Etching machine temperature control method, device, equipment, storage medium and system

Abstract

The invention relates to the field of semiconductor etching, in particular to an etching machine temperature control method, device and equipment, a storage medium and a system. According to the target temperature and the machine monitoring temperature, a heating work instruction and a refrigerating work instruction are determined; and the heating work instruction is sent to a heating assembly to adjust the power of the heating assembly, and the refrigeration work instruction is sent to a refrigeration assembly to adjust the flow speed of cooling liquid of the refrigeration assembly until the machine monitoring temperature is consistent with the target temperature. The corresponding working instructions are sent to the heating assembly and the refrigerating assembly respectively, meanwhile, the heating and refrigerating capacity of the etching machine table is regulated and controlled, compared with the prior art that only the power of the heating assembly is adjusted, the temperature changing rate of the etching machine table is greatly increased, and meanwhile the temperature changing efficiency of the etching machine table is greatly improved. The refrigerating capacity is regulated and controlled by changing the flow speed of the cooling liquid of the refrigerating assembly, the change of the refrigerating capacity can be quantified more accurately, and the high accuracy of temperature control of the etching machine table is guaranteed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor etching, and in particular to a method, apparatus, equipment, storage medium, and system for temperature control of etching equipment. Background Technology

[0002] With the advancement of technology, semiconductor devices are increasingly being used in various fields of society. In the semiconductor manufacturing process, etching is an essential process, and for semiconductor etching, controlling the working temperature during the etching process is of paramount importance to ensure the etching effect.

[0003] In the semiconductor etching process, the temperature control requirements for the wafer surface are extremely stringent (that is, the operating temperature requirements for the etching equipment are strict). Different processes require different temperatures, and it usually takes a long time to reach the required etching temperature, which greatly affects the semiconductor production efficiency.

[0004] Therefore, how to improve the temperature change rate of etching equipment and ensure the accuracy of temperature control of etching equipment, so as to improve the production efficiency of semiconductor devices without reducing the etching quality, is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a method, apparatus, equipment, storage medium, and system for temperature control of etching equipment, in order to solve the problem that the temperature change rate of etching equipment in the prior art is too slow, which cannot improve the production efficiency of semiconductor devices without reducing the etching quality.

[0006] To solve the above technical problems, the present invention provides a temperature control method for an etching machine, comprising:

[0007] Receive target temperature;

[0008] Based on the target temperature and the machine's monitored temperature, determine the heating and cooling operation commands;

[0009] The heating operation command is sent to the heating component to adjust the power of the heating component, and the cooling operation command is sent to the cooling component to adjust the coolant flow rate of the cooling component, until the machine's monitored temperature matches the target temperature.

[0010] Optionally, in the etching machine temperature control method, determining the heating and cooling commands based on the temperature adjustment command and the machine's monitored temperature includes:

[0011] The temperature difference to be adjusted is determined based on the target temperature and the machine monitoring temperature.

[0012] Based on the temperature difference to be adjusted and the preset speed adjustment threshold temperature difference, the heating operation command and the cooling operation command are determined.

[0013] Optionally, in the etching machine temperature control method, determining the heating and cooling commands based on the temperature difference to be adjusted and the preset speed adjustment threshold temperature difference includes:

[0014] Determine whether the absolute value of the temperature difference to be adjusted exceeds the rapid adjustment threshold temperature difference;

[0015] When the absolute value of the temperature difference to be adjusted does not exceed the speed adjustment threshold temperature difference, a heating operation command and a cooling operation command are determined; wherein, the adjustment value of the power percentage of the heating component by the heating operation command is the same as the adjustment value of the power percentage of the cooling component by the cooling operation command.

[0016] Optionally, in the etching machine temperature control method, determining the heating and cooling commands based on the temperature difference to be adjusted and the preset speed adjustment threshold temperature difference includes:

[0017] Determine whether the absolute value of the temperature difference to be adjusted exceeds the rapid adjustment threshold temperature difference;

[0018] When the temperature difference to be adjusted is positive and the absolute value of the temperature difference to be adjusted exceeds the speed adjustment threshold temperature difference, a heating operation command and a cooling component pause command are determined.

[0019] Accordingly, sending the cooling operation command to the cooling component to adjust the coolant flow rate of the cooling component includes:

[0020] The refrigeration component is paused and the coolant flow rate is adjusted to be lower than the effective refrigeration threshold.

[0021] When the temperature difference to be adjusted is negative and the absolute value of the temperature difference to be adjusted exceeds the speed adjustment threshold temperature difference, a heating pause command and a cooling operation command are determined.

[0022] Accordingly, sending the heating operation command to the heating component to adjust the power of the heating component includes:

[0023] The heating pause command is sent to the heating component to adjust the power of the heating component below the effective heating threshold.

[0024] Optionally, in the etching machine temperature control method, the receiving target temperature includes:

[0025] Receive temperature adjustment command;

[0026] The target temperature is determined based on the temperature adjustment command and the machine's monitored temperature.

[0027] A temperature control device for an etching machine includes:

[0028] The receiving module is used to receive the target temperature;

[0029] The working instruction module is used to determine the heating working instruction and the cooling working instruction based on the target temperature and the machine monitoring temperature;

[0030] The sending module is used to send the heating operation command to the heating component to adjust the power of the heating component, and to send the cooling operation command to the cooling component to adjust the coolant flow rate of the cooling component, until the machine monitoring temperature is consistent with the target temperature.

[0031] Optionally, in the etching machine temperature control device, the working instruction module includes:

[0032] The temperature difference to be adjusted unit is used to determine the temperature difference to be adjusted based on the target temperature and the machine monitoring temperature.

[0033] The judgment execution unit is used to determine the heating operation command and the cooling operation command based on the temperature difference to be adjusted and the preset speed adjustment threshold temperature difference.

[0034] A temperature control device for an etching machine, comprising:

[0035] Memory, used to store computer programs;

[0036] A processor for executing the computer program to implement the steps of the etching machine temperature control method as described above.

[0037] A computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the etching machine temperature control method described above.

[0038] A temperature control system for an etching machine includes a control panel, a temperature control processor, a temperature monitoring sensor, a heating component, and a cooling component.

[0039] The temperature monitoring sensor is installed inside the controlled etching machine and is used to obtain the operating temperature of the controlled etching machine as the machine monitoring temperature.

[0040] The temperature control processor is used to receive the target temperature from the control panel, receive the machine monitoring temperature from the temperature monitoring sensor, and determine the heating operation command and the cooling operation command based on the target temperature and the machine monitoring temperature; then, it sends the heating operation command to the heating component and the cooling operation command to the cooling component.

[0041] The heating component is used to heat the controlled etching machine and can adjust its power according to the heating operation command.

[0042] The cooling component is used to cool and reduce the temperature of the controlled etching machine, and can adjust the flow rate of the coolant in the cooling component according to the cooling operation command.

[0043] The etching machine temperature control method provided by the present invention receives a target temperature; determines a heating operation command and a cooling operation command based on the target temperature and the machine monitoring temperature; sends the heating operation command to the heating component to adjust the power of the heating component, and sends the cooling operation command to the cooling component to adjust the coolant flow rate of the cooling component, until the machine monitoring temperature is consistent with the target temperature.

[0044] This invention sends corresponding operating commands to the heating and cooling components respectively, simultaneously regulating the heating and cooling capabilities of the etching machine. Compared to related technologies that only adjust the power of the heating component, this significantly improves the temperature change rate of the etching machine. Furthermore, by controlling the cooling capacity by changing the coolant flow rate of the cooling component, the change in cooling capacity can be quantified more accurately, thus ensuring high precision in temperature control of the etching machine and guaranteeing excellent etching results. This invention also provides an etching machine temperature control device, equipment, storage medium, and system with the aforementioned beneficial effects. Attached Figure Description

[0045] To more clearly illustrate the technical solutions of the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 A flowchart illustrating a specific embodiment of the etching machine temperature control method provided by the present invention;

[0047] Figure 2 A flowchart illustrating another specific embodiment of the etching machine temperature control method provided by the present invention;

[0048] Figure 3 A schematic diagram of a specific embodiment of the etching machine temperature control device provided by the present invention;

[0049] Figure 4 This is a schematic diagram of a specific embodiment of the etching machine temperature control system provided by the present invention.

[0050] The diagram includes 10-control panel, 20-temperature control processor, 30-temperature monitoring sensor, 40-heating component, 50-cooling component, and 01-controlled etching machine. Detailed Implementation

[0051] To enable those skilled in the art to better understand the present invention, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0052] The core of this invention is to provide a temperature control method for an etching machine, and a flowchart of one specific embodiment is shown below. Figure 1 As shown, this is referred to as Specific Implementation Method One, which includes:

[0053] S101: Receive target temperature.

[0054] The target temperature refers to the final temperature that the etching machine needs to reach during operation, i.e., the target temperature for temperature control.

[0055] In one specific implementation, the received target temperature includes:

[0056] A1: Receive temperature adjustment command.

[0057] A2: Determine the target temperature based on the temperature adjustment command and the machine's monitored temperature.

[0058] The temperature adjustment command refers to a command like "temperature rise / fall XX degrees", which directly issues a command indicating the magnitude of the temperature change. However, during system execution, the final target temperature is still needed as the basis for determining whether the temperature adjustment endpoint has been reached. This specific embodiment broadens the types of commands issued when controlling the etching machine, thereby improving the versatility of the present invention.

[0059] S102: Determine the heating operation command and the cooling operation command based on the target temperature and the machine monitoring temperature.

[0060] Furthermore, the step of determining the heating and cooling operation commands based on the temperature adjustment command and the machine's monitored temperature includes:

[0061] B1: Determine the temperature difference to be adjusted based on the target temperature and the machine monitoring temperature.

[0062] The temperature difference to be adjusted has positive and negative values, which represent different directions of temperature adjustment.

[0063] B2: Determine the heating and cooling commands based on the temperature difference to be adjusted and the preset speed adjustment threshold temperature difference.

[0064] The machine monitoring temperature is the real-time temperature of the etching machine's working environment transmitted back by a temperature monitoring sensor installed in the etching machine. Using the target temperature and the machine monitoring temperature, the specific temperature difference that needs to be reduced / increased (i.e., the temperature difference to be adjusted) can be determined. Depending on the magnitude of the specific temperature difference, or whether it exceeds the speed adjustment threshold temperature difference, different heating and cooling commands can be set.

[0065] Furthermore, determining the heating and cooling commands based on the temperature difference to be adjusted and the preset speed adjustment threshold temperature difference includes:

[0066] C1: Determine whether the absolute value of the temperature difference to be adjusted exceeds the speed adjustment threshold temperature difference.

[0067] The speed adjustment threshold temperature difference reflects the difference between the target temperature and the machine monitoring temperature, therefore the speed adjustment threshold temperature difference is a positive value.

[0068] C2: When the absolute value of the temperature difference to be adjusted does not exceed the speed adjustment threshold temperature difference, a heating operation command and a cooling operation command are determined; wherein, the adjustment value of the power percentage of the heating component by the heating operation command is the same as the adjustment value of the power percentage of the cooling component by the cooling operation command.

[0069] The power percentage refers to the percentage of the corresponding component's power relative to the component's maximum power. To illustrate this step, if heating is required in this step, the power percentage of the heating component is increased by 6%, while the power percentage of the cooling component is decreased by 6%.

[0070] In this preferred embodiment, it is further disclosed that when the absolute value of the temperature difference to be adjusted does not exceed the speed adjustment threshold temperature difference, it indicates that the difference between the target temperature and the machine monitoring temperature is not large at this time. The temperature can be adjusted by proportionally adjusting the power of the heating component and the power of the cooling component. During the temperature change process, the high temperature uniformity in the working chamber of the etching machine is always maintained, ensuring a good etching effect.

[0071] S103: Send the heating operation command to the heating component to adjust the power of the heating component, and send the cooling operation command to the cooling component to adjust the coolant flow rate of the cooling component until the machine monitoring temperature is consistent with the target temperature.

[0072] As can be seen from this step, the heating and cooling commands in step S102 are actually adjustments to the heating and cooling efficiency of the etching machine. Therefore, setting different heating and cooling commands in step S102 based on different temperature differences can be as follows: When the target temperature is greater than the machine's monitored temperature, the greater the temperature difference between the target temperature and the machine's monitored temperature, the greater the power increase of the heating component by the heating command, and the greater the reduction in the coolant flow rate of the cooling component by the cooling command. Conversely, when the target temperature is less than the machine's monitored temperature, the greater the temperature difference between the target temperature and the machine's monitored temperature, the greater the increase in the coolant flow rate of the cooling component by the cooling command, and the greater the power reduction of the heating component by the heating command.

[0073] Specifically, the temperature monitored by the machine can be a temperature acquired in one go. In the process of adjusting the temperature of the etching machine to reach the target temperature in a single operation, only one heating operation command and one cooling operation command will be generated. The heating component and the cooling component will work according to the single generated heating operation command and cooling operation command until the target temperature is reached. Then, the heating component and the cooling component will be rebalanced to achieve constant temperature. This implementation method requires less computing power, has a simpler process, lower hardware requirements, and lower cost.

[0074] Of course, the machine monitoring temperature can be acquired continuously multiple times and updated at regular intervals. After each acquisition of a new machine monitoring temperature, new heating and cooling commands will be determined based on the target temperature and the new machine monitoring temperature. In other words, the heating and cooling efficiency of the etching machine is constantly adjusted during the process of reaching the target temperature. This makes the overall temperature adjustment process smoother, more stable, and the etching effect better.

[0075] The etching machine temperature control method provided by this invention receives a target temperature; determines heating and cooling commands based on the target temperature and the machine's monitored temperature; sends the heating command to the heating component to adjust its power, and sends the cooling command to the cooling component to adjust its coolant flow rate, until the machine's monitored temperature matches the target temperature. This invention, by sending corresponding commands to both the heating and cooling components and simultaneously regulating the heating and cooling capabilities of the etching machine, significantly improves the temperature change rate compared to related technologies that only adjust the heating component's power. Furthermore, by controlling the cooling capacity by changing the coolant flow rate of the cooling component, the change in cooling capacity can be more accurately quantified, thereby ensuring high precision in temperature control of the etching machine and guaranteeing excellent etching results.

[0076] Based on Specific Implementation Method 1, the method for determining the heating and cooling operation commands is further defined, resulting in Specific Implementation Method 2, the corresponding flowchart of which is shown below. Figure 2 As shown, it includes:

[0077] S201: Receive target temperature.

[0078] S202: Determine the temperature difference to be adjusted based on the target temperature and the machine monitoring temperature.

[0079] S203: Determine whether the absolute value of the temperature difference to be adjusted exceeds the speed adjustment threshold temperature difference.

[0080] S204: When the temperature difference to be adjusted is positive and the absolute value of the temperature difference to be adjusted exceeds the speed adjustment threshold temperature difference, determine the heating operation command and the cooling component pause command.

[0081] If the temperature difference to be adjusted is positive, it indicates that the etching equipment needs to be heated. If the absolute value of the temperature difference to be adjusted exceeds the speed adjustment threshold temperature difference, it indicates that the etching equipment needs to be heated significantly.

[0082] S205: Send the heating operation command to the heating component to adjust the power of the heating component, and send the cooling component pause command to the cooling component to adjust the coolant flow rate of the cooling component to be lower than the effective cooling threshold.

[0083] The cooling component pause command is an instruction to stop the cooling component from operating, meaning that cooling is not required at this time. The effective cooling threshold is a flow rate threshold that affects the monitored temperature of the machine, which can be determined through experience or calculation. It is readily apparent that upon receiving the cooling pause command, the coolant flow rate becomes zero or close to zero.

[0084] S206: When the temperature difference to be adjusted is negative and the absolute value of the temperature difference to be adjusted exceeds the speed adjustment threshold temperature difference, a heating pause command and a cooling operation command are determined.

[0085] If the temperature difference to be adjusted is negative, it indicates that the etching machine needs to be cooled down. If the absolute value of the temperature difference to be adjusted exceeds the speed adjustment threshold temperature difference, it indicates that the etching machine needs to be cooled down significantly.

[0086] S207: Send the heating pause command to the heating component to adjust the power of the heating component to be lower than the effective heating threshold, and send the cooling operation command to the cooling component to adjust the coolant flow rate of the cooling component.

[0087] Referring to the preceding text, the heating pause command is an instruction to stop the operation of the heating element, meaning that the heating component is not needed to heat up at this time. The effective heating threshold is a power threshold that can affect the machine's monitored temperature, which can be determined through experience or calculation. It is easy to see that after receiving the heating pause command, the power of the heating component becomes zero or close to zero.

[0088] There is no strict sequential relationship between the process consisting of steps S204 and S205 and the steps consisting of steps S206 and S207. The above two steps represent two different cases of the temperature difference to be adjusted.

[0089] This specific embodiment, based on the previous specific embodiment, further discusses the situation where the temperature difference to be adjusted is too large, and the corresponding value exceeds the rapid adjustment threshold temperature difference, and provides a corresponding processing method. The remaining steps are the same as those in the above specific embodiment, and will not be repeated here.

[0090] It should be noted that in both cases of this specific embodiment, the corresponding component pause command is used instead of the working command in the above specific embodiment. It can be considered that the heating working command and the cooling working command are commands that guide the working status of the corresponding heating component and cooling component, while the heating pause command and the cooling pause command in this specific embodiment are one type of working status, which is a special case of the corresponding working command.

[0091] In this specific embodiment, when it is determined that the value of the temperature difference to be adjusted is greater than the rapid adjustment threshold temperature difference, it indicates that the temperature rise / fall is very large. In order to ensure a fast temperature adjustment speed, the functional components of the etching machine that are opposite to the temperature adjustment direction are directly turned off during temperature adjustment. If rapid temperature rise is required, the operation of the cooling component is directly stopped. If rapid temperature fall is required, the operation of the heating component is directly stopped. This achieves rapid change of the working temperature of the etching machine.

[0092] However, as a preferred implementation, when the absolute value of the temperature difference to be adjusted does not exceed the rapid adjustment threshold temperature difference, both the heating component and the cooling component are put into operation again, that is, the heating operation command and the cooling operation command are generated simultaneously, so that the machine monitoring temperature at this time gradually approaches the target temperature stably, thereby shortening the temperature adjustment time and ensuring high etching quality.

[0093] Of course, you can also keep the working components that are opposite to the temperature adjustment direction suspended throughout the entire temperature change process, and adjust accordingly based on the actual situation.

[0094] The etching machine temperature control device provided in the embodiments of the present invention will be described below. The etching machine temperature control device described below can be referred to in correspondence with the etching machine temperature control method described above.

[0095] Figure 3 This is a structural block diagram of the etching machine temperature control device provided in an embodiment of the present invention, with reference to... Figure 3 The temperature control device for the etching machine may include:

[0096] Receiver module 100 is used to receive the target temperature;

[0097] The work instruction module 200 is used to determine the heating work instruction and the cooling work instruction based on the target temperature and the machine monitoring temperature;

[0098] The sending module 300 is used to send the heating operation command to the heating component to adjust the power of the heating component, and to send the cooling operation command to the cooling component to adjust the coolant flow rate of the cooling component, until the machine monitoring temperature is consistent with the target temperature.

[0099] In a preferred embodiment, the working instruction module 200 includes:

[0100] The temperature difference to be adjusted unit is used to determine the temperature difference to be adjusted based on the target temperature and the machine monitoring temperature.

[0101] The judgment execution unit is used to determine the heating operation command and the cooling operation command based on the temperature difference to be adjusted and the preset speed adjustment threshold temperature difference.

[0102] In a preferred embodiment, the working instruction module 200 includes:

[0103] The first speed adjustment judgment unit is used to determine whether the absolute value of the temperature difference to be adjusted exceeds the speed adjustment threshold temperature difference;

[0104] The year-on-year increase / decrease unit is used to determine the heating operation command and the cooling operation command when the absolute value of the temperature difference to be adjusted does not exceed the speed adjustment threshold temperature difference; wherein, the adjustment value of the power percentage of the heating component by the heating operation command is the same as the adjustment value of the power percentage of the cooling component by the cooling operation command.

[0105] In a preferred embodiment, the working instruction module 200 includes:

[0106] The second speed adjustment judgment unit is used to determine whether the absolute value of the temperature difference to be adjusted exceeds the speed adjustment threshold temperature difference.

[0107] A unidirectional heating unit is used to determine a heating operation command and a cooling component pause command when the temperature difference to be adjusted is positive and the absolute value of the temperature difference to be adjusted exceeds the speed adjustment threshold temperature difference.

[0108] A unidirectional cooling unit is used to determine a heating pause command and a cooling operation command when the temperature difference to be adjusted is negative and the absolute value of the temperature difference to be adjusted exceeds the speed adjustment threshold temperature difference.

[0109] In a preferred embodiment, the receiving module 100 includes:

[0110] Temperature control receiving unit, used to receive temperature control commands;

[0111] The target determination unit is used to determine the target temperature based on the temperature adjustment command and the machine monitoring temperature.

[0112] The etching machine temperature control device provided by this invention includes a receiving module 100 for receiving the target temperature; a working instruction module 200 for determining heating and cooling working instructions based on the target temperature and the machine's monitored temperature; and a sending module 300 for sending the heating working instruction to the heating component to adjust its power, and sending the cooling working instruction to the cooling component to adjust its coolant flow rate, until the machine's monitored temperature matches the target temperature. This invention, by sending corresponding working instructions to both the heating and cooling components and simultaneously regulating the heating and cooling capabilities of the etching machine, significantly improves the temperature change rate of the etching machine compared to related technologies that only adjust the power of the heating component. Furthermore, by regulating the cooling capacity by changing the coolant flow rate of the cooling component, the change in cooling capacity can be more accurately quantified, thereby ensuring high precision in temperature control of the etching machine and guaranteeing excellent etching results.

[0113] The etching machine temperature control device in this embodiment is used to implement the aforementioned etching machine temperature control method. Therefore, the specific implementation of the etching machine temperature control device can be found in the embodiment section of the etching machine temperature control method above. For example, the receiving module 100, the working instruction module 200, and the sending working module 300 are respectively used to implement steps S101, S102, and S103 in the above-mentioned etching machine temperature control method. Therefore, the specific implementation can be referred to the description of the corresponding embodiments, which will not be repeated here.

[0114] The present invention also provides a data access device, comprising:

[0115] Memory, used to store computer programs;

[0116] A processor is configured to implement the steps of the data access method described above when executing the computer program. The etching machine temperature control method provided by this invention receives a target temperature; determines heating and cooling operation commands based on the target temperature and the machine's monitored temperature; sends the heating operation command to the heating component to adjust its power; and sends the cooling operation command to the cooling component to adjust its coolant flow rate until the machine's monitored temperature matches the target temperature. This invention, by sending corresponding operation commands to the heating and cooling components respectively, simultaneously regulates the heating and cooling capabilities of the etching machine. Compared to related technologies that only adjust the power of the heating component, this significantly improves the temperature change rate of the etching machine. Furthermore, by regulating the cooling capacity by changing the coolant flow rate of the cooling component, the change in cooling capacity can be more accurately quantified, thereby ensuring high precision in temperature control of the etching machine and guaranteeing good etching results.

[0117] This invention also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps of any of the data access methods described above. The etching machine temperature control method provided by this invention receives a target temperature; determines heating and cooling operation commands based on the target temperature and the machine's monitored temperature; sends the heating operation command to the heating component to adjust its power; and sends the cooling operation command to the cooling component to adjust its coolant flow rate until the machine's monitored temperature matches the target temperature. This invention, by sending corresponding operation commands to the heating and cooling components respectively, simultaneously regulates the heating and cooling capabilities of the etching machine. Compared to related technologies that only adjust the power of the heating component, this significantly improves the temperature change rate of the etching machine. Furthermore, by regulating the cooling capacity by changing the coolant flow rate of the cooling component, the change in cooling capacity can be more accurately quantified, thereby ensuring high precision in temperature control of the etching machine and guaranteeing good etching results.

[0118] The present invention also provides a temperature control system for an etching machine, the structural schematic diagram of one specific embodiment of which is shown below. Figure 4 As shown, it is referred to as Specific Implementation 4, including a control panel 20, a temperature control processor 10, a temperature monitoring sensor 30, a heating component 40 and a cooling component 50;

[0119] The temperature monitoring sensor 30 is installed inside the controlled etching machine 01 to obtain the operating temperature of the controlled etching machine 01 as the machine monitoring temperature.

[0120] The temperature control processor 10 is used to receive the target temperature from the control panel 20, receive the machine monitoring temperature from the temperature monitoring sensor 30, and determine the heating operation command and the cooling operation command based on the target temperature and the machine monitoring temperature; then, it sends the heating operation command to the heating component 40 and the cooling operation command to the cooling component 50.

[0121] The heating component 40 is used to heat the controlled etching machine 01 and can adjust its power according to the heating operation command.

[0122] The cooling component 50 is used to cool and reduce the temperature of the controlled etching machine 01, and can adjust the flow rate of the coolant in the cooling component 50 according to the cooling operation command.

[0123] The etching machine temperature control system provided by this invention is in contrast to the etching machine temperature control method described above. Therefore, various technical details can be referred to in the previous text, and will not be elaborated here.

[0124] The control panel 20 is used by the operator to input commands to the temperature control processor 10, and can also be used to display the parameter information of the controlled etching machine 01.

[0125] The heating component 40 may be an electric heating component 40, and the cooling component 50 may be a liquid cooling component that removes heat through a coolant.

[0126] The etching machine temperature control system provided by this invention includes a control panel 20, a temperature control processor 10, a temperature monitoring sensor 30, a heating component 40, and a cooling component 50. The temperature monitoring sensor 30 is installed inside the controlled etching machine 01 and is used to acquire the operating temperature of the controlled etching machine 01 as the machine monitoring temperature. The temperature control processor 10 is used to receive a target temperature from the control panel 20 and the machine monitoring temperature from the temperature monitoring sensor 30, and determine heating and cooling operation commands based on the target temperature and the machine monitoring temperature. The heating operation command is then sent to the heating component 40, and the cooling operation command is sent to the cooling component 50. The heating component 40 is used to heat the controlled etching machine 01 and can adjust its power according to the heating operation command. The cooling component 50 is used to cool the controlled etching machine 01 and can adjust the coolant flow rate of the cooling component 50 according to the cooling operation command. This invention sends corresponding operating commands to the heating component 40 and the cooling component 50 respectively, and simultaneously regulates the heating and cooling capabilities of the etching machine. Compared with related technologies that only adjust the power of the heating component 40, this invention greatly improves the temperature change rate of the etching machine. At the same time, by changing the flow rate of the coolant in the cooling component 50, the cooling capacity can be quantified more accurately, thereby ensuring high precision in temperature control of the etching machine and guaranteeing good etching results.

[0127] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to in the method section.

[0128] It should be noted that, in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0129] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0130] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein can be implemented directly by hardware, a software module executed by a processor, or a combination of both. The software module can be located in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art.

[0131] The etching machine temperature control method, apparatus, equipment, storage medium, and system provided by this invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this invention. It should be noted that those skilled in the art can make various improvements and modifications to this invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this invention.

Claims

1. A method for temperature control of an etching machine, characterized in that, include: Receive target temperature; Based on the target temperature and the machine's monitored temperature, determine the heating and cooling operation commands; The heating operation command is sent to the heating component to adjust the power of the heating component, and the cooling operation command is sent to the cooling component to adjust the coolant flow rate of the cooling component, until the machine's monitored temperature matches the target temperature.

2. The etching machine temperature control method as described in claim 1, characterized in that, The process of determining the heating and cooling commands based on the temperature control command and the machine's monitored temperature includes: The temperature difference to be adjusted is determined based on the target temperature and the machine monitoring temperature. Based on the temperature difference to be adjusted and the preset speed adjustment threshold temperature difference, the heating operation command and the cooling operation command are determined.

3. The etching machine temperature control method as described in claim 2, characterized in that, The step of determining the heating and cooling commands based on the temperature difference to be adjusted and the preset speed adjustment threshold temperature difference includes: Determine whether the absolute value of the temperature difference to be adjusted exceeds the rapid adjustment threshold temperature difference; When the absolute value of the temperature difference to be adjusted does not exceed the speed adjustment threshold temperature difference, a heating operation command and a cooling operation command are determined; wherein, the adjustment value of the power percentage of the heating component by the heating operation command is the same as the adjustment value of the power percentage of the cooling component by the cooling operation command.

4. The etching machine temperature control method as described in claim 2, characterized in that, The step of determining the heating and cooling commands based on the temperature difference to be adjusted and the preset speed adjustment threshold temperature difference includes: Determine whether the absolute value of the temperature difference to be adjusted exceeds the rapid adjustment threshold temperature difference; When the temperature difference to be adjusted is positive and the absolute value of the temperature difference to be adjusted exceeds the speed adjustment threshold temperature difference, a heating operation command and a cooling component pause command are determined. Accordingly, sending the cooling operation command to the cooling component to adjust the coolant flow rate of the cooling component includes: The refrigeration component is paused and the coolant flow rate is adjusted to be lower than the effective refrigeration threshold. When the temperature difference to be adjusted is negative and the absolute value of the temperature difference to be adjusted exceeds the speed adjustment threshold temperature difference, a heating pause command and a cooling operation command are determined. Accordingly, sending the heating operation command to the heating component to adjust the power of the heating component includes: The heating pause command is sent to the heating component to adjust the power of the heating component below the effective heating threshold.

5. The etching machine temperature control method as described in claim 1, characterized in that, The target temperature to be received includes: Receive temperature adjustment command; The target temperature is determined based on the temperature adjustment command and the machine's monitored temperature.

6. A temperature control device for an etching machine, characterized in that, include: The receiving module is used to receive the target temperature; The working instruction module is used to determine the heating working instruction and the cooling working instruction based on the target temperature and the machine monitoring temperature; The sending module is used to send the heating operation command to the heating component to adjust the power of the heating component, and to send the cooling operation command to the cooling component to adjust the coolant flow rate of the cooling component, until the machine monitoring temperature is consistent with the target temperature.

7. The etching machine temperature control device as described in claim 6, characterized in that, The working instruction module includes: The temperature difference to be adjusted unit is used to determine the temperature difference to be adjusted based on the target temperature and the machine monitoring temperature. The judgment execution unit is used to determine the heating operation command and the cooling operation command based on the temperature difference to be adjusted and the preset speed adjustment threshold temperature difference.

8. A temperature control device for an etching machine, characterized in that, include: Memory, used to store computer programs; A processor, configured to execute the computer program to implement the steps of the etching machine temperature control method as described in any one of claims 1 to 5.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the steps of the etching machine temperature control method as described in any one of claims 1 to 5.

10. A temperature control system for an etching machine, characterized in that, Includes control panel, temperature controller, temperature monitoring sensor, heating element and cooling element; The temperature monitoring sensor is installed inside the controlled etching machine and is used to obtain the operating temperature of the controlled etching machine as the machine monitoring temperature. The temperature control processor is used to receive the target temperature from the control panel, receive the machine monitoring temperature from the temperature monitoring sensor, and determine the heating operation command and the cooling operation command based on the target temperature and the machine monitoring temperature; then, it sends the heating operation command to the heating component and the cooling operation command to the cooling component. The heating component is used to heat the controlled etching machine and can adjust its power according to the heating operation command. The cooling component is used to cool and reduce the temperature of the controlled etching machine, and can adjust the flow rate of the coolant in the cooling component according to the cooling operation command.

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