Intelligent air-cooled air conditioning suit based on semiconductor refrigeration and heat pipe conduction technology and control method of intelligent air-cooled air conditioning suit

Abstract

The invention discloses an intelligent air-cooled air-conditioning garment based on semiconductor refrigeration and heat pipe conduction technologies and a control method thereof, and relates to the technical field of TEC refrigeration garments, the intelligent air-cooled air-conditioning garment comprises a vest, the upper portion of the rear side of the vest is fixedly connected with a sling, and the lower end of the sling is provided with a refrigeration mechanism; the back side of the vest is fixedly connected with a temperature control module, a fixing hole is formed in the back side of the vest, and the refrigeration mechanism is located in the fixing hole. The air flow can be directionally conveyed to key parts such as the back and the armpits of a user through the miniature electric control valve after being cooled, the refrigeration effect is improved, the cold air flow can be dynamically adjusted according to requirements, the air conditioner is suitable for different environment requirements, and the air conditioner has the advantages of being high in practicability and capable of reducing direct contact between condensate water and the user in the refrigeration process.

Description

Technical Field

[0001] This invention relates to the field of TEC refrigeration clothing technology, specifically to an intelligent air-cooled air-conditioned garment based on semiconductor refrigeration and heat pipe conduction technology and its control method. Background Technology

[0002] With global warming and the increasing frequency of extreme heatwaves, outdoor workers, athletes, and those working in high-temperature environments face significant challenges in thermoregulation. Traditional air-conditioned clothing primarily relies on ice packs or fan ventilation for cooling. However, ice packs have limited cooling time and cannot precisely control temperature, while simple fan ventilation is ineffective in high-temperature environments and cannot meet the needs of prolonged work in such conditions. Therefore, air-conditioned clothing with efficient cooling, intelligent temperature control, and a comfortable wearing experience has become an urgent market demand.

[0003] In existing technologies, some air-conditioned clothing uses semiconductor refrigeration technology, which uses semiconductor refrigeration chips to perform thermoelectric conversion to provide a cooling effect. However, since the semiconductor refrigeration chip absorbs heat on one side and releases heat on the other side when it is working, if the heat dissipation effect is not good, it will affect the cold end temperature of the refrigeration chip, thereby reducing the overall cooling effect. At the same time, condensation will be generated during the cooling process. The accumulation of condensation may not only cause the clothes to be damp and affect the wearing comfort, but may also reduce the heat exchange efficiency of the heat dissipation components. In addition, the existing air-conditioned clothing has a relatively fixed distribution of cold air, making it difficult to dynamically adjust the cold air flow according to the needs of different parts of the body, resulting in uneven cooling effect.

[0004] Therefore, it is essential to design a smart air-cooled clothing and its control method based on semiconductor refrigeration and heat pipe conduction technology that is highly practical and can reduce direct contact between condensate and the user during the refrigeration process. Summary of the Invention

[0005] The purpose of this invention is to provide an intelligent air-cooled clothing and its control method based on semiconductor refrigeration and heat pipe conduction technology, so as to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a smart air-cooled clothing based on semiconductor refrigeration and heat pipe conduction technology, including a vest, a suspender fixedly connected to the upper rear side of the vest, a refrigeration mechanism provided at the lower end of the suspender, a temperature control module fixedly connected to the rear side of the vest, a fixing hole opened on the rear side of the vest, and the refrigeration mechanism located inside the fixing hole.

[0007] The cooling mechanism includes a fixed assembly and a thermoelectric cooler, a heat sink, a heat pipe, and a heat sink on the fixed assembly. One side of the heat sink is in contact with the thermoelectric cooler, and the other side of the heat sink faces the inside of the vest. The rear side of the thermoelectric cooler is in contact with the front side of the outer wall of the heat pipe, and the rear outer wall of the heat pipe is fixedly connected to the inner wall of the heat sink.

[0008] According to the above technical solution, the fixing component includes a fixing frame, a connecting cylinder fixedly connected to the rear side of the fixing frame, a first fan fixedly connected to the inner wall of the connecting cylinder via a bracket, a baffle fixedly connected to the rear side of the connecting cylinder, a side frame fixedly connected to the outer wall of the fixing frame via a connecting post, a connecting arm fixedly connected to the front side of the side frame, the front end of the connecting arm fixedly connected to the outer wall of the fixing frame, and a vibration mechanism provided on the outer wall of the connecting post. A connecting frame is embedded inside the side frame, the inner wall of the connecting frame is fixedly connected to the outer wall of the radiator, a pressure frame contacts the rear outer wall of the radiator, the rear outer wall of the pressure frame is fixedly connected to the rear side of the inner wall of the connecting frame, the inner wall of the pressure frame contacts the outer wall of the semiconductor cooling chip, the rear end of the heat pipe extends into the interior of the fixing frame, a vibration mechanism is provided on the rear side of the side frame, and the outer wall of the side frame is fixedly connected to the inner wall of the fixing hole on the rear side of the vest.

[0009] According to the above technical solution, a front sealing plate is fixedly connected to the front side of the side frame, a second fan is fixedly connected to the inner wall of the front sealing plate through a bracket, four exhaust holes are opened on the side wall of the front sealing plate, and a miniature electronically controlled valve is fixedly connected to the inner wall of each of the four exhaust holes. A water-blocking mechanism is provided on the front side of the front sealing plate.

[0010] According to the above technical solution, the output side of the first fan is the rear side, the output side of the second fan is the front side, the exhaust hole on the front cover plate is located in front of the second fan, the outer wall of the connecting frame is fixedly connected to the air intake pipe, and the interior of the air intake pipe is connected to the interior of the connecting frame.

[0011] According to the above technical solution, the semiconductor cooling chip, the first fan, the second fan, and the four micro-electric valves are all electrically connected to the temperature control module. The temperature control module includes a control module and a transmission module. The output side of the four micro-electric valves is the side away from the inside of the front cover plate.

[0012] According to the above technical solution, the vibration mechanism includes a fixed plate, the inner wall of which is fixedly connected to the outer wall of the connecting column. A sliding hole is provided in the middle of the fixed plate, and a slider is inserted into the sliding hole. An extension rod is fixedly connected to the lower end of the slider. The lower end of the extension rod passes through the connecting frame and extends into the interior of the connecting frame. A spring is also fixedly connected to the lower side of the slider. The lower end of the spring is fixedly connected to the upper side of the fixed plate and contacts the upper side of the outer wall of the radiator. A water-absorbing cotton strip is fixedly connected to the lower side of the side frame. One end of the water-absorbing cotton strip passes through the side frame and extends into the interior of the side frame. The other end of the water-absorbing cotton strip passes through the fixed frame and extends into the interior of the fixed frame. The outer wall of the portion of the water-absorbing cotton strip located between the side frame and the fixed frame is covered with a rubber coating layer.

[0013] According to the above technical solution, the water-blocking mechanism includes a water-absorbing fabric. The outer wall of the water-absorbing fabric is fixedly connected to the front side of the front sealing plate. A hydrophobic fabric is provided on the front side of the water-absorbing fabric. The hydrophobic fabric is a fabric with a surface coated with a hydrophobic material. The rear edge of the hydrophobic fabric is fixedly connected to the front side of the outer wall of the front sealing plate. A water-wicking cotton is fixedly connected to the rear side of the water-absorbing fabric. One end of the water-wicking cotton extends through the front sealing plate and into the interior of the front sealing plate. Four protrusions are also fixedly connected to the front side of the front sealing plate. A temperature monitor is fixedly connected to the middle of the front side of the front sealing plate. The temperature monitor is electrically connected to the temperature control module.

[0014] A smart air-cooled clothing control method based on semiconductor refrigeration and heat pipe conduction technology, wherein the temperature control module is connected to the customer terminal, and controls four micro electronic valves, semiconductor refrigeration chip, first fan and second fan through the temperature control module, and is connected to the output end of the micro electronic valves through a hose, the other end of the hose extending to the user's back and armpits;

[0015] Cooling is achieved through a semiconductor cooling chip with its cold side facing forward and contacting the heat sink, thus lowering the heat sink temperature. A second fan draws in air through the intake pipe and delivers the airflow from the rear to the front. The airflow is cooled after passing over the surface of the heat sink, and then the low-temperature airflow is discharged through four micro-electronic control valves. These four micro-electronic control valves can individually control the airflow, facilitating the distribution of cool air and making it suitable for different work areas. The semiconductor cooling chip's heat is in contact with the heat pipe. The first fan draws in air through both sides of the fixed frame and discharges it through the rear. During this process, heat is dissipated through the heat sink, thus completing the heat dissipation of the semiconductor cooling chip and cooling the user.

[0016] The temperature control module adjusts the cooling power of the semiconductor cooling chip, making its cold surface contact the heat sink to reduce the temperature of the heat sink. The second fan draws air in from the rear through the air intake pipe. After being cooled by the heat sink surface, the low-temperature airflow is discharged through four individually controllable micro-electronic valves. The airflow through the four micro-electronic valves can be adjusted according to usage needs to achieve precise distribution of cold air. The absorbent cotton strip absorbs the condensate and dries it with high-temperature airflow, continuously reducing the internal moisture content and reducing the moisture inside the clothing.

[0017] The temperature monitor monitors the airflow temperature in real time, and the temperature control module dynamically adjusts the cooling power of the semiconductor cooling chip based on the detection results to ensure that the cooling temperature is kept within a comfortable range. The absorbent fabric absorbs condensation on the skin surface, and the bumps reduce the contact area between the front cover and the skin, reducing moisture adhesion.

[0018] Compared with the prior art, the beneficial effects achieved by the present invention are: by setting up a semiconductor cooling chip, a heat sink and a second fan, the present invention can realize that the airflow is cooled and then directed to key parts such as the user's back and armpits through a micro electronically controlled valve, thereby improving the cooling effect. The cold air flow can be dynamically adjusted according to the needs, making it suitable for different environmental requirements.

[0019] By incorporating heat pipes, heat sinks, and a first fan, the heat generated by the semiconductor cooling chip can be efficiently conducted and dissipated, ensuring its stable operation. At the same time, combined with the side air intake structure, the convective heat transfer efficiency is enhanced, improving the overall heat dissipation capacity of the cooling system.

[0020] By incorporating a vibration mechanism, the user's natural movement causes the slider to drive the extension rod to periodically strike the radiator, prompting the condensate on the surface to fall off. The water is then carried out to the high-temperature airflow area by absorbent cotton strips for evaporation, reducing water vapor accumulation, improving cooling efficiency, and preventing a decrease in heat dissipation performance.

[0021] The device incorporates a water-blocking mechanism, where absorbent fabric absorbs condensation, water-wicking cotton directs moisture into the front panel, and hydrophobic fabric forms a waterproof and breathable layer to reduce moisture retention. Combined with protrusions, it reduces the contact area between the front panel and the user's skin, preventing condensation from adhering and improving wearing comfort. Attached Figure Description

[0022] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0023] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0024] Figure 2 This is a schematic diagram of the refrigeration mechanism of the present invention;

[0025] Figure 3 This is a schematic diagram of the disassembled structure of the refrigeration mechanism of the present invention;

[0026] Figure 4 This is a schematic diagram of a portion of the refrigeration mechanism of the present invention;

[0027] Figure 5 This is a schematic diagram of the internal structure of the side frame of the present invention;

[0028] Figure 6 This is a schematic diagram of the vibration mechanism structure of the present invention;

[0029] Figure 7 This is a schematic cross-sectional view of the vibration mechanism of the present invention;

[0030] Figure 8 This is a schematic diagram of the water-blocking mechanism of the present invention;

[0031] Figure 9 This is a schematic diagram of the process of this invention;

[0032] In the diagram: 1. Vest; 2. Suspender; 3. Refrigeration mechanism; 4. Temperature control module; 301. Fixing frame; 302. Connecting cylinder; 303. First fan; 304. Baffle; 305. Connecting column; 306. Connecting frame; 307. Connecting arm; 308. Pressure frame; 309. Semiconductor cooling chip; 310. Heat sink; 311. Vibration mechanism; 312. Heat pipe; 313. Heat sink; 314. Air inlet pipe; 315. Second fan; 316. Front sealing plate; 317. Miniature electronic valve; 318. Side frame; 319. Water blocking mechanism; 101. Fixing plate; 102. Slider; 103. Extension rod; 104. Spring; 105. Water-absorbing cotton strip; 106. Rubber wrapping layer; 901. Water-absorbing fabric; 902. Hydrophobic fabric; 903. Water-wicking cotton; 904. Temperature monitor; 905. Protrusion. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Please see Figure 1-9The present invention provides a technical solution: a smart air-cooled clothing based on semiconductor refrigeration and heat pipe conduction technology, including a vest 1, a suspender 2 fixedly connected to the upper back side of the vest 1, a refrigeration mechanism 3 provided at the lower end of the suspender 2, a temperature control module 4 fixedly connected to the back side of the vest 1, and a fixing hole opened on the back side of the vest 1, with the refrigeration mechanism 3 located inside the fixing hole.

[0035] The cooling mechanism 3 includes a fixing assembly and a thermoelectric cooler 309, a heat sink 310, a heat pipe 312, and a heat sink 313 on the fixing assembly. One side of the heat sink 310 contacts the thermoelectric cooler 309, and the other side of the heat sink 310 faces the inside of the vest 1. The rear side of the thermoelectric cooler 309 contacts the front side of the outer wall of the heat pipe 312, and the rear outer wall of the heat pipe 312 is fixedly connected to the inner wall of the heat sink 313. The fixing assembly includes a fixing frame 301, and a connecting cylinder 302 is fixedly connected to the rear side of the fixing frame 301. A first fan 303 is fixedly connected to the inner wall of the connecting cylinder 302 via a bracket. A baffle 304 is fixedly connected to the rear side of the connecting cylinder 302. A side frame 318 is fixedly connected to the outer wall of the fixing frame 301 via a connecting post 305. A connecting arm 307 is fixedly connected to the front side of the side frame 318. The front end of the connecting arm 307 is fixedly connected to the outer wall of the fixing frame 301. A vibration mechanism 311 is provided on the outer wall of the connecting post 305. A connecting frame 306 is embedded inside the side frame 318. The inner wall of the connecting frame 306 is fixedly connected to the outer wall of the radiator 310. A pressure frame 308 contacts the rear outer wall of the radiator 310. The rear outer wall of the pressure frame 308 is fixedly connected to the rear inner wall of the connecting frame 306. The inner wall of the pressure frame 308 contacts the outer wall of the semiconductor cooling chip 309. The rear end of the heat pipe 312 extends into the interior of the fixing frame 301. A vibration mechanism 311 is provided on the rear side of the side frame 318. The outer wall of the side frame 318 is fixedly connected to the inner wall of the fixing hole on the rear side of the vest 1. A front sealing plate 316 is fixedly connected to the front side of the side frame 318. A second fan 315 is fixedly connected to the inner wall of the front sealing plate 316 through a bracket. Four exhaust holes are opened on the side wall of the front sealing plate 316. A miniature electronically controlled valve 317 is fixedly connected to the inner wall of each of the four exhaust holes. A water-blocking mechanism 319 is provided on the front side of the front sealing plate 316. The output side of the first fan 303 is the rear side, the output side of the second fan 315 is the front side, the exhaust port on the front cover plate 316 is located in front of the second fan 315, the outer wall of the connecting frame 306 is fixedly connected to the air inlet pipe 314, the interior of the air inlet pipe 314 is connected to the interior of the connecting frame 306, the semiconductor cooling chip 309, the first fan 303, the second fan 315 and the four micro electronic valves 317 are all electrically connected to the temperature control module 4, the temperature control module 4 includes a control module and a transmission module, the output side of the four micro electronic valves 317 is the side away from the interior of the front cover plate 316;

[0036] In use, the temperature control module 4 connects to the client terminal and controls four miniature electronic valves 317, a thermoelectric cooler 309, a first fan 303, and a second fan 315. The module is connected to the output of each miniature electronic valve 317 via a flexible hose, with the other end extending to the user's back and armpits. Cooling is achieved through the thermoelectric cooler 309, with its cold side facing forward and contacting the radiator 310, thus lowering the temperature of the radiator 310. The second fan 315 draws in air through the intake pipe 314 and directs the airflow forward from the rear. The airflow is delivered from the side and cooled after passing over the surface of the radiator 310. The low-temperature airflow is then discharged through the micro-electric control valve 317. The four micro-electric control valves 317 can individually control the airflow, which facilitates the distribution of cold air and makes it suitable for different working areas. The thermoelectric cooling chip 309 is in contact with the heat pipe 312. The first fan 303 draws in airflow through both sides of the fixed frame 301 and then discharges it through the rear side. During the process, the heat is dissipated through the heat sink 313, thereby completing the heat dissipation of the thermoelectric cooling chip 309 and cooling the user.

[0037] The vibration mechanism 311 includes a fixed plate 101. The inner wall of the fixed plate 101 is fixedly connected to the outer wall of the connecting column 305. A sliding hole is provided in the middle of the fixed plate 101, and a slider 102 is inserted into the sliding hole. An extension rod 103 is fixedly connected to the lower end of the slider 102. The lower end of the extension rod 103 passes through the connecting frame 306 and extends into the interior of the connecting frame 306. A spring 104 is also fixedly connected to the lower side of the slider 102. The lower end of the spring 104 is connected to the fixed plate 101. The upper side of 1 is fixedly connected, the lower end of the spring 104 contacts the upper side of the outer wall of the radiator 310, and the lower side of the side frame 318 is fixedly connected with a water-absorbing cotton strip 105. One end of the water-absorbing cotton strip 105 passes through the side frame 318 and extends into the interior of the side frame 318, and the other end of the water-absorbing cotton strip 105 passes through the fixed frame 301 and extends into the interior of the fixed frame 301. The outer wall of the part of the water-absorbing cotton strip 105 located between the side frame 318 and the fixed frame 301 is covered with a rubber wrapping layer 106.

[0038] During use, as the user moves, the slider 102 moves up and down under the elastic support of the spring 104. When the slider 102 moves downward, it compresses the spring 104 and causes the extension rod 103 to move downward, which in turn causes the extension rod 103 to strike the radiator 310 downward, thereby causing the condensate on the surface of the radiator 310 to be shaken off. This prevents the heat exchange efficiency of the radiator 310 from decreasing due to the presence of condensate, reduces the direct contact between moisture and airflow, and thus reduces the water vapor content in the airflow, promoting cooling for the user.

[0039] The fallen moisture is absorbed by the absorbent swab 105, and then the moisture moves through the absorbent swab 105 to the other end of the absorbent swab 105. Since the other end of the absorbent swab 105 extends into the interior of the fixing frame 301, and the interior of the fixing frame 301 is dried by a rapid high-temperature airflow, the absorbent swab 105 will continue to absorb moisture from the connecting frame 306 and its side frame 318, reducing the moisture content inside the side frame 318, thus reducing the moisture inside the user's clothes.

[0040] The water-blocking mechanism 319 includes an absorbent fabric 901, the outer wall of which is fixedly connected to the front side of the front sealing plate 316. A hydrophobic fabric 902 is provided on the front side of the absorbent fabric 901. The hydrophobic fabric 902 is a fabric with a surface coated with a hydrophobic material. The rear edge of the hydrophobic fabric 902 is fixedly connected to the front side of the outer wall of the front sealing plate 316. A water-wicking cotton 903 is fixedly connected to the rear side of the absorbent fabric 901. One end of the water-wicking cotton 903 extends through the front sealing plate 316 and into the interior of the front sealing plate 316. Four protrusions 905 are also fixedly connected to the front side of the front sealing plate 316. A temperature monitor 904 is fixedly connected to the middle of the front side of the front sealing plate 316. The temperature monitor 904 is electrically connected to the temperature control module 4.

[0041] During use, the temperature monitor 904 detects the airflow temperature inside the front cover 316 in real time, and the temperature control module 4 dynamically adjusts the power of the semiconductor cooling chip 309 to keep the cooling temperature within a comfortable range. At the same time, the absorbent fabric 901 absorbs the condensation generated on the side of the front cover 316 near the skin surface and drains it into the interior of the front cover 316 through the water-wicking cotton 903. Meanwhile, the protrusion 905 forms a raised area, reducing the contact area between the front cover 316 and the user, thereby reducing moisture adhesion. The hydrophobic fabric 902 forms a waterproof and breathable layer, reducing water vapor accumulation and reducing moisture buildup between the front cover 316 and the user.

[0042] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0043] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A smart air-cooled clothing based on semiconductor refrigeration and heat pipe conduction technology, comprising a vest (1), wherein a suspender strap (2) is fixedly connected to the upper rear side of the vest (1), characterized in that: The lower end of the suspender (2) is provided with a cooling mechanism (3), and the back of the vest (1) is fixedly connected with a temperature control module (4). The back of the vest (1) is provided with a fixing hole, and the cooling mechanism (3) is located inside the fixing hole. The cooling mechanism (3) includes a fixed assembly and a semiconductor cooling chip (309), a heat sink (310), a heat pipe (312), and a heat sink (313) on the fixed assembly. One side of the heat sink (310) is in contact with the semiconductor cooling chip (309), and the other side of the heat sink (310) faces the inside of the vest (1). The rear side of the semiconductor cooling chip (309) is in contact with the front side of the outer wall of the heat pipe (312), and the rear outer wall of the heat pipe (312) is fixedly connected to the inner wall of the heat sink (313).

2. The intelligent air-cooled clothing based on semiconductor refrigeration and heat pipe conduction technology according to claim 1, characterized in that: The fixing assembly includes a fixing frame (301), a connecting cylinder (302) fixedly connected to the rear side of the fixing frame (301), a first fan (303) fixedly connected to the inner wall of the connecting cylinder (302) via a bracket, a baffle (304) fixedly connected to the rear side of the connecting cylinder (302), a side frame (318) fixedly connected to the outer wall of the fixing frame (301) via a connecting post (305), a connecting arm (307) fixedly connected to the front side of the side frame (318), the front end of the connecting arm (307) fixedly connected to the outer wall of the fixing frame (301), and a vibration mechanism (311) provided on the outer wall of the connecting post (305). (318) has a connecting frame (306) embedded inside. The inner wall of the connecting frame (306) is fixedly connected to the outer wall of the heat sink (310). The rear outer wall of the heat sink (310) is in contact with a pressure frame (308). The rear outer wall of the pressure frame (308) is fixedly connected to the rear side of the inner wall of the connecting frame (306). The inner wall of the pressure frame (308) is in contact with the outer wall of the semiconductor cooling chip (309). The rear end of the heat pipe (312) extends into the interior of the fixing frame (301). The rear side of the side frame (318) is provided with a vibration mechanism (311). The outer wall of the side frame (318) is fixedly connected to the inner wall of the fixing hole on the rear side of the vest (1).

3. The intelligent air-cooled clothing based on semiconductor refrigeration and heat pipe conduction technology according to claim 2, characterized in that: A front sealing plate (316) is fixedly connected to the front side of the side frame (318). A second fan (315) is fixedly connected to the inner wall of the front sealing plate (316) via a bracket. Four exhaust holes are provided on the side wall of the front sealing plate (316). A miniature electronically controlled valve (317) is fixedly connected to the inner wall of each of the four exhaust holes. A water-blocking mechanism (319) is provided on the front side of the front sealing plate (316).

4. The intelligent air-cooled clothing based on semiconductor refrigeration and heat pipe conduction technology according to claim 3, characterized in that: The output side of the first fan (303) is the rear side, and the output side of the second fan (315) is the front side. The exhaust hole on the front cover plate (316) is located in front of the second fan (315). An air inlet pipe (314) is fixedly connected to the outer wall of the connecting frame (306), and the interior of the air inlet pipe (314) is connected to the interior of the connecting frame (306).

5. The intelligent air-cooled clothing based on semiconductor refrigeration and heat pipe conduction technology according to claim 4, characterized in that: The semiconductor cooling chip (309), the first fan (303), the second fan (315), and the four miniature electronically controlled valves (317) are all electrically connected to the temperature control module (4). The temperature control module (4) includes a control module and a transmission module. The output side of the four miniature electronically controlled valves (317) is the side away from the interior of the front cover plate (316).

6. The intelligent air-cooled clothing based on semiconductor refrigeration and heat pipe conduction technology according to claim 5, characterized in that: The vibration mechanism (311) includes a fixed plate (101), the inner wall of which is fixedly connected to the outer wall of the connecting column (305). A sliding hole is provided in the middle of the fixed plate (101), and a slider (102) is inserted into the sliding hole. An extension rod (103) is fixedly connected to the lower end of the slider (102). The lower end of the extension rod (103) passes through the connecting frame (306) and extends into the interior of the connecting frame (306). A spring (104) is also fixedly connected to the lower side of the slider (102). The lower end of the spring (104) is fixedly connected to the fixed plate (305). The upper side of the plate (101) is fixedly connected, the lower end of the spring (104) contacts the upper side of the outer wall of the radiator (310), and the lower side of the side frame (318) is fixedly connected with a water-absorbing cotton strip (105). One end of the water-absorbing cotton strip (105) extends through the side frame (318) into the interior of the side frame (318), and the other end of the water-absorbing cotton strip (105) extends through the fixed frame (301) into the interior of the fixed frame (301). The outer wall of the part of the water-absorbing cotton strip (105) between the side frame (318) and the fixed frame (301) is covered with a rubber wrapping layer (106).

7. The intelligent air-cooled clothing based on semiconductor refrigeration and heat pipe conduction technology according to claim 6, characterized in that: The water-blocking mechanism (319) includes an absorbent fabric (901), the outer wall of which is fixedly connected to the front side of the front sealing plate (316), and a hydrophobic fabric (902) is provided on the front side of the absorbent fabric (901). The hydrophobic fabric (902) is a fabric with a surface coated with a hydrophobic material. The rear edge of the hydrophobic fabric (902) is fixedly connected to the front side of the outer wall of the front sealing plate (316). A water-wicking cotton (903) is fixedly connected to the rear side of the absorbent fabric (901). One end of the water-wicking cotton (903) extends through the front sealing plate (316) and into the interior of the front sealing plate (316). Four protrusions (905) are also fixedly connected to the front side of the front sealing plate (316). A temperature monitor (904) is fixedly connected to the middle of the front side of the front sealing plate (316). The temperature monitor (904) is electrically connected to the temperature control module (4).

8. A method for controlling intelligent air-cooled clothing based on semiconductor refrigeration and heat pipe conduction technology, characterized in that: The temperature control module (4) is connected to the customer terminal and controls four micro electric valves (317), a semiconductor cooling chip (309), a first fan (303), and a second fan (315) through the temperature control module (4). It is also connected to the output end of the micro electric valve (317) through a hose, with the other end of the hose extending to the user's back and armpits. Cooling is achieved through a semiconductor cooling chip (309), with its cold side facing forward and in contact with the heat sink (310). The temperature of the heat sink (310) decreases. The second fan (315) draws in air through the air intake pipe (314) and delivers the airflow from the rear to the front. The airflow is cooled after passing over the surface of the heat sink (310). Subsequently, the low-temperature airflow is discharged through the micro-electric control valve (317). The four micro-electric control valves (317) can individually control the airflow, thereby facilitating the distribution of cold air and making it suitable for different working areas. The semiconductor cooling chip (309) is in contact with the heat pipe (312). The first fan (303) draws in airflow through both sides of the fixed frame (301) and discharges it through the rear. During the process, heat is dissipated through the heat sink (313), thereby completing the heat dissipation of the semiconductor cooling chip (309) and cooling the user. The cooling power of the semiconductor cooling chip (309) is adjusted by the temperature control module (4) so ​​that its cold surface contacts the heat sink (310) to reduce the temperature of the heat sink (310). The second fan (315) draws air from the rear through the air intake pipe (314). After being cooled by the surface of the heat sink (310), the low-temperature airflow is discharged through four individually controllable exhaust ports of micro electronic valves (317). The airflow through the four micro electronic valves (317) can be adjusted according to the usage requirements to achieve precise distribution of cold air. The absorbent cotton strip (105) absorbs the condensate that falls and dries it through the high-temperature airflow, continuously reducing the internal moisture content and reducing the moisture inside the clothes. The temperature monitor (904) monitors the airflow temperature in real time, and the temperature control module (4) dynamically adjusts the cooling power of the semiconductor cooling chip (309) according to the detection results to ensure that the cooling temperature is kept in a comfortable range. The absorbent fabric (901) absorbs the condensate on the skin surface, and the bumps (905) reduce the contact area between the front cover plate (316) and the skin, reducing moisture adhesion.

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