Inductor assembly and stacked power supply configuration

Abstract

The invention relates to an inductor assembly and a stacked power supply configuration. According to one configuration, an inductor assembly includes a first material, a second material, and one or more conductive paths. The first conductive path extends through the first material. In one example, the first material is not a magnetically conductive material or has a low magnetic permeability. A second conductive path extends through the second material. In one example, the second material is a magnetically conductive material and has a higher magnetic permeability than the first material. Inductor assemblies discussed herein may be implemented in a circuit in which a second conductive path supports current in one direction, while a first conductive path (e.g., a return path) may be configured to support current in a second direction opposite the first direction.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to inductor assemblies and stacked power supply configurations. BACKGROUND

[0002] Generally, conventional inductors are components that include a wire or other conductive material that is shaped into a coil or spiral to increase the magnetic flux through a corresponding circuit path. Wrapping the wire into a multi-turn coil increases the number of corresponding magnetic flux lines in the corresponding inductor component, thereby increasing the magnetic field and thus the overall inductance of the corresponding inductor component.

[0003] In some cases, conventional inductors can be fabricated via surrounding a conductive path with a magnetic permeable material. The assembly can include multiple inductors, such as multiple inductors formed via multiple conductive paths through the magnetic permeable material.

[0004] Conventional switched power supply circuits sometimes include energy storage components, such as one or more inductors, to generate an output voltage to power a load. For example, a controller can be configured to control switching of input current through one or more inductors to an output node of a power converter to maintain a magnitude of an output voltage at the output node within a desired range. SUMMARY

[0005] Implementations of clean energy (or green technology) are important to reduce the impact of humans on the environment. Generally, clean energy includes any method and material that is continually evolving to reduce the overall toxicity of energy consumption on the environment.

[0006] The present disclosure includes the observation that raw energy (such as raw energy received from a green energy source or a non-green energy source) generally needs to be converted into an appropriate form (such as a desired AC voltage, DC voltage, etc.) before it can be used to power an end device (such as a server, computer, mobile communication device, wireless base station, etc.). In some cases, the energy is stored in a corresponding battery resource(s). Alternatively, the energy is received from a voltage generator. Whether the energy is received from a green energy source or a non-green energy source, it is desirable to most efficiently use the raw energy provided by such systems (such as storage and subsequent distribution) to reduce our impact on the environment. The present disclosure helps to reduce our carbon footprint and better utilize energy via more efficient energy conversion.

[0007] The present disclosure also includes the observation that power conversion efficiency and / or density of conventional power supplies can be improved. For example, to this end, the present disclosure includes novel ways to provide improved inductor assemblies that support power conversion.

[0008] Compared to conventional techniques, examples herein include novel inductor assemblies and novel implementations of inductor assemblies in different stacked power converter configurations and circuit arrangements.

[0009] More specifically, an inductor assembly as discussed herein can be configured to include: a first material; a first electrically conductive path extending through the first material; a second material that is a magnetic permeable material; and a second electrically conductive path extending through the second material.

[0010] In one example, the first electrically conductive path is a so-called ground return path that supports the transmission of current transmitted on the second electrically conductive path.

[0011] In another example, the first material can encapsulate the first electrically conductive path. A first portion of the second material can encapsulate the first material. The inductor assembly can further include a third electrically conductive path extending through the second material. A second portion of the second material can encapsulate the third electrically conductive path. Additionally, the first electrically conductive path (e.g., a return current path) can be placed in the inductor assembly between the second electrically conductive path and the third electrically conductive path.

[0012] In still further examples discussed herein, an inductor assembly can be configured to include a first surface (such as a top surface) and a second surface (such as a bottom surface). The first material can extend between the first surface and the second surface. The second material can also extend between the first surface and the second surface. The first electrically conductive path can extend between the first surface and the second surface; the second electrically conductive path can extend between the first surface and the second surface.

[0013] In yet further examples as discussed herein, the first material can be a magnetic permeable material having a first magnetic permeability; the second material can have a second magnetic permeability. In one example, the second magnetic permeability is greater than or substantially greater than the first magnetic permeability.

[0014] In another example, the first material is a non-magnetic permeable material or a magnetic permeable material below a respective threshold level, such that an inductance associated with the first electrically conductive path is very small compared to an inductance of the second electrically conductive path.

[0015] Note that an inductor assembly as discussed herein can be configured to include any number of electrically conductive paths. In one example, an inductor assembly as discussed herein includes a third electrically conductive path extending through the second material. The first electrically conductive path can be placed between the second electrically conductive path and the third electrically conductive path.

[0016] Further, it should be noted that the inductor assemblies discussed herein can include a fourth conductive path extending through the second material and a fifth conductive path extending through the second material. In one example, the first conductive path is placed in the inductor assembly between the fourth conductive path and the fifth conductive path.

[0017] Other examples discussed herein include a circuit assembly, such as a stack of multiple components including an inductor assembly. In one example, the circuit assembly includes any of the embodiments of the inductor assembly as discussed herein. In one example, the circuit assembly further includes a first switch coupled between a first node of the first conductive path and a first node of the second conductive path. It should be noted that the first node of the first conductive path and the first node of the second conductive path can extend to or through a first face, such as a surface, of the inductor assembly. The circuit can further include a second switch coupled between the first node of the second conductive path and an input voltage source. A controller can be configured to control operation of the first switch and the second switch to convert an input voltage to an output voltage.

[0018] In further examples, the output voltage generated at least in part by the second conductive path can be regulated. In another example, the controller is configured to receive a feedback signal indicative of a magnitude of an output voltage output from a second node of the second conductive path. Based on the magnitude of the feedback signal, the controller controls activation of the first switch and the second switch coupled to the first node of the second conductive path to maintain the magnitude of the output voltage relative to a setpoint reference voltage.

[0019] Further, examples herein include a circuit assembly including embodiments of the inductor assembly discussed herein. The circuit assembly can include a load coupled to receive an output voltage generated by the second conductive path. Switching circuitry in the circuit assembly or associated with the circuit assembly is configured to control current through the second conductive path to generate the output voltage.

[0020] In another example, the first conductive path can be an inductor having a first inductance. The inductance of the first conductive path can be substantially less than an inductance of the second conductive path extending through the magnetically permeable material.

[0021] In yet another example, with respect to the inductor assembly as discussed herein includes a first material encapsulating the first conductive path; a second material encapsulating the first material, the second material being a magnetically permeable material; a second conductive path extending through the second material, the second conductive path for transferring a first current to power a load; and wherein the first conductive path is a return path for transferring the first current received from the load to a reference voltage.

[0022] The inductor assembly can also include a third conductive path extending through the second material. The third conductive path can be configured to transport a second current to power a load. The first conductive path, such as a ground return path, can be configured to transport the second current received from the load to a reference voltage.

[0023] Another example discussed herein can include a method of manufacturing an inductor assembly. The method, as implemented by the manufacturer or other suitable entity, can be configured to include receiving a first material; receiving a second material, the second material being a magnetic permeable material; and manufacturing the inductor assembly to include i) a first conductive path extending through the first material, and ii) a second conductive path extending through the second material.

[0024] These and other more particular examples are disclosed in more detail below.

[0025] It should be noted that any of the resources (e.g., the manufacturer) implemented in the systems discussed herein can include one or more computerized devices, controllers, mobile communication devices, hand held or laptop computers, etc., to perform and / or support any or all of the method operations disclosed herein. In other words, one or more computerized devices or processors can be programmed and / or configured to operate as explained herein to perform the different examples as described herein.

[0026] Other examples herein include software programs to perform the steps and operations summarized above and disclosed in more detail below. One such example includes a computer program product having a non-transitory computer readable storage medium (i.e., any computer readable hardware storage medium) encoded thereon with software instructions for subsequent execution by a computing device (hardware). When the instructions are executed by the computing device (hardware) having a processor, the processor (hardware) is programmed and / or configured to perform the operations disclosed herein. Such arrangements are typically provided as software, code, instructions and / or other data (e.g., data structures) arranged or encoded on the non-transitory computer readable storage medium such as an optical medium (e.g., CD-ROM), floppy disk, hard disk, memory stick, memory device, etc., or other media (such as firmware encoded in one or more ROM, RAM, PROM, etc.), or instantiated as an Application Specific Integrated Circuit (ASIC), etc. The software or firmware or other such configurations can be installed onto a computing device to cause the computing device to perform the techniques explained herein.

[0027] Accordingly, examples herein relate to methods, systems, computer program products, and the like that support the operations discussed herein.

[0028] One example includes a manufacturer (such as a system including a computer readable storage medium and / or having instructions stored thereon for manufacturing an inductor device). The instructions, when executed by computer processor hardware, cause the computer processor hardware (e.g., one or more co-located or differently located processor devices or hardware) to: receive a first material; receive a second material, the second material being a magnetic permeable material; manufacture an inductor component such that the second material encases the first material; and manufacture the inductor component to include: i) a first electrically conductive path extending through the first material, the first material encasing the first electrically conductive path, and ii) a second electrically conductive path extending through the second material, the second material encasing the second electrically conductive path.

[0029] For clarity, the order of the above steps is added. It should be noted that any of the processing steps discussed herein can be performed in any suitable order.

[0030] Other examples of the present disclosure include software programs and / or corresponding hardware to perform any of the method example steps and operations outlined above and detailed below.

[0031] It should be understood that the systems, methods, apparatuses, instructions on computer readable storage media, etc. as discussed herein can also be embodied strictly as a software program, firmware, and a mix of software, hardware, and / or firmware, or implemented as separate hardware, such as within a processor (hardware or software), operating system, or software application.

[0032] It should also be noted that although the examples discussed herein can apply to switched mode power supplies, the concepts disclosed herein can be advantageously applied to any other suitable topology.

[0033] Additionally, it should be noted that although each of the different features, techniques, configurations, etc. discussed herein can be discussed in different places of the present disclosure, it should be noted that each of the different features, techniques, configurations, etc. can be employed independently or in any combination with one another.

[0034] Additionally, it should be noted that this initial discussion of examples (example summary of invention) herein does not have the purpose to designate or require protection of each example and / or incremental novel aspect of the present disclosure or claimed invention. Rather, the summary presents general examples of conventional technology and corresponding points of novelty. For additional details and / or possible points of view (arrangements) of the present invention, the reader is directed to the Specific Description portion of the disclosure (which is an overview of the examples) and corresponding drawings discussed further below. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1is an example three-dimensional view illustrating an inductor assembly as discussed herein.

[0036] Figure 2 is an example diagram of a power converter circuit implementing an inductor assembly to generate a respective output voltage as discussed herein.

[0037] Figure 3 is an example diagram of a power converter circuit implementing an inductor assembly to generate a respective output voltage as discussed herein.

[0038] Figure 4 is an example diagram of each respective power converter phase in a power converter circuit as discussed herein.

[0039] Figure 5A is an example top view of an inductor assembly as discussed herein.

[0040] Figure 5B is an example side view of an inductor assembly as discussed herein.

[0041] Figure 5C is an example three-dimensional view illustrating an inductor assembly as discussed herein.

[0042] Figure 6A is an example top view of an inductor assembly as discussed herein.

[0043] Figure 6B is an example side view of an inductor assembly as discussed herein.

[0044] Figure 6C is an example three-dimensional view illustrating an inductor assembly as discussed herein.

[0045] Figure 7A is an example three-dimensional view of an inductor assembly as discussed herein.

[0046] Figure 7B is an example three-dimensional view of an inductor assembly as discussed herein.

[0047] Figure 7C is an example three-dimensional view illustrating an inductor assembly as discussed herein.

[0048] Figure 8A is an example diagram illustrating a substrate associated with a power converter as discussed herein.

[0049] Figure 8B is an example diagram illustrating a component stack including a substrate and an inductor assembly as discussed herein.

[0050] Figure 8Cis an example diagram illustrating a stack of substrates, inductor assemblies, motherboard substrates, and loads as discussed herein.

[0051] Figure 9A is an example diagram illustrating a power stage substrate including switching circuitry as discussed herein.

[0052] Figure 9B is an example diagram illustrating a stack assembly of inductor assemblies onto a power stage assembly as discussed herein.

[0053] Figure 9C is an example diagram illustrating an embodiment of a stack assembly embedded into a CPU substrate as discussed herein. Figure 9B is an example diagram illustrating an embodiment of a stack assembly embedded into a CPU substrate as discussed herein.

[0054] Figure 9D is an example diagram illustrating coupling of a respective load, such as a CPU, onto a stack assembly as discussed herein.

[0055] Figure 10 is an example top view of an inductor assembly supporting multiple power converter phases as discussed herein.

[0056] Figure 11 is an example top view of an inductor assembly supporting multiple power converter phases as discussed herein.

[0057] Figure 12 is an example diagram illustrating an example computer architecture operable to perform one or more operations as discussed herein.

[0058] Figure 13 is an example diagram illustrating a method as discussed herein.

[0059] Figure 14 is an example diagram illustrating a method as discussed herein.

[0060] The foregoing and other objects, features and advantages of the examples herein will be more readily understood upon consideration of the following more particular description of the examples herein, taken in conjunction with the accompanying drawings, in which like reference numerals refer to like parts throughout the various views. The drawings are not necessarily drawn to scale, emphasis instead being placed upon illustrating the examples, principles, concepts, etc. DETAILED DESCRIPTION

[0061] According to one configuration, an inductor assembly includes a first material, a second material, and one or more electrically conductive paths. A first electrically conductive path, such as a ground return path, extends through the first material. In one example, the first material is not a magnetic permeable material or has a low magnetic permeability. A second electrically conductive path extends through the second material. In one example, the second material is a magnetic permeable material and has a higher magnetic permeability than the first material. The inductor assembly discussed herein can be implemented in a circuit where the second electrically conductive path supports current flow in one direction and the first electrically conductive path, such as a return path, can be configured to support current flow in a second direction opposite the first direction.

[0062] Reference will now be made to the drawings, Figure 1 is an example three-dimensional view illustrating an inductor assembly as discussed herein.

[0063] In this example, the inductor assembly 100 includes a first material 151, a second material 152, and a plurality of electrically conductive paths, such as electrically conductive path 110 (such as a ground return path), electrically conductive path 121, and electrically conductive path 122.

[0064] It should be noted that the number of electrically conductive paths through the first material 151 can vary depending on the implementation. For example, the inductor assembly 100 can be configured to include one or more electrically conductive paths that extend through the first material 151, such as at least between the surface 161 (top surface) and the second surface 162 (bottom surface) of the inductor assembly 100. If desired, a port node at a respective axial end of each of the electrically conductive paths through the first material 151 can extend beyond the respective surface 161 and the respective surface 162.

[0065] It should be noted that the number of electrically conductive paths through the material 152 can vary depending on the implementation. For example, the inductor assembly 100 can be configured to include a plurality of electrically conductive paths that extend through the second material 152, such as at least between the surface 161 (top surface) and the second surface 162 (bottom surface) of the inductor assembly 100. If desired, a port node at a respective axial end of each of the electrically conductive paths through the second material 152 can extend beyond the respective surface 161 and the respective surface 162.

[0066] As further shown, in this example, the first material 151 encloses (i.e., surrounds, encapsulates, etc.) the first conductive path 110 (such as a ground return path). The conductive path 110 can be configured to extend longitudinally along the Y-axis through the inductor assembly 100. In one example, the first material 151 extends to a radius Rl (such as at a center in the material 151 or other suitable location) relative to the conductive path 110. Along the Y-axis, the first material 151 extends at least between the first surface 161 and the second surface 162. In this case, the first material 151 is cylindrical in shape. However, it should be noted that the cylindrical shape is shown by way of example only. The first material 151 in the inductor assembly 100 can be formed in any suitable shape.

[0067] In other examples, the conductive path 110 (such as a ground return path) can be implemented as a plurality of conductive paths that extend through the material 151 from the bottom surface 162 to the top surface 161. This can be desirable in situations where the ground / current return path functionality provided by the conductive path 110 (such as a ground return path) requires a higher current magnitude.

[0068] It should also be noted that the first material 151 can be manufactured from any suitable material or materials (such as plastic, etc.). In one example, the first material 151 has a low magnetic permeability (such as 10% or even lower of the magnitude of the magnetic permeability of the second material). Thus, the ratio of the magnitude of the magnetic permeability of the first material 151 relative to the magnitude of the magnetic permeability of the second material 152 can be less than 0.1 or other suitable value. If desired, the material 151 can be a non-magnetic material that has a magnetic permeability close to that of a vacuum or air. In this case, the flux density in the first material 151 based on the current flowing through the conductive path 110 (such as a ground return path) is low, resulting in a situation where the conductive path 110 has very little inductance, close to zero inductance, or possibly no inductance at all.

[0069] The second material 152 can be manufactured from any suitable material or materials. In one example, the second material 152 that is placed outside of the radius Rl extends between the surface 161 and the surface 162. The material 152 can be configured to have a high (or higher) magnetic permeability (such as 10 times (or other suitable multiplier value) or even higher of the magnitude of the magnetic permeability of the first material). In this case, the flux density in the first material 152 (close to the conductive path 121) based on the current flowing through the conductive path 121 is high, resulting in a situation where the conductive path 121 has a higher inductance than the inductance associated with the conductive path 110.

[0070] In other words, the conductive path 121 can be a first inductor associated with the inductor assembly 100; the conductive path 122 is a second inductor associated with the inductor assembly 100.

[0071] Several parameters can be selected to control the respective inductance of each of the conductive paths (e.g., conductive path 121, conductive path 122, etc.) that extend through the second material 152. For example, the length of each conductive path between surface 161 and surface 162 can vary, such as based on the separation distance of surface 161 and surface 162 in inductor assembly 100. The greater the separation distance, the higher the inductance of each of the conductive paths therethrough.

[0072] Additionally, the magnetic permeability of material 152 can be selected to control the magnitude of the inductance of the conductive paths that extend through material 152. The higher the magnetic permeability of material 152, the higher the respective inductance of the conductive paths.

[0073] As previously noted, the magnetic permeability of second material 152 can be greater than the magnetic permeability of first material 151. Thus, in one example, the inductance of each of conductive paths 121, 122, etc. is greater than the inductance of first conductive path 110 (which, as previously discussed, is potentially very low or near zero inductance).

[0074] Furthermore, as shown, a portion of second material 152 in inductor assembly 100 encloses first material 151. More specifically, outside of radius Rl with respect to conductive path 110 (such as the ground return path), inductor assembly 100 includes second material 152 that surrounds material 151.

[0075] More specifically as shown in Figure 1 Second material 152 can enclose (i.e., surround, encapsulate, etc.) each of the one or more conductive paths that extend through inductor assembly 100. The location of conductive path 110 (such as the ground return path) in first material 151 ensures sufficient separation distance of conductive path 110 with respect to magnetic permeable material 152, thereby preventing conductive path 110 from having high inductance, or at least ensuring that the inductance of conductive path 110 is zero or near zero or at least less than the magnitude of the inductance associated with conductive paths 121 and 122.

[0076] In this example, inductor assembly 100 includes conductive path 121, conductive path 122 that extend through second material 152. Conductive path 121 and conductive path 122 extend longitudinally along the Y-axis. A first portion of material 152 encloses conductive path 121; a second portion of material 152 encloses conductive path 122.

[0077] The shape of material 152 associated with inductor assembly 100 is shown by way of example. Second material 152 in inductor assembly 100 can be formed in any suitable shape.

[0078] Furthermore, the conductive path 121 and the conductive path 122 can be placed at any location in the inductor assembly 100. In one example, the conductive path 110 is placed in the inductor assembly 100 between the conductive path 121 and the conductive path 122.

[0079] Accordingly, examples herein include an inductor assembly 100 including: a first material 151, a first conductive path 110 extending through the first material 151; a second material 152 (such as a magnetic permeable material); and a second conductive path 121 and a third conductive path 122 extending through the second material.

[0080] Figure 2 is an example diagram illustrating a power converter circuit implementing an inductor assembly to generate a respective output voltage as discussed herein.

[0081] In one example, the power converter 200 is implemented as a multi-phase buck converter including any number of power converter phases. Assuming there are 4 power converter phases, the power converter 200 includes: four pairs of switches, four-phase low profile inductors with short current paths and ground return paths placed in the inductor assembly 100, and one or more decoupling capacitors Cin and Cout.

[0082] More specifically, a first power converter phase 221 in the power converter 200 includes a switch Ql l, a switch Q12, and an inductor LI (conductive path 121). The controller 140 monitors a magnitude of the output voltage 119 relative to a ground reference voltage 199 (such as a differential voltage) and compares the magnitude of the output voltage 119 to a desired setpoint reference voltage 250 (such as 1 volt DC or other suitable reference value). Based on an error voltage indicative of a difference between the differential voltage (essentially the output voltage 119) and the setpoint reference voltage 250, the controller 140 generates control signals Sll and S12 to control the respective switches Ql l and Q12. As shown, control of the switches Ql l and Q12 results in a flow of a respective current 131 through the conductive path 121 (also referred to as the inductor LI) to an output node N29 of the power converter 200.

[0083] The second power converter phase 222 in the power converter 200 includes a switch Q21, a switch Q22, and an inductor L2 (conductive path 122). The controller 140 monitors the magnitude of the output voltage 119 relative to a ground reference voltage 199, such as a differential voltage, and compares it to a desired setpoint reference voltage 250, such as 1 volt DC or other suitable value. Based on an error voltage indicative of the difference between the differential voltage (essentially the output voltage 119) and the setpoint reference voltage 250, the controller 140 generates control signals S21 and S22 to control the respective switches Q21 and Q22. As shown, the control of the switches Q21 and Q22 results in the flow of a respective current 132 through the conductive path 122 (also referred to as inductor L2) to the output node N29 of the power converter 200.

[0084] The third power converter phase 223 in the power converter 200 includes a switch Q31, a switch Q32, and an inductor L3 (conductive path 123). The controller 140 monitors the magnitude of the output voltage 119 relative to a ground reference voltage 199, such as a differential voltage, and compares it to a desired setpoint reference voltage 250, such as 1 volt DC or other suitable value. Based on an error voltage indicative of the difference between the differential voltage (essentially the output voltage 119) and the setpoint reference voltage 250, the controller 140 generates control signals S31 and S32 to control the respective switches Q31 and Q32. As shown, the control of the switches Q31 and Q32 results in the flow of a respective current 133 through the conductive path 123 (also referred to as inductor L3) to the output node N29 of the power converter 200.

[0085] The fourth power converter phase 224 in the power converter 200 includes a switch Q41, a switch Q42, and an inductor L4 (conductive path 124). The controller 140 monitors the magnitude of the output voltage 133 relative to a ground reference voltage 199, such as a differential voltage, and compares it to a desired setpoint reference voltage 250, such as 1 volt DC or other suitable value. Based on an error voltage indicative of the difference between the differential voltage (essentially the output voltage 119) and the setpoint reference voltage 250, the controller 140 generates control signals S41 and S42 to control the respective switches Q41 and Q42. As shown, the control of the switches Q41 and Q42 results in the flow of a respective current 134 through the conductive path 124 (also referred to as inductor L4) to the output node N29 of the power converter 200.

[0086] Based on the control signals generated by the controller 140 and the flow of the respective currents 131, 132, 133, 134, the magnitude of the output voltage 119 is approximately equal to the setpoint reference voltage 250.

[0087] In one example, the return current 139 through the conductive path 110 is equal to the sum of the current 131, the current 132, the current 133, and the current 134. In other words, the total current supplied from the plurality of power converter phases to the load 118 passes through the load 118 and returns to the ground reference voltage 198 through the conductive path 110.

[0088] Figure 3 is an example diagram illustrating a power converter circuit implementing an inductor assembly to produce a respective output voltage as discussed herein.

[0089] Embodiments of the power converter 200-2 are nearly identical to the previously discussed embodiments of the power converter 200. Figure 3

[0090] However, if desired, the material 152 can be selected to have a magnetic permeability greater than that of air or vacuum. In this case, the conductive path 110 through the inductor assembly 100 is an inductor having an inductance (large or small or zero or non-zero) defined by the magnetic permeability of the material 152 and the length of the conductive path 110 between the surface 161 and the surface 162.

[0091] Figure 4 is an example diagram illustrating a respective power converter phase as discussed herein.

[0092] In this example, each of the power converter phases 22X (where X is an integer value indicating the phase, where X=l corresponds to the power converter phase 221, where X=2 corresponds to the power converter phase 222, and so on) in the power converter 200 (i.e., circuit) includes an inductor LX, a high-side switch QX1, a low-side switch QX2, a driver DX1, and a driver DX2.

[0093] It should be noted that any of the switches (also referred to as switching circuit devices) discussed herein can be implemented in any suitable manner (such as via MOSFETs, semiconductor materials including GaN and SiC; and any power semiconductor including BJTs, IGBTs, JFETs, etc.).

[0094] The switches QX1 and QX2 of the respective power converter phase 22X are connected in series between the input voltage source 120 and the ground reference voltage 199. For example, the drain (D) of the switch QX1 is connected to receive the input voltage 121 from the input voltage source 120; the source (S) of the switch QX1 is connected to the drain (D) of the switch QX2; the source (S) of the switch QX2 is connected to the ground reference voltage 199. The first end of the inductor LX is connected to the source node of the switch QX1 and the drain node of the switch QX2. The second end of the inductor LX is connected to the node N3X (or node N29).​

[0095] It should be noted that the ground reference voltage 199 can be the same as the ground reference voltage 198 or different from the ground reference voltage 198.

[0096] The control signals SX1 and SX2 generated by the controller 140 for a given power converter phase 22X control the operation of the switches in the respective power converter phase 22X via the controller 140. For example, activating the high-side switch QX1 while deactivating the low-side switch QX2 causes the magnitude of the current I3X to increase during the respective control period; deactivation of the high-side switch QX1 while activating the low-side switch QX2 causes the magnitude of the current I3X to decrease during the respective control period. As discussed herein, the controller 140 can be configured to vary the duty cycle of the control signals SX1 and SX2 generated to control the magnitude of the output current I3X supplied to the dynamic load 118. The driver DX1 receives the signal SX1 and drives the gate node of the switch QX1 with the signal SX1. The driver DX2 receives the signal SX2 and drives the gate node of the switch QX2 with the signal SX2.

[0097] It should also be noted that the controller 140 and / or the driver circuitry DX1 and DX2 can be configured to implement a dead time so that the switches QX1 and QX2 are not activated at the same time to prevent a short circuit of the input voltage source 120 and the input voltage 121 to the ground reference voltage 199.

[0098] Figure 5A is an example top view of an inductor assembly as discussed herein.

[0099] In this example, the inductor assembly 100 includes a conductive path 121 (inductor LI or winding), a conductive path 122 (inductor L2 or winding), a conductive path 123 (inductor L3 or winding), and a conductive path 124 (inductor L4 or winding).

[0100] As previously discussed, the conductive path 110 (such as for supporting return current) can have zero inductance, near zero inductance, or some other inductance magnitude. Further, as previously discussed, additional conductive paths can be configured to extend through the material 151 similarly to the conductive path 110.

[0101] In one example, the inductors placed in the inductor assembly 100 are so-called low profile inductors.

[0102] Further, in this example, it should be noted that the conductive path 110 is placed between the conductive path 121 and the conductive path 123 in the inductor assembly 100. The conductive path 110 is also placed between the conductive path 122 and the conductive path 124. In this case, as compared to conventional techniques of providing a return path outside of the respective inductor assembly, the conductive path 110 can be configured to provide a return path for the conductive paths 121 and 123 and for the conductive paths 122 and 124.Figure 5A The return path (conductive path 110) shown is placed in the inductor assembly 100, inside the perimeter defined by the conductive paths 121, 122, 123, and 124.

[0103] Figure 5B is an example top view of an inductor assembly as discussed herein.

[0104] In this example, as discussed previously, the inductor assembly 100 can be configured to include a plurality of conductive paths extending at least from surface 161 to surface 162.

[0105] Figure 5C is an example three-dimensional view illustrating an inductor assembly as discussed herein.

[0106] In this example, as discussed previously, the inductor assembly 100 can be configured to include a plurality of conductive paths extending at least from surface 161 to surface 162.

[0107] Figure 6A is an example top view of an inductor assembly as discussed herein.

[0108] In this example, the assembly 100-2 is similar to the assembly 100 as discussed previously. However, the assembly 100-2 does not include the material 151 or the conductive path 110. Instead, the assembly 100-2 includes a conductive path 610 placed at the material 152 and the perimeter (outer surface) of the corresponding assembly 100-2.

[0109] The conductive path 610 supports a return path function similar to the conductive path 110 discussed previously. In this case, the respective currents 131, 132, 133, 134 are supplied by the respective conductive paths 121, 122, 123, and 124. The corresponding return current 139 associated with the respective currents 131, 132, 133, 134 is transmitted on the conductive path 610 placed on the outer surface of the inductor assembly 100-2.

[0110] Figure 6B is an example side view of an inductor assembly as discussed herein.

[0111] In this example, as discussed previously, the inductor assembly 100 can be configured to include a plurality of conductive paths extending at least from surface 161 to surface 162. The outer surface of the assembly 100-2 includes the conductive path 610.

[0112] Figure 6C is an example three-dimensional view illustrating an inductor assembly as discussed herein.

[0113] In this example, the inductor assembly 100 can be configured to include a plurality of conductive paths extending from the surface 161 to the surface 162, as discussed previously. The outer surface of the assembly 100-2 includes the conductive paths 610.

[0114] Figure 7A is an example diagram illustrating an embodiment of a voltage regulator including an inductor assembly as discussed herein.

[0115] In this example, the inductor assembly 100-2 includes a continuous layer of conductive material 610 that encapsulates the magnetic permeable material 152 and the corresponding inductor assembly 100-2.

[0116] Figure 7B is an example diagram illustrating an embodiment of a plurality of voltage regulators including an inductor assembly as discussed herein.

[0117] In this example, the inductor assembly 100-2 includes a plurality of portions of conductive material 610, such as conductive material 610-1 and conductive material 610-2. Thus, the conductive material can not completely surround the inductor assembly 100-2.

[0118] In this case, the assembly 100-2 includes a plurality of conductive paths 121, 122, 123, 124 through the magnetic permeable material 152. The conductive paths 610-1 and 610-2 can function as a plurality of ground return paths placed on the outer periphery of the inductor assembly 100-2.

[0119] Figure 7C is an example diagram illustrating an embodiment of a plurality of voltage regulators including an inductor assembly as discussed herein.

[0120] In this example, the inductor assembly 100-2 includes a plurality of portions of conductive material 610, such as conductive material 610-11, conductive material 610-12, conductive material 610-13, and conductive material 610-14. The conductive material does not completely surround the inductor assembly 100-2.

[0121] In this case, the assembly 100-2 includes a plurality of conductive paths 121, 122, 123, 124 through the magnetic permeable material 152. The conductive paths 610-11, 610-12, 610-13, and 610-14 can function as a plurality of ground return paths placed on the outer periphery of the inductor assembly 100-2.

[0122] Figure 8A is an example diagram illustrating a substrate associated with a power converter as discussed herein.

[0123] In this example, the switching circuit arrangement associated with the first power converter phase 221, such as the combination of switch Q11 and switch Q12, is placed on or in the substrate 810. Furthermore, as discussed previously, the switching circuit arrangement Q1 controls the output of the current 131 supplied through the node N21 to the inductor LI.

[0124] For example, the switching circuit arrangement Q1 associated with the first power converter phase 221, such as the combination of switch Q11 and switch Q12, is placed on or in the substrate 810. Furthermore, as discussed previously, the switching circuit arrangement Q1 controls the output of the current 131 supplied through the node N21 to the inductor LI.

[0125] The switching circuit arrangement Q2 associated with the power converter phase 222, such as the combination of switch Q21 and switch Q22, is placed on or in the substrate 810. Furthermore, as discussed previously, the switching circuit arrangement Q2 controls the output of the current 132 supplied through the node N22 to the inductor L2.

[0126] The switching circuit arrangement Q3 associated with the power converter phase 223, such as the combination of switch Q31 and switch Q32, is placed on or in the substrate 810. Furthermore, as discussed previously, the switching circuit arrangement Q3 controls the output of the current 133 supplied through the node N23 to the inductor L3.

[0127] The switching circuit arrangement Q4 associated with the power converter phase 224, such as the combination of switch Q41 and switch Q42, is placed on or in the substrate 810. Furthermore, as discussed previously, the switching circuit arrangement Q4 controls the output of the current 134 supplied through the node N24 to the inductor L4.

[0128] Figure 8B is an example diagram illustrating a complementary stack comprising a substrate and an inductor assembly as discussed herein.

[0129] In this example, the assembly 100 is fixed to the substrate 810 such that: i) the switching circuit arrangement Q1 (combination of switch Q11 and switch Q12) controls the current through the conductive path 121; the axial end of the conductive path 121 on the bottom surface 162 of the assembly 100 is connected to the node N21, ii) the switching circuit arrangement Q2 (combination of switch Q21 and switch Q22) controls the current through the conductive path 122; the axial end of the conductive path 122 on the bottom surface 162 of the assembly 100 is connected to the node N22, iii) the switching circuit arrangement Q3 (combination of switch Q31 and switch Q32) controls the current through the conductive path 123; the axial end of the conductive path 123 on the bottom surface 162 of the assembly 100 is connected to the node N23, iv) the switching circuit arrangement Q4 (combination of switch Q41 and switch Q42) controls the current through the conductive path 124; the axial end of the conductive path 124 on the bottom surface 162 of the assembly 100 is connected to the node N24.

[0130] The axial end of the conductive path 110 on the bottom surface 162 is connected to a node N25 (such as a ground reference voltage 198).

[0131] Figure 8C is an example diagram illustrating a stack of substrates, inductor assemblies, motherboards, and loads as discussed herein.

[0132] In this example, the circuit arrangement 899 (assembly stack) includes a stack of the substrate 810, the inductor assembly 100, the substrate 820, and the load 118. As discussed previously, the inductors LI, L2, L3, and L4 in the inductor assembly 100 output respective currents 131, 132, 133, 134 from the top of the inductor assembly 100 to the bottom surface of the substrate 820. The substrate 820 can be configured to include a conductive path to transmit the received output currents 131, 132, 133, 134 to the load 118 and thus transmit the output voltage 119 to the load 118. The load 118 is coupled to the top surface of the substrate 820 to receive the output voltage 119 and the corresponding current supplied by the power converter phase.

[0133] The short distance from the switching converter (such as the switching circuit arrangement on the substrate 810) to the CPU (dynamic load 118) reduces the parasitic inductance and resistance of the power distribution network, which improves the load transient response and reduces the power distribution losses.

[0134] Figure 9A is an example diagram illustrating a power stage substrate as discussed herein.

[0135] In this example, the switching circuit arrangements as discussed previously can be placed on the respective substrates 810.

[0136] For example, the switching circuit arrangement Q1 (such as the combination of switch Q11 and switch Q12) associated with the first power converter phase 221 is placed on or in the substrate 810. Further, as discussed previously, the switching circuit arrangement Q1 controls the output of the current 131 supplied to the inductor LI through the node N21.

[0137] The switching circuit arrangement Q2 (such as the combination of switch Q21 and switch Q22) associated with the power converter phase 222 is placed on or in the substrate 810. Further, as discussed previously, the switching circuit arrangement Q2 controls the output of the current 132 supplied to the inductor L2 through the node N22.

[0138] The switch circuit arrangement Q3 associated with the power converter phase 223, such as the combination of switch Q31 and switch Q32, is placed on or in the substrate 810. Further, as discussed in the foregoing, the switch circuit arrangement Q3 controls the output of the current 133 supplied through the node N23 to the inductor L3.

[0139] The switch circuit arrangement Q4 associated with the power converter phase 224, such as the combination of switch Q41 and switch Q42, is placed on or in the substrate 810. Further, as discussed in the foregoing, the switch circuit arrangement Q4 controls the output of the current 134 supplied through the node N24 to the inductor L4.

[0140] Figure 9B is an example diagram illustrating a stacked assembly of an inductor assembly onto a power stage assembly as discussed herein.

[0141] In this example, the assembly 100 is fixed onto the substrate 810 such that: i) the switch circuit arrangement Q1, the combination of switch Q11 and switch Q12, controls the current through the conductive path 121; the axial end of the conductive path 121 on the bottom surface 162 of the assembly 100 is connected to the node N21, ii) the switch circuit arrangement Q2, the combination of switch Q21 and switch Q22, controls the current through the conductive path 122; the axial end of the conductive path 122 on the bottom surface 162 of the assembly 100 is connected to the node N22, iii) the switch circuit arrangement Q3, the combination of switch Q31 and switch Q32, controls the current through the conductive path 123; the axial end of the conductive path 123 on the bottom surface 162 of the assembly 100 is connected to the node N23, iv) the switch circuit arrangement Q4, the combination of switch Q41 and switch Q42, controls the current through the conductive path 124; the axial end of the conductive path 124 on the bottom surface 162 of the assembly 100 is connected to the node N24.

[0142] Figure 9C is an example diagram illustrating an embodiment of a stacked assembly embedded into a CPU or GPU substrate as discussed herein.

[0143] As shown in this example, the inductor assembly 100 and the substrate 810 are placed, such as embedded, in the respective substrate 910.

[0144] Figure 9D is an example diagram illustrating coupling of a respective load, such as a CPU, to a stacked assembly as discussed herein.

[0145] In this example, the bottom surface of the dynamic load 118 is directly connected to the top surface of the substrate 910 and the corresponding inductor assembly 100.

[0146] Accordingly, in this example, the four-phase switch converter (such as power converter phases 221, 222, 223, 224) is embedded inside of the substrate 910, which is positioned underneath the load 118 (such as a CPU die (central processing unit or one or more semiconductor chips)). The substrate 910, which includes the power converter 200 and corresponding power converter phases, is placed between the load 118 and the substrate 820.

[0147] Accordingly, in one example, the switching circuit components (such as the switches associated with the power converter 200) can be placed on the top surface of the substrate 820. The circuit arrangement 999 includes the stack of dynamic loads 118 on the substrate 910 and the substrate 910 fixed to the substrate 820. Accordingly, the substrate 910 (such as the assembly) is placed between the dynamic loads 118 and the substrate 820 (such as the motherboard).

[0148] In this implementation, the power delivery from the switch converter and corresponding switching circuit arrangement to the load 118 does not pass through the motherboard, which further reduces the distance from the switch converter to the load 118, improves the load transient response, and reduces the power distribution losses.

[0149] It should also be noted that the novel implementation of the assembly 100 is not limited to a buck converter. The assembly 100 can be used in any implementation, such as further including a boost converter, or any other topology that delivers power to a corresponding load.

[0150] Figure 10 is an example top view of an inductor assembly that supports the eight power converter phases discussed herein.

[0151] This example of the inductor assembly 100-10 illustrates that the corresponding inductor assembly can be configured to include any number of conductive paths that extend through the material 152. For example, the assembly 100-10 includes the conductive paths as discussed earlier as well as additional conductive path 125 (inductor L5), conductive path 126 (inductor L6), conductive path 127 (inductor L7), and conductive path 128 (inductor L8).

[0152] Figure 11 is an example top view of an inductor assembly that supports the eight power converter phases discussed herein.

[0153] This example of inductor assembly 100-11 illustrates respective inductor assemblies discussed herein that do not have a conductive path 110, which can be configured to include any number of conductive paths extending through material 152. For example, assembly 100-11 includes conductive paths as discussed previously as well as conductive path 125 (inductor L5), conductive path 126 (inductor L6), conductive path 127 (inductor L7), and conductive path 128 (inductor L8).

[0154] Figure 12 FIG. 1 is a diagram illustrating an example computer architecture that is operable to execute one or more methods in accordance with examples herein.

[0155] In this example, manufacturer 176 is configured to produce / manufacture assembly 100 and / or output any circuit assembly as discussed herein. It should be noted that manufacturer resource 175-1, 175-2, and / or manufacturer resource 176 can be implemented as manufacturer hardware, manufacturer software, or a combination of manufacturer hardware and manufacturer software.

[0156] As shown, computer system 1250 of the present example includes interconnect 1211 coupling computer-readable storage media 1212 (such as a non-transitory medium), which can be any suitable type of hardware storage hardware in which digital information can be stored and retrieved, processor 1213 (computer processor hardware), I / O interface 1214, and communication interface 1217.

[0157] I / O interface 1214 supports connectivity to external resources, such as manufacturer resource 176, storage repository 1280, a keyboard, a display screen, a storage repository, and so on.

[0158] Computer-readable storage media 1212 can be any hardware storage device, such as memory, optical storage, a hard disk drive, a floppy disk, and so on. In one example, computer-readable storage media 1212 stores instructions and / or data.

[0159] As shown, computer-readable storage media 1212 can be encoded with manufacturer application 175-1 (e.g., including instructions) to perform any of the operations discussed herein.

[0160] During operation of one example, processor 1213 accesses computer- readable storage media 1212 via the use of interconnect 1211 in order to launch, run, execute, interpret or otherwise perform the instructions stored in manufacturer application 175-1 stored on computer-readable storage media 1212. The performance of this manufacturer application 175-1 by the processor 1213 produces the manufacturer process 175-2 to execute any of the operations and / or processes discussed herein.

[0161] Those skilled in the art will appreciate that the computer system 1200 can include other processes and / or software and hardware components, such as an operating system to control allocation and use of hardware resources in order to perform operations of the manufacturer application 175-1.

[0162] According to different examples, it should be noted that the computer system can be located in any of various types of devices including, but not limited to, power supplies, switched capacitor converters, power converters, mobile computers, personal computer systems, wireless devices, wireless access points, base stations, telephony devices, desktop computers, laptop computers, notebook computers, netbook computers, mainframe computer systems, handheld computers, workstations, network computers, application servers, storage devices, consumer electronic devices such as cameras, camcorders, set-top boxes, mobile devices, video game consoles, handheld video game devices, peripheral devices such as switches, modems, routers, set-top boxes, content management devices, handheld remote control devices, any type of computing or electronic device. The computer system 1250 can be located at any location or can be included in any suitable resource in any network environment to implement the functionality discussed herein.

[0163] The functionality supported by one or more resources described herein is discussed via flowcharts in Figure 13 The steps in the following flowcharts can be performed in any suitable order.

[0164] Figure 13 is a flowchart 1300 illustrating an example method as discussed herein. It should be noted that there will be some overlap with respect to the concepts discussed above.

[0165] In a process operation 1310, the manufacturer 175 receives a first material 151, such as a non-magnetic permeable material or a material having a low magnetic permeability below a threshold level.

[0166] In a process operation 1320, the manufacturer 175 receives a second material 152. The second material can be a magnetic permeable material.

[0167] In a process operation 1330, the manufacturer 175 manufactures an inductor assembly 100 such that the second material encases the first material.

[0168] In process operation 1340, the manufacturer manufactures the inductor assembly 100 to include: i) the first conductive path 110 extending through the first material, the first material surrounding the first conductive path, ii) the second conductive path 121 extending through the second material, wherein the first portion 152 of the second material surrounds (encloses or surrounds) the second conductive path, and iii) the third conductive path 122 extending through the second material, wherein the second portion of the second material encloses (encloses or surrounds) the third conductive path.

[0169] Figure 14 FIG. 14 is a flow diagram 1400 illustrating an example method in accordance with examples discussed herein. It should be noted that there will be some overlap with respect to the concepts discussed above.

[0170] In operation 1410, the inductor assembly 100 transfers the first current 131 from the power converter 200 on the conductive path 121. As discussed above, the conductive path 121 extends through the material 152 of the inductor assembly 100. The material 152 (magnetic permeable material) encloses the conductive path 121 to create the respective inductor LI. In a similar manner, the inductor assembly 100 can be configured to include multiple conductive paths (inductors) to supply current to the respective load 118.

[0171] In operation 1420, the inductor assembly 100 transfers the second current on the conductive path 110. As discussed above, the conductive path 110 extends through the material 151 of the inductor assembly 100. The conductive path 110 supports the transfer of return current (e.g., combined current 131, current 132, etc.) from the load 118 to a ground reference voltage 199 associated with the power converter 200.

[0172] It should also be noted that the techniques herein are well suited for inductor and power converter applications. However, it should be noted that the examples herein are not limited to use in such applications, and the techniques discussed herein are well suited for other applications as well.

[0173] While the application has been particularly shown and described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes in form and details can be made therein without departing from the spirit and scope of the application as defined by the appended claims. Such changes are intended to fall within the scope of the application. Accordingly, the above description of examples of the application is not intended to be limiting. Rather, any limitations of the application are presented in the accompanying claims.

Claims

1. An inductor assembly comprising: a first material; a first conductive path extending through the first material; a second material, the second material being a magnetic permeable material; and a second conductive path extending through the second material.

2. The inductor assembly of claim 1, wherein the first material encapsulates the first conductive path; and wherein a first portion of the second material encapsulates the first material.

3. The inductor assembly of claim 2, further comprising: a third conductive path extending through the second material; wherein a second portion of the second material encapsulates the first material.

4. The inductor assembly of claim 3, wherein the first conductive path is positioned in the inductor assembly between the second conductive path and the third conductive path.

5. The inductor assembly of claim 1, further comprising: a first surface; a second surface; wherein the first material extends between the first surface and the second surface; and wherein the second material extends between the first surface and the second surface.

6. The inductor assembly of claim 5, wherein the first conductive path extends between the first surface and the second surface; and wherein the second conductive path extends between the first surface and the second surface.

7. The inductor assembly of claim 1, wherein the first material is a magnetic permeable material having a first magnetic permeability; wherein the second material has a second magnetic permeability; and wherein the second magnetic permeability is greater than the first magnetic permeability.

8. The inductor assembly of claim 1, wherein the first material is a non-magnetic permeable material.

9. The inductor assembly of claim 1, further comprising: a third conductive path extending through the second material; a fourth conductive path extending through the second material; a fifth conductive path extending through the second material; wherein the first conductive path is positioned between the second conductive path and the third conductive path; and wherein the first conductive path is positioned between the fourth conductive path and the fifth conductive path.

10. The inductor assembly of claim 9, wherein the first conductive path is positioned at a center of the first material.

11. The inductor assembly of claim 1, further comprising: a third conductive path extending through the first material, the third conductive path being encapsulated by the first material.

12. A circuit assembly comprising the inductor assembly of claim 1, the circuit assembly further comprising: a first switch coupled between a first node of the first conductive path and a first node of the second conductive path; and wherein the first node of the first conductive path and the first node of the second conductive path extend through a first face of the inductor assembly.

13. The circuit assembly of claim 12, further comprising: ​ ​ ​ ​ a second switch coupled between the first node of the second conductive path and an input voltage source; and a controller to control operation of the first and second switches to convert an input voltage to an output voltage.

14. The circuit assembly of claim 13, wherein the controller is to receive a feedback signal indicative of a magnitude of the output voltage output from a second node of the second conductive path.

15. A circuit assembly comprising the inductor assembly of claim 1, the circuit assembly further comprising: a load coupled to receive an output voltage generated by the second conductive path; and a switching circuit arrangement to control current through the second conductive path to produce the output voltage.

16. The apparatus of claim 1, wherein an inductance of the first conductive path is substantially less than the inductance of the second conductive path.

17. An inductor assembly comprising: a first material encapsulating a first conductive path; a second material encapsulating the first material, the second material being a magnetic permeable material; a second conductive path extending through the second material, the second conductive path to transport a first current to power a load; and wherein the first conductive path is a return path to transport the first current received from the load to a reference voltage.

18. The inductor assembly of claim 17, further comprising: a third conductive path extending through the second material, the third conductive path to transport a second current to power the load; and wherein the first conductive path is to transport the second current received from the load to the reference voltage.

19. A method comprising: transporting a first current on a first conductive path extending through a first material of an inductor assembly, the first material encapsulated by a second material of the inductor assembly; and transporting a second current on a second conductive path extending through the second material of the inductor assembly, the second material being a magnetic permeable material.

20. A method of manufacturing an inductor assembly, the method comprising: receiving a first material; receiving a second material, the second material being a magnetic permeable material; and manufacturing the inductor assembly comprises i) a first conductive path extending through the first material, and ii) a second conductive path extending through the second material.

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