Modular high-power three-dimensional integrated phased-array antenna microsystem

Abstract

The invention discloses a modular high-power three-dimensional integrated phased-array antenna microsystem, which comprises a plurality of antenna radiation units, a plurality of radio frequency active chip packaging modules, a composite integrated PCB (Printed Circuit Board) dielectric plate and a heat dissipation / storage plate. The radiation surface is completely occupied by the antenna unit and the radiation field space thereof, the outward aperture size of the whole antenna is utilized to the maximum extent so as to improve the radiation performance of the antenna, and meanwhile, the surface does not have other functions such as heat dissipation. The device face faces the interior of the antenna and is provided with various active chips, heat dissipation channels and radiators, and control, power supply, heat conduction and heat dissipation of radio frequency signals are achieved through the internal space of the antenna. According to the structure, 100% utilization of the effective antenna radiation aperture of the antenna is achieved through minimum performance loss and space, meanwhile, good electrical and thermodynamic performance is achieved, and finally all radio frequency functions are achieved and interconnection with the antenna is completed. The system is small in size, light in weight and low in cost, and the system integration degree is greatly improved.

Description

Technical Field

[0001] This application relates to the field of phased array antenna system technology, and in particular to a modular high-power three-dimensional integrated phased array antenna microsystem. Background Technology

[0002] Phased array antennas have the characteristic of rapid beam scanning and have been widely used in radar, missile guidance and electromagnetic pulse weapons in recent years.

[0003] With technological advancements, phased array antennas have become smaller, lighter, and less expensive, while their power and radiation gain have increased. This has led to increased heat generation in phased array antenna systems, which is often concentrated within small integrated chips. Due to limitations in size and structure, this heat is difficult to dissipate, severely impacting the performance of the phased array antenna and even causing it to burn out due to overheating.

[0004] Therefore, there is an urgent need for a modular, high-power, three-dimensional integrated phased array antenna microsystem. Summary of the Invention

[0005] This invention provides a modular, high-power, three-dimensional integrated phased array antenna microsystem, solving the technical problem of heat concentration and difficulty in heat dissipation in existing phased array antennas. The specific technical solution is as follows:

[0006] A modular high-power three-dimensional integrated phased array antenna microsystem, the microsystem comprising: multiple antenna radiating elements, multiple radio frequency active chip packaging modules, a composite integrated PCB dielectric board, and a heat dissipation / heat storage plate;

[0007] The antenna radiating element is disposed on the top layer of the microsystem, and the radio frequency active chip packaging module is disposed on the lower layer of the antenna radiating element and electrically connected to the antenna radiating element, wherein each antenna radiating element is electrically connected to the corresponding radio frequency active chip packaging module; the composite integrated PCB substrate is disposed on the lower layer of the radio frequency active chip packaging module and electrically connected to the radio frequency active chip packaging module; the heat dissipation / heat storage plate is disposed on the lower layer of the composite integrated PCB substrate;

[0008] The composite integrated PCB substrate encapsulates multiple telecommunication transmission networks. One end of each telecommunication transmission network is electrically connected to the radio frequency active chip packaging module, and the other end is electrically connected to a connector. The connector is disposed on the heat dissipation / heat storage plate and is used to transmit external telecommunication energy to the microsystem. The composite integrated PCB substrate also encapsulates multiple high thermal conductivity material structures. Each high thermal conductivity material structure is associated with a corresponding radio frequency active chip packaging module. The heat generated by the radio frequency active chip packaging module is transferred to the heat dissipation / heat storage plate through the high thermal conductivity material structure.

[0009] In another embodiment of the present invention, the high thermal conductivity material structure is disposed directly below the radio frequency active chip packaging module. The high thermal conductivity material structure consists of multiple thermally conductive cylindrical metal bodies that pass vertically through the composite integrated PCB dielectric board, thereby transferring the heat from the radio frequency active chip packaging module to the heat dissipation / heat storage plate.

[0010] In another embodiment of the present invention, the location and cross-section of the thermally conductive cylindrical metal body are determined based on the location and area of ​​the heat source of the radio frequency active chip packaging module.

[0011] In another embodiment of the present invention, the high thermal conductivity material structure is disposed below or diagonally below the radio frequency active chip packaging module, and the cross-sectional area of ​​the lower end of the high thermal conductivity material structure is larger than the cross-sectional area of ​​the upper end.

[0012] In another embodiment of the present invention, the antenna radiating element includes: a radiating antenna, an antenna array dielectric substrate, a stripline transmission line, and a radio frequency coaxial metal via.

[0013] The radiating antenna is disposed on the upper surface of the antenna array dielectric substrate, and the radio frequency coaxial metal via is disposed on the lower surface of the antenna array dielectric substrate. The radio frequency coaxial metal via connects the radiating antenna and the radio frequency coaxial metal via.

[0014] In another embodiment of the present invention, the radio frequency active chip packaging module encapsulates an amplitude and phase multifunction chip, a power amplifier chip, and a radio frequency coaxial metal via; the radio frequency coaxial metal via in the radio frequency active chip packaging module transmits signals with the radio frequency coaxial metal via in the antenna radiating unit.

[0015] In another embodiment of the present invention, the telecommunications transmission network includes: a power network, a control network, and a radio frequency power distribution feeder network;

[0016] The connector of the power network is a power supply connector, the connector of the control network is a control signal connector, and the connector of the RF power distribution feed network is an RF connector.

[0017] In another embodiment of the present invention, the upper surface of the composite integrated PCB substrate is provided with a plurality of circuit elements and / or circuit chips.

[0018] In another embodiment of the present invention, thermally conductive silicone grease is disposed between the lower surface of the composite integrated PCB dielectric board and the upper surface of the heat dissipation / heat storage plate.

[0019] In another embodiment of the present invention, the upper surface of the radio frequency active chip packaging module is fixed and electrically connected to the antenna radiating unit through metal solder balls; the lower surface of the radio frequency active chip packaging module is fixed and electrically connected to the composite integrated PCB substrate through metal solder balls.

[0020] The beneficial effects of this invention are as follows:

[0021] 1. This system employs a single integrated dual-sided RF chip module. The sidewalls of the RF integrated chip module feature RF-like coaxial metal vias, enabling bidirectional RF signal conduction. This design allows the radiating surface (containing the passive radiating antenna) and the component surface (containing the power amplifier chip, etc.) to be located on separate surfaces. The radiating surface is entirely occupied by the antenna elements and their radiation field space, maximizing the utilization of the antenna's outward aperture size to improve radiation performance. This surface does not bear the burden of heat dissipation or other functions. The component surface faces inward, containing various active chips, heat dissipation channels, and heat sinks. It utilizes the internal space of the antenna to achieve RF signal control, power supply, heat conduction, and heat dissipation. This structure achieves 100% utilization of the effective antenna radiating aperture with minimal performance loss and space, while possessing excellent electrical and thermodynamic performance. Ultimately, it realizes all RF functions and completes interconnection with the antenna. The system is small in size, light in weight, and low in cost, greatly improving system integration.

[0022] 2. The RF chip size is smaller than the antenna array. An additional space cavity is created between the RF integrated chips in the array, which can be used to place resistors, capacitors and control drive chips, etc. This makes full use of the vertical space from the antenna array to the integrated board, ensuring that all functional dimensions of the device are less than or equal to the radiating surface, while ensuring functional performance and heat dissipation.

[0023] 3. All RF integrated chips are arranged in one direction. In addition to related control power supply and RF power distribution functions, the PCB integrated board directly below the power amplifier chip of each chip also uses PCB copper embedding technology to embed copper metal pillars, so that the heat dissipation channel is directly arranged below the heat source of the chip. The heat dissipation method is direct, the heat dissipation channel is the shortest, and the thermal resistance is the smallest.

[0024] 4. The phased array antenna microsystem adopts a distributed and modular design. All functions of the entire antenna are consistent with the antenna array size. It has a regular shape and is splicable. Each subarray has the same complete structure and phased array antenna function. Subarrays can be replaced at will, and the radio frequency signal transmission method is direct.

[0025] 5. The system achieves high integration by using multi-layer PCB stacking, multiple laminations, and copper paste sintering processes to realize RF signal transmission, power distribution network, power supply transmission, and control signal transmission between different layers in space. Through reflow soldering, the antenna array and RF integrated chips can be formed in a single reflow soldering process, simultaneously creating a complete RF channel internally, providing control, power supply, and rapid heat dissipation functions. Attached Figure Description

[0026] Figure 1 This is one of the structural schematic diagrams of a modular high-power three-dimensional integrated phased array antenna microsystem;

[0027] Figure 2 This is a schematic diagram of heat dissipation and radio frequency of a modular high-power three-dimensional integrated phased array antenna microsystem.

[0028] Figure 3 This is one of the structural schematic diagrams of a modular high-power three-dimensional integrated phased array antenna microsystem;

[0029] Figure 4 This is one of the structural schematic diagrams of a modular high-power three-dimensional integrated phased array antenna microsystem;

[0030] The components include: 1. Antenna radiating element; 2. Antenna array dielectric substrate; 3. Transmission line with stripline; 4. RF coaxial metal via; 5. Metal solder ball; 6. Digital driver chip; 7. RF active chip packaging module; 8. Amplitude and phase multifunction chip; 9. Power amplifier chip; 10. Resistor; 11. Capacitor; 12. Composite integrated PCB dielectric substrate; 13. Embedded copper pillar; 14. Power network; 15. RF power distribution feed network; 16. Control network; 17. Embedded resistor; 18. Power supply connector; 19. RF connector; 20. Control signal connector; 21. Thermal grease; 22. Heat dissipation / heat storage plate. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this specification clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments in this specification, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments in this application without creative effort are within the scope of protection of this document.

[0032] The following combination Figure 1-2 This specification provides a detailed description of the technical solutions provided in each embodiment. Specific Implementation Example 1:

[0034] Phased array antennas can be classified according to their composition into laterally integrated "tile-like" structures and horizontally and vertically integrated "brick-like" structures. With technological advancements, three-dimensional integrated structures are becoming the mainstream. The novel T / R component architecture of three-dimensional microwave integrated circuit design employs a multi-layer structure and utilizes vertical interconnect technology to integrate and connect RF, control signals, and power modules. This breaks down the original design boundaries of individual components such as power supply, control, RF, and antenna, saving unnecessary structural frameworks, connectors, and interfaces between different combinations. This integrated design from an overall functional perspective results in significant reductions in size, weight, and cost, and has become the current development trend for phased array antennas.

[0035] Traditional "brick-type" or "tile-type" phased array antennas use discrete designs for components such as the antenna array and feed network, requiring RF connectors for RF signal transmission. This results in high system cost, large size, and heavy weight. Another approach, antenna-on-a-chip (AOC) and antenna-in-package (AIP), integrates the antenna array and circuitry onto a single chip using semiconductor technology, while simultaneously using packaging technology to integrate the antenna array within a packaged material carrying the chip. While this design offers reduced weight and high integration density, the use of chip-level semiconductors and packaging processes leads to higher costs and more complex manufacturing processes. Most importantly, the high-density integration of the system results in severe heat concentration issues, causing performance degradation and making it difficult to meet the high power density requirements of the system.

[0036] This invention discloses a high-power heat dissipation modular three-dimensional integrated phased array antenna microsystem, comprising: antenna radiating element 1, antenna array dielectric substrate 2, transmission line with strip 3, RF coaxial metal via 4, metal solder ball 5, digital driver chip 6, RF active chip packaging module 7, amplitude and phase multi-function chip 8, power amplifier chip 9, resistor 10, capacitor 11, composite integrated PCB dielectric substrate 12, embedded copper pillar 13, power network 14, RF power distribution feed network 15, control network 16, embedded resistor 17, power supply connector 18, RF connector 19, control signal connector 20, thermal grease 21, and heat dissipation / heat storage plate 22.

[0037] This system enables the transmission and reception of high-power electromagnetic signals within the designed frequency band, and completes high-precision beam scanning within the azimuth and elevation angle range of -60° to +60°. Its internal heat can be quickly dissipated, giving the system excellent performance even under high output power conditions.

[0038] The antenna radiating element 1, the transmission line 3, and the RF coaxial metal via 4 are located inside the antenna array dielectric substrate 2. The embedded copper pillar 13, power network 14, RF power distribution feed network 15, control network 16, and buried resistor 17 are located inside the composite integrated PCB dielectric substrate 12. The RF coaxial metal via 4, the amplitude-phase multifunction chip 8, and the power amplifier chip 9 are located inside the RF active chip packaging module 7. Each RF active chip packaging module 7 contains one amplitude-phase multifunction chip 8 and four power amplifier chips 9. The RF active chip packaging module 7 uses a ceramic shell, which can achieve hermetic sealing. The size of the RF active chip packaging module 7 is smaller than that of the antenna array 2. Additional space cavities are created between the RF active chip packaging modules 7 to place digital driver chips 6, resistors 10, and capacitors 11, etc. The top pins of the RF active chip packaging module 7 are led out using a ball-mounted BGA method, and the surface of the bottom pin pads is treated with a nickel-palladium-gold process. Power connector 18, RF connector 19, and control signal connector 20 are soldered to the lower surface of the composite integrated PCB substrate 12 and exposed through openings in the heat dissipation / heat storage plate 22. An embedded copper pillar 13, penetrating the entire board, is arranged directly below the RF active chip packaging module 7. Each trace layer implements RF signal transmission, power distribution, control signal transmission, and power transmission, respectively. The upper layer uses high-strength high-frequency board material, while the lower feed network uses microwave board material to ensure minimal loss. Wilkinson isolation resistors are implemented through embedded resistors 17. The entire board is manufactured using embedded resistors, copper embedding, mechanical vias, and secondary lamination processes. Thermal grease 21 is located between the lower surface of the composite integrated PCB substrate 12 and the heat dissipation / heat storage plate 22. All functions of the antenna are consistent with the antenna array dimensions, and its regular shape allows for splicing.

[0039] Electromagnetic energy in the required frequency band is fed into the system from the outside through the RF connector 19. The RF energy is synthesized and distributed through the RF power distribution feed network 15 inside the composite integrated PCB substrate 12, and then conducted to the RF active chip package module 7 through the metal solder balls 5. The electromagnetic energy undergoes amplitude and phase adjustment and power amplification through the RF active chip package module 7, and is then conducted to the top of the RF active chip package module 7 through the RF coaxial metal vias 4 on its outer wall, and then to the antenna array substrate 2 through the metal solder balls 5. Inside the antenna array substrate 2, the RF signal transmission direction is converted through the strip transmission line 3 and the RF coaxial metal vias 4, and then conducted to the antenna radiating element 1, ultimately forming a high-power, wide-angle scanning spatial radiation beam.

[0040] The heat source of a high-power heat-dissipating modular three-dimensional integrated phased array antenna microsystem is mainly the RF active chip packaging module 7, and the main cold-end heat sink of the system is the heat dissipation / heat storage plate 22. The key to solving the heat dissipation problem is to open up the heat dissipation path from the heat source to the cold-end heat sink, while ensuring that the distance and thermal resistance of the entire heat dissipation path are minimized. This is crucial for ensuring the proper operation of the system. The main heat source in the RF active chip packaging module 7 is the power amplifier chip 9 located at the four corners. Therefore, an embedded copper pillar 13 is embedded in the composite integrated PCB dielectric board 12 directly below each power amplifier chip 9 for heat dissipation, ensuring that the heat dissipation path is the shortest vertical path. Heat is transferred through the ceramic package shell of the RF active chip packaging module 7 to the metal solder ball 5, and then directly downwards to the embedded copper pillar 13 in the composite integrated PCB dielectric board 12, and then directly and quickly downwards to the heat dissipation / heat storage plate 22, completing the shortest path heat dissipation of the heat source. At the four corner intersections of every four RF active chip packaging modules 7, evenly arranged pin hole connector pads are used for fixing with the cold plate. The close contact with the cold plate ensures the heat dissipation effect. Furthermore, the power network 14 and control network 16 inside the composite integrated PCB dielectric board 12 employ large-area copper plating and thick copper technology, which allows for lateral heat transfer and equalization. Outside the main heat dissipation channel, the heat dissipation area is fully utilized for auxiliary heat dissipation. The lower part of the composite integrated PCB dielectric board 12 is entirely copper-plated with gold, forming a surface-to-surface contact with the heat dissipation / heat storage plate 22. To ensure tight contact between the heat dissipation / heat storage plate 7 and the embedded copper pillars 13 and reduce contact thermal resistance, a thin layer of thermally conductive silicone grease 21 is evenly applied to the contact surface. Screws are used to secure the two interfaces, and the fasteners are soldered to the composite integrated PCB dielectric board 12. These multiple heat dissipation measures prevent heat accumulation within the system, achieving temperature uniformity across different areas of the system.

[0041] The materials used in each part of the system are as follows: the antenna radiating unit 1, the transmission line 3, the RF coaxial metal via 4, the power network 14, the control network 16, the RF power distribution feed network 15, and the embedded copper pillar 13 are made of copper; the antenna array dielectric board 2 and the composite integrated PCB dielectric board 12 are made of polytetrafluoroethylene; the metal solder balls 5 are made of tin-lead; the digital driver chip 6, the RF active chip packaging module 7, the amplitude and phase multifunctional chip 8, and the power amplifier chip 9 are made of semiconductor materials; the resistor 10 and the capacitor 11 are made of copper, aluminum, or other alloy materials; the embedded resistor 17 is made of nickel-phosphorus or other metal alloy materials; the thermal grease 21 is a thermally conductive organic material; and the heat dissipation / heat storage plate 22 is made of aluminum alloy.

[0042] like Figure 2 As shown, the antenna array, feed network, transceiver channel, heat dissipation channel, control and power supply channel are highly integrated, and the heat of the RF active chip package module can be quickly dissipated through the heat dissipation channel.

[0043] This invention discloses a high-power heat-dissipating modular three-dimensional integrated phased array antenna microsystem, which solves the heat dissipation bottleneck problem caused by high-power-density integration of phased array antennas, and achieves good working performance of the phased array antenna system under high-power-density integration. It can be applied to various fields. The innovative points of this invention are as follows:

[0044] 1. This design employs a single integrated dual-sided RF chip module. The sidewalls of the RF integrated chip module feature RF-like coaxial metal vias, enabling bidirectional RF signal conduction. This design allows the radiating surface (containing the passive radiating antenna) and the component surface (containing the power amplifier chip, etc.) to be located on separate surfaces. The radiating surface is entirely occupied by the antenna elements and their radiation field space, maximizing the utilization of the antenna's outward aperture size to improve radiation performance. This surface does not bear the burden of heat dissipation or other functions. The component surface faces inward, containing various active chips, heat dissipation channels, and heat sinks. It utilizes the internal space of the antenna to achieve RF signal control, power supply, heat conduction, and heat dissipation. This structure achieves 100% utilization of the effective antenna radiating aperture with minimal performance loss and space, while possessing excellent electrical and thermodynamic performance. Ultimately, it realizes all RF functions and completes interconnection with the antenna. The system is small in size, light in weight, and low in cost, greatly improving system integration.

[0045] 2. The RF chip size is smaller than the antenna array. An additional space cavity is created between the RF integrated chips in the array, which can be used to place resistors, capacitors and control driver chips, etc. This makes full use of the vertical space from the antenna array to the integrated board, ensuring that all functional dimensions of the device are less than or equal to the radiating surface, while ensuring functional performance and heat dissipation.

[0046] 3. All RF integrated chips are arranged in one direction. In addition to related control power supply and RF power distribution functions, the PCB integrated board directly below the power amplifier chip of each chip also uses PCB copper embedding technology to embed copper metal pillars, so that the heat dissipation channel is directly arranged below the heat source of the chip. The heat dissipation method is direct, the heat dissipation channel is the shortest, and the thermal resistance is the smallest.

[0047] 4. The phased array antenna microsystem adopts a distributed and modular design. All functions of the entire antenna are consistent with the antenna array size. It has a regular shape and is modular. Each subarray has the same complete structure and phased array antenna function. Subarrays can be replaced at will, and the radio frequency signal transmission method is direct.

[0048] 5. The system achieves high integration by using multi-layer PCB stacking, multiple laminations, and copper paste sintering processes to realize RF signal transmission, power distribution network, power supply transmission, and control signal transmission between different layers in space. Through reflow soldering, the antenna array and RF integrated chips can be formed in a single reflow soldering process, simultaneously creating a complete RF channel internally, providing control, power supply, and rapid heat dissipation functions.

[0049] Furthermore, the present invention also solves the following technical problems:

[0050] 1. This invention utilizes a copper-embedded metal-based PCB to realize a hybrid packaged integrated board, completing the layout of a one-piece RF integrated chip, power divider chip, RF connector, low-frequency control connector, power supply connector, and capacitors and resistors on both surfaces of the PCB. Through multi-layer PCB stacking, multiple laminations, and copper paste sintering processes, the comprehensive electrical characteristics required for RF signal transmission, power distribution network, power supply transmission, and control signal transmission between different layers are achieved spatially.

[0051] 2. Conventional brick-type and tile-type T / R modules are internally integrated with dozens or even hundreds of bare chips, with channels isolated by metal partitions. To optimize size and weight, this invention uses a single integrated RF chip. Internally, it employs chip stacking, heterogeneous integration, dual-package board integration, and matching low-loss upper and lower board RF interconnection technology. This achieves integrated packaging of polarization switch, RF power amplifier, beam control circuit, low-noise amplifier, power divider network, and amplitude / phase multi-function circuitry. A single chip performs all RF functions and completes antenna interconnection, significantly improving system integration.

[0052] 3. The system of the present invention adopts a distributed and modular design approach, dividing the system into several subarrays. Each subarray has the same and complete structure and phased array antenna function. Subarrays can be arbitrarily replaced. With the addition of the system framework structure and necessary power supply and control, the final system is easy to integrate.

[0053] 4. Currently, the efficiency of high-power RF amplifier chips is generally around 30%-40%, and the efficiency of the assembled chips will further decrease. Therefore, phased array antennas generate a large amount of heat dissipation during transmission, resulting in enormous heat dissipation pressure. Simultaneously, the integration of high-power gallium nitride chips causes a sharp increase in local heat flux density. If the accumulated heat cannot be dissipated in time, it will cause two problems for the entire antenna array microsystem during operation: First, it will cause local overheating, leading to performance degradation or even failure of some components. Second, significant differences in temperature uniformity between different areas will lead to poor performance consistency between phased array antenna channels, subsequently causing a sharp decline in the performance of the antenna array microsystem. Both of these problems seriously affect the system's operating performance. To address the aforementioned issues, this invention adopts an integrated structural and heat dissipation design approach in the system's thermal control design. It utilizes a multi-physics fusion design simulation method to effectively increase the heat exchange area between the T / R component and the heat capacity component, thereby improving heat exchange efficiency. By embedding a copper block, a direct channel is established between the main heat source (gallium nitride power amplifier chip) and the heat dissipation plate, preventing heat accumulation and achieving excellent performance of the phased array antenna system under high power density integration, ultimately solving the heat dissipation problem.

[0054] 5. In order to improve functional density and reduce size and weight, the system needs to rationally design each component in three-dimensional space. Currently, the existing mature hermetic metal package core heat dissipation channel is a ceramic bottom BGA with a spherical surface. The RF channel leading to the antenna array is also a ceramic bottom BGA with a spherical surface. However, the outside of the antenna array is an air layer, which is a poor conductor of heat. A large amount of heat generated cannot be effectively dissipated and forms a concentration effect at the chip. Therefore, the existing technical architecture has great limitations and cannot realize high-power applications. This invention fully utilizes three-dimensional space, spatially separating the antenna radiating surface, RF channel, and heat dissipation channel of the microsystem. On one hand, RF signals are transmitted to the antenna array via RF-like coaxial metal vias on the sidewalls of the RF integrated chip, and the gaps between the packaged chips are utilized effectively. The space in the middle of the RF integrated chip on the array is used to place resistors, capacitors, and driver chips, making full use of the vertical space from the antenna array to the integrated board. The final connection of the RF channel is completed by BGA ball-mounting. On the other hand, copper pillars are embedded in the PCB directly below the power amplifier chip of each chip, and the heat dissipation channel is directly arranged below the heat source of the chip, conducting heat to the heat storage plate with the shortest distance and lowest thermal resistance. This solves the two problems of RF channel signal transmission, radiation, and high-power heat dissipation.

[0055] 6. Functional interconnection of components in a phased array system is also a problem that must be solved. Currently, the RF connectors used in these components have two main issues: First, soldering connectors requires soldering at least two bases and one intermediate connection part at each RF channel. This results in numerous solder joints, a complex soldering process, low yield, and reliability problems. Second, RF connectors are costly and bulky, limiting the integration of 3D integrated microsystems. This invention replaces traditional RF connectors with a coaxial structure formed by metal solder balls. All connections are designed to coexist on a single plane, requiring only one reflow soldering process to complete assembly. This results in lower cost, higher reliability, and further reduction in size and weight.

[0056] 7. Mass production of antenna microsystems needs to consider production costs, process complexity, and compatibility. Currently, both on-chip antennas (AOC) and antenna-in-package (AIP) utilize semiconductor processes or related packaging processes, resulting in high costs, complex designs, and a limited number of manufacturers with limited production capacity. The PCB process used in this invention has a mature domestic industry chain and lower costs. The reflow soldering process is also a fundamental technology in this field, facilitating mass production. Specific Implementation Example 2:

[0058] This invention provides a modular, high-power, three-dimensional integrated phased array antenna microsystem, solving the technical problem of heat concentration and difficulty in heat dissipation in existing phased array antennas. The specific technical solution is as follows:

[0059] A modular high-power three-dimensional integrated phased array antenna microsystem, the microsystem comprising: multiple antenna radiating elements, multiple radio frequency active chip packaging modules, a composite integrated PCB dielectric board, and a heat dissipation / heat storage plate;

[0060] The antenna radiating element is disposed on the top layer of the microsystem, and the radio frequency active chip packaging module is disposed on the lower layer of the antenna radiating element and electrically connected to the antenna radiating element, wherein each antenna radiating element is electrically connected to the corresponding radio frequency active chip packaging module; the composite integrated PCB substrate is disposed on the lower layer of the radio frequency active chip packaging module and electrically connected to the radio frequency active chip packaging module; the heat dissipation / heat storage plate is disposed on the lower layer of the composite integrated PCB substrate;

[0061] The composite integrated PCB substrate encapsulates multiple telecommunication transmission networks. One end of each telecommunication transmission network is electrically connected to the radio frequency active chip packaging module, and the other end is electrically connected to a connector. The connector is disposed on the heat dissipation / heat storage plate and is used to transmit external telecommunication energy to the microsystem. The composite integrated PCB substrate also encapsulates multiple high thermal conductivity material structures. Each high thermal conductivity material structure is associated with a corresponding radio frequency active chip packaging module. The heat generated by the radio frequency active chip packaging module is transferred to the heat dissipation / heat storage plate through the high thermal conductivity material structure.

[0062] In another embodiment of the present invention, the high thermal conductivity material structure is disposed directly below the radio frequency active chip packaging module. The high thermal conductivity material structure consists of multiple thermally conductive cylindrical metal bodies that pass vertically through the composite integrated PCB dielectric board, thereby transferring the heat from the radio frequency active chip packaging module to the heat dissipation / heat storage plate.

[0063] In another embodiment of the present invention, the location and cross-section of the thermally conductive cylindrical metal body are determined based on the location and area of ​​the heat source of the radio frequency active chip packaging module.

[0064] In another embodiment of the present invention, the high thermal conductivity material structure is disposed below or diagonally below the radio frequency active chip packaging module, and the cross-sectional area of ​​the lower end of the high thermal conductivity material structure is larger than the cross-sectional area of ​​the upper end.

[0065] In another embodiment of the present invention, the antenna radiating element includes: a radiating antenna, an antenna array dielectric substrate, a stripline transmission line, and a radio frequency coaxial metal via.

[0066] The radiating antenna is disposed on the upper surface of the antenna array dielectric substrate, and the radio frequency coaxial metal via is disposed on the lower surface of the antenna array dielectric substrate. The radio frequency coaxial metal via connects the radiating antenna and the radio frequency coaxial metal via.

[0067] In another embodiment of the present invention, the radio frequency active chip packaging module encapsulates an amplitude and phase multifunction chip, a power amplifier chip, and a radio frequency coaxial metal via; the radio frequency coaxial metal via in the radio frequency active chip packaging module transmits signals with the radio frequency coaxial metal via in the antenna radiating unit.

[0068] In another embodiment of the present invention, the telecommunications transmission network includes: a power network, a control network, and a radio frequency power distribution feeder network;

[0069] The connector of the power network is a power supply connector, the connector of the control network is a control signal connector, and the connector of the RF power distribution feed network is an RF connector.

[0070] In another embodiment of the present invention, the upper surface of the composite integrated PCB substrate is provided with a plurality of circuit elements and / or circuit chips.

[0071] In another embodiment of the present invention, thermally conductive silicone grease is disposed between the lower surface of the composite integrated PCB dielectric board and the upper surface of the heat dissipation / heat storage plate.

[0072] In another embodiment of the present invention, the upper surface of the radio frequency active chip packaging module is fixed and electrically connected to the antenna radiating unit through metal solder balls; the lower surface of the radio frequency active chip packaging module is fixed and electrically connected to the composite integrated PCB substrate through metal solder balls.

[0073] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the invention.

[0074] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A modular high-power three-dimensional integrated phased array antenna microsystem, characterized in that, The microsystem includes: multiple antenna radiating elements, multiple radio frequency active chip packaging modules, a composite integrated PCB substrate, and a heat dissipation / heat storage plate; The antenna radiating element is disposed on the top layer of the microsystem, and the radio frequency active chip packaging module is disposed on the lower layer of the antenna radiating element and electrically connected to the antenna radiating element, wherein each antenna radiating element is electrically connected to the corresponding radio frequency active chip packaging module; the composite integrated PCB substrate is disposed on the lower layer of the radio frequency active chip packaging module and electrically connected to the radio frequency active chip packaging module; the heat dissipation / heat storage plate is disposed on the lower layer of the composite integrated PCB substrate; The composite integrated PCB substrate encapsulates multiple telecommunication transmission networks. One end of each telecommunication transmission network is electrically connected to the radio frequency active chip packaging module, and the other end is electrically connected to a connector. The connector is disposed on the heat dissipation / heat storage plate and is used to transmit external telecommunication energy to the microsystem. The composite integrated PCB substrate also encapsulates multiple high thermal conductivity material structures. Each high thermal conductivity material structure is associated with a corresponding radio frequency active chip packaging module. The heat generated by the radio frequency active chip packaging module is transferred to the heat dissipation / heat storage plate through the high thermal conductivity material structure.

2. The modular high-power three-dimensional integrated phased array antenna microsystem as described in claim 1, characterized in that, The high thermal conductivity material structure is located directly below the RF active chip packaging module. The high thermal conductivity material structure consists of multiple thermally conductive cylindrical metal bodies that pass vertically through the composite integrated PCB dielectric board, thereby transferring the heat from the RF active chip packaging module to the heat dissipation / heat storage plate.

3. The modular high-power three-dimensional integrated phased array antenna microsystem as described in claim 2, characterized in that, The location and cross-section of the thermally conductive cylindrical metal body are determined based on the location and area of ​​the heat source of the RF active chip packaging module.

4. The modular high-power three-dimensional integrated phased array antenna microsystem as described in claim 1, characterized in that, The high thermal conductivity material structure is disposed below or diagonally below the radio frequency active chip packaging module, and the cross-sectional area of ​​the lower end of the high thermal conductivity material structure is larger than the cross-sectional area of ​​the upper end.

5. The modular high-power three-dimensional integrated phased array antenna microsystem as described in claim 1, characterized in that, The antenna radiating element includes: a radiating antenna, an antenna array dielectric substrate, a stripline transmission line, and a radio frequency coaxial metal via. The radiating antenna is disposed on the upper surface of the antenna array dielectric substrate, and the radio frequency coaxial metal via is disposed on the lower surface of the antenna array dielectric substrate. The radio frequency coaxial metal via connects the radiating antenna and the radio frequency coaxial metal via.

6. The modular high-power three-dimensional integrated phased array antenna microsystem as described in claim 1, characterized in that, The RF active chip packaging module encapsulates an amplitude and phase multifunction chip, a power amplifier chip, and RF coaxial metal vias; the RF coaxial metal vias in the RF active chip packaging module transmit signals with the RF coaxial metal vias in the antenna radiating unit.

7. The modular high-power three-dimensional integrated phased array antenna microsystem as described in claim 1, characterized in that, The telecommunications transmission network includes: a power network, a control network, and a radio frequency power distribution feeder network; The connector of the power network is a power supply connector, the connector of the control network is a control signal connector, and the connector of the RF power distribution feed network is an RF connector.

8. The modular high-power three-dimensional integrated phased array antenna microsystem as described in claim 1, characterized in that, The upper surface of the composite integrated PCB substrate is provided with multiple circuit elements and / or circuit chips.

9. A modular high-power three-dimensional integrated phased array antenna microsystem as described in claim 1, characterized in that, Thermal grease is applied between the lower surface of the composite integrated PCB dielectric board and the upper surface of the heat dissipation / heat storage plate.

10. A modular high-power three-dimensional integrated phased array antenna microsystem as described in claim 1, characterized in that, The upper surface of the RF active chip packaging module is fixed and electrically connected to the antenna radiating unit through metal solder balls; the lower surface of the RF active chip packaging module is fixed and electrically connected to the composite integrated PCB substrate through metal solder balls.

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