High-strength high-conductivity low-beryllium copper alloy

Abstract

The invention relates to the technical field of beryllium-copper alloys, and particularly discloses a high-strength and high-conductivity low-beryllium-copper alloy, and a preparation process of the low-beryllium-copper alloy comprises the following steps: according to the mass percent, the beryllium content is 0.2%-0.6%, the nickel content is 1.4%-2.5%, the cobalt content is less than or equal to 0.3%, the iron content is less than or equal to 0.3%, the silver content is 0.005%-0.01%, and the balance is red copper; adding red copper into a crucible for melting, adding nickel metal, cobalt metal and iron metal, stirring until the added metal is completely dissolved in a melt, then adding beryllium-copper master alloy, starting to cast after the melt is uniform to obtain a cast ingot, carrying out charging homogenization treatment on the cast ingot, and then carrying out extrusion forging processing to obtain a blank; heating and preserving heat; according to the beryllium-copper alloy and the preparation method thereof, the bottleneck problem that strength and electrical conductivity of a traditional beryllium-copper alloy are difficult to consider at the same time is solved, and the beryllium-copper alloy has high strength, excellent plasticity and high electrical conductivity.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of beryllium copper alloys, and particularly relates to a high-strength high-conductivity low-beryllium copper alloy. BACKGROUND

[0002] The existing mainstream Be-Cu alloys (such as C17500, TBe0.6-2.5, etc.) can take into account high strength and good corrosion resistance, and have certain non-magnetic properties, and are therefore widely used in molds, electronic components and high-reliability structural parts. However, although beryllium copper alloys are generally classified as "high-strength high-conductivity" materials, their actual electrical conductivity is usually only at the level of 40-60% IACS, which is still significantly lower than that of pure copper and high-silver copper. This shows that the existing alloy system still has certain limitations in terms of electrical conductivity.

[0003] In addition, the addition of a small amount of silver to copper can significantly improve the softening temperature and creep resistance, and to some extent, maintain high electrical conductivity. However, such technology is mainly used to improve the thermal stability and service life of copper alloys, and has not been used to improve the electrical conductivity of beryllium copper systems. At the same time, the preparation routes of low-beryllium copper at home and abroad are still mostly limited to the traditional process framework of "melting → hot working → heat treatment", and the composition design lacks new breakthroughs, and overall, no substantial progress has been made in the direction of high electrical conductivity.

[0004] The present application introduces a small amount of high-conductivity elements into the low-beryllium copper alloy system and optimizes the ratio, so that the material further improves the electrical conductivity while maintaining high strength and corrosion resistance, achieving a synergistic breakthrough in mechanical and electrical properties. SUMMARY

[0005] The present application aims to provide a high-strength high-conductivity low-beryllium copper alloy to solve the problems in the above background.

[0006] The object of the present application can be achieved by the following technical solutions:

[0007] A high-strength high-conductivity low-beryllium copper alloy, the preparation process of the low-beryllium copper alloy comprising the following steps:

[0008] Step 1: raw material batching, the copper alloy composition includes, by mass percentage: beryllium content of 0.2%-0.6%, nickel content of 1.4%-2.5%, cobalt content of less than or equal to 0.3%, iron content of less than or equal to 0.3%, silver content of 0.005%-0.01%, and the rest is red copper;

[0009] Step two: semi-continuous casting: a non-vacuum furnace is selected, copper is added in the crucible, the temperature is raised to 1080-1090 DEG C, after all the copper is completely melted, nickel metal, cobalt metal and iron metal are added, after the added metal is completely dissolved in the melt, beryllium copper master alloy is added, finally silver copper alloy is added, the temperature is continuously raised to 1150-1250 DEG C, the furnace is shaken for 3-5 minutes, after the melt is uniform, casting is started, and a cast ingot is obtained;

[0010] Step three: homogenization treatment; the cast ingot is loaded into the furnace, the temperature is raised to 915 DEG C and kept for 12 hours, and after the keeping is completed, the water is immediately cooled;

[0011] Step four: processing; the cast ingot is loaded into the furnace, and then extrusion forging processing is carried out to obtain a blank;

[0012] Step five: solid solution aging treatment: the blank is loaded into the furnace at room temperature, then heated and kept; after the keeping is completed, rapid cooling is carried out in cold water, and after cooling to below 35 DEG C, it is taken out, solid solution treatment is completed, and then aging heat treatment is carried out, and a beryllium copper alloy is obtained.

[0013] As a further scheme of the application: in step one, the sum of the iron content, the cobalt content and the nickel content is less than or equal to 2.5%.

[0014] As a further scheme of the application: in step two, during the pouring process, a red runout groove is maintained, and a red ingot water-cooled crystallizer is used for primary water cooling, and then secondary water cooling is carried out by circulating spray cooling water.

[0015] As a further scheme of the application: the flow rate of the secondary water cooling cooling water is 4-10 m 3 / min. 3

[0016] As a further scheme of the application: during the pouring process, the red runout groove is kept stable, and the casting rate is 2-3 mm / s.

[0017] As a further scheme of the application: the loading temperature of steps three and four is room temperature.

[0018] As a further scheme of the application: in step four, the extrusion forging temperature is 890 DEG C.

[0019] As a further scheme of the application: in step four, during the extrusion forging process, the single reduction rate is 25%-35%, and the total reduction rate is 65%-70%.

[0020] As a further scheme of the application: in step five, after being loaded into the furnace at room temperature, the temperature is raised from room temperature to 850-900 DEG C within 50-80 minutes and kept for 90-150 minutes. ​

[0021] As a further scheme of the present application: after the end of the incubation in step five, the cooling is carried out in the circulating cooling water within 20-40s.

[0022] The beneficial effects of the present application are:

[0023] The present scheme realizes the synergistic improvement of mechanical properties and electrical conductivity by optimizing the component design and smelting, casting, homogenization, hot working and solid solution aging process control. The prepared beryllium copper alloy has a stable tensile strength of 560-590MPa, a yield strength of 430-450MPa, and a hardness of 220-240HB, which fully guarantees the high strength characteristics of the material. At the same time, it also performs well in plasticity, with an elongation of 10-16%, taking into account the formability and use safety. Especially significantly, the electrical conductivity of the alloy is broken through to 72-88IACS% on the premise of maintaining high strength without decline, which realizes a substantial leap compared with the prior art. The bottleneck problem of "difficulty in balancing strength and electrical conductivity" of traditional low beryllium copper alloy is effectively solved, and the alloy has high strength, excellent plasticity and high electrical conductivity, which has significant technical progress and broad engineering application prospect. BRIEF DESCRIPTION OF DRAWINGS

[0024] The present application will be further described below in conjunction with the accompanying drawings.

[0025] Figure 1 is a process flow diagram of the present application. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0027] Embodiment one

[0028] Please refer to Figure 1 The present application is a high-strength high-conductivity low-beryllium copper alloy, and the preparation process of the low-beryllium copper alloy comprises the following steps:

[0029] Step one: raw material batching, the copper alloy components include: beryllium content of 0.2%, nickel content of 1.4%, cobalt content of 0.1%, iron content of 0.1%, silver content of 0.005%, and the rest is red copper;

[0030] Step two: semi-continuous casting: a non-vacuum furnace is selected, red copper is added in the crucible, the temperature is raised to 1080 DEG C, after all the red copper is completely melted, nickel metal, cobalt metal and iron metal are added, after the added metal is completely dissolved in the melt, beryllium copper master alloy is added, finally silver copper alloy is added, the temperature is continuously raised to 1150 DEG C, the furnace is shaken for 3 minutes, after the melt is uniform, casting is started, and an ingot is obtained;

[0031] During the pouring process, the red runner and the red ingot water-cooled crystallizer are maintained for one-time water cooling, and then secondary water cooling is carried out by circulating spray cooling water, the secondary water cooling water flow is 4 m 3 / min, the red runner is kept stable, and the casting rate is 2 mm / s;

[0032] Casting can also be carried out by vacuum iron mold casting;

[0033] Step three: homogenization treatment; the ingot is loaded into the furnace, the loading temperature is room temperature, the temperature is raised to 915 DEG C and kept for 12 hours, and then the ingot is immediately water-cooled after the keeping is completed;

[0034] In this step, the homogenization treatment analyzes the segregation elements in the ingot to form secondary thermal motion distribution, solves the composition macrosegregation caused by uneven cooling in the smelting process, and provides support for subsequent hot working;

[0035] Step four: processing; the ingot is loaded into the furnace, the loading temperature is room temperature, and then extrusion forging is carried out to obtain a blank, wherein the extrusion forging temperature is 890 DEG C;

[0036] In the extrusion forging process, the single reduction rate is 25%, and the total reduction rate is 65%;

[0037] Extrusion forging is completed by using traditional processing equipment, and this step can be regarded as the final product property selection;

[0038] Step five: solid solution aging treatment: the blank is loaded into the furnace at room temperature, the temperature is raised to 850 DEG C from room temperature within 50 minutes and kept for 90 minutes; after the keeping is completed, the blank is cooled in circulating cooling water within 20 seconds, and then taken out after the temperature is below 35 DEG C, and then the blank is subjected to aging heat treatment after the solid solution treatment is completed, and a beryllium copper alloy is obtained;

[0039] In this step, the aging heat treatment can be carried out after the solid solution treatment according to the requirements, so as to improve the mechanical and conductive properties of the product, and the product meeting the requirements can be obtained according to the requirements of the customer.

[0040] Example two

[0041] A high-strength high-conductivity low-beryllium copper alloy, a preparation process of the low-beryllium copper alloy comprises the following steps:

[0042] Step one: raw material batching, the copper alloy components include, by mass percentage: beryllium content is 0.6%, nickel content is 1.9%, cobalt content is 0.3%, iron content is 0.3%, silver content is 0.01%, and the rest is red copper;

[0043] Step two: semi-continuous casting: non-vacuum furnace is selected for casting, red copper is added in the crucible, the temperature is raised to 1090 DEG C, after all the red copper is completely melted, nickel metal, cobalt metal and iron metal are added, after stirring until the added metal is completely dissolved in the melt, beryllium copper master alloy is added, finally silver copper alloy is added, continue to raise the temperature to 1250 DEG C, shake the furnace for 5 min, after the melt is uniform, start casting, get the ingot;

[0044] During the pouring process, the red runner and the red ingot water cooling crystallizer are kept for primary water cooling, and then secondary water cooling is carried out by circulating spray cooling water, the secondary water cooling water flow is 10 m 3 / min, the red runner is kept stable and the casting rate is 3 mm / s;

[0045] The casting can also use vacuum iron mold casting;

[0046] Step three: homogenization treatment; the ingot is loaded into the furnace, the loading temperature is room temperature, the temperature is raised to 915 DEG C and kept for 12 hours, after the keeping is completed, it is immediately cooled in water;

[0047] In this step, the homogenization treatment analyzes the segregation elements in the ingot to form secondary thermal motion distribution, solves the composition macrosegregation caused by uneven cooling in the smelting process, and provides support for subsequent hot working;

[0048] Step four: processing; the ingot is loaded into the furnace, the loading temperature is room temperature, and then extrusion forging is carried out to obtain a blank, wherein the extrusion forging temperature is 890 DEG C;

[0049] In the extrusion forging process, the single reduction rate is 35%, and the total reduction rate is 70%;

[0050] The extrusion forging is completed by using traditional processing equipment, and this step can be regarded as the final product property selection;

[0051] Step five: solid solution aging treatment: the blank is loaded into the furnace at room temperature, after the blank is loaded into the furnace at room temperature, the temperature is raised to 900 DEG C from room temperature within 80 min and kept for 150 min; after the keeping is completed, the blank is cooled in the circulating cooling water within 40 s, and then taken out after the temperature is cooled to below 35 DEG C, the solid solution treatment is completed, and then the aging heat treatment is carried out, to obtain the beryllium copper alloy;

[0052] In this step, the aging heat treatment can be carried out after the solid solution treatment according to the requirements, to improve the mechanical and electrical properties of the product, and to make the product meet the requirements according to the customer's requirements.

[0053] Embodiment three

[0054] A high-strength high-conductivity low-beryllium copper alloy, a preparation process of the low-beryllium copper alloy comprises the following steps:

[0055] Step one: raw material batching, the copper alloy components include, by mass percentage: the beryllium content is 0.2%, the nickel content is 2.5%, the silver content is 0.005%, and the rest is red copper;

[0056] Step two: semi-continuous casting: non-vacuum furnace is selected for casting, red copper is added in the crucible, the temperature is raised to 1080 DEG C, after all the red copper is completely melted, nickel metal is added, after stirring until the added metal is completely dissolved in the melt, beryllium copper master alloy is added, finally silver copper alloy is added, continue to raise the temperature to 1150 DEG C, shake the furnace for 3 min, after the melt is uniform, start casting, get the ingot;

[0057] During the pouring process, the red runner and the red ingot water-cooled crystallizer are kept for primary water cooling, and then secondary water cooling is carried out by circulating spray cooling water, the secondary water cooling cooling water flow is 4 m 3 / min, the red runner is kept stable and the casting rate is 2 mm / s;

[0058] The casting can also adopt vacuum iron mold casting;

[0059] Step three: homogenization treatment; the ingot is loaded into the furnace, the loading temperature is room temperature, the temperature is raised to 915 DEG C and kept for 12 hours, after the keeping is completed, it is immediately put into water for air cooling;

[0060] In this step, the homogenization treatment analyzes the segregation elements in the ingot to form secondary thermal motion distribution, solves the composition macrosegregation caused by uneven cooling in the smelting process, and provides support for subsequent hot working;

[0061] Step four: processing; the ingot is loaded into the furnace, the loading temperature is room temperature, then extrusion forging is carried out to obtain a blank, wherein the extrusion forging temperature is 890 DEG C;

[0062] In the extrusion forging process, the single reduction rate is 25%-35%, and the total reduction rate is 65%-70%;

[0063] The extrusion forging is completed by using traditional processing equipment, and this step can be regarded as the final product property selection;

[0064] Step five: solid solution aging treatment: the blank is loaded into the furnace at room temperature, after the blank is loaded into the furnace at room temperature, the temperature is raised to 850 DEG C from room temperature within 50 min and kept for 90 min; after the keeping is completed, it is put into circulating cooling water for cooling within 20 s, and taken out after cooling to below 35 DEG C, after the solid solution treatment is completed, aging heat treatment is carried out, and the beryllium copper alloy is obtained;

[0065] In this step, the solution treatment can be followed by aging heat treatment according to requirements to improve the mechanical and electrical properties of the product, and the product meeting the requirements of the customer is obtained.

[0066] Example Four

[0067] A high-strength high-conductivity low-beryllium copper alloy, the preparation process of the low-beryllium copper alloy comprises the following steps:

[0068] Step one: raw material batching, the copper alloy components include, by mass percentage: beryllium content is 0.2%, nickel content is 1.5%, cobalt content is 0.3%, silver content is 0.005%, and the rest is red copper;

[0069] Step two: semi-continuous casting: non-vacuum furnace is selected for casting, red copper is added in the crucible, heated to 1080℃, and after all the red copper is completely melted, nickel metal and cobalt metal are added, and after stirring until the added metal is completely dissolved in the melt, beryllium copper master alloy is added, and finally silver copper alloy is added, and the temperature is continuously raised to 1150℃, and the furnace is shaken for 3min, and after the melt is uniform, casting is started, and ingot is obtained;

[0070] During the pouring process, the red runner and the red ingot water-cooled crystallizer are kept for primary water cooling, and then secondary water cooling is carried out by circulating spray cooling water, the secondary water cooling water flow is 4m 3 / min, the red runner is kept stable and the casting rate is 2mm / s;

[0071] The casting can also use vacuum iron mold casting;

[0072] Step three: homogenization treatment; the ingot is loaded into the furnace, the loading temperature is room temperature, and the temperature is raised to 915℃ and kept for 12 hours, and then immediately enters the water for air cooling after the heat preservation is completed;

[0073] In this step, the homogenization treatment analyzes the segregation elements in the ingot to form secondary thermal motion distribution, solves the composition macrosegregation caused by uneven cooling in the smelting process, and provides support for subsequent hot working;

[0074] Step four: processing; the ingot is loaded into the furnace, the loading temperature is room temperature, and then extrusion forging is carried out to obtain a blank, wherein the extrusion forging temperature is 890℃;

[0075] In the extrusion forging process, the single reduction rate is 25%, and the total reduction rate is 65%;

[0076] The extrusion forging is completed by using traditional processing equipment, and this step can be regarded as the final product property selection;

[0077] Step five: solid solution aging treatment: the blank is loaded into the furnace at room temperature, and the temperature is raised from room temperature to 850 DEG C within 50 min and kept for 90 min; after the end of the heat preservation, it is cooled in circulating cooling water within 20 s, and taken out after cooling to below 35 DEG C, and then the solid solution treatment is completed, and then the aging heat treatment is carried out, to obtain the beryllium copper alloy;

[0078] In this step, the aging heat treatment can be carried out after the solid solution treatment according to the requirements to improve the mechanical and electrical properties of the product, and the product meeting the requirements can be obtained according to the customer's requirements.

[0079] Example five

[0080] A high-strength high-conductivity low-beryllium copper alloy, the preparation process of the low-beryllium copper alloy comprises the following steps:

[0081] Step one: raw material batching, the copper alloy components include: beryllium content is 0.2%, nickel content is 1.4%, iron content is less than or equal to 0.3%, silver content is 0.005%, and the rest is red copper;

[0082] Step two: semi-continuous casting: non-vacuum furnace is selected for casting, red copper is added in the crucible, the temperature is raised to 1080 DEG C, after all the red copper is completely melted, nickel metal and iron metal are added, stirring until the added metal is completely dissolved in the melt, then adding beryllium copper master alloy, finally adding silver copper alloy, continuing to heat to 1150 DEG C, shaking the furnace for 3 min, and then starting casting after the melt is uniform, to obtain the ingot;

[0083] During the pouring process, the red runner and the red ingot water-cooled crystallizer are kept for primary water cooling, and then secondary water cooling is carried out by circulating spray cooling water, the flow rate of the secondary water cooling water is 4 m 3 / min, the red runner is kept stable, and the casting rate is 2 mm / s;

[0084] The casting can also adopt vacuum iron mold casting;

[0085] Step three: homogenization treatment; the ingot is loaded into the furnace, the loading temperature is room temperature, the temperature is raised to 915 DEG C and kept for 12 hours, and then the ingot is immediately air-cooled in water after the heat preservation is completed;

[0086] In this step, the homogenization treatment analyzes the segregation elements in the ingot to form secondary thermal motion distribution, solves the composition macrosegregation caused by uneven cooling in the smelting process, and provides support for subsequent hot working;

[0087] Step four: processing; the ingot is loaded into the furnace, the loading temperature is room temperature, and then extrusion forging is carried out to obtain the blank, wherein the extrusion forging temperature is 890 DEG C;

[0088] In the extrusion forging process, the single reduction rate is 25%, and the total reduction rate is 65%.

[0089] Extrusion forging is completed by using traditional processing equipment, and this step can be regarded as the final product property selection;

[0090] Step five: solid solution aging treatment: the blank is loaded into the furnace at room temperature, and then heated from room temperature to 850 DEG C within 50 min and kept for 90 min; after the end of the heat preservation, the blank is cooled in circulating cooling water within 20 s, and then taken out after the temperature is below 35 DEG C; after the solid solution treatment, the aging heat treatment is carried out, and the beryllium copper alloy is obtained;

[0091] In this step, the aging heat treatment can be carried out after the solid solution treatment according to the requirement, so as to improve the mechanical and conductive properties of the product, and the product meeting the requirement can be obtained according to the customer requirement.

[0092] The low beryllium copper alloy prepared by the preparation processes of the above embodiments one, two, three, four and five is subjected to various performance tests, and the internationally accepted C17500 / C17510 is taken as comparative examples one and two for performance test comparison, and the following record table is obtained:

[0093]

[0094] In the mechanical property aspect, the low beryllium copper alloy is highly consistent with the internationally accepted C17500 / C17510 / TBe0.6-2.5 / TBe0.4-1.8, the hardness is 220 HB-240 HB (equivalent to 78-88 HRB), the tensile strength is 515-590 MPa, the yield strength is 410-455 MPa, and the elongation is 10-16%, but in the conductive property aspect, there is a leapfrog breakthrough, the conductivity is increased from 45-65 IACS% to 72-88 IACS%;

[0095] In summary, the present application realizes the synergistic improvement of mechanical properties and electrical conductivity by optimizing the component design, melting, casting, homogenization, hot working and solid solution and aging process control. Compared with the prior art, the hardness, tensile strength and yield strength of the present application are at the same level as the international common C17500, C17510 and other typical low-beryllium copper alloys, for example, the tensile strength is stable at 560-590 MPa, the yield strength is 430-450 MPa, and the hardness is 220-240 HB, all of which are at the high-end level of the industry, fully guaranteeing the high strength characteristics of the material. At the same time, the present application also performs well in plasticity, with an elongation of 10-16%, which is 2-4 percentage points higher than the comparative examples, taking into account the formability and use safety. Especially significantly, the electrical conductivity of the present application is broken through to 72-88 IACS%, which is a substantial leap compared with C17500 (about 45-60 IACS%) and C17510 (about 45-55 IACS%) while maintaining high strength. Therefore, the present application effectively solves the bottleneck problem of traditional low-beryllium copper alloys that strength and electrical conductivity are difficult to be considered together, and has high strength, excellent plasticity and high electrical conductivity, which has significant technical progress and broad engineering application prospect.

[0096] The above describes one embodiment of the present application in detail, but the content described is only the preferred embodiment of the present application and cannot be considered to limit the scope of the implementation of the present application. Any equivalent changes and improvements made in the scope of the present application should still belong to the scope of the patent coverage of the present application.

Claims

1. A high-strength high-conductivity low-beryllium copper alloy, characterized by, The preparation process of the low beryllium copper alloy comprises the following steps: Step one: raw material batching: according to the mass percentage content, the copper alloy components include: the beryllium content is 0.2%-0.6%, the nickel content is 1.4%-2.5%, the cobalt content is less than or equal to 0.3%, the iron content is less than or equal to 0.3%, the silver content is 0.005%-0.01%, and the rest is red copper; Step two: semi-continuous casting: non-vacuum furnace is selected for casting, red copper is added in the crucible, the temperature is raised to 1080-1090 DEG C, after all the red copper is completely melted, nickel metal, cobalt metal and iron metal are added, stirring until the added metal is completely dissolved in the melt, then adding beryllium copper master alloy, finally adding silver copper alloy, continuing to raise the temperature to 1150-1250 DEG C, shaking the furnace for 3-5 min, starting casting after the melt is uniform, and obtaining ingot; Step three: homogenization treatment; the ingot is loaded into the furnace, the temperature is raised to 915 DEG C and kept for 12 hours, and then immediately cooled in water; Step four: processing; the ingot is loaded into the furnace, and then extrusion forging processing is carried out to obtain a blank; Step five: solid solution aging treatment: the blank is loaded into the furnace at room temperature, then heated and kept; after the end of the heat preservation, rapid cooling is carried out in cold water, and then taken out after cooling to below 35 DEG C, solid solution treatment is completed, and then aging heat treatment is carried out, and the beryllium copper alloy is obtained.

2. The high-strength, high-conductivity, low-beryllium copper alloy of claim 1, wherein, In step one, the sum of the iron content, the cobalt content and the nickel content is less than or equal to 2.5%.

3. The high-strength, high-conductivity, low-beryllium copper alloy of claim 1, wherein, In step two, during the pouring process, the red flow channel is kept stable and the casting rate is 2-3 mm / s.

4. The high-strength, high-conductivity, low-beryllium copper alloy of claim 3, wherein, The secondary water-cooled cooling water flow rate is 4 m 3 / min-10 m 3 / min.

5. The high-strength, high-conductivity, low-beryllium copper alloy of claim 3, wherein: In the pouring process, the red flow channel is kept stable and the casting rate is 2-3 mm / s.

6. The high-strength, high-conductivity, low-beryllium copper alloy of claim 1, wherein, The loading temperature of steps three and four is room temperature.

7. The high-strength, high-conductivity, low-beryllium copper alloy of claim 1, wherein, In step four, the extrusion forging temperature is 890 DEG C.

8. The high-strength, high-conductivity, low-beryllium copper alloy of claim 7, wherein, In step four, during the extrusion forging process, the single reduction rate is 25%-35%, and the total reduction rate is 65%-70%.

9. The high-strength, high-conductivity, low-beryllium copper alloy of claim 1, wherein, In step five, after the furnace is loaded at room temperature, the temperature is raised to 850-900 DEG C from room temperature within 50-80 min and kept for 90-150 min.

10. The high-strength, high-conductivity, low-beryllium copper alloy of claim 1, wherein, After the end of the heat preservation in step five, the circulating cooling water is poured into the furnace within 20-40 s for cooling.

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