VDDH / L, VDD6H / L, GNDH / L) for driving the first and second gate terminals 106 and 112, respectively. The voltage regulators can be used to adjust the drive voltage to the gates of the bidirectional switch. The first and second drivers 124 and 126 can also include sensor circuitry for sensing the voltage potential across the terminals of the bidirectional switch 102 and / or sensing the current flowing in the bidirectional switch 102. The sensed voltage and / or current can be used to provide overvoltage and overcurrent protection.

[0043] When the INH signal goes high, the input / output circuit 128 can transmit a high signal across the isolation capacitor 130 to the first driver 124. The first driver 124 can receive the INH signal and cause the voltage at the first gate terminal 106 to go high, thereby causing the high side of the bidirectional switch 102 to turn on. When the INL signal goes high, the input / output circuit 128 can transmit a high signal across the isolation capacitor 132 to the second driver 126. The second driver 126 can receive the INL signal and cause the voltage at the second gate terminal 112 to go high, thereby causing the low side of the bidirectional switch 102 to turn on. When both the high side and the low side of the bidirectional switch 102 are turned on, current can flow from the first source terminal 104 to the second source terminal 110, or vice versa, depending on the voltage potential at these source terminals. When both the INH signal or the INL signal are low, no current flows in the bidirectional switch 102 and the bidirectional switch is in blocking mode of operation. In some embodiments, there can be only one control input (VIN) that can drive both outputs to turn on or off.

[0044] Figure 1B An integrated bidirectional four-quadrant switch with drivers and input / output circuit is shown in accordance with some embodiments. Figure 1BAn integrated bidirectional four-quadrant switch 170 with driver and input / output circuitry is shown, which is similar to the integrated bidirectional four-quadrant switch 100 of FIG. 1 with driver and input / output circuitry, except that the driver circuitry 124 and 126 can be coupled to the substrate 114. In the embodiment shown, the co-packaged driver can contain circuitry to detect the state of the bidirectional switch and control the substrate potential accordingly. The substrate potential can control the back-gating effect in the GaN power transistor, which can cause the on-resistance of the bidirectional switch to vary. The gate driver circuitry can use this connection to sense the substrate voltage, and can control the voltage of the substrate and the charge state of the substrate according to the sensed substrate voltage. The gate driver circuitry can also control the desired state of the bidirectional switch. In some environments, the gate driver circuitry can use other parameters, such as but not limited to the operating temperature, the magnitude and / or polarity of the current in the bidirectional switch, and the voltage across the switch. The substrate connection can be driven with a positive or negative voltage, current, or current pulse corresponding to the charge that needs to be injected to control the potential to the desired level. The voltage or current or current pulse level and length can vary between different switching cycles, or within one switching cycle. The gate driver circuitry can use the substrate potential control to reduce the on-resistance variation due to back-gating, and can also use it to temporarily increase the on-resistance in certain situations, including but not limited to suppressing ringing or heating the bidirectional switch in case of low operating temperature.

[0045] Integrated half bridge with two bidirectional switches Figure 2 An integrated half-bridge circuit with two bidirectional four-quadrant switches with driver and input / output circuitry is shown, in accordance with certain embodiments. Figure 2 An integrated half-bridge circuit 200 with two bidirectional switches is shown, which are coupled in series, forming a half-bridge. The integrated half-bridge circuit 200 can include a first bidirectional switch 202 and a second bidirectional switch 204, where the first bidirectional switch 202 is coupled in series to the second bidirectional switch 204 at a switching node 250. The first bidirectional switch 202 can be disposed on a first die 206, and the second bidirectional switch 204 can be disposed on a second die 208. In some embodiments, the first bidirectional switch 202 and the second bidirectional switch 204 can be disposed on the same die. In various embodiments, the first die 206 and the second die 208 can be GaN-based, respectively.

[0046] The integrated half bridge circuit 200 can also include a third die 210 with a first driver 220, a fourth die 212 with a second driver 222, a fifth die 214 with a third driver 224, and a sixth die 216 with a fourth driver 226. The first driver 220 can be coupled to a first gate terminal of the first bidirectional switch 202, and the second driver 222 can be coupled to a second gate terminal of the first bidirectional switch 202. The third driver 224 can be coupled to a first gate terminal of the second bidirectional switch 204, and the fourth driver 226 can be coupled to a second gate terminal of the second bidirectional switch 204. The integrated half bridge circuit 200 can also include a seventh die 228 with an input / output circuit 218. The input / output circuit 218 can be coupled to the first driver, the second driver, the third driver, and the fourth driver via differential isolation capacitors.

[0047] The integrated half bridge circuit 200 can be formed in a single semiconductor package including the first die, the second die, the third die, the fourth die, the fifth die, the sixth die, and the seventh die. The single semiconductor package can be a quad flat no-lead (QFN), small outline integrated circuit package (SOIC), dual in-line package (DIP), or any other suitable semiconductor package.

[0048] The input / output circuit 218 can include I / O pins (pins Dl, D2, SGND) for isolating driver circuitry of the power supply, pins (pins VDD, INH, INL, SGND) for signal input and control logic, and pins (pin TEMP) for temperature sensor and signal output. The input / output circuit 218 can also include transmitter circuitry for sending drive signals across isolation capacitors to the first driver through the fourth driver. The first driver 220 through the fourth driver 226 can each include receiver circuitry for receiving drive signals from the input / output circuit 218. They can also include voltage regulators and driver circuitry (pins VDDH / L / M, VDD6H / L / M, GNDH / L / M) for driving gate terminals of the first bidirectional switch 202 and the second bidirectional switch 204, respectively. The second driver 222 and the third driver 224 can share the same source connection (SM). The power supply nodes and ground nodes of the second driver and the third driver can be referred to as VDDM, VDD6M, GNDM, where M stands for middle, as it is located in the middle of the half bridge. The first driver through the fourth driver can also include sensor circuitry for sensing voltage potentials across terminals of the first bidirectional switch 202 and the second bidirectional switch 204, and / or for sensing currents flowing in the first bidirectional switch 202 and the second bidirectional switch 204, respectively.

[0049] When the INH signal goes high, the input / output circuit 218 can send a high signal across the isolation capacitor to the first driver 220 and the second driver 222, respectively. The first and second drivers can receive the INH signal and cause the voltage at the first and second gate terminals of the first bidirectional switch 202 to go high, thereby causing the first bidirectional switch 202 to turn on. As a result, the switch node 250 can be pulled to the voltage of the high side. When the INL signal goes high, the input / output circuit 218 can send a high signal across the isolation capacitor to the third driver 224 and the fourth driver 226, respectively. The third and fourth drivers can receive the INL signal and cause the voltage at the first and second gate terminals of the second bidirectional switch 204 to go high, thereby causing the second bidirectional switch 204 to turn on, and as a result, the voltage at the switch node 250 can become the voltage of the low side. In some embodiments, when the gate drivers continuously perceive the voltage polarity across each bidirectional switch, the drivers driving the sections of the bidirectional switches that operate in reverse current can continuously remain on, rather than switching like the other section of the bidirectional switch that is GaN. This can reduce the dynamic current consumption of one of the drivers. The drivers can be arranged to determine for themselves whether to remain on as needed, regardless of the state of the input control signals. In this way, the drivers can determine the operating state and take corresponding actions. For example, to limit dynamic current consumption, when 220 and 222 determine the voltage polarity, the integrated half-bridge circuit 200 can be arranged to keep one of the switches (the one that, for a given polarity, passes in the opposite direction anyway) always on, and only control the turn-on / turn-off of the other switch. In various embodiments, this logic can be integrated in each of the drivers 220 and 222 (and / or for the drivers 224 and 226).

[0050] In some embodiments, such as in applications where the input and output power of the converter can be delivered by current rather than voltage, embodiments of the present disclosure enable independent control of the turn-on and turn-off of the two bidirectional switches. Thus, by turning on the bidirectional switch 202 and simultaneously keeping the bidirectional switch 204 off, the input current can be directed to the output. When the bidirectional switch 204 is turned on, the current commutates from the load and returns directly to the input. This mode of operation is also referred to as a “current source inverter”.

[0051] In various embodiments, an input power source can be connected to terminal SH of bidirectional switch 202, and another input power source can be connected to terminal SL of bidirectional switch 204. A load can be connected to terminal SM. In this arrangement, power for the load can be selected from either input, enabling operation in applications where failure of a power source is not allowed to occur with redundant power sources. For example, if one power input is not available, the corresponding bidirectional switch can be turned off and the power source repaired or replaced, while the load continues to be powered by the other power source that is still operational. Some example applications are, but are not limited to, where one power source can consist of a battery, and another power input can come from a power grid, enabling continuous operation even if the grid power fluctuates or is interrupted.

[0052] Integrated bidirectional switch with sensor Figure 3 An integrated bidirectional four-quadrant switch with drivers, input / output circuitry, and current and voltage sensors is shown in accordance with certain embodiments. Figure 3 An integrated bidirectional switch 300 that can include a bidirectional switch 302 is shown. Bidirectional switch 302 can include a first source terminal 304, a first gate terminal 306, a drain terminal 308, a second source terminal 310, a second gate terminal 312, and a first substrate connection 314. Bidirectional switch 302 can be disposed on a first die 316. In some embodiments, the first die can be GaN-based.

[0053] Integrated bidirectional switch 300 can also include a second die 320 with a first driver 328 and a first sensing circuit 321. Integrated bidirectional switch 300 can also include a third die 322 with a second driver 330 and a second sensing circuit 323. First driver 328 can be coupled to first gate terminal 306. In some embodiments, gate driver 328 can be coupled to substrate connection 314 and can be arranged to control the voltage of the substrate, for example, to clamp the substrate voltage when a stray or overvoltage condition exists in the substrate. First sensing circuit 321 can be coupled to first source terminal 304 through connection 324 and can be arranged to sense the state of the voltage at source terminal 304, and can be further arranged to sense the operating state of the directional switch (e.g., the segment to which 328 is connected), for example, to sense the polarity and magnitude of the current in bidirectional switch 302. In some embodiments, first sensing circuit 321 can also be arranged to sense the operating temperature of the bidirectional switch.

[0054] The second driver 330 can be coupled to the second gate terminal 312. In some embodiments, the gate driver 330 can be coupled to the substrate connection 314 and can be arranged to control the voltage of the substrate, for example, to clamp the substrate voltage when a stray or overvoltage condition exists in the substrate. The second sensing circuit 323 can be coupled to the second source terminal 310 through the connection 326 and can be arranged to sense the state of the voltage at the source terminal 310 and can be further arranged to sense the operating state of the directional switch (e.g., the section to which the 330 is connected), for example, to sense the polarity and magnitude of the current in the directional switch 302. In some embodiments, the second sensing circuit 323 can also be arranged to sense the operating temperature of the bidirectional switch. The first source terminal 304 can be connected to the pin source high (SH) and the second source terminal 310 can be connected to the pin source low (SL). In some embodiments, the gate driver circuit can use operating parameters of the bidirectional switch, such as, but not limited to, the operating temperature, the magnitude and / or polarity of the current in the bidirectional switch, and the voltage across the switch.

[0055] The integrated bidirectional switch 300 can also include a fourth die 318 having an input / output circuit 329. In some embodiments, the input / output circuit 329 can include a control circuit. The input / output circuit 329 can be coupled to the first driver 328 and the first sensing circuit 321 via differential isolation capacitors 332, respectively. The input / output circuit 329 can also be coupled to the second driver 330 and the second sensing circuit 323 via differential isolation capacitors 334, respectively. In some embodiments, the differential isolation capacitors 332 can be formed from series connected capacitors, where one capacitor can be disposed on the third die 322 and the other capacitor can be disposed on the fourth die 318.

[0056] The integrated bidirectional switch 300 can be formed in a single semiconductor package including the first, second, third, and fourth dies. The dies can be electrically isolated from one another, allowing the conduction state of the bidirectional switch to be controlled with input signals referenced to independent ground levels. The single semiconductor package can be a quad flat no-lead (QFN), small outline integrated circuit package (SOIC), dual in-line package (DIP), or any other suitable semiconductor package.

[0057] The input / output circuit 329 can include I / O pins (pins D1 / D2 / SGND) for driver circuitry to isolate the power supply, pins (pins VDD, INH, INL, SGND) for signal input and control logic, and pins (pins SENSE) for receiver circuitry of current and voltage signals from the secondary side. The input / output circuit 329 can also include transmitter circuitry for transmitting drive signals across the isolation capacitors 332 and 334 to the first and second drivers, respectively. The first and second drivers 328 and 330 can include receiver circuitry for receiving drive signals from the input / output circuit 329. The first and second drivers 328 and 330 can also include voltage regulators and driver circuitry (pins VDDH / L, VDD6H / L, GNDH / L) for driving the first and second gate terminals 306 and 312, respectively. The voltage regulators can be used to adjust the drive voltage of the gates of the bidirectional switch. The first and second sensing circuits 321 and 323 can include sensor circuitry for sensing the voltage at the terminals of the bidirectional switch 302 and / or sensing the current flowing in the bidirectional switch 302.

[0058] The first and second sensing circuits 321 and 323 can also include analog-to-digital (A / D) conversion circuitry and transmitter circuitry for transmitting signals corresponding to the sensed voltages and currents to the input / output circuit. The signals corresponding to the sensed currents / voltages can be used for autonomous control of the bidirectional switch 302. The signals corresponding to the sensed voltages and currents can be transmitted by the input / output circuit to an external microcontroller. The signals corresponding to the sensed currents / voltages can be transmitted by the input / output circuit using multiple pins or using a single pin in which data is multiplexed. The signals corresponding to the sensed currents can be used to detect when the current crosses zero from positive to negative flow and / or from negative to positive flow. The input / output circuit signals can be arranged to receive turn-on or turn-off signals and transmit the turn-on or turn-off signals to the driver when a relatively low voltage or current is sensed in the bidirectional switch 302 (self-resonant operation).

[0059] Self-resonant operation can be where, in quasi-resonant power supply applications, the resonant nature of the load in combination with additional passive components can be used to achieve turn-on or turn-off of the power supply switch when the voltage or current across the switch is low or zero. Doing so can reduce switching losses, and is sometimes referred to as soft switching. In contrast, switching at high voltage or current levels (also referred to as hard switching) can generate relatively high switching losses, and can place a higher stress level on the power supply switch. In some embodiments, voltage and current can be sensed, which enables precise determination of the voltage and current across the bidirectional switch local to the driver circuit. The sensed voltage and / or current can be used to adjust the precise switching timing to turn on or turn off at the right moment without intervention of a microcontroller. Since the signals are available local to the driver, they can not have to be sent through an isolated signal transmission, followed by connection to a system controller, and experience processing delays in the controller due to limited computing power. Thus, the switching action can be signaled by the controller, but the exact timing can be determined by the driver, resulting in lower losses and EMI emissions.

[0060] The input / output circuit can also be arranged to turn on the bidirectional switch when a relatively high voltage is sensed across the bidirectional switch 302 in either direction. The turn-on time can last for a predetermined time and pulse length, or until the voltage or current in the bidirectional switch 302 has reached a relatively low level (auto-clamp).

[0061] When the INH signal goes high, the input / output circuit 329 can send a high signal across the isolation capacitor 332 to the driver 328. The driver 328 can receive the INH signal and cause the voltage at the first gate terminal 306 to go high, thereby causing the high side of the bidirectional switch 302 to turn on. When the INL signal goes high, the input / output circuit 329 can send a high signal across the isolation capacitor 334 to the second driver 330. The second driver 330 can receive the INL signal and cause the voltage at the second gate terminal 312 to go high, thereby causing the low side of the bidirectional switch to turn on. When both the high side and the low side of the bidirectional switch 302 are turned on, current can flow from the first source terminal 304 to the second source terminal 310, or vice versa, depending on the voltage potential at these source terminals. When either the INH signal or the INL signal is low, no current flows in the bidirectional switch 102, and the bidirectional switch is in a blocking mode of operation.

[0062] Integrated bidirectional switch with multiple input / output circuits Figure 4 An integrated bidirectional four-quadrant switch with drivers, current and voltage sensors, and multiple input / output circuits disposed on a standalone die is shown in accordance with certain embodiments. Figure 4An integrated bidirectional switch 400 is shown that is similar to the integrated bidirectional switch 300, except that there are two input / output circuits provided on separate dies. The integrated bidirectional switch 400 can include a bidirectional switch 402. The bidirectional switch 402 can be provided on a first die 404. In some embodiments, the first die can be GaN-based.

[0063] The integrated bidirectional switch 400 can also include a second die 420 having a first driver and a first sense circuit. The integrated bidirectional switch 400 can also include a third die 422 having a second driver and a second sense circuit. The integrated bidirectional switch 400 can also include a fourth die 418 having a first input / output circuit 428 and a fifth die 426 having a second input / output circuit 438. The first input / output circuit 428 can be coupled to the first driver and the first sense circuit via differential isolation capacitors, respectively, and the second input / output circuit 438 can be coupled to the second driver and the second sense circuit via differential isolation capacitors, respectively. The use of two independent input / output circuits on two separate dies provided within an integrated bidirectional switch package can enable some applications, such as industrial applications, where the integrated bidirectional switch complies with functional safety regulations. These applications can have a safety integrity level (SIL), such as, for example, SIL 3 or SIL 4. SIL is defined as the relative level of risk reduction provided by a safety function. Thus, redundancy is used for these safety-critical functions, particularly shutdown devices to protect them. Thus, the two input / output circuits on two separate dies are used to provide control and monitoring redundancy of the bidirectional switch in order to meet safety-critical functions.

[0064] The integrated bidirectional switch 400 can be formed in a single semiconductor package that includes the first die, the second die, the third die, the fourth die, and the fifth die. These dies can be electrically isolated from one another, thereby allowing the conduction state of the bidirectional switch to be controlled with input signals referenced to independent ground levels. The single semiconductor package can be a quad flat no-lead (QFN), small outline integrated circuit package (SOIC), dual in-line package (DIP), or any other suitable semiconductor package.

[0065] The first and second input / output circuits 428 and 438 can include independent control circuits, signal inputs and control logic (pins VDD, INH, INL, SGND) for both sides of the bidirectional switch 402, and receiver circuits for status signals (FBH, FBL). The first and second input / output circuits 428 and 438 can also include transmitter circuits for sending drive signals to the first and second drivers across the isolation capacitors. The first and second drivers can include receiver circuits for receiving drive signals from the first and second input / output circuits 428 and 438, respectively. The first and second drivers can also include voltage regulators and driver circuits for driving the gate terminals of the bidirectional switch 402. The voltage regulators can be used to adjust the drive voltage to the gate of the bidirectional switch. The first and second sensing circuits can include sensor circuits for sensing the voltage at the terminals of the bidirectional switch 402 and / or sensing the current flowing in the bidirectional switch 402.

[0066] The first and second sensing circuits can also include analog-to-digital (A / D) conversion circuits and transmitter circuitry for sending signals corresponding to the sensed voltages and currents to the input / output circuits. The signals corresponding to the sensed currents / voltages can be used for autonomous control of the bidirectional switch 402. The signals corresponding to the sensed voltages and currents can be sent by the input / output circuits to an external microcontroller. The signals corresponding to the sensed currents / voltages can be sent by the input / output circuits using multiple pins, or a single pin in which the data is multiplexed. The signals corresponding to the sensed currents can be used to detect when the current crosses zero from positive to negative flow and / or from negative to positive flow. The input / output circuit signals can be arranged to receive turn-on or turn-off signals and send the turn-on or turn-off signals to the drivers when a relatively low voltage or current is sensed in the bidirectional switch 402. The input / output circuits can also be arranged to turn on the bidirectional switch when a relatively high voltage is sensed across the bidirectional switch 402 in either direction. The turn-on can be for a predetermined time and pulse length, or until the voltage or current in the bidirectional switch 402 has reached a relatively low level (auto-clamp). In various embodiments, the high voltage signal can have a range from 100 V to 1200 V, while in other embodiments, the high voltage signal can have a range from 200 V to 800 V, while in still other embodiments, the high voltage signal can have a range from 500 V to 600 V. The voltage value of the signal can be set to any suitable value, as understood by one of ordinary skill in the art having the benefit of this disclosure.

[0067] In some embodiments, the first sensing circuit 321 and the second sensing circuit 323 of the integrated bidirectional switch 300 can be configured such that the sense switches are coupled in parallel to the bidirectional switch 302. The sense switches can sense the magnitude and polarity of the current in the bidirectional switch 302 and feed it to an amplifier to generate a first signal. The current sense switches can also be arranged to send the first signal containing at least one of the magnitude and polarity of the current through the bidirectional switch 302 to a driver circuit. The driver circuit can be arranged to send a control signal to the gate terminal of the bidirectional switch based on the first signal.

[0068] Figure 5 An integrated half-bridge circuit with two bidirectional four-quadrant switches with drivers, current and voltage sensors, and multiple input / output circuits disposed on separate dies is shown in accordance with certain embodiments. Figure 5 An integrated half-bridge circuit 500 is shown that is similar to the integrated bidirectional switch 400, except that two bidirectional switches are coupled in series to form a half-bridge circuit. In some embodiments, the two bidirectional four-quadrant switches can be disposed on separate dies. In various embodiments, the two bidirectional four-quadrant switches can be disposed on the same die. The integrated half-bridge circuit 500 can contain a first bidirectional switch 502 coupled in series with a second bidirectional switch 504. The first bidirectional switch 502 can be disposed on a first die 506 and the second bidirectional switch 504 can be disposed on a second die 508. In some embodiments, the first and second dies can be GaN-based. In various embodiments, the first and second dies can be Si-based.

[0069] The integrated half-bridge circuit 500 can also contain a third die 520 with a first driver 511 and a first sensing circuit. The integrated half-bridge circuit 500 can also contain a fourth die 522 with a second driver 512 and a third driver 514. The integrated half-bridge circuit 500 can also contain a fifth die 524 with a fourth driver 516 and a second sensing circuit. The integrated half-bridge circuit 500 can also contain a sixth die 518 with a first input / output circuit 528 and a seventh die 526 with a second input / output circuit 538. The first input / output circuit 528 can be coupled to the first driver 511 and the second driver 512 and to the first sensing circuit via differential isolation capacitors, respectively. The second input / output circuit 538 can be coupled to the third driver 514 and the fourth driver 516 and to the second sensing circuit via differential isolation capacitors, respectively. Similar to the integrated bidirectional switch 400, applications such as industrial applications where the integrated bidirectional switch complies with functional safety regulations can be achieved using two separate input / output circuits disposed on two separate dies within the integrated bidirectional switch package.

[0070] The half bridge circuit 500 can be formed in a single semiconductor package containing a first die, a second die, a third die, a fourth die, a fifth die, a sixth die, and a seventh die. These dies can be electrically isolated from one another, allowing the conduction state of the bidirectional switches to be controlled with input signals referenced to independent ground levels. The single semiconductor package can be a quad flat no-lead (QFN), small outline integrated circuit package (SOIC), dual in-line package (DIP), or any other suitable semiconductor package.

[0071] Integrated bidirectional switch with self-powered driver Figure 6A1 An integrated bidirectional four quadrant switch with a self-powered driver is shown in accordance with certain embodiments. Figure 6A1 An integrated bidirectional switch 600 with a self-powered driver is shown, which can contain a bidirectional switch stage 605, a bidirectional switch stage 607, and a bidirectional switch stage 609. The bidirectional switch stage 605 can contain a bidirectional switch 602, which can have an enhanced (E-type) upper section and an E-type lower section. The bidirectional switch stage 607 can contain a bidirectional switch 620, which can have an E-type upper section and a D-type lower section. The bidirectional switch stage 609 can contain a bidirectional switch 640, which can have a D-type upper section and an E-type lower section. In some embodiments, the bidirectional switch 602, the bidirectional switch 620, and the bidirectional switch 640 can be disposed on the same GaN-based die. In various embodiments, the bidirectional switch 602, the bidirectional switch 620, and the bidirectional switch 640 can be disposed on separate GaN-based dies. In some embodiments, the bidirectional switch 602, the bidirectional switch 620 can be disposed on the same die, while the bidirectional switch 640 is disposed on a separate die. Other combinations of bidirectional switches disposed on various GaN-based dies are within the scope of the present disclosure.

[0072] Figure 6A2 An integrated bidirectional four quadrant switch with a self-powered driver is shown in accordance with some embodiments, with an E-type upper section and an E-type lower section. Figure 6A2 An integrated bidirectional switch 680 with a self-powered driver is shown. As Figure 6A2As shown, bidirectional switch 620 can include an E-shaped upper section and an E-shaped lower section. In various embodiments, bidirectional switch 640 can include an E-shaped upper section and an E-shaped lower section. In certain embodiments, bidirectional switches 602, 620, and 640 can be GaN-based. In some embodiments, each of bidirectional switches 602, 620, and 640 can be disposed on a single die that is isolated from other dies. In various embodiments, bidirectional switches 602, 620, and 640 can all be disposed on a single die. In some embodiments, start-up power supply circuit 687 can be coupled to bidirectional switch 680 with a self-powered driver, where the power supply for die 660 and die 670 can be arranged to provide a supply power during circuit start-up.

[0073] In bidirectional switches 600 and 680 with a self-powered driver, bidirectional switch stage 605 can perform a switching function, while bidirectional switch stage 607 and bidirectional switch stage 609 can be arranged to self-power the drivers for bidirectional switch stages 605, 607, and 609. For example, bidirectional switch stage 605 can be used in an inverter, as an AC relay, or in other applications. Bidirectional switch 602 can be relatively large in size compared to bidirectional switches 620 and 640. In some embodiments, bidirectional switches 620 and 640 can have a relatively high on-resistance (RDSON) and can carry a relatively low current.

[0074] In the illustrated embodiments, the drivers driving the gate terminals of bidirectional switches 602, 620, and 640 can be self-powered, i.e., the drivers can operate without a power supply. This can be advantageous when the drivers are isolated, as it can be cumbersome to provide a power supply for an isolated high-side driver. Current methods, such as bootstrap techniques, can use a relatively large number of external components to provide a power supply to a high-side isolated driver, which can increase system cost and can decrease system reliability. Embodiments of the present disclosure enable self-powering of the drivers of bidirectional switches, thereby reducing system complexity and cost, and increasing system reliability. Furthermore, embodiments of the present disclosure can integrate a self-powered driver with a bidirectional switch and input / output circuit in a single semiconductor package, thereby reducing system cost and enabling a relatively high operating frequency.

[0075] In some embodiments, energy from the first source to the second source of the bidirectional switch can be collected to power the driver that drives the bidirectional switch. The energy can be collected during periods of time when the input voltage is high and stored on an energy harvesting capacitor and can be used to power the driver when the input voltage is zero or unavailable. Thus, energy can be collected when the input voltage is within an acceptable range such that energy harvesting can not draw excessive power by harvesting energy from a high voltage. Embodiments of the present disclosure enable energy to be collected from one source to another when the input voltage is within an acceptable range and used for driving functions. In some embodiments, such as AC applications where the input voltage can be a sinusoidal waveform, energy collection can be performed when the input voltage is near zero, where the input voltage is high enough to deliver charge for driving functions, but not so high as to cause excessive power loss. In various embodiments, energy from the first source to the second source of the bidirectional switch can be collected to power the driver of the bidirectional switch. In some embodiments, the first source and the second source can be coupled to an AC power source.

[0076] Bidirectional switch 602 can have a source terminal 606 coupled to a high side source pin 693 (SH), a gate terminal 610, a drain terminal 612, a substrate connection 608, a gate terminal 614, and a source terminal 616 coupled to a low side source pin 691 (SL). A first driver circuit can be coupled to gate terminal 610 and a second driver circuit can be coupled to gate terminal 614. Bidirectional switch 602 can be disposed on first die 604. Bidirectional switch 620 can be a hybrid switch, i.e., the upper section can be E-mode and the lower section can be D-mode. Bidirectional switch 620 can have a source terminal 622 coupled to a high side source pin, a gate terminal 626, a drain terminal 630, a substrate connection 628, a gate terminal 632, and a source terminal 634. Bidirectional switch 620 can be disposed on second die 624. Source terminal 634 can be coupled to an energy harvesting capacitor 636 and energy harvesting capacitor 636 can be coupled to a low side source pin. Bidirectional switch 640 can be a hybrid switch, i.e., the upper section can be D-mode and the lower section can be E-mode. Bidirectional switch 640 can have a source terminal 644 coupled to an energy harvesting capacitor 642, where energy harvesting capacitor 642 can be coupled to a high side source pin. Bidirectional switch 640 can also include a gate terminal 648, a drain terminal 652, a connection 650 to a substrate, a gate terminal 654, and a source terminal 654 coupled to SL. Bidirectional switch 640 can be disposed on third die 646.

[0077] As Figure 6A2As shown, the integrated bidirectional switch 680 with self-powered drivers can also include a first comparator 664 disposed on the fourth die 660 and a second comparator 674 disposed on the fifth die 670. The fourth die 660 can also include a reference voltage 662 provided to an input of the comparator 664. The fifth die 670 can also include a reference voltage 672 provided to an input of the comparator 664. The fourth and fifth dies can also include impedance divider circuits arranged to measure voltage differences between source terminals 622 and 634 and source terminals 644 and 656, respectively. The reference voltages 662 and 672 can be used to determine appropriate switching levels for the comparators 664 and 674. The comparator 664 can generate a signal sent to a relatively small gate driver (disposed on the fourth die) to drive gate terminals 626 and 648. The comparator 674 can generate a signal sent to a relatively small gate driver (disposed on the fifth die) to drive gate terminals 632 and 654. In some embodiments, the gate terminal 654 can be coupled to the source terminal 656 and the gate terminal 626 can be coupled to the source terminal 622. In this manner, the gate terminals of the D-shaped segments are controlled by the comparator / driver circuitry. Further, the signals generated by the comparators 664 and 674 can be used to provide state signals for controlling the bidirectional switch 602. In some embodiments, the fourth die can also include driver circuitry for the gate 610, and in various embodiments, the fifth die can also include driver circuitry for the gate 614. The fourth die can be powered by VDDL with respect to SL, and the fifth die can be powered by VDDH with respect to SH.

[0078] In some embodiments, the energy harvesting capacitor 636 can be sized, for example, at one microfarad. The energy harvesting capacitor 636 can be charged by the bidirectional switch 620, which can have an on-resistance of, for example, 100 milliohms. Thus, the charge time is on the order of 10 to 100 nanoseconds. The size of the bidirectional switch 620 can be selected such that the charge time of the energy harvesting capacitor is appropriately set, such that the charge time is fast and such that the amount of current flowing through the bidirectional switch 620 is relatively small. Similarly to the bidirectional switch 620, the size of the bidirectional switch 640 can be selected such that it can generate an appropriate charge time for the energy harvesting capacitor 642. As will be appreciated by one of ordinary skill in the art having the benefit of the present disclosure, the size of the energy harvesting capacitor can be set to any suitable value. Further, the value of the on-resistance of the bidirectional switch arranged to charge the energy harvesting capacitor can be set to any suitable value.

[0079] As Figure 6A1As shown, in some embodiments, the gate terminal 626 of the bidirectional switch 620 can be coupled to the source terminal 622. Thus, the upper section of the bidirectional switch 620 can be in a diode-connected configuration. In this way, the energy harvesting capacitor 636 can be charged to the threshold voltage of the D-type upper section and will then automatically turn off on its own. In various embodiments, such as but not limited to Figure 6A2 the gate terminal 626 of the bidirectional switch 620 can be coupled to the output of a comparator 664, where the comparator 664 will control the charge on the energy harvesting capacitor, and where the comparator can turn on or turn off the gate terminal 626 depending on the voltage level. In this way, the energy harvesting capacitor 636 can be charged to a voltage level that is different than the threshold voltage of the D-type upper section.

[0080] In some embodiments, such as but not limited to Figure 6A1 the gate terminal 654 of the bidirectional switch 640 can be coupled to the source terminal 656. Thus, the lower section of the bidirectional switch 640 can be in a diode-connected configuration. In this way, the energy harvesting capacitor 642 can be charged to the threshold voltage of the D-type lower section and will then automatically turn off on its own. In various embodiments, the gate terminal 654 of the bidirectional switch 640 can be coupled to the output of a comparator 674, where the comparator 674 can control the charge on the energy harvesting capacitor 642. In some embodiments, the comparator can turn on or turn off the gate terminal 654 depending on the voltage level. In various embodiments, 648 can be controlled to stop or not charge the capacitor 642. In various embodiments, the energy harvesting capacitor 642 can be charged to a voltage level that is different than the threshold voltage of the lower section.

[0081] In some embodiments, for an input voltage that is a sinusoidal waveform, the voltage levels at SH and SL can be alternating. When the voltage at SL is negative, the voltage at SH can be positive, or when the voltage at SL is positive, the voltage at SH can be negative. When the voltage at the drain terminal 622 reaches a level within a predetermined voltage range, such as 12 volts to 18 volts, the bidirectional switch 620 can turn on and can charge the energy harvesting capacitor 636 to a voltage of, for example, 18 volts. When the voltage goes high, then the bidirectional switch 620 can turn off, so it can work like a window comparator that only charges the capacitor when the voltage difference between SH and SL is within the correct range. During the time period that the bidirectional switch 620 is on, the energy harvesting capacitor 636 can be charged, so the size of the energy harvesting capacitor 636 and the bidirectional switch 620 are set so that there is enough charge on the capacitor to power the circuit during the time that the voltage is not within the correct range. As appreciated by one of ordinary skill in the art having the benefit of this disclosure, the predetermined voltage range can be set to any suitable value.

[0082] In some embodiments, when the voltage at the source terminal 656 reaches a predetermined level, such as 12 volts to 18 volts, the bidirectional switch 640 can turn on and can charge the energy harvesting capacitor 642 to a voltage of, for example, 18 volts. When the voltage is high, then the bidirectional switch 640 can turn off, so it can work like a window comparator that only charges the capacitor 642 when the voltage difference between SH and SL is in the correct range. During the time period when the bidirectional switch 640 is on, the energy harvesting capacitor 642 can be charged, so the energy harvesting capacitor 642 and the bidirectional switch 640 are sized so that there is enough charge on the capacitor to power the circuit during the time when the voltage is not in the correct range.

[0083] Self-powered operation using bidirectional switch with E- and D- section The above section describes the operation of the bidirectional switch 600 with a self-powered driver when all stages are enhancement mode. In the above section, the comparator 664 can turn off the bidirectional switch 620 when the input voltage is in a predetermined window, and for the reverse polarity, the comparator 674 can turn off the bidirectional switch 640 when the input voltage is in a predetermined window. In some embodiments, the energy harvesting capacitors 636 and 642 can start with no charge. Embodiments of the present disclosure can enable the energy harvesting capacitors to power up from zero charge by utilizing depletion mode (D-mode) in the lower section of the bidirectional switch 620 and depletion mode in the upper section of the bidirectional switch 640.

[0084] For example, the D-mode section can have a threshold voltage of -20 V. So, when the gate terminal is connected to the source terminal, the D-mode section will turn on and it will charge the energy harvesting capacitor to a voltage of 20 V, at which point it will turn off by itself because the source voltage will be 20 V, the gate-source voltage will be -20, and the D-mode section will then turn off by itself. During this time period, the source terminal can be at a higher potential compared to the drain terminal, and the transistor will operate in a reverse conduction state. The D-mode lower section of the bidirectional switch 620 and the D-mode upper section of the bidirectional switch 640 can enable start-up. The E-mode section on the opposite end can be configured in a diode-connected arrangement, where the gate terminal and the source terminal are coupled together, and the E-mode section can be used to rectify the input signal so that it turns on when the energy harvesting capacitor is being charged and can work in a blocking mode when the circuit is preventing the energy harvesting capacitor from discharging. As appreciated by one of ordinary skill in the art having the benefit of this disclosure, the threshold voltage of the D-mode section can be set to any suitable value. In some embodiments, the bidirectional switch 600 with a self-powered driver can use a bidirectional switch with a D-mode section that can enable the circuit to operate without using a comparator.

[0085] Start-up operation When the capacitor 636 discharges, the gate terminal 632 of the bidirectional switch 620 (lower section; D-type) can be connected to the node SL, so the effective gate-source voltage of the lower section of the bidirectional switch 620 can be the same as the voltage across the capacitor 636 with opposite polarity. As the voltage SH-SL increases ( Figure 6B ), the bidirectional switch 620 can start conducting current ( Figure 6C ) because a depletion-mode switch can conduct current even when the voltage across the gate-to-source terminal is zero. Thus, the voltage 695 (VDDL) can increase ( Figure 6D ) and reach the threshold voltage level V THQ3,D . In some embodiments, V THQ3,D may have a value of 18 V to 20 V. When the voltage 695 (VDDL) reaches the threshold voltage V THQ3,D , the lower section of the bidirectional switch 620 (D-type) can turn off, and the current through the bidirectional switch 620 reduces to zero, even as the voltage SH-SL continues to rise. During this event, the upper section of the bidirectional switch 620, which is connected as a diode (gate connected to source), can be in a reverse conduction state because the voltage at the source terminal can be higher than the voltage at the drain terminal 630. In some embodiments, the turn-on can occur when the voltage difference is in the range of, for example, 12 V to 18 V, and when the capacitor is charging due to the voltage being in the range of, for example, 12 V to 18 V.

[0086] When the voltage SH-SL decreases again, the lower section of the bidirectional switch 620 (D-type) can re-enter the on state and recharge the capacitor 636. When the voltage SH-SL changes polarity, the upper section of the bidirectional switch 620 can be in the blocking state and no current flows, preventing the capacitor 636 from discharging during this period. The circuit coupled to the capacitor 636 can discharge the capacitor 636, and the voltage 695 (VDDL) can decrease. For each subsequent cycle of the voltage SH-SL, the capacitor 636 can be recharged to the threshold voltage V THQ3,D , where this next charging period can be shorter than the initial charging time at startup. Specifically, the flow of current will start later because the remaining voltage on the capacitor 636 can provide a larger starting value. The size of the bidirectional switch 620 can be set such that the current delivered to the capacitor 636 is relatively high, enough to maintain VDDL above the proper supply voltage of the circuits that have been connected. The size of the bidirectional switch 620 can be small enough to operate as a current source.

[0087] Table 1 also describes an example method of operation of bidirectional switches 600 (or 680) with self-powered drivers, specifically operating bidirectional switches 620 and 640.

[0088]

[0089] Table 1 The control logic can also be restated as: 1) turn off both sections of the bidirectional switch when the voltage at the "other" source is negative with respect to the local source; 2) turn off the bidirectional switch with the local source as a reference when the voltage at the "other" source is positive with respect to the local source; 3) turn on the capacitor-connected bidirectional switch if the voltage is between a predetermined range (e.g., 12 V to 18 V) when the voltage at the "other" source is positive with respect to the local source.

[0090] Table 2 also describes an example method of operation of bidirectional switches 600 (or 680) with self-powered drivers, showing the state of the comparator outputs. Table 2 provides an example of the comparator signals that can be used by the controller to determine the bidirectional switch state.

[0091]

[0092] Table 2 As will be appreciated by one of ordinary skill in the art having the benefit of the present disclosure, the voltage value of the SH-SL can be set to any suitable value.

[0093] Figure 7 An integrated bidirectional four-quadrant switch 700 similar to integrated bidirectional switch 300 is shown in accordance with certain embodiments. The integrated bidirectional four-quadrant switch 700 can include an input / output circuit with I / O pins (pins VDD, INHL, SET, SGND) for signal input and control logic, pins for transmitter circuitry to drive signals, pins for receiver circuitry to receive current and voltage signals from the secondary side (pin SENSE), and pins for signal processing circuitry for current control. The control circuit can receive sensed current information from one or both ends of the bidirectional switch and can process the current information signal along with the input signal to control the bidirectional switch 702. Specifically, the control circuit can implement a turn-on or turn-off sequence so as to turn on or turn off one end of the bidirectional switch before the other. The control circuit can also decide to keep the switch operating in the opposite direction always on while switching the other switch on / off according to the INHL input control.

[0094] When the current through the bidirectional switch 702 becomes relatively high, the control circuit can turn off the bidirectional switch 702 (overcurrent protection). In some embodiments, the turn-off can be latched, so that a power cycle or reset signal can be used for a new turn-on. In some embodiments, the turn-off can be slow, to do a soft turn-off, so that a voltage surge due to high energy accumulated in the parasitic inductor of the power switch does not occur. In various embodiments, the turn-off can be for a relatively short period of time, so that the next rising edge can turn the switch back on. In some embodiments, the turn-off can be interleaved, where the turn-off sequence consists of pulses with a configurable frequency, which gradually become relatively short to reach zero during a predefined period of time. In various embodiments, similar techniques can be used to turn on or turn off the bidirectional switch 702 according to the turn-on / turn-off signal at the input.

[0095] The control circuit can also use the same interleaved pulse scheme for configurable current rise or fall times at turn-on and turn-off. The current rise / fall times can be different for turn-on and turn-off, and can depend on other parameters such as temperature or current or voltage levels. If the current is close to or exceeds a maximum level, the pulses during the current ramp-up can be shortened. If the current has reached zero, the pulses during the current ramp-down can be blanked.

[0096] Figures 8A to 8D Input signals and current waveforms for an integrated bidirectional four-quadrant switch 700 are shown, according to certain embodiments. Using the sensed current information, the turn-off or turn-on of the bidirectional switch 702 can be configured accordingly. The turn-off or turn-on can be hard or interleaved, depending on the load conditions and the parasitic inductance and capacitance in the system. Figure 8A The input signal is shown. Figure 8B The turn-off in a severe overload condition is shown, where another turn-on is not allowed until the load is cleared. Figure 8C The light overload condition, or current-limited repeated turn-on, is shown. This can be used for safety-critical applications. Figure 8D The controlled current ramp-up or ramp-down to prevent current spikes is shown (only ramp-down is shown).

[0097] Integrated semiconductor package Figure 9A A simplified partial plan view of an electronic package 900 including a bidirectional switch, a first driver circuit and a second driver circuit, and an input / output circuit, according to some embodiments of the present disclosure, is shown. As Figure 9AAs shown, the bidirectional switch can be disposed on a first die, the first driver circuit can be disposed on a second die, the second driver circuit can be disposed on a third die, and the input / output circuit can be disposed on a fourth die. The first, second, third, and fourth dies are independent dies and can be arranged in a top-cooled shrink small outline package (SSOP). In some embodiments, the first die can also include a second bidirectional switch and a third bidirectional switch. The second and third bidirectional switches can be arranged to harvest energy from input signals at input terminals (SI-S2) and use the harvested energy to supply power to the first and second driver circuits. In various embodiments, the second bidirectional switch can have a D-section and an E-section. In some embodiments, the third bidirectional switch can have a D-section and an E-section.

[0098] The electronic package 900 can include a bidirectional switch 912, a first driver circuit 906, a second driver circuit 908, and an input / output circuit 910. The bidirectional switch 912 can have substrate connections coupled to package pins 914. The first and second driver circuits 906 and 908 can be coupled to the bidirectional switch 912 by bond wires, respectively. The first and second driver circuits 906 and 908 can also be coupled to the input / output circuit 910 by bond wires, respectively. The first and second driver circuits 906 and 908 can also be coupled to their corresponding package pins by bond wires, respectively. The circuit of the input / output circuit 910 can be coupled to its corresponding package pins 920 and 922 by bond wires. Pin 902 can be coupled to a first source (SI) of the bidirectional switch 912, and pin 904 can be coupled to a second source (S2) of the bidirectional switch 912. The electronic package 900 can also include a spacer 928, which can be formed of, for example, aluminum oxide (AI2O3) or aluminum nitride, or an insulating tape. The spacer 928 can be electrically isolated. In some embodiments, the spacer can have low thermal conductivity properties. Most of the heat dissipation can be conducted by the top of the bidirectional switch. The spacer can be disposed below the first and second driver circuits 906 and 908, and below the die of the input / output circuit 910, respectively, thereby isolating the first and second driver circuits 906 and 908, and the input / output circuit 910 from the bidirectional switch 912, and isolating the first driver circuit 906 from the second driver circuit 908, respectively. An electrically insulating encapsulant can be formed around the electronic package 900. 912 can include several bidirectional switches in parallel, with two bidirectional switches having D- and E-devices for implementing energy harvesting. In this case, the package 900 can have additional low power pins for connecting external decoupling capacitors 636 and 642.

[0099] Figure 9BA simplified partial plan view of an electronic package 950 is shown, which includes bidirectional switches, first and second driver circuits, and input / output circuits, according to some embodiments of the present disclosure. The electronic package 950 is similar to the electronic package 900, but with three additional connections 980 per side. The electronic package 950 can be used to package Figure 6A1 or Figure 6A2 the circuits shown. The three connections 980 in the electronic package 950 can be used to connect the gates indicated by the "D" and "E" transistor terminals, and the source of "D" to the location of C EXT In some embodiments, the bidirectional switches 620 and 640 can be disposed on the same die as the main bidirectional switch 602. In various embodiments, the bidirectional switches 620 and 640 can be disposed on separate dies.

[0100] The electronic package 950 can include bidirectional switches 962, first driver circuit 956, second driver circuit 958, and input / output circuit 960. In some embodiments, the input / output circuit can include a controller. The bidirectional switches 962 can have substrate connections coupled to package pins 964. The first driver circuit 956 and the second driver circuit 958 can be coupled to the bidirectional switches 962 by bond wires, respectively. The first driver circuit 956 and the second driver circuit 958 can also be coupled to the input / output circuit 960 by bond wires, respectively. The first driver circuit 956 and the second driver circuit 958 can also be coupled to their corresponding package pins by bond wires, respectively. The circuit of the input / output circuit 910 can be coupled to its corresponding package pins 970 and 972 by bond wires. Pin 952 can be coupled to the first source (SI) of the bidirectional switches 962, and pin 954 can be coupled to the second source (S2) of the bidirectional switches 962. The electronic package 950 can also include spacers 978, which can be formed of, for example, aluminum oxide (AI2O3) or aluminum nitride, or an insulating tape. The spacers 978 can be electrically isolated. In some embodiments, the spacers can have low thermal conductivity properties. Most of the heat dissipation can be conducted by the top of the bidirectional switches. The spacers can be disposed under the first driver circuit 956 and the second driver circuit 958, and under the die of the input / output circuit 960, respectively, thereby isolating the first driver circuit 956 and the second driver circuit 958, and the input / output circuit 960 from the bidirectional switches 962, and isolating the first driver circuit 956 from the second driver circuit 958, respectively. An electrically insulating encapsulant can be formed around the electronic package 950. The 962 can include several bidirectional switches in parallel, with two bidirectional switches with depletion mode devices and enhancement mode devices for energy harvesting functionality. The package 950 can include additional low power pins for connecting external decoupling capacitors 636 and 642.

[0101] Figure 10 A simplified partial plan view of an electronic package 1000 according to an embodiment of the present disclosure is shown, the electronic package including a bidirectional switch, a first driver circuit and a second driver circuit, and input / output circuitry. Figure 10 As shown, each of the bidirectional switch 1012, the first driver circuit 1006 and the second driver circuit 1008, and the input / output circuit 1010 can be disposed on an independent die and can be arranged in a top-cooled power small outline package (PSOP). The bidirectional switch 1012 may have substrate connections coupled to corresponding package pins. The first driver circuit 1006 and the second driver circuit 1008 can be coupled to the bidirectional switch 1012 via bonding wires, respectively. The first driver circuit 1006 and the second driver circuit 1008 can also be coupled to the input / output circuit 1010 via bonding wires, respectively. The first driver circuit 1006 and the second driver circuit 1008 can also be coupled to their respective package pins via bonding wires, respectively. The circuitry of the input / output circuit 1010 can be coupled to its corresponding package pins via bonding wires. The electronic package 1000 may also include a spacer 1028, which may be formed of, for example, aluminum oxide (Al2O3) or aluminum nitride or insulating tape. The spacer 1028 may be electrically isolated. In some embodiments, the spacer may have low thermal conductivity. Most heat dissipation can be achieved through the top of the bidirectional switch. The spacer may be disposed below the first driver circuit 1006 and the second driver circuit 1008, and below the die of the input / output circuit 1010, respectively, thereby isolating the first driver circuit 1006 and the second driver circuit 1008, and the input / output circuit 1010, from the bidirectional switch 1012, and isolating the first driver circuit 1006 from the second driver circuit 1008. An electrically insulating encapsulation may be formed around the electronic package 1000.

[0102] Figure 11A A simplified partial plan view of an electronic package 1100 according to an embodiment of the present disclosure is shown, the electronic package including a bidirectional switch, a first driver circuit and a second driver circuit, and an input / output circuit. Figure 11B A simplified partial cross-sectional view of the electronic package 1100 is shown. (As shown) Figure 11A and 11BAs shown, each of the bidirectional switch 1112, the first driver circuit 1106 and the second driver circuit 1108, and the input / output circuit 1110 can be disposed on separate dies and can be arranged in a quad flat no-lead (QFN) package. In some embodiments, the electronic package 1100 can be an 8x8 QFN package. The bidirectional switch 1112 can have substrate connections coupled to corresponding package pins. The first driver circuit 1106 and the second driver circuit 1108 can be coupled to the bidirectional switch 1112 by bond wires, respectively. The first driver circuit 1106 and the second driver circuit 1108 can also be coupled to the input / output circuit 1110 by bond wires, respectively.

[0103] The first driver circuit 1106 and the second driver circuit 1108 can also be coupled to their corresponding package pins by bond wires, respectively. The circuit of the input / output circuit 1110 can be coupled to its corresponding package pin by a bond wire. The electronic package 1100 can also include spacers 1128, which can be formed of, for example, aluminum oxide (AI2O3) or aluminum nitride, or an insulating tape. The spacers 1028 can be electrically isolated. The spacers 1128 can be electrically isolated. In some embodiments, the spacers can have low thermal conductivity properties. The spacers can be disposed below the first driver circuit 1106 and the second driver circuit 1108 and below the die of the input / output circuit 1110, respectively, thereby isolating the first driver circuit 1106 and the second driver circuit 1108 and the input / output circuit 1110 from the bidirectional switch 1112, respectively, and isolating the first driver circuit 1106 from the second driver circuit 1108. In this way, the electronic package 1100 can be used, for example, in an A / C circuit breaker. An electrically insulating encapsulant can be formed around the electronic package 1100.

[0104] Figure 11A A 6x6 QFN is shown. Other configurations of QFN packages are within the scope of the present disclosure, such as but not limited to a 6x8 QFN having a similar configuration as the 6x6 QFN but with a relatively longer size in the horizontal dimension. In the 6x8 QFN, the right-hand side portion can be relatively longer, the pins can be disposed on the right side, and the bidirectional switch 1112 can be relatively longer, thereby showing a relatively large die size to reduce the on-resistance.

[0105] In some embodiments, the isolation of the driver circuits and the bidirectional switch can be achieved by using a floating copper pad or a floating copper interconnect that is not connected to any external lead. This can be a pre-molded frame technology, where the frame is half-etched, then molded, then etched again to break the lead.

[0106] Figure 12A simplified partial plan view of an electronic package 1200 is shown, including a bidirectional switch, first and second driver circuits, and input / output circuits, in accordance with embodiments of the present disclosure. The electronic package 1200 can be a QFN package. As Figure 12 shown, the electronic package 1200 can include a bidirectional switch 1212 disposed on a first die and a thin QFN (TQFN) package 1216 that can include first and second driver circuits and input / output circuits. The TQFN package 1216 can be configured to act as an isolator for the first and second driver circuits and input / output circuits. In some embodiments, the TQFN 1216 can be attached to the electronic package 1200 upside down and used as bond pads for final assembly of the electronic package 1200. An electrically insulating encapsulant can be formed around the electronic package 1200.

[0107] Figure 13 A simplified partial transparent plan view of an electronic package 1300 is shown, in accordance with disclosed embodiments. The electronic package 1300 can be or include any of the electronic packages and / or any component, feature, or characteristic of the previously described electronic packages, and the electronic package can be included in a circuit as previously discussed. As Figure 13 shown, the electronic package 1300 includes a package base 1305 having a plurality of external terminals 1310 and conductive die attach pads 1315 partially encapsulated in an electrically insulating polymer 1320. A bidirectional switch 1325 is attached to the die attach pads 1315 using solder, silver sinter material, adhesive, or other suitable material. A transmitter die 1330 and first and second receiver dies 1335A and 1335B, respectively, are attached to the electrically insulating polymer 1320 using adhesive or other suitable material. One or more bond wires 1340 are used to electrically connect the transmitter die 1330, the first and second receiver dies 1335A and 1335B, and the external terminals 1310. Figure 13 The physical arrangement and interconnections shown are by way of example only, and other electronic packages can have other suitable arrangements and interconnections.

[0108] Figure 14 A simplified cross-section of the electronic package 1300 is shown. Figure 13 As Figure 14As shown, the electronic package 1300 includes a package base 1305, which is partially encapsulated by a molded cap 1405 extending across a top surface 1410 of the package base. The package base 1305 includes a die attachment pad 1315 and a plurality of external terminals 1310, which may be made of a conductive material such as copper or other suitable material. An electrically insulating polymer 1320 at least partially encapsulates the die attachment pad 1315 and the plurality of external terminals 1310, thereby providing electrical insulation between conductive areas. A bidirectional switch 1325 is thermally and / or electrically attached to the die attachment pad 1315. A transmitter die 1330 is attached to an area of ​​the electrically insulating polymer 1320 and electrically isolated from the die attachment pad 1315 and the plurality of external terminals 1310. One or more bonding wires 1340 electrically connect the transmitter die 1330 and the external terminals 1310. In other embodiments, metal clips, flip chips, or other suitable interconnects may be used. The molded cover 1405 is formed of an electrically insulating material and encapsulates the transmitter die 1330, the bidirectional switch 1325, and one or more bonding wires 1340.

[0109] Figure 15 A through 15D illustrate a method 1600 for forming an electronic package 1500 according to an embodiment of the present disclosure (see also...). Figure 16 The related steps. More specifically, Figure 15 Simplified cross-sectional views A through 15D are shown for the electronic package, where each view corresponds to a specific step of method 1600. The electronic package 1500 may be similar to... Figure 13 and 14 The electronic package 1300 shown is an example of a package with similar reference numerals indicating similar features. The electronic package 1500 may be or include any component, feature, or characteristic of any electronic package and / or component previously described, and the electronic package may be included in a circuit as previously discussed.

[0110] In the first step 1610, multiple conductive features can be formed. For example... Figure 15 As shown in section 15(a), the conductive features in this particular embodiment include a first external terminal 1310A and a second external terminal 1310B, as well as a die attachment pad 1315. In some embodiments, the conductive features can be formed using a multilayer process employing various plating and photolithographic masks, while in other embodiments, the conductive features can be formed using a removal process including etching, machining, or other material removal processes. The conductive features can be formed from any suitable metal or combination of metals, including but not limited to copper, nickel, tin, aluminum, gold, palladium, or iron.

[0111] In the second step 1620, the conductive features can be partially encapsulated in the electrically insulating polymer 1320. For example... Figure 15As shown in section 15(b), electrically insulating polymer 1320 fills the gaps between the conductive features, thereby forming a relatively planar top surface 1410 of base 1305 of electronic package 1500. Electrically insulating polymer 1320 can be made of any suitable material that is not conductive, and can be formed using injection molding or other suitable processes.

[0112] In a third step 1630, one or more dies are attached to top surface 1410 of base 1305, and one or more bond wires 1340 are used to electrically connect the one or more dies to each other and / or to the conductive features. As shown in section 15(c), bidirectional switch 1325 is attached to die attach pads 1315, and transmitter and / or receiver dies 1330, 1335A, 1335B are attached to electrically insulating polymer 1320. Bond wires 1340 electrically connect the transmitter and / or receiver dies to each other and to one or more external terminals 1310. Bond wires 1340 also electrically connect the transmitter and / or receiver dies to bidirectional switch 1325, and further connect bidirectional switch to one or more external terminals 1310. Figure 15

[0113] In a fourth step 1640, a molded cover 1405 is formed. As shown in section 15(d), molded cover 1405 is formed across top surface 1410 of package base 1305, and encapsulates transmitter and / or receiver dies 1330, 1335A, 1335B and bidirectional switch 1325, as well as one or more bond wires 1340. Molded cover 1405 can be formed of any suitable electrically insulating material, and can be formed via injection molding, transfer molding, or other suitable processes. Figure 15

[0114] It should be understood that method 1600 is illustrative and that variations and modifications are possible. Steps that are described in sequence can be performed in parallel, the order of steps can be varied, and steps can be modified, combined, added, or omitted.

[0115] In some embodiments, the combinations of circuits and methods disclosed herein can be used to form and operate integrated bidirectional switches with drivers and input / output circuits. Although the circuits and methods are described and shown herein with respect to several particular configurations of integrated bidirectional switches with drivers and input / output circuits, embodiments of the present disclosure are suitable for forming other integrated bidirectional switches with drivers and input / output circuits. Furthermore, embodiments of the present disclosure can be used in power converter circuits, such as but not limited to AC-DC power converters, AC-AC power converters, and boost power converters.

[0116] ​​In the foregoing specification, embodiments of the disclosure have been described with reference to numerous specific details that can vary from implementation to implementation. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense. The sole and exclusive indicator of the scope of the disclosure, and what is intended by the applicants to be the scope of the disclosure, is the literal and equivalent scope of the set of claims that issue from this application, in this particular form, containing any subsequent amendments. Combinations of features, components, and / or steps can be made in any suitable manner in different embodiments.

[0117] Also, spatially relative terms, such as "bottom" or "top," and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) and / or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and / or operation in addition to the orientations depicted in the figures. For example, if a device in the figures is turned over, elements described as being on the "bottom" surface of other elements or features would then be oriented on top of the other elements or features. The device can be oriented in other ways (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0118] As used herein, the terms "and," "or," and "and / or" can include a variety of meanings that also are expected to depend at least in part upon the context in which such terms are used. Typically, "or" if used to associate a list includes all of the options of the list (e.g., either A or B or C), but can be used in the same manner as a comprehensive list (e.g., A, B, or C) when used in the context of "and / or." Furthermore, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in the singular or can be used to describe some combination of features, structures, or characteristics. However, it should be noted that this is merely an illustrative example and claimed subject matter is not limited to this example. Furthermore, the term "at least one of" as used herein, when used in the context of a list of items (such as, for example, A, B, or C), can be interpreted to mean any combination or sub-combination of the items A, B, and / or C, such as A or B or C, or A and B or C, or A and B and C, etc.

[0119] Reference throughout this specification to "one example," "an example," "certain examples," or "exemplary implementation" means that a particular feature, structure, or characteristic described in connection with the feature and / or example can be included in at least one feature and / or example of claimed subject matter. Thus, the appearances of the phrase "in one example" or "an example" or "in certain examples" or "in certain implementations" or other similar phrases in various places throughout this specification are not necessarily all referring to the same feature, example, and / or limitation. Furthermore, the particular features, structures, or characteristics can be combined in one or more examples and / or features.

[0120] In the foregoing detailed description, numerous specific details are set forth in order to provide a thorough understanding of the claimed subject matter. However, those skilled in the art having the benefit of this disclosure will appreciate that the claimed subject matter can be practiced without such specific details. In other instances, well-known methods and devices are not described in detail in order to avoid obscuring the claimed subject matter. Thus, the claimed subject matter is not limited to the particular examples disclosed, but rather is intended to include all aspects falling within the scope of the appended claims and equivalents thereof.

[0121] Various embodiments of the present disclosure are provided below. As used hereinafter, any reference to a series of embodiments should be understood as a separate reference to each of these embodiments (e.g., "Embodiments 1-4" should be understood as "Embodiment 1, 2, 3, or 4").

[0122] Embodiment 1 is an electronic system comprising: an electronic package including a base having a plurality of external terminals, and further including an electrically insulating material at least partially encapsulating the base; a controller circuit disposed within the electronic package and referenced to a first ground; first and second driver circuits disposed within the electronic package and referenced to a second ground, and arranged to receive isolated control signals from the controller circuit; and a bidirectional switch disposed within the electronic package and referenced to the second ground, and arranged to receive drive signals from the first and second driver circuits.

[0123] Embodiment 2 is the electronic system of Embodiment 1, wherein the first and second driver circuits are isolated from the controller circuit via a capacitor, a magnetic element, an optocoupler, or a magnetoresistor.

[0124] Embodiment 3 is the electronic system of Embodiment 1, wherein the bidirectional switch is a first bidirectional switch, and wherein the first bidirectional switch includes a first gate terminal, a second gate terminal, a first source terminal, and a second source terminal.

[0125] Embodiment 4 is the electronic system of Embodiments 1 and 3, wherein the first source terminal is coupled to a first external terminal of the plurality of external terminals, and the second source terminal is coupled to a second external terminal of the plurality of external terminals.

[0126] Embodiment 5 is the electronic system of Embodiments 1 and 4, wherein the bidirectional switch is gallium nitride (GaN)-based.

[0127] Example 6 is the electronic system of Example 1, further comprising a signal isolator coupled between the transmitter and the receiver.

[0128] Example 7 is the electronic system of Examples 1 and 6, wherein the first driver circuit is disposed on a first die, the second driver circuit is disposed on a second die, the controller circuit is disposed on a third die, and the bidirectional switch is disposed on a fourth die.

[0129] Example 8 is the electronic system of Examples 1 and 7, wherein the fourth die further comprises a sensing device arranged to send a signal to the controller circuit, the signal containing at least one of a magnitude and a polarity of a current through the bidirectional switch.

[0130] Example 9 is the electronic system of Examples 1 and 3, wherein the first driver circuit is arranged to send a first drive signal to the first gate terminal in response to receiving a first control signal from the control circuit, and the second driver circuit is arranged to send a second drive signal to the second gate terminal in response to receiving a second control signal from the control circuit.

[0131] Example 10 is the electronic system of Examples 1 and 9, further comprising a second bidirectional switch and a third bidirectional switch coupled in parallel to the first bidirectional switch.

[0132] Example 11 is the electronic system of Examples 1, 3, and 10, wherein an AC power source referenced to the second ground is coupled between the first source terminal and the second source terminal, and wherein the second bidirectional switch and the third bidirectional switch are arranged to harvest energy from the AC power source for operating the first driver circuit and the second driver circuit.

[0133] Example 12 is the electronic system of Examples 1, 3, and 10-11, wherein the second bidirectional switch comprises a depletion-mode (D-mode) section and an enhancement-mode (E-mode) section.

[0134] Example 13 is the electronic system of Examples 1, 3, and 10-11, wherein the second bidirectional switch is coupled in series with an energy harvesting capacitor.

[0135] Example 14 is the electronic system of Example 1, wherein the bidirectional switch is arranged to store energy harvested from a primary input, and to use the harvested energy to provide power to the first driver circuit and the second driver circuit.

[0136] Example 15 is a method of forming an electronic assembly, the method comprising: providing an electronic package including a base having a plurality of external terminals; forming an electrically insulating material at least partially encapsulating the base; disposing a controller circuit within the electronic package, the controller circuit referenced to a first ground; disposing a first driver circuit and a second driver circuit within the electronic package, the first driver circuit and the second driver circuit referenced to a second ground and arranged to receive isolated control signals from the controller circuit; and disposing a bidirectional switch within the electronic package, the bidirectional switch referenced to the second ground and arranged to receive drive signals from the first driver circuit and the second driver circuit.

[0137] Example 16 is the method of forming an electronic assembly according to Example 15, wherein the controller circuit is electrically isolated from the first driver circuit and the second driver circuit via a capacitor, a magnetic element, an optocoupler, or a magnetoresistor.

[0138] Example 17 is the method of forming an electronic assembly according to Example 15, wherein the first driver circuit is disposed on a first die, the second driver circuit is disposed on a second die, the controller circuit is disposed on a third die, and the bidirectional switch is disposed on a fourth die.

[0139] Example 18 is the method of forming an electronic assembly according to Examples 15 and 17, wherein the fourth die further comprises a sensing device arranged to send a signal to the control circuit, the signal including at least one of a magnitude and a polarity of a current passing through the bidirectional switch.

[0140] Example 19 is the method of forming an electronic assembly according to Examples 15 and 17-18, wherein the first driver circuit is arranged to send a first drive signal to a first gate terminal of the bidirectional switch in response to receiving a first control signal from the controller circuit, and the second driver circuit is arranged to send a second drive signal to a second gate terminal of the bidirectional switch in response to receiving a second control signal from the controller circuit.

[0141] Example 20 is a method of operating a circuit, the method comprising: providing an electronic package including a base having a plurality of external terminals, and further including an electrically insulating material at least partially encapsulating the base; providing an input / output circuit disposed within the electronic package and referenced to a first ground; providing a first driver circuit and a second driver circuit disposed within the electronic package and referenced to a second ground, and arranged to receive isolated control signals from the input / output circuit; providing a bidirectional switch disposed within the electronic package and referenced to the second ground, and arranged to receive drive signals from the first driver circuit and the second driver circuit; receiving input data by the input / output circuit; sending intermediate data corresponding to the input data by the input / output circuit; receiving the intermediate data by the first driver circuit and the second driver circuit; generating output data corresponding to the input data by the first driver circuit and the second driver circuit; and driving the bidirectional switch by the first driver circuit and the second driver circuit with the output data.

[0142] Those of ordinary skill in the art will appreciate that other modifications can be made to the devices and methods of the present disclosure in order to implement the various applications of the methods and systems for an enhanced area getter architecture for wafer-level vacuum packaged uncooled focal plane arrays without departing from the scope of the present disclosure.

[0143] The examples and embodiments described herein are for illustrative purposes only. Various modifications or changes in light thereof will be apparent to those skilled in the art from the foregoing without departing from the spirit and scope of the application, and the scope of the appended claims.

Claims

1. An electronic system comprising: an electronic package including a base having a plurality of external terminals and further including an electrically insulating material at least partially encapsulating the base; a controller circuit disposed within the electronic package and referenced to a first ground; first and second driver circuits disposed within the electronic package and referenced to a second ground and arranged to receive isolated control signals from the controller circuit; and a bidirectional switch disposed within the electronic package and referenced to the second ground and arranged to receive drive signals from the first and second driver circuits.

2. The electronic system of claim 1, wherein the first and second driver circuits are isolated from the controller circuit via a capacitor, a magnetic element, an optocoupler, or a magnetoresistor.

3. The electronic system of claim 1, wherein the bidirectional switch is a first bidirectional switch, and wherein the first bidirectional switch includes a first gate terminal, a second gate terminal, a first source terminal, and a second source terminal.

4. The electronic system of claim 3, wherein the first source terminal is coupled to a first external terminal of the plurality of external terminals and the second source terminal is coupled to a second external terminal of the plurality of external terminals.

5. The electronic system of claim 1, wherein the bidirectional switch is gallium nitride (GaN)-based.

6. The electronic system of claim 3, wherein the first driver circuit is coupled to the first gate terminal and the second driver circuit is coupled to the second gate terminal.

7. The electronic system of claim 1, wherein the first driver circuit is disposed on a first die, the second driver circuit is disposed on a second die, the controller circuit is disposed on a third die, and the bidirectional switch is disposed on a fourth die.

8. The electronic system of claim 7, wherein the fourth die further includes a sensing device arranged to send a signal to the controller circuit, the signal including at least one of a magnitude and a polarity of a current through the bidirectional switch.

9. The electronic system of claim 3, wherein the first driver circuit is arranged to send a first drive signal to the first gate terminal in response to receiving a first control signal from the control circuit, and the second driver circuit is arranged to send a second drive signal to the second gate terminal in response to receiving a second control signal from the control circuit.

10. The electronic system of claim 3, further comprising second and third bidirectional switches coupled in parallel to the first bidirectional switch.

11. The electronic system of claim 10, wherein an AC power source referenced to the second ground is coupled between the first source terminal and the second source terminal, and wherein the second bidirectional switch and the third bidirectional switch are arranged to harvest energy from the AC power source for operating the first driver circuit and the second driver circuit.

12. The electronic system of claim 11, wherein the second bidirectional switch comprises a depletion-mode (D-mode) section and an enhancement-mode (E-mode) section.

13. The electronic system of claim 11, wherein the second bidirectional switch is coupled in series with an energy harvesting capacitor.

14. The electronic system of claim 1, wherein the bidirectional switch is arranged to store energy harvested from a primary input, and to use the harvested energy to provide power to the first driver circuit and the second driver circuit.

15. A method of forming an electronic assembly, the method comprising: providing an electronic package including a base having a plurality of external terminals; forming an electrically insulating material at least partially encapsulating the base; providing a controller circuit within the electronic package, the controller circuit referenced to a first ground; providing a first driver circuit and a second driver circuit within the electronic package, the first driver circuit and the second driver circuit referenced to a second ground and arranged to receive isolated control signals from the controller circuit; and providing a bidirectional switch within the electronic package, the bidirectional switch referenced to the second ground and arranged to receive drive signals from the first driver circuit and the second driver circuit.

16. The method of claim 15, wherein the controller circuit is electrically isolated from the first driver circuit and the second driver circuit via a capacitor, a magnetic element, an optocoupler, or a magnetoresistor.

17. The method of claim 15, wherein the first driver circuit is provided on a first die, the second driver circuit is provided on a second die, the controller circuit is provided on a third die, and the bidirectional switch is provided on a fourth die.

18. The method of claim 17, wherein the fourth die further comprises a sensing device arranged to send a signal to the control circuit, the signal including at least one of a magnitude and a polarity of a current passing through the bidirectional switch.

19. The method of claim 18, wherein the first driver circuit is arranged to send a first drive signal to a first gate terminal of the bidirectional switch in response to receiving a first control signal from the control circuit, and the second driver circuit is arranged to send a second drive signal to a second gate terminal of the bidirectional switch in response to receiving a second control signal from the control circuit.

20. A method of operating a circuit, the method comprising: providing an electronic package including a base having a plurality of external terminals, and further including an electrically insulating material at least partially encapsulating the base; providing an input / output circuit disposed within the electronic package and referenced to a first ground; providing a first driver circuit and a second driver circuit disposed within the electronic package and referenced to a second ground, and arranged to receive isolated control signals from the input / output circuit; providing a bidirectional switch disposed within the electronic package and referenced to the second ground, and arranged to receive drive signals from the first driver circuit and the second driver circuit; receiving input data by the input / output circuit; sending intermediate data corresponding to the input data by the input / output circuit; receiving the intermediate data by the first driver circuit and the second driver circuit; generating output data corresponding to the input data by the first driver circuit and the second driver circuit; and driving the bidirectional switch by the first driver circuit and the second driver circuit with the output data.

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