Manufacturing jig of electric connection device and manufacturing method of electric connection device

Abstract

A jig for manufacturing an electrical connection device is provided with a jig in which a first guide plate and a second guide plate, each of which has a through-hole (100) penetrating from a first surface to a second surface, are stacked so as to be relatively movable along the first surface. The through hole (100) includes: a common portion (110) extending in a first direction in plan view; a first guide portion (111) extending from the common portion (110) in a second direction different from the first direction; and a second guide portion (112) extending from the common portion (110) in a third direction different from the first direction and the second direction. The jig is configured such that the probe (20) can be continuously inserted into the first guide part (111) and the second guide part (112) in the first guide plate and the second guide plate, respectively.

Description

Technical Field

[0001] The present invention relates to a manufacturing fixture for an electrical connection device used for inspecting an object and a method for manufacturing the electrical connection device. Background Technology

[0002] In the inspection of integrated circuits and other objects, an electrical connection device with probes that contact the object being inspected is used. During inspection using this device, one end of the probe contacts the electrode terminals of the object being inspected. The other end of the probe is electrically connected to a wiring pattern arranged on the circuit board of the electrical connection device. The wiring pattern is then electrically connected to an inspection device such as a tester. This allows for the exchange of electrical signals between the object being inspected and the inspection device using the probe.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2010-197257 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] In manufacturing electrical connection devices, it is necessary to attach the probe to the circuit board in a manner that precisely positions the end of the probe that contacts the electrode terminals of the object being inspected (hereinafter referred to as the "contact portion"). Furthermore, it is necessary to attach the probe to the circuit board with a narrow pitch in the electrical connection device, corresponding to the narrowing of the electrode terminals of the object being inspected.

[0008] The purpose of this invention is to provide a manufacturing fixture and a method for manufacturing an electrical connection device capable of precisely and narrowly pitching probes onto a circuit board.

[0009] Solution for solving the problem

[0010] A manufacturing fixture for an electrical connection device according to one embodiment of the present invention includes a fixture in which a first guide plate and a second guide plate, each having a through hole extending from a first surface to a second surface, are stacked in a manner capable of relative movement along the first surface. The through hole includes: a common portion extending along a first direction when viewed from above; a first guide portion extending from the common portion in a second direction different from the first direction; and a second guide portion extending from the common portion in a third direction different from both the first and second directions. The fixture is configured such that a probe can be continuously inserted into the first guide portion and the second guide portion, respectively, in the first guide plate and the second guide plate.

[0011] The effects of the invention

[0012] According to the present invention, a manufacturing fixture for an electrical connection device capable of precisely and narrowly pitching probes to a circuit board and a method for manufacturing the electrical connection device are provided. Attached Figure Description

[0013] Figure 1 This is a schematic diagram illustrating the structure of the manufacturing fixture according to the embodiment.

[0014] Figure 2 The structure of the manufacturing fixture shown in the embodiment is along... Figure 1 A schematic cross-sectional view along the II-II direction.

[0015] Figure 3 This is a schematic top view illustrating the structure of the manufacturing fixture according to the embodiment.

[0016] Figure 4 This is a schematic top view showing the shape of the through hole formed in the guide plate of the manufacturing fixture in the embodiment.

[0017] Figure 5 This is a schematic top view showing the shape of the through hole formed in the guide plate of the comparative example.

[0018] Figure 6A This is a schematic front view (of 1) illustrating the method of accommodating a probe in a manufacturing fixture of an embodiment.

[0019] Figure 6B This is a schematic cross-sectional view (of 1) used to illustrate the method of accommodating the probe in the manufacturing fixture of the embodiment.

[0020] Figure 6C This is a schematic top view (of 1) used to illustrate the method of accommodating a probe in a manufacturing fixture.

[0021] Figure 7A This is a schematic front view (of 2) used to illustrate the method of accommodating a probe in a manufacturing fixture.

[0022] Figure 7B This is a schematic cross-sectional view (of 2) used to illustrate the method of accommodating a probe in a manufacturing fixture.

[0023] Figure 7C This is a schematic top view (of 2) used to illustrate the method of accommodating a probe in a manufacturing fixture.

[0024] Figure 8A This is a schematic top view showing the position of the probe in the through hole of the first guide plate.

[0025] Figure 8B This is a schematic top view showing the position of the probe in the through hole of the second guide plate.

[0026] Figure 9A This is a schematic cross-sectional view showing the state of the probe being inserted into the fixture.

[0027] Figure 9B This is a schematic cross-sectional view showing another state of the probe being inserted into the fixture.

[0028] Figure 9C This is a schematic cross-sectional view showing another state of the probe being inserted into the fixture.

[0029] Figure 9D This is a schematic cross-sectional view showing another state of the probe being inserted into the fixture.

[0030] Figure 9E This is a schematic cross-sectional view showing another state of the probe being inserted into the fixture.

[0031] Figure 10 This is a schematic diagram illustrating a method for calibrating the orientation of a probe in a calibration fixture.

[0032] Figure 11 This is a flowchart illustrating a method for attaching probes to a circuit board using a manufacturing fixture according to an embodiment.

[0033] Figure 12 This is a schematic diagram (1) illustrating a method for attaching a probe to a circuit board using a manufacturing fixture according to an embodiment.

[0034] Figure 13 This is a schematic diagram (of 2) illustrating a method for attaching a probe to a circuit board using a manufacturing fixture according to an embodiment.

[0035] Figure 14A This is a schematic top view (of 1) showing the shape of the through hole formed by the guide plate of the manufacturing jig in another embodiment.

[0036] Figure 14B This is a schematic top view (of 2) showing another shape of the through hole formed by the guide plate of the manufacturing jig in another embodiment.

[0037] Figure 14C This is a schematic top view (of 3) showing yet another shape of the through hole formed by the guide plate of the manufacturing jig in another embodiment. Detailed Implementation

[0038] Next, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description of the drawings, the same or similar reference numerals are used to label the same or similar parts. However, it should be noted that the drawings are schematic, and the thickness ratios of the various parts may differ from the actual figures. Furthermore, the drawings naturally include parts with different dimensional relationships or ratios. The embodiments shown below are examples of apparatus and methods for embodying the technical concept of the present invention; the material, shape, structure, and arrangement of the structural components in the embodiments of the present invention are not specific to the following description.

[0039] Figures 1-3 The manufacturing fixture for the electrical connection device of the embodiment of the present invention shown is used in the manufacture of an electrical connection device formed by bonding a probe 20 that contacts the object to be inspected to a circuit board. For example... Figure 1 As shown, the probe 20 has a cantilevered arm 21 and a support 22 connected to the fixed end 201 of the arm 21. The contact portion 210, which is the front end of the free end 202 of the arm 21, is the part that contacts the object being inspected.

[0040] The manufacturing fixture of the embodiment includes a fixture 1, which includes a first guide plate 11 and a second guide plate 12. Through holes 100 are formed on the first guide plate 11 and the second guide plate 12, extending from a first surface 101 to a second surface 102 facing the opposite direction to the first surface 101. The probe 20, held in place by the fixture 1, engages with a circuit board of an electrical connection device, as detailed later. The circuit board of the electrical connection device is, for example, a relay substrate. During the inspection of the object to be inspected, the object to be inspected and the inspection device, such as a tester, are electrically connected via the probe 20 and signal wiring formed on the circuit board. The contact portion 210 of the probe 20 contacts the electrode terminals of the object to be inspected.

[0041] The fixture 1 has the following structure: the first guide plate 11 and the second guide plate 12 are stacked such that the probe 20 continuously passes through the through hole 100 of the first guide plate 11 and the through hole 100 of the second guide plate 12. The first guide plate 11 and the second guide plate 12 are stacked with the second surface 102 of the first guide plate 11 and the first surface 101 of the second guide plate 12 facing each other. Hereinafter, the first surface 101 of the first guide plate 11 will also be referred to as the "first main surface 1A" of the fixture 1, and the second surface 102 of the second guide plate 12 will also be referred to as the "second main surface 1B" of the fixture 1.

[0042] Hereinafter, without specifically defining the first guide plate 11 and the second guide plate 12, they will be referred to as "guide plate 10". The guide plate 10 has a through hole 100 through which the probe 20 passes.

[0043] like Figure 1As shown, the through-hole 100's through-direction, i.e., the thickness direction of the guide plate 10, is set as the Z direction. Figure 1 In this diagram, the Z direction is the vertical direction of the paper, the X direction is the horizontal direction of the paper, and the Y direction is the depth direction of the paper. In the description of the embodiment, the view taken from the Y direction is the front view. The front view shows a cut surface of the guide plate 10 along a plane parallel to the Z direction.

[0044] The fixture 1 holds the probe 20 with the probe 20 penetrating the through holes 100 of the first guide plate 11 and the second guide plate 12 respectively. When viewed from the X and Y directions, the second main surface 1B of the fixture 1 of the partial self-governing part 22 of the probe 20 is exposed.

[0045] Figure 2 It is along Figure 1 A cross-sectional view of fixture 1 in the II-II direction. Figure 3 This is a top view obtained by observing fixture 1 from the Z direction. Figure 1 It is along Figure 3 A cross-sectional view along the I-I direction. Figure 2 It is along Figure 3 A sectional view along direction II-II. Figure 3 In the image, the through hole 100 of the second guide plate 12 is indicated by dashed lines through the first guide plate 11. When viewed from above along the normal direction of the first surface 101, the probe 20 is rectangular in shape.

[0046] like Figure 3 As shown, the through hole 100 includes a common portion 110, a first guide portion 111, and a second guide portion 112. The common portion 110, the first guide portion 111, and the second guide portion 112 extend linearly when viewed from above. Hereinafter, the direction in which the common portion 110 extends will be referred to as the "first direction." The first guide portion 111 extends from the common portion 110 in a direction different from the first direction when viewed from above. Hereinafter, the direction in which the first guide portion 111 extends will be referred to as the "second direction." The second guide portion 112 extends from the common portion in a direction different from both the first and second directions when viewed from above. Hereinafter, the direction in which the second guide portion 112 extends will be referred to as the "third direction." The first guide portion 111 may also be connected to one end of the common portion 110 (hereinafter also referred to as the "first end"). The second guide portion 112 may also be connected to the other end of the common portion 110 (hereinafter also referred to as the "second end").

[0047] The fixture 1 holds the probes 20, which are respectively inserted into the first guide portion 111 and the second guide portion 112. The fixture 1 is configured such that, with the first probe 20 inserted into the first guide portion 111 and the second probe 20 inserted into the second guide portion 112, the first guide plate 11 and the second guide plate 12 are movable relative to each other along the first surface 101. The first guide plate 11 and the second guide plate 12 move relative to each other in a direction intersecting the through-hole 100, so that the probes 20 are clamped by the first guide plate 11 and the second guide plate 12; details will be explained later. Hereinafter, the areas through which the probes 20 pass, such as the first guide portion 111 and the second guide portion 112, will also be referred to as guide portions. The fixture 1 is configured such that the probes 20 can be continuously inserted into the first guide portion 111 and the second guide portion 112, respectively, by the first guide plate 11 and the second guide plate 12.

[0048] Figure 4 An example of the shape of the through hole 100 of the guide plate 10 is shown. The common portion 110 extends in a first direction D1 when viewed from above. The first guide portion 111 extends in a second direction D2 orthogonal to the first direction D1 when viewed from above, and the second guide portion 112 extends in a third direction D3 opposite to the second direction D2 when viewed from above. That is, in Figure 4 In the guide plate 10 shown, the second direction D2 and the third direction D3 are orthogonal to the first direction D1 when viewed from above, and the second direction D2 and the third direction D3 are in opposite directions. Alternatively, the first direction D1 can be parallel to the Y direction, and the second direction D2 and the third direction D3 can be parallel to the X direction.

[0049] When forming a through hole that appears rectangular in top view on a flat plate, it is difficult to make all four corners of the through hole right angles. Therefore, a retraction machining process is usually performed to create a recessed area at one corner of the through hole. Figure 5 In the comparative fixture 1M shown as a comparative example, when forming the guide hole 100A for the probe 20 to pass through, as... Figure 5 The recess R is formed as shown. However, if the recess R is formed in the guide hole 100A, then as shown... Figure 5 As shown, a certain distance W is required between adjacent guide holes 100A. Therefore, it hinders the narrowing of the configuration spacing of the probes 20.

[0050] In contrast, Figure 4 The common portion 110 of the through hole 100 formed by the guide plate 10 shown is formed as the recess portion of the first guide portion 111. In this way, by connecting the recess portion of the first guide portion 111 with the second guide portion 112, the arrangement spacing of the probes 20 can be narrowed.

[0051] The following is for reference Figure 6A , Figure 6B , Figures 6C to 7A , Figure 7B , Figure 7C An example of a probe-accommodating method in which the probe 20 is accommodated in the fixture 1 will be described. Furthermore, Figure 6A and Figure 7A This is the main view. Figure 6B and Figure 7B It is along Figure 6A and Figure 7A Sectional view along direction II-II, Figure 6C and Figure 7C This is a top view observed from the Z direction.

[0052] First, prepare a manufacturing jig including jig 1 and a probe 20. Then, set the position of the through hole 100 of the first guide plate 11 and the through hole 100 of the second guide plate 12 to be aligned, so that the probe 20 continuously penetrates the through holes 100 of the first guide plate 11 and the second guide plate 12. At this time, the inner wall surfaces of the through holes 100 of the first guide plate 11 and the second guide plate 12 are aligned. Then, as... Figure 6A , Figure 6B , Figure 6C As shown, probe 20 is inserted into the through holes 100 of the first guide plate 11 and the second guide plate 12. In other words, the first probe 20 is inserted into the first guide portion 111, and the second probe 20 is inserted into the second guide portion 112. At this time, the probe 20 is inserted into the through holes 100 of the first guide portion 111 and the second guide portion 112 such that a portion of the support portion 22 is exposed below the second main surface 1B of the fixture 1.

[0053] Next, with the probe 20 inserted into the first guide portion 111 and the second guide portion 112 respectively, the first guide plate 11 and the second guide plate 12 are moved relative to each other in a direction intersecting the through-hole 100's through-hole direction (Z direction). That is, as... Figure 7A , Figure 7B , Figure 7C As shown, the first guide plate 11 and the second guide plate 12 are moved relative to each other along the first surface 101. For example, as... Figure 7A As shown, in the X direction, the first guide plate 11 is moved to the right of the paper as indicated by arrow DX1, and the second guide plate 12 is moved to the left of the paper as indicated by arrow DX2. Then, in the Y direction, the first guide plate 11 is moved to the right of the paper as indicated by arrow DY1, and the second guide plate 12 is moved to the left of the paper as indicated by arrow DY2. That is, as... Figure 7C As shown, in the XY plane, the first guide plate 11 is moved to the lower right of the paper as indicated by arrow DZ1, and the second guide plate 12 is moved to the upper left of the paper as indicated by arrow DZ2.

[0054] Hereinafter, the action of moving the first guide plate 11 and the second guide plate 12 relative to each other will also be referred to as "sliding of the guide plates". During the sliding of the guide plates, the first guide plate 11 and the second guide plate 12 move relative to each other in a direction intersecting the through-hole 100. For example, the first guide plate 11 and the second guide plate 12 move relative to each other along the first surface 101. Alternatively, the position of either the first guide plate 11 or the second guide plate 12 may be fixed, while the position of the other may be moved. Furthermore, the direction of movement of the guide plate 10 can be either the X direction or the Y direction.

[0055] By sliding the guide plate, in the first guide portion 111 and the second guide portion 112 of the guide plate 10, the probe 20 abuts against one of the inner wall surfaces of the two opposing sides of the through hole 100, and separates from the other. For example, as Figure 8A and Figure 8B As shown, two adjacent sides of probe 20 abut against the inner wall surface of the through hole 100 of the first guide plate 11, and the other two adjacent sides of probe 20 abut against the inner wall surface of the through hole 100 of the second guide plate 12. At this time, probe 20 separates from the inner wall surface of the through hole 100 of the second guide plate 12, which has the same orientation as the inner wall surface of the through hole 100 of the first guide plate 11 that abuts against probe 20. Moreover, probe 20 abuts against the inner wall surface of the through hole 100 of the second guide plate 12, which has the same orientation as the inner wall surface of the through hole 100 of the first guide plate 11 that has separated from probe 20.

[0056] As described above, by moving the first guide plate 11 and the second guide plate 12 relative to each other in the XY plane, the probe 20 is clamped in each of the first guide portion 111 and the second guide portion 112 by the first guide plate 11 and the second guide plate 12. The fixture 1 fixes the position of the probe 20 by clamping the probe 20 by the guide plate 10.

[0057] Figures 9A to 9E The typical posture of the probe 20 inserted into the through hole 100 of the fixture 1 is shown before the guide plate slides. Figure 9A This shows the state in which the probe 20 is held at the center of the through hole 100. Figure 9B and Figure 9C This shows the state in which the probe 20 is biased toward one side of the through hole 100. Figure 9D and Figure 9E This shows the probe 20 tilted inside the through hole 100.

[0058] When using fixture 1 to attach probe 20 to a circuit board to manufacture an electrical connection device, it is necessary to hold probe 20 in the fixture 1 in the correct orientation. "Correct orientation" means that probe 20 is inserted straight into the through hole 100 to the predetermined position. Regardless of whether probe 20 is... Figures 9A to 9E In either of the states shown, probe 12 is pressed against the inner wall of the through hole 100 by the sliding of the guide plate, thereby being corrected to the correct posture. Based on this, probe 20 is held by fixture 1. Hereinafter, holding probe 20 in the correct posture in fixture 1 is defined as probe 20 being normally held in fixture 1.

[0059] However, sometimes the probe 20 does not remain properly on the fixture 1 after the guide plate slides. In this case, it is necessary to correct the posture of the probe 20. For example, the posture of the probe 20 can be corrected by the following method.

[0060] For example, in such Figure 10 As shown, with the probe 20 tilted inside the through-hole 100, the jig base plate 150, which contacts the tip of the probe 20, pushes the probe 20 into the through-hole 100 while simultaneously moving the jig base plate 150 parallel to the jig 1, as indicated by arrow M1. At this time, the probe 20 rotates around the contact point F between the end of the opening of the through-hole 100 of the second guide plate 12 and the probe 20, as indicated by the dashed arrow. By repeating the movement of the jig base plate 150 and the sliding of the guide plate, the probe 20 can be corrected to the correct posture.

[0061] According to the probe receiving method described above, the arrangement spacing of the probes 20 can be narrowed and the probes 20 can be received in the fixture 1 in the correct posture.

[0062] The following is for reference Figure 11 The flowchart illustrates an example of a manufacturing method for manufacturing an electrical connection device by using a manufacturing fixture including fixture 1 to attach probe 20 to a circuit board.

[0063] exist Figure 11 In step S10, like the reference Figure 6A , Figure 6B , Figures 6C to 7A , Figure 7B , Figure 7C As described, probe 20 is housed in fixture 1.

[0064] In step S20, the state of the probe 20 held by the fixture 1 is checked. Step S20 includes checking whether the probe 20 is properly held by the fixture 1. If the probe 20 is properly held by the fixture 1, the process proceeds to step S30. Conversely, if the probe 20 is not properly held by the fixture 1, the process proceeds to step S25.

[0065] In step S25, the state of the probe 20 is corrected so that the probe 20 is correctly held on the fixture 1. For example, if the probe 20 is not properly held on the fixture 1, by referring to... Figure 10The method described above is used to correct the orientation of probe 20. After that, the process returns to step S20.

[0066] In step S30, the probe 20, held in the state by the fixture 1, engages with the circuit board 30. For example, as... Figure 12 As shown, a conductive bonding material 31, such as solder, is applied to a predetermined bonding area on the circuit board 30, and the support portion 22 of the probe 20 is bonded to the circuit board 30 using the bonding material 31. The probe 20 and the circuit board 30 are electrically connected by a wiring pattern (not shown). When solder is used as the bonding material 31, residual stress within the solder can be eliminated by slow cooling curing after reflow soldering to bond the probe 20 and the circuit board 30. Alternatively, as... Figure 12 As shown, the mechanical strength of the fixture 1 is enhanced by mounting the circuit board 30 on the plate-shaped base plate 41 and clamping the fixture 1 and the circuit board 30 with the annular guide pressing member 42 and the base plate 41. This ensures the stability of the flatness of the fixture 1.

[0067] After the probe 20 is attached to the circuit board 30, Figure 11 In step S40, such as Figure 13 As shown, fixture 1 is removed from probe 20. For example, after a space is created between through hole 100 and probe 20 by sliding guide plate, fixture 1 is separated from circuit board 30.

[0068] After that, Figure 11 In step S50, the correct engagement of probe 20 with circuit board 30 is checked. For example, this may involve checking, such as by taking a photograph, whether probe 20 is straight and engaged in the predetermined engagement area of ​​circuit board 30. If probe 20 is found to be improperly engaged with circuit board 30, the process proceeds to step S55 to correct the engagement state of probe 20. Afterwards, the process returns to step S50.

[0069] If there are no problems with the bonding between probe 20 and circuit board 30 in step S50, the process ends. Through the above process, the step of bonding probe 20 to circuit board 30 using manufacturing fixture including fixture 1 is completed.

[0070] As explained above, in the manufacturing fixture of the electrical connection device according to the embodiment, the side surface of the probe 20 is in contact with the inner wall surface of the through hole 100. Therefore, the probe 20 can be stably held using the fixture 1. Moreover, by connecting the multiple guides for inserting the probe 20 via the common portion 110 which also serves as a recess, the spacing between the probes 20 can be narrowed. Therefore, using the manufacturing fixture of the embodiment, the probes 20 can be bonded to the circuit board 30 with high precision and narrow spacing.

[0071] Furthermore, when using the fixture 1 to bond the probe 20 to the circuit board 30, the manufactured probe 20 can be directly arranged on the fixture 1 without the need for a tray to store the probe 20. This eliminates the need to store the probe 20 on a tray, thus shortening the process of bonding the probe 20 to the circuit board 30.

[0072] (Other implementation methods)

[0073] As described above, the present invention has been described through embodiments, but it should not be construed as limiting the invention by the discussions and drawings that form part of this disclosure. Various alternative embodiments, examples, and techniques will be apparent to those skilled in the art based on this disclosure.

[0074] For example, the above description exemplifies the case where a single through-hole 100 includes two guide portions connected by a common portion 110. However, a single through-hole 100 may also include multiple guide portions connected to the common portion 110 and extending parallel to the first guide portion 111, and other multiple guide portions connected to the common portion 110 and extending parallel to the second guide portion 112. By increasing the number of guide portions connected to the common portion 110, the arrangement spacing of the probes 20 can be further narrowed. For example... Figures 14A-14C The through hole 100 shown includes two first guide portions 111 and two second guide portions 112. Figures 14A-14C In this process, the spacing P of the guide portions varies. The spacing of the probes 20 held by the fixture 1 is set according to the spacing of the electrode terminals of the object being inspected. Therefore, the shape of the through hole 100 of the fixture 1 is determined according to the arrangement of the electrode terminals of the object being inspected.

[0075] Furthermore, the above description shows one through hole 100 formed in the guide plate 10, but of course, multiple through holes 100 can also be formed in the guide plate 10. In addition, the extension direction of the first guide portion 111 and the extension direction of the second guide portion 112 are shown to be parallel, but the extension direction of the first guide portion 111 and the extension direction of the second guide portion 112 can also intersect.

[0076] Thus, the present invention naturally includes various embodiments not described herein. Therefore, based on the above description, the scope of protection of the present invention is determined solely by the specific inventive aspects outlined in the appropriate claims.

[0077] Explanation of reference numerals in the attached figures

[0078] 1. Fixture; 11. First guide plate; 12. Second guide plate; 20. Probe; 21. Arm; 22. Support; 30. Circuit board; 31. Bonding material; 100. Through hole; 101. First surface; 102. Second surface; 110. Common part; 111. First guide part; 112. Second guide part; 201. Fixed end; 202. Free end; 210. Contact part.

Claims

1. A manufacturing fixture for an electrical connection device, used to manufacture an electrical connection device comprising a probe that contacts an object to be inspected, wherein, The manufacturing fixture includes a fixture in which a first guide plate and a second guide plate, each having a through hole formed from a first surface to a second surface in the opposite direction to the first surface, are stacked in a manner that allows them to move relative to each other along the first surface. The through hole includes: A common portion that extends along a first direction when viewed from above in a plan view from the direction of the surface normal of the first surface; A first guide portion extends from the common portion in a second direction that is different from the first direction when viewed from above; as well as The second guide portion extends from the common portion in a third direction, which is different from the first and second directions when viewed from above. The manufacturing fixture for the electrical connection device is configured such that the probe can be continuously inserted into the first guide portion and the second guide portion, respectively, in the first guide plate and the second guide plate.

2. The manufacturing jig for the electrical connection device according to claim 1, wherein, The first guide portion extends from the first end of the common portion in a second direction orthogonal to the first direction when viewed from above. The second guide portion extends from the second end of the common portion in a third direction opposite to the second direction when viewed from above.

3. The manufacturing fixture for the electrical connection device according to claim 1, wherein, Two adjacent sides of the probe abut against the inner wall of the through hole of the first guide plate, and the other two adjacent sides of the probe abut against the inner wall of the through hole of the second guide plate.

4. The manufacturing jig for the electrical connection device according to claim 1, wherein, The through hole has a guide portion that is connected to the common portion and extends parallel to the first guide portion, and other guide portions that are connected to the common portion and extend parallel to the second guide portion.

5. A method for manufacturing an electrical connection device, the electrical connection device being used for inspecting an object, wherein, The manufacturing method includes the following processes: Prepare a probe having a cantilevered arm and a support connected to a fixed end of the arm; A jig is prepared in which a first guide plate and a second guide plate, each having a through hole extending from a first surface to a second surface in the opposite direction to the first surface, are stacked in such a way that they can move relative to each other along the first surface. The through hole includes: a common portion extending along a first direction when viewed from the surface normal direction of the first surface; and a first guide portion extending from the common portion in a second direction different from the first direction when viewed from above. And a second guide portion, which extends from the common portion in a third direction that is different from the first direction and the second direction when viewed from above; With the first guide plate and the second guide plate stacked in such a way that the probe can continuously pass through the through hole of the first guide plate and the through hole of the second guide plate, the probe is inserted into the first guide portion and the second guide portion respectively; With the probe inserted into the first guide portion and the second guide portion, the first guide plate and the second guide plate are moved relative to each other along the first surface, and the probe is held by the fixture while being clamped by the first guide plate and the second guide plate; and The probe, held by the fixture, is attached to the circuit board.

6. The method for manufacturing the electrical connection device according to claim 5, wherein, The probe is inserted into the through hole of each of the first guide plate and the second guide plate in such a way that the support portion is partially exposed when viewed from the second side.

7. The method for manufacturing the electrical connection device according to claim 5, wherein, The first guide plate and the second guide plate are moved relative to each other along the first surface so that two adjacent sides of the probe abut against the inner wall surface of the through hole of the first guide plate, and the other two adjacent sides of the probe abut against the inner wall surface of the through hole of the second guide plate.

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