A correction device for chip packaging processing and a method of using the same

Abstract

The application belongs to the technical field of semiconductor device correction, in particular to a correction device for chip packaging processing and a use method thereof, which comprises a machine base; a servo motor is fixedly connected to the machine base; a gear is fixedly connected to the output end of the servo motor; two correction plates are arranged to be close to each other, the first range correction of the chip is performed by the arc end of the long plate of the correction plate, and the four corners of the chip are centered and corrected by the V-shaped plate of the two correction plates, so that the one-time correction effect of different models of semiconductor chips is achieved, the applicability of the correction device and the efficiency of chip packaging production are improved; the arc end of the two long plates is used for range correction of different models of chips, the arc end can smoothly guide the chip into the V-shaped centering area, reduces the risk of rigid collision, and avoids damage to the edge of the chip; the extension structure of the long plate contacts the chip before the V-shaped plate is closed, realizes phased correction, and gradually corrects the chip through coarse adjustment and fine adjustment, thereby improving the positioning effect.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor device calibration technology, specifically a calibration device for chip packaging and processing and its usage method. Background Technology

[0002] The calibration device for chip packaging typically consists of a high-precision optical positioning system, a fine-tuning mechanical platform, and an intelligent control module. It captures the relative position of the chip and the substrate through sensors, calculates the offset, and drives a precision motor for position compensation. The device integrates a force feedback system to prevent overvoltage damage, supports multi-axis linkage calibration, significantly improves packaging yield, and is widely used in key processes of semiconductor devices.

[0003] A patent application with publication number CN116759496A discloses an angle correction device for LED chip packaging, including a platform and a correction device. The platform has a triangular structure, and two push plates are provided. The two push plates are slidably disposed on the platform along the extension direction of the two right-angled sides of the platform. The push device corresponds to each push plate and is located on the side of the push plate away from the right angle of the platform. The push device pushes the push plate out. This application can reduce the probability of chip damage while correcting the chip.

[0004] During the calibration process before semiconductor chip packaging, the use of calibration devices can effectively improve the dimensional accuracy and perpendicularity of the chip, thereby improving the performance of the packaged chip. Although the aforementioned calibration devices can reduce the risk of chip damage from compression, they are usually applicable to specific types of semiconductor chips and have general limitations. They are difficult to adapt to different types of semiconductor chips for calibration at once, which can easily affect the applicability of the calibration device and the efficiency of chip packaging production.

[0005] Therefore, the present invention provides a calibration device for chip packaging and processing and a method for using the same. Summary of the Invention

[0006] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.

[0007] The technical solution adopted by the present invention to solve its technical problem is as follows: A calibration device for chip packaging processing according to the present invention includes a base; a servo motor is fixedly connected to the base; a gear is fixedly connected to the output end of the servo motor; two calibration plates are slidably connected to each other on the base, each calibration plate is composed of a V-shaped plate and a long strip plate, the long strip plate is fixedly connected to one end of the V-shaped plate, and the end of the long strip plate away from the V-shaped plate is set as an arc; a first toothed plate is fixedly connected to the V-shaped plate of one calibration plate, and a second toothed plate is fixedly connected to the V-shaped plate of the other calibration plate, the second toothed plate is located below the first toothed plate, and the teeth of both the first and second toothed plates can mesh with the gear.

[0008] Preferably, a sliding block is slidably connected to the middle of the V-shaped plate of the correction plate; a sliding rod is slidably connected inside the sliding block through a first elastic element; a pressing block is fixed to the end of the sliding rod away from the sliding block; a plurality of first limiting holes are opened on the sliding block; a first pin is inserted into the first limiting hole, and the first pin penetrates the correction plate.

[0009] Preferably, the interior of the extrusion block is slidably connected to a sliding frame via a second elastic element; a circular roller is rotatably connected to the sliding frame; and extrusion pads are fixedly attached to both ends of the extrusion block near the circular roller.

[0010] Preferably, a plurality of guide rollers are rotatably connected to the V-shaped plate of the correction plate; and two opposing protective pads are fixedly attached to the V-shaped plate of the correction plate near the guide rollers.

[0011] Preferably, the bottom end of the long strip of the correction plate is provided with a sliding groove, and a side slider is slidably connected in the sliding groove. The end of the side slider away from the V-shaped plate of the correction plate is set as an inclined surface. A limit plate is fixedly connected to the side slider. A plurality of second limit holes are provided on the limit plate. A limit frame is fixedly connected to the long strip of the correction plate. A second pin is inserted into the second limit hole and passes through the limit frame.

[0012] Preferably, a plurality of guide wheels are rotatably connected to the side slider; the plurality of guide wheels are rotatably connected to the inclined surface of the side slider.

[0013] Preferably, an electric cylinder is fixedly connected to the center of the base, and a top plate is fixedly connected to the output end of the electric cylinder; a sensor is fixedly connected to the inside of the top plate, and the sensor is connected to multiple contacts, which are located on the upper surface of the top plate.

[0014] Preferably, a fixed frame is fixedly connected to the base; a slide rail is fixedly connected to the inner wall of the fixed frame; an electric sliding plate is slidably connected to the bottom end of the slide rail; and a vacuum suction cup is fixedly connected to the bottom end of the electric sliding plate.

[0015] A method for using a calibration device for chip packaging processing, wherein the method employs the calibration device for chip packaging processing described above for calibration, and the steps of the method are as follows:

[0016] S1: First, place the chip in the calibration position between the two calibration plates. Then, the output of the servo motor drives the gear to rotate in the forward direction. The first gear plate and the second gear plate drive the two calibration plates to move closer to each other. During the sliding process of the two calibration plates, the chip is squeezed on both sides by the long strip plate to perform the first range calibration of the chip.

[0017] S2: Then adjust the two side sliders with the same spacing as the chip width. Relying on their inclined surfaces and multiple guide wheels, the chip ends are squeezed and guided, and the chip is limited and attached between the two side sliders. This is the second width correction of the chip. Then, the two rollers are attached to the two ends of the chip. As the two correction plates slide closer to each other, the two extrusion blocks squeeze the two ends of the chip. This is the third end correction of the chip. Until the two ends of the chip are squeezed and attached to the four protective pads of the V-shaped plate of the two correction plates along the guidance of multiple guide rollers. This is the fourth centering correction of the chip.

[0018] S3: Then the output of the servo motor rotates in the opposite direction to release the chip limit. Multiple contacts connected by the sensor detect the chip's calibration status. After confirming that the calibration is complete, the electric cylinder lifts the top plate and the calibrated chip on the top plate. The vacuum suction cup and the electric slide plate are positioned directly above the chip until the chip is attached to the bottom of the vacuum suction cup and is attracted. The electric slide plate then slides along the slide rail with the attracted chip and is sent to the packaging loading position.

[0019] Preferably, in S2, the two extrusion blocks can clamp the two ends of the chip by means of their V-shaped side, and as the two correction plates slide closer, the two sliding rods are squeezed into the interior of the two sliding blocks.

[0020] The beneficial effects of this invention are as follows:

[0021] 1. The present invention discloses a calibration device and its method for chip packaging processing. By placing two calibration plates close to each other, the arc ends of the elongated plates of the two calibration plates first perform a range calibration on the chip, and then the V-shaped plates of the two calibration plates center the four corners of the chip. This achieves a single calibration of different types of semiconductor chips, improving the applicability of the calibration device and the efficiency of chip packaging production. The arc ends of the two elongated plates perform range calibration on different types of chips, smoothly guiding the chip into the V-shaped centering area, reducing the risk of rigid collisions and avoiding chip edge damage. The extended structure of the elongated plates pre-contacts the chip before the V-shaped plates close, achieving phased calibration—a gradual guiding calibration with coarse adjustment followed by fine adjustment—improving the positioning effect. The inclined structure of the V-shaped plates of the calibration plates allows the chip to naturally slide towards the center upon contact, achieving rapid self-positioning and reducing manual adjustment time. The inclined contact disperses pressure, making it less likely to damage chip edges and surface-sensitive structures compared to flat clamping. The symmetrical force application of the double V-shaped structure avoids chip offset and tilting caused by unilateral compression, ensuring the accuracy and stability of the calibration.

[0022] 2. The chip packaging and processing calibration device and its usage method described in this invention guides and calibrates the chip by having two rollers adhere to both ends of the chip. The rotational characteristics of the rollers can automatically adapt to the initial tilt angle of the chip. The chip posture is gradually adjusted through rolling contact, making dynamic correction easier and especially suitable for scenarios with irregular chip positions. The rolling friction of the rollers is much lower than that of sliding friction, which can reduce the risk of scratches on the chip surface. The contact pressure is evenly distributed, avoiding chip cracks caused by local stress concentration. The inclined surfaces of the two side sliders guide the two corners of the chip, enabling the two side sliders to correct the width of the chip on both sides. Attached Figure Description

[0023] The invention will now be further described with reference to the accompanying drawings.

[0024] Figure 1 This is a perspective view of the present invention;

[0025] Figure 2 This is a schematic diagram of the top plate structure in this invention;

[0026] Figure 3 This is a schematic diagram of the structure of the No. 2 toothed plate in this invention;

[0027] Figure 4 This is a schematic diagram of the side slider in this invention;

[0028] Figure 5 This is a schematic diagram of the structure of the correction plate in this invention;

[0029] Figure 6 This is a partial structural cross-sectional view of the extrusion block in this invention;

[0030] Figure 7 This is a flowchart of the method of using the calibration device for chip packaging processing according to the present invention.

[0031] In the diagram: 1. Base; 11. Servo motor; 12. Gear; 13. Gear plate No. 1; 14. Gear plate No. 2; 15. Correction plate; 2. Sliding block; 21. Sliding rod; 22. Extrusion block; 23. Limiting hole No. 1; 24. Pin No. 1; 3. Sliding frame; 31. Circular roller; 32. Extrusion pad; 4. Guide roller; 41. Protective pad; 5. Side slider; 51. Limiting plate; 52. Limiting hole No. 2; 53. Limiting frame; 54. Pin No. 2; 6. Guide wheel; 7. Top plate; 71. Contact point; 8. Fixing frame; 81. Slide rail frame; 82. Electric sliding plate; 83. Vacuum suction cup. Detailed Implementation

[0032] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0033] like Figures 1 to 5 As shown in the embodiment of the present invention, a calibration device for chip packaging processing includes a base 1; a servo motor 11 is fixedly connected to the base 1; a gear 12 is fixedly connected to the output end of the servo motor 11; two calibration plates 15 are slidably connected to each other on the base 1, each calibration plate 15 consisting of a V-shaped plate and a long strip plate, the long strip plate being fixed to one end of the V-shaped plate, and the end of the long strip plate away from the V-shaped plate being arc-shaped; a first toothed plate 13 is fixedly connected to the V-shaped plate of one calibration plate 15, and a second toothed plate 14 is fixedly connected to the V-shaped plate of the other calibration plate 15, the second toothed plate 14 being located below the first toothed plate 13, and the teeth of both the first toothed plate 13 and the second toothed plate 14 being able to mesh with the gear 12; for different types of semiconductors... During the pre-packaging calibration of the semiconductor chip, the semiconductor chip is placed on the base 1 and positioned between two calibration plates 15. Then, the output end of the servo motor 11 drives the gear 12 to rotate in the forward direction. The teeth of the first gear plate 13 and the second gear plate 14 mesh with the gear 12, synchronously driving the two calibration plates 15 to move closer to each other. The long arc end of the two calibration plates 15 first adheres to the two sides of the chip and squeezes it to perform the first range calibration, limiting the chip within the two calibration plates 15. As the two calibration plates 15 continue to slide, the four corners of the chip adhere to the four inclined surfaces of the two V-shaped plates and are squeezed and centered for calibration. This completes the calibration effect of different types of semiconductor chips in one operation, improving the applicability of the calibration device and the efficiency of chip packaging production.

[0034] The curved ends of two long strips are used to calibrate the range of chips of different models. The curved ends can smoothly guide the chip into the V-shaped centering area, reducing the risk of rigid collision and avoiding chip edge damage. The extended structure of the long strips contacts the chip before the V-shaped plate closes, realizing staged calibration. The gradual guiding calibration, first coarse and then fine, improves the positioning effect.

[0035] The sloping structure of the 15V-shaped calibration board allows the chip to slide naturally toward the center upon contact, achieving rapid self-positioning and reducing manual adjustment time. The sloping contact disperses pressure, making it less likely to damage chip edges and surface-sensitive structures compared to flat clamping.

[0036] By relying on the symmetrical force application of the double V-shaped structure, chip displacement and tilting caused by unilateral compression are avoided, ensuring the accuracy and stability of the correction.

[0037] like Figures 1 to 6 As shown, a sliding block 2 is slidably connected to the middle of the V-shaped plate of the calibration plate 15; a sliding rod 21 is slidably connected inside the sliding block 2 via a first elastic element; a pressing block 22 is fixedly connected to the end of the sliding rod 21 away from the sliding block 2; multiple first limiting holes 23 are opened on the sliding block 2; a first pin 24 is inserted into the first limiting hole 23, and the first pin 24 passes through the calibration plate 15; after the chip is calibrated by the guide range of the long strip plate of the calibration plate 15, as the two calibration plates 15 continue to slide closer, the two pressing blocks 22 adhere to both ends of the chip. If the chip is still tilted at this time, the two correction plates 15 continue to slide closer, and the inclined surfaces of the two pressing blocks 22 can fit against the two ends of the chip. The sliding rod 21 can squeeze the first elastic element to shrink, and cooperate with the V-shaped plate inclined surface of the correction plate 15 to press and correct the two ends of the chip until the chip is corrected. It should be noted that before correction, the position of the sliding block 2 needs to be adjusted according to the different models of chips. Then, the first pin 24 is inserted through the sliding block 2 and inserted into the corresponding first limiting hole 23 to limit the sliding block 2, which plays the role of correcting the two ends of the chip.

[0038] The inside of the extrusion block 22 is slidably connected to the sliding frame 3 via the second elastic element; the sliding frame 3 is rotatably connected to the roller 31; the two ends of the extrusion block 22 near the roller 31 are fixedly connected to the extrusion pads 32; when calibrating the two ends of the chip, the two rollers 31 first adhere to the two ends of the chip, and the rollers 31 can guide and calibrate the chip. The rotational characteristics of the rollers 31 can automatically adapt to the initial tilt angle of the chip, and the chip posture is gradually adjusted through rolling contact, making it easier to achieve dynamic correction, especially suitable for scenarios with irregular chip positions. As the calibration plate 15 slides continuously, the chip can squeeze the roller 31 into the inside of the extrusion block 22, and the sliding frame 3 simultaneously squeezes the second elastic element to contract and bear force. The end of the extrusion block 22 near the chip, together with the extrusion pads 32, makes parallel contact with the chip, reducing the shaking of the two ends of the chip and performing stable calibration at both ends;

[0039] The rolling friction of the roller 31 is much lower than that of sliding friction, which can reduce the risk of scratches on the chip surface, ensure uniform contact pressure distribution, and avoid chip cracks caused by local stress concentration.

[0040] like Figures 1 to 5 As shown, multiple guide rollers 4 are rotatably connected to the V-shaped plate of the correction plate 15; two opposing protective pads 41 are fixedly attached to the V-shaped plate of the correction plate 15 near the guide rollers 4; when the chip is corrected and close to the V-shaped plate of the two correction plates 15, the multiple guide rollers 4 can guide the four corners of the chip until the four corners of the chip are aligned with the four protective pads 41 and centered, reducing the wear caused by centering the chip during correction.

[0041] The bottom end of the long strip of the calibration plate 15 is provided with a sliding groove, and a side slider 5 is slidably connected in the sliding groove. The end of the side slider 5 away from the V-shaped plate of the calibration plate 15 is set as an inclined surface. A limiting plate 51 is fixedly connected to the side slider 5. A plurality of second limiting holes 52 are provided on the limiting plate 51. A limiting frame 53 is fixedly connected to the long strip of the calibration plate 15. A second pin 54 is inserted into the second limiting hole 52 and passes through the limiting frame 53. When two calibration plates 15 approach each other to calibrate the chip, the arc end of the long strip of the calibration plate 15 first calibrates the chip area. After the chip is aligned, the two corners of the chip are guided by the inclined surfaces of the two side sliders 5. As the two correction plates 15 continue to slide, the two side sliders 5 can limit the width of the chip on both sides. The chip fits against the side walls of the two side sliders 5. It should be noted that before correction, the position of the side sliders 5 needs to be adjusted according to the width of different chip models. The distance between the two side sliders 5 is consistent with the width of the chip. Then, the second pin 54 is inserted through the limiting frame 53 and into the corresponding second limiting hole 52 on the limiting plate 51 to limit the position of the side sliders 5, which plays the role of correcting the width of the chip on both sides.

[0042] Multiple guide wheels 6 are rotatably connected to the side slider 5; the multiple guide wheels 6 are rotatably connected to the inclined surface of the side slider 5; when the inclined surface of the side slider 5 is used to guide the chip, the multiple guide wheels 6 are rotatably connected to the inclined surface of the side slider 5, which can guide the chip during the chip width limit correction, thereby reducing the wear caused by the chip width limit correction.

[0043] like Figure 1 and Figure 2As shown, an electric cylinder is fixedly connected to the center of the base 1, and a top plate 7 is fixedly connected to the output end of the electric cylinder. A sensor is fixedly connected inside the top plate 7, and the sensor is connected to multiple contacts 71, which are located on the upper surface of the top plate 7. After the chip is centered and corrected, the output end of the servo motor 11 rotates in the opposite direction to release the chip. The multiple contacts 71 connected to the sensor simultaneously detect the chip. If the multiple contacts 71 detect the chip symmetrically from multiple directions, the chip correction is considered complete. If the multiple contacts 71 do not detect the chip symmetrically from multiple directions, the chip correction is considered to be off-center, and the correction equipment needs to be checked. Subsequently, the corrected chip is lifted by the top plate 7 through the output end of the electric cylinder, making it easy to remove and package the chip. Chips that fail the correction need to be re-corrected, which serves as a chip correction, detection, and material handling function.

[0044] like Figure 1 As shown, a fixed frame 8 is fixedly connected to the base 1; a slide rail frame 81 is fixedly connected to the inner wall of the fixed frame 8; an electric slide plate 82 is slidably connected to the bottom end of the slide rail frame 81; a vacuum suction cup 83 is fixedly connected to the bottom end of the electric slide plate 82; when the electric cylinder cooperates with the top plate 7 to lift the chip, the electric slide plate 82 driven by the electric slider first drives the vacuum suction cup 83 to be directly above the chip. The vacuum suction cup 83 is connected to a vacuum pump to vacuum adsorb and lift the chip that is attached. As the electric slide plate 82 drives the adsorbed chip to slide on the slide rail frame 81 supported by the fixed frame 8, the corrected chip is sent to the packaging loading position, which plays the role of feeding the corrected chip.

[0045] like Figure 7 As shown, a method for using a calibration device for chip packaging processing is described above. The method involves using the aforementioned calibration device for chip packaging processing for calibration, and the steps are as follows:

[0046] S1: First, place the chip at the calibration position between the two calibration plates 15. Then, the output of the servo motor 11 drives the gear 12 to rotate in the forward direction. The first gear plate 13 and the second gear plate 14 synchronously drive the two calibration plates 15 to move closer to each other. During the sliding process of the two calibration plates 15, the two sides of the chip are squeezed by the long strip plate to perform the first range calibration of the chip.

[0047] S2: Then adjust the two side sliders 5 with the same spacing as the chip width. Relying on their inclined surfaces and multiple guide wheels 6, the chip ends are squeezed and guided, and the chip is limited and attached between the two side sliders 5. The chip width is corrected for the second time. Then the two round rollers 31 are attached to the two ends of the chip. As the two correction plates 15 slide closer to each other, the two extrusion blocks 22 squeeze the two ends of the chip, and the chip ends are corrected for the third time. Until the two ends of the chip are squeezed and attached to the four protective pads 41 of the V-shaped plate of the two correction plates 15 along the guidance of multiple guide rollers 4, the chip is centered for the fourth time.

[0048] S3: Then the output of the servo motor 11 rotates in the opposite direction to release the chip limit. Multiple contacts 71 connected by the sensor detect the chip's calibration status. After confirming that the calibration is complete, the top plate 7 and the calibrated chip on the top plate 7 are lifted by the electric cylinder. The vacuum suction cup 83 and the electric slide plate 82 are positioned directly above the chip until the chip is attached to the bottom of the vacuum suction cup 83 and is attracted. The electric slide plate 82 then slides on the slide rail 81 with the attracted chip and is sent to the packaging loading position.

[0049] The two squeezing blocks 22 in S2 can clamp the two ends of the chip by means of their V-shaped side, and as the two correction plates 15 slide closer, they squeeze the two sliding rods 21 into the interior of the two sliding blocks 2.

[0050] Working process: When calibrating different types of semiconductor chips before packaging, the semiconductor chip is placed on the base 1 and positioned between two calibration plates 15. Then, the output of the servo motor 11 drives the gear 12 to rotate forward. The teeth of the first gear plate 13 and the second gear plate 14 mesh with the gear 12, synchronously driving the two calibration plates 15 closer together. The long, curved ends of the two calibration plates 15 first press against the sides of the chip, performing the first range calibration and confining the chip within the two calibration plates 15. As the two calibration plates 15 continue to slide, the four corners of the chip are pressed against the four inclined surfaces of the two V-shaped plates for center calibration, thus completing the calibration of different types of semiconductor chips in one pass, improving the applicability of the calibration device. This improves chip packaging and manufacturing efficiency. The curved ends of two long strips are used for range calibration of different chip models. These curved ends smoothly guide the chip into the V-shaped centering area, reducing the risk of rigid collisions and preventing chip edge damage. The extended structure of the long strips pre-contacts the chip before the V-shaped plate closes, enabling phased calibration—a gradual guiding calibration from coarse to fine adjustment—to improve positioning. The inclined structure of the 15V-shaped calibration plate allows the chip to naturally slide towards the center upon contact, achieving rapid self-positioning and reducing manual adjustment time. The inclined contact disperses pressure, making it less likely to damage chip edges and surface-sensitive structures compared to flat clamping. The symmetrical force application of the double V-shaped structure avoids chip displacement and tilting caused by unilateral compression, ensuring calibration accuracy and stability. When the chip is calibrated by the guide plate of the calibration plate 15, as the two calibration plates 15 continue to slide closer, the two pressing blocks 22 adhere to both ends of the chip. If the chip is still tilted at this time, the two calibration plates 15 continue to slide closer, and the inclined surfaces of the two pressing blocks 22 can adhere to and press the ends of the chip. The sliding rod 21 can press the first elastic element to contract, and cooperate with the inclined surfaces of the V-shaped plate of the calibration plate 15 to press and correct the ends of the chip until the chip calibration is completed. It should be noted that before calibration, the position of the sliding block 2 needs to be adjusted according to the different models of chips. Then, the first pin 24 is inserted through the sliding block 2 and inserted into the corresponding first limiting hole 23 to limit the sliding block 2, which plays the role of calibrating the ends of the chip. When calibrating the ends of the chip... By relying on two rollers 31 to first adhere to both ends of the chip, the rollers 31 can guide and correct the chip. The rotational characteristics of the rollers 31 can automatically adapt to the initial tilt angle of the chip. By gradually adjusting the chip posture through rolling contact, dynamic correction is more easily achieved, which is especially suitable for scenarios with irregular chip positions. As the correction plate 15 slides continuously, the chip can squeeze the rollers 31 into the interior of the extrusion block 22. The sliding frame 3 simultaneously extrudes the second elastic element to contract and bear force. The end of the extrusion block 22 close to the chip, together with the extrusion pad 32, makes parallel contact with the chip, reducing the shaking at both ends of the chip and performing stable correction at both ends. The rolling friction of the rollers 31 is much lower than the sliding friction, which can reduce the risk of scratches on the chip surface. The contact pressure is evenly distributed, avoiding chip cracks caused by local stress concentration.

[0051] When the chip is aligned and close to the V-shaped plate of the two alignment plates 15, multiple guide rollers 4 can guide the four corners of the chip until the four corners of the chip are aligned and aligned with the four protective pads 41, reducing the wear caused during the alignment of the chip.

[0052] When the two calibration plates 15 approach each other to calibrate the chip, the arc end of the long strip of calibration plate 15 first calibrates the chip area. Then, the two corners of the chip are guided by the inclined surfaces of the two side sliders 5. As the two calibration plates 15 continue to slide, the two side sliders 5 can limit the width of the chip on both sides. The chip is attached to the sidewalls of the two side sliders 5. It should be noted that before calibration, the position of the side sliders 5 needs to be adjusted according to the width of different chip models. The distance between the two side sliders 5 is consistent with the width of the chip. Then, the second pin 54 is inserted through the limiting frame 53 into the corresponding second limiting hole 52 on the limiting plate 51 to limit the position of the side sliders 5, which plays the role of limiting the width of the chip on both sides. When the inclined surface of the side sliders 5 is used to guide the chip, multiple guide wheels 6 are rotated and connected to the inclined surface of the side sliders 5, which can guide the chip during the width limiting calibration, thereby reducing the wear caused by the chip width limiting calibration.

[0053] After the chip is centered and corrected, the output of the servo motor 11 rotates in the opposite direction to release the chip clamp. The multiple contacts 71 connected to the sensor detect the chip synchronously. If the multiple contacts 71 detect the chip symmetrically from multiple directions, the chip correction is considered complete. If the multiple contacts 71 do not detect the chip symmetrically from multiple directions, the chip correction is considered off, and the correction equipment needs to be checked. The corrected chip is then lifted by the top plate 7 driven by the output of the electric cylinder, making it easy to remove the chip for packaging. Chips that fail the correction need to be re-corrected, which serves as a chip correction detection and material removal function. After the electric cylinder and the top plate 7 lift the chip, the electric sliding plate 82 driven by the electric slider first moves the vacuum suction cup 83 to be directly above the chip. The vacuum suction cup 83 is connected to a vacuum pump to vacuum and lift the attached chip. As the electric sliding plate 82 drives the adsorbed chip to slide on the slide rail 81 supported by the fixed frame 8, the corrected chip is sent to the packaging loading position, which serves as a feeding function for the corrected chip.

[0054] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A calibration device for chip packaging processing, characterized in that: The device includes a base; a servo motor is fixedly mounted on the base; a gear is fixedly mounted on the output end of the servo motor; two correction plates are slidably connected to each other on the base, each correction plate consisting of a V-shaped plate and a long strip plate, the long strip plate being fixedly mounted on one end of the V-shaped plate, and the end of the long strip plate away from the V-shaped plate being rounded; a first toothed plate is fixedly mounted on the V-shaped plate of one correction plate, and a second toothed plate is fixedly mounted on the V-shaped plate of the other correction plate, the second toothed plate being located below the first toothed plate, and the teeth of both the first and second toothed plates being able to mesh with the gear; A sliding block is slidably connected to the middle of the V-shaped plate of the correction plate; a sliding rod is slidably connected inside the sliding block through a first elastic element; a pressing block is fixed to the end of the sliding rod away from the sliding block; multiple first limiting holes are opened on the sliding block; a first pin is inserted into the first limiting hole and the first pin penetrates the correction plate. Multiple guide rollers are rotatably connected to the V-shaped plate of the correction plate; two opposing protective pads are fixedly attached to the V-shaped plate of the correction plate near the guide rollers. The bottom of the long strip of the correction plate is provided with a sliding groove, and a side slider is slidably connected in the sliding groove. The end of the side slider away from the V-shaped plate of the correction plate is set as an inclined surface. A limit plate is fixedly connected to the side slider. A plurality of second limit holes are provided on the limit plate. A limit frame is fixedly connected to the long strip of the correction plate. A second pin is inserted into the second limit hole and passes through the limit frame.

2. The calibration device for chip packaging processing according to claim 1, characterized in that: The inside of the extrusion block is slidably connected to a sliding frame via a second elastic element; a circular roller is rotatably connected to the sliding frame; and extrusion pads are fixedly attached to both ends of the extrusion block near the circular roller.

3. The calibration device for chip packaging processing according to claim 1, characterized in that: Multiple guide wheels are rotatably connected to the side slider; the multiple guide wheels are rotatably connected to the inclined surface of the side slider.

4. The calibration device for chip packaging processing according to claim 1, characterized in that: An electric cylinder is fixedly connected to the center of the base, and a top plate is fixedly connected to the output end of the electric cylinder; a sensor is fixedly connected to the inside of the top plate, and the sensor is connected to multiple contacts, which are located on the upper surface of the top plate.

5. The calibration device for chip packaging processing according to claim 4, characterized in that: A fixed frame is fixedly connected to the base; a slide rail is fixedly connected to the inner wall of the fixed frame; an electric sliding plate is slidably connected to the bottom end of the slide rail; and a vacuum suction cup is fixedly connected to the bottom end of the electric sliding plate.

6. A method of using a calibration device for chip packaging processing, wherein the method employs the calibration device for chip packaging processing as described in any one of claims 1-5, characterized in that: The steps of this method are as follows: S1: First, place the chip in the calibration position between the two calibration plates. Then, the output of the servo motor drives the gear to rotate in the forward direction. The first gear plate and the second gear plate drive the two calibration plates to move closer to each other. During the sliding process of the two calibration plates, the chip is squeezed on both sides by the long strip plate to perform the first range calibration of the chip. S2: Then adjust the two side sliders with the same spacing as the chip width. Relying on their inclined surfaces and multiple guide wheels, the chip ends are squeezed and guided, and the chip is limited and attached between the two side sliders. This is the second width correction of the chip. Then, the two rollers are attached to the two ends of the chip. As the two correction plates slide closer to each other, the two extrusion blocks squeeze the two ends of the chip. This is the third end correction of the chip. Until the two ends of the chip are squeezed and attached to the four protective pads of the V-shaped plate of the two correction plates along the guidance of multiple guide rollers. This is the fourth centering correction of the chip. S3: Then the output of the servo motor rotates in the opposite direction to release the chip limit. Multiple contacts connected by the sensor detect the chip's calibration status. After confirming that the calibration is complete, the electric cylinder lifts the top plate and the calibrated chip on the top plate. The vacuum suction cup and the electric slide plate are positioned directly above the chip until the chip is attached to the bottom of the vacuum suction cup and is attracted. The electric slide plate then slides along the slide rail with the attracted chip and is sent to the packaging loading position.

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