Welding device for chip packaging

By using a pitch-adjustable dual-station welding mechanism and an angle-adjustable welding assembly, combined with a linear motion module and a vision sensor, the problems of low efficiency and inconvenient angle adjustment in existing welding equipment are solved, achieving efficient and precise chip packaging welding.

CN120901487AInactive Publication Date: 2025-11-07HILLTOP ELECTRONICS LLC
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Patent Information

Application Number
CN202511273528.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-09-08
Publication Date
2025-11-07
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Existing welding equipment mostly uses single-sided welding technology, which requires switching the pin areas on both sides of the chip and repeated clamping and positioning, reducing work efficiency and making it inconvenient to adjust the welding angle, thus affecting the welding quality.

Method used

It adopts a dual-station welding mechanism with adjustable spacing and welding components with adjustable angle, combined with a linear motion module, servo motor and vision sensor, to achieve synchronous welding at two stations and flexible adjustment of the laser welding gun, thereby improving adaptability and accuracy.

Benefits of technology

It effectively reduces chip edge switching time, improves work efficiency, adapts to the packaging requirements of chips of different widths, and enhances welding quality and precision.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a welding device for chip packaging, and relates to the technical field of chip packaging, the welding device comprises a welding table welded to the top of a base, the top of the base is connected with a portal frame through a linear moving module, and the portal frame is provided with a spacing-adjustable double-station welding mechanism; the linear moving module comprises two linear moving assemblies symmetrically arranged on the top of the base and a synchronous linkage assembly arranged on the top of the base, and the distance-adjustable double-station welding mechanism comprises a bidirectional screw rod, two adjusting blocks, a first servo motor and two angle-adjustable welding assemblies. By adopting the technical means of double-station synchronous welding, the time wasted in the chip edge changing process can be effectively shortened, the working efficiency is improved, when a packaged chip is welded, the working distance between the two angle-adjustable welding assemblies can be flexibly adjusted, and the welding efficiency is improved. Therefore, the packaging and welding requirements of chips with different widths can be better met, and the adaptability is improved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the chip packaging technical field, especially relates to a welding device for chip packaging. BACKGROUND

[0002] The shell for mounting semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electric heating performance, and is also the bridge between the internal world of the chip and the external circuit. The contacts on the chip are connected to the pins of the packaging shell by wires, and the pins are connected to other devices through wires on the printed board. Therefore, the chip needs to be welded by using a welding device during packaging.

[0003] However, the existing welding equipment is mostly single-sided welding technology, and when welding the pin areas on both sides of the chip, the side changing and repeated clamping positioning process are needed, which effectively reduces the work efficiency, and the welding angle cannot be adjusted when welding the chip, thereby affecting the welding quality. SUMMARY

[0004] In view of the defects of the prior art, the present application provides a welding device for chip packaging, which effectively solves the problem that the existing welding equipment mostly uses single-sided welding technology, and when welding the pin areas on both sides of the chip, the side changing and repeated clamping positioning process are needed, which effectively reduces the work efficiency, and the welding angle cannot be adjusted when welding the chip, thereby affecting the welding quality.

[0005] In order to achieve the above purpose, the present application adopts the following technical scheme:

[0006] A welding device for chip packaging, comprising a welding table welded on the top of a base, the top of the base is connected with a gantry through a linear movement module, the gantry is provided with an interval-adjustable double-station welding mechanism, and the linear movement module comprises two linear movement components symmetrically arranged on the top of the base and a synchronous linkage component arranged on the top of the base;

[0007] The interval-adjustable double-station welding mechanism comprises a bidirectional screw rod rotatably installed in the gantry, two adjusting blocks symmetrically screwed on two opposite threaded ends of the bidirectional screw rod, a first servo motor fixedly connected with the side wall of the gantry through a motor base, and two angle-adjustable welding assemblies installed in sequence at the bottom of the two adjusting blocks;

[0008] The angle-adjustable welding assembly comprises a mounting frame welded to the outer wall of the bottom of the adjusting block, an angle adjusting frame in threaded rotary connection with the mounting frame through a threaded rotary pin, a laser electric welding gun fixedly installed on the side wall of the angle adjusting frame, a servo driver, a sliding groove opened on one side of the mounting frame, an adjusting lead screw rotatably installed in the sliding groove, a lifting block in threaded connection with the lower part of the adjusting lead screw, and an adjusting inclined rod hingedly connected to one side of the lifting block.

[0009] Preferably, the output shaft of the first servo motor is coaxially fixedly connected with one end of the bidirectional screw rod through a shaft coupling, and a sliding channel structure for sliding of the two adjusting blocks is opened on the gantry.

[0010] Preferably, the servo driver comprises a fixed cover fixedly installed in the mounting frame, a second servo motor fixedly installed on the side wall of the fixed cover, a driving bevel gear fixedly sleeved on the output shaft of the second servo motor, and a driven bevel gear fixedly sleeved on the top end of the adjusting lead screw.

[0011] Preferably, the output shaft of the second servo motor penetrates through one side of the fixed cover, and the driving bevel gear and the driven bevel gear are in meshing connection and are both located in the fixed cover.

[0012] Preferably, the top end of the adjusting inclined rod is hingedly connected to the angle adjusting frame, the lifting block is in sliding connection with the inner wall of the sliding groove, and a butterfly lock nut is in threaded connection with the threaded rotary pin.

[0013] Preferably, the two linear motion assemblies each comprise a fixed frame fixedly connected to the outer wall of the top of the base, a transverse lead screw rotatably installed on the fixed frame, a linear guide rail fixedly connected to the outer wall of the top of the fixed frame, and a sliding seat in threaded connection with the transverse lead screw and in sliding connection with the linear guide rail, and the outer wall of the top of each of the two sliding seats is welded to the outer wall of the bottom of the gantry.

[0014] Preferably, the synchronous linkage assembly comprises a third servo motor fixedly connected with the outer wall of the top of the base through a support block, a double-groove synchronous wheel fixedly sleeved on the output shaft of the third servo motor, and two single-groove synchronous wheels fixedly sleeved on one end of the two transverse lead screws in sequence, and the double-groove synchronous wheel is in transmission connection with the two single-groove synchronous wheels through two synchronous belts in sequence.

[0015] Preferably, the outer wall of the bottom of each of the two mounting frames is fixedly installed with a visual sensor, and the outer wall of the top of the base is fixedly installed with an industrial computer.

[0016] The angle-adjustable welding assembly has the following beneficial effects:

[0017] 1、The present application adopts the technical means of double-station synchronous welding, which can effectively reduce the time wasted in the chip edge changing process and improve the work efficiency. When welding the packaged chip, the working distance of the two-angle-adjustable welding assemblies can be flexibly adjusted, so that it can better adapt to the packaging and welding requirements of chips of different widths and improve the adaptability.

[0018] 2、The present application can flexibly adjust the welding angles of the two laser electric welding guns, so that it can better adapt to the diversified welding requirements in the chip packaging process and help to improve the welding quality.

[0019] 3、The present application cooperates the linear movement module, the industrial computer and the visual sensor, so that the two laser electric welding guns can accurately move along the two edges of the chip, which is beneficial to improve the welding precision and efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the specific embodiments or the prior art description will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual proportion.

[0021] Figure 1 It is a schematic diagram of the overall front view of the structure of the present application;

[0022] Figure 2 It is a schematic diagram of the enlarged structure of the middle distance-adjustable double-station welding mechanism in the present application;

[0023] Figure 3 It is a schematic diagram of the enlarged structure of the connection between the bidirectional screw, the two adjusting blocks and the first servo motor in the present application;

[0024] Figure 4 It is a schematic diagram of the enlarged structure of the angle-adjustable welding assembly in the present application;

[0025] Figure 5 It is a schematic diagram of the enlarged structure of the mounting frame area in the present application;

[0026] Figure 6 It is a schematic diagram of the enlarged structure of the servo driver in the present application;

[0027] Figure 7 It is a schematic diagram of the enlarged structure of the linear movement module in the present application.

[0028] In the figure: 1, base; 2, welding table; 3, gantry; 4, bidirectional screw; 5, adjusting block; 6, first servo motor; 7, mounting frame; 8, threaded rotating pin; 9, angle adjusting frame; 10, laser electric welding gun; 11, adjusting lead screw; 12, lifting block; 13, adjusting inclined rod; 14, fixed cover; 15, second servo motor; 16, driving bevel gear; 17, driven bevel gear; 18, butterfly lock nut; 19, visual sensor; 20, fixing frame; 21, transverse lead screw; 22, sliding seat; 23, linear guide rail; 24, third servo motor; 25, double-groove synchronous wheel; 26, single-groove synchronous wheel; 27, industrial computer. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.

[0030] Embodiment 1, refer to Figures 1-3 A welding device for chip packaging, comprising a welding table 2 welded on the top of a base 1, the welding table 2 is used for placing the chip to be packaged, the top of the base 1 is connected with a gantry 3 through a linear moving module, and an interval-adjustable double-station welding mechanism is arranged on the gantry 3.

[0031] Specifically, the interval-adjustable double-station welding mechanism comprises a bidirectional screw 4 rotatably installed in the gantry 3, two adjusting blocks 5 symmetrically screwed on two opposite threaded ends of the bidirectional screw 4, a first servo motor 6 fixedly connected with the side wall of the gantry 3 through a motor base, and two angle-adjustable welding assemblies installed on the bottom of the two adjusting blocks 5 in sequence; further, the output shaft of the first servo motor 6 is coaxially fixedly connected with one end of the bidirectional screw 4 through a shaft coupling, and a slide structure for sliding of the two adjusting blocks 5 is formed on the gantry 3.

[0032] The working principle of the embodiment is as follows: the first servo motor 6 drives the bidirectional screw 4 to rotate forward and backward, and then under the limiting of the slide structure, the two adjusting blocks 5 threadedly connected with the bidirectional screw 4 drive the two angle-adjustable welding assemblies to move closer to each other or move away from each other, so that the working interval of the two angle-adjustable welding assemblies can be flexibly adjusted, thereby better adapting to the packaging and welding requirements of chips of different widths and improving the adaptability.

[0033] Embodiment 2, refer to Figure 2 and Figures 4-6, the embodiment is based on the embodiment 1, specifically: the angle adjustable welding assembly includes the mounting frame 7 welded to the bottom outer wall of the adjusting block 5, the angle adjusting frame 9 connected with the mounting frame 7 through the threaded rotating pin 8, the laser electric welding gun 10 fixedly installed on the side wall of the angle adjusting frame 9, the servo driver, the sliding groove opened on one side of the mounting frame 7, the adjusting lead screw 11 rotatably installed in the sliding groove, the lifting block 12 threadedly connected to the lower part of the adjusting lead screw 11 and the adjusting inclined rod 13 hingedly connected to one side of the lifting block 12; further, the servo driver includes the fixed cover 14 fixedly installed in the mounting frame 7, the second servo motor 15 fixedly installed on the side wall of the fixed cover 14, the driving bevel gear 16 fixedly sleeved on the output shaft of the second servo motor 15 and the driven bevel gear 17 fixedly sleeved on the top end of the adjusting lead screw 11, the output shaft of the second servo motor 15 penetrates one side of the fixed cover 14, the driving bevel gear 16 and the driven bevel gear 17 are meshed with each other and are located in the fixed cover 14; still further, the top end of the adjusting inclined rod 13 is hingedly connected to the angle adjusting frame 9, the lifting block 12 is slidingly connected with the inner wall of the sliding groove, the butterfly lock nut 18 is threadedly connected on the threaded rotating pin 8, after the angle adjustment is completed, the threaded rotating pin 8 can be locked by tightening the butterfly lock nut 18;

[0034] The working principle of the embodiment is as follows: the driving bevel gear 16 is driven to rotate by the second servo motor 15, then the driven bevel gear 17 meshed with the driving bevel gear 16 drives the adjusting lead screw 11 to rotate, then the lifting block 12 threadedly connected with the adjusting lead screw 11 moves upward under the limitation of the sliding groove, and then the adjusting inclined rod 13 hingedly arranged pushes the laser electric welding gun 10 installed on the angle adjusting frame 9 to move, so that the welding angle of the laser electric welding gun 10 can be flexibly adjusted, and then the diversified welding requirements in the chip packaging process can be better adapted to, which is helpful to improve the welding quality, and the laser welding technology can realize non-contact welding.

[0035] Embodiment 3, refer to Figure 1 , Figure 2 and Figure 7 , the embodiment is based on the embodiment 1, specifically: the linear movement module includes two straight line movement assemblies symmetrically arranged on the top of the base 1 and a synchronous linkage assembly arranged on the top of the base 1;

[0036] Further, the two straight line movement assemblies each include the fixed frame 20 fixedly connected to the top outer wall of the base 1, the horizontal lead screw 21 rotatably installed on the fixed frame 20, the straight line guide rail 23 fixedly connected to the top outer wall of the fixed frame 20 and the sliding seat 22 threadedly connected to the horizontal lead screw 21 and slidingly connected with the straight line guide rail 23, the top outer walls of the two sliding seats 22 are each welded with the bottom outer wall of the gantry 3;

[0037] Further, the synchronous linkage assembly comprises a third servo motor 24 fixedly connected with the top outer wall of the base 1 through a supporting block, a double-groove synchronous wheel 25 fixedly sleeved on the output shaft of the third servo motor 24, and two single-groove synchronous wheels 26 fixedly sleeved on one end of the two transverse lead screws 21 in sequence, the double-groove synchronous wheel 25 is drivingly connected with the two single-groove synchronous wheels 26 through two synchronous belts in sequence, the bottom outer wall of each of the two mounting frames 7 is fixedly installed with a visual sensor 19, and the top outer wall of the base 1 is fixedly installed with an industrial computer 27;

[0038] The working principle of the embodiment is as follows: the third servo motor 24 can drive the double-groove synchronous wheel 25 to rotate, then the two single-groove synchronous wheels 26 will drive the two transverse lead screws 21 to synchronously rotate under the driving effect of the two synchronous belts, then the two sliding seats 22 threadedly connected with the two transverse lead screws 21 will drive the gantry 3 to move linearly under the guidance of the two linear guides 23, and the two visual sensors 19 can capture the image information of the two sides of the chip in real time, the industrial computer 27 can receive the image information of the two sides of the chip in real time and analyze and process the image information, so that the two laser electric welding guns 10 can move accurately along the two sides of the chip, which is beneficial to improving the welding precision and the welding efficiency.

[0039] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed or inherent to such processes, methods, articles or devices.

[0040] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A soldering apparatus for chip packaging, comprising a soldering station (2) soldered to the top of a base (1), characterized in that, The top of the base (1) is connected with a portal frame (3) through a linear movement module, the portal frame (3) is provided with an interval-adjustable double-station welding mechanism, and the linear movement module comprises two linear movement assemblies symmetrically arranged on the top of the base (1) and a synchronous linkage assembly arranged on the top of the base (1); The interval-adjustable double-station welding mechanism comprises a bidirectional screw rod (4) rotatably arranged in the portal frame (3), two adjusting blocks (5) symmetrically screwed on two opposite threaded ends of the bidirectional screw rod (4), a first servo motor (6) fixedly connected with the side wall of the portal frame (3) through a motor base, and two angle-adjustable welding assemblies sequentially arranged on the bottom of the two adjusting blocks (5). The angle-adjustable welding assembly comprises a mounting frame (7) welded on the bottom outer wall of the adjusting block (5), an angle adjusting frame (9) rotatably connected with the mounting frame (7) through a threaded rotating pin (8), a laser electric welding gun (10) fixedly arranged on the side wall of the angle adjusting frame (9), a servo driver, a sliding groove formed on one side of the mounting frame (7), an adjusting lead screw (11) rotatably arranged in the sliding groove, a lifting block (12) threadedly connected with the lower part of the adjusting lead screw (11), and an adjusting inclined rod (13) hingedly arranged on one side of the lifting block (12).

2. The soldering apparatus for a chip package according to claim 1, wherein The output shaft of the first servo motor (6) is coaxially fixedly connected with one end of the bidirectional screw rod (4) through a shaft coupling, and the portal frame (3) is provided with a sliding groove structure for sliding of the two adjusting blocks (5).

3. The soldering apparatus for a chip package according to claim 1, wherein The servo driver comprises a fixed cover (14) fixedly arranged in the mounting frame (7), a second servo motor (15) fixedly arranged on the side wall of the fixed cover (14), a driving bevel gear (16) fixedly sleeved on the output shaft of the second servo motor (15), and a driven bevel gear (17) fixedly sleeved on the top end of the adjusting lead screw (11).

4. The soldering apparatus for a chip package according to claim 3, wherein The output shaft of the second servo motor (15) penetrates through one side of the fixed cover (14), and the driving bevel gear (16) and the driven bevel gear (17) are meshed with each other and located in the fixed cover (14).

5. The soldering apparatus for a chip package according to claim 1, wherein The top end of the adjusting inclined rod (13) is hingedly arranged on the angle adjusting frame (9), the lifting block (12) is slidingly connected with the inner wall of the sliding groove, and a butterfly lock nut (18) is threadedly connected with the threaded rotating pin (8).

6. The soldering apparatus for a chip package according to claim 1, wherein Each linear movement assembly comprises a fixed frame (20) fixedly connected with the outer wall of the top of the base (1), a transverse lead screw (21) rotatably arranged on the fixed frame (20), a linear guide rail (23) fixedly connected with the outer wall of the top of the fixed frame (20), and a sliding seat (22) threadedly connected with the transverse lead screw (21) and slidingly connected with the linear guide rail (23), and the top outer wall of each sliding seat (22) is welded with the bottom outer wall of the portal frame (3).

7. The soldering apparatus for a chip package according to claim 1, wherein The synchronous linkage assembly comprises a third servo motor (24) fixedly connected with the top outer wall of the base (1) through a supporting block, a double-groove synchronous wheel (25) fixedly sleeved on the output shaft of the third servo motor (24), and two single-groove synchronous wheels (26) fixedly sleeved on one end of the two transverse lead screws (21) in sequence, and the double-groove synchronous wheel (25) is in driving connection with the two single-groove synchronous wheels (26) in sequence through two synchronous belts.

8. The soldering apparatus for a chip package according to claim 1, wherein Visual sensors (19) are fixedly installed on the bottom outer walls of the two mounting racks (7), and an industrial computer (27) is fixedly installed on the top outer wall of the base (1).