External temperature control structure and air cooling case using same

Abstract

The invention belongs to the technical field of equipment heat dissipation, and particularly relates to an external temperature control structure and an air cooling case using the same, the external temperature control structure comprises a temperature control structure shell used for being connected with heating equipment in a heat conduction mode, and a metal block I, piezoelectric ceramics I or a pressure sensor I and a temperature control module are integrally arranged in the temperature control structure shell; the metal block I is in heat conduction connection with the inner wall of the temperature control structure shell and makes contact with the piezoelectric ceramic I or the pressure sensor I, the piezoelectric ceramic I or the pressure sensor I is electrically connected with the temperature control module, the temperature control module is used for being electrically connected with the fan, and the fan is used for dissipating heat of heating equipment. According to the case, an external temperature control structure is arranged on a case shell. The sensor does not depend on a traditional temperature sensor any more, the metal block or the piezoelectric ceramic or the pressure sensor is simple in structure, the installation and arrangement problems of the temperature sensor are solved, reliability can be improved, and miniaturization design is achieved.

Description

Technical Field

[0001] This invention belongs to the field of equipment heat dissipation technology, specifically relating to an external temperature control structure and an air-cooled chassis using the structure. Background Technology

[0002] like Figure 1 The diagram shows the structure of an air-cooled chassis. The main components include circuit boards (i.e., air-cooling modules, cold plate structure), a backplate assembly, a heatsink enclosure, cooling fans, and a fan shroud. The cooling fans are housed within the shroud, which is located at the bottom of the chassis and connects to the outside. Circuit boards are inserted into the chassis, and their outer walls have heat dissipation fins. Airflow is formed between the circuit boards and between the chassis and the circuit boards. An exhaust vent is located on the top panel of the chassis. The cooling fans draw in cool air from the outside and deliver it into the airflow structure, carrying away the heat generated by the circuit boards during operation and expelling it through the exhaust vent. With increasing integration, the heat dissipation of the circuit boards is increasing, requiring more cooling air to meet the cooling demands. This necessitates higher fan speeds, which present the following problems:

[0003] 1) In order to cope with the increasing heat dissipation of the circuit board, it is necessary to increase the air intake for cooling, which requires increasing the speed of the cooling fan. The higher the speed of the cooling fan, the lower the reliability of the cooling fan.

[0004] 2) The heat dissipation of the circuit board is getting higher and higher, and the temperature of the cooling fan's working area is getting higher and higher, which leads to a decrease in the thermal reliability of the device;

[0005] 3) The higher the speed of the cooling fan, the louder the noise, which affects the user experience.

[0006] In existing technologies, the cooling fan control of air-cooled chassis typically uses temperature sensors as temperature measuring devices. The fan speed is controlled based on the measured temperature. Temperature sensors are usually thermocouples, requiring two wires connected to different locations, making installation complex and space-consuming. As circuit boards become increasingly integrated, the space available for temperature sensors is limited, making installation and placement difficult. Furthermore, thermocouple-based temperature sensors are bulky and have poor reliability. Summary of the Invention

[0007] To solve the above-mentioned technical problems, the present invention provides an external temperature control structure and an air-cooled chassis using the structure, which can automatically adjust the speed of the cooling fan according to the device temperature, avoid the cooling fan from rotating at full speed all the time, and no longer rely on traditional temperature sensors, thus solving the difficulties of temperature sensor installation location and fixation, and realizing the integration and miniaturization of the equipment.

[0008] The objective of this invention is achieved through the following technical solution. An external temperature control structure according to this invention includes a temperature control structure housing for thermally connecting to a heating device. The temperature control structure housing integrates a metal block I, a piezoelectric ceramic I or a pressure sensor I, and a temperature control module. The metal block I is thermally connected to the inner wall of the temperature control structure housing. The metal block I is in contact with the piezoelectric ceramic I or the pressure sensor I. The piezoelectric ceramic I or the pressure sensor I is electrically connected to the temperature control module. The temperature control module is electrically connected to a fan, and the fan is used to dissipate heat from the heating device.

[0009] Compared with the prior art, the advantages of the present invention are:

[0010] This invention proposes an external temperature control structure. The heating device heats up, causing the metal block to deform, which in turn causes the piezoelectric ceramic or pressure sensor to generate an electrical signal. The electrical signal controls the fan speed through the temperature control module, enabling the system to automatically adjust the fan injection according to the temperature of the functional module. This eliminates the reliance on traditional temperature sensors. Furthermore, the structure of the metal block, piezoelectric ceramic, or pressure sensor is simple, solving the installation and placement problems of temperature sensors, improving reliability, and achieving miniaturization.

[0011] This integrated design makes it easy to install on heat-generating equipment.

[0012] Furthermore, the inner wall of the temperature control structure housing is also provided with a heat insulation block, which is thermally connected to the temperature control structure housing. A piezoelectric ceramic II or a pressure sensor II is provided inside the temperature control structure housing and is in contact with the heat insulation block. The piezoelectric ceramic II or the pressure sensor II is electrically connected to the temperature control module. The metal block I and the heat insulation block are arranged in a group. The distance between the metal block I and the heat insulation block in the same group is close to that of the metal block I, the heat insulation block and the corresponding piezoelectric ceramic or pressure sensor, so that the metal block I, the heat insulation block and the corresponding piezoelectric ceramic or pressure sensor will have equal or similar deformation under vibration conditions.

[0013] Compared with the prior art, the advantages of the present invention are:

[0014] When the structure operates under vibration conditions, the vibration will cause relative displacement between the metal block I and the piezoelectric ceramic I or the pressure sensor, thus affecting the contact pressure. This results in inaccurate electrical signals transmitted by the piezoelectric ceramic or pressure sensor corresponding to the metal block I. After setting up the insulation block, the insulation block will only deform due to vibration. After the electrical signal of the piezoelectric ceramic or pressure sensor corresponding to the insulation block is transmitted to the temperature control module, the temperature control module processes the electrical signals of the two piezoelectric ceramics or pressure sensors, calculates the electrical signal generated due to temperature deformation, cancels the electrical signal generated under vibration conditions, corrects the erroneous electrical signal generated under vibration conditions, and makes the temperature control more accurate.

[0015] Furthermore, the temperature control module includes a memory, a control logic circuit, an amplifier circuit for amplifying the input signal, and a power supply.

[0016] Furthermore, the structure has a dynamic compensation function. The initial contact deformation between the metal block I and the piezoelectric ceramic I or the pressure sensor I, and between the insulating block and the piezoelectric ceramic II or the pressure sensor II, under static and initial temperature conditions is set as Δx0. This deformation causes the corresponding piezoelectric ceramic or pressure sensor to generate a voltage V0. When the functional module heats up, the deformation of the metal block I is Δx1. The actual deformation of the metal block I due to temperature is Δx1-Δx0. When Δx1 is deformed, the voltage generated by the piezoelectric ceramic I or the pressure sensor I is V1. The temperature control module receives the voltage V0 and the voltage V1 and calculates and outputs the working current or voltage of the fan when it is stationary.

[0017] When the structure vibrates, the deformation of the piezoelectric ceramic or pressure sensor at the corresponding position of the metal block I and the insulation block due to vibration is set to Δx2. The total deformation of the metal block I and the corresponding piezoelectric ceramic I or pressure sensor I is Δx1±Δx2, and the voltage corresponding to piezoelectric ceramic I or pressure sensor I is V3. The total deformation of the insulation block and the corresponding piezoelectric ceramic II or pressure sensor II is Δx0±Δx2, and the voltage corresponding to piezoelectric ceramic II or pressure sensor II is V4. The difference between the deformation of the metal block I and the insulation block is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0. Correspondingly, the difference between voltage V3 and voltage V4 remains unchanged, so that the current or voltage output by the temperature control module remains unchanged to achieve dynamic compensation function.

[0018] Furthermore, the piezoelectric ceramic I or pressure sensor I, the piezoelectric ceramic II or pressure sensor II, and the temperature control module are integrated and mounted on the temperature control PCB board.

[0019] An air-cooled chassis includes a chassis shell, a backplate assembly with a functional module installed inside the chassis shell, a backplate connector on the backplate assembly, and a module connector on the functional module that mates with the backplate connector. An external temperature control structure is provided on the chassis shell, and the temperature control structure housing is thermally connected to the chassis shell. A functional chip is provided within the functional module, and the functional chip is thermally connected to the functional module housing, which in turn is thermally connected to the chassis shell. A fan for cooling the chassis is provided on the chassis, and the temperature control module is electrically connected to the fan.

[0020] Furthermore, the temperature control module is electrically connected to the backplate assembly, and the fan is electrically connected to the backplate assembly.

[0021] Furthermore, the fan is located on the outside of the chassis housing, which includes an inner housing and an outer housing. A heat sink is provided between the inner housing and the outer housing. The cavity between the inner housing and the outer housing is connected to the outside so that the fan can send cold air into the cavity and exhaust hot air. The inner side of the inner housing is sealed to the outside.

[0022] Compared with the prior art, the advantages of the present invention are:

[0023] Heat sinks can increase the heat dissipation area inside the cavity and accelerate heat dissipation.

[0024] Furthermore, the chassis shell is provided with an air inlet and an air outlet, and the functional modules inside the chassis shell and the functional modules and the chassis shell form an air duct connecting the air inlet and the air outlet, and a fan is provided at the air inlet or air outlet position.

[0025] Compared with the prior art, the advantages of the present invention are:

[0026] By directly venting cool air into the chassis, heat dissipation can be accelerated.

[0027] Furthermore, the functional module includes a functional module housing, a functional PCB board is disposed inside the functional module housing, a functional chip is disposed on the functional PCB board, a thermally conductive protrusion corresponding to the functional chip is disposed on the inner wall of the functional module housing, a thermally conductive pad is disposed on the thermally conductive protrusion, and the functional chip contacts the thermally conductive pad.

[0028] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and to make the purpose, features and advantages of the present invention more obvious and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of an air-cooled chassis in the prior art;

[0030] Figure 2 This is an exploded view of the functional modules in an embodiment of an air-cooled chassis according to the present invention;

[0031] Figure 3 This is a cross-sectional view of an embodiment of an air-cooled chassis according to the present invention;

[0032] Figure 4 for Figure 3 A three-dimensional sectional view of the temperature control structure;

[0033] Figure 5 for Figure 4 Side sectional view;

[0034] Figure 6 for Figure 4 A schematic diagram of the decomposition process;

[0035] Figure 7 for Figure 4 A 3D schematic diagram of a medium-temperature control PCB board;

[0036] Figure 8 for Figure 4 A three-dimensional schematic diagram of the upper shell of the medium temperature control structure;

[0037] Figure 9 This is a schematic diagram illustrating the principle of an embodiment of an external temperature control structure according to the present invention;

[0038] Figure 10 This is a topology diagram of the temperature control module in an embodiment of an external temperature control structure according to the present invention;

[0039] Figure 11 This is a cross-sectional schematic diagram of an embodiment of an external temperature control structure according to the present invention;

[0040] Figure 12 for Figure 11 A schematic diagram of the temperature control structure vibrating as shown.

[0041] Figure 13 This is a schematic diagram of an embodiment of an air-cooled chassis according to the present invention;

[0042] Figure 14 This is a schematic diagram of another embodiment of an air-cooled chassis according to the present invention.

[0043] Figure label:

[0044] 1-Inner shell, 2-Outer shell, 3-Heat sink, 4-Fan, 5-Temperature control structure, 6-Functional module, 61-Cold plate cover I, 62-Cold plate cover II, 63-Functional PCB board, 64-Thermal conductive boss, 65-Thermal conductive pad, 66-Handle, 67-Screw, 7-Backplate assembly, 8-Module connector, 9-Temperature control PCB board, 10-Temperature control structure shell, 11-Piezoelectric ceramic I, 12-Piezoelectric ceramic II, 13-Metal block I, 14-Metal block II, 15-Temperature control module. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] An embodiment of an air-cooled chassis according to the present invention, such as... Figures 2 to 13As shown, the front of the chassis has an opening for inserting the functional module 6, and the rear has a backplane assembly 7 with a backplane connector. The rear of the functional module 6 has a module connector 8; in this embodiment, the module connector 8 can be an LRM connector or a VPX connector. After the functional module 6 is inserted into the chassis, the module connector 8 engages with the backplane connector, enabling signal communication between the functional module 6 and the backplane 7, as well as between the functional modules 6 themselves.

[0047] The chassis includes a chassis shell, which is a double-layered shell on all four sides: an inner shell 1 and an outer shell 2. A heatsink 3 is installed between the inner shell 1 and the outer shell 2. The heatsink 3 is formed by reciprocating folds of a heat-conducting plate to increase the heat dissipation area. The heatsink 3 is in contact with both the inner shell 1 and the outer shell 2. A fan 4 is installed on the outer side of the chassis shell, located at the rear of the chassis shell. This chassis is a fully enclosed chassis. The functional module 6, module connector 8, and backplate assembly 7 are enclosed inside the inner shell 1. The cavity between the inner shell 1 and the outer shell 2 is open to the outside. The fan on the outside of the chassis can blow cool air into the cavity to remove the heat.

[0048] After functional module 6 is inserted into the chassis, it contacts the inner housing 1. When functional module 6 is running, its internal functional chip generates heat. The heat is first transferred to the housing of functional module 6, and then to the inner housing 1. The inner housing 1 then transfers the heat to the heatsink 3. Fan 4 runs, blowing cool air into the cavity where the heatsink 3 is located, carrying away the heat. The cooling speed can be controlled by adjusting the fan speed of 4; the fan speed is directly proportional to the cooling speed. Fan 4 is communicatively connected to the backplane assembly 7.

[0049] The housing of functional module 6 is formed by connecting cold plate cover I 61 and cold plate cover II 62 with screws 67. A functional PCB board 63 is housed in the cavity between cold plate cover I 61 and cold plate cover II 62. Functional chips are distributed on the functional PCB board 63. Thermally conductive protrusions 64 corresponding to the positions of the functional chips are distributed on the inner wall of cold plate cover I 61. Thermally conductive pads 64 are placed on the thermally conductive protrusions 64, ensuring full contact between the thermally conductive pads 64 and the functional chips. This allows heat generated during chip operation to be transferred through the thermally conductive pads 64 to the thermally conductive protrusions 64 and cold plate cover I 61, thereby transferring heat to the inner housing 1 and the heat sink 3. A handle 66 is provided at the front end of functional module 6 for easy insertion and removal.

[0050] A temperature control structure 5 is provided on the inner housing 1. The temperature control structure housing 10 is thermally connected to the inner housing 1, and the temperature control structure 5 is communicatively connected to the backplane assembly 7. In order to better measure the temperature, the temperature control structure 5 is located near the temperature-sensitive chip in the functional module 6, so as to ensure more accurate monitoring of the temperature of the temperature-sensitive chip, and control the operation of the fan 4 according to the monitored temperature to ensure that the temperature of the temperature-sensitive chip is within the normal range.

[0051] In this embodiment, the temperature control structure 5 is installed at the rear end of the inner casing 1 of the chassis, such as... Figure 3 As shown, a cavity is provided at the rear end of the chassis, exposing the rear end of the inner shell 1 within the cavity, which facilitates the installation of the temperature control structure 5 on the inner wall of the inner shell 1. In this embodiment, the temperature control structure 5 is located on the inner shell 1 at the top of the chassis.

[0052] The temperature control structure 5 is integrated and enclosed by the temperature control structure housing 10. In this embodiment, the top outer wall of the temperature control structure housing 10 contacts the inner housing 1. Metal blocks I13 and II14 are disposed on the inner wall of the temperature control structure housing 10. The distance between metal blocks I13 and II14 is small. Figure 4 As shown. A temperature control PCB board 9 is installed inside the temperature control structure housing 10. The temperature control PCB board 9 is installed in the inner cavity of the temperature control structure housing 10 via a bracket (not shown in the figure). The temperature control PCB board 9 is electrically connected to the back panel assembly 7.

[0053] Piezoelectric ceramics I 11 and II 12, corresponding to the positions of metal block I 13 and metal block II 14, are disposed on the temperature control PCB board 9. Metal block I 13 is in contact with piezoelectric ceramic I 11, and metal block II 14 is in contact with piezoelectric ceramic II 12. Metal block I 13 is thermally connected to the temperature control structure housing 10, and an insulation plate is disposed between metal block II 14 and the temperature control structure housing 10 to prevent heat from the temperature control structure housing 10 from being transferred to metal block II 14.

[0054] The heat from the inner shell 1 is transferred to the temperature control structure shell 10, and the heat from the temperature control structure shell 10 is conducted to the metal block I13. After the metal block I13 is heated and expands, it can compress the corresponding piezoelectric ceramic I11. The piezoelectric ceramic has a piezoelectric effect, which generates an electrical signal when the piezoelectric ceramic is deformed. The speed of the fan 4 can be controlled by the electrical signal.

[0055] In this embodiment, metal blocks I13 and II14 are disposed on the top inner wall of the temperature control structure housing 10 to shorten the distance between them and the inner housing 1.

[0056] A temperature control module 15 is installed on the temperature control PCB board 9. The temperature control module includes a storage module, control logic circuit, power supply, and amplification circuit, such as... Figure 10 As shown, piezoelectric ceramic I 11 and piezoelectric ceramic II 12 are electrically connected to the temperature control module 15 through the temperature control PCB board 9, which can transmit the electrical signal generated by the piezoelectric ceramic to the temperature control module 15.

[0057] The power supply provides appropriate voltage (current) to components such as amplifier circuits, memory modules, and control logic circuits.

[0058] The amplifier circuit amplifies the input piezoelectric ceramic electrical signal appropriately and provides a cutoff upper limit to prevent excessive voltage (current) from damaging the fan.

[0059] The storage module mainly stores the corresponding relationships and calculation rules of parameters such as power of functional modules, expansion of metal blocks, voltage (current) of piezoelectric ceramics, and temperature.

[0060] The control logic circuit mainly controls the amplification factor of the amplifier circuit and outputs signals to control the fan speed based on the data from the storage module and the received signals.

[0061] The electrical signal generated by the piezoelectric ceramic (including piezoelectric ceramic I 11 and piezoelectric ceramic II 12) is input to the temperature control module 15. After processing by the temperature control module 15, a suitable regulating fan voltage (current) is output. The regulating fan voltage (current) is transmitted to the fan 4 through the temperature control PCB board 9 and the backplane assembly 7, controlling the speed of the fan 4 so that the speed of the fan 4 follows the power variation of the functional module 6, thereby regulating the temperature of the functional module 6, such as... Figure 9 As shown.

[0062] Fan 4 and temperature control structure 5 are both electrically connected to backplane assembly 7 via wires, including power supply lines, control lines, and signal feedback lines. A power module is installed inside the chassis, supplying power to fan 4 and temperature control structure 5 via backplane assembly 7 and power supply lines. Signals from temperature control structure 5 are transmitted to fan 4 via backplane assembly and control lines to control fan speed. The status of fan 4 is transmitted to backplane and temperature control structure 5 via signal feedback lines for monitoring fan status.

[0063] If the heat dissipation of the functional chip is set to W, then the temperature corresponding to the temperature control structure housing 10 is t. The relationship between t and W can be expressed as follows:

[0064] t = f(W) (0.1)

[0065] When the temperature of the temperature-controlled structure housing 10 is t, the expansion amount Δx of the metal block I13 (the expansion amount, deformation amount, or displacement amount mentioned in this invention refers to the expansion amount, deformation amount, or displacement amount generated by the metal block and the piezoelectric ceramic in the direction of interaction) can be expressed as:

[0066] Δx=f(t) (0.2)

[0067] When the expansion of the piezoelectric ceramic I11 into the metal block I13 is Δx, the change in voltage (current) ΔV can be expressed as:

[0068] ΔV=f(Δx) (0.3)

[0069] When the voltage (current) change is ΔV, the fan operating voltage V after adjustment by the temperature control module 15 is:

[0070] V=f(ΔV) (0.4)

[0071] The expression for the fan operating voltage V and fan flow rate Q is as follows:

[0072] Q = f(V) (0.5)

[0073] By combining equations 1.1-1.5, we can obtain the relationship between the heat dissipation W of functional module 6 and the flow rate of fan 4.

[0074] When the chassis is used under vibration conditions, the structure and components within the temperature control structure 5 will deform. This deformation caused by vibration and temperature may distort the electrical signal generated by the piezoelectric ceramic. Figure 11 , Figure 12 As shown.

[0075] Ideally, the electrical signal output by the piezoelectric ceramic I 11 is positively correlated with temperature; that is, the higher the temperature, the greater the expansion of the metal block I 13, and the greater the electrical signal (voltage or current) generated by the piezoelectric ceramic I 11. For example... Figure 11 , Figure 12 As shown, under vibration conditions, the expansion of metal block I13 due to temperature is Δx1, and the deformation (i.e., displacement) of the piezoelectric ceramics I11 and II12 on the temperature control PCB board 9 at the corresponding positions of metal block I13 and metal block II14 due to vibration is Δx2. When the deformation directions of Δx1 and Δx2 are the same and Δx2>Δx1, the piezoelectric ceramic I11 loosens its contact with metal block I13, and the pressure on piezoelectric ceramic I11 decreases or even disappears; when the deformation directions of Δx1 and Δx2 are the same and Δx2<Δx1, although piezoelectric ceramic I11 does not detach from the contact, the deformation of Δx2 will offset part of the deformation of Δx1, resulting in a decrease in the pressure on piezoelectric ceramic I11; when the deformation directions of Δx1 and Δx2 are opposite, the contact pressure between piezoelectric ceramic I11 and metal block I13 increases, and the pressure on piezoelectric ceramic I11 increases. All of the above situations can lead to inaccurate electrical signals generated by the piezoelectric ceramic I11 (the electrical signal may be larger or smaller under different vibration conditions under the same temperature conditions).

[0076] In this embodiment, two piezoelectric ceramics and two metal blocks are provided. Metal block I13 is in thermally conductive contact with the temperature control structure housing 10, and the heat from the temperature control structure housing 10 can be transferred to metal block I13. Metal block I13 can automatically deform and expand with temperature changes, and the output electrical signal of piezoelectric ceramic I11 can change with temperature. A heat insulation plate is provided between metal block II14 and the temperature control structure housing 10 to achieve a heat insulation connection, preventing heat from being transferred to metal block II14, and thus preventing metal block II14 from expanding and deforming due to temperature changes.

[0077] The initial contact deformation Δx0 is set between metal block I13 and piezoelectric ceramic I11, and between metal block II14 and piezoelectric ceramic II12, under static and initial temperature conditions. This deformation causes the corresponding piezoelectric ceramic to generate a voltage V0. When functional module 6 starts working and generates heat, the deformation of metal block I11 is Δx1. Metal block II14 is thermally insulated from the temperature control structure housing 10 and will not deform due to temperature; its deformation remains Δx0. The actual deformation of metal block I13 due to temperature is Δx1 - Δx0. The voltage generated by the piezoelectric ceramic when Δx0 is deformed is V0, and the voltage generated by the piezoelectric ceramic when Δx1 is deformed is V1. There is a corresponding relationship between the deformation and the voltage generated by the piezoelectric ceramic. This relationship can be pre-stored in the storage module. The temperature control module receives the voltages generated by the two piezoelectric ceramics and calculates the difference. This difference is the voltage value corresponding to the deformation caused by temperature. Then, the calculated voltage is converted into the current (voltage) required by fan 4 and transmitted to fan 4 to dissipate heat from the chassis and functional module 6.

[0078] When the chassis vibrates under the aforementioned temperature conditions (i.e., when metal block I13 expands by Δx1), the positions of metal block I13 and metal block II 14 are close, and the vibration deformation of the piezoelectric ceramics on the temperature control PCB board 9 at the corresponding positions is consistent or has a very small difference, which can both be set to Δx2. At this time, the total deformation of metal block I 11 and piezoelectric ceramic I13 is Δx1±Δx2 (the sum of the deformation caused by temperature and the deformation caused by vibration), and the voltage generated by piezoelectric ceramic I13 is V3. The total deformation of metal block II 14 and piezoelectric ceramic II 12 is Δx0±Δx2 (the deformation caused by vibration), and the voltage generated by piezoelectric ceramic II 12 is V4. The difference in deformation between metal block I13 and metal block II 14 is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0 (removing the deformation caused by vibration). Therefore, the temperature control module 15 receives the voltage generated by the two piezoelectric ceramics and calculates the difference. The difference between voltage V3 and voltage V4 remains unchanged compared with the difference when there is no vibration. This can keep the current output by the temperature control module constant and unaffected by vibration. It can improve the erroneous signal output caused by structural deformation factors. Then, the voltage is converted into the current (voltage) required by the fan and transmitted to the fan 4 to dissipate heat from the functional module, thereby realizing the dynamic compensation function.

[0079] When functional chip 6 is working, heat is transferred to the temperature control structure housing 10 through the thermally conductive pad 65, cold plate cover I 61, and inner housing 1. The temperature of metal block I 13 rises and deforms. The deformation of metal block I 13 acts on piezoelectric ceramic I 11, and the piezoelectric effect of piezoelectric ceramic I 11 generates an electrical signal (voltage or current). The electrical signal is processed and amplified by temperature control module 15 to form a suitable current (voltage), which is then transmitted to fan 4 through backplane assembly 7, thereby controlling the speed of fan 4. This allows the inner housing 1, outer housing 2, and heat sink 3 to dissipate heat at a certain speed, changing the temperature of functional module 6 and functional chip. Temperature control module 15 corrects the electrical signal emitted by piezoelectric ceramic I 11 under vibration conditions by receiving the electrical signal generated by piezoelectric ceramic II 12, avoiding the influence of vibration on the accuracy of the electrical signal.

[0080] This invention proposes an air-cooled chassis that can automatically adjust the speed of fan 4 according to the temperature of functional module 6 (functional chip), eliminating the need for traditional temperature sensors, solving the installation and layout problems of temperature sensors, improving system reliability and miniaturization design, effectively controlling the temperature rise of functional modules, and effectively improving the reliability of heat dissipation of electronic devices.

[0081] In other embodiments, such as Figure 14 As shown, the fully enclosed air-cooled chassis can be replaced with an open air-cooled chassis. The chassis shell is equipped with air inlets and outlets. The functional modules 6 inside the chassis and the functional modules 6 and the chassis shell form air ducts that communicate with the air inlets and outlets. The fan 4 is located at the air inlet or outlet. When the fan rotates, it sends the hot air from the air duct inside the chassis shell out through the outlet and sends the cold air in through the inlet. At this time, since the cold air directly enters the chassis for cooling, it is no longer necessary for the inner shell 1 and the outer shell 2 to collect the cold air from the fan, so the inner shell 1 and the outer shell 2 can be eliminated.

[0082] When using a fully enclosed air-cooled chassis, since the heat from the functional modules is mainly conducted to the inner shell, the outer wall of the functional module shell (i.e., cold plate cover I 61, cold plate cover II 62) may or may not have heat dissipation fins. When using an open air-cooled chassis, heat dissipation fins can be provided on the outer wall of the functional module shell to improve heat dissipation efficiency.

[0083] In other embodiments, the functional chip and the thermally conductive protrusion 64 can be in direct contact, without the thermally conductive pad 65.

[0084] In other embodiments, multiple temperature control structures 5 can be installed inside the chassis. For example, temperature control structures 5 can be installed on all four inner shells 1 (top, bottom, left, and right) to perform multi-point measurements inside the chassis. The temperature control structures 5 are connected to the backplane assembly 7, which is equipped with a heat dissipation control module. The heat dissipation control module receives signals from multiple temperature control structures 5 and selects the highest fan voltage (current) to control the fan speed, ensuring that the fan flow can meet the heat dissipation requirements of all functional chips.

[0085] In other embodiments, the metal block II 14 can be replaced with other forms of insulating blocks, such as plastic blocks, that insulate the temperature control module housing 10.

[0086] In other embodiments, the piezoelectric ceramic can be replaced with a pressure sensor, with metal block I13 contacting pressure sensor I and metal block II 14 contacting pressure sensor II.

[0087] In other embodiments, the piezoelectric ceramic in the temperature control structure 5 can be connected to the temperature control module 15 by a wire. The temperature control module 15 is electrically connected to the backplane assembly via the wire, or the temperature control module 15 is directly electrically connected to the fan 4 via the wire to directly control the fan rotation. Therefore, the temperature control PCB board 9 can be removed.

[0088] An external temperature control structure of the present invention is the temperature control structure 5 in the above-described embodiment of an air-cooled chassis, which will not be described in detail here. Besides being installed inside the chassis, the temperature control structure 5 can also be installed on other heat-generating devices that require heat dissipation, with the temperature control structure housing thermally connected to the heat-generating device. The temperature control structure 5 is electrically connected to the cooling device of the heat-generating device, which can be a fan, etc.

[0089] The external temperature control structure can be directly installed on existing air-cooled chassis, facilitating the retrofitting of existing air-cooled chassis. Alternatively, the external temperature control structure can be integrated with a fan; this integrated device can be installed on the air-cooled chassis during the retrofitting process.

[0090] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An external temperature control structure, comprising a temperature control structure housing (10) for thermally connecting with a heating device, characterized in that: The temperature control structure housing (10) integrates a metal block I (13), a piezoelectric ceramic I (11) or a pressure sensor I, and a temperature control module (15). The metal block I (13) is thermally connected to the inner wall of the temperature control structure housing (10). The metal block I (13) is in contact with the piezoelectric ceramic I (11) or the pressure sensor I. The piezoelectric ceramic I (11) or the pressure sensor I is electrically connected to the temperature control module (15). The temperature control module (15) is used to be electrically connected to the fan (4). The fan (4) is used to dissipate heat from the heat-generating equipment.

2. The external temperature control structure according to claim 1, characterized in that: The inner wall of the temperature control structure housing (10) is also provided with an insulation block. The insulation block is thermally connected to the temperature control structure housing (10). A piezoelectric ceramic II (12) or pressure sensor II is provided inside the temperature control structure housing (10) and contacts the insulation block. The piezoelectric ceramic II (12) or pressure sensor II is electrically connected to the temperature control module (15). The metal block I (13) and the insulation block are arranged in a group. The distance between the metal block I (13) and the insulation block in the same group is close to that of the insulation block in the temperature control structure housing so that the metal block I (13), the insulation block and the corresponding piezoelectric ceramic or pressure sensor will have equal or similar deformation under vibration conditions.

3. The external temperature control structure according to claim 2, characterized in that: The temperature control module (15) includes a memory, a control logic circuit, an amplifier circuit for amplifying the input signal, and a power supply.

4. The external temperature control structure according to claim 3, characterized in that: The structure has a dynamic compensation function. The initial contact deformation between the metal block I (13) and the piezoelectric ceramic I (11) or the pressure sensor I, and between the insulating block and the piezoelectric ceramic II (12) or the pressure sensor II in the static and initial temperature state is set as Δx0. This deformation causes the corresponding piezoelectric ceramic or pressure sensor to generate voltage V0. The functional module (6) heats up, the deformation of the metal block I (13) is Δx1, the actual deformation of the metal block I (13) due to temperature is Δx1-Δx0, and the voltage generated by the piezoelectric ceramic I (11) or the pressure sensor I when Δx1 is deformed is V1. The temperature control module receives voltage V0 and voltage V1 and calculates and outputs the working current or voltage of the fan (4) when it is static. When the structure vibrates, the deformation of the piezoelectric ceramic or pressure sensor at the corresponding position of the metal block I (13) and the insulation block is set to Δx2. The total deformation of the metal block I (13) and the corresponding piezoelectric ceramic I or pressure sensor I is Δx1±Δx2. The voltage corresponding to the piezoelectric ceramic I (11) or pressure sensor I is V3. The total deformation of the insulation block and the corresponding piezoelectric ceramic II or pressure sensor II is Δx0±Δx2. The voltage corresponding to the piezoelectric ceramic II (12) or pressure sensor is V4. The difference between the deformation of the metal block I (13) and the insulation block is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0. Correspondingly, the difference between voltage V3 and voltage V4 remains unchanged, so that the current or voltage output by the temperature control module (15) remains unchanged to achieve dynamic compensation function.

5. An external temperature control structure according to claim 2, characterized in that: The piezoelectric ceramic I (11) or pressure sensor I, piezoelectric ceramic II (12) or pressure sensor II, and temperature control module (15) are integrated on the temperature control PCB board (9).

6. An air-cooled chassis, comprising a chassis shell, a backplate assembly (7) disposed within the chassis shell and into which a functional module (6) is inserted, a backplate connector disposed on the backplate assembly (7), and a module connector (8) disposed on the functional module (6) for engaging with the backplate connector, characterized in that: An external temperature control structure as described in any one of claims 1-5 is provided on the chassis housing. The temperature control structure housing (10) is thermally connected to the chassis housing. A functional chip is provided inside the functional module (6). The functional chip is thermally connected to the functional module housing. The functional module housing is thermally connected to the chassis housing. A fan (4) for cooling the chassis is provided on the chassis. The temperature control module (15) is electrically connected to the fan (4).

7. The air-cooled chassis according to claim 6, characterized in that: The temperature control module (15) is electrically connected to the back panel assembly (7), and the fan (4) is electrically connected to the back panel assembly (7).

8. The air-cooled chassis according to claim 6, characterized in that: The fan (4) is located on the outside of the chassis housing. The chassis housing includes an inner shell (1) and an outer shell (2). A heat sink (3) is provided between the inner shell (1) and the outer shell (2). The cavity between the inner shell (1) and the outer shell (2) is connected to the outside so that the fan (4) can send cold air into the cavity and exhaust hot air. The inner side of the inner shell (1) is sealed to the outside.

9. A wind-cooled chassis according to claim 6, characterized in that: The chassis is provided with an air inlet and an air outlet. The functional modules (6) inside the chassis and the functional modules (6) and the chassis form an air duct that connects the air inlet and the air outlet. A fan (4) is provided at the air inlet or the air outlet.

10. A wind-cooled chassis according to claim 6, characterized in that: The functional module (6) includes a functional module housing, a functional PCB board (63) is disposed inside the functional module housing, a functional chip is disposed on the functional PCB board (63), a thermally conductive boss (64) corresponding to the functional chip is disposed on the inner wall of the functional module housing, a thermally conductive pad (65) is disposed on the thermally conductive boss (64), and the functional chip is in contact with the thermally conductive pad (65).

Images