Multi-project wafer laser operation method

Abstract

The invention discloses a multi-project wafer laser operation method, which is characterized in that two different laser products in a multi-project wafer are integrated into one laser product, data information is modified in four modules of awk, newtftp, newwdemo and lialg of an ESI9350 parameter document, a common universal laser template is developed, and laser operation switching of different products is controlled through a trim-code file. Through a series of operations such as integration of multi-product laserreport messages, modification of four module data development universal templates, switching of operation products by utilizing trim-code files and the like, one template is compatible with two or more laser products, the laser operation efficiency is remarkably improved, multiple products can be processed through single operation, and the workload of repeated programming and debugging of engineers is reduced.

Description

Technical Field

[0001] This invention relates to the field of laser trimming technology, specifically to a multi-project wafer laser operation method based on an ESI9350 laser repair machine. By developing a universal laser template, multiple products can share the same template, thereby improving operation efficiency. Background Technology

[0002] The ESI9350 is a UNIX-based laser repair device primarily used for adjusting the electrical parameters of wafers. In actual production, engineers need to write ESI9350 programs for different products, involving modifications to four files: awk, li_alg.c, ne_ft_ftp.c, and ne_rw_demo.c.

[0003] Multi-project wafers typically contain multiple laser products to be developed. However, completing a single laser product operation based on ESI9350 requires multiple steps, such as programming, template creation, and trial printing and debugging, which is time-consuming and results in low development and debugging efficiency. Therefore, there is an urgent need to develop a universal laser template to enable multiple products to be used together, thereby improving operational efficiency. Summary of the Invention

[0004] To address the aforementioned issues, this invention provides a multi-project wafer laser job method, which aims to integrate multiple laser products from a multi-project wafer into a common template, thereby reducing repetitive development work and improving laser job efficiency.

[0005] The technical solution of this invention is:

[0006] A multi-project wafer laser job method integrates two different laser products in a multi-project wafer into a single laser product. By modifying data information in four modules (awk, ne_ft_ftp, ne_rw_demo, and li_alg) of the ESI9350 parameter document, a universally applicable laser template is developed. The switching of laser jobs for different products is controlled through a trim-code file.

[0007] The working principle of the above technical solution is as follows:

[0008] First, collect the laser_report parameter data from the two laser products and integrate them into a unified parameter dataset in a fixed order to ensure logical consistency when reading parameters later.

[0009] Then, in the awk module, the file is renamed, the extreme values ​​of the X / Y axis coordinates of the wafer device are filled in, and the number of items and links for each product are defined in numerical order; in the ne_ft_ftp module, the product path is set to be consistent with the awk file name; in the ne_rw_demo module, the maximum value of the link quantity is converted to a decimal number using 8421 code for data conversion; in the li_alg module, the link coordinates and their corresponding item numbers are recorded in item order.

[0010] Finally, by using the binary logic of "0" (do not execute the laser) and "1" (execute the laser) in the trim-code file, the link parameter of non-target products is masked, enabling job switching between different products under the same template.

[0011] In a further technical solution, the awk module needs to strictly arrange the item numbers of the two laser products in ascending order of numerical value, and fill in the number of links contained in each item.

[0012] By standardizing the order and number of items and links, the technical problems of chaotic and error-prone reading of multiple product parameters in existing technologies have been solved.

[0013] In a further technical solution, the laser product path of the ne_ft_ftp module must be consistent with the filename of the awk module.

[0014] By unifying path naming rules, the technical problems of FTP transfer failure and program inability to be called due to inconsistent paths in existing technologies have been solved.

[0015] In a further technical solution, the ne_rw_demo module needs to convert the number of items with the most links in the merged laser product into a decimal number using 8421 code.

[0016] By standardizing the conversion between binary and decimal, the technical problems of incompatible multi-product link data formats and incorrect device identification in existing technologies have been solved.

[0017] In a further technical solution, the li_alg module needs to fill in the x-axis and y-axis coordinates of each link and the corresponding item number according to the item sequence, and record the total number of links for each item.

[0018] By establishing a precise mapping of "item-coordinate-link", the technical problems of chaotic laser positioning coordinates and insufficient adjustment accuracy in existing technologies are solved.

[0019] In a further technical solution, the trim-code file controls whether a laser job is performed on a specific link by inputting "0" or "1".

[0020] By using binary logic to shield links for non-target products, the technical problem of low efficiency and repetitive program development required for switching between multiple product templates in existing technologies is solved.

[0021] In a further technical solution, the integrated universal template is developed based on the characteristic of consistent framesize step size across multiple projects.

[0022] By leveraging the regularity of wafer dimensions, the technical problem of multiple product templates being unable to be shared due to differences in hardware specifications in existing technologies has been solved.

[0023] The beneficial effects of this invention are:

[0024] 1. To address the issues of slow development and debugging efficiency and the need for repeated template creation in existing technologies for multi-project wafer laser products, this invention integrates laser_report messages from multiple products, modifies data from four major modules to develop a universal template, and uses trim-code files to switch job products. This enables a single template to be compatible with two or more laser products, significantly improving laser job efficiency, allowing multiple products to be processed in a single job, and reducing the workload of engineers repeatedly writing programs and debugging.

[0025] 2. To address the issues of confusing laser parameter reading and incorrect device identification data in existing technologies, this invention ensures accurate parameter reading under a universal template by strictly standardizing the order and quantity of items / links, standardizing data format conversion (such as 8421 code to decimal), and unifying file path naming. This avoids laser positioning deviations and program errors caused by data confusion, thereby improving the stability and accuracy of laser operations. Attached Figure Description

[0026] Figure 1 This invention provides a template flowchart for developing multi-project wafer laser products based on the ESI9350 laser repair machine.

[0027] Figure 2 A flowchart illustrating the workflow of integrating two different laser products for multi-project wafers using a common laser template. Detailed Implementation

[0028] The embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0029] Example:

[0030] like Figures 1-2 As shown, a multi-project wafer laser operation method includes the following specific steps:

[0031] Data collection and integration: Collect laser_report parameter data for product 1 and product 2 respectively. Classify the parameters of product 1 into items1-3 (each item contains 2 links) and the parameters of product 2 into items4-5 (each item contains 3 links). Integrate them into a unified dataset according to the item numbers 1-5 to ensure that the parameter order is consistent with subsequent module modifications.

[0032] Modifications to the awk module:

[0033] Rename the awk file to "MPW_Universal.awk" for easier and faster searching when used by multiple products;

[0034] The X-axis coordinate range of the wafer prober is 0-200mm, and the Y-axis coordinate range is 0-200mm (based on the consistent wafer framesize step size characteristic of multiple projects);

[0035] Fill in the item quantity in order: Product 1 has 3 items, Product 2 has 2 items, and the number of links for each item is 2, 2, 2, 3, 3 respectively (corresponding to items 1-5).

[0036] Modify the ne_ft_ftp module: Set the laser product path to " / FTP / MPW_Universal / ", which should match the awk filename, to ensure the FTP path is called correctly.

[0037] Modify the ne_rw_demo module: Select item5 (containing 3 links) with the most links in the merged items, represent 3 as "0011" in 8421 code, convert it to decimal number 3, and write it into the module for data conversion to avoid format errors when calling links.

[0038] Modify the li_alg module: Fill in the coordinates and item number of each li_alg item in item order:

[0039] item1: link1(10,20), link2(15,20), total number of links: 2;

[0040] Item 2: link3(20,30), link4(25,30), total number of links: 2;

[0041] Item 3: link5(30,40), link6(35,40), total number of links: 2;

[0042] Item 4: link7(50,60), link8(55,60), link9(60,60), total number of links: 3;

[0043] Item 5: link10(70,80), link11(75,80), link12(80,80), total number of links: 3.

[0044] Program compilation and verification: Compile the program on the ESI9350 laser repair machine. If an error occurs, return to check the module parameters (such as whether the coordinates are outside the device range and whether the item number is consecutive). If it is normal, proceed to the general template development stage.

[0045] Job switching execution:

[0046] When running product 1, set all link7-12 parameters of item4-5 to "0" in the trim-code file, and only activate link1-6 of item1-3. The device will perform laser operation according to the link coordinates.

[0047] When running product 2, set the link1-6 parameter of item1-3 to "0", activate link7-12 of item4-5, and complete the adjustment of product 2.

[0048] The working principle of the above technical solution is as follows:

[0049] By integrating parameters from multiple products and standardizing module modification rules, the general template can be compatible with the laser operation logic of different products. The trim-code file utilizes the binary recognition characteristics of "0 / 1" of ESI9350 to achieve flexible switching between multiple products under the same template by masking the link parameters of non-target products, thus avoiding the repetitive development process of "one template per product" in traditional methods.

[0050] In another embodiment, such as Figure 1 As shown, if a multi-project wafer contains three laser products (Product 1, Product 2, and Product 3), the integration steps are adjusted as follows:

[0051] Arrange the items of the 3 products in the order of number 1-6 (Product 1: item1-2, Product 2: item3-4, Product 3: item5-6), and each item contains 2 links;

[0052] In the awk module, the total number of items is 6, and the number of links for each item is recorded as 2 in product order.

[0053] In the ne_rw_demo module, select the item with the most links (if all have 2, choose one), and convert it to the decimal number 2 (8421 code "0010");

[0054] The li_alg module records the coordinates of all 12 links in the order of item1-6;

[0055] The trim-code file enables job switching between three products by disabling the link parameter (set to "0") corresponding to the item number of non-target products.

[0056] In another embodiment, if the framesize step of the multi-project wafer is 50mm, the extreme values ​​of the X / Y axis coordinates filled in the awk module are adjusted to 0-250mm (assuming the number of wafers is 5) to ensure that the template is adapted to the actual size range of the wafer and solve the template incompatibility problem caused by hardware specification differences.

[0057] In another embodiment, such as Figure 2 As shown, when the general template needs to adapt to different types of laser adjustment parameters (such as resistance adjustment and capacitance adjustment), a parameter type identifier field is added to the li_alg module and associated with the link coordinate record (such as item1 labeled "resistance adjustment" and item4 labeled "capacitance adjustment") to ensure that the device calls the corresponding adjustment algorithm according to the parameter type and improves the accuracy of the operation.

[0058] In another embodiment, if the ne_ft_ftp module path call fails, the path validity can be verified in real time by adding a path verification script (such as embedding automatic detection code in the awk file), thus solving the problem of program interruption caused by human input errors.

[0059] In another embodiment, the trim-code file can be pre-set with product switching macro instructions (such as "PRODUCT1" corresponding to disabling product 2 parameters, and "PRODUCT2" corresponding to disabling product 1 parameters), enabling quick switching through one-click instruction invocation, reducing manual input errors by engineers, and further improving work efficiency.

[0060] The embodiments described above are merely illustrative of specific implementations of the present invention, and while the descriptions are detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. A multi-project wafer laser processing method, characterized in that, The process includes the following steps: integrating laser_report messages from multiple Laser products and generating unified data in a specific order; modifying the awk, ne_ft_ftp, ne_rw_demo, and li_alg module information based on the ESI9350 laser repair machine to create a universal Laser template; and controlling product switching through the trim-code file to enable multiple products to share the same template.

2. The multi-project wafer laser processing method according to claim 1, characterized in that, The integrated laser_report message includes: arranging the item numbers of each product in numerical order, defining the number of links for each item, and ensuring that the parameter reading order is consistent.

3. The multi-project wafer laser processing method according to claim 1, characterized in that, The modifications to the awk module include: renaming the file to the integrated name, filling in the extreme values ​​of the X / Y axis coordinates of the wafer device, and recording the number of items and links for each product.

4. The multi-project wafer laser processing method according to claim 1, characterized in that, The ne_ft_ftp module has been modified to set a product path that matches the awk filename, for use in FTP path configuration.

5. The multi-project wafer laser processing method according to claim 1, characterized in that, The ne_rw_demo module has been modified to convert the maximum number of indexes in the merged item into a decimal number using 8421 code, for data conversion and coordinate system conversion.

6. The multi-project wafer laser processing method according to claim 1, characterized in that, The li_alg module has been modified to: fill in the X / Y axis coordinates of each link, the item number to which it belongs, and the total number of links for each item in the order of item.

7. The multi-project wafer laser processing method according to claim 1, characterized in that, The method of switching products via trim-code file includes: when running a certain product, setting the relevant link parameter of another product to "0" to activate only the link of the target product.

8. The multi-project wafer laser processing method according to any one of claims 1-7, characterized in that, The general template can process at least two Laser products at once, reducing repetitive development steps and improving work efficiency.

Images