Electronic device including multilayer flexible printed circuit board

Abstract

An electronic device according to an embodiment of the present disclosure includes: a first housing on which a first printed circuit board is placed; a second housing on which the second printed circuit board is placed; a hinge rotatably connecting the first housing to the second housing; and a multi-layer flexible printed circuit board connecting the first printed circuit board to the second printed circuit board, in which the multi-layer flexible printed circuit board includes a plurality of pattern layers and a bonding layer for bonding portions between at least two pattern layers among the plurality of pattern layers, and in the folding area, the bonding layer is folded by the first printed circuit board and the second printed circuit board. The multilayer flexible printed circuit board includes bending regions and a non-bending region between the bending regions, and at least one bonding layer in the folding region may be formed at least partially only on the non-bending region.

Description

Technical Field

[0001] This disclosure relates to electronic devices including multilayer flexible printed circuit boards. Background Technology

[0002] Foldable electronics may include a folding region comprising a hinge mechanism to enable folding operation. The foldable electronics may include a flexible printed circuit board for electrical connections between its internal components, and a portion of the flexible printed circuit board may be disposed within the folding region.

[0003] In foldable electronic devices, flexible printed circuit boards (PCBs) may experience stress due to repeated folding operations within the limited space of the folding area. As the radius of curvature of the flexible PCB increases, the stress applied to it can decrease. Therefore, the flexible PCB of a foldable electronic device can be designed with a defined shape to maximize the radius of curvature. Summary of the Invention

[0004] Technical issues

[0005] As the space of the folding area in foldable electronics decreases, the radius of curvature of the flexible printed circuit board decreases, and the stress applied to the flexible printed circuit board increases.

[0006] In foldable electronic devices, the path loss along the flexible printed circuit board (or along the flexible printed circuit board) increases because the length of the flexible printed circuit board is relatively increased (i.e., relatively larger, as it needs to be able to accommodate the folding and unfolding of the device) compared to non-foldable electronic devices.

[0007] When all layers in a flexible printed circuit board (PCB) are bonded together, it becomes difficult for the PCB, located in the folding area of ​​a foldable electronic device, to maintain a defined design shape, and the stress applied to the PCB increases. In other words, when all layers are bonded together (by bonding each pair of adjacent layers to each other using appropriate bonding methods), this can cause the PCB to experience high stress when the device is repeatedly folded and unfolded.

[0008] Solution to the problem

[0009] According to embodiments of this disclosure, an electronic device may include a first housing, a second housing, a hinge, and a multilayer flexible printed circuit board. The first housing may be disposed on the first printed circuit board. The second housing may be disposed on the second printed circuit board. A hinge (or hinge device, hinge assembly, hinge module, or hinge structure) may rotatably (or foldably) connect the first and second housings relative to each other (or may rotatably (or foldably) connect the first and second housings to each other). The multilayer flexible printed circuit board may connect the first and second printed circuit boards (i.e., connect them together, connect them to each other). The multilayer flexible printed circuit board may be configured to pass through (e.g., extend through) a folding region of the electronic device (the hinge is positioned (or located) in the folding region of the electronic device). The multilayer flexible printed circuit board may include a plurality of patterned (or patterned) layers stacked in a first direction (e.g., height or thickness) of the multilayer flexible printed circuit board and a bonding layer (or at least one bonding layer) configured to engage portions between at least two of the plurality of patterned layers (or, in other words, engage corresponding portions of at least a pair of adjacent patterned layers). In the folded region, the multilayer flexible printed circuit board may include a first flexed region and a second flexed region, as well as a non-flexed region NF between the first and second flexed regions, in which the multilayer flexible printed circuit board is bent and stretched (or flexed, for example, when the electronic device is folded and unfolded, or in other words, when its configuration changes between a folded state and an unfolded state). In the folded region, at least one bonding layer may be formed at least partially (or entirely) only on (or within) the non-flexed region. Thus, in some embodiments, the electronic device may include at least one bonding layer that is individually or entirely confined to the non-flexed region and does not extend into the first or second flexed region, such that pairs of adjacent patterned layers bonded together by the bonding layer in the non-flexed region do not bond to each other in the first and second flexed regions. In other words, in some embodiments, the multilayer flexible circuit board includes a pair of adjacent patterned layers, which include corresponding portions joined together in a non-flexible region, other corresponding portions not joined together in a first flexible region, and other corresponding portions not joined together in a second flexible region, such that when the device is folded and unfolded, the non-jointed portions in the flexible regions can slide or move about each other or relative to each other as the flexible regions flex, thereby helping the flexible circuit board maintain the desired shape and reduce stress.

[0010] Beneficial effects of the invention

[0011] An electronic device comprising a multilayer flexible printed circuit board according to an embodiment of the present disclosure has bonding layers disposed only in some (i.e., not all) layers of the multilayer flexible printed circuit board in the folded region (or only between them); thus, the multilayer flexible printed circuit board can easily maintain a defined design shape.

[0012] Compared to cases where the folded area does not include a bonding layer, electronic devices including multilayer flexible printed circuit boards according to embodiments of the present disclosure can reduce path losses of the multilayer flexible printed circuit boards.

[0013] An electronic device comprising a multilayer flexible printed circuit board according to an embodiment of the present disclosure provides bonding layers only in some layers of the multilayer flexible printed circuit board in the folded region, thereby reducing the stress applied to the multilayer flexible printed circuit board compared to the case where all layers of the multilayer flexible printed circuit board are bonded. Attached Figure Description

[0014] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to an embodiment.

[0015] Figure 2a , Figure 2b , Figure 2c , Figure 2d and Figure 2e This is a diagram illustrating an electronic device according to an embodiment of the present disclosure.

[0016] Figure 3a and Figure 3b This is a diagram illustrating an electronic device according to an embodiment of the present disclosure.

[0017] Figure 4 This is a diagram illustrating a multilayer flexible printed circuit board according to an embodiment of the present disclosure.

[0018] Figure 5 This is a diagram illustrating a multilayer flexible printed circuit board according to an embodiment of the present disclosure.

[0019] Figure 6 This is a diagram illustrating a multilayer flexible printed circuit board according to an embodiment of the present disclosure.

[0020] Figure 7 This is a diagram illustrating a multilayer flexible printed circuit board according to an embodiment of the present disclosure.

[0021] Figure 8 This is a diagram illustrating a multilayer flexible printed circuit board according to an embodiment of the present disclosure.

[0022] Figure 9a and Figure 9b This is a diagram illustrating a multilayer flexible printed circuit board according to an embodiment of the present disclosure.

[0023] Figure 10a and Figure 10b This is a diagram illustrating the separation distance and effective separation distance between the bonding layers according to an embodiment of the present disclosure.

[0024] Figure 11 This is a diagram illustrating an electronic device according to an embodiment of the present disclosure.

[0025] Figure 12 This is a diagram illustrating an electronic device including a bonding layer disposed in a first region according to an embodiment of the present disclosure. Detailed Implementation

[0026] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Reference Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0027] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0028] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architectures dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm can include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple layers of artificial neural networks. The artificial neural network can be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model can include software structures in addition to hardware structures.

[0029] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0030] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0031] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0032] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0033] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0034] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0035] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0036] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0037] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0038] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0039] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0040] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0041] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0042] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0043] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0044] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0045] According to various embodiments, antenna module 197 can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top or side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0046] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0047] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0048] Figure 2a , Figure 2b , Figure 2c , Figure 2d and Figure 2e This is a diagram illustrating an electronic device 200 according to an embodiment of the present disclosure.

[0049] Figure 2a This is a perspective view of an electronic device in an unfolded (or flat) state, according to an embodiment of the present disclosure. Figure 2b This is a plan view showing the front surface of an electronic device in its unfolded state according to an embodiment of the present disclosure. Figure 2cThis is a plan view showing the rear surface of an electronic device in an unfolded state according to an embodiment of the present disclosure. Figure 2d This is a perspective view of an electronic device in a folded state, according to an embodiment of the present disclosure. Figure 2e This is a perspective view of an electronic device showing an intermediate state of an electronic device according to an embodiment of the present disclosure.

[0050] refer to Figures 2a to 2e The electronic device 200 may include a hinge-based device (e.g., Figure 2b The hinge device 240) is combined with a first housing 210 and a second housing 220 in a foldable manner (e.g., a foldable housing structure). In an embodiment, the hinge device (e.g., Figure 2b The hinge device 240 can be positioned in the X-axis direction or the Y-axis direction. According to an embodiment, the electronic device 200 may include a first display 230 (e.g., a flexible display, a foldable display, or a main display) disposed in a region (e.g., a recess) formed by the first housing 210 and the second housing 220. According to an embodiment, the first housing 210 and the second housing 220 may be positioned on opposite sides about a folding axis F and may have a substantially symmetrical shape about the folding axis F. According to an embodiment, the angle or distance between the first housing 210 and the second housing 220 may vary depending on the state of the electronic device 200. For example, the angle or distance between the first housing 210 and the second housing 220 may differ depending on whether the electronic device is in an unfolded (or flat) state, a folded state, or an intermediate state.

[0051] According to an embodiment, in the unfolded state of the electronic device 200, the first housing 210 may include a first surface 211 pointing in a first direction (e.g., forward direction) (z-axis direction) and a second surface 212 pointing in a second direction (e.g., rearward direction) (-z-axis direction) opposite to the first surface 211. According to an embodiment, in the unfolded state of the electronic device 200, the second housing 220 may include a third surface 221 pointing in the first direction (z-axis direction) and a fourth surface 222 pointing in the second direction (-z-axis direction). According to an embodiment, in the unfolded state of the electronic device 200, the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 may point in substantially the same first direction (z-axis direction). In an embodiment, in the folded state of the electronic device 200, the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 may face each other. According to an embodiment, in the unfolded state of the electronic device 200, the second surface 212 of the first housing 210 and the fourth surface 222 of the second housing 220 may point in substantially the same second direction (-z-axis direction). In one embodiment, when the electronic device 200 is folded, the second surface 212 of the first housing and the fourth surface 222 of the second housing 220 can point in opposite directions. For example, in the folded state of the electronic device 200, the second surface 212 can point in a first direction (z-axis direction), and the fourth surface 222 can point in a second direction (-z-axis direction). In this case, the first display 230 is not visible from the outside (inward folding mode). In another embodiment, the electronic device 200 can be folded such that the second surface 212 of the first housing 210 and the fourth surface 222 of the second housing 220 face each other. In this case, the first display 230 can be configured to be visible from the outside (outward folding mode).

[0052] According to an embodiment, the first housing 210 (e.g., a first housing structure) may include a first transverse member 213 forming the appearance of the electronic device 200 and a first rear cover 214 combined with the first transverse member 213 to form at least a portion of the second surface 212 of the electronic device 200. According to an embodiment, the first transverse member 213 may include a first side surface 213a, a second side surface 213b extending from one end of the first side surface 213a, and a third side surface 213c extending from the other end of the first side surface 213a. According to an embodiment, the first transverse member 213 may be formed into a quadrilateral (e.g., square or rectangular) shape using the first side surface 213a, the second side surface 213b, and the third side surface 213c.

[0053] According to an embodiment, the second housing 220 (e.g., a second housing structure) may include a second lateral member 223 that at least partially forms the appearance of the electronic device 200, and a second lateral cover 224 that is combined with the second lateral member 223 and forms at least a portion of the fourth surface 222 of the electronic device 200. According to an embodiment, the second lateral member 223 may include a fourth side surface 223a, a fifth side surface 223b extending from one end of the fourth side surface 223a, and a sixth side surface 223c extending from the other end of the fourth side surface 223a. According to an embodiment, the second lateral member 223 may be formed into a quadrilateral shape using the fourth side surface 223a, the fifth side surface 223b, and the sixth side surface 223c.

[0054] According to the embodiments, the first housing 210 and the second housing 220 are not limited to the shapes and combinations shown, but can be implemented by combinations and / or configurations of other shapes or components. In the embodiments, the first transverse member 213 may be integrally formed with the first rear cover 214, and the second transverse member 223 may be integrally formed with the second rear cover 224.

[0055] According to an embodiment, in the unfolded state of the electronic device 200, the second side surface 213b of the first transverse member 213 and the fifth side surface 223b of the second transverse member 223 can be connected to each other without gaps. According to an embodiment, in the unfolded state of the electronic device 200, the third side surface 213c of the first transverse member 213 and the sixth side surface 223c of the second transverse member 223 can be connected to each other without gaps. According to an embodiment, in the unfolded state of the electronic device 200, the sum of the lengths of the second side surface 213b and the fifth side surface 223b can be configured to be longer than the lengths of the first side surface 213a and / or the fourth side surface 223a. According to an embodiment, in the unfolded state of the electronic device 200, the sum of the lengths of the third side surface 213c and the sixth side surface 223c can be configured to be longer than the lengths of the first side surface 213a and / or the fourth side surface 223a.

[0056] refer to Figure 2d and Figure 2e The first lateral member 213 and / or the second lateral member 223 may be formed of metal, or may further comprise a polymer injected into the metal. According to an embodiment, the first lateral member 213 and / or the second lateral member 223 may include at least one conductive portion 216 and / or 226 electrically segmented by at least one segmented portion 2161, 2162 and / or 2261, 2262 formed of polymer. In this case, at least one conductive portion 216 and / or 226 may be electrically connected to a wireless communication circuit included in the electronic device 200, and thus can be used as at least a portion of an antenna operating in at least one specified frequency band (e.g., a conventional frequency band).

[0057] According to an embodiment, the first back cover 214 and / or the second back cover 224 may be formed of at least one of, or a combination of at least two of, coated or colored glass, ceramic, polymer or metal (e.g., aluminum, stainless steel (STS) or magnesium).

[0058] According to an embodiment, the first display 230 may be configured to extend from the first surface 211 of the first housing 210 across a hinge device (e.g., Figure 2b The hinge device 240 extends to at least a portion of the third surface 221 of the second housing 220. In an embodiment, the first display 230 may include a first region 230a substantially corresponding to the first surface 211, a second region 230b corresponding to the second surface 221, and a third region 230c (e.g., a flexible region or a folding region) connecting the first region 230a and the second region 230b to each other. According to an embodiment, the third region 230c may be a part of the first region 220a and / or the second region 230b, and may be disposed with respect to the hinge device (e.g., the hinge device 240). Figure 2b The hinge device 240 is located at a position corresponding to the hinge device 240. According to an embodiment, the electronic device 200 may include a support hinge device (e.g., Figure 2b The hinge housing 241 (e.g., hinge cover) of the hinge device 240. In an embodiment, the hinge housing 241 may be configured to be exposed to the outside when the electronic device 200 is in a folded state, and not visible from the outside when the electronic device 200 is in an unfolded state because it is pulled into the interior space of the first housing 210 and the interior space of the second housing 220.

[0059] According to an embodiment, the electronic device 200 may include a second display 231 (e.g., a sub-display) disposed separately from the first display 230. According to an embodiment, the second display 231 may be configured to be at least partially exposed on a second surface 212 of the first housing 210. In an embodiment, when the electronic device 200 is in a folded state, the second display 231 may display at least a portion of the status information of the electronic device 200 in place of at least a portion of the display function of the first display 230. According to an embodiment, the second display 231 may be configured to be viewed from the outside through at least a portion of the first rear cover 214. In an embodiment, the second display 231 may be disposed on a fourth surface 222 of the second housing 220. In this case, the second display 231 may be configured to be viewed from the outside through at least a portion of the second rear cover 224.

[0060] According to an embodiment, the electronic device 200 may include at least one of an input device 203 (e.g., a microphone), sound output devices 201 and 202, a sensor module 204, camera devices 205 and 208, a key input device 206, or a connector port 207. In the illustrated embodiment, although the input device 203 (e.g., a microphone), sound output devices 201 and 202, sensor module 204, camera devices 205 and 208, key input device 206, or connector port 207 are shown as holes or circular elements formed on the first housing 210 or the second housing 220, they are shown exemplarily for explanation and are not limited thereto. According to an embodiment, the input device 203 may include at least one microphone 203 disposed on the second housing 220. In an embodiment, the input device 203 may include a plurality of microphones 203 configured to sense the direction of sound. In an embodiment, the plurality of microphones 203 may be disposed at appropriate locations on the first housing 210 and / or the second housing 220. According to an embodiment, the sound output devices 201 and 202 may include at least one speaker 201 and 202. According to an embodiment, at least one speaker 201 and 202 may include a receiver 201 for making calls disposed on a first housing 210 and a speaker 202 disposed on a second housing 220. In an embodiment, the input device 203, the sound output devices 201 and 202, and the connector port 207 may be disposed within the space provided in the first housing 210 and / or the second housing 220 of the electronic device 200, and may be exposed to the external environment through at least one hole formed in the first housing 210 and / or the second housing 220. According to an embodiment, at least one connector port 207 may be used to transmit power and / or data to and from an external electronic device. In an embodiment, at least one connector port (e.g., a headphone jack) may accommodate a connector (e.g., a headphone socket) for transmitting audio signals to and from an external electronic device. In an embodiment, the holes formed in the first housing 210 and / or the second housing 220 may be used together for the input device 203 and the sound output devices 201 and 202. In an embodiment, the sound output devices 201 and 202 may include loudspeakers (e.g., piezoelectric loudspeakers) that are not exposed through holes formed in the first housing 210 and / or the second housing 220.

[0061] According to an embodiment, sensor module 204 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of electronic device 200. According to an embodiment, sensor module 204 can detect the external environment through a first surface 211 of the first housing 210. In an embodiment, electronic device 200 may further include at least one sensor module configured to detect the external environment through a second surface 212 of the first housing 210. According to an embodiment, sensor module 204 (e.g., an illuminance sensor) may be configured to detect the external environment below the first display 230 and through the first display 230. According to an embodiment, sensor module 204 may include at least one of a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared (IR) sensor, biosensor, temperature sensor, humidity sensor, illuminance sensor, proximity sensor, biosensor, ultrasonic sensor, or illuminance sensor 204.

[0062] According to an embodiment, camera devices 205 and 208 may include a first camera device 205 (e.g., a front-facing camera device) disposed on a first surface 211 of the first housing 210 and a second camera device 208 disposed on a second surface 212 of the first housing 210. In an embodiment, the electronic device 200 may also include a flash 209 disposed near the second camera device 208. According to an embodiment, camera devices 205 and 208 may include at least one lens, an image sensor, and / or an image signal processor. According to an embodiment, camera devices 205 and 208 may be configured such that two or more lenses (e.g., wide-angle lenses, ultra-wide-angle lenses, or telephoto lenses) and two or more image sensors are located on a surface of the electronic device 200 (e.g., a first surface 211, a second surface 212, a third surface 221, or a fourth surface 222). In an embodiment, camera devices 205 and 208 may include a lens and / or an image sensor for time-of-flight (TOF) measurement.

[0063] According to an embodiment, a key input device 206 (e.g., a key button) may be disposed on a third side surface 213c of the first transverse member 213 of the first housing 210. In an embodiment, the key input device 206 may be disposed on at least one of the other side surfaces 213a and 213b of the first housing 210 and / or the side surfaces 223a, 223b, and 223c of the second housing 220. In an embodiment, the electronic device 200 may not include some or all of the key input devices 206, and the un-included key input devices 206 may be implemented on the first display 230 in another form (such as soft keys). In an embodiment, the key input device 206 may be implemented using a pressure sensor included in the first display 230.

[0064] According to an embodiment, one of camera devices 205 and 208 (e.g., the first camera device 205) or sensor module 204 may be configured to be exposed through the first display 230. According to an embodiment, the first camera device 205 or sensor module 204 may be optically exposed to the outside within the internal space of the electronic device 200 through an opening (e.g., a through-hole) at least partially formed on the first display 230. According to an embodiment, at least a portion of the sensor module 204 may be configured to be visually exposed within the internal space of the electronic device 200 without penetrating the first display 230. Reference Figure 2e The electronic device 200 can be connected via a hinge mechanism (e.g., Figure 2b The hinge device 240 operates to maintain at least one specified folding angle in an intermediate state. In this case, the electronic device 200 can control the first display 230 so that different types of content are displayed on a display area corresponding to the first surface 211 and a display area corresponding to the third surface 221. According to an embodiment, the electronic device 200 can use the hinge device (e.g., Figure 2b The hinge device 240 is in a substantially unfolded state based on a specific folding angle (e.g., the angle between the first housing 210 and the second housing 220 when the electronic device 200 is in an intermediate state). Figure 2a (the unfolded state) and / or substantially folded state (e.g., Figure 2d (in a folded state). In an embodiment, if the electronic device 200 operates via a hinge device (e.g., Figure 2b When the hinge device 240 is in a state where it is unfolded at a specific folding angle, if a pressing force is applied in the unfolding direction (B1 direction), the electronic device 200 can be operated to change to the unfolded state (e.g., Figure 2a (The unfolded state). In an embodiment, if the electronic device 200 is connected by a hinge device (e.g., Figure 2b When the hinge device 240 is unfolded at a specific folding angle, applying pressure in the folding direction (B2 direction) allows the electronic device 200 to operate to transition to the folded state (e.g., Figure 2d (The folded state). In an embodiment, the electronic device 200 can be connected via a hinge device (e.g., Figure 2b The hinge device 240 is operated to maintain the extended state (not shown) at various angles (free stop function).

[0065] Figure 3a and Figure 3b This is a diagram illustrating an electronic device 300 according to an embodiment of the present disclosure.

[0066] Figure 3a This is a diagram illustrating an electronic device 300 according to an embodiment of the present disclosure. Figure 3bThis illustrates an embodiment according to the present disclosure. Figure 3a The cross-sectional view of the electronic device 300 taken by line A-A' shown is shown.

[0067] When describing an electronic device 300 according to an embodiment of the present disclosure, the length direction of the electronic device 300 may refer to the y-axis direction, and the width direction of the electronic device 300 may refer to the x-axis direction. The height direction of the electronic device 300 may refer to the z-axis direction.

[0068] refer to Figure 3a and Figure 3b The electronic device 300 according to embodiments of the present disclosure may include a first housing 310, a second housing 320, a first flexible printed circuit board 330, a second flexible printed circuit board 340, a first printed circuit board 350, a second printed circuit board 360, a hinge housing 370, a support member 380, and / or a display 230.

[0069] according to Figure 3a The electronic device 300 of the embodiment shown may refer to Figure 2a The electronic device 200, or may include Figure 2a At least a portion of the electronic device 200.

[0070] The electronic device 300 according to an embodiment of the present disclosure may be a foldable device. The first housing 310 and the second housing 320 may be foldably connected to each other about a folding axis F.

[0071] In an embodiment, the electronic device 300 may include a folding region 300A (which may also be described as a folding area or folding portion) positioned between a first housing 310 and a second housing 320. Within the folding region 300A, a hinge 390 may be positioned to enable rotation of the first housing 310 and the second housing 320. The first housing 310 and the second housing 320 may be rotatably (or foldably) connected to each other via the hinge 390.

[0072] In one embodiment, the first printed circuit board 350 may be disposed in the first housing 310. The second printed circuit board 360 may be disposed in the second housing 320.

[0073] In an embodiment, a processor 120 (see [reference]) may be provided in the first printed circuit board 350 and / or the second printed circuit board 360. Figure 1 ) and / or memory 130 (see Figure 1 Processor 120 (see) Figure 1 This may include the main processor 121 (see...) Figure 1 (e.g., a central processing unit or processor) or an auxiliary processor 123 capable of operating independently or in conjunction with the main processor (see...) Figure 1(For example, a graphics processing device, a neural processing unit (NPU), an image signal processor, a sensor central processing unit, or a communication processor). Memory 130 (see...) Figure 1 ) may include volatile memory 132 (see Figure 1 ) or non-volatile memory 134 (see Figure 1 ).

[0074] In one embodiment, a first flexible printed circuit board 330 may be disposed in a first housing 310 and a second housing 320. The first flexible printed circuit board 330 may extend from the first housing 310 through the folded region 300A toward the second housing 320.

[0075] In this embodiment, one end of the first flexible printed circuit board 330 can be connected to the first printed circuit board 350, and the other end of the first flexible printed circuit board 330 can be connected to the second printed circuit board 360. The first flexible printed circuit board 330 can be electrically connected to the first printed circuit board 350 and the second printed circuit board 360.

[0076] In one embodiment, a second flexible printed circuit board 340 may be disposed in the first housing 310 and the second housing 320. The second flexible printed circuit board 340 may extend from the first housing 310 through the folded region 300A toward the second housing 320.

[0077] In this embodiment, one end of the second flexible printed circuit board 340 can be connected to the first printed circuit board 350, and the other end of the second flexible printed circuit board 340 can be connected to the second printed circuit board 360. The second flexible printed circuit board 340 can be electrically connected to the first printed circuit board 350 and the second printed circuit board 360.

[0078] Figure 3b A folding region 300A of an electronic device 300 according to an embodiment is shown (see [reference]). Figure 3a ).

[0079] refer to Figure 3b In the folding area 300A of the electronic device 300 (see...) Figure 3a The device may include at least a portion of a first housing 310, a second housing 320, a hinge housing 370, a first flexible printed circuit board 330, a support member 380, and a display 230.

[0080] In the embodiment, the hinge housing 370 may refer to Figure 2e The hinge housing 241 may include Figure 2e At least a portion of the hinge housing 241.

[0081] In this embodiment, the display 230 may refer to Figure 2aThe first display 230, or may include Figure 2a At least a portion of the first display 230.

[0082] In this embodiment, the support member 380 may function to support the display 230 disposed in the electronic device 300. For example, the support member 380 may support the display 230 positioned in its positive z-axis direction.

[0083] refer to Figure 3b In the folded area 300A, the first flexible printed circuit board 330 can be disposed between the support member 380 and the hinge housing 370.

[0084] In one embodiment, the hinge housing 370 may be configured to surround the outer edge of the first flexible printed circuit board 330 in the folding region 300A.

[0085] refer to Figure 3b In the folded region 300A of the electronic device 300, the first flexible printed circuit board 330 can be at least partially bent and extended. For example, the first flexible printed circuit board 330 can be at least partially bent while extending in a direction substantially parallel to the length direction (e.g., the y-axis direction) of the electronic device 300, and extend in the height direction (e.g., the z-axis direction) of the electronic device 300.

[0086] refer to Figure 3b The first flexible printed circuit board 330 may extend in a direction substantially parallel to the length direction (e.g., the y-axis direction) at the center point of the folded region 300A in the length direction (e.g., the y-axis direction) (e.g., the point in the folded region 300A where the first housing 310 and the second housing 320 face).

[0087] Figure 4 This is a diagram illustrating a multilayer flexible printed circuit board 420 according to an embodiment of the present disclosure.

[0088] The electronic device 400 according to embodiments of the present disclosure may refer to Figure 2a Electronic devices 200 or Figure 3a The electronic device 300, or may include Figure 2a Electronic devices 200 and Figure 3a The electronic device 300 is at least a portion of the device. For example, the electronic device 400 may be a foldable device, such as... Figure 2a The electronic device 200 shown.

[0089] Figure 4 This is a diagram illustrating a portion of an electronic device 400 according to an embodiment. For example, Figure 4 This could be the folded area 300A of the electronic device 400 (see...) Figure 3a and Figure 3b A cross-sectional view of ). Figure 4 This shows the electronic device 400 in its unfolded state, positioned in the folding area 300A (see [reference]). Figure 3a Figure 420 of the multilayer flexible printed circuit board in ).

[0090] In an embodiment, the electronic device 400 may include a hinge housing 410, a multilayer flexible printed circuit board 420, and / or a support member 430. The shape and function of the hinge housing 410 and the support member 430 may be respectively related to... Figure 3b The hinge housing 370 and the support member 380 are basically the same in shape and function. The multilayer flexible printed circuit board 420 can refer to... Figure 3a The first flexible printed circuit board 330 or the second flexible printed circuit board 340, or may be having a... Figure 3a The first flexible printed circuit board 330 or the second flexible printed circuit board 340 have essentially the same function.

[0091] In an embodiment, the multilayer flexible printed circuit board 420 may include a patterned (or patterned) layer 421 and / or a bonding layer 422.

[0092] In an embodiment, pattern layer 421 may be a layer through which electrical signals are transmitted in a multilayer flexible printed circuit board 420. Pattern layer may alternatively be described as a patterned layer, conductive layer, signal layer, tracked layer, or connection layer.

[0093] In embodiments, pattern layer 421 may include an insulator, a conductive pattern (e.g., copper foil), and / or an adhesive. For example, pattern layer 421 may be an insulator in which a conductive pattern (e.g., copper foil) is formed on one or another surface. Pattern layer 421 may include an adhesive for adhesion to other layers.

[0094] In an embodiment, the pattern layer 421 may be composed of multiple layers. For example, the pattern layer 421 may be composed of multiple layers and include a layer containing an insulator and a layer containing a conductive pattern.

[0095] In an embodiment, bonding layer 422 may perform the function of bonding two patterned layers 421 to each other. Bonding layer 422 may include an adhesive comprising an epoxy resin, but the material of bonding layer 422 may not be limited to this.

[0096] In an embodiment, bonding layer 422 may include prepreg. For example, bonding layer 422 may be in the form of a bonding sheet including prepreg.

[0097] In an embodiment, the multilayer flexible printed circuit board 420 may include a plurality of patterned layers 421. Patterned layers 421 may include a first patterned layer 4211, a second patterned layer 4212, a third patterned layer 4213, and / or a fourth patterned layer 4214. A bonding layer 422 may be arranged to bond corresponding portions of a pair of adjacent patterned layers together, those corresponding portions being, for example, confined to a non-flexible region NF.

[0098] refer to Figure 4 In the multilayer flexible printed circuit board 420, the pattern layer 421 can be stacked in the order of a first pattern layer 4211, a second pattern layer 4212, a third pattern layer 4213, and a fourth pattern layer 4214. For example, the second pattern layer 4212 can be stacked in one direction of the first pattern layer 4211, and the third pattern layer 4213 can be stacked in one direction of the second pattern layer 4212. The fourth pattern layer 4214 can be stacked in one direction of the third pattern layer 4213.

[0099] In an embodiment, each of the patterned layers 4211, 4212, 4213 and 4214 included in the multilayer flexible printed circuit board 420 may be configured to be insulated from each other.

[0100] In this embodiment, the first pattern layer 4211 may be the layer in the multilayer flexible printed circuit board 420 that is furthest from the hinge housing 410. The fourth pattern layer 4214 may be the layer in the multilayer flexible printed circuit board 420 that is closest to the hinge housing 410.

[0101] In an embodiment, the first pattern layer 4211 may be the layer closest to the display in the multilayer flexible printed circuit board 420 (e.g., Figure 3b The fourth pattern layer 4214 may be a layer positioned away from the display (e.g., the display 230) within the multilayer flexible printed circuit board 420. Figure 3b The layer with the furthest positioning (230) of the display.

[0102] In an embodiment, the multilayer flexible printed circuit board 420 may include a non-flexible region NF and / or a flexible region YF. The flexible region YF may be a region in which the multilayer flexible printed circuit board 420 is at least partially bent and extended. The non-flexible region NF may be a region in which the multilayer flexible printed circuit board 420 is bent and extended to a lesser degree than the flexible region YF. For example, the non-flexible region NF may be flat, or may have a curvature smaller than that of the flexible region YF. The multilayer flexible printed circuit board 420 may extend in one direction without bending in the non-flexible region NF, or may be bent and extended to a lesser degree in the non-flexible region NF than in the flexible region YF.

[0103] In an embodiment, at least a portion of the non-flexible region NF may be located at the center C of the folded region.

[0104] In an embodiment, the flexural region YF can be formed at a location symmetrical about the non-flexural region NF. For example, the flexural region YF can be located at one end and the other end of the non-flexural region NF.

[0105] In this embodiment, the bonding layer 422 may be disposed in the non-flexible region NF of the multilayer flexible printed circuit board 420. For example, the bonding layer 422 may be disposed only in the non-flexible region NF, and may not be disposed in the flexible region YF.

[0106] In an embodiment, in the non-flexible region NF of the multilayer flexible printed circuit board 420, a bonding layer 422 may be disposed between the first pattern layer 4211 and the second pattern layer 4212, and a portion of the first pattern layer and a portion of the second pattern layer may be bonded together. (See reference...) Figure 4 The first pattern layer 4211, in which the bonding layer 422 is provided, may be the pattern layer 421 that is furthest from the hinge housing 410.

[0107] exist Figure 4 Although the diagram shows the bonding layer 422 positioned between the patterned layers 421 furthest from the hinge housing 410, the location of the bonding layer 422 is not limited to this. For example, the bonding layer 422 may be disposed between the second patterned layer 4212 and the third patterned layer 4213 in the non-flexible region NF.

[0108] In an embodiment, the bonding layer 422 may have a predetermined thickness between the first pattern layer 4211 and the second pattern layer 4212, and extends along the length of the multilayer flexible printed circuit board 420. Because the bonding layer 422 has a predetermined thickness and extends, the first pattern layer 4211 and the second pattern layer 4212 may be positioned at a predetermined distance from each other.

[0109] In an embodiment, in the non-flexible region NF of the multilayer flexible printed circuit board 420, the bonding layer 422 may not be disposed between the second pattern layer 4212 and the third pattern layer 4213, or between the third pattern layer 4213 and the fourth pattern layer 4214.

[0110] When the bonding layer 422 is positioned closer to the display in the multilayer flexible printed circuit board 420 (e.g., Figure 3bWhen the multilayer flexible printed circuit board 420 is located at a layer (e.g., a layer further away from the hinge housing 410) of the display 230, the multilayer flexible printed circuit board 420 can easily maintain a defined design shape. In the multilayer flexible printed circuit board 420 according to the embodiment, because the bonding layer 422 is disposed between the first pattern layer 4211 and the second pattern layer 4212, when the multilayer flexible printed circuit board 420 is bent, the tension caused by the bonding layer 422 is transmitted to the third pattern layer 4213 and the fourth pattern layer 4214; therefore, the multilayer flexible printed circuit board 420 can easily maintain a defined design shape.

[0111] As the number of patterned layers 421 bonded together in the multilayer flexible printed circuit board 420 decreases, the multilayer flexible printed circuit board 420 can easily maintain a defined design shape. For example, when three or more patterned layers 421 are bonded together, the reaction forces generated in the patterned layers 421 increase; therefore, the multilayer flexible printed circuit board 420 may have difficulty maintaining a defined design shape. Because the multilayer flexible printed circuit board 420 according to the embodiment allows only two patterned layers 421 to be bonded together, the multilayer flexible printed circuit board 420 can easily maintain a defined design shape. In other words, in some embodiments, only one pair of adjacent patterned layers is bonded together, while the remaining pairs of adjacent patterned layers are not bonded together.

[0112] As the number of patterned layers 421 bonded to each other in the multilayer flexible printed circuit board 420 decreases, the stress applied to the multilayer flexible printed circuit board 420 can be reduced. When three or more patterned layers 421 are bonded to each other, the reaction force generated in the patterned layers 421 increases; therefore, the stress applied to the multilayer flexible printed circuit board 420 increases, thereby reducing the lifespan of the multilayer flexible printed circuit board 420. In the multilayer flexible printed circuit board 420 according to the embodiment, because only two patterned layers 421 are bonded to each other, the stress applied to the multilayer flexible printed circuit board 420 is reduced, thereby increasing the lifespan of the multilayer flexible printed circuit board 420.

[0113] When the bonding layer 422 is positioned adjacent to the flexural region YF in the multilayer flexible printed circuit board 420, the stress applied to the bent portion of the multilayer flexible printed circuit board 420 can be increased. In the multilayer flexible printed circuit board 420 according to the embodiment, by forming the bonding layer 422 only in the non-flexural region NF, the stress applied to the bent portion of the multilayer flexible printed circuit board 420 can be reduced.

[0114] When the multilayer flexible printed circuit board 420 includes a bonding layer 422, the path loss of the multilayer flexible printed circuit board 420 can be reduced. For example, the gap between the patterned layers 421 in which the bonding layer 422 is disposed is maintained by the thickness of the bonding layer 422 to form a transmission line; therefore, the path loss of the multilayer flexible printed circuit board 420 can be reduced. The transmission line having the patterned layers 421 in which the bonding layer 422 is disposed can be a stripline or a microstripline. Because the multilayer flexible printed circuit board 420 according to the embodiment includes a bonding layer 422 in at least a portion thereof, the path loss can be reduced compared to the case where the bonding layer 422 is not present.

[0115] exist Figure 4 Although the diagram shows a bonding layer 422 disposed only between two patterned layers 421, the multilayer flexible printed circuit board 420 according to an embodiment may include multiple bonding layers 422 in the non-flexible region NF, and the multiple bonding layers 422 may be positioned between different patterned layers 421. Even when the multilayer flexible printed circuit board 420 includes multiple bonding layers 422, the bonding layer 422 may not be formed between at least two patterned layers 421. The multilayer flexible printed circuit board 420 according to an embodiment may not have at least one bonding layer 422 formed in the patterned layers 421 in the non-flexible region NF. In other words, in some embodiments, the multilayer flexible printed circuit board includes at least a pair of adjacent patterned layers that are not bonded together in the flexible region.

[0116] In an embodiment, the flexibility of the non-flexible region NF in which the bonding layer 422 is formed may be lower than the flexibility of the flexible region YF. In an embodiment, flexibility may refer to the degree to which the multilayer flexible printed circuit board 420 is easily bent. Compared to the non-flexible region NF in which the bonding layer 422 is formed, the flexible region YF of the multilayer flexible printed circuit board 420 can be bent more easily.

[0117] In an embodiment, the multilayer flexible printed circuit board 420 may include, except for the folded region 300A (see [reference]). Figure 3a The bonding layer 422 is formed at least partially in the area outside the patterned layers 421. For example, Figure 4 A multilayer flexible printed circuit board 420 in the folded region 300A of the electronic device 400 is shown, but the multilayer flexible printed circuit board 420 can be... Figure 4 The region not shown, excluding the folded region, includes a bonding layer 422. In the region excluding the folded region, the multilayer flexible printed circuit board 420 may include all bonding layers 422 between each patterned layer 421, or may include bonding layers 422 only between some of the multiple patterned layers 421.

[0118] Figure 5This is a diagram illustrating a multilayer flexible printed circuit board 520 according to an embodiment of the present disclosure.

[0119] The electronic device 500 according to the embodiment may refer to Figure 2a Electronic devices 200 or Figure 3a The electronic device 300, or may include Figure 2a Electronic devices 200 and Figure 3a The electronic device 300 is at least a portion of the device. For example, the electronic device 500 may be a foldable device, such as... Figure 2a The electronic device 200 shown.

[0120] Figure 5 This is a diagram illustrating a portion of an electronic device 500 according to an embodiment. For example, Figure 5 This could be the folded area 300A of the electronic device 500 (see...) Figure 3a and Figure 3b A cross-sectional view of ). Figure 5 This shows the electronic device 500 in its unfolded state, positioned in the folding area 300A (see [reference]). Figure 3a The figure shows the multilayer flexible printed circuit board 520 in the diagram.

[0121] In an embodiment, the electronic device 500 may include a housing 505, a hinge housing 510, a multilayer flexible printed circuit board 520, a support member 530, and / or a display 230. The functions of the housing 505, hinge housing 510, multilayer flexible printed circuit board 520, and support member 530 may be related to... Figure 3b The housings 310 and 320, hinge housing 370, first flexible printed circuit board 330, support member 380 and display 230 have basically the same function.

[0122] In one embodiment, the multilayer flexible printed circuit board 520 may be disposed between the hinge housing 510 and the support member 530.

[0123] In an embodiment, the multilayer flexible printed circuit board 520 may include a pattern layer 521 and / or a bonding layer 522.

[0124] The functions and materials of the pattern layer 521 and the bonding layer 522 according to the embodiment can be related to... Figure 4 The pattern layer 421 and the bonding layer 422 have essentially the same function and material. The description of the function and material of the pattern layer 521 and the bonding layer 522 can be omitted.

[0125] In an embodiment, the multilayer flexible printed circuit board 520 may include a plurality of pattern layers 521. The pattern layers 521 may include a first pattern layer 5211, a second pattern layer 5212, a third pattern layer 5213 and / or a fourth pattern layer 5214.

[0126] refer to Figure 5 In the multilayer flexible printed circuit board 520, the pattern layer 521 can be stacked in the order of a first pattern layer 5211, a second pattern layer 5212, a third pattern layer 5213, and a fourth pattern layer 5214. For example, the second pattern layer 5212 can be stacked in one direction of the first pattern layer 5211, and the third pattern layer 5213 can be stacked in one direction of the second pattern layer 5212. The fourth pattern layer 5214 can be stacked in one direction of the third pattern layer 5213.

[0127] In one embodiment, the first pattern layer 5211 may be the layer in the multilayer flexible printed circuit board 520 that is furthest from the hinge housing 510. The fourth pattern layer 5214 may be the layer in the multilayer flexible printed circuit board 520 that is closest to the hinge housing 510.

[0128] In this embodiment, the first pattern layer 5211 may be the layer in the multilayer flexible printed circuit board 520 that is closest to the display 230. The fourth pattern layer 5214 may be the layer in the multilayer flexible printed circuit board 520 that is furthest from the display 230.

[0129] In an embodiment, bonding layer 522 may include a first bonding layer 5221 and / or a second bonding layer 5222.

[0130] In an embodiment, the multilayer flexible printed circuit board 520 may include a first non-flexible region NF1, a second non-flexible region NF2, a third non-flexible region NF3, a first flexible region YF1, and / or a second flexible region YF2.

[0131] In an embodiment, the first non-flexible region NF1, the second non-flexible region NF2, and the third non-flexible region NF3 can be regions in which the multilayer flexible printed circuit board 520 does not bend but extends in one direction. The first flexible region YF1 and the second flexible region YF2 can be regions in which the multilayer flexible printed circuit board 520 is at least partially bent and extended.

[0132] In an embodiment, the second non-flexible region NF2, the third non-flexible region NF3, the first flexible region YF1, and the second flexible region YF2 can be formed in pairs at positions symmetrical about the first non-flexible region NF1. For example, the first flexible region YF1 can be located at one end and the other end of the first non-flexible region NF1. The second non-flexible region NF2 can be located on one side and the opposite side of the first non-flexible region NF1, with the first flexible region YF1 interposed therebetween. The third non-flexible region NF3 can be located on one side and the opposite side of the first non-flexible region NF1, with the first flexible region YF1, the second non-flexible region NF2, and the second flexible region YF2 interposed therebetween.

[0133] In one embodiment, at least a portion of the first non-flexible region NF1 may be located at the center C of the folded region. The second non-flexible region NF2 may be located symmetrically about the first non-flexible region NF1.

[0134] In an embodiment, the first flexural region YF1 may be positioned between the first non-flexural region NF1 and the second non-flexural region NF2. For example, the multilayer flexible printed circuit board 520 may extend parallel in one direction in the first non-flexural region NF1, bend in the first flexural region YF1, and connect to the second non-flexural region NF2.

[0135] In an embodiment, the second flexural region YF2 may be positioned between the second non-flexural region NF2 and the third non-flexural region NF3. For example, the multilayer flexible printed circuit board 520 may extend parallel in one direction within the second non-flexural region NF2, bend within the second flexural region YF2, and connect to the third non-flexural region NF3.

[0136] In this embodiment, the bonding layer 522 may be disposed in the non-flexible regions NF1, NF2, and NF3 of the multilayer flexible printed circuit board 520. For example, the bonding layer 522 may be disposed only in the non-flexible regions NF1, NF2, and NF3, but may not be disposed in the flexible regions YF1 and YF2.

[0137] In an embodiment, a bonding layer 522 may be formed in each of the non-flexible regions NF1, NF2, and NF3 of the multilayer flexible printed circuit board 520. For example, in the non-flexible regions NF1, NF2, and NF3 of the multilayer flexible printed circuit board 520, only one bonding layer 522 may be formed between two defined patterned layers 521, but may not be formed between the remaining patterned layers 521.

[0138] In embodiments, the location of the bonding layer 522 (e.g., the layer in which the bonding layer 522 is disposed within the multilayer flexible printed circuit board 520) can vary depending on the non-flexible regions NF1, NF2, and NF3. For example, refer to Figure 5 In the first non-flexible region NF1, a first bonding layer 5221 can be formed between the first pattern layer 5211 and the second pattern layer 5212. In the second non-flexible region NF2, a second bonding layer 5222 can be formed between the third pattern layer 5213 and the fourth pattern layer 5214.

[0139] Although not in Figure 5As shown, however, the multilayer flexible printed circuit board 520 may include a bonding layer 522 in the third non-flexible region NF3 at a location different from that in the second non-flexible region NF2. For example, in the third non-flexible region NF3, a first bonding layer 5221 disposed between the first pattern layer 5211 and the second pattern layer 5212 may be formed.

[0140] exist Figure 5 Although the diagram shows a bonding layer 522 disposed only between two patterned layers 521, the multilayer flexible printed circuit board 520 according to an embodiment may include multiple bonding layers 522 in a non-flexible region (e.g., NF1), and the multiple bonding layers 522 may be positioned between different patterned layers 521. Even when the multilayer flexible printed circuit board 520 includes multiple bonding layers 522, the bonding layer 522 may not be formed between at least two patterned layers 521. The multilayer flexible printed circuit board 520 according to an embodiment may not have at least one bonding layer 522 formed in the patterned layers 521 in a non-flexible region (e.g., NF1).

[0141] Figure 6 This is a diagram illustrating a multilayer flexible printed circuit board 620 according to an embodiment of the present disclosure.

[0142] The electronic device 600 according to the embodiment may refer to Figure 2a Electronic devices 200 or Figure 3a The electronic device 300, or may include Figure 2a Electronic devices 200 and Figure 3a The electronic device 300 is at least a portion of the device. For example, the electronic device 600 may be a foldable device, such as... Figure 2a The electronic device 200 shown.

[0143] Figure 6 This is a diagram illustrating a portion of an electronic device 600 according to an embodiment. For example, Figure 6 This could be the folded area 300A of the electronic device 600 (see...) Figure 3a and Figure 3b A cross-sectional view of ). Figure 6 This shows the electronic device 600 in its unfolded state, positioned in the folding area 300A (see [reference]). Figure 3a The figure shows the multilayer flexible printed circuit board 620 in the diagram.

[0144] In an embodiment, the electronic device 600 may include a hinge housing 610 and / or a multilayer flexible printed circuit board 620. The functions of the hinge housing 610 and the multilayer flexible printed circuit board 620 may be related to... Figure 3b The hinge housing 370 and the first flexible printed circuit board 330 have essentially the same function.

[0145] In an embodiment, the multilayer flexible printed circuit board 620 may include a pattern layer 621 and / or a bonding layer 622.

[0146] The functions and materials of the pattern layer 621 and the bonding layer 622 according to the embodiment can be related to... Figure 4 The pattern layer 421 and the bonding layer 422 have essentially the same function and material. The description of the function and material of the pattern layer 621 and the bonding layer 622 can be omitted.

[0147] In an embodiment, the multilayer flexible printed circuit board 620 may include a plurality of pattern layers 621. The pattern layers 621 may include a first pattern layer 6211, a second pattern layer 6212, a third pattern layer 6213 and / or a fourth pattern layer 6214.

[0148] refer to Figure 6 In the multilayer flexible printed circuit board 620, the pattern layer 621 can be stacked in the order of a first pattern layer 6211, a second pattern layer 6212, a third pattern layer 6213, and a fourth pattern layer 6214. For example, the second pattern layer 6212 can be stacked in one direction of the first pattern layer 6211, and the third pattern layer 6213 can be stacked in one direction of the second pattern layer 6212. The fourth pattern layer 6214 can be stacked in one direction of the third pattern layer 6213.

[0149] In this embodiment, the first pattern layer 6211 may be the layer in the multilayer flexible printed circuit board 620 that is furthest from the hinge housing 610. The fourth pattern layer 6214 may be the layer in the multilayer flexible printed circuit board 620 that is closest to the hinge housing 610.

[0150] In an embodiment, the first pattern layer 6211 may be the layer closest to the display in the multilayer flexible printed circuit board 620 (e.g., Figure 3b The first display 230) is positioned as a layer. The fourth pattern layer 6214 may be located in the multilayer flexible printed circuit board 620 away from the display (e.g., Figure 3b The first display (230) is the layer with the furthest positioning.

[0151] In one embodiment, bonding layer 622 may include a first bonding layer 6221 and / or a second bonding layer 6222.

[0152] In an embodiment, the multilayer flexible printed circuit board 620 may include a first non-flexible region NF1, a second non-flexible region NF2 and / or a first flexible region YF1.

[0153] In an embodiment, the first non-flexible region NF1 and the second non-flexible region NF2 can be regions in which the multilayer flexible printed circuit board 620 does not bend but extends in one direction. The first flexible region YF1 can be a region in which the multilayer flexible printed circuit board 620 is at least partially bent and extended.

[0154] In an embodiment, the second non-flexible region NF2 and the first flexible region YF1 can be formed in pairs at symmetrical positions with respect to the first non-flexible region NF1. For example, the first flexible region YF1 can be located at one end and the other end of the first non-flexible region NF1. The second non-flexible region NF2 can be located on one side and the opposite side of the first non-flexible region NF1, respectively, with the first flexible region YF1 interposed therebetween.

[0155] In an embodiment, the first flexural region YF1 may be positioned between the first non-flexural region NF1 and the second non-flexural region NF2. For example, the multilayer flexible printed circuit board 520 may extend parallel in one direction in the first non-flexural region NF1, and then bend and extend in the first flexural region YF1 to connect to the second non-flexural region NF2.

[0156] According to an embodiment, the multilayer flexible printed circuit board 620 can extend in a W-shaped manner when the electronic device 600 is in its unfolded state. For example, the multilayer flexible printed circuit board 620 can extend to have two convex shapes in opposite directions toward the hinge housing 610 at positions symmetrical about the first non-flexible region NF1. (See reference...) Figure 6 The multilayer flexible printed circuit board 620 can be bent and extended in a convex shape in opposite directions of the hinge housing 610 in two first flexural regions YF1.

[0157] According to an embodiment, the multilayer flexible printed circuit board 620 can extend in the second non-flexible region NF2 along an inclined direction based on the first non-flexible region NF1 in the unfolded state of the electronic device 600. For example, referring to... Figure 6 The first non-flexible region NF1 can extend in a direction parallel to the y-axis, and the second non-flexible region NF2 can extend in a direction parallel to the tilt direction from the y-axis toward the z-axis.

[0158] In an embodiment, a bonding layer 622 may be provided in the first non-flexible region NF1 and the second non-flexible region NF2 of the multilayer flexible printed circuit board 620. For example, the bonding layer 622 may be provided only in the first non-flexible region NF1 and the second non-flexible region NF2, but may not be provided in the first flexible region NF1.

[0159] In an embodiment, a bonding layer 622 may be formed in each of the non-flexible regions NF1, NF2, and NF3 of the multilayer flexible printed circuit board 620. For example, in the non-flexible regions NF1 and NF2 of the multilayer flexible printed circuit board 620, only one bonding layer 622 may be formed between two defined patterned layers 621, but may not be formed between the remaining patterned layers 621.

[0160] In embodiments, the location of the bonding layer 622 (e.g., the layer in which the bonding layer 622 is disposed within the multilayer flexible printed circuit board 620) can vary depending on the non-flexible regions NF1 and NF2. For example, refer to Figure 6 In the first non-flexible region NF1, a first bonding layer 6221 can be formed between the first pattern layer 6211 and the second pattern layer 6212. In the second non-flexible region NF2, a second bonding layer 6222 can be formed between the third pattern layer 6213 and the fourth pattern layer 6214.

[0161] exist Figure 6 Although the diagram shows a bonding layer 622 disposed only between two patterned layers 621, the multilayer flexible printed circuit board 620 according to an embodiment may include multiple bonding layers 622 in a non-flexible region (e.g., NF1), and the multiple bonding layers 622 may be positioned between different patterned layers 621. Even when the multilayer flexible printed circuit board 620 includes multiple bonding layers 622, the bonding layer 622 may not be formed between at least two patterned layers 621. The multilayer flexible printed circuit board 620 according to an embodiment may not have at least one bonding layer 622 formed in the patterned layers 621 in a non-flexible region (e.g., NF1).

[0162] Figure 7 This is a diagram illustrating a multilayer flexible printed circuit board 720 according to an embodiment of the present disclosure.

[0163] The electronic device 700 according to the embodiment may refer to Figure 2a Electronic devices 200 or Figure 3a The electronic device 300, or may include Figure 2a Electronic devices 200 and Figure 3a The electronic device 700 is at least a portion of the device. For example, the electronic device 700 may be a foldable device, such as... Figure 2a The electronic device 200 shown is shown.

[0164] Figure 7 This is a diagram illustrating a portion of an electronic device 700 according to an embodiment. For example, Figure 7 This could be the folded area 300A of the electronic device 700 (see...) Figure 3a and Figure 3bA cross-sectional view of ). Figure 7 This shows the electronic device 700 in its unfolded state, positioned in the folding area 300A (see [reference]). Figure 3a The figure shows the multilayer flexible printed circuit board 720 in the diagram.

[0165] In an embodiment, the electronic device 700 may include a hinge housing 710 and / or a multilayer flexible printed circuit board 720. The functions of the hinge housing 710 and the multilayer flexible printed circuit board 720 may be related to... Figure 3b The hinge housing 370 and the first flexible printed circuit board 330 have essentially the same function.

[0166] In an embodiment, the multilayer flexible printed circuit board 720 may include a pattern layer 721 and / or a bonding layer 722.

[0167] The functions and materials of the pattern layer 721 and the bonding layer 722 according to the embodiment can be related to... Figure 4 The pattern layer 421 and the bonding layer 422 have essentially the same function and material. The description of the function and material of the pattern layer 721 and the bonding layer 722 can be omitted.

[0168] In an embodiment, the multilayer flexible printed circuit board 720 may include a plurality of pattern layers 721. The pattern layers 721 may include a first pattern layer 7211, a second pattern layer 7212, a third pattern layer 7213 and / or a fourth pattern layer 7214.

[0169] refer to Figure 7 In the multilayer flexible printed circuit board 720, the pattern layer 721 can be stacked in the order of a first pattern layer 7211, a second pattern layer 7212, a third pattern layer 7213, and a fourth pattern layer 7214. For example, the second pattern layer 7212 can be stacked in one direction of the first pattern layer 7211, and the third pattern layer 7213 can be stacked in one direction of the second pattern layer 7212. The fourth pattern layer 7214 can be stacked in one direction of the third pattern layer 7213.

[0170] In one embodiment, the first pattern layer 7211 may be the layer in the multilayer flexible printed circuit board 720 that is furthest from the hinge housing 710. The fourth pattern layer 7214 may be the layer in the multilayer flexible printed circuit board 720 that is closest to the hinge housing 710.

[0171] In an embodiment, the first pattern layer 7211 may be the layer closest to the display in the multilayer flexible printed circuit board 720 (e.g., Figure 3b The first display 230) is positioned as a layer. The fourth pattern layer 7214 may be located in the multilayer flexible printed circuit board 720 away from the display (e.g., Figure 3b The first display (230) is the layer with the furthest positioning.

[0172] In an embodiment, bonding layer 722 may include a first bonding layer 7221 and / or a second bonding layer 7222.

[0173] In an embodiment, the multilayer flexible printed circuit board 720 may include a first non-flexible region NF1, a second non-flexible region NF2, a third non-flexible region NF3, a first flexible region YF1, and / or a second flexible region YF2.

[0174] In an embodiment, the first non-flexible region NF1, the second non-flexible region NF2, and the third non-flexible region NF3 can be regions in which the multilayer flexible printed circuit board 720 is not bent and extends in one direction. The first flexible region YF1 and the second flexible region YF2 can be regions in which the multilayer flexible printed circuit board 720 is at least partially bent and extended.

[0175] In the multilayer flexible printed circuit board 720 according to an embodiment, the second non-flexible region NF2, the third non-flexible region NF3, the first flexible region YF1, and the second flexible region YF2 can be formed in pairs at symmetrical positions with respect to the first non-flexible region NF1. For example, the first flexible region YF1 can be positioned at one end and the other end of the first non-flexible region NF1. The second non-flexible region NF2 can be positioned on one side and the opposite side of the first non-flexible region NF1, respectively, with the first flexible region YF1 interposed therebetween. The third non-flexible region NF3 can be positioned on one side and the opposite side of the first non-flexible region NF1, respectively, with the first flexible region YF1, the second non-flexible region NF2, and the second flexible region YF2 interposed therebetween.

[0176] In the multilayer flexible printed circuit board 720 according to an embodiment, a first flexural region YF1 may be positioned between a first non-flexural region NF1 and a second non-flexural region NF2. For example, the multilayer flexible printed circuit board 720 may extend parallel in one direction in the first non-flexural region NF1, and then bend and extend in the first flexural region YF1 to connect to the second non-flexural region NF2.

[0177] In the multilayer flexible printed circuit board 720 according to an embodiment, the second flexural region YF2 can be positioned between the second non-flexural region NF2 and the third non-flexural region NF3. For example, the multilayer flexible printed circuit board 520 can extend parallel in one direction in the second non-flexural region NF2, and then bend and extend in the second flexural region YF2 to connect to the third non-flexural region NF3.

[0178] The multilayer flexible printed circuit board 720 according to an embodiment can be extended such that at least a portion thereof has a U-shaped form in the unfolded state of the electronic device 700. For example, in the multilayer flexible printed circuit board 720, portions of the multilayer flexible printed circuit board 720 in the first non-flexible region NF1 and the two second non-flexible regions NF2 can have a convex shape and extend in one direction (e.g., the negative z-axis direction). The multilayer flexible printed circuit board 720 can also extend in the first flexible region YF1 in another direction (e.g., the positive z-axis direction) to have a convex shape.

[0179] In the multilayer flexible printed circuit board 720 according to an embodiment, a first non-flexible region NF1 and two second non-flexible regions NF2 may extend parallel to each other. Compared to the second non-flexible regions NF2, the first non-flexible region NF1 of the multilayer flexible printed circuit board 720 may be closer to the display (e.g., Figure 3b The first display (230) is positioned.

[0180] In this embodiment, the bonding layer 722 may be disposed in the non-flexible regions NF1, NF2, and NF3 of the multilayer flexible printed circuit board 720. For example, the bonding layer 722 may be disposed only in the non-flexible regions NF1, NF2, and NF3 of the multilayer flexible printed circuit board 720, but may not be disposed in the flexible regions YF1 and YF2.

[0181] In an embodiment, a bonding layer 722 may be formed in each of the non-flexible regions NF1, NF2, and NF3 of the multilayer flexible printed circuit board 720. For example, in the non-flexible regions NF1, NF2, and NF3 of the multilayer flexible printed circuit board 720, only one bonding layer 722 may be formed between two defined patterned layers 721, but may not be formed between the remaining patterned layers 721.

[0182] In an embodiment, the bonding layer 722 may be disposed in different layers in two non-flexible regions NF1, NF2, and NF3 located on opposite sides of a flexible region YF1 and YF2. The fact that the bonding layer 722 is disposed in different layers can mean that the bonding layer 722 is disposed between different pattern layers 721. For example, in the first non-flexible region NF1 and the second non-flexible region NF2 located on opposite sides of the first flexible region YF1, the bonding layer 722 may be disposed in different layers. In the first non-flexible region NF1, a first bonding layer 7221 may be formed between the first pattern layer 7211 and the second pattern layer 7212. In the second non-flexible region NF2, a second bonding layer 7222 may be formed between the third pattern layer 7213 and the fourth pattern layer 7214. Similarly, in the second non-flexible region NF2 and the third non-flexible region NF3 located on opposite sides of the second flexible region YF2, the bonding layer 722 may be disposed in different layers. In the third non-flexible region NF3, a second bonding layer 7222 can be formed between the first pattern layer 7211 and the second pattern layer 7212.

[0183] exist Figure 7 Although the diagram shows a bonding layer 722 disposed only between two patterned layers 721, the multilayer flexible printed circuit board 720 according to an embodiment may include multiple bonding layers 722 in a non-flexible region (e.g., NF1), and the multiple bonding layers 722 may be positioned between different patterned layers 721. Even when the multilayer flexible printed circuit board 720 includes multiple bonding layers 722, the bonding layer 722 may not be formed between at least two patterned layers 721. The multilayer flexible printed circuit board 720 according to an embodiment may not have at least one bonding layer 722 formed in the patterned layers 721 in a non-flexible region (e.g., NF1).

[0184] Figure 8 This is a diagram illustrating a multilayer flexible printed circuit board 820 according to an embodiment of the present disclosure.

[0185] according to Figure 8 The multilayer flexible printed circuit board 820 of the embodiment shown can be used with Figure 6 The multilayer flexible printed circuit board 620 has a shape that is essentially the same as the shape of the extended board.

[0186] Because according to Figure 8 The multilayer flexible printed circuit board 820 of the embodiment shown has with Figure 6 The multilayer flexible printed circuit board 620 has a shape and function that are basically the same, so the difference can be omitted. Figure 6 The structure of the multilayer flexible printed circuit board 620 is basically the same as that described.

[0187] according to Figure 8 The multilayer flexible printed circuit board 820 of the embodiment shown may include more than Figure 6 The multilayer flexible printed circuit board 620 has fewer patterned layers 821. For example, Figure 8 The multilayer flexible printed circuit board 820 may include three patterned layers 821.

[0188] In an embodiment, the multilayer flexible printed circuit board 820 may include a pattern layer 821 and / or a bonding layer 822.

[0189] In an embodiment, pattern layer 821 may include a first pattern layer 8211, a second pattern layer 8212, and / or a third pattern layer 8213.

[0190] In an embodiment, bonding layer 822 may include a first bonding layer 8221 and / or a second bonding layer 8222.

[0191] In embodiments, the location of the bonding layer 822 (e.g., the layer in which the bonding layer 822 is disposed within the multilayer flexible printed circuit board 820) can vary depending on the non-flexible regions NF1 and NF2. For example, refer to Figure 8 In the first non-flexible region NF1, a first bonding layer 8221 may be formed between the first pattern layer 8211 and the second pattern layer 8212. In the second non-flexible region NF2, a second bonding layer 8222 may be formed between the second pattern layer 8212 and the third pattern layer 8213.

[0192] In embodiments, when bonding layers 522, 622, 722, and 822 are positioned in different layers (e.g., between different patterned layers) in adjacent non-flexible regions (e.g., NF1 and NF2), the stress applied to the multilayer flexible printed circuit board 520, 620, 720, and 820 can be reduced, and the multilayer flexible printed circuit board 520 can easily maintain a defined shape. For example, when bonding layers 522, 622, 722, and 822 are positioned in different layers in adjacent non-flexible regions (e.g., NF1 and NF2), the effective separation distance ED between bonding layers 522, 622, 722, and 822 (see [link to documentation]) can be increased. Figure 10b The stress applied to the multilayer flexible printed circuit boards 520, 620, 720 and 820 can be reduced, and the multilayer flexible printed circuit boards 520, 620, 720 and 820 can easily maintain a defined shape.

[0193] Because the multilayer flexible printed circuit boards 520, 620, 720 and 820 according to the embodiments have bonding layers 522, 622, 722 and 822 disposed in different layers (e.g., disposed between different patterned layers) in non-flexible regions (e.g. NF1 and NF2) located on the opposite side of the flexural region (e.g. YF1), the stress applied to the multilayer flexible printed circuit boards 520, 620, 720 and 820 can be reduced, and the multilayer flexible printed circuit boards 520, 620, 720 and 820 can easily maintain a defined shape.

[0194] Figure 9a and Figure 9b This is a diagram illustrating a multilayer flexible printed circuit board 920 according to an embodiment of the present disclosure.

[0195] according to Figure 9a and Figure 9b The multilayer flexible printed circuit board 920 of the embodiment shown may be disposed in the non-flexible region NF (e.g., see Figure 4 The multilayer flexible printed circuit board 920 in )

[0196] refer to Figure 9a and Figure 9b The multilayer flexible printed circuit board 920 may include a pattern layer 921 and / or a bonding layer 922.

[0197] In an embodiment, the multilayer flexible printed circuit board 920 may include a plurality of pattern layers 921. For example, the pattern layers 921 may include a first pattern layer 9211, a second pattern layer 9212, a third pattern layer 9213 and / or a fourth pattern layer 9214.

[0198] In an embodiment, the first pattern layer 9211 may be the layer closest to the display in the multilayer flexible printed circuit board 920 (e.g., Figure 3b The first display 230) is positioned as a layer. The fourth pattern layer 9214 may be located in the multilayer flexible printed circuit board 920 away from the display (e.g., Figure 2a The first display (930) is the layer with the furthest positioning.

[0199] In describing a multilayer flexible printed circuit board 920 according to an embodiment of the present disclosure, the height direction of the multilayer flexible printed circuit board 920 may refer to the direction in which multiple patterned layers 921 are stacked. The length direction of the multilayer flexible printed circuit board 920 may refer to the direction perpendicular to its height direction, and the multilayer flexible printed circuit board 920 extends relatively long in this direction.

[0200] In an embodiment, the bonding layer 922 may include a plurality of bonding portions 922a. The bonding portions 922a may be configured to extend from a portion between the patterned layers 921. The length of the bonding portions 922a extending in the longitudinal direction of the multilayer flexible printed circuit board 920 may be shorter than the length of a bonding layer (e.g., the first bonding layer 9221) extending in the longitudinal direction of the multilayer flexible printed circuit board 920.

[0201] refer to Figure 9a In the multilayer flexible printed circuit board 920 according to an embodiment, a plurality of bonding portions 922a may be configured to be spaced apart from each other between two patterned layers 921. For example, the plurality of bonding portions 922a may be configured to be spaced apart in the longitudinal direction of the multilayer flexible printed circuit board 920 between a first patterned layer 9211 and a second patterned layer 9212. Thus, in some embodiments, the plurality of bonding layers (or the plurality of bonding portions 922a) may be arranged to bond together a plurality of portions or a series of portions of a pair of adjacent patterned layers (with gaps (unbonded portions)).

[0202] refer to Figure 9b In the multilayer flexible printed circuit board 920 according to an embodiment, a bonding layer 922 may be disposed between each pattern layer 921. In other words, the device may include multiple bonding layers, each disposed between a corresponding pair of adjacent pattern layers and bonding them together. The multiple bonding layers may have the same length as each other, or they may have different lengths. For example, a first bonding layer 9221 may be disposed between a first pattern layer 9211 and a second pattern layer 9212, and a second bonding layer 9222 may be disposed between the second pattern layer 9212 and a third pattern layer 9213. A third bonding layer 9223 may be disposed between the third pattern layer 9213 and a fourth pattern layer 9214.

[0203] refer to Figure 9b In the multilayer flexible printed circuit board 920 according to an embodiment, as the bonding layer 922 is positioned closer to the first pattern layer 9211, the length of the bonding layer 922 (e.g., the length of the bonding layer 922 extending in the longitudinal direction of the multilayer flexible printed circuit board 920) can be formed to be longer. For example, the length of the first bonding layer 9221 can be longer than the length of the second bonding layer 9222. The length of the second bonding layer 9222 can be longer than the length of the third bonding layer 9223.

[0204] As the length of the bonding layer 922 disposed in the multilayer flexible printed circuit board 920 becomes shorter, the multilayer flexible printed circuit board 920 can be easily bent. Because the multilayer flexible printed circuit board 920 according to the embodiment includes a bonding layer 922 with a relatively short extension length, the multilayer flexible printed circuit board 920 can be easily bent compared to the case where a bonding layer 922 is configured to extend longer.

[0205] Figure 10a and Figure 10b This is a diagram showing the separation distances D1 and D2 between the bonding layers 1020 according to an embodiment of the present disclosure, as well as the effective separation distance ED.

[0206] according to Figure 10a and Figure 10b The multilayer flexible printed circuit board 1000 of the embodiment shown may be disposed in the electronic device 300 (see Figure 3a The folded area 300A (for example, see...) Figure 3a The multilayer flexible printed circuit board 1000 in )

[0207] refer to Figure 10a and Figure 10b The multilayer flexible printed circuit board 1000 may include a pattern layer 1010 and / or a bonding layer 1020.

[0208] In an embodiment, the multilayer flexible printed circuit board 1000 may include a plurality of pattern layers 1010. For example, the pattern layers 1010 may include a first pattern layer 1011, a second pattern layer 1012, a third pattern layer 1013 and / or a fourth pattern layer 1014.

[0209] In an embodiment, the bonding layer 1020 may include a first bonding layer 1021, a second bonding layer 1022, and / or a third bonding layer 1023. The first bonding layer 1021 may be a bonding layer 1020 disposed between a first pattern layer 1011 and a second pattern layer 1012. The second bonding layer 1022 may be a bonding layer 1020 disposed between the second pattern layer 1012 and the third pattern layer 1013. The third bonding layer 1023 may be a bonding layer 1020 disposed between the third pattern layer 1013 and the fourth pattern layer 1014.

[0210] In embodiments, the distance between bonding layers 1020 disposed in the same pattern layer 1010 can be formed differently depending on the bonding layers 1020 included in the multilayer flexible printed circuit board 1000. For example, refer to Figure 10aIn the case where the multilayer flexible printed circuit board 1000 includes all of the first bonding layer 1021, the second bonding layer 1022, and the third bonding layer 1023, the distance between the bonding layers 1020 disposed in the same pattern layer 1010 can be formed differently compared to the case where only a portion of the first bonding layer 1021, the second bonding layer 1022, and the third bonding layer 1023 are included.

[0211] refer to Figure 10a In the case where the multilayer flexible printed circuit board 1000 includes a first bonding layer 1021, a second bonding layer 1022 and a third bonding layer 1023, the distance between the bonding layers 1020 disposed in the same pattern layer 1010 can be formed as a first separation distance D1 or a second separation distance D2.

[0212] refer to Figure 10b In the case where the multilayer flexible printed circuit board 1000 includes a portion of bonding layers 1020 (e.g., a first bonding layer 1021 and a third bonding layer 1023), the distance between bonding layers 1020 disposed in the same pattern layer 1010 can be formed as a third separation distance D3. For example, two third bonding layers 1023 disposed between a third pattern layer 1013 and a fourth pattern layer 1014 can be configured to be spaced apart from each other by a third separation distance D3.

[0213] In an embodiment, the stress applied to the multilayer flexible printed circuit board 1000 can vary based on the distance between the bonding layers 1020 disposed in the same patterned layer 1010. For example, as the separation distance between the bonding layers 1020 increases, the stress applied to the multilayer flexible printed circuit board 1000 can decrease. When the stress applied to the multilayer flexible printed circuit board 1000 decreases, the lifespan of the multilayer flexible printed circuit board 1000 can increase.

[0214] When another bonding layer 1020 disposed in another patterned layer 1010 is positioned between two bonding layers 1020 disposed in one patterned layer 1010, the stress applied to the multilayer flexible printed circuit board 1000 can vary based on the effective separation distance ED (which is formed to be shorter than the separation distance between the two bonding layers 1020 (e.g., D3)). For example, refer to Figure 10b When the first bonding layer 1021 (located in a layer different from the third bonding layer 1023) is positioned between the two third bonding layers 1023, the effective separation distance ED between the third bonding layers 1023 can be formed to be shorter than the third separation distance D3. Applied to Figure 10b The stress of the multilayer flexible printed circuit board 1000 can be based on the effective separation distance ED.

[0215] In an embodiment, Figure 10bThe effective distance ED shown can be greater than Figure 10a The first distance D1 and the second distance D2 shown are longer. Because the stress applied to the multilayer flexible printed circuit board 1000 is inversely proportional to the separation distance or effective separation distance between the bonding layers 1020, the stress applied to... Figure 10a The stress on the multilayer flexible printed circuit board 1000 can be greater than that applied to Figure 10b The stress on the multilayer flexible printed circuit board 1000. Therefore, in relation to... Figure 10b The multilayer flexible printed circuit board 1000 has the same form in which the bonding layer 1020 is disposed only between some patterned layers 1010, instead of being in the same form as the multilayer flexible printed circuit board 1000. Figure 10a The same form of the multilayer flexible printed circuit board 1000, with the bonding layer 1020 disposed between all patterned layers 1010, can be advantageous in improving the lifespan of the multilayer flexible printed circuit board 1000.

[0216] The multilayer flexible printed circuit boards 520, 620, 720 and 820 according to embodiments of the present disclosure can be coupled with... Figure 10b The same form of the multilayer flexible printed circuit board 1000 is used, with the bonding layer 1020 only disposed between some patterned layers 1010, thereby improving the lifespan of the multilayer flexible printed circuit board 1000.

[0217] Figure 11 This is a diagram illustrating an electronic device 1100 according to an embodiment of the present disclosure.

[0218] In describing the electronic device 1100 according to an embodiment of the present disclosure, the length direction of the electronic device 1100 may refer to the y-axis direction, and the width direction of the electronic device 1100 may refer to the x-axis direction. The height direction of the electronic device 1100 may refer to the z-axis direction.

[0219] The electronic device 1100 according to embodiments of the present disclosure may be a multi-foldable device. For example, the electronic device 1100 may be a device including multiple folding regions 1100A and 1100B (in which the electronic device 1100 can be folded). For example, refer to... Figure 11 The electronic device 1100 may include a first folding region 1100A and / or a second folding region 1100B. In the first folding region 1100A and the second folding region 1100B, the electronic device 1100 may be configured to fold about a longitudinal axis (e.g., the y-axis direction). The electronic device 1100 may also fold in opposite directions in the first folding region 1100A and the second folding region 1100B.

[0220] Figure 11It is a diagram showing a state in which the multi-foldable electronic device 1100 is fully folded in folding regions 1100A and 1100B and at least a portion of the display 1150 of the electronic device 1100 overlaps with each other.

[0221] Figure 11 This is a diagram showing an electronic device 1100 in a cross-section perpendicular to the length direction (e.g., the y-axis direction) according to an embodiment.

[0222] An electronic device 1100 according to an embodiment of the present disclosure may include a hinge housing 1110, a multilayer flexible printed circuit board 1120, a housing 1130, a camera 1140, a display 1150, a printed circuit board 1160, a speaker 1170, a battery 1180, and / or a hinge (e.g., 390, see also 390). Figure 3a ).

[0223] In an embodiment, housing 1130 may include a first housing 1131, a second housing 1132 and / or a third housing 1133.

[0224] In an embodiment, the electronic device 1100 may include a first folding region 1100A and / or a second folding region 1100B. In the first folding region 1100A, a first hinge (e.g., 390, see below) may be positioned for rotatably connecting the first housing 1131 and the second housing 1132 relative to each other. Figure 3a In the second folding region 1100B, a second hinge (e.g., 390, see below) can be positioned to rotatably connect the second housing 1132 and the third housing 1133 relative to each other. Figure 3a ).

[0225] In an embodiment, the printed circuit board 1160 may include a first printed circuit board 1161, a second printed circuit board 1162, and / or a third printed circuit board 1163.

[0226] In an embodiment, a processor 120 may be disposed in the first printed circuit board 1161, the second printed circuit board 1162, and / or the third printed circuit board 1163 (see [link to embodiment]). Figure 1 ) and / or memory 130 (see Figure 1 ).

[0227] In an embodiment, the hinge housing 1110 may be configured to surround at least a portion of the folding regions 1100A and 1100B at its outer edge. Figure 2d The hinge housing 241 has the same function.

[0228] In the embodiment, camera 1140, speaker 1170, and battery 1180 may respectively refer to Figure 1The camera module 180, the sound output module 155, and the battery 189.

[0229] In this embodiment, display 1150 may refer to Figure 1 The display module 160 may be a flexible display comprising a bendable material.

[0230] In this embodiment, a first printed circuit board 1161 may be disposed in a first housing 1131. A second printed circuit board 1162 may be disposed in a second housing 1132. A third printed circuit board 1163 may be disposed in a third housing 1133.

[0231] In an embodiment, the multilayer flexible printed circuit board 1120 can perform the function of electrically connecting the first printed circuit board 1161, the second printed circuit board 1162 and / or the third printed circuit board 1163.

[0232] In an embodiment, the multilayer flexible printed circuit board 1120 may include a plurality of pattern layers 1121. The pattern layers 1121 may include a first pattern layer 1121a, a second pattern layer 1121b, a third pattern layer 1121c, and / or a fourth pattern layer 1121d.

[0233] In this embodiment, the first pattern layer 1121a may be the layer in the multilayer flexible printed circuit board 1120 that is closest to the display 1150. The fourth pattern layer 1121d may be the layer in the multilayer flexible printed circuit board 1120 that is furthest from the display 1150.

[0234] refer to Figure 11 In the multilayer flexible printed circuit board 1120, the pattern layers 1121 can be stacked in the order of a first pattern layer 1121a, a second pattern layer 1121b, a third pattern layer 1121c, and a fourth pattern layer 1121d. For example, the second pattern layer 1121b can be stacked in one direction of the first pattern layer 1121a, and the third pattern layer 1121c can be stacked in one direction of the second pattern layer 1121b. The fourth pattern layer 1121d can be stacked in one direction of the third pattern layer 1121c.

[0235] In an embodiment, the bonding layer 1122 may include a first bonding layer 1122a and / or a second bonding layer 1122b. The first bonding layer 1122a may be a bonding layer 1122 disposed between the first pattern layer 1121a and the second pattern layer 1121b. The second bonding layer 1122b may be a bonding layer 1122 disposed between the third pattern layer 1121c and the fourth pattern layer 1121d.

[0236] The functions and materials of the pattern layer 1121 and the bonding layer 1122 according to the embodiment can be related to... Figure 4 The pattern layer 421 and the bonding layer 422 have essentially the same function and material. The description of the function and material of the pattern layer 1121 and the bonding layer 1122 can be omitted.

[0237] In the multilayer flexible printed circuit board 1120 according to the embodiment, the position of the bonding layer 1122 may vary depending on the folded regions 1100A and 1100B. For example, in the first folded region 1100A, the multilayer flexible printed circuit board 1120 may include a second bonding layer 1122b disposed between the third patterned layer 1121c and the fourth patterned layer 1121d. For example, in the second folded region 1100B, the multilayer flexible printed circuit board 1120 may include a first bonding layer 1122a disposed between the first patterned layer 1121a and the second patterned layer 1121b.

[0238] By forming the layers in which the bonding layer 1122 is disposed differently according to the folded regions 1100A and 1100B, the electronic device 1100 according to the embodiment can improve the lifespan of the multilayer flexible printed circuit board 1120 and enable the flexible printed circuit board 1120 to maintain a defined design shape.

[0239] Figure 12 This is a diagram illustrating an electronic device 400 including a bonding layer 422 disposed in a first region P1 according to an embodiment of the present disclosure.

[0240] In describing an electronic device 400 according to an embodiment of the present disclosure, the width direction of the electronic device 400 may refer to the x-axis direction, and its length direction may refer to the y-axis direction. The height direction of the electronic device 400 may refer to the z-axis direction.

[0241] Figure 12 The electronic device 400 shown may refer to Figure 3a The electronic device 300 may include Figure 3a At least a portion of the electronic device 300.

[0242] Figure 12 The electronic device 400 shown may include, with Figure 4 The electronic device 400 has the same structure. Figure 12 In the description of the structure of the electronic device 400, the details related to... Figure 4 The electronic device 400 has the same structure as described above.

[0243] refer to Figure 12 The electronic device 400 according to the embodiment may include a hinge housing 410, a multilayer flexible printed circuit board 420 and / or a support member 430.

[0244] In this embodiment, the multilayer flexible printed circuit board 420 may include a plurality of pattern layers 421. The pattern layers 421 may include a first pattern layer 4211, a second pattern layer 4212, a third pattern layer 4213 and / or a fourth pattern layer 4214.

[0245] In an embodiment, the non-flexible region NF may include a first region P1 and / or a second region P2. The first region P1 may be a region where path loss of the multilayer flexible printed circuit board 420 needs to be reduced. The first region P1 may be a region in which radio frequency (RF) signal lines are disposed.

[0246] In an embodiment, the bonding layer 422 may be formed only in a predetermined region of the non-flexible region NF. For example, refer to Figure 12 The bonding layer 422 may be formed only in the first region P1 of the non-flexible region NF.

[0247] In an embodiment, the first region P1 of the multilayer flexible printed circuit board 420 may include a bonding layer 422, and the second region P2 of the multilayer flexible printed circuit board 420 may not include the bonding layer 422. For example, in the first region P1 of the multilayer flexible printed circuit board 420, the bonding layer 422 may be disposed between the first pattern layer 4211 and the second pattern layer 4212.

[0248] According to the embodiment, the multilayer flexible printed circuit board 420 includes a bonding layer 422 only in the first region P1; therefore, the multilayer flexible printed circuit board 420 can be easily bent.

[0249] According to an embodiment, the multilayer flexible printed circuit board 420 may have a bonding layer 422 disposed in a region where path loss needs to be reduced (e.g., a first region P1), thereby reducing its path loss.

[0250] In the multilayer flexible printed circuit boards 420, 520, 620, 720, 820, 920, 1120, and 1220 according to embodiments of the present disclosure, the length direction of the multilayer flexible printed circuit board (e.g., 420) may refer to the direction in which the multilayer flexible printed circuit board (e.g., 420) extends relatively long. The height direction of the multilayer flexible printed circuit board (e.g., 420) may refer to a direction substantially perpendicular to its length direction and to one surface of each layer (e.g., 421, 422) included in the multilayer flexible printed circuit board (e.g., 420).

[0251] An electronic device 300 according to an embodiment of the present disclosure may include: a first housing 310, in which a first printed circuit board 350 is disposed; a second housing 320, in which a second printed circuit board 360 is disposed; a hinge 390 for rotatably connecting the first housing 310 and the second housing 320 relative to each other; and a multilayer flexible printed circuit board 420 for connecting the first printed circuit board 350 and the second printed circuit board 360.

[0252] According to embodiments of the present disclosure, a multilayer flexible printed circuit board 420 may be disposed through a folding region 300A of an electronic device 300 (with a hinge 390 positioned in the folding region 300A of the electronic device 300), and includes a plurality of patterned layers 421 stacked in the height direction of the multilayer flexible printed circuit board 420 and a bonding layer 422 for bonding portions between at least two of the plurality of patterned layers 420. In the folding region 300A, the multilayer flexible printed circuit board 420 may include at least one flexural region YF and a non-flexural region NF (e.g., between flexural regions YF), in which the multilayer flexible printed circuit board 420 bends and extends (i.e., flexes, when the device is folded and unfolded).

[0253] In an embodiment, in the folded region 300A of the electronic device 300, at least one bonding layer 422 may be formed at least partially only in the non-flexible region NF.

[0254] In an embodiment, the non-flexible region NF is characterized as being flat or having a curvature smaller than that of the flexible region YF (or each flexible region YF).

[0255] In an embodiment, the bonding layer 422 (or each bonding layer 422) may be formed only between two pattern layers 421 of the plurality of pattern layers 421 in the non-flexible region NF.

[0256] In an embodiment, the multilayer flexible printed circuit board 420 may not have at least one bonding layer 422 between patterned layers 421 formed in the non-flexible region NF. In other words, pairs of adjacent patterned layers bonded together may not exist in the non-flexible region or in each non-flexible region.

[0257] In an embodiment, in the folded region 300A, the multilayer flexible printed circuit board 520 may include a plurality of non-flexible regions NF, and in the two non-flexible regions NF1 and NF2 in which the flexible region YF is located, the bonding layer 522 may be disposed between different patterned layers 521.

[0258] In an embodiment, the electronic device 300 may further include a display 230 disposed in a first housing 310 and a second housing 320, and the bonding layer 422 may be disposed between the two pattern layers 421 of the plurality of pattern layers 421 in the non-flexible region NF that are closest to the display 230.

[0259] In an embodiment, the non-flexible region NF may include a first non-flexible region NF1 and a second non-flexible region NF2, with at least a portion of the first non-flexible region NF1 located at the center C of the folded region (see [link]). Figure 5 At point ), the second non-flexible region NF2 is symmetrically located about the first non-flexible region NF1.

[0260] In an embodiment, the bonding layer 5221 formed in the first non-flexible region NF1 and the bonding layer 5222 formed in the second non-flexible region NF2 can be positioned between different patterned layers 521.

[0261] In an embodiment, the bonding layer may include a plurality of bonding portions 922a, and the plurality of bonding portions 922a may be configured to be spaced apart in the length direction of the multilayer flexible printed circuit board 920 in the non-flexible region NF.

[0262] In an embodiment, pattern layer 921 may include a first pattern layer 9211, a second pattern layer 9212, and a third pattern layer 9213 stacked in the height direction of the multilayer flexible printed circuit board 920, and bonding layer 922 may include a first bonding layer 9221 disposed between the first pattern layer 9211 and the second pattern layer 9212 and a second bonding layer 9222 disposed between the second pattern layer 9212 and the third pattern layer 9213, and the length of the first bonding layer 9221 may be longer than the length of the second bonding layer 9222.

[0263] In an embodiment, in the folded region 300A, at least one bonding layer 422 may be formed only in a predetermined region of the non-flexible region NF.

[0264] In an embodiment, the predetermined region where at least one bonding layer 422 is formed may be a region where path loss needs to be reduced.

[0265] In an embodiment, the predetermined area in which at least one bonding layer 422 is formed may be an area in which radio frequency (RF) signal lines are disposed.

[0266] In an embodiment, the pattern layer 421 may be composed of multiple layers, including a layer containing an insulator and a layer containing a conductive pattern.

[0267] In an embodiment, the bonding layer 422 may have a predetermined thickness between the two patterned layers 421 and extend along the length of the multilayer flexible printed circuit board 420.

[0268] In one embodiment, the flexibility of the non-flexible region NF, where the bonding layer 422 is formed, can be lower than the flexibility of the flexible region YF.

[0269] In an embodiment, the multilayer flexible printed circuit board 420 may include a bonding layer 422 formed in portions between patterned layers 421 in areas other than the folded region 300A.

[0270] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0271] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0272] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0273] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0274] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0275] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration.

[0276] According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

Claims

1. An electronic device (300), comprising: A first housing (310) is disposed within the first housing (310); The second housing (320) and the second printed circuit board (360) are disposed in the second housing (320); A hinge (390) is configured to rotatably connect the first housing and the second housing relative to each other; as well as A multilayer flexible printed circuit board (420) is configured to connect the first printed circuit board and the second printed circuit board. The multilayer flexible printed circuit board is disposed through a folding region (300A) of the electronic device, the hinge is positioned in the folding region (300A), and the multilayer flexible printed circuit board includes a plurality of patterned layers (421) stacked in the height direction of the multilayer flexible printed circuit board and at least one bonding layer (422) configured to bond portions between at least two of the plurality of patterned layers. In the folded region, the multilayer flexible printed circuit board includes a flexural region (YF) and a non-flexural region (NF). The multilayer flexible printed circuit board bends and extends within the flexural region (YF), and the non-flexural region (NF) lies between the flexural regions. In the folded region, the at least one bonding layer is formed at least partially only in the non-flexible region.

2. The electronic device of claim 1, wherein the non-flexible region is flat or has a curvature smaller than that of the flexible region.

3. The electronic device according to claim 1 or 2, wherein the bonding layer is formed only between two of the plurality of patterned layers in the non-flexible region.

4. The electronic device according to any one of claims 1 to 3, wherein the multilayer flexible printed circuit board does not have at least one bonding layer formed between the patterned layers in the non-flexible region.

5. The electronic device according to any one of claims 1 to 4, wherein, In the folded region, the multilayer flexible printed circuit board includes multiple non-flexible regions, and The bonding layer is positioned between two non-flexible regions in the flexural region, between different patterned layers.

6. The electronic device according to any one of claims 1 to 5, further comprising a display (230) disposed in the first housing and the second housing, The bonding layer is disposed between the two pattern layers closest to the display positioning among the plurality of pattern layers in the non-flexible region.

7. The electronic device according to any one of claims 1 to 6, wherein the non-flexible region comprises: A first non-flexible region (NF1) is located at least a portion of the center (C) of the folded region; as well as A second non-flexible region (NF2) is located symmetrically with respect to the first non-flexible region.

8. The electronic device of claim 7, wherein the bonding layer formed in the first non-flexible region and the bonding layer formed in the second non-flexible region are positioned between different patterned layers.

9. The electronic device according to any one of claims 1 to 8, wherein, In the non-flexible region, the bonding layer includes a plurality of bonding portions (922a), and The plurality of joints are configured to be spaced apart along the length of the multilayer flexible printed circuit board.

10. The electronic device according to any one of claims 1 to 9, wherein the plurality of patterned layers comprises a first patterned layer (9211), a second patterned layer (9212), and a third patterned layer (9213) stacked in the height direction of the multilayer flexible printed circuit board. The bonding layer includes: A first bonding layer (9221) is disposed between the first pattern layer and the second pattern layer. as well as A second bonding layer (9222) is disposed between the second pattern layer and the third pattern layer. The length of the first bonding layer is longer than the length of the second bonding layer.

11. The electronic device according to any one of claims 1 to 10, wherein, In the folded region, the at least one bonding layer is formed only in a predetermined region (P1) of the non-flexible region.

12. The electronic device of claim 11, wherein the predetermined region is a region where path loss needs to be reduced.

13. The electronic device of claim 11, wherein the predetermined region is a region in which a radio frequency (RF) signal line is disposed.

14. The electronic device according to any one of claims 1 to 13, wherein the patterned layer comprises a plurality of layers and includes a layer containing an insulator and a layer containing a conductive pattern.

15. The electronic device according to any one of claims 1 to 14, wherein the bonding layer has a predetermined thickness between two patterned layers and extends in the longitudinal direction of the multilayer flexible printed circuit board.

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