Chip mounting mechanism for electronic component processing

Abstract

The invention relates to the technical field of chip mounting mechanisms, in particular to a chip mounting mechanism for electronic component processing, which comprises a shell, a mechanical arm is arranged in the shell, the chip mounting mechanism further comprises a connecting plate, the connecting plate is fixed at the end part of the mechanical arm, a strip-shaped groove is formed in the top surface of the connecting plate, an air delivery pipe is inserted in the strip-shaped groove, and the air delivery pipe is fixed in the shell. One end of the air delivery pipe is connected with negative pressure equipment; the two sliding blocks are both connected to the bottom of the connecting plate in a sliding mode, through holes are formed in the surfaces of the sliding blocks, the gas conveying pipes fixedly communicate with the through holes, and extension pipes are fixed to the bottoms of the through holes; according to the invention, the two adsorption heads are configured, and the sizes of the adsorption holes of the two adsorption heads are different, so that different types of electronic components can be adapted; when encountering part of electronic elements which are difficult to process in an adsorption mode, the two adsorption heads can be adjusted to be close to each other to clamp the elements, so that the replacement frequency of the adsorption heads is reduced, and the production and processing efficiency is guaranteed.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of patch mechanism, especially to a patch mechanism for electronic component processing. BACKGROUND

[0002] The traditional patch machine is originally designed for mass production scene, and it often takes a long time to switch production lines. Manual adjustment of various parameters is required during program conversion, which makes it difficult to meet the production needs of small batch orders. When processing small batch orders, the types of components involved are often more diverse. The top surface structure of some components is special, making it difficult to form a stable adsorption area. This makes the adsorption head have to be replaced frequently. Even if some patch machines can automatically replace the adsorption head, the replacement process will also consume a lot of time and affect the processing efficiency. SUMMARY

[0003] The purpose of the present application is to solve the problem of low processing efficiency in the prior art when processing multiple types of patching procedures. A patch mechanism for electronic component processing is proposed.

[0004] To achieve the above purpose, the technical scheme adopted by the present application is as follows: a patch mechanism for electronic component processing, comprising a shell, a mechanical arm is arranged in the shell, and further comprising: A connecting plate is fixed to the end of the mechanical arm, a strip-shaped slot is formed on the top surface of the connecting plate, a gas delivery pipe is inserted into the strip-shaped slot, and one end of the gas delivery pipe is connected with a negative pressure device; Two sliders are slidingly connected to the bottom of the connecting plate, a through hole is formed on the surface of the slider, the gas delivery pipe is fixedly communicated with the through hole, and an extension pipe is fixed to the bottom of the through hole; Two pushers are symmetrically fixed to the bottom surface of the connecting plate, and the movable ends of the two pushers are fixed with the sliders; An adsorption head is fixed on both sides of the adsorption head, the fixed end of the puller is fixed with the slider, a sliding slot is formed on the top of the adsorption head, the extension pipe is slidingly inserted into the sliding slot, and the extension pipe is fixedly communicated with the sliding slot.

[0005] Specifically, the present application is configured with two adsorption heads, the sizes of the adsorption holes of the two adsorption heads are different, so as to adapt to different types of electronic components. When some electronic components are difficult to process by adsorption, the two adsorption heads can be adjusted to approach each other to clamp the components, thereby reducing the replacement frequency of the adsorption head and ensuring the efficiency of production and processing.

[0006] Further, the pushing member and the pulling member are driven by electric push rods, in the initial state, the pulling member is in the retracted state, the bottoms of the two suction heads are kept in the same horizontal plane, when the suction heads are needed to work, the pulling member is started to be elongated, and then the corresponding suction head is pushed downward, so that the bottoms of the two suction heads are staggered in height, so as to avoid the mutual interference between them.

[0007] In the process of suction work, first adjust the position of the suction head by the mechanical arm, so that the suction head is in contact with the surface of the element, and then start the negative pressure device to extract the gas in the gas conveying pipe; the gas conveying pipe is connected with the inside of the suction head through the extension pipe, so that the negative pressure environment is formed in the inside of the suction head, so as to suck and convey the element to the specified position.

[0008] When clamping operation is performed, first start the pulling member, so that the two pulling members are in the retracted state, and the bottoms of the two suction heads return to the same horizontal position; then start the pushing structure, the pushing structure drives the two sliders to approach each other, and the two sliders in turn drag the suction heads connected therewith to gradually approach, and then the clamping operation of the element is completed.

[0009] Preferably, the surface of the suction head is provided with a mounting groove, and the flexible pad is fixed in the mounting groove.

[0010] Preferably, the inner wall of the sliding groove is provided with an expansion groove and an arc-shaped groove, the bottom of the extension pipe is in a closed state, a plurality of exhaust grooves are formed in the side wall of the extension pipe, a plurality of suction channels are formed in the surface of the suction head, a plurality of suction grooves are formed in the surface of the flexible pad, the suction grooves and the suction channels are connected with each other, the suction channels are connected with the inside of the arc-shaped groove, and the inside of the suction channel is provided with an adjusting mechanism.

[0011] Preferably, the adjusting mechanism comprises a first pipe body, the first pipe body is fixed in the inside of the suction channel, a support is fixed in the first pipe body, a sliding rod is slidably connected to the surface of the support, a blocking plate is fixed to one end of the sliding rod close to the arc-shaped groove, a first spring is fixed between the blocking plate and the support, the other end of the sliding rod is fixed with a positioning disc, and a limiting assembly is arranged on one side of the positioning disc.

[0012] Preferably, the limiting assembly comprises a second tube and a third tube, the second tube is fixed on one side of the first tube, the third tube is inserted into the second tube, the end of the third tube is inserted into the adsorption groove, the surface of the second tube is provided with a vertical slot, a limiting plate is slidably connected in the vertical slot, the limiting plate is arranged on one side of the positioning disc, the end of the third tube is provided with a U-shaped slot, the surface of the limiting plate is provided with an inclined slot, a guide pin is inserted into the inclined slot, and the two ends of the guide pin are fixed in the U-shaped slot, and the elastic element is fixed between the third tube and the second tube.

[0013] Preferably, the third tube and the inner wall of the adsorption groove have a gap.

[0014] Preferably, the end of the second tube is provided with a ring groove, the elastic element is an elastic ring film, the outer ring surface of the elastic ring film is fixed on the inner wall of the ring groove, the inner ring surface of the elastic ring film is fixed on the outer wall of the third tube, and the ring groove is provided with an exhaust assembly.

[0015] Preferably, the exhaust assembly comprises a gas permeable hole, the gas permeable hole is arranged on the outer wall of the ring groove, the adsorption head is provided with a gas permeable groove, one end of the gas permeable groove is communicated with the outside, the other end of the gas permeable groove is communicated with the gas permeable hole, and the end of the third tube and the slot of the adsorption groove have a gap.

[0016] Specifically, when the electronic element to be processed is of a special shape, the edge of the electronic element often has a difference in thickness, so that only part of the surface of the electronic element can be in contact with the adsorption groove. When the adsorption groove performs the adsorption operation, the local contact is easy to cause air leakage, thereby adversely affecting the overall negative pressure adsorption effect. The elastic ring film is arranged at the connecting position of the third tube and the second tube to solve the problem. When the adsorption groove can be completely attached to the surface of the element, under the extrusion action, the adsorption groove will be deformed, and the internal space will be reduced; at this time, one end of the first tube is tightly blocked by the blocking plate, and the internal gas cannot be discharged, under the action of air pressure, the elastic ring film will be deformed and moved to the inside of the ring groove to provide a gap, and the gas in the ring groove is discharged from the gas permeable hole and the gas permeable groove. At the same time, the elastic ring film will pull the third tube to move, thereby pushing the limiting plate to move, and the limiting effect of the positioning disc is removed, so that a stable negative pressure state is formed in the adsorption groove. When part of the adsorption groove fails to contact the element surface, that is, in the air leakage state, because the end of the third pipe body and the notch of the adsorption groove have a reserved space, even if the element pushes the flexible pad to deform, it will not contact the third pipe body. At the same time, because it is in the air leakage state, it cannot form enough air pressure to push the elastic ring membrane to move, so that it can automatically identify whether the adsorption groove is in full contact with the element. Only when the adsorption groove is in full contact with the element, the negative pressure adsorption function is started, effectively avoiding the problem of overall negative pressure effect decline caused by air leakage.

[0017] Preferably, the inside of the adsorption groove has an arc surface, which is in an outwardly convex state.

[0018] Preferably, the mechanical arm is provided with a feeding frame and a patch frame on both sides, respectively, and a sliding rail is fixed between the feeding frame and the patch frame, and the mechanical arm is in sliding connection with the sliding rail.

[0019] Compared with the prior art, the present application has the following beneficial effects: First, the present application is configured with two adsorption heads, and the sizes of the adsorption holes of the two adsorption heads are different, so as to adapt to different types of electronic elements. When some electronic elements are difficult to handle by adsorption, the two adsorption heads can be adjusted to approach each other to clamp the elements, thereby reducing the replacement frequency of the adsorption heads and ensuring the efficiency of production and processing.

[0020] Second, when in the clamping operation state, the pulling member is in a contracted state, at this time the end of the extension pipe is flush with the bottom of the adsorption head, thereby forming a sealing effect on the bottom of the adsorption head, and the exhaust groove is only in communication with the inside of the arc-shaped groove. The negative pressure environment is generated in the arc-shaped groove, the adsorption channel is opened by the adjusting mechanism, a negative pressure environment is formed in the inside of the adsorption channel, the electronic element can be further adsorbed, and the stability of the clamping operation is enhanced.

[0021] Third, the present application can automatically identify whether the adsorption groove is in full contact with the element. Only when the adsorption groove is in full contact with the element, the negative pressure adsorption function is started, effectively avoiding the problem of overall negative pressure effect decline caused by air leakage. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is the overall structure schematic diagram of the present application.

[0023] Figure 2 It is the overall structure schematic diagram of the present application. Figure 1 It is the enlarged structure schematic diagram of A in the present application.

[0024] Figure 3 It is the structure schematic diagram of the connecting plate, sliding block and adsorption head of the present application.

[0025] Figure 4The cross section structure schematic diagram of the connecting plate, the sliding block and the adsorption head of the application.

[0026] Figure 5 The cross section structure schematic diagram of the connecting plate, the sliding block and the adsorption head of the application. Figure 4 The enlarged structure schematic diagram of B in the connecting plate, the sliding block and the adsorption head of the application.

[0027] Figure 6 The cross section structure schematic diagram of the connecting plate, the sliding block and the adsorption head of the application. Figure 5 The enlarged structure schematic diagram of C in the connecting plate, the sliding block and the adsorption head of the application.

[0028] Figure 7 The third pipe body structure schematic diagram of the application.

[0029] Figure 8 The first pipe body, the second pipe body and the third pipe body structure schematic diagram of the application.

[0030] In the figure: 1, the shell; 2, the mechanical arm; 3, the connecting plate; 4, the strip-shaped slot; 5, the gas conveying pipe; 6, the sliding block; 7, the through hole; 8, the extension pipe; 9, the pusher; 10, the adsorption head; 11, the puller; 12, the sliding groove; 13, the mounting slot; 14, the flexible pad; 15, the expansion slot; 16, the arc-shaped slot; 17, the exhaust slot; 18, the adsorption channel; 19, the adsorption slot; 20, the first pipe body; 21, the support; 22, the sliding rod; 23, the blocking plate; 24, the first spring; 25, the positioning disc; 26, the second pipe body; 27, the third pipe body; 28, the vertical slot; 29, the limiting plate; 30, the U-shaped slot; 31, the inclined slot; 32, the guide pin; 33, the accommodation gap; 34, the ring slot; 35, the elastic ring film; 36, the air-permeable hole; 37, the air-permeable slot; 38, the feeding rack; 39, the patch rack; 40, the sliding rail. DETAILED DESCRIPTION

[0031] The following description is used to disclose the application so that those skilled in the art can implement the application. The preferred embodiments in the following description are only as examples, and other obvious modifications can be thought of by those skilled in the art.

[0032] As shown in Figures 1 to 8 A patch mechanism for electronic component processing, comprising a shell 1, the shell 1 is provided with a mechanical arm 2, further comprising: A connecting plate 3 is fixed at the end of the mechanical arm 2, a strip-shaped slot 4 is formed on the top surface of the connecting plate 3, a gas conveying pipe 5 is inserted into the strip-shaped slot 4, one end of the gas conveying pipe 5 is connected with a negative pressure device; Two sliding blocks 6 are both slidingly connected at the bottom of the connecting plate 3, a through hole 7 is formed on the surface of the sliding block 6, the gas conveying pipe 5 is fixedly communicated with the through hole 7, and an extension pipe 8 is fixed at the bottom of the through hole 7; Two pushers 9 are symmetrically fixed on the bottom surface of the connecting plate 3, and the movable ends of the two pushers 9 are both fixed with the sliding blocks 6; The adsorption head 10 is fixed with pulling pieces 11 on both sides, the fixed end of the pulling piece 11 is fixed with the sliding block 6, the top of the adsorption head 10 is provided with a sliding groove 12, and the extension pipe 8 is slidably inserted into the sliding groove 12, and the extension pipe 8 is fixedly communicated with the inside of the sliding groove 12.

[0033] Specifically, the traditional chip mounter is originally designed for mass production scenes, and a long time is often needed when switching production lines, and manual adjustment of various parameters is needed during program conversion, which makes it difficult to meet the production needs of small batch orders. When processing small batch orders, the types of components involved are often more diverse, and the top surface structure of some components is special, making it difficult to form a stable adsorption area, which makes the adsorption head 10 have to be replaced frequently. Even if some chip mounters can automatically replace the adsorption head 10, the replacement process will also consume a lot of time and affect the processing efficiency. The present application can solve the above problems, and the specific working mode is as follows: by configuring two adsorption heads 10, the sizes of the adsorption holes of the two adsorption heads 10 are different, thereby adapting to different types of electronic components; when encountering some electronic components that are difficult to process by adsorption, the two adsorption heads 10 can be adjusted to be close to each other to clamp the components, thereby reducing the replacement frequency of the adsorption head 10 and ensuring the efficiency of production and processing.

[0034] Further, the pushing piece 9 and the pulling piece 11 are both driven by an electric push rod. In the initial state, the pulling piece 11 is in a retracted state, and the bottoms of the two adsorption heads 10 remain at the same level. When the adsorption head 10 needs to be used for work, the pulling piece 11 is started to be elongated, thereby pushing the corresponding adsorption head 10 downward, so that the bottoms of the two adsorption heads 10 form a staggered state in height, thereby avoiding the mutual interference between them.

[0035] During the adsorption operation, the position of the adsorption head 10 is first adjusted by the mechanical arm 2 to make the adsorption head 10 contact the surface of the component, and then the negative pressure equipment is started to extract the gas in the gas conveying pipe 5. The gas conveying pipe 5 is connected with the inside of the adsorption head 10 through the extension pipe 8, so that a negative pressure environment is formed in the inside of the adsorption head 10, thereby adsorbing the component and conveying it to the specified position.

[0036] When clamping the component, the pulling piece 11 is first started to make both pulling pieces 11 be in a retracted state, so that the bottoms of the two adsorption heads 10 return to the same horizontal position. Then the pushing structure is started, which drives the two sliding blocks 6 to move close to each other, and the two sliding blocks 6 in turn pull the adsorption heads 10 connected thereto to gradually move close to each other, thereby completing the clamping operation of the component.

[0037] As a further embodiment of the present application, the surface of the adsorption head 10 is provided with a mounting groove 13, and a flexible pad 14 is fixed in the mounting groove 13.

[0038] Specifically, by providing a flexible pad 14 on the surface of the adsorption head 10, the flexible pad 14 comes into contact with the electronic components during clamping, thereby avoiding clamping damage to the electronic components and protecting them.

[0039] As a further embodiment of the present invention, an expansion groove 15 and an arc-shaped groove 16 are provided on the inner wall of the slide groove 12, the bottom of the extension tube 8 is in a closed state, a plurality of exhaust grooves 17 are provided on the side wall of the extension tube 8, a plurality of adsorption channels 18 are provided on the surface of the adsorption head 10, a plurality of adsorption grooves 19 are provided on the surface of the flexible pad 14, the adsorption grooves 19 are interconnected with the adsorption channels 18, the adsorption channels 18 are interconnected with the interior of the arc-shaped groove 16, and an adjustment mechanism is provided inside the adsorption channel 18. The adjustment mechanism is used to open the adsorption channel 18 when the adsorption head 10 is in a clamping state.

[0040] Specifically, some electronic components have relatively thin sidewalls, and some have irregular shapes or grooves in certain areas, which limits the contact area between them and the flexible pad 14. During transport and movement, these components are prone to positional shifts, and in severe cases, they may even slip off, thus affecting the efficiency of the placement process. This invention effectively solves the above problems, and its specific working method is as follows: In the adsorption operation state, the pulling part 11 is in the extended state, and the adjustment mechanism closes the adsorption channel 18. At this time, the expansion groove 15 and the exhaust groove 17 are in a connected state. When the bottom of the adsorption head 10 contacts the surface of the element, a stable adsorption effect can be formed on the element by means of the negative pressure environment. When in the clamping operation state, the puller 11 will be in a retracted state. At this time, the end of the extension tube 8 is flush with the bottom of the adsorption head 10, thereby forming a sealing effect on the bottom of the adsorption head 10. The exhaust groove 17 is only connected to the inside of the arc groove 16, and a negative pressure environment is generated in the arc groove 16. The adsorption channel 18 is opened by the adjustment mechanism, so that a negative pressure environment is formed inside the adsorption channel 18, which can further adsorb electronic components, thereby enhancing the stability of the clamping operation.

[0041] As a further embodiment of the present invention, the adjustment mechanism includes a first tube 20, which is fixed inside the adsorption channel 18. A bracket 21 is fixed inside the first tube 20. A slide rod 22 is slidably connected to the surface of the bracket 21. A sealing plate 23 is fixed to one end of the slide rod 22 near the arc groove 16. A first spring 24 is fixed between the sealing plate 23 and the bracket 21. A positioning disk 25 is fixed to the other end of the slide rod 22. A limiting component is provided on one side of the positioning disk 25. The limiting component is used to cancel the limiting component's limitation on the positioning disk 25 when the flexible pad 14 is deformed.

[0042] Specifically, if a traditional one-way valve is used, when the adsorption head 10 is in the working state of the adsorption element, the one-way valve will be opened under the action of the negative pressure environment, which will cause the adsorption channel 18 to leak, thereby interfering with the normal adsorption function. The present application optimizes and improves the structure of the traditional one-way valve, effectively solving this problem. When the adsorption head 10 is in the adsorption state, the limiting assembly will limit the movement of the positioning disc 25, thereby preventing the displacement of the blocking plate 23. At this time, the blocking plate 23 will tightly fit the end of the first pipe body 20, forming a reliable seal, even in a negative pressure environment, to ensure that the first pipe body 20 always remains sealed, thereby avoiding the influence of the normal adsorption operation due to the leakage of the adsorption channel 18. When the adsorption head 10 switches to the clamping state, as the adsorption head 10 gradually approaches the element, the flexible pad 14 will deform under the extrusion, and this deformation will trigger the limiting assembly to act, releasing the limiting effect on the positioning disc 25. At this time, under the action of the negative pressure environment, the blocking plate 23 can be separated from the end of the first pipe body 20, releasing the blocking state of the first pipe body 20, so that a stable negative pressure environment is formed inside the adsorption channel 18. The adsorption hole slot generates an adsorption force on the element, further ensuring the stability of the clamping process.

[0043] As a further embodiment of the present application, the limiting assembly includes a second pipe body 26 and a third pipe body 27, the second pipe body 26 is fixed on one side of the first pipe body 20, the third pipe body 27 is inserted into the inside of the second pipe body 26, the end of the third pipe body 27 is inserted into the inside of the adsorption slot 19, the surface of the second pipe body 26 is provided with a vertical slot 28, the vertical slot 28 is slidably connected with a limiting plate 29, the limiting plate 29 is arranged on one side of the positioning disc 25, the end of the third pipe body 27 is provided with a U-shaped slot 30, the surface of the limiting plate 29 is provided with an inclined slot 31, the inside of the inclined slot 31 is inserted with a guide pin 32, both ends of the guide pin 32 are fixed in the inside of the U-shaped slot 30, and the third pipe body 27 and the second pipe body 26 are fixed with an elastic member.

[0044] Specifically, when the flexible pad 14 is not subjected to extrusion, the limiting plate 29 will stably limit the positioning disc 25, preventing the displacement of the positioning disc 25, thereby limiting the movement of the blocking plate 23. The third pipe body 27 is embedded in the adsorption slot 19 of the flexible pad 14, and when the flexible pad 14 is deformed due to extrusion, the third pipe body 27 can play the role of internal support, preventing the adsorption slot 19 from being blocked due to deformation, thereby avoiding affecting the negative pressure suction effect. And when the flexible pad 14 is deformed, the third pipe body 27 is pushed to move, the third pipe body 27 drives the guide pin 32 to move synchronously, the guide pin 32 slides in the inclined groove 31, under the guidance of the inclined groove 31, the limiting plate 29 is pushed away from the positioning disc 25, thereby the limiting of the positioning disc 25 is released, at this time, the negative pressure equipment is started, the negative pressure environment is formed in the adsorption channel 18, the stability of the clamping operation is further enhanced. When the clamping operation is completed, the negative pressure state in the adsorption channel 18 is released, under the pulling force of the first spring 24, the blocking plate 23 can return to the initial position, since the positioning disc 25 and the blocking plate 23 are fixedly connected through the slide rod 22, the positioning disc 25 can also reset synchronously, at the same time, under the pushing action of the elastic member, the third pipe body 27 can also return to the original position.

[0045] As a further embodiment of the present application, the third pipe body 27 and the inner wall of the adsorption groove 19 have a gap 33.

[0046] Specifically, when the processed electronic element is a special-shaped structure, the edge often has irregular shapes such as grooves or protrusions, which makes the adsorption groove 19 only contact with part of the surface of the element. When the flexible pad 14 is deformed under pressure, the parts not in contact with the element will also deform, resulting in part of the adsorption groove 19 not being able to form a tight fit with the surface of the element, but still being in a negative pressure state, ultimately causing air leakage problems, which adversely affects the overall negative pressure adsorption effect. The present application can effectively solve the above problems, and the specific working mode is as follows: a certain gap 33 is reserved between the adsorption groove 19 and the third pipe body 27, so that when the flexible pad 14 is deformed, the gap 33 can provide sufficient buffer space to avoid the flexible pad 14 directly driving the third pipe body 27 to move, thereby reducing the air leakage problem caused by the mutual interference of the structure.

[0047] As a further embodiment of the present application, the end of the second pipe body 26 is provided with a ring groove 34, the elastic member is an elastic ring membrane 35, the outer ring surface of the elastic ring membrane 35 is fixed on the inner wall of the ring groove 34, the inner ring surface of the elastic ring membrane 35 is fixed on the outer wall of the third pipe body 27, and the ring groove 34 is internally provided with an exhaust assembly.

[0048] The exhaust assembly comprises a gas permeable hole 36, the gas permeable hole 36 is arranged on the outer wall of the ring groove 34, the inside of the adsorption head 10 is provided with a gas permeable groove 37, one end of the gas permeable groove 37 is in communication with the outside, the other end of the gas permeable groove 37 is in communication with the gas permeable hole 36, and the end of the third pipe body 27 and the slot of the adsorption groove 19 have a gap space.

[0049] Specifically, when the electronic component to be processed is of a special shape, the edge thereof often has uneven thickness differences, so that the surface of the component can only be in contact with part of the adsorption groove 19. When the adsorption groove 19 performs the adsorption operation, such local contact is prone to cause air leakage problems, thereby adversely affecting the overall negative pressure adsorption effect. The present application solves this problem by providing an elastic ring membrane 35 at the connection position of the third pipe body 27 and the second pipe body 26. When the adsorption groove 19 can be completely attached to the surface of the component, under the extrusion action, the adsorption groove 19 will be deformed, and its internal space will be reduced accordingly. At this time, one end of the first pipe body 20 is tightly blocked by the blocking plate 23, and the internal gas cannot be discharged. Under the action of air pressure, the elastic ring membrane 35 will be deformed and moved towards the inside of the ring groove 34 to provide space for the gas in the ring groove 34 to be discharged from the air holes 36 and the air grooves 37. At the same time, the elastic ring membrane 35 will pull the third pipe body 27 to move, thereby pushing the limiting plate 29 to move and releasing the limiting action on the positioning disc 25, so that a stable negative pressure state is formed in the inside of the adsorption groove 19. When part of the adsorption groove 19 cannot be in contact with the surface of the component, i.e. in the air leakage state, since there is a space reserved between the end of the third pipe body 27 and the slot of the adsorption groove 19, even if the component deforms the flexible pad 14, it will not contact the third pipe body 27. At the same time, since it is in the air leakage state, it cannot form enough air pressure to push the elastic ring membrane 35 to move, thereby automatically identifying whether the adsorption groove 19 is in complete contact with the component. Only when the adsorption groove 19 is in complete contact with the component, the negative pressure adsorption function will be started, thereby effectively avoiding the problem of overall negative pressure effect reduction caused by air leakage.

[0050] As a further embodiment of the present application, the inside of the adsorption groove 19 has an arc surface, which is in an outwardly convex state.

[0051] Specifically, the inner wall of the adsorption groove 19 is designed with a continuous and smooth arc surface, which forms a gradual change from expansion to contraction of the internal space through the natural transition of the arc surface. This space change structure guided by the arc surface can more scientifically guide the deformation process when it is subjected to extrusion: when the adsorption groove 19 is in contact with the surface of the component and bears pressure, the expansion section of the arc surface will first disperse the initial force through the curvature of the arc surface, providing sufficient deformation buffer space for the flexible material, thereby avoiding damage or uneven deformation of the material caused by excessive local stress.

[0052] As a further embodiment of the present application, the mechanical arm 2 is provided with a feeding rack 38 and a patch rack 39 on both sides thereof, and a sliding rail 40 is fixed between the feeding rack 38 and the patch rack 39, and the mechanical arm 2 is in sliding connection with the sliding rail 40. Specifically, the electronic component is placed on the loading rack 38, the circuit board is fixed on the patch rack 39, the mechanical arm 2 adjusts the position of the suction head 10, the patch on the loading rack 38 is sucked and transported to the circuit board to perform the patching operation.

[0053] The above shows and describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above-mentioned embodiments, and the above-mentioned embodiments and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application.

Claims

1. A patching mechanism for electronic component processing, comprising a housing (1), a mechanical arm (2) is arranged in the housing (1), characterized in that, Also include: The connecting plate (3) is fixed at the end of the mechanical arm (2), and a strip-shaped slot (4) is formed on the top surface of the connecting plate (3), and a gas conveying pipe (5) is inserted in the strip-shaped slot (4), and one end of the gas conveying pipe (5) is connected with a negative pressure device; Two sliders (6) are slidingly connected to the bottom of the connecting plate (3), a through hole (7) is formed on the surface of the slider (6), the gas conveying pipe (5) is fixedly communicated with the through hole (7), and an extension pipe (8) is fixed to the bottom of the through hole (7); Two pushers (9) are fixed symmetrically on the bottom surface of the connecting plate (3), and the movable ends of the two pushers (9) are fixed with the sliders (6); The adsorption head (10) is fixed with a pulling piece (11) on both sides, the fixed end of the pulling piece (11) is fixed with the slider (6), and a sliding groove (12) is formed on the top of the adsorption head (10). The extension pipe (8) is slidingly inserted into the sliding groove (12), and the extension pipe (8) is fixedly communicated with the sliding groove (12).

2. The taping mechanism for electronic component processing according to claim 1, characterized by: A mounting groove (13) is formed on the surface of the adsorption head (10), and a flexible pad (14) is fixed in the mounting groove (13).

3. The taping mechanism for electronic component processing according to claim 2, characterized by: An expansion groove (15) and an arc-shaped groove (16) are formed on the inner wall of the sliding groove (12), the bottom of the extension pipe (8) is in a closed state, a plurality of exhaust grooves (17) are formed on the side wall of the extension pipe (8), a plurality of adsorption channels (18) are formed on the surface of the adsorption head (10), a plurality of adsorption grooves (19) are formed on the surface of the flexible pad (14), the adsorption grooves (19) and the adsorption channels (18) are communicated with each other, the adsorption channels (18) are communicated with the arc-shaped groove (16), and an adjusting mechanism is arranged in the adsorption channels (18). The adjusting mechanism is used to open the adsorption channels (18) when the adsorption head (10) is in a clamping state.

4. The taping mechanism for electronic component processing according to claim 3, wherein: The adjusting mechanism comprises a first pipe body (20), the first pipe body (20) is fixed in the adsorption channel (18), a support (21) is fixed in the first pipe body (20), a sliding rod (22) is slidingly connected to the surface of the support (21), one end of the sliding rod (22) close to the arc-shaped groove (16) is fixed with a blocking plate (23), the blocking plate (23) and the support (21) are fixed with a first spring (24), the other end of the sliding rod (22) is fixed with a positioning disc (25), and a limiting assembly is arranged on one side of the positioning disc (25). The limiting assembly is used to cancel the limiting of the limiting assembly on the positioning disc (25) when the flexible pad (14) deforms.

5. The taping mechanism for electronic component processing according to claim 4, characterized by: The limiting assembly comprises a second pipe body (26) and a third pipe body (27), the second pipe body (26) is fixed on one side of the first pipe body (20), the third pipe body (27) is inserted into the second pipe body (26), the end of the third pipe body (27) is inserted into the adsorption groove (19), the surface of the second pipe body (26) is provided with a vertical groove (28), the limiting plate (29) is slidably connected in the vertical groove (28), the limiting plate (29) is arranged on one side of the positioning disc (25), the end of the third pipe body (27) is provided with a U-shaped groove (30), the surface of the limiting plate (29) is provided with an inclined groove (31), the guide pin (32) is inserted into the inclined groove (31), the both ends of the guide pin (32) are fixed in the U-shaped groove (30), and the third pipe body (27) is fixed with the elastic member between the second pipe body (26).

6. The taping mechanism for electronic component processing according to claim 5, wherein: The third pipe body (27) and the inner wall of the adsorption groove (19) have a gap (33).

7. The taping mechanism for electronic component processing according to claim 5, wherein: The end of the second pipe body (26) is provided with a ring groove (34), the elastic member is an elastic ring film (35), the outer ring surface of the elastic ring film (35) is fixed on the inner wall of the ring groove (34), the inner ring surface of the elastic ring film (35) is fixed on the outer wall of the third pipe body (27), and the ring groove (34) is provided with an exhaust assembly.

8. The taping mechanism for electronic component processing according to claim 7, wherein: The exhaust assembly comprises a gas permeable hole (36), the gas permeable hole (36) is arranged on the outer wall of the ring groove (34), the adsorption head (10) is provided with a gas permeable groove (37), one end of the gas permeable groove (37) is communicated with the outside, the other end of the gas permeable groove (37) is communicated with the gas permeable hole (36), and the end of the third pipe body (27) and the gap between the groove of the adsorption groove (19) have a gap.

9. The taping mechanism for electronic component processing according to claim 4, wherein: The inner wall of the adsorption groove (19) has an arc surface, and the arc surface is outwardly convex.

10. The taping mechanism for electronic component processing according to claim 1, wherein: The both sides of the mechanical arm (2) are respectively provided with a feeding frame (38) and a patch frame (39), the feeding frame (38) and the patch frame (39) are fixed with a sliding rail (40), and the mechanical arm (2) is slidably connected with the sliding rail (40).

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