Cable internal temperature determination method and device, electronic equipment and storage medium

Abstract

The invention discloses a method and device for determining the internal temperature of a cable, electronic equipment and a storage medium, and the method comprises the steps: determining a thermal resistance coefficient matrix based on first radial thermal resistance, radial thermal resistance of a copper shielding laminated region and a non-laminated region, radial thermal resistance of an inner sheath, second radial thermal resistance, first axial thermal resistance, second axial thermal resistance and third axial thermal resistance, determining a loss parameter matrix based on the copper shielding lamination area conductor heating loss, the copper shielding lamination area insulating layer dielectric loss, the non-lamination area conductor heating loss and the non-lamination area insulating layer dielectric loss, and determining a node temperature matrix based on the thermal resistance coefficient matrix and the loss parameter matrix; and based on the node temperature matrix, determining a copper shielding lamination area wire core temperature, a copper shielding lamination area copper shielding layer temperature, a copper shielding lamination area armor layer temperature, a non-lamination area wire core temperature, a non-lamination area copper shielding layer temperature and a non-lamination area armor layer temperature corresponding to the target cable. By adopting the embodiment of the invention, the accuracy of determining the internal temperature of the cable is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of power grid temperature anomaly monitoring, and in particular to a cable internal temperature determination method and device, electronic equipment and a storage medium. BACKGROUND

[0002] As an important hub connecting the power grid and users, the reliability of the distribution network directly affects the quality of user power. In the operation and maintenance of the distribution network cable, the internal temperature of the cable is an important indicator for measuring the operating condition of the power transmission system. Monitoring the internal temperature of the cable can better determine the real-time condition of the power transmission line, which is conducive to the stable operation of the power system. The existing thermal circuit model method ignores the loss and heat generated by the structure of the copper shielding superposition, and cannot accurately detect the internal temperature of the cable. Therefore, how to improve the accuracy of the cable internal temperature determination is a problem to be solved. SUMMARY

[0003] The present application provides a cable internal temperature determination method, device, electronic equipment and storage medium, which improves the accuracy of the cable internal temperature determination.

[0004] In a first aspect, the present application provides a cable internal temperature determination method, comprising:

[0005] determining a first radial thermal resistance corresponding to a first structure layer, a copper shielding superposition area filling layer radial thermal resistance and a non-superposition area filling layer radial thermal resistance corresponding to a second structure layer, an inner sheath radial thermal resistance, and a second radial thermal resistance corresponding to a third structure layer; the target cable comprises the first structure layer, the second structure layer and the third structure layer; the first structure layer is an insulation layer, the second structure layer is a filling layer and an inner sheath, and the third structure layer is an outer sheath;

[0006] determining a first axial thermal resistance, a second axial thermal resistance and a third axial thermal resistance of the target cable; the first axial thermal resistance is a core thermal resistance, the second axial thermal resistance is a copper shielding layer thermal resistance, and the third axial thermal resistance is an armored layer thermal resistance;

[0007] determining a thermal resistance coefficient matrix based on the first radial thermal resistance, the copper shielding superposition area filling layer radial thermal resistance, the non-superposition area filling layer radial thermal resistance, the inner sheath radial thermal resistance, the second radial thermal resistance, the first axial thermal resistance, the second axial thermal resistance and the third axial thermal resistance;

[0008] determining a copper shielding superposition area conductor heat loss, a copper shielding superposition area insulation layer dielectric loss, a non-superposition area conductor heat loss and a non-superposition area insulation layer dielectric loss corresponding to the target cable;

[0009] determine a loss parameter matrix based on the conductor heat loss of the copper shielded and overlapped area, the dielectric loss of the insulating layer of the copper shielded and overlapped area, the conductor heat loss of the non-overlapped area, and the dielectric loss of the insulating layer of the non-overlapped area;

[0010] determine a node temperature matrix based on the thermal resistance coefficient matrix and the loss parameter matrix;

[0011] determine the conductor temperature of the copper shielded and overlapped area, the copper shield layer temperature of the copper shielded and overlapped area, the armor layer temperature of the copper shielded and overlapped area, the conductor temperature of the non-overlapped area, the copper shield layer temperature of the non-overlapped area, and the armor layer temperature of the non-overlapped area corresponding to the target cable based on the node temperature matrix.

[0012] In a second aspect, the embodiments of the present application provide a device for determining the temperature inside a cable, the device comprising: a determining unit and a processing unit;

[0013] the determining unit is configured to determine a first radial thermal resistance corresponding to a first structure layer, a copper shielded and overlapped area filling layer radial thermal resistance and a non-overlapped area filling layer radial thermal resistance corresponding to a second structure layer, an inner sheath radial thermal resistance, and a second radial thermal resistance corresponding to a third structure layer; the target cable comprises the first structure layer, the second structure layer, and the third structure layer; the first structure layer is an insulating layer, the second structure layer is a filling layer and an inner sheath, and the third structure layer is an outer sheath;

[0014] the processing unit is configured to determine a first axial thermal resistance, a second axial thermal resistance, and a third axial thermal resistance of the target cable; the first axial thermal resistance is a conductor thermal resistance, the second axial thermal resistance is a copper shield layer thermal resistance, and the third axial thermal resistance is an armor layer thermal resistance;

[0015] determine a thermal resistance coefficient matrix based on the first radial thermal resistance, the copper shielded and overlapped area filling layer radial thermal resistance, the non-overlapped area filling layer radial thermal resistance, the inner sheath radial thermal resistance, the second radial thermal resistance, the first axial thermal resistance, the second axial thermal resistance, and the third axial thermal resistance;

[0016] determine a conductor heat loss of the copper shielded and overlapped area, a dielectric loss of the insulating layer of the copper shielded and overlapped area, a conductor heat loss of the non-overlapped area, and a dielectric loss of the insulating layer of the non-overlapped area corresponding to the target cable;

[0017] determine a loss parameter matrix based on the conductor heat loss of the copper shielded and overlapped area, the dielectric loss of the insulating layer of the copper shielded and overlapped area, the conductor heat loss of the non-overlapped area, and the dielectric loss of the insulating layer of the non-overlapped area;

[0018] determine a node temperature matrix based on the thermal resistance coefficient matrix and the loss parameter matrix;

[0019] determining, based on the node temperature matrix, a copper shielded lapped zone core temperature, a copper shielded lapped zone copper shield temperature, a copper shielded lapped zone armor temperature, a non-lapped zone core temperature, a non-lapped zone copper shield temperature, and a non-lapped zone armor temperature corresponding to the target cable.

[0020] In a third aspect, an electronic device is provided, including: a processor, a memory, a communication interface, and one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the processor to cause the electronic device to perform the method of the first aspect.

[0021] In a fourth aspect, a computer-readable storage medium is provided, which stores a computer program, and the computer program is executed by a processor to implement the method of the first aspect.

[0022] In a fifth aspect, a computer program product is provided, which includes a non-transitory computer-readable storage medium storing a computer program, and the computer program is executed by a computer to implement the method of the first aspect.

[0023] The embodiments of the present application have the following beneficial effects:

[0024] It can be seen that the cable internal temperature determination method described in the embodiment of the application determines the first radial thermal resistance corresponding to the first structure layer, the copper shielding lamination area filling layer radial thermal resistance and the non-lamination area filling layer radial thermal resistance corresponding to the second structure layer, the inner sheath radial thermal resistance, the second radial thermal resistance corresponding to the third structure layer, the target cable includes the first structure layer, the second structure layer and the third structure layer, the first structure layer is an insulation layer, the second structure layer is a filling layer and an inner sheath, and the third structure layer is an outer sheath, then the first axial thermal resistance, the second axial thermal resistance and the third axial thermal resistance of the target cable are determined, the first axial thermal resistance is a core thermal resistance, the second axial thermal resistance is a copper shielding layer thermal resistance, and the third axial thermal resistance is an armored layer thermal resistance, then a thermal resistance coefficient matrix is determined based on the first radial thermal resistance, the copper shielding lamination area filling layer radial thermal resistance, the non-lamination area filling layer radial thermal resistance, the inner sheath radial thermal resistance, the second radial thermal resistance, the first axial thermal resistance, the second axial thermal resistance and the third axial thermal resistance, the copper shielding lamination area conductor heat loss, the copper shielding lamination area insulation layer dielectric loss, the non-lamination area conductor heat loss and the non-lamination area insulation layer dielectric loss corresponding to the target cable are determined, the loss parameter matrix is determined based on the copper shielding lamination area conductor heat loss, the copper shielding lamination area insulation layer dielectric loss, the non-lamination area conductor heat loss and the non-lamination area insulation layer dielectric loss, then the node temperature matrix is determined based on the thermal resistance coefficient matrix and the loss parameter matrix, and finally the copper shielding lamination area core temperature, the copper shielding lamination area copper shielding layer temperature, the copper shielding lamination area armored layer temperature, the non-lamination area core temperature, the non-lamination area copper shielding layer temperature and the non-lamination area armored layer temperature corresponding to the target cable are determined based on the node temperature matrix, thereby improving the accuracy of cable internal temperature determination. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the drawings required to be used in the embodiments of the present application or the background art will be described below.

[0026] Figure 1 is a flowchart of a cable internal temperature determination method provided by the embodiment of the present application;

[0027] Figure 2 is a structural schematic diagram of a target cable provided by the embodiment of the present application;

[0028] Figure 3 is a structural schematic diagram of a three-dimensional thermal circuit model corresponding to a target cable provided by the embodiment of the present application;

[0029] Figure 4 is a flowchart of determining a plurality of axial resistances provided by the embodiment of the present application;

[0030] Figure 5 is a flowchart of determining a target fault risk value provided by an embodiment of the present application;

[0031] Figure 6 is a flowchart of determining prompt information provided by an embodiment of the present application;

[0032] Figure 7 is a structural schematic diagram of a cable internal temperature determination device provided by an embodiment of the present application;

[0033] Figure 8 is a structural schematic diagram of an electronic device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0034] In order to enable persons skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by persons skilled in the art without creative labor fall within the scope of protection of the present application.

[0035] The terms "first", "second", and the like in the specification of the present application and the above-described drawings are used to distinguish different objects, rather than to describe a specific sequence. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally include other steps or units not listed or can optionally include other steps or units inherent to the process, method, product or device.

[0036] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it mutually exclusive or alternative to other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0037] Please refer to Figure 1 , Figure 1 is a flowchart of a cable internal temperature determination method provided by an embodiment of the present application, including but not limited to the following steps:

[0038] S101: Determine the first radial thermal resistance corresponding to the first structural layer, the copper shielding overlying area filling layer radial thermal resistance and the non-overlying area filling layer radial thermal resistance corresponding to the second structural layer, the inner sheath radial thermal resistance, and the second radial thermal resistance corresponding to the third structural layer.

[0039] In the present embodiment, the target cable includes the first structural layer, the second structural layer and the third structural layer, the first structural layer is an insulation layer, the second structural layer is a filling layer and an inner sheath, and the third structural layer is an outer sheath.

[0040] The insulation layer of the target cable is located outside the wire core and directly wraps the wire core. The core function is electrical insulation, which prevents the wire core from short-circuiting with the outside (such as the copper shielding layer and the armor layer), and bears the high voltage transmitted by the wire core. The insulation layer is usually made of insulation materials such as cross-linked polyethylene, polyethylene or oil paper, and has characteristics such as high insulation resistance and aging resistance. As the first layer of radial thermal resistance, the thermal resistance is related to the thermal conductivity coefficient and thickness of the material, and directly affects the conduction efficiency of the heat from the wire core to the outside.

[0041] The filling layer of the target cable is used to fill the gap between the wire cores, making the cable structure round and stable, and reducing mechanical stress during laying or operation. The material is usually non-hygroscopic material such as polypropylene rope and rubber. The filling layer is usually loose material with low thermal conductivity. The inner sheath is wrapped outside the filling layer or copper shielding layer. The main function is to protect the internal structure (such as the insulation layer and the shielding layer) from mechanical damage and prevent moisture and impurities from entering. The material is usually polyvinyl chloride and polyethylene. The inner sheath is a dense plastic with moderate thermal conductivity. The filling layer and the inner sheath together form the second layer of radial thermal resistance. Due to the differences in material and structure of the filling layer, and the possible inclusion of different interfaces of the copper shielding overlying area and the non-overlying area, the radial thermal resistance of the filling layer in the overlying area and the non-overlying area of this structural layer needs to be calculated separately.

[0042] The outer sheath of the target cable is the outermost layer of the cable, which wraps the armor layer or the inner sheath, and serves as the outermost protection of the cable to resist mechanical damage (such as extrusion and friction), chemical corrosion (such as acid and alkali in the soil and moisture), ultraviolet aging, etc. It is commonly used in special environments such as aluminum-plastic composite sheath. As the third layer of radial thermal resistance, its thermal resistance is also related to the thermal conductivity coefficient and thickness of the material, and it is the last radial barrier for the heat inside the cable to dissipate to the external environment, which has a significant impact on the overall heat dissipation efficiency.

[0043] The heat loss generated by the wire core, the copper shielding layer and the armor layer during operation needs to be dissipated through radial and axial heat conduction. Due to the difference between the copper shielding overlying area and the non-overlying area, the thermal resistance distribution is uneven, so the thermal resistance coefficient needs to be calculated layer by layer and region by region.

[0044] Please refer to Figure 2 , Figure 2Figure 1 is a structural schematic diagram of a target cable provided by an embodiment of the present application, the target cable 200 including a copper shielding lapped region and a non-lapped region. The target cable 200 in this embodiment is a three-core cable.

[0045] The copper shielding lapped region refers to the part where the edges of adjacent copper bands overlap during wrapping. The main purpose of lapped design is to ensure the continuity and integrity of the shielding, avoiding the occurrence of shielding gaps that lead to electric field concentration or a decrease in shielding effect. The width of the lapped region is usually determined according to the cable specifications and shielding requirements. The thermal resistance and heat dissipation characteristics of this region differ from those of the non-lapped region. Due to the increased material thickness of the lapped part, the heat conduction path is more complex. The non-lapped region refers to the part where the copper bands do not overlap during wrapping, i.e., the area covered by a single copper band itself. This region is the main body part of the shielding layer, with uniform material thickness and relatively stable heat conduction characteristics. The lapped region may be slightly inferior to the non-lapped region in terms of heat dissipation performance due to the structural overlap, but it is superior in mechanical properties such as tensile strength and wear resistance. It is usually used in critical parts such as cable joints and terminals that require strengthened shielding and structural stability, while the non-lapped region is mostly used in the regular sections of the main body of the cable, thereby achieving a balance between shielding and reducing manufacturing costs.

[0046] S102: Determine the first axial thermal resistance, the second axial thermal resistance, and the third axial thermal resistance of the target cable.

[0047] In this embodiment, the first axial thermal resistance is the core thermal resistance, the second axial thermal resistance is the copper shielding layer thermal resistance, and the third axial thermal resistance is the armor layer thermal resistance.

[0048] The first axial thermal resistance corresponds to the thermal resistance of the cable core, i.e., the resistance to heat transfer in the axial direction (along the length of the cable) caused by the material's thermal conductivity characteristics when current passes through the core. The second axial thermal resistance corresponds to the thermal resistance of the copper shielding layer, i.e., the ability of the copper shielding layer to resist heat conduction in the axial direction. The third axial thermal resistance corresponds to the thermal resistance of the armor layer, reflecting the resistance to heat conduction in the axial direction.

[0049] S103: Determine the thermal resistance coefficient matrix based on the first radial thermal resistance, the copper shielding lapped region filler layer radial thermal resistance, the non-lapped region filler layer radial thermal resistance, the inner sheath radial thermal resistance, the second radial thermal resistance, the first axial thermal resistance, the second axial thermal resistance, and the third axial thermal resistance.

[0050] In the embodiment, the copper shielding lamination area and the non-lamination area of the target cable can be regarded as independent sub-thermal paths, respectively. The copper shielding lamination area corresponds to three nodes, i.e., the lamination core temperature node, the lamination copper shielding layer temperature node, and the lamination armor layer temperature node. The non-lamination area corresponds to three nodes, i.e., the non-lamination core temperature node, the non-lamination copper shielding layer temperature node, and the non-lamination armor layer temperature node. The diagonal elements of the thermal resistance coefficient matrix are the sum of all thermal conductivities connected to each node, and the non-diagonal elements are the negative values of the thermal conductivities between nodes.

[0051] It should be explained that the core difference between the axial thermal resistance and the radial thermal resistance of the target cable lies in the heat transfer direction and the corresponding physical meaning. The axial thermal resistance is the heat transfer resistance of the core, the copper shielding layer, and the armor layer along the length direction (axial direction) of the cable, which reflects the difficulty of heat dissipation along the extension direction of the cable in the same component. The radial thermal resistance is the heat transfer resistance perpendicular to the length direction (radial direction, i.e., from inside to outside or from outside to inside) of the cable, which involves the radial heat dissipation resistance between different components or in the component itself. The axial thermal resistance focuses on the axial heat transfer characteristics of a single component, and the radial thermal resistance focuses on the heat transfer characteristics between different components or in the component. The axial thermal resistance and the radial thermal resistance of the target cable jointly characterize the overall heat dissipation capability of the cable from different directions.

[0052] Referring to Figure 3 , Figure 3 is a structural schematic diagram of a three-dimensional thermal path model corresponding to a target cable provided by the embodiment.

[0053] In the three-dimensional thermal path model 300 corresponding to the target cable, the lamination core temperature node is θ1, the lamination copper shielding layer temperature node is θ2, the lamination armor layer temperature node is θ3, the non-lamination area corresponds to the non-lamination core temperature node θ1', the non-lamination copper shielding layer temperature node θ2', and the non-lamination armor layer temperature node θ3'. The first radial thermal resistance is T1, the copper shielding lamination area filling layer radial thermal resistance is T2, the non-lamination area filling layer radial thermal resistance is T2', the inner sheath radial thermal resistance is T3, the second radial thermal resistance is T4, the first axial thermal resistance is T a , the second axial thermal resistance is T b , and the third axial thermal resistance is T c .

[0054] In the embodiment, the expression of the thermal resistance coefficient matrix A is as follows:

[0055]

[0056] It can be seen that by defining the temperature nodes of the wire core, copper shielding layer and armored layer in the overlapping and non-overlapping regions of the target cable three-dimensional thermal circuit model, the first radial thermal resistance, the radial thermal resistance of the copper shielding overlapping and non-overlapping regions, the second radial thermal resistance and the axial thermal resistance and other parameters are clearly distinguished, and then the thermal resistance coefficient matrix is constructed, which can accurately depict the complex heat transfer path and thermal resistance relationship between different regions (overlapping and non-overlapping) and different structure layers (wire core, copper shielding, armored) of the cable. The diagonal elements in the matrix reflect the comprehensive influence of the associated thermal resistance of each node itself, and the non-diagonal elements reflect the interaction of the thermal resistance between the nodes, realizing the mapping from the physical parameters of the thermal circuit model to the mathematical matrix, converting the multi-dimensional characteristics of the cable heat transfer into a calculable linear system, facilitating the solution of each node temperature through matrix operation, laying a foundation for subsequent accurate analysis of cable temperature distribution and evaluation of thermal related fault risk, making the quantitative analysis of cable thermal performance more systematic and scientific, and improving the accuracy of understanding and control of cable thermal behavior.

[0057] S104: Determine the copper shielding overlapping region conductor heat loss, copper shielding overlapping region insulation layer dielectric loss, non-overlapping region conductor heat loss, and non-overlapping region insulation layer dielectric loss corresponding to the target cable.

[0058] In the present embodiment, the copper shielding overlapping region wire core loss corresponding to the target cable is mainly due to the current passing through the wire core. According to Joule's law, when the current flows through the wire core conductor, the electric energy will be converted into heat energy due to the resistance of the conductor, thereby generating loss. In the copper shielding overlapping region, due to the special structure of the copper shielding layer (the overlapping part is different from other regions in structure, which may affect the electromagnetic field distribution, etc.), the current distribution and electromagnetic environment of the wire core may be different from those in the non-overlapping region, thereby causing different loss conditions, and the loss size generated by the wire core in this region needs to be determined separately.

[0059] The copper shielding layer loss in the copper shielding overlapping region corresponding to the target cable will generate resistance loss due to induced current (the copper shielding layer will induce current due to the alternating magnetic field generated by the alternating current of the wire core) when the cable is running. On the other hand, in the overlapping region, because the copper shielding layer is a structure that is overlapped, its current distribution, electromagnetic coupling with other structures, etc. are different from those in the non-overlapping region, which will cause differences in loss.

[0060] The armored layer loss in the copper shielding overlapping region corresponding to the target cable is due to the alternating magnetic field generated by the alternating current of the wire core and the copper shielding layer inside the cable. The armored layer is in this alternating magnetic field and will generate eddy current due to electromagnetic induction. The eddy current flows in the armored layer conductor and generates eddy current loss due to the resistance of the armored layer. In the copper shielding overlapping region, the magnetic field distribution changes due to the overlapping structure of the copper shielding layer, and the electromagnetic environment in which the armored layer is located is different, so the size and distribution of the eddy current induced by the armored layer are also different, resulting in different losses. Therefore, the loss of the armored layer in this specific region needs to be determined.

[0061] The non-laminated area core loss corresponding to the target cable is due to the current passing through the core, which will cause loss. However, the electromagnetic environment, current distribution, and other factors of the non-laminated area are different from those of the laminated area. The loss of the core in the non-laminated area is also different. The electromagnetic field around the core in the non-laminated area is relatively uniform, and the influencing factors of the AC resistance of the core are different from those in the laminated area. Therefore, the loss of the core in the non-laminated area under the action of the current needs to be determined separately.

[0062] The copper shielding layer loss corresponding to the target cable in the non-laminated area will cause loss due to the alternating current induced by the alternating magnetic field of the core. However, due to the absence of laminated structure, there is no special loss form such as circulating current in the laminated area. The distribution of induced current is relatively simple, mainly including eddy current loss, etc. However, the size and distribution of the induced current are different from those in the laminated area due to the structural characteristics of the non-laminated area. Therefore, the loss of the copper shielding layer in the non-laminated area needs to be determined separately.

[0063] The armor layer loss corresponding to the target cable in the non-laminated area is due to the eddy current induced by the alternating magnetic field of the core and the copper shielding layer in the non-laminated area. However, the magnetic field environment in the non-laminated area is different from that in the laminated area, resulting in differences in the size and distribution of the induced eddy current, and thus the loss is different. The magnetic field distribution in the non-laminated area is relatively uniform, and the generation of eddy current in the armor layer is different from that in the laminated area. Therefore, the loss of the armor layer in the non-laminated area due to eddy current needs to be determined.

[0064] S105: Determine a loss parameter matrix based on the copper shielding laminated area conductor heat loss, the copper shielding laminated area insulating layer dielectric loss, the non-laminated area conductor heat loss, and the non-laminated area insulating layer dielectric loss.

[0065] In the present embodiment, the loss parameter matrix satisfies the following expression:

[0066]

[0067] wherein B is the loss parameter matrix, Q c is the copper shielding laminated area conductor heat loss, Q d is the copper shielding laminated area insulating layer dielectric loss, Q c ’ is the non-laminated area conductor heat loss, Q d ’ is the non-laminated area insulating layer dielectric loss, λ1 is the copper shielding inner layer loss coefficient, λ1’ is the copper shielding outer layer loss coefficient, θ4 is the surface temperature of the copper shielding laminated area of the target cable, and θ4’ is the surface temperature of the non-laminated area of the target cable.

[0068] S106: Determine a node temperature matrix based on the thermal resistance coefficient matrix and the loss parameter matrix.

[0069] In the embodiment, the thermal resistance coefficient matrix multiplied by the node temperature matrix equals the loss parameter matrix, so after the thermal resistance coefficient matrix and the loss parameter matrix are determined, the node temperature matrix can be determined based on the thermal resistance coefficient matrix and the loss parameter matrix.

[0070] It can be seen that, by using the relationship that the thermal resistance coefficient matrix multiplied by the node temperature matrix equals the loss parameter matrix, after the thermal resistance coefficient matrix and the loss parameter matrix are determined, the node temperature matrix is solved, a clear and rigorous heat transfer mathematical model is constructed, and the complex thermal circuit characteristics of the cable are converted into a calculable linear equation set form. The thermal resistance coefficient matrix accurately depicts the interaction of thermal resistance between nodes, the loss parameter matrix clearly indicates the heating input of each node, and through matrix operation, the temperature of each node can be efficiently solved, without manually disassembling complex heat balance equations, which not only ensures the normativity and repeatability of the calculation process, but also quickly and accurately obtains the temperature distribution of each layer (wire core, copper shielding, armor) of the cable in the overlapping area and the non-overlapping area, provides quantitative and reliable temperature data support for subsequent fault risk assessment, thermal performance optimization, etc., changes the cable thermal characteristic analysis from experience judgment to precise mathematical derivation, and improves the scientificity and efficiency of the control of the cable thermal state.

[0071] S107: Determine the copper shielding overlapping area wire core temperature, the copper shielding overlapping area copper shielding layer temperature, the copper shielding overlapping area armor layer temperature, the non-overlapping area wire core temperature, the non-overlapping area copper shielding layer temperature, and the non-overlapping area armor layer temperature corresponding to the target cable based on the node temperature matrix.

[0072] In the embodiment, after the node temperature matrix is determined, the copper shielding overlapping area wire core temperature, the copper shielding overlapping area copper shielding layer temperature, the copper shielding overlapping area armor layer temperature, the non-overlapping area wire core temperature, the non-overlapping area copper shielding layer temperature, and the non-overlapping area armor layer temperature corresponding to the target cable can be determined according to the elements in the node temperature matrix.

[0073] It can be seen that by first defining and accurately calculating the radial and axial thermal resistance of each structural layer (insulation layer, filling layer and inner sheath, outer sheath) and key components (core, copper shielding layer, armor layer) of the target cable, constructing a thermal resistance coefficient matrix to clearly quantify the heat transfer resistance relationship, then determining the conductor heat loss of the copper shielding overlap area and the non-overlap area, the insulation layer dielectric loss and forming a loss parameter matrix to clearly heat source, and then solving the node temperature matrix by combining the thermal resistance coefficient matrix and the loss parameter matrix, the temperature of the core, copper shielding layer and armor layer in the overlap area and non-overlap area can be obtained. The complex heat transfer process of the cable can be simulated systematically and accurately, which breaks through the limitations of traditional simplified models, considers the influence of structural differences between the overlap area and the non-overlap area on thermal resistance, loss and temperature distribution, provides high-precision temperature data for cable operation state evaluation, identifies potential faults such as insulation aging and component failure caused by temperature abnormalities in advance, and further supports the life prediction of the cable.

[0074] Please refer to Figure 4 , Figure 4 is a flowchart provided by the embodiment of the present application for determining a plurality of axial resistances, including but not limited to the following steps:

[0075] S401: Obtain the core outer diameter, core thermal resistance coefficient and copper shielding area axial length corresponding to the target cable.

[0076] In the embodiment, the core outer diameter is the outer diameter of the core conductor, the core thermal resistance coefficient is the thermal conductivity characteristic parameter of the core material, and the copper shielding area axial length is the length of the cable covered by the copper shielding layer when heat is transferred along the axial direction of the cable.

[0077] S402: Determine the first axial thermal resistance based on the core outer diameter, the core thermal resistance coefficient and the copper shielding area axial length.

[0078] In the embodiment, the first axial thermal resistance is calculated according to the following formula:

[0079]

[0080] Wherein, p a is the core thermal resistance coefficient, l2 is the copper shielding area axial length, D c is the core outer diameter.

[0081] S403: Obtain the copper shielding layer outer diameter, copper shielding layer thermal resistance coefficient and copper shielding layer thickness corresponding to the target cable.

[0082] In the embodiment, the copper shielding layer outer diameter is the outer diameter of the copper shielding layer, the copper shielding layer thermal resistance coefficient is the thermal conductivity characteristic parameter of the copper shielding layer material, and the copper shielding layer thickness is the radial thickness of the copper shielding layer.

[0083] S404: determining the second axial thermal resistance based on the copper shielding layer outer diameter, the copper shielding layer thermal resistance coefficient, the copper shielding layer thickness, and the copper shielding region axial length.

[0084] In this embodiment, the second axial thermal resistance is calculated according to the following formula:

[0085]

[0086] wherein p is the copper shielding layer thermal resistance coefficient, D is the copper shielding layer outer diameter, and d2 is the copper shielding region axial length. b s

[0087] S405: obtaining the inner sheath layer inner diameter, the armored layer thermal resistance coefficient, and the armored layer thickness corresponding to the target cable.

[0088] In this embodiment, the inner sheath layer inner diameter is the inner circle diameter of the inner sheath, the armored layer thermal resistance coefficient is the thermal conductivity characteristic parameter of the armored layer material, and the armored layer thickness is the radial thickness of the armored layer.

[0089] S406: determining the third axial thermal resistance based on the inner sheath layer inner diameter, the armored layer thermal resistance coefficient, the armored layer thickness, and the copper shielding region axial length.

[0090] In this embodiment, the third axial thermal resistance is calculated according to the following formula:

[0091]

[0092] wherein p is the armored layer thermal resistance coefficient, D is the inner sheath layer inner diameter, and d5 is the copper shielding region axial length. c i

[0093] It can be seen that by sequentially obtaining the geometric dimensions (wire core outer diameter, copper shielding layer outer diameter and thickness, inner sheath layer inner diameter and armored layer thickness), material thermal characteristics (wire core thermal resistance coefficient, copper shielding layer thermal resistance coefficient, armored layer thermal resistance coefficient) of the target cable core, copper shielding layer, and armored layer, and the unified copper shielding region axial length parameter, the axial thermal resistances of the wire core, copper shielding layer, and armored layer are accurately calculated respectively, realizing the quantitative derivation from the cable basic structure and material parameters to the axial thermal resistance. Based on the actual geometric structure and material thermal conductivity nature of the cable, an axial thermal resistance model that fits the real heat transfer characteristics is established, which provides accurate and physically clear axial thermal resistance input for subsequent construction of thermal resistance coefficient matrix, development of cable thermal field analysis and temperature calculation.

[0094] Please refer to Figure 5 , Figure 5 ​​​​is a flowchart of determining a target failure risk value provided by the embodiment of the present application, including but not limited to the following steps:

[0095] S501: Determine a first temperature difference value based on the copper shielded lapped area conductor temperature and the non-lapped area conductor temperature.

[0096] In the embodiment, the difference between the copper shielded lapped area conductor temperature and the non-lapped area conductor temperature is determined to obtain the first temperature difference value.

[0097] S502: Determine a second temperature difference value based on the copper shielded lapped area copper shield layer temperature and the non-lapped area copper shield layer temperature.

[0098] In the embodiment, the difference between the copper shielded lapped area copper shield layer temperature and the non-lapped area copper shield layer temperature is determined to obtain the second temperature difference value.

[0099] S503: Determine a third temperature difference value based on the copper shielded lapped area armored layer temperature and the non-lapped area armored layer temperature.

[0100] In the embodiment, the difference between the copper shielded lapped area armored layer temperature and the non-lapped area armored layer temperature is determined to obtain the third temperature difference value.

[0101] S504: Determine the target failure risk value of the target cable based on the first temperature difference value, the second temperature difference value and the third temperature difference value.

[0102] In the embodiment, the target failure risk value is used to evaluate the failure risk degree of the target cable.

[0103] For example, the conductor failure risk value is determined based on the first temperature difference value. Specifically, it can be a preset mapping relationship between the temperature difference value between the copper shielded lapped area conductor temperature and the non-lapped area conductor temperature and the failure risk value. Based on the mapping relationship, the conductor failure risk value corresponding to the first temperature difference value can be determined.

[0104] For example, the copper shield layer failure risk value is determined based on the second temperature difference value. Specifically, it can be a preset mapping relationship between the temperature difference value between the copper shielded lapped area copper shield layer temperature and the non-lapped area copper shield layer temperature and the failure risk value. Based on the mapping relationship, the copper shield layer failure risk value corresponding to the second temperature difference value can be determined.

[0105] For example, the third temperature difference value is used to determine a risk value of the armored layer failure, and specifically, a preset mapping relationship between a temperature difference value between the copper shielding layer temperature and the non-overlapped area armored layer temperature and a risk value of the armored layer failure can be used to determine the risk value of the armored layer failure corresponding to the third temperature difference value.

[0106] For example, the target risk value is determined based on the risk value of the wire core failure, the risk value of the copper shielding layer failure, and the risk value of the armored layer failure, and specifically, an average value corresponding to the risk value of the wire core failure, the risk value of the copper shielding layer failure, and the risk value of the armored layer failure can be calculated first to obtain an average risk value corresponding to the risk value of the wire core failure, the risk value of the copper shielding layer failure, and the risk value of the armored layer failure.

[0107] For example, the use time of the target cable is obtained, and specifically, as the use time increases, the insulation material of the cable will gradually age (such as performance degradation, mechanical strength reduction, etc.), and the copper shielding layer, the armored layer and other structures may also be corroded, worn and other losses due to long-term operation, which reduces their ability to resist failure. The longer the use time is, the greater the target risk value is, which means that the possibility of cable failure due to aging and long-term loss is more fully quantified, and the evaluation result is more in line with the objective law that long-term use will increase the risk of failure in actual operation, thereby more accurately reflecting the real failure risk level of the cable. Therefore, the use time of the target cable needs to be obtained.

[0108] For example, an optimization factor corresponding to the use time is determined, and specifically, a preset mapping relationship between the use time and the optimization factor can be used to determine the optimization factor corresponding to the use time.

[0109] For example, the average risk value is optimized based on the optimization factor to obtain the target risk value, and specifically, the target risk value can be calculated according to the following formula:

[0110] Target risk value = average risk value x (1 + optimization factor)

[0111] According to the above formula, the average risk value can be optimized based on the optimization factor to obtain the target risk value.

[0112] It can be seen that by layering the temperature of the core, copper shielding layer and armor layer of the copper shielding overlap area and non-overlap area of the cable and calculating the difference, the abnormal difference of the temperature of different structure areas can be accurately captured, and the risk assessment of each layer is provided with targeted basis. Through the average processing of the layering risk value, the basic risk level of the whole cable is comprehensively reflected, the one-sidedness of single structure assessment is avoided, and the optimization factor corresponding to the use time is introduced to modify the average risk value. The influence of the cumulative effects of material aging and structure loss of the cable caused by long-term operation on the fault risk is fully considered. The final target fault risk value not only reflects the immediate temperature abnormal risk of different structures, but also integrates the long-term risk of equipment aging, so that the fault risk degree of the cable is more comprehensively and accurately evaluated. A more scientific basis is provided for the maintenance and repair decision of the cable, which helps to prevent faults in advance and improves the safety and reliability of the cable operation.

[0113] Please refer to Figure 6 , Figure 6 is a flowchart for determining prompt information provided by the embodiment of the present application, including but not limited to the following steps:

[0114] S601: If the core fault risk value is greater than a first preset fault risk value, a first prompt information is generated.

[0115] In the embodiment, the first prompt information is used to prompt the core of the target cable to fail.

[0116] The first preset fault risk value is a threshold value set in advance, which can be determined based on the cable safe operation standard, historical fault data or industry specification, and represents the highest risk level acceptable to the core and other components. When the actual risk value of the core exceeds the first preset fault risk value, the first prompt information is generated, which is used to inform the relevant personnel that the core of the target cable currently has a high fault risk and may have appeared or is about to fail, which needs to be paid attention to and handled in time.

[0117] The first prompt information can be reminded in various ways to ensure that the relevant personnel can timely perceive the core fault risk: such as popping up a window with a red warning symbol on the monitoring system interface, synchronously displaying key data such as risk value; turning on a red warning light in the on-site control cabinet, or playing "core fault risk exceeds" through a voice device; sending a message to the mobile phone of the operation and maintenance personnel, pushing a notification through the work software, and clearly indicating the fault position and basic situation; a fault work order can also be automatically generated in the operation and maintenance management system, and the warning time and details are recorded. Through the combination of vision, hearing, mobile terminal pushing and system work order, the timeliness and effectiveness of the reminder are ensured.

[0118] S602: If the copper shielding layer fault risk value is greater than the first preset fault risk value, a second prompt information is generated.

[0119] In the embodiment, the second prompt information is used to prompt that the copper shielding layer of the target cable is faulty.

[0120] When the fault risk value of the copper shielding layer is greater than the first preset fault risk value, it indicates that the copper shielding layer is likely to be faulty, and therefore the second prompt information is generated to prompt that the copper shielding layer of the target cable is faulty. The main function of the copper shielding layer is to shield the electric field and protect the insulation layer, and its fault may cause abnormal electric field distribution, insulation damage and other problems, and therefore the purpose of the second prompt information is to specifically warn the fault risk of the copper shielding layer so as to be specifically checked.

[0121] The second prompt information can adopt a specific reminding manner to ensure that the operation and maintenance personnel quickly locate the risk of the copper shielding layer. For example, a yellow flashing window is highlighted in the monitoring system to display “copper shielding layer fault risk exceeds the standard”, and the temperature difference data of the overlap area and the non-overlap area are attached; the on-site device can trigger intermittent beeping alarm, and the specific risk position of the copper shielding layer is displayed in the control cabinet display screen; the exclusive software notification is pushed to the personnel responsible for the maintenance of the shielding layer, the content is marked as “copper shielding layer abnormal early warning” and the equipment number, and a processing work order with a “shielding layer special” label is generated in the operation and maintenance system, the response efficiency of the copper shielding layer risk is improved through the combination of visual differentiation, directional pushing and special work order.

[0122] S603: If the armored layer fault risk value is greater than the first preset fault risk value, a third prompt information is generated.

[0123] In the embodiment, the third prompt information is used to prompt that the armored layer of the target cable is faulty.

[0124] When the armored layer fault risk value is greater than the first preset fault risk value, it indicates that the armored layer is likely to be faulty, and therefore the third prompt information is generated to prompt that the armored layer of the target cable is faulty. The armored layer fault may cause the cable to have reduced resistance to external damage, and even cause the insulation layer to be exposed and damp, and therefore the prompt information is used to specifically warn the fault risk of the armored layer to help the operation and maintenance personnel quickly locate the risk position and take measures such as repair or replacement.

[0125] The third prompt information focuses on the scene demand of mechanical protection: for example, the "armor layer failure risk warning" is popped up in the monitoring interface with orange bold font, and the armor layer temperature difference and the corresponding line segment position are displayed synchronously; the sound and light alarm set on site emits a low-frequency intermittent alarm sound, and the indicator light of the corresponding area of the armor layer is always on; a message containing "armor layer protection risk" and a map positioning link is sent to the team responsible for line mechanical maintenance, and the armor layer historical maintenance record is automatically associated in the operation and maintenance management system to generate a processing work order containing replacement suggestions, which helps to quickly judge the failure impact of the armor layer and take reinforcement or replacement measures through color differentiation, directional notification, and historical data linkage.

[0126] It can be seen that for the three key components of the cable core, copper shielding layer, and armor layer, clear failure risk judgment standards and corresponding prompt information are set to achieve precise positioning and classified warning of failure risk. When the failure risk value of each part exceeds the preset threshold, targeted prompts can be generated in time to enable operation and maintenance personnel to quickly know which component has a failure risk, without the need for comprehensive inspection of the entire cable, thereby greatly improving the efficiency of failure response, facilitating timely maintenance or maintenance measures, and effectively reducing the risk of overall cable failure and affecting power supply stability due to failure of components not being handled in time.

[0127] It should be noted that if the target failure risk value is greater than a second preset failure risk value, a fourth prompt information is generated; the fourth prompt information is used to prompt that the target cable has failed, and the second preset failure risk value is less than the first preset failure risk value, specifically, the second preset failure risk value is a preset value for judging whether the target cable has failed, and when the target failure risk value is greater than the second preset failure risk value, it means that the target cable has failed, at which time the fourth prompt information for prompting that the target cable has failed is generated.

[0128] The fourth prompt information should highlight the urgency and comprehensiveness to quickly mobilize resources to respond to overall failure: for example, a red full-screen flashing window is popped up in the monitoring system, labeled "cable overall failure warning" and displaying the complete information of the failed cable; the highest level of sound and light alarm is started, emitting a continuous high-decibel buzzing and voice broadcast "the cable has overall failure, please handle immediately"; at the same time, an emergency push is sent to the mobile phones and work terminals of the operation and maintenance personnel and emergency team, with key information such as fault location and impact range, and the highest priority repair work order is automatically triggered in the management system to link dispatch resources, through strong visual impact, high-decibel warning, multi-channel emergency push, and emergency work order scheduling, to ensure that the overall failure information is received and emergency handling is started at the first time.

[0129] It can be seen that by setting the second preset value lower than the first preset fault risk value, a more sensitive overall cable fault early warning mechanism is constructed: when the target fault risk value exceeds the second preset value, the fourth prompt information prompting the overall cable fault is generated in time, which can issue a global fault warning in advance in the case that the individual risk of each component has not reached the first preset value but the overall risk is already high enough, such a hierarchical threshold design not only ensures the accurate early warning of component risk, but also realizes the early discovery and response of overall cable fault through a lower overall risk threshold, avoids ignoring the potential serious problem of the overall cable due to the single component risk not exceeding the standard, and thus more comprehensively guarantees the safe operation of the cable and reduces the loss caused by the expansion of the fault.

[0130] In summary, the implementation of the present application has the following beneficial effects:

[0131] It can be seen that the cable internal temperature determination method described in the embodiment of the present application determines the first radial thermal resistance corresponding to the first structure layer, the copper shielding laminated area filling layer radial thermal resistance and the non-laminated area filling layer radial thermal resistance corresponding to the second structure layer, the inner sheath radial thermal resistance, the second radial thermal resistance corresponding to the third structure layer, the target cable includes the first structure layer, the second structure layer and the third structure layer, the first structure layer is an insulation layer, the second structure layer is a filling layer and an inner sheath, and the third structure layer is an outer sheath, then the first axial thermal resistance, the second axial thermal resistance and the third axial thermal resistance of the target cable are determined, the first axial thermal resistance is a core thermal resistance, the second axial thermal resistance is a copper shielding layer thermal resistance, and the third axial thermal resistance is an armored layer thermal resistance, then a thermal resistance coefficient matrix is determined based on the first radial thermal resistance, the copper shielding laminated area filling layer radial thermal resistance, the non-laminated area filling layer radial thermal resistance, the inner sheath radial thermal resistance, the second radial thermal resistance, the first axial thermal resistance, the second axial thermal resistance and the third axial thermal resistance, the copper shielding laminated area conductor heat loss, the copper shielding laminated area insulation layer dielectric loss, the non-laminated area conductor heat loss and the non-laminated area insulation layer dielectric loss corresponding to the target cable are determined, the loss parameter matrix is determined based on the copper shielding laminated area conductor heat loss, the copper shielding laminated area insulation layer dielectric loss, the non-laminated area conductor heat loss and the non-laminated area insulation layer dielectric loss, then the node temperature matrix is determined based on the thermal resistance coefficient matrix and the loss parameter matrix, and finally the copper shielding laminated area core temperature, the copper shielding laminated area copper shielding layer temperature, the copper shielding laminated area armored layer temperature, the non-laminated area core temperature, the non-laminated area copper shielding layer temperature and the non-laminated area armored layer temperature corresponding to the target cable are determined based on the node temperature matrix, which improves the accuracy of cable internal temperature determination.

[0132] Please refer to Figure 7 , Figure 7Fig. 1 is a structural schematic diagram of a cable internal temperature determination device provided by an embodiment of the present application. The cable internal temperature determination device 700 comprises a determination unit 701 and a processing unit 702.

[0133] The determination unit 701 is configured to determine a first radial thermal resistance corresponding to a first structure layer, a copper shielding laminated area filling layer radial thermal resistance and a non-laminated area filling layer radial thermal resistance corresponding to a second structure layer, an inner sheath radial thermal resistance, and a second radial thermal resistance corresponding to a third structure layer. The target cable comprises the first structure layer, the second structure layer, and the third structure layer. The first structure layer is an insulation layer. The second structure layer is a filling layer and an inner sheath. The third structure layer is an outer sheath.

[0134] The processing unit 702 is configured to determine a first axial thermal resistance, a second axial thermal resistance, and a third axial thermal resistance of the target cable. The first axial thermal resistance is a core thermal resistance. The second axial thermal resistance is a copper shielding layer thermal resistance. The third axial thermal resistance is an armoring layer thermal resistance.

[0135] A thermal resistance coefficient matrix is determined based on the first radial thermal resistance, the copper shielding laminated area filling layer radial thermal resistance, the non-laminated area filling layer radial thermal resistance, the inner sheath radial thermal resistance, the second radial thermal resistance, the first axial thermal resistance, the second axial thermal resistance, and the third axial thermal resistance.

[0136] A copper shielding laminated area conductor heat loss, a copper shielding laminated area insulation layer dielectric loss, a non-laminated area conductor heat loss, and a non-laminated area insulation layer dielectric loss corresponding to the target cable are determined.

[0137] A loss parameter matrix is determined based on the copper shielding laminated area conductor heat loss, the copper shielding laminated area insulation layer dielectric loss, the non-laminated area conductor heat loss, and the non-laminated area insulation layer dielectric loss.

[0138] A node temperature matrix is determined based on the thermal resistance coefficient matrix and the loss parameter matrix.

[0139] A copper shielding laminated area core temperature, a copper shielding laminated area copper shielding layer temperature, a copper shielding laminated area armoring layer temperature, a non-laminated area core temperature, a non-laminated area copper shielding layer temperature, and a non-laminated area armoring layer temperature corresponding to the target cable are determined based on the node temperature matrix.

[0140] In some possible embodiments, in terms of determining the first axial thermal resistance, the second axial thermal resistance, and the third axial thermal resistance of the target cable, the processing unit 702 is specifically configured to:

[0141] Obtain a core outer diameter, a core thermal resistance coefficient, and a copper shielding area axial length corresponding to the target cable.

[0142] determine the first axial thermal resistance based on the wire core outer diameter, the wire core thermal resistance coefficient, and the copper shielding region axial length;

[0143] obtain a copper shielding layer outer diameter, a copper shielding layer thermal resistance coefficient, and a copper shielding layer thickness corresponding to the target cable;

[0144] determine the second axial thermal resistance based on the copper shielding layer outer diameter, the copper shielding layer thermal resistance coefficient, the copper shielding layer thickness, and the copper shielding region axial length;

[0145] obtain an inner sheath layer inner diameter, an armoring layer thermal resistance coefficient, and an armoring layer thickness corresponding to the target cable;

[0146] determine the third axial thermal resistance based on the inner sheath layer inner diameter, the armoring layer thermal resistance coefficient, the armoring layer thickness, and the copper shielding region axial length.

[0147] In some possible implementation manners, the processing unit 702 is further specifically configured to:

[0148] determine a first temperature difference value based on the copper shielding overlap region wire core temperature and the non-overlap region wire core temperature;

[0149] determine a second temperature difference value based on the copper shielding overlap region copper shielding layer temperature and the non-overlap region copper shielding layer temperature;

[0150] determine a third temperature difference value based on the copper shielding overlap region armoring layer temperature and the non-overlap region armoring layer temperature;

[0151] determine a target failure risk value of the target cable based on the first temperature difference value, the second temperature difference value, and the third temperature difference value; the target failure risk value is used to evaluate a failure risk degree of the target cable.

[0152] In some possible implementation manners, in the determination of the target failure risk value of the target cable based on the first temperature difference value, the second temperature difference value, and the third temperature difference value, the processing unit 702 is specifically configured to:

[0153] determine a wire core failure risk value based on the first temperature difference value;

[0154] determine a copper shielding layer failure risk value based on the second temperature difference value;

[0155] determine an armoring layer failure risk value based on the third temperature difference value;

[0156] determine the target failure risk value based on the wire core failure risk value, the copper shielding layer failure risk value, and the armoring layer failure risk value.

[0157] In some possible implementation manners, in determining the target failure risk value based on the core failure risk value, the copper shielding layer failure risk value and the armored layer failure risk value, the processing unit 702 is specifically configured to:

[0158] determine an average failure risk value corresponding to the core failure risk value, the copper shielding layer failure risk value and the armored layer failure risk value;

[0159] obtain a use duration of the target cable;

[0160] determine an optimization factor corresponding to the use duration;

[0161] optimize the average failure risk value based on the optimization factor to obtain the target failure risk value.

[0162] In some possible implementation manners, the processing unit 702 is further specifically configured to:

[0163] if the core failure risk value is greater than a first preset failure risk value, generate first prompt information; the first prompt information is used to prompt that the core of the target cable fails;

[0164] if the copper shielding layer failure risk value is greater than the first preset failure risk value, generate second prompt information; the second prompt information is used to prompt that the copper shielding layer of the target cable fails;

[0165] if the armored layer failure risk value is greater than the first preset failure risk value, generate third prompt information; the third prompt information is used to prompt that the armored layer of the target cable fails.

[0166] In some possible implementation manners, the processing unit 702 is further specifically configured to:

[0167] if the target failure risk value is greater than a second preset failure risk value, generate fourth prompt information; the fourth prompt information is used to prompt that the target cable fails; the second preset failure risk value is less than the first preset failure risk value.

[0168] Please refer to Figure 8 , Figure 8 which is a structural schematic diagram of an electronic device provided in the embodiments of the present application. As shown in Figure 8 , the electronic device 800 includes a transceiver 801, a processor 802 and a memory 803. They are connected through a bus 804. The memory 803 is used to store computer programs and data, and the transceiver 801 can transmit the data stored in the memory 803 to the processor 802. The above-mentioned programs include instructions for performing the following steps:

[0169] determining a first radial thermal resistance corresponding to a first structure layer, a copper shielding laminated area filling layer radial thermal resistance and a non-laminated area filling layer radial thermal resistance corresponding to a second structure layer, an inner sheath radial thermal resistance, and a second radial thermal resistance corresponding to a third structure layer; the target cable includes the first structure layer, the second structure layer, and the third structure layer, the first structure layer is an insulation layer, the second structure layer is a filling layer and an inner sheath, and the third structure layer is an outer sheath;

[0170] determining a first axial thermal resistance, a second axial thermal resistance, and a third axial thermal resistance of the target cable; the first axial thermal resistance is a core thermal resistance, the second axial thermal resistance is a copper shielding layer thermal resistance, and the third axial thermal resistance is an armored layer thermal resistance;

[0171] determining a thermal resistance coefficient matrix based on the first radial thermal resistance, the copper shielding laminated area filling layer radial thermal resistance, the non-laminated area filling layer radial thermal resistance, the inner sheath radial thermal resistance, the second radial thermal resistance, the first axial thermal resistance, the second axial thermal resistance, and the third axial thermal resistance;

[0172] determining a copper shielding laminated area conductor heat loss, a copper shielding laminated area insulation layer dielectric loss, a non-laminated area conductor heat loss, and a non-laminated area insulation layer dielectric loss corresponding to the target cable;

[0173] determining a loss parameter matrix based on the copper shielding laminated area conductor heat loss, the copper shielding laminated area insulation layer dielectric loss, the non-laminated area conductor heat loss, and the non-laminated area insulation layer dielectric loss;

[0174] determining a node temperature matrix based on the thermal resistance coefficient matrix and the loss parameter matrix;

[0175] determining a copper shielding laminated area core temperature, a copper shielding laminated area copper shielding layer temperature, a copper shielding laminated area armored layer temperature, a non-laminated area core temperature, a non-laminated area copper shielding layer temperature, and a non-laminated area armored layer temperature corresponding to the target cable based on the node temperature matrix.

[0176] In some possible implementations, in terms of determining the first axial thermal resistance, the second axial thermal resistance, and the third axial thermal resistance of the target cable, the above program includes instructions for performing the following steps:

[0177] obtaining a core outer diameter, a core thermal resistance coefficient, and a copper shielding area axial length corresponding to the target cable;

[0178] determining the first axial thermal resistance based on the core outer diameter, the core thermal resistance coefficient, and the copper shielding area axial length;

[0179] obtaining a copper shielding layer outer diameter, a copper shielding layer thermal resistance coefficient, and a copper shielding layer thickness corresponding to the target cable;

[0180] determining the second axial thermal resistance based on the copper shielding layer outer diameter, the copper shielding layer thermal resistance coefficient, the copper shielding layer thickness, and the copper shielding region axial length;

[0181] obtaining an inner sheath layer inner diameter, an armor layer thermal resistance coefficient, and an armor layer thickness corresponding to the target cable;

[0182] determining the third axial thermal resistance based on the inner sheath layer inner diameter, the armor layer thermal resistance coefficient, the armor layer thickness, and the copper shielding region axial length.

[0183] In some possible implementations, the above program includes instructions for performing the following steps:

[0184] determining a first temperature difference value based on the copper shielding lamination zone conductor temperature and the non-lamination zone conductor temperature;

[0185] determining a second temperature difference value based on the copper shielding lamination zone copper shielding layer temperature and the non-lamination zone copper shielding layer temperature;

[0186] determining a third temperature difference value based on the copper shielding lamination zone armor layer temperature and the non-lamination zone armor layer temperature;

[0187] determining a target failure risk value of the target cable based on the first temperature difference value, the second temperature difference value, and the third temperature difference value; the target failure risk value is used to evaluate the failure risk degree of the target cable.

[0188] In some possible implementations, in terms of determining the target failure risk value of the target cable based on the first temperature difference value, the second temperature difference value, and the third temperature difference value, the above program includes instructions for performing the following steps:

[0189] determining a conductor failure risk value based on the first temperature difference value;

[0190] determining a copper shielding layer failure risk value based on the second temperature difference value;

[0191] determining an armor layer failure risk value based on the third temperature difference value;

[0192] determining the target failure risk value based on the conductor failure risk value, the copper shielding layer failure risk value, and the armor layer failure risk value.

[0193] In some possible implementations, in terms of determining the target failure risk value based on the conductor failure risk value, the copper shielding layer failure risk value, and the armor layer failure risk value, the above program includes instructions for performing the following steps:

[0194] determine an average failure risk value corresponding to the wire core failure risk value, the copper shielding layer failure risk value, and the armored layer failure risk value;

[0195] obtain a use duration of the target cable;

[0196] determine an optimization factor corresponding to the use duration;

[0197] optimize the average failure risk value based on the optimization factor to obtain the target failure risk value.

[0198] In some possible implementation manners, the program includes instructions for performing the following steps:

[0199] generate first prompt information if the wire core failure risk value is greater than a first preset failure risk value; the first prompt information is used to prompt that the wire core of the target cable has failed;

[0200] generate second prompt information if the copper shielding layer failure risk value is greater than the first preset failure risk value; the second prompt information is used to prompt that the copper shielding layer of the target cable has failed;

[0201] generate third prompt information if the armored layer failure risk value is greater than the first preset failure risk value; the third prompt information is used to prompt that the armored layer of the target cable has failed.

[0202] In some possible implementation manners, the program includes instructions for performing the following steps:

[0203] generate fourth prompt information if the target failure risk value is greater than a second preset failure risk value; the fourth prompt information is used to prompt that the target cable has failed; and the second preset failure risk value is less than the first preset failure risk value.

[0204] It should be understood that the electronic device in the present application can include a smart phone (such as an Android phone, an iOS phone, a Windows Phone phone, etc.), a tablet computer, a palm computer, a notebook computer, a mobile Internet device (MID, Mobile Internet Devices for short), or a wearable device or a server, an edge computing node, etc. The above electronic devices are only examples and are not exhaustive, and include but are not limited to the above electronic devices.

[0205] The embodiments of the present application also provide a computer readable storage medium, which stores a computer program. The computer program is executed by a processor to implement part or all steps of any one of the methods described in the above method embodiments.

[0206] The method embodiments described above are also provided by a computer program product. The computer program product includes a non-transitory computer readable storage medium having stored thereon a computer program. The computer program is operable to cause a computer to perform some or all of the steps of any of the methods described above.

[0207] It should be noted that, for the above-mentioned method embodiments, in order to simply describe, they are all described as a combination of a series of actions, but those skilled in the art should know that the application is not limited to the order of the actions described, because according to the application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should know that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required by the application.

[0208] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0209] In the several embodiments provided by the present application, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There can be another division during actual implementation. For example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed coupling or direct coupling or communication connection between the units can be indirect coupling or communication connection through some interface, device or unit, and can be electrical or other form.

[0210] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they can be located in one place, or they can be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0211] In addition, each functional unit in each embodiment of the present application can be integrated into a processing unit, or each unit can exist physically independently, or two or more units can be integrated into one unit. The integrated unit can be realized in the form of hardware or in the form of a software program module.

[0212] If the integrated unit is realized in the form of a software program module and sold or used as an independent product, it can be stored in a computer readable memory. Based on this understanding, the technical solutions of the present application essentially or the part that contributes to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a memory and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server or a network device, etc.) to execute all or part of the steps of the methods of the various embodiments of the present application. The aforementioned memory includes: a U disk, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk, and various media that can store program codes.

[0213] A person of ordinary skill in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by a program instructing relevant hardware, and the program can be stored in a computer readable memory, and the memory can include a flash disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.

[0214] The embodiments of the present application are described in detail above, and specific examples are applied in this paper to describe the principles and embodiments of the present application. The above description of the embodiments is only used to help understand the method of the present application and its core idea; at the same time, for those skilled in the art, according to the idea of the present application, the specific embodiments and application scope will be changed, and the above description of the embodiments should not be understood as a limitation of the present application.

Claims

1. A method of determining a temperature inside a cable, characterized by, The method comprises the following steps: determining a first radial thermal resistance corresponding to a first structural layer, a copper shielding laminated area filling layer radial thermal resistance and a non-laminated area filling layer radial thermal resistance corresponding to a second structural layer, an inner sheath radial thermal resistance, and a second radial thermal resistance corresponding to a third structural layer; the target cable comprises the first structural layer, the second structural layer, and the third structural layer, the first structural layer is an insulation layer, the second structural layer is a filling layer and an inner sheath, and the third structural layer is an outer sheath; determining a first axial thermal resistance, a second axial thermal resistance, and a third axial thermal resistance of the target cable; the first axial thermal resistance is a core thermal resistance, the second axial thermal resistance is a copper shielding layer thermal resistance, and the third axial thermal resistance is an armored layer thermal resistance; determining a thermal resistance coefficient matrix based on the first radial thermal resistance, the copper shielding laminated area filling layer radial thermal resistance, the non-laminated area filling layer radial thermal resistance, the inner sheath radial thermal resistance, the second radial thermal resistance, the first axial thermal resistance, the second axial thermal resistance, and the third axial thermal resistance; determining a copper shielding laminated area conductor heat loss, a copper shielding laminated area insulation layer dielectric loss, a non-laminated area conductor heat loss, and a non-laminated area insulation layer dielectric loss corresponding to the target cable; determining a loss parameter matrix based on the copper shielding laminated area conductor heat loss, the copper shielding laminated area insulation layer dielectric loss, the non-laminated area conductor heat loss, and the non-laminated area insulation layer dielectric loss; determining a node temperature matrix based on the thermal resistance coefficient matrix and the loss parameter matrix; determining a copper shielding laminated area core temperature, a copper shielding laminated area copper shielding layer temperature, a copper shielding laminated area armored layer temperature, a non-laminated area core temperature, a non-laminated area copper shielding layer temperature, and a non-laminated area armored layer temperature corresponding to the target cable based on the node temperature matrix.

2. The method of claim 1, wherein, The method further comprises the following steps: acquiring a core outer diameter, a core thermal resistance coefficient, and a copper shielding area axial length corresponding to the target cable; determining the first axial thermal resistance based on the core outer diameter, the core thermal resistance coefficient, and the copper shielding area axial length; acquiring a copper shielding layer outer diameter, a copper shielding layer thermal resistance coefficient, and a copper shielding layer thickness corresponding to the target cable; determining the second axial thermal resistance based on the copper shielding layer outer diameter, the copper shielding layer thermal resistance coefficient, the copper shielding layer thickness, and the copper shielding area axial length; acquiring an inner sheath layer inner diameter, an armored layer thermal resistance coefficient, and an armored layer thickness corresponding to the target cable; determining the third axial thermal resistance based on the inner sheath layer inner diameter, the armored layer thermal resistance coefficient, the armored layer thickness, and the copper shielding area axial length.

3. The method of claim 2, wherein, The method further comprises the following steps: determining a first temperature difference value based on the copper shielding laminated area core temperature and the non-laminated area core temperature; determining a second temperature difference value based on the copper shielding laminated area copper shielding layer temperature and the non-laminated area copper shielding layer temperature; determining a third temperature difference value based on the copper shielding laminated area armored layer temperature and the non-laminated area armored layer temperature; determine a target fault risk value of the target cable based on the first temperature difference value, the second temperature difference value and the third temperature difference value; the target fault risk value is used to evaluate the fault risk degree of the target cable.

4. The method of claim 3, wherein, The method further comprises: determine a wire core fault risk value based on the first temperature difference value; determine a copper shielding layer fault risk value based on the second temperature difference value; determine an armoring layer fault risk value based on the third temperature difference value; determine the target fault risk value based on the wire core fault risk value, the copper shielding layer fault risk value and the armoring layer fault risk value.

5. The method of claim 4, wherein, The method further comprises: determine an average fault risk value corresponding to the wire core fault risk value, the copper shielding layer fault risk value and the armoring layer fault risk value; obtain a use duration of the target cable; determine an optimization factor corresponding to the use duration; optimize the average fault risk value based on the optimization factor to obtain the target fault risk value.

6. The method of claim 5, wherein, The method further comprises: if the wire core fault risk value is greater than a first preset fault risk value, generate a first prompt information; the first prompt information is used to prompt that the wire core of the target cable has a fault; if the copper shielding layer fault risk value is greater than the first preset fault risk value, generate a second prompt information; the second prompt information is used to prompt that the copper shielding layer of the target cable has a fault; if the armoring layer fault risk value is greater than the first preset fault risk value, generate a third prompt information; the third prompt information is used to prompt that the armoring layer of the target cable has a fault.

7. The method of claim 6, wherein, The method further comprises: if the target fault risk value is greater than a second preset fault risk value, generate a fourth prompt information; the fourth prompt information is used to prompt that the target cable has a fault; the second preset fault risk value is less than the first preset fault risk value.

8. A cable internal temperature determining device, characterized by The device comprises a determination unit and a processing unit. The determination unit is configured to determine a first radial thermal resistance corresponding to a first structure layer, a copper shielding superposed area filling layer radial thermal resistance and a non-superposed area filling layer radial thermal resistance corresponding to a second structure layer, an inner sheath radial thermal resistance, and a second radial thermal resistance corresponding to a third structure layer; the target cable comprises the first structure layer, the second structure layer and the third structure layer; the first structure layer is an insulation layer; the second structure layer is a filling layer and an inner sheath; and the third structure layer is an outer sheath. The processing unit is configured to determine a first axial thermal resistance, a second axial thermal resistance and a third axial thermal resistance of the target cable; the first axial thermal resistance is a wire core thermal resistance; the second axial thermal resistance is a copper shielding layer thermal resistance; and the third axial thermal resistance is an armoring layer thermal resistance. determining a thermal resistance coefficient matrix based on the first radial thermal resistance, the copper shielded lamination area filling layer radial thermal resistance, the non-lamination area filling layer radial thermal resistance, the inner sheath radial thermal resistance, the second radial thermal resistance, the first axial thermal resistance, the second axial thermal resistance, the third axial thermal resistance; determining copper shielded lamination area conductor heat loss, copper shielded lamination area insulation layer dielectric loss, non-lamination area conductor heat loss, non-lamination area insulation layer dielectric loss corresponding to the target cable; determining a loss parameter matrix based on the copper shielded lamination area conductor heat loss, the copper shielded lamination area insulation layer dielectric loss, the non-lamination area conductor heat loss, the non-lamination area insulation layer dielectric loss; determining a node temperature matrix based on the thermal resistance coefficient matrix and the loss parameter matrix; determining copper shielded lamination area wire core temperature, copper shielded lamination area copper shield temperature, copper shielded lamination area armor layer temperature, non-lamination area wire core temperature, non-lamination area copper shield temperature, non-lamination area armor layer temperature corresponding to the target cable based on the node temperature matrix.

9. An electronic device, comprising: A computer readable storage medium stores a computer program, and the computer program is executed by a processor to implement the method of any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The computer readable storage medium stores a computer program, and the computer program is executed by a processor to implement the method of any one of claims 1-7.

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