Computing power chip processing equipment and processing technology thereof

Abstract

The invention relates to the technical field of chip manufacturing, and particularly discloses computing power chip processing equipment and a processing technology thereof.The computing power chip processing equipment comprises a processing box, a material blocking barrel and a rotating disc; the material blocking barrel is mounted on the bottom wall of the processing box; a rotating shaft is coaxially and fixedly connected to the bottom surface of the rotating disc; the bottom end of the rotating shaft extends to the bottom of the blocking cylinder; a first motor is mounted on the inner bottom wall of the processing box; the output end of the first motor is coaxially and fixedly connected with a driving shaft; the top end of the driving shaft is coaxially and fixedly connected with a first straight gear; a second straight gear meshed with the first straight gear is coaxially and fixedly connected to the outer wall of the bottom end of the rotating shaft; a gluing mechanism capable of gluing the silicon wafer is arranged on the top wall of the processing box; after the photoresist is sprayed on the surface of the silicon wafer by the gluing mechanism, the first motor is started to drive the turntable to rotate, and the photoresist is expanded along the surface of the silicon wafer by utilizing centrifugal force, so that the photoresist uniformly covers the surface of the silicon wafer, and the possibility of generating bubbles is reduced.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing technology, and in particular to a computing chip processing equipment and its processing technology. Background Technology

[0002] Using single-crystal silicon wafers as the base layer, and then using photolithography, doping, CMP and other technologies to make MOSFETs or BJTs and other components, and then using thin film and CMP technology to make wires, the chip manufacturing is completed. The main process technologies for chip manufacturing can be divided into the following categories: photolithography, etching, diffusion, thin film, planarization and metallization.

[0003] In the existing technology, a layer of photoresist needs to be coated on the raw silicon wafer when manufacturing chips. Currently, the coating method is generally to apply the photoresist to the surface of the silicon wafer by brushing. However, the brushing method will cause air bubbles to form inside the solidified photoresist layer on the silicon wafer surface, which will affect the subsequent chip manufacturing effect. Summary of the Invention

[0004] This application provides a computing chip processing equipment and its processing technology, which uses centrifugal diffusion to uniformly coat the photoresist on the silicon wafer surface, reducing the possibility of bubbles forming after the photoresist layer on the silicon wafer surface solidifies.

[0005] This application provides a computing chip processing equipment and its processing technology, which adopts the following technical solution: A computing chip processing device includes a processing box, a baffle cylinder, and a turntable. One side of the processing box is open, and a door is installed on the outer wall of the open side. The baffle cylinder is installed on the bottom wall of the processing box. The turntable is located inside the baffle cylinder and can adsorb and fix chips placed on its top surface. A rotating shaft is coaxially fixed to the bottom surface of the turntable. The bottom end of the rotating shaft extends through the bottom wall of the baffle cylinder to the bottom of the baffle cylinder, and the rotating shaft rotatably engages with the bottom wall of the baffle cylinder. A first motor is installed on the bottom wall of the processing box. A drive shaft is coaxially fixed to the output end of the first motor. A first spur gear is coaxially fixed to the outer wall of the top end of the drive shaft. A second spur gear, meshing with the first spur gear, is coaxially fixed to the outer wall of the bottom end of the rotating shaft. A coating mechanism for applying adhesive to silicon wafers is provided on the top wall of the processing box.

[0006] By adopting the above technical solution, when coating silicon wafers with photoresist, the silicon wafer is placed at a designated position on the top surface of the turntable. The coating mechanism sprays photoresist onto the surface of the silicon wafer. Then, the first motor is started to drive the drive shaft and the first spur gear to rotate. Under the meshing of the first spur gear and the second spur gear, the drive shaft drives the rotating shaft and the turntable to rotate. Centrifugal force is used to spread the photoresist along the surface of the silicon wafer, so that the photoresist is evenly covered on the surface of the silicon wafer, reducing the possibility of bubbles being generated during the coating process and improving the quality of the produced chips.

[0007] Preferably, the top surface of the turntable is provided with a placement slot for placing silicon wafers; the interior of the turntable is provided with a cavity communicating with the placement slot; a channel communicating with the cavity is coaxially provided inside the rotating shaft; an air pump is provided on the bottom wall of the processing box; an air inlet pipe extending into the channel and communicating with the channel is fixedly connected to the input end of the air pump, and an air outlet pipe is fixedly connected to the output end of the air pump.

[0008] By adopting the above technical solution, when applying adhesive to silicon wafers, the silicon wafers are placed in the placement tank, and the air pump is started to perform air extraction. The air pump draws air from the cavity through the air inlet pipe, causing the silicon wafers to be adsorbed in the placement tank, reducing the possibility of the silicon wafers detaching during the rotation of the turntable, and improving the stability of the silicon wafers during the adhesive application process.

[0009] Preferably, the coating mechanism includes a coating head and a glue tank; the coating head is installed at the center of the corresponding placement slot on the top wall of the processing box; the glue tank is installed on the top surface of the processing box and contains photoresist; a pump body is installed on the outer wall of the processing box; the pump body has an input end fixedly connected to a feed pipe communicating with the glue tank, and an output end fixedly connected to an outlet pipe communicating with the coating pipe.

[0010] By adopting the above technical solution, after the silicon wafer is placed into the placement slot, the pump body is started to extract the photoresist from the adhesive box. The photoresist is transported to the coating head through the feed pipe and the discharge pipe. The coating head then applies the photoresist to the surface of the silicon wafer, thus conveniently realizing the photoresist coating work on the surface of the silicon wafer.

[0011] Preferably, a second motor is installed on the outer wall of the glue tank; a first stirring shaft extending into the glue tank is coaxially fixed to the output end of the second motor; a first stirring plate is fixed to the outer wall of the first stirring shaft.

[0012] By adopting the above technical solution, when applying photoresist to silicon wafers, the second motor is started to drive the first stirring shaft to rotate, which causes the first stirring plate to stir the photoresist in the glue tank, so as to promote uniform mixing of the components in the photoresist and reduce the possibility of photoresist precipitation or layering.

[0013] Preferably, a hot air duct is installed on the top wall of the processing box; an air nozzle is installed on the outer wall of the hot air duct; a hot air blower is installed on the outer wall of the processing box; an air inlet pipe is fixedly connected to the input end of the hot air blower, and an air outlet pipe connected to the hot air duct is fixedly connected to the output end of the hot air blower.

[0014] By adopting the above technical solution, after the photoresist coated on the silicon wafer surface is evenly spread, the hot air blower is started to blow hot air into the hot air pipe and spray the hot air out through the nozzle, which raises the temperature inside the processing box and causes the photoresist coated on the silicon wafer surface to solidify quickly, thereby improving chip production efficiency.

[0015] Preferably, a storage cylinder located at the bottom of the baffle cylinder is fixedly connected to the bottom wall of the processing box; a connecting pipe is provided on the top surface of the storage cylinder; the connecting pipe connects the baffle cylinder and the storage cylinder; a water-cooling pipe is provided inside the storage cylinder; a water tank is fixedly connected to the bottom surface of the processing box; a water pump is installed on the outer wall of the water tank; an inlet pipe connected to the water tank is fixedly connected to the input end of the water pump, and an outlet pipe connected to the inlet end of the water-cooling pipe is fixedly connected to the output end of the water pump; a return pipe connected to the water tank is fixedly connected to the outlet end of the water-cooling pipe.

[0016] By adopting the above technical solution, the photoresist collected at the bottom of the baffle cylinder will flow into the storage cylinder through the connecting pipe for storage. When the photoresist is stored in the storage cylinder, the water pump is started to draw out the coolant from the water tank and transport it to the water cooling pipe. After heat exchange with the photoresist, it flows back to the water tank through the return pipe to cool the stored photoresist and reduce the possibility of solidification caused by the temperature rise in the processing box, so as to recycle and reuse the photoresist.

[0017] Preferably, a second stirring shaft coaxial with the first stirring shaft is rotatably connected to the inner wall of the water tank; a second stirring plate is fixedly connected to the outer wall of the second stirring shaft; a pair of heat dissipation vents are provided on the side wall of the water tank, respectively located at the top of both ends of the second stirring shaft; a first pulley is coaxially fixedly connected to the outer wall of one end of the first stirring shaft; a second pulley is coaxially fixedly connected to the outer wall of one end of the second stirring shaft; and the same first belt is sleeved on the outside of the first pulley and the second pulley.

[0018] By adopting the above technical solution, under the cooperation of the first pulley, the second pulley and the first belt, the first stirring shaft will drive the second stirring shaft to rotate during the rotation process, causing the second stirring plate to stir the coolant in the water tank, causing the coolant to exchange heat with the air and dissipate the heat through the heat dissipation vent, so that the coolant can be recycled.

[0019] Preferably, a support shaft is rotatably connected to the inner wall of any one of the pair of heat dissipation vents; the support shaft is coaxial with the second stirring shaft, and a fan blade located inside the water tank is fixedly connected to one end of the support shaft; a third pulley is coaxially fixedly connected to the outer wall of the second stirring shaft near the support shaft; a fourth pulley is fixedly connected to the outer wall of the end of the support shaft away from the fan blade; the same second belt is sleeved on the outside of the third pulley and the fourth pulley.

[0020] By adopting the above technical solution, with the cooperation of the third pulley, the fourth pulley and the second belt, the second stirring shaft will drive the support shaft to rotate during rotation, causing the fan blades to rotate and draw air from the inside of the water tank so that the heat inside the water tank can be dissipated quickly.

[0021] Preferably, a filter screen is provided on the inner wall of each pair of heat dissipation vents.

[0022] By adopting the above technical solution, the filter screen installed on the inner wall of the heat dissipation port is used to block dust and impurities, reducing the possibility of dust and impurities from the external environment entering the water tank.

[0023] A computing chip manufacturing process, based on the aforementioned computing chip manufacturing equipment, includes the following steps: S1: Place the silicon wafer at the designated position on the turntable, and use vacuum to generate negative pressure to adsorb and fix the silicon wafer, so as to keep the silicon wafer stable on the turntable; S2: Photoresist is sprayed onto the silicon wafer surface by the coating mechanism, and then the first motor is started to drive the turntable to rotate. Centrifugal force is used to spread the photoresist along the silicon wafer surface, so that the photoresist is evenly coated on the silicon wafer surface. S3: After the photoresist has spread evenly on the silicon wafer surface, start the hot air blower to blow hot air into the hot air pipe, and spray the hot air out through the nozzle to increase the ambient temperature inside the processing box, so as to promote the rapid solidification of the photoresist on the silicon wafer surface.

[0024] In summary, this application has the following beneficial effects: 1. Place the silicon wafer on the designated position on the turntable. The coating mechanism sprays photoresist onto the surface of the silicon wafer. Start the first motor to drive the drive shaft and the first spur gear to rotate. Under the meshing of the first spur gear and the second spur gear, the drive shaft drives the rotating shaft and the turntable to rotate. Centrifugal force is used to spread the photoresist along the surface of the silicon wafer, so that the photoresist is evenly covered on the surface of the silicon wafer, reducing the possibility of bubbles being generated during the coating process and improving the quality of the chip. 2. After the photoresist coated on the silicon wafer surface has spread evenly, start the hot air blower to blow hot air into the hot air pipe and spray the hot air out through the nozzle, so that the temperature inside the processing box rises, which causes the photoresist coated on the silicon wafer surface to solidify quickly, thereby improving chip production efficiency. 3. During the silicon wafer coating process, the second motor can be started to drive the first stirring shaft to rotate, causing the first stirring plate to stir the photoresist in the adhesive tank, so as to promote uniform mixing of the components in the photoresist, reduce the possibility of photoresist precipitation or delamination, and improve the quality of silicon wafer coating. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of a computing chip processing device according to this application; Figure 2 This is a schematic diagram of the internal structure of the processing box in this application; Figure 3 This is a schematic diagram of the cooperative structure of the baffle cylinder, turntable, first motor and vacuum pump in this application; Figure 4 This is a schematic diagram of the assembly structure of the storage cylinder, water cooling pipe and water pump in this application; Figure 5 This is a cross-sectional structural diagram of the rubber tank and water tank in this application; Figure 6 This is a schematic diagram of the transmission structure of the second stirring shaft and the support shaft in this application.

[0026] Explanation of reference numerals in the attached drawings: 1. Processing box; 11. Box door; 12. Hot air duct; 121. Air nozzle; 13. Hot air blower; 131. Air inlet pipe; 132. Air outlet pipe; 2. Material baffle; 3. Turntable; 31. Rotating shaft; 311. Channel; 32. Second spur gear; 33. Placement slot; 34. Cavity; 35. Air pump; 351. Air inlet pipe; 352. Air outlet pipe; 4. First motor; 41. Drive shaft; 42. First spur gear; 5. Glue application mechanism; 51. Glue application head; 52. Glue box; 521. Second motor; 522. First stirring shaft 523. First stirring plate; 524. First pulley; 525. Second pulley; 526. First belt; 53. Pump body; 531. Feed pipe; 532. Discharge pipe; 6. Storage cylinder; 61. Connecting pipe; 62. Water cooling pipe; 63. Return pipe; 7. Water tank; 71. Water pump; 711. Water inlet pipe; 712. Water outlet pipe; 72. Second stirring shaft; 721. Second stirring plate; 722. Third pulley; 723. Fourth pulley; 724. Second belt; 73. Heat dissipation port; 731. Support shaft; 732. Fan blade; 733. Filter screen. Detailed Implementation

[0027] The present invention will be further described in detail below with reference to the accompanying drawings. Identical components are indicated by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "upper," "lower," "bottom," and "top" used in the following description refer to directions in the drawings, while the terms "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0028] This invention discloses a computing chip processing device, such as... Figure 1 , Figure 2 and Figure 3 As shown, the equipment includes a processing box 1, a baffle cylinder 2, a turntable 3, and a vacuum pump 35. One side of the processing box 1 is open. A door 11 is installed on the outer wall of the open end of the processing box 1. The door 11 is made of acrylic material. The baffle cylinder 2 is installed on the bottom wall of the processing box 1. The turntable 3 is coaxially arranged inside the baffle cylinder 2. A rotating shaft 31 is coaxially and vertically fixed to the bottom end of the turntable 3. The bottom end of the rotating shaft 31 passes through the bottom wall of the baffle cylinder 2 and extends to the bottom of the baffle cylinder 2. The rotating shaft 31 rotates with the bottom wall of the baffle cylinder 2. The top surface of the turntable 3 is provided with a placement groove 33 for placing silicon wafers. The turntable 3 is provided with a cavity 34 that communicates with the bottom wall of the placement groove 33. The rotating shaft 31 is coaxially provided with a channel 311 that communicates with the cavity 34. The vacuum pump 35 is installed on the bottom wall of the processing box 1. The input end of the vacuum pump 35 is fixedly connected to an air inlet pipe 351. The end of the air inlet pipe 351 away from the pump body 53 extends from the bottom end of the rotating shaft 31 into the channel 311. The air inlet pipe 351 rotates with the rotating shaft 31. The output end of the vacuum pump 35 is fixedly connected to an air outlet pipe 352.

[0029] During the silicon wafer coating process, the silicon wafer is placed in the placement groove 33 on the top surface of the turntable 3. The vacuum pump 35 is started to evacuate the cavity 34. The vacuum pump 35 draws air from the cavity 34 through the air inlet pipe 351, causing the silicon wafer to be adsorbed in the placement groove 33. This reduces the possibility of the silicon wafer detaching during the rotation of the turntable 3 and ensures the stability of the silicon wafer during the coating process.

[0030] like Figure 1 , Figure 2 and Figure 3 As shown, a first motor 4 is vertically installed on the bottom wall of the processing box 1. A drive shaft 41 is coaxially fixed to the output end of the first motor 4. A first spur gear 42 is coaxially fixed to the outer wall of the top end of the drive shaft 41. A second spur gear 32 that meshes with the first spur gear 42 is coaxially fixed to the outer wall of the bottom end of the rotating shaft 31. A glue application mechanism 5 is provided on the top wall of the processing box 1. The glue application mechanism 5 includes a glue application head 51, a glue tank 52, and a pump body 53. The glue application head 51 is installed on the inner top wall of the processing box 1, and the glue outlet of the glue application head 51 is directly above the center of the placement slot 33. The glue tank 52 is installed on the top surface of the processing box 1. The pump body 53 is installed on the outer wall of the processing box 1 near the top. The input end of the pump body 53 is fixedly connected to a feed pipe 531. The end of the feed pipe 531 away from the pump body 53 is fixedly connected to the side wall of the glue tank 52 and communicates with the glue tank 52. The output end of the pump body 53 is fixedly connected to a discharge pipe 532. The end of the discharge pipe 532 away from the pump body 53 is fixedly connected to the outer wall of the glue application head 51 and communicates with the glue application head 51.

[0031] During the coating process, the pump body 53 is started to deliver the photoresist in the adhesive tank 52 to the coating head 51 and then coat it onto the top surface of the silicon wafer. Then, the first motor 4 is started to drive the drive shaft 41 and the first spur gear 42 to rotate. Under the meshing of the first spur gear 42 and the second spur gear 32, the drive shaft 41 drives the rotating shaft 31 and the turntable 3 to rotate. Centrifugal force is used to spread the photoresist along the surface of the silicon wafer, so that the photoresist is uniformly coated on the surface of the silicon wafer.

[0032] like Figure 1 and Figure 2As shown, a hot air duct 12 is installed on the top wall of the processing box 1. Multiple air nozzles 121 arranged along the axial direction of the hot air duct 12 are installed on the outer wall of the hot air duct 12. A hot air blower 13 is installed on the outer wall of the processing box 1 near the top. An air inlet pipe 131 is fixedly connected to the input end of the hot air blower 13, and an air outlet pipe 132 is fixedly connected to the output end of the hot air blower 13. The end of the air outlet pipe 132 away from the hot air blower 13 is fixedly connected to the side wall of the hot air duct 12 and communicates with the hot air duct 12.

[0033] Once the photoresist on the silicon wafer surface has spread evenly, the hot air blower 13 is activated to blow hot air into the hot air pipe 12 and spray it out through the nozzle 121, thereby increasing the internal temperature of the processing box 1 and causing the photoresist coated on the silicon wafer surface to solidify quickly, so as to improve the chip coating efficiency.

[0034] like Figure 1 and Figure 2 As shown, the bottom end of the baffle cylinder 2 is shaped like an inverted frustum. A storage cylinder 6 located at the bottom of the baffle cylinder 2 is fixed to the bottom wall of the processing box 1. A pair of connecting pipes 61 are provided between the baffle cylinder 2 and the storage cylinder 6. The top end of the connecting pipe 61 is fixed to the bottom wall of the baffle cylinder 2, and the bottom end of the connecting pipe 61 is fixed to the top wall of the storage cylinder 6. The connecting pipe 61 connects the baffle cylinder 2 and the storage cylinder 6.

[0035] During the rotation of turntable 3, the adhesive material that is thrown off the silicon wafer will be blocked by baffle cylinder 2 and eventually gather at the bottom of baffle cylinder 2. The adhesive material gathered at the bottom of baffle cylinder 2 will then enter storage cylinder 6 through connecting pipe 61 for collection, so as to recycle and reuse the adhesive material.

[0036] like Figure 1 and Figure 4 As shown, a spiral water-cooling pipe 62 is fixedly connected to the inner wall of the storage cylinder 6. A water tank 7 containing coolant is fixedly connected to the bottom surface of the processing box 1. A water pump 71 is installed on the outer wall of the water tank 7. An inlet pipe 711 is fixedly connected to the input end of the water pump 71. The end of the inlet pipe 711 away from the water pump 71 is fixedly connected to the side wall of the water tank 7 and communicates with the water tank 7. An outlet pipe 712 is fixedly connected to the output end of the water pump 71. The end of the outlet pipe 712 away from the water pump 71 is fixedly connected to the outer wall of the inlet end of the water-cooling pipe 62 and communicates with the water-cooling pipe 62. A return pipe 63 is fixedly connected to the outer wall of the outlet end of the water-cooling pipe 62. The other end of the return pipe 63 is fixedly connected to the top wall of the water tank 7 and communicates with the water tank 7.

[0037] When the photoresist is stored in the storage cylinder 6, the water pump 71 is started to draw out the coolant from the water tank 7 and deliver it to the water cooling pipe 62 to exchange heat with the stored photoresist, thereby cooling the photoresist and reducing the possibility of solidification so that the photoresist can be recycled and reused.

[0038] like Figure 1 and Figure 5As shown, a second motor 521 is horizontally mounted on the outer wall of the glue tank 52. The output end of the second motor 521 is coaxially fixed to a first stirring shaft 522 extending into the glue tank 52. A pair of first stirring plates 523 are fixed to the outer wall of the first stirring shaft 522.

[0039] When applying photoresist to silicon wafers, the second motor 521 and the first stirring shaft 522 are started to rotate, causing the first stirring plate 523 to stir the photoresist in the photoresist box 52, so as to promote uniform mixing of the photoresist components and ensure the quality of photoresist application.

[0040] like Figure 1 and Figure 5 As shown, a second stirring shaft 72 is horizontally rotatably connected to the inner wall of the water tank 7. The second stirring shaft 72 is coaxial with the first stirring shaft 522. A pair of second stirring plates 721 are fixedly connected to the outer wall of the second stirring shaft 72. The water tank 7 is provided with heat dissipation vents 73 at the top of the side walls at both ends of the second stirring shaft 72. A first pulley 524 located outside the glue box 52 is coaxially fixed to the outer wall of the end of the first stirring shaft 522 away from the second motor 521. A second pulley 525 located outside the water tank 7 is coaxially fixed to the outer wall of the end of the second stirring shaft 72 near the first pulley 524. The first pulley 524 and the second pulley 525 are tensioned and sleeved with the same first belt 526. The first belt 526 makes the first pulley 524 and the second pulley 525 move together.

[0041] During rotation, the first stirring shaft 522 drives the second stirring shaft 72 to rotate through the cooperation of the first pulley 524, the second pulley 525 and the first belt 526. This causes the second stirring plate 721 to stir the coolant in the water tank 7, promotes heat exchange between the coolant and the atmospheric environment and dissipates the heat through the heat dissipation port 73, so that the coolant can be recycled.

[0042] like Figure 5 and Figure 6 As shown, a support shaft 731, coaxial with the second stirring shaft 72, is horizontally rotatably connected to the inner wall of one of the two heat dissipation vents 73. A fan blade 732 located inside the water tank 7 is coaxially fixed to the outer wall of one end of the support shaft 731. A fourth pulley 723 located outside the water tank 7 is coaxially fixed to the outer wall of the end of the support shaft 731 away from the fan blade 732. A third pulley 722 located outside the water tank 7 is coaxially fixed to the outer wall of the end of the second stirring shaft 72 near the fourth pulley 723. The third pulley 722 and the fourth pulley 723 are tensioned and fitted with the same second belt 724. The second belt 724 causes the third pulley 722 and the fourth pulley 723 to move together. A filter screen 733 is installed on the inner wall of both heat dissipation vents 73.

[0043] During rotation, the second stirring shaft 72 drives the support roller to rotate through the cooperation of the third pulley 722, the fourth pulley 723 and the second belt 724, which causes the fan blade 732 to rotate to draw air, so that the heat inside the water tank 7 can be quickly dissipated to the external environment. The filter screen 733 is set to block dust and reduce the possibility of dust and impurities entering the water tank 7.

[0044] A computing chip manufacturing process includes the following steps: S1: Place the silicon wafer in the placement slot 33 on the top surface of the turntable 3, and start the air pump 35 to evacuate the cavity 34, so that the silicon wafer is adsorbed and fixed in the placement slot 33 and kept stable. S2: Start the pump body 53 to transport the photoresist in the glue tank 52 to the coating head 51. The coating head 51 then coats the photoresist on the top surface of the silicon wafer. Then start the first motor 4 to drive the turntable 3 to rotate. Use centrifugal force to spread the photoresist along the surface of the silicon wafer, so that the photoresist can be evenly coated on the surface of the silicon wafer. S3: After the photoresist is evenly spread on the silicon wafer surface, the hot air blower 13 is started to blow hot air into the hot air pipe 12, and the hot air is sprayed out through the air nozzle 121 to increase the internal ambient temperature of the processing box 1, so as to promote the rapid solidification of the photoresist on the silicon wafer surface. S4: During the coating process, the second motor 521 can be started to drive the first stirring shaft 522 to rotate, which causes the first stirring plate 523 to stir the photoresist in the glue box 52, thereby improving the coating quality of the silicon wafer. S5: When the photoresist enters the storage cylinder 6 for storage, the water pump 71 is started to transport the coolant in the water tank 7 to the water cooling pipe 62 to exchange heat with the photoresist and cool it down so that the photoresist can be recycled and reused.

[0045] Working principle: During the silicon wafer coating process, the silicon wafer is placed in the placement slot 33 on the top surface of the turntable 3. The vacuum pump 35 is started to evacuate the cavity 34, causing the silicon wafer to be adsorbed and fixed in the placement slot 33 to maintain stability. Then, the pump body 53 is started to extract the photoresist from the adhesive tank 52 and transport it to the coating head 51. The coating head 51 then coats the top surface of the silicon wafer with photoresist. Next, the first motor 4 is started to drive the drive shaft 41 and the first spur gear 42 to rotate. Under the meshing of the first spur gear 42 and the second spur gear 32, the drive shaft 41 rotates. The moving shaft 41 drives the rotating shaft 31 and the turntable 3 to rotate. Centrifugal force is used to spread the photoresist along the surface of the silicon wafer, so that the photoresist is evenly coated on the surface of the silicon wafer. Excess photoresist is sprayed out and finally falls to the bottom of the baffle cylinder 2 and enters the storage cylinder 6 through the connecting pipe 61 for storage. After the photoresist is evenly spread on the surface of the silicon wafer, the hot air blower 13 is started to blow hot air into the hot air pipe 12 and spray the hot air out through the nozzle 121 to increase the temperature of the internal environment of the processing box 1, so as to promote the rapid solidification of the photoresist on the surface of the silicon wafer and improve the chip processing efficiency. During the temperature rise inside the processing box 1, the water pump 71 is started to draw out the coolant from the water tank 7 and deliver it to the water cooling pipe 62 to exchange heat with the stored photoresist, thereby cooling the stored photoresist and reducing the possibility of the photoresist solidifying due to excessive temperature, so that the collected photoresist can be recycled and reused. During the silicon wafer coating process, the second motor 521 can be started to drive the first stirring shaft 522 to rotate, causing the first stirring plate 523 to stir the photoresist in the adhesive box 52, so as to promote uniform mixing of the components in the photoresist, reduce the possibility of photoresist precipitation or layering, and improve the quality of silicon wafer coating.

[0046] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A computing chip processing device, characterized in that: The system includes a processing box (1), a baffle cylinder (2), and a turntable (3). One side of the processing box (1) is open, and a door (11) is installed on the outer wall of the open side of the processing box (1). The baffle cylinder (2) is installed on the bottom wall of the processing box (1). The turntable (3) is located inside the baffle cylinder (2) and can adsorb and fix the chip placed on its top surface. A rotating shaft (31) is coaxially fixed to the bottom surface of the turntable (3). The bottom end of the rotating shaft (31) extends through the bottom wall of the baffle cylinder (2) and into the baffle cylinder (2). At the bottom, the rotating shaft (31) is rotatably engaged with the bottom wall of the baffle cylinder (2); a first motor (4) is installed on the bottom wall of the processing box (1); a drive shaft (41) is coaxially fixed to the output end of the first motor (4); a first spur gear (42) is coaxially fixed to the outer wall of the top end of the drive shaft (41); a second spur gear (32) that meshes with the first spur gear (42) is coaxially fixed to the outer wall of the bottom end of the rotating shaft (31); a coating mechanism (5) for coating silicon wafers is provided on the top wall of the processing box (1).

2. The computing chip processing equipment according to claim 1, characterized in that: The top surface of the turntable (3) is provided with a placement groove (33) for placing silicon wafers; the interior of the turntable (3) is provided with a cavity (34) communicating with the placement groove (33); the rotating shaft (31) is coaxially provided with a channel (311) communicating with the cavity (34); an air pump (35) is provided on the bottom wall of the processing box (1); the input end of the air pump (35) is fixedly connected to an air inlet pipe (351) extending into the channel (311) and communicating with the channel (311), and the output end of the air pump (35) is fixedly connected to an air outlet pipe (352).

3. The computing chip processing equipment according to claim 2, characterized in that: The coating mechanism (5) includes a coating head (51) and a glue tank (52); the coating tube is installed on the top wall of the processing box (1), and multiple coating heads (51) are installed on the outer wall of the coating tube; the multiple coating heads (51) correspond to the positions of multiple placement slots (33); the glue tank (52) is installed on the top surface of the processing box (1), and photoresist is contained in the glue tank (52); a pump body (53) is installed on the outer wall of the processing box (1); the input end of the pump body (53) is fixedly connected to a feed pipe (531) communicating with the glue tank (52), and the output end of the pump body (53) is fixedly connected to a discharge pipe (532) communicating with the coating tube.

4. The computing chip processing equipment according to claim 3, characterized in that: A second motor (521) is installed on the outer wall of the glue tank (52); a first stirring shaft (522) extending into the glue tank (52) is coaxially fixed to the output end of the second motor (521); a first stirring plate (523) is fixed to the outer wall of the first stirring shaft (522).

5. The computing chip processing equipment according to claim 1, characterized in that: A hot air pipe (12) is installed on the inner top wall of the processing box (1); a nozzle (121) is installed on the outer wall of the hot air pipe (12); a hot air blower (13) is installed on the outer wall of the processing box (1); an air inlet pipe (131) is fixedly connected to the input end of the hot air blower (13), and an air outlet pipe (132) connected to the hot air pipe (12) is fixedly connected to the output end of the hot air blower (13).

6. The computing chip processing equipment according to claim 4, characterized in that: A storage cylinder (6) located at the bottom of the baffle cylinder (2) is fixedly connected to the bottom wall of the processing box (1); a connecting pipe (61) is provided on the top surface of the storage cylinder (6); the connecting pipe (61) connects the baffle cylinder (2) and the storage cylinder (6); a water cooling pipe (62) is provided inside the storage cylinder (6); a water tank (7) is fixedly connected to the bottom surface of the processing box (1); a water pump (71) is installed on the outer wall of the water tank (7); an inlet pipe (711) connected to the water tank (7) is fixedly connected to the input end of the water pump (71), and an outlet pipe (712) connected to the inlet end of the water cooling pipe (62) is fixedly connected to the output end of the water pump (71); a return pipe (63) connected to the water tank (7) is fixedly connected to the outlet end of the water cooling pipe (62).

7. The computing chip processing equipment according to claim 6, characterized in that: The inner wall of the water tank (7) is rotatably connected to a second stirring shaft (72) coaxial with the first stirring shaft (522); a second stirring plate (721) is fixedly connected to the outer wall of the second stirring shaft (72); a pair of heat dissipation vents (73) are provided on the side wall of the water tank (7), located at the top of the two ends of the second stirring shaft (72); a first pulley (524) is coaxially fixedly connected to the outer wall of one end of the first stirring shaft (522); a second pulley (525) is coaxially fixedly connected to the outer wall of one end of the second stirring shaft (72); the same first belt (526) is sleeved on the outside of the first pulley (524) and the second pulley (525).

8. The computing chip processing equipment according to claim 7, characterized in that: A support shaft (731) is rotatably connected to the inner wall of any one of the pair of heat dissipation vents (73); the support shaft (731) is coaxial with the second stirring shaft (72), and a fan blade (732) located in the water tank (7) is fixedly connected to one end of the support shaft (731); a third pulley (722) is coaxially fixedly connected to the outer wall of the second stirring shaft (72) near the support shaft (731); a fourth pulley (723) is fixedly connected to the outer wall of the end of the support shaft (731) away from the fan blade (732); the same second belt (724) is sleeved on the outside of the third pulley (722) and the fourth pulley (723).

9. A computing chip processing device according to claim 7, characterized in that: A filter screen (733) is provided on the inner wall of each pair of heat dissipation vents (73).

10. A computing chip manufacturing process, based on the computing chip manufacturing equipment according to any one of claims 1-9, characterized in that: The processing technology includes the following steps: S1: Place the silicon wafer at the designated position on the turntable (3), and use the method of generating negative pressure by air extraction to adsorb and fix the silicon wafer, so that the silicon wafer remains stable on the turntable (3); S2: The photoresist is sprayed onto the silicon wafer surface by the coating mechanism (5), and then the first motor (4) is started to drive the turntable (3) to rotate. The centrifugal force is used to spread the photoresist along the silicon wafer surface, so that the photoresist is evenly coated on the silicon wafer surface. S3: After the photoresist is evenly diffused on the silicon wafer surface, the hot air blower (13) is started to blow hot air into the hot air pipe (12), and the hot air is sprayed out through the nozzle (121) to increase the internal ambient temperature of the processing box (1) and promote the rapid solidification of the photoresist on the silicon wafer surface.

Images