IWC cleaning machine

Abstract

The invention discloses an IWC cleaning machine, and relates to the technical field of semiconductors, the IWC cleaning machine comprises a machine body, a first cleaning box and a second cleaning box are fixedly arranged in the machine body, two guide rails are fixedly arranged in the machine body, an electric sliding rod is slidably arranged between the two guide rails, and two electric mechanical arms are fixedly arranged at the bottom of the electric sliding rod; limiting plates are fixedly arranged in the first cleaning box and the second cleaning box, limiting frames are arranged at the tops of the two limiting plates, and fixing columns are fixedly arranged at the two ends of each limiting frame. Through the arrangement of the first wedge-shaped plate, the telescopic triangular block, the T-shaped sliding plate, the two second springs, the fixing plate, the telescopic hinge column and the multiple adjusting assemblies, the wafer size is automatically judged, the distance between the cleaning tanks is automatically adjusted, the situation that the edge shearing force is higher than the center is avoided, and the ultrasonic cleaning effect is guaranteed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, specifically to an IWC cleaning machine. Background Technology

[0002] In semiconductor manufacturing, IWC cleaning process usually refers to Integrated Wet Cleaning, which is a key step in removing contaminants during wafer processing. Its core objective is to keep the wafer surface clean between different process steps to ensure the yield of subsequent processes and device performance.

[0003] Existing tank-type wafer cleaning machines cannot adaptively adjust the tank spacing according to the size of the semiconductor wafer during cleaning, which easily leads to higher shear force at the edges than at the center, resulting in residual contaminants or excessive corrosion on the surface. Furthermore, they cannot adaptively adjust the wafer tank spacing according to the pure water rinsing speed to meet different operational needs, resulting in poor rinsing effect. This increases energy consumption while reducing the rinsing effect. Summary of the Invention

[0004] The present invention addresses the problem that existing technical solutions are too simplistic and provides a solution that is significantly different from existing technologies. Specifically, the purpose of the present invention is to provide an IWC cleaning machine to solve the problems mentioned in the background.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an IWC cleaning machine, comprising a body, wherein a first cleaning box and a second cleaning box are fixedly disposed inside the body, two guide rails are fixedly disposed inside the body, an electric slide rod is slidably disposed between the two guide rails, two electric robotic arms are fixedly disposed at the bottom of the electric slide rod, a limit plate is fixedly disposed inside both the first and second cleaning boxes, wherein a limit frame is disposed at the top of the two limit plates, and a fixing post is fixedly disposed at both ends of the limit frame, a plurality of cleaning tanks are slidably disposed between the limit frames, a counterweight plate is disposed inside one of the cleaning tanks, a switching mechanism is disposed on the side wall of one of the cleaning tanks, a flow rate mechanism is disposed inside the second cleaning box, and a linkage mechanism is disposed inside the second cleaning box.

[0006] Preferably, the second cleaning box has several rinsing ports on its side wall.

[0007] Preferably, each of the cleaning tanks includes a base plate, a placement plate, and two first springs. The placement plate is slidably sleeved on the limiting frame, one end of each of the two first springs is fixedly disposed at the bottom of the sliding plate, and the base plate is fixedly disposed at the other end of the two first springs.

[0008] Preferably, the switching mechanism includes a first wedge plate, a telescopic triangular block, a T-shaped sliding plate, two second springs, a fixed plate, a telescopic hinge post, and several adjusting components. The first wedge plate is inserted into the side wall of the placement plate, the fixed plate is fixedly installed on one of the side walls of the placement plate, the two second springs are fixedly installed on the top of the fixed plate, the telescopic triangular block is fixedly installed on the top of the second springs, the T-shaped sliding plate is fixedly installed on the side wall of the telescopic triangular block, the telescopic hinge post is fixedly installed on the telescopic section of the telescopic triangular block, the T-shaped sliding plate is limited to slide on the side wall of the placement plate, and several adjusting components are rotatably installed on the side walls of several placement plates. One of the adjusting components is hinged to the bottom of the telescopic hinge post, and the several adjusting components are rotatably connected to each other.

[0009] Preferably, each of the adjustment components includes a first telescopic plate, a first shaft, and two hinge rods. The first shaft is rotatably mounted on the side wall of the placement plate, one end of each of the two hinge rods is rotatably mounted on the first shaft, and the first telescopic plate is rotatably mounted on the first shaft.

[0010] Preferably, the flow rate mechanism includes two mounting brackets, a rotating shaft, several baffles, a fixed ring, a conical ring, a second wedge block, a sliding column, and a judgment spring. The two mounting brackets are fixedly disposed at the bottom of the second cleaning box. The rotating shaft is rotatably disposed between the two mounting brackets. The several baffles are fixedly disposed on the rotating shaft in a circular array. The fixed ring is fixedly disposed at the bottom of the second cleaning box. The conical ring is slidably disposed inside the fixed ring. The rotating shaft is provided with a long groove. A limit rod is slidably disposed in the long groove. The limit rod is a telescopic structure. The sliding column is fixedly disposed on the top of the limit rod. A sleeve plate is movably sleeved on the limit rod. A judgment spring is disposed on the top of the sleeve plate. The second wedge block is movably sleeved on the sliding column. The second wedge block is fixedly connected to the judgment spring.

[0011] Preferably, the linkage mechanism includes a connecting rod, a first wedge rod, a second wedge rod, an L-shaped wedge rod, a return spring, a first conical block, and a second conical block. The second conical block is fixedly mounted on the rotating shaft, the first conical block is fixedly mounted on the rotating shaft, the connecting rod is fixedly mounted on the top of the first wedge plate, the first wedge rod is fixedly mounted on the bottom of the connecting rod, the second wedge rod is fixedly mounted on the side wall of one of the first telescopic plates, the L-shaped wedge rod is slidably mounted on the bottom of the second cleaning box, the return spring is fixedly mounted on the side wall of the L-shaped wedge rod, the first wedge rod abuts against the second conical block, the first conical block abuts against the sleeve plate, the L-shaped wedge rod abuts against the conical ring, and the L-shaped wedge rod abuts against the second wedge rod.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] (1) The present invention achieves automatic judgment of wafer size and automatic adjustment of the spacing between cleaning tanks by setting up a first wedge plate, telescopic triangular block, T-shaped slide plate, two second springs, fixed plate, telescopic hinge column and several adjustment components, so as to avoid the edge shear force being higher than the center and ensure the ultrasonic cleaning effect.

[0014] (2) The present invention achieves adaptive adjustment of the wafer spacing according to the rinsing speed by setting up a connecting rod, a first wedge rod, a second wedge rod, an L-shaped wedge rod, a return spring, a first conical block and a second conical block, so as to ensure that the best cleaning effect can be achieved at any rinsing speed. Furthermore, it adaptively switches between two sets of rinsing speed spacing adjustment systems according to wafers of different sizes, so as to ensure that wafers of different sizes can achieve the best cleaning effect at different rinsing speeds. No manual supervision and adjustment are required, and the operation is simple, convenient and quick. Attached Figure Description

[0015] Figure 1 This is a schematic cross-sectional view of the overall structure of the present invention;

[0016] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0017] Figure 3 This is a schematic diagram of the switching mechanism structure of the present invention;

[0018] Figure 4 This is a cross-sectional view of the switching mechanism and cleaning tank of the present invention;

[0019] Figure 5 This is a schematic diagram of the internal structure of the flow velocity mechanism of the present invention;

[0020] Figure 6 This is a schematic diagram showing the positional relationship between the flow velocity mechanism and the linkage mechanism of the present invention;

[0021] Figure 7 For the present invention Figure 6 Enlarged view of point A in the middle.

[0022] In the diagram: 1. Machine body; 2. Second cleaning box; 3. First cleaning box; 4. Counterweight plate; 5. Flow rate mechanism; 51. Mounting bracket; 52. Rotating shaft; 53. Baffle; 54. Fixing ring; 55. Conical ring; 56. Second wedge block; 57. Sliding column; 58. Judgment spring; 6. Switching mechanism; 61. First wedge plate; 62. Telescopic triangular block; 63. T-shaped sliding plate; 64. Second spring; 65. Fixing plate; 66. Telescopic hinge column; 67. First telescopic plate; 68. First shaft; 69. 7. Hinge rod; 71. Linkage mechanism; 72. Connecting rod; 73. First wedge rod; 74. Second wedge rod; 75. L-shaped wedge rod; 76. Return spring; 77. First conical block; 78. Second conical block; 79. Sleeve plate; 70. Limiting rod; 71. Long groove; 8. Limiting plate; 9. Fixed column; 10. Guide rail; 11. Electric sliding rod; 12. Electric robotic arm; 13. Limiting frame; 14. Cleaning tank; 15. Base plate; 16. Placement plate; 17. First spring; 18. Rinse port. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Please see Figures 1-7An embodiment of the present invention provides an IWC cleaning machine, comprising a body 1, a first cleaning box 3 and a second cleaning box 2 fixedly disposed inside the body 1, two guide rails 10 fixedly disposed inside the body 1, an electric slide rod 11 slidably disposed between the two guide rails 10, two electric robotic arms 12 fixedly disposed at the bottom of the electric slide rod 11, a limit plate 8 fixedly disposed inside the first cleaning box 3 and the second cleaning box 2, wherein a limit frame 13 is disposed at the top of the two limit plates 8, and a fixing post 9 is fixedly disposed at both ends of the limit frame 13, and a plurality of cleaning tanks 14 slidably disposed between the limit frames 13, wherein a counterweight plate 4 is disposed inside one of the cleaning tanks 14, and a switching mechanism 6 is disposed on the side wall of one of the cleaning tanks 14, a flow rate mechanism 5 is disposed inside the second cleaning box 2, and a linkage mechanism 7 is disposed inside the second cleaning box 2. First, the counterweight plate 4 is placed inside the middle cleaning tank 14. Then, all semiconductor wafers of the same specification are placed inside the remaining cleaning tanks 14. The counterweight plate 4, acting as a contact point, drives the switching mechanism 6 to adjust the spacing of the cleaning tanks 14. If it is a six-inch wafer, it will not contact the switching mechanism 6 to adjust the spacing of the cleaning tanks 14. The electric slide rod 11 drives the electric robotic arm 12 to hook onto the two fixing posts 9, placing the entire cleaning tank 14 inside the first cleaning box 3 for ultrasonic cleaning. This is existing technology and will not be elaborated further. Next, the electric robotic arm 12 retracts and hooks onto the fixing posts 9, causing the limiting frame 13 and the cleaning tank 14 to move upwards as a whole. The electric slide rod 11 moves the entire assembly to above the second cleaning tank 14, and then the electric motor... The robotic arm 12 places the entire cleaning tank 14 inside the second cleaning box 2, and then performs a second cleaning of the wafer with pure water. The flow rate mechanism 5 judges the rinsing water speed, and as the water flow speed increases, it drives the linkage mechanism 7 to work. The linkage mechanism 7 further adjusts the spacing of the cleaning tank 14. When the wafer diameter is twelve inches, the adaptability of adjusting the spacing of the cleaning tank 14 at the same rinsing water speed increases. After rinsing, the water stains are dried by air blowing. This realizes the adaptive switching of the appropriate spacing of the cleaning tank 14 according to different wafer sizes to ensure the cleaning effect. It also automatically switches the maximum threshold for adjusting the spacing of the cleaning tank 14 according to different wafer sizes, achieving adaptive adjustment of the spacing between wafers based on wafer size and rinsing water speed.

[0025] Specifically, the second cleaning box 2 has several rinsing ports 15 on its side wall.

[0026] Specifically, each of the aforementioned cleaning tanks 14 includes a base plate 141, a placement plate 142, and two first springs 143. The placement plate 142 is slidably sleeved on the limiting frame 13. One end of each of the two first springs 143 is fixedly disposed at the bottom of the sliding plate, and the base plate 141 is fixedly disposed at the other end of each of the two first springs 143. The first springs 143 are stretched by the downward movement of the base plate 141.

[0027] Specifically, the switching mechanism 6 includes a first wedge plate 61, a telescopic triangular block 62, a T-shaped sliding plate 63, two second springs 64, a fixed plate 65, a telescopic hinge post 66, and several adjusting components. The first wedge plate 61 is inserted into the side wall of the placement plate 142. The fixed plate 65 is fixedly installed on one of the side walls of the placement plate 142. The two second springs 64 are fixedly installed on the top of the fixed plate 65. The telescopic triangular block 62 is fixedly installed on the top of the second springs 64. The T-shaped sliding plate 63 is fixedly installed on the side wall of the telescopic triangular block 62. The telescopic hinge post 66 is fixedly installed on the telescopic section of the telescopic triangular block 62. The T-shaped sliding plate 63 is limited to slide on the side wall of the placement plate 142. Several adjusting components are rotatably installed on the side walls of several placement plates 142. One of the adjusting components is hinged to the bottom of the telescopic hinge post 66. The several adjusting components are rotatably connected to each other. The first wedge plate 61 extends by contacting the counterweight plate 4. The extension of the first wedge plate 61 causes the telescopic triangular block 62 and the T-shaped slide plate 63 to move downward. The downward movement of the telescopic triangular block 62 causes the telescopic hinge column 66 to move downward. This achieves automatic determination of wafer size without the need for manual inspection and debugging.

[0028] Specifically, each of the aforementioned adjustment components includes a first telescopic plate 67, a first shaft 68, and two hinge rods 69. The first shaft 68 is rotatably mounted on the side wall of the placement plate 142, and one end of each of the two hinge rods 69 is rotatably mounted on the first shaft 68. The first telescopic plate 67 is rotatably mounted on the first shaft 68. The downward movement of the telescopic hinge column 66 causes the first telescopic plate 67 to move downward, which in turn causes the first shaft 68 to move downward. This downward movement of the first shaft 68 causes one end of each of the two hinge rods 69 to rotate around the first rotating shaft 52, thereby increasing the angle between the two hinge rods 69. This, in turn, causes the corresponding cleaning tanks 14 to move synchronously, thus adjusting the spacing between the cleaning tanks 14. This achieves automatic determination of the wafer size and automatic adjustment of the spacing between the cleaning tanks 14, ensuring the ultrasonic cleaning effect.

[0029] Specifically, the flow rate mechanism 5 includes two mounting brackets 51, a rotating shaft 52, several baffles 53, a fixing ring 54, a conical ring 55, a second wedge block 56, a sliding column 57, and a judgment spring 58. The two mounting brackets 51 are fixedly installed at the bottom of the second cleaning box 2. The rotating shaft 52 is rotatably installed between the two mounting brackets 51. Several baffles 53 are fixedly installed in a circular array on the rotating shaft 52. The fixing ring 54 is fixedly installed at the bottom of the second cleaning box 2. The conical ring 55 is slidably installed inside the fixing ring 54. The rotating shaft 52 is provided with a long groove 782. A limit rod 781 is slidably installed in the long groove 782. The limit rod 781 is a telescopic structure. The sliding column 57 is fixedly installed on the top of the limit rod 781. A sleeve plate 78 is movably sleeved on the limit rod 781. A judgment spring 58 is provided on the top of the sleeve plate 78. The second wedge block 56 is movably sleeved on the sliding column 57. The second wedge block 56 is fixedly connected to the judgment spring 58. Pure water is sprayed out through the rinsing port 15, which drives the baffle 53 and the rotating shaft 52 to rotate. It is worth noting that the second wedge block 56 is a counterweight. The rotating shaft 52 drives the sliding column 57 and the second wedge block 56 to rotate synchronously. The centrifugal force drives the second wedge block 56 to slide along the sliding column 57. When a certain speed is reached, the second wedge block 56 abuts against the conical ring 55, causing the conical ring 55 to move. The speed is determined by the centrifugal force, which makes it easier to adjust the tank spacing according to the water flow impact speed, ensuring rinsing efficiency while avoiding residual stains on the wafer surface.

[0030] Specifically, the linkage mechanism 7 includes a connecting rod 71, a first wedge rod 72, a second wedge rod 73, an L-shaped wedge rod 74, a return spring 75, a first conical block 76, and a second conical block 77. The second conical block 77 is fixedly mounted on the rotating shaft 52, and the first conical block 76 is fixedly mounted on the rotating shaft 52. The connecting rod 71 is fixedly mounted on the top of the first wedge plate 61, the first wedge rod 72 is fixedly mounted on the bottom of the connecting rod 71, and the second wedge rod 73 is fixedly mounted on the side wall of one of the first telescopic plates 67. The L-shaped wedge rod 74 is slidably mounted on the bottom of the second cleaning box 2, and the return spring 75 is fixedly mounted on the side wall of the L-shaped wedge rod 74. The first wedge rod 72 abuts against the second conical block 77, the first conical block 76 abuts against the sleeve plate 78, the L-shaped wedge rod 74 abuts against the conical ring 55, and the L-shaped wedge rod 74 abuts against the second wedge rod 73. The conical ring 55 moves to abut against the L-shaped wedge rod 74, which in turn moves to abut against the second wedge rod 73, causing it to move downwards. The downward movement of the second wedge rod 73 drives the first telescopic plate 67 to move downwards, thereby increasing the angle between the two hinge rods 69. This achieves the effect of adjusting the wafer spacing according to the flow rate. When the limiting frame 13 is placed inside the second cleaning box 2, the connecting rod 71 and the first wedge rod 72 move downwards. The first wedge rod 72 abuts against the second conical block 77, which drives the rotating shaft 52 and the first conical block 76 to move synchronously. The first conical block 76 moves to abut against... The contact plate 78 moves upward, compressing the judgment spring 58. This results in a larger increase in wafer pitch for a 12-inch wafer compared to a 6-inch wafer, under the same water flow rinsing speed. This enables adaptive adjustment of the wafer pitch based on the rinsing speed, ensuring optimal cleaning at any rinsing speed. Furthermore, it adaptively switches between two rinsing speed pitch adjustment systems for different wafer sizes, guaranteeing optimal cleaning at different rinsing speeds for wafers of varying sizes. No manual monitoring or adjustment is required, making operation simple, convenient, and quick.

[0031] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An IWC cleaning machine, comprising a body, wherein a first cleaning box and a second cleaning box are fixedly disposed inside the body, two guide rails are fixedly disposed inside the body, an electric slide rod is slidably disposed between the two guide rails, and two electric robotic arms are fixedly disposed at the bottom of the electric slide rod, characterized in that: Both the first and second cleaning boxes are fixedly equipped with limiting plates inside. The top of the two limiting plates is equipped with limiting frames, and both ends of the limiting frames are fixedly equipped with fixing posts. Several cleaning tanks are slidably arranged between the limiting frames. One of the cleaning tanks is equipped with a counterweight plate inside, and one of the cleaning tanks is equipped with a switching mechanism on its side wall. The second cleaning box is equipped with a flow rate mechanism and a linkage mechanism.

2. The IWC cleaning machine according to claim 1, characterized in that: The second cleaning box has several rinsing ports on its side wall.

3. The IWC cleaning machine according to claim 1, characterized in that: Each of the aforementioned cleaning tanks includes a base plate, a placement plate, and two first springs. The placement plate is slidably sleeved on the limiting frame, and one end of each of the two first springs is fixedly disposed at the bottom of the sliding plate. The base plate is fixedly disposed at the other end of each of the two first springs.

4. An IWC cleaning machine according to claim 3, characterized in that: The switching mechanism includes a first wedge plate, a telescopic triangular block, a T-shaped sliding plate, two second springs, a fixed plate, a telescopic hinge post, and several adjusting components. The first wedge plate is inserted into the side wall of the placement plate. The fixed plate is fixedly installed on one of the side walls of the placement plate. The two second springs are fixedly installed on the top of the fixed plate. The telescopic triangular block is fixedly installed on the top of the second springs. The T-shaped sliding plate is fixedly installed on the side wall of the telescopic triangular block. The telescopic hinge post is fixedly installed on the telescopic section of the telescopic triangular block. The T-shaped sliding plate is limited to sliding on the side wall of the placement plate. Several adjusting components are rotatably installed on the side walls of several placement plates. One of the adjusting components is hinged to the bottom of the telescopic hinge post. The several adjusting components are rotatably connected to each other.

5. An IWC cleaning machine according to claim 4, characterized in that: Each of the aforementioned adjustment components includes a first telescopic plate, a first shaft, and two hinge rods. The first shaft is rotatably mounted on the side wall of the placement plate, and one end of each of the two hinge rods is rotatably mounted on the first shaft. The first telescopic plate is rotatably mounted on the first shaft.

6. An IWC cleaning machine according to claim 1, characterized in that: The flow rate mechanism includes two mounting brackets, a rotating shaft, several baffles, a fixed ring, a conical ring, a second wedge block, a sliding column, and a judgment spring. The two mounting brackets are fixedly installed at the bottom of the second cleaning box. The rotating shaft is rotatably installed between the two mounting brackets. The several baffles are fixedly installed on the rotating shaft in a circular array. The fixed ring is fixedly installed at the bottom of the second cleaning box. The conical ring is slidably installed inside the fixed ring. The rotating shaft is provided with a long groove. A limit rod is slidably installed in the long groove. The limit rod is a telescopic structure. The sliding column is fixedly installed on the top of the limit rod. A sleeve plate is movably sleeved on the limit rod. A judgment spring is provided on the top of the sleeve plate. The second wedge block is movably sleeved on the sliding column. The second wedge block is fixedly connected to the judgment spring.

7. An IWC cleaning machine according to claim 6, characterized in that: The linkage mechanism includes a connecting rod, a first wedge rod, a second wedge rod, an L-shaped wedge rod, a return spring, a first conical block, and a second conical block. The second conical block is fixedly mounted on the rotating shaft, and the first conical block is fixedly mounted on the rotating shaft. The connecting rod is fixedly mounted on the top of the first wedge plate, the first wedge rod is fixedly mounted on the bottom of the connecting rod, and the second wedge rod is fixedly mounted on the side wall of one of the first telescopic plates. The L-shaped wedge rod is slidably mounted on the bottom of the second cleaning box, and the return spring is fixedly mounted on the side wall of the L-shaped wedge rod. The first wedge rod abuts against the second conical block, the first conical block abuts against the sleeve plate, the L-shaped wedge rod abuts against the conical ring, and the L-shaped wedge rod abuts against the second wedge rod.

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