Heat dissipation device, electronic equipment and manufacturing method of heat dissipation device

Abstract

The embodiment of the invention discloses a heat dissipation device, electronic equipment and a manufacturing method of the heat dissipation device. The heat dissipation device comprises a body which comprises an accommodating cavity; the first target piece is arranged in the accommodating cavity and divides the accommodating cavity into a first area and a second area; the first medium is arranged in the containing cavity, and the first medium can be switched from a liquid state to a gaseous state; the first medium can move between the first area and the second area through the first target piece; the second medium is arranged in the second area, the second medium is in a liquid state, the second medium is formed by a third medium and a first medium in a liquid state, the first target piece is used for limiting the third medium in the second area, and the second target piece is used for limiting the second medium in the second area. The amount of the second medium in the second area unit space is larger than the amount of the liquid first medium in the first area unit space.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of heat dissipation, and in particular, to a heat dissipation device, an electronic device, and a manufacturing method of the heat dissipation device. BACKGROUND

[0002] The heat dissipation structure is a device frequently used by electronic devices; in the related art, the stability of the heat dissipation structure for heat dissipation of the electronic device is poor. SUMMARY

[0003] In view of this, the embodiments of the present disclosure aim to provide a heat dissipation device, an electronic device, and a manufacturing method of the heat dissipation device.

[0004] To achieve the above object, the technical solutions of the present disclosure are as follows:

[0005] The embodiments of the present disclosure provide a heat dissipation device, comprising:

[0006] a body comprising a containing cavity;

[0007] a first target piece arranged in the containing cavity and separating the containing cavity into a first region and a second region;

[0008] a first medium arranged in the containing cavity, the first medium being capable of switching from a liquid state to a gaseous state; the first medium being capable of moving between the first region and the second region through the first target piece;

[0009] a second medium arranged in the second region, the second medium being in a liquid state, the second medium being formed by a third medium and the first medium in a liquid state, the first target piece being used to restrict the third medium in the second region, in the case that the first medium in a liquid state in the second medium switches from a liquid state to a gaseous state, the second medium being converted into the first medium in a gaseous state and the third medium;

[0010] The amount of the second medium in the second region per unit space is greater than the amount of the first medium in a liquid state in the first region per unit space. BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.

[0012] Figure 1 An optional partial structure sectional view of the heat dissipation device provided by the embodiments of the present disclosure;

[0013] Figure 2 Yet another optional partial structural cross-sectional view of the heat dissipation device provided by the embodiments of the present disclosure;

[0014] Figure 3 Yet another optional partial structural cross-sectional view of the heat dissipation device provided by the embodiments of the present disclosure;

[0015] Figure 4 Yet another optional partial structural cross-sectional view of the heat dissipation device provided by the embodiments of the present disclosure;

[0016] Figure 5 Yet another optional partial structural cross-sectional view of the heat dissipation device provided by the embodiments of the present disclosure;

[0017] Figure 6 Yet another optional partial structural cross-sectional view of the heat dissipation device provided by the embodiments of the present disclosure;

[0018] Figure 7 Yet another optional partial structural cross-sectional view of the heat dissipation device provided by the embodiments of the present disclosure;

[0019] Figure 8 Yet another optional partial structural cross-sectional view of the heat dissipation device provided by the embodiments of the present disclosure;

[0020] Figure 9 Yet another optional partial structural cross-sectional view of the heat dissipation device provided by the embodiments of the present disclosure;

[0021] Figure 10 Yet another optional structural exploded view of the heat dissipation device provided by the embodiments of the present disclosure;

[0022] Figure 11 Another optional structural cross-sectional view of the heat dissipation device provided by the embodiments of the present disclosure;

[0023] Figure 12 An optional partial structural schematic view of an electronic device provided by the embodiments of the present disclosure;

[0024] Figure 13 Another perspective schematic view of Figure 12 the electronic device provided by the embodiments of the present disclosure;

[0025] Figure 14 An optional flow schematic view of a manufacturing method of the heat dissipation device provided by the embodiments of the present disclosure.

[0026] Reference signs: 100, body; 110, accommodating cavity; 111, first region; 1111, first sub-region; 1112, second sub-region; 112, second region; 113, third region; 120, first wall body; 210, first target piece; 220, second target piece; 310, first medium; 320, second medium; 330, third medium; 340, fourth medium; 350, fifth medium; 410, first capillary structure; 420, second capillary structure; 430, third capillary structure; 600, main body; 610, first part; 620, second part; 630, third part; 641, first space; 642, second space; 601, opening; 710, heating piece; 711, main plate; 712, chip; 720, heat sink. DETAILED DESCRIPTION

[0027] The technical solutions of the present disclosure are further described in detail below in combination with the accompanying drawings and specific embodiments.

[0028] In the embodiments of the present disclosure, it should be noted that unless otherwise stated and limited, the term "connection" should be understood broadly, for example, it can be an electrical connection, or a connection between two elements, it can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above-mentioned term can be understood according to the specific circumstances.

[0029] It should be noted that the terms "first", "second", and "third" involved in the embodiments of the present disclosure are only to distinguish similar objects, and do not represent a specific order of the objects. Understandably, "first", "second", and "third" can be interchanged in a specific order or sequence as allowed. It should be understood that the objects distinguished by "first", "second", and "third" can be interchanged under appropriate circumstances, so that the embodiments of the present disclosure described herein can be implemented in an order other than those illustrated or described herein.

[0030] The following is described in combination with Figures 1 to 14 The heat dissipation device, electronic equipment and manufacturing method of the heat dissipation device of the connection structure described in the embodiments of the present disclosure are described in detail.

[0031] Some embodiments of the present disclosure disclose a heat dissipation device, comprising a body 100, a first target 210, a first medium 310 and a second medium 320. The body 100 comprises a containing cavity 110; the first target 210 is arranged in the containing cavity 110, and the first target 210 divides the containing cavity 110 into a first area 111 and a second area 112; the first medium 310 is arranged in the containing cavity 110, and the first medium 310 can be switched from a liquid state to a gaseous state; the first medium 310 can move between the first area 111 and the second area 112 through the first target 210; the second medium 320 is arranged in the second area 112, and the second medium 320 is in a liquid state; the second medium 320 is formed by a third medium 330 and the first medium 310 in a liquid state; the first target 210 is used to limit the third medium 330 in the second area 112; when the first medium 310 in a liquid state in the second medium 320 is switched from a liquid state to a gaseous state, the second medium 320 is converted into the first medium 310 in a gaseous state and the third medium 330; the amount of the second medium 320 in a unit space in the second area 112 is greater than the amount of the first medium 310 in a liquid state in a unit space in the first area 111.

[0032] In the embodiments of the present disclosure, the heat dissipation device can be used for heat dissipation of electronic devices such as mobile phones, computers, servers and motors. During use, the heat dissipation device can be in contact with or connected to the heat generating part of the electronic device in need of heat dissipation through a heat conduction structure, so as to dissipate heat for the heat generating part of the electronic device through the heat dissipation device. The heat dissipation device can be arranged in the electronic device or arranged outside the electronic device, and the present disclosure does not limit this.

[0033] Some embodiments of the present disclosure also disclose an electronic device, which comprises a heat-generating component, a body 100, a first target component 210, a first medium 310 and a second medium 320. The body 100 comprises a receiving cavity 110, and the body 100 is configured to absorb heat of the heat-generating component. The first target component 210 is arranged in the receiving cavity 110, and the first target component 210 divides the receiving cavity 110 into a first region 111 and a second region 112. The first medium 310 is arranged in the receiving cavity 110, and the first medium 310 is capable of switching from a liquid state to a gaseous state. The first medium 310 is capable of moving between the first region 111 and the second region 112 through the first target component 210. The second medium 320 is arranged in the second region 112, and the second medium 320 is in a liquid state. The second medium 320 is formed by a third medium 330 and the first medium 310 in the liquid state. The first target component 210 is configured to confine the third medium 330 in the second region 112. When the first medium 310 in the liquid state in the second medium 320 switches from the liquid state to the gaseous state, the second medium 320 is converted into the first medium 310 in the gaseous state and the third medium 330. The amount of the second medium 320 in a unit space in the second region 112 is greater than the amount of the first medium 310 in the liquid state in a unit space in the first region 111.

[0034] In the embodiments of the present disclosure, the structure of the electronic device is not limited. For example, the electronic device can be a mobile phone, a computer, a server or the like. The structure of the heat-generating component is not limited. For example, the heat-generating component can be a processor, a memory card, a graphics card or the like of the electronic device. The relative position relationship between the heat-generating component and the body 100 is not limited. For example, the electronic device can comprise a shell, the heat-generating component can be arranged in the shell, and the body 100 can be arranged in the shell or outside the shell. As an example, the body 100 can be arranged in the shell, and the body 100 and the heat-generating component can be in direct contact, or the body 100 and the heat-generating component can be connected through a heat-conducting structure or the like. The heat-conducting structure can be a heat-conducting glue, a heat-conducting copper block or the like.

[0035] The relative position relationship between the heat-generating component and the first region 111 and the second region 112 is not limited. For example, the thermal resistance between the second region 112 and the heat-generating component can be less than the thermal resistance between the first region 111 and the heat-generating component. Here, the heat of the heat-generating component is more easily transferred to the second region 112, the heat of the heat-generating component can be mainly transferred to the second region 112, the heat of the heat-generating component can not be transferred to the first region 111, or the heat of the heat-generating component can be transferred to the first region 111 in a small amount. As another example, the thermal resistance between the second region 112 and the heat-generating component is equal to the thermal resistance between the first region 111 and the heat-generating component. However, the present disclosure is not limited thereto, and a person skilled in the art can adjust or arrange the same according to specific requirements.

[0036] The thermal conduction resistance can be the resistance encountered by heat when transferred between objects in a thermal conduction manner. The thermal conduction resistance between the second region 112 and the heat generating component can be the resistance encountered by heat when transferred between the second region 112 and the heat generating component. The thermal conduction resistance between the first region 111 and the heat generating component can be the resistance encountered by heat when transferred between the first region 111 and the heat generating component.

[0037] In some embodiments, the thermal conduction resistance between the second region 112 and the heat generating component is not limited to being smaller than the thermal conduction resistance between the first region 111 and the heat generating component. For example, the distance between the second region 112 and the heat generating component is smaller than the distance between the first region 111 and the heat generating component. For another example, the thermal conductivity of the thermal conduction structure between the second region 112 and the heat generating component is greater than the thermal conductivity of the thermal conduction structure between the first region 111 and the heat generating component. However, the present disclosure is not limited thereto, and those skilled in the art can adjust or set the same according to specific needs.

[0038] As an example, as shown in Figure 12 and Figure 13 , the electronic device can include a heat sink 720, the part of the body 100 corresponding to the second region 112 can be disposed at the heat generating component 710, and the part of the body 100 corresponding to the second region 112 can be in contact with the heat generating component 710 or connected through a thermal conduction structure; the part of the body 100 corresponding to the first region 111 can be disposed at the heat sink 720, and the part of the body 100 corresponding to the first region 111 can be in contact with the heat sink 720 or connected through a thermal conduction structure; so that the body 100 can transfer the heat generated by the heat generating component 710 to the heat sink 720.

[0039] Here, the structure of the heat generating component 710 is not limited. For example, as shown in Figure 12 and Figure 13 , the heat generating component 710 can include a mainboard 711 and a chip 712 disposed on the mainboard 711; the number of the body 100 can be two, one body 100 is disposed between the chip 712 and the heat sink 720 for dissipating heat for the chip 712, and the other body 100 is disposed between the mainboard 711 and the heat sink 720 for dissipating heat for the mainboard 711 or other heat generating structures on the mainboard 711.

[0040] Here, the structure of the heat sink 720 is not limited. For example, the heat sink 720 can be a heat dissipation fin or the like.

[0041] In other examples, the part of the body 100 corresponding to the first region 111 can also be placed in a region with lower temperature or on the air path of a fan, etc. However, the present disclosure is not limited thereto, and those skilled in the art can adjust or set the same according to specific needs.

[0042] The inventor of the present application found that in the use process of the heat dissipation structure such as heat pipe, uniform plate, etc., the heat pipe, uniform plate, etc. may cause dry burning phenomenon due to the too fast evaporation of the water and other heat dissipation medium in the heat pipe, uniform plate, etc., thereby greatly reducing the stability of the heat pipe, uniform plate, etc. for heat dissipation of electronic equipment. The heat dissipation device of the present disclosure, as shown in Figure 1 and Figure 2 The amount of the second medium 320 in the unit space of the second area 112 is greater than the amount of the liquid first medium 310 in the unit space of the first area 111, and the larger amount of the liquid second medium 320 in the unit space of the second area 112 converts into the third medium 330 and the gaseous first medium 310 to absorb more heat than the smaller amount of the liquid first medium 310 in the unit space of the first area 111 converts into the gaseous first medium 310 to absorb heat, so that the second medium 320 in the unit space of the second area 112 can absorb more heat; at the same time, in the case of absorbing the same amount of heat, the larger amount of the liquid second medium 320 in the unit space of the second area 112 converts into the third medium 330 and the gaseous first medium 310 in a longer time than the smaller amount of the liquid first medium 310 in the unit space of the first area 111 converts into the gaseous first medium 310, thereby reducing the risk of dry burning of the second medium 320 at the second area 112, and further greatly improving the stability of the heat dissipation device for heat dissipation of electronic equipment.

[0043] The second medium 320 in the unit space of the second region 112 can be the volume or mass of the second medium 320 in the unit volume of the second region 112. The amount of the first medium 310 in liquid state in the unit space of the first region 111 can be the volume or mass of the first medium 310 in the unit volume of the first region 111. For example, the second medium 320 in the unit space of the second region 112 can be the volume of the second medium 320 in 1 cubic centimeter of the second region 112, and the amount of the first medium 310 in liquid state in the unit space of the first region 111 can be the volume of the first medium 310 in 1 cubic centimeter of the first region 111. Here, the volume of the second medium 320 in 1 cubic centimeter of the second region 112 can be 0.35 cubic centimeter to 0.45 cubic centimeter, and the volume of the first medium 310 in 1 cubic centimeter of the first region 111 can be 0.25 cubic centimeter to 0.35 cubic centimeter. As an example, the volume of the second medium 320 in 1 cubic centimeter of the second region 112 can be 0.35 cubic centimeter, and the volume of the first medium 310 in 1 cubic centimeter of the first region 111 can be 0.25 cubic centimeter. As another example, the volume of the second medium 320 in 1 cubic centimeter of the second region 112 can be 0.45 cubic centimeter, and the volume of the first medium 310 in 1 cubic centimeter of the first region 111 can be 0.35 cubic centimeter. As another example, the body is in a tubular shape, and the cross-sectional dimensions of the body at the first region and the second region can be substantially the same; the volume of the first region 111 can be 1 cubic centimeter, and the volume of the second region 112 can be 1 cubic centimeter; the length of the first region 111 can be 20 mm, and the length of the second region 112 can be 20 mm; the volume of the first medium 310 in 1 cubic centimeter of the first region 111 (20 mm in length) can be 0.30 cubic centimeter, and the volume of the second medium 320 in 1 cubic centimeter of the second region 112 (20 mm in length) can be 0.45 cubic centimeter; here, the height of the first medium 310 in the first region 111 is less than the height of the second medium 320 in the second region 112 when the body is placed substantially horizontally, as shown in FIG. 1. However, the present disclosure is not limited thereto, i.e., one skilled in the art can adjust or set the same according to specific requirements. Figure 1 The present disclosure is not limited thereto, i.e., one skilled in the art can adjust or set the same according to specific requirements.

[0044] Here, the amount of the second medium 320 in the second region 112 per unit space can be greater than the amount of the first medium 310 in the first region 111 per unit space can include that the amount of the first medium 310 in the second medium 320 in the second region 112 per unit space can be greater than the amount of the first medium 310 in the first region 111 per unit space. The amount of the second medium in the second region per unit space can be greater than the amount of the first medium in the first region per unit space can include that the amount of the first medium 310 in the second medium 320 in the second region 112 per unit space can be equal to the amount of the first medium 310 in the first region 111 per unit space, where the second medium 320 in the second region 112 per unit space further includes the third medium 330. The amount of the second medium in the second region per unit space can be greater than the amount of the first medium in the first region per unit space can include that the amount of the first medium 310 in the second medium 320 in the second region 112 per unit space can be less than the amount of the first medium 310 in the first region 111 per unit space, where the amount of the first medium 310 in the second medium 320 in the second region 112 per unit space is less than the amount of the first medium 310 in the first region 111 per unit space by the amount of the third medium 330 in the second medium 320 in the second region 112 per unit space.

[0045] In some embodiments of the present disclosure, since the second medium 320 of the second region 112 includes the third medium 330 and the first medium 310 in a liquid state, and the third medium 330 in the second medium 320 cannot pass through the first target piece 210; so that the amount of the second medium 320 in the second region 112 per unit space is greater than the amount of the first medium 310 in a liquid state in the first region 111 per unit space.

[0046] In some embodiments of the present disclosure, in the case that the temperature of the second region 112 and the first region 111 is the same, since a larger amount of the second medium 320 in a liquid state in the second region 112 per unit space absorbs more heat when converting into the third medium 330 and the first medium 310 in a gaseous state than a smaller amount of the first medium 310 in a liquid state in the first region 111 per unit space absorbs when converting into the first medium 310 in a gaseous state, the amount of heat absorbed by the second medium 320 in the second region 112 per unit space can be greater than the amount of heat absorbed by the first medium 310 in a liquid state in the first region 111 per unit space; so that the second region 112 can improve the ability of the heat dissipation device to dissipate heat for the electronic device.

[0047] In some embodiments of the present disclosure, the height of the second medium 320 in the second region 112 can be greater than the height of the first medium 310 in a liquid state in the first region 111; here, the body 100 can be placed horizontally or substantially horizontally.

[0048] In the embodiments of the present disclosure, the structure of the body 100 is not limited. For example, the body 100 can be a tubular structure, a plate structure, a block structure, etc.

[0049] The accommodating cavity can be a sealed cavity or a non-sealed cavity.

[0050] In the embodiments of the present disclosure, the structure of the first target piece 210 is not limited. The first target piece 210 is a structure that can allow the liquid first medium 310 to pass through but not allow the third medium 330 in the second medium 320 to pass through, and can make the amount of the second medium 320 in the unit space of the second region 112 greater than the amount of the liquid first medium 310 in the unit space of the first region 111. For example, the first target piece 210 can include a semi-permeable membrane. Here, the semi-permeable membrane can be a reverse osmosis membrane, an ultrafiltration membrane, a nanofiltration membrane, etc., and the semi-permeable membrane can also be a natural semi-permeable membrane. As an example, the first target piece 210 can be formed by an egg membrane. As another example, the semi-permeable membrane can also be made by phase separation method, interfacial polymerization method, stretching pore method, electrospinning method, etc.

[0051] The material of the first target piece 210 is not limited. For example, the material of the first target piece 210 can be metal, high molecular material, etc.

[0052] The first target piece 210 can be arranged in the accommodating cavity 110 by bonding, clamping, welding, hot melting, etc.

[0053] The shape of the first target piece 210 is not limited. For example, the first target piece 210 can be a sheet structure, a ring structure, a block structure, a strip structure, etc.

[0054] The relative position of the first region 111 and the second region 112 is not limited. For example, the first region 111 can be located on one side of the second region 112, the first region 111 can be located on both sides of the second region 112, the first region 111 can also be located on the circumferential side of the second region 112, etc. In the case that the first region 111 is located on the circumferential side of the second region 112, the first region 111 can be similar to a ring structure, etc., and here, the first target piece 210 is a ring structure. In the case that the first region 111 is located on one side of the second region 112, here, the first target piece 210 can be a ring structure or a sheet. However, the present disclosure is not limited thereto, i.e., those skilled in the art can adjust or arrange, etc. according to specific needs.

[0055] In the embodiments of the present disclosure, the first medium 310 is capable of transforming from a liquid state to a gaseous state at a first set temperature, and is also capable of transforming from the gaseous state to the liquid state at a second set temperature. Here, the first set temperature is greater than the second set temperature. The first set temperature can be a first boiling point of the first medium 310 in the liquid state. The second set temperature can be a liquefaction temperature of the first medium 310 in the gaseous state.

[0056] The material of the first medium 310 is not limited. For example, the first medium 310 can be water, ethanol, acetone, etc. However, the present disclosure is not limited thereto, and a person skilled in the art can adjust or set, etc. according to specific needs.

[0057] In the embodiments of the present disclosure, the third medium 330 is capable of forming the second medium 320 in the liquid state with the first medium 310 in the liquid state, and the third medium 330 located in the second medium 320 in the liquid state cannot pass through the first target piece 210.

[0058] The state of the third medium 330 is not limited, as long as the third medium 330 is capable of forming the second medium 320 in the liquid state with the first medium 310 in the liquid state. For example, the third medium 330 can be in a solid state, a gel state, etc.

[0059] The first boiling point of the first medium 310 can be greater than a second boiling point of the third medium 330. The second boiling point of the third medium 330 can be a temperature at which the third medium 330 transforms into a gaseous state.

[0060] The material of the third medium 330 is not limited. For example, the third medium 330 can be an electrolyte material, a high polymer, a sugar, etc. As an example, the third medium 330 can be an electrolyte material such as sodium chloride, potassium chloride, calcium chloride, etc. As another example, the third medium 330 can be a high polymer such as polyethylene glycol (PEG), polyvinylpyrrolidone (PVP), polyvinyl alcohol (PVA), dextran, sodium polyacrylate, etc. As a further example, the third medium 330 can be a sugar such as sucrose, glucose, trehalose, etc. However, the present disclosure is not limited thereto, and a person skilled in the art can adjust or set, etc. according to specific needs.

[0061] In the embodiments of the present disclosure, the second medium 320 is formed by the third medium 330 and the first medium 310 in the liquid state, and here, the second medium 320 can only include the third medium 330 and the first medium 310 in the liquid state. The second medium 320 can also include other substances. However, the present disclosure is not limited thereto, and a person skilled in the art can adjust or set, etc. according to specific needs.

[0062] Here, the third medium 330 can be dissolved in the liquid first medium 310, and the third medium 330 can be distributed in the liquid first medium 310. As an example, the first medium 310 can be a solvent, the first medium 310 is a liquid that can be converted into a gas, the third medium 330 can be a solute, the third medium 330 is a solid or semi-solid, the first boiling point of the first medium 310 can be less than the second boiling point of the third medium 330; in the case of heat absorption of the liquid second medium 320, the liquid first medium 310 can first reach the first boiling point to form a gaseous first medium 310 and absorb heat, and the third medium 330 can not change into a gaseous state and can remain in the second area 112. Here, due to the decrease in the amount of the liquid first medium 310 in the second medium 320, the concentration of the third medium 330 in the second medium 320 can increase, the higher the concentration of the third medium 330 in the liquid second medium 320, the greater the force of the liquid second medium 320 through the first target piece 210 to attract the first medium 310 on the first area 111 side, in other words, the second medium 320 can be a solution, the higher the concentration of the solute (third medium 330) in the solution (second medium 320), the greater the osmotic pressure of the solution (second medium 320), and the greater the physical amount of the solution (second medium 320) through the first target piece 210 to attract the solvent (first medium 310); in the case of an increase in the concentration of the third medium 330, the force of the liquid second medium 320 through the first target piece 210 to make the first medium 310 on the first area 111 side enter the second area 112 increases, thereby improving the ability of the first medium 310 in the first area 111 to enter the second area 112, and further improving the ability of the first medium 310 to flow back to the second area 112 through the increase in the concentration of the third medium 330 in the second medium 320; in the case of an increase in the heat absorbed by the second medium 320 and an increase in the speed of the liquid first medium 310 in the second medium 320 to become a gaseous first medium 310, the concentration of the third medium 330 in the second medium 320 can also increase, thereby further improving the ability of the first medium 310 in the first area 111 to enter the second area 112 to adapt to the ability of the liquid second medium 320 to absorb heat, in other words, the higher the concentration of the third medium 330, the first medium 310 can return to the second area 112 through the first target piece 210 to adapt to different concentration gradients, and the higher the concentration of the third medium 330 in the second medium 320, the greater the return flow rate of the first medium 310. Here, the second area 112 can be located at a heat source or the like, thereby greatly improving the ability of the heat dissipation device to return the first medium 310 to the second area 112; thereby further avoiding the phenomenon of dry burning in the second area 112. For example, in the case of the first medium 310 being water, the water return efficiency of the heat dissipation device can be improved.Here, the concentration of the third medium 330 can be a molar mass of the third medium 330 per unit volume of the second medium 320. As an example, the concentration of the third medium 330 can be a molar mass of the third medium 330 per cubic centimeter of the second medium 320.

[0063] Here, the increase in the osmotic pressure due to the increase in the concentration of the solution (the second medium 320) is because the number of solute (the third medium 330) particles in the second region 112 increases, which reduces the chemical potential of the solvent (the first medium 310), thereby enhancing the driving force for the migration of the solvent (the first medium 310) molecules in the first region 111 to the side of the solution (the second medium 320).

[0064] As an example, the first medium 310 can be water, and the third medium 330 can be an electrolyte material, a high-molecular polymer, a sugar, or the like.

[0065] As another example, the first medium 310 can be ethanol, and the third medium 330 can be an electrolyte material, polyvinyl alcohol (PVA), polyvinylpyrrolidone (PVP), or the like.

[0066] As a further example, the first medium 310 can be acetone, and the third medium 330 can be polymethyl methacrylate (PMMA), cellulose acetate (CA), or the like.

[0067] The first target piece 210 is not limited in the manner in which the third medium 330 is restricted within the second region 112. For example, the third medium 330 is in a molecular form within the first medium 310 in a liquid state, and the volume of the third medium 330 in the molecular form is too large to pass through the first target piece 210. As another example, the third medium 330 is in an ionic form within the first medium 310 in a liquid state, and the third medium 330 in the ionic form can form a substance with a large volume with the molecules of the first medium 310 in a liquid state, and the substance with the large volume is unable to pass through the first target piece 210. However, the present disclosure is not limited thereto, and a person skilled in the art can adjust or set the same according to specific requirements, and the like.

[0068] In some embodiments of the present disclosure, the second medium 320 can have a first force on the first medium 310 in a liquid state in the first region 111, or the third medium 330 can have a first force on the first medium 310 in a liquid state in the first region 111, or the third medium 330 and the second medium 320 can have a first force on the first medium 310 in a liquid state in the first region 111. The first force can cause a first amount of the first medium 310 in a liquid state in the first region 111 to enter the second region 112 from the first target 210; meanwhile, the second medium 320 can have a second force on the first medium 310 in the second region 112, and the second force can cause a second amount of the first medium 310 in a liquid state in the second medium 320 to enter the first region 111 from the first target 210, and the particles in the second amount of the first medium 310 in a liquid state are different from at least part of the particles in the first amount of the first medium 310 in a liquid state; wherein the first amount and the second amount are the same, so that in the case that the heat dissipation device does not dissipate heat for the heat generating element, the amount of the second medium 320 in a unit space in the second region 112 can be greater than the amount of the first medium 310 in a liquid state in a unit space in the first region 111. Further, in the case that the heat dissipation device starts to dissipate heat for the heat generating element, the heat generating element can be quickly dissipated by the larger amount of the second medium 320, the risk of temperature rise of the heat generating element is reduced, and the safety of the electronic device is improved.

[0069] The first amount can be the volume or mass of the first medium 310 in a liquid state in the first region 111 entering the second region 112 from the first target 210. The second amount can be the volume or mass of the first medium 310 in a liquid state in the second region 112 entering the first region 111 from the first target 210.

[0070] The first force can be suction. In the case that the first target 210 is a semi-permeable membrane, the first force can be osmotic suction. The second force can be pressure. As an example, in the case that the heat dissipation device does not dissipate heat for the heat generating element, the second force can be hydrostatic pressure.

[0071] As an example, the third medium 330 is a solute, the second medium 320 is a solution, and the first medium 310 is a solvent; the first target piece 210 is a semi-permeable membrane; the first force is the osmotic pressure of the second medium 320 to the first medium 310 in the first region 111 through the first target piece 210, that is, the physical quantity of the solution (the second medium 320) through the semi-permeable membrane (the first target piece 210) to attract the solvent (the first medium 310) in the first region 111. The second force is the hydrostatic pressure of the second medium 320 to the first medium 310 in the second region 112. The solution (the second medium 320) can make the first amount of liquid solvent (the first medium 310) in the first region 111 enter the second region 112 from the first target piece 210 through the osmotic pressure (the first force); at the same time, the solution (the second medium 320) can make the second amount of liquid solvent (the first medium 310) in the second region 112 enter the first region 111 from the first target piece 210 through the hydrostatic pressure, the second amount of liquid solvent (the first medium 310) and the first amount of liquid solvent (the first medium 310) have the same volume or mass, and the particles in the second amount of liquid solvent (the first medium 310) and the first amount of liquid solvent (the first medium 310) are at least partially different, so that the amount of the second medium 320 in the unit space of the second region 112 is greater than the amount of the liquid first medium 310 in the unit space of the first region 111 in the case that the heat dissipation device does not dissipate heat for the heat generating piece.

[0072] In some embodiments of the present disclosure, in the heat absorption state, the liquid first medium 310 in the second medium 320 can be switched to the gaseous first medium 310 through heat absorption, the gaseous first medium 310 can be switched to the liquid first medium 310 through heat release in the first region 111, and the liquid first medium 310 can enter the second region 112 through the first target piece 210 to form the second medium 320 with the third medium 330; the second medium 320 can be heated again to form the third medium 330 and the gaseous first medium 310, and the cycle is repeated, so that the heat dissipation device can continuously dissipate heat for the heat generating piece. At the same time, due to the decrease of the amount of the liquid first medium 310 in the second medium 320, the concentration of the third medium 330 in the second medium 320 can be increased, and in the case that the concentration of the third medium 330 is increased, the force of the second medium 320 through the first target piece 210 to make the first medium 310 on the first region 111 side enter the second region 112 is increased, and the liquid first medium 310 in the first region 111 can be more quickly returned to the second region 112, so as to improve the ability of the heat dissipation device to circulate heat dissipation.

[0073] In some embodiments of the present disclosure, the first target piece 210, the second region 112, and the first region 111 are located on the first wall body 120 side of the body 100; seeFigure 3 The receiving cavity 110 may have a third region 113 located on the side away from the first wall 120. Figure 3 The area between the two dashed lines); the third area 113 is connected to the second area 112 and the first area 111 respectively; the third area 113 can be used to contain the gaseous first medium 310; the heat dissipation device may include: a first capillary structure 410 and a second capillary structure 420. The first capillary structure 410 can be disposed in the second area 112 by means of bonding, snapping, welding, sintering, etc.; the first capillary structure 410 is used to lock the second medium 320 to prevent the second medium 320 from entering the third area 113; the second capillary structure 420 can be disposed in the first area 111 by means of bonding, snapping, welding, sintering, etc.; the second capillary structure 420 is used to lock the liquid first medium 310 to prevent the liquid first medium 310 from entering the third area 113.

[0074] It is important to note that Figures 1 to 8 The first medium 310 is an illustration of the position of the liquid first medium 310. The gaseous first medium 310 can be located in the third region 113, or in the space of the second region 112 that is not occupied by the second medium 320, or in the space of the first region 111 that is not occupied by the liquid first medium 310.

[0075] The third region 113 can be a single, undivided area not separated by the first target component 210. Since the third region 113 does not have the first target component 210 or similar structures, the gaseous first medium 310 can move rapidly and unimpeded through the third region 113, thereby improving the heat dissipation capacity of the heat sink. Here, the third region 113 is not separated by the first target component 210. Of course, in other embodiments, the third region 113 can also be completely separated by the first target component 210. Here, the third region 113 may include a portion located on the side of the first region 111 and a portion located on the side of the second region 112. The third region 113 on the side of the first region 111 and the third region 113 on the side of the second region 112 are not connected. The gaseous first medium 310 can enter the third region 113 on the side of the first region 111 through the first target component 210. However, this disclosure is not limited to this; those skilled in the art can adjust or set it according to specific needs.

[0076] In some embodiments, the first capillary structure 410 has a first capillary hole, and the first capillary structure 410 is capable of locking the second medium 320 in the first capillary hole of the first capillary structure 410 by the first capillary force of the first capillary hole, so as to prevent the liquid second medium 320 from flowing from the second region 112 to the third region 113 into the first region 111, but the liquid second medium 320 can flow through the first capillary hole of the first capillary structure 410, and in the case that the liquid second medium 320 absorbs heat to form the third medium 330 and the gaseous first medium 310, the third medium 330 can be located in the first capillary hole of the first capillary structure 410, and the gaseous first medium 310 can exit the first capillary structure 410 into the third region 113.

[0077] Here, the second medium 320 can be locked in the first capillary hole of the first capillary structure 410 by the first capillary structure 410, and the setting space and range of the second medium 320 can also be increased. As an example, as shown in FIGS. 1 and 2, the first capillary structure 410 can be arranged in a ring shape along the circumference of the body 100, and here, the second medium 320 can also be arranged in a ring shape along the circumference of the body 100, and here, the force of the first capillary structure 410 on the second medium 320 can be greater than the gravity of the second medium 320, so as to enable the second medium 320 to be stably located in the first capillary structure 410, and here, in various cases such as horizontal placement or inclined placement of the body 100, the second medium 320 can be prevented from entering the third region 113. Figure 3 and Figure 4 As shown in FIGS. 1 and 2, the first capillary structure 410 can be arranged in a ring shape along the circumference of the body 100, and here, the second medium 320 can also be arranged in a ring shape along the circumference of the body 100, and here, the force of the first capillary structure 410 on the second medium 320 can be greater than the gravity of the second medium 320, so as to enable the second medium 320 to be stably located in the first capillary structure 410, and here, in various cases such as horizontal placement or inclined placement of the body 100, the second medium 320 can be prevented from entering the third region 113.

[0078] The volume of the first capillary hole is not limited. For example, the volume of the first capillary hole can be greater than or equal to the volume of the second medium 320, so that the entire second medium 320 is located in the first capillary hole. Of course, the volume of the first capillary hole can also be less than the volume of the second medium 320, so that part of the second medium 320 is located in the first capillary hole, and here, the third region 113 can also be completely separated by the first target piece 210, and the third medium 330 in the second medium 320 is prevented from flowing into the first region 111 by the first target piece 210. In the case that the volume of the first capillary hole is equal to or substantially equal to the volume of the second medium 320, the entire second medium 320 can be located in the first capillary hole, and the space occupied by the first capillary structure 410 can be reduced, and the space occupied by the gaseous first medium 310 can be increased, so as to improve the utilization rate of the accommodation cavity 110.

[0079] The first capillary structure 410 can be formed by sintering of metal powder, metal wire mesh, etc. In this case, the first capillary structure 410 has good thermal conductivity, and the heat dissipation efficiency of the heat dissipation device can be further improved. For example, the first capillary structure 410 can be formed by mechanical cutting, chemical etching, laser etching, etc. of a metal block, a metal strip, etc. In this case, the first capillary structure 410 has good thermal conductivity, and the heat dissipation efficiency of the heat dissipation device can be further improved. For example, the first capillary structure 410 can also be formed by mechanical cutting, chemical etching, laser etching, etc. of a non-metal block, a non-metal strip, etc. However, the present disclosure is not limited thereto, and the skilled person in the art can adjust or set, etc. according to specific needs.

[0080] In some embodiments, the second capillary structure 420 has a second capillary hole, and the second capillary structure 420 can lock the first medium 310 in liquid form in the second capillary hole of the second capillary structure 420 by the second capillary force of the second capillary hole, so as to prevent the first medium 310 in liquid form from flowing from the first region 111 to the third region 113 and entering the second region 112; but the first medium 310 in liquid form can flow through the second capillary hole of the second capillary structure 420.

[0081] Here, the first medium 310 can be locked in the second capillary hole of the second capillary structure 420 by the second capillary structure 420, and the setting space and range of the first medium 310 can also be increased. As an example, as shown in Figure 3 and Figure 4 The second capillary structure 420 can be arranged in a ring shape along the circumference of the body 100, and the first medium 310 can also be arranged in a ring shape along the circumference of the body 100. The force of the second capillary structure 420 on the first medium 310 can be greater than the gravity of the first medium 310, so that the first medium 310 can be stably located in the second capillary structure 420. In this case, the first medium 310 can be prevented from entering the third region 113 in various cases such as horizontal placement or inclined placement of the body 100.

[0082] The volume of the second capillary hole is not limited. For example, the volume of the second capillary hole can be greater than or equal to the volume of the first medium 310, so that the entire first medium 310 is located in the second capillary hole. Of course, the volume of the second capillary hole can also be less than the volume of the first medium 310, so that part of the first medium 310 is located in the second capillary hole, and here the third region 113 can also be completely separated by the first target piece 210. In the case where the volume of the second capillary hole is equal to or substantially equal to the volume of the first medium 310, both the entire first medium 310 can be located in the second capillary hole, and the space occupied by the second capillary structure 420 can be reduced, the space occupied by the gaseous first medium 310 can be increased, thereby improving the utilization rate of the accommodation cavity 110.

[0083] The forming method of the second capillary structure 420 is not limited. For example, the second capillary structure 420 can be formed by sintering through metal powder, metal wire mesh, etc., and here the thermal conductivity of the second capillary structure 420 is good, which can further improve the heat dissipation efficiency of the heat dissipation device. For another example, the second capillary structure 420 can be formed by mechanical cutting, chemical etching, laser etching, etc. through metal blocks, metal strips, etc.; here the thermal conductivity of the second capillary structure 420 is good, which can further improve the heat dissipation efficiency of the heat dissipation device. For another example, the second capillary structure 420 can also be formed by mechanical cutting, chemical etching, laser etching, etc. through non-metal blocks, non-metal strips, etc. However, the present disclosure is not limited thereto, and those skilled in the art can adjust or set according to specific needs.

[0084] In some embodiments, the volume of the first capillary structure 410 in the unit space of the second region 112 can be greater than the volume of the second capillary structure 420 in the unit space of the first region 111; so that a larger amount of the second medium 320 is locked by the relatively larger volume of the first capillary structure 410, and a smaller amount of the first medium 310 is locked by the relatively smaller volume of the second capillary structure 420, thereby reasonably utilizing the accommodation cavity 110 and improving the heat dissipation efficiency of the heat dissipation device. Of course, in other embodiments, the volume of the first capillary structure 410 in the unit space of the second region 112 can also be less than or equal to the volume of the second capillary structure 420 in the unit space of the first region 111.

[0085] The volume of the first capillary structure 410 in the unit space of the second region 112 is not limited, and the volume of the second capillary structure 420 in the unit space of the first region 111 is not limited. For example, the volume of the first capillary structure 410 in the unit space of the second region 112 can be 1 cubic centimeter of the first capillary structure 410 in the second region 112, and the volume of the second capillary structure 420 in the unit space of the first region 111 can be 1 cubic centimeter of the second capillary structure 420 in the first region 111. Here, the volume of the first capillary structure 410 in 1 cubic centimeter of the second region 112 can be 0.35 cubic centimeters to 0.45 cubic centimeters, and the volume of the second capillary structure 420 in 1 cubic centimeter of the first region 111 can be 0.25 cubic centimeters to 0.35 cubic centimeters. As an example, the volume of the first capillary structure 410 in 1 cubic centimeter of the second region 112 can be 0.35 cubic centimeters, and the volume of the second capillary structure 420 in 1 cubic centimeter of the first region 111 can be 0.25 cubic centimeters. As another example, the volume of the first capillary structure 410 in 1 cubic centimeter of the second region 112 can be 0.45 cubic centimeters, and the volume of the second capillary structure 420 in 1 cubic centimeter of the first region 111 can be 0.35 cubic centimeters. As another example, the body is tubular, and the cross-sectional size of the body at the first region and the second region can be substantially the same; the volume of the first region 111 can be 1 cubic centimeter, and the volume of the second region 112 can be 1 cubic centimeter; the length of the first region 111 can be 20 mm, and the length of the second region 112 can be 20 mm; the volume of the second capillary structure 420 in 1 cubic centimeter of the first region 111 (20 mm in length) can be 0.30 cubic centimeters, and the volume of the first capillary structure 410 in 1 cubic centimeter of the second region 112 (20 mm in length) can be 0.45 cubic centimeters; here, the height of the second capillary structure 420 in the first region 111 is less than the height of the first capillary structure 410 in the second region 112 when the body is placed substantially horizontally, as shown in FIG. 2; here, the height of the second capillary structure 420 at each location in the first region 111 can be the same, and the height of the first capillary structure 410 at each location in the second region 112 can be the same. However, the present disclosure is not limited thereto, and one skilled in the art can adjust or set the same according to specific needs. Figure 8 The height of the second capillary structure 420 in the first region 111 is less than the height of the first capillary structure 410 in the second region 112 when the body is placed substantially horizontally, as shown in FIG. 2; here, the height of the second capillary structure 420 at each location in the first region 111 can be the same, and the height of the first capillary structure 410 at each location in the second region 112 can be the same. However, the present disclosure is not limited thereto, and one skilled in the art can adjust or set the same according to specific needs.

[0086] In some embodiments, the shape of the first target piece 210 is not limited. For example, as shown in FIG. 1, the first target piece 210 can be a cylinder, and the second target piece 220 can be a cylinder. Figure 3 and Figure 4As shown, the body 100 can be in a tubular structure, the first target piece 210 can be in a ring structure, the first wall 120 of the body 100 can be all the circumferential side walls of the body 100, and the first wall 120 can be in a cylindrical shape. Of course, the first target piece 210 can be in a half-ring structure, the first wall 120 of the body 100 can be part of the circumferential side walls of the body 100, and the first wall 120 can be in a half-ring shape. For example, the body 100 can be in a plate structure. The first target piece 210 can be in a ring structure, the first wall 120 of the body 100 can be all the circumferential side walls of the body 100, and the first wall 120 can be in a ring shape. Of course, the first target piece 210 can also be in a plate structure, the first wall 120 of the body 100 can be a side wall of the body 100, and the first wall 120 can be in a plate shape. However, the present disclosure is not limited thereto, i.e., those skilled in the art can adjust or set, etc. according to specific needs.

[0087] In some embodiments, the height of the first target piece 210 protruding from the first wall 120 of the body 100 can be greater than the height of the first capillary structure 410, as shown in FIG. 2B. Figure 3 Of course, the height of the first target piece 210 protruding from the first wall 120 of the body 100 can also be equal to or substantially equal to the height of the first capillary structure 410, as shown in FIG. 2C. Figure 4 As shown, the height of the first target piece 210 protruding from the first wall 120 of the body 100 can be greater than the height of the first capillary structure 410, so as to form a third region 113 with a larger space, thereby more reasonably utilizing the space of the accommodation cavity 110 and improving the heat dissipation efficiency of the heat dissipation device.

[0088] In some embodiments of the present disclosure, the heat dissipation device can include a second target piece 220 and a fourth medium 340, the second target piece 220 can be arranged in the first region 111 by means of bonding, clamping, welding, sintering, hot melting, etc., as shown in FIG. 3A. Figure 5, the second target member 220 divides the first region 111 into a first sub-region 1111 and a second sub-region 1112, the second sub-region 1112 is located on the side of the first sub-region 1111 away from the second region 112; the fourth medium 340 can be arranged in the first sub-region 1111, the fourth medium 340 is formed by the fifth medium 350 and the liquid first medium 310, the second target member 220 is used to limit the fifth medium 350 in the first sub-region 1111; the first medium 310 can move between the second sub-region 1112 and the first sub-region 1111 through the second target member 220; the concentration of the fifth medium 350 in the fourth medium 340 is less than the concentration of the third medium 330 in the second medium 320, so as to improve the flow speed of the first medium 310 in the second sub-region 1112 to the first sub-region 1111; here, the fifth medium 350 in the fourth medium 340 can improve the flow speed of the first medium 310 in the second sub-region 1112 to the first sub-region 1111, so that the first sub-region 1111 has more amount of the first medium 310, and then through the action of the third medium 330 in the second medium 320, the first medium 310 in the first sub-region 1111 can flow into the second region 112 quickly, so as to circulate, greatly improve the flow speed of the first medium 310 into the second region 112, and improve the heat dissipation efficiency of the heat dissipation device.

[0089] The amount of the second medium 320 in the unit space of the second region 112 is greater than the amount of the liquid fourth medium 340 in the unit space of the first sub-region 1111, and the amount of the fourth medium 340 in the unit space of the first sub-region 1111 is greater than the amount of the liquid first medium 310 in the unit space of the second sub-region 1112.

[0090] The amount of the second medium 320 in the unit space of the second region 112 can be a volume or a mass of the second medium 320 in a unit volume of the second region 112. The amount of the fourth medium 340 in a liquid state in the unit space of the first sub-region 1111 can be a volume or a mass of the fourth medium 340 in a unit volume of the first sub-region 1111. The amount of the first medium 310 in a liquid state in the unit space of the second sub-region 1112 can be a volume or a mass of the first medium 310 in a liquid state in a unit volume of the second sub-region 1112. For example, the amount of the second medium 320 in the unit space of the second region 112 can be a volume of the second medium 320 in 1 cubic centimeter of the second region 112, the amount of the fourth medium 340 in a liquid state in the unit space of the first sub-region 1111 can be a volume of the fourth medium 340 in 1 cubic centimeter of the first sub-region 1111, and the amount of the first medium 310 in a liquid state in the unit space of the second sub-region 1112 can be a volume of the first medium 310 in a liquid state in 1 cubic centimeter of the second sub-region 1112. Here, the volume of the second medium 320 in 1 cubic centimeter of the second region 112 can be 0.4 cubic centimeters to 0.5 cubic centimeters, the volume of the fourth medium 340 in 1 cubic centimeter of the first sub-region 1111 can be 0.3 cubic centimeters to 0.4 cubic centimeters, and the volume of the first medium 310 in a liquid state in 1 cubic centimeter of the second sub-region 1112 can be 0.2 cubic centimeters to 0.3 cubic centimeters. As an example, the volume of the second medium 320 in 1 cubic centimeter of the second region 112 can be 0.35 cubic centimeters, the volume of the fourth medium 340 in 1 cubic centimeter of the first sub-region 1111 can be 0.25 cubic centimeters, and the volume of the first medium 310 in a liquid state in 1 cubic centimeter of the second sub-region 1112 can be 0.2 cubic centimeters. As another example, the volume of the second medium 320 in 1 cubic centimeter of the second region 112 can be 0.45 cubic centimeters, the volume of the fourth medium 340 in 1 cubic centimeter of the first sub-region 1111 can be 0.35 cubic centimeters, and the volume of the first medium 310 in 1 cubic centimeter of the second sub-region 1112 can be 0.3 cubic centimeters.As a further example, the body is tubular, the cross-sectional dimension of the body at the first sub-region, the second sub-region and the second region can be substantially the same; the volume of the second sub-region 1112 can be 1 cubic centimeter, the volume of the first sub-region 1111 can be 1 cubic centimeter, the volume of the second region 112 can be 1 cubic centimeter; the length of the first sub-region 1111 can be 20 mm, the length of the second sub-region 1112 can be 20 mm, the length of the second region 112 can be 20 mm; the volume of the first medium 310 in the 1 cubic centimeter second sub-region 1112 (length of 20 mm) can be 0.25 cubic centimeters, the volume of the fourth medium 340 in the 1 cubic centimeter first sub-region 1111 (length of 20 mm) can be 0.35 cubic centimeters, the volume of the second medium 320 in the 1 cubic centimeter second region 112 (length of 20 mm) can be 0.45 cubic centimeters; here, the height of the first medium 310 in the second sub-region 1112 is less than the height of the fourth medium 340 in the first sub-region 1111, the height of the fourth medium 340 in the first sub-region 1111 is less than the height of the second medium 320 in the second region 112, when the body is placed substantially horizontally, see. Figure 5 The disclosure is not limited thereto, i.e., those skilled in the art can adjust or set the like according to specific needs.

[0091] The positional relationship between the heat generating member and the second region 112, the first sub-region 1111 and the second sub-region 1112 is not limited. For example, the thermal conduction thermal resistance between the second region 112 and the heat generating member is less than the thermal conduction thermal resistance between the first sub-region 1111 and the heat generating member; the thermal conduction thermal resistance between the first sub-region 1111 and the heat generating member is less than the thermal conduction thermal resistance between the second sub-region 1112 and the heat generating member; here, the heat of the heat generating member is more easily transmitted to the second region 112, the heat of the heat generating member can be mainly transmitted to the second region 112, the heat of the heat generating member can not be transmitted to the first sub-region 1111 and the second sub-region 1112, or the heat of the heat generating member can be transmitted to the first sub-region 1111 and the second sub-region 1112 in a small amount. As another example, the thermal conduction thermal resistance between the second region 112 and the heat generating member is equal to the thermal conduction thermal resistance between the first sub-region 1111 and the heat generating member. The disclosure is not limited thereto, i.e., those skilled in the art can adjust or set the like according to specific needs.

[0092] The implementation mode of the thermal conduction thermal resistance between the second region 112 and the heat generating member being less than the thermal conduction thermal resistance between the first sub-region 1111 and the heat generating member, the implementation mode of the thermal conduction thermal resistance between the first sub-region 1111 and the heat generating member being less than the thermal conduction thermal resistance between the second sub-region 1112 and the heat generating member, and the implementation mode of the thermal conduction thermal resistance between the second region 112 and the heat generating member being less than the thermal conduction thermal resistance between the first region 111 and the heat generating member are similar, and will not be repeated here.

[0093] In some embodiments of the present disclosure, in the case that the temperature of the second region 112, the first sub-region 1111 and the second sub-region 1112 is the same, the heat absorption amount of the second medium 320 in the unit space of the second region 112 is greater than the heat absorption amount of the fourth medium 340 in the liquid state in the unit space of the first sub-region 1111; the heat absorption amount of the fourth medium 340 in the unit space of the first sub-region 1111 is greater than the heat absorption amount of the first medium 310 in the liquid state in the unit space of the second sub-region 1112; the heat of the heat-generating component is mainly absorbed by the second region 112, which can reduce the risk of dry burning of the second medium 320 at the second region 112, thereby greatly improving the stability of the heat dissipation device for dissipating heat for the electronic device.

[0094] In some embodiments of the present disclosure, the height of the second medium 320 in the second region 112 can be greater than the height of the fourth medium 340 in the liquid state in the first sub-region 1111; the height of the fourth medium 340 in the first sub-region 1111 can be greater than the height of the first medium 310 in the liquid state in the second sub-region 1112; as shown in the figure, here, the body 100 can be placed horizontally or substantially horizontally. Figure 5

[0095] In embodiments of the present disclosure, the structure of the first target component 210 is not limited. The first target component 210 is a structure that can allow the first medium 310 in the liquid state to pass through but not allow the third medium 330 in the second medium 320 to pass through, and not allow the fifth medium 350 in the fourth medium 340 to pass through, and can make the amount of the second medium 320 in the unit space of the second region 112 greater than the amount of the fourth medium 340 in the unit space of the first sub-region 1111. For example, the first target component 210 can include a semi-permeable membrane. The semi-permeable membrane has been described above, and will not be described here again.

[0096] The structure of the second target component 220 is not limited. The second target component 220 is a structure that can allow the first medium 310 in the liquid state to pass through but not allow the fifth medium 350 in the fourth medium 340 to pass through, and can make the amount of the fourth medium 340 in the unit space of the first sub-region 1111 greater than the amount of the first medium 310 in the liquid state in the unit space of the second sub-region 1112. For example, the second target component 220 can include a semi-permeable membrane. The semi-permeable membrane has been described above, and will not be described here again.

[0097] The material of the second target component 220 is not limited. For example, the material of the second target component 220 can be metal, high molecular material, etc.

[0098] The shape of the second target component 220 is not limited. For example, the second target component 220 can be a sheet structure, a ring structure, a block structure, a strip structure, etc. ​

[0099] The second target piece 220 and the first target piece 210 can be the same or different. As an example, the second target piece 220 and the first target piece 210 are the same so as to be processed and manufactured.

[0100] The relative positions of the second region 112, the first sub-region 1111 and the second sub-region 1112 are not limited. For example, the first sub-region 1111 can be located at one side of the second region 112, the first sub-region 1111 can be located at two sides of the second region 112, the first sub-region 1111 can also be located at a circumferential side of the second region 112, and the like. For example, the second sub-region 1112 can be located at one side of the first sub-region 1111, the second sub-region 1112 can be located at two sides of the first sub-region 1111, the second sub-region 1112 can also be located at a circumferential side of the first sub-region 1111, and the like. In the case that the first sub-region 1111 is located at a circumferential side of the second region 112, the first sub-region 1111 can be annular or the like, and here, the second sub-region 1112 can be located at one side, two sides, a circumferential side, or the like of the first sub-region 1111. In the case that the first sub-region 1111 is located at one side of the second region 112, the second sub-region 1112 can be located at one side, two sides, or the like of the first sub-region 1111. However, the present disclosure is not limited thereto, that is, a person skilled in the art can adjust or set, and the like, according to specific requirements.

[0101] In the embodiment of the present disclosure, the fifth medium 350 can form the fourth medium 340 in a liquid state with the first medium 310 in a liquid state, and the fifth medium 350 located in the fourth medium 340 in a liquid state cannot pass through the second target piece 220.

[0102] The state of the fifth medium 350 is not limited, as long as the fifth medium 350 can form the fourth medium 340 in a liquid state with the first medium 310 in a liquid state. For example, the fifth medium 350 can be in a solid state, a gel state, or the like.

[0103] The first boiling point of the first medium 310 can be greater than the third boiling point of the fifth medium 350. The third boiling point of the fifth medium 350 can be the temperature at which the fifth medium 350 is converted into a gaseous state.

[0104] The material of the fifth medium 350 is not limited. For example, the fifth medium 350 can be an electrolyte material, a polymer, a sugar, etc. As an example, the fifth medium 350 can be an electrolyte material such as sodium chloride, potassium chloride, calcium chloride, etc. As another example, the fifth medium 350 can be a polymer such as polyethylene glycol (PEG), polyvinylpyrrolidone (PVP), polyvinyl alcohol (PVA), Dextran, sodium polyacrylate, etc. As a further example, the fifth medium 350 can be a sugar such as sucrose, glucose, trehalose, etc. However, the present disclosure is not limited thereto, i.e., a person skilled in the art can adjust or set, etc. according to specific needs.

[0105] In the embodiments of the present disclosure, the fourth medium 340 is formed by the fifth medium 350 and the liquid first medium 310, and here, the fourth medium 340 can only include the fifth medium 350 and the liquid first medium 310. Of course, the fourth medium 340 can also include other substances. However, the present disclosure is not limited thereto, i.e., a person skilled in the art can adjust or set, etc. according to specific needs.

[0106] Here, the fifth medium 350 can be dissolved in the liquid first medium 310, and here, the fifth medium 350 can be distributed in the liquid first medium 310. As an example, the first medium 310 can be a solvent, the fifth medium 350 can be a solute, and the first boiling point of the first medium 310 can be less than the third boiling point of the fifth medium 350; in the case of heat absorption of the liquid fourth medium 340, the liquid first medium 310 can first reach the first boiling point to form a gaseous first medium 310 and absorb heat, and the fifth medium 350 can not change into a gaseous state and can be kept in the first sub-region 1111 at the first boiling point. Of course, the liquid fourth medium 340 can not be used for heat absorption, and the liquid fourth medium 340 can be used to make the first medium 310 flow quickly. Here, the concentration of the fifth medium 350 can be the molar mass of the fifth medium 350 per unit volume of the fourth medium 340. As an example, the concentration of the fifth medium 350 can be the molar mass of the fifth medium 350 per cubic centimeter of the fourth medium 340.

[0107] As an example, the first medium 310 can be water, and the fifth medium 350 can be an electrolyte material, a polymer, a sugar, etc.

[0108] As another example, the first medium 310 can be ethanol, and the fifth medium 350 can be an electrolyte material, polyvinyl alcohol (PVA), polyvinylpyrrolidone (PVP), etc.

[0109] As a further example, the first medium 310 can be acetone, and the fifth medium 350 can be polymethyl methacrylate (PMMA), cellulose acetate (CA), etc.

[0110] The fifth medium 350 and the third medium 330 can be the same or different. When the fifth medium 350 and the third medium 330 are the same, it is convenient for processing and manufacturing.

[0111] The second target piece 220 is not limited in the way of restricting the fifth medium 350 in the first sub-region 1111. For example, the fifth medium 350 is in a molecular form in the liquid first medium 310, and the volume of the fifth medium 350 in the molecular form is too large to pass through the second target piece 220. For another example, the fifth medium 350 is in an ionic form in the liquid first medium 310, and the fifth medium 350 in the ionic form can form a large volume of substance with the molecules of the liquid first medium 310, and the large volume of substance cannot pass through the second target piece 220. However, the present disclosure is not limited thereto, that is, a person skilled in the art can adjust or set according to specific needs, etc.

[0112] In some embodiments of the present disclosure, the second medium 320 has a first force on the liquid first medium 310 in the first sub-region 1111, and the first force can make the first amount of the liquid first medium 310 in the first sub-region 1111 enter the second region 112 from the first target piece 210; at the same time, the second medium 320 has a second force on the first medium 310 in the second region 112, and the second force can make the second amount of the liquid first medium in the second medium 320 enter the first sub-region 1111 from the first target piece 210, and the second amount of the liquid first medium is different from at least part of the first amount of the liquid first medium 310; wherein the first amount and the second amount are the same, the fourth medium 340 has a third force on the liquid first medium 310 in the second sub-region 1112, and the third force can make the third amount of the liquid first medium 310 in the second sub-region 1112 enter the first sub-region 1111 from the second target piece 220; at the same time, the fourth medium 340 has a fifth force on the first medium 310 in the first sub-region 1111, and the fifth force can make the fourth amount of the liquid first medium 310 in the fourth medium 340 enter the second sub-region 1112 from the second target piece 220; the third amount of the liquid first medium 310 and the fourth amount of the liquid first medium 310 are different from at least part of each other; wherein the third amount and the fourth amount are the same, so that in the case that the heat dissipation device does not dissipate heat from the heat generating piece, the amount of the second medium 320 in the unit space of the second region 112 can be greater than the amount of the liquid fourth medium 340 in the unit space of the first sub-region 1111, and the amount of the fourth medium 340 in the unit space of the first sub-region 1111 can be greater than the amount of the liquid first medium 310 in the unit space of the second sub-region 1112, as shown in Figure 5 .

[0113] The first amount can be the volume or mass of the liquid first medium 310 in the first sub-region 1111 entering the second region 112 from the first target member 210. The second amount can be the volume or mass of the liquid first medium 310 in the second region 112 entering the first sub-region 1111 from the first target member 210. The third amount can be the volume or mass of the liquid first medium 310 in the first sub-region 1111 entering the second sub-region 1112 from the second target member 220. The fourth amount can be the volume or mass of the liquid first medium 310 in the second sub-region 1112 entering the first sub-region 1111 from the second target member 220.

[0114] The third force can be a suction force. When the second target member 220 is a semi-permeable membrane, the third force can be a permeation suction force. The fourth force can be a pressure.

[0115] When the heat dissipation device dissipates heat from the heat generating member, the second medium 320 in the second region 112 can absorb more heat than the liquid fourth medium 340 in the first sub-region 1111, so that the amount of the second medium 320 in the second region 112 is reduced more than the amount of the liquid fourth medium 340 in the first sub-region 1111. Here, the first force can be greater than the second force, so that the first amount can be greater than the second amount, the third force can be greater than the fourth force, so that the third amount can be greater than the fourth amount, so that more of the first medium 310 enters the first sub-region 1111 through the second target member 220, and more of the first medium 310 enters the second region 112 through the first target member 210, thereby further reducing the risk of dry burning of the second medium 320 in the second region 112, and thereby greatly improving the stability of the heat dissipation device in dissipating heat from the electronic device; and the flow rate of the first medium 310 can also be improved.

[0116] In some embodiments of the present disclosure, in the heat absorption state, the first medium 310 in the liquid state in the second medium 320 can be switched to the first medium 310 in the gaseous state by heat absorption, the first medium 310 in the gaseous state can be switched to the first medium 310 in the liquid state by heat release in the second sub-region 1112, the first medium 310 in the liquid state in the fourth medium 340 formed by the first medium 310 in the first sub-region 1111 entering the second region 112 through the second target piece 220 and the fifth medium 350 can be switched to the second medium 320 by the first medium 310 in the second region 112 through the first target piece 210; the second medium 320 can form the third medium 330 and the first medium 310 in the gaseous state again by heat absorption, and the cycle is repeated, so that the heat dissipation device can continuously dissipate heat for the heat generating piece. At the same time, since the second medium 320 has the first force on the first medium 310 in the liquid state in the first sub-region 1111, the first medium 310 in the liquid state in the first sub-region 1111 can also flow back to the second region 112 more quickly, and since the fourth medium 340 has the third force on the first medium 310 in the liquid state in the second sub-region 1112, the first medium 310 in the liquid state in the second sub-region 1112 can also flow back to the first sub-region 1111 more quickly; so as to improve the flow rate of the first medium 310, and further improve the ability of the heat dissipation device to circulate heat dissipation.

[0117] In some embodiments, in the heat absorption state, the first medium 310 in the liquid state in the fourth medium 340 can be switched to the first medium 310 in the gaseous state by heat absorption, the first medium 310 in the gaseous state can be switched to the first medium 310 in the liquid state by heat release in the second sub-region 1112, and the first medium 310 in the liquid state can form the fourth medium 340 by entering the first sub-region 1111 through the second target piece 220 and the fifth medium 350; the fourth medium 340 can form the fifth medium 350 and the first medium 310 in the gaseous state again by heat absorption, and the cycle is repeated, so that the heat dissipation device can continuously dissipate heat for the heat generating piece.

[0118] In some embodiments of the present disclosure, the first target piece 210, the second target piece 220, the second region 112, the first sub-region 1111 and the second sub-region 1112 are located on the side of the first wall body 120 of the body 100; see Figure 6 , the accommodation cavity 110 can have a third region 113 located on the side away from the first wall body 120 Figure 6The third region 113 is in communication with the second region 112, the first sub-region 1111 and the second sub-region 1112, respectively; the third region 113 can be used to accommodate the gaseous first medium 310; the heat dissipation device can include: a first capillary structure 410, a second capillary structure 420 and a third capillary structure 430. The first capillary structure 410 can be arranged in the second region 112 by bonding, clamping, welding, sintering or the like; the first capillary structure 410 is used to lock the second medium 320 to prevent the second medium 320 from entering the third region 113; the second capillary structure 420 can be arranged in the first sub-region 1111 by bonding, clamping, welding, sintering or the like; the second capillary structure 420 is used to lock the fourth medium 340 to prevent the fourth medium 340 from entering the third region 113; the third capillary structure 430 can be arranged in the second sub-region 1112 by bonding, clamping, welding, sintering or the like; the third capillary structure 430 is used to lock the liquid first medium 310 to prevent the liquid first medium 310 from entering the third region 113.

[0119] It should be noted that, Figures 5 to 7 The first medium 310 in the figure is used to indicate the position of the liquid first medium 310; the gaseous first medium 310 can be located in the third region 113, can be located in the space of the second region 112 not occupied by the second medium 320, can be located in the space of the first sub-region 1111 not occupied by the liquid fourth medium 340, and can be located in the space of the second sub-region 1112 not occupied by the liquid first medium 310.

[0120] The third region 113 can be an overall region not separated by the first target piece 210 and the second target piece 220; since the third region 113 can not be provided with structures such as the first target piece 210 and the second target piece 220, the gaseous first medium 310 can pass through the third region 113 without obstruction to achieve rapid movement, thereby improving the ability of the heat dissipation device to circulate heat dissipation; here, the third region 113 is not completely separated by the first target piece 210 and the second target piece 220. Of course, in other embodiments, the third region 113 can also be completely separated by the first target piece 210 and the second target piece 220; here, the third region 113 on the side of the second region 112, the third region 113 on the side of the first sub-region 1111 and the third region 113 on the side of the second sub-region 1112 are not in communication, the gaseous first medium 310 can enter the first sub-region 1111 from the second region 112 through the first target piece 210, and the gaseous first medium 310 can enter the second sub-region 1112 from the first sub-region 1111 through the second target piece 220. However, the present disclosure is not limited thereto, i.e., those skilled in the art can adjust or arrange according to specific needs.

[0121] In some embodiments, the third capillary structure 430 has third capillary holes, and the third capillary structure 430 can lock the first medium 310 in liquid state in the third capillary holes of the third capillary structure 430 by the third capillary force of the third capillary holes, so as to prevent the first medium 310 in liquid state from flowing from the second sub-region 1112 to the third region 113 and entering the first sub-region 1111; but the first medium 310 in liquid state can flow through the second capillary holes of the second capillary structure 420.

[0122] Here, the first medium 310 can be locked in the third capillary holes of the third capillary structure 430 by the third capillary structure 430, and the setting space and range of the first medium 310 can also be increased. As an example, as shown in Figs. 7 and 8, the third capillary structure 430 can be arranged in a ring shape along the circumference of the body 100, and here, the first medium 310 can also be arranged in a ring shape along the circumference of the body 100, and here, the acting force of the third capillary structure 430 on the first medium 310 can be greater than the gravity of the first medium 310, so as to enable the first medium 310 to be stably located in the third capillary structure 430, and here, the first medium 310 can be prevented from entering the third region 113 in various conditions such as horizontal placement or inclined placement of the body 100. Figure 5 and Figure 6 As shown in Figs. 7 and 8, the third capillary structure 430 can be arranged in a ring shape along the circumference of the body 100, and here, the first medium 310 can also be arranged in a ring shape along the circumference of the body 100, and here, the acting force of the third capillary structure 430 on the first medium 310 can be greater than the gravity of the first medium 310, so as to enable the first medium 310 to be stably located in the third capillary structure 430, and here, the first medium 310 can be prevented from entering the third region 113 in various conditions such as horizontal placement or inclined placement of the body 100.

[0123] The volume of the third capillary hole is not limited. For example, the volume of the third capillary hole can be greater than or equal to the volume of the first medium 310, so as to enable the first medium 310 to be located in the third capillary hole. Of course, the volume of the third capillary hole can also be less than the volume of the first medium 310, so as to enable the first medium 310 to be partially located in the third capillary hole, and here, the third region 113 can also be completely separated by the second target piece 220, and the fifth medium 350 in the fourth medium 340 can be prevented from flowing into the second sub-region 1112 by the second target piece 220. In the case that the volume of the third capillary hole is equal to or substantially equal to the volume of the first medium 310, the first medium 310 in liquid state can be located in the third capillary hole, and the space occupied by the third capillary structure 430 can be reduced, and the space occupied by the first medium 310 in gaseous state can be increased, so as to improve the utilization rate of the accommodating cavity 110.

[0124] The third capillary structure 430 can be formed by sintering of metal powder, metal wire mesh, etc. In this case, the third capillary structure 430 has good thermal conductivity, and the heat dissipation efficiency of the heat dissipation device can be further improved. For example, the third capillary structure 430 can be formed by mechanical cutting, chemical etching, laser etching, etc. of metal blocks, metal strips, etc. In this case, the third capillary structure 430 has good thermal conductivity, and the heat dissipation efficiency of the heat dissipation device can be further improved. For example, the third capillary structure 430 can also be formed by mechanical cutting, chemical etching, laser etching, etc. of non-metal blocks, non-metal strips, etc.

[0125] In some embodiments, the second capillary structure 420 can lock the fourth medium 340 in the second capillary hole of the second capillary structure 420 by the second capillary force of the second capillary hole, so as to prevent the fourth medium 340 from flowing from the first sub-region 1111 to the third region 113 and entering the second region 112; or from the first sub-region 1111 to the third region 113 and entering the second sub-region 1112. However, the fourth medium 340 in liquid state can flow through the second capillary hole of the second capillary structure 420.

[0126] In some embodiments, the volume of the first capillary structure 410 in the unit space of the second region 112 can be greater than the volume of the second capillary structure 420 in the unit space of the first sub-region 1111, and the volume of the second capillary structure 420 in the unit space of the first sub-region 1111 can be greater than the volume of the third capillary structure 430 in the unit space of the second sub-region 1112; so as to lock the largest amount of the second medium 320 by the first capillary structure 410 with the largest volume, lock a larger amount of the fourth medium 340 by the second capillary structure with a relatively larger volume, and lock a smaller amount of the first medium 310 in liquid state by the third capillary structure 430 with a relatively smaller volume, so as to reasonably utilize the accommodation cavity 110 and improve the heat dissipation efficiency of the heat dissipation device. Of course, in other embodiments, the volume of the first capillary structure 410 in the unit space of the second region 112 can also be less than or equal to the volume of the second capillary structure 420 in the unit space of the first sub-region 1111, and the volume of the second capillary structure 420 in the unit space of the first sub-region 1111 can also be less than or equal to the volume of the third capillary structure 430 in the unit space of the second sub-region 1112.

[0127] The volume of the first capillary structure 410 in the unit space of the second region 112 is not limited, the volume of the second capillary structure 420 in the unit space of the first sub-region 1111 is not limited, and the volume of the third capillary structure 430 in the unit space of the second sub-region 1112 is not limited. For example, the volume of the first capillary structure 410 in the unit space of the second region 112 can be 1 cubic centimeter of the volume of the first capillary structure 410 in the second region 112, the volume of the second capillary structure 420 in the unit space of the first sub-region 1111 can be 1 cubic centimeter of the volume of the second capillary structure 420 in the first sub-region 1111, and the volume of the third capillary structure 430 in the unit space of the second sub-region 1112 can be 1 cubic centimeter of the volume of the third capillary structure 430 in the second sub-region 1112. Here, 1 cubic centimeter of the volume of the first capillary structure 410 in the second region 112 can be 0.4 cubic centimeters to 0.5 cubic centimeters, 1 cubic centimeter of the volume of the second capillary structure 420 in the first sub-region 1111 can be 0.3 cubic centimeters to 0.4 cubic centimeters, and 1 cubic centimeter of the volume of the third capillary structure 430 in the second sub-region 1112 can be 0.2 cubic centimeters to 0.3 cubic centimeters. As an example, 1 cubic centimeter of the volume of the first capillary structure 410 in the second region 112 can be 0.35 cubic centimeters, 1 cubic centimeter of the volume of the second capillary structure 420 in the first sub-region 1111 can be 0.25 cubic centimeters, and 1 cubic centimeter of the volume of the third capillary structure 430 in the second sub-region 1112 can be 0.2 cubic centimeters. As another example, 1 cubic centimeter of the volume of the first capillary structure 410 in the second region 112 can be 0.45 cubic centimeters, 1 cubic centimeter of the volume of the second capillary structure 420 in the first sub-region 1111 can be 0.35 cubic centimeters, and 1 cubic centimeter of the volume of the third capillary structure 430 in the second sub-region 1112 can be 0.25 cubic centimeters.As a further example, the body is tubular, the cross-sectional dimension of the body at the first region and the second region can be substantially the same; the volume of the second sub-region 1112 can be 1 cubic centimeter, the volume of the first sub-region 1111 can be 1 cubic centimeter, the volume of the second region 112 can be 1 cubic centimeter; the length of the second sub-region 1112 can be 20 mm, the length of the first sub-region 1111 can be 20 mm, the length of the second region 112 can be 20 mm; the volume of the third capillary structure 430 within the 1 cubic centimeter second sub-region 1112 (length of 20 mm) can be 0.25 cubic centimeter, the volume of the second capillary structure 420 within the 1 cubic centimeter first sub-region 1111 (length of 20 mm) can be 0.35 cubic centimeter, the volume of the first capillary structure 410 within the 1 cubic centimeter second region 112 (length of 20 mm) can be 0.45 cubic centimeter; here, the height of the third capillary structure 430 within the second sub-region 1112 is less than the height of the second capillary structure 420 within the first sub-region 1111, the height of the second capillary structure 420 within the first sub-region 1111 is less than the height of the first capillary structure 410 within the second region 112, see Figure 7 as shown; here, the height of the third capillary structure 430 at each location of the second sub-region 1112 can be the same, the height of the second capillary structure 420 at each location of the first sub-region 1111 can be the same, the height of the first capillary structure 410 at each location of the second region 112 can be the same. But the present disclosure is not limited thereto, i.e. one skilled in the art can adjust or set etc. according to specific needs.

[0128] In some embodiments, the shape of the second target piece 220 is not limited. For example, as shown in Figure 5 and Figure 6 shown, the body 100 can be in a tubular structure, the second target piece 220 can be in a ring structure, the first wall body 120 of the body 100 can be all of the side walls of the body 100 in the circumferential direction, and the first wall body 120 can be in a cylindrical shape. Of course, the second target piece 220 can be in a half-ring structure, the first wall body 120 of the body 100 can be part of the side walls of the body 100 in the circumferential direction, and the first wall body 120 can be in a half-ring shape. For another example, the body 100 can be in a plate structure. The second target piece 220 can be in a ring structure, the first wall body 120 of the body 100 can be all of the side walls of the body 100 in the circumferential direction, and the first wall body 120 can be in a ring shape. Of course, the second target piece 220 can also be in a plate structure, the first wall body 120 of the body 100 can also be a side wall of the body 100, and the first wall body 120 can also be in a plate shape. But the present disclosure is not limited thereto, i.e. one skilled in the art can adjust or set etc. according to specific needs.

[0129] In some embodiments, the height of the first wall 120 side of the second target piece 220 protruding body 100 can be greater than the height of the second capillary structure 420, as shown in FIG. 4B. Of course, the height of the first wall 120 side of the second target piece 220 protruding body 100 can also be equal to or substantially equal to the height of the second capillary structure 420, as shown in FIG. 4C, so as to form a third region 113 of a larger space, thereby more reasonably utilizing the space of the accommodation cavity 110 and improving the heat dissipation efficiency of the heat dissipation device. Figure 6 Figure 7 Of course, the height of the first wall 120 side of the second target piece 220 protruding body 100 can also be equal to or substantially equal to the height of the second capillary structure 420, as shown in FIG. 4C, so as to form a third region 113 of a larger space, thereby more reasonably utilizing the space of the accommodation cavity 110 and improving the heat dissipation efficiency of the heat dissipation device.

[0130] Some embodiments of the present disclosure also provide a manufacturing method of a heat dissipation device, comprising:

[0131] Step 501, placing the first target piece 210 between the first space 641 and the second space 642 of the cavity of the main body 600 to separate the first space 641 and the second space 642.

[0132] Step 502, placing the third medium 330 in the second space 642; the first target piece 210 is used to limit the third medium 330 in the second space 642.

[0133] Step 503, placing the first medium 310 in a liquid state in the cavity of the main body 600; wherein the first medium 310 can move between the first space 641 and the second space 642 through the first target piece 210; the third medium 330 and the first medium 310 in a liquid state in the second space 642 are used to form the second medium 320;

[0134] Step 504, sealing the opening of the main body 600, so that the cavity of the main body 600 forms a sealed cavity.

[0135] The above embodiments have described the first target piece 210, the third medium 330, the second medium 320 and the first medium 310, which will not be described here.

[0136] In the embodiments of the present disclosure, the order of steps 501 and 502 is not limited, and in the manufacturing process of the heat dissipation device, step 501 can be performed first, and then step 502 can be performed; or step 502 can be performed first, and then step 501 can be performed. Through steps 501 and 502, the third medium 330 can be limited in the second space 642.

[0137] ​In some embodiments, the structure of the main body 600 is not limited. For example, the shape of the main body 600 can be the same as the shape of the body 100; here, the entire or part of the main body 600 can form the body 100 after the heat dissipation device is manufactured, and here, the shape of the second space 642 and the second area 112 can be the same or substantially the same, and the shape of the first space 641 and the first area 111 can be the same or substantially the same. The shape of the first target piece 210 here can be the same as the shape of the first target piece 210 of the heat dissipation device in the above embodiments. For another example, the shape of the main body 600 can be different from the shape of the body 100. Here, the manufacturing method of the heat dissipation device can include: flattening the sealed main body 600 to make the main body 600 form a body 100 with a thinner thickness, so as to set the heat dissipation device in a thinner space, and here, the shape of the second space 642 and the second area 112 is different, the second area 112 can be deformed from the second space 642, and the first area 111 can be deformed from the first space 641. The shape of the first target piece 210 here can be different from the shape of the first target piece 210 of the heat dissipation device in the above embodiments.

[0138] In some embodiments, the implementation of step 501 is not limited. For example, step 501 can include cutting the main body 600 into the first part 610 and the second part 620 by means of a cutter, laser cutting, etc., so that the second space 642 is located in the second part 620 and the first space 641 is located in the first part 610; the first target piece 210 is connected to the second part 620 and the first part 610 respectively by means of bonding, clamping, welding, etc., so that the first target piece 210 is located between the first space 641 and the second space 642. For another example, the first target piece 210 can be directly placed between the first space 641 and the second space 642 of the cavity of the main body 600 by means of a jig, a tooling, a robot, etc., to separate the first space 641 and the second space 642. However, the present disclosure is not limited thereto, i.e., those skilled in the art can adjust or set, etc. according to specific needs.

[0139] In some embodiments, the implementation of step 502 is not limited. For example, the third medium 330 can be placed in the second space 642 by means of a fixture, tooling, or robotic arm. Here, the third medium 330 is generally in the form of a non-flowing powder, granules, or gel, and can be stably located in the second space 642. Here, the third medium 330 can also be in the form of a viscous liquid. As an example, the third medium 330 can be polyethylene glycol (PEG), and the third medium 330 can also be stably located in the second space 642. As another example, the solution formed by the third medium 330 and the first medium 310 can be placed in the second space 642 by means of a fixture, tooling, or robotic arm. Since the third medium 330 in the solution formed by the third medium 330 and the first medium 310 cannot pass through the first target 210, the third medium 330 can be stably located in the second space 642. At the same time, the third medium 330 can be evenly distributed in various regions of the second space 642 by being distributed within the first medium 310. The first medium 310 can be evaporated by heating, natural drying, or other methods. Here, the third medium 330 can be evenly distributed in each region of the second space 642. By placing the solution formed by the third medium 330 and the first medium 310 in the second space 642, the third medium 330 can be evenly distributed in each region of the second space 642. However, this disclosure is not limited to this, meaning that those skilled in the art can adjust or set it according to specific needs.

[0140] The implementation method of the first target component 210 for confining the third medium 330 within the second space 642 is similar to the implementation method of the first target component 210 for confining the third medium 330 within the second region 112, and will not be repeated here.

[0141] In some embodiments, the implementation of step 503 is not limited. For example, the liquid first medium 310 can be placed into the cavity of the main body 600 by means of a fixture, tooling, or robotic arm. As an example, the liquid first medium 310 can be placed in the first space 641 or the second space 642 of the main body 600 by means of a fixture, tooling, or robotic arm.

[0142] In some embodiments, the implementation of step 504 is not limited. For example, the opening of the main body 600 can be directly blocked by means of bonding, welding, etc., so that the cavity of the main body 600 forms a sealed cavity.

[0143] Here, the opening 601 of the main body 600 can be an opening 601 that communicates with a cavity of the main body 600. For example, as Figure 9 As shown, the main body 600 can be tubular, and the opening 601 of the main body 600 can be an opening 601 at one end or both ends of the main body 600.

[0144] In some embodiments, before the opening of the main body 600 is sealed, the opening area of the main body 600 can be necked down by rotating die radial compression, hydraulic expansion pipe shrinking, roller pipe shrinking, etc. to form an opening of the main body 600 with a smaller cross-sectional area. By reducing the opening area of the main body 600 and then sealing, the service life of the heat dissipation device can be improved.

[0145] In some embodiments, the manufacturing method can include:

[0146] Step 505, placing the to-be-processed piece in the second space 642 of the main body 600.

[0147] Step 506, sintering the main body 600 to form the first capillary structure 410 of the to-be-processed piece in the second space 642.

[0148] Step 507, placing the to-be-processed piece in the first space 641 of the main body 600.

[0149] Step 508, sintering the main body 600 to form the second capillary structure 420 of the to-be-processed piece in the first space 641.

[0150] The above embodiments have described the first capillary structure 410 and the second capillary structure 420, which will not be described here. It should be noted that the shape of the first capillary structure 410 here can be the same as or different from the first capillary structure 410 of the heat dissipation device described above. In the case where the main body 100 is flattened by the main body 600, the first capillary structure 410 here is flattened and deformed to form the first capillary structure 410 of the heat dissipation device described above. The shape of the second capillary structure 420 here can be the same as or different from the second capillary structure 420 of the heat dissipation device described above. In the case where the main body 100 is flattened by the main body 600, the second capillary structure 420 here is flattened and deformed to form the second capillary structure 420 of the heat dissipation device described above.

[0151] The sequence of steps 505, 506, 507, and 508 is not limited. For example, the manufacturing method can include first performing steps 505 and 507, and the sequence of steps 505 and 507 is not limited; then performing steps 506 and 508, and the sequence of steps 506 and 508 is not limited. Steps 506 and 508 can be performed simultaneously or separately.

[0152] The structure of the to-be-processed piece is not limited. For example, the to-be-processed piece can be a metal powder, a metal wire mesh, etc.

[0153] In some embodiments, the implementation of step 505 is not limited. For example, the piece to be processed can be placed in the second space 642 of the main body 600 by means of a jig, a tooling, a robot hand, etc. The implementation of step 507 is not limited. For example, the piece to be processed can be placed in the first space 641 of the main body 600 by means of a jig, a tooling, a robot hand, etc.

[0154] In some embodiments, the implementation of step 506 is not limited. For example, the main body 600 can be placed into a bell jar atmosphere sintering furnace, a push cart screw lift furnace, a vacuum / atmosphere tube sintering furnace, a special VC (hot plate) sintering furnace, etc. by means of a jig, a tooling, a robot hand, etc. so that the temperature of the main body 600 reaches a temperature at which the piece to be processed can be solidified on the wall of the main body 600 to build a porous capillary layer, so that the piece to be processed forms the first capillary structure 410 in the second space 642. The implementation of step 508 is not limited. For example, the main body 600 can be placed into a bell jar atmosphere sintering furnace, a push cart screw lift furnace, a vacuum / atmosphere tube sintering furnace, a special VC (hot plate) sintering furnace, etc. by means of a jig, a tooling, a robot hand, etc. so that the temperature of the main body 600 reaches a temperature at which the piece to be processed can be solidified on the wall of the main body 600 to build a porous capillary layer, so that the piece to be processed forms the second capillary structure 420 in the first space 641.

[0155] The sequence of steps 507, 508, and 501 is not limited. For example, steps 507 and 508 can be formed after step 501. As an example, the first capillary structure 410, the second capillary structure 420, or the first capillary structure 410 and the second capillary structure 420 can be formed after the first target piece 210 is placed in the cavity of the main body 600. As another example, steps 507 and 508 can be formed before step 501.

[0156] As an example, the manufacturing method can include: step 501, placing the first target piece 210 between the first space 641 and the second space 642 of the cavity of the main body 600 to separate the first space 641 and the second space 642. Step 505, placing the piece to be processed in the second space 642 of the main body 600. Step 507, placing the piece to be processed in the first space 641 of the main body 600. Step 506, sintering the main body 600 to form the first capillary structure 410 in the second space 642 of the piece to be processed. Step 508, sintering the main body 600 to form the second capillary structure 420 in the first space 641 of the piece to be processed. Step 502, placing the third medium 330 in the second space 642. Step 503, placing the first medium 310 in a liquid state in the cavity of the main body 600; and step 504, sealing the opening of the main body 600 to form a sealed cavity in the cavity of the main body 600. Thus, a heat dissipation device is formed, see Figure 8Fig. 6 shows a partial structure of the heat dissipation device. Here, the order of step 505 and step 507 is not limited. Here, the order of step 506 and step 508 is not limited. As an example, step 506 and step 508 can be performed simultaneously.

[0157] It is noted that the melting point of the first target piece 210 is greater than the sintering temperature of the capillary structure. For example, the material of the first target piece 210 can be high melting point material such as alumina. The melting point of alumina is 2050C. The first target piece 210 formed by the material of alumina can improve the mechanical strength, good thermal stability and chemical stability of the first target piece 210.

[0158] As another example, the main body 600 is a tubular structure. The manufacturing method can include: first, necking the opening region of one end of the main body 600. Step 507, placing the piece to be processed in the first space 641 of the main body 600. Here, the piece to be processed can be placed in the first space 641 from the opening region of the other end of the main body 600. Step 508, sintering the main body 600 to form the second capillary structure 420 in the first space 641 of the main body 600. Step 501, placing the first target piece 210 between the first space 641 and the second space 642 of the cavity of the main body 600 to separate the first space 641 and the second space 642. Here, the first target piece 210 can be placed between the first space 641 and the second space 642 of the cavity of the main body 600 from the opening region of the other end of the main body 600. Step 505, placing the piece to be processed in the second space 642 of the main body 600. Step 506, sintering the main body 600 to form the first capillary structure 410 in the second space 642 of the main body 600. Step 502, placing the third medium 330 in the second space 642. Step 501 again, placing the first target piece 210 between the second space 642 and the first space 641 of the cavity of the main body 600 to separate the second space 642 and the first space 641. Step 507 again, placing the piece to be processed in the first space 641 of the main body 600. Step 508 again, sintering the main body 600 to form the second capillary structure 420 in the first space 641 of the main body 600. Step 503, placing the first medium 310 in the liquid state in the cavity of the main body 600; Step 504, sealing the opening of the main body 600 to form a sealed cavity in the cavity of the main body 600. Thus, the heat dissipation device is formed, see Fig. 6. Figure 3 and Figure 4 Fig. 6 shows a partial structure of the heat dissipation device. Here, the order of step 505 and step 507 is not limited. Here, the order of step 506 and step 508 is not limited. As an example, step 506 and step 508 can be performed simultaneously.

[0159] As another example, the main body 600 is a tubular structure. The manufacturing method can include: step 505, placing the piece to be processed in the second space 642 of the main body 600. Step 506, sintering the main body 600 to form the first capillary structure 410 in the second space 642 of the piece to be processed. Step 507, placing the piece to be processed in the first space 641 of the main body 600. Step 508, sintering the main body 600 to form the second capillary structure 420 in the first space 641 of the piece to be processed. The main body 600 is divided into the second part 620, the first part 610 and the third part 630. The second part 620, the first part 610 and the third part 630 are all tubular structures, as shown in Figure 9 , where the first capillary structure 410 can be formed in the cavity (the second space 642) of the second part 620, and the second capillary structure 420 can be formed in the cavity (the first space 641) of the first part 610 and the third part 630, as shown in Figure 3 and Figure 4 . Step 502, placing the third medium 330 in the second space 642 (the cavity of the second part 620). Step 501, placing the first target piece 210 between the first space 641 and the second space 642 of the cavity of the main body 600 to separate the first space 641 and the second space 642. Here, one of the two first target pieces 210 can be connected to the second part 620 and the third part 630 respectively, and the other of the two first target pieces 210 can be connected to the second part 620 and the first part 610 respectively. Step 503, placing the first medium 310 in the liquid state in the cavity of the main body 600; step 504, sealing the opening of the main body 600 to form a sealed cavity in the cavity of the main body 600. Thus, a heat dissipation device is formed, as shown in Figure 3 and Figure 4 , which are partial structure schematic diagrams of the heat dissipation device.

[0160] It should be noted that the melting point of the first target piece 210 can be lower than the sintering temperature of the capillary structure, so that the selection range of the material of the first target piece 210 is wider, and the manufacturing method of the heat dissipation device can be simplified.

[0161] Here, the main body 600 can be directly formed into the body 100 without flattening, as shown in Figure 11 . Of course, the main body 600 can also be flattened to form the body 100, as shown in Figure 10 .

[0162] As an example, the solution formed by the third medium 330 and the first medium 310 can be placed in the first capillary structure 410 of the second space 642 by means of a jig, a tool, a robot, etc. The third medium 330 can be stably positioned in the second space 642 due to the capillary force of the first capillary structure 410, and the third medium 330 can be uniformly positioned in each region of the second space 642 by being distributed in the first medium 310. The first medium 310 can be evaporated by heating, natural cooling, etc. Here, the third medium 330 can be uniformly positioned in each region of the first capillary hole of the first capillary structure 410 of the second space 642. By placing the solution formed by the third medium 330 and the first medium 310 in the second space 642, the third medium 330 can be uniformly positioned in each region of the first capillary hole of the first capillary structure 410 of the second space 642. However, the present disclosure is not limited thereto, i.e., a person skilled in the art can adjust or set, etc. according to specific needs.

[0163] In the specific embodiments, various specific technical features described can be combined in any suitable manner without contradiction, e.g., different embodiments and technical solutions can be formed by combination of different specific technical features. In order to avoid unnecessary repetition, various possible combinations of various specific technical features in the present disclosure are not described again.

[0164] The above is merely a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present disclosure, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A heat dissipation device, comprising: a body comprising a containing cavity; a first target member disposed in the containing cavity, the containing cavity being divided into a first region and a second region by the first target member; a first medium disposed in the containing cavity, the first medium being switchable from a liquid state to a gaseous state; the first medium being movable between the first region and the second region by the first target member; a second medium disposed in the second region, the second medium being in a liquid state, the second medium being formed by a third medium and the first medium in a liquid state, the first target member being configured to confine the third medium in the second region, in a case that the first medium in a liquid state in the second medium is switched from a liquid state to a gaseous state, the second medium being converted into the first medium in a gaseous state and the third medium; an amount of the second medium per unit space in the second region being greater than an amount of the first medium in a liquid state per unit space in the first region.

2. The heat dissipation device according to claim 1, the second medium and / or the third medium having a first force on the first medium in a liquid state in the first region, the first force being capable of causing a first amount of the first medium in a liquid state in the first region to enter the second region from the first target member; the second medium having a second force on the first medium in the second region, the second force being capable of causing a second amount of the first medium in a liquid state in the second medium to enter the first region from the first target member; wherein the first amount and the second amount being the same.

3. The heat dissipation device according to claim 1, in a case that the second medium is in an endothermic state, the first medium in a liquid state in the second medium being switchable to the first medium in a gaseous state by endothermic, the first medium in a gaseous state being switchable to the first medium in a liquid state by exothermic in the first region, the first medium in a liquid state being capable of entering the second region from the first target member to form the second medium with the third medium.

4. The heat dissipation device according to claim 1, in a case that temperatures of the second region and the first region are the same, an amount of endothermic of the second medium per unit space in the second region being greater than an amount of endothermic of the first medium in a liquid state per unit space in the first region.

5. The heat dissipation device according to claim 1, the first target member comprising a semi-permeable membrane; the first medium being a solvent, the third medium being a solute, a first boiling point of the first medium being less than a second boiling point of the third medium.

6. The heat dissipating device of claim 1, wherein the first target member, the first region and the second region are located on a first wall side of the body; and the accommodating cavity further has a third region located away from the first wall side. the third region being in communication with the first region and the second region respectively; the third region being configured to contain the first medium in a gaseous state; the heat dissipation device further comprising: a first capillary structure disposed in the second region; the first capillary structure being configured to lock the second medium to prevent the second medium from entering the third region; a second capillary structure disposed in the first region; the second capillary structure being configured to lock the first medium in a liquid state to prevent the first medium in a liquid state from entering the third region. The volume of the first capillary structure in the second region unit space is greater than the volume of the second capillary structure in the first region unit space.

7. The heat dissipation device of claim 1, further comprising: a second target member disposed in the first region, the second target member separating the first region into a first sub-region and a second sub-region, the second sub-region being located on a side of the first sub-region distal to the second region; a fourth medium disposed in the first sub-region, the fourth medium being formed from a fifth medium and the first medium in a liquid state, the second target member being configured to confine the fifth medium in the first sub-region; the first medium being movable between the second sub-region and the first sub-region via the second target member; a concentration of the fifth medium in the fourth medium being less than a concentration of the third medium in the second medium, the concentration of the fifth medium in the fourth medium being configured to increase a rate of flow of the first medium from the second sub-region to the first sub-region.

8. An electronic device, comprising: a heat generating member; a body including a receiving cavity, the body being configured to absorb heat from the heat generating member; a first target member disposed in the receiving cavity, the first target member separating the receiving cavity into a first region and a second region; a first medium disposed in the receiving cavity, the first medium being switchable from a liquid state to a gaseous state, the first medium being movable between the first region and the second region via the first target member; a second medium disposed in the second region, the second medium being in a liquid state, the second medium being formed from a third medium and the first medium in a liquid state, the first target member being configured to confine the third medium in the second region; in the event that the first medium in a liquid state in the second medium switches from the liquid state to the gaseous state, the second medium being converted to the first medium and the third medium in the gaseous state; an amount of the second medium in a unit space of the second region being greater than an amount of the first medium in a liquid state in a unit space of the first region.

9. A method of manufacturing a heat dissipation device, comprising: positioning a first target member between a first space and a second space of a cavity of a body to separate the first space and the second space; positioning a third medium in the second space, the first target member being configured to confine the third medium in the second space; positioning a first medium in a liquid state in the cavity of the body, the first medium being movable between the first space and the second space via the first target member, the third medium and the first medium in a liquid state being configured to form a second medium in the second space; sealing an opening of the body to form a sealed cavity from the cavity of the body.

10. The method of claim 9, further comprising: positioning a to-be-processed member in the second space of the body; sintering the body to form a first capillary structure of the to-be-processed member in the second space; positioning the to-be-processed member in the first space of the body; sintering the body to form a second capillary structure of the to-be-processed member in the first space.

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