Laser processing method and device for packaging substrate, electronic equipment and storage medium

Abstract

The present disclosure provides a laser processing method and device for packaging substrates, electronic equipment and storage medium. The method comprises: obtaining a packaging substrate to be processed, and determining the layer number of the packaging substrate to be processed; in response to determining that the layer number is an odd layer, directly performing laser processing on the packaging substrate to be processed in an initial position; in response to determining that the layer number is an even layer, rotating the packaging substrate to be processed by a first preset angle, controlling the packaging substrate to be processed to move from the initial position to an updated position, and performing laser processing on the packaging substrate to be processed in the updated position.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of substrate processing, and particularly relates to a laser processing method and device for packaging substrates, an electronic device and a storage medium. BACKGROUND

[0002] In the process of high-precision substrate processing and chip packaging, the expansion and contraction values of different regions of the packaging substrate will deviate, and the deviation of the expansion and contraction values will become larger and larger with the increase of the number of laser processing layers. When the expansion and contraction values of the packaging substrates in the same batch deviate greatly, it will have a serious impact on subsequent assembly, packaging and other processes, resulting in a decrease in product yield.

[0003] Therefore, how to avoid the expansion and contraction value deviation between different regions of the packaging substrate from being too large becomes a technical problem to be solved. SUMMARY

[0004] Therefore, the purpose of the present disclosure is to provide a laser processing method and device for packaging substrates, an electronic device and a storage medium to solve or partially solve the above technical problems.

[0005] To achieve the above purpose, the first aspect of the present disclosure provides a laser processing method for packaging substrates, which comprises the following steps:

[0006] acquiring a packaging substrate to be processed, and determining the layer number of the packaging substrate to be processed;

[0007] in response to determining that the layer number is an odd number, directly performing laser processing on the packaging substrate to be processed in an initial position;

[0008] in response to determining that the layer number is an even number, rotating the packaging substrate to be processed by a first preset angle, controlling the packaging substrate to be processed to move from the initial position to an updated position, and performing laser processing on the packaging substrate to be processed in the updated position.

[0009] Based on the same inventive concept, the second aspect of the present disclosure provides a laser processing device for packaging substrates, which comprises:

[0010] a layer number determination module configured to acquire a packaging substrate to be processed, and determine the layer number of the packaging substrate to be processed;

[0011] a first laser processing module configured to, in response to determining that the layer number is an odd number, directly perform laser processing on the packaging substrate to be processed in an initial position;

[0012] The second laser processing module is configured to rotate the packaging substrate to be processed by a first preset angle, control the packaging substrate to be processed to move from the initial position to an updated position, and perform laser processing on the packaging substrate to be processed in the updated position, in response to determining that the number of layers is even.

[0013] Based on the same inventive concept, a third aspect of the present disclosure provides an electronic device, comprising a memory, a processor, and a computer program stored on the memory and executable by the processor, wherein the processor implements the method described above when executing the computer program.

[0014] Based on the same inventive concept, a fourth aspect of the present disclosure provides a non-transitory computer-readable storage medium storing computer instructions for causing a computer to execute the method described above.

[0015] As can be seen from the above, the present disclosure provides a packaging substrate laser processing method, device, electronic device, and storage medium. The packaging substrate to be processed is obtained, and the number of layers of the packaging substrate to be processed is determined. When the number of layers is odd, the packaging substrate to be processed in the initial position is directly subjected to laser processing. When the number of layers is even, the packaging substrate to be processed is rotated by a first preset angle, the packaging substrate to be processed is controlled to move from the initial position to an updated position, and the packaging substrate to be processed in the updated position is subjected to laser processing. In this way, by rotating the packaging substrate of even layers, the areas of the packaging substrates of odd layers and even layers subjected to laser processing are different, thereby reducing the expansion and contraction value deviation between different areas of the packaging substrate, and further avoiding the influence of the expansion and contraction deviation on product yield due to the excessive expansion and contraction deviation. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present disclosure or the related art, the following will briefly introduce the drawings needed to be used in the embodiments or related art descriptions. Obviously, the drawings in the following description are only embodiments of the present disclosure, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.

[0017] Figure 1A A schematic diagram of the expansion and contraction values of the packaging substrate after laser processing in the related art;

[0018] Figure 1B A schematic diagram of the expansion and contraction values of each layer of the packaging substrate in the related art;

[0019] Figure 1C A flowchart of the laser processing of the packaging substrate in the related art;

[0020] Figure 2A Flow chart of the laser processing method for the package substrate of the embodiment of the present disclosure;

[0021] Figure 2B Flow chart of the laser processing method for the package substrate of the embodiment of the present disclosure;

[0022] Figure 2C Schematic diagram of the foolproof hole coordinate modification of the embodiment of the present disclosure;

[0023] Figure 2D Schematic diagram of the program configuration interface of the embodiment of the present disclosure;

[0024] Figure 2E Schematic diagram of the new configuration interface of the embodiment of the present disclosure;

[0025] Figure 2F Schematic diagram of the new subprogram interface of the embodiment of the present disclosure;

[0026] Figure 2G Schematic diagram of the new mother program interface of the embodiment of the present disclosure;

[0027] Figure 2H Schematic diagram of the request approval interface of the embodiment of the present disclosure;

[0028] Figure 2I Schematic diagram of the QP coordinate of the package substrate of the embodiment of the present disclosure;

[0029] Figure 2J Schematic diagram of the expansion value of the package substrate after the laser processing of different areas before and after the improvement of the embodiment of the present disclosure;

[0030] Figure 3 Structural schematic diagram of the laser processing device for the package substrate of the embodiment of the present disclosure;

[0031] Figure 4 Structural schematic diagram of the electronic device of the embodiment of the present disclosure. DETAILED DESCRIPTION

[0032] In order to make the objectives, technical solutions and advantages of the present disclosure clearer, the present disclosure is further described in detail below with reference to the embodiments and the accompanying drawings.

[0033] It should be noted that, unless otherwise defined, technical terms or scientific terms used in the embodiments of the disclosure shall have the common meaning understood by one of ordinary skill in the art to which the disclosure belongs. The terms "first", "second", and similar terms used in the embodiments of the disclosure do not denote any order, quantity, or importance, but are used to distinguish different components. The terms "include", "contain", and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "upper", "lower", "left", "right", and the like are used only to represent relative positional relationships, and when the absolute positions of the described objects change, the relative positional relationships can also change accordingly.

[0034] Based on the description of the background, Ajinomoto Build-up Film (ABF) is an organic resin material used for high-density packaging, mainly used for high-end chip packaging substrates. In the process of using ABF to manufacture semiconductor packaging substrates of Flip Chip Ball Grid Array (FCBGA), there is a large difference in the shrinkage values of different areas (for example, Quarter Panel, QP) of the same packaging substrate (Panel) after each layer of ABF is processed by laser technology. After laser processing, all packaging substrates have a fixed shrinkage deviation trend. Figure 1A The figure is a schematic diagram of the shrinkage values of different areas of the packaging substrate after laser processing in the related art. As shown in Figure 1A The shrinkage values of the two QPs (QP2 and QP3) processed by laser at the back end of the same packaging substrate are always higher than the shrinkage values of the two QPs (QP1 and QP4) processed by laser at the front end.

[0035] Figure 1B The figure is a schematic diagram of the shrinkage values of each layer of the packaging substrate in the related art. As shown in Figure 1B The shrinkage values of the QPs (QP2 and QP3) and the QPs (QP1 and QP4) after laser processing of the BU01 layer (BU01 layer) to the EP layer (EP layer) increase more and more with the increase of the number of ABF insulating layer accumulation. Then, the shrinkage deviation values of the EP layer to the SR layer (SR layer) without laser processing change little and are relatively stable. Therefore, the shrinkage value deviation between QP and QP becomes larger and larger because the laser processing technology has a direct impact on the difference in shrinkage value.

[0036] According to the current laser processing method, the QP and QP expansion value difference increases with the increase of the ABP stack layer number after the laser production and processing procedure, and the expansion value deviation between QPs becomes larger and larger after laser processing. Figure 1C The flowchart of the laser processing of the packaging substrate in the related art is shown in FIG. 1. Figure 1C As shown in FIG. 1, the laser drilling process is first performed on the BU01 layer, then the laser drilling process is performed on the BU02 layer, and finally the laser drilling process is performed on the EP layer. This will cause the problem of the expansion value deviation becoming larger and larger.

[0037] When the expansion value deviation of the packaging substrate in the same batch is large, the ball planting (Uball) process needs to be divided into two or more batches according to the QP expansion performance to manufacture different expansion values in the same batch of packaging substrates, otherwise the product yield will be lost due to the expansion problem.

[0038] As described above, how to avoid the expansion value deviation between different regions of the packaging substrate from being too large has become an important research problem.

[0039] Based on the above description, as shown in FIG. 2, the laser processing method of the packaging substrate provided by the embodiment includes: Figure 2A

[0040] Step 101, obtaining a packaging substrate to be processed, and determining the layer number of the packaging substrate to be processed.

[0041] Step 102, in response to determining that the layer number is an odd layer, directly performing laser processing on the packaging substrate to be processed in an initial position.

[0042] Step 103, in response to determining that the layer number is an even layer, rotating the packaging substrate to be processed by a first preset angle, controlling the packaging substrate to be processed to move from the initial position to an updated position, and performing laser processing on the packaging substrate to be processed in the updated position.

[0043] In specific implementation, according to the current laser processing method, a fixed expansion change trend is found, and the expansion values of two QPs (QP2 and QP3) after laser processing of the same Panel back end are always higher than the expansion values of two QPs (QP1 and QP4) after laser processing of the front end. Therefore, in order to reduce the expansion value difference between QPs and QPs, the packaging substrate Panel is rotated by 180° to improve and reduce the expansion value difference between QPs and QPs in the laser processing key process. The first preset angle can be 180°.

[0044] Figure 2B The flowchart of the laser processing of the packaging substrate after rotation in the embodiment of the present disclosure is shown in FIG. 2.​Figure 2B As shown, when processing the BU01 layer, the laser processing applies a normal process processing procedure to process the packaging substrate panel, without processing by rotation. When the packaging substrate is produced through the entire process flow to produce the BU01 layer and is circulated to the ABF stacking layer to the BU02 layer to the laser station, the packaging substrate panel is processed by applying a new key process at the laser station, after being rotated by 180° based on the original processing of the BU01 layer, to perform laser processing of the BU02 layer. In this way, the odd layers such as the BU01 layer are processed without rotation, and the even layers such as the BU02 layer are processed by rotation by 180°. The laser processing uses a new key process to produce a reduced QP and QP difference in expansion and contraction values. The odd and even layers are processed by rotation by 180° to achieve complementary expansion and contraction values between QP (QP2 & QP3) and QP (QP1 & QP4) of the same packaging substrate panel, thereby reducing the difference in expansion and contraction values between QP and QP after laser processing of the packaging substrate, improving the uniformity of expansion and contraction, and improving the yield of the packaging substrate product.

[0045] In the above embodiment, the packaging substrate to be processed is obtained, and the layer number of the packaging substrate to be processed is determined. When the layer number is an odd layer, the packaging substrate to be processed in the initial position is directly processed by laser. When the layer number is an even layer, the packaging substrate to be processed is rotated by a first preset angle, the packaging substrate to be processed is controlled to move from the initial position to an updated position, and the packaging substrate to be processed in the updated position is processed by laser. In this way, the packaging substrate of the even layer is rotated, so that the regions of the packaging substrate of the odd layer and the even layer processed by laser are different, thereby reducing the deviation of the expansion and contraction values between different regions of the packaging substrate, and further avoiding the influence of the product yield due to the excessive deviation of the expansion and contraction.

[0046] In some embodiments, step 101 includes:

[0047] Step 1011, obtaining a packaging substrate to be processed and substrate processing data.

[0048] Step 1012, converting the substrate processing data into laser machine processing format data, and determining the layer number of the packaging substrate to be processed based on the laser machine processing format data.

[0049] In practice, the substrate processing data can be Computer Aided Manufacturing (CAM). Specifically, the substrate processing data of the packaging substrate to be processed is acquired, and the substrate processing data is converted into laser machine processing format data using application software (e.g., CAD CONVERT). Based on the laser machine processing format data, the layer number of the packaging substrate to be processed is determined. The layer number of the packaging substrate includes at least one of the following: BU01 layer, BU02 layer, BU03 layer, BU04 layer, BU05 layer, BU06 layer…EP layer and SR layer.

[0050] The above method obtains the substrate processing data of the packaging substrate to be processed. The application software can convert the substrate processing data into laser machine processing format data. In this way, the layer number of the packaging substrate to be processed can be quickly and accurately determined based on the laser machine processing format data.

[0051] In some embodiments, after step 1012, the method further includes:

[0052] Step 1012A: Modify the coordinates of the anti-foolproof holes in the even-numbered layers of the laser machine processing format data to obtain updated processing data.

[0053] Step 1012B: Set the processing program name for the updated processing data and store the updated processing data according to the preset storage path.

[0054] In practice, Figure 2C This is a schematic diagram illustrating the change of the anti-fool hole coordinates according to an embodiment of this disclosure. Figure 2C As shown, after converting the substrate processing data into laser machine processing format data, for even-numbered layers that need to be rotated, the coordinates of the Hirita ID holes are changed in the laser machine processing format data, while keeping other contents unchanged, to obtain updated processing data.

[0055] The system sets the processing program name for the updated processing data and stores the updated processing data according to a pre-defined storage path. Specifically, when the user clicks "Save to specified path," the path control in the system interface receives the path setting instruction and sets the storage path for the updated processing data. At the same time, the save control in the system interface receives the save instruction and stores the updated processing data according to the pre-defined storage path.

[0056] The even layer hole coordinates in the laser machine processing format data are changed by the above scheme to obtain updated processing data, facilitating rotation of the even layer packaging substrate. The updated processing data is set with a processing program name, and the updated processing data is stored according to a pre-set storage path, so that the subprogram can be configured according to the processing program name and the storage path.

[0057] In some embodiments, step 103 includes:

[0058] Step 1031, scanning the packaging substrate to be processed to obtain a pre-configured subprogram and a master program, wherein the pre-configured subprogram is set in binding with the laser machine, and the pre-configured master program is set in binding with the upper plate machine and the lower plate machine.

[0059] Step 1032, based on the pre-configured master program and the subprogram, it is identified that the packaging substrate to be processed is an even layer, and a rotation instruction is generated.

[0060] Step 1033, the upper plate machine rotates the packaging substrate to be processed by a first preset angle based on the rotation instruction, and controls the packaging substrate to be processed to move from the initial position to an updated position.

[0061] Step 1034, the laser machine processes the packaging substrate to be processed in the updated position.

[0062] Step 1035, the lower plate machine rotates the packaging substrate to be processed by a second preset angle, and controls the packaging substrate to be processed to move from the updated position to the initial position.

[0063] In specific implementation, the embodiment of the present disclosure needs to realize the function of automatically rotating the packaging substrate by 180°, which cannot be realized by hardware alone, and new functions need to be developed for software and hardware combination to realize the action of rotating the packaging substrate by 180°.

[0064] By developing new software and hardware in the MES system, binding the laser machine, the plate feeding machine and the plate unloading machine together, when the packaging substrate to be processed reaches the laser station, the production scans the process card barcode or two-dimensional code on the current batch of packaging substrate by using the code scanning gun, and the program Recipe configures and issues instructions to the plate feeding machine. If the program needs to rotate, the plate feeding machine rotates 180° in the first direction after grabbing the packaging substrate, and then places it on the processing table of the laser machine. The laser machine completes the laser processing of the packaging substrate through the corresponding production layer sequence. After the laser processing of the packaging substrate is completed in the laser machine, the plate unloading machine rotates the packaging substrate by 180° in the second direction. The first direction and the second direction are opposite directions. In this way, the plate unloading machine can rotate the packaging substrate back to the initial position, so that the foolproof holes of the even layer and the odd layer packaging substrate are on the same side, avoiding the blocking of the foolproof holes of the packaging substrate.

[0065] Through the above scheme, based on the pre-configured mother program and subprogram, it is identified that the packaging substrate to be processed is even layer, and the rotation instruction can be quickly and accurately generated. The plate feeding machine rotates the packaging substrate to be processed by a first preset angle based on the rotation instruction, controls the packaging substrate to be processed to move from the initial position to the updated position, and the laser machine performs laser processing on the packaging substrate to be processed in the updated position, thereby realizing laser processing on the even layer packaging substrate after rotation, thereby reducing the expansion value deviation between different regions of the packaging substrate. The plate unloading machine rotates the packaging substrate to be processed by a second preset angle, controls the packaging substrate to be processed to move from the updated position to the initial position, so that the foolproof holes of the even layer and the odd layer packaging substrate are on the same side, avoiding the blocking of the foolproof holes of the packaging substrate.

[0066] In some embodiments, the pre-configuration process of the subprogram includes:

[0067] Step 1031A, creating a new subprogram by using a manufacturing execution system, and selecting a preset change item in a change set.

[0068] Step 1031B, in response to determining that the number of layers is odd layer, setting a first subprogram name.

[0069] Step 1031C, in response to determining that the number of layers is even layer, setting a second subprogram name.

[0070] Step 1031D, configuring the newly created subprogram based on the first subprogram name, the second subprogram name, the product type, the storage path and the processing program name.

[0071] In practice, the laser processing subroutine (sub-recipe) is created in the Manufacturing Execution System (MES), which is a newly developed software interface specifically designed for creating laser processing programs.

[0072] Figure 2D This is a schematic diagram of the program configuration interface according to an embodiment of this disclosure. Figure 2D As shown, the newly created MES interface displays a Recipe. Clicking on a Subroutine sends a command to the Subroutine control, which then enters the Subroutine configuration interface. The Subroutine configuration interface displays multiple control buttons. Clicking the "New" control button sends a command to the newly created control, which then enters the new control configuration interface.

[0073] Figure 2E This is a schematic diagram of a new configuration interface according to an embodiment of this disclosure. Figure 2E As shown, the new configuration interface displays a set of change items. Clicking the drop-down option of the change set will display multiple arbitrary strings. Select a relatively complex string. The main purpose of the change set is to prevent the existence of the same characters as other baseboards, which may lead to defects (bugs). It is mainly to prevent software conflicts that may cause bugs. After completing this step, click Next. The Next control receives the instruction and enters the new subroutine interface.

[0074] Figure 2F This is a schematic diagram of the interface for creating a new subroutine according to an embodiment of this disclosure. Figure 2F As shown, in the "New Recipe" interface, the subroutine is created. The specific creation process is as follows:

[0075] ⑤ Subroutine Name: Subroutine name confirmation. Specifically, when the packaging substrate to be processed is an odd-numbered layer that does not require rotation, a first subroutine name without a suffix is ​​set (e.g., DOE_LAC_MTGTF4_BU01F); when the packaging substrate to be processed is an even-numbered layer that requires rotation, a second subroutine name with a suffix is ​​set (e.g., DOE_LAC_MTGTF4_BU01_ROT, where ROT is a suffix).

[0076] ⑥ Product Type: This refers to the product category. The drop-down options are Production and Engineering. You can set the product type accordingly.

[0077] ⑦Supplier information: refers to the storage path preset in step 1012B, and the storage path of the subprogram needs to match the storage path of the updated machining data in step 1012B.

[0078] ⑧Resource Recipe Name: refers to the machining program name in step 1012B, and the machining program name of the subprogram needs to match the machining program name of the updated machining data in step 1012B.

[0079] ⑨Create: after the above steps are completed, the create control is clicked, and the create control receives the instruction to complete the creation of the subprogram.

[0080] Through the above scheme, based on the first subprogram name, the second subprogram name, the product type, the storage path and the machining program name, the configuration of the subprogram can be realized, so that the configured subprogram can be used to control the laser processing machine to process the packaging substrate.

[0081] In some embodiments, the pre-configuration process of the mother program includes:

[0082] Step 1031a, a new mother program is created by using a manufacturing execution system.

[0083] Step 1031b, in response to determining that the current layer is an odd layer, a first mother program name is set.

[0084] Step 1031c, in response to determining that the current layer is an even layer, a second mother program name is set.

[0085] Step 1031d, the newly created mother program is configured based on the first mother program name, the second mother program name, the product type and the resource configuration name.

[0086] In specific implementation, after the subprogram of the laser processing is created, a mother program (Recipe) also needs to be created. The subprogram is mainly used for laser machine processing creation, and the subprogram name is convenient for production to confirm whether the laser program is rotated. The mother program covers all program actions, such as issuing a formula, automatically tracking in / out the board machine, and all related programs.

[0087] The mother program is also created by clicking the newly developed Recipe option in the MES system, such as Figure 2DAs shown, the MES newly established interface displays a program (Recipe), and clicking the master program causes the master program control to receive the instruction and enter the master program configuration interface. The subprogram configuration interface displays a plurality of control buttons, and clicking the New control button causes the new control to receive the instruction and enter the new master program interface.

[0088] Figure 2G A schematic diagram of the new master program interface of the embodiments of the present disclosure is shown. As shown, in the new master program (New Recipe) interface, the creation of the master program in the new master program interface is completed, and the specific creation process is as follows: Figure 2G

[0089] ① Master program name (Name): Master program name confirmation. Specifically, when the layer number of the packaging substrate to be processed is an odd layer that does not need to be rotated, a first master program name containing a first suffix POR (for example, DOE_LAC_MTGTF4_BU01F_POR) is set; when the layer number of the packaging substrate to be processed is an even layer that needs to be rotated, a second master program name containing a second suffix ROTATION (for example, DOE_LAC_MTGTF4_BU01F_ROTATION) is set.

[0090] ② Product type (Type): refers to the product category, and the drop-down options are production (Production) and engineering (Engineering), which can be set according to the product type.

[0091] ③ Resource configuration name (Resource Recipe Name): The resource configuration name is configured as LACMIT when the master program is configured.

[0092] ④ Next: After completing the above steps, clicking Next will pop up a verification interface, and in the verification interface, the created program name is directly searched. If the corresponding subprogram and master program are displayed, it means that the entire subprogram and master program have been successfully created.

[0093] Through the above scheme, based on the first master program name, the second master program name, the product type, and the resource configuration name, the configuration of the master program can be realized, so that the configured master program can be used to control the upper board machine to rotate the even layer packaging substrate to a new position, and the configured master program can be used to control the lower board machine to rotate the even layer packaging substrate after laser processing to the initial position.

[0094] In some embodiments, after step 1031D and step 1031d, further comprising:

[0095] ​Step 1031X, determining a processing request generated based on the sub-program and the mother program in the manufacturing execution system, determining a newly created configuration interface based on the processing request, and confirming the processing request based on the newly created configuration interface.

[0096] Step 1031Y, binding and setting the pre-configured sub-program with the laser machine in the manufacturing execution system, and binding and setting the pre-configured mother program with the upper plate machine and the lower plate machine.

[0097] In implementation, Figure 2H A schematic diagram of a request approval interface of an embodiment of the present disclosure is shown in FIG. 10. As shown, after the configuration of the sub-program and the mother program is completed, the program needs to be activated to take effect. Specifically, clicking the newly developed request approval (Request Approval) control button in the MES will pop up the request change set approval (Request Change Set Approval) interface. After confirming that there is no error, clicking the request approval (“Request Approval”) control button, the request approval control receives the instruction, and the configured production Recipe takes effect. Figure 2H

[0098] Through the above scheme, the processing request generated based on the sub-program and the mother program is determined in the manufacturing execution system, the newly created configuration interface is determined based on the processing request, and the processing request is confirmed based on the newly created configuration interface. The pre-configured sub-program is bound and set with the laser machine in the manufacturing execution system, and the pre-configured mother program is bound and set with the upper plate machine and the lower plate machine. In this way, the pre-configured sub-program can be used to control the laser machine to perform laser processing on the packaging substrate, and the pre-configured mother program can be used to control the upper plate machine to rotate the even-numbered packaging substrate to an updated position, and the pre-configured mother program can be used to control the lower plate machine to rotate the laser-processed packaging substrate of even-numbered layers back to the initial position.

[0099] In some embodiments, step 1032 includes:

[0100] Step 1032A, obtaining a target mother program name from the pre-configured mother program, and obtaining a target sub-program name from the pre-configured sub-program.

[0101] Step 1032B, in response to determining that the target mother program name is the second mother program name and the target sub-program name is the second sub-program name, determining that the packaging substrate to be processed is even-numbered, and generating a rotation instruction.

[0102] ​In a specific implementation, when the layer number of the packaging substrate to be processed is an odd layer that does not need to be rotated, a first subprogram name without a suffix (for example, DOE_LAC_MTGTF4_BU01F) is set; when the layer number of the packaging substrate to be processed is an even layer that needs to be rotated, a second subprogram name with a suffix (for example, DOE_LAC_MTGTF4_BU01_ROT, where ROT is the suffix) is set.

[0103] In addition, when the layer number of the packaging substrate to be processed is an odd layer that does not need to be rotated, a first master program name with a first suffix POR (for example, DOE_LAC_MTGTF4_BU01F_POR) is set; when the layer number of the packaging substrate to be processed is an even layer that needs to be rotated, a second master program name with a second suffix ROTATION (for example, DOE_LAC_MTGTF4_BU01F_ROTATION) is set.

[0104] When the target master program name is DOE_LAC_MTGTF4_BU01F_ROTATION and the target subprogram name is DOE_LAC_MTGTF4_BU01_ROT, it is determined that the packaging substrate to be processed is an even layer, and a rotation instruction is generated. The packaging substrate is determined to be an even layer according to the second suffix ROTATION in the target master program name and the suffix ROT in the target subprogram name.

[0105] Through the above scheme, when the target master program name is the second master program name and the target subprogram name is the second subprogram name, the packaging substrate to be processed can be quickly and accurately determined to be an even layer, and a rotation instruction is generated, so that the packaging substrate of the even layer is controlled to rotate based on the rotation instruction.

[0106] Figure 2I A schematic diagram of QP coordinates of a packaging substrate of an embodiment of the present disclosure is shown. As shown in Figure 2I , the packaging substrate is divided into four regions of QP1, QP2, QP3, and QP4, and the coordinates of the four corner positions on each QP are as shown in Figure 2I . In QP1, the coordinates of the P1 point position are , the coordinates of the P2 point position are , the coordinates of the P3 point position are , and the coordinates of the P4 point position are . In QP2, the coordinates of the P5 point position are , the coordinates of the P6 point position are , the coordinates of the P7 point position are , and the coordinates of the P8 point position are . In QP3, the coordinates of the P9 point position are The coordinates of the P10 point are The coordinates of the P11 point are The coordinates of the P12 point are The coordinates of the P13 point are The coordinates of the P14 point are The coordinates of the P15 point are The coordinates of the P16 point are .

[0107] On the packaging substrate, taking QP1 as an example, the expansion and contraction values between QPs are calculated, and the specific calculation is as follows:

[0108]

[0109] wherein, represents the expansion and contraction value of the QP1 region of the packaging substrate in the X direction, represents the expansion and contraction rate between the P3 point and the P2 point in the X direction, represents the expansion and contraction rate between the P4 point and the P1 point in the X direction.

[0110]

[0111] wherein, represents the expansion and contraction value of the QP1 region of the packaging substrate in the Y direction, represents the expansion and contraction rate between the P2 point and the P1 point in the Y direction, represents the expansion and contraction rate between the P3 point and the P4 point in the Y direction.

[0112]

[0113] wherein, represents the expansion and contraction rate between the P3 point and the P2 point in the X direction, may also be represented as , represents the actual coordinate of the P3 point in the X direction, may also be represented as , represents the actual coordinate of the P2 point in the X direction, may also be represented as , represents the normal coordinate of the P3 point in the X direction, may also be represented as , represents the normal coordinate of the P2 point in the X direction.

[0114]

[0115] wherein, represents the expansion ratio in the X direction between the position of P4 point and the position of P1 point, may also be represented as , represents the actual coordinate of P4 point position in the X direction, may also be represented as , represents the actual coordinate of P1 point position in the X direction, may also be represented as , represents the normal coordinate of P4 point position in the X direction, may also be represented as , represents the normal coordinate of P1 point position in the X direction.

[0116]

[0117] wherein, represents the expansion ratio in the Y direction between the position of P2 point and the position of P1 point, may also be represented as , represents the actual coordinate of P2 point position in the Y direction, may also be represented as , represents the actual coordinate of P1 point position in the Y direction, may also be represented as , represents the normal coordinate of P2 point position in the Y direction, may also be represented as , represents the normal coordinate of P1 point position in the Y direction.

[0118]

[0119] wherein, represents the expansion ratio in the Y direction between the position of P3 point and the position of P4 point, may also be represented as , represents the actual coordinate of P3 point position in the Y direction, may also be represented as , represents the actual coordinate of P4 point position in the Y direction, may also be represented as , represents the normal coordinate of P3 point position in the Y direction, may also be represented as , represents the normal coordinate of the position of the P4 point in the Y direction.

[0120]

[0121] wherein, represents the expansion and contraction deviation in the X direction between QP and QP, represents the maximum expansion and contraction value in the X direction from the four QPs of the packaging substrate, represents the minimum expansion and contraction value in the X direction from the four QPs of the packaging substrate.

[0122]

[0123] wherein, represents the expansion and contraction deviation in the Y direction between QP and QP, represents the maximum expansion and contraction value in the Y direction from the four QPs of the packaging substrate, represents the minimum expansion and contraction value in the Y direction from the four QPs of the packaging substrate.

[0124] Similarly, on the packaging substrate, the expansion and contraction value between QP and QP is calculated according to QP2, QP3 and QP4, which can be obtained in the above calculation manner.

[0125] The embodiments of the present disclosure have the following technical effects:

[0126] By rotating the packaging substrate Panel by 180° in the laser processing process of the even-numbered layers such as BU02 layer, BU04 layer, BU06 layer, 2n layer, etc. of the packaging substrate, the expansion and contraction deviation between QP and QP can be effectively solved, thereby improving the problem of the expansion and contraction deviation caused by laser processing affecting product yield.

[0127] Figure 2J The figure is a schematic diagram of the expansion and contraction values of the packaging substrate of the present disclosure before and after improvement after laser processing of different regions of the packaging substrate. As shown in the figure, Figure 2JAs shown, the experimental verification result comparison of the design of experiment (DOE) of the key technical scheme of the laser processing mode rotating 180° according to the embodiment of the present disclosure shows that the process result before improvement has obvious improvement and promotion. The same batch of packaging substrates is split into two batches for verification. One batch is produced according to the original processing mode at the laser site, and the result after laser processing shows that due to the large difference in expansion and contraction between QPs, a part of QPs cannot be completely covered by the Stencil. The other batch is processed according to the technical scheme of the embodiment of the present disclosure, and the even layers are laser processed by rotating the packaging substrate 180° after laser processing. The data result after processing shows that all QPs can be effectively and completely covered by the Stencil by rotating the packaging substrate 180° after laser processing. The technical scheme of the embodiment of the present disclosure can realize the reduction of the expansion and contraction values between QPs.

[0128] According to the technical scheme of the embodiment of the present disclosure, after the ABF film is applied to the packaging substrate for layer-by-layer build-up, the laser processing mode of rotating the even layers of the packaging substrate 180° can effectively reduce the expansion and contraction deviation between QPs, and improve and promote the problem of low product yield caused by the expansion and contraction deviation.

[0129] Through the above embodiment, the packaging substrate to be processed is obtained, and the layer number of the packaging substrate to be processed is determined. When the layer number is an odd layer, the packaging substrate to be processed in the initial position is directly laser processed. When the layer number is an even layer, the packaging substrate to be processed is rotated by a first preset angle, the packaging substrate to be processed is controlled to move from the initial position to an updated position, and the packaging substrate to be processed in the updated position is laser processed. In this way, by rotating the even layers of the packaging substrate, the areas of the odd layers and the even layers of the packaging substrate for laser processing are different, so as to reduce the expansion and contraction value deviation between different areas of the packaging substrate, and further avoid affecting the product yield due to the large expansion and contraction deviation.

[0130] It should be noted that the method of the embodiment of the present disclosure can be executed by a single device, such as a computer or a server. The method of the embodiment can also be applied to a distributed scenario, and completed by multiple devices cooperating with each other. In this distributed scenario, one of the multiple devices can only execute one or more steps in the method of the embodiment of the present disclosure, and the multiple devices will interact with each other to complete the method.

[0131] It is to be understood that the foregoing description is directed to some embodiments of the disclosure. Other embodiments fall within the scope of the following claims. In some cases, the actions or steps recited in the claims can be performed in a different order and still achieve desirable results. Additionally, processes depicted in the figures do not necessarily require the particular order shown or sequential order to achieve desirable results. In certain implementations, multitasking and parallel processing can be advantageous.

[0132] Based on the same inventive concept, the disclosure also provides a laser processing device of a packaging substrate corresponding to any of the above-mentioned embodiment methods.

[0133] Reference Figure 3 The laser processing device of the packaging substrate comprises:

[0134] The layer number determination module 301 is configured to obtain a packaging substrate to be processed and determine the layer number of the packaging substrate to be processed.

[0135] The first laser processing module 302 is configured to, in response to determining that the layer number is an odd layer, directly perform laser processing on the packaging substrate to be processed in an initial position.

[0136] The second laser processing module 303 is configured to, in response to determining that the layer number is an even layer, rotate the packaging substrate to be processed by a first preset angle, control the packaging substrate to be processed to move from the initial position to an updated position, and perform laser processing on the packaging substrate to be processed in the updated position.

[0137] In some embodiments, the layer number determination module 301 comprises:

[0138] The obtaining unit is configured to obtain a packaging substrate to be processed and substrate processing data.

[0139] The layer number determination unit is configured to convert the substrate processing data into laser machine processing format data, and determine the layer number of the packaging substrate to be processed based on the laser machine processing format data.

[0140] In some embodiments, after determining the layer number of the packaging substrate to be processed based on the laser machine processing format data, the layer number determination module 301 further comprises:

[0141] The change processing unit is configured to perform change processing on the foolproof hole coordinates of the even layer in the laser machine processing format data to obtain updated processing data.

[0142] A storage unit configured to set a machining program name for the updated machining data and store the updated machining data according to a preset storage path.

[0143] In some embodiments, the second laser processing module 303 includes:

[0144] A scanning processing unit configured to perform scanning processing on the to-be-processed packaging substrate to obtain a preset subprogram and a preset master program, wherein the preset subprogram is set to be bound to the laser machine, and the preset master program is set to be bound to the upper plate machine and the lower plate machine.

[0145] A rotation instruction generation unit configured to generate a rotation instruction based on the preset master program and the preset subprogram identifying that the to-be-processed packaging substrate is an even layer.

[0146] A first rotation unit configured to rotate the to-be-processed packaging substrate by a first preset angle based on the rotation instruction, and control the to-be-processed packaging substrate to move from the initial position to an updated position.

[0147] A laser processing unit configured to perform laser processing on the to-be-processed packaging substrate in the updated position.

[0148] A second rotation unit configured to rotate the to-be-processed packaging substrate by a second preset angle, and control the to-be-processed packaging substrate to move from the updated position to the initial position.

[0149] In some embodiments, the device further includes a subprogram configuration module, and the subprogram configuration module includes:

[0150] A subprogram new creation unit configured to create a subprogram by using a manufacturing execution system, and select a preset change item in a change set.

[0151] A first subprogram name setting unit configured to set a first subprogram name in response to determining that the current layer is an odd layer.

[0152] A second subprogram name setting unit configured to set a second subprogram name in response to determining that the current layer is an even layer.

[0153] A subprogram configuration unit configured to configure the created subprogram based on the first subprogram name, the second subprogram name, a product type, a storage path, and a machining program name.

[0154] In some embodiments, the device further includes a master program configuration module, and the master program configuration module includes:

[0155] The mother program new unit is configured to newly create a mother program by using a manufacturing execution system;

[0156] The first mother program name setting unit is configured to set a first mother program name in response to determining that the current layer is an odd layer;

[0157] The second mother program name setting unit is configured to set a second mother program name in response to determining that the current layer is an even layer;

[0158] The mother program configuration unit is configured to configure the newly created mother program based on the first mother program name, the second mother program name, a product type, and a resource configuration name.

[0159] In some embodiments, the rotation instruction generation unit comprises:

[0160] The acquisition sub-unit is configured to acquire a target mother program name from a pre-configured mother program and a target sub-program name from a pre-configured sub-program;

[0161] The rotation instruction generation sub-unit is configured to determine that the packaging substrate to be processed is an even layer and generate a rotation instruction in response to determining that the target mother program name is the second mother program name and the target sub-program name is the second sub-program name.

[0162] For the sake of description, the above apparatus is described in various modules in terms of functions. Of course, the functions of the modules can be implemented in one or more software and / or hardware in the implementation of the present disclosure.

[0163] The apparatus of the above embodiments is used to implement the laser processing method of the packaging substrate in any of the above embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be described here.

[0164] Based on the same inventive concept, the present disclosure also provides an electronic device corresponding to the method of any of the above embodiments, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the laser processing method of the packaging substrate according to any of the above embodiments when executing the program.

[0165] Figure 4 A more specific hardware structure of an electronic device is shown, which can include a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040 are connected to each other through the bus 1050 for communication within the device.

[0166] The processor 1010 can be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an ASIC (Application Specific Integrated Circuit), or one or more integrated circuits, etc., for executing relevant programs to implement the technical solutions provided by the embodiments of the present specification.

[0167] The memory 1020 can be implemented by a ROM (Read Only Memory), a RAM (Random Access Memory), a static storage device, a dynamic storage device, etc. The memory 1020 can store an operating system and other application programs, and when the technical solutions provided by the embodiments of the present specification are implemented by software or firmware, the relevant program codes are stored in the memory 1020 and called and executed by the processor 1010.

[0168] The input / output interface 1030 is configured to connect input / output modules to implement information input and output. The input / output modules can be configured as components in the device (not shown in the figure) or externally connected to the device to provide corresponding functions. The input devices can include a keyboard, a mouse, a touch screen, a microphone, various sensors, etc., and the output devices can include a display, a speaker, a vibrator, an indicator light, etc.

[0169] The communication interface 1040 is configured to connect a communication module (not shown in the figure) to implement communication interaction between the device and other devices. The communication module can realize communication through a wired manner (for example, a USB (Universal Serial Bus), a network cable, etc.) or a wireless manner (for example, a mobile network, WIFI (Wireless Fidelity), Bluetooth, etc.).

[0170] The bus 1050 includes a channel for transmitting information between various components (for example, the processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040) of the device.

[0171] It should be noted that although the above device only shows the processor 1010, the memory 1020, the input / output interface 1030, the communication interface 1040, and the bus 1050, in the specific implementation process, the device can also include other components necessary for normal operation. In addition, those skilled in the art can understand that the above device can also only include components necessary for implementing the solutions of the embodiments of the present specification, and does not necessarily include all the components shown in the figure.

[0172] The electronic device of the above embodiment is used to implement the laser processing method of the corresponding packaging substrate in any of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiment, which are not repeated here.

[0173] Based on the same inventive concept, corresponding to the method of any of the above embodiments, the disclosure also provides a non-transitory computer-readable storage medium storing computer instructions for causing the computer to perform the laser processing method of the packaging substrate as claimed in any of the above embodiments.

[0174] The computer-readable medium of the present embodiment includes permanent and non-permanent, removable and non-removable media, which can be implemented by any method or technology to store information. The information can be computer-readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassette, magnetic tape disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information accessible by a computing device.

[0175] The computer instructions stored in the storage medium of the above embodiment are used to cause the computer to perform the laser processing method of the packaging substrate as claimed in any of the above embodiments, and have the beneficial effects of the corresponding method embodiment, which are not repeated here.

[0176] Based on the same inventive concept, corresponding to the method of any of the above embodiments, the present application also provides a computer program product comprising computer program instructions which, when executed on a computer, cause the computer to perform the laser processing method of the packaging substrate as claimed in any of the above embodiments, have the beneficial effects of the corresponding method embodiment, which are not repeated here.

[0177] It can be understood that before using the technical solutions of various embodiments in the present disclosure, the user will be informed of the type, use range, use scenario, etc. of the personal information involved in a proper manner, and the authorization of the user will be obtained.

[0178] For example, in response to receiving an active request of a user, a prompt information is sent to the user to explicitly prompt the user that the operation requested to be performed will require obtaining and using personal information of the user. Thus, the user can autonomously select whether to provide the personal information to the software or hardware, such as an electronic device, an application program, a server or a storage medium, performing the operation of the technical solution of the present disclosure according to the prompt information.

[0179] As an optional but non-limiting implementation, in response to receiving an active request of a user, the prompt information can be sent to the user in the form of a pop-up window, in which the prompt information can be presented in the form of text. In addition, the pop-up window can also carry selection controls for the user to select "agree" or "disagree" to provide personal information to the electronic device.

[0180] It can be understood that the above notification and obtaining user authorization process is only illustrative, and does not limit the implementation of the present disclosure, and other ways that meet the relevant laws and regulations can also be applied to the implementation of the present disclosure.

[0181] Those skilled in the art will understand that the discussion of any of the above embodiments is merely exemplary and is not intended to suggest that the scope of the present disclosure is limited to these examples; under the idea of the present disclosure, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes of different aspects of the embodiments of the present disclosure as described above, which are not provided in detail for the sake of brevity.

[0182] In addition, in order to simplify the description and discussion, and so as not to make the embodiments of the present disclosure difficult to understand, the known power / ground connections of integrated circuit (IC) chips and other components can or can not be shown in the provided drawings. In addition, the devices can be shown in the form of block diagrams in order to avoid making the embodiments of the present disclosure difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform to be implemented to implement the embodiments of the present disclosure (i.e., these details should be fully within the understanding of those skilled in the art). Where specific details (e.g., circuitry) are set forth in order to describe an illustrative embodiment of the present disclosure, it will be apparent to those skilled in the art that the embodiments of the present disclosure can be practiced without these specific details or with variations on these specific details. Therefore, these descriptions should be considered as illustrative rather than limiting.

[0183] Although the present disclosure has been described in conjunction with specific embodiments thereof, many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) can use the embodiments discussed.

[0184] Embodiments of the present disclosure are intended to cover all such alternatives, modifications, and variations as fall within the broad scope of the present disclosure. Accordingly, any one or more of the above-described features, benefits and alternatives can be included in any addition to the features and benefits of the present disclosure. Accordingly, the disclosure is not to be seen as being limited to the embodiments described herein, but rather is to be interpreted within the scope of the appended claims.

Claims

1. A method of laser processing a package substrate, the method comprising: The method comprises: acquiring a packaging substrate to be processed and determining the layer number of the packaging substrate to be processed; in response to determining that the layer number is an odd number, directly performing laser processing on the packaging substrate to be processed in an initial position; in response to determining that the layer number is an even number, rotating the packaging substrate to be processed by a first preset angle, controlling the packaging substrate to be processed to move from the initial position to an updated position, and performing laser processing on the packaging substrate to be processed in the updated position.

2. The method of claim 1, wherein, The acquisition of the packaging substrate to be processed and the determination of the layer number of the packaging substrate to be processed comprise: acquiring a packaging substrate to be processed and substrate processing data; converting the substrate processing data into laser machine processing format data, and determining the layer number of the packaging substrate to be processed based on the laser machine processing format data.

3. The method of claim 2, wherein, After determining the layer number of the packaging substrate to be processed based on the laser machine processing format data, the method further comprises: performing change processing on the even-layer foolproof hole coordinates in the laser machine processing format data to obtain updated processing data; setting a processing program name for the updated processing data, and storing the updated processing data according to a pre-set storage path.

4. The method of claim 3, wherein, In response to determining that the layer number is an even number, rotating the packaging substrate to be processed by a first preset angle, controlling the packaging substrate to be processed to move from the initial position to an updated position, and performing laser processing on the packaging substrate to be processed in the updated position, the method comprises: performing scanning processing on the packaging substrate to be processed to obtain a pre-configured subprogram and a master program, wherein the pre-configured subprogram is bound and set with a laser machine, and the pre-configured master program is bound and set with an upper plate machine and a lower plate machine; generating a rotation instruction based on the pre-configured master program and subprogram identifying that the packaging substrate to be processed is an even number; rotating the packaging substrate to be processed by a first preset angle based on the rotation instruction, and controlling the packaging substrate to be processed to move from the initial position to an updated position by the upper plate machine; performing laser processing on the packaging substrate to be processed in the updated position by the laser machine; rotating the packaging substrate to be processed by a second preset angle, and controlling the packaging substrate to be processed to move from the updated position to the initial position by the lower plate machine.

5. The method of claim 4, wherein, The pre-configuration process of the subprogram comprises: creating a subprogram by using a manufacturing execution system, and selecting a pre-set change item in a change set; in response to determining that the layer number is an odd number, setting a first subprogram name; in response to determining that the layer number is an even number, setting a second subprogram name; configuring the newly created subprogram based on the first subprogram name, the second subprogram name, a product type, a storage path, and a processing program name.

6. The method of claim 4, wherein, The pre-configuration process of the master program comprises: creating a master program by using a manufacturing execution system; in response to determining that the layer number is an odd number, setting a first master program name; in response to determining that the layer number is an even number, setting a second master program name; The newly created mother program is configured based on the first mother program name, the second mother program name, a product type, and a resource configuration name.

7. The method of claim 4, wherein, The generated rotation instruction includes: The target mother program name is obtained from the pre-configured mother programs, and the target subprogram name is obtained from the pre-configured subprograms; In response to determining that the target mother program name is the second mother program name and the target subprogram name is the second subprogram name, it is determined that the to-be-processed packaging substrate is an even layer, and a rotation instruction is generated.

8. A laser processing apparatus of a package substrate, characterized by, The number of layers determination module is configured to obtain a to-be-processed packaging substrate and determine the number of layers of the to-be-processed packaging substrate; The first laser processing module is configured to, in response to determining that the number of layers is an odd layer, directly perform laser processing on the to-be-processed packaging substrate in an initial position. The second laser processing module is configured to, in response to determining that the number of layers is an even layer, rotate the to-be-processed packaging substrate by a first preset angle, control the to-be-processed packaging substrate to move from the initial position to an updated position, and perform laser processing on the to-be-processed packaging substrate in the updated position. The non-transitory computer readable storage medium stores computer instructions for causing a computer to execute the method of any one of claims 1 to 7.

9. An electronic device, comprising: The non-transitory computer readable storage medium stores computer instructions for causing a computer to execute the method of any one of claims 1 to 7.

10. A non-transitory computer-readable storage medium, comprising: ​

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