Preparation method of solar cell and photovoltaic module
By increasing the thickness at the edges of solar cells and optimizing stress distribution, the problems of silicon wafer warping and microcracks were solved, improving product yield and reliability.
CN120936137APending Publication Date: 2025-11-11HUAIAN JIETAI NEW ENERGY TECHNOLOGY CO LTD
0 Cites 0 Cited by
Patent Information
- Application Number
- CN202511120443.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-30
- Publication Date
- 2025-11-11
AI Technical Summary
Technical Problem
In existing solar cell manufacturing processes, uneven stress on silicon wafers leads to a high risk of warping, microcracks, and fragmentation, affecting product yield and reliability.
Method used
By increasing the thickness of the non-gateline region at the edge of the silicon wafer to be greater than that of the middle section, and by combining laser and wet etching processes to optimize stress distribution, the structural strength of the edge region is ensured.
Benefits of technology
This improves the structural strength of solar cells, reduces the risk of warping and impact damage, and increases product yield and lifespan.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention provides a preparation method of a solar cell and a photovoltaic module, and relates to the field of photovoltaic technology. The preparation method comprises the steps that the doped polycrystalline silicon layer and part of the silicon wafer in the non-grid line area are removed through etching, and the etching depth of the middle part of the silicon wafer is larger than that of the edge part of the silicon wafer. Compared with the non-grid line area of the middle part, the non-grid line area of the edge part is thicker, so that the structural strength of the non-grid line area of the edge part is better than that of the middle part. Therefore, the silicon wafer and the solar cell are not easy to warp, crack or fragment, and are not easy to damage due to collision. In the processing of a solar cell, the assembling process of a photovoltaic module and the subsequent use process of the photovoltaic module, the silicon wafer with better reliability can enable the solar cell to have higher product yield, better performance and longer service life.
Need to check novelty before this filing date? Find Prior Art