Multi-phase interface adhesive, preparation method thereof and cross-medium target transfer system

Abstract

The invention belongs to the field of semiconductor processing equipment, and particularly relates to a multiphase interface adhesive, a preparation method thereof and a cross-medium target transfer system. The multi-phase interface adhesion device comprises an adhesion disc and a gas injection device. The bottom of the adhesion disc is a smooth plane; a through hole penetrating through the top surface and the bottom surface is formed in the center of a disc body; a plurality of annular microgrooves which are distributed at intervals layer by layer from the center to the outside are formed in the bottom surface of the adhesion disc; the surfaces of the microgrooves on the bottom surface of the adhesion disc are lyophobic interfaces, and areas among the microgrooves are lyophilic interfaces; a gas outlet of the gas injection device is communicated with the through hole along the top of the adhesion disc. In the state that the surface of the adhesion disc is stained with a specified liquid-phase medium, the adhesion disc is attached to the surface of the target object, and micro-pressure with the specified size is applied to complete adhesion; and in the adhesion state, gas is injected into the through hole through the gas injection device so that the target object can be separated from the adhesion disc. The scheme provided by the invention has the advantages of high response speed, high reliability, good repeatability and easiness in operation, thereby having a wide application prospect.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor processing equipment, specifically relating to a multiphase interface adhesive and its preparation method, as well as a cross-medium target transport system. Background Technology

[0002] With the continuous development of semiconductor processes and the ongoing evolution of micro-nano manufacturing technologies, achieving high-precision and high-efficiency transfer and manipulation of devices in multi-medium environments (such as air, water, and flexible substrates) has become a key technological challenge in chip packaging, advanced testing, flexible electronics, and microsystem assembly.

[0003] Currently, various methods are widely used in the reversible transfer and manipulation of semiconductor devices, micro / nano chips, and flexible components. The most common include dry adhesion, electrostatic adsorption, shape memory material controlled adsorption, and polymer stamp transfer technology. Dry adhesion employs a gecko-like biomimetic principle, utilizing van der Waals forces between the biomimetic dry adhesion structure and the interface to generate strong adhesion to different materials and surfaces. Polydimethylsiloxane (PDMS) microstructure stamps utilize surface van der Waals forces to achieve temporary adsorption and transfer, exhibiting flexible adaptability. Electrostatic adsorption devices generate adsorption force through voltage regulation, allowing manipulation of surfaces of different materials. Shape memory polymer (SMP) grippers achieve controllable grasping and release through light- or heat-triggered deformation. In addition, thermoresponsive films and magnetostrictive materials are also used for microdevice transfer in specific scenarios.

[0004] However, most of the aforementioned methods rely on external fields (electric, thermal, optical) for activation, which often suffers from slow response speed, high energy consumption, insufficient control precision, and weak reusability. Furthermore, in complex environments or cross-medium environments (such as from air to underwater, or from rigid to flexible), their adhesion stability and release controllability are significantly limited. Summary of the Invention

[0005] To address the problems of slow response speed, low stability, and poor controllability in existing semiconductor transfer and manipulation devices, this invention provides a multiphase interface adhesive and its preparation method, as well as a cross-medium target transfer system.

[0006] The technical solution provided by this invention is as follows:

[0007] A multiphase interface adhesive is disclosed for adhering to and releasing a target object with a mirror-like surface in a gas phase or a liquid phase environment composed of a liquid medium of a specified composition. The multiphase interface adhesive includes an adhesion disk and an injection device. The bottom of the adhesion disk is a smooth plane, and a through-hole penetrating the top and bottom surfaces is provided in the center of the disk. The bottom surface of the adhesion disk also has multiple annular microgrooves spaced outwards from the center; the microgrooves are 50–80 μm deep and 0.5–5 mm wide. The surfaces of the microgrooves on the bottom surface of the adhesion disk are hydrophobic, while the regions between the microgrooves are hydrophilic. The outlet of the injection device communicates with the through-hole along the top of the adhesion disk and is used to inject gas into the through-hole.

[0008] In the presence of a specified liquid medium, the adhesion plate is attached to the surface of the target object, and a specified amount of micro-pressure is applied to complete the adhesion. While in the adhesion state, air is injected into the through-hole via an air injection device to detach the target object from the adhesion plate.

[0009] As a further improvement of the invention, a flange for connecting pipes is provided at the position corresponding to the through hole on the top surface of the adhesion plate, or a functional bracket is also provided on the adhesion plate. The air injection device uses an electric air pump, and the air outlet of the electric air pump is detachably and sealed to the flange or functional bracket on the adhesion plate through a hose.

[0010] As a further improvement of the present invention, the bottom surface of the adhesion plate has at least two hydrophobic microgrooves, and each microgroove is a similar pattern with the similarity center located in the center of the adhesion plate.

[0011] As a further improvement of the present invention, the microgroove is circular or has a shape similar to the contour of the mirrored surface of the target object.

[0012] As a further improvement of the present invention, the adhesion disk is made of a single material, either rigid or flexible; or a combination of both. The rigid adhesion disk can be made of quartz glass, borosilicate glass, silicon wafer, sapphire, stainless steel, or polyimide.

[0013] As a further improvement of the present invention, the adhesion disk is provided with a stress sensor for measuring the compressive stress between itself and the target object.

[0014] As a further improvement of the present invention, when the adhesion disk is made of a flexible material, the stress sensor is embedded in the adhesion disk near the bottom surface. When the adhesion disk is made of a rigid material, a groove is provided on the bottom surface of the adhesion disk; the stress sensor is installed in the groove and the bottom of the pressure sensor is flush with the bottom surface of the adhesion disk.

[0015] As a further improvement of the present invention, the multiphase interface adhesive also includes a spraying device for spraying a liquid medium of a specified composition onto one side near the bottom surface of the adhesive pad.

[0016] As a further improvement of the present invention, the spraying device includes a pump body, a storage tank, a pipeline, and an atomizing nozzle. The atomizing nozzle is mounted on an adhesion plate; the pump body is connected to the storage tank and the atomizing nozzle through a pipeline, and is used to pump the liquid medium stored in the storage tank to the atomizing nozzle for atomization and spraying.

[0017] This invention also includes a method for preparing a multiphase interface adhesive, which is used to prepare the multiphase interface adhesive as described above, and the preparation method includes the following steps:

[0018] S1: Obtain the substrate material used to prepare the adhesion disk, process a through hole in the center of the substrate, and then clean the surface.

[0019] S2: Determine whether the mirrored bottom surface of the substrate material needs to be modified to be hydrophilic based on the affinity between the substrate material and the specified medium. If the bottom surface of the substrate material is a natural hydrophilic interface, no modification is required; otherwise, modify it to make it a hydrophilic surface.

[0020] S3: Cover the bottom surface of the substrate material from the previous step with a removable mask.

[0021] S4: Using a femtosecond laser processing system, multiple microgrooves of preset width and depth are processed on the bottom surface of the substrate material from the previous step according to the preset distribution area of ​​the hydrophobic interface.

[0022] S5: After cleaning the substrate material from the previous step, a surface modification treatment is performed using a modifier to make the microgroove area hydrophobic.

[0023] S6: Remove the remaining mask from the bottom surface of the substrate material to obtain the desired adhesion disk.

[0024] S7: Assemble the gas injection device and possibly the liquid spraying device onto the adhesion plate to obtain the desired multiphase interface adhesive.

[0025] As a further improvement of the present invention, the mask in step S3 is a PET film with a thickness of 40 μm.

[0026] As a further improvement of the present invention, each microgroove processed in step S4 has a multi-layered concentric ring structure.

[0027] As a further improvement of the present invention, assuming that the liquid medium of the specified component is water, the surface modification process in step S5 is as follows: the substrate material is immersed in a fluoride hydrophobic reagent for no less than 1 hour.

[0028] The present invention also includes a cross-medium target transfer system for non-contact adsorption and transfer of a target object within the same medium or between different media. The target transfer system includes: a multiphase interface adhesive as described above, a multi-degree-of-freedom transfer robot, and a host computer. The multiphase interface adhesive is mounted at the end effector of the multi-degree-of-freedom transfer robot; the transfer robot is used to adhere the target object via the multiphase interface adhesive and to perform spatial transfer and attitude adjustment.

[0029] The host computer is electrically connected to the transfer robot and the multiphase interface adhesive; and is used for: (1) issuing motion control commands to the transfer robot to adjust the spatial position and attitude of the multiphase interface adhesive to achieve the adhesion and spatial transfer of the target object. (2) issuing commands to the air injection device to control the air injection device to inject air into the through hole of the adhesion plate to release the adhered target object.

[0030] As a further improvement of the present invention, the host computer is also electrically connected to the spraying device and is used to issue instructions to the spraying device to spray a liquid medium of a specified composition onto the surface of the adsorption plate before adhering to the target object.

[0031] As a further improvement of the present invention, the host computer is also used to acquire the detection signal of the pressure sensor in order to monitor the compressive stress value between the adhesion plate and the target object in real time.

[0032] As a further improvement of the present invention, the cross-medium target transport system realizes the transfer of target objects between liquid phases and the transfer of target objects from a liquid phase environment to a gas phase environment as follows:

[0033] (a) Drive the transfer robot to move the multiphase interface adhesive to the gripping position according to the preset motion trajectory.

[0034] (b) Attach the bottom of the adhesive pad to the surface of the target object to be adhered and apply a specified amount of micro-pressure to complete the adhesion.

[0035] (c) Drive the transfer robot to move the target object to the release position.

[0036] (d) Drive the gas injection device in the multiphase interface adhesive to inject gas into the through hole so that the target object detaches from the adhesive disk.

[0037] As a further improvement of the present invention, the cross-medium target transport system realizes the transfer of target objects between gas phases and the transfer of target objects from a liquid-gas phase environment to a liquid phase environment as follows:

[0038] (A) Drive the transfer robot to move the multiphase interface adhesive to the gripping position according to the preset motion trajectory.

[0039] (B) After attaching the bottom surface of the adhesion plate to the surface of the target object to be adhered, drive the spraying device to spray a liquid medium of a specified composition onto one side of the bottom surface of the adhesion plate.

[0040] (C) Drive the transfer robot to approach the target object and apply a specified amount of micro-pressure to complete the adhesion.

[0041] (D) Drive the transfer robot to move the target object to the release position.

[0042] (E) Drive the air injection device to inject air into the through hole so that the target object is separated from the adhesion plate and the transfer is completed.

[0043] As a further improvement of the present invention, the cross-media target transfer system also includes an environmental sensing component; the environmental sensing component includes one or more of a camera, a distance sensor, and a depth camera. A host computer is electrically connected to the environmental sensing component and is used to identify all objects and their spatial positions within the current working environment based on the data collected by the environmental sensing component, thereby enabling the identification, grasping, transfer, and release of the target object.

[0044] The technical solution provided by this invention has the following beneficial effects:

[0045] This invention utilizes three technical routes—femtosecond laser processing, chemical modification, and mechanical gas injection—to design a multiphase interface adhesive that combines high-speed release, cross-medium adaptability, long lifespan, wear resistance, and high-precision processing capabilities. It enables efficient, reversible, cross-medium adhesion and transfer of semiconductor devices without the need for electrical or thermal fields. The multiphase interface adhesive provided by this invention involves covering a glass or rigid substrate surface with a mask and then using a femtosecond laser to process a precise micro-concave structure on the surface. Subsequently, fluoride treatment is applied to partially annular regions to achieve hydrophobicity, forming a wetting pattern with multiple alternating hydrophilic and hydrophobic rings. The annular groove structure forms hydrophobic regions to protect hydrophilic regions. This alternating phase structure enhances the stability of the gas-liquid interface and capillary force, thus achieving stable adhesion after device bonding without the need for an external field. When the target device needs to be released, simply injecting gas via a mechanical pump to disrupt the liquid bridge structure allows for rapid release of the target device with an extremely fast response speed.

[0046] The product provided by this invention achieves non-contact adsorption of target devices through a liquid bridge structure formed by gas-liquid interface stability and capillary force, thereby avoiding damage to the target devices during the "grabbing" and transport processes. The modified hydrophobic region formed by multi-layered grooves processed by femtosecond laser in the multiphase interface adhesive not only improves the reliability of the liquid bridge structure and ensures the stability of the adhesion effect, but also avoids material wear during repeated use, thus improving the product's lifespan.

[0047] In summary, the solution provided by this invention has advantages such as strong structural programmability, stable adhesion performance, fast release response, and multiple cycles of use. It is particularly suitable for non-destructive picking, precise positioning, and high-throughput testing of semiconductor chips, micro-nano sensors, and other devices in different environments such as air and underwater, significantly improving the manipulation capability of micro-nano devices in complex environments. Attached Figure Description

[0048] Figure 1 This is a schematic diagram of the multiphase interface adhesive provided in Embodiment 1 of the present invention.

[0049] Figure 2 A schematic diagram of the structure of the functional support used in the multiphase interface adhesive.

[0050] Figure 3 This is a schematic diagram illustrating the fabrication process of the adhesion disc in a multiphase interface adhesive.

[0051] Figure 4 This is a flowchart of the preparation method of the multiphase interface adhesive provided in Embodiment 2 of the present invention.

[0052] Figure 5 A diagram of the femtosecond laser processing system used to fabricate multiphase interface adhesives.

[0053] Figure 6 This is a schematic diagram illustrating the operational principle of the cross-media target transfer system provided in Embodiment 3 of the present invention.

[0054] Figure 7 This is an experimental flowchart for testing the durability of a multiphase interface adhesive during the experiment.

[0055] Figure 8 This is a curve showing the change in adhesion performance of the multiphase interface adhesive during a wear-resistant cycle test in the test experiment.

[0056] Figure 9 Figure 1 shows the test results of the response characteristics of the adhesion and release process of the multiphase interface adhesive in different media.

[0057] Figure 10 This image shows the test results of a multiphase interface adhesive adhering to different materials in air. Detailed Implementation

[0058] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0059] Example 1

[0060] This embodiment provides a multiphase interface adhesive for adhering to and releasing a target object with a mirror-like surface in a gas phase or a liquid phase environment composed of a liquid medium of specified components. Specifically, as Figure 1 As shown, the multiphase interface adhesive includes an adhesion disk and an injection device. The adhesion disk has a smooth, flat bottom and a through-hole penetrating both the top and bottom surfaces at its center. The bottom surface of the adhesion disk also has multiple annular microgrooves spaced outwards from the center. The surfaces of the microgrooves on the bottom surface of the adhesion disk are hydrophobic, while the areas between the microgrooves are hydrophilic. The outlet of the injection device connects to the through-hole along the top of the adhesion disk and is used to inject gas into the through-hole.

[0061] Based on the above structure, it can be seen that the surface of the adhesion disk in this embodiment forms a special interface composed of multiple annular hydrophobic and hydrophilic regions arranged in alternating inner and outer concentric rings. In practical applications, when a specified liquid phase medium is applied to the surface of the adhesion disk, this liquid phase medium will be evenly distributed in the hydrophilic regions of different concentric rings. Next, the adhesion disk is attached to the surface of the target object, and then a specified amount of micro-pressure is applied and then removed, so that the excess liquid phase medium and gas between the adhesion disk and the target object will be expelled. At this time, on the surface of the adhesion disk, all hydrophilic interfaces are in indirect contact with the target object through a thin liquid film; while a low-pressure area close to a vacuum is formed between the hydrophobic interfaces and the surface of the target object. In this state, the adhesion disk can stably "adhere" to the target object by means of the liquid bridge adsorption mechanism induced by interfacial capillary force. Specifically, in the adhesion state, the multiple alternating hydrophilic regions form stable liquid bridges to provide adhesion force, while the hydrophobic regions surrounding each hydrophilic region maintain the integrity of the gas-liquid interface, inhibit the diffusion of liquid phase components, and enhance structural stability.

[0062] In practical applications, the multiphase interface adhesive of this embodiment can "suspend" the target object below the adhesion plate through adhesion. The adhesion force between the two is provided by the liquid bridge structure formed within the gas-liquid interface. When the adhesion force provided by the liquid bridge structure is greater than the weight of the target object, the target object can be stably adhered without spontaneous detachment. When the multiphase interface adhesive provided in this embodiment is in the adhesion state, if it is necessary to release the target object below the adhesion plate, air can be injected into the through hole through the air injection device to detach the target object from the adhesion plate. The working principle of air injection detachment is as follows: when the air injection device injects air into the bottom side through the through hole in the center of the adhesion plate, the central pressure in the area between the adhesion plate and the target object rapidly increases and diffuses outward. During this process, when the central pressure is higher than the critical pressure for maintaining the liquid bridge structure, the injected gas will break through each layer of liquid film layer by layer, thereby destroying the liquid bridge structure between the adsorption plate and the target object, and the adsorption force disappears. At this time, under the action of gravity, the target object will naturally detach from the adhesion plate.

[0063] In the aforementioned "adhesion-release" process, the formation of the liquid bridge structure depends on the specially distributed hydrophobic and hydrophilic interfaces on the surface of the adhesion disk. When the liquid bridge structure is disrupted, only the liquid medium between the two is blown away; the interfacial properties of the bottom surface of the adhesion disk are not affected. Therefore, by continuing to apply a liquid medium of a specified composition to the surface of the adhesion disk and bringing the adhesion disk close to the target object, the aforementioned leaf bridge structure can be reformed between them. Thus, the multiphase interface adhesive provided in this embodiment has good reusability and can function through multiple adhesion-release cycles without failing due to an increase in the number of adhesion cycles.

[0064] Further analysis reveals that this multiphase interface adhesive only requires a pre-tightening force to form a liquid bridge structure to achieve the adhesion effect; afterwards, it maintains a stable adhesion effect without any additional energy consumption, thus exhibiting low power consumption. Furthermore, during the adhesion process, the target object and the adhesion disk achieve a non-contact connection through the liquid bridge structure. Therefore, this "air-free" adsorption method minimizes damage to the target object's surface, making it particularly suitable for gripping and transferring precision products such as semiconductor devices, demonstrating significant advantages. Finally, the multiphase interface adhesive of this embodiment achieves adhesion and detachment of the target object through two methods: one relies on the liquid bridge structure formed by applying a pre-tightening force, and the other relies on the gas injection action to destroy the liquid bridge structure. Both operations have very rapid response times, thus meeting the practical needs of relevant engineering fields.

[0065] In summary, the hierarchical liquid bridge design formed by multiple hydrophilic and hydrophobic rings in this embodiment allows for easy, step-by-step destruction of the liquid bridges, avoiding energy waste caused by the "instantaneous peak" of the overall adhesion force. The gas-injection desorption method employs directional gas propagation from the inside out, destroying the gas and liquid bridges layer by layer, thus improving the destruction efficiency of the bubble-liquid bridge interface. This centrally diffused airflow path also features short channels and low inertia, resulting in extremely low gas transmission resistance and ensuring a pressure response with virtually no delay. Overall, the multiphase interface adhesive provided in this embodiment not only significantly outperforms traditional adhesion structures in terms of mechanical durability but also allows for rapid release at a speed of <50ms, meeting the stringent requirements of "instant placement, precise and non-destructive" operation in scenarios such as high-speed sorting of semiconductor chips, online testing, and microsystem assembly.

[0066] When the solution of this embodiment is applied to the adhesion and transport of semiconductors and similar materials, the liquid medium mentioned above can be pure water such as distilled water or deionized water. Correspondingly, the liquid-phobic and liquid-philic interfaces in the adhesion disk are hydrophobic and hydrophilic interfaces, respectively. In this case, the multiphase interface adhesive can achieve adsorption and desorption of the target material in an aqueous environment, as well as in air. It can also achieve adsorption of the target material in an aqueous environment and desorption in air, or adsorption of the target material in air and desorption in an aqueous environment. Specifically, when adsorbing the target material in air, an appropriate amount of water needs to be applied to the surface of the adhesion disk to form the required liquid bridge structure; however, when adsorbing the target material in water, no additional water application to the adhesion disk is required.

[0067] In this embodiment, to form the required liquid bridge structure, at a minimum, only one annular hydrophilic region and two hydrophobic regions located on the bottom surface of the adhesion disk are needed. Therefore, the bottom surface of the adhesion disk in this embodiment contains at least two hydrophobic microgrooves. In practical applications, more hydrophobic microgrooves are acceptable, as more hydrophobic regions can divide a wider hydrophilic region into multiple narrower hydrophilic regions, forming a multi-layered liquid bridge structure with internal and external distribution. Forming multiple narrower liquid bridge structures between the adhesion disk and the target object offers significantly better stability and reliability compared to forming a single wider liquid bridge structure, making it less susceptible to damage from external forces. For example, with a single liquid bridge structure, simply disrupting the water film at any point in the outer hydrophobic region can disable the adsorption of the multiphase interface adhesive; this limitation does not exist in multi-layered liquid bridge structures. However, the number of microgrooves should not be excessive, as too many microgrooves will reduce the area ratio of the hydrophilic region in the adhesion disk, thereby decreasing the total adhesion force provided by each liquid bridge structure.

[0068] It should be further noted that, for the multiphase interface adhesive of this embodiment to function, it is only necessary for the bottom surface of the adhesion disk to have a special interface consisting of alternating annular hydrophobic and annular hydrophilic regions; it is not necessary for the hydrophobic or hydrophilic regions to be concave. However, considering that natural materials with such a specific interface do not exist in nature, it is necessary to locally modify the hydrophilic interface to be hydrophobic, or vice versa. To prevent the modified layer in the modified region from wearing down and failing during actual application, this embodiment chooses to place the hydrophobic region, which requires modification to form, within an annular microgroove. In this state, even if the pre-tightening force applied each time the liquid bridge structure is formed causes a certain degree of contact friction between the adhesion disk and the target object, it will not cause wear to the hydrophobic modified layer formed in the microgroove. In addition, the groove structure can also be surface roughened to further improve the adhesion strength of the hydrophobic modified layer, thereby enhancing the reliability of this special interface in actual application. To achieve the above technical effects, the microgroove depth is set to 50–80 μm, and the width is 0.2–10 mm.

[0069] In this embodiment, to ensure a more uniform distribution of the adsorption effect provided by the formed liquid bridge structure and thus improve the reliability of the connection between the target object and the adhesion disk, the hydrophilic region between adjacent microgrooves should be of equal width everywhere. To achieve this effect, the shape of each microgroove on the surface of the adhesion disk can adopt a similar shape, with the similarity center located at the center of the adhesion disk. That is, the microgrooves on the outer layer are obtained by proportionally enlarging the microgrooves on the inner side with the center of the adhesion disk as the similarity center, and the distance between adjacent microgrooves is equal everywhere.

[0070] In this embodiment, to form the desired liquid bridge structure, it is sufficient that both the hydrophobic and hydrophilic regions in different layers are annular. There are no special requirements for the shape or pattern of these regions; in practical applications, easily manufactured annular shapes can be used. However, for certain target objects with specific shapes, annular shapes may not fully utilize the space on the bottom surface of the adhesion disk and achieve the best adhesion effect. In this case, the microgrooves should adopt a shape similar to the contour of the mirrored surface of the target object. For example, if the target object has a square, smooth plane for adsorption, then the hydrophilic and hydrophobic regions on the surface of the adhesion disk should also be distributed in a similar square annular pattern. In this case, the liquid bridge area formed between the two is the largest, and the adsorption effect is the strongest.

[0071] In practical applications, the adhesion disc is mainly made of materials such as quartz glass, borosilicate glass, silicon wafers, sapphire, stainless steel, and polyimide. Most of these materials have high hardness and mechanical strength, strong thermal stability, are not easily deformed during use, have high structural stability, and are easy to process.

[0072] In practical use, a flange or functional bracket for connecting pipes can be installed at the position corresponding to the through hole on the top surface of the adhesion plate. In this state, the air injection device can be an electric air pump, and the air outlet of the electric air pump is detachably and sealed to the flange or functional bracket on the adhesion plate through a hose. In this state, simply starting the air pump will complete the air injection to detach the target object from the adhesion plate. When the air pump is turned off, the air pressure at the through hole remains constant, maintaining a stable adhesion effect.

[0073] In practical applications, to facilitate the mounting of the adhesion disc on its moving mechanism, the following methods can also be used: Figure 2 The functional support shown is a horizontally placed T-shaped structure. The lower parts of the horizontal and vertical rods are hollow, providing a gas channel; the upper part of the vertical rod is solid. By airtightly connecting the support to the top of the adhesion plate and ensuring communication between the lower section of the vertical rod and the through-hole on the adhesion plate, an electric air pump can be connected to the horizontal rod for gas injection, and a moving mechanism connected to the upper section of the vertical rod drives the multiphase interface adhesive to move.

[0074] In practical applications, considering that a certain preload is required between the adhesion pad and the target object when forming a liquid bridge structure, it is necessary to monitor the compressive stress between them in real time to prevent excessive preload from causing cracks in thin substrates (such as wafers). Therefore, the adhesion pad in this embodiment is equipped with a stress sensor for measuring the compressive stress between itself and the target object. When the bottom surface of the adhesion pad is made of a rigid material, a groove is provided on the bottom surface of the adhesion pad; the stress sensor is installed in the groove, and the bottom of the stress sensor is flush with the bottom surface of the adhesion pad.

[0075] Based on the same objective of preventing pressure damage to the target object, the adhesion disk in this embodiment can also be made of certain flexible materials. These flexible materials can undergo slight deformation when in contact with and under pressure on the target object, thereby controlling the stress applied to the target object. Of course, in addition to using fully flexible materials, the adhesion disk can also be designed as a multi-layered stacked structure, with rigid and flexible materials serving as different functional layers, thus simultaneously achieving the advantages of both types of materials. For example, the layer near the bottom of the adhesion disk can be made of a thin sheet with high strength and a certain degree of toughness, while the upper part can be made of flexible materials such as rubber. Furthermore, when part or all of the structure of the adhesion disk is made of flexible materials, stress sensors can be embedded in the flexible structure to measure stress based on the deformation of the flexible structure.

[0076] To address the drawback of the multiphase adhesion device in this embodiment requiring pre-wetting when adhering to the target object in a gaseous environment, this embodiment provides a more optimized solution by incorporating a spraying device within the multiphase interface adhesive. This spraying device is used to spray a liquid medium of a specified composition onto one side of the adhesion disk when needed. In practical applications, the spraying device includes a pump body, a storage tank, pipes, and an atomizing nozzle. The atomizing nozzle is fixedly installed in the adhesion disk; the pump body is connected to the storage tank and the atomizing nozzle via pipes and is used to pump the liquid medium stored in the storage tank to the atomizing nozzle for atomization. Specifically, in a typical embodiment, another through-hole can be provided in the center of the adhesion disk for installing the spraying device. With this assembly method, the liquid medium sprayed from the atomizing nozzle can precisely reach the bottom surface of the adhesion disk.

[0077] Example 2

[0078] Based on the practical example 1, this embodiment further provides a method for preparing a multiphase interface adhesive, which is used to prepare the multiphase interface adhesive in Example 1. In this method, the adhesion disk is the core component, while the gas injection device and liquid spraying device can be replaced by existing equivalent products. Therefore, manufacturing the desired adhesion disk is actually the core step in the entire method for preparing the multiphase interface adhesive. After obtaining the adhesion disk, it is assembled with a customized gas injection device and, if necessary, a liquid spraying device to obtain the desired multiphase interface adhesive.

[0079] In order to prepare the required adhesion disk, this embodiment first processes a corresponding through hole in the center of the quartz glass substrate, and then, as follows: Figure 3 As shown, this embodiment employs a combination of femtosecond laser processing and surface chemical modification to construct a multiphase interface structure with alternating hydrophilic and hydrophobic ring patterns on a quartz glass substrate. Finally, using 3D printing technology, a functional support for clamping and releasing is precisely fabricated on this surface. A flexible tube connects the through-holes in the structure to an external mechanical pump, enabling control of the interfacial gas-liquid state. This functional support, similar to a vacuum suction cup, can be mounted on the upper surface of the adhesion plate and connected to the through-holes on the adhesion plate via a pipe. After assembling all components, a complete multiphase interface adhesive is formed.

[0080] Specifically, such as Figure 4 As shown, the method for preparing a multiphase interface adhesive provided in this embodiment includes the following steps:

[0081] S1: Obtain the substrate material used to prepare the adhesion disk, process a through hole in the center of the substrate, and then clean the surface.

[0082] Specifically, in this embodiment, a custom-made quartz glass disc with a diameter of 20mm can be used as the substrate material. After the required through-hole is machined in the center of the substrate material using a femtosecond laser processing system, it is placed in an ultrasonic cleaner and ultrasonically cleaned with deionized water for 20 minutes to thoroughly remove particulate impurities and organic residues from the surface. After cleaning, it is rinsed with anhydrous ethanol and allowed to air dry or blown dry with nitrogen to obtain a clean and contamination-free processed surface.

[0083] Besides quartz glass, the substrate material in this embodiment can also be borosilicate glass, silicon wafers, sapphire, stainless steel sheets, polyimide (PI), or other materials with high thermal stability and mechanical strength. The alternative materials must meet the requirements of good laser machinability, surface treatment compatibility, and strong structural stability. Of course, certain flexible materials can also be used as the substrate material.

[0084] S2: Determine whether the mirrored bottom surface of the substrate material needs to be modified for hydrophilicity based on the affinity between the substrate material and the specified medium.

[0085] (1) If the bottom surface of the substrate material is a natural hydrophilic interface, no modification treatment is required. (2) Otherwise, it should be modified to make it hydrophilic.

[0086] For example, when silicon wafers are used as the substrate material, they are naturally hydrophilic and do not require surface modification. Hydrophilic modification can be achieved through chemical treatment or through physical means of modifying the surface morphology of the material.

[0087] S3: Cover the bottom surface of the substrate material from the previous step with a removable mask.

[0088] In this embodiment, the mask can be a 40μm thick PET film. Besides PET film, other mask materials can also be peelable materials such as PI film, photoresist, aluminum film, and copper film, provided that the material is easily ablated by the laser and does not cause contamination or residue on the substrate. Furthermore, in practical applications, this embodiment can select a suitable thickness and type of mask material based on the wavelength and pulse width of the processing system.

[0089] S4: Using a femtosecond laser processing system, multiple microgrooves of preset width and depth are processed on the bottom surface of the substrate material from the previous step according to the preset distribution area of ​​the hydrophobic interface.

[0090] like Figure 5As shown, the femtosecond laser processing system used in this embodiment integrates a lifting mirror, an aperture, a beam expander, a semi-reflective membrane, a filter, a 45° mirror pair, and a scanning galvanometer. The laser beam is first lifted to the working height by the mirror, then the aperture limits the beam diameter, and the beam expander enlarges the spot to improve focusing accuracy. After being split by the semi-reflective membrane and the filter controls the beam energy, the beam is oriented by the mirror and enters the galvanometer system, ultimately achieving high-speed, high-precision focusing and scanning processing on the sample surface. The femtosecond laser micro / nano processing system possesses advantages such as stable energy, fine processing, flexible path, and strong system compatibility. It is particularly suitable for high-resolution three-dimensional micro / nano structure processing and functional surface construction of various materials, including glass, silicon, and metal thin films, and is widely used in cutting-edge fields such as micro / nano optical devices, sensors, and semiconductor packaging.

[0091] Of course, in other alternative solutions of this embodiment, if femtosecond laser equipment is unavailable, near-field processing technologies such as picosecond lasers, nanosecond lasers, and ultraviolet laser etching can be used for micro / nano structure fabrication; or traditional microfabrication processes, such as photolithography combined with RIE etching, sandblasting, and wet etching, can be used to construct the required grooves and rough structures. Correspondingly, the pores in the center of the substrate material can be prepared not only by femtosecond laser drilling, but also by mechanical drilling, plasma etching, or mask-assisted etching, as long as the gas channel penetration and flatness meet the gas injection requirements.

[0092] In the practical application of this embodiment, the femtosecond laser processing system creates microgrooves on the substrate material in a multi-layered concentric ring structure. During processing, the laser first ablates the surface of the PET mask to expose a portion of the glass area, and then further irradiates the exposed quartz glass with high-energy pulses to precisely process micro-nano groove structures with a certain depth and roughness on its surface. This process ensures significant wettability selectivity in subsequent chemical modification of the area.

[0093] S5: After cleaning the substrate material from the previous step, a surface modification treatment is performed using a modifier to make the microgroove area hydrophobic.

[0094] For example, assuming the liquid medium for the specified components is water, the substrate material can be immersed in a fluorinated hydrophobic reagent for at least 1 hour. Besides fluorosilanes (such as FOTS and PFOTS), in practical applications, OTS (octyltrichlorosilane), commercial hydrophobic sprays (such as NeverWet), or thermosetting low surface energy polymer solutions can also be used for surface modification. Alternative reagents should possess strong chemical bonding ability, excellent wear resistance, and low surface energy properties.

[0095] In the actual processing, the sample can first be placed in an ultrasonic cleaner for 20 minutes to remove particles and residual contaminants generated during laser processing. Then, the cleaned sample is immersed in a fluoride-based hydrophobic reagent (such as 1H, 1H, 2H, 2H-perfluorooctyltrichlorosilane / hexane solution) at room temperature for 1 hour. Since the femtosecond laser has removed the mask and created a rough structure, hydrophobic molecules preferentially deposit in these micro / nano structure regions, forming a stable hydrophobic coating, thus constructing a hydrophobic concentric ring structure, while the unexposed areas remain covered by the PET mask.

[0096] S6: Remove the remaining mask from the bottom surface of the substrate material to obtain the desired adhesion disk.

[0097] In practical applications, this embodiment primarily uses mechanical peeling to remove the mask from the surface of the hydrophobically modified substrate material. After mask removal, the area between any two adjacent annular microgrooves is the hydrophilic region, and the corresponding area of ​​each annular microgroove is the hydrophobic region. For example, after the sample is soaked in the hydrophobic modifier in the previous step, it is taken out and placed in a 60°C constant temperature oven to dry for 20 minutes to allow the hydrophobic agent to fully solidify. The PET mask in the areas not yet ablated by the laser is carefully peeled off using tweezers, exposing these areas to the air. Since this part of the glass has not undergone hydrophobic treatment, it naturally retains its hydrophilicity, ultimately forming a concentric ring structure interface with alternating hydrophilic and hydrophobic phases on the quartz glass surface.

[0098] S7: Assemble the gas injection device and possibly the liquid spraying device onto the adhesion plate to obtain the desired multiphase interface adhesive.

[0099] For example, this embodiment uses 3D printing technology to print a set such as Figure 2 The functional support shown is compatible with the adhesion disk and includes a sample clamping structure and a gas connection interface. The quartz glass plate with the constructed hydrophilic / hydrophobic micro / nano structure is precisely assembled with the 3D-printed support, and sealed and positioned using O-rings or threads. Thus, the multiphase interface adhesive with a multiphase wettable interface structure is completed.

[0100] Example 3

[0101] Building upon the solutions in Embodiments 1 and 2, this embodiment further provides a cross-medium target transfer system for non-contact adsorption and transfer of target objects within the same medium or between different media. This target transfer system includes: a multiphase interface adhesive as described in Embodiments 1 and 2, a multi-degree-of-freedom transfer robot, and a host computer. The multiphase interface adhesive is installed at the end effector of the multi-degree-of-freedom transfer robot; the transfer robot is used to adhere the target object via the multiphase interface adhesive and to perform spatial transfer and attitude adjustment on it.

[0102] The host computer is electrically connected to the transfer robot and the multiphase interface adhesive; and is used for: (1) issuing motion control commands to the transfer robot to adjust the spatial position and attitude of the multiphase interface adhesive to achieve the adhesion and spatial transfer of the target object. (2) issuing commands to the air injection device to control the air injection device to inject air into the through hole of the adhesion plate to release the adhered target object.

[0103] In a further optimized embodiment, the cross-media target transfer system may also include a liquid spraying device. A host computer is electrically connected to the liquid spraying device and is used to issue commands to the device to spray a liquid medium of a specified composition onto the surface of the adsorption disk before adhering to the target object, depending on the specific application scenario. It should be noted that, in addition to integrating the liquid spraying device into the multiphase interface adhesive, this embodiment may also fix the liquid spraying device with a bracket and place it near the target object to be transferred, spraying liquid onto the surface of the target object or the surface of the adsorption disk before transfer.

[0104] In a further optimized embodiment, the multiphase interface adhesive across media can also integrate a stress sensor, and the host computer is used to acquire the detection signal of the pressure sensor to monitor the compressive stress value between the adhesive disk and the target object in real time.

[0105] Based on the structure and function of the cross-media target transfer system described above, such as Figure 6 As shown, the process of transferring target objects between liquid phases and from a liquid environment to a gaseous environment is as follows:

[0106] (a) Drive the transfer robot to move the multiphase interface adhesive to the gripping position according to the preset motion trajectory.

[0107] (b) Attach the bottom of the adhesive pad to the surface of the target object to be adhered and apply a specified amount of micro-pressure to complete the adhesion.

[0108] (c) Drive the transfer robot to move the target object to the release position.

[0109] (d) Drive the gas injection device in the multiphase interface adhesive to inject gas into the through hole so that the target object detaches from the adhesive disk.

[0110] It should be noted that when applying the solution of this embodiment to actual production scenarios in semiconductor device handling and testing, the cross-medium target transfer system typically needs to grasp the target object at one fixed workstation and transfer it to another fixed workstation. Therefore, the transfer robot only needs to move along a preset trajectory each time it performs a task. Considering the simple working scenario, the posture of the multiphase interface adhesive during movement, the method and force of applying pre-tightening force during adhesion, and the flow rate and volume of air injected during release, etc., can all be determined in advance through extensive testing. Then, the optimal operating parameters are set for the cross-medium target transfer system based on the test results.

[0111] Accordingly, the cross-medium target transport system realizes the transfer of target objects between gas phases and from liquid-gas phase environments to liquid phase environments as follows:

[0112] (A) Drive the transfer robot to move the multiphase interface adhesive to the gripping position according to the preset motion trajectory.

[0113] (B) After attaching the bottom surface of the adhesion plate to the surface of the target object to be adhered, drive the spraying device to spray a liquid medium of a specified composition onto one side of the bottom surface of the adhesion plate.

[0114] (C) Drive the transfer robot to approach the target object and apply a specified amount of micro-pressure to complete the adhesion.

[0115] (D) Drive the transfer robot to move the target object to the release position.

[0116] (E) Drive the air injection device to inject air into the through hole so that the target object is separated from the adhesion plate and the transfer is completed.

[0117] Compared to adhering targets in a liquid environment, as described above, when adhering targets in a gaseous environment, a cross-medium target transfer system needs to actively spray a liquid medium onto the interface between the equipment and the target.

[0118] Furthermore, in a further optimized embodiment, the cross-medium target transfer system may also include an environmental perception component; this component includes one or more of a camera, a distance sensor, and a depth camera. A host computer is electrically connected to the environmental perception component and is used to identify all objects and their spatial locations within the current working environment based on data collected by the component, thereby achieving accurate identification, grasping, transfer, and release of the target object. By configuring an environmental perception component for the cross-medium target transfer system in this embodiment, the system can be adapted to more diverse working scenarios. Combined with information collected by the environmental perception component, the host computer can control the device to flexibly adjust its operating parameters, rather than performing transfer tasks in a fixed scenario according to preset parameters. This expands the practical value of the relevant equipment in diverse and complex environments.

[0119] Test Experiment

[0120] To verify the performance of the multiphase interface adhesive and cross-mechanism transfer and release system provided by this invention, technicians fabricated corresponding samples and conducted a number of tests on the fabricated samples. The experimental content and results are as follows:

[0121] I. Durability Testing

[0122] To systematically evaluate the mechanical stability and durability of multiphase interface adhesives in practical applications, such as Figure 7 As shown, this experiment subjected the device to various physical damage tests, including sandpaper abrasion, repeated finger rubbing, and repeated tape peeling. During the tests, the device surface was subjected to friction of different intensities and methods to simulate the external disturbances it might encounter in typical environments (such as manual operation, surface contact, and repeated use).

[0123] The results show that after completing the series of wear resistance tests, the device was still able to stably adhere to a 20g standard weight. This indicates that its adhesion structure retains good functionality even after experiencing physical friction.

[0124] This experiment further used 800-grit sandpaper to conduct a constant-frequency, constant-pressure reciprocating friction test on the surface of the device, and recorded the changes in its adhesion properties within the friction cycle. The test results were then plotted as follows: Figure 8 The adhesion effect wear resistance cycle test curve is shown. Analysis of the data in the figure shows that even after about 10,000 friction cycles, the adhesion force of the multiphase interface adhesive remains at the initial level without significant decay. This fully verifies the excellent wear resistance of the structure under long-cycle, high-frequency working conditions.

[0125] II. Response Characteristic Test

[0126] In addition to its excellent wear resistance, this multiphase interface adhesive also possesses the significant advantages of ultra-fast and controlled release. This experiment tested the response characteristics of the device during the release phase. Figure 9 As shown, when the gas injection device is activated, a high-speed airflow first enters the center of the hydrophilic-hydrophobic interface through the through-hole, forming a local high-pressure bubble. Subsequently, the bubble diffuses outward from the center, merging with the liquid bridges formed by the surrounding hydrophilic area in successive rings, thereby destroying the integrity of each level of liquid bridge. As the capillary negative pressure is rapidly counteracted by the gas pressure, the originally firm adhesion interface instantly becomes unstable, and the two contact surfaces detach within milliseconds.

[0127] Experimental results show that by adjusting the gas injection flow rate and pressure, the release response time can be optimized to <50ms, which is much faster than common reversible adhesion methods such as electrostatic adsorption, shape memory polymer release, or thermo-optic triggering (which typically require hundreds of milliseconds to several seconds).

[0128] The speed advantage of the present invention stems primarily from the following three points:

[0129] (1) Hierarchical liquid bridge design - The multi-ring hydrophilic and hydrophobic structure makes the liquid bridge easy to be destroyed step by step, avoiding energy waste caused by the "instantaneous peak" of the overall adhesion force.

[0130] (2) Gas-liquid synergistic boundary breaking mechanism: gas propagates directionally from the inside to the outside, destroying gas bridges and liquid bridges layer by layer; thus improving the destruction efficiency of the bubble-liquid bridge interface.

[0131] (2) Short channel, low inertia structure - the glass substrate is thin, the diameter of the through hole is small, and the gap between adjacent hydrophobic zones is narrow, which makes the transmission resistance of the gas injected along the center extremely low, ensuring a pressure response with almost no delay.

[0132] III. Generality Testing

[0133] To further verify the adaptability and versatility of the multiphase interface adhesive on different material surfaces, this experiment conducted handling and transfer tests on various typical material surfaces in an air environment. For example... Figure 10 As shown, the experimental objects cover a variety of material types, from rigid to flexible, from conductor to insulator, and from smooth to rough, including smooth glass, silicon wafers, PDMS films, epoxy resin, fluorescent surfaces, aluminum sheets, copper sheets, rough glass, Mini LED chips, and flexible heating films.

[0134] During testing, the device consistently achieved stable adhesion, smooth extraction, and residue-free release, completing the entire transport process without pretreatment or additional external fields. The results demonstrate that this multiphase interface structure is not only suitable for common inorganic materials (such as glass, silicon, and metals), but also well-suited for flexible polymers, device surface microstructures, and even microelectronic components, exhibiting excellent surface adhesion and broad material compatibility.

[0135] This high degree of material versatility stems from the synergistic effect of liquid bridge-induced adhesion and enhanced stability of the hydrophilic-hydrophobic multi-loop interface in this structure, enabling it to maintain efficient adsorption capacity when facing target objects with different surface energies, roughnesses, and morphologies. Simultaneously, the mechanical gas injection and release mechanism ensures non-destructive separation of the target object, making it particularly suitable for devices requiring high surface cleanliness and integrity, such as optoelectronic components, flexible sensors, and microchips.

[0136] In summary, the multiphase interface adhesive and cross-medium target transport system provided in this embodiment have broad application prospects in many fields such as microelectronics manufacturing, flexible device packaging, microsystem integration, precision handling and biological sample manipulation due to their excellent material compatibility, non-selective adsorption capacity, rapid response characteristics and repeatability.

[0137] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A multiphase interface adhesive for adhering to and releasing a target object with a mirror-like surface in a gas phase or a liquid phase environment composed of a liquid medium of specified components; characterized in that, It includes an adhesion plate and an air injection device; the bottom of the adhesion plate is a smooth plane and a through hole is provided in the center of the plate, penetrating the top and bottom surfaces; the bottom surface of the adhesion plate is provided with multiple annular microgrooves distributed layer by layer from the center outward; the depth of the microgrooves is 50–80 μm and the width is 0.2–10 mm; the surface of the microgrooves on the bottom surface of the adhesion plate is a hydrophobic interface, and the area between the microgrooves is a hydrophilic interface; the air outlet of the air injection device is connected to the through hole along the top of the adhesion plate. In the presence of a specified liquid medium, the adhesion disk is attached to the surface of the target object, and a specified amount of micro-pressure is applied to complete the adhesion. In the adhesive state, air is injected into the through hole through the air injection device to detach the target object from the adhesive plate.

2. The multiphase interface adhesive as described in claim 1, characterized in that: The top surface of the adhesive tray is provided with a flange for connecting pipes at the position corresponding to the through hole, or the adhesive tray is also provided with a functional support. The air injection device uses an electric air pump, and the air outlet of the electric air pump is detachably and sealed to the flange or functional bracket on the adhesion plate via a hose.

3. The multiphase interface adhesive as described in claim 2, characterized in that: In the bottom surface of the adhesion disk, there are no fewer than two hydrophobic microgrooves, and each microgroove is a similar pattern with the similarity center located in the center of the adhesion disk. And / or, the microgroove is circular or has a shape similar to the contour of the mirrored surface of the target object.

4. The multiphase interface adhesive as described in claim 3, characterized in that: The adhesion disk is made of a rigid material or a single flexible material; or a combination of flexible and rigid materials. And / or, the material of the adhesion disk is selected from any one of quartz glass, borosilicate glass, silicon wafer, sapphire, stainless steel, and polyimide; And / or, the adhesion disk is provided with a stress sensor for measuring the compressive stress between itself and the target object; And / or, when the adhesion disk is made of a flexible material, the stress sensor is embedded in the adhesion disk near the bottom surface; when the adhesion disk is made of a rigid material, a groove is provided on the bottom surface of the adhesion disk; the stress sensor is installed in the groove and the bottom of the pressure sensor is flush with the bottom surface of the adhesion disk.

5. The multiphase interface adhesive as described in claim 1, characterized in that: It also includes a spraying device for spraying a liquid medium of a specified composition onto one side near the bottom of the adhesion plate. And / or, the spraying device includes a pump body, a storage tank, a pipeline, and an atomizing nozzle; the atomizing nozzle is mounted on an adhesion plate; the pump body is connected to the storage tank and the atomizing nozzle through a pipeline, and is used to pump the liquid medium stored in the storage tank to the atomizing nozzle for atomization and spraying.

6. A method for preparing a multiphase interfacial adhesive, characterized in that: It is used to prepare the multiphase interface adhesive as described in any one of claims 1-5, comprising: S1: Obtain the substrate material used to prepare the adhesion disk, process a through hole in the center of it, and then clean the surface; S2: Determine whether the mirrored bottom surface of the substrate material needs to be modified for hydrophilicity based on the affinity between the substrate material and the specified medium; If the bottom surface of the substrate material is a natural hydrophilic interface, no modification treatment is required; otherwise, it should be modified to make it a hydrophilic surface. S3: Cover the bottom surface of the substrate material from the previous step with a removable mask; S4: Using a femtosecond laser processing system, multiple microgrooves of a preset width and depth are processed on the bottom surface of the substrate material from the previous step according to the preset distribution area of ​​the hydrophobic interface. S5: After cleaning the substrate material from the previous step, a surface modification treatment is performed using a modifier to make the microgroove area hydrophobic. S6: Remove the remaining mask from the bottom surface of the substrate material to obtain the desired adhesion disk; S7: Assemble the gas injection device and / or liquid spraying device onto the adhesion plate to obtain the desired multiphase interface adhesive.

7. The method for preparing a multiphase interface adhesive as described in claim 6, characterized in that: The mask used in step S3 is a 40μm thick PET film; And / or, the microgrooves processed in step S4 are in the form of a multi-layered concentric ring structure; And / or, assuming the liquid medium of the specified component is water, then in step S5, the surface modification process is as follows: the substrate material is immersed in a fluoride hydrophobic reagent for no less than 1 hour.

8. A cross-medium target transport system for achieving non-contact adsorption and transfer of a target object within the same medium or between different media; characterized in that, It includes: The multiphase interface adhesive as described in any one of claims 1-5; Multi-degree-of-freedom transport robot; The multiphase interface adhesive is installed at its end, and the transfer robot is used to adhere the target object through the multiphase interface adhesive and to transfer and adjust its attitude. The host computer is electrically connected to the transfer robot and the multiphase interface adhesive and is used to: (1) issue motion control commands to the transfer robot to adjust the spatial position and attitude of the multiphase interface adhesive in order to achieve the adhesion and spatial transfer of the target object; (2) issue commands to the air injection device to control the air injection device to inject air into the through hole of the adhesion plate to release the adhered target object. And / or, the host computer is also electrically connected to the spraying device and is used to issue instructions to the spraying device to spray a liquid medium of a specified composition onto the surface of the adsorption plate before adhering to the target object; And / or, the host computer is also used to acquire the detection signal of the pressure sensor in order to monitor the compressive stress value between the adhesion disk and the target object in real time.

9. The cross-medium target transfer system as described in claim 8, characterized in that: The current process of transferring target substances between liquid phases, and from a liquid environment to a gaseous environment, is as follows: (a) Drive the transfer robot to move the multiphase interface adhesive to the gripping position according to the preset motion trajectory; (b) Attach the bottom surface of the adhesive pad to the surface of the target object to be adhered and apply a specified amount of micro-pressure to complete the adhesion; (c) Drive the transfer robot to move the target object to the release position; (d) Drive the gas injection device in the multiphase interface adhesive to inject gas into the through hole so that the target object detaches from the adhesive disk; And / or, in fact, the current process of target object transfer between gas phases, and the transfer of target objects from a liquid-gas phase environment to a liquid phase environment, is as follows: (A) Drive the transfer robot to move the multiphase interface adhesive to the gripping position according to the preset motion trajectory; (B) After attaching the bottom surface of the adhesion plate to the surface of the target object to be adhered, drive the spraying device to spray a liquid medium of a specified composition onto one side of the bottom surface of the adhesion plate. (C) Drive the transfer robot to approach the target object and apply a specified amount of micro-pressure to complete the adhesion; (D) Drive the transfer robot to move the target object to the release position; (E) Drive the air injection device to inject air into the through hole so that the target object is separated from the adhesion plate and the transfer is completed.

10. The cross-medium target transfer system as described in claim 8, characterized in that: It also includes an environmental perception component; the environmental perception component includes one or more of a camera, a distance sensor, and a depth camera; the host computer is electrically connected to the environmental perception component and is used to identify all objects and their spatial positions in the current working environment based on the data collected by the environmental perception component, thereby realizing the identification, grasping, transfer, and release of target objects.

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