Light guide plate defect sample enhancement and detection integrated method

Abstract

The invention discloses a light guide plate defect sample enhancement and detection integrated method, and relates to the technical field of light guide plate detection, and the method comprises the steps: marking all lattice points based on a front view of a light guide plate; acquiring same-distance defect characteristics by using a same-distance analysis method; obtaining adjacent distance defect influence characteristics by using an adjacent distance dot analysis method; when the light guide plate is subjected to defect detection, acquiring a defect sample area and an influence detection area in the light guide plate; the method is used for solving the problems that in an existing light guide plate defect sample enhancement and detection method, in the aspect of dot defect detection in a light guide plate, defect hidden dangers caused by dot influences cannot be effectively analyzed on the basis of dot defect types, but due to the fact that detection parameters are stable when defect parts are enhanced, areas which are not divided into defect spots cannot be effectively analyzed, and the detection accuracy is poor. And the defect detection precision is low.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of light guide plate detection, in particular to a light guide plate defect sample enhancement and detection integrated method. BACKGROUND

[0002] The light guide plate is an optical element made of optical-grade acrylic or polycarbonate plate material. By engraving light guide points on the bottom surface of the plate through a special process, point light sources are converted into uniform surface light sources. The core principle is that light is uniformly emitted from the front after multiple refraction and diffuse reflection of the light guide points in the plate, and the bottom light leakage is recycled through the reflector to improve the light efficiency. The defects of the light guide plate mainly include scratch phenomenon, fusion mark and net point design defect.

[0003] The existing method for light guide plate defect sample enhancement and detection usually obtains the original image corresponding to the light guide plate, pre-processes and segments the image, and obtains the defect point through defect part enhancement to realize the precision and accuracy of detection. Although this improved method can realize the automation of defect detection through machine vision, it lacks a detection method for dividing the influence area of the defective net point when the net point in the light guide plate has defects, resulting in that when the net point in the light guide plate has defects, it is impossible to effectively analyze the area not divided into the defect point based on the defect type of the net point, causing low defect detection precision and inability to effectively divide all areas affected by the same defect. For example, in the patent application with publication number CN111257348A, a LED light guide plate defect detection method based on machine vision is disclosed. This scheme combines image acquisition and lighting scheme with machine vision to realize the automation of light guide plate image segmentation and defect classification detection, and improves the detection precision and accuracy without affecting the detection efficiency through effective image enhancement and preprocessing method. However, other improvements for light guide plate defect sample enhancement and detection method are usually specific to certain special defects in the light guide plate, and still cannot solve the problem of lack of detection method for dividing the influence area of the defective net point when the net point in the light guide plate has defects, resulting in that when the net point in the light guide plate has defects, it is impossible to effectively analyze the area not divided into the defect point based on the defect type of the net point, causing low defect detection precision and inability to effectively divide all areas affected by the same defect. In view of this, it is necessary to improve the existing light guide plate defect sample enhancement and detection method. SUMMARY

[0004] The present application aims to at least solve one of the technical problems in the prior art by proposing a light guide plate defect sample enhancement and detection integrated method, which is used to solve the problem that in the existing light guide plate defect sample enhancement and detection method, there is a lack of detection method for dividing the influence area of the defective dot in the light guide plate, resulting in that when the dot in the light guide plate has a defect, the defective area affected by the dot cannot be effectively analyzed, and the defect detection accuracy is low, and all areas affected by the same defect cannot be effectively divided.

[0005] To achieve the above-mentioned purpose, the present application provides a light guide plate defect sample enhancement and detection integrated method, comprising the following steps: Based on the front view of the light guide plate, the positions of the light source entrance and all dots in the light guide plate are obtained, and all dots are marked based on the distance between all dots and the light source entrance; all marked dots are analyzed using the same distance analysis method, and the same distance defect characteristics of each dot are obtained based on the analysis result; Based on the same distance defect characteristics of each dot, the same distance defect dot group of each dot in the light guide plate is obtained, and all same distance defect dot groups are analyzed using the adjacent distance dot analysis method, and the adjacent distance defect influence characteristics of each dot are obtained based on the analysis result; When the defect of the light guide plate is detected, the defect sample area and the influence detection area in the light guide plate are obtained based on the same distance defect characteristics of each dot and the adjacent distance defect influence characteristics of all dots in all same distance defect dot groups.

[0006] Further, based on the front view of the light guide plate, the positions of the light source entrance and all dots in the light guide plate are obtained, and all dots are marked based on the distance between all dots and the light source entrance, comprising: Obtain the front view of the light guide plate and mark it as the front light plate graph; mark the point corresponding to the light source entrance in the front light plate graph as the light source point; establish a plane rectangular coordinate system and mark it as the front plate analysis coordinate system, wherein the units of the X-axis and the Y-axis of the front plate analysis coordinate system are cm; place the front light plate graph in the front plate analysis coordinate system, wherein the light source point in the front light plate graph coincides with the coordinate origin of the front plate analysis coordinate system; Based on laser scanning positioning, the positions of all dots in the light guide plate are obtained, and the positions of all dots in the light guide plate are marked in the front plate analysis coordinate system; the distance between each dot and the coordinate origin is obtained, which is marked as the light distance of the dot; for any dot in the front plate analysis coordinate system, the dot with the same light distance as the dot is marked as the same distance dot of the dot.

[0007] Further, the same distance analysis method comprises: Based on the historical use record of the light guide plate, defects of the dots in the light guide plate caused by process parameters are obtained, and are respectively recorded as process defects GQ1 to process defects GQ t ; For any one process defect GQ u and any one dot α in the light guide plate: the dot α and all the equidistant dots of the dot α are recorded as to-be-tested dots, wherein u is a positive integer less than or equal to t and greater than or equal to 1; based on the historical use record of the light guide plate, the light source with the most number of times of being introduced into the light guide plate is recorded as a light source that can be introduced into the light guide plate.

[0008] Further, the equidistant analysis method further comprises: placing a dot with good process parameters at the position of all the to-be-tested dots, introducing the light source that can be introduced into the light guide plate into the light guide plate from the position corresponding to the light source point in the light guide plate, obtaining the gray image corresponding to the front light plate at this time, and recording it as a full-intact gray image; using the dot proportion analysis method to obtain the pixel proportion corresponding to each to-be-tested dot in the full-intact gray image, and recording it as the standard proportion of the to-be-tested dot; The dot proportion analysis method comprises: recording all the pixel points covered by the to-be-tested dot as standard pixel points of the to-be-tested dot, obtaining the gray values of all the standard pixel points, and recording the mode of all the gray values as a standard gray value; recording the number of all the standard pixel points as t1, and recording the number of the standard pixel points with the standard gray value as t2, and recording the value of t2 divided by t1 as the pixel proportion of the to-be-tested dot.

[0009] Further, the equidistant analysis method further comprises: placing a dot with process defects GQ u at the position of all the to-be-tested dots, introducing the light source that can be introduced into the light guide plate into the light guide plate from the position corresponding to the light source point in the light guide plate, obtaining the gray image corresponding to the front light plate at this time, and recording it as a full-defect gray image; using the dot proportion analysis method to obtain the pixel proportion corresponding to each to-be-tested dot in the full-defect gray image, and recording it as the full-defect proportion of the to-be-tested dot.

[0010] Further, the equidistant analysis method further comprises: placing a dot with process defects GQ u at the position of the dot α, introducing the light source that can be introduced into the light guide plate into the light guide plate from the position corresponding to the light source point in the light guide plate, obtaining the gray image corresponding to the front light plate at this time, and recording it as a dot-defect gray image; using the dot proportion analysis method to obtain the pixel proportion corresponding to each to-be-tested dot in the dot-defect gray image, and recording it as the dot-defect proportion of the to-be-tested dot; recording the value obtained by subtracting the full-defect proportion from the standard proportion of the dot α as the defect difference value of the dot α; For any one of the to-be-tested screen dots other than screen dot α: when the value of the standard proportion of the to-be-tested screen dot minus the dot defect proportion is less than or equal to the defect difference value, the to-be-tested screen dot is recorded as a dot residual image dot.

[0011] Further, the same-distance analysis method further comprises: a curve obtained by fitting screen dot α and all dot residual influence dots in the positive plate analysis coordinate system is recorded as the same-distance defect feature of screen dot α at process defect GQ u ; the same-distance defect features of all screen dots at all process defects are obtained.

[0012] Further, based on the same-distance defect feature of each screen dot, the same-distance defect net group of each screen dot in the light guide plate is obtained, comprising: For any one of the screen dots in the light guide plate α: all screen dots corresponding to the same-distance defect feature of screen dot α at all process defects are recorded as the same-distance defect group of screen dot α; each screen dot in the same-distance defect group is analyzed using the adjacent-distance screen dot analysis method, and the adjacent-distance defect influence feature of screen dot α is obtained based on the analysis result.

[0013] Further, the adjacent-distance screen dot analysis method comprises: For any one of the screen dots β in the same-distance defect group: when screen dot β is recorded as a screen dot in the same-distance defect group of screen dot α, the process defect of screen dot α is recorded as the same-distance influence defect of screen dot β, wherein screen dot β can correspond to multiple same-distance influence defects; In the front light plate diagram, the dot closest to screen dot β in each direction is recorded as the adjacent-distance dot of screen dot β, and all adjacent-distance dots that are in the same-distance defect group of screen dot α are excluded from the adjacent-distance dots of screen dot β; For any one of the same-distance influence defects of screen dot β: a screen dot with the same-distance influence defect is placed at the position of screen dot β, a light source is turned on from the position corresponding to the light source point in the light guide plate, a gray-scale image corresponding to the front light plate diagram at this time is obtained, and is recorded as the adjacent residual defect gray-scale image; The pixel proportion of each adjacent-distance dot in the adjacent residual defect gray-scale image is obtained using the screen dot proportion analysis method, and is recorded as the adjacent residual defect proportion of the adjacent-distance dot; when the adjacent residual defect proportion of the adjacent-distance dot is less than the standard proportion of the adjacent-distance dot, the adjacent-distance dot is recorded as an adjacent influence dot; A scatter plot formed by all adjacent influence dots and screen dot β is recorded as the adjacent influence diagram of screen dot β; The adjacent influence diagrams of all same-distance influence defects of screen dot β are obtained; The adjacent influence diagrams of all same-distance influence defects of all screen dots in the same-distance defect group are obtained; for any one of the process defects GQ u , all same-distance influence defects are recorded as the process defect GQ uThe minimum circumscribed area of the scatter diagram constituted by the adjacent influence graph of the dot is recorded as dot alpha about process defect GQ u The defect influence area of dot alpha about all process defects; The defect influence area of dot alpha about all process defects is recorded as the adjacent distance defect influence feature of dot alpha.

[0014] Further, when defect detection is performed on the light guide plate, based on the same distance defect feature of each dot and the adjacent distance defect influence feature of all dots in all same distance defect dot groups, the defect sample area and the influence detection area in the light guide plate are obtained, which includes: When defect detection is performed on the light guide plate, for any dot gamma that has been detected to have a defect: the defect of dot gamma is recorded as a detected defect, the same distance defect feature of dot gamma when the detected defect is detected is recorded as a main analysis area, and the defect influence area of the adjacent distance defect influence feature of dot gamma about the process defect is recorded as an adjacent dot influence area. The area intersected by the main analysis area and the adjacent dot influence area is recorded as the defect sample area when dot gamma is detected, and the area in the main analysis area and the adjacent dot influence area other than the defect sample area is recorded as the influence detection area.

[0015] The beneficial effects of the present application are: firstly, based on the front view of the light guide plate, the positions of the light source entrance and all dots in the light guide plate are obtained, and all dots are labeled; all labeled dots are analyzed using the same distance analysis method, and the same distance defect feature of each dot is obtained based on the analysis result. The advantage of this is that by obtaining the same distance defect feature of each dot in the light guide plate, the mutual influence state of the dots with the same light distance from the light source entrance when there is a defect can be effectively obtained, so that when there is a defect in the dot, other dots affected by the dot defect and having the same light distance can be obtained, so that in subsequent analysis, based on the defect type of the dot, the area affected by the dot and having a defect hidden danger but having stable detection parameters when the defect position is enhanced is effectively framed, thereby improving the defect detection precision. The application is also based on the same-distance defect features of each net point, acquires the same-distance defect net groups of each net point in the light guide plate, analyzes all the same-distance defect net groups using the adjacent-distance net point analysis method, and acquires the adjacent-distance defect influence features of each net point based on the analysis result; finally, when the light guide plate is subjected to defect detection, the defect sample area and the influence detection area in the light guide plate are acquired based on the same-distance defect features of each net point and the adjacent-distance defect influence features of all the net points in all the same-distance defect net groups, which has the advantage that, by acquiring the same-distance defect net groups based on the same-distance defect features and further acquiring the adjacent-distance defect influence features, the net points that have defect hidden dangers caused by other net points can be further acquired based on other net points that are affected by the net point defects and have the same light distance when the net points have defects, so that the obtained defect sample area and influence detection area can reflect the area directly affected by the defect net points and the area indirectly affected by the defect net points respectively, and thus the problem that the defect detection precision is low and all the areas affected by the same defect cannot be effectively divided due to the fact that the detection parameters are relatively stable when the defect position is enhanced and the area not divided into the defect net points is effectively analyzed is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A flow chart of steps of the method of the application; Figure 2 A schematic diagram of the positive plate analysis coordinate system of the application; Figure 3 A curve schematic diagram corresponding to the same-distance defect groups of the application; Figure 4 A schematic diagram of the adjacent influence map of the application; Figure 5 An acquisition schematic diagram of the defect influence area of the application; Figure 6 A structural schematic diagram of the electronic device of the application. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the application.

[0018] Embodiment 1, please refer to Figure 1 The application provides a light guide plate defect sample enhancement and detection integrated method, which comprises the following steps: Step S1, based on the front view of the light guide plate, the entrance of the light source and the positions of all the dots in the light guide plate are obtained, and all the dots are marked based on the distance of all the dots from the entrance of the light source; all the marked dots are analyzed using the same distance analysis method, and the same distance defect characteristics of each dot are obtained based on the analysis results; Step S1 includes: step S101, obtaining the front view of the light guide plate and recording it as the front light plate graph; the point corresponding to the entrance of the light source in the front light plate graph is recorded as the light source point; a plane rectangular coordinate system is established and recorded as the front plate analysis coordinate system, wherein the units of the X and Y axes of the front plate analysis coordinate system are cm; the front light plate graph is placed in the front plate analysis coordinate system, wherein the light source point in the front light plate graph coincides with the coordinate origin of the front plate analysis coordinate system; In the specific implementation process, the purpose of building the front plate analysis coordinate system is to clearly obtain the positions of all the dots in the light guide plate, and to more intuitively obtain the positions of each feature or region in the front plate analysis coordinate system when subsequently obtaining the same distance defect characteristics, the adjacent distance defect influence characteristics, the defect sample area and the influence detection area, thereby improving the efficiency of data analysis and the defect repair efficiency of the staff; Step S102, based on laser scanning positioning, the positions of all the dots in the light guide plate are obtained, and the positions of all the dots in the light guide plate are marked in the front plate analysis coordinate system; the distance between each dot and the coordinate origin is obtained, which is recorded as the light distance of the dot; for any one dot a in the front plate analysis coordinate system, the dot with the same light distance as the dot a is recorded as the same distance dot of the dot a; In the specific implementation process, the distance between the dot and the coordinate origin, that is, the straight line distance between the dot in the light guide plate and the light source access point.

[0019] Step S103, the same distance analysis method includes: step S1031, based on the historical use record of the light guide plate, the defects of the dots in the light guide plate caused by process parameters are obtained and are respectively recorded as process defects GQ1 to process defects GQ t ; In the specific implementation, the process defects can include dot scratches, foreign matter pollution, existence of fusion marks and dot delamination, etc. The process defects can be specifically set according to the defects that may exist at the dots in the actual light guide plate, so as to ensure that the subsequent analysis can be consistent with various defect conditions in the use process of the actual light guide plate; Step S1032, for any one process defect GQ u and any one dot a in the light guide plate: the dot a and all the same distance dots of the dot a are recorded as the to-be-tested dots, wherein u is a positive integer less than or equal to t and greater than or equal to 1; based on the historical use record of the light guide plate, the light source with the most number of times of being introduced into the light guide plate is recorded as the available light source; In the implementation process, the purpose of selecting the same distance dot of the dot as the to-be-tested dot is that the distance between the same distance dot of the dot and the light source entrance is the same as the distance between the dot and the light source entrance, so when the dot has a defect, the same distance dot, which is closest to the parameters of the defective dot, is easily affected by the defective dot and thus has a defect, and therefore the to-be-tested dot can be used as a dot that is preferentially analyzed among all dots.

[0020] The same distance analysis method further includes: in step S1033, placing a dot with good process parameters at the position of each to-be-tested dot, passing the light source into the light guide plate from the position corresponding to the light source in the light guide plate, obtaining a gray image corresponding to the front light plate diagram at this time, and recording the gray image as a full-perfect gray image; In step S1034, the dot proportion analysis method is used to obtain the pixel proportion of each to-be-tested dot in the full-perfect gray image, and the pixel proportion is recorded as the standard proportion of the to-be-tested dot. The dot proportion analysis method includes: in step S1035, all pixel points covered by the to-be-tested dot are recorded as standard pixel points of the to-be-tested dot, the gray values of all standard pixel points are obtained, and the mode of all gray values is recorded as a standard gray value; the number of all standard pixel points is recorded as t1, the number of standard pixel points with the standard gray value is recorded as t2, and the value of t2 divided by t1 is recorded as the pixel proportion of the to-be-tested dot. In the implementation process, for example, in one data analysis, the number of standard pixel points of the to-be-tested dot obtained is 256, and the standard gray value is 129; through data analysis, it is obtained that the number of pixel points with the gray value of 129 in the standard pixel points is 224, t1 is 256, t2 is 224, and the pixel proportion of the to-be-tested dot is 0.875; by obtaining the standard proportion, the full-defect proportion, and the point-defect proportion of the to-be-tested dot, the dot affected by the defect of dot α, that is, the point residual image point, among all to-be-tested dots except dot α can be obtained when dot α has a defect, so as to effectively frame the area that is not divided into a defective dot when dot α has a process defect GQ u . In step S1036, a dot with a process defect GQ u is placed at the position of each to-be-tested dot, the light source is passed into the light guide plate from the position corresponding to the light source in the light guide plate, a gray image corresponding to the front light plate diagram at this time is obtained, and the gray image is recorded as a full-defect gray image. In step S1037, the dot proportion analysis method is used to obtain the pixel proportion of each to-be-tested dot in the full-defect gray image, and the pixel proportion is recorded as the full-defect proportion of the to-be-tested dot.

[0021] The same distance analysis method further includes: step S1038, placing a screen dot where the screen dot a is located and which has the process defect GQ u , corresponding to the position of the light source point in the light guide plate, passing the light source into the light guide plate, obtaining the gray image corresponding to the front light plate at this time, and recording it as a point defect gray image; Step S1039, using the screen dot proportion analysis method to obtain the pixel proportion corresponding to each to-be-measured screen dot in the point defect gray image, and recording it as the point defect proportion of the to-be-measured screen dot; subtracting the value of the full defect proportion from the standard proportion of the screen dot a, and recording it as the defect difference value of the screen dot a; Step S10310, for any one to-be-measured screen dot other than the screen dot a: when the value obtained by subtracting the point defect proportion from the standard proportion of the to-be-measured screen dot is less than or equal to the defect difference value, the to-be-measured screen dot is recorded as a point residual image point; In the specific process, for example, in one data analysis, the standard proportion of the screen dot a and the full defect proportion are 0.9 and 0.6 respectively, and then through calculation, the defect difference value is 0.3; for any one to-be-measured screen dot other than the screen dot a, the standard proportion and the point defect proportion of the to-be-measured screen dot are 0.95 and 0.8 respectively, and then the value obtained by subtracting the point defect proportion from the standard proportion of the to-be-measured screen dot is 0.15, which indicates that when the screen dot a has a defect, the to-be-measured screen dot is affected by the screen dot a and thus has a partial defect, and therefore the to-be-measured screen dot can be recorded as a point residual image point, that is, a screen dot directly affected by the defect of the screen dot a; When actually analyzing, if the value obtained by subtracting the point defect proportion from the standard proportion of the to-be-measured screen dot is greater than the defect difference value, it indicates that when the screen dot a has a defect, the defect degree of the to-be-measured screen dot caused by the influence of the screen dot a is greater than the defect degree of the screen dot a, and therefore the to-be-measured screen dot has a quality problem, and the to-be-measured screen dot can be directly marked and repaired.

[0022] The same distance analysis method further includes: step S10311, fitting the curve of the screen dot a and all point residual influence points in the positive plate analysis coordinate system to record the same distance defect feature of the screen dot a under the process defect GQ u ; In the specific implementation process, for example, in one data analysis, the positive plate analysis coordinate system obtained is as shown in Figure 2 , and Figure 2 the midpoint of all Δs is the position of all screen dots, and the same distance screen dot of the screen dot a is TJ1 to TJ6 in Figure 2 ; through analysis, TJ2, TJ4, TJ5 and TJ6 are point residual influence points of the screen dot a under one process defect, and the corresponding same distance defect feature is the curve TQ; Step S10312, obtaining the same distance defect feature of all screen dots under all process defects.

[0023] Step S2, based on the same distance defect characteristics of each mesh point, obtain the same distance defect mesh group of each mesh point in the light guide plate, and analyze all the same distance defect mesh groups using the adjacent distance mesh point analysis method, and obtain the adjacent distance defect influence characteristics of each mesh point based on the analysis result; Step S2 includes: step S201, for any one mesh point α in the light guide plate: all the mesh points corresponding to the same distance defect characteristics of the mesh point α in all process defects are recorded as the same distance defect group of the mesh point α; using the adjacent distance mesh point analysis method to analyze each mesh point in the same distance defect group, and obtaining the adjacent distance defect influence characteristics of the mesh point α based on the analysis result.

[0024] The adjacent distance mesh point analysis method includes: step S2011, for any one mesh point β in the same distance defect group: when the mesh point β is recorded as the mesh point in the same distance defect group of the mesh point α, the process defect of the mesh point α is recorded as the same distance influence defect of the mesh point β, wherein the mesh point β can correspond to multiple same distance influence defects; Step S2012, in the front light plate diagram, the point closest to the mesh point β in each direction is recorded as the adjacent point of the mesh point β, and all the adjacent points in the same distance defect group of the mesh point α are removed from the adjacent points of the mesh point β; In the specific implementation process, such as in one data analysis, the same distance defect group of the mesh point α and the position of the mesh point β are Figure 3 The curve TQ and the point β in the figure, through analysis, the adjacent points of the mesh point β are points LJ1 to LJ8, through calculating the adjacent residual defect proportion and the standard proportion of each adjacent point, it is obtained that among the points LJ1 to LJ8, points LJ1, LJ2, LJ3, LJ4, LJ7 and LJ8 are adjacent influence points, and the adjacent influence diagram corresponding to the mesh point β is shown in the scatter diagram composed of all solid triangles in Figure 4 Step S2013, for any one same distance influence defect of the mesh point β: placing the mesh point with the same distance influence defect at the position of the mesh point β, the position corresponding to the light source point in the light guide plate is filled with light source, the gray image corresponding to the front light plate diagram at this time is obtained, and is recorded as the adjacent residual defect gray image; Step S2014, using the mesh point proportion analysis method to obtain the pixel proportion corresponding to each adjacent point in the adjacent residual defect gray image, and recording it as the adjacent residual defect proportion of the adjacent point; when the adjacent residual defect proportion of the adjacent point is less than the standard proportion of the adjacent point, the adjacent point is recorded as the adjacent influence point; In the specific implementation process, when the adjacent residual defect proportion of the adjacent point is less than the standard proportion of the adjacent point, it indicates that the adjacent point is affected by the mesh point β and has certain defects, therefore, the adjacent influence diagram composed of all the adjacent influence points and the mesh point β can be obtained by recording the adjacent point as the adjacent influence point, and the influence area of the mesh point β affected by the defects is limited; ​Step S2015, all adjacent influence points and the scatter diagram of the net point β are recorded as the adjacent influence diagram of the net point β; Step S2016, the adjacent influence diagram of all same distance influence defects of the net point β is obtained; Step S2017, the adjacent influence diagram of all same distance influence defects of all net points in the same distance defect group is obtained; for any one process defect GQ u , the adjacent influence diagram of all same distance influence defects of the net point of the process defect GQ u is recorded as the defect influence area of the net point α about the process defect GQ u ; In the specific implementation process, for example, in one data analysis, the analyzed process defect is a fusion mark, and the scatter diagram of the adjacent influence diagram of all same distance influence defects of the net point is as shown in Figure 5 , wherein Figure 5 The midpoint of all o in the area is the position of all points in the scatter diagram, so the defect influence area can be set as area QY; by obtaining the defect influence area, the affected area of the net point α when the net point α exists a fusion mark causing a defect can be obtained; so as to prevent the problem of missing part of the area in the defect influence area due to the relatively stable detection parameters in actual detection, causing the detection of the area affected by the defect of the net point α not comprehensive enough; Step S2018, the defect influence area of the net point α about all process defects is recorded as the adjacent distance defect influence characteristic of the net point α.

[0025] Step S3, when the light guide plate is subjected to defect detection, based on the same distance defect characteristic of each net point and the adjacent distance defect influence characteristic of all net points in all same distance defect net groups, the defect sample area and the affected detection area in the light guide plate are obtained. Step S3 includes: step S301, when the light guide plate is subjected to defect detection, for any one net point γ which has been detected to have a defect: the defect existing in the net point γ is recorded as a detection defect, the same distance defect characteristic of the net point γ when the detection defect is detected is recorded as a main analysis area, and the defect influence area of the adjacent distance defect influence characteristic of the net point γ about the process defect is recorded as an adjacent distance point influence area. In the specific implementation process, by dividing the main analysis area and the adjacent distance point influence area, and further obtaining the defect sample area and the affected detection area, the area directly affected by the defect net point and the area indirectly affected by the defect net point can be reflected respectively, thereby avoiding the problem that the detection parameters are relatively stable when the defect position is enhanced, causing the area not divided into the defect point to be effectively analyzed, resulting in low defect detection accuracy and unable to effectively divide all areas affected by the same defect; Step S302, the area where the main analysis area intersects with the adjacent dot influence area is recorded as a defect sample area for dot γ detection, and the area in the main analysis area and the adjacent dot influence area except the defect sample area is recorded as an influence detection area.

[0026] Embodiment 2, please refer to Figure 6 As shown in the figure, Figure 6 An electronic device can include a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory can communicate with each other through the communication bus. The memory stores computer readable instructions, and the processor can call the instructions in the memory. When the computer readable instructions are executed by the processor, the steps in the light guide plate defect sample enhancement and detection integrated method are executed to realize the following functions: first, based on the front view of the light guide plate, the positions of the light source entrance and all dots in the light guide plate are obtained, and all dots are labeled based on the distance between all dots and the light source entrance; all labeled dots are analyzed using the same distance analysis method, and the same distance defect features of each dot are obtained based on the analysis result; then, based on the same distance defect features of each dot, the same distance defect dot group of each dot in the light guide plate is obtained, and all same distance defect dot groups are analyzed using the adjacent dot analysis method, and the adjacent distance defect influence features of each dot are obtained based on the analysis result; finally, when the light guide plate is detected for defects, based on the same distance defect features of each dot and the adjacent distance defect influence features of all dots in all same distance defect dot groups, the defect sample area and the influence detection area in the light guide plate are obtained.

[0027] In addition, the logic instructions in the memory described above can be implemented in the form of a software function unit and sold or used as an independent product, which can be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application essentially or the part that contributes to the prior art or part of the technical solutions can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a plurality of instructions to make a computer device (which can be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the method described in various embodiments of the present application. The foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk, and various media that can store program codes.

[0028] In embodiment 3, the present application also provides a computer program product, which comprises a computer program stored on a computer readable storage medium, and the computer program comprises program instructions, when the program instructions are executed by a computer, the computer can execute the light guide plate defect sample enhancement and detection integrated method provided by the above method, and the method comprises the following steps: first, based on the front view of the light guide plate, the position of the light source entrance and all the dots in the light guide plate are obtained, and all the dots are marked based on the distance between all the dots and the light source entrance; all the marked dots are analyzed by using the same distance analysis method, and the same distance defect characteristics of each dot are obtained based on the analysis result; then, based on the same distance defect characteristics of each dot, the same distance defect net group of each dot in the light guide plate is obtained, and all the same distance defect net groups are analyzed by using the adjacent distance dot analysis method, and the adjacent distance defect influence characteristics of each dot are obtained based on the analysis result; finally, when the defect detection of the light guide plate is performed, the defect sample area and the influence detection area in the light guide plate are obtained based on the same distance defect characteristics of each dot and the adjacent distance defect influence characteristics of all the dots in all the same distance defect net groups.

[0029] In embodiment 4, the present application also provides a computer readable storage medium, and the present application provides a storage medium, which stores a computer program, and the computer program is executed by a processor, and the steps in the light guide plate defect sample enhancement and detection integrated method are executed to realize the following functions: first, based on the front view of the light guide plate, the position of the light source entrance and all the dots in the light guide plate are obtained, and all the dots are marked based on the distance between all the dots and the light source entrance; all the marked dots are analyzed by using the same distance analysis method, and the same distance defect characteristics of each dot are obtained based on the analysis result; then, based on the same distance defect characteristics of each dot, the same distance defect net group of each dot in the light guide plate is obtained, and all the same distance defect net groups are analyzed by using the adjacent distance dot analysis method, and the adjacent distance defect influence characteristics of each dot are obtained based on the analysis result; finally, when the defect detection of the light guide plate is performed, the defect sample area and the influence detection area in the light guide plate are obtained based on the same distance defect characteristics of each dot and the adjacent distance defect influence characteristics of all the dots in all the same distance defect net groups.

[0030] Through the description of the above embodiments, the embodiments of the present application can be provided as a method, a system or a computer program product. Based on such understanding, the above technical solutions can be embodied in the form of a software product, which can be stored in a computer readable storage medium, such as a ROM / RAM, a magnetic disk, an optical disk, etc., and includes a plurality of instructions to make a computer device (which can be a personal computer, a server, or a network device, etc.) execute the method described in each embodiment or some parts of the embodiment.

[0031] In the embodiments of the present application, it should be understood that the disclosed system or method can be implemented in other ways. The embodiments described above are only illustrative, for example, the division of modules or units is only a logical function division, and other division manners can be used in actual implementation, for example, a plurality of modules or units can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the displayed or discussed each other can be through some communication interface, the indirect coupling or communication connection between the system, the module and the unit can be electrical, mechanical or other forms.

[0032] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for light guide plate defect sample enhancement and detection integration, characterized in that, The method comprises the following steps: Based on the front view of the light guide plate, the positions of the light source entrance and all the dots in the light guide plate are obtained, and all the dots are marked based on the distances of all the dots from the light source entrance; The same distance analysis method is used to analyze all the marked dots, and the same distance defect characteristics of each dot are obtained based on the analysis results; Based on the same distance defect characteristics of each dot, the same distance defect dot groups of each dot in the light guide plate are obtained, and the adjacent distance dot analysis method is used to analyze all the same distance defect dot groups, and the adjacent distance defect influence characteristics of each dot are obtained based on the analysis results; When the defect detection of the light guide plate is performed, the defect sample area and the influence detection area in the light guide plate are obtained based on the same distance defect characteristics of each dot and the adjacent distance defect influence characteristics of all the dots in all the same distance defect dot groups.

2. The method of claim 1, wherein the method is characterized by: Based on the front view of the light guide plate, the positions of the light source entrance and all the dots in the light guide plate are obtained, and all the dots are marked based on the distances of all the dots from the light source entrance, which comprises: The front view of the light guide plate is obtained and is recorded as a front light plate diagram; the point corresponding to the light source entrance in the front light plate diagram is recorded as a light source point; a plane rectangular coordinate system is established and is recorded as a front plate analysis coordinate system, wherein the units of the X-axis and the Y-axis of the front plate analysis coordinate system are cm; the front light plate diagram is placed in the front plate analysis coordinate system, wherein the light source point in the front light plate diagram coincides with the coordinate origin of the front plate analysis coordinate system; The positions of all the dots in the light guide plate are obtained based on laser scanning positioning, and the positions of all the dots in the light guide plate are marked in the front plate analysis coordinate system; the distance between each dot and the coordinate origin is obtained and is recorded as the optical distance of the dot; for any dot α in the front plate analysis coordinate system, the dot with the same optical distance as the dot α is recorded as the same distance dot of the dot α.

3. The method of claim 2, wherein the method further comprises: providing a plurality of light sources; and providing a plurality of light detectors. The same distance analysis method comprises: Based on the historical use record of the light guide plate, defects of the screen dots in the light guide plate caused by process parameters are obtained, and are respectively recorded as process defects GQ1 to process defects GQ t ; For any one process defect GQ u And any one dot α in the light guide plate: record the dot α and all the same distance dots of the dot α as the to-be-tested dots, wherein u is a positive integer less than or equal to t and greater than or equal to 1; based on the historical use record of the light guide plate, record the light source with the most times of being turned on into the light guide plate as the light source that can be turned on.

4. The method of claim 3, wherein the method further comprises: providing a plurality of light sources; and providing a plurality of light detectors. The same distance analysis method further comprises: A dot with good process parameters is placed at the position of each to-be-detected dot, a light source is introduced into the light guide plate from the position corresponding to the light source point in the light guide plate, a gray image corresponding to the front light plate diagram at this time is obtained, and is recorded as a full-perfect gray image; The pixel proportion corresponding to each to-be-detected dot in the full-perfect gray image is obtained using the dot proportion analysis method, and is recorded as the standard proportion of the to-be-detected dot. The dot proportion analysis method comprises: all the pixel points covered by the to-be-detected dot are recorded as standard pixel points of the to-be-detected dot, the gray values of all the standard pixel points are obtained, and the mode of all the gray values is recorded as a standard gray value; the number of all the standard pixel points is recorded as t1, and the number of the standard pixel points with the standard gray value is recorded as t2, and the value of t2 divided by t1 is recorded as the pixel proportion of the to-be-detected dot.

5. The method of claim 4, wherein the method further comprises: determining the defect type of the defect of the LGP sample based on the detected defect type of the defect of the LGP sample. The same distance analysis method further comprises: A dot with process defect GQ is placed at the position of each test dot u The light source is turned on, and the gray-scale image corresponding to the front light plate image at this time is obtained, and is recorded as a full defect gray-scale image. The pixel proportion corresponding to each to-be-detected dot in the full-perfect gray image is obtained using the dot proportion analysis method, and is recorded as the standard proportion of the to-be-detected dot.

6. The method of claim 5, wherein the method further comprises: determining the defect type of the defect of the LGP sample based on the detected defect type of the defect of the LGP sample. The same distance analysis method further comprises: Place a web point with process defects GQ at the location of the web point α u corresponding to the location of the light source point in the light guide plate, pass the light source into the light guide plate, obtain the gray image corresponding to the front light plate diagram at this time, and record it as the point defect gray image; The pixel proportion corresponding to each to-be-detected dot in the full-perfect gray image is obtained using the dot proportion analysis method, and is recorded as the standard proportion of the to-be-detected dot. For any one of the to-be-tested dots other than the dot α: when the standard proportion of the to-be-tested dot minus the point defect proportion is less than or equal to the defect difference value, the to-be-tested dot is recorded as a point residual image dot.

7. The LGP defect sample enhancement and detection integrated method according to claim 6, characterized in that, The same distance analysis method further includes: In the positive plate analysis coordinate system, the curve obtained by fitting the dot a with all the dot residual influence points is denoted as the same distance defect feature of the dot a at the process defect GQ u . Obtaining the same distance defect characteristics of all the dots under all the process defects.

8. The method of claim 7, wherein the method further comprises: determining the defect type of the defect of the LGP sample based on the detected defect type of the defect of the LGP sample. Based on the same distance defect characteristics of each dot, the same distance defect net group of each dot in the light guide plate is obtained, including: For any one dot α in the light guide plate: all the dots corresponding to the same distance defect characteristics of the dot α under all the process defects are recorded as the same distance defect group of the dot α; the neighbor distance dot analysis method is used to analyze each dot in the same distance defect group, and the neighbor distance defect influence characteristics of the dot α are obtained based on the analysis results.

9. The method of claim 8, wherein the method further comprises: providing a plurality of light emitting diodes (LEDs) on the substrate; and providing a plurality of light guides on the substrate, wherein the plurality of light guides are configured to receive light from the plurality of LEDs. The neighbor distance dot analysis method includes: For any one dot β in the same distance defect group: when the dot β is recorded as a dot in the same distance defect group of the dot α, the process defect of the dot α is recorded as the same distance influence defect of the dot β, wherein the dot β can correspond to multiple same distance influence defects; In the front light plate image, the dot closest to the dot β in each direction is recorded as the neighbor distance dot of the dot β, and all the neighbor distance dots of the dot β are removed from the neighbor distance dots of the dot β which are in the same distance defect group of the dot α; For any one same distance influence defect of the dot β: a dot with the same distance influence defect is placed at the position of the dot β, a light source is turned on in the light guide plate from the position corresponding to the light source point in the light guide plate, a gray image corresponding to the front light plate image at this time is obtained, and the gray image is recorded as the neighbor defect gray image; The pixel proportion of each neighbor distance dot in the neighbor defect gray image is obtained using the dot proportion analysis method, and the neighbor defect proportion of the neighbor distance dot is recorded; when the neighbor defect proportion of the neighbor distance dot is less than the standard proportion of the neighbor distance dot, the neighbor distance dot is recorded as a neighbor influence dot; A scatter plot formed by all the neighbor influence dots and the dot β is recorded as the neighbor influence image of the dot β; The neighbor influence images corresponding to all the same distance influence defects of the dot β are obtained. obtaining the neighbor influence graph of all the same-distance influence defects of all the dots in the same-distance defect group; for any one process defect GQ u , the neighbor influence graph of all the same-distance influence defects of the dots with the process defect GQ u forms a scatter diagram in the positive plate analysis coordinate system, and the minimum circumscribed area of the scatter diagram is recorded as the defect influence area of the dot α with respect to the process defect GQ u ; The defect influence region of the dot α with respect to all the process defects is recorded as the neighbor distance defect influence characteristics of the dot α.

10. The method of claim 9, wherein the method is characterized by: When the light guide plate is detected for defects, based on the same distance defect characteristics of each dot and the neighbor distance defect influence characteristics of all the dots in all the same distance defect net groups, the defect sample region and the influence detection region in the light guide plate are obtained, including: When the light guide plate is detected for defects, for any one dot γ that has been detected to have a defect: the defect of the dot γ is recorded as a detected defect, the same distance defect characteristics of the dot γ at the detected defect are recorded as a main analysis region, and the defect influence region of the neighbor distance defect influence characteristics of the dot γ with respect to the process defect is recorded as a neighbor distance dot influence region; The region intersected by the main analysis region and the neighbor distance dot influence region is recorded as the defect sample region when the dot γ is detected, and the region of the main analysis region and the neighbor distance dot influence region other than the defect sample region is recorded as the influence detection region.

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