Connector

Abstract

A connector (10, 10A) is provided with: outer conductors (12, 13); an inner conductor (11) disposed on the inner side of the outer conductors (12, 13); and a dielectric body (14) interposed between the inner conductor (11) and the outer conductors (12, 13). The outer conductors (12, 13) have: a bottom surface (46) facing the board surface of the circuit board (100); a lead-out opening (42) that opens in the bottom surface (46) and leads out the inner conductor (11) to the circuit board (100) side; mounting parts (47, 48) protruding from the bottom surface (46); and at least one substrate installation part (51, 52) which is provided so as to protrude from each of the two sides of the bottom surface (46) across an installation region (49) in which the installation parts (47, 48) and the outlet (42) are formed, and the tip end surfaces of the substrate installation parts (51, 52) are located further toward the distal side than the tip end surfaces of the installation parts (47, 48).

Description

Technical Field

[0001] This disclosure relates to connectors. Background Technology

[0002] The connector disclosed in Patent Document 1 includes a plug body (hereinafter referred to as the outer conductor) and an inner conductor portion (hereinafter referred to as the inner conductor) disposed inside the plug body. The outer conductor has a bottom surface facing the board surface of the circuit board. A mounting portion for electrical connection with the grounding conductive path of the circuit board is provided on the bottom surface of the outer conductor. The inner conductor penetrates the bottom surface of the plug body and its lower end is electrically connected to the signal conductive path of the circuit board. Existing technical documents Patent documents

[0003] Patent Document 1: Japanese Patent Application Publication No. 2019-71272 Summary of the Invention The problem that the invention aims to solve

[0004] The mounting portion of the outer conductor is soldered to the copper foil (conductive layer) of the circuit board and connected thereto. For example, during reflow soldering, if the top surface of the mounting portion is misaligned relative to the circuit board, there is a concern that a proper solder joint may not be achieved due to contact between the mounting portion and the resist layer (insulating layer, resin layer) of the circuit board.

[0005] Therefore, the purpose of this disclosure is to provide a connector that can achieve improved mountability relative to the circuit board. Solution for solving the problem

[0006] The connector disclosed herein comprises: a conductive outer conductor; a conductive inner conductor disposed inside the outer conductor; and an insulating dielectric body disposed between the inner conductor and the outer conductor. The outer conductor has: a bottom surface facing a circuit board; an outlet opening on the bottom surface and leading the inner conductor toward the circuit board; a mounting portion protruding from the bottom surface; and a substrate mounting portion, at least one of which protrudes from each side of the bottom surface across a mounting area having the mounting portion and the outlet formed therebetween. The top surface of the substrate mounting portion is located further away from the top surface of the mounting portion. Invention Effects

[0007] According to this disclosure, a connector that enables improved mountability relative to the circuit board can be provided. Attached Figure Description

[0008] Figure 1 This is a side sectional view of the connector in Embodiment 1 of this disclosure. Figure 2 yes Figure 1The diagram shows a three-dimensional representation of the second outer conductor. Figure 3 yes Figure 1 The diagram shows a three-dimensional view of the first outer conductor. Figure 4 yes Figure 1 The bottom view of the first outer conductor is shown. Figure 5 yes Figure 1 The connector shown is viewed from below. Figure 6 It is Figure 1 The enlarged side sectional view of the connector mounted on the circuit board is shown. Figure 7 This is a bottom view of the connector in Embodiment 2 of this disclosure. Detailed Implementation

[0009] [Description of embodiments of this disclosure] The embodiments of this disclosure are first described in detail. The connector disclosed herein, (1) The device comprises: an outer conductor that is conductive; an inner conductor that is conductive and disposed inside the outer conductor; and an insulating dielectric body disposed between the inner conductor and the outer conductor, wherein the outer conductor has: a bottom surface facing the board surface of the circuit board; an outlet that opens on the bottom surface and leads the inner conductor toward the circuit board side; a mounting portion that protrudes from the bottom surface; and a substrate mounting portion that protrudes from at least one on each side of the bottom surface across a mounting area in which the mounting portion and the outlet are formed, wherein the top surface of the substrate mounting portion is located at a position further away from the top surface of the mounting portion.

[0010] According to the above structure, with the top surface of the substrate mounting portion supported on the surface of the circuit board, a gap can be formed between the top surface of the mounting portion and the surface of the circuit board. Therefore, even if the mounting portion is misaligned relative to the circuit board during reflow soldering, the solder can follow the mounting portion, forming a solder joint between the surface of the circuit board and the mounting portion. In particular, since at least one substrate mounting portion protrudes from each side of the bottom surface of the outer conductor across the mounting area, the gap formed between the top surface of the mounting portion and the surface of the circuit board can be maintained at an appropriate size.

[0011] (2) Based on the connector described in (1) above, it is preferable that the outer conductor has a base and a cylindrical portion protruding forward from the base, the bottom surface is disposed between the base and the plate surface, and the substrate mounting portion is provided with at least one protruding portion on each of the front and rear sides separated by the mounting area.

[0012] The outer conductor's center of gravity is located at the front due to the cylindrical portion protruding forward from the base. This raises concerns about the mounting portion tilting relative to the circuit board surface. However, according to the above structure, since the substrate mounting portion, located further forward than the mounting area, is supported on the circuit board surface, tilting of the mounting portion relative to the circuit board can be suppressed.

[0013] (3) Based on the connector described in (2) above, the connector may also include an insulating housing that holds the outer conductor and is disposed on the front side of the outer conductor, the cylindrical portion protruding into the interior of the housing, and the substrate mounting portion located on the front side of the mounting area being disposed within the range of the front-rear direction of the housing.

[0014] According to the above structure, since the substrate mounting portion located at a position further forward than the mounting area is supported on the surface of the circuit board within the front-rear direction of the housing, the tilting of the outer conductor to the front side can be effectively suppressed.

[0015] (4) Based on the connector described in any of (1) to (3) above, the substrate mounting portion may also have a pair of connectors that are spaced apart in the left-right direction on the front and back sides of the mounting area.

[0016] According to the above structure, the outer conductor is stably supported on the circuit board by each substrate mounting portion, and the gap between the top surface of the mounting portion and the surface of the circuit board can be adjusted to be fixed. Therefore, better solder joints can be formed between the surface of the circuit board and the mounting portion.

[0017] [Details of the embodiments of this disclosure] Specific examples of this disclosure will now be described with reference to the accompanying drawings. Furthermore, the invention is not limited to these examples, but is defined by the claims, which are intended to include all modifications within the meaning and scope equivalent to the claims.

[0018] <Implementation Method 1> Regarding the connector 10 in embodiment 1, as follows Figure 1 As shown, a shielded connector mounted on a circuit board 100 is illustrated. The connector 10 includes a conductive inner conductor 11, conductive outer conductors 12 and 13 surrounding the outer periphery of the inner conductor 11, an insulating dielectric body 14 between the inner conductor 11 and the outer conductors 12 and 13, and a housing 15 that maintains the insulation of the outer conductors 12 and 13. The housing 15 can be engaged with a counterpart connector (not shown). Furthermore, in the following description, regarding the front-rear direction, the side where the housing 15 engages with the counterpart connector is designated as the front side. Figure 1 The arrow X becomes the front side. Left and right directions are... Figure 1 The thickness direction of the paper is used as the reference. The left and right directions are synonymous with the width direction. Figure 1 The Y-label in the attached diagram becomes the right side. The vertical direction is... Figure 1 The vertical direction is used as the reference. The vertical direction is synonymous with the height direction. Figure 1 Arrow Z is the upper side. These directions are defined for convenience. For example, the lower side may not necessarily be the lower side of gravity when the connector 10 is mounted on a vehicle (not shown) or the like.

[0019] (Shell 15) The casing 15 is made of synthetic resin, such as Figure 1 As shown, the device has an end wall portion 16 and a cover portion 17 protruding forward from the end wall portion 16. A mating connector (not shown) is fitted inside the cover portion 17. The cover portion 17 has a locking portion 18 that locks the mating connector into a fitted state. The locking portion 18 is claw-shaped and protrudes inward from the upper wall of the cover portion 17. The end wall portion 16 has a through hole 19 extending in the front-rear direction. The cylindrical portion 32, described later, is inserted into the through hole 19.

[0020] The housing 15 has an assembly recess 21 within the wall thickness of the end wall portion 16. For example... Figure 5 As shown, the assembly recess 21 has openings on the rear and lower surfaces of the end wall portion 16. A pair of locking portions 22 are provided on the lower end side of the end wall portion 16 to partially close the left and right ends of the rear surface of the assembly recess 21. The connecting portion 39 of the outer conductor 12, described later, is inserted into the assembly recess 21 from below. Each locking portion 22 contacts the left and right ends of the connecting portion 39 from the rear in a pressed state, thereby holding the connecting portion 39 in the assembly recess 21.

[0021] like Figure 1 As shown, a conductive connecting member 23 is fitted onto the housing 15. The connecting member 23, when fitted onto the housing 15, has an upwardly protruding portion that contacts the wall surface of the externally disposed conductive frame 90. Furthermore, the connecting member 23, when fitted onto the housing 15, has a portion located inside the housing 15 that contacts the cylindrical portion 32.

[0022] (Inner conductor 11, dielectric 14) The inner conductor 11 is disposed inside the outer conductors 12 and 13. The inner conductor 11 is made of metal and is in the form of a tab or pin, such as... Figure 1 As shown, the circuit board 100 has a parallel connector 24 extending elongated in the front-rear direction and a substrate connector 25 extending downward from the rear end of the parallel connector 24. When the housing 15 is engaged with the parallel connector, the front end of the parallel connector 24 is electrically connected to the parallel inner conductor (not shown). When the substrate connector 25 is mounted to the circuit board 100, its lower end is inserted into the through hole 102 of the circuit board 100 and electrically connected to the signal conductive path of the circuit board 100.

[0023] Dielectric 14 is made of synthetic resin, such as Figure 1As shown, the device has a terminal receiving portion 26 extending elongated in the front-rear direction and a terminal output portion 27 extending downward from the rear end of the terminal receiving portion 26. The dielectric body 14 has a receiving chamber 28 extending in the front-rear direction in the terminal receiving portion 26 and an output groove 29 extending in the vertical direction in the terminal output portion 27. The receiving chamber 28 penetrates the dielectric body 14 in the front-rear direction. The upper end of the output groove 29 communicates with the rear end of the receiving chamber 28. The lower end of the output groove 29 opens on the lower surface of the terminal output portion 27. The output groove 29 opens towards the rear of the terminal output portion 27. The opposing connection portion 24 of the inner conductor 11 is inserted into the receiving chamber 28 of the terminal receiving portion 26 from the rear. By receiving the opposing connection portion 24 in the receiving chamber 28 and contacting the substrate connection portion 25 of the inner conductor 11 with the inside of the output groove 29, further insertion of the inner conductor 11 is restricted. At this time, the front end of the connector 24 protrudes forward from the terminal receiving portion 26. The lower end of the substrate connector 25 protrudes downward from the terminal output portion 27. The space behind the substrate connector 25 is closed by the back wall 43, which will be described later.

[0024] (Outer conductors 12, 13) The outer conductors 12 and 13 are used to electrically shield the inner conductor 11, and are constructed, for example, as die-cast conductive rigid bodies. In the case of this embodiment 1, the outer conductors are composed of a first outer conductor 12 and a second outer conductor 13, which are different from each other. Figure 1 As shown, the first outer conductor 12 is disposed below the second outer conductor 13.

[0025] like Figure 2 As shown, the second outer conductor 13 has a base 31 and a cylindrical portion 32 protruding forward from the base 31. The base 31 is square-shaped and has a mounting recess 33 inside. The mounting recess 33 is open on the rear and lower surfaces of the base 31. The first outer conductor 12 is inserted from below and mounted into the mounting recess 33. The base 31 has a pair of sidewall portions 34 that close the left and right ends of the mounting recess 33. Figure 5 As shown, the lower end of each sidewall portion 34 has a support end 35 in the front-rear direction that is wider than the middle portion in the front-rear direction. Each support end 35 forms the four corners of the lower part of the base 31. The base 31 has four legs 36 protruding from the flat lower surface of each support end 35. Each leg 36 is cylindrical, as shown... Figure 1 As shown, the components are inserted into and soldered to the circuit board 100 through the fixing holes 101 formed thereon and thus fixed.

[0026] The cylindrical portion 32 is cylindrical and protrudes from the front surface of the base 31. The front-to-back dimension of the cylindrical portion 32 (the protruding dimension) is larger than the front-to-back length of the base 31. For example... Figure 1As shown, the interior of the cylindrical portion 32 forms an insertion hole 37 into which the power supply dielectric 14 can be inserted. The insertion hole 37 is formed extending from the cylindrical portion 32 to the base 31 and opens toward the rear of the second outer conductor 13 via the mounting recess 33. In short, the insertion hole 37 penetrates the interior of the second outer conductor 13 in the front-to-back direction.

[0027] The first outer conductor 12 is composed of a main body portion 38 and a connecting portion 39 connected to the front of the main body portion 38. For example... Figure 4 As shown, the main body 38, when viewed from below, has an external shape corresponding to the opening shape of the mounting recess 33 of the first outer conductor 12. The connecting part 39, when viewed from below, has an external shape corresponding to the opening shape of the mounting recess 21 of the housing 15.

[0028] like Figure 3 As shown, the first outer conductor 12 has a plate-shaped bottom wall 41 that forms the bottom of the main body 38 and the connecting portion 39. The main body 38 has an outlet 42 that is rectangular in shape when viewed from below, extending along the thickness direction (vertical direction) through the rear end side of the bottom wall 41. Figure 5 and Figure 6 As shown, the lower end of the terminal outlet 27 of the dielectric body 14 is fitted into the outlet 42 of the bottom wall 41. The lower end of the substrate connection portion 25 of the inner conductor 11 is led out from the outlet 42 of the bottom wall 41 and inserted into the through hole 102 of the circuit board 100.

[0029] The main body 38 has an upwardly extending back wall 43 on the rear end side of the bottom wall 41. For example... Figure 1 As shown, when the first outer conductor 12 is assembled in the mounting recess 33 of the second outer conductor 13, the back wall 43 blocks the opening on the rear surface of the mounting recess 33 of the second outer conductor 13.

[0030] like Figure 3 As shown, multiple retaining ribs 44 extending in the vertical direction are formed on the left and right sides of the back wall 43 and the bottom wall 41, respectively. Figure 5 As shown, the first outer conductor 12 is held in place of the second outer conductor 13 by the contact between each retaining rib 44 and the inner surface of the mounting recess 33 in a pressed state.

[0031] like Figure 3 As shown, the connecting portion 39 has a pair of upward-pointing protrusions 45 at its left and right ends on the front end side of the bottom wall 41. (As shown...) Figure 5 As shown, each protrusion 45 fits into the assembly recess 21 of the housing 15.

[0032] The second outer conductor 13 is assembled to the housing 15 from the rear. Then, the first outer conductor 12 is assembled to the second outer conductor 13 and the housing 15 from below. The first outer conductor 12, the second outer conductor 13, and the housing 15 are held in an assembled state by pressing the main body 38 into the mounting recess 33 and pressing the connecting part 39 into the mounting recess 21.

[0033] like Figures 3-5 As shown, the lower surface of the bottom wall 41 is a flat bottom surface 46 in both the front-back and left-right directions. On the bottom surface 46 of the bottom wall 41, a plurality of mounting portions 47 and 48 are provided at intervals around the outlet 42. Each mounting portion 47 and 48 is soldered to a grounding conductive path (copper foil) on the surface of the circuit board 100 and electrically connected thereto. The inner area of ​​the bottom surface 46 of the main body 38, excluding the outer edge, is provided with an outlet 42 for the lower end of the substrate connection portion 25 of the inner conductor 11 and various mounting portions 47 and 48, forming a mounting area 49 for soldering onto the circuit board 100. Furthermore, as... Figure 1 As shown, for example, the top end of the cylindrical portion 32 is located in the front-to-back direction in front of the mounting area 49. Furthermore, when the connector 10 is disposed on the circuit board 100, the bottom surface 46 is disposed between the base 31 and the surface of the circuit board 100.

[0034] like Figures 3-5 As shown, for example, a pair of first mounting portions 47 are disposed on the front and rear sides of the outlet 42. Additionally, for example, a pair of second mounting portions 48 are disposed on the left and right sides of the outlet 42. Each first mounting portion 47 is formed as a rib extending in the left and right directions along the front and rear edges of the outlet 42, and its protruding top surface (lower surface) is flat in the left and right directions. Each second mounting portion 48 is formed as a rib extending in the front and rear directions along the left and right edges of the outlet 42, and its protruding top surface (lower surface) is flat in the front and rear directions. The front-rear dimension (front-rear length) of each second mounting portion 48 is smaller than the left-right dimension (left-right length) of each first mounting portion 47. The top surfaces of each first mounting portion 47 and each second mounting portion 48 are disposed at the same height. Each support end 35 (including each leg 36) of the second outer conductor 13 is disposed on the left and right sides of each first mounting portion 47 and on the front and rear sides of each second mounting portion 48.

[0035] On the bottom surface 46 of the bottom wall 41, a plurality of substrate mounting portions 51 and 52 are provided protruding on both the front and rear sides of the mounting area 49. Each substrate mounting portion 51 and 52 is mounted on the resist layer of the circuit board 100. Each substrate mounting portion 51 and 52 is prismatic in shape, and its top surface (lower surface) in the protruding direction is formed flat. The protrusion dimension of each substrate mounting portion 51 and 52 from the bottom surface 46 is larger than the protrusion dimension of each mounting portion 47 and 48 from the bottom surface 46. The top surface of each substrate mounting portion 51 and 52 is positioned lower than the top surface of each mounting portion 47 and 48. The top surfaces of each substrate mounting portion 51 and 52 are respectively positioned at the same height, located at the lowest end of the first outer conductor 12. Therefore, the top surface of each substrate mounting portion 51 and 52 is located further away from the top surface of each mounting portion 47 and 48 in the protruding direction of the substrate mounting portion 51 and 52. The area of ​​the top surface of each substrate mounting part 51, 52 is smaller than the area of ​​the top surface of each mounting part 47, 48.

[0036] Each substrate mounting portion is constructed by a pair of first substrate mounting portions 51 arranged at intervals along the left-right direction at a position slightly forward of the first mounting portion 47 on the front side, and a pair of second substrate mounting portions 52 arranged at intervals along the left-right direction at a position slightly rearward of the first mounting portion 47 on the rear side. Each first substrate mounting portion 51 is provided on the front end side of the bottom surface 46 of the connecting portion 39. Each first substrate mounting portion 51 is disposed within the front-rear direction of the housing 15 by pressing the connecting portion 39 into the assembly recess 21. In the case of the connector 10 of this embodiment 1, since the cylindrical portion 32 protrudes forward of the base portion 31 and the housing 15 is connected to the front of the outer conductors 12 and 13, the center of gravity is located on the housing 15 side. Each first substrate mounting portion 51 is stably supported on the circuit board 100 by being disposed near the center of gravity of the connector 10.

[0037] Each second substrate mounting portion 52 is provided on the rear end side of the bottom surface 46 of the main body portion 38. The rear surface of each second substrate mounting portion 52 is continuous with the rear surface of the back wall 43 without any difference in height. The front-to-back distance between the front first mounting portion 47 and each first substrate mounting portion 51 is greater than the front-to-back distance between the rear first mounting portion 47 and each second substrate mounting portion 52.

[0038] (Function of connector 10) The connector 10 is mounted to the circuit board 100 via reflow soldering. Before reflow soldering, the connector 10 is positioned on the circuit board 100. At this time, each leg 36 is inserted into each fixing hole 101, and each substrate mounting portion 51, 52 is placed on the surface of the circuit board 100. By supporting each substrate mounting portion 51, 52 on the circuit board 100, the gap between the bottom surface 46 of the bottom wall 41 and the circuit board 100 is maintained at a fixed position. Furthermore, at this time, the connector 10 is positioned relative to the circuit board 100 by abutting the top surfaces of each substrate mounting portion 51, 52 against the surface of the circuit board 100, thereby positioning the top surfaces of each mounting portion 47, 48 facing the surface of the circuit board 100 with a gap between them. For example, the top surfaces of each mounting portion 47, 48 are positioned parallel to the surface of the circuit board 100.

[0039] Next, connector 10 is heated in a reflow oven (not shown) to melt the solder on the surface of circuit board 100. Thus, as... Figure 6 As shown, solder feet 70 are formed between the top surfaces of each mounting portion 47, 48 and the surface of the circuit board 100. Additionally, solder feet 80 are also formed between the lower end of the substrate connection portion 25 of the inner conductor 11 and the surface of the circuit board 100. Then, by cooling and solidifying the solder, the mounting portions 47, 48 of the outer conductors 12, 13 are soldered to the grounding conductive path of the circuit board 100, and the substrate connection portion 25 of the inner conductor 11 is soldered to the signal conductive path of the circuit board 100. The portion of the lower end of the substrate connection portion 25 of the inner conductor 11 exposed between the bottom surface 46 of the bottom wall 41 and the surface of the circuit board 100 is surrounded from all four directions (front-back and left-right directions) by the mounting portions 47, 48. This improves the shielding performance of the inner conductor 11. Furthermore, each leg 36 is soldered to the mounting holes 101 of the circuit board 100 and fixed thereto.

[0040] No solder is applied to the substrate mounting portions 51 and 52. During the reflow soldering process, the substrate mounting portions 51 and 52 function to maintain a fixed gap between the bottom surface 46 of the bottom wall 41 and the surface of the circuit board 100. Therefore, even assuming that the connector 10 is relative to the circuit board 100, it is possible to prevent the mounting portions 47 and 48 from contacting the resist layer.

[0041] The aforementioned spacing maintenance function is achieved by the substrate mounting portions 51 and 52, thereby forming a gap between the top surface of each mounting portion 47 and 48 and the surface of the circuit board 100. Therefore, molten solder can appropriately form solder feet 70 following the misalignment direction of each mounting portion 47 and 48.

[0042] As explained above, according to Embodiment 1, with the top surfaces of the substrate mounting portions 51 and 52 each supported on the surface of the circuit board 100, a gap can be formed between the top surfaces of the mounting portions 47 and 48 and the surface of the circuit board 100. Therefore, even assuming that the mounting portions 47 and 48 are misaligned relative to the circuit board 100 during reflow soldering, the solder can follow the mounting portions 47 and 48, and solder feet 70 can be appropriately formed between the surface of the circuit board 100 and the mounting portions 47 and 48. In particular, each substrate mounting portion 51 and 52 has a pair of protruding portions on each side of the bottom surface 46 of the first outer conductor 12, separated by the mounting area 49, so the gap formed between the top surfaces of the mounting portions 47 and 48 and the surface of the circuit board 100 can be adjusted to a fixed size. As a result, the connector 10 can achieve improved installability.

[0043] In addition, in the case of this embodiment 1, each first substrate mounting portion 51 located in front of the mounting area 49 is supported on the surface of the circuit board 100 near the center of gravity of the connector 10, so that the tilting of each mounting portion 47, 48 relative to the circuit board 100 during reflow soldering can be suppressed.

[0044] <Implementation Method 2> like Figure 7 As shown, the connector 10A of Embodiment 2 has two inner conductors 11 and two dielectric bodies 14, with two outlets 42 opening on the bottom surface 46 of the bottom wall 41. A plurality of mounting portions 47A and 48A are provided corresponding to each outlet 42, which differs from Embodiment 1. Everything else is the same as Embodiment 1. In Embodiment 2, the same reference numerals are used to refer to structures that are the same as or similar to those in Embodiment 1, and repeated descriptions are omitted.

[0045] like Figure 7 As shown, two outlets 42 are arranged along the front-to-back direction in the bottom wall 41 of the first outer conductor 12. Each outlet 42 opens in a rectangular shape on the bottom surface 46 of the bottom wall 41 when viewed from below. The rear edge of the front outlet 42 is arranged parallel to the front edge of the rear outlet 42. The two dielectric bodies 14 respectively engage the lower end of the terminal lead-out portion 27 with the corresponding outlet 42. The two inner conductors 11 respectively protrude the lower end of the substrate connection portion 25 downward from the corresponding outlet 42.

[0046] Multiple mounting portions include: a main mounting portion 47A disposed in the mounting area 49, excluding the ends in the front-rear direction; and a pair of auxiliary mounting portions 48A disposed at the ends in the front-rear direction of the mounting area 49. The main mounting portion 47A is constructed by a rib-shaped intermediate mounting portion 47B extending in the left-right direction between each outlet 42, and a pair of rib-shaped side mounting portions 47C extending relatively long along the left and right edges of each outlet 42. The left and right ends of the intermediate mounting portion 47B are connected to the middle portions in the front-rear direction of each side mounting portion 47C. The front-rear dimension (front-rear width) of the intermediate mounting portion 47B is larger than the left-right dimension (left-right width) of the side mounting portions 47C. The main mounting portion 47A is formed in an H-shape when viewed from below by the intermediate mounting portion 47B and each side mounting portion 47C. The top surface of the main mounting portion 47A is formed flat along the H-shape of the main mounting portion 47A.

[0047] Each sub-mounting part 48A is constructed by a rib-like portion extending laterally along the leading edge of the front outlet 42 and a rib-like portion extending laterally along the rear edge of the rear outlet 42. The top surface of each sub-mounting part 48A is formed flat at the same height as the top surface of the main mounting part 47A. The front-rear dimension of each sub-mounting part 48A is smaller than the front-rear dimension of the intermediate mounting part 47B.

[0048] On the bottom surface 46 of the bottom wall 41, a pair of substrate mounting portions 51 and 52 are provided at intervals along the left and right directions on both the front and rear sides of the mounting area 49. The top surface of each substrate mounting portion 51 and 52 is positioned below the top surface of each mounting portion 47A and 48A. Each substrate mounting portion 51 and 52 is placed on the surface of the circuit board 100. Each mounting portion 47A and 48A forms a gap with the surface of the circuit board 100 through each substrate mounting portion 51 and 52. The structure and arrangement of the substrate mounting portions 51 and 52 are the same as in Embodiment 1.

[0049] According to Embodiment 2, since the main mounting portion 47A and each of the auxiliary mounting portions 48A surround the four sides of each outlet 42, the shielding performance of each inner conductor 11 led out from each outlet 42 can be improved. In particular, since the intermediate mounting portion 47B of the main mounting portion 47A is provided between the substrate connection portions 25 of each inner conductor 11, crosstalk between the inner conductors 11 can be prevented.

[0050] [Other embodiments of this disclosure] It should be considered that the above-disclosed embodiments 1 and 2 are illustrative in all respects and are not restrictive. In embodiments 1 and 2 described above, a pair of substrate mounting portions are arranged on each side of the mounting area. In contrast, according to other embodiments, only one substrate mounting portion may be arranged on each side of the mounting area, or three or more may be arranged on each side of the mounting area. In embodiments 1 and 2, the substrate mounting portion is disposed on both the front and rear sides of the mounting area. In contrast, according to other embodiments, the substrate mounting portion may also be disposed on both the left and right sides of the mounting area. Furthermore, the substrate mounting portion may be disposed on both the front and rear sides and both the left and right sides of the mounting area, respectively. In embodiments 1 and 2, multiple mounting parts are arranged around the outlets on the bottom surface of the bottom wall. In contrast, according to other embodiments, only one mounting part may be arranged around each outlet on the bottom surface of the bottom wall in such a way that it completely surrounds the outlet. In embodiments 1 and 2, the mounting portion is formed on the bottom surface of the bottom wall in a shape that extends linearly along the edge of the outlet. In contrast, for example, if the outlet has a circular opening shape, the mounting portion may also be in a shape that extends curvedly along the edge of the outlet. In embodiments 1 and 2, the outer conductor can be separated or combined into a first outer conductor and a second outer conductor. In contrast, according to other embodiments, the outer conductor may also be an integral, non-separable outer conductor. In embodiments 1 and 2 described above, the outer conductor is die-cast. In contrast, according to other embodiments, the outer conductor can also be formed by machining a block-shaped metal component. Explanation of reference numerals in the attached figures

[0051] 10, 10A… connector 11…Inner conductor 12…First outer conductor (outer conductor) 13…Second outer conductor (outer conductor) 14…Dielectric 15…shell 16...End wall part 17…covering 18… Locking Department 19… Through-hole 21…Assemble the recess 22… Locking part 23…Connecting components 24… Opposite connecting part 25…Substrate connection portion 26…Terminal storage section 27…Terminal outlet section 28… Storage Room 29…Export slot 31…base 32…Cylinder section 33…Assembly recess 34…side wall portion 35… Support end 36…legs 37…Insert Hole 38…Main Body 39…Connection Section 41…bottom wall 42…exit 43…back wall 44…Keep the ribs 45…protrusion 46…Bottom 47…First Installation Department (Installation Department) 47A…Main Installation Section (Installation Section) 47B…Intermediate mounting section (mounting section) 47C…Side mounting section (mounting section) 48…Second Installation Department (Installation Department) 48A…Subsidiary Installation Department (Installation Department) 49… Installation Area 51…First substrate setting section (substrate setting section) 52…Second substrate setting section (substrate setting section) 70… (weld feet on the mounting side) 80… (inner conductor side) solder pad 90…frame 100…Circuit board 101… Fixing hole 102…through hole

Claims

1. A connector comprising: An external conductor that is electrically conductive; An inner conductor with conductivity is disposed inside the outer conductor; and An insulating dielectric material, situated between the inner conductor and the outer conductor. The outer conductor has: The bottom surface faces the circuit board. An outlet is provided, which opens on the bottom surface and leads the inner conductor toward the circuit board side; The mounting part is prominently located on the bottom surface; as well as The substrate mounting portion has at least one protruding portion on each side of the mounting area on the bottom surface, which is separated from the mounting portion and the outlet. The top surface of the substrate mounting portion is located at a position further away from the top surface of the mounting portion.

2. The connector according to claim 1, wherein, The outer conductor has a base and a cylindrical portion protruding forward from the base. The bottom surface is disposed between the base and the plate surface. The substrate mounting portion has at least one protruding portion on each of the front and rear sides, separated by the mounting area.

3. The connector according to claim 2, wherein, The connector also includes an insulating housing that holds the outer conductor and is disposed on the front side of the outer conductor. The cylindrical portion protrudes into the interior of the housing. The substrate mounting portion, located at a position further forward than the mounting area, is disposed within the range of the front-rear direction of the housing.

4. The connector according to any one of claims 1 to 3, wherein, The substrate mounting portion has a pair of protruding parts on each of the front and rear sides of the mounting area, spaced apart in the left and right direction.

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