Laser heating device and laser welding equipment
By combining the first laser module and the second laser module, the laser welding equipment can be flexibly adapted to components of different sizes and structures, thereby improving the welding effect.
Patent Information
- Application Number
- CN202511460225.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-11
- Publication Date
- 2025-11-14
AI Technical Summary
Existing laser welding equipment cannot effectively adapt to components of different sizes and structures, affecting the welding effect.
The system employs a combination of a first laser module and a second laser module. The first module is fixed while the second module is rotatable. The laser spots of the two modules are set perpendicularly, and the laser spots are spliced together by adjusting the angle to form a heating laser spot, which can be adapted to different target objects.
It enables flexible adjustment of the heating spot to adapt to target objects of different sizes and structures, thereby improving welding quality.
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Figure CN120940897A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of welding equipment, and more specifically, to a laser heating device and laser welding equipment. Background Technology
[0002] With the development of laser technology, it has been widely used in various technical fields, such as welding of components or welding of other structures.
[0003] In related technologies, laser welding equipment includes a laser mechanism that emits laser light onto components, thereby welding the components onto a circuit board. However, the components on the circuit board may have varying structural dimensions, and the laser may not be optimally suited to these dimensions, thus affecting the welding performance. Summary of the Invention
[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention proposes a laser heating device and a laser welding equipment, which can adjust the size and power density of the laser spot to better heat the target object.
[0005] In a first aspect, embodiments of this application provide a laser heating device, comprising:
[0006] The first laser mechanism includes a fixedly installed first laser module, which is used to emit light towards a target object to form a first light spot on the target object;
[0007] The second laser mechanism includes a rotatably mounted second laser module, which is used to emit light towards the target object to form a second light spot on the target object;
[0008] The orientation of the first laser module is perpendicular to the axis of rotation of the second laser module, and the second laser module can be angled to adjust the splicing between the second light spot and the first light spot.
[0009] According to some embodiments of the present invention, the second laser module is provided in multiple forms, and the multiple second laser modules are sequentially located on the periphery of the first laser module.
[0010] According to some embodiments of the present invention, four second laser modules are provided, and the four second laser modules are respectively located on the four sides of the first laser module.
[0011] According to some embodiments of the present invention, the first laser mechanism further includes a mounting base, and the first laser module is fixedly disposed on the mounting base;
[0012] The second laser mechanism also includes a turntable base, on which the second laser module is rotatably mounted, and is separately and independently mounted from the mounting base.
[0013] According to some embodiments of the present invention, the turntable base includes a fixed part and a mounting part connected to each other, the mounting part being U-shaped, and the second laser module being rotatably disposed between the two sides of the mounting part.
[0014] According to some embodiments of the present invention, the second laser mechanism further includes a driving member for driving the second laser module to rotate and adjust.
[0015] According to some embodiments of the present invention, the laser heating device further includes a control module, which includes a main control unit, a first control board, and a second control board. The main control unit is used to send a first control command to the first control board, and the first control board controls the power generated by the first laser module and the second laser module according to the first control command. The main control unit is also used to send a second control command to the second control board, and the second control board controls the rotation adjustment of the driving component according to the second control command.
[0016] According to some embodiments of the present invention, both the first laser module and the second laser module are provided with liquid cooling plates on their back sides, and the inner side of the liquid cooling plates is integrated with liquid cooling channels for supplying liquid cooling water.
[0017] According to some embodiments of the present invention, the first laser module and the second laser module are provided with multiple sets of laser modules, and the liquid cooling plate is provided with multiple sets of liquid cooling channels. The number of sets of laser modules and the number of sets of liquid cooling channels are set in equal numbers and correspond one-to-one.
[0018] Secondly, this application discloses a camera assembly device, including the aforementioned laser heating device.
[0019] As can be seen from the above technical solutions, the embodiments of this application have the following advantages: the first laser module and the second laser module simultaneously emit heating lasers towards the target object to form a first light spot and a second light spot on the target object, respectively. The first light spot and the second light spot are spliced together to form a heating light spot for heating the target object. The second laser module is rotatably arranged relative to the first laser module, and the orientation direction of the first laser module is perpendicular to the axial direction of the rotation axis of the second laser module. This arrangement allows for adjustment of the angle of the second laser module, thereby adjusting the splicing between the second light spot and the first light spot, and consequently adjusting the size, shape, power density, etc., of the heating light spot, enabling better heating of the target object. Furthermore, for target objects of different sizes and / or structures, the heating light spot can be adjusted to better adapt to the target object, thus achieving better heating for different target objects. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings.
[0021] Figure 1 This is a schematic diagram of the axial structure of the laser heating device disclosed in the embodiments of this application;
[0022] Figure 2 This is a schematic diagram of the front and side structure of the laser heating device disclosed in the embodiments of this application;
[0023] Figure 3 This is a schematic diagram of the structure of the laser module disclosed in the embodiments of this application;
[0024] Figure 4 This is a schematic diagram of the structure of the turntable base disclosed in the embodiments of this application.
[0025] Explanation of reference numerals in the attached figures:
[0026] 100, First laser mechanism; 110, First laser module; 120, Mounting base; 200, Second laser mechanism; 210, Second laser module; 130, Turntable base; 131, Fixing part; 132, Mounting part; 1321, Side part; 140, Driving component; 300, Liquid cooling plate. Detailed Implementation
[0027] The present application will be further described in detail below with reference to the accompanying drawings.
[0028] This application provides a laser heating device.
[0029] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all of them. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present application. Furthermore, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by the present application.
[0030] The terms "first," "second," "third," "fourth," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in a sequence other than that illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0031] To resolve the above technical issues, please refer to [link / reference]. Figure 1 and Figure 2 The laser heating device in this embodiment includes a first laser mechanism 100 and a second laser mechanism 200. The first laser mechanism 100 includes a fixedly disposed first laser module 110, which is used to emit laser light towards a target object to form a first light spot on the target object. The second laser mechanism 200 includes a rotatably disposed second laser module 210, which is used to emit laser light towards the target object to form a second light spot on the target object. The orientation direction of the first laser module 110 is perpendicular to the axial direction of the rotation axis of the second laser module 210, and the second laser module 210 can adjust its angle to adjust the combination between the second light spot and the first light spot.
[0032] In practical applications, the laser heating device is positioned directly above the target object. The first laser module 110 emits laser light vertically downwards towards the target object, while the second laser module 210 emits laser light vertically towards the target object at a certain tilt angle. Both the first laser module 110 and the second laser module 210 simultaneously emit heating laser light towards the target object, forming a first light spot and a second light spot on the target object, respectively. The first and second light spots are then combined to form a heating spot for heating the target object. The second laser module 210 is rotatably configured relative to the first laser module 110, and the orientation of the first laser module 110 is perpendicular to the axial direction of the rotation axis of the second laser module 210. This configuration allows adjustment of the angle of the second laser module 210, thereby adjusting the splicing between the second and first laser spots, and consequently adjusting the size, shape, and power density of the heating spot. This allows the heating spot to better heat the target object. Furthermore, for target objects of different sizes and / or structures, the heating spot can be adjusted to better fit the target object, thus providing better heating for different target objects.
[0033] In some embodiments, please refer to Figure 1 and Figure 2 The second laser module 210 is provided in multiple units, and the multiple second laser modules 210 are arranged around the first laser module 110. In other words, the first laser module 110 is located between the multiple second laser modules 210, and there are four second laser modules 210, which are respectively located on the four sides of the first laser module 110. Therefore, in practical applications, the operator can adjust each or some of the second laser modules 210 around the first laser module 110 to adjust the splicing of each second light spot with the first light spot, thereby obtaining a heating light spot adapted to the target object.
[0034] Understandably, multiple second laser modules 210 are arranged around the periphery of the first laser module 110. While the first laser module 110 forms a first light spot on the target object, the multiple second laser modules 210 form multiple second light spots around the periphery of the first light spot on the target object. The first light spot and the multiple second light spots are then combined to form a heating light spot. The operator can adjust the angle of each of the second laser modules 210, thereby adjusting the second light spots around the first light spot, and further adjusting the combination of each second light spot and the first light spot to adjust the resulting heating light spot. It should be noted that multiple second laser modules 210 are provided. This arrangement allows the operator more flexibility in adjusting the size, shape, and power density of the heating light spot. In particular, having four second laser modules 210 allows for the adjustment of rectangular heating light spots of different sizes.
[0035] In one specific embodiment, please refer to Figure 1 and Figure 4 The second laser mechanism 200 further includes a turntable base 130, on which the second laser module 210 is rotatably mounted. Specifically, the turntable base 130 includes a fixed part 131 and a mounting part 132 connected together. The fixed part 131 is cylindrical, and the mounting part 132 is U-shaped. The mounting part 132 is connected to the top of the fixed part 131. The mounting part 132 has two parallel sides 1321. A driving member 140 is fixedly mounted on one side plate. One end of the second laser module 210 is connected to the driving part of the driving member 140, and the other end of the second laser module 210 is rotatably connected to the other side plate. Thus, the second laser module 210 is conveniently connected between the two sides 1321. It is understandable that the turntable base 130 adopts the above-mentioned structural form. The turntable base 130 has a simple structure, and the second detection module can be easily installed on the turntable base 130. Multiple second laser mechanisms 200 can be compactly installed around the first detection mechanism.
[0036] In some embodiments, please refer to Figure 1 and Figure 2 The first laser mechanism 100 further includes a mounting base 120, on which the first laser module 110 is fixedly mounted. The mounting base 120 is separate from and independently mounted to the turntable base 130. Correspondingly, the first laser mechanism 100 and the second laser mechanism 200 are independently mounted. Alternatively, the first laser module 110 and the second laser module 210 can be mounted on the same mounting base 120, with the second laser module 210 rotatably connected to the mounting base 120; this will not be described in detail. It is understood that by independently mounting the first laser mechanism 100 and the second laser mechanism 200, when either the first laser module 110 or the second laser module 210 malfunctions, personnel can easily disassemble either the first laser mechanism 100 or the second laser mechanism 200 to repair the laser module of the first laser mechanism 100, or to facilitate repair of the laser module of the second laser mechanism 200.
[0037] In some embodiments, the second laser mechanism 200 further includes a drive member 140, which is disposed on a turntable base 130. The drive member 140 is used to drive the second laser module 210 to rotate and adjust. For example, the drive member 140 is a motor disposed on the turntable base 130, one end of the second laser module 210 is connected to the drive part of the drive member 140, and the other end of the second laser module 210 is rotatably connected to the turntable base 130.
[0038] Understandably, when it is necessary to adjust the angle of the second laser module 210 relative to the first laser module 110, the operator can control the drive component 140 through the control system, thereby controlling the rotation angle of the second laser module 210. For example, the operator can pre-design a working procedure, and the second laser module 210 will adjust its angle according to the working procedure during operation.
[0039] Furthermore, the first laser mechanism 100 and the second laser mechanism 200 are set separately, and each second laser module 210 is also set separately. This arrangement allows operators to set the required number of second laser modules 210 around the first laser mechanism 100 as needed. For example, two, three, or four second laser modules 210 can be sequentially set around the first laser module 110. Of course, the second laser mechanism 200 does not need to be set around the first laser module 110; this can be done according to actual needs.
[0040] Furthermore, the laser heating device also includes a control module, which is electrically connected to the drive unit 140. Specifically, the control module includes host computer software, a drive PCB board, a control PCB board, and embedded control software. The host computer software sends control commands to the control PCB board, which decodes the signals and transmits them to the drive PCB board. The drive PCB board controls the laser light source's emission area and laser power according to the command requirements. The host computer software sends control commands to the control PCB board, which then controls the control motor of the laser module angle adjustment module, thereby adjusting the module's rotation angle. Five laser modules are combined in different arrangements, with one module irradiating vertically downwards and the other four modules irradiating at certain angles. By adjusting the angles of the four modules, the light spots of the five laser modules are stitched together, thus changing the light spot size. By adjusting the output power of the five modules, extremely high power density is achieved at a given light spot size. The power density of the laser system is adjustable through the overall control system.
[0041] In some embodiments, please refer to Figures 1 to 3 Both the first laser module 110 and the second laser module 210 have a liquid cooling plate 300 on their back sides, and the liquid cooling plate 300 has a water cooling channel. One end of the liquid cooling channel is a water inlet, which is connected to an external water source, and the other end of the liquid cooling channel is a water outlet, which can be connected to an external transducer. Thus, the external water source inputs liquid cooling water into the liquid cooling channel of the liquid cooling plate 300, and the liquid cooling water dissipates heat from the liquid cooling plate 300, thereby enabling the liquid cooling plate 300 to dissipate heat from the laser modules.
[0042] Furthermore, both the first laser module 110 and the second laser module 210 can be divided into multiple regions, each region housing a set of laser modules. Simultaneously, the liquid cooling plate 300 has multiple sets of liquid cooling channels, with each laser module having an equal number of liquid cooling channels, and each set of laser modules having an independent water channel on its back. It can be understood that by using multiple liquid cooling channels, each liquid cooling channel cools its corresponding set of laser modules, thus ensuring sufficient cooling for the laser modules.
[0043] This application also discloses a laser welding device, including the aforementioned laser heating device.
[0044] Understandably, the laser welding equipment employs the aforementioned laser heating device. The laser heating device is located directly above the target object. The first laser module 110 emits laser light vertically downwards towards the target object, while the second laser module 210 emits laser light vertically towards the target object at a certain tilt angle. Specifically, the first laser module 110 and the second laser module 210 simultaneously emit heating laser light towards the target object, forming a first light spot and a second light spot respectively on the target object. The first and second light spots are then combined to form a heating spot for heating the target object. The second laser module 210 is rotatably configured relative to the first laser module 110, and the orientation of the first laser module 110 is perpendicular to the axial direction of the rotation axis of the second laser module 210. This configuration allows adjustment of the angle of the second laser module 210, thereby adjusting the splicing between the second and first laser spots, and consequently adjusting the size, shape, and power density of the heating spot. This allows the heating spot to better heat the target object. Furthermore, for target objects of different sizes and / or structures, the heating spot can be adjusted to better fit the target object, thus providing better heating for different target objects.
[0045] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.
Claims
1. A laser heating device, characterized in that, include: The first laser mechanism (100) includes a fixedly disposed first laser module (110), which is used to emit light towards the target object to form a first light spot on the target object; The second laser mechanism (200) includes a rotatably configured second laser module (210) for emitting light toward a target object to form a second light spot on the target object; The orientation of the first laser module (110) is perpendicular to the axis of rotation of the second laser module (210), and the second laser module (210) can be angled to adjust the splicing between the second light spot and the first light spot.
2. The laser heating device according to claim 1, characterized in that, The second laser module (210) is provided in multiple ways, and the multiple second laser modules (210) are located sequentially on the periphery of the first laser module (110).
3. The laser heating device according to claim 2, characterized in that, There are four second laser modules (210), and the four second laser modules (210) are respectively located on the four sides of the first laser module (110).
4. The laser heating device according to claim 4, characterized in that, The turntable base (130) includes a fixed part (131) and a mounting part (132) connected to each other. The mounting part (132) is U-shaped, and the second laser module (210) is rotatably disposed between the two sides (1321) of the mounting part (132).
5. The laser heating device according to claim 4, characterized in that, The first laser mechanism (100) also includes a mounting base (120), the first laser module (110) is fixedly mounted on the mounting base (120) and is set separately and independently from the turntable base (130).
6. The laser heating device according to any one of claims 1-5, characterized in that, The second laser mechanism (200) further includes a drive member (140) for driving the second laser module (210) to rotate and adjust.
7. The laser heating device according to claim 6, characterized in that, The laser heating device further includes a control module, which includes a main control unit, a first control board, and a second control board. The main control unit is used to send a first control command to the first control board, and the first control board controls the power emitted by the first laser module (110) and the second laser module (210) according to the first control command. The main control unit is also used to send a second control command to the second control board, and the second control board controls the rotation adjustment of the drive component (140) according to the second control command.
8. The laser heating device according to claim 1, characterized in that, Both the first laser module (110) and the second laser module (210) have liquid cooling plates (300) on their back sides. The inner side of the liquid cooling plate (300) is integrated with a liquid cooling channel for supplying liquid cooling water.
9. The laser heating device according to claim 8, characterized in that, Both the first laser module (110) and the second laser module (210) are provided with multiple sets of laser modules, and the liquid cooling plate (300) is provided with multiple sets of liquid cooling channels. The number of sets of laser modules and the number of sets of liquid cooling channels are set in equal numbers and correspond one-to-one.
10. A laser welding device, characterized in that, Includes the laser heating device according to any one of claims 1 to 9.
Citation Information
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