Test method and test system for smartphone mainboard

Abstract

The invention belongs to the technical field of intelligent mobile phone hardware testing, and particularly relates to a testing method and system for an intelligent mobile phone mainboard, and the testing method comprises the steps: dividing a mainboard testing task into a plurality of independent sub-testing tasks, and constructing a composite testing scene; distributing each independent sub-test task to different threads for parallel execution based on a multi-core processing architecture, and establishing a real-time data interaction link between the test equipment and the mainboard; mainboard operation parameters and environment response data are collected in real time in the test, data abnormal characteristics are recognized through an intelligent analysis model and an abnormal confidence coefficient calculation formula, and a test strategy is dynamically adjusted according to an analysis result; compared with a traditional static test, the mobile phone mainboard quality evaluation method has the advantages that the fault detection rate is increased, compared with a serial test, the time consumption of the same test content is reduced, and the quality evaluation is quantifiable.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of intelligent mobile phone hardware testing, and particularly relates to a test method and a test system for an intelligent mobile phone mainboard. BACKGROUND

[0002] With the diversification of functions and the continuous improvement of integration of intelligent mobile phones, the performance stability and reliability of the mainboard as a core component directly determine the overall quality of the equipment, but the current testing technology still has significant limitations: traditional testing is mostly carried out in a static environment, with fixed temperature, humidity and no electromagnetic interference setting, which is difficult to simulate the complex scenarios such as high and low temperature alternation, urban dense electromagnetic environment and multi-load switching that users face in actual use, resulting in potential faults such as radio frequency performance attenuation under high temperature and communication interruption caused by electromagnetic interference that cannot be effectively detected, and the single test scene is a prominent problem; at the same time, most of the existing tests are carried out in a serial execution mode, and the detection is carried out in sequence according to the function modules, the test period is long, the test efficiency is low, and the quality evaluation stage of the test mostly depends on the experience of the test personnel, lacks a standardized quantitative scoring system, and the consistency of the determination results of different batches or different test personnel is poor, the subjective evaluation method cannot realize the accurate grading of the quality, and is not conducive to the tracing and improvement of the problems, which seriously affects the scientificity and standardization of the quality control of the mainboard. SUMMARY

[0003] In view of the above deficiencies in the prior art, the application provides a test method and a test system for an intelligent mobile phone mainboard to solve the problems in the background art.

[0004] In order to solve the above technical problems, the application adopts the following technical solutions: A test method for an intelligent mobile phone mainboard, comprising the following steps: Step S1, according to the preset test requirements of the mobile phone mainboard, the test task of the mobile phone mainboard is divided into multiple independent sub-test tasks, and a composite test scene simulating the actual use environment of the mobile phone mainboard is constructed; Step S2, based on the multi-core processing architecture, the independent sub-test tasks are distributed to different threads for parallel execution, and a real-time data interaction link between the test equipment and the mobile phone mainboard is established, and a time synchronization mechanism is used to ensure the time consistency of data acquisition; Step S3, in the test process, the running parameters of the mainboard and the environmental response data are collected in real time, the intelligent analysis model and the abnormal confidence calculation formula are used to identify the abnormal characteristics of the data, and the test strategy is dynamically adjusted according to the analysis result; Step S4, the test data of each thread is summarized, the quality of the mobile phone mainboard is evaluated based on the comprehensive scoring formula and the multi-level judgment standard, and a quality evaluation report is generated.

[0005] Further, step S1 comprises the following steps: Step S101, according to the function of the mobile phone mainboard, the mobile phone mainboard test task is divided into five independent sub-test tasks, which are communication function test, radio frequency performance test, power management test, storage interaction test and interface compatibility test; Step S102, the basic environment of the composite test simulation field is constructed, and the basic environment is temperature 25±2℃, humidity 50±5%RH, electromagnetic shielding degree≥80dB; Step S103, superimpose dynamic interference factors on the basic environment to form a complete composite test simulation scene, which specifically includes: Temperature dynamic simulation, the temperature is changed in the range of-10℃ to 45℃ at a rate of 3℃ / min; Electromagnetic interference simulation, superimpose multi-band interference signals covering 800MHz-6GHz, signal strength dynamically switches in the range of-80dBm to-40dBm, simulate the city dense electromagnetic environment; Load dynamic simulation, cycle switch according to the sequence of standby→call→game, the standby is 5% load, the call is 30% load, and the game is 100% load.

[0006] Further, step S2 includes the following steps: Step S201, based on the multi-core processing architecture, the communication function test, the radio frequency performance test, the power management test, the storage interaction test and the interface compatibility test divided in step S101 are allocated to five independent threads, wherein five cores of the multi-core processor are used for parallel execution of test tasks, and one core is specially responsible for thread scheduling and resource coordination; Step S202, a bidirectional data interaction link between the test equipment and the mobile phone mainboard is established through a high-speed communication interface with a transmission rate of≥1Gbps, and the high-speed communication interface integrates an anti-interference filter module to adapt to the composite test simulation field of step S103; Step S203, each thread executes each independent sub-test task in parallel according to a preset process; Step S204, the data acquisition time of each thread is controlled through a timestamp synchronization mechanism, and the synchronization error is≤±1ms.

[0007] Further, the step S203 includes: The communication function test thread simulates a multi-network environment through a virtual base station, and cyclically executes "frequency band switching-signal transmission-index calculation", switches the frequency band every 10 cycles, and the test indexes include call success rate, call drop rate and transmission rate; The radio frequency performance test thread samples at an interval of 10ms for WiFi and Bluetooth modules, and the test indexes include transmit power, receive sensitivity and adjacent channel rejection ratio; Power management test thread, simulating multi-load scenarios, test indicators include voltage ripple, load regulation and over-current protection response time; Storage interaction test thread, through the protocol interface, cyclically executing "read-write-verify-erase" operation, test indicators include continuous read-write speed, random access delay and data integrity; Interface compatibility test thread, for various physical interfaces, cyclically executing "connect-transmit-reconnect" operation, test indicators include connection success rate, data transmission error rate and protocol adaptability.

[0008] Further, step S3 comprises the following steps: Step S301, real-time acquisition of mainboard running parameters and environmental response data through the sensor array, sampling frequency is 1 kHz, the running parameters include core voltage, working current, radio frequency signal strength, surface temperature, the environmental response data include real-time temperature of composite test simulation field, electromagnetic interference signal strength, load state value; Step S302, input the collected mainboard running parameters and environmental response data into the intelligent analysis model, the intelligent analysis model adopts random forest algorithm, trained by at least 5000 groups of historical fault data, uses abnormal confidence calculation formula to identify abnormal data, the abnormal confidence calculation formula is , is the abnormal confidence, the value range of is 0-1, when ≥0.8, it is judged as abnormal, is the total number of collected parameters, is the parameter level weight, when testing communication function related parameters the value is 0.3, when testing radio frequency performance related parameters the value is 0.25, when testing power management related parameters the value is 0.2, when testing storage interaction related parameters the value is 0.15, when testing interface compatibility related parameters the value is 0.1, is the measured value, is the reference value, is the time decay coefficient, the value range of is 0.1-0.5, used to suppress the influence of instantaneous interference on abnormal judgment, for the long-term stable parameters of core voltage, storage read-write speed, the value range is 0.1-0.2, for the easily disturbed parameters of radio frequency signal strength, electromagnetic interference response, the value range is 0.3-0.5, is the number of continuous normal sampling times; Step S303, when ≥0.8 and for three consecutive times, the corresponding independent sub-test task priority is raised and a special test is started, the sample size is increased to three times the original sample size, and the abnormal characteristic parameters are recorded simultaneously. When a suspected false welding feature is identified, a 5Hz low-frequency vibration test is triggered, and the sampling frequency is simultaneously increased from 1kHz to 2kHz. The parameter fluctuation characteristics during vibration are continuously recorded. The false welding feature refers to a phenomenon that the parameter jump amplitude is ≥10% and the surface temperature rises suddenly during data monitoring.

[0009] Further, the special test includes performing extreme environmental parameter test, long-time stability test and fault mode verification test on the identified abnormal characteristics for the corresponding independent sub-test task.

[0010] Further, the original sample size is set according to the type of independent sub-test task as follows: 100 cycles of communication function test, 200 sampling periods of radio frequency performance test, 50 load switching of power management test, 100 read-write cycles of storage interaction test, and 50 connection cycles of interface compatibility test.

[0011] Further, step S4 includes the following steps: Step S401, aggregate thread test data, including regular test results, special test results, abnormal parameter records and dynamic adjustment records, to form a standardized data set; Step S402, calculate the mainboard quality comprehensive score S based on the comprehensive score formula; Step S403, perform multi-level quality determination according to the mainboard quality comprehensive score S, and the determination standard is: when S≥0.95, it is first-class qualified, when 0.9≤S<0.95, it is second-class qualified, and when S<0.9, it is unqualified; Step S404, generate a quality evaluation report containing the comprehensive score, quality level and abnormal feature record.

[0012] Further, the comprehensive score formula in step S402 is , wherein, is the comprehensive score, The value range of is 0-1, to 5 correspond to five independent sub-test tasks, is the independent sub-test task weight, the weight of communication function test is The value of is 0.3, the weight of radio frequency performance test is The value of is 0.25, the weight of power management test is The value of is 0.2, the weight of storage interaction test is The value of is 0.15, and the weight of interface compatibility test is The value of is 0.1. the number of parameters for the

[0013] The application discloses a test system for a smartphone mainboard, which is used for realizing the test method in any one of claims 1-9, and comprises the following modules. A task splitting and scene construction module is used for splitting the smartphone mainboard test task according to the functions of the smartphone mainboard into five independent sub-test tasks of communication function test, radio frequency performance test, power management test, storage interaction test and interface compatibility test, and constructing a composite test scene simulating the actual use environment of the smartphone mainboard. A parallel execution and data interaction module is used for distributing the independent sub-test tasks to different threads for parallel execution based on a multi-core processing architecture, establishing a real-time data interaction link between the test equipment and the smartphone mainboard, and adopting a time synchronization mechanism to ensure the time consistency of data collection. A data collection and analysis module is used for collecting the mainboard running parameters and environment response data in real time, identifying the data abnormal features by using an intelligent analysis model and an abnormal confidence calculation formula, and dynamically adjusting the test strategy according to the analysis result. A result evaluation and report generation module is used for summarizing the test data of the threads, evaluating the quality of the smartphone mainboard based on a comprehensive scoring formula and multi-level judgment standards, and generating a quality evaluation report.

[0014] Compared with the prior art, the application has the following beneficial effects: 1. By constructing a composite test scene of basic environment and dynamic interference, simulating temperature cycle, multi-band electromagnetic interference and real load switching, the hidden faults of the mainboard in extreme environment and complex use scene can be fully exposed, and the fault detection rate is improved compared with the traditional static test. 2. The test task is split into five independent sub-test tasks of communication function test, radio frequency performance test, power management test, storage interaction test and interface compatibility test, and is distributed to five cores of a multi-core processor for parallel execution, and one core is specially responsible for scheduling, so that the test period is greatly shortened, the time consumption of the same test content is reduced compared with the serial test, and the efficient detection demand in the mass production scene can be met. 3. Based on the random forest model trained based on more than 5000 groups of historical fault data, combined with the quantitative abnormal confidence calculation formula, the instantaneous interference and the real abnormality can be effectively distinguished, the abnormal recognition accuracy is improved, the comprehensive scoring formula is used for comprehensively scoring the test results of each functional module, the three-level quality judgment standard is used, the subjective experience judgment is replaced, and the quality evaluation provides a quantifiable scientific basis. BRIEF DESCRIPTION OF DRAWINGS

[0015] ​​​Figure 1 Flowchart of the present application; Figure 2 Flowchart of the present application; Figure 1 Detailed step flowchart of step S1 in the present application; Figure 3 Flowchart of the present application; Figure 1 Detailed step flowchart of step S2 in the present application; Figure 4 Flowchart of the present application; Figure 1 Detailed step flowchart of step S3 in the present application; Figure 5 Flowchart of the present application; Figure 1 Detailed step flowchart of step S4 in the present application; Figure 6 Composition diagram of the test system for the mainboard of the smart phone. DETAILED DESCRIPTION

[0016] In order for those skilled in the art to better understand the present application, the technical solutions of the present application are further described below in conjunction with the accompanying drawings and examples.

[0017] Among them, the drawings are only used for example explanation, and the representation is only a schematic diagram, not a physical diagram, and cannot be understood as a limitation on the present patent; in order to better illustrate the embodiments of the present application, some components in the drawings will be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some known structures and their descriptions in the drawings can be omitted.

[0018] The same or similar reference numerals in the drawings of the embodiments of the present application correspond to the same or similar components; in the description of the present application, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer" and the like indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the positional relationship in the drawings are only used for example explanation, and cannot be understood as a limitation on the present patent, for those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0019] In the description of the present application, unless otherwise explicitly specified and limited, if the term "connection" and the like indicating the connection relationship between components appears, the term should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two components. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0020] Embodiment one: As Figures 1-5 shown, a test method for a smartphone mainboard, comprising the following steps: Step S1, according to the preset test requirements of the mobile phone mainboard, the test task of the mobile phone mainboard is divided into multiple independent sub-test tasks, and a composite test scene simulating the actual use environment of the mobile phone mainboard is constructed; Step S2, based on the multi-core processing architecture, each independent sub-test task is allocated to different threads for parallel execution, and a real-time data interaction link between the test equipment and the mobile phone mainboard is established, and a time synchronization mechanism is used to ensure the time consistency of data acquisition; Step S3, in the test process, the mainboard running parameters and environmental response data are collected in real time, the abnormal characteristics of the data are identified by using the intelligent analysis model and the abnormal confidence calculation formula, and the test strategy is dynamically adjusted according to the analysis result; Step S4, the test data of each thread is summarized, the quality of the mobile phone mainboard is evaluated based on the comprehensive scoring formula and the multi-level judgment standard, and the quality evaluation report is generated.

[0021] The present application adopts task splitting and multi-core parallel architecture as a whole, splits the mainboard test task into independent sub-test tasks according to the function module and allocates it to different threads for synchronous execution, greatly shortens the test period, solves the pain point of low efficiency of traditional serial test, constructs a composite test scene, simulates the complex environment in the actual use of the mainboard, compared with single static environment test, can more fully expose potential faults, improves the authenticity and comprehensiveness of the test, the intelligent analysis model and the quantitative abnormal confidence calculation formula, combined with the dynamic adjustment strategy, realizes the accurate identification of subtle abnormalities, avoids the problem of missed detection or misjudgment in traditional test, and realizes the quality quantitative evaluation by comprehensive scoring and report generation, provides a comprehensive and scientific basis for mainboard quality judgment.

[0022] Step S1 includes the following steps: Step S101, according to the function of the mobile phone mainboard, the test task of the mobile phone mainboard is divided into 5 independent sub-test tasks, which are communication function test, radio frequency performance test, power management test, storage interaction test and interface compatibility test; Step S102, construct the basic environment of the composite test simulation field, the basic environment is temperature 25±2℃, humidity 50±5%RH, electromagnetic shielding degree≥80dB; Step S103, superimpose dynamic interference factors on the basic environment to form a complete composite test simulation scene, which specifically includes: Temperature dynamic simulation, the temperature changes in the range of-10℃ to 45℃ at a rate of 3℃ / min; Electromagnetic interference simulation, superimposed multi-band interference signals covering 800MHz-6GHz, signal strength dynamically switches in the range of-80dBm to-40dBm, simulating the dense city electromagnetic environment; Load dynamic simulation, cycle switching according to the sequence of standby→call→game, the standby is 5% load, the call is 30% load, and the game is 100% load.

[0023] In the embodiments, five independent sub-test tasks of communication function test, radio frequency performance test, power management test, storage interaction test and interface compatibility test comprehensively cover the core functions of the motherboard, ensure that there is no omission in the test, provide a stable benchmark for the basic environment, reduce the interference of environmental fluctuations on the initial test, simulate extreme temperature, complex electromagnetic environment and real use load changes, can fully expose the potential problems of the motherboard under different severe conditions, and improve the comprehensiveness and severity of the test.

[0024] The step S2 comprises the following steps: Step S201, based on the multi-core processing architecture, the communication function test, the radio frequency performance test, the power management test, the storage interaction test and the interface compatibility test divided in step S101 are allocated to five independent threads, wherein five cores of the multi-core processor are used to execute the test tasks in parallel, and one core is specially responsible for thread scheduling and resource coordination; Step S202, a bidirectional data interaction link between the test equipment and the motherboard of the mobile phone is established through a high-speed communication interface with a transmission rate of ≥1Gbps, and an anti-interference filter module is integrated in the high-speed communication interface to adapt to the composite test simulation field of step S103; Step S203, each thread executes each independent sub-test task in parallel according to a preset process: The communication function test thread simulates a multi-network environment through a virtual base station, and cyclically executes "frequency band switching-signal transmission-receiving-index calculation", switches the frequency band every 10 cycles, and the test indexes include call success rate, call drop rate and transmission rate; The radio frequency performance test thread samples at an interval of 10ms for WiFi and Bluetooth modules, and the test indexes include transmit power, receive sensitivity and adjacent channel rejection ratio; The power management test thread simulates a multi-load scenario, and the test indexes include voltage ripple, load regulation rate and overcurrent protection response time; The storage interaction test thread cyclically executes "read-write-verification-erase" operations through a protocol interface, and the test indexes include continuous read-write speed, random access delay and data integrity; The interface compatibility test thread cyclically executes "connection-transmission-reconnection" operations for various physical interfaces, and the test indexes include connection success rate, data transmission error rate and protocol adaptability; Step S204: Control the data acquisition time of each thread through a timestamp synchronization mechanism, with a synchronization error ≤ ±1ms.

[0025] In this implementation, multi-core processing and scheduling improve the parallel efficiency of test tasks and reduce overall test time. High-speed communication interfaces ensure rapid transmission of large amounts of test data, anti-interference modules ensure stable data interaction in complex environments, and each thread is designed with a specific test process for a particular functional module. Test indicators are aligned with the core performance of the function to ensure test accuracy. The timestamp synchronization mechanism keeps the error within an extremely low range, ensuring the time consistency of data collected by multiple threads and providing a reliable foundation for subsequent data analysis.

[0026] Step S3 includes the following steps: Step S301: The motherboard operating parameters and environmental response data are collected in real time through a sensor array at a sampling frequency of 1kHz. The operating parameters include core voltage, operating current, radio frequency signal strength, and surface temperature. The environmental response data includes real-time temperature of the composite test simulation field, electromagnetic interference signal strength, and load status value. Step S302: Input the collected motherboard operating parameters and environmental response data into the intelligent analysis model. The intelligent analysis model adopts the random forest algorithm, is trained with at least 5000 sets of historical fault data, and identifies abnormal data using an anomaly confidence calculation formula. The anomaly confidence calculation formula is as follows: , For abnormal confidence levels, The value range is 0-1, when A value ≥0.8 is considered abnormal. This represents the total number of parameters collected. As parameter-level weights, when testing parameters related to communication functions. A value of 0.3 is used when testing RF performance-related parameters. The value is 0.25 when testing power management related parameters. The value is 0.2 when testing storage interaction-related parameters. The value is 0.15 when testing interface compatibility-related parameters. The value is 0.1. These are measured values. For reference only. The time decay coefficient, The value range is 0.1-0.5. Used to suppress the impact of transient interference on anomaly detection The long-term stable parameters for core voltage and memory read / write speed range from 0.1 to 0.2. The range of values ​​for the environmental interference susceptibility parameters of radio frequency signal strength and electromagnetic interference response is 0.3-0.5. is the normal sampling frequency, and n is the normal sampling number. Step S303, when ≥0.8 and for 3 consecutive times, the priority of the corresponding independent sub-test task is raised, and the special test is started, the sample size is increased to 3 times of the original sample size, and the abnormal characteristic parameters are recorded synchronously, when the suspected false soldering feature is identified, the 5Hz low-frequency vibration test is triggered, the sampling frequency is raised from 1kHz to 2kHz synchronously, and the parameter fluctuation characteristics in the vibration process are recorded continuously. The special test includes extreme environmental parameter test, long-time stability test and fault mode verification test performed on the mainboard function module involved in the corresponding independent sub-test task for the identified abnormal characteristics. The original sample size is set according to the independent sub-test task type as follows: 100 cycles of communication function test, 200 sampling periods of radio frequency performance test, 50 load switching of power management test, 100 read-write cycles of storage interaction test, and 50 connection cycles of interface compatibility test. The false soldering feature refers to the phenomenon that the parameter jump amplitude is greater than or equal to 10% and the surface temperature rises suddenly in the data monitoring process.

[0027] In the embodiment, 1kHz high-frequency sampling can capture subtle parameter changes, ensure complete data details, and the random forest model trained by a large amount of historical data improves the accuracy of abnormal recognition. The abnormal confidence formula realizes the objectivity and standardization of abnormal judgment through weight distribution and quantitative calculation, and the dynamic adjustment test strategy of raising the priority, increasing the sample size and triggering the special test can focus on the problem points for in-depth verification. Especially for the vibration test design of hidden faults such as false soldering, it can effectively improve the fault detection rate.

[0028] Step S4 includes the following steps: Step S401, the test data of each thread is summarized, including the results of regular test, special test, abnormal parameter record and dynamic adjustment record, to form a standardized data set; Step S402, the mainboard quality comprehensive score S is calculated based on the comprehensive score formula, and the comprehensive score formula is wherein, is the comprehensive score, the value range of is 0-1, to 5 correspond to five independent sub-test tasks, is the independent sub-test task weight, the weight of the communication function test is 0.3, the weight of the radio frequency performance test is 0.25, the weight of the power management test is 0.2, the weight of the storage interaction test is 0.15, and the weight of the interface compatibility test is value is 0.1, is the number of parameters of the th independent sub-test task, is the measured value, is the reference value; Step S403, according to the mainboard quality comprehensive score S, multi-level quality judgment is executed, the judgment standard is: when S≥0.95, it is first-class qualified, when 0.9≤S<0.95, it is second-class qualified, and when S<0.9, it is unqualified; Step S404, a quality evaluation report is generated, including the comprehensive score, quality level and abnormal feature record report.

[0029] In the embodiments, the standardized data set facilitates data comparison and analysis, the comprehensive score formula realizes quality quantitative evaluation, the multi-level judgment standard clearly distinguishes the mainboard quality level, the detailed report provides clear basis for production improvement and quality traceability, and the scientificity of quality control is improved.

[0030] As shown in Figure 6 , a test system for a smartphone mainboard is used to implement the test method of any one of claims 1-9, comprising the following modules: Task splitting and scene construction module, for splitting the smartphone mainboard test task into five independent sub-test tasks of communication function test, radio frequency performance test, power management test, storage interaction test and interface compatibility test according to the functions of the smartphone mainboard, and constructing a composite test scene simulating the actual use environment of the smartphone mainboard; Parallel execution and data interaction module, based on a multi-core processing architecture, each independent sub-test task is distributed to different threads for parallel execution, and a real-time data interaction link between the test equipment and the smartphone mainboard is established, and a time synchronization mechanism is used to ensure the time consistency of data collection; Data acquisition and analysis module, for real-time acquisition of mainboard running parameters and environmental response data, identification of data abnormal features by using intelligent analysis model and abnormal confidence calculation formula, and dynamic adjustment of test strategy according to the analysis results; Result evaluation and report generation module, for summarizing the test data of each thread, evaluating the quality of the smartphone mainboard based on the comprehensive score formula and the multi-level judgment standard, and generating a quality evaluation report.

[0031] In the embodiments, each module has clear division of labor and cooperative cooperation, realizes the automation and intelligentization of the whole process of mainboard test, the task splitting and scene construction module guarantees the pertinence and authenticity of the test, the parallel execution module improves the efficiency, the data acquisition and analysis module improves the accuracy of abnormal identification, the result evaluation module realizes the quality quantification and visualization, and the whole system ensures the efficient landing of the test method, and significantly improves the reliability and standardization of the test of the smartphone mainboard.

[0032] The method and the system are based on the same application concept, and the implementation of the method and the system can be referred to each other because the principles of the method and the system for solving problems are similar, and the repeated parts will not be described again.

[0033] In order to make the technical solutions of the present application clearer, the working process will be described in detail below by taking a certain model of 5G smartphone mainboard as the test object, which includes a Dimensity 9300 processor, a 5G integrated baseband, a WiFi 6E module, a UFS 4.0 storage chip, and a PMIC power management chip.

[0034] Task splitting and scenario building: The test task of the mainboard to be tested is split into the following according to the function modules of the mainboard: Communication function test, verifying 2G / 3G / 4G / 5G multi-network environment; Radio frequency performance test, detecting WiFi and Bluetooth signal parameters; Power management test, evaluating voltage stability and load response; Storage interaction test, testing UFS read / write speed and reliability; Interface compatibility test, verifying USB-C and SIM card interface functions; Build a composite scenario, the basic environment temperature is 25℃, the humidity is 50%RH, the electromagnetic shielding degree is 82dB, the temperature of the dynamic interference environment increases from -10℃ to 45℃ at a rate of 3℃ / min, the 1.8GHz frequency band interference signal is superimposed, the electromagnetic interference strength gradually increases from -80dBm to -50dBm, and the load dynamic simulation is in standby→call→game cycle, each state lasts for 5 minutes.

[0035] Parallel execution and data interaction: Based on a 6-core processor, 5 cores respectively execute test communication function test, radio frequency performance test, power management test, storage interaction test, and interface compatibility test, and 1 core schedules and coordinates; Bidirectional communication between the test host and the mainboard is realized through a PCIe3.0x4 special interface, and the interface integrates a 10Hz-1GHz anti-interference filter module to adapt to the electromagnetic interference environment.

[0036] Sub-test task execution, at the 10th minute, the measured data of the communication function test thread: through a virtual base station to simulate a 5G network, execute the 30th "frequency band switching-signal transceiver-index calculation" cycle, the current frequency band is 3.5GHz, the call success rate is 99%, the call drop rate is 1%, and the transmission rate is 900Mbps.

[0037] Radio frequency performance test thread: for the WiFi 5GHz module, sampling at 10ms intervals, the current transmission power is 22dBm, the receiving sensitivity is -92dBm, and the adjacent channel rejection ratio is 45dB.

[0038] Power management test thread: simulate 100% load scenario, voltage ripple 45mV, load regulation 1.8%, overcurrent protection response time 90μs.

[0039] Storage interaction test thread: execute the 50th "read-write-verify-erase" cycle through the UFS protocol interface, continuous read-write speed 1600MB / s, random access delay 8ms.

[0040] Interface compatibility test thread: execute the 20th "connect-transmit-reconnect" cycle for the USB-C interface, connection success rate 100%, data transmission error rate 0 Control the data acquisition time of each thread through the timestamp synchronization mechanism, and the synchronization error is measured as ±0.8ms.

[0041] Data acquisition and anomaly identification: Sample data at the 10th minute, collect 3 operating parameters and 1 environmental response data at a sampling frequency of 1kHz: Select core voltage, working current, radio frequency signal strength, and electromagnetic interference strength for calculation, so the total number of collected parameters =4 Continuous normal sampling times : all 5 times Use the anomaly confidence calculation formula Step calculation shows that the core voltage is about 0.001; the working current 1.2A is within the range of 0.5A-2.0A without deviation, with a contribution value of 0; the radio frequency signal strength is about 0.0046; and the electromagnetic interference strength is about 0.0056; Therefore, the overall total anomaly confidence is 0.001+0.0046+0+0.0056=0.0112, so <0.8, it is determined to be normal, the original test strategy is maintained, the sampling frequency is kept at 1kHz, and the test sample size is executed according to the original setting.

[0042] Quality evaluation and report generation: Summarize the data, the results of the regular test: 5 sub-test tasks are completed with the preset sample size, and the parameter qualification rates are respectively 98.5% for communication function test, 97% for radio frequency performance test, 99% for power management test, 100% for storage interaction test, and 99.5% for interface compatibility test; Independent sub-test task weight, the The weight of the communication function independent sub-test task is 0.3, the weight of the radio frequency performance independent sub-test task is 0.25, the weight of the power management independent sub-test task is 0.2, the weight of the storage interaction independent sub-test task is 0.15, and the weight of the interface compatibility independent sub-test task is 0.1; The number of parameters of each independent sub-test task is 3; The comprehensive score formula is adopted Step-by-step calculation shows that the communication function test: the average score is 0.985, and the weighted score is 0.3x0.985=0.2955 The radio frequency performance test: the average score is 0.97, and the weighted score is 0.25x0.97=0.2425 The power management test: the average score is 0.99, and the weighted score is 0.2x0.99=0.198 The storage interaction test: the average score is 1.0, and the weighted score is 0.15x1.0=0.15 The interface compatibility test: the average score is 0.995, and the weighted score is 0.1x0.995=0.0995 The comprehensive score: S=0.2955+0.2425+0.198+0.15+0.0995=0.9855 0.9855≥0.95, and it is determined to be first-class qualified.

[0043] The evaluation report is generated, the mainboard is first-class qualified, the storage performance is better than the design standard, the power stability is good, there is no abnormal record, and it can directly enter the assembly link.

[0044] Although the embodiments of the present application have been shown and described, it can be understood by those of ordinary skill in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

[0045] The above is only an embodiment of the present application, and relates to circuits and electronic components and modules, which are all prior art. Those skilled in the art can implement the present application without further description. The present application does not involve improvement of software and methods. Commonly known specific structures and characteristics in the scheme are not described in detail herein. Those skilled in the art know all common technical knowledge in the field of the present application before the filing date or the priority date, can know all prior art in the field, and have the ability to apply conventional experimental means before the date. Those skilled in the art can perfect and implement the present scheme based on their own ability under the guidance of the present application. Some typical known structures or known methods should not be an obstacle for those skilled in the art to implement the present application. It should be pointed out that, for those skilled in the art, a number of modifications and improvements can be made without departing from the structure of the present application. These should also be considered as the protection scope of the present application, and these will not affect the implementation effect and practicality of the patent.

Claims

1. A testing method for a smartphone motherboard, characterized in that, The method comprises the following steps: Step S1, according to the preset test requirements of the mobile phone mainboard, the test task of the mobile phone mainboard is divided into multiple independent sub-test tasks, and a composite test scene simulating the actual use environment of the mobile phone mainboard is constructed; Step S2, based on the multi-core processing architecture, each independent sub-test task is allocated to different threads for parallel execution, and a real-time data interaction link between the test equipment and the mobile phone mainboard is established, and a time synchronization mechanism is used to ensure the time consistency of data acquisition; Step S3, in the test process, the running parameters of the mainboard and the environmental response data are collected in real time, the intelligent analysis model and the abnormal confidence calculation formula are used to identify the abnormal characteristics of the data, and the test strategy is dynamically adjusted according to the analysis result; Step S4, the test data of each thread is summarized, the quality of the mobile phone mainboard is evaluated based on the comprehensive scoring formula and the multi-level judgment standard, and a quality evaluation report is generated.

2. The method for testing a main board of a smart phone according to claim 1, wherein, Step S1 comprises the following steps: Step S101, according to the function of the mobile phone mainboard, the test task of the mobile phone mainboard is divided into five independent sub-test tasks, which are communication function test, radio frequency performance test, power management test, storage interaction test and interface compatibility test; Step S102, the basic environment of the composite test simulation field is constructed, and the basic environment is temperature 25±2℃, humidity 50±5%RH, and electromagnetic shielding degree≥80dB; Step S103, superimpose dynamic interference factors on the basic environment to form a complete composite test simulation scene, which specifically includes: Temperature dynamic simulation, the temperature is cyclically changed at a rate of 3℃ / min in the range of-10℃ to 45℃; Electromagnetic interference simulation, superimpose multi-frequency band interference signals covering 800MHz-6GHz, signal strength dynamically switches in the range of-80dBm to-40dBm, simulating the city dense electromagnetic environment; Load dynamic simulation, cycle switching according to the sequence of standby→call→game.

3. The method of claim 2, wherein the method further comprises: Step S2 comprises the following steps: Step S201, based on the multi-core processing architecture, the communication function test, the radio frequency performance test, the power management test, the storage interaction test and the interface compatibility test divided in step S101 are allocated to five independent threads, wherein five cores of the multi-core processor are used for parallel execution of the test tasks, and one core is specially responsible for thread scheduling and resource coordination; Step S202, a bidirectional data interaction link between the test equipment and the mobile phone mainboard is established through a high-speed communication interface with a transmission rate of≥1Gbps, and the high-speed communication interface integrates an anti-interference filter module to adapt to the composite test simulation field of step S103; Step S203, each thread executes each independent sub-test task in parallel according to the preset process; Step S204, the data acquisition time of each thread is controlled through a timestamp synchronization mechanism, and the synchronization error is≤±1ms.

4. The method for testing a main board of a smart phone according to claim 3, wherein, The step S203 comprises: The communication function test thread simulates a multi-network environment through a virtual base station, and cyclically executes "frequency band switching-signal transmission-index calculation", switches the frequency band every 10 cycles, and the test indexes include call success rate, call drop rate and transmission rate; The radio frequency performance test thread samples at an interval of 10ms for WiFi and Bluetooth modules, and the test indexes include transmit power, receive sensitivity and adjacent channel rejection ratio; Power management test thread, simulating multi-load scenarios, test indicators include voltage ripple, load regulation and over-current protection response time; Storage interaction test thread, through the protocol interface, cyclically execute "read-write-verify-erase" operation, test indicators include continuous read-write speed, random access delay and data integrity; Interface compatibility test thread, for all kinds of physical interface, cyclically execute "connect-transmit-reconnect" operation, test indicators include connection success rate, data transmission error rate and protocol adaptability.

5. The method for testing a smartphone mainboard of claim 1, wherein, Step S3 includes the following steps: Step S301, real-time acquisition of mainboard running parameters and environmental response data, sampling frequency is 1 kHz, the running parameters include core voltage, working current, radio frequency signal strength, surface temperature, the environmental response data include real-time temperature of composite test simulation field, electromagnetic interference signal strength, load state value; Step S302, input the collected mainboard running parameters and environment response data into the intelligent analysis model, the intelligent analysis model adopts random forest algorithm, is trained through at least 5000 groups of historical fault data, adopts an abnormal confidence calculation formula to identify abnormal data, the abnormal confidence calculation formula is , is the abnormal confidence, The value range of is 0-1, when ≥0.8, it is judged to be abnormal, It is the total number of collected parameters, It is the parameter level weight, It is the measured value, It is the reference value, It is the time attenuation coefficient, The value range of is 0.1-0.5, It is used to suppress the influence of instantaneous interference on abnormal determination, It is the number of continuous normal sampling times; Step S303, when ≥ 0.8 and for 3 consecutive times, the priority of the corresponding independent sub-test task is raised and the special test is started, the sample size is increased to 3 times of the original sample size, and the abnormal characteristic parameters are recorded simultaneously. When the suspected false welding feature is identified, the 5Hz low-frequency vibration test is triggered, the sampling frequency is simultaneously increased from 1kHz to 2kHz, and the parameter fluctuation characteristics during vibration are continuously recorded.

6. The method for testing a smartphone motherboard as claimed in claim 5, wherein, The special test includes performing extreme environmental parameter test, long-time stability test and fault mode verification test on the corresponding independent sub-test task according to the identified abnormal features.

7. The method of claim 5, wherein the method further comprises: The original sample size is set according to the type of independent sub-test task: 100 cycles of communication function test, 200 sampling periods of radio frequency performance test, 50 load switches of power management test, 100 read-write cycles of storage interaction test, and 50 connection cycles of interface compatibility test.

8. The method of claim 1, wherein the method further comprises: Step S4 includes the following steps: Step S401, aggregate thread test data, including regular test results, special test results, abnormal parameter records and dynamic adjustment records, to form a standardized data set; Step S402, calculate the mainboard quality comprehensive score S based on the comprehensive score formula; Step S403, perform multi-level quality judgment according to the mainboard quality comprehensive score S, the judgment standard is: when S≥0.95, it is first-class qualified, when 0.9≤S<0.95, it is second-class qualified, and when S<0.9, it is unqualified; Step S404, generate a quality evaluation report containing comprehensive score, quality level and abnormal feature record.

9. The method of claim 8, wherein the method further comprises: The comprehensive score formula in step S402 is wherein, is the comprehensive score, the value range of is 0-1, corresponds to five independent sub-test tasks, is the independent sub-test task weight, is the parameter number of the th independent sub-test task, is the measured value, is the reference value.

10. A test system for a smartphone motherboard for implementing the test method of any one of claims 1-9, characterized in that, It includes the following modules: Task splitting and scene construction module, for splitting the mobile phone mainboard test task into five independent sub-test tasks of communication function test, radio frequency performance test, power management test, storage interaction test and interface compatibility test according to the function of mobile phone mainboard, and constructing a composite test scene simulating the actual use environment of mobile phone mainboard; Parallel execution and data interaction module, based on multi-core processing architecture, distribute each independent sub-test task to different threads for parallel execution, and establish real-time data interaction link between test equipment and mobile phone mainboard, and use time synchronization mechanism to ensure the time consistency of data acquisition; Data acquisition and analysis module, for real-time acquisition of mainboard running parameters and environmental response data, identifying data abnormal features by using intelligent analysis model and abnormal confidence calculation formula, and dynamically adjusting test strategy according to the analysis result; Result evaluation and report generation module, for aggregating thread test data, evaluating the quality of mobile phone mainboard based on the comprehensive score formula and multi-level judgment standard, and generating a quality evaluation report.

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