Head binding device, mounting method and die bonding equipment

Abstract

The invention relates to a binding head device, a mounting method and die bonding equipment. The binding head device is used for picking up a chip and mounting the chip on a substrate, and comprises a force control detection module, a force control driving module and a mounting module; the force control detection module comprises a reference block, a photoelectric sensor and a signal amplifier, and the signal amplifier is in signal connection with the photoelectric sensor; the mounting module comprises a main shaft and a main shaft seat, the main shaft penetrates through the main shaft seat and can lift relative to the main shaft seat, and the working end of the main shaft is exposed out of the main shaft seat; the top end of the reference block is connected with the force control driving module; the bottom end of the reference block is connected with the transmission end of the main shaft; the photoelectric sensor is arranged on the spindle seat, one end of the photoelectric sensor emitting a light source extends into the spindle seat, the other end of the photoelectric sensor is connected to the signal amplifier, and the photoelectric sensor can emit the light source to the top end face of the reference block. And when the chip is in contact with the substrate, the signal amplifier determines the height variation of the reference block by detecting the light quantity variation reflected and received by the light source.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a head-binding device, a mounting method, and a die bonding device. Background Technology

[0002] Lead bonding devices are indispensable equipment in the integrated circuit packaging process, mainly used for chip picking and placement in the automated chip placement process in the semiconductor industry. Chip picking involves using the nozzle of the lead bonding device to remove the chip from the wafer, while chip placement involves attaching the removed chip to the lead frame. However, existing lead bonding devices struggle to detect proper contact between the chip and the substrate when aligning the chip to the corresponding position on the lead frame. This makes it difficult to ensure uniform placement force and compliance with process requirements, easily leading to chip damage due to overvoltage or poor bonding due to undervoltage during chip picking or placement. Summary of the Invention

[0003] To address the technical problem that existing chip bonding devices are prone to chip damage due to overvoltage or poor bonding due to undervoltage during chip picking or bonding, this invention provides a chip bonding device, a bonding method, and a die bonding device.

[0004] The present invention provides a bonding head device for picking up chips and mounting them onto a substrate. The bonding head device includes a force control detection module, a force control drive module, and a mounting module. The force control detection module includes a reference block, a photoelectric sensor, and a signal amplifier, with the signal amplifier connected to the photoelectric sensor. The mounting module includes a spindle and a spindle seat. The two ends of the spindle are a drive end and a working end, respectively. The spindle passes through the spindle seat and can move up and down relative to the spindle seat. The working end of the spindle is exposed outside the spindle seat. The top end of the reference block is connected to the force control drive module, and the bottom end of the reference block is connected to the drive end of the spindle. The photoelectric sensor is located on the spindle seat, with one end of the photoelectric sensor emitting a light source extending into the interior of the spindle seat. The other end of the photoelectric sensor is connected to the signal amplifier. The photoelectric sensor can emit a light source towards the top surface of the reference block. When the chip contacts the substrate, the signal amplifier determines the height change of the reference block by detecting the change in the amount of light reflected and received by the light source.

[0005] Preferably, the photoelectric sensor is set at an angle θ to the top surface of the reference block, and the light source emitted by the photoelectric sensor is aligned with the middle region of the top surface of the reference block. The angle θ is in the range of 0° < θ ≤ 90°. The photoelectric sensor is one of an optical fiber sensor, a laser rangefinder, a grating sensor, and an infrared sensor.

[0006] Preferably, the force control drive module includes a cylinder body, a proportional valve, and a transmission component. The cylinder body is pneumatically connected to the proportional valve, which controls the cylinder body to work with a certain constant force. The cylinder body abuts against the top of the reference block in a vertical direction through the transmission component, so that the cylinder body and the reference block are connected by transmission.

[0007] Preferably, the mounting module further includes a vertical guide assembly located between the force control drive module and the spindle seat, and the vertical guide assembly is sleeved on the spindle. The vertical guide assembly includes a guide seat, a movable shaft, a guide bearing, and a guide block. The guide seat has a hollow channel extending horizontally. The movable shaft and the guide bearing are located within the hollow channel. The guide bearing is mounted on the movable shaft, and the movable shaft is connected to the spindle. Both the guide bearing and the movable shaft are perpendicular to the spindle. The guide block is fixedly located within the hollow channel and parallel to the spindle. The guide block abuts against the outer ring of the guide bearing, allowing the guide bearing to slide relative to the guide block.

[0008] Preferably, the mounting module further includes a first guide assembly, a bearing assembly, and a nozzle assembly. The first guide assembly and the bearing assembly are arranged along the length direction of the spindle. The nozzle assembly is connected to the working end of the spindle. The spindle seat is provided with a vacuum port for drawing a vacuum for the nozzle assembly. The first guide assembly includes an air bearing and an air bearing seat. The air bearing is sleeved on the spindle, and the air bearing seat is sleeved on the air bearing. The spindle seat is sleeved on the bearing assembly, and the bearing assembly is sleeved on the air bearing seat, to form a first guide fit structure in which the spindle seat, the bearing assembly, the air bearing seat, and the air bearing are sequentially sleeved.

[0009] Preferably, the spindle seat is provided with an air inlet for air intake of the air bearing. The air inlet passes sequentially through the spindle seat, the bearing assembly, and the air bearing seat, and then communicates with the internal air passage of the air bearing. The air inlet and the vacuum inlet are adjacent to each other but not interconnected. The gas of the binding device passes through the interior of the suction nozzle assembly, flows through the interior of the spindle, the reference block, the guide seat, and the air bearing seat, and then communicates with the vacuum inlet. The binding device also includes a rotary drive module, which includes a servo motor and a synchronous pulley assembly. The working end of the servo motor is connected to the spindle via the synchronous pulley assembly. The synchronous pulley assembly includes a first synchronous pulley, a second synchronous pulley, and a synchronous belt. The synchronous belt is simultaneously fitted on the first and second synchronous pulleys. The first synchronous pulley is fitted on the side of the air bearing seat near the working end of the spindle, and the second synchronous pulley is fitted on the working end of the servo motor.

[0010] Preferably, the mounting module further includes a second guide assembly, a bearing assembly, and a nozzle assembly, wherein the second guide assembly and the bearing assembly are arranged along the length direction of the spindle; the second guide assembly includes a spline sleeve and a spline seat, wherein the spline sleeve is fitted onto the spindle, and the spline seat is fitted onto the spline sleeve; the spindle seat is fitted onto the bearing assembly, and the bearing assembly is fitted onto the spline seat, to form a second guide fit structure in which the spindle seat, the bearing assembly, the spline seat, and the spline sleeve are sequentially fitted; the nozzle assembly is connected to the working end of the spindle, and the spindle seat is provided with a vacuum port for drawing a vacuum for the nozzle assembly; the binding head The gas in the device passes through the interior of the nozzle assembly, and after flowing through the interior of the main shaft, the reference block, the guide seat, and the spline seat, it communicates with the vacuum port. The binding head device also includes a rotary drive module, which includes a servo motor and a synchronous pulley assembly. The working end of the servo motor is connected to the main shaft via the synchronous pulley assembly. The synchronous pulley assembly includes a first synchronous pulley, a second synchronous pulley, and a synchronous belt. The synchronous belt is simultaneously fitted onto the first synchronous pulley and the second synchronous pulley. The first synchronous pulley is fitted onto the spline seat on the side near the working end of the main shaft, and the second synchronous pulley is fitted onto the working end of the servo motor.

[0011] Preferably, the mounting module further includes a magnetic spring assembly and a magnetic rod holder. The magnetic spring assembly includes an iron block and a magnetic rod, and the magnetic rod holder is fixedly disposed within the hollow channel. The magnetic rod is connected to the magnetic rod holder, and the iron block is located within the hollow channel, with a gap between the iron block and the magnetic rod. The iron block is provided with a clamping structure, and the iron block is connected to the main shaft through the clamping structure. The iron block is threadedly connected to the movable shaft. The iron block can move relative to the magnetic rod in the vertical direction through magnetic force, driving the main shaft to move synchronously to achieve elastic reset of the main shaft in the vertical direction.

[0012] This invention also provides a mounting method applied to the aforementioned binding head device for mounting chips onto a substrate. The mounting method includes the following steps: pre-setting a mounting threshold for the signal amplifier, the mounting threshold being used to determine whether the external force on the working end of the spindle is excessive; the photoelectric sensor emitting a light source towards the top surface of the reference block; the working end of the spindle picking up the chip; before the chip contacts the substrate, the signal amplifier obtaining a first position of the reference block when it is stationary by detecting the amount of light reflected and received by the light source; obtaining a second position of the reference block when the chip contacts the substrate; the signal amplifier calculating the height change of the reference block based on the first position and the second position, and comparing the height change with the mounting threshold; when the height change does not exceed the mounting threshold, the signal amplifier sending a mounting signal to the force control drive module; the force control drive module driving the spindle to move vertically downwards through the reference block, mounting the chip onto the substrate; when the height change exceeds the mounting threshold, the signal amplifier triggers an alarm.

[0013] The present invention also provides a die bonding device, including a control component, a track component, and a first fixing base. The track component and the first fixing base are arranged side by side. The first fixing base is provided with a dispensing component, a lower vision component, and a mounting component in sequence along its length. A loading component and a unloading component are respectively provided at both ends of the track component. A wafer component is provided on the side of the track component away from the first fixing base. The wafer component and the mounting component are positioned corresponding to each other. The control component is signal connected to the track component, the loading component, the dispensing component, the lower vision component, the wafer component, the mounting component, and the unloading component. The mounting component includes the aforementioned binding head device.

[0014] Compared with the prior art, the head-binding device, mounting method, and die-bonding equipment provided by the present invention have the following advantages: 1. This invention provides a chip-binding device for picking up chips and mounting them onto a substrate. The device includes a force control detection module, a force control drive module, and a mounting module. In the force control detection module, a photoelectric sensor emits a light source to the top surface of a reference block. When the chip contacts the substrate, a signal amplifier detects the change in the amount of light reflected from the light source to determine the change in the height of the reference block, providing real-time feedback on the force applied to the spindle drive end. This non-contact measurement method has high sensitivity and anti-electromagnetic interference characteristics. By detecting the change in the amount of light reflected from the light source before and during chip-substrate contact, the device can detect the chip's position when it contacts the substrate. Furthermore, it provides feedback on the pressure change before and after chip-substrate contact during the mounting process, ensuring that the mounting force at the spindle working end is uniform and meets process requirements, avoiding damage to the chip due to overpressure or poor bonding due to underpressure. The top of the reference block is connected to the force control drive module, and the bottom of the reference block is connected to the drive end of the spindle, ensuring the transmission efficiency and detection accuracy of the mounting pressure.

[0015] It should be noted that existing technologies for detecting chip-substrate contact typically involve placing sensors such as distance sensors or photoelectric sensors on the side of the nozzle. These sensors directly detect changes in nozzle height to determine chip-substrate contact. However, this approach has several drawbacks: First, side-mounting the nozzle occupies actual mounting space, impacting chip mounting efficiency. Second, when mounting multiple chip types, different sizes and lengths of nozzles are required. Each nozzle change necessitates readjusting the sensor's detection reference, affecting the accuracy of nozzle height change detection. This can lead to chip damage due to overvoltage or poor bonding due to undervoltage during chip picking or mounting. Third, the nozzle typically rotates with the spindle. If the nozzle rotates relative to the sensor, the shape of the nozzle's outer surface can affect the detected height change value. Compared with the prior art, the binding device provided in this embodiment of the invention sets a reference block connected to the transmission end of the spindle. A photoelectric sensor emits a light source to the top surface of the reference block, and a signal amplifier detects the change in the amount of light reflected and received by the light source to determine the change in the height of the reference block. This does not occupy the actual mounting space near the working end of the spindle. The detection object is changed from the nozzle to the reference block between the force control drive module and the spindle. It is also not affected by different nozzle types and different outer peripheral surface shapes, thereby ensuring mounting efficiency, improving the detection accuracy when the chip contacts the substrate, and avoiding chip damage due to overvoltage or poor bonding due to undervoltage.

[0016] 2. In the head-binding device provided in this embodiment of the invention, the bottom end of the reference block is connected to the transmission end of the main shaft, so that the reference block has both lifting and rotating movements. The main function of the photoelectric sensor is to determine the lifting position of the reference block. The rotation movement of the reference block following the main shaft will not affect the photoelectric detection. The photoelectric sensor is set at an inclined angle θ with the top surface of the reference block. The inclined angle θ can be an acute angle or a right angle, so that when the reference block is lifted to different positions, the light source of the photoelectric sensor can be illuminated on the top surface of the reference block. The light source emitted by the photoelectric sensor is aligned with the middle area of ​​the top surface of the reference block, which can avoid the irregular deformation of the edge of the reference block from interfering with the signal amplifier when detecting the change in the amount of light reflected and received by the light source. This further ensures the accuracy of detecting the change in the height of the reference block when the chip contacts the substrate. The photoelectric sensor can be a fiber optic sensor, a laser rangefinder sensor, a grating sensor or an infrared sensor, which is smaller in size and has a faster response speed than other sensors.

[0017] 3. In the binding head device provided in this embodiment of the invention, the proportional valve of the force control drive module can control the cylinder body to work with a certain constant force, which enables the binding head to achieve high-speed placement in PTP (Place To Place) mode. The proportional valve does not need to repeatedly output during the placement process, ensuring the stability of the driving force. The cylinder body abuts against the top of the reference block in the vertical direction through the transmission component, which makes the transmission direction of the driving force output by the cylinder body clear and the loss smaller, ensuring that the driving force can be fully applied to the reference block. In conjunction with the force control detection module, it can achieve precise control of the chip placement pressure, which can both expand the adjustable range of the placement pressure and ensure the high precision requirements of the chip placement pressure.

[0018] 4. In the binding device provided in this embodiment of the invention, a vertical guide component is provided between the force control drive module and the spindle seat, and the vertical guide component is sleeved on the spindle to provide guidance for the spindle in the vertical direction; the guide seat is provided with a hollow channel running through the horizontal direction, and the movable shaft, guide bearing and guide block are all located in the hollow channel. The guide bearing is installed on the movable shaft, which is connected to the spindle. The guide block is parallel to the spindle. Through the cooperation of the guide bearing and the guide block, the vertical movement of the spindle can be further precisely guided. By the guide block abutting against the outer ring of the guide bearing, the guide bearing is restricted by the guide block and can only move in the vertical direction and cannot rotate relative to it. Through this design, the spindle can be prevented from deviating in the horizontal direction, while the guide bearing can slide relative to the guide block. The guide bearing can reduce friction during the movement and make the vertical movement of the spindle smoother. The overall structure of the vertical guide component helps to ensure the stability and accuracy of the working end of the spindle in the vertical direction, thereby improving the accuracy of chip mounting.

[0019] 5. In the binding device provided in this embodiment of the invention, the air bearing of the first guide component cooperates with the air bearing seat. Since the air bearing has low friction, the sequential sleeve arrangement of the air bearing seat, the air bearing, and the spindle can reduce the influence of vertical movement resistance on the mounting pressure during the operation of the binding device, thereby improving the accuracy of the mounting pressure of the binding device when placing the chip onto the substrate. After the spindle seat, the bearing assembly, and the air bearing seat are sequentially sleeved, a first guide engagement mechanism is formed, which can provide high-precision guide constraints for the spindle, reduce radial offset when the spindle moves in the vertical direction, and improve the stability of the spindle when performing lifting and rotating actions. The bearing assembly serves as a guide to ensure the accuracy of the rotating action.

[0020] Understandably, the vacuum port on the spindle can draw a vacuum for the nozzle assembly, reducing the impact of the nozzle vacuum path on the placement force control process, thus preventing the nozzle assembly from shifting when picking up and placing chips, and ensuring that the nozzle assembly's chip picking and placement operations are more reliable; the bearing assembly can ensure the sealing of the nozzle vacuum path, ensuring that chip picking and placement operations do not shift.

[0021] 6. In the binding head device provided in this embodiment of the invention, the air inlet can stably supply air to the air bearing, ensuring the normal operation of the air bearing and improving the motion accuracy of the spindle; the air inlet and the vacuum inlet are arranged adjacent to each other but not connected to each other, which can avoid mutual interference between the air intake of the air bearing and the vacuum inlet of the nozzle assembly, ensuring the independence and stability of each airway; the gas of the binding head device passes through the inside of the nozzle assembly, and after flowing through the inside of the spindle, the reference block, the guide seat and the air bearing seat, it connects with the vacuum inlet on the spindle seat. Through this design, the sealing of the vacuum extraction for the nozzle assembly is ensured, so as to ensure the stability of chip adsorption when the nozzle assembly picks up and places chips, and improves the overall stability and reliability of the binding head device; the working end of the servo motor is connected to the spindle drive through the synchronous pulley assembly to drive the spindle to rotate. The structure is compact, and the synchronous belt drive can reduce the vertical size of the binding head device, leaving space for the installation of a downward view camera, making the overall layout of the binding head device more compact.

[0022] 7. In the binding head device provided in this embodiment of the invention, the spline sleeve of the second guide component cooperates with the spline seat. Due to the low friction of the spline sleeve, the sequential arrangement of the spline seat, spline sleeve, and spindle can reduce the influence of vertical motion resistance on the mounting pressure during the operation of the binding head device, thereby improving the accuracy of the mounting pressure of the binding head device in placing the chip onto the substrate. The spline structure formed by the spline sleeve and spline seat helps the spindle transmit torque and reduce offset during movement, improving the reliability of the guide. After the spindle seat, bearing assembly, and spline seat are sequentially arranged, a second guide engagement mechanism is formed, which can provide high-precision guide constraints for the spindle, reduce radial offset when the spindle moves in the vertical direction, and improve the stability of the spindle when completing lifting and rotating actions. The bearing assembly serves as a guide to ensure the accuracy of the rotating action. Understandably, the vacuum port on the spindle seat can draw a vacuum for the nozzle assembly, reducing the impact of the nozzle vacuum path on the placement force control process, thus preventing the nozzle assembly from shifting during chip picking and placement, and ensuring more reliable chip picking and placement operations. The bearing assembly ensures the sealing of the nozzle vacuum path, ensuring that chip picking and placement operations do not shift. The working end of the servo motor is connected to the spindle drive via a synchronous pulley assembly, thereby driving the spindle to rotate. The structure is compact, and the synchronous belt drive reduces the vertical dimensions of the head-binding device, allowing space to be reserved for the installation of a downward-facing camera, making the overall layout of the head-binding device more compact.

[0023] 8. In the binding device provided in this embodiment of the invention, the magnetic spring assembly and the magnetic rod seat are disposed inside the mounting module. The magnetic spring assembly includes an iron block and a magnetic rod. The magnetic rod seat is fixedly disposed in the hollow channel. The main function of the magnetic rod seat is to fix the magnetic rod. In the magnetic spring assembly, the iron block is connected to the main shaft through a clamping structure. At the same time, the iron block is also threadedly connected to the movable shaft so that a magnetic spring is formed between the iron block and the magnetic rod. The relative movement between the iron block and the magnetic rod is realized through magnetic force. The iron block can drive the main shaft to elastically reset in the vertical direction, balancing the weight of the main shaft and the weight of the load on the main shaft. There is a gap between the iron block and the magnetic rod, and they will not contact each other. The non-contact reset method driven by magnetic force can reduce mechanical wear, improve the service life of the binding device, and avoid the influence of the spring reset tension on the bonding force between the chip and the substrate when using traditional springs as the displacement changes.

[0024] 9. This embodiment of the invention also provides a mounting method in which a signal amplifier is connected to a photoelectric sensor. The photoelectric sensor emits a light source before the chip contacts the substrate and during the chip's contact with the substrate. The signal amplifier then detects the amount of light reflected and received by the light source to obtain the position of the reference block. The signal amplifier can calculate the height change of the reference block based on the position change of the reference block. By comparing the height change with a mounting threshold, it can be determined whether the external force on the spindle's working end when picking up the chip and contacting it with the substrate is excessive. When the height change is lower than the mounting threshold, the force control drive module can normally drive the spindle's working end to complete the mounting. When the height change is higher than the mounting threshold, the signal amplifier will issue an alarm to avoid damage to the chip due to excessive force, ensure the mounting quality of the bonding head device, and further reduce the chip scrap rate.

[0025] 10. This embodiment of the invention also provides a die bonding device, which has the same beneficial effects as the head-binding device in the above embodiments. The die bonding device coordinates multiple modules such as the track assembly, feeding assembly, and dispensing assembly through the control component, forming a fully automated production line of "feeding-dust removal and dispensing-inspection-mounting-unloading", which greatly reduces manual intervention and improves production continuity and efficiency. The track assembly and the first fixed seat are arranged side by side, and each functional component is arranged sequentially along the length of the track. The process is clear and the space utilization is high. The linear layout allows the substrate to flow in a straight line without rotation or secondary clamping, improving the overall mounting efficiency. The wafer assembly and the mounting assembly are positioned correspondingly, shortening the chip transfer path and reducing mounting waiting time. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the overall structure of the head-binding device according to an embodiment of the present invention.

[0028] Figure 2 This is a cross-sectional view of the head-binding device according to an embodiment of the present invention, including its internal structure. Figure 1 .

[0029] Figure 3 This is a schematic diagram of the overall framework of the force control drive module in the head-binding device of this invention.

[0030] Figure 4 This is a cross-sectional view of the internal structure of the bonding module in the binding device of this invention, which has an air bearing and an air bearing seat.

[0031] Figure 5 This is a cross-sectional view of the internal structure of the bonding module in the head-binding device of this invention, which has a spline sleeve and a spline seat.

[0032] Figure 6 This is a cross-sectional view of the head-binding device according to an embodiment of the present invention, including its internal structure. Figure 2 .

[0033] Figure 7 This is a schematic flowchart of the mounting method according to an embodiment of the present invention.

[0034] Figure 8 This is a schematic diagram of the layout structure of the die bonding device according to an embodiment of the present invention.

[0035] Figure 9 This is a side view of the track assembly in the die bonding device according to an embodiment of the present invention.

[0036] Figure 10 This is a schematic diagram of the clamping component in the die bonding device according to an embodiment of the present invention.

[0037] Figure 11 This is a schematic diagram of the heating stage in the die bonding equipment of this invention.

[0038] Figure 12 This is a partial structural schematic diagram of the track assembly in the die bonding device according to an embodiment of the present invention.

[0039] Figure 13 This is a schematic diagram of the structure of the lower vision component in the die bonding device according to an embodiment of the present invention.

[0040] Figure 14 This is a partial layout diagram of the die bonding device according to an embodiment of the present invention.

[0041] Figure 15 This is a schematic diagram of the dispensing assembly in the die bonding equipment according to an embodiment of the present invention.

[0042] Figure 16 This is a cross-sectional view of the dust removal head in the die bonding equipment of this embodiment of the invention.

[0043] Figure 17 This is a bottom view of the dust removal head in the die bonding equipment of this embodiment of the invention.

[0044] Figure 18 This is a schematic diagram of the structure of the first fixing seat in the die bonding device of this invention.

[0045] Figure 19 This is a schematic diagram of the mounting component in the die bonding equipment of this invention.

[0046] Figure 20 This is a schematic diagram of the structure of the third fixing plate in the die bonding device of this embodiment of the invention.

[0047] Figure 21 This is a schematic diagram of the structure of the second fixing plate in the die bonding device of this embodiment of the invention.

[0048] Explanation of reference numerals in the attached diagram: 100. Die bonding equipment; 10. Substrate; 1. Dispensing assembly; 11. First base; 111. Horizontal drive; 112. Vertical drive; 113. Mounting bracket; 1131. First mounting plate; 1132. Second mounting plate; 12. Dust removal mechanism; 121. Storage tank; 122. Air pipe; 123. Dust removal head; 1231. Adsorption air path; 1232. Vacuum hole; 1233. Air blowing path; 1234. Air blowing hole; 13. Dispensing mechanism; 131. First vision detector; 132. Dispensing head; 2. Track assembly; 21. First fixing seat; 22. Second fixing seat; 221. First guide rail; 222. Second guide rail; 2221. Drive module; 223. First boss; 224. Limit sensor; 225. Heating table; 2251. First heating zone; 2252. Second heating zone; 2253. Third heating zone; 2254. Vacuum adsorption channel; 226. Fixing base; 2261. Crossbeam; 2262. Pressure block; 227. Third guide rail; 23. Dust removal and dispensing area; 24. Mounting area; 25. Transfer table; 26. Clamping assembly; 261. Clamping base; 262. Fourth drive component; 263. First gripper; 264. Second gripper; 265. First cam; 266. Second cam; 3. Lower vision assembly; 31. Second base; 311. Second vision detector; 312. Third vision detector; 313. Fourth vision detector; 314. Fifth vision detector; 315. Linear drive module; 4. Mounting Assembly components; 41. First fixing plate; 411. First driving component; 412. First slide rail; 413. Fixing bracket; 42. Second fixing plate; 421. Second driving component; 422. Second slide rail; 423. Third driving component; 424. Third slide rail; 425. Clearance groove; 43. Loading mechanism; 44. Placement mechanism; 45. Third fixing plate; 451. First connecting part; 452. Second connecting part; 453. Reinforcing rib; 5. Wafer assembly; 51. Wafer tray; 52. Ejector pin assembly; 6. Loading assembly; 7. Unloading assembly; 8. Control assembly; 9. Binding device; 91. Force control detection module; 911. Reference block; 912. Photoelectric sensor; 913. Signal amplifier; 92. Force control drive module; 92 1. Cylinder body; 922. Proportional valve; 923. Transmission component; 93. Mounting module; 931. Spindle; 932. Spindle seat; 9321. Vacuum inlet; 9322. Air inlet; 933. Vertical guide assembly; 9331. Guide seat; 93311. Hollow channel; 9332. Movable shaft; 9333. Guide bearing; 9334. Guide block; 934. First guide assembly; 9341. Air bearing; 9342. Air bearing seat; 935. Second guide assembly; 9351. Spline sleeve; 9352. Spline seat; 936. Bearing assembly; 9361. Bearing spacer; 937. Nozzle assembly; 938. Magnetic spring assembly; 9381. Iron block; 9382. Magnetic rod; 939. Magnetic rod seat;94. Rotary drive module; 941. Servo motor; 942. Synchronous pulley assembly; 9421. First synchronous pulley; 9422. Second synchronous pulley; 9423. Synchronous belt. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In the embodiments provided by this invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information. It should be understood that "an embodiment" or "one embodiment" mentioned throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in one embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to the invention. In the various embodiments of this invention, it should be understood that the sequence number of the above processes does not necessarily imply a necessary order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this invention. The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, or they may sometimes be executed in reverse order, depending on the functions involved. It is particularly important to note that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0050] Please see Figure 1 and Figure 2This invention provides a chip-binding device 9 for picking up chips and mounting them onto a substrate. The chip-binding device 9 includes a force control detection module 91, a force control drive module 92, and a mounting module 93. The force control detection module 91 includes a reference block 911, a photoelectric sensor 912, and a signal amplifier 913. The signal amplifier 913 is connected to the photoelectric sensor 912. The mounting module 93 includes a spindle 931 and a spindle seat 932. The two ends of the spindle 931 are a transmission end and a working end, respectively. The spindle 931 passes through the spindle seat 932 and can move up and down relative to the spindle seat 932. The working end of 31 is exposed on the spindle seat 932; the top of the reference block 911 is connected to the force control drive module 92, and the bottom of the reference block 911 is connected to the transmission end of the spindle 931; the photoelectric sensor 912 is located on the spindle seat 932, and one end of the photoelectric sensor 912 that emits a light source extends into the interior of the spindle seat 932, and the other end of the photoelectric sensor 912 is connected to the signal amplifier 913. The photoelectric sensor 912 can emit a light source to the top surface of the reference block 911. When the chip contacts the substrate, the signal amplifier 913 determines the height change of the reference block 911 by detecting the change in the amount of light received by the light source reflection.

[0051] The binding head device 9 provided in this embodiment of the invention can be used for chip picking and placement in the automated placement process of the semiconductor industry. The binding head device 9 is applied in applications requiring high-precision chip placement. When picking up and adsorbing chips, it exposes the features that need to be identified, enabling real-time alignment of the chip's surface and placement position identification points during chip placement. Specifically, the placement module 93 includes a spindle 931 and a spindle seat 932. The spindle 931 passes through the spindle seat 932 and can move up and down relative to the spindle seat 932. The working end of the spindle seat 932 is exposed. The working end of the spindle 931 can be connected to nozzles of different specifications to adsorb different types of chips. Through the vertical movement of the spindle 931 and the spindle seat 932, the nozzle at the working end of the spindle 931 can reach the chip picking and placement positions, whereby the nozzle is responsible for picking up, adsorbing, and placing the chip.

[0052] Understandably, the force control detection module 91 includes a reference block 911, a photoelectric sensor 912, and a signal amplifier 913. The photoelectric sensor 912 emits a light source towards the top surface of the reference block 911. When the chip contacts the substrate, the signal amplifier 913 determines the height change of the reference block 911 by detecting the change in the amount of light reflected and received by the light source, and provides real-time feedback on the force on the transmission end of the spindle 931. The non-contact measurement method has the characteristics of high sensitivity and anti-electromagnetic interference. By detecting the change in the amount of light reflected and received by the light source in two cases, before the chip contacts the substrate and when the chip contacts the substrate, the positioning detection when the chip contacts the substrate can be realized. In addition, the pressure change before and after the chip contacts the substrate during the mounting process can be fed back to ensure that the mounting force of the working end of the spindle 931 is uniform and meets the process requirements, avoiding damage to the chip due to overpressure or poor bonding due to underpressure. The top of the reference block 911 is connected to the force control drive module 92, and the bottom of the reference block 911 is connected to the transmission end of the spindle 931 to ensure the transmission efficiency and detection accuracy of the mounting pressure.

[0053] This invention utilizes a photoelectric sensor 912 to detect the chip's contact with the substrate. The specific steps are as follows: A mounting threshold is pre-set for the signal amplifier 913, used to determine whether the external force on the working end of the spindle 931 is excessive. The photoelectric sensor 912 emits a light source towards the top surface of the reference block 911. The working end of the spindle 931 picks up the chip. Before the chip contacts the substrate, the signal amplifier 913 detects the amount of light reflected from the light source to obtain the first position of the reference block 911 when it is stationary. When the chip contacts the substrate, the signal amplifier 913 obtains the second position of the reference block 911. Based on the first and second positions, the signal amplifier 913 calculates the height change of the reference block 911 and compares the height change with the mounting threshold. It then determines whether the height change exceeds the mounting threshold. If the height change does not exceed the mounting threshold, the signal amplifier 913 sends a mounting signal to the force control drive module 92. The force control drive module 92 drives the spindle 931 vertically downwards via the reference block 911, mounting the chip onto the substrate. If the height change exceeds the mounting threshold, the signal amplifier 913 issues an alarm.

[0054] It should be noted that existing technologies for detecting chip-substrate contact typically involve placing sensors such as distance sensors or photoelectric sensors on the side of the nozzle. These sensors directly detect changes in nozzle height to determine chip-substrate contact. However, this approach has several drawbacks: First, side-mounting the nozzle occupies actual mounting space, impacting chip mounting efficiency. Second, when mounting multiple chip types, different sizes and lengths of nozzles are required. Each nozzle change necessitates readjusting the sensor's detection reference, affecting the accuracy of nozzle height change detection. This can lead to chip damage due to overvoltage or poor bonding due to undervoltage during chip picking or mounting. Third, the nozzle typically rotates with the spindle. If the nozzle rotates relative to the sensor, the shape of the nozzle's outer surface can affect the detected height change value. Compared with the prior art, the binding head device 9 provided in this embodiment of the invention has a reference block 911 connected to the transmission end of the spindle 931. The photoelectric sensor 912 emits a light source to the top surface of the reference block 911, and the signal amplifier 913 detects the change in the amount of light reflected and received by the light source to determine the change in the height of the reference block 911. This does not occupy the actual mounting space near the working end of the spindle 931. The detection object is changed from the nozzle to the reference block 911 between the force control drive module 92 and the spindle 931. It is also not affected by different nozzle types and different outer peripheral surface shapes, thereby ensuring mounting efficiency, improving the detection accuracy when the chip contacts the substrate, and avoiding chip damage due to overvoltage or poor bonding due to undervoltage.

[0055] In some embodiments, the signal amplifier 913 may be installed on the side of the binding device 9 away from the spindle seat 932. It is understood that the signal amplifier 913 in this embodiment of the invention can be fixed by a detachable connection such as bolts, threads or clips, and the signal amplifier 913 can be placed according to actual needs. It is only necessary to ensure the accuracy of detecting changes in the amount of light received by the light source reflection and to determine the amount of height change of the reference block 911. The specific implementation of this embodiment cannot be used to limit the invention. Any modifications, equivalent substitutions and improvements made within the principles of the invention should be included within the protection scope of the invention.

[0056] In some embodiments, the photoelectric sensor 912 and the top surface of the reference block 911 are set at an inclined angle θ, and the light source emitted by the photoelectric sensor 912 is aimed at the middle region of the top surface of the reference block 911. In the head-binding device 9 provided in this embodiment of the invention, the bottom end of the reference block 911 is connected to the transmission end of the main shaft 931. The reference block 911 and the main shaft 931 move synchronously, so that the reference block 911 has both lifting and rotating movements. The main function of the photoelectric sensor 912 is to determine the lifting position of the reference block 911. The rotational movement of the reference block 911 following the main shaft 931 will not affect the photoelectric detection.

[0057] Understandably, the photoelectric sensor 912 is tilted relative to the top surface of the reference block 911, with an angle θ between them. The light source emitted by the photoelectric sensor 912 is aligned with the middle area of ​​the top surface of the reference block 911. This avoids the irregular deformation of the edge of the reference block 911 from interfering with the signal amplifier 913 when detecting changes in the amount of light reflected and received by the light source, and further ensures the accuracy of detecting the change in the height of the reference block 911 when the chip is in contact with the substrate.

[0058] In some embodiments, the tilt angle θ ranges from 0° to 90°. Understandably, by setting the tilt angle θ to an acute or right angle, it can be ensured that the light source of the photoelectric sensor 912 illuminates the top surface of the reference block 911 when the reference block 911 is raised or lowered to different positions. In this embodiment, the upper limit position of the reference block 911's raising and lowering is the bottom of the force control drive module 92, and the lower limit position is the transmission end of the main shaft 931; regardless of whether the reference block 911 moves to the upper or lower limit position, the position illuminated by the light source of the photoelectric sensor 912 can be guaranteed, thereby improving the detection accuracy of the force control implemented by the head-binding device 9. In this embodiment, the tilt angle θ is 30°, 45°, or 60°.

[0059] It should be noted that the reference block 911 serves two purposes: firstly, it can detect whether the chip is in contact with the substrate before the bonding head device 9 completes the bonding process; secondly, it enables the transmission of bonding pressure between the force control drive module 92, the reference block 911, and the spindle 931 when the chip is bonded to the substrate at the working end of the spindle 931. Therefore, if the tilt angle θ between the photoelectric sensor 912 and the top surface of the reference block 911 is 0°, that is, the light source emitted by the photoelectric sensor 912 illuminates the top surface of the reference block 911 horizontally, it is difficult to ensure that the light source of the photoelectric sensor 912 continuously illuminates the top surface of the reference block 911 during the bonding pressure transmission process between the force control drive module 92, the reference block 911, and the spindle 931.

[0060] In some embodiments, the photoelectric sensor 912 is one of an optical fiber sensor, a laser rangefinder, a grating sensor, and an infrared sensor. Understandably, the photoelectric sensor 912, in conjunction with the signal amplifier 913, can obtain a signal reflecting position changes. Specifically, in the binding device 9 of this embodiment, this is used to calculate the distance the reference block 911 moves upward when the nozzle actually presses down. The cooperation between the two can also obtain a feedback signal within a range, indicating that the chip and substrate have made contact and are awaiting the next mounting signal. Furthermore, the cooperation can also obtain an overshoot signal when the pressure of the chip when in contact with the substrate exceeds a threshold. This overshoot signal indicates that the chip may be damaged, and to avoid affecting subsequent mounting processes, it is necessary to remind the operator to reset the detection reference of the photoelectric sensor 912 and the signal amplifier 913. In this embodiment, the photoelectric sensor 912 is an optical fiber sensor. The optical fiber sensor emits a light source towards the top surface of the reference block 911, receives the light intensity through reflection from the optical fiber, and transmits it to the signal amplifier 913. The light intensity value displayed on the signal amplifier 913 reflects the position of the reference block 911.

[0061] As an alternative implementation, the sensor in this embodiment of the invention can also be a Hall sensor, a capacitive sensor, or an inductive sensor. When using a Hall sensor, by mounting a magnet on the top surface of the reference block 911, the distance the reference block 911 moves up and down can be measured by the Hall sensor. However, compared to fiber optic sensors, which require the mounting of a magnet, the detection accuracy is relatively low. When using a capacitive sensor or an inductive sensor, only the feedback signal of the contact between the chip and the substrate can be detected, which has limitations.

[0062] Please see Figure 2 and Figure 3 The force control drive module 92 includes a cylinder body 921, a proportional valve 922, and a transmission component 923. The cylinder body 921 is pneumatically connected to the proportional valve 922, which is used to control the cylinder body 921 to work with a certain constant force. The cylinder body 921 abuts against the top of the reference block 911 in the vertical direction through the transmission component 923, so that the cylinder body 921 and the reference block 911 are connected by transmission.

[0063] In the binding head device 9 provided in this embodiment of the invention, the proportional valve 922 of the force control drive module 92 can control the cylinder body 921 to work with a certain constant force, enabling the binding head to achieve high-speed placement in PTP (Place To Place) mode. The proportional valve 922 does not need to repeatedly output during the placement process, which can reduce the mechanical wear of the proportional valve 922 and extend its service life. The constant force output can ensure the driving stability of the cylinder body 921, so that the placement pressure is consistent during batch chip placement, improving the uniformity of batch placement. It can be understood that the cylinder body 921 abuts against the top of the reference block 911 in the vertical direction through the transmission component 923, which can make the transmission path of the driving force output by the cylinder body 921 more direct and the transmission direction more clear, avoiding unnecessary losses caused by the deviation of the force direction of the reference block 911 during the transmission of the driving force, ensuring that the driving force can be fully applied to the reference block 911, thereby reducing the placement position deviation caused by unstable driving force transmission.

[0064] It should be noted that the cylinder body 921, proportional valve 922, and force control detection module 91 work together to achieve precise control of the chip placement pressure. This expands the adjustable range of the placement pressure while ensuring the high precision requirements of the chip placement pressure. The proportional valve 922 can precisely regulate the constant force output by the cylinder body 921, allowing the placement pressure between the chip and the substrate to be adjusted according to the process requirements of different chips, thus adapting to the process requirements of different types of chips. Using the cylinder body 921 for pneumatic drive enables faster response, and the precise control of constant force by the proportional valve 922 allows for rapid and stable output of the pre-set driving force during high-speed chip placement, helping to improve overall placement efficiency.

[0065] Please see Figure 1 and Figure 4 The mounting module 93 also includes a vertical guide assembly 933, which is located between the force control drive module 92 and the spindle seat 932, and is sleeved on the spindle 931. The vertical guide assembly 933 includes a guide seat 9331, a movable shaft 9332, a guide bearing 9333, and a guide block 9334. The guide seat 9331 has a hollow channel 93311 extending horizontally, and the movable shaft 9332 and guide bearing 9333... Located within the hollow channel 93311, the guide bearing 9333 is mounted on the movable shaft 9332, which is connected to the main shaft 931. Both the guide bearing 9333 and the movable shaft 9332 are perpendicular to the main shaft 931. The guide block 9334 is fixedly located within the hollow channel 93311 and is parallel to the main shaft 931. The guide block 9334 abuts against the outer ring of the guide bearing 9333, allowing the guide bearing 9333 to slide relative to the guide block 9334.

[0066] In the binding device 9 provided in this embodiment of the invention, the vertical guide component 933 between the force control drive module 92 and the spindle seat 932 is sleeved on the spindle 931. The vertical guide component 933 is used to provide guidance for the spindle 931 in the vertical direction. The overall structure helps to ensure the stability and accuracy of the working end of the spindle 931 in the vertical direction, thereby improving the accuracy of chip mounting and ensuring the accuracy of the force control detection module 91 in detecting the position of the chip when it contacts the substrate.

[0067] Understandably, the guide seat 9331 has a hollow channel 93311 running horizontally through it. The movable shaft 9332, guide bearing 9333, and guide block 9334 are all located within the hollow channel 93311. The guide bearing 9333 is mounted on the movable shaft 9332, which is connected to the main shaft 931. The guide block 9334 is parallel to the main shaft 931. Through the cooperation of the guide bearing 9333 and the guide block 9334, the vertical movement of the main shaft 931 can be precisely guided. The hollow channel 93311 integrates the movable shaft 9332, guide bearing 9333, and guide block 9334, making the vertical guide assembly 933 more compact, reducing space occupation, and facilitating the overall miniaturization of the binding device 9. The centralized layout of the components also facilitates later inspection and replacement, further reducing the maintenance cost of the binding device 9. Furthermore, by abutting the outer ring of the guide bearing 9333 with the guide block 9334, the guide bearing 9333 is restricted by the guide block 9334, allowing it to move only in the vertical direction and not rotate relative to it. This design prevents the spindle 931 from shifting in the horizontal direction while allowing the guide bearing 9333 to slide relative to the guide block 9334. The guide bearing 9333 reduces friction during movement, making the vertical movement of the spindle 931 smoother. It should be noted that the combination of the vertical connection between the movable shaft 9332 and the spindle 931, and the abutting of the outer ring of the guide bearing 9333 with the guide block 9334, forms a multi-directional constraint stable structure. This structure can counteract the lateral forces that may be generated at the working end of the spindle 931 during the mounting process, further suppressing slight wobbling of the spindle 931 and ensuring the positional accuracy of the binding head device 9 at the moment of mounting. In some embodiments, the top and bottom of the hollow channel 93311 are provided with limits for the guide bearing 9333. The guide bearing 9333 can slide up and down in the vertical direction by a distance of 3mm, which is suitable for the force control stroke range required for most types of chip mounting. By setting the upper and lower limits to prevent exceeding the force control stroke, on the one hand, it can avoid over-pressure and damage to the chip and / or substrate, and on the other hand, it can enhance the safety and durability of the vertical guide assembly 933 and extend the service life of the binding head device 9.

[0068] Please see Figure 2 and Figure 4The mounting module 93 also includes a first guide assembly 934, a bearing assembly 936, and a nozzle assembly 937. The first guide assembly 934 and the bearing assembly 936 are arranged along the length of the spindle 931. The nozzle assembly 937 is connected to the working end of the spindle 931. The spindle seat 932 is provided with a vacuum port 9321 for drawing a vacuum for the nozzle assembly 937. The first guide assembly 934 includes an air bearing 9341 and an air bearing seat 9342. The air bearing 9341 is sleeved on the spindle 931, and the air bearing seat 9342 is sleeved on the air bearing 9341. The spindle seat 932 is sleeved on the bearing assembly 936, and the bearing assembly 936 is sleeved on the air bearing seat 9342, so as to form a first guide fit structure in which the spindle seat 932, the bearing assembly 936, the air bearing seat 9342, and the air bearing 9341 are sequentially sleeved.

[0069] In the binding device 9 provided in this embodiment of the invention, the air bearing 9341 of the first guide assembly 934 cooperates with the air bearing seat 9342. Due to the low friction of the air bearing 9341, the sequential arrangement of the air bearing seat 9342, the air bearing 9341, and the main shaft 931 reduces the impact of vertical movement resistance on the mounting pressure during the operation of the binding device 9. This improves the accuracy of the binding device 9 in detecting the chip's contact with the substrate and the accuracy of the mounting pressure when placing the chip onto the substrate. Understandably, in this embodiment of the invention, the outer ring of the bearing assembly 936 is connected to the main shaft seat 932, and the inner ring of the bearing assembly 936 is connected to the air bearing seat 9342. After the main shaft seat 932, the bearing assembly 936, and the air bearing seat 9342 are sequentially arranged, a first guide engagement mechanism is formed. This mechanism provides high-precision guide constraints to the main shaft 931, reduces radial offset when the main shaft 931 moves vertically, and improves the stability of the main shaft 931 when performing lifting and rotating actions. It should be noted that the vacuum port 9321 on the spindle seat 932 can draw a vacuum for the nozzle assembly 937, reducing the impact of the nozzle vacuum path on the placement force control process, so as to avoid the nozzle assembly 937 from shifting when picking up and placing chips, and ensuring that the nozzle assembly 937 picks up and places chips more reliably.

[0070] Among them, the bearing assembly 936 serves as a guide to ensure the accuracy of the spindle 931 in completing the rotation action. The bearing assembly 936 also ensures the sealing of the vacuum path of the nozzle, ensuring that the chip picking and placement operations do not deviate.

[0071] For further information, please refer to [link / reference]. Figure 2 , Figure 4 and Figure 6The spindle seat 932 is provided with an air inlet 9322, which is used for air intake of the air bearing 9341. The air inlet 9322 passes through the spindle seat 932, the bearing assembly 936 and the air bearing seat 9342 in sequence, and then communicates with the internal air passage of the air bearing 9341. The air inlet 9322 and the vacuum air inlet 9321 are arranged adjacent to each other but not connected to each other. The gas of the head-binding device 9 passes through the inside of the nozzle assembly 937, and after flowing through the inside of the spindle 931, the reference block 911, the guide seat 9331 and the air bearing seat 9342, it communicates with the vacuum air inlet 9321.

[0072] In the head-binding device 9 provided in this embodiment of the invention, the air inlet 9322 can stably supply air to the air bearing 9341, ensuring the normal operation of the air bearing 9341 and improving the motion accuracy of the spindle 931; the air inlet 9322 and the vacuum inlet 9321 are arranged adjacent to each other and are not connected to each other, which can avoid mutual interference between the air intake of the air bearing 9341 and the vacuum path of the nozzle assembly 937, and ensure the independence and stability of their respective air paths.

[0073] It should be noted that the gas in the binding head device 9 passes through the interior of the nozzle assembly 937, and after flowing through the interior of the spindle 931, reference block 911, guide seat 9331, and air bearing seat 9342, it connects with the vacuum port 9321 on the spindle seat 932. This design ensures, on the one hand, the sealing of the vacuum evacuation for the nozzle assembly 937, so as to ensure the stability of chip adsorption when the nozzle assembly 937 picks up and places chips, thus improving the overall stability and reliability of the binding head device 9; on the other hand, it ensures that the nozzle assembly 937 and the spindle 931 remain relatively stationary, so that the force control detection module 91's detection of chip-substrate contact is not affected by the vacuum path of the nozzle, thereby avoiding errors. In the embodiment of the present invention, the bearing assembly 936 includes two bearings sleeved on the air bearing seat 9342 and a bearing spacer 9361, with the bearing spacer 9361 located between the two bearings. Among them, the bearing is a contact rubber sealing ring type bearing, which is used to improve the sealing of the vacuum circuit of the nozzle and ensure that the chip is picked up and placed without deviation. The groove of the bearing spacer 9361 is fitted with a sealing ring to block the air circuit inlet 9322 and the vacuum circuit outlet 9321, ensuring that the vacuum circuit of the nozzle and the positive pressure of the air bearing do not interfere with each other.

[0074] In some embodiments, the head-binding device 9 further includes a rotary drive module 94, which includes a servo motor 941 and a synchronous pulley assembly 942. The working end of the servo motor 941 is connected to the main shaft 931 via the synchronous pulley assembly 942. The synchronous pulley assembly 942 includes a first synchronous pulley 9421, a second synchronous pulley 9422, and a synchronous belt 9423. The synchronous belt 9423 is simultaneously fitted on the first synchronous pulley 9421 and the second synchronous pulley 9422. The first synchronous pulley 9421 is fitted on the air bearing seat 9342 on the side near the working end of the main shaft 931, and the second synchronous pulley 9422 is fitted on the working end of the servo motor 941. Understandably, the working end of the servo motor 941 is connected to the main shaft 931 via the synchronous pulley assembly 942, thereby driving the main shaft 931 to rotate. The structure is compact, and the synchronous belt drive can reduce the vertical size of the binding device 9, leaving space for the installation of the downward-view camera, making the overall layout of the binding device 9 more compact. In this embodiment, the outer diameter of the first synchronous pulley 9421 is larger than the outer diameter of the second synchronous pulley 9422, further subdividing the rotation angle and improving the angle accuracy of the binding device 9 during mounting.

[0075] Please see Figure 2 and Figure 5 The mounting module 93 also includes a second guide assembly 935, a bearing assembly 936, and a nozzle assembly 937. The second guide assembly 935 and the bearing assembly 936 are arranged along the length of the spindle 931. The nozzle assembly 937 is connected to the working end of the spindle 931. The spindle seat 932 is provided with a vacuum port 9321 for drawing a vacuum for the nozzle assembly 937. The second guide assembly 935 includes a spline sleeve 9351 and a spline seat 9352. The spline sleeve 9351 is fitted onto the spindle 931, and the spline seat 9352... 352 is fitted onto spline sleeve 9351; spindle seat 932 is fitted onto bearing assembly 936, and bearing assembly 936 is fitted onto spline seat 9352, to form a second guide fit structure in which spindle seat 932, bearing assembly 936, spline seat 9352 and spline sleeve 9351 are fitted together in sequence; the gas from head-binding device 9 passes through the inside of nozzle assembly 937, and after flowing through the inside of spindle 931, reference block 911, guide seat 9331 and spline seat 9352, it connects with vacuum port 9321.

[0076] In the binding head device 9 provided in this embodiment of the invention, the spline sleeve 9351 of the second guide component 935 cooperates with the spline seat 9352. Since the spline sleeve 9351 has low friction, by sequentially sleeved between the spline seat 9352, the spline sleeve 9351 and the main shaft 931, the influence of vertical movement resistance on the mounting pressure can be reduced during the operation of the binding head device 9, thereby improving the accuracy of the mounting pressure of the binding head device 9 when mounting the chip to the substrate. Understandably, the spline structure formed by the spline sleeve 9351 and the spline seat 9352 helps the spindle 931 transmit torque and reduce offset during movement, thus improving guiding reliability. In this embodiment of the invention, the outer ring of the bearing assembly 936 is connected to the spindle seat 932, and the inner ring of the bearing assembly 936 is connected to the spline seat 9352. After the spindle seat 932, the bearing assembly 936, and the spline seat 9352 are sequentially fitted together, a second guiding fit mechanism is formed, which can provide high-precision guiding constraints for the spindle 931, reduce radial offset when the spindle 931 moves in the vertical direction, and improve the stability of the spindle 931 when performing lifting and rotating actions.

[0077] It should be noted that the vacuum port 9321 on the spindle seat 932 can draw a vacuum for the nozzle assembly 937, reducing the impact of the nozzle vacuum path on the placement force control process. This prevents the nozzle assembly 937 from shifting during chip pickup and placement, ensuring more reliable chip pickup and placement operations. It also ensures that the nozzle assembly 937 and the spindle 931 remain relatively stationary, so that the force control detection module 91's detection of chip-substrate contact is not affected by the nozzle vacuum path, thus avoiding errors. In this embodiment, the bearing assembly 936 includes two bearings fitted onto the spline seat 9352 and a bearing spacer 9361, located between the two bearings. The bearings are contact rubber sealing ring type bearings. As guides, the bearings ensure the accuracy of the spindle 931's rotational movement and also guarantee the sealing of the nozzle vacuum path, ensuring that chip pickup and placement operations do not shift.

[0078] In some embodiments, the head-binding device 9 further includes a rotary drive module 94, which includes a servo motor 941 and a synchronous pulley assembly 942. The working end of the servo motor 941 is connected to the main shaft 931 via the synchronous pulley assembly 942. The synchronous pulley assembly 942 includes a first synchronous pulley 9421, a second synchronous pulley 9422, and a synchronous belt 9423. The synchronous belt 9423 is simultaneously fitted on the first synchronous pulley 9421 and the second synchronous pulley 9422. The first synchronous pulley 9421 is fitted on the spline seat 9352 on the side near the working end of the main shaft 931, and the second synchronous pulley 9422 is fitted on the working end of the servo motor 941. Understandably, the working end of the servo motor 941 is connected to the main shaft 931 via the synchronous pulley assembly 942, thereby driving the main shaft 931 to rotate. The structure is compact, and the synchronous belt drive can reduce the vertical size of the binding device 9, leaving space for the installation of the downward-view camera, making the overall layout of the binding device 9 more compact. In this embodiment, the outer diameter of the first synchronous pulley 9421 is larger than the outer diameter of the second synchronous pulley 9422, further subdividing the rotation angle and improving the angle accuracy of the binding device 9 during mounting.

[0079] Please see Figure 4 , Figure 5 ,in, Figure 4 This is a cross-sectional view of the internal structure of the mounting module 93, which includes an air bearing 9341 and an air bearing housing 9342. Figure 5 The internal structure of the mounting module 93 includes a spline sleeve 9351 and a spline seat 9352. The design of the air bearing 9341 and the air bearing seat 9342 is the same as that of the spline sleeve 9351 and the spline seat 9352. The application scenarios are the same, but the mounting effect is slightly different.

[0080] Understandably, the coefficient of friction of air bearings is typically between 0.0001 and 0.0002, while that of low-friction splines is typically between 0.0006 and 0.003. From the perspective of friction coefficient, the air bearing solution offers higher mounting pressure accuracy. In this embodiment of the invention, a low-friction spline sleeve 9351 is used as the Z-axis guide for the spindle 931, which reduces the impact of Z-axis motion resistance on the mounting pressure of the spindle 931, thus improving the mounting pressure accuracy of the binding head device 9. If an air bearing 9341 is used to replace the spline sleeve 9351, the resistance to Z-axis motion will be further reduced, further improving the mounting pressure accuracy of the binding head device 9.

[0081] Please see Figure 1 , Figure 4 and Figure 6The mounting module 93 also has a magnetic spring assembly 938 and a magnetic rod holder 939 inside. The magnetic spring assembly 938 includes an iron block 9381 and a magnetic rod 9382. The magnetic rod holder 939 is fixedly installed in the hollow channel 93311. The magnetic rod 9382 is connected to the magnetic rod holder 939. The iron block 9381 is located in the hollow channel 93311, and there is a gap between the iron block 9381 and the magnetic rod 9382. The iron block 9381 is provided with a clamping structure, and the iron block 9381 is connected to the main shaft 931 through the clamping structure. The iron block 9381 is threadedly connected to the movable shaft 9332. The iron block 9381 can move relative to the magnetic rod 9382 in the vertical direction through magnetic force, driving the main shaft 931 to move synchronously to achieve the elastic reset of the main shaft 931 in the vertical direction.

[0082] In the head-binding device 9 provided in this embodiment of the invention, the magnetic spring assembly 938 and the magnetic rod seat 939 are disposed inside the mounting module 93. The magnetic spring assembly 938 includes an iron block 9381 and a magnetic rod 9382. The magnetic rod seat 939 is fixedly disposed in the hollow channel 93311, that is, the magnetic rod seat 939 is fixed together with the guide seat 9331. The main function of the magnetic rod seat 939 is to fix the magnetic rod 9382. The magnetic spring assembly 938 is integrated inside the mounting module 93, and the structure layout is more compact. It does not occupy the external space of the head-binding device 9, which is conducive to the miniaturization and integration of the head-binding device 9.

[0083] Understandably, while the iron block 9381 is connected to the main spindle 931 through the clamping structure, the iron block 9381 is also threadedly connected to the movable shaft 9332, so that a magnetic spring is formed between the iron block 9381 and the magnetic rod 9382. The relative movement between the iron block 9381 and the magnetic rod 9382 is achieved through magnetic force. The iron block 9381 can drive the main spindle 931 to achieve elastic reset in the vertical direction, balance the weight of the main spindle 931 and the weight of the load on the main spindle 931, and avoid the signal amplifier 913 from frequently alarming when the main spindle 931 does not elastically reset in the vertical direction, thereby reducing or even eliminating the false alarm rate of the signal amplifier 913.

[0084] It should be noted that there is a gap between the iron block 9381 and the magnetic rod 9382, and they will not come into contact with each other. The non-contact reset method driven by magnetic force can reduce mechanical wear, improve the service life of the binding device 9, and avoid the impact of the tension of the traditional spring on the bonding force between the chip and the substrate when the displacement changes during the reset. This results in the maintenance cycle of the traditional spring and its related components gradually shortening and the maintenance cost gradually increasing.

[0085] In some embodiments, the movable shaft 9332 is vertically connected to the main shaft 931, and the iron block 9381 is connected to the main shaft 931 through a clamping structure. The iron block 9381 is also threadedly connected to the movable shaft 9332, which can form a double fixation of "the main shaft 931 is connected to the iron block 9381 and the movable shaft 9332 respectively" and "the iron block 9381 is connected to the movable shaft 9332". This ensures that there is no relative looseness between the iron block 9381, the main shaft 931 and the movable shaft 9332, so that the elastic restoring force of the magnetic spring in the vertical direction can be efficiently transmitted to the main shaft 931, avoiding reset lag or position deviation due to gaps in the connection.

[0086] Please see Figure 7 For ease of understanding, this embodiment of the invention also provides a mounting method applied to the aforementioned binding device to mount the chip onto the substrate. The mounting method includes the following steps: S1: Preset the mounting threshold of the signal amplifier. The mounting threshold is used to determine whether the external force on the working end of the spindle is overshoot. S2: The photoelectric sensor emits a light source to the top surface of the reference block. The working end of the spindle picks up the chip. Before the chip contacts the substrate, the signal amplifier obtains the first position of the reference block when it is stationary by detecting the amount of light reflected and received by the light source. When the chip contacts the substrate, the second position of the reference block is obtained. S3: The signal amplifier calculates the height change of the reference block based on the first and second positions, and compares the height change with the mounting threshold. S4: When the height change does not exceed the mounting threshold, the signal amplifier sends a mounting signal to the force control drive module. The force control drive module drives the spindle to move vertically downward through the reference block to mount the chip onto the substrate. When the height change exceeds the mounting threshold, the signal amplifier issues an alarm.

[0087] The mounting method of this invention is applied to the aforementioned bonding head device to mount chips onto a substrate, achieving the same beneficial effects as the bonding head device. Understandably, the signal amplifier is connected to the photoelectric sensor. The photoelectric sensor emits a light source before and during contact with the substrate, and the signal amplifier detects the amount of light reflected and received by the light source to obtain the position of the reference block. The signal amplifier can calculate the height change of the reference block based on its position change. In the mounting method provided by this invention, by comparing the height change with a mounting threshold, it can be determined whether the external force on the spindle's working end when picking up the chip and contacting it with the substrate is excessive. When the height change is lower than the mounting threshold, the force control drive module can normally drive the spindle's working end to complete the mounting. When the height change is higher than the mounting threshold, the signal amplifier will issue an alarm to prevent damage to the chip due to excessive force, ensuring the mounting quality of the bonding head device and further reducing the chip scrap rate.

[0088] Specifically, in step S1, the signal amplifier is connected to the photoelectric sensor to ensure that the detected reference block position signal can be stably transmitted and resolved, providing a reliable signal basis for subsequent mounting threshold judgment and ensuring the accuracy and real-time performance of signal transmission. By pre-setting the mounting threshold, a clear quantitative standard can be provided for force control judgment during the mounting process, avoiding the signal amplifier sending a mounting signal to the force control drive module before the chip and substrate make contact, which would affect the chip mounting effect. It also facilitates flexible adjustment of the mounting threshold according to the process requirements of different chips and substrates to adapt to different mounting process requirements. In this embodiment, the photoelectric sensor is specifically a fiber optic sensor. The cooperation between the fiber optic sensor and the signal amplifier can provide a feedback signal indicating the chip is in place when it contacts the substrate, and can also trigger an alarm when the chip is subjected to over-force. In step S2, the position of the reference block is detected in stages. First, the static position of the reference block before the chip contacts the substrate is detected, and then the position change of the reference block when the chip contacts the substrate is detected, so that the signal amplifier can calculate the height change of the reference block when the chip contacts the substrate. In step S3, the height change of the reference block is calculated by the signal amplifier and compared with the mounting threshold. This can determine whether the external force received by the spindle working end when picking up the chip and bonding it to the substrate is excessive.

[0089] In step S4, based on the comparison result between the height change and the mounting threshold, mounting or alarm actions are performed to form an instant response mechanism of "detection, judgment, and execution". While ensuring the continuity of normal mounting, it can also provide an alarm to technicians when the external force on the working end of the spindle is over-exposed, thereby realizing the operation of quickly interrupting the mounting process to avoid damage to the chip and / or substrate and reduce the probability of downtime maintenance of the overall die bonding equipment.

[0090] Please see Figure 1 and Figure 8 This invention provides a die bonding device 100, which includes a control component 8, a track component 2, and a first fixing base 21. The track component 2 and the first fixing base 21 are arranged side by side. The first fixing base 21 is provided with a dispensing component 1, a lower vision component 3, and a mounting component 4 in sequence along its length. The track component 2 is provided with a loading component 6 and a unloading component 7 at both ends. A wafer component 5 is provided on the side of the track component 2 away from the first fixing base 21. The wafer component 5 and the mounting component 4 are positioned correspondingly. The control component 8 is connected to the track component 2, the loading component 6, the dispensing component 1, the lower vision component 3, the wafer component 5, the mounting component 4, and the unloading component 7 by signal connection. The mounting component 4 includes the aforementioned binding head device 9.

[0091] The die bonding equipment 100 provided in this embodiment of the invention has the same beneficial effects as the head-binding device 9 in the above embodiment. The die bonding equipment 100 coordinates multiple modules such as the track assembly 2, the feeding assembly 6, and the dispensing assembly 1 through the control component 8, forming a fully automated production line of "feeding-dust removal and dispensing-inspection-mounting-unloading," significantly reducing manual intervention and improving production continuity and efficiency. The track assembly 2 and the first fixing seat 21 are arranged side-by-side, with each functional component arranged sequentially along the track length direction. The process is clear and space utilization is high. The linear layout allows the substrate 10 to flow linearly without rotation or secondary clamping, improving overall mounting efficiency. The wafer assembly 5 and the mounting assembly 4 are positioned correspondingly, shortening the chip transfer path and reducing mounting waiting time.

[0092] Furthermore, please combine them together. Figure 9 The track assembly 2 includes a second fixed base 22, a first guide rail 221 fixedly installed on the second fixed base 22, and a second guide rail 222 movably installed on the second fixed base 22 and spaced apart from the first guide rail 221. The first guide rail 221 and the second guide rail 222 are provided with first protrusions 223 on opposite sides. The first protrusions 223 are arranged along the length direction of the track assembly 2 and are used to support the substrate 10 transported from the loading assembly 6.

[0093] Specifically, the second fixed base 22 is provided with a third guide rail 227, which is arranged along the width direction of the second fixed base 22. The second guide rail 222 is fixed on the third guide rail 227 and can move along the width direction of the second fixed base 22 under the action of the third guide rail 227, thereby adjusting the distance between it and the first guide rail 221.

[0094] Understandably, by using the design of the first guide rail 221 being fixed and the second guide rail 222 being movable in the track assembly 2, the distance between the two can be adjusted to accommodate substrates 10 of different widths, thus improving the versatility of the equipment; the first boss 223 is set along the length of the track, which can stably support the substrate 10 and prevent the substrate 10 from slipping off the edge of the guide rail during transportation.

[0095] Specifically, a limit sensor 224 is provided on the side of the second fixed base 22 away from the first guide rail 221. The limit sensor 224 is signal-connected to the control component 8. When the second guide rail 222 moves to a distance less than a preset threshold from the limit sensor 224, the control component 8 controls the second guide rail 222 to stop moving. It should be noted that the limit sensor 224 can monitor the movement position of the second guide rail 222 in real time. When the distance is less than the preset threshold, a stop command is triggered to prevent the second guide rail 222 from moving excessively and colliding with other components, thereby improving the safety of equipment operation and extending the equipment life.

[0096] In some embodiments, the first fixing base 21 is higher than the second fixing base 22. The first fixing base 21 and the second fixing base 22 are provided with clearance spaces at corresponding positions. The second guide rail 222 is provided with a drive module 2221 on the side away from the first guide rail 221, which is used to drive the movement of the second guide rail 222. When the second guide rail 222 moves away from the first guide rail 221, the drive module 2221 can be embedded in the clearance space. While ensuring that the first guide rail 221 and the second guide rail 222 can be adjusted to the maximum width, the first fixing base 21 and the second fixing base 22 can also be compactly arranged to shorten the movement distance of each execution module and improve the overall mounting efficiency.

[0097] Please combine further Figure 10 The first guide rail 221 and / or the second guide rail 222 are provided with a plurality of clamping components 26. The clamping components 26 include a clamping base 261. The clamping base 261 is slidably connected to the first guide rail 221 or the second guide rail 222 along the length direction of the track assembly 2. A fourth driving member 262 is provided on the clamping base 261. A first gripper 263 and a second gripper 264 are also slidably connected to the clamping base 261 along the direction perpendicular to the track assembly 2. A first cam 265 and a second cam 266 are misaligned on the rotating end of the fourth driving member 262. The first gripper 263 abuts against the first cam 265, and the second gripper 264 abuts against the second cam 266.

[0098] It should be noted that when the fourth driving member 262 drives the first cam 265 to rotate, the first gripper 263 can be lifted by the first cam 265 to support the substrate 10 due to the different radii at various points of the first cam 265. The first cam 265 and the second cam 266 are offset on the rotating end of the fourth driving member 262, meaning they are stacked on the rotating end of the fourth driving member 262 and their outer contours do not overlap. Since the radius of the second cam 266 is also different at various points, when the fourth driving member 262 drives the second cam 266 to rotate, the second gripper 263 can be lifted by the first cam 265 to support the substrate 10. The gripper 264 floats up and down to press against the substrate 10. It can be understood that when the substrate 10 needs to be clamped, the fourth driving member 262 synchronously drives the first cam 265 and the second cam 266 to rotate. The first gripper 263 rises under the action of the first cam 265, and the second gripper 264 descends under the action of the second cam 266. The first gripper 263 and the second gripper 264 cooperate to clamp the substrate 10. Afterwards, the substrate 10 can be transported to a designated position by sliding the clamping base 261 relative to the first guide rail 221 or the second guide rail 222. In one feasible embodiment, the track assembly 2 is provided with four sets of clamping assemblies 26. Two sets of clamping assemblies 26 are located at both ends of the track assembly 2 along its length to complete the loading and unloading of the substrate 10. The other two sets of clamping assemblies 26 are respectively located below the dispensing assembly 1 and the mounting assembly 4 to transport the substrate 10 to a designated position for dust removal, dispensing, mounting, and other operations.

[0099] Furthermore, please combine Figure 9 and Figure 11 A heating platform 225 is also provided on the second fixed base 22. The heating platform 225 is located between the first guide rail 221 and the second guide rail 222. The heating platform 225 is provided with a first heating area 2251, a second heating area 2252 and a third heating area 2253 in sequence along the length of the track assembly 2. The three heating areas of the heating platform 225 can be independently controlled in temperature, which can meet the temperature requirements of the substrate 10 at different stages of mounting.

[0100] In some embodiments, the first heating zone 2251 is used to preheat the substrate 10, the second heating zone 2252 is used to heat the preheated substrate 10 to the process temperature, and the third heating zone 2253 is used to keep the substrate 10 warm after chip mounting to avoid affecting the mounting quality due to rapid cooling. In other embodiments, the length of the first heating zone 2251 is greater than that of the second heating zone 2252. When performing die bonding on a long substrate 10, the first heating zone 2251 first heats a larger area of ​​the substrate 10 to a certain temperature, and then the preheated portion of the substrate 10 is transported in segments to the second heating zone 2252 for rapid heating to the process temperature.

[0101] Please combine them together Figure 12 A pressure block 2262 is placed on the first guide rail 221 and / or the second guide rail 222 at a position corresponding to the heating table 225. The pressure block 2262 can move axially relative to the heating table 225 to fix the substrate 10 located on the heating table 225. The heating table 225 is provided with a vacuum adsorption channel 2254 for adsorbing the substrate 10. The cooperation between the pressure block 2262 and the vacuum adsorption channel 2254 provides double fixation of the substrate 10 from both mechanical pressing and negative pressure adsorption aspects, which can effectively prevent the substrate 10 from warping or shifting due to thermal expansion and contraction during the heating process.

[0102] Specifically, the heating stage 225 is equipped with a lifting assembly at its bottom, which allows the heating stage 225 to move up and down perpendicular to the track assembly 2. It should be noted that when the clamping assembly 26 clamps the substrate 10 and transports it to the heating stage 225, the heating stage 225 descends under the action of the lifting assembly, specifically until its upper surface is below the first protrusion 223, so that the substrate 10 can be smoothly transported above the heating stage 225. When the substrate 10 is transported above the heating stage 225, the lifting assembly drives the heating stage 225 to rise and lift the substrate 10, and activates the vacuum adsorption channel 2254 to adsorb the substrate 10. It should be understood that the upper surface of the heating stage 225 is flat; the substrate 10 being lifted by the heating stage 225 ensures its flatness and improves the mounting quality.

[0103] As a feasible implementation, a fixing seat 226 is provided on the first guide rail 221. The fixing seat 226 can move up and down relative to the track assembly 2. A crossbeam 2261 extending towards the second guide rail 222 is provided on the fixing seat 226. The crossbeam 2261 is located above the track assembly 2 and higher than the clamping assembly 26. Pressure blocks 2262 are provided at both ends of the crossbeam 2261. When the substrate 10 is located on the heating table 225, the fixing seat 226 can drive the pressure blocks 2262 to descend, thereby pressing against the substrate 10 and further fixing the substrate 10. Specifically, the pressure blocks 2262 are misaligned with the clamping assembly 26, so that the clamping assembly 26 does not interfere with the pressure blocks 2262 when it moves.

[0104] Further, please refer to Figure 1 , Figure 8 , Figure 13 and Figure 14 The track assembly 2 has a dust removal and dispensing area 23 and a mounting area 24 along its length. The track assembly 2 has a transfer station 25 on the side near the wafer assembly 5. The wafer assembly 5 includes a wafer tray 51. The mounting area 24, the transfer station 25 and the wafer tray 51 are collinear. The lower vision assembly 3 includes a second base 31 and a second vision detector 311, a third vision detector 312, a fourth vision detector 313 and a fifth vision detector 314 disposed on the second base 31. The second vision detector 311 is located above the dust removal and dispensing area 23, the third vision detector 312 is located above the mounting area 24, the fourth vision detector 313 is located above the transfer station 25 and the fifth vision detector 314 is located above the wafer tray 51.

[0105] Specifically, the second visual detector 311, the third visual detector 312, the fourth visual detector 313, and the fifth visual detector 314 are all fixedly mounted on the second base 31 to identify a predetermined area. The visual detectors perform fine detection of the area to be identified at a fixed angle to ensure the stability of the visual detection. In some embodiments, the third visual detector 312 is further provided with a linear drive module 315. Under the action of the linear drive module 315, the third visual detector 312 can move along the width direction of the track assembly 2. When the size of the substrate 10 to be mounted is large, multiple chips need to be mounted in one column along its width direction. The linear drive module 315 controls the movement of the third visual detector 312 to accurately identify the position of each chip to be mounted.

[0106] The die bonding equipment 100 provided in this embodiment of the invention divides the track assembly 2 into a dust removal and dispensing area 23 and a mounting area 24 according to function, making the production process clearer and facilitating independent control of each process. The mounting area 24, the transfer station 25, and the wafer tray 51 are arranged in a co-line manner, which shortens the transfer path of the chip from the wafer tray 51 through the transfer station 25 to the mounting area 24, reducing the transfer time. The multiple vision detectors of the lower vision assembly 3 correspond to the dust removal and dispensing area 23, the mounting area 24, the transfer station 25, and the wafer tray 51, respectively, and can specifically detect key parameters such as the dispensing quality of the substrate 10 and the chip position, providing accurate positioning data for dust removal, mounting and other processes, and greatly improving the die bonding yield.

[0107] In some embodiments, the wafer assembly 5 includes a transfer head assembly and a ejector pin assembly 52. ​​A pick-up position is defined on the wafer tray 51, which is the position where the chip is to be picked up. The fifth vision detector 314 is used to locate the chip at the pick-up position. The transfer head assembly is used to transfer the chip at the pick-up position to the transfer stage 25. Specifically, the transfer stage 25 is collinear with the pick-up position, so that the transfer path of the chip from the wafer tray 51 to the transfer stage 25 is a straight line, which reduces the complexity of the movement trajectory of the transfer head assembly and shortens the transfer time. At the same time, the straight path can reduce the risk of positional deviation during the chip transfer process and improve the transfer accuracy. As a feasible implementation, the third visual detector 312, the fourth visual detector 313, the fifth visual detector 314, the placement mechanism 44, and the transfer head assembly can work synchronously; that is, when the transfer head assembly picks up the chip on the wafer tray 51, the fourth visual detector 313 simultaneously identifies and detects the chip on the transfer station 25, and the fifth visual detector 314 also simultaneously identifies the placement area 24 to obtain the placement position information. At the same time, the placement mechanism 44 can also perform chip placement operations at this stage.

[0108] Specifically, a translation drive component is also provided below the wafer tray 51 to control the wafer tray 51 to move along the length and width directions of the track component 2; under the drive of the translation drive component, the wafer tray 51 can ensure that the pick-up position always corresponds to the fifth vision detector 314, so that the fifth vision detector 314 can accurately identify the chip.

[0109] As a feasible implementation, the ejector pin assembly 52 is provided with a driving component at its bottom. Under the action of the driving component, the ejector pin assembly 52 can move along the line connecting it to the transfer stage 25. By moving the ejector pin assembly 52, a row of chips on the wafer tray 51 can be lifted sequentially. In some embodiments, the binding head device 9 is part of the mounting mechanism 44, and the transfer stage 25 is detachably mounted on the track assembly 2. For chips with low mounting accuracy requirements, the binding head device 9 of the mounting mechanism 44 can directly pick up the chip from the wafer tray 51 and then transfer it to the substrate 10 for mounting. For mounting such chips, the transfer stage 25 can be removed, allowing the wafer tray 51 to move closer to the track assembly 2, thereby shortening the distance of the chip from the wafer tray 51 to the track assembly 2, further shortening the chip transfer time, and improving mounting efficiency.

[0110] Further, please refer to Figure 13 , Figures 15-17 The dispensing assembly 1, used to remove micro-dust from the substrate 10, includes a second visual detector 311, a first base 11, a horizontal drive 111 disposed at the bottom of the first base 11, and a vertical drive 112 disposed on the side of the first base 11. A dust removal mechanism 12 and / or a dispensing mechanism 13 are detachably disposed on the side of the vertical drive 112 away from the first base 11. The second visual detector 311 is used to identify micro-dust on the substrate 10. The dispensing mechanism 13 includes a first visual detector 131 and a dispensing head 132, which are signal-connected. The dust removal mechanism 12 includes a storage tank 121, an air pipe 122, and a dust removal head 123, with an adsorption air passage 1 on the dust removal head 123. 231 and blowing air passage 1233, one end of air pipe 122 is connected to storage tank 121, and the other end is connected to adsorption air passage 1231; a mounting bracket 113 is fixed on vertical drive component 112, the mounting bracket 113 includes a first mounting plate 1131 and a second mounting plate 1132 spaced apart, the side of the first mounting plate 1131 away from the second mounting plate 1132 is fixedly connected to vertical drive component 112, a first visual detector 131 is fixed between the first mounting plate 1131 and the second mounting plate 1132, the storage tank 121 is fixed to the side of the first mounting plate 1131, and the side of the second mounting plate 1132 away from the first mounting plate 1131 is detachably provided with a dotting head 132 and / or a dust removal head 123.

[0111] Understandably, the dispensing assembly 1, by integrating the second vision detector 311, the horizontal drive 111, and the vertical drive 112, realizes the integrated operation of micro-dust recognition, dust removal, and dispensing on the substrate 10, reducing process changeover time and improving production efficiency. Among them, the cooperation of the horizontal drive 111 and the vertical drive 112 can drive the dust removal and dispensing mechanism 13 to achieve multi-dimensional movement, which can accurately adapt to the dust removal and dispensing needs at different positions on the substrate 10. The detachable dust removal mechanism 12 and dispensing mechanism 13 facilitate the quick replacement of dispensing heads 132 of different diameters or different types of dust removal heads 123 according to process requirements, reducing maintenance costs and making it suitable for multi-variety small-batch production. The double-layer plate design of the mounting bracket 113 arranges the first vision detector 131, storage tank 121, dispensing head 132, and dust removal head 123 in an orderly manner, with a compact structure and avoiding interference and vibration between components, further improving the overall mounting accuracy.

[0112] In some embodiments, only a dispensing head 132 is installed on the first mounting plate 1131 for dispensing or drawing adhesive onto the substrate 10; or only a dust removal head 123 is installed on the first mounting plate 1131 for dust removal from the substrate 10. Depending on the actual die bonding process, the corresponding dispensing head 132 or dust removal head 123 can be installed, and unnecessary components can be removed, so that the dispensing assembly 1 can meet the die bonding process requirements, effectively reduce the load on the mounting bracket 113, and improve its movement accuracy.

[0113] In some embodiments, a dispensing head 132 and a dust removal head 123 are simultaneously installed on the first mounting plate 1131. The dust removal head 123 can be used to remove dust from the substrate 10 to clean the micro-dust on the substrate 10 that may affect dispensing and mounting, and then the dispensing head 132 can be used to dispense adhesive onto the substrate 10.

[0114] Please see Figure 16 and Figure 17 The adsorption air path 1231 and the blowing air path 1233 are isolated. The bottom of the dust removal head 123 is provided with multiple vacuum holes 1232 and multiple blowing holes 1234. The vacuum holes 1232 are connected to the adsorption air path 1231, and the blowing holes 1234 are connected to the blowing air path 1233. The adsorption air path 1231 and the blowing air path 1233 can work simultaneously.

[0115] Specifically, multiple vacuum holes 1232 and multiple air blowing holes 1234 are arranged in two rows along the length of the bottom of the dust removal head 123, that is, the vacuum holes 1232 are arranged in one row and the air blowing holes 1234 are arranged in another row, and the vacuum holes 1232 and air blowing holes 1234 correspond one-to-one. Optionally, the arrangement of the vacuum holes 1232 and air blowing holes 1234 can also be a spiral, annular, or other arbitrary arrangement, which can be set according to the actual situation.

[0116] Understandably, the adsorption air path 1231 and the blowing air path 1233 are isolated to prevent the adsorbed dust from flowing back into the blowing air path 1233 and being blown out, thus causing secondary contamination of the substrate 10. When both work simultaneously, the blowing air path 1233 can blow away the stubborn dust electrostatically adsorbed on the surface of the substrate 10 through the blowing holes 1234, while the adsorption air path 1231 can promptly remove the blown-away dust through the vacuum holes 1232, forming a "blowing-suction" circulating airflow to synergistically remove dust and significantly improve the dust removal efficiency. The distribution design of multiple vacuum holes 1232 and blowing holes 1234 can cover a larger area of ​​the substrate 10 and adapt to the dust removal needs of substrates 10 of different sizes.

[0117] Furthermore, the second vision detector 311 performs micro-dust identification detection on the substrate 10 before and after the dust removal head 123 operates. Specifically, when the second vision detector 311 detects micro-dust on the substrate 10 that has already been dusted, it feeds the information back to the control component 8. The control component 8 then controls the dust removal head 123 to perform dust removal treatment on the substrate 10 again until the second vision detector 311 detects that the cleanliness of the substrate 10 meets the standard. Understandably, the second vision detector 311 performs micro-dust detection on the substrate 10 before and after dust removal, forming a closed-loop dust removal detection system of "detection-dust removal-re-detection." This allows for quantitative evaluation of the dust removal effect, preventing substandard substrates 10 from flowing into subsequent dispensing or mounting processes, ensuring product yield, and achieving automated detection, reducing the randomness and error of manual sampling and improving production stability.

[0118] Furthermore, the second visual detector 311 includes a second base 31, with the first visual detector 131 fixed on the first base 11. The second visual detector 311 is located above the first base 11, and the detection range of the first visual detector 131 is smaller than that of the second visual detector 311. It should be noted that the second base 31 is fixed on the first fixing base 21, and the second visual detector 311 is fixed on the second base 31, corresponding to the dust removal and adhesive dispensing area 23. By fixing the second visual detector 311, its relative position to the dust removal and adhesive dispensing area 23 remains unchanged, ensuring that the same reference is maintained for each detection and guaranteeing detection stability.

[0119] Understandably, by scanning the entire substrate 10 with the second visual detector 311, multiple micro-dust particles in a large area can be quickly located, improving detection accuracy. Furthermore, the second visual detector 311 is located above the first base 11, which ensures that the second visual detector 311 has a larger detection angle and avoids structural interference with the moving dust removal mechanism 12 or dispensing mechanism 13 below. The first visual detector 131, which is mounted on the mounting bracket 113, can move synchronously with the dispensing mechanism 13 and perform real-time and accurate identification and detection of the dispensing area.

[0120] Specifically, the dust removal process using the dispensing assembly 1 is as follows: After the substrate 10 is transported to the dust removal dispensing area 23, the second vision detector 311 is used to identify micro-dust on the substrate 10 and the identification result is fed back to the control assembly 8. The control assembly 8 controls the dust removal head 123 to remove dust from the substrate 10. After the dust removal process is completed, the control assembly 8 controls the second vision detector 311 to identify micro-dust on the substrate 10 again. If the identification result is that there is no micro-dust on the current substrate 10, the dust removal process ends. Otherwise, the dust removal head 123 is controlled again to perform a second dust removal process on the substrate 10.

[0121] The dispensing process using dispensing assembly 1 is as follows: after the substrate 10 is transported to the dust removal dispensing area 23, the first base 11 is moved to correspond with the first vision detector 131 and the substrate 10. The first vision detector 131 is used to identify the position to be dispensed on the substrate 10, and then the dispensing head 132 is controlled to perform dispensing or drawing of glue at the position.

[0122] As a feasible implementation method, when the dispensing assembly 1 is performing dust removal or dispensing, it can first use the second vision detector 311 to scan and identify the micro-dust area and dispensing area of ​​the substrate 10 over a wide range, and then use the first vision detector 131 to perform high-precision detection on key areas, such as the dispensing position, thus taking into account both detection efficiency and accuracy.

[0123] Further, please refer to Figure 18 and Figure 19 The first fixed base 21 is provided with a first fixed plate 41 and a second fixed plate 42 at intervals. A load mechanism 43 is movably installed on the first fixed plate 41, and a mounting mechanism 44 is movably installed on the second fixed plate 42. The load mechanism 43 and the mounting mechanism 44 can move towards each other or away from each other.

[0124] In some embodiments, a first driving member 411 is mounted on a first fixing plate 41, a second driving member 421 is mounted on a second fixing plate 42, a load mechanism 43 is mounted on the first driving member 411, and a mounting mechanism 44 is mounted on the second driving member 421. The load mechanism 43 and the mounting mechanism 44 move towards each other or away from each other under the drive of the first driving member 411 and the second driving member 421. It should be noted that during chip mounting, the second driving member 421 is used to move the mounting mechanism 44 to the transfer table 25 or the wafer tray 51 to pick up the chip, and then the chip is moved to the designated position on the substrate 10 for mounting. During this process, the movement of the mounting mechanism 44 may accelerate or decelerate, causing the overall center of gravity of the mounting assembly 4 to shift and slight vibration to occur.

[0125] The die bonding device 100 provided in this embodiment of the invention has a load mechanism 43 movably mounted on a first fixed plate 41 and a mounting mechanism 44 movably mounted on a second fixed plate 42, so that the load mechanism 43 and the mounting mechanism 44 on the first fixed plate 41 and the second fixed plate 42 can move towards or away from each other, thereby ensuring that the center of gravity of the mounting assembly 4 does not shift, offsetting the vibration generated by the mounting mechanism 44 during acceleration or reduction of movement, and improving the movement stability and accuracy of the mounting mechanism 44.

[0126] As a feasible implementation, the first fixing plate 41 and the second fixing plate 42 are arranged collinearly along their length direction, and both the first fixing plate 41 and the second fixing plate 42 are perpendicular to the first fixing base 21; the first fixing plate 41 is provided with a first slide rail 412 along its length direction, and the second fixing plate 42 is provided with a second slide rail 422 along its length direction; the load mechanism 43 and the mounting mechanism 44 are slidably connected to the first slide rail 412 and the second slide rail 422 respectively.

[0127] Specifically, the weight of the load mechanism 43 matches the weight of the mounting mechanism 44. When the mounting mechanism 44 moves, the load mechanism 43 moves in the opposite direction at the same time, and the moving speed and distance are consistent with the moving speed and distance of the mounting mechanism 44.

[0128] Understandably, the design of the first fixing plate 41 and the second fixing plate 42 being collinear and perpendicular to the first fixing base 21, combined with the slide rails arranged along their respective length directions, provides stable linear motion guidance for the load mechanism 43 and the mounting mechanism 44, effectively reducing lateral offset during movement and improving mounting accuracy. Simultaneously, the slide rail connection method also reduces movement resistance, allowing the mechanism to respond more quickly and adapt to the mounting rhythm more rapidly. In some embodiments, the slide rail surface is coated with wear-resistant lubricating grease to reduce the coefficient of friction, further improving the smoothness of movement and the service life of the slide rail.

[0129] Furthermore, please refer to the following: Figure 20 and Figure 21 The second fixed plate 42 is provided with a third slide rail 424, the third slide rail 424 is provided with a third driving member 423, the third driving member 423 is mounted with a third fixed plate 45, and the third fixed plate 45 is fixedly connected to the second slide rail 422; the third slide rail 424 is perpendicular to the second slide rail 422, and the second slide rail 422 and the third slide rail 424 are slidably connected through the third fixed plate 45.

[0130] Optionally, the specific structures of the first driving component 411, the second driving component 421, the third driving component 423, and the fourth driving component 262 include, but are not limited to, one or more of the following: linear motor, servo motor, voice coil motor, drive cylinder, ball screw with motor, gear rack structure with motor.

[0131] It should be noted that the third slide rail 424 on the second fixed plate 42 is perpendicular to the second slide rail 422. The second slide rail 422 is moved by the third driving component 423, which adds a dimension of motion to the mounting mechanism 44, allowing it to cover more mounting positions on the substrate 10. The third fixed plate 45 connects the second slide rail 422 and the third slide rail 424, realizing the flexible conversion of the movement direction of the mounting mechanism 44, enabling it to achieve two-dimensional planar movement, and the structure is compact and does not occupy too much space.

[0132] Furthermore, the second fixing plate 42 has a clearance groove 425 on the side facing the third fixing plate 45. The third fixing plate 45 includes a first connecting part 451 and a second connecting part 452. The first connecting part 451 is fixedly connected to the third driving member 423, and the second connecting part 452 is fixedly connected to the second slide rail 422. A reinforcing rib 453 is provided between the first connecting part 451 and the second connecting part 452, and the reinforcing rib 453 is clearance-fitted with the clearance groove 425. As a feasible implementation, the first fixing plate 41 is provided with a fixing bracket 413, and the first slide rail 412 is disposed on the same side as the fixing bracket 413 and the second connecting part 452.

[0133] Specifically, buffer devices are provided at both ends of the third slide rail 424 to prevent rigid collisions when the third drive component 423 drives the second slide rail 422 to its limit position. Understandably, the clearance groove 425 of the second fixed plate 42 provides space for the movement of the third fixed plate 45, avoiding structural interference and ensuring smooth movement of the third fixed plate 45. The reinforcing rib 453 enhances the overall rigidity of the third fixed plate 45, reducing deformation caused by motion inertia when supporting the mounting mechanism 44, thus ensuring mounting accuracy. The clearance fit between the reinforcing rib 453 and the clearance groove 425 further improves the smoothness of movement.

[0134] The foregoing provides a detailed description of a head-binding device, mounting method, and die-bonding equipment disclosed in the embodiments of the present invention. Specific examples are used to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of the present invention. Furthermore, those skilled in the art will recognize that, based on the ideas of the present invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A bonding device for picking up chips and mounting them onto a substrate, characterized in that, The binding device includes a force control detection module, a force control drive module, and a mounting module; The force control detection module includes a reference block, a photoelectric sensor, and a signal amplifier, wherein the signal amplifier is connected to the photoelectric sensor. The mounting module includes a spindle and a spindle seat. The two ends of the spindle are a transmission end and a working end, respectively. The spindle passes through the spindle seat and can move up and down relative to the spindle seat. The working end of the spindle is exposed outside the spindle seat. The top of the reference block is connected to the force control drive module, and the bottom of the reference block is connected to the transmission end of the spindle. The photoelectric sensor is located on the spindle seat, and one end of the photoelectric sensor that emits a light source extends into the interior of the spindle seat. The other end of the photoelectric sensor is connected to the signal amplifier. The photoelectric sensor can emit a light source towards the top surface of the reference block. When the chip contacts the substrate, the signal amplifier determines the height change of the reference block by detecting the change in the amount of light received by the reflected light source.

2. The head-binding device as described in claim 1, characterized in that: The photoelectric sensor is set at an angle θ to the top surface of the reference block, and the light source emitted by the photoelectric sensor is aimed at the middle region of the top surface of the reference block. The range of the angle θ is 0° < θ ≤ 90°. The photoelectric sensor is one of the following: fiber optic sensor, laser rangefinder, grating sensor, and infrared sensor.

3. The head-binding device as described in claim 2, characterized in that: The force control drive module includes a cylinder body, a proportional valve, and a transmission component. The cylinder body is pneumatically connected to the proportional valve, which controls the cylinder body to work with a certain constant force. The cylinder body abuts against the top of the reference block in the vertical direction through the transmission component, so that the cylinder body and the reference block are connected by transmission.

4. The head-binding device as described in claim 3, characterized in that: The mounting module further includes a vertical guide component, which is located between the force control drive module and the spindle seat, and is sleeved on the spindle. The vertical guide assembly includes a guide seat, a movable shaft, a guide bearing, and a guide block. The guide seat has a hollow channel that runs horizontally through it. The movable shaft and the guide bearing are located in the hollow channel. The guide bearing is mounted on the movable shaft, and the movable shaft is connected to the main shaft. Both the guide bearing and the movable shaft are perpendicular to the main shaft. The guide block is fixedly disposed within the hollow channel and is parallel to the main shaft. The guide block abuts against the outer ring of the guide bearing so that the guide bearing can slide relative to the guide block.

5. The head-binding device as described in claim 4, characterized in that: The mounting module further includes a first guide assembly, a bearing assembly, and a nozzle assembly. The first guide assembly and the bearing assembly are arranged along the length direction of the spindle. The nozzle assembly is connected to the working end of the spindle. The spindle seat is provided with a vacuum port for drawing a vacuum for the nozzle assembly. The first guide assembly includes an air bearing and an air bearing housing. The air bearing is sleeved on the main shaft, and the air bearing housing is sleeved on the air bearing. The main shaft housing is sleeved on the bearing assembly, and the bearing assembly is sleeved on the air bearing housing, to form a first guide fit structure in which the main shaft housing, the bearing assembly, the air bearing housing, and the air bearing are sequentially sleeved.

6. The head-binding device as described in claim 5, characterized in that: The spindle seat is provided with an air inlet, which is used for air intake of the air bearing. After passing through the spindle seat, the bearing assembly and the air bearing seat in sequence, the air inlet communicates with the internal air passage of the air bearing. The air inlet and the vacuum inlet are adjacent to each other but not connected. The gas of the head-binding device passes through the inside of the nozzle assembly, and after flowing through the inside of the main shaft, the reference block, the guide seat and the air bearing seat, it connects with the vacuum inlet. The binding device further includes a rotary drive module, which includes a servo motor and a synchronous pulley assembly. The working end of the servo motor is connected to the main shaft via the synchronous pulley assembly. The synchronous pulley assembly includes a first synchronous pulley, a second synchronous pulley, and a synchronous belt. The synchronous belt is simultaneously fitted onto the first synchronous pulley and the second synchronous pulley. The first synchronous pulley is fitted onto the air bearing seat on the side near the working end of the main shaft, and the second synchronous pulley is fitted onto the working end of the servo motor.

7. The head-binding device as described in claim 4, characterized in that: The mounting module further includes a second guide assembly, a bearing assembly, and a nozzle assembly. The second guide assembly and the bearing assembly are arranged along the length direction of the spindle. The second guide assembly includes a spline sleeve and a spline seat. The spline sleeve is fitted onto the spindle, and the spline seat is fitted onto the spline sleeve. The spindle seat is fitted onto the bearing assembly, and the bearing assembly is fitted onto the spline seat, thereby forming a second guide fit structure in which the spindle seat, the bearing assembly, the spline seat, and the spline sleeve are sequentially fitted together. The suction nozzle assembly is connected to the working end of the spindle. The spindle seat is provided with a vacuum port for drawing a vacuum for the suction nozzle assembly. The gas from the head-binding device passes through the inside of the suction nozzle assembly, and after flowing through the inside of the spindle, the reference block, the guide seat and the spline seat, it communicates with the vacuum port. The binding device further includes a rotary drive module, which includes a servo motor and a synchronous pulley assembly. The working end of the servo motor is connected to the main shaft via the synchronous pulley assembly. The synchronous pulley assembly includes a first synchronous pulley, a second synchronous pulley, and a synchronous belt. The synchronous belt is simultaneously fitted onto the first synchronous pulley and the second synchronous pulley. The first synchronous pulley is fitted onto the spline seat on the side near the working end of the main shaft, and the second synchronous pulley is fitted onto the working end of the servo motor.

8. The head-binding device as described in claim 6 or 7, characterized in that: The mounting module is also equipped with a magnetic spring assembly and a magnetic rod holder inside. The magnetic spring assembly includes an iron block and a magnetic rod, and the magnetic rod holder is fixedly installed in the hollow channel. The magnetic rod is connected to the magnetic rod seat, the iron block is located in the hollow channel, and there is a gap between the iron block and the magnetic rod; the iron block is provided with a clamping structure, and the iron block is connected to the main shaft through the clamping structure; the iron block is threadedly connected to the movable shaft. The iron block can move relative to the magnetic rod in the vertical direction through magnetic force, driving the main shaft to move synchronously to achieve elastic reset of the main shaft in the vertical direction.

9. A mounting method, applied to the binding device according to any one of claims 1-8, for mounting a chip to a substrate, characterized in that, The mounting method includes the following steps: The mounting threshold of the signal amplifier is preset, and the mounting threshold is used to determine whether the external force on the working end of the spindle is overshoot; The photoelectric sensor emits a light source towards the top surface of the reference block. The working end of the spindle picks up the chip. Before the chip contacts the substrate, the signal amplifier obtains the first position of the reference block when it is stationary by detecting the amount of light reflected and received by the light source. When the chip contacts the substrate, the second position of the reference block is obtained. The signal amplifier calculates the height change of the reference block based on the first position and the second position, and compares the height change with the mounting threshold. When the height change does not exceed the mounting threshold, the signal amplifier sends a mounting signal to the force control drive module, and the force control drive module drives the spindle to move downward in the vertical direction through the reference block to mount the chip onto the substrate; when the height change exceeds the mounting threshold, the signal amplifier issues an alarm.

10. A die bonding apparatus, characterized in that, The device includes a control component, a track component, and a first mounting base. The track component and the first mounting base are arranged side by side. The first mounting base is provided with a dispensing component, a lower vision component, and a mounting component in sequence along its length. A loading component and a unloading component are respectively provided at both ends of the track component. A wafer component is provided on the side of the track component away from the first mounting base. The wafer component corresponds to the mounting component. The control component is signal-connected to the track component, the loading component, the dispensing component, the lower vision component, the wafer component, the mounting component, and the unloading component. The mounting component includes the binding head device according to any one of claims 1-8.

Images