Method and device for removing aluminum adhered to mold

Abstract

The invention discloses a method and a device for removing aluminum adhered to a mold, and belongs to the field of molds. The method comprises the following steps: preparing a NaOH solution, and forming a mixed solution by taking NaNO3 as an oxidizing agent and benzotriazole as a corrosion inhibitor; putting a mold adhered with aluminum into the mixed solution, and enabling the aluminum on the mold to react with NaOH to generate soft sodium tetrahydroxyaluminate which is adsorbed on the surface of the mold; a high-frequency vibrator is adopted to vibrate a mixed solution, tetrahydroxy sodium aluminate is separated from the surface of a mold, reaction of aluminum and NaOH is promoted, heating knocking is not needed, aluminum adhering to the mold is removed in a reaction dissolution mode, a corrosion inhibitor and an oxidizing agent are added to control the reaction speed, the mold is prevented from being damaged by excessive corrosion, and the service life of the mold is prolonged. Operation is simple, and the die is not damaged.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of mold, in particular to a mold aluminum adhesion removing method and a mold aluminum adhesion removing device for implementing the method. BACKGROUND

[0002] Aluminum adhesion phenomenon is that molten aluminum (Al) and mold steel (Fe) are diffusion welded at high temperature and high pressure to form Al-Fe intermetallic compound (such as Al5Fe2) and firmly adhere to the surface of the mold. In the production process, the event of mold adhesion in a large area often causes shutdown, so how to quickly clean the aluminum adhered to the mold has become the key to improving production efficiency.

[0003] The common method is to burn the aluminum adhesion position with fire, and knock out the aluminum block when the temperature rises. However, this method of relying on external force to clean up is time-consuming and laborious, and is easy to damage the mold. SUMMARY

[0004] In order to overcome the deficiencies of the prior art, one of the purposes of the present application is to provide a mold aluminum adhesion removing method which is simple to operate and does not damage the mold.

[0005] In order to overcome the deficiencies of the prior art, the second purpose of the present application is to provide a mold aluminum adhesion removing device which is simple to operate and does not damage the mold.

[0006] One of the purposes of the present application is achieved by adopting the following technical solutions:

[0007] A mold aluminum adhesion removing method, comprising the following steps:

[0008] Preparation of solution: prepare NaOH solution, use NaNO3 as oxidant, and form a mixed solution with benzotriazole as corrosion inhibitor;

[0009] Dissolution reaction: place the mold with aluminum adhesion into the mixed solution, and the aluminum on the mold reacts with NaOH to produce soft-textured sodium tetrahydroxy aluminate which is adsorbed on the surface of the mold;

[0010] High-frequency vibration: use a high-frequency vibrator to vibrate the mixed solution, so that the sodium tetrahydroxy aluminate is separated from the surface of the mold, and the reaction of aluminum and NaOH is promoted;

[0011] Cleaning: take out the mold after reaction from the mixed solution and clean it with pure water.

[0012] Further, in the solution preparation step, the concentration of NaOH is 10%-20%.

[0013] Further, in the solution preparation step, the NaNO3 is 3-5g / L.

[0014] Further, in the configuration solution step, the benzotriazole is 0.5-1.0 g / L.

[0015] Further, the dissolving reaction step further comprises heating the mixed solution, and the temperature of the mixed solution is 60-80 DEG C.

[0016] Further, the mold aluminum removing method further comprises a pre-cleaning step, which is arranged before the dissolving reaction step, and the pre-cleaning step specifically comprises: cleaning the mold with aluminum by using an oil-removing solution to remove the oil on the mold.

[0017] Further, the mold aluminum removing method further comprises a surface polishing step, which is arranged after the cleaning step, and the surface polishing specifically comprises: polishing the surface of the mold after cleaning.

[0018] Further, the mold aluminum removing method further comprises a waste liquid discharging step, which is arranged after the high-frequency vibration step, and the waste liquid discharging step specifically comprises: neutralizing the solution after reaction and then discharging.

[0019] The second purpose of the present application is achieved by using the following technical scheme:

[0020] A mold aluminum removing device is used to implement any one of the mold aluminum removing methods, and the mold aluminum removing device comprises a box body, the top of the box body is an open structure to facilitate the mold to enter, the box body is made of an alkali-resistant and high-temperature-resistant material to facilitate the box body to contain the NaOH mixed solution, the mold aluminum removing device further comprises a heating device and a high-frequency vibrator, the heating device is installed on the inner wall of the box body to heat the NaOH mixed solution, and the high-frequency vibrator is installed on the box body to vibrate the NaOH mixed solution, so that the sodium tetrahydroxyaluminate is separated from the surface of the mold and the reaction of aluminum and NaOH is promoted.

[0021] Further, the box body comprises a bottom plate and a side wall extending from the bottom plate, the side wall is provided with a groove, and the heating device is installed in the groove.

[0022] Compared with the prior art, the mold aluminum adhesion removing method of the present application removes the aluminum adhesion on the mold by configuring a NaOH solution, using NaNO3 as an oxidizing agent, and using benzotriazole as an inhibitor to form a mixed solution; placing the mold with aluminum adhesion into the mixed solution, the aluminum on the mold reacts with the NaOH to produce soft-textured sodium tetrahydroxy aluminate which is adsorbed on the surface of the mold; using a high-frequency vibrator to vibrate the mixed solution to make the sodium tetrahydroxy aluminate separate from the surface of the mold, and promote the reaction between the aluminum and the NaOH, etc., without heating and knocking, the aluminum adhesion on the mold is removed by using the reaction dissolution method, and the inhibitor and the oxidizing agent are added to control the reaction speed, prevent the mold from being damaged by excessive corrosion, and the operation is simple and does not damage the mold. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 Flow chart of the mold aluminum adhesion removing method of the present application;

[0024] Figure 2 Another perspective view of the mold aluminum adhesion removing device of the present application.

[0025] Figure 3 Another perspective view of the mold aluminum adhesion removing device of the present application. Figure 2

[0026] In the figure: 10, box; 11, bottom plate; 110, drain hole; 12, side wall; 20, heating device; 30, high-frequency vibrator. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0028] It should be noted that when a component is referred to as being "fixed" to another component, it can be directly on the other component or there can be another intermediate component fixed by the intermediate component. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or there can be another intermediate component. When a component is referred to as being "disposed" on another component, it can be directly disposed on the other component or there can be another intermediate component. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0029] ​Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0030] Referring to Figure 1 The mold aluminum removing method comprises the following steps:

[0031] Solution preparation: NaOH solution is prepared, NaNO3 is used as oxidant, and benzotriazole is used as corrosion inhibitor to form a mixed solution;

[0032] Dissolution reaction: the mold with aluminum is placed in the mixed solution, and the aluminum on the mold reacts with NaOH to produce soft-textured sodium tetrahydroxy aluminate which is adsorbed on the surface of the mold;

[0033] High-frequency vibration: a high-frequency vibrator is used to vibrate the mixed solution, so that the sodium tetrahydroxy aluminate is separated from the surface of the mold, and the reaction of aluminum and NaOH is promoted;

[0034] Cleaning: the mold after reaction is taken out from the mixed solution, and is cleaned with pure water.

[0035] The solution preparation step specifically comprises:

[0036] Since the mold is made of manganese steel, if an acidic solution is used, the mold steel will be damaged while the aluminum is dissolved, so the acidic solution is not considered. The alkaline solution will not damage the mold steel while dissolving the aluminum, so sodium hydroxide solution is selected to react with aluminum. The reaction equation is: 2Al + 2NaOH + 6H2O→2Na[Al(OH)4]+3H2↑, the concentration of NaOH is 10%-20%, the concentration of NaNO2 is 3-5g / L, and the concentration of benzotriazole is 0.5-1.0g / L.

[0037] The dissolution reaction step specifically comprises:

[0038] The mixed solution is heated to a temperature of 60℃–80℃. Initially, the reaction between aluminum and sodium hydroxide solution is quite vigorous. However, as the reaction progresses, more and more aluminum is replaced by soft sodium tetrahydroxyaluminate (sodium aluminate), which is adsorbed onto the surface of the mold, thus affecting the further progress of the reaction. Therefore, a high-frequency vibration step is required. High-frequency vibration removes sodium tetrahydroxyaluminate from the mold surface, promoting the reaction between aluminum and NaOH, which is beneficial for the reaction within the deep holes. During the dissolution reaction, a large amount of hydrogen gas and sodium hydroxide solution volatilize, requiring a well-ventilated environment. If the mold is frequently lifted out of the solution during the reaction, the aluminum is easily oxidized in the air, forming a dense alumina film, affecting the reaction rate. Therefore, the degree of aluminum corrosion should be checked only after no obvious bubbles emerge from the solution.

[0039] The method for removing aluminum adhering to molds also includes a pre-cleaning step, which is located before the dissolution reaction step. The pre-cleaning step specifically involves using a degreasing solution to clean the mold with aluminum adhering to it and removing the oil stains from the mold.

[0040] The method for removing aluminum adhering to molds also includes a surface polishing step, which is located after the cleaning step. The surface polishing step specifically involves polishing the mold surface after cleaning.

[0041] The method for removing aluminum adhering to molds also includes a waste liquid discharge step, which is located after the high-frequency vibration step. Specifically, the waste liquid discharge step involves neutralizing the solution after the reaction and then discharging it.

[0042] Please continue reading. Figure 2 as well as Figure 3 The present invention also relates to a mold aluminum adhesion removal device for the above-mentioned mold aluminum adhesion removal method.

[0043] The mold aluminum sticking removal device includes a housing 10, a heating device 20, and a high-frequency vibrator 30.

[0044] The housing 10 is made of alkali-resistant and high-temperature-resistant material to facilitate the holding of the NaOH mixed solution. The top of the housing 10 has an open structure to facilitate mold entry. Specifically, the housing 10 includes a bottom plate 11 and four side walls 12 extending from the bottom plate 11. The bottom plate 11 has drainage holes 110 for draining waste liquid. The side walls 12 have grooves for installing the heating device 20, ensuring that the heating device 20 does not protrude from the side walls 12 and is not damaged by the mold. In this embodiment, the grooves are toothed. The heating device 20 is a heating tube. A high-frequency vibrator 30 is installed at the bottom of the bottom plate 11 of the housing 10 to vibrate the NaOH mixed solution.

[0045] The mold aluminum adhesion removing method of the present application forms a mixed solution by configuring a NaOH solution, using NaNO3 as an oxidizing agent, and benzotriazole as an inhibitor; places the mold with aluminum adhesion into the mixed solution, and the aluminum on the mold reacts with the NaOH to produce soft-textured sodium tetrahydroxy aluminate adsorbed on the surface of the mold; uses a high-frequency vibrator to vibrate the mixed solution, so that the sodium tetrahydroxy aluminate is separated from the surface of the mold, and the aluminum reacts with the NaOH, etc. Without heating and knocking, the aluminum adhesion on the mold is removed by using the reaction dissolution method, and the inhibitor and the oxidizing agent are added to control the reaction speed, prevent excessive corrosion from damaging the mold, and the operation is simple and does not damage the mold.

[0046] The above examples only express several embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are equivalent modifications and evolutions of the above examples according to the essential technology of the present application, and these all belong to the protection scope of the present application.

Claims

1. A method for removing aluminum sticking to a mold, characterized by, The method comprises the following steps: Solution preparation: prepare a NaOH solution, and form a mixed solution by using NaNO3 as an oxidant and benzotriazole as a corrosion inhibitor; Dissolution reaction: place the mold with aluminum into the mixed solution, and make the aluminum on the mold react with the NaOH to produce soft-textured sodium tetrahydroxy aluminate adsorbed on the surface of the mold; High-frequency vibration: use a high-frequency vibrator to vibrate the mixed solution, so that the sodium tetrahydroxy aluminate is separated from the surface of the mold, and the reaction of aluminum and NaOH is promoted; Cleaning: take out the mold after the reaction from the mixed solution, and clean it with pure water.

2. The die-bonded aluminum removal method according to claim 1, characterized by: In the solution preparation step, the concentration of the NaOH is 10%-20%.

3. The die-bonded aluminum removal method of claim 1, wherein: In the solution preparation step, the NaNO3 is 3-5 g / L.

4. The die-bonded aluminum cleanup method of claim 1, wherein: In the solution preparation step, the benzotriazole is 0.5-1.0 g / L.

5. The die-bonded aluminum cleanup method of claim 1, wherein: In the dissolution reaction step, the mixed solution is heated, and the temperature of the mixed solution is 60°C-80°C.

6. The die-bonded aluminum cleanup method of claim 1, wherein: The mold aluminum removal method further comprises a pre-cleaning step, which is located before the dissolution reaction step. The pre-cleaning step specifically comprises cleaning the mold with aluminum with a degreasing solution to remove oil stains on the mold.

7. The die-bonded aluminum cleanup method of claim 1, wherein: The mold aluminum removal method further comprises a surface polishing step, which is located after the cleaning step. The surface polishing specifically comprises polishing the surface of the mold after cleaning.

8. The die-bonded aluminum cleanup method of claim 1, wherein: The mold aluminum removal method further comprises a waste liquid discharge step, which is located after the high-frequency vibration step. The waste liquid discharge step specifically comprises neutralizing the solution after the reaction, and then discharging the neutralized solution.

9. A mold aluminum adhesion removal device for implementing the mold aluminum adhesion removal method as described in any one of claims 1-8, the mold aluminum adhesion removal device comprising a housing, the top of the housing having an open structure to facilitate mold entry, characterized in that: The box is made of an alkali-resistant and high-temperature-resistant material, so that the box can hold the NaOH mixed solution. The mold aluminum removal device further comprises a heating device and a high-frequency vibrator. The heating device is installed on the inner wall of the box to heat the NaOH mixed solution. The high-frequency vibrator is installed on the box to vibrate the NaOH mixed solution, so that the sodium tetrahydroxy aluminate is separated from the surface of the mold, and the reaction of aluminum and NaOH is promoted.

10. The die-bonded aluminum cleanup apparatus of claim 9, wherein: The box comprises a bottom plate and a side wall extending from the bottom plate. The side wall is provided with a groove, and the heating device is installed in the groove.

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