A crystallizer copper plate polishing device and processing technology

Abstract

The present application relates to the technical field of polishing, and provides a crystallizer copper plate polishing device and processing technology.The polishing device comprises a rack, a mounting frame movably arranged on the rack, a polishing mechanism arranged on the mounting frame, and a workbench comprising a base and an adjusting table; the base is provided with two groups of mounting plates provided with mounting holes one and mounting holes two; the adjusting table is connected with the mounting holes one or the mounting holes two through the through holes on the connecting plate, so that the flat surface or the inclined surface of the copper plate can be arranged horizontally, thereby enabling the polishing mechanism to polish the flat surface or the inclined surface; and the present application realizes convenient horizontal polishing of the flat surface and the inclined surface of the copper plate by means of the angle-switchable adjusting table, and solves the technical problem of inconvenient leveling of the surface to be polished in the multi-surface polishing of the copper plate in the prior art.

Description

Technical Field

[0001] This invention relates to the field of polishing technology, specifically to a polishing device and processing technology for a crystallizer copper plate. Background Technology

[0002] As a key component in the continuous casting process of the metallurgical industry, the copper plate in the crystallizer comes into direct contact with molten steel at high temperatures and plays a crucial role in the solidification and shaping of the steel. Its surface quality has a decisive impact on the production efficiency of the cast billet and the quality of the finished product. During continuous casting, the copper plate surface must maintain extremely high flatness. If there are protrusions, depressions, or rough marks on the surface, it will not only increase the frictional resistance between the cast billet and the copper plate, leading to defects such as cracks and scratches on the billet surface, but in severe cases, it can also cause steel leakage accidents, resulting in significant economic losses such as production line shutdowns and equipment damage. Therefore, in the copper plate production and processing stage, especially after solution coating, its surface must be finely treated using professional grinding processes to meet the stringent requirements of continuous casting production.

[0003] The structure of the crystallizer copper plate is quite unique. It is not a single planar structure, but rather includes a flat surface and two inclined surfaces symmetrically arranged on both sides of the flat surface, sloping outwards and downwards. The grinding precision required for each surface is consistent, and each surface must be ground separately.

[0004] In the existing technology, there are still obvious technical limitations in the grinding equipment and processing technology for crystallizer copper plates. In terms of grinding equipment, most of the mainstream equipment on the market adopts a fixed horizontal worktable design, the angle of the worktable cannot be adjusted, and it can only be adapted to grinding operations on a single plane. At the same time, the grinding components are mostly single-function modules (either only capable of coarse grinding or only capable of fine grinding). In terms of processing technology, some manufacturers often skip the milling pretreatment step in pursuit of efficiency and directly grind the coated copper plate. Even if pretreatment is carried out, there is a lack of precise control over the grinding amount (often resulting in the coating grinding amount exceeding 0.05mm, damaging the copper plate substrate). In multi-face grinding operations, the existing process for adjusting the grinding surface to keep it level is quite cumbersome. After the flat surface is ground, if it is necessary to grind the inclined surfaces on both sides, the operator either needs to frequently disassemble and replace special tooling fixtures (different fixtures are required for copper plates with different inclination angles), or manually insert shims of different thicknesses at the bottom of the copper plate to adjust the inclination angle. Moreover, after each adjustment, it is necessary to repeatedly calibrate with tools such as a level, making the operation process extremely cumbersome. Summary of the Invention

[0005] To overcome the above-mentioned defects, embodiments of the present invention provide a crystallizer copper plate grinding device and processing technology, which solves the technical problem of inconvenient leveling of the surface to be ground when grinding multiple sides of copper plates in the prior art.

[0006] According to one aspect, at least one embodiment of the present invention provides a crystallizer copper plate polishing device for polishing copper plates, the copper plates having a flat surface and an inclined surface to be polished, the inclined surface being two in number, the two inclined surfaces being located on both sides of the flat surface and inclined outward and downward, including:

[0007] frame;

[0008] Mounting bracket, which is movably mounted on the frame;

[0009] A grinding mechanism, wherein the grinding mechanism is mounted on the mounting bracket;

[0010] The workbench includes a base and an adjustment platform. The base is located below the grinding mechanism. Two sets of mounting plates are provided on the base, symmetrically arranged on both sides above the base. Each mounting plate has a first mounting hole and a second mounting hole. The two second mounting holes are located either below or above the two first mounting holes. The adjustment platform supports and fixes the copper plate. The bottom of the adjustment platform has two connecting plates corresponding to the mounting plates. The connecting plates have through holes for alignment with the first or second mounting holes and connection via connectors, so that the flat surface or the inclined surface is horizontal.

[0011] For example, in a crystallizer copper plate polishing device provided in at least one embodiment of the present invention, a limiting component for fixing the copper plate is provided on the adjusting table. The limiting component includes two limiting plates one and two limiting plates two. The two limiting plates one are arranged in parallel, and the two limiting plates two are arranged in parallel. The two limiting plates one and the two limiting plates two can enclose and form a receiving space for accommodating the copper plate. The limiting plate one has a first limiting surface and second limiting surfaces located at both ends of the first limiting surface. The second limiting surface gradually tilts outward and downward. The first limiting surface is parallel to the top surface of the adjusting table.

[0012] The second limiting plate has a third limiting surface that is coplanar with the second limiting surface. The first limiting plate and the second limiting plate are configured such that when the copper plate is located in the accommodating space, the first limiting surface is coplanar with the flat surface, and the second limiting surface and the third limiting surface are coplanar with the inclined surface.

[0013] For example, in a crystallizer copper plate polishing device provided in at least one embodiment of the present invention, the polishing mechanism includes a coarse polishing module and a fine polishing module, and a switching mechanism is provided between the coarse polishing module and the fine polishing module. The switching mechanism is used to put the coarse polishing module or the fine polishing module into a polishing state. The switching mechanism includes:

[0014] A linear drive unit, the linear drive unit being disposed on the mounting bracket;

[0015] The transmission assembly includes a rack I connected to the output end of the linear drive, two gears I rotatably mounted on the mounting frame, and two vertically extending racks II. Both gears I are connected to the mounting frame via the same shaft I. One gear I meshes with the rack I, and the other gear I is located between the two racks II and meshes with each of the two racks II. The fine grinding module and the coarse grinding module are respectively connected to the two racks II and are used to move up and down under the drive of the racks II to move the fine grinding module or the coarse grinding module down and grind the copper plate.

[0016] For example, in a crystallizer copper plate polishing device provided in at least one embodiment of the present invention, the polishing mechanism further includes a rotation drive assembly for driving the coarse polishing module and the fine polishing module to work. The rotation drive assembly includes a drive member disposed on the mounting frame and two sets of transmission members respectively connected to the coarse polishing module and the fine polishing module. The rotation drive assembly is configured such that when the switching mechanism puts the coarse polishing module or the fine polishing module into a polishing state, the transmission members can drive the coarse polishing module or the fine polishing module to rotate under the action of the drive member.

[0017] For example, in a crystallizer copper plate grinding device provided in at least one embodiment of the present invention, the coarse grinding module includes:

[0018] Connector 1, which is slidably disposed on the mounting bracket and located on one side of rack 2 away from gear 1, rack 2 being connected to connector 1;

[0019] A coarse grinding wheel is rotatably mounted on the connecting member, and a rotating wheel is provided on the shaft of the coarse grinding wheel for transmission connection with the transmission member.

[0020] For example, in a crystallizer copper plate polishing device provided in at least one embodiment of the present invention, the fine polishing module includes:

[0021] Connector 2, which is slidably disposed on the mounting bracket and located on the side of another rack 2 away from the gear 1, and the rack 2 is connected to the connector 2;

[0022] A pulley is rotatably mounted on the connecting member 2, and a rotating wheel 2 for transmission connection with the transmission member is provided on the shaft of the pulley 1.

[0023] Pulley 2, wherein multiple pulleys 2 are provided, and multiple pulleys 2 are rotatably mounted on the mounting frame;

[0024] A polishing belt, which is tensioned on the first pulley and the second pulley, is used for fine polishing of the copper plate.

[0025] For example, in a crystallizer copper plate polishing device provided in at least one embodiment of the present invention, each set of the transmission components includes:

[0026] A drive wheel, which is connected to the output shaft of the drive component;

[0027] Driven wheels, the number of which is at least two, and both driven wheels are rotatably mounted on the mounting bracket;

[0028] A conveyor belt is wound around the driving wheel and the driven wheel. The second rotating wheel and the first rotating wheel are located inside the conveyor belt. The transmission component is configured such that when the switching mechanism switches the working state of the coarse grinding module and the fine grinding module, the second rotating wheel or the first rotating wheel can move and abut against the conveyor belt to drive the coarse grinding module or the fine grinding module to rotate under the action of the conveyor belt.

[0029] For example, in a crystallizer copper plate grinding device provided in at least one embodiment of the present invention, the fine grinding module further includes an adjustment component, the adjustment component comprising:

[0030] A telescopic component is mounted on the mounting frame, and a sliding component is provided at the telescopic end of the telescopic component;

[0031] The tensioning wheel is rotatably mounted on the sliding member, and its peripheral wall can abut against the outer wall of the grinding belt under the extension of the telescopic member to tension the grinding belt.

[0032] For example, in a crystallizer copper plate polishing device provided in at least one embodiment of the present invention, the frame is further provided with a moving component for driving the mounting frame to move. The moving component includes a longitudinal moving frame, a transverse moving frame and a lifting frame. The longitudinal moving frame is movably disposed on the frame, the transverse moving frame is movably disposed on the longitudinal moving frame, the moving direction of the longitudinal moving frame and the moving direction of the transverse moving frame are both arranged in the horizontal direction and are perpendicular to each other, the lifting frame is lifted and lowered on the transverse moving frame, and the mounting frame is disposed on the lifting frame.

[0033] According to another aspect, at least one embodiment of the present invention also provides a crystallizer copper plate processing technology, comprising the following steps:

[0034] S1. Milling pretreatment: After the copper plate is straightened, it is milled to leave a grinding allowance on the surface of the copper plate. The grinding allowance is less than or equal to 0.05 mm and the flatness of the coating is less than 0.03 mm.

[0035] S2. Rough grinding: Place the copper plate on the worktable, making the flat surface and the inclined surface of the copper plate parallel to the horizontal plane in turn. Use a rough grinding wheel to rough grind the copper plate so that the surface roughness of the copper plate coating is less than 0.8μmm and the flatness is less than 0.01mm.

[0036] S3. Fine grinding: Place the copper plate on the worktable, making the flat surface and the inclined surface of the copper plate parallel to the horizontal plane in turn. Use a grinding belt to fine grind the copper plate so that the surface roughness of the copper plate coating is less than 0.4μm and the flatness is less than 0.01mm.

[0037] The beneficial effects of this invention are as follows:

[0038] In this invention, the worktable, through the matching design of mounting holes one and two on the base and the connecting plate, eliminates the need to change tooling fixtures. Simply by switching the insertion position, the flat or inclined surface of the copper plate can be kept horizontal. This simplifies the multi-face grinding process, avoids errors caused by manual angle adjustment, and significantly improves the leveling accuracy of the surface to be ground, laying the foundation for subsequent high-quality grinding. At the same time, a single worktable can adapt to the multi-face grinding needs of copper plates, significantly improving the versatility of the device and reducing equipment investment costs.

[0039] From a process perspective, the milling pretreatment stage precisely controls the coating grinding amount to be less than 0.05mm and the flatness to be less than 0.03mm, leaving reasonable allowance for subsequent grinding and avoiding excessive grinding that could damage the copper plate substrate. The coarse grinding and fine grinding are carried out in separate steps, and with the grinding mechanism of the device, the surface roughness of the copper plate coating can be reduced to less than 0.8μm, less than 0.4μm, and the flatness to less than 0.01mm, respectively, meeting the surface precision requirements of the crystallizer copper plate and effectively ensuring the quality of the cast billet in continuous casting production. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are merely some exemplary embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the exemplary embodiments of the present invention and these drawings without any creative effort.

[0041] Figure 1 This is a schematic diagram of a crystallizer copper plate polishing device according to one embodiment of the present invention;

[0042] Figure 2 for Figure 1 A schematic diagram of the base structure in the embodiment;

[0043] Figure 3 for Figure 1A schematic diagram of the regulating table in the embodiment;

[0044] Figure 4 for Figure 1 A front view of the grinding mechanism in the embodiment;

[0045] Figure 5 for Figure 4 Enlarged view of a portion of point A in the middle;

[0046] Figure 6 for Figure 1 Rear view of the grinding mechanism in the embodiment;

[0047] Figure 7 for Figure 1 A schematic diagram of an angle structure of the grinding mechanism in the embodiment;

[0048] Figure 8 for Figure 1 Another structural schematic diagram of the grinding mechanism in the embodiment;

[0049] Figure 9 for Figure 1 The embodiment shows another angle structural diagram of the grinding mechanism.

[0050] In the diagram: 100, Copper plate; 101, Flat surface; 102, Inclined surface; 1, Frame; 2, Mounting bracket; 3, Grinding mechanism; 31, Coarse grinding module; 311, Connector 1; 312, Coarse grinding wheel; 313, Rotating wheel 1; 32, Fine grinding module; 321, Connector 2; 322, Pulley 1; 323, Pulley 2; 324, Grinding belt; 325, Rotating wheel 2; 326, Adjustment component; 3261, Telescopic component; 3262, Tensioning wheel; 3263, Sliding component; 33, Switching mechanism; 3311, Linear drive component; 3312, Rack 1; 332, Transmission component; 3321, Rotating shaft 1; 3322. Gear 1; 3323, Rack 2; 34, Rotation drive assembly; 341, Drive component; 342, Transmission component; 3421, Driving wheel; 3422, Driven wheel; 3423, Conveyor belt; 4, Worktable; 41, Base; 411, Mounting plate; 4111, Mounting hole 1; 4112, Mounting hole 2; 42, Adjustment platform; 421, Connecting plate; 4211, Through hole; 43, Limiting assembly; 431, Limiting plate 1; 4311, First limiting surface; 4312, Second limiting surface; 432, Limiting plate 2; 4321, Third limiting surface; 5, Moving assembly; 51, Longitudinal moving frame; 52, Transverse moving frame; 53, Lifting frame. Detailed Implementation

[0051] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it.

[0052] To keep the drawings concise, each drawing only schematically shows the parts relevant to the invention; these do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one," and "several" includes "two" and "more than two."

[0053] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0054] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0055] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of description and simplification of operation, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0056] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0057] In the continuous casting process of the metallurgical industry, the crystallizer copper plate is a key component that comes into direct contact with high-temperature molten steel. Its main function is to achieve the solidification and shaping of the molten steel. Continuous casting production has extremely high requirements for the surface quality of the crystallizer copper plate. The surface must have excellent flatness and smoothness. If there are bumps, depressions, or rough marks on the copper plate surface, it will not only increase the frictional resistance between the billet and the copper plate, leading to defects such as cracks and scratches on the billet surface, but in severe cases, it can also cause steel leakage accidents, resulting in production line shutdowns, equipment damage, and other significant economic losses.

[0058] After the copper plate of the crystallizer has undergone solvent coating treatment, its surface needs to be finely processed through a professional grinding process to meet the requirements of continuous casting production. However, the structure of the crystallizer copper plate is special. It is not a single plane. It includes a flat surface 101 to be ground for the main forming, and two inclined surfaces 102 respectively set symmetrically on both sides of the flat surface 101 and inclined in an outward and downward direction. The grinding precision requirements of each surface are consistent. This brings unique technical challenges to the grinding operation, and also makes the crystallizer copper plate grinding equipment and process important in the field of metallurgical equipment processing.

[0059] The crystallizer copper plate polishing device provided in this embodiment is used to polish a copper plate 100 having a flat surface 101 and two inclined surfaces 102, such as... Figure 1 As shown, the overall structure includes a frame 1, a mounting frame 2, a polishing mechanism 3, a worktable 4, and a moving component 5. All components work together to complete the copper plate polishing operation.

[0060] The frame 1 serves as the basic support component of the device, providing a stable mounting platform for the entire device. The mounting bracket 2 is movably mounted on the frame 1, and the grinding mechanism 3 is mounted on the mounting bracket 2. Movement of the mounting bracket 2 allows the grinding mechanism 3 to adjust its position, thereby enabling grinding of different areas of the copper plate 100. The worktable 4 is located below the grinding mechanism 3 and is used to support and fix the copper plate 100. The worktable 4 includes a base 41 and an adjusting table 42. The base 41 is fixed to the frame 1, and the adjusting table 42 is detachably connected to the base 41, allowing for angle adjustment according to different surfaces to be ground.

[0061] The moving component 5 is mounted on the frame 1 and is used to move the mounting frame 2. It includes a longitudinal moving frame 51, a transverse moving frame 52, and a lifting frame 53. The longitudinal moving frame 51 can move along the length of the frame 1, and the transverse moving frame 52 can move along the length of the longitudinal moving frame 51. The moving directions of the longitudinal moving frame 51 and the transverse moving frame 52 are perpendicular to each other and are both arranged in a horizontal direction. The lifting frame 53 can be raised and lowered vertically on the transverse moving frame 52, and the mounting frame 2 is fixed on the lifting frame 53. Through the horizontal movement of the longitudinal moving frame 51 and the transverse moving frame 52, and the raising and lowering movement of the lifting frame 53, the mounting frame 2 and the grinding mechanism 3 can be adjusted in three-dimensional space to ensure that the grinding mechanism 3 can cover all areas of the copper plate 100 to be ground.

[0062] In the actual working process, the copper plate 100 is first fixed on the adjustment table 42 of the workbench 4. The connection between the adjustment table 42 and the base 41 is adjusted according to the type of the surface to be polished, either flat surface 101 or inclined surface 102, so that the surface to be polished is set in the horizontal direction. Then, the position of the mounting frame 2 and the polishing mechanism 3 is adjusted by the moving component 5 so that the polishing mechanism 3 is aligned with the surface to be polished. Finally, the polishing mechanism 3 is started to polish the surface of the copper plate 100.

[0063] like Figure 2 and Figure 3 As shown, the workbench 4 includes a base 41 and an adjustment platform 42. The base 41 is provided with two sets of mounting plates 411 symmetrically arranged on its upper sides. Each set includes at least two mounting plates 411 to ensure the stability of the installation between the adjustment platform 42 and the base 41. Each set of mounting plates 411 is provided with a first mounting hole 4111 and a second mounting hole 4112. The two second mounting holes 4112 are located below the two first mounting holes 4111, or are located above the two first mounting holes 4111. The bottom of the adjustment platform 42 is provided with two connecting plates 421 that correspond one-to-one with the mounting plates 411. The connecting plates 421 are provided with through holes 4211. The through holes 4211 can be aligned with the first mounting hole 4111 or the second mounting hole 4112 and connected by a connector. Specifically, the connector can be a bolt or a pin.

[0064] When it is necessary to grind the flat surface 101 of the copper plate 100, align the through hole 4211 of the bottom connecting plate 421 of the adjusting platform 42 with the mounting hole 4111 on the mounting plate 411 of the base 41, insert the connecting plate 421 between each set of two mounting plates 411, and fix the adjusting platform 42 to the base 41 using connectors such as bolts and pins. At this time, the top surface of the adjusting platform 42 remains horizontal, and the flat surface 101 of the copper plate 100 is set horizontally accordingly; when it is necessary to grind the inclined surface 102 of the copper plate 100, disassemble After removing the connector, align the through hole 4211 of the connecting plate 421 with a mounting hole 4111 on a set of mounting plates 411 and a mounting hole 4112 on another set of mounting plates 411, and then fix it again with the connector. Since the mounting hole 4112 and the mounting hole 4111 are in a side-down or side-up position, the adjusting platform 42 will tilt as the connecting plate 421 is connected to the mounting holes 4111 and 4112, so that the inclined surface 102 of the copper plate 100 turns into a horizontal setting.

[0065] By utilizing the positional design of mounting holes 4111 and 4112 on the base 41 and their coordination with the connecting plate 421 of the adjusting table 42, the angle of the adjusting table 42 can be adjusted simply by switching the connection position of the connectors, without the need to change the fixtures, thus simplifying the operation process. At the same time, the angle of the adjusting table 42 is limited by the position of mounting holes 4111 and 4112, avoiding the inconvenience of manual adjustment, ensuring that the surface to be polished remains stable and horizontal, providing a reference for the polishing mechanism 3, and effectively ensuring the flatness accuracy of the copper plate 100 surface after polishing.

[0066] The adjusting platform 42 is provided with a limiting assembly 43 for fixing the copper plate 100, including two parallel limiting plates 431 and two parallel limiting plates 432, which together form a receiving space for accommodating the copper plate 100. The limiting plate 431 has a first limiting surface 4311 and a second limiting surface 4312 located at both ends thereon. The second limiting surface 4312 is inclined outward and downward. The first limiting surface 4311 is parallel to the top surface of the adjusting platform 42. The limiting plate 432 has a third limiting surface 4321 that is coplanar with the second limiting surface 4312. When the copper plate 100 is located in the receiving space, the first limiting surface 4311 is coplanar with the flat surface 101, and the second limiting surface 4312 and the third limiting surface 4321 are coplanar with the inclined surface 102.

[0067] In existing technologies, the copper plate 100 is often fixed using a simple clamping method, which is prone to positional displacement and affects the grinding accuracy. This example uses an enclosed receiving space to limit the displacement of the copper plate 100 during the grinding process, avoiding positional displacement caused by vibration. Combined with the angle adjustment function of the adjustment table 42, it further ensures the stability of the horizontal state of the surface to be ground, reduces grinding errors, and improves grinding quality.

[0068] Based on the coplanar cooperation between the first limiting surface 4311, the second limiting surface 4312, and the third limiting surface 4321 of the limiting component 43 and the surface of the copper plate 100, the above three limiting surfaces also have the function of assisting in the smoothing of the edge of the copper plate 100. When the coarse grinding wheel 312 of the coarse grinding module 31 or the grinding belt 324 of the fine grinding module 32 grinds the junction of the smooth surface 101 and the inclined surface 102 of the edge area of ​​the copper plate 100, and the outer edge of the inclined surface 102, the first limiting surface 4311, the second limiting surface 4312, and the third limiting surface 4321 can form an abutment cooperation with the peripheral wall of the coarse grinding wheel 312 or the working surface of the grinding belt 324, providing a reference support for the edge grinding of the grinding tool.

[0069] like Figures 1 to 4As shown, when the coarse grinding wheel 312 moves to the connection point, the connection between the first limiting surface 4311 and the second limiting surface 4312 of the limiting plate 431 will abut against the peripheral wall of the coarse grinding wheel 312, limiting the coarse grinding wheel 312 to cut too deeply into the copper plate 100, and at the same time guiding the coarse grinding wheel 312 to grind along the connection trajectory of the limiting surface; similarly, when grinding the outer edge of the inclined surface 102, the outer edge of the third limiting surface 4321 of the limiting plate 432 will abut against the coarse grinding wheel 312 or the grinding belt 324, ensuring that the grinding tool only acts on the edge area of ​​the copper plate 100, and avoiding excessive grinding amount that causes the copper plate 100 to exceed the dimensional tolerance.

[0070] Based on the structure of the adjustment table 42 of the worktable 4, in order to further improve the positioning accuracy and stability of the copper plate 100 on the adjustment table 42, the bottom of the copper plate 100 is provided with multiple positioning holes, which are evenly distributed on the bottom of the copper plate 100; correspondingly, the top surface of the adjustment table 42 is provided with multiple positioning pins, the number and position of the positioning pins correspond one-to-one with the positioning holes on the bottom of the copper plate 100, and the outer diameter of the positioning pins is adapted to the inner diameter of the positioning holes.

[0071] When fixing the copper plate 100, first clean the top surface of the adjusting platform 42 and the bottom of the copper plate 100 to avoid impurities affecting the positioning. Then, according to the specifications of the copper plate 100, confirm whether the position of the positioning pin on the adjusting platform 42 matches the positioning hole at the bottom of the copper plate 100. If it is necessary to adapt to different specifications of copper plates 100, the positioning pin can be designed to be detachable, and the adaptation can be achieved by replacing the mounting base with different positioning pin spacing. After confirming the match, align the positioning hole at the bottom of the copper plate 100 with the positioning pin, and slowly lower it to insert the positioning pin into the positioning hole to complete the initial positioning. After the positioning pin and positioning hole are engaged, the horizontal position of the copper plate 100 on the adjusting platform 42 is initially limited. With the enclosing and limiting of the limiting component 43, the copper plate 100 is double-fixed on the adjusting platform 42.

[0072] Based on the connection structure between the limiting component 43 and the adjusting table 42, several shims (not shown) can be added between the bottom of the limiting component 43 and the top surface of the adjusting table 42. The shape of the shims is adapted to the bottom mounting area of ​​the limiting component 43. Shims of different thicknesses can be selected according to actual needs, or the total thickness can be adjusted by stacking multiple shims of the same thickness, so that the limiting surface of the limiting component and the polished surface of the copper plate 100 can be superimposed after fine adjustment.

[0073] like Figures 4 to 9As shown, the grinding mechanism 3 includes a coarse grinding module 31, a fine grinding module 32, and a switching mechanism 33. The switching mechanism 33 includes a linear drive component 3311 mounted on the mounting frame 2, and a transmission assembly 332 composed of a rack 3312, two gears 3322, and two vertical racks 3323. The two gears 3322 are rotatably mounted on the mounting frame 2 via the same shaft 3321. One gear meshes with the rack 3312, and the other is located between the two racks 3323 and meshes with the two racks 3323 at both ends. The coarse grinding module 31 and the fine grinding module 32 are respectively connected to the two racks 3323.

[0074] When coarse grinding is required, the linear drive 3311 is activated, which moves rack 3312. Rack 3312 drives gear 3322, which meshes with it, to rotate. Gear 3322 drives another gear 3322 to rotate synchronously through shaft 3321, which in turn drives two racks 3323 to move up and down in opposite directions. This causes rack 3323 connected to coarse grinding module 31 to move down, and coarse grinding module 31 moves closer to the surface to be ground and enters the grinding state. At the same time, rack 3323 connected to fine grinding module 32 moves up, and fine grinding module 32 is disengaged from the grinding state. When it is necessary to switch to fine grinding, the linear drive 3311 is controlled to move in the opposite direction. Similarly, fine grinding module 32 moves down to enter the grinding state, and coarse grinding module 31 moves up to disengage from the grinding state.

[0075] In existing technologies, rough grinding and fine grinding often need to be performed on different equipment, requiring the transfer of copper plate 100, which is cumbersome and inefficient. This example uses a switching mechanism 33 to achieve rapid switching between the rough grinding module 31 and the fine grinding module 32 on the same device, eliminating the need to transfer copper plate 100 or change equipment, thus reducing operational steps; the gear and rack transmission structure ensures the correspondence of the lifting and lowering displacements of the two grinding modules, improving grinding efficiency and continuity.

[0076] The grinding mechanism 3 also includes a rotation drive assembly 34, which includes a drive component 341 (a motor in this example) mounted on the mounting bracket 2 and two sets of transmission components 342 that are respectively connected to the coarse grinding module 31 and the fine grinding module 32; and when the switching mechanism 33 puts a certain grinding module in the grinding state, the corresponding transmission component 342 can drive the module to rotate under the action of the drive component 341.

[0077] When the switching mechanism 33 puts the coarse grinding module 31 into the grinding state, the drive component 341 starts and transmits power to the coarse grinding module 31 through the transmission component 342 corresponding to the coarse grinding module 31, driving the coarse grinding module 31 to run for coarse grinding; when the switching mechanism 33 puts the fine grinding module 32 into the grinding state, the drive component 341 transmits power to the fine grinding module 32 through the transmission component 342 corresponding to the fine grinding module 32, driving the fine grinding module 32 to run for fine grinding.

[0078] In existing technologies, different grinding modules often require separate drive devices, resulting in complex device structures and high costs. This example achieves selective power transmission to two grinding modules through a single drive source and two sets of transmission components 342, simplifying the device structure and reducing equipment costs. Furthermore, the transmission connection only takes effect when the grinding module is in grinding mode, ensuring targeted and stable power transmission, avoiding energy loss, and improving grinding efficiency.

[0079] The coarse grinding module 31 includes a connector 311 and a coarse grinding wheel 312. The connector 311 is slidably mounted on the mounting bracket 2 and is located on the side of one of the racks 3323 away from the gear 3322. The rack 3323 is connected to the connector 311. The coarse grinding wheel 312 is rotatably mounted on the connector 311, and its shaft is provided with a rotating wheel 313 for transmission connection with the transmission component 342.

[0080] When the switching mechanism 33 is working, the rack 2 3323 drives the connecting part 1 311 to slide along the mounting frame 2, thereby driving the coarse grinding wheel 312 to rise and fall; when the coarse grinding module 31 is in the grinding state, the transmission part 342 is connected to the rotating wheel 1 313, and under the action of the driving part 341, it drives the coarse grinding wheel 312 to rotate, and performs coarse grinding on the copper plate 100.

[0081] The fine grinding module 32 includes a second connector 321, a first pulley 322, multiple second pulleys 323, and a grinding belt 324. The second connector 321 is slidably mounted on the mounting frame 2 and is located on the side of another rack 3323 away from the first rack 3322. The rack 3323 is connected to the second connector 321. The first pulley 322 is rotatably mounted on the second connector 321, and a rotating wheel 325 is provided on its shaft. The second pulleys 323 are rotatably mounted on the mounting frame 2, and the grinding belt 324 is tensioned on the first pulley 322 and the second pulleys 323.

[0082] When the switching mechanism 33 is working, the rack 2 3323 drives the connecting piece 2 321 to slide along the mounting frame 2, which drives the pulley 1 322 to rise and fall, thereby adjusting the position of the grinding belt 324; when the fine grinding module 32 is in the grinding state, the transmission piece 342 is connected to the rotating wheel 2 325, which drives the pulley 1 322 to rotate, and with the cooperation of the pulley 2 323, the grinding belt 324 runs to perform fine grinding on the copper plate 100.

[0083] Each set of transmission components 342 includes a drive wheel 3421, at least two driven wheels 3422, and a conveyor belt 3423. The drive wheel 3421 is connected to the output shaft of the drive component 341. The driven wheels 3422 are rotatably mounted on the mounting plate 411. The conveyor belt 3423 is wound around the drive wheel 3421 and the driven wheels 3422. The second rotating wheel 325 and the first rotating wheel 313 are located inside the conveyor belt 3423. When the switching mechanism 33 switches the working state of the coarse grinding module 31 and the fine grinding module 32, the second rotating wheel 325 or the first rotating wheel 313 can move and abut against the conveyor belt 3423.

[0084] When the drive unit 341 is activated, it drives the drive wheel 3421 to rotate. The drive wheel 3421 drives the driven wheel 3422 to rotate synchronously via the conveyor belt 3423, keeping the conveyor belt 3423 running continuously. When the switching mechanism 33 moves the coarse grinding module 31 down to enter the grinding state, the first rotating wheel 313 of the coarse grinding module 31 moves down and abuts against the inner side of the corresponding conveyor belt 3423. The conveyor belt 3423 drives the first rotating wheel 313 to rotate through friction, thereby driving the coarse grinding wheel 312 to rotate. When the switching mechanism 33 moves the fine grinding module 32 down to enter the grinding state, the second rotating wheel 325 of the fine grinding module 32 moves down and abuts against the inner side of the corresponding conveyor belt 3423. At the same time, the first rotating wheel 313 leaves the corresponding conveyor belt 3423. The conveyor belt 3423 corresponding to the fine grinding module 32 drives the second rotating wheel 325 to rotate through friction, thereby driving the pulley 322 and the grinding belt 324 to rotate.

[0085] Through the contact transmission between the conveyor belt 3423 and the rotating wheel, the grinding module is raised and lowered by the switching mechanism 33, which simultaneously realizes the contact or separation of the rotating wheel and the conveyor belt 3423. No additional clutch structure is required, which simplifies the design of the transmission system. At the same time, the setting of at least two driven wheels 3422 can ensure that the conveyor belt 3423 maintains a stable tension and running trajectory, avoiding the poor contact between the rotating wheel and the conveyor belt 3423 caused by the deviation of the conveyor belt 3423, ensuring the continuity and stability of power transmission, and further improving the reliability of the grinding module.

[0086] When the coarse grinding module 31 needs to grind the copper plate 100, the linear drive 3311 drives the rack 3312 to move, and through the gear 3322, the rack 3323 connected to the coarse grinding module 31 moves downward, driving the coarse grinding wheel 312 of the coarse grinding module 31 to approach the surface of the copper plate 100 to be ground, until it enters the grinding state; at the same time, the rack 3323 connected to the fine grinding module 32 moves upward synchronously, driving the grinding belt 324 of the fine grinding module 32 to move upward away from the copper plate 100, so that the grinding belt 324 maintains a sufficient distance from the surface of the copper plate 100 and is completely out of the grinding range.

[0087] Furthermore, the cooperation between the transmission component 342 of the rotation drive assembly 34 and the coarse grinding module 31 further ensures that the fine grinding module 32 does not participate in the grinding: when the coarse grinding module 31 moves down, its first rotating wheel 313 moves down accordingly and comes into contact with the corresponding conveyor belt 3423, obtaining power to drive the coarse grinding wheel 312 to rotate; while when the fine grinding module 32 moves up, its second rotating wheel 325 moves up synchronously and disengages from the corresponding conveyor belt 3423. The second rotating wheel 325 cannot drive the corresponding conveyor belt 3423 to rotate, and thus cannot drive the grinding belt 324 to move, and cannot perform a grinding effect on the copper plate 100.

[0088] Similarly, when the fine grinding module 32 needs to be polished, the linear drive component 3311 drives the rack 3312 to move, driving the gear 3322 to rotate, causing the rack 3323 connected to the fine grinding module 32 to move downward, driving the polishing belt 324 closer to the copper plate 100 to enter the polishing state; at the same time, the rack 3323 connected to the coarse grinding module 31 moves upward synchronously, driving the coarse grinding wheel 312 away from the copper plate 100 and out of the polishing range. When the coarse grinding module 31 moves upward, its rotating wheel 313 disengages from the conveyor belt 3423 and cannot obtain power, and the coarse grinding wheel 312 remains stationary, further ensuring that the coarse grinding module 31 does not participate in polishing.

[0089] The fine grinding module 32 also includes an adjustment component 326, which includes a telescopic member 3261 and a tensioning wheel 3262. The telescopic member 3261 is mounted on the mounting bracket 2, and its telescopic end is provided with a sliding member 3263. The tensioning wheel 3262 is rotatably mounted on the sliding member 3263, and when the telescopic member 3261 extends outward, the peripheral wall of the tensioning wheel 3262 can abut against the outer wall of the grinding belt 324. In this example, the telescopic member 3261 can be a cylinder.

[0090] When the grinding belt 324 becomes loose due to long-term use, affecting the fine grinding effect, the telescopic component 3261 is extended outward. The telescopic component 3261 drives the sliding component 3263 to move closer to the grinding belt 324. The sliding component 3263 drives the tension wheel 3262 to move synchronously, so that the peripheral wall of the tension wheel 3262 abuts against the outer wall of the grinding belt 324. The telescopic component 3261 is extended outward, and the tension wheel 3262 applies outward tension to the grinding belt 324 until the grinding belt 324 returns to a suitable tension. When the grinding belt 324 needs to be replaced, the telescopic component 3261 is retracted, which drives the tension wheel 3262 away from the grinding belt 324, reducing the tension of the grinding belt 324 and facilitating the disassembly and installation of the grinding belt 324.

[0091] The tensioning wheel 3262 is moved by the telescopic component 3261 to adjust the tension of the grinding belt 324, ensuring that the grinding belt 324 maintains a suitable tension throughout the fine grinding process, avoiding slippage due to insufficient tension or excessive wear due to excessive tension, and extending the service life of the grinding belt 324.

[0092] The frame 1 is equipped with a moving component 5, which includes a longitudinal moving frame 51, a transverse moving frame 52 and a lifting frame 53. The longitudinal moving frame 51 is movably mounted on the frame 1, and the transverse moving frame 52 is movably mounted on the longitudinal moving frame 51. The moving directions of the longitudinal moving frame 51 and the transverse moving frame 52 are both horizontal and perpendicular to each other. The lifting frame 53 is lifted and lowered on the transverse moving frame 52, and the mounting frame 2 is mounted on the lifting frame 53.

[0093] When it is necessary to adjust the position of the grinding mechanism 3 in the horizontal direction along the length of the frame 1, the longitudinal moving frame 51 is driven to move along the frame 1, and the longitudinal moving frame 51 drives the transverse moving frame 52, the lifting frame 53, the mounting frame 2, and the grinding mechanism 3 to move synchronously. When it is necessary to adjust the position of the grinding mechanism 3 in the horizontal direction along the width of the frame 1, the transverse moving frame 52 is driven to move along the longitudinal moving frame 51, and the transverse moving frame 52 drives the lifting frame 53, the mounting frame 2, and the grinding mechanism 3 to move synchronously. When it is necessary to adjust the position of the grinding mechanism 3 in the vertical direction to accommodate copper plates 100 of different thicknesses or to adjust the grinding depth, the lifting frame 53 is driven to rise and fall along the transverse moving frame 52, and the lifting frame 53 drives the mounting frame 2 and the grinding mechanism 3 to rise and fall synchronously. Through the coordinated actions of longitudinal movement, transverse movement, and lifting, the grinding mechanism 3 can be adjusted to any position in three-dimensional space.

[0094] The three-dimensional moving structure composed of the longitudinal moving frame 51, the transverse moving frame 52 and the lifting frame 53 enables the grinding mechanism 3 to adjust its position in three-dimensional space. It can cover all areas of the copper plate 100 to be ground without moving the copper plate 100, thus avoiding positioning errors caused by moving the copper plate 100. At the same time, the independent control of longitudinal, transverse and lifting can adjust the position and grinding depth of the grinding mechanism 3 according to the grinding requirements, adapting to the grinding requirements of different specifications and different surfaces to be ground, further improving the versatility and grinding accuracy of the device.

[0095] The present invention also provides a crystallizer copper plate processing technology, including the following three steps: milling pretreatment S1, rough grinding S2, and fine grinding S3; in S1, the copper plate 100 after being coated is straightened and then milled so that the coating has a grinding amount ≤0.05mm and a coating flatness ≤0.03mm; in S2, the copper plate 100 is placed on the worktable 4, so that the flat surface 101 and the inclined surface 102 are horizontal in sequence, and rough grinding is performed with a rough grinding wheel 312 so that the coating surface roughness is <0.8μmm and the flatness is <0.01mm; in S3, the copper plate 100 is placed in the same way as in S2, and fine grinding is performed with a grinding belt 324 so that the coating surface roughness is <0.4μmm and the flatness is <0.01mm.

[0096] Working process: First, milling pretreatment S1 is performed to straighten the copper plate 100, which may be deformed after the solvent treatment. Then, the surface of the copper plate 100 is milled using a milling machine. The milling amount is controlled so that the coating on the surface of the copper plate 100 retains a grinding amount of no more than 0.05mm, while ensuring that the flatness of the coating does not exceed 0.03mm. Then, rough grinding S2 is performed. The pretreated copper plate 100 is fixed on the adjustment table 42 of the worktable 4. By adjusting the connection between the adjustment table 42 and the base 41, the flat surface 101 of the copper plate 100 is set horizontally. The switching mechanism 33 is activated to put the rough grinding module 31 into the grinding state. The position of the grinding mechanism 3 is adjusted with the moving component 5, and the flat surface 101 is rough ground with the rough grinding wheel 312. After grinding, adjust the angle of the adjustment table 42 so that the inclined surface 102 is horizontal. Repeat the above rough grinding steps to grind the two inclined surfaces 102 until the surface roughness of the copper plate 100 coating is less than 0.8μm and the flatness is less than 0.01mm. Finally, perform fine grinding S3. Keep the copper plate 100 fixed on the worktable 4, adjust the angle of the adjustment table 42 so that the flat surface 101 is horizontal, start the switching mechanism 33 to switch to the fine grinding module 32, and use the grinding belt 324 with the moving component 5 to fine grind the flat surface 101. After the flat surface 101 is finely ground, adjust the angle of the adjustment table 42 so that the inclined surface 102 is horizontal. Repeat the fine grinding steps to fine grind the inclined surface 102 until the surface roughness of the copper plate 100 coating is less than 0.4μm and the flatness is less than 0.01mm.

[0097] By performing a milling pretreatment step, a reasonable grinding allowance is reserved for subsequent grinding, avoiding damage to the copper plate 100 substrate due to excessive grinding allowance, or failure to eliminate milling marks due to insufficient grinding allowance. At the same time, the coating flatness is controlled in advance, laying a good foundation for subsequent grinding. Rough grinding and fine grinding are carried out in steps. Rough grinding quickly removes most of the machining allowance, while fine grinding further improves the surface accuracy. The two work together to ensure that the surface quality of the copper plate 100 meets the requirements of continuous casting production. Moreover, the entire process is completed using the same grinding device, eliminating the need to transfer the copper plate 100, shortening the processing cycle. At the same time, relying on the angle adjustment and positioning functions of the device, the processing accuracy of each step is ensured to be stable, effectively guaranteeing the final product quality and reducing production risks and costs.

[0098] Optionally, the number of mounting holes on the mounting plate 411 can be increased according to the angle requirements of the inclined surface 102 of the copper plate 100, such as setting mounting hole three, mounting hole four, etc. Different mounting holes correspond to different inclination angles, so that the adjustment table 42 can adapt to the polishing requirements of more specifications of copper plates 100. Furthermore, the arrangement of the mounting holes can be changed from a fixed position of "side up / side down" to an arrangement along an arc trajectory, with the center of the arc coinciding with the rotation fulcrum of the connecting plate 421. By connecting the through hole 4211 with mounting holes at different arc positions, the angle of the adjustment table 42 can be adjusted, improving the flexibility of angle adjustment.

[0099] Optionally, the linear drive 3311 can be a drive device such as a cylinder or hydraulic cylinder, which directly drives the rack 3312 to move through the extension and retraction of the cylinder or hydraulic cylinder; furthermore, the transmission assembly 332 can adopt a structure of gear set and worm gear cooperation to replace the meshing transmission of rack and gear. Through the self-locking function of worm gear, it is ensured that the grinding module can be stably maintained in the current position after being raised and lowered, avoiding position displacement caused by external force.

[0100] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A crystallizer copper plate polishing device for polishing a copper plate (100), the copper plate (100) having a flat surface (101) and an inclined surface (102) to be polished, the inclined surface (102) being two in number, the two inclined surfaces (102) being located on both sides of the flat surface (101) and inclined outward and downward, characterized in that, include: Rack (1); Mounting bracket (2), which is movably mounted on the frame (1); A grinding mechanism (3) is mounted on the mounting bracket (2); The workbench (4) includes a base (41) and an adjustment table (42). The base (41) is located below the grinding mechanism (3). Two sets of mounting plates (411) are provided on the base (41). The two sets of mounting plates (411) are symmetrically arranged on both sides above the base (41). Each mounting plate (411) has a mounting hole 1 (4111) and a mounting hole 2 (4112). The two mounting holes 2 (4112) are located one-to-one below the two mounting holes 1 (4111), or the two mounting holes 2 (4112) are located below the two mounting holes 1 (4111). 112) are all located one-to-one with the two mounting holes (4111) on the side above. The adjustment platform (42) is used to support and fix the copper plate (100). The bottom of the adjustment platform (42) is provided with two connecting plates (421) that correspond one-to-one with the mounting plate (411). The connecting plate (421) is provided with through holes (4211). The through holes (4211) are used to align with the mounting hole (4111) or the mounting hole (4112) and connect them through the plug-in connector so that the flat surface (101) or the inclined surface (102) is set horizontally. The grinding mechanism (3) includes a coarse grinding module (31) and a fine grinding module (32). A switching mechanism (33) is provided between the coarse grinding module (31) and the fine grinding module (32). The switching mechanism (33) is used to put the coarse grinding module (31) or the fine grinding module (32) into a grinding state. The switching mechanism (33) includes: A linear drive (3311) is disposed on the mounting bracket (2); The transmission assembly (332) includes a rack (3312) connected to the output end of the linear drive (3311), two gears (3322) rotatably mounted on the mounting frame (2), and two vertically extending racks (3323). Both gears (3322) are connected to the mounting frame (2) via the same shaft (3321). One gear (3322) meshes with the rack (3312), and the other gear (3322) is located between the two racks (3323) and meshes with the two racks (3323) respectively. The fine grinding module (32) and the coarse grinding module (31) are respectively connected to the two racks (3323) and are used to move up and down under the drive of the racks (3323) so that the fine grinding module (32) or the coarse grinding module (31) moves down and grinds the copper plate (100).

2. The crystallizer copper plate polishing device according to claim 1, characterized in that, The adjustment platform (42) is provided with a limiting component (43) for fixing the copper plate (100). The limiting component (43) includes two limiting plates (431) and two limiting plates (432). The two limiting plates (431) are arranged in parallel, and the two limiting plates (432) are arranged in parallel. The two limiting plates (431) and the two limiting plates (432) can enclose and form a receiving space for accommodating the copper plate (100). The limiting plate (431) has a first limiting surface (4311) and second limiting surfaces (4312) located at both ends of the first limiting surface (4311). The second limiting surface (4312) gradually tilts outward and downward. The first limiting surface (4311) is parallel to the top surface of the adjustment platform (42). The second limiting plate (432) has a third limiting surface (4321) that is coplanar with the second limiting surface (4312). The first limiting plate (431) and the second limiting plate (432) are configured such that when the copper plate (100) is located in the accommodating space, the first limiting surface (4311) is coplanar with the flat surface (101), and the second limiting surface (4312) and the third limiting surface (4321) are coplanar with the inclined surface (102).

3. The crystallizer copper plate polishing device according to claim 1, characterized in that, The grinding mechanism (3) further includes a rotation drive assembly (34) for driving the coarse grinding module (31) and the fine grinding module (32) to work. The rotation drive assembly (34) includes a drive member (341) disposed on the mounting bracket (2) and two sets of transmission members (342) respectively connected to the coarse grinding module (31) and the fine grinding module (32). The rotation drive assembly (34) is configured such that when the switching mechanism (33) puts the coarse grinding module (31) or the fine grinding module (32) into a grinding state, the transmission members (342) can drive the coarse grinding module (31) or the fine grinding module (32) to rotate under the action of the drive member (341).

4. The crystallizer copper plate polishing device according to claim 3, characterized in that, The coarse grinding module (31) includes: Connector 1 (311) is slidably disposed on the mounting bracket (2) and located on one side of rack 2 (3323) away from gear 1 (3322), rack 2 (3323) is connected to connector 1 (311); A coarse grinding wheel (312) is rotatably mounted on the connecting member (311), and a rotating wheel (313) is provided on the shaft of the coarse grinding wheel (312) for transmission connection with the transmission member (342).

5. A crystallizer copper plate polishing device according to claim 4, characterized in that, The fine grinding module (32) includes: Connector 2 (321), which is slidably disposed on the mounting bracket (2) and located on the side of the other rack 2 (3323) away from the gear 1 (3322), and the rack 2 (3323) is connected to the connector 2 (321); A pulley (322) is rotatably mounted on the connecting member (321), and a rotating wheel (325) is provided on the shaft of the pulley (322) for transmission connection with the transmission member (342). Multiple pulleys (323) are provided, and multiple pulleys (323) are rotatably mounted on the mounting frame (2); A polishing belt (324) is tensioned on the first pulley (322) and the second pulley (323), and the polishing belt (324) is used to finely polish the copper plate (100).

6. The crystallizer copper plate polishing device according to claim 5, characterized in that, Each of the aforementioned transmission components (342) includes: A drive wheel (3421) is connected to the output shaft of the drive member (341); Driven wheel (3422), the number of driven wheels (3422) is at least two, and both driven wheels (3422) are rotatably mounted on the mounting bracket (2); A conveyor belt (3423) is wound around the driving wheel (3421) and the driven wheel (3422). The second rotating wheel (325) and the first rotating wheel (313) are located inside the conveyor belt (3423). The transmission member (342) is configured such that when the switching mechanism (33) switches the working state of the coarse grinding module (31) and the fine grinding module (32), the second rotating wheel (325) or the first rotating wheel (313) can move and abut against the conveyor belt (3423) to drive the coarse grinding module (31) or the fine grinding module (32) to rotate under the action of the conveyor belt (3423).

7. A crystallizer copper plate polishing device according to claim 5, characterized in that, The fine grinding module (32) further includes an adjustment component (326), which includes: Telescopic component (3261), the telescopic component (3261) is disposed on the mounting frame (2), and the telescopic end of the telescopic component (3261) is provided with a sliding component (3263). Tensioner (3262), which is rotatably mounted on the sliding member (3263), and whose peripheral wall can abut against the outer wall of the polishing belt (324) under the extension of the telescopic member (3261) to tension the polishing belt (324).

8. A crystallizer copper plate polishing device according to claim 7, characterized in that, The frame (1) is also provided with a moving component (5) for moving the mounting frame (2). The moving component (5) includes a longitudinal moving frame (51), a transverse moving frame (52) and a lifting frame (53). The longitudinal moving frame (51) is movably mounted on the frame (1), and the transverse moving frame (52) is movably mounted on the longitudinal moving frame (51). The moving direction of the longitudinal moving frame (51) and the moving direction of the transverse moving frame (52) are both set in the horizontal direction and are perpendicular to each other. The lifting frame (53) is lifted and lowered on the transverse moving frame (52), and the mounting frame (2) is mounted on the lifting frame (53).

9. A process for processing copper plates for crystallizers, characterized in that, The crystallizer copper plate polishing apparatus according to any one of claims 1 to 8 comprises the following steps: S1. Milling pretreatment: After the copper plate (100) is straightened, it is milled so that the coating on the surface of the copper plate (100) has a grinding amount, the grinding amount is less than or equal to 0.05mm, and the flatness of the coating is less than 0.03mm. S2. Rough grinding: Place the copper plate (100) on the worktable (4) so ​​that the flat surface (101) and inclined surface (102) of the copper plate (100) are parallel to the horizontal plane in sequence. Use a rough grinding wheel (312) to rough grind the copper plate (100) so that the roughness of the coating surface of the copper plate (100) is less than 0.8μmm and the flatness is less than 0.01mm. S3. Fine grinding: Place the copper plate (100) on the worktable (4) so ​​that the flat surface (101) and inclined surface (102) of the copper plate (100) are parallel to the horizontal plane in sequence. Use the grinding belt (324) to fine grind the copper plate (100) so that the roughness of the coating surface of the copper plate (100) is less than 0.4μmm and the flatness is less than 0.01mm.

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