Semiconductor surface mounting and welding integrated equipment

Abstract

The invention discloses semiconductor mounting and welding integrated equipment, which belongs to the technical field of semiconductor manufacturing, and comprises a base, the top of the base is provided with a three-way driving mechanism, the bottom end of the three-way driving mechanism is connected with a grabbing mechanism, and one side of the grabbing mechanism is provided with a welding mechanism; the grabbing mechanism comprises a mounting plate and a connecting plate, a plurality of suction cups are fixedly mounted in the mounting plate, the connecting plate movably abuts against the top of the mounting plate, and a positioning mechanism and a testing mechanism are arranged at the top of the connecting plate; the positioning mechanism comprises a driving arm, two rotating frames and six sliding seats, and a plurality of positioning rods are fixedly installed on the outer sides of the sliding seats. Automatic surface mounting and welding of semiconductors are achieved through the three-way driving mechanism, the grabbing mechanism and the welding mechanism, centering positioning, position calibration and welding stability testing of semiconductor chips are achieved in cooperation with the positioning mechanism, the industrial camera and the testing mechanism, and therefore the rate of finished products is increased.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to an integrated semiconductor mounting and bonding equipment. Background Technology

[0002] Pick and place machine: also known as "placement machine" or "surface mount system", it is a device that is set after the dispensing machine or screen printer in the production line. It is a device that accurately places surface mount components onto the PCB pads by moving the placement head. It is divided into manual and fully automatic types. The fully automatic pick and place machine is a device used to achieve high-speed, high-precision, fully automatic placement of components. It is the most critical and complex equipment in the entire SMT production. The pick and place machine is the main equipment in the SMT production line. The pick and place machine has evolved from the early low-speed mechanical pick and place machine to the high-speed optical alignment pick and place machine, and is developing towards multi-functionality, flexible connection and modularity.

[0003] Traditional semiconductor mounting and soldering equipment can perform semiconductor mounting and soldering, but it cannot calibrate mounting accuracy during the mounting process, nor can it test soldering stability after mounting and soldering, which easily leads to defective products and reduces the yield. Therefore, we propose an integrated semiconductor mounting and soldering equipment to solve this problem. Summary of the Invention

[0004] The purpose of this invention is to provide an integrated semiconductor mounting and bonding device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A semiconductor mounting and soldering integrated equipment includes: a base, a three-way driving mechanism is provided on the top of the base, a gripping mechanism is connected to the bottom end of the three-way driving mechanism, and a soldering mechanism is provided on one side of the gripping mechanism; The gripping mechanism includes a mounting plate and a connecting plate. Multiple suction cups are fixedly installed inside the mounting plate, and the connecting plate is movably abutted against the top of the mounting plate. The top of the connecting plate is provided with a positioning mechanism and a testing mechanism. The positioning mechanism includes a drive arm, two rotating frames and six sliding seats. Multiple positioning rods are fixedly installed on the outer side of the sliding seats, and a linkage rod is rotatably connected to the top of the sliding seats. Arc-shaped connecting rods are rotatably connected to both ends of the top of the drive arm. The other ends of the arc-shaped connecting rods and the linkage rods are rotatably connected to the top of the corresponding rotating frames. The rotating frames and the drive arm are both rotatably connected to the top of the connecting plate. The testing mechanism includes a rotary motor and a fixed ring. The fixed ring is fixedly installed on the top of the connecting plate, and multiple arc-shaped protrusions are integrally formed on the outer side of the fixed ring. The rotary motor is fixedly installed on the top of the mounting plate, and a screw and a rotating plate are fixedly connected to the output shaft of the rotary motor. A sliding frame is slidably sleeved on the outer side of the rotating plate, and an abutment wheel is rotatably connected to the bottom of the sliding frame. The abutment wheel movably abuts against the outer side of the fixed ring.

[0006] Preferably, a compression spring is fixedly connected to the outer side of the sliding frame, and a pressure sensor is fixedly connected to the other end of the compression spring. The pressure sensor is fixedly connected to one end of the rotating plate. A horizontal plate is threadedly connected to the outer side of the screw. A control button is provided on the top of the connecting plate and is located directly below the horizontal plate. Two guide rods are fixedly connected to the top of the mounting plate, and the horizontal plate is slidably sleeved on the outside of the two guide rods. The top of the connecting plate has two through holes, and the two guide rods pass through the corresponding through holes.

[0007] Preferably, a drive motor is fixedly mounted on the top of the connecting plate, and the drive arm is fixedly connected to the output shaft of the drive motor.

[0008] Preferably, the three-way drive mechanism includes two first linear modules, a second linear module, and a third linear module. Support plates are fixedly connected to both ends of the bottom of the two first linear modules. The bottom of the support plates is fixedly connected to the top of the base. Connecting plates are fixedly connected to the output ends of the first linear modules. Two connecting plates are fixedly connected to both ends of the second linear modules. The third linear module is fixedly connected to the output end of the second linear modules. Connecting brackets are fixedly connected to the output end of the third linear module. Support legs are fixedly connected to the four corners of the bottom of the base. A drag chain is provided on the top of the second linear module. A U-shaped plate is fixedly connected to the top of the mounting plate, and the U-shaped plate is fixedly connected to the bottom of the connecting frame.

[0009] Preferably, square holes are provided on both sides of the top of the connecting plate, and square plates are slidably installed in the square holes. Two guide holes are provided on the front side of the U-shaped plate, and the two square plates are slidably connected in the corresponding guide holes. A limiting rod is fixedly installed inside the square hole, and the square plate is slidably sleeved on the outside of the corresponding limiting rod.

[0010] Preferably, the welding mechanism includes an electric push rod, a mounting base, and a spot welding head. The output end of the electric push rod is fixedly connected to the top of the mounting base, and the spot welding head is fixedly connected inside the mounting base.

[0011] Preferably, side frames are fixedly installed on both sides of the connecting frame, the electric push rod is fixedly installed on one of the side frames, and an industrial camera is fixedly installed inside the other side frame.

[0012] Preferably, the bottom of the connecting plate has a vertical groove, a retaining plate is slidably installed in the vertical groove, the top of the mounting plate has a retaining groove, the retaining plate is movably engaged in the retaining groove, and an iron sheet and a connecting spring are fixedly connected to the top of the retaining plate. The top of the connecting spring is fixedly connected to the inner wall of the top of the vertical groove, and an electromagnet is fixedly connected to the inner wall of the top of the vertical groove.

[0013] Preferably, the top of the connecting plate is fixedly mounted with multiple fixed shafts and multiple guide rails, the sliding seat is slidably sleeved on the outside of the corresponding guide rail, and the rotating frame is rotatably sleeved on the outside of the fixed shaft.

[0014] The beneficial effects of this invention are as follows: 1. In this invention, a semiconductor mounting and welding integrated equipment is described. By activating the first linear module, the connecting plate and the second linear module move back and forth. The second linear module drives the third linear module to move left and right. The third linear module drives the connecting frame to move up and down, thereby realizing three-dimensional movement control of the connecting frame. This moves the mounting plate directly below the semiconductor chip to be mounted, and makes the suction cup adhere to the semiconductor chip. By activating the drive motor, the drive arm rotates. The drive arm drives the two rotating frames to rotate through two arc-shaped connecting rods. The rotating frames, in cooperation with three linkage rods, drive the three sliding seats located on the same side to move closer to each other, and make the positioning rod abut against the outside of the semiconductor chip, thereby centering and positioning the semiconductor chip. Then, the suction cup is evacuated by the air extraction mechanism, thereby adsorbing and positioning the semiconductor chip. 2. In this invention, the integrated semiconductor mounting and soldering equipment realizes the handling of semiconductor chips by activating a three-way drive mechanism, thereby automatically transporting the semiconductor chips to a designated position on a circuit board printed with solder paste, and realizing automatic mounting. 3. In this invention, the integrated semiconductor mounting and welding equipment opens the exhaust valve to contact the adsorption of the semiconductor chip, then starts the three-way drive mechanism to move the industrial camera above the semiconductor chip to calibrate the position of the semiconductor chip, and then drives the spot welding head to move through the three-way drive mechanism and electric push rod to realize the automatic welding of the semiconductor chip. 4. In this invention, a semiconductor mounting and soldering integrated device uses a three-way drive mechanism to move the mounting plate directly above the semiconductor chip. Then, a drive motor is activated to move multiple positioning rods closer together, achieving clamping and positioning of the semiconductor chip. Next, an electromagnet is energized, generating magnetism to attract an iron sheet and move the clamping plate upwards, causing it to disengage from the slot and release the connection plate from the mounting plate. Then, a rotary motor is activated to rotate the rotating plate and screw. Simultaneously, the rotating plate drives the sliding frame and the abutment wheel in a circular motion. When the abutment wheel abuts against the arc-shaped protrusion, it applies a horizontal thrust to the fixing ring and the connecting plate. When the semiconductor chip soldering stability is sufficient, the fixing ring and the connecting plate will not shift. The abutment wheel moves along the circular axis... While moving, the plate is abutted by the arc-shaped protrusion, causing it to move outward and compress the spring. The pressure sensor monitors the pressure change of the spring. During the rotation of the plate, the abutting wheel applies forces in different directions to the fixed ring, connecting plate, and semiconductor chip, causing the spring to be compressed intermittently. The pressure value sensed by the pressure sensor increases and decreases periodically. At the same time, the rotating motor drives the screw to rotate. The screw is driven by the thread of the horizontal plate and guided by the guide rod, causing the horizontal plate to move downward gradually until it contacts the control button. The control button sends a signal to end the detection, thereby determining whether the pressure value sensed by the pressure sensor increases by the same amount each time during the detection process, thus judging the stability of the semiconductor chip welding. 5. The semiconductor mounting and welding integrated equipment described in this invention realizes automatic mounting and welding of semiconductors through a three-way drive mechanism, a gripping mechanism and a welding mechanism, and cooperates with a positioning mechanism, an industrial camera and a testing mechanism to realize the centering and positioning, position calibration and welding stability testing of semiconductor chips, thereby improving the yield. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a semiconductor mounting and welding integrated device proposed in this invention; Figure 2 This is a three-dimensional structural diagram of a semiconductor mounting and bonding integrated device proposed in this invention from another perspective; Figure 3 This is a three-dimensional structural diagram of the gripping mechanism proposed in this invention; Figure 4 for Figure 3 A magnified view of a portion of the image; Figure 5 for Figure 3 Another enlarged view of a portion of the image; Figure 6 This is a three-dimensional structural diagram of the testing mechanism proposed in this invention; Figure 7 This is a cross-sectional structural diagram of the testing mechanism proposed in this invention; Figure 8 This is a cross-sectional structural schematic diagram of the gripping mechanism proposed in this invention; Figure 9 for Figure 8 A magnified view of part A in the image; Figure 10 for Figure 8 A magnified view of part B in the image; Figure 11 This is a partial three-dimensional structural diagram of a semiconductor mounting and welding integrated device proposed in this invention.

[0016] In the diagram: 1. Base; 101. Support leg; 102. Support plate; 2. First linear module; 201. Connecting plate; 3. Second linear module; 4. Third linear module; 401. Connecting frame; 5. Mounting plate; 501. U-shaped plate; 502. Square plate; 503. Limiting rod; 6. Connecting plate; 7. Fixing ring; 701. Arc-shaped protrusion; 8. Rotary motor; 801. Rotating plate; 802. Screw; 803. Horizontal plate; 804. Guide rod; 805. Control button; 806. Sliding frame; 807. Abutment wheel; 808. Compression spring; 809. Pressure sensor; 9. Sliding seat; 901. Positioning rod; 902. Guide rail; 903. Linkage rod; 904. Fixed shaft; 905. Rotating frame; 906. Arc-shaped connecting rod; 907. Drive arm; 908. Drive motor; 10. Clamping plate; 11. Iron sheet; 12. Electromagnet; 13. Connecting spring; 14. Side frame; 15. Industrial camera; 16. Electric push rod; 17. Mounting base; 18. Spot welding head; 19. Suction cup; 20. Cable drag chain. Detailed Implementation

[0017] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0018] Reference Figure 1 - Figure 11 A semiconductor mounting and soldering integrated equipment includes: a base 1, a three-way drive mechanism is provided on the top of the base 1, a gripping mechanism is connected to the bottom of the three-way drive mechanism, and a soldering mechanism is provided on one side of the gripping mechanism. The gripping mechanism includes a mounting plate 5 and a connecting plate 6. Multiple suction cups 19 are fixedly installed inside the mounting plate 5. The top of each suction cup 19 is connected to an air extraction pipe, and the other end of the air extraction pipe is connected to an air extraction mechanism. An exhaust valve is provided on the air extraction pipe. The connecting plate 6 is movably abutted against the top of the mounting plate 5. A positioning mechanism and a testing mechanism are provided on the top of the connecting plate 6. The positioning mechanism includes a drive arm 907, two rotating frames 905 and six sliding seats 9. Multiple positioning rods 901 are fixedly installed on the outside of the sliding seats 9, and a linkage rod 903 is rotatably connected to the top of the sliding seats 9. Arc-shaped connecting rods 906 are rotatably connected to both ends of the top of the drive arm 907. The other ends of the arc-shaped connecting rods 906 and the linkage rods 903 are rotatably connected to the top of the corresponding rotating frames 905. The rotating frames 905 and the drive arm 907 are rotatably connected to the top of the connecting plate 6. The testing mechanism includes a rotary motor 8 and a fixed ring 7. The fixed ring 7 is fixedly installed on the top of the connecting plate 6, and multiple arc-shaped protrusions 701 are integrally formed on the outer side of the fixed ring 7. The rotary motor 8 is fixedly installed on the top of the mounting plate 5, and a screw 802 and a rotating plate 801 are fixedly connected to the output shaft of the rotary motor 8. A sliding frame 806 is slidably sleeved on the outer side of the rotating plate 801. An abutment wheel 807 is rotatably connected to the bottom of the sliding frame 806, and the abutment wheel 807 is movably abutting against the outer side of the fixed ring 7.

[0019] In this embodiment, a compression spring 808 is fixedly connected to the outer side of the sliding frame 806, and a pressure sensor 809 is fixedly connected to the other end of the compression spring 808. The pressure sensor 809 is fixedly connected to one end of the rotating plate 801, thereby monitoring the pressure of the compression spring 808 through the pressure sensor 809. A horizontal plate 803 is threadedly connected to the outer side of the screw 802. A control button 805 is provided on the top of the connecting plate 6. The control button 805 is located directly below the horizontal plate 803. Two guide rods 804 are fixedly connected to the top of the mounting plate 5. The horizontal plate 803 is slidably sleeved on the outside of the two guide rods 804, thereby guiding the horizontal plate 803. Two through holes are opened on the top of the connecting plate 6. The two guide rods 804 pass through the corresponding through holes to avoid the connecting plate 6 obstructing the movement of the guide rods 804.

[0020] In this embodiment, a drive motor 908 is fixedly installed on the top of the connecting plate 6, and a drive arm 907 is fixedly connected to the output shaft of the drive motor 908, thereby driving the drive arm 907 to rotate.

[0021] In this embodiment, the three-way drive mechanism includes two first linear modules 2, a second linear module 3, and a third linear module 4. Support plates 102 are fixedly connected to both ends of the bottom of the two first linear modules 2. The bottom of the support plates 102 is fixedly connected to the top of the base 1. Connecting plates 201 are fixedly connected to the output end of the first linear modules 2. The two connecting plates 201 are fixedly connected to both ends of the second linear modules 3 respectively. The third linear module 4 is fixedly connected to the output end of the second linear modules 3. Connecting brackets 401 are fixedly connected to the output end of the third linear modules 4. Support legs 101 are fixedly connected to the four corners of the bottom of the base 1. A drag chain 20 is provided on the top of the second linear modules 3. A U-shaped plate 501 is fixedly connected to the top of the mounting plate 5. The U-shaped plate 501 is fixedly connected to the bottom of the connecting bracket 401.

[0022] In this embodiment, square holes are provided on both sides of the top of the connecting plate 6. A square plate 502 is slidably installed in the square holes. Two guide holes are provided on the front side of the U-shaped plate 501. The two square plates 502 are slidably connected in the corresponding guide holes, thereby realizing the guidance between the connecting plate 6 and the mounting plate 5. A limit rod 503 is fixedly installed in the square hole. The square plate 502 is slidably sleeved on the outside of the corresponding limit rod 503 to guide the square plate 502. The welding mechanism includes an electric push rod 16, a mounting base 17 and a spot welding head 18. The output end of the electric push rod 16 is fixedly connected to the top of the mounting base 17, and the spot welding head 18 is fixedly connected in the mounting base 17.

[0023] In this embodiment, side frames 14 are fixedly installed on both sides of the connecting frame 401. An electric push rod 16 is fixedly installed on one of the side frames 14. An industrial camera 15 is fixedly installed inside the other side frame 14. The industrial camera 15 can acquire images of the placement position of the semiconductor chip and can calibrate the placement position by comparing the images.

[0024] In this embodiment, a vertical groove is provided at the bottom of the connecting plate 6, and a locking plate 10 is slidably installed in the vertical groove. A slot is provided at the top of the mounting plate 5, and the locking plate 10 is movably locked in the slot. An iron sheet 11 and a connecting spring 13 are fixedly connected to the top of the locking plate 10. The top end of the connecting spring 13 is fixedly connected to the inner wall of the top of the vertical groove. An electromagnet 12 is fixedly connected to the inner wall of the top of the vertical groove, and the electromagnet 12 and the iron sheet 11 are magnetically attracted to each other.

[0025] In this embodiment, multiple fixed shafts 904 and multiple guide rails 902 are fixedly installed on the top of the connecting plate 6. The sliding seat 9 is slidably sleeved on the outside of the corresponding guide rail 902, thereby guiding the sliding seat 9. The rotating frame 905 is rotatably sleeved on the outside of the fixed shaft 904, thereby rotating and positioning the rotating frame 905.

[0026] In this embodiment, during use, the first linear module 2 is activated to drive the connecting plate 201 and the second linear module 3 to move back and forth. The second linear module 3 drives the third linear module 4 to move left and right. The third linear module 4 drives the connecting frame 401 to move up and down, thereby realizing three-dimensional movement control of the connecting frame 401. This moves the mounting plate 5 directly below the semiconductor chip to be mounted, and makes the suction cup 19 adhere to the semiconductor chip. The drive motor 908 is activated to drive the drive arm 907 to rotate. The drive arm 907 drives the two rotating frames 905 to rotate through two arc-shaped connecting rods 906. The rotating frames 905, through cooperation with three linkage rods 903, drive the three sliding seats 9 on the same side to move closer to each other, and make the positioning rod 901 abut against the outside of the semiconductor chip, thereby centering and positioning the semiconductor chip. Then, the suction cup 19 is evacuated by the air extraction mechanism, thereby adsorbing and positioning the semiconductor chip. By activating a three-way drive mechanism, the semiconductor chip is transported, thereby automatically transporting the semiconductor chip to a designated position on a circuit board printed with solder paste, thus achieving automatic mounting. After mounting, the exhaust valve is opened to contact the adsorption of the semiconductor chip. Then, the three-way drive mechanism is activated to move the industrial camera 15 above the semiconductor chip to calibrate the position of the semiconductor chip. Then, the three-way drive mechanism and the electric push rod 16 drive the spot welding head 18 to move to realize the automatic welding of the semiconductor chip. After welding, the mounting plate 5 is moved to directly above the semiconductor chip by a three-way drive mechanism. Then, the drive motor 908 is activated to move multiple positioning rods 901 closer together, achieving clamping and positioning of the semiconductor chip. Next, the electromagnet 12 is energized, generating magnetism to attract the iron sheet 11 and move the clamping plate 10 upwards, causing it to disengage from the slot and release the connection plate 6 from the mounting plate 5. Then, the rotary motor 8 is activated to rotate the rotating plate 801 and the screw 802. Simultaneously, the rotating plate 801 drives the sliding frame 806 and the abutment wheel 807 in a circular motion. When the abutment wheel 807 abuts against the arc-shaped protrusion 701, it applies a horizontal thrust to the fixing ring 7 and the connecting plate 6. When the semiconductor chip welding stability is sufficient, the fixing ring 7 and the connecting plate 6 will not shift. The abutment wheel 807, while moving in a circular motion, is subjected to the arc-shaped protrusion 701. The contact wheel 807 moves outward, compressing the spring 808. The pressure sensor 809 monitors the pressure changes of the spring 808. During the rotation of the rotating plate 801, the contact wheel 807 applies forces in different directions to the fixing ring 7, connecting plate 6, and semiconductor chip, causing the spring 808 to be compressed intermittently. The pressure value sensed by the pressure sensor 809 increases and decreases periodically. At the same time, the rotating motor 8 drives the screw 802 to rotate. The screw 802 is driven by the thread of the horizontal plate 803 and guided by the guide rod 804, causing the horizontal plate 803 to move downward gradually until it contacts the control button 805. The control button 805 sends a signal to end the detection, thereby determining whether the increase in pressure value sensed by the pressure sensor 809 is equal each time during the detection process, thus judging the stability of the semiconductor chip welding.

[0027] The semiconductor mounting and soldering integrated equipment provided by the present invention has been described in detail above. Specific embodiments have been used to illustrate the principles and implementation methods of the present invention. The descriptions of these embodiments are merely for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A semiconductor mounting and soldering integrated equipment, characterized in that, include: The base (1) is provided with a three-way drive mechanism at the top and a gripping mechanism at the bottom. A welding mechanism is provided on one side of the gripping mechanism. The gripping mechanism includes a mounting plate (5) and a connecting plate (6). Multiple suction cups (19) are fixedly installed inside the mounting plate (5), and the connecting plate (6) is movably abutted against the top of the mounting plate (5). The top of the connecting plate (6) is provided with a positioning mechanism and a testing mechanism. The positioning mechanism includes a drive arm (907), two rotating frames (905) and six sliding seats (9). Multiple positioning rods (901) are fixedly installed on the outer side of the sliding seats (9), and a linkage rod (903) is rotatably connected to the top of the sliding seats (9). Arc-shaped connecting rods (906) are rotatably connected to both ends of the top of the drive arm (907). The other ends of the arc-shaped connecting rods (906) and the linkage rods (903) are rotatably connected to the top of the corresponding rotating frames (905), and the rotating frames (905) and the drive arm (907) are rotatably connected to the top of the connecting plate (6). The testing mechanism includes a rotary motor (8) and a fixed ring (7). The fixed ring (7) is fixedly installed on the top of the connecting plate (6), and multiple arc-shaped protrusions (701) are integrally formed on the outer side of the fixed ring (7). The rotary motor (8) is fixedly installed on the top of the mounting plate (5), and a screw (802) and a rotating plate (801) are fixedly connected to the output shaft of the rotary motor (8). A sliding frame (806) is slidably sleeved on the outer side of the rotating plate (801), and an abutting wheel (807) is rotatably connected to the bottom of the sliding frame (806). The abutting wheel (807) abuts against the outer side of the fixed ring (7).

2. The semiconductor mounting and soldering integrated equipment according to claim 1, characterized in that, A compression spring (808) is fixedly connected to the outside of the sliding frame (806), and a pressure sensor (809) is fixedly connected to the other end of the compression spring (808). The pressure sensor (809) is fixedly connected to one end of the rotating plate (801). The screw (802) is threadedly connected to a horizontal plate (803). A control button (805) is provided on the top of the connecting plate (6). The control button (805) is located directly below the horizontal plate (803). Two guide rods (804) are fixedly connected to the top of the mounting plate (5). The horizontal plate (803) is slidably sleeved on the outside of the two guide rods (804). The top of the connecting plate (6) has two through holes, and the two guide rods (804) pass through the corresponding through holes respectively.

3. The semiconductor mounting and soldering integrated equipment according to claim 1, characterized in that, A drive motor (908) is fixedly installed on the top of the connecting plate (6), and the drive arm (907) is fixedly connected to the output shaft of the drive motor (908).

4. The semiconductor mounting and soldering integrated equipment according to claim 1, characterized in that, The three-way drive mechanism includes two first linear modules (2), a second linear module (3), and a third linear module (4). Support plates (102) are fixedly connected to both ends of the bottom of the two first linear modules (2). The bottom of the support plates (102) is fixedly connected to the top of the base (1). A connecting plate (201) is fixedly connected to the output end of the first linear module (2). The two connecting plates (201) are fixedly connected to both ends of the second linear module (3). The third linear module (4) is fixedly connected to the output end of the second linear module (3). A connecting frame (401) is fixedly connected to the output end of the third linear module (4). Support legs (101) are fixedly connected to the four corners of the bottom of the base (1). A drag chain (20) is provided on the top of the second linear module (3). A U-shaped plate (501) is fixedly connected to the top of the mounting plate (5), and the U-shaped plate (501) is fixedly connected to the bottom of the connecting frame (401).

5. The semiconductor mounting and soldering integrated equipment according to claim 1, characterized in that, The top two sides of the connecting plate (6) are provided with square holes, and square plates (502) are slidably installed in the square holes. The front side of the U-shaped plate (501) is provided with two guide holes, and the two square plates (502) are slidably connected in the corresponding guide holes respectively. A limiting rod (503) is fixedly installed inside the square hole, and the square plate (502) is slidably sleeved on the outside of the corresponding limiting rod (503).

6. The semiconductor mounting and soldering integrated equipment according to claim 4, characterized in that, The welding mechanism includes an electric push rod (16), a mounting base (17), and a spot welding head (18). The output end of the electric push rod (16) is fixedly connected to the top of the mounting base (17), and the spot welding head (18) is fixedly connected inside the mounting base (17).

7. The semiconductor mounting and soldering integrated equipment according to claim 6, characterized in that, Side frames (14) are fixedly installed on both sides of the connecting frame (401). The electric push rod (16) is fixedly installed on one of the side frames (14), and an industrial camera (15) is fixedly installed inside the other side frame (14).

8. The semiconductor mounting and soldering integrated equipment according to claim 1, characterized in that, The bottom of the connecting plate (6) is provided with a vertical groove, and a card plate (10) is slidably installed in the vertical groove. The top of the mounting plate (5) is provided with a card slot, and the card plate (10) is movably engaged in the card slot. The top of the card plate (10) is fixedly connected with an iron sheet (11) and a connecting spring (13). The top of the connecting spring (13) is fixedly connected to the inner wall of the top of the vertical groove, and an electromagnet (12) is fixedly connected to the inner wall of the top of the vertical groove.

9. A semiconductor mounting and soldering integrated equipment according to claim 1, characterized in that, The top of the connecting plate (6) is fixedly installed with multiple fixed shafts (904) and multiple guide rails (902). The sliding seat (9) is slidably sleeved on the outside of the corresponding guide rail (902), and the rotating frame (905) is rotatably sleeved on the outside of the fixed shaft (904).

Images