Vacuum cup

Abstract

The invention discloses a vacuum cup which comprises a first shell, a second shell, a cup body, at least one supporting column, a cup cover assembly and a thermoelectric semiconductor refrigeration assembly. The second shell is arranged in the first shell, and a vacuum chamber is formed between the outer side wall of the second shell and the inner side wall of the first shell; the cup body is provided with a water cavity, the cup body is arranged in the second shell, and a temperature equalizing cavity is formed between the outer side wall of the cup body and the inner side wall of the second shell; a liquid working medium and a wick structure are arranged in the uniform temperature chamber; one end of the supporting column abuts against the bottom wall of the outer side of the cup body, and the other end of the supporting column abuts against the bottom wall of the inner side of the second shell. The cup cover assembly is detachably connected with the top of the cup body; and the thermoelectric semiconductor refrigeration assembly is provided with a hot end and a cold end which are oppositely arranged, and the hot end of the thermoelectric semiconductor refrigeration assembly is connected with at least part of the outer side bottom wall of the second shell. The vacuum cup has good heat preservation performance and excellent heat exchange capacity, and the top-speed temperature control requirement of the vacuum cup can be well met.

Description

Technical Field

[0001] This invention relates to the technical field of thermos cups, and particularly to thermos cups. Background Technology

[0002] Thermos flasks are common daily necessities. Their double-walled structure with a vacuum seal effectively isolates heat transfer, ensuring a constant water temperature for extended periods, especially in winter, preventing repeated boiling. However, this same insulation property also causes significant inconvenience when users urgently need warm water, as the boiling water inside cannot be cooled down quickly enough.

[0003] While there are many technologies available for cooling and controlling the temperature of insulated cups, their functions are relatively limited, typically offering only a single cooling or heating function. Even with the emergence of some temperature control technologies, the separate cooling and heating modules take up a lot of space, and some technologies even use materials with potential safety hazards. Furthermore, current technologies usually use metal heat-conducting sheets as the heat transfer element for insulated cups, resulting in low heat transfer efficiency and an inability to meet the demands for rapid temperature control.

[0004] The present invention solves at least one of the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this invention is to solve at least one of the technical problems in the background art, and to provide a thermos cup with good heat preservation performance and excellent heat exchange capacity, which can well meet the rapid temperature control requirements of thermos cups.

[0006] The objective of this invention is achieved through the following technical solution:

[0007] This invention provides a thermos cup, comprising:

[0008] First shell;

[0009] A second housing is disposed inside the first housing, and a vacuum chamber is formed between the outer side wall of the second housing and the inner side wall of the first housing;

[0010] The cup body has a water cavity and is disposed inside the second shell. A temperature equalization chamber is formed between the outer side wall of the cup body and the inner side wall of the second shell. A liquid working fluid and a liquid suction core structure are disposed inside the temperature equalization chamber.

[0011] At least one support column, one end of which abuts against the outer bottom wall of the cup body, and the other end of which abuts against the inner bottom wall of the second housing;

[0012] A cup lid assembly is detachably connected to the top of the cup body;

[0013] A thermoelectric semiconductor cooling assembly has a hot end and a cold end disposed opposite to each other, the hot end of the thermoelectric semiconductor cooling assembly being connected to at least a portion of the outer bottom wall of the second housing.

[0014] Beneficial Effects: The thermos cup of this invention integrates a thermoelectric semiconductor refrigeration component for both cooling and heating. It can control the liquid temperature within the cup's water cavity according to user needs, with a wide temperature control range to meet the drinking temperature requirements from iced to hot beverages. The thermos cup also integrates a temperature equalization system, enabling efficient heat transfer. It optimizes traditional single-metal heat conduction into two-phase flow vapor conduction based on the principle of a temperature equalization plate. According to heat transfer theory, this temperature equalization system can improve heat transfer performance by approximately 10 times compared to traditional copper plates, achieving rapid cooling / heating of the liquid within the cup's water cavity. The thermos cup of this invention enhances heat exchange efficiency with the external environment through the aforementioned thermoelectric semiconductor refrigeration component and temperature equalization system.

[0015] In some feasible implementations, the thermoelectric semiconductor cooling assembly includes:

[0016] The base housing is connected to the outer bottom wall of the first housing, and the inner side wall of the base housing, the outer side wall of the first housing, and the outer bottom wall of the second housing form an air chamber.

[0017] A semiconductor cooler is located in the air chamber, the semiconductor cooler having a cold end and a hot end disposed opposite each other, the hot end of the semiconductor cooler being connected to at least a portion of the outer bottom wall of the second housing;

[0018] A heat dissipation assembly, one end of which is connected to the cold end of the thermoelectric cooler, and the other end of which is connected to the base housing;

[0019] The fan is located on the inner bottom wall of the base housing and near the heat dissipation assembly.

[0020] In some feasible implementations, the liquid-absorbing core structure includes a first liquid-absorbing core sleeve, which is sleeved on the outer side wall of the cup body and fits against the outer side wall of the cup body. The bottom wall of the first liquid-absorbing core sleeve has at least one first through hole corresponding to the support column. One end of the support column passes through the first through hole and abuts against the outer bottom wall of the cup body.

[0021] And / or, the liquid-absorbing core structure includes a second liquid-absorbing core sleeve, which is embedded in the second housing and fits against the inner sidewall of the second housing. The bottom wall of the second liquid-absorbing core sleeve has at least one second through hole corresponding to the support column. The other end of the support column passes through the second through hole and abuts against the inner bottom wall of the second housing.

[0022] In some feasible implementations, the first absorbent core sleeve includes one or more composite absorbent core layers.

[0023] In some feasible implementations, the second absorbent core sleeve includes:

[0024] A circular liquid-absorbing core is disposed inside the second housing and connected to the inner bottom wall of the second housing. The circular liquid-absorbing core is provided with at least one second through hole.

[0025] Multiple strip-shaped absorbent cores are connected to the circular absorbent core, and all the strip-shaped absorbent cores are circumferentially spaced on the outer peripheral edge of the circular absorbent core;

[0026] All the strip-shaped absorbent cores are circumferentially spaced and attached to the inner wall of the second housing, so that a channel is formed between two adjacent strip-shaped absorbent cores along the circumference on the inner wall of the second housing.

[0027] In some feasible implementations, the cup body includes:

[0028] The main body is disposed within the second housing, and the temperature equalization chamber is formed between the outer side wall of the main body and the inner side wall of the second housing;

[0029] A first extension is connected to the main body and located outside the second housing. The outer sidewall of the first extension is provided with an external thread, and the first extension is detachably connected to the cup lid assembly through the external thread.

[0030] The first extension has an annular cavity distributed circumferentially along the first extension, and the annular cavity is provided with a first heat insulation material.

[0031] In some feasible implementations, the cup lid assembly includes:

[0032] The cover portion has an internal thread on its inner sidewall that mates with the external thread, and the cover portion is detachably connected to the external thread of the first extension portion via the internal thread.

[0033] The second extension is connected to the inner bottom wall of the cover portion, and the second extension is located at least within the first extension.

[0034] The second extension has a circular cavity, and the circular cavity contains a second heat insulation material.

[0035] In some feasible implementations, a handle is also included, which passes through the first housing and is embedded in the second housing. The surface of the handle has an injection port, and the inside of the handle has an injection chamber. The injection port and the injection chamber are in communication, and the injection chamber is in communication with the temperature equalization chamber.

[0036] In some feasible implementations, the heat dissipation component includes:

[0037] A heat dissipation body, one side of which is connected to the cold end of the semiconductor cooler;

[0038] Multiple finned bodies are distributed on the outer periphery of the other side of the heat dissipation body.

[0039] Multiple finned supports, each corresponding to a finned body, are distributed on the inner periphery of the other side of the heat dissipation body.

[0040] The height of the fin body is higher than that of the fin support, so that a receiving space is formed between the multiple fin bodies and the multiple fin bodies, and the fan is located within the receiving space. Attached Figure Description

[0041] Figure 1 This is a three-dimensional structural diagram of the thermos cup of the present invention;

[0042] Figure 2 This is a schematic diagram of the exploded structure of the thermos cup of the present invention;

[0043] Figure 3 This is a schematic cross-sectional view of the thermos cup of the present invention;

[0044] Figure 4 for Figure 3 Enlarged view of point A in the image;

[0045] Figure 5 This is a schematic diagram of the structure of the second liquid-absorbing core sleeve;

[0046] Figure 6 This is a schematic diagram of the structure of a thermoelectric semiconductor refrigeration component;

[0047] Figure 7 This is a schematic diagram of the heat dissipation component.

[0048] In the figure, 1. First shell; 2. Second shell; 3. Cup body; 31. Main body; 32. First extension; 321. Annular cavity; 4. Support column; 5. Cup lid assembly; 51. Lid body; 52. Second extension; 521. Circular cavity; 6. Thermoelectric semiconductor refrigeration assembly; 61. Base shell; 62. Semiconductor cooler; 63. Heat dissipation assembly; 630. Heat dissipation body; 631. Fin body; 632. Fin support; 64. Fan; 7. First liquid suction core sleeve; 8. Second liquid suction core sleeve; 81. Circular liquid suction core; 82. Strip-shaped liquid suction core; 9. Handle; 91. Injection port; 92. Injection chamber; 10. Sealing ring; 100. Vacuum chamber; 200. Water chamber; 300. Temperature equalization chamber; 400. Air chamber; 500. Accommodation space; 600. Vent. Detailed Implementation

[0049] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided to make the invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted.

[0050] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0051] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0052] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or display that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or display.

[0053] See appendix Figure 1-7 As shown, the present invention provides a thermos cup, including a first shell 1, a second shell 2, a cup body 3, a support column 4, a cup lid assembly 5, and a thermoelectric semiconductor cooling assembly 6.

[0054] The second housing 2 is disposed inside the first housing 1, and a vacuum chamber 100 is formed between the outer side wall of the second housing 2 and the inner side wall of the first housing 1. Preferably, the vacuum degree of the vacuum chamber 100 is less than 0.01 Pa. The material of the first housing 1 can be stainless steel.

[0055] The cup body 3 is disposed within the second shell 2, and a uniform temperature chamber 300 is formed between the outer side wall of the cup body 3 and the inner side wall of the second shell 2. The uniform temperature chamber 300 contains a liquid working fluid and a liquid wick structure. The liquid working fluid includes, but is not limited to, deionized water, acetone, or fluorinated liquid. The materials of the cup body 3 and the second shell 2 include, but are not limited to, stainless steel, copper alloy, etc.

[0056] The cup body 3 has a water cavity 200, which is used to contain liquids. Liquids include, but are not limited to, coffee, water, or milk tea.

[0057] One end of the support column 4 abuts against the outer bottom wall of the cup body 3, and the other end of the support column 4 abuts against the inner bottom wall of the second shell 2. Furthermore, a copper powder structure is sintered on the radially outer side of the support column 4 to promote the reflux of the liquid working fluid to the evaporation end. The number of support columns 4 is at least one, and 19 can be provided as an example.

[0058] The lid assembly 5 is detachably connected to the top of the cup body 3. The detachable connection includes, but is not limited to, threaded connection or snap-on connection.

[0059] The thermoelectric semiconductor cooling assembly 6 has a hot end and a cold end disposed opposite to each other, and the hot end of the thermoelectric semiconductor cooling assembly 6 is connected to at least a portion of the outer bottom wall of the second housing 2.

[0060] The thermos cup of this invention forms a uniform temperature chamber 300 through the cup body 3 and the second shell 2. Utilizing the capillary action of the liquid wick structure and the phase change heat transfer of the liquid working fluid, a uniform temperature system is formed. Through the phase change heat transfer principle of the uniform temperature system, the heat exchange between the liquid in the water cavity 200 of the cup body 3 and external cold and heat sources is enhanced, achieving rapid cooling and heating of the liquid. A vacuum chamber 100 is formed between the second shell 2 and the first shell 1, serving as an insulation layer for the water cavity 200 of the cup body 3. This effectively prevents heat transfer to the environment through conduction and convection, thereby achieving the purpose of heat preservation. Due to the contact connection between the thermoelectric semiconductor refrigeration component 6 and the second shell 2, rapid cooling or heating of the water temperature inside the thermos cup can be achieved by switching the direction of the cold and hot ends of the thermoelectric semiconductor refrigeration component 6.

[0061] The thermos cup of this invention integrates a thermoelectric semiconductor refrigeration component 6 for a cooling / heating system. It can control the liquid temperature within the water cavity 200 of the cup body 3 according to user needs, with a wide temperature control range to meet the drinking temperature requirements from iced to hot beverages. The thermos cup also integrates a temperature equalization system, enabling efficient heat transfer. It optimizes traditional single-metal heat conduction to two-phase flow vapor conduction based on the principle of a temperature equalization plate. According to heat transfer theory, this temperature equalization system can improve heat transfer performance by approximately 10 times compared to traditional copper plates, achieving rapid cooling / heating of the liquid within the water cavity 200 of the cup body 3. The thermos cup of this invention enhances heat exchange efficiency with the external environment through the aforementioned thermoelectric semiconductor refrigeration component 6 and temperature equalization system.

[0062] See appendix Figure 3 , 4 As shown in Figure 6, as one embodiment of the thermoelectric semiconductor cooling assembly 6, the thermoelectric semiconductor cooling assembly 6 includes a base housing 61, a semiconductor cooler 62, a plurality of heat dissipation components 63, and a fan 64.

[0063] The base housing 61 is connected to the outer bottom wall of the first housing 1, and the inner side wall of the base housing 61, the outer side wall of the first housing 1, and the outer bottom wall of the second housing 2 form an air chamber 400.

[0064] Furthermore, the side wall of the base housing 61 is provided with at least one vent 600 that communicates with the air chamber 400 for heat exchange between the semiconductor cooler 62 and the external environment.

[0065] A semiconductor cooler 62 is located within the air chamber 400. The semiconductor cooler 62 has a cold end and a hot end that are positioned opposite each other. The hot end of the semiconductor cooler 62 is connected to at least a portion of the outer bottom wall of the second housing 2. Since the positive and negative terminals of the semiconductor cooler 62 are connected to a charge pump polarity reverser, the direction of the cold end and the hot end can be switched via the charge pump polarity reverser to cool / heat the second housing 2, thereby achieving rapid cooling / heating of the liquid in the water chamber 200 of the thermos cup.

[0066] One end of the heat dissipation component 63 is connected to the cold end of the thermoelectric cooler 62, and the other end of the heat dissipation component 63 is connected to the base housing 61. The heat dissipation component 63 is used to transfer the heat generated by the thermoelectric cooler 62.

[0067] The fan 64 is mounted on the inner bottom wall of the base housing 61 and is located near the heat dissipation assembly 63. The fan 64 is used to forcibly dissipate the heat transferred by the heat dissipation assembly 63.

[0068] See appendix Figure 3-5As shown, as one embodiment of the liquid absorption core structure, the liquid absorption core structure includes a first liquid absorption core sleeve 7, which is sleeved on the outer side wall of the cup body 3 and fits against the outer side wall of the cup body 3. The bottom wall of the first liquid absorption core sleeve 7 is provided with at least one first through hole corresponding to the support column 4. One end of the support column 4 passes through the first through hole and abuts against the outer bottom wall of the cup body 3.

[0069] The first liquid-absorbing core sleeve 7 uses capillary action to transport the condensed liquid from the condensation section to the evaporation section, realizing a two-phase flow circulation. When the evaporation section is heated, the liquid working fluid evaporates to generate steam. The steam rises to the condensation section, exchanges heat with the external cold source, and then condenses. The first liquid-absorbing core sleeve 7 transports the condensed liquid back to the evaporation section through the capillary network, forming a circulation. This liquid circulation mechanism enables the temperature equalization system to respond quickly to temperature changes and achieve stable control of the liquid temperature in the water chamber 200 of the cup body 3 by adjusting the liquid flow balance between the condensation section and the evaporation section.

[0070] Furthermore, the first liquid-absorbing core sleeve 7 includes one or more composite liquid-absorbing core layers, and the thickness of a single liquid-absorbing core layer can be 0.05 to 0.3 mm, for example, 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm or 0.3 mm. The first liquid-absorbing core sleeve 7 adopts a structure including but not limited to copper wire mesh or copper powder sintering.

[0071] As one possible implementation of the absorbent core structure, the absorbent core structure includes a second absorbent core sleeve 8, which is embedded in the second housing 2 and fits against the inner sidewall of the second housing 2. The bottom wall of the second absorbent core sleeve 8 has at least one second through hole corresponding to a support post 4. The other end of the support post 4 passes through the second through hole and abuts against the inner bottom wall of the second housing 2. The function of the second absorbent core sleeve 8 can be the same as that of the first absorbent core sleeve 7, and will not be elaborated here.

[0072] The thickness of the second absorbent core sleeve 8 can be 0.1 to 1 mm, for example 0.1 mm, 0.3 mm, 0.5 mm, 0.8 mm or 1 mm.

[0073] See appendix Figure 5 As shown, as one embodiment of the second absorbent core sleeve 8, the second absorbent core sleeve 8 includes a circular absorbent core 81 and a plurality of strip-shaped absorbent cores 82.

[0074] A circular liquid-absorbing core 81 is disposed inside the second housing 2 and connected to the inner bottom wall of the second housing 2. The circular liquid-absorbing core 81 is provided with at least one first through hole.

[0075] Multiple strip-shaped absorbent cores 82 are connected to a circular absorbent core 81, and the strip-shaped absorbent cores 82 are circumferentially spaced on the outer periphery of the circular absorbent core 81.

[0076] All the strip-shaped absorbent cores 82 are circumferentially spaced and attached to the inner wall of the second housing 2, so that a channel is formed between two adjacent strip-shaped absorbent cores 82 on the inner wall of the second housing 2.

[0077] All the strip-shaped liquid-absorbing cores 82 are distributed at intervals around the inner wall of the second shell 2. The multiple channels formed promote the reflux of condensate under gravity, accelerate the heat exchange cycle, and thus improve the heat exchange performance of the thermos cup.

[0078] It should be noted that the connection between the circular liquid-absorbing core 81 and the strip-shaped liquid-absorbing core 82 can be designed as an integral or separate design. When it is integral, both the circular liquid-absorbing core 81 and the strip-shaped liquid-absorbing core 82 adopt the same liquid-absorbing core structure, including but not limited to multi-layer copper mesh or micro-grooves. When it is separate, the circular liquid-absorbing core 81 and the strip-shaped liquid-absorbing core 82 adopt different structures. The strip-shaped liquid-absorbing core 82 can adopt a multi-layer copper mesh structure or a micro-groove structure, while the circular liquid-absorbing core 81 can adopt a sintered copper powder sintering or foamed copper sintering structure. The integral design can simplify the process flow, while the separate design can further enhance the heat exchange performance of the thermos cup.

[0079] See appendix Figure 2-3 As shown, as one embodiment of the cup body 3, the cup body 3 includes a main body 31 and a first extension 32.

[0080] The main body 31 is disposed inside the second housing 2, and a uniform temperature chamber 300 is formed between the outer side wall of the main body 31 and the inner side wall of the second housing 2.

[0081] The first extension 32 is connected to the main body 31 and is located outside the second housing 2. The outer sidewall of the first extension 32 is provided with external threads, and the first extension 32 is detachably connected to the cup lid assembly 5 through the external threads.

[0082] The first extension 32 has an annular cavity 321 distributed circumferentially along the first extension 32, and the annular cavity 321 contains a first heat insulation material. The first heat insulation material includes, but is not limited to, polypropylene or polyurethane foam.

[0083] By achieving a detachable connection with the lid assembly 5 through the first extension 32, and by using the first heat-insulating material within the annular cavity 321 of the first extension 32 to achieve heat insulation, heat loss from the lid assembly 5 is prevented, which is beneficial to improving the heat preservation performance of the thermos.

[0084] See appendix Figure 2-3 As shown, in one embodiment of the cup lid assembly 5, the cup lid assembly 5 includes a lid portion 51 and a second extension portion 52.

[0085] The inner sidewall of the cover portion 51 is provided with an internal thread that mates with the external thread, and the cover portion 51 is detachably connected to the external thread of the first extension portion 32 through the internal thread.

[0086] The second extension 52 is connected to the inner bottom wall of the cover portion 51, and the second extension 52 is located at least within the first extension 32.

[0087] The second extension 52 has a circular cavity 521, and the circular cavity 521 contains a second heat insulation material. The second heat insulation material includes, but is not limited to, polypropylene or polyurethane foam.

[0088] The lid part 51 is detachably connected to the cup body 3. The second heat insulation material in the circular cavity 521 of the second extension part 52 is used to achieve heat insulation, further preventing heat loss from the lid assembly 5, which is beneficial to improving the heat preservation performance of the thermos cup.

[0089] Furthermore, a sealing ring 10 is fitted on the outer sidewall of the second extension 52 to enhance heat insulation, prevent heat loss from the cup lid assembly 5, and further improve the heat preservation effect.

[0090] See appendix Figure 2 As shown, as one possible implementation, the thermos cup also includes a handle 9. The handle 9 passes through the first housing 1 and is embedded in the second housing 2. The surface of the handle 9 is provided with a liquid injection port 91, and the inside of the handle 9 is provided with a liquid injection chamber 92. The liquid injection port 91 and the liquid injection chamber 92 are connected, and the liquid injection chamber 92 is connected to the temperature equalization chamber 300.

[0091] The handle 9 makes it easy to hold the thermos cup. Through the connection between the liquid inlet 91, the liquid inlet 92 and the temperature equalization chamber 300, it is convenient to inject liquid working fluid into the temperature equalization chamber 300 and vent the air.

[0092] See appendix Figure 6 and 7 As shown, as one embodiment of the heat dissipation component 63, the heat dissipation component 63 includes a heat dissipation body 630, a plurality of fin bodies 631 and a plurality of fin supports 632.

[0093] One side of the heat dissipation body 630 is connected to the cold end of the semiconductor cooler 62.

[0094] The fin body 631 is distributed on the outer periphery of the other side of the heat dissipation body 630.

[0095] The fin support 632 is connected to the fin body 631 in a one-to-one correspondence and is distributed on the inner periphery of the other side of the heat dissipation body 630.

[0096] The height of the fin body 631 is higher than that of the fin support 632, so that the multiple fin bodies 631 and the multiple fin bodies 631 together form an accommodating space 500, and the fan 64 is located within the accommodating space 500.

[0097] Since the height of the fin body 631 is higher than that of the fin support 632, the distribution of all fin bodies 631 and fin supports 632 is radial. The heat dissipation component 63 is made of aluminum. The thickness of the fin body 631 and fin support 632 can be 0.1 to 0.5 mm. The minimum height of the fin support 632 is greater than 1 mm. The fan 64 is located within the housing space 500, which can increase the compactness of the thermos cup structure.

[0098] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the invention without departing from the principles and spirit of the invention, and all such changes should fall within the protection scope of the claims of the present invention.

Claims

1. A thermos cup, characterized in that, include: First shell (1); A second housing (2) is disposed inside the first housing (1), and a vacuum chamber (100) is formed between the outer side wall of the second housing (2) and the inner side wall of the first housing (1); The cup body (3) has a water cavity (200). The cup body (3) is disposed inside the second shell (2). A uniform temperature chamber (300) is formed between the outer side wall of the cup body (3) and the inner side wall of the second shell (2). The uniform temperature chamber (300) is provided with a liquid working medium and a liquid suction core structure. At least one support column (4), one end of which abuts against the outer bottom wall of the cup body (3), and the other end of which abuts against the inner bottom wall of the second shell (2); The cup lid assembly (5) is detachably connected to the top of the cup body (3); Thermoelectric semiconductor cooling assembly (6) has a hot end and a cold end disposed opposite to each other, the hot end of the thermoelectric semiconductor cooling assembly (6) being connected to at least a portion of the outer bottom wall of the second housing (2).

2. The thermos cup according to claim 1, characterized in that, The thermoelectric semiconductor cooling component (6) includes: The base housing (61) is connected to the outer bottom wall of the first housing (1), and the inner side wall of the base housing (61), the outer side wall of the first housing (1) and the outer bottom wall of the second housing (2) form an air chamber (400). A semiconductor cooler (62) is located in the air chamber (400), the semiconductor cooler (62) having a cold end and a hot end disposed opposite to each other, the hot end of the semiconductor cooler (62) being connected to at least a portion of the outer bottom wall of the second housing (2); Heat dissipation assembly (63), one end of which is connected to the cold end of the semiconductor cooler (62), and the other end of which is connected to the base housing (61); A fan (64) is disposed on the inner bottom wall of the base housing (61) and located near the heat dissipation assembly (63).

3. The thermos cup according to claim 1, characterized in that, The liquid-absorbing core structure includes a first liquid-absorbing core sleeve (7), which is sleeved on the outer side wall of the cup body (3) and fits against the outer side wall of the cup body (3). The bottom wall of the first liquid-absorbing core sleeve (7) is provided with at least one first through hole corresponding to the support column (4). One end of the support column (4) passes through the first through hole and abuts against the outer bottom wall of the cup body (3). And / or, the absorbent core structure includes a second absorbent core sleeve (8), the second absorbent core sleeve (8) is embedded in the second housing (2) and fits against the inner side wall of the second housing (2), the bottom wall of the second absorbent core sleeve (8) is provided with at least one second through hole corresponding to the support column (4), and the other end of the support column (4) passes through the second through hole and abuts against the inner bottom wall of the second housing (2).

4. The thermos cup according to claim 3, characterized in that, The first absorbent core sleeve (7) includes one or more composite absorbent core layers.

5. The thermos cup according to claim 3, characterized in that, The second absorbent core sleeve (8) includes: A circular liquid-absorbing core (81) is disposed inside the second housing (2) and connected to the inner bottom wall of the second housing (2). The circular liquid-absorbing core (81) is provided with at least one second through hole. Multiple strip-shaped absorbent cores (82) are connected to the circular absorbent core (81), and all the strip-shaped absorbent cores (82) are circumferentially spaced on the outer periphery of the circular absorbent core (81); All the strip-shaped absorbent cores (82) are circumferentially spaced and attached to the inner wall of the second housing (2) so that a channel is formed between two adjacent strip-shaped absorbent cores (82) on the inner wall of the second housing (2).

6. The thermos cup according to claim 1, characterized in that, The cup body (3) includes: The main body (31) is disposed inside the second housing (2), and the temperature equalization chamber (300) is formed between the outer side wall of the main body (31) and the inner side wall of the second housing (2); The first extension (32) is connected to the main body (31) and located outside the second housing (2). The outer sidewall of the first extension (32) is provided with external threads. The first extension (32) is detachably connected to the cup lid assembly (5) through the external threads. The first extension (32) is provided with an annular cavity (321) distributed circumferentially along the first extension (32), and the annular cavity (321) is provided with a first heat insulation material.

7. The thermos cup according to claim 6, characterized in that, The cup lid assembly (5) includes: The cover part (51) has an inner sidewall that is provided with an internal thread that mates with the external thread. The cover part (51) is detachably connected to the external thread of the first extension part (32) through the internal thread. The second extension (52) is connected to the inner bottom wall of the cover (51), and the second extension (52) is located at least inside the first extension (32); The second extension (52) has a circular cavity (521) inside, and the circular cavity (521) has a second heat insulation material inside.

8. The thermos cup according to claim 1, characterized in that, It also includes a handle (9), which passes through the first housing (1) and is embedded in the second housing (2). The surface of the handle (9) is provided with an injection port (91), and the inside of the handle (9) is provided with an injection chamber (92). The injection port (91) and the injection chamber (92) are connected, and the injection chamber (92) is connected to the temperature equalization chamber (300).

9. The thermos cup according to claim 2, characterized in that, The heat dissipation assembly (63) includes: A heat dissipation body (630) is provided, one side of which is connected to the cold end of the semiconductor cooler (62). Multiple finned bodies (631) are distributed on the outer periphery of the other side of the heat dissipation body (630). Multiple finned supports (632) are connected one-to-one with the finned body (631) and are distributed on the inner periphery of the other side of the heat dissipation body (630). The height of the fin body (631) is higher than that of the fin support (632) so that a receiving space (500) is formed between the plurality of fin bodies (631) and the plurality of fin bodies (631), and the fan (64) is located within the receiving space (500).

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