A crystalline silicon plate laminating machine

Abstract

The application provides a crystalline silicon plate film laminating machine, and relates to the technical field of mechanical equipment. The machine comprises a chassis, two support frames are symmetrically and uniformly arranged on the upper surface of the chassis, a cutting assembly is arranged between the two support frames, the cutting assembly comprises two semicircular groove plates which are fixedly installed on the middle parts of the two support frames and have opposite notches, sliding blocks are movably connected to the inner walls of the semicircular groove plates, a side groove rod is fixedly connected between the two sliding blocks, a sliding cylinder is movably connected to the outer wall of the side groove rod, and double-edge curved knives are movably installed below the sliding cylinder. The sliding cylinder on the outer wall of the side groove rod is introduced into the gap between two adjacent crystalline silicon plates, the double-edge curved knives below the sliding cylinder are attached to the edges of the rear crystalline silicon plate, the crystalline silicon plate continues to move to push the cutter to move on the inclined rod, and the film is cut, so that the machine can cut the film without stopping, thereby improving the film laminating efficiency of the crystalline silicon plate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of mechanical equipment, in particular to a crystalline silicon plate laminating machine. BACKGROUND

[0002] Crystalline silicon plate is a flat core base material made of high-purity single crystal silicon or polycrystalline silicon, which is widely used in photovoltaic, semiconductor and electronic fields; in the photovoltaic industry, it specifically refers to crystalline silicon solar cell. In order to save cost, some solar cells are made of polycrystalline silicon. Because it is fragile and needs to be used outdoors for a long time, it must be laminated to improve its strength, so as to achieve impact protection, moisture protection, electrical insulation and improve light absorption efficiency, and ultimately ensure the durability and power generation stability of the solar panel.

[0003] In the process of laminating the crystalline silicon plate, a laminating machine is usually used to press the required film material onto the surface of the crystalline silicon plate with its pressing structure, and then a cutting knife is used to cut the film material to separate the film layer connection between the adjacent two crystalline silicon plates. However, in this laminating process, the conveying belt needs to drive the crystalline silicon plate to continuously move to complete the lamination, and the conveying needs to be stopped to cooperate with the cutting action when cutting. This intermittent operation mode affects the overall efficiency of the crystalline silicon plate lamination.

[0004] For example: the "plate automatic laminating device" disclosed in Chinese invention patent (publication number: CN108312561A) has the following disclosure in the specification: the present application relates to the field of mechanical equipment, in particular to a plate automatic laminating device, which can be adjusted according to the specifications of the plate, can process various types of plates, and can cut the film through the first cutting assembly, the second cutting assembly and the third cutting assembly, reducing the amount of manual labor; however, although this invention can cut the film laminated on the crystalline silicon plate multiple times, the conveying process of the crystalline silicon plate lamination needs to be stopped during the cutting process, which affects the efficiency of the crystalline silicon plate lamination.

[0005] Therefore, we improve it and propose a crystalline silicon plate laminating machine. SUMMARY

[0006] The purpose of the present application is to solve the problem that the cutting operation needs to stop the conveying belt in the current laminating process, and this frequent start-stop intermittent operation mode affects the lamination efficiency.

[0007] In order to achieve the above-mentioned purpose of the application, the present application provides a crystalline silicon plate laminating machine to improve the above-mentioned problems.

[0008] The present application is as follows:

[0009] The utility model provides a kind of crystalline silicon plate film laminating machine, including chassis, four side frames are uniformly fixedly connected above the chassis, two adjacent side frames are movably connected with shaft above, side roller is fixedly connected on the outer wall of the shaft, conveying belt is movably connected between two side rollers, two support frames are fixedly connected in the middle of the upper surface of the chassis in symmetry, the top of the support frame is fixedly connected with auxiliary frame, film roller is movably connected between two auxiliary frames, cutting assembly is equipped between two support frames, the cutting assembly includes half-arc groove plate fixedly installed in the middle of two support frames, and the notch of two half-arc groove plates is opposite, sliding block is movably connected on the inner wall of the half-arc groove plate, side slot rod is fixedly connected between two sliding blocks, sliding cylinder is movably connected on the outer wall of the side slot rod, double-side arc knife is movably installed below the sliding cylinder, one end of the sliding block away from the side slot rod is fixedly connected with arc plate, and the arc plate is movably connected with half-arc groove plate, arc toothed plate is fixedly connected on the side of the arc plate away from the side slot rod, four fixed frames are fixedly connected on the both sides of the upper surface of the chassis in straight line, two adjacent fixed frames are fixedly connected with auxiliary plate above, and four auxiliary plates are distributed in the side of support frame in rectangle, one group of auxiliary plates is equipped with inclined pressing assembly above, and the upper surface of another group of auxiliary plates is equipped with auxiliary assembly on one side.

[0010] As the preferred technical solution of the application, two auxiliary springs are sleeved on the both sides of the outer wall of the side slot rod, and the other end of the auxiliary spring is fixedly installed on the side of the sliding block.

[0011] As the preferred technical solution of the application, a side window is formed in the middle of the side of one of the half-arc groove plates, a bidirectional motor is fixedly connected on the side of the support frame away from the side slot rod, an auxiliary gear is fixedly connected on the output shaft end of the bidirectional motor, and the auxiliary gear is meshingly connected with the arc toothed plate through the side window on one side.

[0012] As the preferred technical solution of the application, the inclined pressing assembly includes a limiting frame plate fixedly installed on the upper surface of two auxiliary plates on one side, two half-round rods are movably connected on the inner wall of the limiting frame plate in symmetry, and the two half-round rods are symmetrically distributed, one end of one of the half-round rods away from the limiting frame plate is fixedly connected with an extension bolt shaft, and the other end of the other half-round rod away from the limiting frame plate is fixedly connected with a shaft sleeve rod, and the extension bolt shaft and the shaft sleeve rod are movably connected.

[0013] As the preferred technical solution of the application, a sliding groove is formed on the surface of the auxiliary plate in straight line in symmetry, a sliding rod is movably connected on the inner wall of the sliding groove, a positioning wheel is movably installed below the sliding rod, a spring telescopic rod is fixedly connected on the other end of the sliding rod, and the spring telescopic rod is fixedly installed on the lower surface of the auxiliary plate on the other end.

[0014] As a preferred technical scheme of the present application, the other end of the semicircular rod is movably connected with a positioning shaft disc, and the positioning shaft disc is movably installed on the upper surface of the auxiliary plate.

[0015] As a preferred technical scheme of the present application, the auxiliary assembly comprises two inclined frame plates which are fixedly installed above the auxiliary plate, and the opposite surfaces of the two inclined frame plates are respectively provided with a limiting sliding window, and a limiting shaft is movably connected between the two limiting sliding windows, and a pressure roller is fixedly connected to the outer wall of the limiting shaft, and an arc-shaped sleeve is movably connected above the limiting shaft in a symmetrical and uniform manner, and an elastic telescopic rod is fixedly connected above the arc-shaped sleeve.

[0016] As a preferred technical scheme of the present application, the rolling assembly comprises a straight slot which is formed in the plane of the semicircular rod, and the straight slot is movably connected between the inner wall of the straight slot and the outer wall of the extending bolt shaft, and two adjacent semicircular rods can be connected to each other to form a circular rod, and the outer wall of one of the positioning shaft discs is fixedly connected with an adjusting gear, and the outer wall of the adjusting gear is meshingly connected with a straight toothed plate.

[0017] As a preferred technical scheme of the present application, the straight toothed plate is fixedly connected with a push plate on the side away from the adjusting gear, and the push plate is fixedly connected with an electric telescopic rod on one side, and the electric telescopic rod is fixedly connected with a positioning plate on the other end.

[0018] As a preferred technical scheme of the present application, a support plate is fixedly connected between two auxiliary plates on the same side, and the upper surface of the support plate is fixedly connected with a rib plate in a symmetrical and uniform manner.

[0019] Compared with the prior art, the present application has the following beneficial effects:

[0020] In the scheme of the present application:

[0021] 1. In order to solve the problem that the cutting operation needs to pause the conveying belt in the existing film covering process, and this frequent start-stop intermittent operation mode affects the film covering efficiency, in the process of conveying the crystalline silicon plate with film, an inclined side groove rod is erected to perform a first inclined pressure covering operation on the crystalline silicon plate with film, so as to guide the bubbles between the film and the crystalline silicon plate to be discharged, and the sliding cylinder of the side groove rod is pushed into the gap between the adjacent two crystalline silicon plates by the auxiliary spring, and the double-sided arc knife below the sliding cylinder is attached to the edge of the rear-end crystalline silicon plate, so as to cut the film on the surface of the crystalline silicon plate, thereby realizing the inclined pressure covering of the surface of the crystalline silicon plate to guide the bubbles therebetween, so as to ensure that the film can be closely attached, and the knife body is attached to the front edge of the crystalline silicon plate, the crystalline silicon plate continues to move to push the knife body to move on the outer wall of the inclined rod body, the rotation of the knife body is completed, the knife body is always attached to the rear-end crystalline silicon plate, and cutting can be completed without stopping, so as to improve the efficiency and quality of the film covering of the crystalline silicon plate;

[0022] 2. By four cross-distributed semicircular rods, and relative distribution two with arc surface downward, the other two are erected on the semicircular rod with arc surface downward to make the film on the surface of the crystalline silicon plate be secondly inclined and covered, so that the film on the crystalline silicon plate can be secondly inclined and covered to prevent bubbles between the film and the plate;

[0023] 3. By erecting an arc sleeve above the limiting shaft of the covering roller to adjust the rotation of the bolt on the inclined plate to drive the arc sleeve to adjust the height, the height of the covering roller is changed, and the elastic telescopic rod is erected above the arc sleeve to make the covering roller be elastically adjusted according to the height of the plate plane to prevent the covering roller from being damaged by passing through the uneven plate plane, so that the height of the covering roller can be adjusted according to the thickness of the plate, and the elastic adjustment can be used to cope with the uneven crystalline silicon plate to prevent the surface of the roller from being damaged due to the uneven surface of the plate;

[0024] 4. By rotating one of the semicircular rods to take the positioning shaft disc as the axis, the angle between the two symmetrically distributed semicircular rods is gradually expanded, the extension bolt shaft is slid into the straight slot of the other semicircular rod, and the two semicircular rods are spliced to form a circular rod by continuously rotating, so that the film-coated crystalline silicon plate can be rolled and covered to meet the film-coating requirements of the crystalline silicon plate at this time;

[0025] 5. When positioning and covering is needed, the extension bolt shaft of one of the semicircular rods is slid out of the straight slot of the other semicircular rod and into the shaft sleeve rod, the two semicircular rods are rotated with the extension bolt shaft and the shaft sleeve rod as the hinge to reduce the angle between them, so that the two semicircular rods are symmetrically distributed, the arc surface of one of the semicircular rods is used to incline and cover the film-coating process of the crystalline silicon plate, and when rolling and covering is needed, the extension bolt shaft of one of the semicircular rods is driven by the rotating adjusting gear to rotate around the positioning shaft disc, so that the extension bolt shaft of one of the semicircular rods is separated from the shaft sleeve rod and enters the straight slot of the other semicircular rod during the rotation process, and the two semicircular rods are spliced to form a circular rod by continuously sliding, and the connection between the two semicircular rods and the positioning shaft disc is taken as the axis to rotate, so that the film-coating process of the crystalline silicon plate is rolled and covered, so that the film-coating state can be adjusted according to the different types of film-coated crystalline silicon plates, and the film-coating state can be flexibly switched between the inclined covering state and the rolling covering state to ensure the film-coating effect of the crystalline silicon plate. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 The overall structure of the crystalline silicon plate film coating machine provided by the present application Figure 1 ;

[0027] Figure 2 The overall structure of the crystalline silicon plate film coating machine provided by the present application Figure 2 ;

[0028] Figure 3 A partial structure diagram of the film laminating machine for crystalline silicon plate provided in the present application Figure 1

[0029] Figure 4 A partial structure diagram of the film laminating machine for crystalline silicon plate provided in the present application Figure 2

[0030] Figure 5 A partial structure diagram of the film laminating machine for crystalline silicon plate provided in the present application Figure 3

[0031] Figure 6 A partial structure diagram of the film laminating machine for crystalline silicon plate provided in the present application Figure 4

[0032] Figure 7 A partial structure diagram of the film laminating machine for crystalline silicon plate provided in the present application

[0033] Figure 8 A partial structure diagram of the film laminating machine for crystalline silicon plate provided in the present application

[0034] Figure 9 A partial structure diagram of the film laminating machine for crystalline silicon plate provided in the present application Figure 6

[0035] A partial structure diagram of the film laminating machine for crystalline silicon plate provided in the present application Figure 10 Figure 8 A partial structure diagram of the film laminating machine for crystalline silicon plate provided in the present application

[0036] A partial structure diagram of the film laminating machine for crystalline silicon plate provided in the present application

[0037] ​​​​​1, bottom frame; 2, side frame; 3, rotating shaft; 4, side roller; 5, shaft frame; 6, cutting assembly; 601, half-arc groove plate; 602, sliding block; 603, side slot rod; 604, auxiliary spring; 605, arc plate; 606, arc tooth plate; 607, side window; 608, auxiliary gear; 609, sliding cylinder; 610, double-edge arc knife; 611, bidirectional motor; 7, inclined pressing assembly; 701, limiting frame plate; 702, positioning shaft disc; 703, semicircular rod; 704, extension bolt shaft; 705, sliding groove; 706, sliding rod; 707, positioning wheel; 708, shaft sleeve rod; 709, spring telescopic rod; 8, auxiliary assembly; 801, inclined frame plate; 802, pressure covering roller; 803, adjusting bolt; 804, elastic telescopic rod; 805, limiting sliding window; 806, limiting shaft; 807, arc sleeve; 9, rolling assembly; 901, adjusting gear; 902, straight tooth plate; 903, push plate; 904, positioning plate; 905, electric telescopic rod; 906, straight slot; 10, fixing frame; 11, auxiliary plate; 12, transmission wheel; 13, belt; 14, auxiliary wheel; 15, support frame; 16, auxiliary frame; 17, film roller; 18, auxiliary roller; 19, conveying belt; 20, driving motor; 21, support plate; 22, rib plate; 23, upper pressing roller; 24, guide roller. DETAILED DESCRIPTION

[0038] In order to make the personnel in the technical field better understand the present application scheme, the technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the present application.

[0039] As described in the background, in the film coating process, the conveying belt needs to drive the silicon wafer to continuously run to complete the film coating, and needs to be stopped to cooperate with the cutting action when cutting. This intermittent operation mode will affect the overall efficiency of the silicon wafer film coating.

[0040] In order to solve this technical problem, the present application provides a silicon wafer film coating machine, which is applied to the technical field of mechanical equipment.

[0041] Embodiment 1, please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10The utility model provides a kind of crystalline silicon plate film laminating machine, including chassis 1, four side frames 2 are uniformly fixedly connected with top of chassis 1, side frame 2 top is fixedly connected with axle frame 5, adjacent two axle frames 5 are movably connected with shaft 3, side roller 4 is fixedly connected with the outer wall of shaft 3, conveying belt 19 is movably connected between two side rollers 4, two support frames 15 are fixedly connected with top of chassis 1 and are symmetrically and evenly distributed, auxiliary frame 16 is fixedly connected with the top of support frame 15, film roller 17 is movably connected between two auxiliary frames 16, cutting assembly 6 is arranged between two support frames 15, cutting assembly 6 includes half-arc groove plate 601 fixedly installed in the middle of two support frames 15, and the notch of two half-arc groove plates 601 is opposite, sliding block 602 is movably connected with the inner wall of half-arc groove plate 601, side slot rod 603 is fixedly connected between two sliding blocks 602, sliding cylinder 609 is movably connected with the outer wall of side slot rod 603, double-side arc cutter 610 is movably installed below sliding cylinder 609, one end of one sliding block 602 away from side slot rod 603 is fixedly connected with arc plate 605, and arc plate 605 is movably connected with half-arc groove plate 601, arc tooth plate 606 is fixedly connected with the side of arc plate 605 away from side slot rod 603, four fixed frames 10 are fixedly connected with the both sides of the top of chassis 1 and are linearly and evenly distributed, auxiliary plate 11 is fixedly connected with the top of adjacent two fixed frames 10, and four auxiliary plates 11 are rectangularly distributed on the side of support frame 15, oblique pressing assembly 7 is arranged on the top of one group of auxiliary plates 11, and auxiliary assembly 8 is arranged on the top of the other group of auxiliary plates 11, the driving motor 20 drives auxiliary wheel 14 to rotate, under the transmission of belt 13, auxiliary wheel 14 rotates, auxiliary wheel 14 drives one side roller 4, cooperates with another side roller 4, and transports and laminates crystalline silicon plate, and under the transmission and guidance of two guide rollers 24 and upper pressing roller 23, it passes through two support frames 15, and the film wound by film roller 17 passes through two auxiliary rollers 18, then passes through pressing roller 802, and the film is pressed and laminated on the top surface of crystalline silicon plate, with crystalline silicon plate passing through pressing roller 802 in sequence, laminating operation is carried out, crystalline silicon plate with film passes below side slot rod 603, at this time, side slot rod 603 is in inclined state, sliding cylinder 609 on the outer wall of side slot rod 603 is pressed by auxiliary spring 604, double-side arc cutter 610 is driven to be attached to the side of crystalline silicon plate, and side slot rod 603 carries out first pressing operation to crystalline silicon plate, when one crystalline silicon plate passes through two support frames 15, the next crystalline silicon plate enters, and there is a certain space between the one and the next crystalline silicon plate, auxiliary spring 604 drives sliding cylinder 609 to enter the space and contact the front edge of one crystalline silicon plate, the cutting edge of double-side arc cutter 610 is attached to the edge of crystalline silicon plate, with the continuous movement of crystalline silicon plate driven by conveying belt 19, crystalline silicon plate also drives double-side arc cutter 610 to slide on the outer wall of inclined side slot rod 603, and the film laminated on the surface of crystalline silicon plate is cut, with continuous pushing, double-side arc cutter 610 is pushed out of the gap between adjacent crystalline silicon plates,When the side of the crystalline silicon plate enters, the auxiliary spring 604 at one end of the side slot rod 603 is compressed, and after completion, the bidirectional motor 611 is started to drive the auxiliary gear 608 to rotate, which drives the meshed arc tooth plate 606 to move, and the center of the side slot rod 603 is used as the axis to rotate, and the slider 602 in the arc plate 605 slides in the half-arc slot plate 601, so as to change the inclination direction of the side slot rod 603, drive the double-arc knife 610 to continue to contact the edge of the crystalline silicon plate which does not pass through the support frame 15, and make the double-arc knife 610 connected to the sliding cylinder 609 move from one end of the side slot rod 603 to the other end, so as to perform the cutting operation again.

[0042] During the film conveying process of the crystalline silicon plate, the inclined side slot rod 603 is erected to perform the first inclined pressing operation on the film of the crystalline silicon plate, so as to guide the bubbles between the film and the crystalline silicon plate to be discharged, and the sliding cylinder 609 on the outer wall of the side slot rod 603 is pushed into the space between the adjacent two crystalline silicon plates by the auxiliary spring 604, and the double-arc knife 610 below the sliding cylinder 609 is attached to the edge of the rear-end crystalline silicon plate, so as to cut the film on the surface of the crystalline silicon plate, so that the film can be closely attached by realizing the inclined pressing on the surface of the crystalline silicon plate to guide the bubbles therebetween, and the knife body is attached to the front edge of the crystalline silicon plate, the crystalline silicon plate continues to move to push the knife body to move on the inclined rod body, the knife body rotates, so that the knife body is always attached to the rear-end crystalline silicon plate, and the cutting operation is completed without stopping, so as to improve the efficiency and quality of the film coating of the crystalline silicon plate.

[0043] Further, as shown in Figure 3 , Figure 4 and Figure 5 , two auxiliary springs 604 are sleeved on the two sides of the outer wall of the side slot rod 603, one end of the auxiliary spring 604 is fixedly installed on the side of the sliding block 602, the sliding cylinder 609 is pushed to be attached to the crystalline silicon plate by the auxiliary spring 604, so as to guide the double-arc knife 610 into the space between the adjacent two crystalline silicon plates to perform the cutting operation.

[0044] Further, as shown in Figure 2 , Figure 3 and Figure 5 , one of the half-arc slot plates 601 is provided with a side window 607 in the middle of the side, the support frame 15 is fixedly connected to the side away from the side slot rod 603, the bidirectional motor 611 is fixedly connected to the output shaft end of the bidirectional motor 611, the auxiliary gear 608 is meshingly connected with the arc tooth plate 606 through the side window 607, the auxiliary gear 608 is rotated by the bidirectional motor 611, the arc plate 605 slides in the half-arc slot plate 601 through the meshing of the side window 607 of the half-arc slot plate 601 and the arc tooth plate 606, and the inclination direction of the side slot rod 603 is changed.

[0045] Embodiment 2, the further optimization of the crystalline silicon plate film laminating machine provided in Embodiment 1, specifically, as shown in Figure 2 、 Figure 7 、 Figure 8 、 Figure 9 and Figure 10 shown, the inclined pressing assembly 7 includes a limiting frame plate 701 fixedly installed on the upper surface of one of the two auxiliary plates 11, the inner wall of the limiting frame plate 701 is symmetrically and uniformly distributed with two semicircular rods 703 movably connected, and the two semicircular rods 703 are symmetrically distributed. One of the semicircular rods 703 is fixedly connected with an extension bolt shaft 704 at the end away from the limiting frame plate 701, and the other semicircular rod 703 is fixedly connected with a shaft sleeve rod 708 at the end away from the limiting frame plate 701. The extension bolt shaft 704 and the shaft sleeve rod 708 are movably connected. The conveying belt 19 conveys the crystalline silicon plate with the film cut to size through the two support frames 15 and into the lower part of the semicircular rods 703. Since the four semicircular rods 703 are cross-distributed above the conveying belt 19, and the arc surfaces of two of the semicircular rods 703 face downward, and the other two semicircular rods 703 are erected above the adjacent semicircular rods 703 with the plane downward, they are connected by the extension bolt shaft 704 and the shaft sleeve rod 708 and erected above the conveying belt 19. The crystalline silicon plate with the film passes through from below and contacts the arc surfaces of the semicircular rods 703. The two oppositely distributed semicircular rods 703 press and cover the film on the surface of the crystalline silicon plate with the arc surfaces, and in an inclined state, thereby realizing the second inclined pressing and covering of the film on the crystalline silicon plate.

[0046] Through the four cross-distributed semicircular rods 703, and the two oppositely distributed semicircular rods 703 with the arc surfaces facing downward, and the other two semicircular rods 703 erected above the semicircular rods 703 with the arc surfaces facing downward with the plane downward, the crystalline silicon plate passes through to press and cover the film on the surface of the crystalline silicon plate twice, thereby being able to press and cover the film on the crystalline silicon plate twice to prevent bubbles from existing between the film and the plate.

[0047] Further, as shown in Figure 7 、 Figure 8 、 Figure 9 and Figure 10 , the surface of the auxiliary plate 11 is linearly and uniformly distributed with a sliding groove 705, the inner wall of the sliding groove 705 is movably connected with a sliding rod 706, the lower part of the sliding rod 706 is movably installed with a positioning wheel 707, the other end of the sliding rod 706 is fixedly connected with a spring telescopic rod 709, and the other end of the spring telescopic rod 709 is fixedly installed on the lower surface of the auxiliary plate 11. The linearly distributed positioning wheels 707 below the auxiliary plate 11 concentrate and guide the crystalline silicon plate, and the spring telescopic rod 709 elastically guides and drives the positioning wheel 707 to move. The sliding rod 706 connected with the positioning wheel 707 moves in the sliding groove 705, and the direction of the movement of the positioning wheel 707.

[0048] Further, as shown in Figure 2 andFigure 7 As shown in the figure, the other end of the semicircular rod 703 is movably connected with a positioning shaft disc 702, and the positioning shaft disc 702 is movably installed on the upper surface of the auxiliary plate 11. One end of the semicircular rod 703 is limited on one side of the auxiliary plate 11 through the positioning shaft disc 702, so as to prevent the semicircular rod 703 from deviating during the rolling process. The upper surface of the auxiliary plate 11 is provided with a rolling assembly 9.

[0049] In the embodiment 3, the crystalline silicon plate film coating machine provided in the embodiments 1 and 2 is further optimized, specifically as shown in the figure, Figure 1 、 Figure 6 、 Figure 8 and Figure 10 As shown in the figure, the auxiliary assembly 8 includes an inclined frame plate 801 fixedly installed above the auxiliary plate 11. The opposite surfaces of the two inclined frame plates 801 are respectively provided with a limiting sliding window 805. The limiting sliding window 805 is movably connected with a limiting shaft 806. The outer wall of the limiting shaft 806 is fixedly connected with a rolling roller 802. The upper portion of the limiting shaft 806 is symmetrically and uniformly movably connected with an arc-shaped sleeve 807. The outer wall of the arc-shaped sleeve 807 is movably installed on the inner wall of the limiting sliding window 805. The upper portion of the arc-shaped sleeve 807 is fixedly connected with an elastic telescopic rod 804. The film is contacted with the surface of the crystalline silicon plate after passing through the rolling roller 802. Then the conveying belt 19 is started to drive the crystalline silicon plate to move, so as to pull the film. The film roller 17 releases the film. The film is pressed on the crystalline silicon plate by the rolling roller 802. According to the thickness of the crystalline silicon plate, the adjusting screw 803 is rotated. Since the adjusting screw 803 is threadedly connected with the upper portion of the inclined frame plate 801, the arc-shaped sleeve 807 connected with the elastic telescopic rod 804 is driven to move up and down. The elastic telescopic rod 804 cooperates with the surface of the crystalline silicon plate. If the surface of the plate is uneven, the rolling roller 802 is driven to change the height. At this time, the limiting shaft 806 of the rolling roller 802 is in a positioning connection, so that the surface of the rolling roller 802 is easily damaged. The elastic telescopic rod 804 arranged above the arc-shaped sleeve 807 can provide elastic buffering for the rolling roller 802.

[0050] The arc-shaped sleeve 807 is arranged above the limiting shaft 806 of the rolling roller 802. The adjusting screw 803 is rotated on the inclined frame plate 801 to drive the arc-shaped sleeve 807 to adjust the height, so as to change the height of the rolling roller 802. The elastic telescopic rod 804 is arranged above the arc-shaped sleeve 807. The rolling roller 802 is elastically adjusted according to the height of the plate plane to prevent the rolling roller 802 from being damaged when passing through the uneven plate plane. Thus, the height of the rolling roller 802 can be adjusted according to the thickness of the plate. The elastic adjustment can cope with the uneven crystalline silicon plate to prevent the surface of the roller from being damaged due to the uneven surface of the plate.

[0051] Further, as shown in the figure, Figure 8 and Figure 10As shown in the figure, the elastic telescopic rod 804 is movably mounted above the adjusting bolt 803, and the adjusting bolt 803 is threadedly mounted above the inclined shelf plate 801. The height of the arc-shaped sleeve 807 connected with the elastic telescopic rod 804 is adjusted by the threaded connection of the adjusting bolt 803 above the inclined shelf plate 801, so that the height of the laminating roller 802 is adjusted according to the thickness of the plate.

[0052] Further, as shown in the figure, Figure 3 , Figure 4 and Figure 5 , two auxiliary rollers 18 are movably mounted between the upper middle portions of the two support frames 15 in a symmetrical and uniform manner, and the two auxiliary rollers 18 are above the side groove rod 603. The film guided out by the film roller 17 is guided by the auxiliary roller 18 to prevent wrinkles in the film before lamination.

[0053] In embodiment 4, the crystal silicon plate laminating machine provided in embodiments 1, 2 and 3 is further optimized. Specifically, as shown in the figure, Figure 1 , Figure 7 , Figure 8 and Figure 9 , the rolling assembly 9 includes a straight slot 906 opened in the plane of the semicircular rod 703, and the inner wall of the straight slot 906 is movably connected with the outer wall of the extension bolt shaft 704. Adjacent two semicircular rods 703 can be spliced to form a circular rod. Two groups of semicircular rods 703 are cross-distributed in the middle of the two auxiliary plates 11. One of the outer walls of the positioning shaft disc 702 is fixedly connected with an adjusting gear 901, and the outer wall of the adjusting gear 901 is meshingly connected with a straight toothed plate 902. The straight toothed plate 902 is moved by driving the electric telescopic rod 905 to extend, and the adjusting gear 901 meshingly connected with the straight toothed plate 902 is driven to rotate, so that the semicircular rod 703 rotates around the positioning shaft disc 702 as the axis. Since the two semicircular rods 703 are symmetrically distributed, the semicircular rod 703 on one side rotates to drive the shaft sleeve rod 708 of the other semicircular rod 703 to move, and the angle gradually expands, so that the extension bolt shaft 704 slides into the straight slot 906 of the other semicircular rod 703. With continuous rotation, the two semicircular rods 703 are spliced into a circular rod. At this time, when the crystal silicon plate is conveyed to the circular rod formed by splicing, the circular rod rotates to roll and laminate the film on the crystal silicon plate.

[0054] By rotating one of the semicircular rods 703 around the positioning shaft disc 702 as the axis, the angle between the two symmetrically distributed semicircular rods 703 gradually expands, so that the extension bolt shaft 704 slides into the straight slot 906 of the other semicircular rod 703. With continuous rotation, the two semicircular rods 703 are spliced into a circular rod, so that the laminated crystal silicon plate can be roll-laminated to meet the lamination requirements of the crystal silicon plate at this time.

[0055] Further, as shown in the figure,Figure 9 As shown, the straight-toothed plate 902 is fixedly connected with a push plate 903 away from the adjusting gear 901, the push plate 903 is fixedly connected with an electric telescopic rod 905 on one side, the electric telescopic rod 905 is fixedly connected with a positioning plate 904 on the other end, and the positioning plate 904 is fixedly installed on the surface of the auxiliary plate 11, and the electric telescopic rod 905 is stretched to drive the straight-toothed plate 902 to move through the connected push plate 903, thereby providing power for the rotation of the meshed adjusting gear 901.

[0056] Further, as shown in Figure 7 As shown, the two auxiliary plates 11 on the same side are fixedly connected with a support plate 21, and the upper surface of the support plate 21 is fixedly connected with a rib plate 22 in a symmetrical and uniform distribution, and the rib plate 22 is erected on the support plate 21 below the conveying belt 19 to provide support during the conveying of the crystalline silicon plate by the conveying belt 19.

[0057] Further, as shown in Figure 1 , Figure 2 and Figure 6 As shown, one side of one of the side rollers 4 is fixedly connected with a transmission wheel 12, the outer wall of the transmission wheel 12 is movably installed with a belt 13, the other end of the belt 13 is movably connected with an auxiliary wheel 14, one side of the auxiliary wheel 14 is fixedly connected with a driving motor 20, and the driving motor 20 is fixedly installed on the upper surface of the chassis 1, the auxiliary wheel 14 is driven to rotate by the driving motor 20, and the auxiliary wheel 14 is driven to rotate by the transmission of the belt 13, and the auxiliary wheel 14 drives one of the side rollers 4 to rotate, and the other side roller 4 is driven to rotate, and the crystalline silicon plate is conveyed and coated.

[0058] Further, as shown in Figure 4 and Figure 5 As shown, the upper pressing roller 23 is movably installed in the middle below the two support frames 15, and the upper pressing roller 23 is located in the middle of the outer wall of the conveying belt 19, the two guide rollers 24 are movably installed in a symmetrical and uniform distribution in the lower part of the two support frames 15, and the two guide rollers 24 are located in the inner wall of the conveying belt 19, and the conveying belt 19 is adjusted by the two guide rollers 24 and the upper pressing roller 23, and the transmission process of the conveying belt 19 is adjusted.

[0059] The use process of the crystalline silicon plate coating machine provided by the application is as follows:

[0060] Working principle: the staff places the overall structure in a suitable position, and installs the film roller 17 above the support frame 15, passes through the two auxiliary rollers 18, and then passes through the pressing and coating roller 802 to press and coat the film on the upper surface of the crystalline silicon plate, and as the crystalline silicon plate passes through the pressing and coating roller 802 in sequence, the film coating operation is performed.

[0061] Adjust: according to the thickness of the crystalline silicon plate, the adjusting bolt 803 is rotated, because the adjusting bolt 803 is connected with the inclined frame plate 801 above, the arc-shaped sleeve 807 connected with the elastic telescopic rod 804 is driven to move up and down, and the elastic telescopic rod 804 cooperates with the surface of the crystalline silicon plate, if the surface of the plate is uneven, the cover roller 802 is driven to change its height, at this time, the limiting shaft 806 of the cover roller 802 is positioned and connected, so that the surface of the cover roller 802 is easily damaged, the elastic telescopic rod 804 above the arc-shaped sleeve 807 can provide elastic buffer for the cover roller 802;

[0062] Conveying: the driving motor 20 drives the auxiliary wheel 14 to rotate, under the transmission of the belt 13, the auxiliary wheel 14 rotates, the auxiliary wheel 14 drives one of the side rollers 4 to rotate, cooperates with the other side roller 4, and conveys the crystalline silicon plate for film coating operation, and the two guide rollers 24 and the upper pressure roller 23 are transmitted and guided, so that the crystalline silicon plate passes through the two supporting frames 15, the lower part of the conveying belt 19 is supported by the rib plate 22 above the supporting plate 21, which provides a stable base for the film coating process of the crystalline silicon plate, when the crystalline silicon plate passes through the two groups of auxiliary plates 11, the two sides of the crystalline silicon plate contact with the positioning wheels 707 below the auxiliary plates 11, which adjusts the crystalline silicon plate, the spring telescopic rod 709 connected with the positioning wheel 707 elastically guides the crystalline silicon plate, the slide rod 706 connected with the positioning wheel 707 moves in the sliding groove 705 to limit the moving direction of the positioning wheel 707, the film wound on the film roller 17 passes through the two auxiliary rollers 18 and then passes through the cover roller 802, and the film is pressed on the upper surface of the crystalline silicon plate, as the crystalline silicon plate passes through the cover roller 802 in turn, the film coating operation is performed, and the crystalline silicon plate with the film passes through below the side slot rod 603;

[0063] Film cutting: the silicon wafer with film passes below the side groove rod 603, at this time the side groove rod 603 is in an inclined state, the sliding cylinder 609 on the outer wall of the side groove rod 603 is pressed by the auxiliary spring 604, driving the double-sided arc knife 610 to adhere to the side edge of the silicon wafer, and the side groove rod 603 performs the first film pressing operation on the silicon wafer, while the previous silicon wafer passes through the two support frames 15, the next silicon wafer enters, at this time there is a certain space between the previous and the next silicon wafer, the auxiliary spring 604 pushes the sliding cylinder 609 into the space and contacts the front edge of the silicon wafer, the cutting edge of the double-sided arc knife 610 adheres to the edge of the silicon wafer, as the conveying belt 19 continues to drive the silicon wafer to move, the silicon wafer also pushes the double-sided arc knife 610 to slide on the inclined outer wall of the side groove rod 603, cutting the film on the surface of the silicon wafer, as it continues to be pushed, the double-sided arc knife 610 is pushed out of the gap between the adjacent silicon wafers and enters the side edge of the silicon wafer, compressing the auxiliary spring 604 at one end of the side groove rod 603, after completion, the bidirectional motor 611 is started to drive the auxiliary gear 608 to rotate, driving the meshed arc gear plate 606 to move, rotating around the center of the side groove rod 603, and making the sliding block 602 in the arc-shaped plate 605 slide in the semicircular groove plate 601, changing the inclination direction of the side groove rod 603, driving the double-sided arc knife 610 to continue to contact the edge of the silicon wafer that has not passed through the support frame 15, so that it can move with the silicon wafer to push the sliding cylinder 609 connected to the double-sided arc knife 610 from one end of the side groove rod 603 to the other end, in order to perform the cutting operation again;

[0064] Inclined pressing: the conveying belt 19 conveys the silicon wafer with film cutting to pass through the two support frames 15 and enters below the semicircular rod 703, since the four semicircular rods 703 are cross-distributed above the conveying belt 19, and the arc surfaces of two of the semicircular rods 703 face downward, the other two semicircular rods 703 are erected on the adjacent semicircular rods 703 with the plane downward, relying on the extension bolt shaft 704 and the shaft sleeve rod 708 for connection, since the two connected semicircular rods 703 are symmetrically distributed, when the silicon wafer with film passes below, the semicircular rod 703 cannot rotate with the positioning shaft disc 702 to be erected above the conveying belt 19, the silicon wafer with film passes below and contacts the arc surface of the semicircular rod 703, the two oppositely distributed semicircular rods 703 press the film on the surface of the silicon wafer with the arc surface, and in an inclined state, thereby realizing the second inclined pressing of the film on the silicon wafer;

[0065] Rolling pressure covering: according to the different films covered on the crystalline silicon plate, the rolling pressure covering can be adjusted, the electric telescopic rod 905 is started to extend to drive the straight-toothed plate 902 to move, the adjusting gear 901 engaged with the straight-toothed plate 902 is driven to rotate, so that the semicircular rod 703 rotates around the positioning shaft disc 702 as the axis, since the two semicircular rods 703 are symmetrically distributed, the semicircular rod 703 on one side rotates to drive the extension bolt shaft 704 to drive the shaft sleeve rod 708 of the other semicircular rod 703, the angle gradually expands, so that the extension bolt shaft 704 slides into the straight slot 906 of the other semicircular rod 703, and with the continuous rotation, the two semicircular rods 703 are spliced into a circular rod, at this time the crystalline silicon plate is conveyed to the circular rod, so that the circular rod formed by splicing rotates to roll and press the film covered on the crystalline silicon plate, and after the second pressure covering is completed, it is guided out on the conveying belt 19.

[0066] In the present application, unless otherwise clearly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected or communicated with each other; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0067] Obviously, the above-described embodiments are only a part of the embodiments of the present application, and are not all the embodiments. The preferred embodiments of the present application are given in the drawings, but do not limit the patent scope of the present application. The present application can be realized in many different forms, and conversely, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or equivalently replace some technical features. Any equivalent structure made by using the contents of the present application specification and drawings, directly or indirectly applied to other related technical fields, is also within the patent protection scope of the present application.

Claims

1. A silicon substrate coating machine, comprising a base frame (1), wherein two support frames (15) are symmetrically and evenly distributed and fixedly connected to the middle of the upper surface of the base frame (1), characterized in that, A cutting assembly (6) is provided in the middle between the two support frames (15). The cutting assembly (6) includes a semi-arc groove plate (601) fixedly installed in the middle of the two support frames (15), and the grooves of the two semi-arc groove plates (601) are opposite to each other. A slider (602) is movably connected to the inner wall of the semi-arc groove plate (601). A side groove rod (603) is fixedly connected between the two sliders (602). A slide cylinder (609) is movably connected to the outer wall of the side groove rod (603). A double-sided arc blade (610) is movably installed below the slide cylinder (609). An arc plate (605) is fixedly connected to one end of the slider (602) away from the side groove rod (603). An arc tooth plate (606) is fixedly connected to the side of the arc plate (605) away from the side groove rod (603). Four fixed frames (10) are fixedly connected in a straight line evenly distributed on both sides of the upper surface of the base frame (1). An auxiliary plate (11) is fixedly connected above two adjacent fixed frames (10). An inclined pressure component (7) is provided above one set of auxiliary plates (11), and an auxiliary component (8) is provided on one side of the upper surface of the other set of auxiliary plates (11). Two auxiliary springs (604) are sleeved on both sides of the outer wall of the side groove rod (603). The other end of the auxiliary spring (604) is fixedly installed on the side of the slider (602). A side window (607) is opened in the middle of the side of one of the semi-arc groove plates (601). A bidirectional motor (611) is fixedly connected to the side of the support frame (15) away from the side groove rod (603). An auxiliary gear (608) is fixedly connected to the output shaft end of the bidirectional motor (611). One side of the auxiliary gear (608) passes through the side window (607) and meshes with the arc tooth plate (606). During the lamination process, the first silicon wafer passes through two support frames (15), and the second silicon wafer follows. At this time, there is a certain space between the first and second silicon wafers. The auxiliary spring (604) pushes the slide cylinder (609) into the space, which contacts the front edge of a silicon wafer. The blade of the double-sided arc blade (610) then fits against the edge of the silicon wafer. As the silicon wafer continues to move, it also pushes the double-sided arc blade (610) to slide on the outer wall of the inclined side groove rod (603), cutting the film pressed onto the surface of the silicon wafer. As it continues to move, the double-sided arc blade (610) is pushed out of the gap between adjacent silicon wafers and enters the side of the silicon wafer, pressing the auxiliary spring at one end of the side groove rod (603). After the spring (604) is compressed, the bidirectional motor (611) is started to drive the auxiliary gear (608) to rotate, which in turn drives the meshing arc tooth plate (606) to move around the center of the side groove rod (603) and rotates it. This causes the slider (602) in the arc plate (605) to slide in the semi-arc groove plate (601), thereby changing the tilt direction of the side groove rod (603). This causes the double-sided arc blade (610) to continue to contact the edge of the crystalline silicon substrate that has not passed through the support frame (15), so that the movement of the crystalline silicon substrate can push the slide cylinder (609) connected to the double-sided arc blade (610) from one end of the side groove rod (603) to the other end for recutting.

2. The silicon substrate coating machine according to claim 1, characterized in that, The inclined pressure assembly (7) includes a limiting frame plate (701) fixedly installed on the upper surface of two auxiliary plates (11) on one side. The inner wall of the limiting frame plate (701) is symmetrically and evenly connected to two semi-circular rods (703), and the two semi-circular rods (703) are symmetrically distributed. One of the semi-circular rods (703) is fixedly connected to an extension bolt (704) at the end away from the limiting frame plate (701), and the other semi-circular rod (703) is fixedly connected to a bushing rod (708) at the end away from the limiting frame plate (701). The extension bolt (704) and the bushing rod (708) are movably connected.

3. The crystalline silicon substrate coating machine according to claim 2, characterized in that, The auxiliary plate (11) has grooves (705) evenly distributed in a straight line on its surface. A slide rod (706) is movably connected to the inner wall of the groove (705). A positioning wheel (707) is movably installed below the slide rod (706). A spring telescopic rod (709) is fixedly connected to the other end of the slide rod (706).

4. A crystalline silicon substrate coating machine according to claim 2, characterized in that, The other end of the semi-circular rod (703) is movably connected to a positioning shaft disk (702), and the positioning shaft disk (702) is movably installed on the upper surface of the auxiliary plate (11). A rolling assembly (9) is provided on one side of the upper surface of the auxiliary plate (11).

5. A crystalline silicon substrate coating machine according to claim 2, characterized in that, The auxiliary component (8) includes a slanted frame plate (801) fixedly installed above the auxiliary plate (11). Each of the two slanted frame plates (801) has a limiting slide window (805) on its opposite side. A limiting shaft (806) is movably connected between the two limiting slide windows (805). A pressing roller (802) is fixedly connected to the outer wall of the limiting shaft (806). Arc sleeves (807) are movably connected symmetrically and evenly distributed above the limiting shaft (806). The outer wall of the arc sleeves (807) is movably installed on the inner wall of the limiting slide window (805). An elastic telescopic rod (804) is fixedly connected above the arc sleeves (807).

6. A crystalline silicon substrate coating machine according to claim 4, characterized in that, The rolling assembly (9) includes a straight groove (906) formed on the plane of the semi-circular rod (703). The inner wall of the straight groove (906) is movably connected to the outer wall of the extension pin shaft (704). Two adjacent semi-circular rods (703) can be spliced ​​together to form a round rod. An adjusting gear (901) is fixedly connected to the outer wall of one of the positioning shaft discs (702). A straight toothed plate (902) is meshed with the outer wall of the adjusting gear (901).

7. A crystalline silicon substrate coating machine according to claim 6, characterized in that, A push plate (903) is fixedly connected to the side of the straight tooth plate (902) away from the adjusting gear (901). An electric telescopic rod (905) is fixedly connected to one side of the push plate (903). A positioning plate (904) is fixedly connected to the other end of the electric telescopic rod (905). The positioning plate (904) is fixedly installed on the surface of the auxiliary plate (11).

8. A crystalline silicon substrate coating machine according to claim 7, characterized in that, A support plate (21) is fixedly connected between the two auxiliary plates (11) on the same side, and ribs (22) are fixedly connected to the upper surface of the support plate (21) in a symmetrical and uniform manner.

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